JP7687540B1 - アミノ基含有化合物、硬化性樹脂組成物、硬化物及び積層体 - Google Patents

アミノ基含有化合物、硬化性樹脂組成物、硬化物及び積層体 Download PDF

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Publication number
JP7687540B1
JP7687540B1 JP2024567513A JP2024567513A JP7687540B1 JP 7687540 B1 JP7687540 B1 JP 7687540B1 JP 2024567513 A JP2024567513 A JP 2024567513A JP 2024567513 A JP2024567513 A JP 2024567513A JP 7687540 B1 JP7687540 B1 JP 7687540B1
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group
compound
resin composition
curable resin
amino group
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Japanese (ja)
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JPWO2025033160A1 (https=
JPWO2025033160A5 (https=
Inventor
悦子 鈴木
和郎 有田
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DIC Corp
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DIC Corp
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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D209/56—Ring systems containing three or more rings
    • C07D209/58—[b]- or [c]-condensed
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
JP2024567513A 2023-08-10 2024-07-23 アミノ基含有化合物、硬化性樹脂組成物、硬化物及び積層体 Active JP7687540B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023131566 2023-08-10
JP2023131566 2023-08-10
PCT/JP2024/026261 WO2025033160A1 (ja) 2023-08-10 2024-07-23 アミノ基含有化合物、硬化性樹脂組成物、硬化物及び積層体

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JPWO2025033160A1 JPWO2025033160A1 (https=) 2025-02-13
JP7687540B1 true JP7687540B1 (ja) 2025-06-03
JPWO2025033160A5 JPWO2025033160A5 (https=) 2025-07-15

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JP2024567513A Active JP7687540B1 (ja) 2023-08-10 2024-07-23 アミノ基含有化合物、硬化性樹脂組成物、硬化物及び積層体

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JP (1) JP7687540B1 (https=)
CN (1) CN121175290A (https=)
TW (1) TW202521510A (https=)
WO (1) WO2025033160A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008056888A (ja) * 2006-07-31 2008-03-13 Fujifilm Corp レーザー分解性樹脂組成物及びそれを用いるパターン形成材料
WO2013170313A1 (en) * 2012-05-18 2013-11-21 Monash University Epoxy resins
JP2023069539A (ja) * 2021-11-05 2023-05-18 国立大学法人横浜国立大学 化合物、エポキシ樹脂組成物及びエポキシ樹脂硬化物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013256557A (ja) 2012-06-11 2013-12-26 Hitachi Ltd 接着剤組成物及び接着構造体の解体方法
JP6575220B2 (ja) 2015-08-18 2019-09-18 富士電機株式会社 半導体装置
JP7528140B2 (ja) 2022-03-09 2024-08-05 キヤノン株式会社 画像処理装置、画像処理方法、及びプログラム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008056888A (ja) * 2006-07-31 2008-03-13 Fujifilm Corp レーザー分解性樹脂組成物及びそれを用いるパターン形成材料
WO2013170313A1 (en) * 2012-05-18 2013-11-21 Monash University Epoxy resins
JP2023069539A (ja) * 2021-11-05 2023-05-18 国立大学法人横浜国立大学 化合物、エポキシ樹脂組成物及びエポキシ樹脂硬化物

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WO2025033160A1 (ja) 2025-02-13
CN121175290A (zh) 2025-12-19
JPWO2025033160A1 (https=) 2025-02-13
TW202521510A (zh) 2025-06-01

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