TW202415958A - Probe position detection equipment for MEMS probes of image sensing chips - Google Patents

Abstract

A needle position detection device for a micro-electromechanical probe head of an image sensing chip, comprising: a base, an optical microscope lens assembly, a microscope and a display, the base is provided with a reference platform, a Y-axis precision moving stage, a first gantry and a second gantry are provided on the reference platform, the optical microscope lens assembly is arranged on the first gantry via a Z-axis precision moving stage, the microscope is arranged on the second gantry, the first gantry and the second gantry are separated by a distance An X-axis precision moving stage and a carrier are arranged on the Y-axis precision moving stage in sequence. The carrier is used to carry the probe card, so that the optical microscope lens assembly can quickly and accurately capture and collect the MEMS probe image, and then the probe card can be automatically and accurately moved to the bottom of the microscope, so that the operator can quickly inspect the needle position of the MEMS probe.

Description

Probe position detection equipment for MEMS probes of image sensing chips

The present invention relates to a probe position detection device for a micro-electromechanical probe head used for an image sensing chip.

In the semiconductor manufacturing process, bare die testing is performed immediately after the wafer has completed the circuit layout process, in order to remove defective products before packaging, so as to prevent defective bare chips from entering the packaging stage and causing unnecessary cost increases. Therefore, bare die testing plays an extremely important role in the semiconductor industry.

The probe card is an important tool in the bare chip test process. It serves as the connection interface for electrical contact between the tester and the die. The probe head in the probe card contacts the specific pad of the die through the probe to measure the circuit characteristics and then judge the quality of the die. As the die size decreases, the pad spacing also decreases synchronously. The machined probes no longer meet the requirements. The MEMS probes completed by the semiconductor process are currently the mainstream. In contrast, the MEMS probes used in the MEMS probe head are smaller in size and adjacent spacing, and the number of probes is larger. Therefore, after the MEMS probe head is assembled, the needle position inspection operation for each MEMS probe is more cumbersome and time-consuming.

The needle position operation of the MEMS probe head consists of two parts, needle position detection and needle position adjustment, and two different sets of equipment must be used. Needle position detection: The probe of the MEMS probe head is pointed downward, and a digital zoom optical microscope is used to collect images, and several defective needle positions are determined through optical recognition software. Needle position adjustment: the probe card is taken out and turned over so that the MEMS probe faces upward, and the probe card is moved under another microscope. The operator moves the probe card so that the defective needle of the MEMS probe head is directly under the microscope. The operator observes and uses tools to help adjust the needle position to the correct position. In this way, the MEMS probe may be damaged or shifted again due to accidental contact during the turning and moving of the probe card. In addition, it is very time-consuming and labor-intensive to manually search for the position and movement among hundreds of MEMS probes and then make fine adjustments.

The main purpose of the present invention is to provide a needle position detection device for a micro-electromechanical probe head used for an image sensing chip. The device can automatically perform a needle position inspection of the micro-electromechanical probe head. After obtaining multiple defective needle positions, the defective needle position can be automatically moved to the bottom of the microscope for re-inspection by clicking, which is convenient for the operator to quickly inspect and adjust. In this way, the time required for re-inspection can be greatly shortened, efficiency is improved, and accuracy is high.

To achieve the above-mentioned purpose, the present invention adopts the following technical solutions:

The present invention is a needle position detection device for a micro-electromechanical probe head of an image sensing chip, comprising: a machine base, a reference platform, a Y-axis precision moving stage, a first gantry and a second gantry are arranged on the reference platform at a distance and are both located in the moving path of the Y-axis precision moving stage; the Y-axis precision moving stage is responsible for driving an X-axis precision moving stage to move in the Y-axis direction, the X-axis precision moving stage is responsible for driving a carrier to move in the X-axis direction, and the carrier A probe card is placed on the first gantry, and a Z-axis precision moving stage is provided. An optical microscope lens assembly is arranged on the first gantry via the Z-axis precision moving stage, and the Z-axis precision moving stage can accurately control the moving distance of the optical microscope lens assembly in the Z-axis direction, so that the optical microscope lens assembly can focus and shoot the micro-electromechanical probe image of the probe card on the supporting stage moved from below. A microscope is arranged on the second gantry, and can observe the micro-electromechanical probe on the supporting stage moved from below. A display is set up on the side of the reference platform to display the operation image.

As one of the preferred implementation solutions, the benchmark platform is a granite platform.

As one of the preferred implementation schemes, the first gantry is a granite U-shaped gantry.

As one of the preferred implementation schemes, the second gantry is a granite U-shaped gantry.

As one of the preferred implementation schemes, the Y-axis precision moving stage, the X-axis precision moving stage and the Z-axis precision moving stage are all composed of high-precision linear slides and slides, with ball screws, stepping servo motors and motor drivers to control their moving distances.

As one of the preferred implementation schemes, the display can display all defective needle positions of the probe card. When the operator clicks on the defective needle position to be re-inspected, the Y-axis precision moving stage and the X-axis precision moving stage can be precisely moved so that the defective needle position is directly located under the microscope.

As one of the preferred implementation schemes, when the probe card is placed on the carrier, all the digital micro-motor probes are facing upward, and the Y-axis precision moving stage drives the X-axis precision moving stage and the carrier to move the probe card to below the optical microscope lens assembly and the microscope.

Compared with the prior art, the present invention places the probe of the probe card upward on the carrier, and through the operation of the Y-axis precision moving carrier and the X-axis precision moving carrier, the position of the MEMS probe of the MEMS probe head is first automatically photographed through the optical microscope lens assembly, and several defective needle positions are determined by optical recognition software. After that, the defective needle position is displayed and clicked on the display, and the defective needle position can be automatically moved to the bottom of the microscope, so that the operator can re-inspect or correct the needle position. It is fast, convenient and accurate, and the detection time is greatly shortened. In addition, the probe card does not need to be flipped or moved between two devices like the conventional mechanism, which avoids the tiny MEMS probe from being damaged due to accidental contact.

The technical solution of the present invention will be described clearly and completely below in conjunction with specific embodiments and accompanying drawings. It should be noted that when an element is referred to as being "mounted on or fixed to" another element, it means that it can be directly on the other element or there can also be a centered element. When an element is considered to be "connected to" another element, it means that it can be directly connected to the other element or there can be a centered element at the same time. In the illustrated embodiments, the directions indicating up, down, left, right, front and back, etc. are relative, and are used to explain that the structures and movements of different components in this case are relative. These representations are appropriate when the components are in the positions shown in the figures. However, if the description of the component positions changes, it is believed that these representations will also change accordingly.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention pertains. The terms used herein are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and/or" used herein includes any and all combinations of one or more of the related listed items.

As shown in FIG1 and FIG2, they are the three-dimensional view and side view of the invention respectively. The needle position detection device of the micro-electromechanical probe head for image sensing chip of the invention comprises: a base 10, an optical microscope lens assembly 20, a microscope 30 and a display 40. A reference platform 11 is provided on the machine base 10, and a Y-axis precision moving platform 12, a first gantry 13 and a second gantry 14 are provided on the reference platform 11. The first gantry 13 and the second gantry 14 are provided on the reference platform 11 at a distance and are both located in the moving path of the Y-axis precision moving platform 12. In addition, the Y-axis precision moving platform 12 is responsible for driving an X-axis precision moving platform 15 stacked thereon to move in the Y-axis direction, and the X-axis precision moving platform 15 is responsible for driving a carrier 16 stacked thereon to move in the X-axis direction, and the carrier 16 is provided for placing a probe card. The optical microscope lens set 20 is set at the first gantry 13 via a Z-axis precision moving stage 17. The Z-axis precision moving stage 17 can accurately control the moving distance of the optical microscope lens set 20 in the Z-axis direction, so that the optical microscope lens set 20 can automatically focus and shoot the digital micro-electromechanical probe image of the probe card on the support platform 16 moving from below and collect it; the microscope 30 is set on the second gantry 14 and can observe the micro-electromechanical probe image on the support platform 16 moving from below. The display 40 is set on the side of the reference platform 11 to display the operation image.

The present invention utilizes the support stage 16 to move the optical microscope lens assembly 20 below, and the Y-axis precision moving stage 12 and the X-axis precision moving stage 15 cooperate with each other to allow the optical microscope lens assembly 20 to shoot and record each probe position, and determine a number of defective probe positions through optical recognition software. After the detection is completed, the support stage 16 is first moved to the position below the microscope 30 through the Y-axis precision moving stage 12. When the operator wants to repair, the operator clicks on the position of the defective needle position displayed on the display 40, and then the Y-axis precision moving stage 12 and the X-axis precision moving stage 15 move synchronously and precisely, directly moving the defective needle position to the position directly below the microscope 30, eliminating the need for searching and moving operations, and then the adjustment and detection operation can be performed immediately, which is convenient, fast and easy.

Next, the structure of each component is described in detail:

As shown in FIG. 3 , the probe card 60 of the present invention is used to detect the needle position. The middle area is where the probe head 61 is located. The probe head 61 has a plurality of test areas, each of which is composed of a plurality of micro-electromechanical probes 62. Of course, this is only one type of probe card 60, and it is not limited to this type.

The base 10 is a support bracket for receiving the reference platform 11. In order to improve the accuracy and stability of the detection, in this embodiment, the reference platform 11 is a granite platform. The Y-axis precision moving stage 12, the first gantry 13 and the second gantry 14 are installed on the reference platform 11. In this embodiment, the first gantry 13 and the second gantry 14 are also granite U-shaped granites to ensure the accuracy of the detection. The Y-axis precision moving stage 12 stacks the X-axis precision moving stage 15 and the support platform 16 in sequence from bottom to top, and the first gantry 13 is installed with the Z-axis precision moving stage 17. In this embodiment, the Y-axis precision moving stage 12, the X-axis precision moving stage 15 and the Z-axis precision moving stage 17 are all made of high-precision linear slide rails and slide seats, and are matched with ball screws, stepping servo motors and motor drivers to control their moving distances to meet the required nanometer-level precision. Therefore, the Y-axis precision moving stage 12 of the present invention can accurately control the X-axis precision moving stage 15 to move in the Y-axis direction, the X-axis precision moving stage 15 can accurately control the carrier 16 to move in the X-axis direction, and the Z-axis precision moving stage 17 can accurately control the optical microscope lens assembly 20 to move in the Z-axis direction. The support platform 16 is used to place the probe card 60. The probe card 60 can be fixed by a fixture, but the present invention is not limited thereto. The support platform 16 can also be a porous ceramic vacuum suction cup so as to directly absorb the probe card 60 placed thereon. In addition, the first gantry 13 and the second gantry 14 are arranged on the reference platform 11 at a distance and are both located in the moving path of the Y-axis precision moving stage 12, so that the support platform 16 and the probe card 60 can be automatically and quickly moved to the bottom of the optical microscope lens assembly 20 and the microscope 30.

The optical microscope lens assembly 20 is a digital automatic zoom optical microscope lens assembly, which can quickly and accurately photograph the MEMS probe 62 of the probe card 60, collect and process the digital probe image, and determine the suspected defective needle position through optical recognition software in conjunction with the standard image in the original database. During the process, the Y-axis precision moving stage 12 and the X-axis precision moving stage 15 are used to accurately move the position of the carrier 16, so that the MEMS probe 62 at different positions on the probe card 60 can be moved to the optical axis of the optical microscope lens assembly 20 in a timely manner, so as to synchronously record each needle position.

The microscope 30 is a physical microscope, which is disposed at the second gantry 14 and is used to observe the probe card 60 moved there. The present invention can also use computer software to virtually generate a standard needle position and image it in the observation window. When the defective needle in the probe card 60 moves directly below the microscope 30, the operator can quickly and correctly correct the needle position of the MEMS probe 62 with the tool in conjunction with the standard needle position presented in the observation window.

The display 40 is disposed on the side of the reference platform 11 to display the images captured or observed by the optical microscope lens set 20 or the microscope 30, or to display all defective needle positions of the probe head 61. When repairing, the operator can freely click and use the Y-axis precision moving stage 12 and the X-axis precision moving stage 15 to accurately move the defective needle position to the bottom of the microscope 30, shortening the operator's search time.

As shown in FIG4, it is a schematic diagram of the actual operation of the present invention. The operator places the probe card 60 on the carrier 16, and the MEMS probe 62 faces upward, and starts the needle position detection process: according to the test file of the selected probe model, the Y-axis precision moving stage 12 is used to first move the carrier 16 under the optical microscope lens assembly 20, as shown in FIG5, and then the Y-axis precision moving stage 12 and the X-axis precision moving stage 15 cooperate with each other to enable the optical microscope lens assembly 20 to shoot and record the location of each MEMS probe 62, and then the optical recognition software determines the defective needle position. After all MEMS probes 62 have completed the recording, as shown in FIG6, the probe card 60 will be moved by the Y-axis precision moving stage 12 to the bottom of the optical microscope lens assembly 20. The precision moving stage 12 moves back to the position below the microscope 30. At this time, the display 40 displays all the defective needle positions of the probe card 60. The operator can immediately click on the defective needle position to be re-inspected. Then the Y-axis precision moving stage 12 and the X-axis precision moving stage 15 move synchronously and precisely so that the defective needle position is directly located under the microscope 30. The operator then adjusts the needle position with high accuracy, which can save the time of operating the search and movement, greatly shorten the re-inspection time, and avoid unnecessary damage to the probe card 60 caused by the movement. In addition, the virtual standard needle position displayed by the computer software will also make the repair operation faster and more accurate.

The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the embodiments of the present invention. That is, all equivalent changes and modifications made according to the scope of the patent application of the present invention are covered by the patent scope of the present invention.

10: base 11: reference platform 12: Y-axis precision moving stage 13: first gantry 14: second gantry 15: X-axis precision moving stage 16: carrier 17: Z-axis precision moving stage 20: optical microscope head assembly 30: microscope 40: display 60: probe card 61: probe head 62: MEMS probe X: X-axis Y: Y-axis Z: Z-axis

FIG1 is a perspective view of the present invention.

FIG. 2 is a side view of the present invention.

FIG. 3 is a perspective view of the probe card used in the present invention.

FIG. 4 is a schematic diagram of the actual use of the present invention.

FIG. 5 is a top view of the actual use of the present invention, with the probe card moved below the optical microscope lens assembly.

FIG6 is a top view of the actual use of the present invention, with the probe card moved under the microscope.

10: Base

11: Benchmark platform

12: Y-axis precision moving stage

13: First gantry

14: Second gantry

15: X-axis precision moving stage

16: Carrier platform

17: Z-axis precision moving stage

20: Optical microscope lens set

30:Microscope

40: Display

X: X axis

Y:Y axis

Z:Z axis

Claims (7)

A needle position detection device for a micro-electromechanical probe head of an image sensing chip, comprising: A machine base, provided with a reference platform, on which a Y-axis precision moving stage, a first gantry and a second gantry are provided, the first gantry and the second gantry are provided on the reference platform at a distance and are both located in the moving path of the Y-axis precision moving stage; the Y-axis precision moving stage is responsible for driving an X-axis precision moving stage to move in the Y-axis direction, the X-axis precision moving stage is responsible for driving a carrier to move in the X-axis direction, the carrier is provided for a probe card to be placed, and the first gantry is provided with a Z-axis precision moving stage; An optical microscope lens set is arranged at the first gantry via the Z-axis precision moving stage. The Z-axis precision moving stage can accurately control the moving distance of the optical microscope lens set in the Z-axis direction, so that the optical microscope lens set can focus and shoot the image of the micro-electromechanical probe of the probe card on the carrier moving from below; A microscope is arranged on the second gantry, and the micro-electromechanical probe on the carrier moving from below is observed by the microscope; A display is set on the side of the reference platform to display the operation image. As described in claim 1, in the probe position detection device for a micro-electromechanical probe head used for an image sensing chip, the reference platform is a granite platform. A needle position detection device for a micro-electromechanical probe head of an image sensing chip as described in claim 1, wherein the first gantry is a granite U-shaped gantry. A needle position detection device for a micro-electromechanical probe head used for an image sensing chip as described in claim 1, wherein the second gantry is a granite U-shaped gantry. As described in claim 1, the needle position detection device of the micro-electromechanical probe head for image sensing chips, the Y-axis precision moving stage, the X-axis precision moving stage and the Z-axis precision moving stage are all composed of high-precision linear slides and slides, combined with ball screws, stepping servo motors and motor drivers to control the moving distance. As described in claim 1, the needle position detection device of the micro-electromechanical probe head used for image sensing chips, the display can show all defective needle positions of the probe card, and when the operator clicks on the defective needle position to be re-inspected, the Y-axis precision moving stage and the X-axis precision moving stage can be precisely moved so that the defective needle position is directly located under the microscope. As described in claim 1, in the probe position detection device for the micro-electromechanical probe head of the image sensing chip, when the probe card is set on the supporting platform, all the micro-electromechanical probes are facing upward, and the supporting platform is driven by the Y-axis precision moving platform to move the probe card to the position below the optical microscope lens assembly and the microscope.

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