TW202419909A - Guided autofocus assembly - Google Patents

Guided autofocus assembly Download PDF

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Publication number
TW202419909A
TW202419909A TW112127297A TW112127297A TW202419909A TW 202419909 A TW202419909 A TW 202419909A TW 112127297 A TW112127297 A TW 112127297A TW 112127297 A TW112127297 A TW 112127297A TW 202419909 A TW202419909 A TW 202419909A
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Taiwan
Prior art keywords
snap
actuator assembly
wire
sma
frame
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TW112127297A
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Chinese (zh)
Inventor
馬克 A 米勒
Original Assignee
美商哈欽森技術股份有限公司
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Priority claimed from US17/871,780 external-priority patent/US20220357544A1/en
Application filed by 美商哈欽森技術股份有限公司 filed Critical 美商哈欽森技術股份有限公司
Publication of TW202419909A publication Critical patent/TW202419909A/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F03MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03GSPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
    • F03G7/00Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
    • F03G7/06Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
    • F03G7/061Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the actuating element
    • F03G7/0614Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the actuating element using shape memory elements
    • F03G7/06143Wires
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/08Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B3/00Focusing arrangements of general interest for cameras, projectors or printers
    • G03B3/10Power-operated focusing
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B5/00Adjustment of optical system relative to image or object surface other than for focusing
    • G03B5/06Swinging lens about normal to the optical axis
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2205/00Adjustment of optical system relative to image or object surface other than for focusing
    • G03B2205/0053Driving means for the movement of one or more optical element
    • G03B2205/0076Driving means for the movement of one or more optical element using shape memory alloys

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Lens Barrels (AREA)
  • Adjustment Of Camera Lenses (AREA)

Abstract

A buckler wire actuator assembly is provided herein. The buckler wire actuator assembly includes at least one buckler frame mounted onto a base of the buckler wire actuator assembly and including at least one isolated electrical conductor. The buckler wire actuator assembly also includes a first SMA wire in electrical connection to one of the at least one isolated electrical conductor a second SMA wire opposite the first SMA wire. The first and second SMA wires are arranged in series to enable both the first and second SMA wires to receive equal current from a current input.

Description

導引式自動對焦總成Guided auto focus assembly

本發明之實施例係關於形狀記憶合金系統之領域。更特定而言,本發明之實施例係關於形狀記憶合金致動器及其相關方法之領域。Embodiments of the present invention relate to the field of shape memory alloy systems. More particularly, embodiments of the present invention relate to the field of shape memory alloy actuators and related methods.

形狀記憶合金(「SMA」)系統具有一移動總成或結構,例如其可與一相機鏡頭元件結合用作一自動對焦驅動器。此等系統可由諸如一屏蔽罩之一結構圍封。該移動總成經支撐以在一支撐總成上移動。由金屬(諸如磷青銅或不鏽鋼)形成之撓性元件具有一移動板及撓曲件。撓曲件在移動板與固定式支撐總成之間延伸,並充當彈簧以使移動總成能夠相對於固定式支撐總成移動。移動總成與支撐總成係藉由在該等總成之間延伸之四條形狀記憶合金(SMA)線耦合。SMA線之每一者具有附接至支撐總成之一端,及附接至移動總成之一相對端。懸架係藉由對SMA線施加電驅動信號而致動。但此等類型之系統飽受系統複雜性之困擾,其導致需要一大佔據面積與一大高度間隙之龐大系統。此外,目前之系統無法以一緊湊、低輪廓佔據面積提供高Z衝程範圍。Shape Memory Alloy ("SMA") systems have a moving assembly or structure that can be used as an autofocus actuator in conjunction with a camera lens element, for example. These systems can be enclosed by a structure such as a shield. The moving assembly is supported for movement on a support assembly. A flexible element formed of a metal such as phosphor bronze or stainless steel has a moving plate and a flexure. The flexure extends between the moving plate and the fixed support assembly and acts as a spring to enable the moving assembly to move relative to the fixed support assembly. The moving assembly and the support assembly are coupled by four Shape Memory Alloy (SMA) wires extending between the assemblies. Each of the SMA wires has one end attached to the support assembly, and an opposite end attached to the moving assembly. The suspension is actuated by applying an electrical drive signal to the SMA wires. However, these types of systems suffer from system complexity, which results in bulky systems requiring a large footprint and a large height clearance. Additionally, current systems are unable to provide a high Z-stroke range in a compact, low profile footprint.

本文中提供一種扣合線致動器總成。該扣合線致動器總成包括至少一扣合框,該扣合框安裝在扣合線致動器總成之一基座上,並包括至少一隔離電導體。該扣合線致動器總成亦包括一第一SMA線,該第一SMA線電連接至該至少一隔離電導體之一者及與第一SMA線相對之一第二SMA線。第一與第二SMA線以串聯配置,以使第一與第二SMA線兩者能夠從一電流輸入接收相等電流。A snap wire actuator assembly is provided herein. The snap wire actuator assembly includes at least one snap frame mounted on a base of the snap wire actuator assembly and includes at least one isolated electrical conductor. The snap wire actuator assembly also includes a first SMA wire electrically connected to one of the at least one isolated electrical conductor and a second SMA wire opposite the first SMA wire. The first and second SMA wires are configured in series so that both the first and second SMA wires can receive equal current from a current input.

本發明之實施例之其他特徵與優點將從附圖與以下詳細描述中變得明顯。Other features and advantages of embodiments of the present invention will become apparent from the accompanying drawings and the following detailed description.

相關申請案之交叉參考Cross-reference to related applications

本申請案主張2022年7月22日申請之美國專利申請案第17/871,780號之權利及優先權,該申請案之全文以引用之方式併入本文中。This application claims the rights and priority of U.S. Patent Application No. 17/871,780 filed on July 22, 2022, the entire text of which is incorporated herein by reference.

本文中描述一導引式自動對焦總成之實施例,其包括一緊湊佔據面積並實現一高致動高度,例如在本文中稱為z衝程之正z軸方向(z方向)上之移動。圖1繪示根據本發明之一實例之一導引式自動對焦總成100。該總成100包括經組態以與一影像感測器對準之一光軸29。該總成100亦包括一外殼40與一霍爾(hall)外殼壁42。該總成100包括經組態以附著至一撓性印刷電路板(「FPC」) 38上之一磁性元件37。該撓性印刷電路板經組態以附著至霍爾外殼壁42上。如圖2所見,該磁性元件37相對於該霍爾感測器36定位於該總成100的一第一側上,以使該霍爾感測器36經組態以指示一鏡頭元件沿光軸29之位置。An embodiment of a guided autofocus assembly is described herein that includes a compact footprint and achieves a high actuation height, such as movement in the positive z-axis direction (z-direction), referred to herein as z-stroke. FIG. 1 illustrates a guided autofocus assembly 100 according to an embodiment of the present invention. The assembly 100 includes an optical axis 29 configured to be aligned with an image sensor. The assembly 100 also includes a housing 40 and a hall housing wall 42. The assembly 100 includes a magnetic element 37 configured to be attached to a flexible printed circuit board ("FPC") 38. The flexible printed circuit board is configured to be attached to the hall housing wall 42. As seen in FIG. 2 , the magnetic element 37 is positioned on a first side of the assembly 100 relative to the Hall sensor 36 such that the Hall sensor 36 is configured to indicate the position of a lens element along the optical axis 29 .

圖2繪示根據本發明之一實例之圖1之導引式自動對焦總成之一分解圖。該總成100包括一蓋9、一彈簧元件20、一鏡頭支架300、一外殼元件40、一第一扣合框50A、一第二扣合框50B、SMA線80、一滑動基座60及一總成基座70。該鏡頭支架300可被接納於該外殼元件40內。FIG2 shows an exploded view of the guided autofocus assembly of FIG1 according to an embodiment of the present invention. The assembly 100 includes a cover 9, a spring element 20, a lens holder 300, a housing element 40, a first buckle frame 50A, a second buckle frame 50B, an SMA wire 80, a sliding base 60 and an assembly base 70. The lens holder 300 can be received in the housing element 40.

該蓋9經組態以將該彈簧元件20固定至該鏡頭支架300。該彈簧元件20經組態以在與z衝程方向相反之方向上對鏡頭支架300施加一力,根據某些實施例,該力係在平行於該光軸29之一方向上。根據各種實施例,當SMA線80A與80B中之張力因SMA線去致動而降低時,該彈簧元件20經組態以在z衝程方向之相反方向上移動該鏡頭支架300。根據一些實施例,該彈簧元件20由不鏽鋼製成。The cover 9 is configured to fix the spring element 20 to the lens holder 300. The spring element 20 is configured to apply a force to the lens holder 300 in a direction opposite to the z-stroke direction, and according to some embodiments, the force is in a direction parallel to the optical axis 29. According to various embodiments, when the tension in the SMA wires 80A and 80B is reduced due to the deactivation of the SMA wires, the spring element 20 is configured to move the lens holder 300 in a direction opposite to the z-stroke direction. According to some embodiments, the spring element 20 is made of stainless steel.

該外殼40包括一中心壁44、一第一相鄰壁46、一第二相鄰壁48及與該中心壁44相對之一開口面43。該外殼40亦界定一接納空間41。該接納空間41經組態以接納鏡頭支架300。該外殼40亦包括一霍爾外殼壁42。該霍爾外殼壁42經組態以固定一或多個滾珠軸承、一霍爾磁體32及一霍爾感測器36。該霍爾磁體32固定至鏡頭支架300。根據一些實施例,該霍爾感測器36固定在該霍爾外殼壁42中之一孔隙42B內。The housing 40 includes a central wall 44, a first adjacent wall 46, a second adjacent wall 48, and an opening surface 43 opposite to the central wall 44. The housing 40 also defines a receiving space 41. The receiving space 41 is configured to receive the lens holder 300. The housing 40 also includes a Hall housing wall 42. The Hall housing wall 42 is configured to fix one or more ball bearings, a Hall magnet 32, and a Hall sensor 36. The Hall magnet 32 is fixed to the lens holder 300. According to some embodiments, the Hall sensor 36 is fixed in a hole 42B in the Hall housing wall 42.

雖然本文中繪示滾珠軸承,但軸承可由以下任何類型之軸承元件替換,包括但不限於:寶石軸承;流體軸承;磁性軸承;撓曲軸承;複合軸承;及聚甲醛(「POM」)滑動軸承。此外,滾珠軸承亦可由一搖臂或樞轉軸承替換,其中,軸承元件在移動及靜止元件上樞轉或擺動。Although ball bearings are shown herein, the bearings may be replaced by any of the following types of bearing elements, including but not limited to: jewel bearings; fluid bearings; magnetic bearings; flexure bearings; composite bearings; and polyoxymethylene ("POM") slide bearings. In addition, the ball bearing may be replaced by a swing arm or pivot bearing, in which the bearing element pivots or oscillates on moving and stationary elements.

一磁性元件37經安置於該霍爾外殼壁42處,以磁力吸引該霍爾磁體32。在某些實例中,使用黏合劑將該磁性元件37附著至該撓性印刷電路板38。對於某些實施例,使用黏合劑將該撓性印刷電路板38附著至該霍爾外殼壁42。該霍爾外殼壁42經組態以固定元件,例如在該霍爾外殼壁42與該鏡頭支架300之間之滾珠軸承及該霍爾磁體32。該霍爾感測器36經組態以基於該霍爾磁體32與該霍爾感測器36之間之一距離判定該鏡頭支架300在沿該光軸29之z方向上從初始位置移動的量。根據某些實施例,該霍爾感測器36與該FPC 38上之控制器或處理器電耦合。A magnetic element 37 is disposed at the Hall housing wall 42 to magnetically attract the Hall magnet 32. In some examples, the magnetic element 37 is attached to the flexible printed circuit board 38 using an adhesive. For some embodiments, the flexible printed circuit board 38 is attached to the Hall housing wall 42 using an adhesive. The Hall housing wall 42 is configured to fix components such as a ball bearing and the Hall magnet 32 between the Hall housing wall 42 and the lens holder 300. The Hall sensor 36 is configured to determine the amount of movement of the lens holder 300 from an initial position in the z direction along the optical axis 29 based on a distance between the Hall magnet 32 and the Hall sensor 36. According to some embodiments, the Hall sensor 36 is electrically coupled to a controller or processor on the FPC 38.

FPC 38中實施之控制器或處理器產生驅動信號並將該等驅動信號供應至其所連接之SMA線80。控制器或處理器亦接收表示鏡頭支架300沿光軸29之一所需位置之一輸入信號,並產生驅動信號以將鏡頭支架300驅動至所需位置。該等驅動信號可基於霍爾感測器36之輸出使用閉環控制來產生,該霍爾感測器36感測鏡頭支架300沿光軸29之位置。The controller or processor implemented in the FPC 38 generates drive signals and supplies them to the SMA wire 80 to which it is connected. The controller or processor also receives an input signal representing a desired position of the lens holder 300 along the optical axis 29 and generates drive signals to drive the lens holder 300 to the desired position. The drive signals can be generated using closed loop control based on the output of the Hall sensor 36, which senses the position of the lens holder 300 along the optical axis 29.

在某些實例中,在該霍爾外殼壁42與該鏡頭支架300之間形成接納空間35。各接納空間35經組態以接納一或多個滾珠軸承。例如,一第一接納空間35A包括滾珠軸承31A、31B及31C。同樣地,一第二接納空間35B包括滾珠軸承33A、33B及33C。根據一些實施例,鏡頭支架300之霍爾外殼壁42亦包括霍爾磁體32之一接納空間,該接納空間位於第一與第二接納空間35A、35B之間。In some embodiments, a receiving space 35 is formed between the Hall housing wall 42 and the lens holder 300. Each receiving space 35 is configured to receive one or more ball bearings. For example, a first receiving space 35A includes ball bearings 31A, 31B, and 31C. Similarly, a second receiving space 35B includes ball bearings 33A, 33B, and 33C. According to some embodiments, the Hall housing wall 42 of the lens holder 300 also includes a receiving space for the Hall magnet 32, which is located between the first and second receiving spaces 35A, 35B.

第一相鄰壁46在該開口面43處之端包括一接合特徵47。同樣地,第二相鄰壁48在該開口面43處之端包括一接合特徵49。該外殼40亦包括在該開口面43處該第一相鄰壁46與該第二相鄰壁48之間之一基座接合特徵45。其他實施例包括不包含一接合特徵45之一外殼元件40。該霍爾外殼壁42在一第一端包括一接合特徵52,且在與該第一端相對之一第二端包括一第二接合特徵51。The first adjacent wall 46 includes a bonding feature 47 at the end at the opening face 43. Similarly, the second adjacent wall 48 includes a bonding feature 49 at the end at the opening face 43. The housing 40 also includes a base bonding feature 45 between the first adjacent wall 46 and the second adjacent wall 48 at the opening face 43. Other embodiments include a housing element 40 that does not include a bonding feature 45. The Hall housing wall 42 includes a bonding feature 52 at a first end and a second bonding feature 51 at a second end opposite the first end.

該霍爾外殼壁42之接合特徵52經組態以與外殼40之接合特徵47耦合。同樣地,該霍爾外殼壁42之接合特徵51經組態以與該外殼40之接合特徵49耦合。該霍爾外殼壁42經組態以固定至該基座接合特徵45上。The engagement feature 52 of the Hall housing wall 42 is configured to couple with the engagement feature 47 of the housing 40. Similarly, the engagement feature 51 of the Hall housing wall 42 is configured to couple with the engagement feature 49 of the housing 40. The Hall housing wall 42 is configured to be fixed to the base engagement feature 45.

第一與第二扣合框50A、50B經組態以接合該鏡頭支架300。此在下文關於圖3更詳細地討論。第一及第二扣合框50A、50B固定至該滑動基座60。該滑動基座60可使用包括本領域中已知之技術由金屬(諸如不鏽鋼)形成。但熟悉此項技術者將理解,可使用其他材料來形成該滑動基座60。The first and second snap-fit frames 50A, 50B are configured to engage the lens holder 300. This is discussed in more detail below with respect to FIG. 3. The first and second snap-fit frames 50A, 50B are secured to the sliding base 60. The sliding base 60 may be formed of metal (e.g., stainless steel) using techniques known in the art. However, those skilled in the art will appreciate that other materials may be used to form the sliding base 60.

此外,該第一扣合框50A包括耦合至滑動基座60之扣合臂59A。同樣地,第二扣合框50B包括耦合至滑動基座60之扣合臂59B。該滑動基座60可包括滑動軸承55,該滑動軸承55經組態以最小化滑動基座60與扣合臂59A、59B之間之任何摩擦。根據本發明之各種實施例,滑動軸承55可由聚甲醛(「POM」)形成。熟悉此項技術者將理解,可使用其他結構以降低扣合致動器與基座之間之任何摩擦,例如用諸如青銅之金屬製成之滑動軸承。該滑動基座60經組態以與一總成基座70 (例如一自動對焦總成之一自動對焦基座)耦合。In addition, the first snap-fit frame 50A includes a snap-fit arm 59A coupled to the sliding base 60. Similarly, the second snap-fit frame 50B includes a snap-fit arm 59B coupled to the sliding base 60. The sliding base 60 may include a sliding bearing 55, which is configured to minimize any friction between the sliding base 60 and the snap-fit arms 59A, 59B. According to various embodiments of the present invention, the sliding bearing 55 may be formed of polyoxymethylene ("POM"). Those familiar with this technology will understand that other structures may be used to reduce any friction between the snap-fit actuator and the base, such as sliding bearings made of metals such as bronze. The sliding base 60 is configured to be coupled to an assembly base 70 (e.g., an autofocus base of an autofocus assembly).

圖3繪示根據本發明之一實例之總成100之一或多個滾珠軸承之組態。該鏡頭支架300包括一圓形框320。該圓形框320包括第一橫向突出元件314A與一第二橫向突出元件314B。第一及第二橫向突出元件314A、314B各包括一各自表面312,該表面312分別與該外殼40 (如圖2所示)之第一及第二橫向壁46、48之一對應區段對準。根據某些實施例,該第一橫向突出元件314A亦包括一對接合元件310。僅繪示一個接合元件310,但一般技術者將理解,一第二接合元件310在該接合元件310之相反方向上延伸。FIG. 3 illustrates a configuration of one or more ball bearings of an assembly 100 according to an example of the present invention. The lens holder 300 includes a circular frame 320. The circular frame 320 includes a first transverse protruding element 314A and a second transverse protruding element 314B. The first and second transverse protruding elements 314A, 314B each include a respective surface 312, which is aligned with a corresponding section of the first and second transverse walls 46, 48 of the housing 40 (as shown in FIG. 2). According to some embodiments, the first transverse protruding element 314A also includes a pair of engagement elements 310. Only one engagement element 310 is shown, but a person of ordinary skill in the art will understand that a second engagement element 310 extends in the opposite direction of the engagement element 310.

該鏡頭支架300亦經組態以安置於扣合框50A及50B上。扣合框50A及50B附接至一滑動基座60。某些實例包括經劃分以電隔離兩側之一滑動基座60,一側通常用作一接地,且另一側用作供電。其他實施例包括兩側彼此電耦合之一滑動基座60。The lens holder 300 is also configured to be placed on the snap-fit frames 50A and 50B. The snap-fit frames 50A and 50B are attached to a sliding base 60. Some examples include a sliding base 60 divided to electrically isolate two sides, one side is generally used as a ground, and the other side is used as a power supply. Other embodiments include a sliding base 60 with two sides electrically coupled to each other.

扣合框50A與50B分別包括扣合臂59A與59B。扣合臂對59A與59B之各扣合臂在其各自之扣合框50A與50B之一單獨部分上形成。The snap-fit frames 50A and 50B include snap-fit arms 59A and 59B, respectively. Each snap-fit arm of the snap-fit arm pair 59A and 59B is formed on a separate portion of its respective snap-fit frame 50A and 50B.

如本文中所描述,扣合臂59A與59B經組態以當SMA線被致動及去致動時在z軸方向移動。扣合臂59A與59B經組態以與該鏡頭支架300之該接合元件310接合。在某些實例中,扣合臂59A與59B可經組態以與該鏡頭支架300之其他元件接合。例如,扣合臂59A與59B可透過一中心部分(例如一吊床部分)彼此耦合,該中心部分經組態以承托一物件之一部分(例如鏡頭支架300)。根據此等實施例,扣合臂59A與59B經組態以作用於一物件上以使其移動。例如,該等扣合臂經組態以直接作用於一鏡頭支架300之特徵上以將其向上推。As described herein, the snap arms 59A and 59B are configured to move in the z-axis direction when the SMA wire is actuated and deactuated. The snap arms 59A and 59B are configured to engage with the engagement element 310 of the lens holder 300. In some examples, the snap arms 59A and 59B may be configured to engage with other elements of the lens holder 300. For example, the snap arms 59A and 59B may be coupled to each other through a central portion (e.g., a hammock portion) that is configured to support a portion of an object (e.g., the lens holder 300). According to these embodiments, the snap arms 59A and 59B are configured to act on an object to cause it to move. For example, the snap arms are configured to act directly on a feature of a lens holder 300 to push it upward.

圓形框320亦包括隅角元件311。雖本文中繪示兩個隅角元件,但一般技術者將理解,該圓形框320在該鏡頭支架300之相對端亦包括兩個額外之隅角元件311。四個隅角元件311經組態以使該鏡頭支架300在外殼40內並沿光軸29居中。The circular frame 320 also includes corner elements 311. Although two corner elements are shown herein, one of ordinary skill in the art will appreciate that the circular frame 320 also includes two additional corner elements 311 at opposite ends of the lens holder 300. The four corner elements 311 are configured to center the lens holder 300 within the housing 40 and along the optical axis 29.

該鏡頭支架300包括一第一外殼元件316A,其經組態以固定該霍爾磁體32。FPC 38亦位於該鏡頭支架300之第一端處。該磁性元件37經組態以使該霍爾磁體32將該鏡頭支架300吸向磁性元件37,從而有效地將一或多個滾珠軸承固定在接納空間35內之霍爾外殼壁42與鏡頭支架300之間。該FPC 38包括多個接觸墊39。該等接觸墊39可為鍍金不鏽鋼墊,其經組態以對滾珠軸承自動對焦總成之一或多個組件供電。霍爾外殼壁42機械耦合至滾珠軸承33,實現在沿光軸之z方向上移動滾珠軸承之一致動程序。鏡頭支架300之第一端亦包括在該鏡頭支架300與該霍爾外殼壁42之間形成之接納空間35A與35B。The lens holder 300 includes a first housing element 316A configured to secure the Hall magnet 32. The FPC 38 is also located at a first end of the lens holder 300. The magnetic element 37 is configured so that the Hall magnet 32 attracts the lens holder 300 toward the magnetic element 37, thereby effectively securing one or more ball bearings between the Hall housing wall 42 and the lens holder 300 within the receiving space 35. The FPC 38 includes a plurality of contact pads 39. The contact pads 39 may be gold-plated stainless steel pads configured to power one or more components of the ball bearing autofocus assembly. The Hall housing wall 42 is mechanically coupled to the ball bearing 33 to realize a motion process of moving the ball bearing in the z direction along the optical axis. The first end of the lens holder 300 also includes receiving spaces 35A and 35B formed between the lens holder 300 and the Hall housing wall 42.

接納空間35A與35B可形成為一三角形。在某些實例中,該霍爾外殼壁42包括一第一表面,且該隅角元件311A包括一V形槽,其經組態以完成三角形之形狀。在其他實例中,該霍爾外殼壁42包括包含一V形槽之一第一表面,且該隅角元件311A包括與第一表面之V形槽對準之一V形槽。在某些實例中,可潤滑接納空間35A與35B以實現滾珠軸承之一低摩擦環境。例如,可潤滑該接納空間35A以實現滾珠軸承33A、33B與33C之低摩擦旋轉及位移。同樣地,可潤滑該接納空間35B以實現滾珠軸承31A、31B與31C之旋轉及位移。The receiving spaces 35A and 35B can be formed into a triangle. In some examples, the Hall housing wall 42 includes a first surface, and the corner element 311A includes a V-groove configured to complete the shape of the triangle. In other examples, the Hall housing wall 42 includes a first surface including a V-groove, and the corner element 311A includes a V-groove aligned with the V-groove of the first surface. In some examples, the receiving spaces 35A and 35B can be lubricated to achieve a low friction environment for the ball bearing. For example, the receiving space 35A can be lubricated to achieve low friction rotation and displacement of the ball bearings 33A, 33B and 33C. Similarly, the receiving space 35B can be lubricated to achieve rotation and displacement of the ball bearings 31A, 31B and 31C.

此外,潤滑提供一低表面粗糙度,以最小化摩擦並改良動態傾斜。在本發明之某些實例中,霍爾外殼壁42與鏡頭支架300(及因此隅角元件)由塑膠製成。由塑膠形成接納空間35A與35B並潤滑接納空間35A與35B之內表面,提供了滾珠可在其上轉動之一光滑表面,且容許達成所需之動態傾斜效能。In addition, lubrication provides a low surface roughness to minimize friction and improve dynamic tilt. In some examples of the present invention, the Hall housing wall 42 and the lens holder 300 (and therefore the corner element) are made of plastic. Forming the receiving spaces 35A and 35B from plastic and lubricating the inner surfaces of the receiving spaces 35A and 35B provides a smooth surface on which the ball can rotate and allows the desired dynamic tilt performance to be achieved.

滾珠軸承31A至31C與33A至33C相對於其中SMA致動器線80之長度對鏡頭支架300施加力之位置的位置有助於約束圍繞法向於包含光軸29之一平面之一軸線的旋轉。此係因為與軸承31A至31C與33A至33C更遠地定位相比,由SMA致動器線80之長度與滾珠軸承31A至31C與33A至33C施加之力之間的耦合減小。此效應由滾珠軸承數量改良,其增加滾珠軸承沿該光軸29之長度。因此,導引式軸承自動對焦總成之實施例具有比當前之自動對焦總成更好的效能,從而導致改良圖像品質之一更高效總成。The location of the ball bearings 31A-31C and 33A-33C relative to the location where the length of the SMA actuator wire 80 applies force to the lens holder 300 helps constrain rotation about an axis normal to a plane containing the optical axis 29. This is because the coupling between the length of the SMA actuator wire 80 and the force applied by the ball bearings 31A-31C and 33A-33C is reduced compared to if the bearings 31A-31C and 33A-33C were located farther away. This effect is ameliorated by the number of ball bearings, which increases the length of the ball bearings along the optical axis 29. Therefore, embodiments of the guided bearing autofocus assembly have better performance than current autofocus assemblies, resulting in a more efficient assembly with improved image quality.

滑動基座60包括接觸墊62A與62B。接觸墊62A與62B可為鍍金不鏽鋼墊,其經組態以對SMA線80供電。此在下文關於圖4與圖5更詳細地討論。The sliding base 60 includes contact pads 62A and 62B. The contact pads 62A and 62B may be gold-plated stainless steel pads that are configured to power the SMA wire 80. This is discussed in more detail below with respect to FIGS. 4 and 5.

圖4繪示根據本發明之一實例之總成100之SMA線80A與80B之一例示性電路設計。SMA線80A與80B以串聯接線。例如,可經由接觸墊62A提供電力331以對SMA線80A、80B供電。電流沿SMA線80A在方向332A上流動,沿電流流動方向332B進入該滑動基座60中。該電流沿SMA線80B在方向332C上流動,且沿電流流動方向332D進入該滑動基座60中。最終,電流流至接觸墊62B。因此,施加至SMA線80A之相同電流亦施加至SMA線80B。藉由施加相同電流通過SMA線80A與80B,可對兩條線施加更均勻之熱量。對SMA線80A與80B施加更均勻之熱量減少扣合致動器施加至鏡頭支架之兩側之力的不平衡,並減少動態傾斜,其導致跨一影像感測器所有像素之圖像品質更好。FIG. 4 illustrates an exemplary circuit design of SMA wires 80A and 80B of an assembly 100 according to an example of the present invention. SMA wires 80A and 80B are wired in series. For example, power 331 may be provided via contact pad 62A to power SMA wires 80A, 80B. Current flows along SMA wire 80A in direction 332A and enters the sliding base 60 along current flow direction 332B. The current flows along SMA wire 80B in direction 332C and enters the sliding base 60 along current flow direction 332D. Finally, the current flows to contact pad 62B. Therefore, the same current applied to SMA wire 80A is also applied to SMA wire 80B. By applying the same current through SMA wires 80A and 80B, more uniform heat can be applied to the two wires. Applying more uniform heat to SMA wires 80A and 80B reduces the imbalance of the force applied by the snap actuator to the two sides of the lens holder and reduces dynamic tilt, which results in better image quality across all pixels of an image sensor.

圖5繪示根據本發明之一實例之總成100之SMA線80A與80B之一例示性電路設計。在某些實例中,SMA線80A與80B並聯接線。例如,可經由接觸墊62B提供電力231以對SMA線80A、80B供電。電流沿SMA線80A在方向231A上流動,沿電流流動方向231C進入該滑動基座60中。電流亦在方向232D上流入該滑動基座60中,沿SMA線80B在方向232C上,沿SMA線80B在方向232B上,並沿電流流動方向231C進入滑動基座60中。最後,電流流至接觸墊62A。FIG. 5 illustrates an exemplary circuit design of SMA wires 80A and 80B of an assembly 100 according to an example of the present invention. In some examples, SMA wires 80A and 80B are wired in parallel. For example, power 231 may be provided via contact pad 62B to power SMA wires 80A, 80B. Current flows along SMA wire 80A in direction 231A and into the sliding base 60 along current flow direction 231C. Current also flows into the sliding base 60 in direction 232D, along SMA wire 80B in direction 232C, along SMA wire 80B in direction 232B, and into the sliding base 60 along current flow direction 231C. Finally, the current flows to contact pad 62A.

至SMA線80A與80B之熱量取決於由SMA線長度之製造引起的電阻變動。因此,各側可以不同之力推動該鏡頭支架300,從而使圖5之總成100更容易發生傾斜變動。但本文中公開之滾珠軸承組態減輕此傾斜變動,使得其不成問題。The amount of heat to the SMA wires 80A and 80B depends on the resistance change caused by the manufacturing of the SMA wire length. Therefore, each side can push the lens holder 300 with a different force, making the assembly 100 of Figure 5 more susceptible to tilting. However, the ball bearing configuration disclosed herein mitigates this tilting change, making it not a problem.

圖6繪示根據本發明之一替代實例之一致動器總成600。該致動器總成600亦包括一第一致動器框630與一第二致動器框640。該致動器總成600可包括一SMA線610與一SMA線620。該致動器總成600亦包括一電源650與一接地660。該致動器總成600可包括但不限於扣合致動器、雙壓電晶片致動器及其他SMA致動器。在某些實例中,該致動器總成600係一扣合線致動器。FIG. 6 illustrates an actuator assembly 600 according to an alternative embodiment of the present invention. The actuator assembly 600 also includes a first actuator frame 630 and a second actuator frame 640. The actuator assembly 600 may include an SMA wire 610 and an SMA wire 620. The actuator assembly 600 also includes a power supply 650 and a ground 660. The actuator assembly 600 may include, but is not limited to, snap-fit actuators, bi-piezoelectric chip actuators, and other SMA actuators. In some embodiments, the actuator assembly 600 is a snap-fit wire actuator.

本發明之以下實例實現通過致動器總成600之SMA線之最佳化電流流動。本實例提供具有用於串聯附接SMA線之一隔離金屬壓接墊之至少一個隔離導體電路,其容許相等電流沿方向601至604流過兩條線。在由單個源供電時,此係達成致動器總成600之兩側相等推力之最佳方式。此在下文中更詳細地討論。The following example of the present invention achieves optimized current flow through the SMA wires of the actuator assembly 600. This example provides at least one isolated conductor circuit with one isolated metal crimp pad for serially attaching the SMA wires, which allows equal current to flow through both wires in directions 601 to 604. This is the best way to achieve equal thrust on both sides of the actuator assembly 600 when powered by a single source. This is discussed in more detail below.

圖7係根據本發明之一實例之致動器總成600接納鏡頭支架300的一側視圖。可輸入一電流至該致動器總成600之SMA線中,其使SMA線加熱收縮,此驅動該鏡頭支架300向上。可提供一彈簧(未展示)以使該鏡頭支架300向下返回。FIG7 is a side view of an actuator assembly 600 according to one embodiment of the present invention receiving a lens holder 300. A current may be input into the SMA wire of the actuator assembly 600, which heats and contracts the SMA wire, which drives the lens holder 300 upward. A spring (not shown) may be provided to return the lens holder 300 downward.

圖8係根據本發明之一實例之致動器總成600接納鏡頭支架300的一等距側視圖。該致動器總成600包括一第一致動器框630與一第二致動器框640。在某些實例中,該第一致動器框630與該第二致動器框可分別經組態作為第一與第二扣合框。該第一致動器框630包括一第一致動器臂631。在某些實例中,該第一致動器臂631可經組態作為第一扣合臂。該第一致動器框630之第一致動器臂631朝向該第二致動器框640延伸。該第二致動器框640類似地包括一第一致動器臂641。該第二致動器框640之第一致動器臂641朝向第一致動器框640延伸。第一與第二致動器框630、640之第一致動器臂631、641由一SMA線620連接。FIG8 is an isometric side view of an actuator assembly 600 receiving a lens holder 300 according to an embodiment of the present invention. The actuator assembly 600 includes a first actuator frame 630 and a second actuator frame 640. In some embodiments, the first actuator frame 630 and the second actuator frame can be configured as first and second snap-fit frames, respectively. The first actuator frame 630 includes a first actuator arm 631. In some embodiments, the first actuator arm 631 can be configured as a first snap-fit arm. The first actuator arm 631 of the first actuator frame 630 extends toward the second actuator frame 640. The second actuator frame 640 similarly includes a first actuator arm 641. The first actuator arm 641 of the second actuator frame 640 extends toward the first actuator frame 640. The first actuator arms 631 , 641 of the first and second actuator frames 630 , 640 are connected by an SMA wire 620 .

該第一致動器框630包括一第二致動器臂632。該第二致動器臂632可經組態作為一第二扣合臂。該第一致動器框630之第二致動器臂632朝向該第二致動器框640延伸。該第二致動器框640類似地包括一第二致動器臂642。該第二致動器框640之第二致動器臂642朝向該第一致動器框640延伸。第一與第二致動器框630、640之第二致動器臂632、642由一第二SMA線連接。The first actuator frame 630 includes a second actuator arm 632. The second actuator arm 632 can be configured as a second snap-on arm. The second actuator arm 632 of the first actuator frame 630 extends toward the second actuator frame 640. The second actuator frame 640 similarly includes a second actuator arm 642. The second actuator arm 642 of the second actuator frame 640 extends toward the first actuator frame 640. The second actuator arms 632, 642 of the first and second actuator frames 630, 640 are connected by a second SMA wire.

第一及第二致動器框630、640之第一致動器臂631、641及第二致動器臂632、642經組態以與鏡頭支架300接合,如圖2中描述。The first actuator arms 631 , 641 and the second actuator arms 632 , 642 of the first and second actuator frames 630 , 640 are configured to engage with the lens holder 300 , as described in FIG. 2 .

圖9繪示根據本發明之一實例之由致動器總成600施加於該鏡頭支架300上之一力。該致動器總成600之第一致動器臂631、641與第二致動器臂632、642對該鏡頭支架300施加一向上力。具體而言,該第一致動器臂631、641對該鏡頭支架300提供一向上力611。類似地,該第二致動器臂632、642對鏡頭支架300提供一向上力612。向上力611與向上力612分別使用SMA線620與610產生。在某些實例中,向上力611與向上力612相等。FIG. 9 illustrates a force applied to the lens holder 300 by the actuator assembly 600 according to an example of the present invention. The first actuator arms 631, 641 and the second actuator arms 632, 642 of the actuator assembly 600 apply an upward force to the lens holder 300. Specifically, the first actuator arms 631, 641 provide an upward force 611 to the lens holder 300. Similarly, the second actuator arms 632, 642 provide an upward force 612 to the lens holder 300. The upward force 611 and the upward force 612 are generated using SMA wires 620 and 610, respectively. In some examples, the upward force 611 and the upward force 612 are equal.

當由SMA線620與610所產生之向上力611、612不相等時,可能產生過多扭矩,誘使該鏡頭支架300傾斜,其可能導致一擷取影像之影像畸變或模糊。When the upward forces 611, 612 generated by the SMA wires 620 and 610 are not equal, excessive torque may be generated, inducing the lens holder 300 to tilt, which may cause image distortion or blurring of a captured image.

圖10繪示與致動器線致動器總成600組裝之鏡頭支架300之一側視圖。如圖可見,該第一致動器臂631、641與該鏡頭支架300接觸。FIG10 shows a side view of the lens holder 300 assembled with the actuator wire actuator assembly 600. As can be seen in the figure, the first actuator arms 631, 641 are in contact with the lens holder 300.

圖11繪示根據本發明之一實例之致動器線致動器總成600之一分解圖。圖12繪示根據本發明之一實例之該致動器總成600之一組裝圖。該致動器總成600包括該第一致動器框630、該第二致動器框640。該致動器總成600亦包括一基座670。該基座670經組態以接納該第一致動器框630及與該第一致動器框630相對之第二致動器框640。致動器總成600亦包括SMA線620、610。該致動器總成600亦包括位於基座670之各隅角處之平坦滑動軸承675A、675B、675C與675D。各平坦滑動軸承675A、675B、675C與675D經組態以作為一機械元件,其將相對運動約束為僅預期運動,並減少移動部件間之摩擦。FIG. 11 shows an exploded view of an actuator wire actuator assembly 600 according to an embodiment of the present invention. FIG. 12 shows an assembled view of the actuator assembly 600 according to an embodiment of the present invention. The actuator assembly 600 includes the first actuator frame 630, the second actuator frame 640. The actuator assembly 600 also includes a base 670. The base 670 is configured to receive the first actuator frame 630 and the second actuator frame 640 opposite to the first actuator frame 630. The actuator assembly 600 also includes SMA wires 620, 610. The actuator assembly 600 also includes flat sliding bearings 675A, 675B, 675C and 675D located at each corner of the base 670. Each flat sliding bearing 675A, 675B, 675C and 675D is configured to act as a mechanical element that constrains relative motion to only the intended motion and reduces friction between moving parts.

在某些實例中,SMA線620、610以串聯配置,以達成來自單一電源之跨兩條線的相等電流。當SMA線620、610兩者接收一相等電流時,線承受相等熱量,因此致動相等(膨脹或收縮)。因此,致動器各側之力偏差最低。此最小化鏡頭傾斜與減少相機影像之影像畸變。In some examples, the SMA wires 620, 610 are configured in series to achieve equal current across both wires from a single power source. When both SMA wires 620, 610 receive an equal current, the wires experience equal heat and therefore actuate equally (expand or contract). As a result, force deviations on either side of the actuator are minimized. This minimizes lens tilt and reduces image distortion of the camera image.

在某些實例中,第一與第二致動器框630、640由一單體金屬材料製成。在其他實例中,第一與第二致動器框630、640由附接有隔離電導體之金屬材料製成。隔離電導體將詳細討論。In some embodiments, the first and second actuator frames 630, 640 are made of a single metal material. In other embodiments, the first and second actuator frames 630, 640 are made of a metal material with isolated conductors attached. The isolated conductors will be discussed in detail.

圖13繪示根據本發明之一實例之跨致動器總成600之一電流路徑。具體而言,該電流路徑包括一電源輸入1305、沿一第一隔離導體之路徑1306、沿一第一SMA線之路徑1302、沿一單體金屬致動器框之路徑1301、沿一第二SMA線之路徑1307、沿一第二隔離導體之路徑1303,以及接地輸出1304。13 shows a current path across the actuator assembly 600 according to an embodiment of the present invention. Specifically, the current path includes a power input 1305, a path 1306 along a first isolation conductor, a path 1302 along a first SMA line, a path 1301 along a single metal actuator frame, a path 1307 along a second SMA line, a path 1303 along a second isolation conductor, and a ground output 1304.

電流在電源輸入1305處進入該致動器總成600中。然後電流沿路徑1306傳過一第一隔離導體,該導體經電連接至該電源輸入1305。一旦電流沿路徑1306傳過一隔離導體,電流就沿路徑1302傳過一第一SMA線。該第一SMA線經電連接至該第一隔離導體。一旦電流沿路徑1302傳過第一SMA線,電流就沿路徑1301傳過該單體金屬致動器框。該第一SMA線經電連接至該單體金屬致動器框。一旦電流沿路徑1301傳過該單體金屬致動器框,電流就沿路徑1307傳過該第二SMA線。該第二SMA線亦經電連接至該單體金屬致動器框。然後電流沿路徑1303傳過一第二隔離導體,該導體經電連接至該第二SMA線。一旦電流沿路徑1303傳過該第二隔離導體,電流就傳過接地輸出1304。Current enters the actuator assembly 600 at power input 1305. The current then passes through a first isolation conductor along path 1306, which is electrically connected to the power input 1305. Once the current passes through an isolation conductor along path 1306, the current passes through a first SMA wire along path 1302. The first SMA wire is electrically connected to the first isolation conductor. Once the current passes through the first SMA wire along path 1302, the current passes through the single metal actuator frame along path 1301. The first SMA wire is electrically connected to the single metal actuator frame. Once the current passes through the single metal actuator frame along path 1301, the current passes through the second SMA wire along path 1307. The second SMA wire is also electrically connected to the single metal actuator frame. The current then passes through a second isolation conductor along path 1303, which is electrically connected to the second SMA wire. Once the current passes through the second isolation conductor along path 1303, the current passes through the ground output 1304.

如圖13所繪示,第一與第二SMA線經串聯組態以達成來自單一源(即,該電源輸入1305)跨兩條線之相等電流。在某些實例中,分別沿路徑1302與1307跨第一與第二SMA線施加之相等電流相當於在第一與第二SMA線處導出之相等熱量。在某些實例中,致動器各側上之最小力偏差最小化鏡頭傾斜並減少相機影像之影像畸變。具有路徑1301之該第一致動器框可經組態為一金屬單體結構。另一致動器框係附接有隔離電導體(未展示)之金屬。As shown in FIG. 13 , the first and second SMA wires are configured in series to achieve equal current across the two wires from a single source (i.e., the power input 1305). In some examples, the equal current applied across the first and second SMA wires along paths 1302 and 1307, respectively, is equivalent to equal heat conducted at the first and second SMA wires. In some examples, the minimum force deviation on each side of the actuator minimizes lens tilt and reduces image distortion of the camera image. The first actuator frame with path 1301 can be configured as a metal single body structure. The other actuator frame is metal with an isolated conductor (not shown) attached.

圖14繪示根據本發明之一實例之致動器總成600之一致動器框640與一電路680。在某些實例中,該致動器框640可經組態為一扣合框640。具體而言,圖14繪示致動器框640與電路680之所有層。在某些實例中,可在該電路680之導體層頂上提供一保護覆蓋塗層(未展示)。該致動器框640亦包括一第一隔離導體1401與一第二隔離導體1402。第一與第二隔離導體1401、1402可實施以完成如關於圖13中描述之電流路徑。第一與第二隔離導體1401、1402可包括通往隔離金屬墊之通孔,以將第一與第二隔離導體1401、1402電連接至圖13之第一與第二SMA線。此將在下文關於圖18更詳細地討論。FIG. 14 illustrates an actuator frame 640 and a circuit 680 of an actuator assembly 600 according to an embodiment of the present invention. In some embodiments, the actuator frame 640 can be configured as a snap-on frame 640. Specifically, FIG. 14 illustrates all layers of the actuator frame 640 and the circuit 680. In some embodiments, a protective cover coating (not shown) can be provided on top of the conductor layers of the circuit 680. The actuator frame 640 also includes a first isolation conductor 1401 and a second isolation conductor 1402. The first and second isolation conductors 1401, 1402 can be implemented to complete the current path as described with respect to FIG. 13. The first and second isolated conductors 1401, 1402 may include vias to the isolated metal pads to electrically connect the first and second isolated conductors 1401, 1402 to the first and second SMA wires of Figure 13. This will be discussed in more detail below with respect to Figure 18.

在某些實例中,圖13之第一與第二SMA線可分別附接至第一與第二隔離導體1401、1402。該等第一與第二SMA線可藉由電阻焊接壓接或機械壓接而壓接至該等第一與第二隔離導體1401、1402。In some examples, the first and second SMA wires of FIG13 can be attached to the first and second isolated conductors 1401, 1402, respectively. The first and second SMA wires can be crimped to the first and second isolated conductors 1401, 1402 by resistance welding crimping or mechanical crimping.

圖15繪示根據本發明之一實例之具有第一與第二隔離導體1401、1402之致動器框640之一分解圖。該致動器框640包括一第一隔離導體電路682、一第二隔離導體電路684與一金屬致動器框層688。在某些實例中,該金屬致動器框層688可經組態為一金屬扣合框層。該致動器框640亦包括一絕緣體層686,其夾置於該等第一及第二隔離導體電路682、684與該金屬致動器框層688之間。在某些實例中,可在該等第一與第二隔離導體1401、1402頂上提供一保護覆蓋塗層。FIG. 15 shows an exploded view of an actuator frame 640 having first and second isolation conductors 1401, 1402 according to an embodiment of the present invention. The actuator frame 640 includes a first isolation conductor circuit 682, a second isolation conductor circuit 684, and a metal actuator frame layer 688. In some embodiments, the metal actuator frame layer 688 can be configured as a metal snap-fit frame layer. The actuator frame 640 also includes an insulator layer 686 sandwiched between the first and second isolation conductor circuits 682, 684 and the metal actuator frame layer 688. In some embodiments, a protective cover coating can be provided on top of the first and second isolation conductors 1401, 1402.

圖16繪示根據本發明之一實例之致動器框640之一俯視圖。該致動器框640可包括第一與第二隔離導體1401、1402。該致動器框640可包括相鄰於第一隔離導體1401之一第一通孔681B。此外,該致動器框640可包括相鄰於第二隔離導體1402之一第二通孔681A。第一與第二通孔681B、681A係絕緣層(如圖15之686)中暴露隔離金屬墊之至少一部分之通孔或孔隙。該致動器框640亦可包括電氣墊683A、683B,其經組態以以將該致動器框640電連接至一電源輸入及接地輸出(圖13中之1305與1304)。FIG. 16 shows a top view of an actuator frame 640 according to an example of the present invention. The actuator frame 640 may include first and second isolation conductors 1401, 1402. The actuator frame 640 may include a first through hole 681B adjacent to the first isolation conductor 1401. In addition, the actuator frame 640 may include a second through hole 681A adjacent to the second isolation conductor 1402. The first and second through holes 681B, 681A are through holes or apertures in an insulating layer (e.g., 686 in FIG. 15) that expose at least a portion of an isolation metal pad. The actuator frame 640 may also include electrical pads 683A, 683B configured to electrically connect the actuator frame 640 to a power input and ground output (1305 and 1304 in FIG. 13).

圖17繪示根據本發明之一實例之致動器框640之一仰視圖。該第一隔離導體1401經附接至一第一SMA線,如本文中所討論。該第二隔離導體1402經附接至一第二SMA線,如本文中所討論。17 shows a bottom view of an actuator frame 640 according to an example of the present invention. The first isolation conductor 1401 is attached to a first SMA wire, as discussed herein. The second isolation conductor 1402 is attached to a second SMA wire, as discussed herein.

圖18繪示第二致動器框640類似地包括一第二致動器臂642。在某些實例中,該第二致動器臂642可經組態為一第二扣合臂。圖18亦繪示根據本發明之一實例之一隔離導體通孔688。圖18亦繪示SMA線610使用SMA線壓接1801而附接至隔離導體1939。因此,在某些實例中,該隔離導體1939為至該SMA線610之連接接頭或壓接位置。在某些實例中,SMA線壓接1801可經組態為一電阻焊接或一機械折疊壓接。FIG. 18 shows that the second actuator frame 640 similarly includes a second actuator arm 642. In some examples, the second actuator arm 642 can be configured as a second snap-on arm. FIG. 18 also shows an isolation conductor through hole 688 according to an example of the present invention. FIG. 18 also shows that the SMA wire 610 is attached to the isolation conductor 1939 using an SMA wire crimp 1801. Thus, in some examples, the isolation conductor 1939 is a connection joint or crimp location to the SMA wire 610. In some examples, the SMA wire crimp 1801 can be configured as a resistance weld or a mechanical crimp crimp.

圖19繪示根據本發明之一實例之隔離導體通孔688至隔離金屬墊之一截面圖。該通孔延伸穿過該導體層1940、該絕緣體層1941,且至該金屬墊層1901。19 shows a cross-sectional view of an isolated conductor via 688 to an isolated metal pad according to an embodiment of the present invention. The via extends through the conductor layer 1940, the insulator layer 1941, and to the metal pad layer 1901.

圖20繪示根據本發明之一實例之一模組化扣合電路總成2000。圖21繪示一模組化扣合電路總成2000。該模組化扣合電路總成2000包括一第一致動器框2001與一第二致動器框2002。在某些實例中,該第一致動器框2001與該第二致動器框2002可分別經組態為一第一與第二扣合框。該模組化扣合電路總成2000亦包括一金屬基座2004,該等第一與第二致動器框2001、2002附接至該金屬基座。該模組化扣合電路總成2000亦包括一第一SMA線2010與一第二SMA線2020。該模組化扣合電路總成2000亦包括一第一致動器電路2030與一第二致動器電路2040,其等經組態以附接並致動該第二致動器框2002。在某些實例中,該第一致動器電路2030與該第二致動器電路2040可分別經組態為第一與第二扣合電路。該第一致動器框2001亦可包括經組態以附接並致動該第一致動器框2001之一第一與第二致動器電路(未展示)。FIG. 20 illustrates a modular snap-fit circuit assembly 2000 according to an example of the present invention. FIG. 21 illustrates a modular snap-fit circuit assembly 2000. The modular snap-fit circuit assembly 2000 includes a first actuator frame 2001 and a second actuator frame 2002. In some examples, the first actuator frame 2001 and the second actuator frame 2002 can be configured as a first and second snap-fit frame, respectively. The modular snap-fit circuit assembly 2000 also includes a metal base 2004 to which the first and second actuator frames 2001, 2002 are attached. The modular snap-fit circuit assembly 2000 also includes a first SMA wire 2010 and a second SMA wire 2020. The modular snap-on circuit assembly 2000 also includes a first actuator circuit 2030 and a second actuator circuit 2040, which are configured to attach to and actuate the second actuator frame 2002. In some examples, the first actuator circuit 2030 and the second actuator circuit 2040 can be configured as first and second snap-on circuits, respectively. The first actuator frame 2001 can also include a first and second actuator circuit (not shown) configured to attach to and actuate the first actuator frame 2001.

圖22A繪示根據本發明之一實例之模組化扣合電路總成之第一與第二模組化致動器電路2030與2040。圖22B繪示根據本發明之一實例之第一與第二模組化致動器電路2030與2040之一底視圖。該第一模組化致動器電路2030可包括一隔離金屬墊2034以附接至一SMA線(未展示)。該隔離金屬墊2034可由鋼或任何其他類型之合適金屬製成。該第一模組化致動器電路2030亦可包括一電氣墊2032。該第二模組化致動器電路2040可包括一隔離金屬墊2044以附接至一SMA線(未展示)。該隔離金屬墊2044可由鋼或任何其他類型之合適金屬製成。該第二模組化致動器電路2040亦可包括一電氣墊2042。FIG. 22A illustrates a first and a second modular actuator circuit 2030 and 2040 of a modular snap-fit circuit assembly according to an embodiment of the present invention. FIG. 22B illustrates a bottom view of the first and the second modular actuator circuit 2030 and 2040 according to an embodiment of the present invention. The first modular actuator circuit 2030 may include an isolation metal pad 2034 for attachment to an SMA wire (not shown). The isolation metal pad 2034 may be made of steel or any other type of suitable metal. The first modular actuator circuit 2030 may also include an electrical pad 2032. The second modular actuator circuit 2040 may include an isolation metal pad 2044 for attachment to an SMA wire (not shown). The isolation metal pad 2044 can be made of steel or any other type of suitable metal. The second modular actuator circuit 2040 can also include an electrical pad 2042.

第一與第二模組化致動器電路2030與2040實現模組化扣合電路總成之一較高面板密度。該等第一與第二模組化致動器電路2030與2040亦使相同模組化電路組件能夠製造並設置於各種相機尺寸上,而不需重新設計或重建電路。此外,該等第一與第二模組化致動器電路2030與2040經組態以附接至具有一單體金屬成分之致動器框。在某些實例中,該等第一與第二模組化致動器電路2030與2040具有隔離金屬墊2034、2044以將SMA線壓接至此(電阻焊接或折疊壓接)。雖本文中繪示兩個模組化致動器電路,但致動器框亦可經附接至一單一模組化電路設計。The first and second modular actuator circuits 2030 and 2040 enable a higher panel density of modular snap-fit circuit assemblies. The first and second modular actuator circuits 2030 and 2040 also enable the same modular circuit assembly to be manufactured and placed on a variety of camera sizes without redesigning or rebuilding the circuit. In addition, the first and second modular actuator circuits 2030 and 2040 are configured to be attached to an actuator frame having a single metal component. In some examples, the first and second modular actuator circuits 2030 and 2040 have isolated metal pads 2034, 2044 to crimp SMA wires thereto (resistance welding or fold crimping). Although two modular actuator circuits are shown herein, the actuator frames can also be attached to a single modular circuit design.

圖23繪示根據本發明之一實例之該第一模組化致動器電路2030之多電路層之一分解圖。圖24繪示根據本發明之一實例之該第一模組化致動器電路2030之多電路層之一組裝圖。該第一模組化扣合電路2030包括一隔離導體層2031、一絕緣體層2033與一金屬層2035。該第一模組化扣合電路2030亦包括一隔離金屬墊2037以附接至一SMA線(未展示)。FIG. 23 shows an exploded view of multiple circuit layers of the first modular actuator circuit 2030 according to an example of the present invention. FIG. 24 shows an assembled view of multiple circuit layers of the first modular actuator circuit 2030 according to an example of the present invention. The first modular snap-fit circuit 2030 includes an isolated conductor layer 2031, an insulator layer 2033, and a metal layer 2035. The first modular snap-fit circuit 2030 also includes an isolated metal pad 2037 for attachment to an SMA wire (not shown).

該隔離導體層2031可直接連接至隔離金屬墊2037。例如,該隔離導體層2031可直接鍍至該隔離金屬墊2037。在其他實例中,隔離導體層2031可焊接至隔離金屬墊2037。在替代實例中,導電環氧樹脂可施加於該隔離導體層2031與該隔離金屬墊2037之間。在某些替代實例中,該隔離導體層2031可雷射或電阻焊接至該隔離金屬墊2037。The isolation conductor layer 2031 may be directly connected to the isolation metal pad 2037. For example, the isolation conductor layer 2031 may be directly plated to the isolation metal pad 2037. In other examples, the isolation conductor layer 2031 may be welded to the isolation metal pad 2037. In alternative examples, a conductive epoxy may be applied between the isolation conductor layer 2031 and the isolation metal pad 2037. In certain alternative examples, the isolation conductor layer 2031 may be laser or resistance welded to the isolation metal pad 2037.

該絕緣體層2033可直接連接至該金屬層2035。例如,該絕緣體層2033可形成於金屬層2035頂上,接著是隔離導體層2031與覆蓋塗層;各層在一附加程序中形成。在本發明之某些替代實例中,該絕緣體層2033可在至少一位置處膠合至該金屬層2035。在某些替代實例中,該絕緣體層2033、該隔離導體層2031與(若干)覆蓋塗層可構建為單獨撓性電路組件,並膠合至該金屬層2035。The insulator layer 2033 may be directly connected to the metal layer 2035. For example, the insulator layer 2033 may be formed on top of the metal layer 2035, followed by the isolation conductor layer 2031 and the cover coating; each layer is formed in an additional process. In some alternative embodiments of the present invention, the insulator layer 2033 may be glued to the metal layer 2035 at at least one location. In some alternative embodiments, the insulator layer 2033, the isolation conductor layer 2031 and (several) cover coatings may be constructed as a separate flexible circuit component and glued to the metal layer 2035.

(圖13之)具有隔離導體之致動器總成600與(圖20之)模組化扣合電路總成2000兩者均實現兩條SMA線串聯附接,以最小化由一單一源驅動時該等線之間之力差。該模組化扣合電路總成2000係一更緊湊之電路設計,其在各種尺寸相機平台內實施時無需改變尺寸。在某些實例中,該隔離金屬墊用作隔離電路與該SMA線之間之一連接點。歸因於該SMA線之高拉力,此隔離金屬墊經剛性連接至金屬致動器框。因此,在某些實例中,隔離金屬墊經形成為至SMA線之一壓接。Both the actuator assembly 600 with isolated conductors (of FIG. 13 ) and the modular snap-fit circuit assembly 2000 (of FIG. 20 ) implement serial attachment of two SMA wires to minimize force differences between the wires when driven by a single source. The modular snap-fit circuit assembly 2000 is a more compact circuit design that does not require size changes when implemented in camera platforms of various sizes. In some embodiments, the isolation metal pad is used as a connection point between the isolation circuit and the SMA wire. Due to the high tensile force of the SMA wire, this isolation metal pad is rigidly connected to the metal actuator frame. Therefore, in some embodiments, the isolation metal pad is formed as a press connection to the SMA wire.

(圖13之)具有隔離導體之致動器總成600與(圖20之)模組化扣合電路總成2000兩者均可使用附加電路技術構建。例如,在一金屬層頂上形成一絕緣體層,在該絕緣體頂上形成導電材料,接著是一保護覆蓋塗層。在某些替代實例中,絕緣體層、導體層與(若干)覆蓋塗層可分別形成,然後使用一黏著劑附接至金屬層。Both the actuator assembly 600 with isolated conductors (of FIG. 13 ) and the modular snap-fit circuit assembly 2000 (of FIG. 20 ) can be constructed using additive circuit techniques. For example, an insulator layer is formed on top of a metal layer, a conductive material is formed on top of the insulator, and then a protective cover coating is formed. In some alternative embodiments, the insulator layer, the conductor layer, and the cover coating(s) can be formed separately and then attached to the metal layer using an adhesive.

應理解,如本文中所使用之諸如「頂」、「底」、「上方」、「下方」,及x方向、y方向及z方向之術語僅為方便起見,表示部件相對於彼此之空間關係,而非任何特定空間或重力定向。因此,該等術語意欲涵蓋組件部件之一總成,不論該總成是否經定向為圖中所示及說明書中所述之特定定向、自該定向上下顛倒或任何其他旋轉變動。It should be understood that terms such as "top", "bottom", "above", "below", and the x-, y-, and z-directions as used herein are merely for convenience and refer to the spatial relationship of components relative to each other, rather than any particular spatial or gravitational orientation. Thus, such terms are intended to encompass an assembly of component parts regardless of whether the assembly is oriented in the particular orientation shown in the figures and described in the specification, inverted from that orientation, or in any other rotational variation.

應理解,如本文中所使用之術語「本發明」不應解釋為指僅提出具有一單一基本要素或要素群組之一單一發明。類似地,亦應理解術語「本發明」涵蓋可各自視為獨立發明之多項獨立創新。雖本發明已關於其較佳實施例及圖式進行詳細描述,但熟悉此項技術者將理解,在不脫離本發明之精神與範疇之情況下,可對本發明實施例完成各種調適與修改。此外,本文中所述之技術可用以製作具有二、三、四、五、六或更多個(統稱為n個)雙壓電晶片致動器與扣合致動器之一裝置。因此,應理解,如上文所闡述之詳細描述及附圖不旨在限制本發明之廣度,本發明之廣度應僅自隨附發明申請專利範圍及其適當地解釋之合法等效物推斷。It should be understood that the term "present invention" as used herein should not be interpreted as referring to a single invention having only a single essential element or group of elements. Similarly, it should also be understood that the term "present invention" encompasses multiple independent innovations that can each be considered an independent invention. Although the present invention has been described in detail with respect to its preferred embodiments and drawings, those skilled in the art will understand that various adaptations and modifications can be made to the embodiments of the present invention without departing from the spirit and scope of the present invention. In addition, the techniques described herein can be used to make a device having two, three, four, five, six or more (collectively referred to as n) dual piezoelectric chip actuators and snap-on actuators. Therefore, it should be understood that the detailed description and accompanying drawings as set forth above are not intended to limit the breadth of the present invention, which should be inferred only from the scope of the accompanying invention claims and their properly interpreted legal equivalents.

9:蓋 20:彈簧元件 29:光軸 31A:滾珠軸承 31B:滾珠軸承 31C:滾珠軸承 32:霍爾磁體 33A:滾珠軸承 33B:滾珠軸承 33C:滾珠軸承 35A:第一接納空間 35B:第二接納空間 36:霍爾感測器 37:磁性元件 38:撓性印刷電路板(FPC) 39:接觸墊 40:外殼元件/外殼 41:接納空間 42:霍爾外殼壁 42B:孔隙 43:開口面 44:中心壁 45:基座接合特徵 46:第一相鄰壁 47:接合特徵 48:第二相鄰壁 49:接合特徵 50A:第一扣合框 50B:第二扣合框 51:第二接合特徵 52:接合特徵 55:滑動軸承 59A:扣合臂 59B:扣合臂 60:滑動基座 62A:接觸墊 62B:接觸墊 70:總成基座 80A:SMA線 80B:SMA線 100:導引式自動對焦總成 231:電源 231A:方向 231C:方向 232B:方向 232C:方向 232D:方向 300:鏡頭支架 310:接合元件 311A:隅角元件 311B:隅角元件 312A:表面 314A:第一橫向突出元件 314B:第二橫向突出元件 316A:第一外殼元件 320:圓形框 331:電源 332A:方向 332B:方向 332C:方向 332D:方向 600:致動器總成 601:方向 602:方向 603:方向 604:方向 610:SMA線 611:向上力 612:向上力 620:SMA線 630:第一致動器框 631:第一致動器臂 632:第二致動器臂 640:第二致動器框 641:第一致動器臂 642:第二致動器臂 650:電源 660:接地電位 670:基座 675A:平坦滑動軸承 675B:平坦滑動軸承 675C:平坦滑動軸承 675D:平坦滑動軸承 680:電路 681A:通孔 681B:通孔 682:第一隔離導體電路 683A:電氣墊 683B:電氣墊 684:第二隔離導體電路 686:絕緣體層 688:金屬致動器框層/隔離導體通孔 1301:路徑 1302:路徑 1303:路徑 1304:接地輸出 1305:電源輸入 1306:路徑 1307:路徑 1401:第一隔離導體 1402:第二隔離導體 1801:SMA線壓接 1901:金屬墊層 2000:模組化扣合電路總成 2001:第一致動器框 2002:第二致動器框 2004:金屬基座 2010:第一SMA線 2020:第二SMA線 2030:第一致動器電路/第一模組化致動器電路 2031:隔離導體層 2032:電氣墊 2033:絕緣體層 2034:隔離金屬墊 2035:金屬層 2040:第二致動器電路/第二模組化致動器電路 2042:電氣墊 2044:隔離金屬墊 9: Cover 20: Spring element 29: Optical axis 31A: Ball bearing 31B: Ball bearing 31C: Ball bearing 32: Hall magnet 33A: Ball bearing 33B: Ball bearing 33C: Ball bearing 35A: First receiving space 35B: Second receiving space 36: Hall sensor 37: Magnetic element 38: Flexible printed circuit board (FPC) 39: Contact pad 40: Housing element/housing 41: Receiving space 42: Hall housing wall 42B: Aperture 43: Opening surface 44: Center wall 45: Base joint feature 46: First adjacent wall 47: Joint feature 48: Second adjacent wall 49: Joint feature 50A: First snap-fit frame 50B: Second snap-fit frame 51: Second joint feature 52: Joint feature 55: Sliding bearing 59A: Snap-fit arm 59B: Snap-fit arm 60: Sliding base 62A: Contact pad 62B: Contact pad 70: Assembly base 80A: SMA wire 80B: SMA wire 100: Guided autofocus assembly 231: Power supply 231A: Direction 231C: Direction 232B: Direction 232C: Direction 232D: Direction 300: Lens bracket 310: Engagement element 311A: Corner element 311B: Corner element 312A: Surface 314A: First transverse protrusion element 314B: Second transverse protrusion element 316A: First housing element 320: Circular frame 331: Power supply 332A: Direction 332B: Direction 332C: Direction 332D: Direction 600: Actuator assembly 601: Direction 602: Direction 603: Direction 604: Direction 610: SMA wire 611: Upward force 612: Upward force 620: SMA wire 630: First actuator frame 631: First actuator arm 632: Second actuator arm 640: Second actuator frame 641: First actuator arm 642: Second actuator arm 650: Power supply 660: Ground potential 670: Base 675A: Flat sliding bearing 675B: Flat sliding bearing 675C: Flat sliding bearing 675D: Flat sliding bearing 680: Circuit 681A: Through hole 681B: Through hole 682: First isolation conductor circuit 683A: Electrical pad 683B: Electrical pad 684: Second isolation conductor circuit 686: Insulator layer 688: Metal actuator frame layer/isolation conductor through hole 1301: Path 1302: Path 1303: Path 1304: Ground output 1305: Power input 1306: Path 1307: Path 1401: First isolation conductor 1402: Second isolation conductor 1801: SMA wire crimping 1901: Metal pad layer 2000: Modular snap-fit circuit assembly 2001: First actuator frame 2002: Second actuator frame 2004: Metal base 2010: First SMA wire 2020: Second SMA wire 2030: First actuator circuit/first modular actuator circuit 2031: Isolation conductor layer 2032: Electrical pad 2033: Insulation layer 2034: Isolation metal pad 2035: Metal layer 2040: Second actuator circuit/second modular actuator circuit 2042: Electrical pad 2044: Isolation metal pad

本發明之實施例藉由實例而非限制在附圖之圖式中繪示,其中相同元件符號指代相同元件,且其中:Embodiments of the invention are illustrated by way of example and not limitation in the figures of the accompanying drawings in which like reference numerals refer to like elements and in which:

圖1繪示根據本發明之一實例之一滾珠軸承自動對焦總成;FIG1 shows a ball bearing automatic focusing assembly according to an embodiment of the present invention;

圖2繪示根據本發明之一實例之圖1之滾珠軸承扣合自動對焦總成之一分解圖;FIG. 2 is an exploded view of the ball bearing automatic focusing assembly of FIG. 1 according to an embodiment of the present invention;

圖3繪示根據本發明之一實例之滾珠軸承扣合自動對焦總成之滾珠軸承的組態;FIG. 3 illustrates a configuration of a ball bearing engaging with an automatic focusing assembly according to an embodiment of the present invention;

圖4繪示根據本發明之一實例之滾珠軸承扣合自動對焦總成之SMA線之一電路設計;FIG. 4 shows a circuit design of an SMA line of a ball bearing buckled automatic focus assembly according to an embodiment of the present invention;

圖5繪示根據本發明之一實例之滾珠軸承扣合自動對焦總成之SMA線之一電路設計;FIG. 5 shows a circuit design of an SMA line of a ball bearing buckled automatic focus assembly according to an embodiment of the present invention;

圖6繪示根據本發明之一替代實例之一致動器總成;FIG6 illustrates an actuator assembly according to an alternative embodiment of the present invention;

圖7係根據本發明之一實例之圖6之致動器總成接納圖2之鏡頭支架的一側視圖;FIG. 7 is a side view of the actuator assembly of FIG. 6 receiving the lens bracket of FIG. 2 according to an embodiment of the present invention;

圖8係根據本發明之一實例之圖6之致動器總成接納圖2之鏡頭支架之一等距側視圖;FIG8 is an isometric side view of the actuator assembly of FIG6 receiving the lens support of FIG2 according to an embodiment of the present invention;

圖9繪示根據本發明之一實例之由圖6之致動器總成施加於圖2之鏡頭支架上的一力;FIG. 9 illustrates a force applied by the actuator assembly of FIG. 6 to the lens support of FIG. 2 according to an embodiment of the present invention;

圖10繪示根據本發明之一實例之組裝在圖6之致動器總成上的圖2之鏡頭支架;FIG. 10 illustrates the lens support of FIG. 2 assembled on the actuator assembly of FIG. 6 according to one embodiment of the present invention;

圖11繪示根據本發明之一實例之圖6之致動器總成之一分解圖;FIG. 11 is an exploded view of the actuator assembly of FIG. 6 according to an embodiment of the present invention;

圖12繪示根據本發明之一實例之圖6之致動器總成之一組裝圖;FIG. 12 is an assembly diagram of the actuator assembly of FIG. 6 according to an embodiment of the present invention;

圖13繪示根據本發明之一實例之跨圖6之致動器總成之一電流路徑;FIG. 13 illustrates a current path across the actuator assembly of FIG. 6 according to an embodiment of the present invention;

圖14繪示根據本發明之一實例之圖6之致動器總成之一扣合框及一電路;FIG. 14 illustrates a snap-fit frame and a circuit of the actuator assembly of FIG. 6 according to an embodiment of the present invention;

圖15繪示根據本發明之一實例之具有隔離導體之一致動器框;FIG. 15 illustrates an actuator frame with isolated conductors according to an embodiment of the present invention;

圖16繪示根據本發明之一實例之圖15之致動器框之一俯視圖;FIG. 16 illustrates a top view of the actuator frame of FIG. 15 according to an embodiment of the present invention;

圖17繪示根據本發明之一實例之圖15之致動器框之一仰視圖;FIG. 17 illustrates a bottom view of the actuator frame of FIG. 15 according to an embodiment of the present invention;

圖18繪示根據本發明之一實例之一隔離導體通孔至隔離金屬墊;FIG. 18 shows an isolated conductor via to an isolated metal pad according to an embodiment of the present invention;

圖19繪示根據本發明之一實例之圖18之隔離導體通孔至金屬之一截面圖;FIG. 19 is a cross-sectional view of the isolated conductor via to metal of FIG. 18 according to an embodiment of the present invention;

圖20繪示根據本發明之一實例之一模組化電路總成;FIG. 20 shows a modular circuit assembly according to an embodiment of the present invention;

圖21繪示根據本發明之一實例之一模組化電路總成;FIG. 21 illustrates a modular circuit assembly according to an embodiment of the present invention;

圖22A繪示根據本發明之一實例之模組化電路總成之模組化電路;FIG. 22A shows a modular circuit of a modular circuit assembly according to an embodiment of the present invention;

圖22B繪示根據本發明之一實例之模組化電路總成之模組化電路之一底視圖;FIG. 22B illustrates a bottom view of a modular circuit of a modular circuit assembly according to an embodiment of the present invention;

圖23繪示根據本發明之一實例之模組化電路總成之多個電路層之一分解圖;及FIG. 23 illustrates an exploded view of multiple circuit layers of a modular circuit assembly according to an embodiment of the present invention; and

圖24繪示根據本發明之一實例之模組化電路總成之多個電路層之一組裝圖。FIG. 24 shows an assembly diagram of multiple circuit layers of a modular circuit assembly according to an embodiment of the present invention.

9:蓋 9: Cover

20:彈簧元件 20: Spring element

29:光軸 29: Light axis

31A:滾珠軸承 31A: Ball bearing

31B:滾珠軸承 31B: Ball bearing

32:霍爾磁體 32: Hall magnet

33A:滾珠軸承 33A: Ball bearing

33B:滾珠軸承 33B: Ball bearing

33C:滾珠軸承 33C: Ball bearing

35A:第一接納空間 35A: First receiving space

35B:第二接納空間 35B: Second receiving space

36:霍爾感測器 36: Hall sensor

37:磁性元件 37: Magnetic components

38:撓性印刷電路板(FPC) 38: Flexible printed circuit board (FPC)

40:外殼元件 40: Shell components

41:接納空間 41: Receiving space

42:霍爾外殼壁 42: Hall's outer shell

42B:孔隙 42B: Porosity

43:開口面 43: Opening surface

44:中心壁 44: Center wall

45:基座接合特徵 45: Base joint features

46:第一相鄰壁 46: First neighbor

47:接合特徵 47:Joint features

48:第二相鄰壁 48: Second phase neighbor

49:接合特徵 49:Joint features

50A:第一扣合框 50A: First buckle frame

50B:第二扣合框 50B: Second buckle frame

51:第二接合特徵 51: Second bonding feature

52:接合特徵 52:Joint features

55:滑動軸承 55: Sliding bearing

59A:扣合臂 59A: snap-fit arm

59B:扣合臂 59B: snap-fit arm

60:滑動基座 60: Sliding base

70:總成基座 70: Assembly base

80A:SMA線 80A:SMA cable

80B:SMA線 80B:SMA cable

100:致動器總成 100:Actuator assembly

300:鏡頭支架 300: Lens bracket

Claims (20)

一種扣合線致動器總成,其包含: 至少一個扣合框,其安裝於該扣合線致動器總成之一基座上,並包括至少一個隔離電導體; 一第一SMA線,其電連接至該至少一個隔離電導體之一者;及 一第二SMA線,其與該第一SMA線相對, 其中該等第一與第二SMA線經串聯配置,以使該等第一與第二SMA線兩者能夠自一電流輸入接收相等電流。 A snap wire actuator assembly comprising: At least one snap frame mounted on a base of the snap wire actuator assembly and including at least one isolated conductor; A first SMA wire electrically connected to one of the at least one isolated conductor; and A second SMA wire opposite the first SMA wire, wherein the first and second SMA wires are configured in series so that both the first and second SMA wires can receive equal current from a current input. 如請求項1之扣合線致動器總成,其中該至少一個扣合框包括安裝於該扣合線致動器總成之該基座上之一第一及第二扣合框。A snap-line actuator assembly as claimed in claim 1, wherein the at least one snap-line frame comprises a first and a second snap-line frame mounted on the base of the snap-line actuator assembly. 如請求項2之扣合線致動器總成,其中該第二扣合框包含與該等第一及第二SMA線電連接之一單體金屬材料。A snap-on wire actuator assembly as claimed in claim 2, wherein the second snap-on frame comprises a single piece of metal material electrically connected to the first and second SMA wires. 如請求項2之扣合線致動器總成,其進一步包含定位於該基座之各隅角處之至少一個平坦滑動軸承,且各平坦滑動軸承經組態以約束移動組件之間之相對運動及減少摩擦。The latching line actuator assembly of claim 2 further comprises at least one flat sliding bearing positioned at each corner of the base, and each flat sliding bearing is configured to constrain the relative motion between the moving components and reduce friction. 如請求項2之扣合線致動器總成,其中該至少一個扣合框進一步包括與該第二SMA線電連接之一第二隔離電導體。A snap wire actuator assembly as in claim 2, wherein the at least one snap frame further comprises a second isolated conductor electrically connected to the second SMA wire. 如請求項5之扣合線致動器總成,其中該第二SMA線使用一電阻焊接壓接或機械壓接之至少一者而壓接至該第二隔離導體。A snap-wire actuator assembly as in claim 5, wherein the second SMA wire is crimped to the second isolation conductor using at least one of a resistance welding crimp or a mechanical crimp. 如請求項5之扣合線致動器總成,其中一電流傳過該至少一個扣合框之該第二隔離導體至一接地輸出。As in the snap-fit wire actuator assembly of claim 5, wherein a current is transmitted through the second isolation conductor of the at least one snap-fit frame to a ground output. 如請求項1之扣合線致動器總成,其中該電流輸入經組態以接收一電流,該電流傳過該至少一個隔離電導體至該第一SMA線。A snap wire actuator assembly as in claim 1, wherein the current input is configured to receive a current that is passed through the at least one isolated conductor to the first SMA wire. 如請求項1之扣合線致動器總成,其中該第一SMA線使用一電阻焊接壓接或機械壓接之至少一者而壓接至該至少一個隔離電導體之一者。A snap-wire actuator assembly as in claim 1, wherein the first SMA wire is crimped to one of the at least one isolated conductor using at least one of a resistance welding crimp or a mechanical crimp. 如請求項1之扣合線致動器總成,其中該至少一個扣合框包括至少一個隔離導體電路、一金屬扣合框層及在該至少一個隔離導體電路與該金屬扣合框層之間之一絕緣層。A snap-fit wire actuator assembly as claimed in claim 1, wherein the at least one snap-fit frame includes at least one isolation conductor circuit, a metal snap-fit frame layer and an insulating layer between the at least one isolation conductor circuit and the metal snap-fit frame layer. 如請求項10之扣合線致動器總成,其中該至少一個扣合框包括穿過該絕緣層至該至少一個隔離電導體之至少一個電通孔。A snap-fit wire actuator assembly as in claim 10, wherein the at least one snap-fit frame includes at least one electrical via extending through the insulating layer to the at least one isolated conductor. 如請求項10之扣合線致動器總成,其中該至少一個扣合框包括設置於該至少一個隔離導體電路上之一保護覆蓋塗層。A snap-fit wire actuator assembly as claimed in claim 10, wherein the at least one snap-fit frame includes a protective covering coating disposed on the at least one isolation conductor circuit. 如請求項10之扣合線致動器總成,其中該至少一個扣合框進一步包括相鄰於一第一隔離導體之一第一電通孔及相鄰於一第二隔離導體之一第二通孔。A snap-fit wire actuator assembly as claimed in claim 10, wherein the at least one snap-fit frame further includes a first electrical through hole adjacent to a first isolation conductor and a second through hole adjacent to a second isolation conductor. 一種扣合線致動器總成,其包含: 至少一個扣合框,其安裝於該扣合線致動器總成之一基座上; 一第一SMA線,其電連接至該至少一個扣合框;及 一第二SMA線,其與該第一SMA線相對, 其中該等第一與第二SMA線經串聯配置,以使該等第一與第二SMA線兩者能夠自一電流輸入接收相等電流。 A snap wire actuator assembly comprising: At least one snap frame mounted on a base of the snap wire actuator assembly; A first SMA wire electrically connected to the at least one snap frame; and A second SMA wire opposite the first SMA wire, wherein the first and second SMA wires are configured in series so that both the first and second SMA wires can receive equal current from a current input. 如請求項14之扣合線致動器總成,其中該至少一個扣合框包括至少一個隔離電導體。A snap-fit wire actuator assembly as in claim 14, wherein the at least one snap-fit frame comprises at least one isolated conductor. 如請求項15之扣合線致動器總成,其中該第一SMA線電連接至該至少一個隔離電導體。A snap-wire actuator assembly as in claim 15, wherein the first SMA wire is electrically connected to the at least one isolated conductor. 如請求項16之扣合線致動器總成,其中該第一SMA線使用一電阻焊接壓接或機械壓接之至少一者而壓接至該至少一個隔離電導體之一者。A snap-wire actuator assembly as in claim 16, wherein the first SMA wire is crimped to one of the at least one isolated conductor using at least one of a resistance welding crimp or a mechanical crimp. 如請求項14之扣合線致動器總成,其進一步包含一第二扣合框,其安裝於該扣合線致動器總成之該基座上、與該第一扣合框相對。The fastening line actuator assembly of claim 14 further comprises a second fastening frame mounted on the base of the fastening line actuator assembly, opposite to the first fastening frame. 如請求項18之扣合線致動器總成,其中該至少一個扣合框包括安裝於該扣合線致動器總成之該基座上之一第一與第二扣合框。A snap-line actuator assembly as claimed in claim 18, wherein the at least one snap-line frame comprises a first and a second snap-line frame mounted on the base of the snap-line actuator assembly. 如請求項19之扣合線致動器總成,其中該第二SMA線使用一電阻焊接壓接或一機械壓接之至少一者而壓接至該第二隔離導體。A snap-wire actuator assembly as in claim 19, wherein the second SMA wire is crimped to the second isolation conductor using at least one of a resistance welding crimp or a mechanical crimp.
TW112127297A 2022-07-22 2023-07-21 Guided autofocus assembly TW202419909A (en)

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US11815794B2 (en) * 2017-05-05 2023-11-14 Hutchinson Technology Incorporated Shape memory alloy actuators and methods thereof
WO2019142005A1 (en) * 2018-01-22 2019-07-25 Cambridge Mechatronics Limited Shape memory alloy actuation apparatus
KR102356806B1 (en) * 2020-04-08 2022-01-28 삼성전기주식회사 Lens module and camera module have the same
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