TW202418820A - 骨傳導揚聲器單元 - Google Patents

骨傳導揚聲器單元 Download PDF

Info

Publication number
TW202418820A
TW202418820A TW112134596A TW112134596A TW202418820A TW 202418820 A TW202418820 A TW 202418820A TW 112134596 A TW112134596 A TW 112134596A TW 112134596 A TW112134596 A TW 112134596A TW 202418820 A TW202418820 A TW 202418820A
Authority
TW
Taiwan
Prior art keywords
bone conduction
conduction speaker
speaker unit
ring
elastic
Prior art date
Application number
TW112134596A
Other languages
English (en)
Chinese (zh)
Inventor
福田幹夫
渥美智也
Original Assignee
日商特摩柯日本股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商特摩柯日本股份有限公司 filed Critical 日商特摩柯日本股份有限公司
Publication of TW202418820A publication Critical patent/TW202418820A/zh

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00Electric hearing aids
    • H04R25/60Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/604Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers
    • H04R25/606Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers acting directly on the eardrum, the ossicles or the skull, e.g. mastoid, tooth, maxillary or mandibular bone, or mechanically stimulating the cochlea, e.g. at the oval window
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/105Earpiece supports, e.g. ear hooks
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058Manufacture or assembly
    • H04R1/1066Constructional aspects of the interconnection between earpiece and earpiece support
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058Manufacture or assembly
    • H04R1/1075Mountings of transducers in earphones or headphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00Electric hearing aids
    • H04R25/65Housing parts, e.g. shells, tips or moulds, or their manufacture
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2460/00Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
    • H04R2460/13Hearing devices using bone conduction transducers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • General Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Neurosurgery (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
TW112134596A 2022-10-27 2023-09-12 骨傳導揚聲器單元 TW202418820A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-172195 2022-10-27
JP2022172195 2022-10-27

Publications (1)

Publication Number Publication Date
TW202418820A true TW202418820A (zh) 2024-05-01

Family

ID=90830588

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112134596A TW202418820A (zh) 2022-10-27 2023-09-12 骨傳導揚聲器單元

Country Status (5)

Country Link
US (1) US20250254479A1 (https=)
EP (1) EP4429266A4 (https=)
JP (1) JP7604047B2 (https=)
TW (1) TW202418820A (https=)
WO (1) WO2024090030A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58104077U (ja) * 1981-12-30 1983-07-15 ソニー株式会社 電気音響変換装置
JP2005328125A (ja) 2004-05-12 2005-11-24 Nec Tokin Corp イヤフォン
JP4683635B2 (ja) 2005-09-30 2011-05-18 Necトーキン株式会社 受話装置
EP2061273A1 (en) * 2006-09-07 2009-05-20 Temco Japan Co., Ltd. Bone conduction speaker
JP2008270879A (ja) 2007-04-16 2008-11-06 Nec Tokin Corp 受話装置
WO2009116272A1 (ja) * 2008-03-17 2009-09-24 株式会社テムコジャパン 骨伝導スピーカ及びそれを用いた聴取装置
JP5662254B2 (ja) * 2011-06-08 2015-01-28 威雄 相野谷 音声出力装置
JP6237411B2 (ja) 2014-03-31 2017-11-29 株式会社Jvcケンウッド イヤホン
CN107920293B (zh) * 2017-11-29 2019-07-26 苏州佑克骨传导科技有限公司 一种具有心率测量与计步功能的后戴式骨传导耳机
JP6427701B1 (ja) 2018-04-20 2018-11-21 リオン株式会社 イヤモールド、イヤホン、及び軟骨伝導補聴器
JP7347943B2 (ja) 2019-03-18 2023-09-20 リオン株式会社 軟骨伝導補聴装置

Also Published As

Publication number Publication date
WO2024090030A1 (ja) 2024-05-02
US20250254479A1 (en) 2025-08-07
EP4429266A1 (en) 2024-09-11
JPWO2024090030A1 (https=) 2024-05-02
EP4429266A4 (en) 2025-04-30
JP7604047B2 (ja) 2024-12-23

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