TW202421429A - 感光性元件、抗蝕劑圖案之形成方法、及印刷線路板之製造方法 - Google Patents
感光性元件、抗蝕劑圖案之形成方法、及印刷線路板之製造方法 Download PDFInfo
- Publication number
- TW202421429A TW202421429A TW112135477A TW112135477A TW202421429A TW 202421429 A TW202421429 A TW 202421429A TW 112135477 A TW112135477 A TW 112135477A TW 112135477 A TW112135477 A TW 112135477A TW 202421429 A TW202421429 A TW 202421429A
- Authority
- TW
- Taiwan
- Prior art keywords
- meth
- film
- acrylate
- photosensitive element
- photosensitive
- Prior art date
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/094—Multilayer resist systems, e.g. planarising layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/043813 WO2024116247A1 (ja) | 2022-11-28 | 2022-11-28 | 感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法 |
| WOPCT/JP2022/043813 | 2022-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202421429A true TW202421429A (zh) | 2024-06-01 |
Family
ID=91323290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112135477A TW202421429A (zh) | 2022-11-28 | 2023-09-18 | 感光性元件、抗蝕劑圖案之形成方法、及印刷線路板之製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250278024A1 (https=) |
| JP (1) | JPWO2024116513A1 (https=) |
| KR (1) | KR20250111303A (https=) |
| CN (1) | CN120202439A (https=) |
| TW (1) | TW202421429A (https=) |
| WO (2) | WO2024116247A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001013681A (ja) | 1999-06-28 | 2001-01-19 | Hitachi Chem Co Ltd | 感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 |
| JP2014074764A (ja) | 2012-10-03 | 2014-04-24 | Hitachi Chemical Co Ltd | 感光性エレメント及びこれを用いたレジストパターンの形成方法、プリント配線板の製造方法 |
| KR102654084B1 (ko) * | 2015-07-08 | 2024-04-04 | 가부시끼가이샤 레조낙 | 감광성 엘리먼트, 적층체, 레지스터 패턴의 형성 방법 및 프린트 배선판의 제조 방법 |
| JP2021015296A (ja) * | 2020-10-30 | 2021-02-12 | 昭和電工マテリアルズ株式会社 | 感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法 |
-
2022
- 2022-11-28 WO PCT/JP2022/043813 patent/WO2024116247A1/ja not_active Ceased
-
2023
- 2023-08-30 WO PCT/JP2023/031634 patent/WO2024116513A1/ja not_active Ceased
- 2023-08-30 US US18/858,202 patent/US20250278024A1/en active Pending
- 2023-08-30 CN CN202380037188.4A patent/CN120202439A/zh active Pending
- 2023-08-30 KR KR1020257015044A patent/KR20250111303A/ko active Pending
- 2023-08-30 JP JP2024561170A patent/JPWO2024116513A1/ja active Pending
- 2023-09-18 TW TW112135477A patent/TW202421429A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024116247A1 (ja) | 2024-06-06 |
| US20250278024A1 (en) | 2025-09-04 |
| JPWO2024116513A1 (https=) | 2024-06-06 |
| CN120202439A (zh) | 2025-06-24 |
| WO2024116513A1 (ja) | 2024-06-06 |
| KR20250111303A (ko) | 2025-07-22 |
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