JP2023530250A - Shape memory alloy actuator and method - Google Patents

Abstract

SMA actuators and related methods are described. One embodiment of the actuator includes a base, a plurality of bending arms, and at least a first shape memory alloy wire connected to a pair of the bending arms of the plurality of bending arms. Another embodiment of the actuator includes a base and at least one bimorph actuator comprising a shape memory alloy material. A bimorph actuator is attached to the base.

Description

Embodiments of the present invention relate to the field of shape memory alloy systems. More particularly, embodiments of the present invention relate to the field of shape memory alloy actuators and related methods.

A shape memory alloy (SMA) system comprises a movable assembly or structure that can be used, for example, with a camera lens element as an autofocus driver. These systems may be surrounded by structures such as screening cans. A movable assembly is supported for movement on the support assembly by bearings, such as a plurality of balls. A flexure element formed from metal such as phosphor bronze or stainless steel has a movable plate and a flexure. A flexure extends between the movable plate and the stationary support assembly and functions as a spring to permit movement of the movable assembly relative to the stationary support assembly. The ball allows the moveable assembly to move with little resistance. The moveable assembly and support assembly are connected by four shape memory alloy (SMA) wires extending between the assemblies. Each of the SMA wires has one end attached to the support assembly and the opposite end attached to the moveable assembly. The suspension is actuated by applying an electrical drive signal to the SMA wires. However, these types of systems suffer from system complexity, resulting in bulky systems requiring large footprints and high clearances. Additionally, current systems fail to provide high Z-stroke range in a compact, low-profile footprint.

SMA actuators and related methods are described. One embodiment of the actuator includes a base, a plurality of buckle arms, and at least a first shape memory alloy wire connected to a pair of the plurality of buckle arms. Another embodiment of the actuator includes a base and at least one bimorph actuator comprising a shape memory alloy material. A bimorph actuator is attached to the base.

A method of manufacturing a skew module tilt OIS assembly comprising: providing an upper skew assembly configured to provide yaw axis motion to enable dynamic tilt adjustment; and mounting the sensor circuit PCB to the autofocus assembly on the side facing the upper distortion assembly, thereby connecting the sensor circuit between the sensor circuit PCB and the autofocus assembly comprising the sensor bracket. connecting the bottom distortion assembly to the module circuit PCB opposite the autofocus assembly; and attaching the bottom distortion assembly to the top distortion assembly along a fixed perimeter. .

The method, wherein the upper strain assembly includes a 4-wire strain actuator.
The method, wherein the bottom strain assembly includes a 4-wire strain actuator.
The method of claim 1, wherein the skew module tilt OIS assembly is operable to effect tilt of the two-axis camera module OIS to move the movable mass to a greater tilt angle of up to ±5 degrees.

The method, wherein the movable mass includes an autofocus assembly, a sensor circuit PCB, and a module circuit PCB.
The method further comprising securing the autofocus assembly to the upper distortion assembly with an adhesive.

The method, wherein the upper flexure assembly includes one or more flexure arms, each flexure arm arranged to impart yaw axis motion to the upper flexure assembly.
The method of claim 1, wherein the bottom flexure assembly includes one or more flexure arms, each flexure arm arranged to impart pitch axis motion to the bottom flexure assembly.

The method, wherein the top warp assembly and the bottom warp assembly are operable to push apart from each other to effect dynamic tilting of the warp module tilt OIS assembly.
The method further includes providing an upper skew assembly including a housing with an upper spring, an upper autofocus carriage, a flexible sensor circuit, and a yaw tilt subassembly.

The method, wherein the yaw tilt subassembly includes a tilt subassembly flexure frame, a stainless-steel (SST) flexure frame, two or more slide bearings, at least one SMA wire, and an SST slide base.

The method further includes providing a bottom skew assembly including a housing with a bottom spring, a bottom autofocus carriage, and a pitch tilt subassembly.
The method, wherein the pitch tilt subassembly includes a tilt subassembly strain frame, a stainless steel (SST) strain frame, two or more slide bearings, at least one SMA wire, and an SST slide base.

Other features and advantages of embodiments of the invention will become apparent from the accompanying drawings and from the detailed description that follows.
Embodiments of the invention are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings, in which like reference numerals indicate like elements.

4 illustrates a lens assembly including an SMA actuator configured as a distortion actuator according to one embodiment; 1 shows an SMA actuator according to one embodiment. 1 shows an SMA actuator according to one embodiment. FIG. 4 illustrates an exploded view of an autofocus assembly including an SMA wire actuator according to one embodiment; 1 illustrates an autofocus assembly including an SMA actuator according to one embodiment; 1 shows an SMA actuator according to one embodiment, including a sensor; FIG. 10 shows top and side views of an SMA actuator configured as a distortion actuator according to one embodiment, with a lens carriage. FIG. 10 shows a side view of a section of an SMA actuator according to an embodiment; FIG. 4 shows multiple views of one embodiment of a strain actuator. Fig. 3 shows a bimorph actuator according to one embodiment with a lens carriage; FIG. 4B shows a cutaway view of an autofocus assembly including an SMA actuator according to one embodiment. FIG. 4 shows a diagram of a bimorph actuator according to some embodiments; FIG. 4 shows a diagram of a bimorph actuator according to some embodiments; FIG. 4 shows a diagram of a bimorph actuator according to some embodiments; FIG. 12 shows a diagram of one embodiment of a bimorph actuator, according to one embodiment. FIG. 11 illustrates an end pad cross-section of a bimorph actuator according to one embodiment; FIG. FIG. 10 illustrates a central feed pad cross-section of a bimorph actuator according to one embodiment; FIG. FIG. 11 illustrates an exploded view of an SMA actuator including two strain actuators according to one embodiment; 1 shows an SMA actuator including two strain actuators according to one embodiment. FIG. 4B shows a side view of an SMA actuator including two strain actuators according to one embodiment. FIG. 4B shows a side view of an SMA actuator including two strain actuators according to one embodiment. FIG. 11 illustrates an exploded view of an assembly including an SMA actuator including two strain actuators according to one embodiment; 1 shows an SMA actuator including two strain actuators according to one embodiment. 1 shows an SMA actuator including two strain actuators according to one embodiment. 1 shows an SMA actuator including two strain actuators according to one embodiment. FIG. 11 illustrates an SMA actuator including two strain actuators and a coupler according to one embodiment; FIG. FIG. 10 illustrates an exploded view of an SMA system including an SMA actuator including a tortuous actuator comprising a laminate hammock according to one embodiment. 24 shows an SMA system including an SMA actuator including a bending actuator 2402 comprising a laminate hammock according to one embodiment. 1 illustrates a strain actuator including a laminate hammock according to one embodiment. FIG. 11 illustrates a laminate hammock for an SMA actuator according to one embodiment. FIG. FIG. 4 illustrates a laminated crimp connection of an SMA actuator according to one embodiment. FIG. Fig. 3 shows an SMA actuator including a strain actuator with a laminated plate hammock; 1 illustrates an exploded view of an SMA system including an SMA actuator including a strain actuator according to one embodiment; FIG. 1 illustrates an SMA system including an SMA actuator including a strain actuator according to one embodiment; 1 illustrates an SMA actuator including a strain actuator according to one embodiment; FIG. 12 illustrates a two-yoke capture joint of a pair of flexure arms of an SMA actuator according to one embodiment; FIG. FIG. 11 illustrates a resistance weld crimp of an SMA actuator used to attach SMA wire to the strain actuator according to one embodiment. FIG. 1 shows an SMA actuator including a strain actuator with a two-yoke capture joint; 1 illustrates an SMA bimorph liquid lens according to one embodiment. 1 illustrates a perspective SMA bimorph liquid lens according to one embodiment. FIG. 2 illustrates a cross-sectional and bottom view of an SMA bimorph liquid lens according to one embodiment; 1 illustrates an SMA system including an SMA actuator with a bimorph actuator, according to one embodiment. 1 shows an SMA actuator with a bimorph actuator according to one embodiment. The length of the bimorph actuator and the location of bonding pads for the SMA wires are shown to extend the wire length beyond the bimorph actuator. 1 shows an exploded view of an SMA system including a bimorph actuator according to one embodiment. FIG. FIG. 4 shows an exploded view of a subsection of an SMA actuator according to one embodiment; 1 shows a subsection of an SMA actuator according to one embodiment; 1 illustrates a 5-axis sensor shifting system according to one embodiment. 1 illustrates an exploded view of a 5-axis sensor shifting system according to one embodiment. FIG. FIG. 11 shows an SMA actuator including a bimorph actuator that is incorporated into this circuit for all movements, according to one embodiment. FIG. FIG. 11 shows an SMA actuator including a bimorph actuator that is incorporated into this circuit for all movements, according to one embodiment. FIG. 4 illustrates a cross-section of a 5-axis sensor shifting system according to one embodiment. 1 shows an SMA actuator according to one embodiment, including a bimorph actuator. FIG. 10 shows a top view of an SMA actuator according to one embodiment, including a bimorph actuator with the image sensor moved to different x and y positions. FIG. 11 illustrates an SMA actuator including a bimorph actuator according to one embodiment configured as a box bimorph autofocus; FIG. 1 illustrates an SMA actuator including a bimorph actuator according to one embodiment; 1 illustrates an SMA actuator including a bimorph actuator according to one embodiment; 1 illustrates an SMA actuator including a bimorph actuator according to one embodiment; 1 shows an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator. FIG. 10 shows an exploded view of an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator configured as a two-axis lens-shifting OIS. FIG. 10B shows a cross-section of an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator configured as a two-axis lens-shift OIS. FIG. 4 illustrates a box bimorph actuator according to one embodiment. 1 shows an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator. 1 shows an exploded view of an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator. FIG. 1 shows a cross-section of an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator. 4 illustrates a box bimorph actuator according to one embodiment. 1 shows an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator. 1 shows an exploded view of an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator. FIG. 1 shows an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator. 1 shows an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator. 1 shows an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator. FIG. 10 illustrates an exploded view of an SMA including a SMA actuator, including a bimorph actuator, according to one embodiment. FIG. 11 shows a cross-section of an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator configured as a 3-axis sensor shift OIS. 4 illustrates a box bimorph actuator component according to one embodiment; 1 illustrates a flexible sensor circuit for use in an SMA system according to one embodiment; 1 shows an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator. 1 shows an exploded view of an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator. FIG. 1 illustrates a cross-section of an SMA system including an SMA actuator according to one embodiment; 4 illustrates a box bimorph actuator according to one embodiment. 1 illustrates a flexible sensor circuit for use in an SMA system according to one embodiment; 1 shows an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator. 1 shows an exploded view of an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator. FIG. 1 illustrates a cross-section of an SMA system including an SMA actuator according to one embodiment; 4 illustrates a box bimorph actuator according to one embodiment. 1 illustrates a flexible sensor circuit for use in an SMA system according to one embodiment; 1 shows an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator. 1 illustrates an exploded view of an SMA system including an SMA actuator according to one embodiment; FIG. 1 shows a cross-section of an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator. 4 illustrates a box bimorph actuator for use in an SMA system according to one embodiment; 1 illustrates a flexible sensor circuit for use in an SMA system according to one embodiment; 4 illustrates exemplary dimensions of a bimorph actuator of an SMA actuator according to several embodiments; 1 illustrates a lens system for a folding camera according to one embodiment; 4 illustrates several embodiments of a lens system including a liquid lens according to one embodiment; FIG. 11 illustrates a prismatic bending lens positioned on an actuator, according to one embodiment. FIG. FIG. 11 illustrates a bimorph arm with an offset according to one embodiment; FIG. FIG. 11 illustrates a bimorph arm with offsets and limits according to one embodiment; FIG. FIG. 11 illustrates a bimorph arm with offsets and limits according to one embodiment; FIG. FIG. 11 illustrates an embodiment of a base including offset bimorph arms according to one embodiment. FIG. 4 illustrates an embodiment of a base including two offset bimorph arms according to one embodiment. 4 illustrates a curved arm including load point extensions according to one embodiment. 98 shows a bending arm 9801 including a load point extension 9810 according to one embodiment. FIG. 11 illustrates a bimorph arm including load point extensions according to one embodiment. FIG. FIG. 11 illustrates a bimorph arm including load point extensions according to one embodiment. FIG. 1 illustrates an SMA optical image stabilization mechanism according to one embodiment. 4 shows the SMA material attachment portion 40 of the moving part according to one embodiment. FIG. 11 illustrates an SMA attachment of a stationary plate with resistance welded SMA wires attached, according to one embodiment. FIG. SMA actuator 45 including a strain actuator according to one embodiment is shown. 4 illustrates a resistance weld crimp including islands for an SMA actuator according to one embodiment. 4 illustrates a resistance weld crimp including islands for an SMA actuator according to one embodiment. FIG. 4 shows the relationship between bending plane z-offset, trough width, and peak force for a bimorph beam, according to one embodiment. FIG. 12 shows an example of how the box volume, which is an approximation of the box containing the entire bimorph actuator according to one embodiment, relates to the work done per bimorph component. FIG. Figure 10 illustrates a liquid lens actuated using a distortion actuator according to one embodiment; FIG. 11 illustrates an unfixed load point end of a bimorph arm according to one embodiment; FIG. FIG. 11 illustrates an unfixed load point end of a bimorph arm according to one embodiment; FIG. FIG. 11 illustrates an unfixed load point end of a bimorph arm according to one embodiment; FIG. FIG. 11 illustrates an unfixed load point end of a bimorph arm according to one embodiment; FIG. Figure 4 shows a fixed end of a bimorph arm according to one embodiment; Figure 4 shows a fixed end of a bimorph arm according to one embodiment; Figure 4 shows a fixed end of a bimorph arm according to one embodiment; Figure 4 shows a fixed end of a bimorph arm according to one embodiment; FIG. 10B shows a rear view of a fixed end of a bimorph arm according to one embodiment. FIG. 10 illustrates an exploded view of a distortion module tilt OIS assembly according to one embodiment. 119 shows an assembled view of the distortion module tilt OIS assembly of FIG. 118, according to one embodiment. FIG. 119 illustrates forces applied to the distortion module tilt OIS assembly of FIG. 118, according to one embodiment. 119 shows the results of tilting force applied to the distortion module tilt OIS assembly of FIG. 118, according to one embodiment. 119 shows an exploded view of the upper distortion assembly of the distortion module tilt OIS assembly of FIG. 118, according to one embodiment. FIG. 119 shows an exploded view of the bottom distortion assembly of the distortion module tilt OIS assembly of FIG. 118, according to one embodiment. FIG. 119 shows an exploded view of the partially assembled skew module tilt OIS assembly of FIG. 118, according to one embodiment. FIG. 124B shows an assembled view of the partially assembled distortion module tilt OIS assembly of FIG. 124A, according to one embodiment. FIG. 124B illustrates a front view of the partially assembled skew module tilt OIS assembly of FIG. 124A, according to one embodiment. FIG. 119 illustrates an assembly process for the distortion module tilt OIS assembly of FIG. 118, according to one embodiment. 119 illustrates an assembly process for the distortion module tilt OIS assembly of FIG. 118, according to one embodiment. 119 shows a flexible sensor circuit of the distortion module tilt OIS assembly of FIG. 118, according to one embodiment. 119 shows a flexible sensor circuit of the distortion module tilt OIS assembly of FIG. 118, according to one embodiment. 119 shows a flexible sensor circuit of the distortion module tilt OIS assembly of FIG. 118, according to an alternative embodiment; 119 shows a flexible sensor circuit of the distortion module tilt OIS assembly of FIG. 118, according to an alternative embodiment; FIG. 12B shows an assembled view of a distortion module tilt OIS assembly, according to an alternative embodiment; FIG. 12B shows an assembled view of a distortion module tilt OIS assembly, according to an alternative embodiment; 134 shows a bottom view of an assembled view of the bending module tilt OIS assembly of FIG. 133, according to an alternative embodiment; FIG. FIG. 4 shows a footprint dimensioned for an AF assembly according to one embodiment. FIG. 4 illustrates an SMA module tilted OIS assembly according to one embodiment. 137 shows the SMA module tilted OIS assembly of FIG. 136 under directional deformation according to one embodiment. 137 shows a flexible sensor circuit of the distortion module tilt OIS assembly of FIG. 136 according to one embodiment. FIG. 1 shows a skewed module tilted OIS assembly 1 including a single housing according to one embodiment. FIG. 10 illustrates an exploded view of a bending module tilting OIS assembly including a single housing according to one embodiment. FIG. 11 illustrates a distortion module tilt OIS according to one embodiment; FIG. FIG. 4 shows internal components, such as those described herein, of a distortion module gradient OIS according to one embodiment. FIG. 4 illustrates an upper spring according to one embodiment; Figure 10 shows a bottom spring according to one embodiment; FIG. 11 illustrates a flexible sensor circuit connected to a module of a distortion module tilt OIS assembly according to one embodiment; FIG. 146 shows a flexible sensor circuit according to the embodiment shown in FIG. 145 including a base cap; 4 illustrates a bending module tilt OIS assembly according to one embodiment without the housing and base cap. FIG. 4B illustrates a bottom view of a module including flexible sensor circuitry according to one embodiment. FIG. 10 illustrates side and bottom views of a module including flexible sensor circuitry according to one embodiment. FIG. 10 illustrates side and bottom views of a module including flexible sensor circuitry according to one embodiment.

Embodiments of SMA actuators are described herein that include a compact footprint and high actuation in the positive z-axis direction (z-direction), referred to herein as the z-stroke. Bring height, e.g. movement. Embodiments of SMA actuators include SMA bending actuators and SMA bimorph actuators. SMA actuators have many applications, such as limited It can be used in lens assemblies as autofocus actuators, micro-fluidic pumps, sensor shifts, optical image stabilization, optical zoom assemblies, although not as autofocus actuators. For example, embodiments of the actuators described herein are for use in cellular phones and wearable devices configured to provide a user with an alarm, notification, alert, area-touched or button-press response. can be used as a haptic feedback actuator for Additionally, more than one SMA actuator can be used in the system to achieve larger strokes.

For various embodiments, the SMA actuator has a z-stroke greater than 4 millimeters. Further, the SMA actuator for various embodiments has a height in the z direction of 2.2 millimeters or less when the SMA actuator is in its initial, deactuated position. Various embodiments of SMA actuators configured as autofocus actuators in lens assemblies can have footprints as small as 3 millimeters greater than the lens inner diameter (ID). According to various embodiments, an SMA actuator can have a footprint that is wide in one direction to accommodate components including, but not limited to, sensors, wires, traces, and connectors. . According to some embodiments, the footprint of the SMA actuator is 0.5 millimeters larger in one direction, eg the length of the SMA actuator is 0.5 millimeters longer than the width.

FIG. 1a shows a lens assembly including an SMA actuator configured as a distortion actuator according to one embodiment. FIG. 1b shows an SMA actuator configured as a strain actuator according to one embodiment. A distortion actuator 102 is connected to the base 101 . As shown in FIG. 1b, the SMA wires 100 are attached to strain actuators 102 such that at least a central portion 104 of each strain actuator 102 bends when the SMA wires 100 are actuated and contract, thereby deflecting the strain actuators 102. moves in the z stroke direction, eg, the positive z direction as indicated by arrow 108 . According to some embodiments, SMA wire 100 is actuated when current is applied to one end of the wire through a wire retainer such as crimping structure 106 . An electric current flows through SMA wire 100 and heats it due to the inherent resistance of the SMA material from which SMA wire 100 is made. The other side of SMA wire 100 has a wire retainer, such as crimp structure 106, which connects SMA wire 100 to ground to complete the circuit. Heating the SMA wire 100 to a sufficient temperature causes the inherent material properties of the wire to change the martensitic to austenitic crystal structure, thereby changing the length of the wire. Changing the current changes the temperature and hence the length of the wire, which is used to activate and deactivate the actuator to control its movement in at least the z-direction. be. Those skilled in the art will appreciate that other techniques can be used to bring current into the SMA wire.

FIG. 2 shows an SMA actuator configured as an SMA bimorph actuator according to one embodiment. As shown in FIG. 2, the SMA actuator includes a bimorph actuator 202 connected with a base 204 . Bimorph actuator 202 includes SMA ribbon 206 . Bimorph actuator 202 is configured to move at least the free end of bimorph actuator 202 in z-stroke direction 208 as SMA ribbon 206 contracts.

FIG. 3 shows an exploded view of an autofocus assembly including an SMA actuator according to one embodiment. As shown, SMA actuator 302 is configured as a strain actuator according to embodiments described herein. The autofocus assembly also includes an optical image stabilization (OIS) 304 and a lens carriage configured to hold one or more optical lenses using techniques including those known in the art. 306 , a return spring 308 , a vertical slide bearing 310 and a guide cover 312 . When the SMA wire is actuated and the strain actuator 302 is pulled to deflect using techniques including those described herein, the SMA actuator 302 moves in the z-stroke direction, e.g., the positive z-direction, Lens carriage 306 is configured to slide against vertical slide bearing 310 . Return spring 308 is configured to exert a force on lens carriage 306 in a direction opposite to the stroke direction using techniques including those known in the art. Return spring 308 is configured, according to various embodiments, to move lens carriage 306 in a direction opposite the z-stroke direction when the SMA wire tension is reduced such that the SMA wire is deactivated. . When the SMA wire tension is reduced to its initial value, the lens carriage 306 moves to its lowest height in the z-stroke direction. FIG. 4 shows an autofocus assembly including an SMA wire actuator according to one embodiment shown in FIG.

FIG. 5 shows an SMA wire actuator according to one embodiment, including a sensor. For various embodiments, sensor 502 is configured to measure movement of the SMA actuator in the z-direction, or movement of the component on which the SMA actuator is moving, using techniques including those known in the art. be. The SMA actuators include one or more strain actuators 506 configured to operate using one or more SMA wires 508 similar to those described herein. For example, in the autofocus assembly described with reference to FIG. 4, a sensor determines the amount of movement of lens carriage 306 from its initial position in z-direction 504 using techniques including those known in the art. configured to According to some embodiments, the sensor is a tunnel magneto resistance (TMR) sensor.

FIG. 6 shows top and side views of an SMA actuator 602 configured as a distortion actuator according to one embodiment, with a lens carriage 604 mounted. FIG. 7 shows a side view of a section of SMA actuator 602 according to the embodiment shown in FIG. According to the embodiment shown in FIG. 7, SMA actuator 602 includes slide base 702 . According to one embodiment, slide base 702 is formed of metal, such as stainless steel, using techniques including those known in the art. However, those skilled in the art will appreciate that other materials can be used to form slide base 702 . Additionally, the slide base 702 according to some embodiments has a spring arm 612 connected with the SMA actuator 602 . According to various embodiments, spring arm 612 is configured to serve two functions. The first function is to help push an object, such as lens carriage 604, into the vertical slide surface of the guide cover. For this example, the spring arm 612 preloads the lens carriage 604 upwardly against this surface to ensure that the lens does not tilt during operation. For some embodiments, vertical slide surface 708 is configured to engage guide covers. A second function of the spring arm 612 is to help the SMA wire 608 move the SMA actuator 602 in the z stroke direction, the positive z direction, and then pull the SMA actuator 602 back, eg, in the negative z direction. That is. Therefore, when SMA wires 608 are actuated, they contract to move SMA actuator 602 in the z-stroke direction, and when SMA wires 608 are deactivated, spring arms 612 cause SMA actuator 602 to move in the z-stroke direction. configured to move in the opposite direction.

SMA actuator 602 also includes a strain actuator 710 . For various embodiments, the strain actuator 710 is formed of metal, such as stainless steel. Additionally, bending actuator 710 includes a bending arm 610 and one or more wire retainers 606 . According to the embodiment shown in FIGS. 6 and 7, bending actuator 710 includes four wire retainers 606 . Four wire retainers 606 are each configured to receive an end of SMA wire 608 and hold that end of SMA wire 608 such that SMA wire 608 is attached to strain actuator 710 . . For various embodiments, the four wire retainers 606 are crimps configured to clamp a portion of the SMA wire 608, allowing the wires to be attached to the crimps. Those skilled in the art will appreciate that SMA wire 608 may be attached to wire retainer 606 using techniques known in the art, such as, but not limited to, adhesives, soldering, and mechanical attachment. you will understand. A smart memory alloy (SMA) wire 608 extends between a pair of wire retainers 606 such that when the SMA wire 608 is actuated, a bending arm 610 of a bending actuator 710 is configured to move, thereby A pair of wire retainers 606 are pulled close together. According to various embodiments, SMA wire 608 is electrically actuated to move and control the position of flexing arm 610 when an electric current is passed through SMA wire 608 . SMA wire 608 is deactivated when the current is removed or below a threshold. This moves the pair of wire retainers 606 apart, and when the SMA wire 608 is actuated, the flexure arm 610 moves in the opposite direction. According to various embodiments, the flexure arm 610 is configured to have an initial angle of 5 degrees with respect to the slide base 702 when the SMA wire is deactivated in its initial position. And, according to various embodiments, at full stroke, or when the SMA wire is fully actuated, the flexure arm 610 is configured to have 10-12 degrees with respect to the slide base 702 .

According to the embodiment shown in FIGS. 6 and 7, SMA actuator 602 also includes slide bearing 706 configured between slide base 702 and wire retainer 606 . Slide bearing 706 is configured to minimize any friction between slide base 702 and flexure arm 610 and/or wire retainer 606 . A slide bearing for some embodiments is attached to slide bearing 706 . According to various embodiments, the plain bearing is formed of polyoxymethylene (POM). Those skilled in the art will appreciate that other structures can be used to reduce any friction between the strain actuator and the base.

According to various embodiments, slide base 702 is configured to connect with assembly base 704, eg, an autofocus base for an autofocus assembly. According to some embodiments, the actuator base 704 includes etched shims. Such etched shims can be used to provide clearance between wires and crimps when SMA actuator 602 is part of an assembly, such as an autofocus assembly.

FIG. 8 shows multiple views of one embodiment of a strain actuator 802 for the x-, y-, and z-axes. As oriented in FIG. 8, the flexing arm 804 is configured to move in the z-axis when the SMA wire is activated and deactivated as described herein. According to the embodiment shown in FIG. 8, flexure arms 804 are connected to each other by a central portion such as hammock portion 806 . According to various embodiments, the hammock portion 806 is configured to support a portion of the object on which the distortion actuator acts, such as a lens carriage moved by the distortion actuator using techniques including those described herein. be done. According to some embodiments, the hammock portion 806 is configured to provide lateral stiffness to the strain actuator during actuation. For other embodiments, the strain actuator does not include hammock portion 806 . According to these embodiments, the bending arm is configured to act on and move the object. For example, the distorting arm is configured to directly act on a feature of the lens carriage to push it upwards.

FIG. 9 shows an SMA actuator configured as an SMA bimorph actuator according to one embodiment. The SMA bimorph actuator includes a bimorph actuator 902 including those described herein. According to the embodiment shown in FIG. 9, one end 906 of each of the bimorph actuators 902 is attached to a base 908 . According to some embodiments, one end 906 is welded to base 908 . However, those skilled in the art will appreciate that other techniques can be used to attach one end 906 to the base 908 . FIG. 9 also shows a lens carriage 904 arranged such that the bimorph actuator 902 is configured to curl in the z-direction when actuated to lift the carriage 904 in the z-direction. For some embodiments, a return spring is used to push the bimorph actuator 902 back to the initial position. A return spring may be configured to assist in depressing the bimorph actuators to their initial, de-activated position, as described herein. Due to the small footprint of bimorph actuators, SMA actuators can be made with a smaller footprint than current actuator technology.

FIG. 10 shows a cutaway view of an autofocus assembly including a SMA actuator, including a position sensor, eg, a TMR sensor, according to one embodiment. Autofocus assembly 1002 includes a position sensor 1004 attached to a movable spring 1006 and a magnet 1008 attached to a lens carriage 1010 of the autofocus assembly that includes an SMA actuator such as those described herein. The position sensor 1004 uses techniques including those known in the art to determine the amount the lens carriage 1010 moves from its initial position in the z-direction 1005 based on the distance of the magnet 1008 from the position sensor 1004 . Configured. According to some embodiments, the position sensor 1004 is electrically connected to a controller or processor, e.g. Connected.

Figures 11a-11c show views of bimorph actuators according to some embodiments. According to various embodiments, the bimorph actuator 1102 comprises a beam 1104 and one or more SMA materials 1106, such as an SMA ribbon 1106b (eg, as shown in a perspective view of a bimorph actuator including an SMA ribbon according to the embodiment of FIG. 11b). ) or SMA wire 1106a (eg, as shown in a cross-sectional view of a bimorph actuator including an SMA wire according to the embodiment of FIG. 11a). SMA material 1106 is attached to beam 1104 using techniques including those described herein. According to some embodiments, SMA material 1106 is attached to beam 1104 using adhesive film material 1108 . For various embodiments, the ends of SMA material 1106 are electrically and mechanically connected to contacts 1110 configured to supply current to SMA material 1106 using techniques including those known in the art. Connected. According to various embodiments, contacts 1110 (eg, as shown in FIGS. 11a and 11b) are gold-plated copper pads. According to embodiments, a bimorph actuator 1102 having a length of approximately 1 millimeter is configured to produce a larger stroke and pushing force of 50 millinewtons (mN) and is shown, for example, in FIG. As such, it is used as part of the lens assembly. According to some embodiments, the use of a bimorph actuator 1102 with a length greater than 1 millimeter produces a greater stroke than a 1 millimeter length, but produces less force. For one embodiment, the bimorph actuator 1102 comprises a 20 micrometer thick SMA material 1106, a 20 micrometer thick insulator 1112, such as a polyimide insulator, and a 30 micrometer thick stainless steel beam 1104 or base metal. include. Various embodiments include a second insulator 1114 disposed between the contact layer containing contact 1110 and SMA material 1106 . According to some embodiments, second insulator 1114 is configured to insulate SMA material 1106 from portions of the contact layer not used as contact 1110 . For some embodiments, the second insulator 1114 is a covercoat layer such as a polyimide insulator. Those skilled in the art will appreciate that other dimensions and materials can be used to meet the desired design characteristics.

FIG. 12 shows a diagram of one embodiment of a bimorph actuator, according to one embodiment. Embodiments such as that shown in FIG. 12 include a central feed 1204 for supplying power. Power is supplied to the center of the SMA material 1202 (wire or ribbon) such as those described herein. The end of SMA material 1202 is grounded to beam 1206 or base metal as a return path at end pad 1203 . End pad 1203 is electrically isolated from the rest of contact layer 1214 . According to embodiments, the proximity of the beam 1206 or base metal to the SMA material 1202 along the entire length of the SMA material 1202, such as SMA wire, causes the current to be turned off, i.e. the bimorph actuator is When stopping, the wire cools faster. Faster wire deactivation and actuator response time result. The thermal profile of the SMA wire or ribbon is improved. For example, the thermal profile can be made more uniform and more total current can be reliably delivered to the wire. Without a uniform heat sink, portions of the wire, such as the central region, can be overheated and damaged, thus requiring reduced current and reduced movement for reliable operation. The central feed 1204 benefits from faster wire activation/actuation of the SMA material 1202 (faster heating) and reduced power consumption (lower resistance path length) for faster response time. This allows for faster actuator movement and the ability to operate at higher movement frequencies.

As shown in FIG. 12, beam 1206 includes a central metal 1208 that is insulated from the rest of beam 1206 to form central feed 1204 . An insulator 1210 , such as those described herein, is placed over the top of beam 1206 . Insulator 1210 has one or more openings or vias 1212 to provide electrical access to beam 1206, for example to connect to ground section 1214b of the contact layer, and to provide contact to center metal 1208. It is configured to form a central feed 1204 . According to some embodiments, a contact layer 1214, such as those described herein, includes a power section 1214a and a ground section 1214b for actuation/control via power supply contacts 1216 and ground contacts 1218 to the bimorph actuator. provide a signal. A covercoat layer 1220, such as those described herein, is disposed over the contact layer 1214 to provide portions of the contact layer 1214 where electrical connection is desired (eg, one or more contacts). electrically insulates the contact layer except for

FIG. 13 shows an end pad cross-section of a bimorph actuator, as shown in FIG. 12, according to one embodiment. As described above, end pad 1203 is electrically isolated from the rest of contact layer 1214 by gap 1222 formed between end pad 1203 and contact layer 1214 . According to some embodiments, the gap is formed using etching techniques, including those known in the art. End pad 1203 includes via section 1224 configured to electrically connect end pad 1203 with beam 1206 . Via section 1224 is formed in via 1212 formed in insulator 1210 . SMA material 1202 is electrically connected to end pad 1213 . SMA material 1202 may be electrically connected to end pads 1213 using techniques including, but not limited to, soldering, resistance welding, laser welding, and direct plating.

FIG. 14 shows a cross-section of a central feed of a bimorph actuator, as shown in FIG. 12, according to one embodiment. Center feed 1204 is electrically connected to a power supply through contact layer 1214 and electrically connected to center metal 1208 by via sections 1226 in center feed 1204 formed in vias 1212 formed in insulator 1210 . physically and thermally connected.

The actuators described herein can be used to form actuator assemblies that employ multiple strain actuators and/or multiple bimorph actuators. According to one embodiment, the actuators can be stacked on top of each other to increase the stroke distance that can be achieved.

FIG. 15 shows an exploded view of an SMA actuator including two strain actuators according to one embodiment. According to several embodiments described herein, the two strain actuators 1302, 1304 are positioned relative to each other to use their opposing motion. For various embodiments, the two distortion actuators 1302 , 1304 are configured to move in inverse relation to each other to position the lens carriage 1306 . For example, first strain actuator 1302 is configured to receive the inverse power signal of the power signal sent to second strain actuator 1304 .

FIG. 16 shows an SMA actuator including two strain actuators according to one embodiment. The strain actuators 1302, 1304 are configured such that the strain arms 1310, 1312 of each strain actuator 1302, 1304 face each other and the slide bases 1314, 1316 of each strain actuator 1302, 1304 are the outer surfaces of the two strain actuators. be. According to various embodiments, the hammock portion 1308 of each SMA actuator 1302, 1304 includes an object on which one or more strain actuators 1302, 1304 act, such as those described herein, using techniques that It is configured to support the portion of the lens carriage 1306 that is moved by the distortion actuator.

FIG. 17 shows a side view of an SMA actuator including two distortion actuators according to one embodiment, showing the orientation of SMA wires 1318 that move an object, such as a lens carriage, in the positive z-direction or upward direction.

FIG. 18 shows a side view of an SMA actuator including two distortion actuators according to one embodiment, showing the orientation of SMA wires 1318 that move an object, such as a lens carriage, in the negative z-direction or downward direction.

FIG. 19 shows an exploded view of an assembly including an SMA actuator including two strain actuators according to one embodiment. The strain actuators 1902, 1904 are configured such that the strain arms 1910, 1912 of each strain actuator 1902, 1904 are the outer surfaces of the two strain actuators and the slide bases 1914, 1916 of each strain actuator 1902, 1904 face each other. be. According to various embodiments, the hammock portion 1908 of each SMA actuator 1902, 1904 comprises an object on which one or more strain actuators 1902, 1904 act, such as those described herein, using techniques such as It is configured to support the portion of lens carriage 1906 that is moved by the distortion actuator. For some embodiments, the SMA actuator includes a base portion 1918 configured to receive the second strain actuator 1904 . The SMA actuator may also include cover portion 1920 . FIG. 20 shows an SMA actuator including two strain actuators according to one embodiment, including a base portion and a cover portion.

FIG. 21 shows an SMA actuator including two strain actuators according to one embodiment. For some embodiments, the strain actuators 1902, 1904 are positioned with respect to each other such that the hammock portion 1908 of the first strain actuator 1902 is rotated about 90 degrees from the hammock portion of the second strain actuator 1904. . The 90 degree configuration allows pitch and roll rotation of objects such as lens carriage 1906 . This provides better control over the movement of the lens carriage 1906 . For various embodiments, a differential power signal is applied to the SMA wires of each distortion actuator pair, thereby providing pitch and roll rotation of the lens carriage to induce tilting of the OIS motion.

Embodiments of SMA actuators that include two strain actuators eliminate the need for return springs. The use of two strain actuators may improve/reduce hysteresis when using SMA wire resistance for position feedback. SMA actuators that produce opposing forces, including two tortuous actuators, support more precise position control due to lower hysteresis than those including return springs. For some embodiments, such as the embodiment shown in FIG. 22, an SMA actuator that includes two strain actuators 2202, 2204 uses differential power to the left and right SMA wires 2218a, 2218b of each strain actuator 2202, 2204. to provide 2-axis tilt. For example, left SMA wire 2218a is operated at a higher power than right SMA wire 2218b. This moves (tilts) the left side of the lens carriage 2206 downwards and the right side upwards. The SMA wires of the first bending actuator 2202 are held with equal force and, for some embodiments, serve as a fulcrum for the SMA wires 2218a, 2218b to push differently to induce tilting motion. By reversing the power signal applied to the SMA wires, for example, to provide equal power to the SMA wires of the second strain actuator 2202 and a difference to the left and right SMA wires 2218a, 2218b of the second strain actuator 2204. Using electromotive forces causes tilting of the lens carriage 2206 in the other direction. This provides the ability to tilt an object, such as a lens carrier, in either axis of motion, or can adjust any tilt between the lens and sensor for better dynamic tilt, thereby Resulting in better image quality across all pixels.

FIG. 23 shows an SMA actuator including two strain actuators and a coupler according to one embodiment. A SMA actuator includes two strain actuators such as those described herein. First strain actuator 2302 is configured to connect with second strain actuator 2304 using a coupler, eg, coupler ring 2305 . The strain actuators 2302 , 2304 are positioned with respect to each other such that the hammock portion 2308 of the first strain actuator 2302 is rotated approximately 90 degrees from the hammock portion 2309 of the second strain actuator 2304 . A payload for movement, such as a lens or lens assembly, is attached to a lens carriage 2306 that is configured to be positioned on the slide base of the first distortion actuator 2302 .

For various embodiments, equal power may be supplied to the SMA wires of first strain actuator 2302 and second strain actuator 2304 . This can maximize the z-stroke of the SMA actuator in the positive z-direction. For some embodiments, the stroke of the SMA actuator may have a z-stroke equal to or more than twice the stroke of other SMA actuators, including two tortuous actuators. For some embodiments, additional springs may be added to the two flexures to help push the actuator assembly and payload downward when the power signal is removed from the SMA actuator. . Equal and opposite power signals are applied to the SMA wires of the first strain actuator 2302 and the second strain actuator 2304 . This allows the SMA actuators to be moved in the positive z-direction by some strain actuators and in the negative z-direction by some strain actuators, thereby allowing precise control of the position of the SMA actuators. . In addition, equal and opposite power signals (differential power signals) are applied to the left and right SMA wires of first distortion actuator 2302 and second distortion actuator 2304 to move an object, such as lens carriage 2306, into two Tilt in at least one of the axes.

Embodiments of SMA actuators that include two strain actuators and couplers, such as the one shown in FIG. A desired stroke can be achieved.

FIG. 24 shows an exploded view of an SMA system including an SMA actuator including a tortuous actuator comprising a laminate hammock according to one embodiment. As described herein, for some embodiments, the SMA system is configured for use with one or more camera lens elements as an autofocus driver. As shown in FIG. 24, the SMA system moves the lens carriage 2406 away from the z-stroke direction when tension on the SMA wire 2408 is reduced because the SMA wire is deactivated, according to various embodiments. It includes a return spring 2403 configured to move in a direction. For some embodiments, the SMA system includes a housing 2409 configured to receive the return spring 2403 and act as a slide bearing to guide the lens carriage in the z-stroke direction. Housing 2409 is also configured to be disposed on strain actuator 2402 . Bending actuator 2402 includes a sliding base 2401 similar to that described herein. Bending actuator 2402 includes a bending arm 2404 connected to a hammock portion, eg, a laminated hammock 2406 formed of laminated plates. Bending actuator 2402 also includes an SMA wire attachment structure, such as a laminated crimp connection 2412 .

As shown in FIG. 24, slide base 2401 is placed on optional adapter plate 2414 . The adapter plate is configured to mate the SMA system or strain actuator 2402 with another system such as OIS, additional SMA systems, or other components. FIG. 25 shows an SMA system 2501 including an SMA actuator including a bending actuator 2402 comprising a laminate hammock according to one embodiment.

FIG. 26 illustrates a strain actuator including a laminate hammock according to one embodiment. Bending actuator 2402 includes a bending arm 2404 . As described herein, flexure arm 2404 is configured to move in the z-axis when SMA wire 2412 is activated and deactivated. SMA wire 2408 is attached to the strain actuator using a laminated crimp connection 2412 . According to the embodiment shown in FIG. 26, the flexure arms 2404 are connected to each other by a central portion, eg, a laminate hammock 2406 . According to various embodiments, the laminate hammock 2406 supports the object on which the distortion actuator acts, such as a portion of the lens carriage that is moved by the distortion actuator using techniques including those described herein. Configured.

FIG. 27 shows a laminate hammock for SMA actuators according to one embodiment. For some embodiments, the laminate hammock 2406 material is a low stiffness material so that it does not resist actuation movement. For example, laminate hammock 2406 is formed using a copper layer disposed on a first polyimide layer, with a second polyimide layer disposed on the copper. For some embodiments, laminate hammock 2406 is formed on curved arm 2404 using deposition and etching, using techniques including those known in the art. For other embodiments, the laminate hammock 2406 is formed separately from the flexure arm 2404 and attached to the flexure arm 2404 using techniques including welding, adhesives, and other techniques known in the art. . For various embodiments, glue or other adhesive is used on the laminate hammock 2406 to ensure that the flexure arm 2404 stays in place relative to the lens carriage.

FIG. 28 shows a laminated crimp connection of an SMA actuator according to one embodiment. A laminated crimp connection 2412 is configured to attach the SMA wire 2408 to the strain actuator and create an electrical circuit bond with the SMA wire 2408 . For various embodiments, the laminated crimp connection 2412 includes a laminate formed of one or more layers of insulator and one or more layers of conductive layers formed on the crimp.

For example, a polyimide layer is disposed on at least a portion of the stainless steel portion forming crimp 2413 . A conductive layer, such as copper, is then placed on the polyimide layer, which is electrically connected to one or more signal traces 2415 placed on the strain actuator. Also, the SMA wire is brought into electrical contact with the conductive layer by deforming the crimp portion into contact with the SMA wire. Therefore, a conductive layer connected with one or more signal traces is used to apply power signals to the SMA wire using techniques including those described herein. For some embodiments, a second polyimide layer is formed over the conductive layer in areas where the conductive layer does not contact the SMA wires. For some embodiments, laminated crimp connection 2412 is formed in crimp portion 2413 using deposition and etching techniques, including those known in the art. For other embodiments, the laminated crimped connection 2412 and one or more electrical traces are formed separately from the crimped portion 2413 and the torsional actuator using welding, adhesives, and other techniques known in the art. Attached to the crimping portion 2412 and the strain actuator using techniques including techniques.

FIG. 29 shows an SMA actuator that includes a bending actuator with a laminate hammock. As shown in FIG. 29, when the power signal is applied, the SMA wires contract or shorten, moving the flexure arm and laminate hammock in the positive z-direction. Similarly, a laminate hammock in contact with an object will move that object, eg, the lens carriage, in the positive z-direction. Reducing or removing the power signal lengthens the SMA wire and moves the flexure arm and laminate hammock in the negative z-direction.

FIG. 30 shows an exploded view of an SMA system including SMA actuators including strain actuators according to one embodiment. As described herein, for some embodiments, the SMA system is configured for use with one or more camera lens elements as an autofocus driver. As shown in FIG. 30, the SMA system includes a return spring 3003 that, according to various embodiments, causes the lens carriage to move when the SMA wire is deactivated to reduce tension on the SMA wire 3008. 3005 is configured to move in a direction opposite to the z-stroke direction. For some embodiments, the SMA system includes a stiffener 3000 positioned on the return spring 3003. For some embodiments, the SMA system includes a two-part housing 3009 configured to receive a return spring 3003 and act as a slide bearing to guide the lens carriage in the z-stroke direction. Housing 3009 is also configured to be disposed on strain actuator 3002 . Bending actuator 3002 includes a slide base 3001 formed in two parts, similar to those described herein. The sliding base 3001 is split to electrically isolate the two sides (e.g. one side is ground and the other side is power), which according to some embodiments allows current flow This is because it flows through multiple portions of the slide base 3001 to the wire.

Bending actuator 3002 includes a bending arm 3004 . Each pair of strain actuators 3002 is formed in a separate portion of strain actuator 3002 . The strain actuator 3002 also includes an SMA wire attachment structure, such as a resistance welded wire crimp 3012 . The SMA system optionally includes a flex circuit 3020 for electrically connecting the SMA wires 3008 to one or more control circuits.

As shown in FIG. 30, slide base 3001 is placed on optional adapter plate 3014 . The adapter plate is configured so that the SMA system or strain actuator 3002 mates with another system, such as an OIS, an additional SMA system, or other components. FIG. 31 shows an SMA system 3101 including an SMA actuator including a strain actuator 3002 according to one embodiment.

FIG. 32 includes an SMA actuator including a strain actuator according to one embodiment. Bending actuator 3002 includes a bending arm 3004 . As described herein, flexing arm 3004 is configured to move in the z-axis when SMA wire 3012 is activated and deactivated. SMA wire 2408 is attached to resistance welding wire crimp 3012 . According to the embodiment shown in FIG. 32, the distorting arm 3004 is configured to mate with an object such as a lens carriage using a two yoke capture joint without a center section. be.

FIG. 33 shows a two-yoke capture joint of a pair of flexure arms of an SMA actuator according to one embodiment. Figure 33 also shows the plating pads used to attach the optional flex circuit to the slide base. For some embodiments, the plating pads are formed using gold. FIG. 34 shows a resistance weld crimp for an SMA actuator according to one embodiment used to attach the SMA wire to the strain actuator. For some embodiments, a glue or adhesive is also placed on top of the weld as a fatigue strain relief during operation and impact loading to aid in mechanical strength and work. obtain.

FIG. 35 shows an SMA actuator that includes a strain actuator with a two-yoke capture joint. As shown in FIG. 35, when a power signal is applied, the SMA wire contracts or shortens, moving the flexing arm in the positive z-direction. A two-yoke capture joint contacts an object and then moves that object, eg, the lens carriage, in the positive z-direction. When the power signal is reduced or removed, the SMA wire lengthens and moves the distorting arm in the negative z direction. A yoke capture feature ensures that the distorting arm remains in the correct position relative to the lens carriage.

FIG. 36 shows an SMA bimorph liquid lens according to one embodiment. SMA bimorph liquid lens 3501 includes liquid lens subassembly 3502 , housing 3504 , and circuitry with SMA actuator 3506 . For various embodiments, the SMA actuators include four bimorph actuators 3508, such as the embodiments described herein. A bimorph actuator 3508 is configured to push a shaping ring 3510 located on a flexible membrane 3512 . The ring warps the membrane 3512/liquid 3514 and changes the optical path through the membrane 3512/liquid 3514. FIG. A liquid containment ring 3516 is used to contain liquid 3514 between membrane 3512 and lens 3518 . An equal force from the bimorph actuator changes the focus of the image in the Z direction (perpendicular to the lens), thereby allowing it to function as an autofocus. Differential forces from the bimorph actuator 3508 can move the light beam in the X, Y directions, thereby allowing it to function as an optical image stabilizer according to some embodiments. Both OIS and AF functions can be achieved simultaneously with appropriate control of each actuator. For some embodiments, three actuators are used. A circuit comprising the SMA actuator 3506 has one or more contacts 3520 for control signals to actuate the SMA actuator. According to some embodiments including four SMA actuators, the circuit comprising SMA actuators 3506 includes four power circuit control contacts for each SMA actuator and a common return contact.

FIG. 37 shows a perspective SMA bimorph liquid lens according to one embodiment. FIG. 38 shows a cross-sectional view of the bottom surface of an SMA bimorph liquid lens according to one embodiment.
FIG. 39 shows an SMA system including an SMA actuator 3902 comprising a bimorph actuator according to one embodiment. SMA actuator 3902 includes four bimorph actuators using the techniques described herein. As shown in FIG. 40, two of the bimorph actuators are configured as positive z-stroke actuators 3904 and two are configured as negative z-stroke actuators 3906, which according to one embodiment are bimorph actuators. SMA actuator 3902 with . Opposite actuators 3906, 3904 are configured to control motion in both directions over the full stroke range. This provides the ability to adjust the control code to compensate for tilt. For various embodiments, two SMA wires 3908 attached to the top of the component allow positive z-stroke displacement. Two SMA wires attached to the bottom of the component allow negative z-stroke displacement. For some embodiments, each bimorph actuator is attached to an object, such as lens carriage 3910, using tabs to engage the object. The SMA system includes a top spring 3912 configured to provide stability of the lens carriage 3910 in an axis perpendicular to the z-stroke axis, eg, in the x-axis and y-axis directions. Additionally, an upper spacer 3914 is configured to be positioned between the upper spring 3912 and the SMA actuator 3902 . A bottom spacer 3916 is configured to be positioned between the SMA actuator 3902 and the bottom spring 3918 . Bottom springs 3918 are configured to provide stability of lens carriage 3910 in axes perpendicular to the z-stroke axis, eg, in the x-axis and y-axis directions. Bottom spring 3918 is configured to be disposed on base 3920, such as those described herein.

FIG. 41 shows the length 4102 of the bimorph actuator 4103 and the location of the bonding pads 4104 for the SMA wire 4206 to extend the wire length beyond the bimorph actuator. Longer wires are used than bimorph actuators to increase stroke and force. Therefore, the length 4108 of that SMA wire 4206 extension beyond the bimorph actuator 4103 is used to set the stroke and force for the bimorph actuator 4103 .

FIG. 42 shows an exploded view of an SMA system including an SMA bimorph actuator 4202 according to one embodiment. According to various embodiments, the SMA system is configured using separate metallic materials and non-conductive adhesives to create one or more electrical circuits for independently powering the SMA wires. . Some embodiments have no AF size influence and include four bimorph actuators such as those described herein. Two of the bimorph actuators are configured as positive z-stroke actuators and two as negative z-stroke actuators. FIG. 43 shows an exploded view of a subsection of an SMA actuator according to one embodiment. The subsection includes a negative actuator signal connection 4302 and a base 4304 with a bimorph actuator 4306 . Negative actuator signal connection 4302 includes wire bonding pads 4308 for connecting SMA wires of bimorph actuator 4306 using techniques including those described herein. Negative actuator signal connection 4302 is attached to base 4304 using adhesive layer 4310 . The subsection also includes a positive actuator signal connection 4314 comprising wire bonding pads 4316 for connecting SMA wires 4312 of bimorph actuators 4306 using techniques including those described herein. Positive actuator signal connection 4314 is attached to base 4304 using adhesive layer 4318 . Each of the base 4304, the negative actuator signal connection 4302, and the positive actuator signal connection 4314 are formed of metal, such as stainless steel. Connection pads 4322 on each of base 4304, negative actuator signal connection 4302, and positive actuator signal connection 4314 are used to actuate bimorph actuator 4306 using techniques including those described herein. and is configured to electrically connect the control signal to ground. For some embodiments, connection pads 4322 are gold plated. FIG. 44 shows a subsection of an SMA actuator according to one embodiment. For some embodiments, gold plated pads are formed on the stainless steel layer for solder bonding or other known electrical termination methods. Additionally, the formed wire bonding pads are used in signal joints to electrically connect SMA wires for power signals.

FIG. 45 shows a 5-axis sensor shifting system according to one embodiment. A five-axis sensor shift system is configured to move an object, eg, an image sensor, relative to one or more lenses in five axes. This includes X/Y/Z axis translation and pitch/roll tilt. Optionally, the system is configured to use only 4 axes, with X/Y axis translation and pitch/roll tilt, along with a separate AF on top to perform Z motion. be. Other embodiments include a 5-axis sensor shift system configured to move one or more lenses relative to the image sensor. For some embodiments, a static lens stack is attached to the top cover and inserted into the ID (without touching the orange moveable carriage inside).

FIG. 46 shows an exploded view of a 5-axis sensor shifting system according to one embodiment. The 5-axis sensor shift system consists of two circuit components, a flexible sensor circuit 4602 and a bimorph actuator circuit 4604, and an 8- to 8-axis built on bimorph circuit component using techniques including those described herein. Contains 12 bimorph actuators 4606 . The 5-axis sensor shifting system includes a moveable carriage 4608 configured to hold one or more lenses and an outer housing 4610 . Bimorph actuator circuit 4604 includes 8-12 SMA actuators such as those described herein, according to one embodiment. The SMA actuators are configured to move moveable carriage 4608 in five axes, eg, x-direction, y-direction, z-direction, pitch and roll, similar to other five-axis systems described herein.

FIG. 47 shows an SMA actuator that includes a bimorph actuator that is incorporated into this circuit for all movements, according to one embodiment. Embodiments of SMA actuators may include 8-12 bimorph actuators 4606 . However, other embodiments may include more or fewer. FIG. 48 shows an SMA actuator 4802 that is partially formed to fit within a corresponding outer housing 4804 and includes a bimorph actuator that is incorporated into this circuit for all movements, according to one embodiment. FIG. 49 shows a cross-section of a 5-axis sensor shifting system according to one embodiment.

FIG. 50 shows an SMA actuator 5002 according to one embodiment, including a bimorph actuator. SMA actuator 5002 is configured to use four side-mounted SMA bimorph actuators 5004 to move an image sensor, lens, or various other payloads in the x and y directions. FIG. 51 shows a top view of an SMA actuator including a bimorph actuator that moves an image sensor, lens, or various other payloads to different x and y positions.

FIG. 52 shows an SMA actuator including a bimorph actuator 5202 according to one embodiment configured as a box bimorph autofocus. Four top and bottom mounted SMA bimorph actuators, such as those described herein, are configured to move together to produce motion in the z-stroke direction for autofocus motion. FIG. 53 shows an SMA actuator including bimorph actuators according to one embodiment, two top-mounted bimorph actuators 5302 configured to depress one or more lenses. FIG. 54 shows an SMA actuator including bimorph actuators according to one embodiment, and its two bottom-mounted bimorph actuators 5402 are configured to lift one or more lenses. FIG. 55 shows an SMA actuator including bimorph actuators according to one embodiment, in which four top and bottom mounted SMA bimorph actuators 5502, such as those described herein, move one or more lenses to tilt. Indicates that it is used to produce motion.

FIG. 56 shows an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator configured as a two-axis lens-shifting OIS. For some embodiments, the 2-axis lens shift OIS is configured to move the lens in the X/Y axes. For some embodiments, Z-axis motion is produced by a separate AF such as those described herein. Four bimorph actuators push the sides of the autofocus for OIS movement. FIG. 57 shows an exploded view of an SMA system including a SMA actuator 5802 according to one embodiment including a bimorph actuator 5806 configured as a two-axis lens-shifting OIS. FIG. 58 shows a cross-section of an SMA system including a SMA actuator 5802 according to one embodiment including a bimorph actuator 5806 configured as a two-axis lens-shifting OIS. FIG. 59 shows a box bimorph actuator 5802 according to one embodiment for use in an SMA system configured as a two-axis lens shift OIS, as manufactured before being molded to fit into the system. Such systems can be configured to have high OIS stroke OIS (eg, ±200um or more). Additionally, such an embodiment is configured to have a wide range of motion and good OIS dynamic tilt using four slide bearings, eg, POM slide bearings. Embodiments are configured for easy integration with AF designs (eg, VCM or SMA).

FIG. 60 shows an SMA system including a SMA actuator according to one embodiment, including a 5-axis lens shift OIS and a bimorph actuator configured as an autofocus. For some embodiments, the 5-axis lens shift OIS and autofocus are configured to move the lens in the X/Y/Z axes. For some embodiments, the pitch and yaw axis movements are to allow for dynamic tilt adjustment. Eight bimorph actuators are used to provide autofocus and OIS movement using the techniques described herein. FIG. 61 shows an exploded view of an SMA system including a SMA actuator 6202 according to one embodiment, including a bimorph actuator 6204 according to one embodiment configured as a 5-axis lens shifting OIS and autofocus. FIG. 62 shows a cross-section of an SMA system including a SMA actuator 6202 according to one embodiment, including a 5-axis lens shifting OIS and a bimorph actuator 6204 configured as an autofocus. FIG. 63 shows a box bimorph actuator 6202 according to one embodiment for use in an SMA system configured as a 5-axis lens shift OIS and autofocus as manufactured before being molded to fit within the system. show. Such a system can be configured to have a high OIS stroke OIS (eg ±200um or more) and a high autofocus stroke (eg 400um or more). Additionally, such embodiments can be adjusted to eliminate any tilt, eliminating the need for a separate autofocus assembly.

FIG. 64 shows an SMA system including a SMA actuator according to one embodiment including a bimorph actuator configured as an outward pushing box. For some embodiments, the bimorph actuator assembly is configured to wrap around an object such as a lens carriage. This is because the circuit assembly moves the flexure for low X/Y/Z stiffness with the lens carriage. The trailing edge pads of the circuit are static. The outward pushing box can be configured for both 4 bimorph actuators or 8 bimorph actuators. So the outward pushing box can be configured as a 4-bimorph actuator on the side of the OIS that moves in the X and Y axes. The outward push box can be configured as a top and bottom 4-bimorph actuator for autofocus moving in the z-axis. The outward push box can be configured as a top, bottom, and multiple side 8-bimorph actuator for OIS and autofocus, with x, y, and z axis motion, and 3-axis tilt (pitch/roll/ yaw). FIG. 65 shows an exploded view of an SMA system including a SMA actuator 6602 according to one embodiment including a bimorph actuator 6604 configured as an outward pushing box. The SMA actuator is therefore configured such that the bimorph actuator acts on the outer housing 6504 to move the lens carriage 6506 using the techniques described herein. FIG. 66 shows an SMA system including an SMA actuator 6602 according to one embodiment including a bimorph actuator configured as an outwardly pushing box partially shaped to receive a lens carriage 6604 . FIG. 67 shows an SMA system including an SMA actuator 6602 including a bimorph actuator 6604 according to one embodiment configured as a box that pushes outward as manufactured before being molded to fit within the system.

FIG. 68 shows an SMA system including a SMA actuator 6802 according to one embodiment including a bimorph actuator configured as a 3-axis sensor shift OIS. For some embodiments, Z-axis motion comes from a separate autofocus system. The four bimorph actuators are configured to push against multiple sides of the sensor carriage 6804 to provide motion to the OIS using the techniques described herein. FIG. 69 shows an exploded view of an SMA including a SMA actuator 6802 according to one embodiment including a bimorph actuator configured as a 3-axis sensor shift OIS. FIG. 70 shows a cross-section of an SMA system including a SMA actuator 6802 according to one embodiment including a bimorph actuator 6806 configured as a 3-axis sensor shift OIS. FIG. 71 shows components of a box bimorph actuator 6802 according to one embodiment for use in an SMA system configured as a 3-axis sensor shift OIS, as manufactured prior to being molded to fit within the system. show. FIG. 72 shows a flexible sensor circuit for use in an SMA system according to one embodiment, configured as a 3-axis sensor shift OIS. Such a system can be configured to have a high OIS stroke OIS (eg ±200um or more) and a high autofocus stroke (eg 400um or more). Further, such an embodiment is configured to have a wide range of two-axis motion and good OIS dynamic tilt using four slide bearings, eg, POM slide bearings. Embodiments are configured for easy integration with AF designs (eg, VCM or SMA).

FIG. 73 shows an SMA system including a SMA actuator 7302 according to one embodiment, including a 6-axis sensor shift OIS and a bimorph actuator 7304 configured as autofocus. For some embodiments, the 6-axis sensor shift OIS and autofocus is configured to move the lens in the X/Y/Z/pitch/yaw/roll axes. For some embodiments, the pitch and yaw axis movements are to allow for dynamic tilt adjustment. Eight bimorph actuators are used to provide autofocus and OIS movement using the techniques described herein. FIG. 74 shows an exploded view of an SMA system including a SMA actuator 7402 according to one embodiment, including a 6-axis sensor shift OIS and a bimorph actuator 7404 configured as autofocus. FIG. 75 shows a cross-section of an SMA system including a SMA actuator 7402 according to one embodiment, including a 6-axis sensor shift OIS and a bimorph actuator configured as an autofocus. FIG. 76 illustrates a box bimorph actuator 7402 according to one embodiment for use in an SMA system configured as a 6-axis sensor shift OIS and autofocus as manufactured before being molded to fit within the system. show. FIG. 77 shows a flexible sensor circuit for use in an SMA system according to one embodiment, configured as a 3-axis sensor shift OIS. Such a system can be configured to have a high OIS stroke OIS (eg ±200um or more) and a high autofocus stroke (eg 400um or more). Further, such embodiments allow any tilt to be adjusted and eliminate the need for a separate autofocus assembly.

FIG. 78 shows an SMA system including a SMA actuator according to one embodiment including a bimorph actuator configured as a two-axis camera tilt OIS. For some embodiments, the 2-axis camera tilt OIS is configured to move the camera in the pitch/yaw axes. Four bimorph actuators are used to push the top and bottom of the autofocus for whole camera motion for pitch and yaw motion of the OIS using the techniques described herein. FIG. 79 shows an exploded view of an SMA system including a SMA actuator 7902 according to one embodiment including a bimorph actuator 7904 configured as a two-axis camera tilt OIS. FIG. 80 shows a cross-section of an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator configured as a two-axis camera tilt OIS. FIG. 81 shows a box bimorph actuator according to one embodiment for use in an SMA system configured as a 2-axis camera tilt OIS, as manufactured before being molded to fit within the system. FIG. 82 shows a flexible sensor circuit for use in an SMA system according to one embodiment, configured as a two-axis camera tilt OIS. Such systems can be configured to have a high OIS stroke OIS (eg, ±3 degrees or more). Embodiments are configured for easy integration with autofocus (AF) designs (eg, VCM or SMA).

FIG. 83 shows an SMA system including a SMA actuator according to one embodiment including a bimorph actuator configured as a 3-axis camera tilt OIS. For some embodiments, the 2-axis camera tilt OIS is configured to move the camera in pitch/yaw/roll axes. Four bimorph actuators are used to push the top and bottom of the autofocus, and four bimorph actuators are used to push the autofocus top and bottom for overall camera movement for pitch and yaw movement of the OIS using the techniques described herein. A single bimorph actuator is used to push multiple sides of the autofocus for overall camera movement for OIS roll movement using the techniques described herein. FIG. 84 shows an exploded view of an SMA system including a SMA actuator 8402 according to one embodiment including a bimorph actuator 8404 configured as a 3-axis camera tilt OIS. FIG. 85 shows a cross-section of an SMA system including a SMA actuator according to one embodiment, including a bimorph actuator configured as a 3-axis camera tilt OIS. FIG. 86 shows a box bimorph actuator for use in an SMA system according to one embodiment, configured as a 3-axis camera tilt OIS as manufactured before being molded to fit within the system. FIG. 87 shows a flexible sensor circuit for use in an SMA system according to one embodiment configured as a 3-axis camera tilt OIS. Such systems can be configured to have a high OIS stroke OIS (eg, ±3 degrees or more). Embodiments are configured for easy integration with AF designs (eg, VCM or SMA).

FIG. 88 shows exemplary dimensions for a bimorph actuator of an SMA actuator according to several embodiments. Although the dimensions are a preferred embodiment, those skilled in the art will appreciate that other dimensions may be used based on the desired properties of the SMA actuator.

FIG. 89 shows a lens system for a folded camera according to one embodiment. The folding camera includes a folding lens 8902 configured to fold light into a lens system 8901 including one or more lenses 8903a-d. For some embodiments, the folded lens is one or more of any of a prism and a lens. Lens system 8901 is configured to have a principal axis 8904 at an angle to a transmission axis 8906 that is parallel to the direction in which light travels before reaching bending lens 8902 . For example, folding cameras are used in camera phone systems to reduce the height of lens system 8901 in the direction of transmission axis 8906 .

Embodiments of the lens system include one or more liquid lenses such as those described herein. The embodiment shown in Figure 89 includes two liquid lenses 8903b, 8903d such as those described herein. One or more liquid lenses 8903b, 8903d are configured to be actuated using techniques including those described herein. Liquid lenses are actuated using actuators including, but not limited to, distortion actuators, bimorph actuators, and other SMA actuators. FIG. 108 includes a liquid lens actuated using a distortion actuator 60 according to one embodiment. The liquid lens includes a molded ring coupler 64 , a liquid lens assembly 61 , one or more distortion actuators 60 such as those described herein, a slide base 65 and a base 62 . One or more distortion actuators 60 may move a shaping ring/coupler 64 to change the shape of the flexible membrane of the liquid lens assembly 61 to move or shape the light rays, for example as described herein. Configured. For some embodiments, 3 or 4 actuators are used. A liquid lens, alone or in combination with other lenses, may be configured to function as an autofocus or optical image stabilization mechanism. A liquid lens may also be configured to direct the image onto the image sensor in other ways.

FIG. 90 shows some embodiments of a lens system 9001 including liquid lenses 9002a-9002h for imaging onto an image sensor 9004. FIG. As shown, the liquid lenses 9002a-9002h can include any lens shape and are dynamically configured to adjust the optical path through the lenses using techniques including those described herein. can be configured as

A lens system for a folding camera is configured to include a flexing lens 9100 that is actuated. An example of an actuated bending lens is the tilting of a prism such as that shown in FIG. In the example shown in FIG. 91, the bending lens is a prism 9102 located on actuator 9104 . Actuators include, but are not limited to, SMA actuators, including those described herein. For some embodiments, the tilt of the prism is placed on an SMA actuator that includes four bimorph actuators 9106 such as those described herein. According to some embodiments, the actuated bending lens 9100 is configured as an optical image stabilization mechanism using techniques including those described herein. For example, the actuated bending lens is configured to include an SMA system such as that shown in FIG. Another example of an actuated bending lens may include an SMA actuator such as that shown in FIG. However, the bending lens may also include other actuators.

FIG. 92 shows a bimorph arm with an offset according to one embodiment. Bimorph arm 9201 includes a bimorph beam 9202 having a preformed offset 9203 . The preformed offset 9203 enhances the mechanical advantage of generating higher forces than a bimorph arm without the offset. According to some embodiments, offset depth 9204 (also referred to herein as bending plane z-offset 9204) and offset length 9206 (also referred to herein as trough width 9206) is configured to define a characteristic of, e.g., peak force. For example, the graph in FIG. 106 illustrates the relationship between bending plane z-offset 9204, trough width 9206, and peak force for a bimorph beam 9202, according to one embodiment.

The bimorph arm includes one or more SMA materials, such as SMA ribbons or SMA wires 9210 such as those described herein. The SMA material is attached to the beam using techniques including those described herein. For some embodiments, the SMA material, e.g., SMA wire 9210, is attached to the fixed end 9212 of the bimorph arm and the load point end 9214 of the bimorph arm, so that the preformed offset 9203 is Between departments. For various embodiments, the ends of the SMA material are electrically and mechanically connected to contacts configured to apply current to the SMA material using techniques including those known in the art. be. Offset bimorph arms can be included in SMA actuators and systems such as those described herein.

FIG. 93 shows a bimorph arm with offsets and limits according to one embodiment. Bimorph arm 9301 includes bimorph beam 9302 having a formed offset 9303 and a limiter 9304 adjacent to formed offset 9303 . The offset 9303 enhances the mechanical advantage of producing a higher force than the bimorph arm 9301 without the offset, and the limiter 9304 is oriented away from the free load point end 9306 of the bimorph actuator. Prevent arm movement. Bimorph arm 9301 with preformed offset 9303 and limiter 9304 can be included in SMA actuators and systems such as those described herein. Bimorph arm 9301 can be one or more SMA materials, such as SMA ribbons or SMA wires, attached to bimorph arm 9301 using techniques including those described herein, such as those described herein. Including 9308.

FIG. 94 shows a bimorph arm with offsets and limits according to one embodiment. Bimorph arm 9401 includes a bimorph beam 9402 having a formed offset 9403 and a limiter 9404 adjacent to formed offset 9403 . Limiter 9404 is formed as part of base 9406 for bimorph arm 9401 . Base 9406 is configured to receive bimorph arm 9401 and includes a recess 9408 configured to receive an offset portion of the bimorph beam. The bottom of the recess configured as limiter 9404 is adjacent to preformed offset 9403 . The base 9406 can also include one or more portions 9410 configured to support portions of the bimorph arm when not actuated. Bimorph arm 9401 with preformed offset 9403 and limiter 9404 can be included in SMA actuators and systems such as those described herein. The bimorph arm 9401 may comprise one or more SMA materials, such as an SMA ribbon or SMA wire, such as those described herein, attached to the bimorph arm 9401 using techniques including those described herein. including.

FIG. 95 shows an embodiment of a base including offset bimorph arms according to one embodiment. Bimorph arm 9501 includes a bimorph beam 9502 having a preformed offset 9504 . Bimorph arms may also include limiters using techniques including those described herein. The bimorph arm 9501 may comprise one or more SMA materials, such as an SMA ribbon or SMA wire, such as those described herein, attached to the bimorph arm 9501 using techniques including those described herein. Including 9506.

FIG. 96 shows an embodiment of a base 9608 that includes two bimorph arms that are offset according to one embodiment. Each bimorph arm 9601a, 9601b includes a bimorph beam 9602a, 9602b having a formed offset 9604a, 9604b. Each bimorph arm 9601a, 9601b includes one or more SMA materials, such as SMA ribbons, such as those described herein, attached to the bimorph arm 9501 using techniques including those described herein. or SMA wires 9606a, 9606b. Each bimorph arm 9601a, 9601b may also include a limiter using techniques including those described herein. Some embodiments include a base that includes three or more bimorph arms formed using techniques including those described herein. According to some embodiments, bimorph arm 9601 is integrally formed with base 9608 . For other embodiments, one or more of the bimorph arms 9602a, 9602b are formed separately from the base 9608 and are formed using techniques including, but not limited to, soldering, resistance welding, laser welding, and adhesives. attached to the base 9608 using For some embodiments, two or more bimorph arms 9601a, 9601b are configured to act on a single object. This allows the ability to increase the force applied to the object. The graph in FIG. 107 below shows an example of how the box volume, which is an approximation of the box containing the entire bimorph actuator, relates to the amount of work done per bimorph component. The box volume is approximated using the bimorph actuator length 9612, the bimorph actuator width 9610, and the bimorph actuator height 9614 (collectively referred to as the "box volume").

FIG. 97 shows a curved arm including load point extensions according to one embodiment. Bending arm 9701 includes a beam portion 9702 and one or more load point extensions 9704a, 9704b extending from beam portion 9702 . Each end 9706a, 9706b of the flexure arm 9701 is configured to be attached to or integrally formed with a plate or other base using techniques including those described herein. According to some embodiments, one or more load point extensions 9704a, 9704b are attached to or integrally formed with beam portion 9702 offset from load points 9710a, 9710b of beam portion 9702 . Load points 9710a, 9710b are portions of beam portion 9702 that are configured to transfer the force of flexure arm 9701 to another object. For some embodiments, the load point 9710a, 9710b is the center of the beam portion 9702. For other embodiments, the load points 9710a, 9710b are at locations other than the center of the beam portion 9702. Load point extensions 9704a, 9704b are configured to extend in the direction of the longitudinal axis of beam portion 9702 from the point where they are joined to beam portion 9702 toward load points 9710a, 9710b of beam portion 9702 . For some embodiments, the ends of the load point extensions 9704a, 9704b extend to at least the load points 9710a, 9710b of the beam portion 9702. Bending arm 9701 includes one or more SMA materials, such as SMA ribbons or SMA wires 9712 such as those described herein. SMA material, eg, SMA wire 9712 , is attached to opposite ends of beam portion 9702 . The SMA material is attached to opposite ends of the beam section using techniques including those described herein. For some embodiments, the length of the load point extensions 9704a, 9704b may be any length contained within the longitudinal length of the associated flat (non-actuated) beam portion 9702 of the flexure arm 9701. can be configured to

FIG. 98 shows a bending arm 9801 including a load point extension 9810 according to one embodiment in an actuated position. The SMA material attached to opposite ends of beam portion 9802 is actuated using techniques including those described herein. The load point 9804 allows the flexure arm 9801 to have a greater stroke range than a flexure arm without extensions. Therefore, a curved arm that includes a load point extension can have a larger maximum vertical stroke. Bent arms with load point extensions can be included in SMA actuators and systems such as those described herein.

FIG. 99 shows a bimorph arm including load point extensions according to one embodiment. Bimorph arm 9901 includes a beam portion 9902 and one or more load point extensions 9904a, 9904b extending from the beam portion. One end of the bimorph arm 9901 is configured to be attached to or integrally formed with a plate or other base using techniques including those described herein. The end of the beam portion 9902 opposite the attached or integrally formed end is free and free to move. According to some embodiments, one or more load point extensions 9904a, 9904b are attached to or integrally formed with the beam portion 9902 offset from the free end of the beam portion 9902. Load point extensions 9904 a , 9904 b are configured to extend from the point where they are joined to beam portion 9902 in a direction away from a plane containing the longitudinal axis of beam portion 9902 . For example, one or more of the load point extensions 9904a, 9904b extend in the direction the free ends of the beams extend in operation. Some embodiments of the bimorph arm 9901 include one or more load point extensions 9904a, 9904b having longitudinal axes that form an angle, such as 1 degree to 90 degrees, with a plane containing the longitudinal axis of the beam. include. For some embodiments, ends 9910a, 9910b of load point extensions 9904a, 9904b are configured to engage an object configured to be moved.

Bimorph arm 9901 includes one or more SMA materials, such as SMA ribbons or SMA wires 9906 such as those described herein. SMA material, eg, SMA wire 9906 is attached to opposite ends of beam portion 9902 . The SMA material is attached to opposite ends of the beam portion 9902 using techniques including those described herein. For some embodiments, the length of load point extensions 9904a, 9904b can be configured to be any length. According to some embodiments, the location of the point of engagement of the object by the ends 9910a, 9910b of the load point extensions 9904a, 9904b is configured to be at any point along the longitudinal length of the beam portion 9902. obtain. The height of the end of the load point extension above the beam when the beam is flat (not actuated) can be configured to be any height. For some embodiments, the load point extension may be configured to be at least above other portions of the bimorph arm when the bimorph arm is actuated.

FIG. 100 shows a bimorph arm including a load point extension according to one embodiment in an actuated position. The SMA material attached to opposite ends of beam portion 2 is actuated using techniques including those described herein. The load point extension 10 enables the bimorph arm 1 to have greater stroke force than a bimorph arm without the extension. Therefore, the bimorph arm 1 including the load point extension 10 allows greater forces to be applied by the bimorph arm 1 . A bimorph arm 1 provided with a load point extension 10 can be included in SMA actuators and systems such as those described herein.

FIG. 101 illustrates an SMA optical image stabilization mechanism according to one embodiment. SMA optical image stabilization mechanism 20 includes a movable plate 22 and a stationary plate 24 . Movable plate 22 includes spring arms 26 that are integrally formed with movable plate 22 . For some embodiments, movable plate 22 and stationary plate 24 are each formed to be unitary one-piece plates. Movable plate 22 includes a first SMA material mounting portion 28a and a second SMA material mounting portion 28b. Stationary plate 24 includes a first SMA material mounting portion 30a and a second SMA material mounting portion 30b. Each SMA material attachment 28, 30 is configured to secure the SMA material, eg, SMA wire, to the plate using a resistance weld joint. The first SMA material mounting portion 28a of the movable plate 22 has a first SMA wire 32a disposed between it and the first SMA material mounting portion 30a of the stationary plate, and it and the second SMA of the stationary plate 24. It includes a second SMA wire 32b disposed between it and the mounting portion 30b. The second SMA material mounting portion 28b of the moving plate 22 is connected to a third SMA wire 32c disposed between it and the second SMA material mounting portion 30b of the stationary plate, and it and the first SMA of the stationary plate 24. It includes a fourth SMA wire 32d positioned between it and the mounting portion 30a. Actuation of each SMA wire, using techniques including those described herein, moves movable plate 22 away from stationary plate 24 . FIG. 102 shows the SMA material attachment portion 40 of the moving part according to one embodiment. The SMA material attachment portion is configured to have SMA material, eg, SMA wire 41 , resistance welded to SMA material attachment portion 40 . FIG. 103 shows a stationary plate SMA attachment 42 with a resistance welded SMA wire 43 attached thereto, according to one embodiment.

FIG. 104 shows an SMA actuator 45 that includes a strain actuator according to one embodiment. Bending actuator 46 includes a bending arm 47 such as those described herein. Bending arm 47 is configured to move in the z-axis when SMA wire 48 is activated and deactivated using techniques including those described herein. Each SMA wire 48 is attached to a respective resistance weld wire crimp 49 using resistance welding. Each resistance weld wire crimp 49 includes islands 50 isolated from the metal 51 that form the flexure arms 47 on at least one side of the SMA wire 48 . The island structure connects at least one side of the SMA wire to an isolated island structure formed in a base metal layer such as the OIS application shown in FIG. and in autofocus systems.

FIG. 105 illustrates a resistance weld crimp including islands for an SMA actuator according to one embodiment used to attach SMA wire 48 to strain actuator 46 using techniques including those described herein. 105a shows the bottom portion of the SMA actuator 45. FIG. According to some embodiments, SMA actuator 45 is formed from stainless steel base layer 51 . A dielectric layer 52 such as a polyimide layer is disposed on the bottom portion of the stainless steel base layer 51 . According to some embodiments, a conductor layer 53 is electrically connected to the stainless steel islands 50 by vias in the dielectric layer 52 and attached to wires welded to the stainless steel islands 50 and the stainless steel islands. to make electrical connections between the conductor circuits. According to some embodiments, islands 50 are etched from a stainless steel base layer. Dielectric layer 52 maintains the position of islands 50 within stainless steel base layer 51 . Island 50 is configured to have SMA wire attached to it using techniques including those described herein such as resistance welding. FIG. 105b shows the upper part of the SMA actuator 45 including the islands 50. FIG. For some embodiments, glue or adhesive may also be placed on top of the weld to aid in mechanical strength and work as fatigue strain relief during operation and impact loading.

FIG. 108 includes a lens system including an SMA actuator provided with a distortion actuator according to one embodiment. The lens system includes a liquid lens assembly 61 located on base 62 . The lens system also includes a molded ring/coupler 64 mechanically connected to the distortion actuator 60 . An SMA actuator, including a strain actuator 60 such as those described herein, is located on a slide base 65 that is located on base 62 . The SMA actuator is configured to move the shaped ring/coupler 64 along the optical axis of the liquid lens assembly 61 by actuating the distortion actuator 60 using techniques including those described herein. . This moves the molding ring/coupler 64 to change the focus of the liquid lens within the liquid lens assembly.

FIG. 109 shows an unfixed load point end of a bimorph arm according to one embodiment. The free load point end 70 of the bimorph arm includes a flat surface 71 for mounting SMA material, such as SMA wire 72 . SMA wire 72 is attached to flat surface 71 by resistance welds 73 . Resistance weld 73 is formed using techniques including those known in the art.

FIG. 110 shows an unfixed load point end of a bimorph arm, according to one embodiment. The free load point end 76 of the bimorph arm includes a flat surface 77 for mounting SMA material, such as SMA wire 78 . SMA wire 78 is attached to flat surface 77 by a resistance weld similar to that shown in FIG. Adhesive 79 is placed on the resistance weld. This allows for a more reliable bond between the SMA wire 78 and the free load point end 76 . Adhesives 79 include, but are not limited to, conductive adhesives, non-conductive adhesives, and other adhesives known in the art.

FIG. 111 shows an unfixed load point end of a bimorph arm according to one embodiment. The free load point end 80 of the bimorph arm includes a flat surface 81 for mounting SMA material, such as SMA wire 82 . A metal intermediate layer 84 is disposed on the planar surface 81 . Metal intermediate layer 84 includes, but is not limited to, a gold layer, a nickel layer, or an alloy layer. SMA wire 82 is attached by resistance welds 83 to a metal interlayer 84 located on planar surface 81 . Resistance welds 83 are formed using techniques including those known in the art. The metal intermediate layer 84 allows better adhesion with the unfixed load point end 80 .

FIG. 112 shows an unfixed load point end of a bimorph arm according to one embodiment. The free load point end 88 of the bimorph arm includes a flat surface 89 for mounting SMA material, such as SMA wire 90 . A metal interlayer 92 is disposed on planar surface 89 . Metal intermediate layer 92 includes, but is not limited to, a gold layer, a nickel layer, or an alloy layer. SMA wire 90 is attached to flat surface 89 by a resistance weld similar to that shown in FIG. Adhesive 91 is placed on the resistance weld. This allows for a more reliable bond between the SMA wire 90 and the free load point end 88 . Adhesives 91 include, but are not limited to, conductive adhesives, non-conductive adhesives, and other adhesives known in the art.

FIG. 113 shows a fixed end of a bimorph arm according to one embodiment. The fixed end 95 of the bimorph arm includes a flat surface 96 for mounting SMA material, eg, SMA wire 97 . SMA wire 97 is attached to flat surface 96 by resistance welds 98 . Resistance welds 98 are formed using techniques including those known in the art.

FIG. 114 shows a fixed end of a bimorph arm according to one embodiment. The fixed end 120 of the bimorph arm includes a flat surface 121 for mounting SMA material, eg, SMA wire 122 . SMA wire 122 is attached to flat surface 121 by a resistance weld similar to that shown in FIG. Adhesive 123 is placed on the resistance weld. This allows for a more reliable bond between SMA wire 122 and fixed end 120 . Adhesives 123 include, but are not limited to, conductive adhesives, non-conductive adhesives, and other adhesives known in the art.

FIG. 115 shows a fixed end of a bimorph arm according to one embodiment. A fixed end 126 of the bimorph arm includes a flat surface 127 for mounting an SMA material, such as SMA wire 128 . A metal interlayer 130 is disposed on the planar surface 127 . Metal intermediate layer 130 includes, but is not limited to, a gold layer, a nickel layer, or an alloy layer. SMA wire 128 is attached by resistance welds 129 to metal interlayer 130 located on planar surface 127 . Resistance weld 129 is formed using techniques including those known in the art. Metal intermediate layer 130 allows for better adhesion with fixed end 126 .

FIG. 116 shows a fixed end of a bimorph arm according to one embodiment. Fixed end 135 of bimorph arm includes flat surface 136 for attachment to SMA material, eg, SMA wire 137 . A metal interlayer 138 is disposed on planar surface 136 . Metal intermediate layer 136 includes, but is not limited to, a gold layer, a nickel layer, or an alloy layer. SMA wire 137 is attached to flat surface 136 by a resistance weld similar to that shown in FIG. Adhesive 139 is placed on the resistance weld. This allows for a more reliable bond between SMA wire 137 and fixed end 135 . Adhesives 139 include, but are not limited to, conductive adhesives, non-conductive adhesives, and other adhesives known in the art.

FIG. 117 shows a rear view of the fixed end of a bimorph arm according to one embodiment. Bimorph arm 143 is configured in accordance with multiple embodiments described herein. The fixed end 143 of the bimorph arm includes an island 144 that is isolated from the outer portion 145 of the fixed end 143 . This allowed the island 144 to be electrically and/or thermally isolated from the outer portion 145 . For some embodiments, the SMA material attached to opposite sides of the fixed end 143 of the bimorph arm is electrically connected to the SMA material, eg, SMA wire, through vias. Island 144 is disposed in insulator 146, such as those described herein. Islands 144 may be formed using etching techniques, including those known in the art.

FIG. 118 shows an exploded view of a distortion module tilt OIS assembly 11800 according to one embodiment. The warp module tilt OIS assembly 11800 includes two subassemblies, a top warp assembly 11820 and a bottom warp assembly 11900 . The upper skew assembly 11820 is configured to provide yaw axis motion to allow for dynamic tilt adjustment. The bottom flexure assembly 11900 is configured to provide pitch axis movement to allow dynamic tilt adjustment. The skew module tilt OIS assembly 11800 is configured to be two separate subassemblies each containing a two-wire skew actuator that respectively moves the carriage. Two bending assemblies are implemented for efficient manufacturing and assembly.

The strain module tilt OIS assembly 11800 includes a 4-wire strain actuator using techniques including those described herein, eg, a 4-wire strain section as described above with reference to FIGS. 19-22. Distortion module tilt OIS assembly 11800 enables tilting of the two-axis camera module OIS using techniques including those described herein, such as those described above with reference to FIGS. can operate as Therefore, the skew module tilt OIS assembly 11800 moves heavier masses than current actuators of smaller size, moves masses to greater tilt angles up to ±5°, and moves masses at higher speeds. is operable. Therefore, the distortion module tilt OIS assembly 11800 can suppress unwanted hand-shake motion.

The distortion module tilt OIS assembly 11800 includes a compact flexible circuit operable to allow the camera module to move/tilt in two axes and transmit many electrical signals from the moving image sensor. This is described in more detail below with reference to FIGS. 128-131 and 133-134. In addition, various sensors or components, such as Hall element sensors, TMR sensors, and resistive feedback of SMA wires that are the same as the movement of the actuator, to measure the tilt position of the closed-loop control and enable its feedback. , may be implemented herein.

Distortion module tilt OIS assembly 11800 includes AF assembly with sensor bracket 11840 , sensor circuit PCB 11860 , and module circuit PCB 11880 sandwiched between top and bottom distortion assemblies 11820 and 11900 . The moving mass includes AF assembly with sensor bracket 11840, sensor circuit PCB 11860, and module circuit PCB 11880. Upper distortion assembly 11820 is configured to receive AF assembly comprising sensor bracket 11840 and sensor circuit PCB 11860 . This is described in more detail below with reference to Figures 124A and 124B. Note that the distortion module tilt OIS assembly 11800 may include more or fewer components than shown in FIG. However, the illustration is sufficient to disclose illustrative embodiments for practicing the subject invention. In some examples, the moving module is a full camera module. Therefore, the distortion module tilt OIS assembly 11800 includes an image sensor on a PCB, an autofocus (AF) module, and a camera lens. However, it should be understood that the present disclosure and example embodiments may be implemented in various technologies.

FIG. 119 shows an assembled view of a distortion module tilt OIS assembly 11800 according to one embodiment. The skew module tilt OIS assembly 11800 can be configured to fit a footprint of up to 14.5 mm x 14.5-16.5 mm. For reference, the footprint of the AF assembly with sensor bracket 11840 is approximately 10 mm x 10 mm. FIG. 135 shows the footprint dimensions of an AF assembly with a sensor bracket 11840 according to one embodiment. As a result, some embodiments of the distortion module tilt OIS assembly 11800 have a footprint that is 4.5 mm larger than the AF assembly with sensor bracket 11840 .

FIG. 120 illustrates forces applied to a bending module tilt OIS assembly 11800 according to one embodiment. Upper flexure assembly 11820 includes flexure arms 11833 each positioned to cause upper flexure assembly 11820 to produce yaw axis motion. The bottom flexing assembly 11900 includes flexing arms 11813 each positioned to cause the bottom flexing assembly 11900 to produce pitch axis motion. As a result, the top warp assembly 11820 and the bottom warp assembly 11900 push away from each other resulting in dynamic tilting of the warp module tilt OIS assembly 11800 . The top flexure assembly 11820 provides an upward force (yaw) 11830 while the bottom flexure assembly 11900 provides a downward force (pitch) 11810 . According to some embodiments, distortion module tilt OIS assembly 11800 is operable to connect directly to SMA wires and Hall sensors via module circuit PCB 11880 .

The push force of some of the embodiments is ten times or more than the push force of current technology. An example pushing force of the top flexing assembly 11820 and bottom flexing assembly 11900 is 20-30 grams. This allows for a higher frequency response rate of the distortion module tilt OIS assembly 11800 when used with objects having greater mass. As a result, the disclosed embodiments have a smaller footprint and can move more mass than current technology.

FIG. 121 illustrates tilt resulting from forces applied to the distortion module tilt OIS assembly 11800 according to one embodiment. The AF assembly with sensor bracket 11840 is shown tilted at an angle θ. In some examples, the angle θ is about 5 degrees off-center. According to some embodiments, the AF assembly with sensor bracket 11840 is operable to move up and down approximately 0.56 mm. Additionally, for some embodiments, the AF assembly including the sensor bracket 11840 is operable to move about 0.155 mm side to side. According to some embodiments, the distortion module tilt OIS assembly 11800 provides clearance for relative motion of the AF assembly with the sensor bracket 11840 .

FIG. 122 shows an exploded view of the upper distortion assembly 11820 of the distortion module tilt OIS assembly 11800 according to one embodiment. The upper warp assembly 11820 may include a housing 11920 with upper springs, an upper AF carriage 11940, a flexible sensor circuit 11960, and a yaw tilt subassembly 11980. Yaw tilt subassembly 11980 includes tilt subassembly flex frame 11910 , stainless steel SST flex frame 11930 , slide bearing 11950 , at least one SMA wire 11970 and SST slide base 11990 . For some embodiments, plain bearing 11950 is formed of polyoxymethylene (POM bearing).

FIG. 123 shows an exploded view of the bottom warp assembly 11900 of the warp module tilt OIS assembly 11800 according to one embodiment. The bottom warp assembly 11900 may include a housing 12000 with bottom springs, a bottom AF carriage 12020, and a pitch tilt subassembly 12040. Pitch tilt subassembly 12040 includes tilt subassembly flex frame 12010 , stainless steel SST flex frame 12030 , bearings, SMA wire 12070 and SST slide base 12030 .

FIG. 124A shows an exploded view of a partially assembled distortion module tilt OIS assembly 11801, according to one embodiment. The AF assembly with sensor bracket 11840 is inserted from below and secured to the upper distortion assembly 11820 . In some examples, the AF assembly including sensor bracket 11840 is secured to upper flexure assembly 11820 by adhesives, solder welding, or other known processes of attaching subcomponents. FIG. 124B shows an assembled view of a partially assembled distortion module tilt OIS assembly 11801, according to one embodiment. The AF assembly with sensor bracket 11840 is connected to sensor circuit PCB 11860 . A sensor circuit connection 12120 is easily made between the sensor circuit PCB 11860 and the AF assembly comprising the sensor bracket 11840 when connecting both components.

FIG. 125 shows a front view of a partially assembled bending module tilt OIS assembly 11801, according to one embodiment. The sensor circuit PCB 11860 is connected from below to the AF assembly with sensor bracket 11840 . Sensor circuit PCB 11860 may be secured to AF assembly with sensor bracket 11840 by solder welds 12124 and 12122, or other known processes of attaching subcomponents.

FIG. 126 illustrates the assembly process of the distortion module tilt OIS assembly 11800 according to one embodiment. As described above, the AF assembly with sensor bracket is inserted from below and secured to the upper distortion assembly 11820 to form a partially assembled distortion module tilt OIS assembly 11801 (movable mass). At this point, many electrical contacts are still exposed and are joined together (typically by soldering). The module circuit PCB 11880 is connected from below to the partially assembled skewed module tilt OIS assembly 11801 .

FIG. 127 shows the connection of the module circuit PCB 11880 to the partially assembled distorted module tilt OIS assembly 11801, according to one embodiment. Additionally, the bottom warp assembly 11900 is connected from below to the module circuit PCB and the partially assembled warp module tilt OIS assembly to form the warp module tilt OIS assembly 11800 . The bottom warp assembly 11900 is then connected along a fixed perimeter to both the top warp assembly 11820 and the bottom warp assembly 11900 and the carriage attaches to the bottom of the partially assembled warp module tilt OIS assembly 11801. be done.

FIG. 128 shows the flexible sensor circuit 11909 of the distortion module tilt OIS assembly 11800 according to one embodiment. FIG. 129 shows the flexible sensor circuit 11909 of the distortion module tilt OIS assembly 11800 according to one embodiment. Flexible sensor circuit 11909 may have a fixed connection to module circuit PCB 11880 at a first end. Flexible sensor circuit 11909 may include sensor circuit connection 12120 at a second end.

FIG. 130 shows a flexible sensor circuit of a distortion module tilt OIS assembly 12500 according to an alternative embodiment. Distortion module tilt OIS assembly 12500 includes two flexible sensor circuits 11908 and 11909 . Two flexible sensor circuits 11908 and 11909 are separated by a flexible section 12501 to allow motion of the flexure module tilt OIS assembly 12500 in two axes. Other embodiments include skew module tilt OIS assemblies that include three or more flexible sensor circuits. FIG. 131 shows a flexible sensor circuit of a distortion module tilt OIS assembly 12500, according to an alternative embodiment. As shown herein, a first end of flexible sensor circuit 11908 is attached to fixed module circuit PCB 12880 . A second end of the flexible sensor circuit 11908 is attached to the sensor circuit PCB 11860, which is free and operable to move. Similarly, a first end of flexible sensor circuit 11909 is attached to fixed module circuit PCB 12880 . A second end of the flexible sensor circuit 11909 is attached to the sensor circuit PCB 11860, which is free and operable to move. Each of the flexible sensor circuits 11908 and 11909 includes one or more flexible regions 12502 to allow the flexible sensor circuits to move with the movable components of the bending module tilt OIS assembly 12500.

FIG. 132 shows an assembled view of a distortion module tilt OIS assembly 13200, according to an alternative embodiment. Distortion module tilt OIS assembly 13200 includes upper distortion assembly 13220 . The upper flexure assembly 13220 includes flexure arms 13233 each downwardly positioned to cause the upper flexure assembly 13220 to produce pitch axis motion in a downward direction. The distortion module tilt OIS assembly 13200 also includes a bottom distortion assembly 13230 .

The bottom flexing assembly 13230 includes flexing arms 13213 each positioned to cause the bottom flexing assembly 13230 to produce yaw axis motion in an upward direction. As a result, the top warp assembly 13220 and the bottom warp assembly 13230 push toward each other to provide dynamic tilting of the warp module tilt OIS assembly 13200 . The top flexure assembly 13230 provides a downward force (pitch), while the bottom flexure assembly 13230 provides an upward force (yaw).

FIG. 133 shows a bending module tilting OIS assembly 13300 according to an alternative embodiment. FIG. 134 shows the underside of an assembled view of the distortion module tilt OIS assembly 13300. FIG. Distortion module tilt OIS assembly 13300 includes a long flexible circuit 13301 extending directly from sensor circuit PCB 13360 . A flexible circuit extends from the sensor circuit PCB 13360 to allow movement in two axes. Distortion module tilt OIS assembly 13300 includes a 4-wire distortion system for tilting the camera for OIS according to multiple embodiments described herein.

FIG. 136 shows an SMA module tilted OIS assembly 13600 according to one embodiment. FIG. 137 shows an under directional deformation SMA module tilted OIS assembly 13600, according to one embodiment. The SMA module tilt OIS assembly 13600 incorporates a 4-wire skew tilt camera module, which enables pitch and yaw movement using techniques including those described herein. The bottom 2 wires are operable to be driven differently for pitch tilt using techniques including those described herein. Additionally, the top two wires are operable to be driven differently for yaw tilt. Movement of the subassemblies enables the SMA module tilt OIS assembly 13600 to produce tilts up to ±4.9°, as described herein. Furthermore, the pushing force of the bending portion is 20 grams or more. This configuration is ideal for moving heavier masses with higher frequency and amplitude.

FIG. 138 shows a flexible sensor circuit 13700 of a distortion module tilt OIS assembly 13600 according to an alternative embodiment. The flexible sensor circuit 13700 is operable to transfer signals from the image sensor to the PCB or other circuitry external to the sensor.

FIG. 139 shows a bending module tilting OIS assembly 1 that includes a single housing, according to one embodiment. Housing 2 is configured to include within housing 2 a top flexing assembly according to embodiments described herein and a bottom flexing assembly according to embodiments described herein. Housing 2 is configured to receive a flexible printed circuit 3 on the outer surface of housing 2 . Flexible printed circuit 3 is configured to include one or more position sensors 22 configured to enable closed-loop control using techniques including those described herein. For some embodiments, the one or more sensors are Hall element sensors. For some embodiments, flexible printed circuit 3 is configured to include one or more integrated circuits, such as OIS drivers.

FIG. 140 shows an exploded view of a bending module tilting OIS assembly 1 including a single housing, according to one embodiment. The skew module tilt OIS assembly 1 includes an upper return spring 4 configured to produce a return torque that aids tilt stroke stability. An upper return spring 4 is located in the upper autofocus carriage 5 of the upper warping assembly according to some embodiments. The upper autofocus carriage 5 is configured to receive the upper part of the module. For some embodiments the module is the autofocus and image sensor module 21 . The upper strain assembly 6 also includes a strain actuator 7 such as those described herein. The strain actuator 6 is configured to use techniques including those described herein. According to some embodiments, upper bending assembly 6 includes one or more bearings 8 such as those described herein. Upper bending assembly 6 includes one or more SMA wires 9 similar to those described herein. One or more SMA wires 9 are configured to actuate strain actuators 7 using techniques including those described herein.

The distortion module tilt OIS assembly also includes a bottom distortion assembly 11 . Bottom flexing assembly 11 includes a flexing actuator 12 such as those described herein. The strain actuator 12 is configured to use techniques including those described herein. For some embodiments, strain actuator 12 is a different type of SMA actuator than strain actuator 11 of upper strain assembly 6 . According to some embodiments, the bottom flexure assembly 11 includes one or more bearings 13 such as those described herein. Bottom bending assembly 11 includes one or more SMA wires 14 similar to those described herein. One or more SMA wires 14 are configured to actuate strain actuators 12 using techniques including those described herein. According to some embodiments, the top distorting assembly 6 is arranged on the bottom distorting assembly 11 .

A distortion module tilt OIS assembly according to the embodiment shown in FIG. 140 includes a bottom autofocus carriage 16 . The bottom autofocus carriage 16 is configured to receive the bottom portion of the module, the autofocus and image sensor module 21 . Bottom autofocus carriage 16 is configured to receive one or more magnets 15 . One or more magnets 15 are aligned with respective position sensors included in flexible printed circuit 3 as part of closed loop control using techniques including those described herein. One or more magnets 15 and one or more position sensors 22 are configured to allow information regarding the tilt and height or z-axis position of modules such as the autofocus and image sensor module 21 .

The skew module tilt OIS assembly includes a bottom spring 17 . Bottom spring 17 is configured to receive bottom autofocus carriage 16 . A sensor circuit 18 is configured to electrically connect the module for powering to circuitry external to the module. According to some embodiments, the sensor circuit 18 is also configured to electrically connect the one or more position sensors and any integrated circuits, eg OIS drivers, by the flexible printed circuit 3 . For some embodiments, sensor circuit 18 is a flexible circuit that includes conductive traces that electrically connect one or more position sensors, any integrated circuits, and/or modules. The flexible circuit allows the module to be moved by the top flexing assembly 6 and bottom flexing assembly 7 without damaging the conductive traces. A sensor circuit 18 is located on the base cap 19 . Base cap 19 is configured to mate with housing 1 using techniques including those known in the art.

FIG. 141 illustrates a distortion module gradient OIS according to one embodiment. Distortion module tilt OIS 23 includes a top distortion assembly 24 such as those described herein and a bottom distortion assembly 25 such as those described herein. Distortion module tilt OIS 23 includes a module circuit printed circuit board (PCB) 26 configured to include one or more position sensors such as those described herein. As shown in FIG. 141, a yaw-tilt subassembly, such as those described herein, of the upper flexure assembly 24 applies a strong force 27 to one side to allow tilting of the module in a first direction. and a weaker force 28 on the other side. Regarding this example of tilting in a first direction, according to some embodiments, a pitch-tilting subassembly, such as those described herein, of the bottom flexing assembly 25 is a pivot point for tilting movement. It is configured to have moderate force on both sides to function. Using similar techniques, the skew module tilt OIS 23 is configured to move the module to many positions.

FIG. 142 shows internal components, such as those described herein, of a distortion module tilt OIS 30, according to one embodiment. Bending module tilt OIS 30 includes a top spring 31 and a bottom spring 32 . Top spring 31 and bottom spring 32 are configured to have similar stiffness. For some embodiments, the stiffness of top spring 31 and bottom spring 32 is 61 millinewton-millimeters/degree. However, those skilled in the art will appreciate that the stiffness can be configured to any desired stiffness by adjusting the spring material and/or material thickness.

FIG. 143 shows an upper spring according to one embodiment. Top spring 33 includes one or more spring arms 34a-34d. The top spring 33 is configured to generate a return torque to assist tilt stroke stability of the skew module tilt OIS according to embodiments. FIG. 144 shows bottom spring 35 according to one embodiment. The bottom spring 35 is configured to generate a return torque to assist tilt stroke stability of the skew module tilt OIS according to embodiments. For some embodiments, the material of the top spring 33 and bottom spring 35 is made of 302/304 stainless steel with a thickness of 50 micrometers and a spring arm width of 120 micrometers.

FIG. 145 shows a flexible sensor circuit connected to a module of a distortion module tilt OIS assembly according to one embodiment. The distortion module tilt OIS is configured in accordance with multiple embodiments described herein. A flexible sensor circuit 37 is electrically connected to the bottom of the module 38 at a first end of the flexible sensor circuit 37 such as those described herein. Flexible sensor circuit 38 is configured to have a first set of traces 39 and a second set of traces 40 . A first set of traces 39 extend from the first pads 46 and are electrically connected to the first portion of the module 38 through the first pads 46 of the flexible sensor circuit 37 . A second set of traces 40 extend from the second pads 47 and are electrically connected to the first portion of the module 38 through the second pads 47 of the flexible sensor circuit 37 . A second end of the first set of traces 39 is configured to terminate in a first terminal pad 44 located within the terminal pad portion 42 of the single housing 43 . A second end of the second set of traces 39 is configured to terminate in a second terminal pad 45 located within the terminal pad portion 42 on the side of the single housing 43 . The terminal pad portions 42 of the single housing 43 are configured to electrically connect other circuits of the module and skew module tilt OIS assembly to other circuits by way of one or more connectors on the circuit board.

For some embodiments, first terminal pad 46 and second terminal pad 47 are formed on the same base layer. For other embodiments, first terminal pad 46 and second terminal pad 47 are formed on physically separate base layers. The configuration of the flexible sensor circuit 37 allows soldering of the connections of the first pad 46, the second pad 47, the first terminal pad 44 and the second terminal pad 45 simultaneously. In addition, flexible sensor circuit 37 is configured to have many electrical traces with low stiffness within a small size to minimize impact during module 38 movement.

FIG. 146 shows a flexible sensor circuit according to the embodiment shown in FIG. 145 including a base cap 48 such as those described herein. The base cap is configured to fit into the single housing 43 using techniques including those known in the art. Base cap 48 includes a terminal cover portion 49 configured to cover first terminal pad 44 and second terminal pad 45 .

FIG. 147 shows an assembly showing a distortion module tilt OIS according to one embodiment without a housing and base cap. Distortion module gradient OIS 50 includes a flexible sensor circuit 51 such as described herein that includes a first set of traces and a second set of traces. The flexible sensor circuit 51 is configured to minimize the bias between pitch and yaw stiffness and to have a low force impact on motion of modules such as those described herein. According to some embodiments, the first terminal pad and the second terminal pad extend one millimeter or less from the side of the module. However, those skilled in the art will appreciate that the terminal pads may extend beyond one millimeter if desired.

For some embodiments, flexible sensor circuit 51 is formed of one or more stainless steel base layers. For some embodiments, the stainless steel base layer is formed having a thickness of 18 microns. The stainless steel base layer includes a dielectric layer such as a polyimide layer. Further, the first pad, second pad, first terminal pad, and second terminal pad traces and plurality of contact pads are formed from a conductor layer disposed on the dielectric layer. For some embodiments, the conductor layer is a copper layer, although other conductive materials may be used. For some embodiments, the flexible sensor circuit includes a second dielectric layer disposed on the conductor layer. For some embodiments, the conductor layer is formed to have a thickness of 12 microns or 24 microns. However, other embodiments include conductor layers having other thicknesses. For some embodiments, the second dielectric layer is a polyimide layer. For some embodiments, the second dielectric layer is formed to have a thickness of 5-7 microns. However, other embodiments include second dielectric layers having other thicknesses. According to embodiments, the flexible sensor circuit is configured to have a thickness of 0.05 millimeters or less and includes electrical traces with a width of 0.015 millimeters or less. The base layer of the flexible sensor circuit includes a base layer that is formable and configured to hold the shape of the flexible sensor circuit.

FIG. 148 shows a bottom view of a module including flexible sensor circuitry according to one embodiment. Module 52 includes flexible sensor circuitry 53 configured in accordance with multiple embodiments described herein. For some embodiments, flexible sensor circuit 53 is configured to have pitch and yaw stiffnesses of 38 millinewton-millimeters per degree or less. For some embodiments, flexible sensor circuit 53 is configured to have a pitch stiffness of no greater than 38 millinewton-millimeters per degree and a yaw stiffness of no greater than 24 millinewton-millimeters per degree.

FIG. 149 shows side and bottom views of a module including flexible sensor circuitry, according to one embodiment. Module 54 includes flexible sensor circuitry 55 configured in accordance with multiple embodiments described herein. A first set of traces 56 and a second set of traces 58 are configured to be positioned outside of first pads 57 and second pads 59, respectively. FIG. 150 shows side and bottom views of a module including flexible sensor circuitry according to one embodiment. Module 61 includes flexible sensor circuitry 64 configured in accordance with multiple embodiments described herein. The first set of traces 63 and the second set of traces 66 are configured to be positioned outside the first pads 62 and the second pads 65 . For some embodiments, first set of traces 63 and second set of traces 66 each include at least one bend, eg, first bend 68 and second bend 69 . For some embodiments, the bend is 6 degrees or more from the surface of the module. However, the bend may be any other value. The first flexure 68 and the second flexure 69 are designed to minimize any contact with the module and/or any other component of the distorted module tilt OIS, such as the base cap, during movement. configured to

Terms such as “top,” “bottom,” “above,” “below,” and the x-, y-, and z-directions, as used herein for convenience, refer to any particular spatial or the orientation of gravity, but rather the spatial relationship of the portions to each other. Hence, the terminology applies to the components regardless of whether the assembly is oriented in the particular orientation shown in the drawings and described herein, inverted from that orientation, or any other rotational variation. shall include the assembly of the part of

It is recognized that the term "present invention" as used herein should not be construed to mean that only a single invention possessing any single essential element or group of elements is presented. would be It is also recognized that the term "present invention" includes several separate inventions, each of which may be considered a separate invention. Although the present invention has been described in detail with respect to preferred embodiments and drawings thereof, various adaptations and modifications of the embodiments of the invention can be accomplished by those skilled in the art without departing from the spirit and scope of the invention. It is clear to obtain Additionally, the techniques described herein can be used to fabricate devices having 2, 3, 4, 5, 6, or more, typically n bimorph and strain actuators. Accordingly, the detailed description set forth above and the accompanying drawings are not intended to limit the scope of the invention, which covers the following claims and their properly construed legal equivalents. It is understood that it should only be inferred from the object.

Claims (30)

A skew module tilt OIS assembly, comprising:
an upper skew assembly configured to provide yaw axis movement to enable dynamic tilt adjustment;
a bottom distortion assembly configured to provide pitch axis movement to enable dynamic tilt adjustment. 2. The strain module tilt OIS assembly of claim 1, wherein the upper strain assembly includes a two-wire strain actuator. 2. The warp module tilt OIS assembly of claim 1, wherein the bottom warp assembly includes a two-wire warp actuator. 2. The distortion module tilt OIS assembly of claim 1, wherein the distortion module tilt OIS assembly is operable to provide tilting of the two-axis camera module OIS to move the movable mass to large tilt angles up to ±5 degrees. assembly. 5. The distortion module tilt OIS assembly of claim 4, wherein the movable mass includes an autofocus assembly, a sensor circuit PCB, and a module circuit PCB. 5. The distortion module tilt OIS assembly of claim 4, wherein the autofocus assembly is secured to the upper distortion assembly with an adhesive. The distortion module tilt OIS assembly of claim 1, further comprising an autofocus AF assembly, a sensor circuit PCB, and a module circuit PCB disposed between said top and bottom distortion assemblies. assembly. 8. The distortion module tilt OIS assembly of claim 7, wherein the upper distortion assembly is configured to receive the AF assembly and the sensor circuit PCB. 2. The bending module tilt OIS assembly of claim 1, wherein the bending module tilt OIS assembly is configured to fit in a footprint of up to 14.5 mm in length and up to 14.5 mm in width. 2. The distortion module tilt OIS assembly of claim 1, wherein the upper distortion assembly includes one or more distortion arms, each distortion arm arranged to impart yaw axis motion to the upper distortion assembly. 11. The distortion module tilt OIS assembly of claim 10, wherein the bottom distortion assembly includes one or more distortion arms, each distortion arm arranged to impart pitch axis motion to the bottom distortion assembly. 12. The warp module tilt OIS assembly of claim 11, wherein the top warp assembly and the bottom warp assembly are operable to push apart from each other to provide dynamic tilting of the warp module tilt OIS assembly. The bending module tilt OIS assembly of claim 1, wherein the pushing force of said top bending assembly and said bottom bending assembly is 20-30 grams. 2. The warp module tilt OIS assembly of claim 1, wherein the upper warp assembly includes a housing with a top spring, an upper AF carriage, a flexible sensor circuit, and a yaw tilt subassembly. 15. The flex module of claim 14, wherein the yaw tilt subassembly includes a tilt subassembly flex frame, a stainless steel (SSTl) flex frame, two or more slide bearings, at least one SMA wire, and an SST slide base. Tilt OIS assembly. The warp module tilt OIS assembly of claim 1, wherein the bottom warp assembly includes a housing with a bottom spring, a bottom AF carriage, and a pitch tilt subassembly. 17. The strain module of claim 16, wherein the pitch tilt subassembly includes a tilt subassembly strain frame, a stainless steel (SST) strain frame, two or more slide bearings, at least one SMA wire, and an SST slide base. Tilt OIS assembly. 2. The skew module tilt OIS assembly of claim 1, comprising a single housing and base cap, said base cap configured to mate with said single housing. 19. The skew module tilt OIS assembly of claim 18, comprising a flexible printed circuit configured to be disposed on an outer surface of said single housing. 20. The skew module tilt OIS assembly of Claim 19, wherein the flexible printed circuit is configured to include one or more position sensors. 20. The skewed module tilt OIS assembly of claim 19, comprising a module and a flexible sensor circuit electrically connected to said module. 22. The flexible sensor circuit of claim 21, wherein the flexible sensor circuit includes a first set of traces configured to extend from a first pad and a second set of traces configured to extend from a second pad. distortion module tilt OIS assembly. 22. The distortion module tilt OIS assembly of claim 21, wherein the flexible sensor circuit includes a first set of traces configured to be positioned outside the first pad and the second pad, respectively. 22. The distortion module tilt OIS assembly of claim 21, wherein the flexible sensor circuit includes a first set of traces configured to be positioned inside the first pad and the second pad, respectively. 20. The flexure module tilt OIS assembly of claim 19, wherein the flexible sensor circuit electrically includes one or more flexures. A method of manufacturing a skewed module tilt OIS assembly, comprising:
providing an upper skew assembly configured to provide yaw axis movement to enable dynamic tilt adjustment;
mounting an autofocus assembly to the upper distortion assembly;
Mounting the sensor circuit PCB to the autofocus assembly on the opposite side of the upper flexure assembly facilitates sensor circuit connection between the sensor circuit PCB and the autofocus assembly comprising a sensor bracket. and
connecting a bottom distortion assembly to the module circuit PCB opposite the autofocus assembly;
attaching the bottom flexure assembly to the top flexure assembly along a fixed perimeter. 27. The method of claim 26, wherein the upper strain assembly includes a 4-wire strain actuator. 27. The method of claim 26, wherein the bottom strain assembly includes a 4-wire strain actuator. A skew module tilt OIS assembly, comprising:
an upper deflection assembly configured to provide pitch axis movement to enable dynamic tilt adjustment;
a bottom distortion assembly configured to provide yaw axis movement to enable dynamic tilt adjustment. A skew module tilt OIS assembly, comprising:
configured to provide yaw axis movement to enable dynamic tilt adjustment and configured to provide pitch axis movement to enable dynamic tilt adjustment a 4-wire flexure;
A distortion module tilt OIS assembly comprising: a flexible sensor circuit;

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