TW202500503A - 氮化矽粉末及使用其的樹脂組成物 - Google Patents
氮化矽粉末及使用其的樹脂組成物 Download PDFInfo
- Publication number
- TW202500503A TW202500503A TW113106164A TW113106164A TW202500503A TW 202500503 A TW202500503 A TW 202500503A TW 113106164 A TW113106164 A TW 113106164A TW 113106164 A TW113106164 A TW 113106164A TW 202500503 A TW202500503 A TW 202500503A
- Authority
- TW
- Taiwan
- Prior art keywords
- silicon nitride
- nitride powder
- powder
- particle size
- resin composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/068—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/51—Particles with a specific particle size distribution
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023058723 | 2023-03-31 | ||
| JP2023-058723 | 2023-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202500503A true TW202500503A (zh) | 2025-01-01 |
Family
ID=92905102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113106164A TW202500503A (zh) | 2023-03-31 | 2024-02-21 | 氮化矽粉末及使用其的樹脂組成物 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024202728A1 (https=) |
| KR (1) | KR20250166257A (https=) |
| CN (1) | CN120916973A (https=) |
| TW (1) | TW202500503A (https=) |
| WO (1) | WO2024202728A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2874299B2 (ja) * | 1990-07-24 | 1999-03-24 | 株式会社イナックス | 窒化珪素焼結体の製造方法 |
| JP4089974B2 (ja) | 2004-04-27 | 2008-05-28 | 日立金属株式会社 | 窒化ケイ素質粉末、窒化ケイ素質焼結体及びこれを用いた電子部品用回路基板 |
| JP2020023406A (ja) * | 2016-12-12 | 2020-02-13 | 宇部興産株式会社 | 高純度窒化ケイ素粉末の製造方法 |
-
2024
- 2024-02-21 JP JP2025509945A patent/JPWO2024202728A1/ja active Pending
- 2024-02-21 TW TW113106164A patent/TW202500503A/zh unknown
- 2024-02-21 KR KR1020257035268A patent/KR20250166257A/ko active Pending
- 2024-02-21 WO PCT/JP2024/006269 patent/WO2024202728A1/ja not_active Ceased
- 2024-02-21 CN CN202480022617.5A patent/CN120916973A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20250166257A (ko) | 2025-11-27 |
| CN120916973A (zh) | 2025-11-07 |
| JPWO2024202728A1 (https=) | 2024-10-03 |
| WO2024202728A1 (ja) | 2024-10-03 |
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