TWI840150B - Sensor package structure and manufacturing method threrof - Google Patents

Abstract

The present invention provides a sensor package structure and a manufacturing method thereof. The sensor package structure includes a substrate, a fixing glue layer disposed on the substrate, a sensor chip adhered to the fixing glue layer, an annular bonding layer disposed on the sensor chip, a light permeable sheet adhered to the annular bonding layer, and a plurality of metal wires electrically coupled to the substrate and the sensor chip. The size of the light permeable sheet is smaller than that of the sensor chip.

Description

Sensor packaging structure and manufacturing method thereof

The present invention relates to a packaging structure, and more particularly to a sensor packaging structure and a manufacturing method thereof.

Based on the overall structure of the existing sensor package structure, during the manufacturing of the existing sensor package structure, a sensing chip is first fixed to a substrate, and then a light-transmitting sheet is installed on the sensing chip. However, before the light-transmitting sheet is installed on the sensing chip, the sensing area of the sensing chip is easily contaminated and damaged during the production process or before packaging, thereby reducing its sensing accuracy and yield.

The present invention provides a sensor package structure and a manufacturing method thereof, which can effectively improve the defects of the existing sensor package structure and the manufacturing method thereof.

The present invention discloses a manufacturing method of a sensor package structure, which includes: a pre-step: providing a wafer and a plurality of light-transmitting sheets separated from each other, wherein the wafer defines a plurality of sensing chips connected to each other, and the size of each sensing chip is larger than the size of any light-transmitting sheet; a first bonding step: attaching a light-transmitting sheet to the top surface of each sensing chip with an annular bonding layer; wherein each sensing chip, the annular bonding layer disposed thereon, and the light-transmitting sheet together define a sensing module and are jointly connected to each other; A closed space is formed by enclosing the wafers, wherein a sensing area of each sensing chip is located within the closed space, and a plurality of connection pads of each sensing chip are located on the outer side of the annular bonding layer; a cutting step: holding the wafer and cutting it to form a plurality of sensing modules separated from each other; and a second bonding step: fixing one of the sensing modules on an upper surface of a substrate, and connecting the plurality of bonding pads of the substrate and the plurality of connection pads of one of the sensing modules by bonding with a plurality of metal wires.

The present invention also discloses a sensor packaging structure, which includes: a substrate, whose upper surface has a module fixing area and a plurality of bonding pads located outside the module fixing area; a fixing adhesive layer, which is arranged in the module fixing area of the substrate; a sensing module, which is fixed to the substrate through the fixing adhesive layer, and the sensing module includes: a sensing chip, whose bottom surface is adhered to the fixing adhesive layer, and the sensing chip has a plurality of columnar microstructures buried in the fixing adhesive layer formed on the bottom surface; wherein a top surface of the sensing chip contains a sensing area and a plurality of bonding pads located outside the sensing area; an annular bonding layer , arranged on the top surface of the sensing chip, and the annular bonding layer surrounds the sensing area, and a plurality of connection pads are located on the outer side of the annular bonding layer; and a light-transmitting sheet, arranged on the annular bonding layer, so that the light-transmitting sheet, the annular bonding layer, and the sensing chip together surround a closed space; wherein a projection area formed by the orthographic projection of the light-transmitting sheet toward the top surface is located on the inner side of the plurality of connection pads and separated by a distance; and a plurality of metal wires, respectively connecting the plurality of bonding pads of the substrate to the plurality of connection pads of the sensing chip, so that the substrate and the sensing chip are electrically coupled to each other.

The present invention also discloses a sensor packaging structure, which includes: a substrate, whose upper surface has a module fixing area and a plurality of bonding pads located outside the module fixing area; a fixing adhesive layer, which is arranged on the module fixing area of the substrate; a sensing module, which is fixed to the substrate through the fixing adhesive layer, and the sensing module includes: a sensing chip, whose bottom surface is adhered to the fixing adhesive layer; wherein a top surface of the sensing chip contains a sensing area and a plurality of bonding pads located outside the sensing area; an annular bonding layer, which is arranged on the top surface of the sensing chip, and The annular connecting layer surrounds the sensing area, and a plurality of connecting pads are located on the outer side of the annular connecting layer; and a light-transmitting sheet is disposed on the annular connecting layer so that the light-transmitting sheet, the annular connecting layer, and the sensing chip together surround a closed space; wherein a projection area formed by the orthographic projection of the light-transmitting sheet toward the top surface is located on the inner side of the plurality of connecting pads and separated by a distance; and a plurality of metal wires are respectively connected to the plurality of bonding pads of the substrate to the plurality of connecting pads of the sensing chip so that the substrate and the sensing chip are electrically coupled to each other.

In summary, the sensor package structure and the manufacturing method thereof disclosed in the embodiment of the present invention form the sensing module by bonding the smaller light-transmitting sheet to the sensing chip (e.g., using the light-transmitting sheet and the annular bonding layer to surround the chip sensing area), so that the sensing area of the sensing chip is located within the closed space of the sensing module, and then the sensing module is fixed to the substrate, thereby effectively preventing the sensing area of the sensing chip from being contaminated and damaged during the manufacturing process of the sensor package structure, thereby improving the yield.

Furthermore, the sensor packaging structure and the manufacturing method thereof disclosed in the embodiment of the present invention, in the sensing module, the expanded portion of the annular bonding layer having a larger coefficient of thermal expansion (CTE) is accommodated by the closed space, thereby reducing the risk of the light-transmitting sheet or the sensing area being squeezed and damaged due to the expansion of the annular bonding layer.

To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and do not limit the protection scope of the present invention.

The following is an explanation of the implementation of the "sensor packaging structure and its manufacturing method" disclosed in the present invention through specific concrete embodiments. Technical personnel in this field can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without deviating from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual sizes. Please note in advance. The following implementation will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

It should be understood that, although the terms "first", "second", "third", etc. may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used in this document may include any one or more combinations of the related listed items depending on the actual situation.

[Example 1]

Please refer to FIG. 1 to FIG. 7 , which are the first embodiment of the present invention. As shown in FIG. 1 , the present embodiment discloses a manufacturing method S100 of a sensor packaging structure, which sequentially includes (or implements) a pre-step S110, a first bonding step S120, a cutting step S130, a second bonding step S140, and a packaging step S150.

This embodiment introduces the steps S110 to S150 of the manufacturing method S100 of the sensor package structure in order below, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the steps of the manufacturing method S100 of the sensor package structure can be increased, decreased or adjusted according to design requirements (e.g., the packaging step S150 can be omitted according to design requirements).

The pre-step S110: As shown in FIG. 1 to FIG. 3, a wafer 31a and a plurality of light-transmitting sheets 33 separated from each other are provided. The wafer 31a is defined with a plurality of sensing chips 31 connected to each other, and the size of each sensing chip 31 is larger than the size of any light-transmitting sheet 33. The plurality of light-transmitting sheets 33 are defined to exist independently and not connected to each other, and each light-transmitting sheet 33 is illustrated as a flat glass in this embodiment, but the present invention is not limited thereto. In other words, any light-transmitting sheet with a size larger than or equal to that of the sensing chip 31 is different from the light-transmitting sheet 33 referred to in this embodiment.

The first bonding step S120: As shown in FIG. 1 and FIG. 3 , a transparent sheet 33 is attached to the top surface 311 of each sensing chip 31 by means of an annular bonding layer 32. Each sensing chip 31, the annular bonding layer 32 and the transparent sheet 33 disposed thereon are collectively defined as a sensing module 3 and collectively surround a closed space S. A sensing area 3111 of each sensing chip 31 is located within the closed space S, and a plurality of connection pads 3113 of each sensing chip 31 are located on the outer side of the annular bonding layer 32.

It should be noted that, in each of the sensing modules 3, the annular bonding layer 32 may be first attached to the top surface 311 of the sensing chip 31, and then the light-transmitting sheet 33 may be adhered to the annular bonding layer 32; or, the annular bonding layer 32 may be first attached to the light-transmitting sheet 33, and then the light-transmitting sheet 33 may be adhered to the top surface 311 of the sensing chip 31 through the annular bonding layer 32; or, The glass plate is glued and then cut to form the annular bonding layer 32 on which the plurality of light-transmitting sheets 33 are adhered (that is, the plurality of light-transmitting sheets 33 may also be the uncut glass plate before the first bonding step S120 is performed), and each of the light-transmitting sheets 33 may be adhered to the top surface 311 of the sensing chip 31 through the corresponding annular bonding layer 32, but the present invention is not limited to the above.

More specifically, in each of the sensing modules 3, a projection area formed by the orthographic projection of the light-transmitting sheet 33 toward the top surface 311 is located inside the plurality of connection pads 3113 and is separated from each of the connection pads 3113 by a distance G (e.g., FIG. 7 ). In other words, any structure that does not conform to the above-mentioned connection relationship between the light-transmitting sheet 33 and the sensing chip 31 is different from the sensing module 3 referred to in this embodiment.

The cutting step S130: As shown in FIG. 1, FIG. 3 and FIG. 4, the wafer 31a is held and cut to form a plurality of the sensing modules 3 separated from each other. In this embodiment, the plurality of light-transmitting sheets 33 are separated by chessboard-shaped channels, so that a cutting tool or laser (not shown in the figure) passes through and cuts the wafer 31a along the channels (that is, the plurality of light-transmitting sheets 33 will not touch the cutting tool in the cutting step S130).

It should be noted that the cutting step S130 in this embodiment is limited to cutting a single component (i.e., the wafer 31a) to avoid affecting the relative position relationship between components due to cutting multiple components. Therefore, any cutting process that requires cutting multiple components is different from the cutting step S130 in this embodiment.

The second bonding step S140: As shown in FIG. 1 and FIG. 5 , one of the sensing modules 3 is fixed to an upper surface 11 of a substrate 1, and a plurality of bonding pads 112 of the substrate 1 and a plurality of connection pads 3113 of the one of the sensing modules 3 are connected by bonding with a plurality of metal wires 4. In this embodiment, the one of the sensing modules 3 is fixed to the upper surface 11 of the substrate 1 by a fixing glue layer 2.

Furthermore, in one of the sensing modules 3, the bottom surface 312 of the sensing chip 31 is not ground and is fixed to the upper surface 11 of the substrate 1, so that the maximum allowable value of the thickness T31 of the sensing chip 31 is 700 micrometers (μm). Accordingly, since the sensing chip 31 does not need to be ground to reduce the thickness T31, the sensing chip 31 can have a higher heat capacity, thereby making the temperature of the sensing chip 31 rise more slowly during operation, effectively improving the signal-to-noise ratio (SNR) of the sensing chip 31.

The packaging step S150: As shown in FIG. 1, FIG. 6 and FIG. 7, a packaging body 5 is formed on the upper surface 11 of the substrate 1, and the one of the sensing modules 3 and the plurality of metal wires 4 are embedded in the packaging body 5, while at least a partial outer surface 331 of the light-transmitting sheet 33 is exposed outside the packaging body 5. In other words, after the packaging step S150 is performed, a sensor packaging structure 100 is obtained, in which no solder balls are disposed on the lower surface 12 of the substrate 1, thereby reducing the overall thickness of the sensor packaging structure 100.

In summary, the manufacturing method S100 of the sensor package structure disclosed in the embodiment of the present invention forms the sensing module 3 by first bonding the smaller light-transmitting sheet 33 to the sensing chip 31, so that the sensing area 3111 of the sensing chip 31 is located within the closed space S of the sensing module 3, and then the sensing module 3 is fixed to the substrate 1, thereby effectively preventing the sensing area 3111 of the sensing chip 31 from being contaminated and damaged during the manufacturing process of the sensor package structure 100.

In addition, this embodiment generally describes the manufacturing method S100 of the sensor package structure with the above content, and then generally introduces the specific structure of the sensor package structure 100. Among them, the sensor package structure 100 is preferably manufactured by the manufacturing method S100 of the sensor package structure, but the present invention is not limited thereto.

In this embodiment, as shown in FIG. 6 and FIG. 7 , the sensor packaging structure 100 includes a substrate 1, a fixing adhesive layer 2 disposed on the substrate 1, a sensing module 3 fixed to the substrate 1 through the fixing adhesive layer 2, a plurality of metal wires 4 electrically coupling the substrate 1 and the sensing module 3, and a packaging body 5 formed on the substrate 1, but the present invention is not limited thereto.

The substrate 1 is square or rectangular in this embodiment, but the present invention is not limited thereto. The substrate 1 is provided with a module fixing area 111 at approximately the center of its upper surface 11, and the substrate 1 is formed with a plurality of bonding pads 112 on the outer side of the module fixing area 111 on the upper surface 11. The plurality of bonding pads 112 are arranged roughly in a ring shape in this embodiment, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the plurality of bonding pads 112 may also be arranged in two rows on opposite sides of the module fixing area 111.

It should be noted that the substrate 1 does not have any solder balls on its lower surface 12; that is, the sensor package structure 100 can be directly soldered and fixed to an electronic component (not shown in the figure) through the lower surface 12 of the substrate 1, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the substrate 1 can also have multiple solder balls on the lower surface 12 according to design requirements.

The fixing adhesive layer 2 is disposed in the module fixing area 111 of the substrate 1; that is, the fixing adhesive layer 2 is located on the inner side of the plurality of bonding pads 112, so that the sensing module 3 is fixed to the module fixing area 111 of the substrate 1 along a preset direction D through the fixing adhesive layer 2. It should be noted that the sensing module 3 is integrally bonded to the substrate 1 in this embodiment, which is different from a structure in which a plurality of components are sequentially mounted on the substrate 1.

In more detail, the sensing module 3 includes a sensing chip 31, an annular bonding layer 32 disposed on the sensing chip 31, and a transparent sheet 33 disposed on the annular bonding layer 32. The size of the sensing chip 31 (e.g., outer contour area) is larger than the size of the annular bonding layer 32 but smaller than the size of the sensing chip 31, so that the outer edge of the annular bonding layer 32 is surrounded by the sensing chip 31 and the transparent sheet 33 to form an annular groove 34.

Furthermore, the sensing chip 31 is square (e.g., rectangular or square) in this embodiment and is described as an image sensing chip, and the maximum allowable value of the thickness T31 of the sensing chip 31 is 700 microns, but not limited thereto. The bottom surface 312 of the sensing chip 31 is adhered to the fixing adhesive layer 2; that is, the sensing chip 31 is located on the inner side of the plurality of bonding pads 112. Furthermore, a top surface 311 of the sensing chip 31 includes a sensing area 3111 and a supporting area 3112 surrounding the sensing area 3111 (and in a ring shape).

The sensing chip 31 includes a plurality of connection pads 3113 located in the carrying area 3112 (that is, the plurality of connection pads 3113 are located outside the sensing area 3111). The number and position of the plurality of connection pads 3113 of the sensing chip 31 respectively correspond to the number and position of the plurality of bonding pads 112 of the substrate 1 in this embodiment; that is, the plurality of connection pads 3113 are also roughly arranged in a ring shape in this embodiment.

The annular bonding layer 32 is disposed on the top surface 311 (e.g., the supporting area 3112) of the sensing chip 31, and the annular bonding layer 32 surrounds the sensing area 3111, and a plurality of connection pads 3113 are located outside the annular bonding layer 32. The annular bonding layer 32 is spaced apart from the sensing area 3111 and any of the connection pads 3113 by a distance.

The light-transmitting sheet 33 is illustrated as a flat glass in this embodiment, but the present invention is not limited thereto. The light-transmitting sheet 33 has an outer surface 331 and an inner surface 332 located on opposite sides, and the light-transmitting sheet 33 (with the inner surface 332) is disposed on the annular bonding layer 32, so that the light-transmitting sheet 33, the annular bonding layer 32, and the sensing chip 31 together surround a closed space S. The sensing area 3111 of the sensing chip 31 is located within the closed space S, and a projection area formed by the orthographic projection of the light-transmitting sheet 33 (along the preset direction D) toward the top surface 311 is located on the inner side of the plurality of connection pads 3113 and separated by a distance.

Accordingly, the sensor package structure 100 can accommodate the expanded portion of the annular bonding layer 32 having a larger coefficient of thermal expansion (CTE) through the closed space S among the light-transmitting sheet 33 and its corresponding annular bonding layer 32 and the sensing chip 31, thereby reducing the light-transmitting sheet 33 or the sensing area 3111 from being squeezed and damaged due to the expansion of the annular bonding layer 32.

The plurality of metal wires 4 respectively connect the plurality of bonding pads 112 of the substrate 1 to the plurality of connecting pads 3113 of the sensing chip 31 (that is, the two ends of each of the metal wires 4 are respectively connected to one bonding pad 112 and the corresponding connecting pad 3113), so that the substrate 1 and the sensing chip 31 are electrically coupled to each other.

In this embodiment, the bending point (or highest point) of any of the metal wires 4 forms a maximum distance H4 with the upper surface 11 of the substrate 1, which is greater than a spacing distance H33 between the light-transmitting sheet 33 and the substrate 1. In other words, the component configuration of the sensing module 3 does not affect the subsequent bonding process of the metal wires 4.

The package body 5 is opaque in this embodiment to prevent visible light from passing through. The package body 5 is described as a liquid encapsulation, and the package body 5 is formed on the upper surface 11 of the substrate 1 and its edge is aligned with the edge of the substrate 1. The sensing module 3 and the plurality of metal wires 4 are buried in the package body 5, and at least a portion of the outer surface 331 of the light-transmitting sheet 33 is exposed outside the package body 5. Furthermore, the sensing module 3 in this embodiment can also effectively improve the bonding between the sensing module 3 and the package body 5 through its component configuration (e.g., the annular groove 34 is filled with the package body 5).

[Example 2]

Please refer to FIG. 8 to FIG. 10 , which are the second embodiment of the present invention. Since this embodiment is similar to the first embodiment, the similarities between the two embodiments will not be described in detail, and the differences between this embodiment and the first embodiment are roughly described as follows:

In this embodiment, the sensing chip 31 has a plurality of columnar microstructures 3121 formed on the bottom surface 312, and in the second bonding step, the plurality of columnar microstructures 3121 of the sensing chip 31 are buried in the fixing adhesive layer 2, and the configuration of each columnar microstructure 3121 can be adjusted and changed according to design requirements; for example, each columnar microstructure 3121 can be in the shape of a triangular prism as shown in FIG8 , a cylindrical or rectangular prism as shown in FIG9 , or a spherical shape as shown in FIG10 . The thickness T2 of the fixing adhesive layer 2 is greater than the thickness T3121 of any columnar microstructure 3121, so that each columnar microstructure 3121 is completely buried in the fixing adhesive layer 2 and does not touch the substrate 1.

As described above, in the present embodiment, the sensor package structure 100 can form a plurality of columnar microstructures 3121 embedded in the fixing adhesive layer 2 through the sensing chip 31, thereby further effectively improving the bonding between the sensing module 3 and the substrate 1.

[Example 3]

Please refer to FIG. 11 and FIG. 12, which are the third embodiment of the present invention. Since this embodiment is similar to the first and second embodiments, the similarities of the above embodiments are not described in detail, and the differences between this embodiment and the first and second embodiments are roughly described as follows:

In this embodiment, the manufacturing method S100 of the sensor package structure can omit the packaging step according to design requirements; that is, the sensor package structure 100 can omit the package body 5 according to design requirements. In addition, the package body 5 can also be adjusted and changed according to design requirements; for example: in other embodiments not shown in the present invention, the package body 5 can surround the side of the light-transmitting sheet 33, but the package body 5 does not cover any of the metal wires 3 or only covers a part of any of the metal wires 3.

[Technical Effects of the Embodiments of the Invention]

In summary, the sensor package structure and the manufacturing method thereof disclosed in the embodiments of the present invention form the sensing module by bonding the smaller light-transmitting sheet to the sensing chip, so that the sensing area of the sensing chip is located within the closed space of the sensing module, and then the sensing module is fixed to the substrate, thereby effectively preventing the sensing area of the sensing chip from being contaminated and damaged during the manufacturing process of the sensor package structure.

Furthermore, the sensor packaging structure and manufacturing method disclosed in the embodiment of the present invention, in the sensing module, accommodates the expanded portion of the annular bonding layer having a larger thermal expansion coefficient through the closed space, thereby reducing the risk of the light-transmitting sheet or the sensing area being squeezed and damaged due to the expansion of the annular bonding layer.

The above disclosed contents are only preferred feasible embodiments of the present invention and are not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the contents of the specification and drawings of the present invention are included in the patent scope of the present invention.

100: sensor package structure 1: substrate 11: upper surface 111: module fixing area 112: bonding pad 12: lower surface 2: fixed adhesive layer 3: sensing module 31a: wafer 31: sensing chip 311: top surface 3111: sensing area 3112: carrying area 3113: connection pad 312: bottom surface 3121: columnar microstructure 32: annular bonding layer 33: light-transmitting sheet 331: outer surface 332: inner surface 34: annular groove 4: metal wire 5: package body S100: manufacturing method of sensor package structure S110: pre-step S120: First joining step S130: Cutting step S140: Second joining step S150: Packaging step D: Default direction T31: Thickness T3121: Thickness T2: Thickness S: Closed space H4: Maximum distance H33: Interval distance G: Distance

FIG. 1 is a schematic diagram of a process for manufacturing a sensor package structure according to a first embodiment of the present invention.

FIG. 2 is a three-dimensional schematic diagram corresponding to the preceding step in FIG. 1 .

FIG. 3 is a three-dimensional schematic diagram corresponding to the first joining step in FIG. 1 .

FIG. 4 is a three-dimensional schematic diagram corresponding to the cutting step in FIG. 1 .

FIG. 5 is a three-dimensional schematic diagram corresponding to the second joining step in FIG. 1 .

FIG. 6 is a three-dimensional schematic diagram corresponding to the packaging step in FIG. 1 .

FIG. 7 is a schematic cross-sectional view along section line VII-VII of FIG. 6 .

FIG8 is a partial schematic diagram of the sensor packaging structure of the second embodiment of the present invention (I).

FIG9 is a partial schematic diagram (II) of the sensor packaging structure of the second embodiment of the present invention.

FIG10 is a partial schematic diagram of the sensor packaging structure of the second embodiment of the present invention (III).

FIG. 11 is a schematic diagram of the process of manufacturing the sensor package structure of the third embodiment of the present invention.

FIG12 is a schematic cross-sectional view of the sensor packaging structure of the third embodiment of the present invention.

100:Sensor packaging structure

1: Substrate

11: Upper surface

111: Module fixing area

112:Joint pad

12: Lower surface

2:Fix the glue layer

3:Sensor module

31:Sensor chip

311: Top

3111: Sensing area

3112: Loading area

3113:Connection pad

312: Bottom

32: Ring-shaped layer

33: Translucent film

331: External surface

332: Inner surface

34: Annular groove

4:Metal wire

D: Default direction

T31:Thickness

S: Closed space

H4: Highest distance

H33: Spacing distance

G:Distance

Claims (17)

A manufacturing method of a sensor package structure comprises: a pre-step: providing a wafer and a plurality of light-transmitting sheets separated from each other, wherein the wafer defines a plurality of sensing chips connected to each other, and the size of each sensing chip is larger than the size of any light-transmitting sheet; a first bonding step: attaching a light-transmitting sheet to the top surface of each sensing chip with an annular bonding layer; wherein each sensing chip, the annular bonding layer disposed thereon and the light-transmitting sheet together define a sensing module and together surround a closed space, wherein each sensing chip A sensing area of the sensing chip is located in the closed space, and a plurality of connection pads of each sensing chip are located on the outer side of the annular bonding layer; a cutting step: holding the wafer and cutting to form a plurality of sensing modules separated from each other; and a second bonding step: fixing one of the sensing modules on an upper surface of a substrate, and connecting the plurality of bonding pads of the substrate and the plurality of connection pads of the one of the sensing modules by bonding with a plurality of metal wires; wherein no solder balls are provided on the lower surface of the substrate. The manufacturing method of the sensor package structure as described in claim 1, wherein, in each of the sensing modules, a projection area formed by the orthographic projection of the light-transmitting sheet toward the top surface is located on the inner side of the plurality of connection pads and is separated from each of the connection pads by a distance. The manufacturing method of the sensor package structure as described in claim 1, wherein, in one of the sensing modules, the bottom surface of the sensing chip is not ground and is fixed to the upper surface of the substrate, and the maximum allowable thickness of the sensing chip is 700 micrometers (μm). The manufacturing method of the sensor package structure as described in claim 1, wherein, in the second bonding step, one of the sensing modules is fixed to the upper surface of the substrate with a fixing glue layer. The manufacturing method of the sensor package structure as described in claim 4, wherein the sensing chip has a plurality of columnar microstructures formed on the bottom surface; in the second bonding step, the plurality of columnar microstructures of the sensing chip are buried in the fixing glue layer, and the thickness of the fixing glue layer is greater than the thickness of any of the columnar microstructures, so that each of the columnar microstructures does not touch the substrate. The manufacturing method of the sensor package structure as described in claim 1, wherein the manufacturing method of the sensor package structure further includes a packaging step: a packaging body is formed on the upper surface of the substrate, and one of the sensing modules and the plurality of metal wires are buried in the packaging body, and at least a part of the outer surface of the light-transmitting sheet is exposed outside the packaging body. A sensor packaging structure, comprising: a substrate, the upper surface of which has a module fixing area and a plurality of bonding pads located outside the module fixing area; a fixing adhesive layer, arranged in the module fixing area of the substrate; a sensing module, fixed to the substrate through the fixing adhesive layer, and the sensing module includes: a sensing chip, the bottom surface of which is adhered to the fixing adhesive layer, and the sensing chip has a plurality of columnar microstructures buried in the fixing adhesive layer formed on the bottom surface; wherein a top surface of the sensing chip contains a sensing area and a plurality of connection pads located outside the sensing area; an annular bonding layer, arranged in the The top surface of the sensing chip is formed by the annular bonding layer surrounding the sensing area, and a plurality of connection pads are located on the outer side of the annular bonding layer; and a transparent sheet is disposed on the annular bonding layer so that the transparent sheet, the annular bonding layer, and the sensing chip together surround a closed space; wherein a projection area formed by the orthographic projection of the transparent sheet toward the top surface is located on the inner side of the plurality of connection pads and separated by a distance; and a plurality of metal wires are respectively connected to the plurality of bonding pads of the substrate to the plurality of connection pads of the sensing chip, so that the substrate and the sensing chip are electrically coupled to each other. A sensor packaging structure as described in claim 7, wherein the thickness of the fixing glue layer is greater than the thickness of any of the columnar microstructures, so that each of the columnar microstructures does not touch the substrate. The sensor packaging structure as described in claim 7, wherein each of the columnar microstructures is in the shape of a triangular column, a circular column, or a rectangular column. The sensor package structure as described in claim 7, wherein no solder balls are provided on the lower surface of the substrate, and the maximum allowable thickness of the sensor chip is 700 microns. The sensor package structure as described in claim 7, wherein the bending point of any of the metal wires forms a maximum distance with the upper surface of the substrate, which is greater than a spacing distance between the light-transmitting sheet and the substrate. The sensor package structure as described in claim 7, wherein the sensor package structure further includes a package body formed on the upper surface, and the sensing module and the plurality of metal wires are buried in the package body, and at least a portion of the outer surface of the light-transmitting sheet is exposed outside the package body. The sensor packaging structure as described in claim 12, wherein the outer edge of the annular bonding layer is surrounded by the sensor chip and the light-transmitting sheet to form an annular groove, and the annular groove is filled with the packaging body. A sensor package structure comprises: a substrate, the upper surface of which has a module fixing area and a plurality of bonding pads located outside the module fixing area; wherein the lower surface of the substrate is not provided with any soldering balls; a fixing adhesive layer, which is provided in the module fixing area of the substrate; a sensing module, which is fixed to the substrate through the fixing adhesive layer, and the sensing module comprises: a sensing chip, the bottom surface of which is adhered to the fixing adhesive layer; wherein a top surface of the sensing chip contains a sensing area and a plurality of bonding pads located outside the sensing area; an annular bonding layer, which is provided on the module fixing area of the sensing chip; The top surface is disposed on the annular bonding layer, and the annular bonding layer surrounds the sensing area, and a plurality of connection pads are located on the outer side of the annular bonding layer; and a light-transmitting sheet is disposed on the annular bonding layer, so that the light-transmitting sheet, the annular bonding layer, and the sensing chip together surround a closed space; wherein a projection area formed by the orthographic projection of the light-transmitting sheet toward the top surface is located on the inner side of the plurality of connection pads and separated by a distance; and A plurality of metal wires are respectively connected to the plurality of bonding pads of the substrate and the plurality of connection pads of the sensing chip, so that the substrate and the sensing chip are electrically coupled to each other. The sensor package structure as described in claim 14, wherein the maximum allowable thickness of the sensor chip is 700 microns. The sensor package structure as described in claim 14, wherein the bending point of any of the metal wires forms a maximum distance from the upper surface of the substrate, which is greater than a spacing distance between the light-transmitting sheet and the substrate; wherein the outer edge of the annular bonding layer forms an annular groove surrounding the sensor chip and the light-transmitting sheet. The sensor package structure as described in claim 16, wherein the sensor package structure further comprises a package body formed on the upper surface, and the sensing module and the plurality of metal wires are buried in the package body, and at least a portion of the outer surface of the light-transmitting sheet is exposed outside the package body, and the annular groove is filled with the package body.