TW202429529A - 用於處理裝置的技術 - Google Patents

用於處理裝置的技術 Download PDF

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Publication number
TW202429529A
TW202429529A TW113106101A TW113106101A TW202429529A TW 202429529 A TW202429529 A TW 202429529A TW 113106101 A TW113106101 A TW 113106101A TW 113106101 A TW113106101 A TW 113106101A TW 202429529 A TW202429529 A TW 202429529A
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TW
Taiwan
Prior art keywords
techniques
processing devices
microelectronic components
bonding
prepared
Prior art date
Application number
TW113106101A
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English (en)
Inventor
賽普里恩 艾米卡 烏佐
蘿拉 威爾 麥卡雷米
桂蓮 高
二世 蓋烏斯 吉爾曼 方騰
Original Assignee
美商艾德亞半導體接合科技有限公司
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Application filed by 美商艾德亞半導體接合科技有限公司 filed Critical 美商艾德亞半導體接合科技有限公司
Publication of TW202429529A publication Critical patent/TW202429529A/zh

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Abstract

本發明的代表性技術提供用於形成微電子組裝件之製程步驟，其包括製備用於接合之微電子組件，諸如晶粒、晶圓、基板及類似者。該等微電子組件之一或多個表面經形成及製備為接合表面。該等微電子組件在該等所製備接合表面處無黏合劑之情況下經堆疊及接合。
TW113106101A 2018-02-15 2019-02-11 用於處理裝置的技術 TW202429529A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US62/631,216 2018-02-15
US16/262,489 2019-01-30

Publications (1)

Publication Number Publication Date
TW202429529A true TW202429529A (zh) 2024-07-16

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