CN121175290A - 含有胺基的化合物、固化性树脂组合物、固化物及层叠体 - Google Patents

含有胺基的化合物、固化性树脂组合物、固化物及层叠体

Info

Publication number
CN121175290A
CN121175290A CN202480033571.7A CN202480033571A CN121175290A CN 121175290 A CN121175290 A CN 121175290A CN 202480033571 A CN202480033571 A CN 202480033571A CN 121175290 A CN121175290 A CN 121175290A
Authority
CN
China
Prior art keywords
compound
group
resin composition
curable resin
represented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480033571.7A
Other languages
English (en)
Chinese (zh)
Inventor
铃木悦子
有田和郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
DIC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIC Corp filed Critical DIC Corp
Publication of CN121175290A publication Critical patent/CN121175290A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D209/56—Ring systems containing three or more rings
    • C07D209/58—[b]- or [c]-condensed
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
CN202480033571.7A 2023-08-10 2024-07-23 含有胺基的化合物、固化性树脂组合物、固化物及层叠体 Pending CN121175290A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-131566 2023-08-10
JP2023131566 2023-08-10
PCT/JP2024/026261 WO2025033160A1 (ja) 2023-08-10 2024-07-23 アミノ基含有化合物、硬化性樹脂組成物、硬化物及び積層体

Publications (1)

Publication Number Publication Date
CN121175290A true CN121175290A (zh) 2025-12-19

Family

ID=94534281

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480033571.7A Pending CN121175290A (zh) 2023-08-10 2024-07-23 含有胺基的化合物、固化性树脂组合物、固化物及层叠体

Country Status (4)

Country Link
JP (1) JP7687540B1 (https=)
CN (1) CN121175290A (https=)
TW (1) TW202521510A (https=)
WO (1) WO2025033160A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008056888A (ja) * 2006-07-31 2008-03-13 Fujifilm Corp レーザー分解性樹脂組成物及びそれを用いるパターン形成材料
WO2013170313A1 (en) * 2012-05-18 2013-11-21 Monash University Epoxy resins
JP2013256557A (ja) 2012-06-11 2013-12-26 Hitachi Ltd 接着剤組成物及び接着構造体の解体方法
JP6575220B2 (ja) 2015-08-18 2019-09-18 富士電機株式会社 半導体装置
JP7681273B2 (ja) * 2021-11-05 2025-05-22 国立大学法人横浜国立大学 エポキシ樹脂の硬化剤、化合物、エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP7528140B2 (ja) 2022-03-09 2024-08-05 キヤノン株式会社 画像処理装置、画像処理方法、及びプログラム

Also Published As

Publication number Publication date
WO2025033160A1 (ja) 2025-02-13
JPWO2025033160A1 (https=) 2025-02-13
TW202521510A (zh) 2025-06-01
JP7687540B1 (ja) 2025-06-03

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