KR102865860B1 - 정전 척 - Google Patents

정전 척

Info

Publication number
KR102865860B1
KR102865860B1 KR1020240001472A KR20240001472A KR102865860B1 KR 102865860 B1 KR102865860 B1 KR 102865860B1 KR 1020240001472 A KR1020240001472 A KR 1020240001472A KR 20240001472 A KR20240001472 A KR 20240001472A KR 102865860 B1 KR102865860 B1 KR 102865860B1
Authority
KR
South Korea
Prior art keywords
bonding layer
dielectric substrate
modulus
young
electrostatic chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020240001472A
Other languages
English (en)
Korean (ko)
Other versions
KR20240156940A (ko
Inventor
마사후미 이케구치
고우타 고바야시
유타카 모미야마
Original Assignee
토토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2023070804A external-priority patent/JP7347709B1/ja
Application filed by 토토 가부시키가이샤 filed Critical 토토 가부시키가이샤
Publication of KR20240156940A publication Critical patent/KR20240156940A/ko
Priority to KR1020250137768A priority Critical patent/KR20250143140A/ko
Application granted granted Critical
Publication of KR102865860B1 publication Critical patent/KR102865860B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H01L21/6833—
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H01L21/68757—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
KR1020240001472A 2023-04-24 2024-01-04 정전 척 Active KR102865860B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020250137768A KR20250143140A (ko) 2023-04-24 2025-09-24 정전 척

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2023070804A JP7347709B1 (ja) 2023-04-24 2023-04-24 静電チャック
JPJP-P-2023-070804 2023-04-24
JPJP-P-2023-141339 2023-08-31
JP2023141339A JP2024156593A (ja) 2023-04-24 2023-08-31 静電チャック

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020250137768A Division KR20250143140A (ko) 2023-04-24 2025-09-24 정전 척

Publications (2)

Publication Number Publication Date
KR20240156940A KR20240156940A (ko) 2024-10-31
KR102865860B1 true KR102865860B1 (ko) 2025-09-30

Family

ID=93120982

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020240001472A Active KR102865860B1 (ko) 2023-04-24 2024-01-04 정전 척
KR1020250137768A Pending KR20250143140A (ko) 2023-04-24 2025-09-24 정전 척

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020250137768A Pending KR20250143140A (ko) 2023-04-24 2025-09-24 정전 척

Country Status (4)

Country Link
US (1) US20240356465A1 (https=)
JP (1) JP2024156593A (https=)
KR (2) KR102865860B1 (https=)
TW (1) TW202443780A (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5811513B2 (ja) * 2014-03-27 2015-11-11 Toto株式会社 静電チャック
JP6971183B2 (ja) * 2018-03-23 2021-11-24 新光電気工業株式会社 基板固定装置
JP6886439B2 (ja) 2018-08-07 2021-06-16 日本特殊陶業株式会社 複合部材および接着剤組成物
JP7633794B2 (ja) * 2020-03-26 2025-02-20 三星電子株式会社 静電チャック装置
US11776794B2 (en) * 2021-02-19 2023-10-03 Applied Materials, Inc. Electrostatic chuck assembly for cryogenic applications
KR20240092572A (ko) * 2022-12-14 2024-06-24 주식회사 미코세라믹스 서셉터 및 그 제조방법
KR20250135271A (ko) * 2023-04-18 2025-09-12 니혼도꾸슈도교 가부시키가이샤 유지 장치

Also Published As

Publication number Publication date
KR20240156940A (ko) 2024-10-31
TW202443780A (zh) 2024-11-01
US20240356465A1 (en) 2024-10-24
KR20250143140A (ko) 2025-09-30
JP2024156593A (ja) 2024-11-06

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