TW202419807A - Repeated-bending vapor chamber structure - Google Patents
Repeated-bending vapor chamber structure Download PDFInfo
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- TW202419807A TW202419807A TW111141972A TW111141972A TW202419807A TW 202419807 A TW202419807 A TW 202419807A TW 111141972 A TW111141972 A TW 111141972A TW 111141972 A TW111141972 A TW 111141972A TW 202419807 A TW202419807 A TW 202419807A
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- 238000005452 bending Methods 0.000 title abstract description 8
- 238000012935 Averaging Methods 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 8
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- 238000010586 diagram Methods 0.000 description 4
- 230000007812 deficiency Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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- 230000016776 visual perception Effects 0.000 description 1
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Abstract
Description
本發明係與一種均溫板有關,尤指一種可彎曲均溫板結構。The present invention relates to a temperature balancing plate, and in particular to a bendable temperature balancing plate structure.
按,由於現今3C產品走向輕薄化等趨勢,通過如觸控螢幕不僅使產品更容易達到直覺性的操作,同時在攜帶上也更為便利。但在操作上,也往往需要賴仰螢幕的大小,可以提供更佳的視覺觀感及清晰度等需求。As 3C products are becoming thinner and lighter, touch screens not only make it easier to operate intuitively, but also more convenient to carry. However, in terms of operation, it often depends on the size of the screen to provide better visual perception and clarity.
而現有應用於上述3C產品的均溫板中,往往僅係貼附於上述電子產品的發熱源上;例如通過較大面積的均溫板貼附在螢幕背面各電子發熱元件上,以達到散熱的需求。但在上述3C產品不斷地演變中,如曲面螢幕或可捲曲螢幕等新產品的誕生,作為其散熱或冷卻所需的均溫板也需要做出相對應的設計。既有的均溫板在彎曲上往往只考慮內部的毛細結構,而在板體本身則僅採用撓性較佳的材質構成,因此未能針對板體本身提出較佳的結構設計,來滿足其結構上亦提供的可撓性能力。The existing heat spreaders used in the above-mentioned 3C products are often only attached to the heat source of the above-mentioned electronic products; for example, a larger heat spreader is attached to each electronic heating element on the back of the screen to meet the heat dissipation needs. However, with the continuous evolution of the above-mentioned 3C products, such as the birth of new products such as curved screens or rollable screens, the heat spreaders required for heat dissipation or cooling also need to be designed accordingly. Existing heat spreaders often only consider the internal capillary structure in bending, and the board itself is only made of materials with better flexibility. Therefore, a better structural design for the board itself is not proposed to meet the flexibility provided by its structure.
有鑑於此,本發明人係為改善並解決上述之缺失,乃特潛心研究並配合學理之運用,終於提出一種設計合理且有效改善上述缺失之本發明。In view of this, the inventors of the present invention have conducted intensive research and applied theories to improve and solve the above-mentioned deficiencies, and finally proposed the present invention which has a reasonable design and effectively improves the above-mentioned deficiencies.
本發明之主要目的,在於可提供一種可彎曲均溫板結構,其係通過結構上的設計,以複數細紋分佈於均溫板板體外表面上,使其可產生一定的撓性能力且不破壞板體結構,進而可使均溫板適用於可彎曲或可捲曲的電子發熱產品或其場合上。The main purpose of the present invention is to provide a bendable heat absorbing plate structure, which is designed in a structure with a plurality of fine lines distributed on the outer surface of the heat absorbing plate body, so that it can generate a certain flexibility without destroying the plate body structure, thereby making the heat absorbing plate suitable for bendable or rollable electronic heating products or their occasions.
為了達成上述之目的,本發明係提供一種可彎曲均溫板結構,包括一第一板體、以及相對第一板體而疊置於其上的第二板體,第一、二板體間形成封閉的中空狀;第一板體具有一圍繞其周緣的第一封邊,並於第一板體上形成有被第一封邊圍繞的第一內面,以披覆一第一毛細層;而第二板體亦具有一圍繞其周緣的第二封邊,並於第二板體上形成有被第二封邊圍繞的第二內面,第二內面上設有複數支撐柱、以及排列於支撐柱間的複數第二毛細層;其中,第一、二板體相對疊置而具有二熱交換區以及一可彎區,可彎區連接於二熱交換區之間,且可彎區的外表面上皆設有複數間距排列的細紋。In order to achieve the above-mentioned purpose, the present invention provides a bendable temperature-averaging plate structure, comprising a first plate body and a second plate body stacked on the first plate body, wherein a closed hollow is formed between the first plate body and the second plate body; the first plate body has a first sealing edge surrounding its periphery, and a first inner surface surrounded by the first sealing edge is formed on the first plate body to cover a first capillary layer; and the second plate body also has A second sealing edge surrounds the periphery thereof, and a second inner surface surrounded by the second sealing edge is formed on the second plate body, and a plurality of supporting columns and a plurality of second capillary layers arranged between the supporting columns are arranged on the second inner surface; wherein the first and second plate bodies are relatively stacked and have two heat exchange areas and a bendable area, the bendable area is connected between the two heat exchange areas, and the outer surface of the bendable area is provided with a plurality of fine lines arranged at intervals.
為了使 貴審查委員能更進一步瞭解本發明之特徵及技術內容,請參閱以下有關本發明之詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。In order to enable the Honorable Review Committee to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the attached drawings are only provided for reference and explanation and are not used to limit the present invention.
請參閱圖1及圖2,係分別為本發明之立體分解圖及立體組合圖。本發明係提供一種可彎曲均溫板結構,包括一第一板體1、以及一第二板體2;其中:Please refer to Figures 1 and 2, which are the three-dimensional exploded view and three-dimensional assembled view of the present invention respectively. The present invention provides a bendable temperature-averaging plate structure, including a
請一併參閱圖3所示,該第一板體1係具有一圍繞其周緣的第一封邊10,並於該第一板體1上形成有被所述第一封邊10圍繞的第一內面100,所述第一內面100可呈凹入狀,以於該第一板體1的內表面披覆一第一毛細層11,所述第一毛細層11可為金屬網或粉末燒結而成。Please refer to FIG. 3 , the
承上所述,該第二板體2係相對上述第一板體1而疊置於其上,並與該第一體1間形成封閉的中空狀。該第二板體2係具有一圍繞其周緣的第二封邊20,並於該第二板體2上形成有被所述第二封邊20圍繞的第二內面200,所述第二內面200亦可呈凹入狀,以與該第一板體1相對疊置而形成前述封閉的中空狀;更詳細地,該第一板體1的第一封邊10係與第二板體2的第二封邊20相對疊置,可通過如雷射焊接等方式使第一、二板體1、2之第一、二封邊10、20相互密合。此外,該第一、二板體1、2之第一內面100與第二內面200可由其中任一者呈凹入狀、另一者則呈平面狀,或是二者皆呈凹入狀者,如此皆可使第一、二板體1、2相對疊置後於彼此間形成封閉的中空狀者。As mentioned above, the
再請一併參閱圖1至圖4所示,上述第二板體2之第二內面200上係設有複數支撐柱21、以及排列於該等支撐柱21間的複數第二毛細層22。可先配合圖2所示,該第一、二板體1、2相對疊置後,係使本發明之均溫板可區分為二熱交換區C1、C2以及一可彎區F,所述可彎區F連接於二熱交換區C1、C2之間,而二熱交換區C1、C2可分別為均溫板內部作為之蒸發及冷凝之區域。再如圖1及圖4所示,各第二毛細層22係依循二熱交換區C1、C2間並通過可彎區F的直線方向而貼附於第二板體2的第二內面200上,且各第二毛細層22彼此間係呈間隔配置,以供該等支撐柱21沿著各第二毛細層22間的間隔作複數排的排列設置。具體而言,前述的各排支撐柱21彼此間係以寬度W作間隔,以供各第二毛細層22分別配置於任二排的支撐柱21間,同時,任一排的支撐柱21中,彼此再以大間距D與小間距d作間距排列。Please refer to FIGS. 1 to 4 together. The second
承上所述,如圖1及圖2所示,各支撐柱21於二熱交換區C1、C2內係以所述大間距D而作間距排列,而於可彎區F內則以所述小間距d作間距排列;換言之,各支撐柱21於二熱交換區C1、C2的排列間距係大於在可彎區F內的排列間距。至於二熱交換區C1、C2內的各支撐柱21間距是否需要一致則無需限制。As mentioned above, as shown in FIG. 1 and FIG. 2 , the
再者,如圖2至圖4所示,本發明係於上述第一、二板體1、2之可彎區F的外表面上,皆設有複數間距排列的細紋101、201,且所述細紋101、201的間距排列方向係介於二熱交換區C1、C2之間。如圖4所示,各細紋101、201的斷面可呈「V」字型者,其深度h約為第一、二板體1、2厚度T的1/10至1/2,較佳者為1/20至1/15,而所述第一、二板體1、2厚度T係以其第一、二內面100、200至外表面的距離;舉例而言,例如第一、二板體1、2的厚度T為0.6mm,則細紋101、201的深度h可為0.06mm至0.30mm,較佳者為0.03mm至0.04mm。如此,可以提供第一、二板體1、2於可彎區F產生一定的撓性能力且不破壞板體1、2結構。另外,上述第二板體2之第二毛細層22亦可為金屬網或纖維束而成。更進一步地,第二毛細層22的孔細係較上述第一板體1之第一毛細層11的孔細為粗;具體而言,在本發明所舉之實施例中,所述第一毛細層11可由顆粒較細的粉末燒結而成、或是透過線徑較細的編織網構成,而所述第二毛細層22則可由線徑較粗的編織網、或纖維束構成。Furthermore, as shown in FIG. 2 to FIG. 4 , the present invention provides a plurality of
是以,藉由上述之構造組成,即可得到本發明可彎曲均溫板結構。Therefore, by means of the above-mentioned structural composition, the bendable temperature-averaging plate structure of the present invention can be obtained.
據此,如圖3及圖4所示,當上述第一、二板體1、2相對疊置而封邊後,該第二板體2之各支撐柱21係可抵頂於第一板體1之第一毛細層11上。而如圖5所示,當本發明之均溫板進行彎曲時,係由第二板體2朝向第一板體1作彎曲,且由於位在可彎區F內的支撐柱21係採小間距d排列(如圖1所示),故可彎區F內的第一毛細層11可透過更密集的支撐柱21作抵頂,以維持其與第一板體1之第一內面100的貼附性,而各第二毛細層22本身即採間隔配置,所以彼此間存在一定的間隔空間可以承受彎曲。再加上該第一、二板體1、2於可彎區F的外表面上所設置的複數細紋101、201,使得第一、二板體1、2於可彎區F處可以提供一定的可撓性能力,同時也不致於使第一、二板體1、2因彎曲而產生裂痕等問題而造成均溫板無法使用。Accordingly, as shown in FIG3 and FIG4, when the first and
此外,如圖6及圖7所示,本發明亦可進一步於上述細紋101、201內披覆一膠質層3,所述膠質層3可為如環氧樹脂(Epoxy)等具有彈性之材質製成。該膠質層3可用於填補於細紋101、201內(即如圖6所示),或進一步以薄化厚度t(約0.01mm至0.20mm)的方式形成於第一、二板體1、2外表面上(即如圖7所示),以在可撓曲的情況下作為均溫板外部的保護作用。In addition, as shown in FIG6 and FIG7, the present invention can further coat a
綜上所述,本發明確可達到預期之使用目的,而解決習知之缺失,又因極具新穎性及進步性,完全符合發明專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障發明人之權利。In summary, this invention can achieve the intended purpose and solve the lack of knowledge. It is also extremely novel and progressive and fully meets the requirements for invention patent application. Therefore, we have filed an application in accordance with the Patent Law. We sincerely request that you carefully examine and grant the patent in this case to protect the rights of the inventor.
惟以上所述僅為本發明之較佳可行實施例,非因此即拘限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之等效技術、手段等變化,均同理皆包含於本發明之範圍內,合予陳明。However, the above is only the preferred feasible embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technologies, means and other changes made by using the contents of the description and drawings of the present invention are also included in the scope of the present invention and are appropriately stated.
<本發明> 1:第一板體 10:第一封邊 100:第一內面 101:細紋 11:第一毛細層 2:第二板體 20:第二封邊 200:第二內面 201:細紋 21:支撐柱 22:第二毛細層 3:膠質層 C1:熱交換區 C2:熱交換區 F:可彎區 D:大間距 D:小間距 h:深度 T:厚度 t:厚度 <The present invention> 1: First plate body 10: First edge seal 100: First inner surface 101: Fine lines 11: First capillary layer 2: Second plate body 20: Second edge seal 200: Second inner surface 201: Fine lines 21: Support column 22: Second capillary layer 3: Rubber layer C1: Heat exchange zone C2: Heat exchange zone F: Bendable zone D: Large spacing D: Small spacing h: Depth T: Thickness t: Thickness
圖1係本發明之立體分解圖。FIG. 1 is a three-dimensional exploded view of the present invention.
圖2係本發明之立體組合圖。FIG. 2 is a three-dimensional assembly diagram of the present invention.
圖3係圖2之3-3斷面剖視圖。FIG. 3 is a cross-sectional view taken along line 3-3 of FIG. 2 .
圖4係圖3之A部分放大詳圖。FIG. 4 is an enlarged detailed view of portion A of FIG. 3 .
圖5係本發明呈彎曲狀態之示意圖。FIG. 5 is a schematic diagram of the present invention in a bent state.
圖6係本發明第一、二板體之外表面放大示意圖。FIG. 6 is an enlarged schematic diagram of the outer surfaces of the first and second plates of the present invention.
圖7係本發明另一實施例第一、二板體之外表面放大示意圖。FIG. 7 is an enlarged schematic diagram of the outer surfaces of the first and second plates of another embodiment of the present invention.
1:第一板體 1: First plate
2:第二板體 2: Second plate
3:膠質層 3:Colloid layer
C1:熱交換區 C1: Heat exchange area
C2:熱交換區 C2: Heat exchange area
F:可彎區 F: bendable area
Claims (10)
Publications (1)
Publication Number | Publication Date |
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TW202419807A true TW202419807A (en) | 2024-05-16 |
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