TW202443780A - 靜電吸盤 - Google Patents

靜電吸盤 Download PDF

Info

Publication number
TW202443780A
TW202443780A TW113102177A TW113102177A TW202443780A TW 202443780 A TW202443780 A TW 202443780A TW 113102177 A TW113102177 A TW 113102177A TW 113102177 A TW113102177 A TW 113102177A TW 202443780 A TW202443780 A TW 202443780A
Authority
TW
Taiwan
Prior art keywords
bonding layer
dielectric substrate
modulus
young
thickness
Prior art date
Application number
TW113102177A
Other languages
English (en)
Chinese (zh)
Inventor
池口雅文
小林幸太
籾山大
Original Assignee
日商Ｔｏｔｏ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2023070804A external-priority patent/JP7347709B1/ja
Application filed by 日商Ｔｏｔｏ股份有限公司 filed Critical 日商Ｔｏｔｏ股份有限公司
Publication of TW202443780A publication Critical patent/TW202443780A/zh

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
TW113102177A 2023-04-24 2024-01-19 靜電吸盤 TW202443780A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2023070804A JP7347709B1 (ja) 2023-04-24 2023-04-24 静電チャック
JP2023-070804 2023-04-24
JP2023-141339 2023-08-31
JP2023141339A JP2024156593A (ja) 2023-04-24 2023-08-31 静電チャック

Publications (1)

Publication Number Publication Date
TW202443780A true TW202443780A (zh) 2024-11-01

Family

ID=93120982

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113102177A TW202443780A (zh) 2023-04-24 2024-01-19 靜電吸盤

Country Status (4)

Country Link
US (1) US20240356465A1 (https=)
JP (1) JP2024156593A (https=)
KR (2) KR102865860B1 (https=)
TW (1) TW202443780A (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5811513B2 (ja) * 2014-03-27 2015-11-11 Toto株式会社 静電チャック
JP6971183B2 (ja) * 2018-03-23 2021-11-24 新光電気工業株式会社 基板固定装置
JP6886439B2 (ja) 2018-08-07 2021-06-16 日本特殊陶業株式会社 複合部材および接着剤組成物
JP7633794B2 (ja) * 2020-03-26 2025-02-20 三星電子株式会社 静電チャック装置
US11776794B2 (en) * 2021-02-19 2023-10-03 Applied Materials, Inc. Electrostatic chuck assembly for cryogenic applications
KR20240092572A (ko) * 2022-12-14 2024-06-24 주식회사 미코세라믹스 서셉터 및 그 제조방법
KR20250135271A (ko) * 2023-04-18 2025-09-12 니혼도꾸슈도교 가부시키가이샤 유지 장치

Also Published As

Publication number Publication date
KR20240156940A (ko) 2024-10-31
KR102865860B1 (ko) 2025-09-30
US20240356465A1 (en) 2024-10-24
KR20250143140A (ko) 2025-09-30
JP2024156593A (ja) 2024-11-06

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