TW202521510A - 含有胺基之化合物、硬化性樹脂組成物、硬化物及積層體 - Google Patents

含有胺基之化合物、硬化性樹脂組成物、硬化物及積層體 Download PDF

Info

Publication number
TW202521510A
TW202521510A TW113127817A TW113127817A TW202521510A TW 202521510 A TW202521510 A TW 202521510A TW 113127817 A TW113127817 A TW 113127817A TW 113127817 A TW113127817 A TW 113127817A TW 202521510 A TW202521510 A TW 202521510A
Authority
TW
Taiwan
Prior art keywords
group
compound
resin composition
formula
amine
Prior art date
Application number
TW113127817A
Other languages
English (en)
Chinese (zh)
Inventor
鈴木悅子
有田和郎
Original Assignee
日商Ｄｉｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｄｉｃ股份有限公司 filed Critical 日商Ｄｉｃ股份有限公司
Publication of TW202521510A publication Critical patent/TW202521510A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D209/56—Ring systems containing three or more rings
    • C07D209/58—[b]- or [c]-condensed
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
TW113127817A 2023-08-10 2024-07-26 含有胺基之化合物、硬化性樹脂組成物、硬化物及積層體 TW202521510A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-131566 2023-08-10
JP2023131566 2023-08-10

Publications (1)

Publication Number Publication Date
TW202521510A true TW202521510A (zh) 2025-06-01

Family

ID=94534281

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113127817A TW202521510A (zh) 2023-08-10 2024-07-26 含有胺基之化合物、硬化性樹脂組成物、硬化物及積層體

Country Status (4)

Country Link
JP (1) JP7687540B1 (https=)
CN (1) CN121175290A (https=)
TW (1) TW202521510A (https=)
WO (1) WO2025033160A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008056888A (ja) * 2006-07-31 2008-03-13 Fujifilm Corp レーザー分解性樹脂組成物及びそれを用いるパターン形成材料
WO2013170313A1 (en) * 2012-05-18 2013-11-21 Monash University Epoxy resins
JP2013256557A (ja) 2012-06-11 2013-12-26 Hitachi Ltd 接着剤組成物及び接着構造体の解体方法
JP6575220B2 (ja) 2015-08-18 2019-09-18 富士電機株式会社 半導体装置
JP7681273B2 (ja) * 2021-11-05 2025-05-22 国立大学法人横浜国立大学 エポキシ樹脂の硬化剤、化合物、エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP7528140B2 (ja) 2022-03-09 2024-08-05 キヤノン株式会社 画像処理装置、画像処理方法、及びプログラム

Also Published As

Publication number Publication date
WO2025033160A1 (ja) 2025-02-13
CN121175290A (zh) 2025-12-19
JPWO2025033160A1 (https=) 2025-02-13
JP7687540B1 (ja) 2025-06-03

Similar Documents

Publication Publication Date Title
JP7597989B2 (ja) フェノール性水酸基含有化合物、硬化性樹脂組成物、硬化物及び積層体
JP2024100826A (ja) グリシジルエーテル基含有化合物、硬化性樹脂組成物、硬化物及び積層体
JP7635904B1 (ja) アミノ基含有化合物、硬化性樹脂組成物、硬化物及び積層体
TW202411223A (zh) 含縮水甘油基的化合物、硬化性樹脂組成物、硬化物、積層體及耐熱構件
TW202521510A (zh) 含有胺基之化合物、硬化性樹脂組成物、硬化物及積層體
TW202513543A (zh) 含有胺基之化合物、硬化性樹脂組成物、硬化物及積層體
JP7533820B2 (ja) グリシジルエーテル基含有化合物、硬化性樹脂組成物、硬化物及び積層体
JP7729484B2 (ja) 水酸基含有化合物、硬化性樹脂組成物、硬化物及び積層体
JP7533821B2 (ja) グリシジルエーテル基含有化合物、硬化性樹脂組成物、硬化物及び積層体
JP7648022B2 (ja) 硬化性化合物、硬化性樹脂組成物、硬化物及び積層体
TW202521511A (zh) 含有胺基之化合物、硬化性樹脂組成物、硬化物及積層體
WO2024195558A1 (ja) 硬化性樹脂組成物、硬化物、積層体、及び硬化性化合物
JP2025026162A (ja) アミノ基含有化合物、硬化性樹脂組成物、硬化物及び積層体
KR20260051356A (ko) 아미노기 함유 화합물, 경화성 수지 조성물, 경화물 및 적층체
TW202528406A (zh) 環氧樹脂組成物、其硬化物及拆解方法
KR20260052036A (ko) 아미노기 함유 화합물, 경화성 수지 조성물, 경화물 및 적층체