JP7604047B2 - 骨伝導スピーカユニット - Google Patents
骨伝導スピーカユニット Download PDFInfo
- Publication number
- JP7604047B2 JP7604047B2 JP2023579272A JP2023579272A JP7604047B2 JP 7604047 B2 JP7604047 B2 JP 7604047B2 JP 2023579272 A JP2023579272 A JP 2023579272A JP 2023579272 A JP2023579272 A JP 2023579272A JP 7604047 B2 JP7604047 B2 JP 7604047B2
- Authority
- JP
- Japan
- Prior art keywords
- bone conduction
- conduction speaker
- speaker unit
- ring
- eyeglasses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Electric hearing aids
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
- H04R25/604—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers
- H04R25/606—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers acting directly on the eardrum, the ossicles or the skull, e.g. mastoid, tooth, maxillary or mandibular bone, or mechanically stimulating the cochlea, e.g. at the oval window
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/105—Earpiece supports, e.g. ear hooks
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
- H04R1/1066—Constructional aspects of the interconnection between earpiece and earpiece support
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
- H04R1/1075—Mountings of transducers in earphones or headphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Electric hearing aids
- H04R25/65—Housing parts, e.g. shells, tips or moulds, or their manufacture
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
- H04R2460/13—Hearing devices using bone conduction transducers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- General Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Neurosurgery (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022172195 | 2022-10-27 | ||
| JP2022172195 | 2022-10-27 | ||
| PCT/JP2023/031924 WO2024090030A1 (ja) | 2022-10-27 | 2023-08-31 | 骨伝導スピーカユニット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024090030A1 JPWO2024090030A1 (https=) | 2024-05-02 |
| JP7604047B2 true JP7604047B2 (ja) | 2024-12-23 |
Family
ID=90830588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023579272A Active JP7604047B2 (ja) | 2022-10-27 | 2023-08-31 | 骨伝導スピーカユニット |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250254479A1 (https=) |
| EP (1) | EP4429266A4 (https=) |
| JP (1) | JP7604047B2 (https=) |
| TW (1) | TW202418820A (https=) |
| WO (1) | WO2024090030A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005328125A (ja) | 2004-05-12 | 2005-11-24 | Nec Tokin Corp | イヤフォン |
| WO2008029515A1 (en) | 2006-09-07 | 2008-03-13 | Temco Japan Co., Ltd. | Bone conduction speaker |
| JP2008270879A (ja) | 2007-04-16 | 2008-11-06 | Nec Tokin Corp | 受話装置 |
| JP2015195444A (ja) | 2014-03-31 | 2015-11-05 | 株式会社Jvcケンウッド | 当接部材及びイヤホン |
| JP6427701B1 (ja) | 2018-04-20 | 2018-11-21 | リオン株式会社 | イヤモールド、イヤホン、及び軟骨伝導補聴器 |
| JP2020155802A (ja) | 2019-03-18 | 2020-09-24 | リオン株式会社 | 軟骨伝導補聴装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58104077U (ja) * | 1981-12-30 | 1983-07-15 | ソニー株式会社 | 電気音響変換装置 |
| JP4683635B2 (ja) | 2005-09-30 | 2011-05-18 | Necトーキン株式会社 | 受話装置 |
| WO2009116272A1 (ja) * | 2008-03-17 | 2009-09-24 | 株式会社テムコジャパン | 骨伝導スピーカ及びそれを用いた聴取装置 |
| JP5662254B2 (ja) * | 2011-06-08 | 2015-01-28 | 威雄 相野谷 | 音声出力装置 |
| CN107920293B (zh) * | 2017-11-29 | 2019-07-26 | 苏州佑克骨传导科技有限公司 | 一种具有心率测量与计步功能的后戴式骨传导耳机 |
-
2023
- 2023-08-31 US US18/723,534 patent/US20250254479A1/en active Pending
- 2023-08-31 JP JP2023579272A patent/JP7604047B2/ja active Active
- 2023-08-31 WO PCT/JP2023/031924 patent/WO2024090030A1/ja not_active Ceased
- 2023-08-31 EP EP23882244.9A patent/EP4429266A4/en not_active Withdrawn
- 2023-09-12 TW TW112134596A patent/TW202418820A/zh unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005328125A (ja) | 2004-05-12 | 2005-11-24 | Nec Tokin Corp | イヤフォン |
| WO2008029515A1 (en) | 2006-09-07 | 2008-03-13 | Temco Japan Co., Ltd. | Bone conduction speaker |
| JP2008270879A (ja) | 2007-04-16 | 2008-11-06 | Nec Tokin Corp | 受話装置 |
| JP2015195444A (ja) | 2014-03-31 | 2015-11-05 | 株式会社Jvcケンウッド | 当接部材及びイヤホン |
| JP6427701B1 (ja) | 2018-04-20 | 2018-11-21 | リオン株式会社 | イヤモールド、イヤホン、及び軟骨伝導補聴器 |
| JP2020155802A (ja) | 2019-03-18 | 2020-09-24 | リオン株式会社 | 軟骨伝導補聴装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024090030A1 (ja) | 2024-05-02 |
| TW202418820A (zh) | 2024-05-01 |
| US20250254479A1 (en) | 2025-08-07 |
| EP4429266A1 (en) | 2024-09-11 |
| JPWO2024090030A1 (https=) | 2024-05-02 |
| EP4429266A4 (en) | 2025-04-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231226 |
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| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
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| A61 | First payment of annual fees (during grant procedure) |
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