TW202502994A - 熱硬化型黏著片及印刷配線板 - Google Patents

熱硬化型黏著片及印刷配線板 Download PDF

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Publication number
TW202502994A
TW202502994A TW113109059A TW113109059A TW202502994A TW 202502994 A TW202502994 A TW 202502994A TW 113109059 A TW113109059 A TW 113109059A TW 113109059 A TW113109059 A TW 113109059A TW 202502994 A TW202502994 A TW 202502994A
Authority
TW
Taiwan
Prior art keywords
adhesive sheet
styrene
thermosetting adhesive
mass
parts
Prior art date
Application number
TW113109059A
Other languages
English (en)
Chinese (zh)
Inventor
伊原恵
大旗亮平
谷井翔太
Original Assignee
日商Ｄｉｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｄｉｃ股份有限公司 filed Critical 日商Ｄｉｃ股份有限公司
Publication of TW202502994A publication Critical patent/TW202502994A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
TW113109059A 2023-04-06 2024-03-12 熱硬化型黏著片及印刷配線板 TW202502994A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023061961 2023-04-06
JP2023-061961 2023-04-06

Publications (1)

Publication Number Publication Date
TW202502994A true TW202502994A (zh) 2025-01-16

Family

ID=92973128

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113109059A TW202502994A (zh) 2023-04-06 2024-03-12 熱硬化型黏著片及印刷配線板

Country Status (5)

Country Link
JP (1) JP7794360B2 (https=)
KR (1) KR20250172802A (https=)
CN (1) CN120359277A (https=)
TW (1) TW202502994A (https=)
WO (1) WO2024209940A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7090428B2 (ja) 2018-02-05 2022-06-24 デクセリアルズ株式会社 接着剤組成物、熱硬化性接着シート及びプリント配線板
WO2021024364A1 (ja) * 2019-08-06 2021-02-11 デクセリアルズ株式会社 接着剤組成物、熱硬化性接着シート及びプリント配線板
US20230151175A1 (en) * 2019-10-16 2023-05-18 Asahi Kasei Kabushiki Kaisha Spacer, method of producing same, and composite
CN115996999A (zh) * 2020-07-01 2023-04-21 信越聚合物株式会社 粘接剂组合物
JPWO2022255078A1 (https=) * 2021-06-02 2022-12-08
JP7555684B2 (ja) * 2021-11-10 2024-09-25 信越化学工業株式会社 熱硬化性マレイミド樹脂組成物
CN113969122B (zh) * 2021-11-25 2024-06-18 华烁科技股份有限公司 一种低介电热固型胶粘剂组合物及其制备方法和挠性覆铜板

Also Published As

Publication number Publication date
JP7794360B2 (ja) 2026-01-06
WO2024209940A1 (ja) 2024-10-10
CN120359277A (zh) 2025-07-22
KR20250172802A (ko) 2025-12-09
JPWO2024209940A1 (https=) 2024-10-10

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