TW202418606A - Sensor package structure - Google Patents

Abstract

The present invention provides a sensor package structure, which includes a substrate, a sensor chip disposed on the substrate along a predetermined direction for being electrically coupled to each other, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulation that is formed on the substrate. The adhesive layer is formed with at least one kind of a buffering cavity, wave-shaped slots, and rectangular slots, which penetrate through the adhesive layer along the predetermined direction. Specifically, the buffering cavity can be provided by being located in the adhesive layer, the wave-shaped slots can be provided by being respectively recessed in an inner side and an outer side of the adhesive layer, and the rectangular slots can be provided by being respectively recessed in the inner side and the outer side. A minimum width of the adhesive layer is greater than or equal to 50% of a predetermined width between the inner side and the outer side.

Description

Sensor package structure

The present invention relates to a packaging structure, and in particular to a sensor packaging structure.

The existing sensor package structure includes a transparent sheet, a sensor chip, and an adhesive layer adhered between the glass sheet and the sensor chip. However, since the adhesive layer usually has a relatively large coefficient of thermal expansion (CTE), when the existing sensor package structure is heated, stress will be generated between the adhesive layer and other components, thereby causing delamination problems or component damage.

Therefore, the inventors of the present invention believe that the above defects can be improved, and have conducted intensive research and applied scientific principles to finally propose the present invention which has a reasonable design and effectively improves the above defects.

The present invention provides a sensor packaging structure that can effectively improve the defects that may occur in the existing sensor packaging structure.

The present invention discloses a sensor package structure, which includes: a substrate; a sensing chip, which is arranged on the substrate along a preset direction and is electrically coupled to the substrate; wherein a top surface of the sensing chip contains a sensing area and a supporting area surrounding the sensing area; an adhesive layer, which is annular and arranged on the supporting area of the sensing chip, wherein the adhesive layer has an inner edge and an outer edge located on opposite sides, respectively, and the inner edge and the outer edge have a width perpendicular to the preset direction. The adhesive layer is provided with at least one of L buffer cavities, M wave grooves, and N rectangular grooves, and L is a positive integer, and M and N are positive integers greater than 1; wherein, on a cross-section of the adhesive layer perpendicular to the preset direction, the minimum width of the adhesive layer in the width direction is not less than 50% of the preset width; a light-transmitting layer having an outer surface and an inner surface located at opposite sides, and the light-transmitting layer is disposed on the adhesive layer so that the light-transmitting layer and the adhesive layer The inner edge of the substrate and the sensing chip together surround a closed space; and a package body is formed on the substrate, and the sensing chip, the adhesive layer, and the light-transmitting layer are buried in the package body, and at least a portion of the outer surface of the light-transmitting layer is exposed outside the package body; wherein, when the adhesive layer is formed with L buffer cavities, any one of the buffer cavities is located in the adhesive layer and penetrates the adhesive layer along the preset direction; wherein, when the adhesive layer is formed with M wave grooves, the M wave grooves are The wave grooves are respectively recessed at the inner edge and the outer edge and penetrate the adhesive layer along the preset direction, and any two of the wave grooves that are adjacent to each other but respectively located at the inner edge and the outer edge are only partially overlapped along the width direction; wherein, when the adhesive layer is formed with N rectangular grooves, the N rectangular grooves are respectively recessed at the inner edge and the outer edge and penetrate the adhesive layer along the preset direction, and any two of the rectangular grooves that are adjacent to each other but respectively located at the inner edge and the outer edge are not overlapped along the width direction.

The present invention also discloses a sensor package structure, which includes: a substrate; a sensing chip, which is arranged on the substrate along a preset direction and electrically coupled to the substrate; wherein a top surface of the sensing chip contains a sensing area and a carrier area surrounding the sensing area; an adhesive layer, which is annular and arranged on the carrier of the sensing chip; In the region, the adhesive layer has an inner edge and an outer edge located at opposite sides, and the inner edge and the outer edge are separated by a preset width in a width direction perpendicular to the preset direction; wherein the adhesive layer is formed with a plurality of wave grooves, the plurality of wave grooves are respectively recessed in the inner edge and the outer edge, and penetrate the adhesive layer along the preset direction, and are mutually Any two of the wave grooves adjacent to each other but located at the inner edge and the outer edge are only partially overlapped along the width direction; wherein, in a cross section of the adhesive layer perpendicular to the preset direction, the minimum width of the adhesive layer in the width direction is not less than 50% of the preset width; a light-transmitting layer having an outer surface and an inner surface located at opposite sides, and the The light-transmitting layer is arranged on the adhesive layer so that the light-transmitting layer, the inner edge of the adhesive layer, and the sensing chip together surround a closed space; and a packaging body is formed on the substrate, and the sensing chip, the adhesive layer, and the light-transmitting layer are buried in the packaging body, and at least a portion of the outer surface of the light-transmitting layer is exposed outside the packaging body.

The present invention also discloses a sensor package structure, which includes: a substrate; a sensing chip disposed on the substrate along a preset direction and electrically coupled to the substrate; wherein a top surface of the sensing chip contains a sensing area and a supporting area surrounding the sensing area; an adhesive layer in a ring shape and disposed on the supporting area of the sensing chip; The adhesive layer has an inner edge and an outer edge located on opposite sides, and the inner edge and the outer edge are separated by a preset width in a width direction perpendicular to the preset direction; wherein the adhesive layer is formed with a plurality of rectangular grooves, the plurality of rectangular grooves are respectively recessed in the inner edge and the outer edge and penetrate the adhesive layer along the preset direction, and each Any two of the rectangular grooves that are adjacent but located at the inner edge and the outer edge are not overlapped along the width direction; wherein, on a cross-section of the adhesive layer perpendicular to the preset direction, the minimum width of the adhesive layer in the width direction is not less than 50% of the preset width; a light-transmitting layer having an outer surface and an inner surface located at opposite sides, and the light-transmitting layer is arranged on the adhesive layer so that the light-transmitting layer, the inner edge of the adhesive layer, and the sensing chip together surround a closed space; and a packaging body formed on the substrate, and the sensing chip, the adhesive layer, and the light-transmitting layer are buried in the packaging body, and at least part of the outer surface of the light-transmitting layer is exposed outside the packaging body.

In summary, the sensor packaging structure disclosed in the embodiment of the present invention can effectively reduce the intensity of stress by forming at least one of L buffer cavities, M wave grooves, and N rectangular grooves (such as the adhesive layer forms multiple wave grooves or multiple rectangular grooves) when heated, thereby improving the separation problem and avoiding damage to components (such as the sensor chip or the light-transmitting layer).

To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and do not limit the protection scope of the present invention.

The following is an explanation of the implementation of the "sensor packaging structure" disclosed in the present invention through specific concrete embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without deviating from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustrations and are not depicted according to actual sizes. Please note in advance. The following implementation will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

It should be understood that, although the terms "first", "second", "third", etc. may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used in this document may include any one or more combinations of the related listed items depending on the actual situation.

Please refer to Figures 1 to 11, which are an embodiment of the present invention. This embodiment discloses a sensor packaging structure 100; that is, any structure inside that is not a packaged sensor has a different structural design basis from the sensor packaging structure 100 referred to in this embodiment, so the two are not suitable for comparison.

As shown in Figures 1 to 4, the sensor packaging structure 100 includes a substrate 1, a sensing chip 2 disposed on the substrate 1, a plurality of metal wires 3 electrically coupling the sensing chip 2 and the substrate 1, an adhesive layer 4 in a ring shape and disposed on the sensing chip 2, a light-transmitting layer 5 disposed on the adhesive layer 4, and a packaging body 6 formed on the substrate 1.

Among them, although the sensor package structure 100 is described as including the above-mentioned components in this embodiment, the sensor package structure 100 can also be adjusted and changed according to design requirements. For example, in other embodiments not shown in the present invention, the sensor package structure 100 can omit a plurality of the metal wires 3, and the sensor chip 2 is fixed and electrically coupled to the substrate 1 by flip chip or die bonding. The following will respectively explain the structure and connection relationship of each component of the sensor package structure 100 in this embodiment.

The substrate 1 is square or rectangular in this embodiment, but the present invention is not limited thereto. The substrate 1 is provided with a chip fixing area 111 at approximately the center of its upper surface 11, and the substrate 1 is formed with a plurality of bonding pads 112 on the outer side of the chip fixing area 111 on the upper surface 11. The plurality of bonding pads 112 are arranged roughly in a ring shape in this embodiment, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the plurality of bonding pads 112 may also be arranged in two rows on opposite sides of the chip fixing area 111.

In addition, the substrate 1 may also be provided with a plurality of solder balls 7 on its lower surface 12, and the sensor package structure 100 may be soldered and fixed on an electronic component (not shown in the figure) through the plurality of solder balls 7, so that the sensor package structure 100 can be electrically connected to the electronic component through the plurality of solder balls 7.

The sensing chip 2 in this embodiment is square (e.g., rectangular or square) and is described as an image sensing chip, but is not limited thereto. The sensing chip 2 (the bottom surface 22) is fixed to the chip fixing area 111 of the substrate 1 along a preset direction D (and through a die-bonding adhesive); that is, the sensing chip 2 is located on the inner side of the plurality of bonding pads 112. Furthermore, a top surface 21 of the sensing chip 2 includes a sensing area 211 and a supporting area 212 surrounding the sensing area 211 (and in a ring shape), and the two ends of each of the metal wires 3 are respectively connected to the substrate 1 and the supporting area 212 of the sensing chip 2, so that the substrate 1 and the sensing chip 2 are electrically coupled to each other.

In more detail, the sensing chip 2 includes a plurality of connection pads 213 located in the carrying area 212 (that is, the plurality of connection pads 213 are located outside the sensing area 211). In this embodiment, the number and position of the plurality of connection pads 213 of the sensing chip 2 respectively correspond to the number and position of the plurality of bonding pads 112 of the substrate 1; that is, the plurality of connection pads 213 are also roughly arranged in a ring shape in this embodiment. Furthermore, the two ends of each of the metal wires 3 are respectively connected to one of the bonding pads 112 and the corresponding connection pad 213.

In this embodiment, the adhesive layer 4 includes a plurality of segments 4a that are sequentially connected and in a ring shape (e.g., a rectangular ring), and the adhesive layer 4 is disposed on the supporting area 212 of the sensing chip 2 and surrounds the outer side of the sensing area 211, and each of the metal wires 3 is located on the outer side of the adhesive layer 4. Furthermore, the adhesive layer 4 has an inner edge 41 and an outer edge 42 located on opposite sides, respectively, and the inner edge 41 and the outer edge 42 are separated by a preset width W4 in a width direction W1, W2 perpendicular to the preset direction D. In this embodiment, the width directions W1, W2 include directions perpendicular to any of the segments 4a.

Furthermore, since the adhesive layer 4 has a relatively large thermal expansion coefficient (e.g., the thermal expansion coefficient of the adhesive layer 4 is approximately at least three times the thermal expansion coefficient of the light-transmitting layer 5 or the sensing chip 2), the sensor packaging structure 100 is (selectively) formed with at least one of L buffer cavities 43, M wave grooves 44, and N rectangular grooves 45 in the adhesive layer 4 according to different design requirements (L is a positive integer, and M and N are each positive integers greater than 1), thereby effectively reducing the intensity of stress.

Specifically, when the adhesive layer 4 is formed with L buffer cavities 43 (e.g., FIGS. 1 to 7 , 9 , and 11 ), any of the buffer cavities 43 is located within the adhesive layer 4 and penetrates the adhesive layer 4 along the preset direction D. In other words, L buffer cavities 43 can be provided by being formed in the adhesive layer 4 in the above manner.

Furthermore, when the adhesive layer 4 is formed with M wave grooves 44 (such as FIGS. 1 to 4, 8, and 9), the M wave grooves 44 are respectively recessed in the inner edge 41 and the outer edge 42 and penetrate the adhesive layer 4 along the preset direction D, and any two wave grooves 44 adjacent to each other but respectively located at the inner edge 41 and the outer edge 42 are only partially overlapped along the width directions W1 and W2. That is, the M wave grooves 44 can be provided by being formed in the inner edge 41 and the outer edge 42 in the above manner.

In addition, when the adhesive layer 4 is formed with N rectangular grooves 45 (such as FIGS. 1 to 4, 10, and 11), the N rectangular grooves 45 are respectively recessed in the inner edge 41 and the outer edge 42 and penetrate the adhesive layer 4 along the preset direction D, and any two rectangular grooves 45 adjacent to each other but respectively located at the inner edge 41 and the outer edge 42 are not overlapped along the width directions W1 and W2. The N rectangular grooves 45 can be provided by being formed in the inner edge 41 and the outer edge 42 in the above manner.

It should be noted that, in order to avoid insufficient structural strength of the adhesive layer 4, the configuration of the buffer cavity 43, the wave groove 44, and/or the rectangular groove 45 on the adhesive layer 4 in this embodiment needs to meet the following conditions: the minimum width Wmin of the adhesive layer 4 in the width directions W1 and W2 on a cross section of the adhesive layer 4 perpendicular to the preset direction D is not less than 50% of the preset width W4. In other words, the position of the minimum width Wmin corresponds to (or is marked on) the portion of the adhesive layer 4 where the buffer cavity 43, the wave groove 44, and/or the rectangular groove 45 occupy the highest proportion in the width directions W1 and W2.

The light-transmitting layer 5 is illustrated as a flat glass in this embodiment, but the present invention is not limited thereto. The light-transmitting layer 5 has an outer surface 51 and an inner surface 52 located at opposite sides, and the light-transmitting layer 5 (with the inner surface 52) is disposed on the adhesive layer 4, so that the light-transmitting layer 5, the inner edge 41 of the adhesive layer 4, and the sensing chip 2 together surround a closed space E, and the inner edge 41 of the adhesive layer 4 and the sensing area 211 of the sensing chip 2 are both located within the closed space E.

The package body 6 is opaque in this embodiment to prevent visible light from passing through. The package body 6 is illustrated as a liquid encapsulation, and the package body 6 is formed on the upper surface 11 of the substrate 1 and its edge is aligned with the edge of the substrate 1. Each of the metal wires 3, the sensor chip 2, the adhesive layer 4, and the light-transmitting layer 5 are embedded in the package body 6 (e.g., the outer edge 42 of the adhesive layer 4 is connected to the package body 6), and at least part of the outer surface 51 of the light-transmitting layer 5 is exposed outside the package body 6, but the present invention is not limited thereto.

As described above, when the sensor package structure 100 disclosed in this embodiment is heated, the adhesive layer 4 can effectively reduce the intensity of stress by forming at least one of the L buffer cavities 43, M wave grooves 44, and N rectangular grooves 45, thereby improving the separation problem and avoiding damage to components (such as the sensor chip 2 or the light-transmitting layer 5).

It should be noted that the above content is explained based on the common features of various possible configurations of the adhesive layer 4. For example, as shown in the first configuration of the adhesive layer 4 shown in FIGS. 1 to 4 of this embodiment, when the adhesive layer 4 is formed with M wave grooves 44 and N rectangular grooves 45, the M wave grooves 44 are formed in one of the sections 4a, and the N rectangular grooves 45 are formed in another of the sections 4a. Furthermore, when the adhesive layer 4 is further formed with L buffer cavities 43, the L buffer cavities 43 are not aligned with any of the wave grooves 44 and any of the rectangular grooves 45 along the width direction.

Furthermore, the number and arrangement of the buffer cavity 43, the wave groove 44, and the rectangular groove 45 formed by the adhesive layer 4 can be adjusted and varied according to design requirements. Therefore, it is difficult to present all configurations of the adhesive layer 4 in the drawings of this embodiment, so only some preferred configurations are listed below for illustration, but the present invention is not limited thereto. In addition, the adhesive layer 4 is described in the following multiple configurations with L greater than 1, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, L can be equal to 1.

[Second Configuration]

As shown in FIG5 , the adhesive layer 4 (only) forms a plurality of the buffer cavities 43, and the plurality of the buffer cavities 43 may be formed in a plurality of the sections 4a, respectively, and any two adjacent buffer cavities 43 (located in the same section 4a) are not overlapped along the width directions W1 and W2, and any buffer cavity 43 is preferably symmetrically arranged with respect to the center of the sensing area 211 with respect to another buffer cavity 43, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the adhesive layer 4 may form a plurality of the buffer cavities 43 in only one of the sections 4a.

In addition, in the cross section, each of the buffer cavities 43 is elongated (e.g., elliptical), and the total area of the plurality of buffer cavities 43 is no more than 50% of the area jointly enclosed by the inner edge 41 and the outer edge 42, thereby effectively avoiding the plurality of buffer cavities 43 from causing insufficient structural strength of the adhesive layer 4.

[Third Configuration]

As shown in FIG6 , the adhesive layer 4 (only) forms a plurality of the buffer cavities 43, and the plurality of the buffer cavities 43 may be formed in a plurality of the sections 4a, respectively, and any of the buffer cavities 43 (located in the same section 4a) is overlapped with another buffer cavity 43 along the width directions W1 and W2, and any of the buffer cavities 43 is preferably symmetrically arranged with respect to the center of the sensing area 211 with respect to another buffer cavity 43, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the adhesive layer 4 may form a plurality of the buffer cavities 43 in only one of the sections 4a.

In addition, in the cross section, each of the buffer cavities 43 is circular, and the total area of the plurality of buffer cavities 43 is no more than 50% of the area enclosed by the inner edge 41 and the outer edge 42, thereby effectively avoiding the plurality of buffer cavities 43 from causing insufficient structural strength of the adhesive layer 4. Furthermore, as shown in FIG. 7 , the plurality of buffer cavities 43 may also be both elongated and circular.

[Fourth Configuration]

As shown in FIG8 , the adhesive layer 4 (only) forms a plurality of the wave grooves 44, and the plurality of the wave grooves 44 may be formed in a plurality of the sections 4a, respectively, and any two of the wave grooves 44 adjacent to each other (in the same section 4a) but located at the inner edge 41 and the outer edge 42 are only partially overlapped along the width directions W1 and W2, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the adhesive layer 4 may only form a plurality of the wave grooves 44 in one of the sections 4a.

To be more specific, in any two of the wave grooves 44 that are adjacent to each other (in the same section 4a) but are respectively located at the inner edge 41 and the outer edge 42, the wave crest 441 of one of the wave grooves 44 preferably corresponds to the wave trough 442 of another of the wave grooves 44 along the width directions W1, W2, so that the minimum width Wmin can be formed between the corresponding wave crest 441 and the wave trough 442, thereby effectively avoiding the insufficient structural strength of the adhesive layer 4 caused by multiple wave grooves 44.

[Fifth Configuration]

As shown in FIG9 , the adhesive layer 4 is formed with a plurality of the wave grooves 44 and a plurality of the buffer cavities 43, and the structures of the plurality of the wave grooves 44 and the plurality of the buffer cavities 43 have been described above and will not be repeated here. The following only introduces the configuration relationship between the plurality of the wave grooves 44 and the plurality of the buffer cavities 43. The plurality of the wave grooves 44 are formed in two of the sections 4a, respectively, and a portion of the plurality of the buffer cavities 43 (e.g., at least one of the buffer cavities 43) is located between the plurality of the wave grooves 44, and the other portions of the plurality of the buffer cavities 43 are located in the other two sections 4a where the plurality of the wave grooves 44 are not formed.

[Sixth Configuration]

As shown in FIG. 10 , the adhesive layer 4 (only) forms a plurality of rectangular grooves 45, and the plurality of rectangular grooves 45 may be formed in a plurality of the sections 4a, respectively, and any two of the rectangular grooves 45 adjacent to each other (in the same section 4a) but located at the inner edge 41 and the outer edge 42 are not overlapped along the width directions W1 and W2, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the adhesive layer 4 may only form a plurality of rectangular grooves 45 in one of the sections 4a.

In more detail, any of the rectangular grooves 45 has a notch 451 located at the inner edge 41 or the outer edge 42, and any of the rectangular grooves 45 also has a groove bottom 452 away from the notch 451. Among them, any two of the rectangular grooves 45 located in the same section 4a but located at the inner edge 41 and the outer edge 42, respectively, preferably have their groove bottoms 452 arranged in a coplanar configuration, but the present invention is not limited thereto.

From another perspective, the slot 451 has a slot width W451, and any two of the rectangular slots 45 that are adjacent to each other (in the same section 4a) but located at the inner edge 41 and the outer edge 42 are separated by a distance D1 that is not less than the slot width W451. Furthermore, any two of the rectangular slots 45 that are adjacent to each other (in the same section 4a) and located at the inner edge 41 or the outer edge 42 are separated by a distance D2 that is at least three times the slot width W451, but the present invention is not limited thereto.

[Seventh Configuration]

As shown in FIG. 11 , the adhesive layer 4 is formed with a plurality of rectangular grooves 45 and a plurality of buffer cavities 43. The structures of the plurality of rectangular grooves 45 and the plurality of buffer cavities 43 have been described above and will not be described here in detail. The following only introduces the configuration relationship between the plurality of rectangular grooves 45 and the plurality of buffer cavities 43. The plurality of rectangular grooves 45 are formed in two of the sections 4a, respectively, and the plurality of buffer cavities 43 are located in the other two sections 4a where the plurality of wave grooves 44 are not formed.

[Technical Effects of the Embodiments of the Invention]

In summary, the sensor packaging structure disclosed in the embodiment of the present invention can effectively reduce the intensity of stress by forming at least one of L buffer cavities, M wave grooves, and N rectangular grooves (such as the adhesive layer forms multiple wave grooves or multiple rectangular grooves) when heated, thereby improving the separation problem and avoiding damage to components (such as the sensor chip or the light-transmitting layer).

Furthermore, in the sensor packaging structure disclosed in the embodiment of the present invention, the adhesive layer can be adjusted and varied in quantity and configuration of the buffer cavity, the wavy groove, and the rectangular groove formed by the adhesive layer under certain structural conditions (such as the minimum width is not less than 50% of the preset width) to meet different design requirements.

The above disclosed contents are only preferred feasible embodiments of the present invention and are not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the contents of the specification and drawings of the present invention are included in the patent scope of the present invention.

100: Sensor package structure 1: Substrate 11: Upper surface 111: Chip fixing area 112: Bonding pad 12: Lower surface 2: Sensing chip 21: Top surface 211: Sensing area 212: Carrying area 213: Connecting pad 22: Bottom surface 3: Metal wire 4: Adhesive layer 4a: Segment 41: Inner edge 42: Outer edge 43: Buffer cavity 44: Wave groove 441: Wave crest 442: Wave trough 45: Rectangular groove 451: Notch 452: Groove bottom 5: Transparent layer 51: Outer surface 52: Inner surface 6: Package body 7: Solder ball D: Default direction W1: Width direction W2: Width direction E: Enclosed space Wmin: Minimum width W4: Default width W451: Slot width D1: Distance D2: Distance

FIG1 is a three-dimensional schematic diagram of a first configuration of a sensor package structure according to an embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view along section line II-II of FIG. 1 .

FIG. 3 is a top view of FIG. 1 with the light-transmitting layer and the packaging body omitted.

FIG. 4 is an enlarged schematic diagram of region IV of FIG. 3 .

FIG. 5 is a partial top view of the second configuration of the sensor package structure according to the embodiment of the present invention after omitting the light-transmitting layer and the package body.

FIG. 6 is a partial top view of the third configuration of the sensor package structure according to the embodiment of the present invention after omitting the light-transmitting layer and the package body.

FIG. 7 is a partial top view of another third configuration of the sensor package structure according to the embodiment of the present invention after omitting the light-transmitting layer and the package body.

FIG8 is a partial top view of the fourth configuration of the sensor package structure according to the embodiment of the present invention after omitting the light-transmitting layer and the package body.

FIG. 9 is a partial top view of the fifth configuration of the sensor package structure according to the embodiment of the present invention after omitting the light-transmitting layer and the package body.

FIG. 10 is a partial top view of the sixth configuration of the sensor package structure according to the embodiment of the present invention after omitting the light-transmitting layer and the package body.

FIG. 11 is a partial top view of the seventh configuration of the sensor package structure according to the embodiment of the present invention after omitting the light-transmitting layer and the package body.

100:Sensor packaging structure

1: Substrate

11: Upper surface

112:Joint pad

12: Lower surface

2:Sensor chip

213:Connection pad

3:Metal wire

4: Adhesive layer

4a: Section

43: Buffer chamber

44: Wave trough

45: Rectangular slot

5: Translucent layer

6: Package body

D: Default direction

W1: Width direction

W2: Width direction

Claims (19)

A sensor packaging structure, comprising: a substrate; a sensing chip, arranged on the substrate along a preset direction, and the sensing chip is electrically coupled to the substrate; wherein a top surface of the sensing chip contains a sensing area and a carrying area surrounding the sensing area; An adhesive layer, in a ring shape and disposed on the supporting area of the sensing chip, the adhesive layer having an inner edge and an outer edge located on opposite sides, respectively, and the inner edge and the outer edge are separated by a preset width in a width direction perpendicular to the preset direction; wherein the adhesive layer is formed with at least one of L buffer cavities, M wave grooves, and N rectangular grooves, and L is a positive integer, and M and N are positive integers greater than 1; wherein, in a cross-section of the adhesive layer perpendicular to the preset direction, the minimum width of the adhesive layer in the width direction is not less than 50% of the preset width; A light-transmitting layer having an outer surface and an inner surface located at opposite sides, and the light-transmitting layer is disposed on the adhesive layer so that the light-transmitting layer, the inner edge of the adhesive layer, and the sensing chip together surround a closed space; and A package body is formed on the substrate, and the sensing chip, the adhesive layer, and the light-transmitting layer are buried in the package body, and at least part of the outer surface of the light-transmitting layer is exposed outside the package body; Wherein, when the adhesive layer forms L buffer cavities, any one of the buffer cavities is located in the adhesive layer and penetrates the adhesive layer along the preset direction; Wherein, when the adhesive layer is formed with M wave grooves, the M wave grooves are respectively recessed at the inner edge and the outer edge and penetrate the adhesive layer along the preset direction, and any two wave grooves adjacent to each other but respectively located at the inner edge and the outer edge are only partially overlapped along the width direction; Wherein, when the adhesive layer is formed with N rectangular grooves, the N rectangular grooves are respectively recessed at the inner edge and the outer edge and penetrate the adhesive layer along the preset direction, and any two rectangular grooves adjacent to each other but respectively located at the inner edge and the outer edge are not overlapped along the width direction. The sensor package structure as described in claim 1, wherein when the adhesive layer is formed with L buffer cavities and L is greater than 1, any two adjacent buffer cavities are not overlapped along the width direction. The sensor package structure as described in claim 1, wherein when the adhesive layer is formed with L buffer cavities and L is greater than 1, any buffer cavity is overlapped with another buffer cavity along the width direction. The sensor package structure as described in claim 1, wherein when the adhesive layer forms L buffer cavities, in the cross-section, the total area of the L buffer cavities is not greater than 50% of the area jointly enclosed by the inner edge and the outer edge. The sensor packaging structure as described in claim 1, wherein the adhesive layer includes a plurality of segments connected in sequence and in a ring shape; when the adhesive layer forms L buffer cavities, the L buffer cavities are located in at least one of the segments. The sensor package structure as described in claim 1, wherein, when the adhesive layer is formed with L buffer cavities and L is greater than 1, any buffer cavity is symmetrically arranged with respect to the center of the sensing area with respect to another buffer cavity. A sensor packaging structure as described in claim 1, wherein the adhesive layer includes a plurality of sections connected in sequence and in a ring shape; when the adhesive layer is formed with M wavy grooves and N rectangular grooves, the M wavy grooves are formed in one of the sections, and the N rectangular grooves are formed in another of the sections. A sensor packaging structure as described in claim 1, wherein when the adhesive layer is formed with L buffer cavities, M wavy grooves, and N rectangular grooves, the L buffer cavities are not aligned with any of the wavy grooves and any of the rectangular grooves along the width direction. A sensor packaging structure, comprising: a substrate; a sensing chip, arranged on the substrate along a preset direction, and the sensing chip is electrically coupled to the substrate; wherein a top surface of the sensing chip contains a sensing area and a supporting area surrounding the sensing area; an adhesive layer, which is annular and arranged on the supporting area of the sensing chip, the adhesive layer having an inner edge and an outer edge located on opposite sides, respectively, and the inner edge and the outer edge are separated by a preset width in a width direction perpendicular to the preset direction; wherein the adhesive layer is formed with a plurality of wave grooves, and the plurality of wave grooves are respectively recessed in the inner side. The inner edge and the outer edge and penetrate the adhesive layer along the preset direction, and any two of the wave grooves adjacent to each other but respectively located at the inner edge and the outer edge are only partially overlapped along the width direction; wherein, on a cross section of the adhesive layer perpendicular to the preset direction, the minimum width of the adhesive layer in the width direction is not less than 50% of the preset width; A light-transmitting layer having an outer surface and an inner surface located at opposite sides, and the light-transmitting layer is disposed on the adhesive layer so that the light-transmitting layer, the inner edge of the adhesive layer, and the sensing chip together surround a closed space; and a package body formed on the substrate, and the sensing chip, the adhesive layer, and the light-transmitting layer are buried in the package body, and at least part of the outer surface of the light-transmitting layer is exposed outside the package body. A sensor packaging structure as described in claim 9, wherein, in any two of the wave grooves that are adjacent to each other but located at the inner edge and the outer edge respectively, the crest of one of the wave grooves corresponds to the trough of another of the wave grooves along the width direction. A sensor packaging structure as described in claim 9, wherein the adhesive layer includes a plurality of segments connected in sequence and in a ring shape, and a plurality of the wave grooves are formed in at least one of the segments. The sensor packaging structure as described in claim 9, wherein the adhesive layer is formed with at least one buffer cavity, and at least one of the buffer cavities is located within the adhesive layer and penetrates the adhesive layer along the preset direction. A sensor packaging structure as described in claim 12, wherein at least one of the buffer cavities is located between a plurality of the wave grooves. A sensor packaging structure, comprising: a substrate; a sensing chip, arranged on the substrate along a preset direction, and the sensing chip is electrically coupled to the substrate; wherein a top surface of the sensing chip contains a sensing area and a carrying area surrounding the sensing area; an adhesive layer, which is annular and arranged on the carrying area of the sensing chip, the adhesive layer having an inner edge and an outer edge located on opposite sides, respectively, and the inner edge and the outer edge are separated by a preset width in a width direction perpendicular to the preset direction; wherein the adhesive layer is formed with a plurality of rectangular grooves, and the plurality of rectangular grooves are respectively recessed in the inner edge and the outer edge. The side edge and the outer edge, and penetrate the adhesive layer along the preset direction, any two of the rectangular grooves adjacent to each other but located at the inner edge and the outer edge respectively are not overlapped along the width direction; wherein, on a cross section of the adhesive layer perpendicular to the preset direction, the minimum width of the adhesive layer in the width direction is not less than 50% of the preset width; A light-transmitting layer having an outer surface and an inner surface located at opposite sides, and the light-transmitting layer is disposed on the adhesive layer so that the light-transmitting layer, the inner edge of the adhesive layer, and the sensing chip together surround a closed space; and a package body formed on the substrate, and the sensing chip, the adhesive layer, and the light-transmitting layer are buried in the package body, and at least part of the outer surface of the light-transmitting layer is exposed outside the package body. A sensor packaging structure as described in claim 14, wherein any one of the rectangular grooves has a notch located at the inner edge or the outer edge, and the notch has a groove width; wherein any two of the rectangular grooves that are adjacent to each other but located at the inner edge and the outer edge respectively are separated by a distance not less than the groove width. A sensor packaging structure as described in claim 14, wherein any one of the rectangular grooves has a notch located at the inner edge or the outer edge, and the notch has a groove width; wherein any two of the rectangular grooves that are adjacent to each other and both located at the inner edge or the outer edge are separated by a distance of at least three times the groove width. A sensor packaging structure as described in claim 14, wherein the adhesive layer includes a plurality of segments connected in sequence and in a ring shape, and a plurality of the rectangular grooves are formed in at least one of the segments. A sensor packaging structure as described in claim 17, wherein any one of the rectangular grooves has a notch located at the inner edge or the outer edge, and any one of the rectangular grooves also has a groove bottom away from the notch; any two of the rectangular grooves located in the same section but respectively located at the inner edge and the outer edge, have their groove bottoms arranged in a coplanar manner. The sensor packaging structure as described in claim 14, wherein the adhesive layer forms at least one buffer cavity, and at least one of the buffer cavities is located within the adhesive layer and penetrates the adhesive layer along the preset direction.

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