TW202500503A - 氮化矽粉末及使用其的樹脂組成物 - Google Patents

氮化矽粉末及使用其的樹脂組成物 Download PDF

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Publication number
TW202500503A
TW202500503A TW113106164A TW113106164A TW202500503A TW 202500503 A TW202500503 A TW 202500503A TW 113106164 A TW113106164 A TW 113106164A TW 113106164 A TW113106164 A TW 113106164A TW 202500503 A TW202500503 A TW 202500503A
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TW
Taiwan
Prior art keywords
silicon nitride
nitride powder
powder
particle size
resin composition
Prior art date
Application number
TW113106164A
Other languages
English (en)
Chinese (zh)
Inventor
関口泰広
江川貴将
原田和人
鏡好晴
Original Assignee
日商住友化學股份有限公司
日商燃燒合成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商住友化學股份有限公司, 日商燃燒合成股份有限公司 filed Critical 日商住友化學股份有限公司
Publication of TW202500503A publication Critical patent/TW202500503A/zh

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    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00Nitrogen; Compounds thereof
    • C01B21/06Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/068Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/51Particles with a specific particle size distribution
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/54Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW113106164A 2023-03-31 2024-02-21 氮化矽粉末及使用其的樹脂組成物 TW202500503A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023058723 2023-03-31
JP2023-058723 2023-03-31

Publications (1)

Publication Number Publication Date
TW202500503A true TW202500503A (zh) 2025-01-01

Family

ID=92905102

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113106164A TW202500503A (zh) 2023-03-31 2024-02-21 氮化矽粉末及使用其的樹脂組成物

Country Status (5)

Country Link
JP (1) JPWO2024202728A1 (https=)
KR (1) KR20250166257A (https=)
CN (1) CN120916973A (https=)
TW (1) TW202500503A (https=)
WO (1) WO2024202728A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2874299B2 (ja) * 1990-07-24 1999-03-24 株式会社イナックス 窒化珪素焼結体の製造方法
JP4089974B2 (ja) 2004-04-27 2008-05-28 日立金属株式会社 窒化ケイ素質粉末、窒化ケイ素質焼結体及びこれを用いた電子部品用回路基板
JP2020023406A (ja) * 2016-12-12 2020-02-13 宇部興産株式会社 高純度窒化ケイ素粉末の製造方法

Also Published As

Publication number Publication date
KR20250166257A (ko) 2025-11-27
CN120916973A (zh) 2025-11-07
JPWO2024202728A1 (https=) 2024-10-03
WO2024202728A1 (ja) 2024-10-03

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