TW202500504A - 氮化矽粉末及使用其的樹脂組成物 - Google Patents

氮化矽粉末及使用其的樹脂組成物 Download PDF

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Publication number
TW202500504A
TW202500504A TW113106180A TW113106180A TW202500504A TW 202500504 A TW202500504 A TW 202500504A TW 113106180 A TW113106180 A TW 113106180A TW 113106180 A TW113106180 A TW 113106180A TW 202500504 A TW202500504 A TW 202500504A
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TW
Taiwan
Prior art keywords
silicon nitride
nitride powder
powder
resin composition
sample
Prior art date
Application number
TW113106180A
Other languages
English (en)
Chinese (zh)
Inventor
中田邦彦
島崎泰治
大門(上原)滿
原田和人
鏡好晴
Original Assignee
日商住友化學股份有限公司
日商燃燒合成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友化學股份有限公司, 日商燃燒合成股份有限公司 filed Critical 日商住友化學股份有限公司
Publication of TW202500504A publication Critical patent/TW202500504A/zh

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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/068—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/11—Powder tap density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Products (AREA)
TW113106180A 2023-03-31 2024-02-21 氮化矽粉末及使用其的樹脂組成物 TW202500504A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023058622 2023-03-31
JP2023-058622 2023-03-31

Publications (1)

Publication Number Publication Date
TW202500504A true TW202500504A (zh) 2025-01-01

Family

ID=92905116

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113106180A TW202500504A (zh) 2023-03-31 2024-02-21 氮化矽粉末及使用其的樹脂組成物

Country Status (5)

Country Link
JP (1) JPWO2024202729A1 (https=)
KR (1) KR20250165634A (https=)
CN (1) CN120916974A (https=)
TW (1) TW202500504A (https=)
WO (1) WO2024202729A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3801252B2 (ja) * 1996-03-27 2006-07-26 電気化学工業株式会社 窒化珪素の製造方法
JP4089974B2 (ja) 2004-04-27 2008-05-28 日立金属株式会社 窒化ケイ素質粉末、窒化ケイ素質焼結体及びこれを用いた電子部品用回路基板
JP2020023406A (ja) * 2016-12-12 2020-02-13 宇部興産株式会社 高純度窒化ケイ素粉末の製造方法
CN110049946A (zh) * 2016-12-12 2019-07-23 宇部兴产株式会社 氮化硅粉末、多晶硅铸锭用脱模剂及多晶硅铸锭的制造方法
JP7063050B2 (ja) * 2018-03-28 2022-05-09 住友金属鉱山株式会社 熱伝導性グリース用表面処理粉末の製造方法および熱伝導性グリース用表面処理粉末
CN109761206A (zh) * 2019-03-18 2019-05-17 青岛瓷兴新材料有限公司 一种高纯低铝类球形β氮化硅粉体、其制造方法及应用

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Publication number Publication date
KR20250165634A (ko) 2025-11-26
JPWO2024202729A1 (https=) 2024-10-03
CN120916974A (zh) 2025-11-07
WO2024202729A1 (ja) 2024-10-03

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