TW202415437A - Washing device for removing ammonia gas and organic matter - Google Patents
Washing device for removing ammonia gas and organic matter Download PDFInfo
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- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 title claims abstract description 90
- 238000005406 washing Methods 0.000 title claims abstract description 64
- 239000005416 organic matter Substances 0.000 title claims abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 51
- 239000002253 acid Substances 0.000 claims abstract description 34
- 239000002912 waste gas Substances 0.000 claims abstract description 32
- 238000004140 cleaning Methods 0.000 claims abstract description 23
- 239000007788 liquid Substances 0.000 claims description 129
- 238000005554 pickling Methods 0.000 claims description 65
- 229910021529 ammonia Inorganic materials 0.000 claims description 38
- 238000012544 monitoring process Methods 0.000 claims description 28
- 150000002500 ions Chemical class 0.000 claims description 27
- 238000001179 sorption measurement Methods 0.000 claims description 27
- 239000007789 gas Substances 0.000 claims description 26
- 239000007921 spray Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 16
- 230000002378 acidificating effect Effects 0.000 claims description 13
- 230000005540 biological transmission Effects 0.000 claims description 12
- 239000003054 catalyst Substances 0.000 claims description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 12
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 6
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 238000011010 flushing procedure Methods 0.000 abstract description 7
- 125000004122 cyclic group Chemical group 0.000 abstract 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 18
- 239000002585 base Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 10
- 239000012855 volatile organic compound Substances 0.000 description 10
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 7
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- 239000002957 persistent organic pollutant Substances 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000003344 environmental pollutant Substances 0.000 description 3
- 231100000719 pollutant Toxicity 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 231100001243 air pollutant Toxicity 0.000 description 2
- 239000000809 air pollutant Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000007717 exclusion Effects 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 1
- 238000003915 air pollution Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 231100001244 hazardous air pollutant Toxicity 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 239000010812 mixed waste Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 nitrogen-methyl 2-tetrahydropyrrolidone Chemical compound 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
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Abstract
Description
本發明係有關一種洗滌裝置,尤其是一種用於晶圓洗淨製程中的去除氨氣及有機物之洗滌裝置。The present invention relates to a cleaning device, in particular to a cleaning device for removing ammonia and organic matter in a wafer cleaning process.
在超大型積體電路(ULSI)製程中,晶圓洗淨之技術及其潔淨度(Cleanliness)往往是影響晶圓製程的良率(Yield)、元件品質(Quality)以及其可靠度(Reliability)的重要因素之一。因此,在相關製程中需要對晶圓進行清洗來達到潔淨度的要求。In the ultra-large integrated circuit (ULSI) process, wafer cleaning technology and its cleanliness are often one of the important factors affecting the yield, component quality and reliability of the wafer process. Therefore, the wafer needs to be cleaned in the relevant process to meet the cleanliness requirements.
而晶圓的清洗是將整批次或單一晶圓,藉由化學品浸泡或純水清洗來進行,主要是為了清除晶圓表面的污染物,如微粒子、有機汙染物、無機物、金屬離子等雜質。Wafer cleaning involves soaking a whole batch or a single wafer in chemicals or using pure water to clean the wafer surface, mainly to remove contaminants such as microparticles, organic pollutants, inorganic substances, metal ions and other impurities.
目前業界較常使用濕式清洗法,而最為被接受的是濕式清洗法中的RCA清潔法(RCA Clean),此RCA清潔法為1960年代由RCA公司所發展。其清潔原理在於使用於不同的化學配方來進行清潔,像是標準清潔液1(SC-1)及標準清潔液2(SC-2)等。Currently, the industry is more likely to use wet cleaning methods, and the most accepted one is the RCA Clean method, which was developed by RCA in the 1960s. The cleaning principle is to use different chemical formulas for cleaning, such as Standard Cleaning Solution 1 (SC-1) and Standard Cleaning Solution 2 (SC-2).
而在使用化學配方SC-1(APM)、SC-2(HPM)、SPM、DHF及BHF…等進行清潔的同時,常會帶有大量酸氣、鹼氣及揮發性有機物等製程混合廢氣排放。目前對於揮發性有機物的去除效率一直未能達到良好之效果。When using chemical formulas such as SC-1 (APM), SC-2 (HPM), SPM, DHF and BHF for cleaning, a large amount of acid gas, alkaline gas and volatile organic matter are often discharged as mixed waste gas. Currently, the removal efficiency of volatile organic matter has not been able to achieve a good effect.
而揮發性有機物(又稱揮發性有機氣體污染物,Volatile Organic Compounds, VOCs),係指在一大氣壓下,沸點在250℃以下之有機化合物之空氣污染物總稱,其所造成的環境污染問題,廣泛地存在於各類型工業中。Volatile organic compounds (VOCs) are a general term for air pollutants that are organic compounds with a boiling point below 250°C under atmospheric pressure. The environmental pollution problems they cause are widely present in all types of industries.
而工業上常見的揮發性有機物以丙酮(Acetone)、異丙酮(IPA)、丙二醇單甲基醚(PGME)、乙酸丙二醇單甲基醚酯(PGMEA)、二甲基亞碸(DMSO)、乙醇胺(MEA)、氮-甲基2-四氫吡咯酮(NMP)、二乙二醇單丁醚(BDG)、四甲基氫氧化銨(TMAH)等成份為多數。The most common volatile organic compounds in industry are acetone (Acetone), isopropyl acetone (IPA), propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), dimethyl sulfoxide (DMSO), ethanolamine (MEA), nitrogen-methyl 2-tetrahydropyrrolidone (NMP), diethylene glycol monobutyl ether (BDG), tetramethylammonium hydroxide (TMAH) and other components.
在解決混合廢氣的問題上,多為導入濕式洗滌塔來處理廢氣中污染物(酸、鹼、有機物質),但對於有機氣體的去除效率卻一直未能達到良好之效果,尤其是在單晶圓清洗機上,有機性製程廢氣(主要為異丙醇)其去除效率一直未有良好之效果。In order to solve the problem of mixed exhaust gas, a wet scrubber is usually used to treat pollutants (acids, alkalis, and organic substances) in the exhaust gas. However, the removal efficiency of organic gases has not been able to achieve good results, especially in single-wafer cleaning machines. The removal efficiency of organic process exhaust gas (mainly isopropyl alcohol) has not been good.
而現今濕式洗滌塔的清洗方式,除了有機性製程廢氣的去除效率一直無法提高外,亦無法在去除有機性製程廢氣的同時,同步去除高濃度腐蝕性製程廢氣。The current wet scrubber cleaning method not only has a low efficiency in removing organic process waste gas, but also cannot remove highly concentrated corrosive process waste gas simultaneously with the organic process waste gas.
為此,除了改善並提高濕式洗滌塔對異丙醇(IPA)等有機物之去除效率外,在去除異丙醇(IPA)等有機物的同時,亦製作出可同步去除高濃度腐蝕性製程廢氣之濕式洗滌塔,並且高濃度腐蝕性製程廢氣及有機污染物具有高去除效率,為本領域技術人員所欲解決的問題。Therefore, in addition to improving and increasing the removal efficiency of wet scrubbers for organic substances such as isopropyl alcohol (IPA), a wet scrubber is also manufactured that can simultaneously remove high-concentration corrosive process exhaust gas while removing organic substances such as isopropyl alcohol (IPA). The high-concentration corrosive process exhaust gas and organic pollutants have high removal efficiency, which is a problem that technicians in this field want to solve.
本發明之主要目的,係提供一種去除氨氣及有機物之洗滌裝置,藉由第一過濾裝置的循環酸洗模式(其pH值維持於5以下)及第二過濾裝置的沖洗水洗模式的設置,來同步去除廢棄氣體中高濃度之氨氣及有機物。The main purpose of the present invention is to provide a washing device for removing ammonia and organic matter, by setting a circulating acid washing mode (its pH value is maintained below 5) of the first filter device and a flushing water washing mode of the second filter device, to simultaneously remove high-concentration ammonia and organic matter in the waste gas.
為了達到上述之目的,本發明揭示了一種去除氨氣及有機物之洗滌裝置,其係設置於一腔體內,該腔體兩側分別設有一進氣口及一出氣口,其結構包含:一第一過濾裝置,其係設置於該腔體內,並位於該進氣口之一側,該第一過濾裝置係包含;以及一酸洗腔室,該酸洗腔室之兩側分別設置一第一過濾進氣口以及一第一過濾出氣口,該進氣口係透過一進氣連通道連通該第一過濾進氣口;一第一過濾件,其設置於該酸洗腔室之內側,並位於該第一過濾進氣口之上方; 一第一噴灑裝置,其設置於該酸洗腔室之內側,並位於該第一過濾件之上方,該第一噴灑裝置包含至少一第一噴頭及一第一管路,該第一管路係一端連接該至少一第一噴頭,另一端穿設該酸洗腔室並連通一液體切換閥;以及一循環管路,其位於該酸洗腔室之下方並穿設該酸洗腔室,其一端連通該液體切換閥,該循環管路係用以運輸一第一液體經由該液體切換閥進入該第一管路,使該第一噴灑裝置於該第一過濾件上噴灑該第一液體,該第一液體係酸性液體; 一第二過濾裝置,其係設置於該腔體內,並位於該出氣口之一側,該第二過濾裝置係包含;一水洗腔室,該水洗腔室之兩側分別設置一第二過濾進氣口以及一第二過濾出氣口,該第一過濾出氣口係經由一氣體連通道連通該第二過濾進氣口,該第二過濾出氣口係連通該出氣口;一第二過濾件,其設置於該水洗腔室之內側,並位於該第二過濾進氣口之上方;以及一第二噴灑裝置,其設置於該水洗腔室之內側,並位於該第二過濾件之上方,該第二噴灑裝置包含至少一第二噴頭及一第二管路,該第二管路係一端連接該至少一第二噴頭,另一端穿設該水洗腔室並連通一水洗液體供應裝置。In order to achieve the above-mentioned purpose, the present invention discloses a washing device for removing ammonia and organic matter, which is arranged in a cavity, and an air inlet and an air outlet are respectively arranged on both sides of the cavity, and its structure includes: a first filter device, which is arranged in the cavity and located on one side of the air inlet, and the first filter device includes; and a pickling chamber, and a first filter air inlet and a first filter air outlet are respectively arranged on both sides of the pickling chamber, and the air inlet is connected to the first filter air inlet through an air inlet connecting channel; a first filter element, which is arranged on the inner side of the pickling chamber and located above the first filter air inlet; a first spray device, which is arranged inside the pickling chamber and above the first filter element, and comprises at least one first spray head and a first pipeline, one end of the first pipeline is connected to the at least one first spray head, and the other end passes through the pickling chamber and is connected to a liquid switching valve; and a circulation pipeline, which is located below the pickling chamber and passes through the pickling chamber, and one end of the circulation pipeline is connected to the liquid switching valve, and the circulation pipeline is used to transport a first liquid through the liquid switching valve into the first pipeline, so that the first spray device sprays the first liquid on the first filter element, and the first liquid is an acidic liquid; a second filter device, which is arranged in the cavity and located on one side of the air outlet, the second filter device comprises: a water washing chamber, a second filter air inlet and a second filter air outlet are respectively arranged on both sides of the water washing chamber, the first filter air outlet is connected to the second filter air inlet through a gas connecting channel, and the second filter air outlet is connected to the air outlet; a second filter element, It is arranged on the inner side of the water washing chamber and located above the second filter air inlet; and a second spraying device is arranged on the inner side of the water washing chamber and located above the second filter element, the second spraying device includes at least one second nozzle and a second pipeline, one end of the second pipeline is connected to the at least one second nozzle, and the other end passes through the water washing chamber and is connected to a water washing liquid supply device.
本發明提供一實施例,其內容在於當一廢棄氣體進入該酸洗腔室,該廢棄氣體係包含一氨氣及一有機物,該氨氣之濃度大於800ppm及該有機物之濃度大於1000ppm,當該廢棄氣體通過該第一過濾件後去除該氨氣,並經由該第一過濾出氣口排出該酸洗腔室,後續經由該氣體連通道進入該水洗腔室,並通過該第二過濾件去除該有機物後,該廢棄氣體經由該第二過濾出氣口排出該水洗腔室,再者,該第一液體經由該第一管路進入該酸洗腔室,並通過該至少一第一噴頭噴灑於經過該第一過濾件之該廢棄氣體後,該第一液體排出該酸洗腔室並流入該循環管路,且該第二液體經由該第二管路進入該水洗腔室,並通過該至少一第二噴頭噴灑於經過該第二過濾件之該廢棄氣體後,該第二液體排出該水洗腔室。The present invention provides an embodiment, wherein when a waste gas enters the pickling chamber, the waste gas contains ammonia and an organic substance, the concentration of the ammonia is greater than 800 ppm and the concentration of the organic substance is greater than 1000 ppm, the waste gas passes through the first filter element to remove the ammonia, and is discharged from the pickling chamber through the first filter outlet, and then enters the water washing chamber through the gas connection channel, and passes through the second filter element to remove the organic substance, and then the waste gas The first liquid is discharged from the water washing chamber through the second filter outlet, and the first liquid enters the acid washing chamber through the first pipeline, and after being sprayed on the waste gas passing through the first filter element by the at least one first nozzle, the first liquid is discharged from the acid washing chamber and flows into the circulation pipeline, and the second liquid enters the water washing chamber through the second pipeline, and after being sprayed on the waste gas passing through the second filter element by the at least one second nozzle, the second liquid is discharged from the water washing chamber.
本發明提供一實施例,其內容在於該第一過濾裝置係進一步包含一監控模組(一第一傳輸元件)、一酸鹼檢測儀、一排酸控制裝置(一第二傳輸元件、一計時元件)及一酸洗液體供應裝置(一第三傳輸元件)。The present invention provides an embodiment, the content of which is that the first filtering device further includes a monitoring module (a first transmission element), an acid-base detector, an acid discharge control device (a second transmission element, a timing element) and a pickling liquid supply device (a third transmission element).
本發明提供一實施例,其內容在於當該酸鹼檢測儀檢測該第一液體之酸鹼值大於5時,該酸鹼檢測儀通知該監控模組,該監控模組傳送一排除訊息至該排酸控制裝置並排除該酸洗腔室之該第一液體,且該排酸控制裝置傳送一補充訊息至該酸洗液體供應裝置,該酸洗液體供應裝置補充該第一液體至一液體供應管路,該液體供應管路之一端連通該液體切換閥,另一端連通該酸洗液體供應裝置。The present invention provides an embodiment, the content of which is that when the acid-base detector detects that the acid-base value of the first liquid is greater than 5, the acid-base detector notifies the monitoring module, the monitoring module transmits an exclusion message to the acid discharge control device and discharges the first liquid in the pickling chamber, and the acid discharge control device transmits a replenishment message to the pickling liquid supply device, the pickling liquid supply device replenishes the first liquid to a liquid supply pipeline, one end of the liquid supply pipeline is connected to the liquid switching valve, and the other end is connected to the pickling liquid supply device.
本發明提供一實施例,其內容在於當該計時元件到達一預定時間值時,該排酸控制裝置自動排除該酸洗腔室之該第一液體,且該排酸控制裝置傳送該補充訊息至該酸洗液體供應裝置,該酸洗液體供應裝置補充該第一液體至該液體供應管路。The present invention provides an embodiment, the content of which is that when the timing element reaches a predetermined time value, the acid discharge control device automatically discharges the first liquid in the pickling chamber, and the acid discharge control device transmits the replenishment message to the pickling liquid supply device, and the pickling liquid supply device replenishes the first liquid to the liquid supply pipeline.
本發明提供一實施例,其內容在於該第二過濾裝置係進一步包含一排水裝置,其係設置於該水洗腔室之下方,該排水裝置係用以排出該第二液體。The present invention provides an embodiment, wherein the second filtering device further comprises a drainage device disposed below the washing chamber, and the drainage device is used to discharge the second liquid.
本發明提供一實施例,其內容在於該第一過濾件包含一第一殼體、至少一第一多孔元件及至少一第一離子吸附元件,該至少一第一多孔元件(上方設置一第一觸媒材料)及該至少一第一離子吸附元件係依序堆疊設置於該第一殼體內,且該至少一第一多孔元件位於該第一過濾進氣口之一側,該至少一第一離子吸附元件位於該第一過濾出氣口之一側。The present invention provides an embodiment, the content of which is that the first filter includes a first shell, at least one first porous element and at least one first ion adsorption element, the at least one first porous element (a first catalyst material is arranged on the top) and the at least one first ion adsorption element are stacked in sequence in the first shell, and the at least one first porous element is located on one side of the first filter air inlet, and the at least one first ion adsorption element is located on one side of the first filter air outlet.
本發明提供一實施例,其內容在於該第二過濾件包含一第二殼體、至少一第二多孔元件及至少一第二離子吸附元件,該至少一第二多孔元件(上方設置一第二觸媒材料)及該至少一第二離子吸附元件係依序堆疊設置於該第二殼體內,且該至少一第二多孔元件位於該第二過濾進氣口之一側,該至少一第二離子吸附元件位於該第二過濾出氣口之一側。The present invention provides an embodiment, the content of which is that the second filter element includes a second shell, at least one second porous element and at least one second ion adsorption element, the at least one second porous element (with a second catalyst material arranged on the top) and the at least one second ion adsorption element are stacked in sequence in the second shell, and the at least one second porous element is located on one side of the second filter air inlet, and the at least one second ion adsorption element is located on one side of the second filter air outlet.
為使貴審查委員對本發明之特徵及所達成之功效有更進一步之瞭解與認識,謹佐以實施例及配合說明,說明如後:In order to enable you to have a deeper understanding and knowledge of the features and effects of the present invention, we would like to provide practical examples and accompanying explanations as follows:
有鑑於無法在去除有機汙染物(其去除效率不高)的同時,同步去除高濃度腐蝕性製程廢氣的問題。據此,本發明遂提出一種去除氨氣及有機物之洗滌裝置,以解決習知技術所造成之問題。In view of the problem that it is impossible to remove high-concentration corrosive process exhaust gas simultaneously with the removal of organic pollutants (the removal efficiency is not high), the present invention proposes a cleaning device for removing ammonia and organic matter to solve the problem caused by the prior art.
以下將進一步說明本發明之去除氨氣及有機物之洗滌裝置其包含之特性、所搭配之結構及方法:The following will further describe the characteristics, structure and method of the cleaning device for removing ammonia and organic matter of the present invention:
首先,請參閱第1A圖,其係本發明之實施例之結構示意圖。如第1A圖所示,本發明之去除氨氣及有機物之洗滌裝置1,其係設置於一腔體10內,該腔體10兩側分別設有一進氣口12及一出氣口14,其結構包含一第一過濾裝置20及一第二過濾裝置30。First, please refer to FIG. 1A, which is a schematic diagram of the structure of an embodiment of the present invention. As shown in FIG. 1A, the cleaning device 1 for removing ammonia and organic matter of the present invention is arranged in a chamber 10, and the chamber 10 is provided with an air inlet 12 and an air outlet 14 on both sides thereof, and the structure thereof includes a first filter device 20 and a second filter device 30.
本實施例之該第一過濾裝置20其係設置於該腔體10內,並位於該進氣口12之一側,其結構包含:一酸洗腔室21、一第一過濾件22、一第一噴灑裝置23及一循環管路24。其中該酸洗腔室21之兩側分別設置一第一過濾進氣口211以及一第一過濾出氣口212,該進氣口12係透過一進氣連通道121連通該第一過濾進氣口211。The first filter device 20 of this embodiment is disposed in the chamber 10 and located on one side of the air inlet 12, and its structure includes: a pickling chamber 21, a first filter element 22, a first spray device 23 and a circulation pipeline 24. A first filter air inlet 211 and a first filter air outlet 212 are disposed on both sides of the pickling chamber 21, respectively, and the air inlet 12 is connected to the first filter air inlet 211 through an air inlet connection channel 121.
而本實施例之該第一過濾件22設置於該酸洗腔室21之內側,並位於該第一過濾進氣口211之上方,其中該第一過濾件22包含一第一殼體221、至少一第一多孔元件222及至少一第一離子吸附元件223。The first filter element 22 of the present embodiment is disposed inside the pickling chamber 21 and above the first filter air inlet 211 , wherein the first filter element 22 includes a first shell 221 , at least one first porous element 222 and at least one first ion adsorption element 223 .
而該至少一第一多孔元件222及該至少一第一離子吸附元件223係依序堆疊設置於該第一殼體221內,且該至少一第一多孔元件221位於該第一過濾進氣口211之一側,該至少一第一離子吸附元件223(係為塑膠、玻璃纖維、金屬板或陶瓷填充材料以單一或複合材料之方式製成板式波浪狀之平板構造,使板與板之間形成氣體通道)位於該第一過濾出氣口212之一側。The at least one first porous element 222 and the at least one first ion adsorption element 223 are stacked in sequence in the first shell 221, and the at least one first porous element 221 is located on one side of the first filter air inlet 211, and the at least one first ion adsorption element 223 (which is a flat plate structure made of plastic, glass fiber, metal plate or ceramic filling material in a single or composite material to form a plate-like corrugated shape so that a gas channel is formed between the plates) is located on one side of the first filter air outlet 212.
並於該至少一第一多孔元件222(其材質係為不鏽鋼、鈦、鉑或鋁,但不已此為限)之上表面設置一第一觸媒材料2221(係為二氧化鈦、氧化矽、氧化鋁或鉑,但不已此為限)。A first catalyst material 2221 (such as titanium dioxide, silicon oxide, aluminum oxide or platinum, but not limited thereto) is disposed on the upper surface of the at least one first porous element 222 (such as stainless steel, titanium, platinum or aluminum, but not limited thereto).
再者,本實施例之該第一噴灑裝置23其設置於該酸洗腔室21之內側,並位於該第一過濾件22之上方,該第一噴灑裝置23包含至少一第一噴頭231及一第一管路232,該第一管路232係一端連接該至少一第一噴頭231,另一端穿設該酸洗腔室21並連通一液體切換閥233(係為球閥或球向閥之結構,包含二通閥或三通閥或四通閥等,本實施例中係以三通球閥進行說明,但不以此為限)。Furthermore, the first spray device 23 of the present embodiment is arranged on the inner side of the pickling chamber 21 and is located above the first filter element 22. The first spray device 23 includes at least one first nozzle 231 and a first pipeline 232. The first pipeline 232 is connected to the at least one first nozzle 231 at one end, and the other end passes through the pickling chamber 21 and is connected to a liquid switching valve 233 (a ball valve or a ball valve structure, including a two-way valve, a three-way valve, a four-way valve, etc. In this embodiment, a three-way ball valve is used for illustration, but it is not limited to this).
其中該至少一第一噴頭231係噴灑一第一液體W1(係酸性液體,本實施例選用硫酸,但不已此為限,並依據一氨氣N之濃度對該第一液體W1之pH值用水進行調整,並維持低於pH 5以下)於該第一過濾件22上,使該第一過濾件22呈現酸性狀態(維持低於pH 5以下)。The at least one first nozzle 231 sprays a first liquid W1 (an acidic liquid, sulfuric acid is used in this embodiment, but not limited to this, and the pH value of the first liquid W1 is adjusted with water according to the concentration of ammonia N and maintained below pH 5) onto the first filter element 22, so that the first filter element 22 is acidic (maintained below pH 5).
再者,該第一過濾裝置20之該循環管路24其位於該酸洗腔室21之下方並穿設該酸洗腔室21,其一端連通該液體切換閥233,該循環管路24係用以運輸該第一液體W1經由該液體切換閥233再次進入該第一管路232,使該第一噴灑裝置23於該第一過濾件33上噴灑該第一液體W1,並再進入該循環管路24中進行循環。Furthermore, the circulation pipeline 24 of the first filter device 20 is located below the pickling chamber 21 and penetrates the pickling chamber 21, and one end of the circulation pipeline 24 is connected to the liquid switching valve 233. The circulation pipeline 24 is used to transport the first liquid W1 through the liquid switching valve 233 to re-enter the first pipeline 232, so that the first spraying device 23 sprays the first liquid W1 on the first filter element 33, and then enters the circulation pipeline 24 for circulation.
而本實施例之該第二過濾裝置30,其係設置於該腔體10內,並位於該出氣口14之一側,該第二過濾裝置30係包含:一水洗腔室31、一第二過濾件32及一第二噴灑裝置33。其中該水洗腔室31之兩側分別設置一第二過濾進氣口311以及一第二過濾出氣口312,該第一過濾出氣口311係經由一氣體連通道122連通該第二過濾進氣口311,該第二過濾出氣口312係連通該出氣口14。The second filter device 30 of this embodiment is disposed in the chamber 10 and located on one side of the air outlet 14. The second filter device 30 includes: a water washing chamber 31, a second filter element 32 and a second spray device 33. A second filter air inlet 311 and a second filter air outlet 312 are disposed on both sides of the water washing chamber 31. The first filter air outlet 311 is connected to the second filter air inlet 311 via a gas connection channel 122, and the second filter air outlet 312 is connected to the air outlet 14.
而該第二過濾件32其設置於該水洗腔室31之內側,並位於該第二過濾進氣口311之上方,其中該第二過濾件32包含一第二殼體321、至少一第二多孔元件322及至少一第二離子吸附元件323。The second filter element 32 is disposed inside the water washing chamber 31 and above the second filter air inlet 311 , wherein the second filter element 32 includes a second shell 321 , at least one second porous element 322 and at least one second ion adsorption element 323 .
而該至少一第二多孔元件322及該至少一第二離子吸附元件323係依序堆疊設置於該第二殼體321內,且該至少一第二多孔元件322位於該第二過濾進氣口311之一側,該至少一第二離子吸附元件323(係為塑膠、玻璃纖維、金屬板或陶瓷填充材料以單一或複合材料之方式製成板式波浪狀之平板構造,使板與板之間形成氣體通道)位於該第二過濾出氣口312之一側。The at least one second porous element 322 and the at least one second ion adsorption element 323 are stacked in sequence in the second shell 321, and the at least one second porous element 322 is located on one side of the second filter air inlet 311, and the at least one second ion adsorption element 323 (which is a flat plate structure made of plastic, glass fiber, metal plate or ceramic filling material in a single or composite material to form a plate-like corrugated shape so that a gas channel is formed between the plates) is located on one side of the second filter air outlet 312.
並於該至少一第二多孔元件322(其材質係為不鏽鋼、鈦、鉑或鋁,但不已此為限)之上表面設置一第二觸媒材料3221(係為二氧化鈦、氧化矽、氧化鋁或鉑,但不已此為限)。A second catalyst material 3221 (titanium dioxide, silicon oxide, aluminum oxide or platinum, but not limited thereto) is disposed on the upper surface of the at least one second porous element 322 (the material of which is stainless steel, titanium, platinum or aluminum, but not limited thereto).
再者,本實施例之該第二噴灑裝置33其設置於該水洗腔室31之內側,並位於該第二過濾件32之上方,該第二噴灑裝置33包含至少一第二噴頭331及一第二管路332,該第二管路332係一端連接該至少一第二噴頭331,另一端穿設該水洗腔室31並連通一水洗液體供應裝置34。Furthermore, the second spray device 33 of the present embodiment is arranged on the inner side of the water washing chamber 31 and is located above the second filter element 32. The second spray device 33 includes at least one second nozzle 331 and a second pipe 332. One end of the second pipe 332 is connected to the at least one second nozzle 331, and the other end passes through the water washing chamber 31 and is connected to a water washing liquid supply device 34.
其中該至少一第二噴頭331係噴灑一第二液體W2(本實施例選用水,但不已此為限)於該第二過濾件32上,使該第二過濾件32呈現濕性狀態。The at least one second nozzle 331 sprays a second liquid W2 (water in this embodiment, but not limited thereto) onto the second filter element 32 to make the second filter element 32 in a wet state.
並,請進一步參閱第1B圖,其係本發明之實施例之結構運作示意圖。首先,由晶圓清洗製程產生的一廢棄氣體A(該廢棄氣體A係包含該氨氣N及一有機物VOC,該氨氣N之濃度大於800ppm及該有機物VOC之濃度大於1000ppm)進入位於該第一過濾裝置20中之該酸洗腔室21(隨著第1B圖之大箭頭行進),並通過該第一過濾件22時,會透過該第一過濾件22之該第一液體W1(由該至少一第一噴頭23噴出所造成)來去除吸附該廢棄氣體A中之高濃度之該氨氣N(此時該第一過濾件22因該第一液體W1呈現酸性狀態),過濾掉該氨氣N之該廢棄氣體A接續經由該第一過濾出氣口211排出該酸洗腔室21,並進入該第二過濾裝置30。Please further refer to FIG. 1B, which is a schematic diagram of the structure and operation of an embodiment of the present invention. First, a waste gas A generated by the wafer cleaning process (the waste gas A includes the ammonia N and an organic VOC, the concentration of the ammonia N is greater than 800ppm and the concentration of the organic VOC is greater than 1000ppm) enters the pickling chamber 21 located in the first filter device 20 (following the large arrow in FIG. 1B), and passes through the first filter 22, and then passes through the acid cleaning chamber 21. The first liquid W1 of the first filter element 22 (produced by the at least one first nozzle 23) removes the high-concentration ammonia N adsorbed in the waste gas A (at this time, the first filter element 22 is acidic due to the first liquid W1), and the waste gas A that has filtered out the ammonia N is continuously discharged from the pickling chamber 21 through the first filter outlet 211 and enters the second filter device 30.
後續,過濾掉該氨氣N之該廢棄氣體A經由該氣體連通道122進入該第二過濾裝置30之該水洗腔室31,並透過該第二過濾件32之該第二液體W2(由該至少一第二噴頭22噴灑)來去除吸附該有機物VOC後(此時該第二過濾件32因該第二液體W2呈現濕性狀態),該廢棄氣體A(已去除高濃度之該氨氣N及該有機物VOC)經由該第二過濾出氣口312排出該水洗腔室31,並接續排出洗滌裝置10。Subsequently, the waste gas A from which the ammonia N is filtered out enters the water washing chamber 31 of the second filter device 30 through the gas connection channel 122, and after passing through the second liquid W2 (sprayed by the at least one second nozzle 22) of the second filter element 32 to remove the adsorbed organic VOC (at this time, the second filter element 32 is in a wet state due to the second liquid W2), the waste gas A (from which the high-concentration ammonia N and the organic VOC have been removed) is discharged from the water washing chamber 31 through the second filter outlet 312, and then discharged from the washing device 10.
再者,本實施例之該第一液體W1先經由一酸洗液體供應裝置28透過一液體供應管路282進入該液體切換閥233後,再透過該第一管路232進入該酸洗腔室21,並通過該至少一第一噴頭23噴灑於該第一過濾件22(呈現酸性狀態),並吸附排除該廢棄氣體A中之該氨氣N後,該第一液體W1會排出該酸洗腔室21並流入該循環管路24,再接續透過該液體切換閥233轉換至該第一管路232進入該酸洗腔室21,以此達到酸性循環的模式。Furthermore, the first liquid W1 of the present embodiment first enters the liquid switching valve 233 through a pickling
而,本實施例之該第二液體W2先經由該水洗液體供應裝置34透過該第二管路332進入該水洗腔室31,並通過該至少一第二噴頭331噴灑於該第二過濾件32(呈現濕性狀態),並吸附排除該廢棄氣體A中之該有機物VOC後,該第二液體W2透過一排水裝置35(係設置於該水洗腔室31之下方,用以排出該第二液體W2)排出該水洗腔室31,不再進行循環。However, the second liquid W2 of the present embodiment first enters the water washing chamber 31 through the water washing liquid supply device 34 through the second pipe 332, and is sprayed on the second filter 32 (in a wet state) through the at least one second nozzle 331, and after adsorbing and removing the organic VOC in the waste gas A, the second liquid W2 is discharged from the water washing chamber 31 through a drainage device 35 (which is arranged below the water washing chamber 31 to discharge the second liquid W2) and no longer circulates.
又,請參閱第2圖,其係本發明之離子吸附元件之結構放大示意圖,如第2圖所示,本實施例以該第二過濾件32做為範例(其本發明之該第一過濾件22之結構配置及運作模式亦相同於該第二過濾件32,故不在此贅述),該至少一第二離子吸附元件323之間形成複數個氣體通道,且該些個氣體通道(相互具有一間距P,該間距P係為3mm至30mm之間)採取斜向配置外,亦採連續轉彎方向,向左或向右傾斜,如此對於已溶解後再次逸散之該廢棄氣體A可達再次補集之功效,可有效提高汙染物質去除率,減少二次逸散之機率。且,該間距P之設置還可防止氣體壓損過大的問題產生。In addition, please refer to FIG. 2, which is an enlarged schematic diagram of the structure of the ion adsorption element of the present invention. As shown in FIG. 2, the second filter element 32 is used as an example in this embodiment (the structural configuration and operation mode of the first filter element 22 of the present invention are also the same as the second filter element 32, so they are not described here in detail). A plurality of gas channels are formed between the at least one second ion adsorption element 323, and these gas channels (having a distance P between each other, and the distance P is between 3 mm and 30 mm) are arranged obliquely and continuously turn to the left or right. In this way, the waste gas A that has been dissolved and then dissipated again can be re-collected, which can effectively improve the removal rate of pollutants and reduce the probability of secondary dissipation. Furthermore, the setting of the spacing P can also prevent the problem of excessive gas pressure loss from occurring.
再者,如第2圖所示,本實施例中將該至少一第二離子吸附元件323設計為該些個氣體通道之形式,使該第二液體W2可由上往下順著該至少一第二離子吸附元件323表面往下流,與該廢棄氣體A之方向相反,且角度可相衝突,可使該廢棄氣體A中之汙染物更容易被該第二液體W2所吸附,更可確保已溶解於吸收該第二液體W2之有機污染物不易再次被釋出於空氣中,以達高效率去除之功效。Furthermore, as shown in FIG. 2 , in this embodiment, the at least one second ion adsorption element 323 is designed to be in the form of the gas channels, so that the second liquid W2 can flow downward along the surface of the at least one second ion adsorption element 323 from top to bottom, in the opposite direction of the waste gas A, and the angles can conflict with each other, so that the pollutants in the waste gas A can be more easily adsorbed by the second liquid W2, and it can be ensured that the organic pollutants dissolved in the second liquid W2 are not easily released into the air again, so as to achieve a high-efficiency removal effect.
更進一步,該些個氣體通道與該至少一第二多孔元件322形成一角度θ,該角度θ係介於30∘至90∘之間,可使該廢棄氣體A在通過該些個氣體通道時,更易直接衝擊吸收該第二液體W2,從而被該第二液體W2所吸收。Furthermore, the gas channels and the at least one second porous element 322 form an angle θ, and the angle θ is between 30° and 90°, so that the waste gas A can more easily directly impact and absorb the second liquid W2 when passing through the gas channels, thereby being absorbed by the second liquid W2.
又,為維持其去除率,請進一步參閱第3A圖,其係本發明之酸鹼監測模式之訊號傳輸示意圖。如第3A圖所示,本發明之去除氨氣及有機物之洗滌裝置1之該第一過濾裝置20係進一步包含一監控模組25(係一種酸鹼值控製器,如微電腦酸鹼度分析儀,用於監控pH值)、一酸鹼檢測儀26(係一種工業用酸鹼度三合一電極酸鹼pH計,用於量測該第一液體W1加入時之酸鹼值)、一排酸控制裝置27(係一種氣動閥件,可以控制開關,並藉由氣動閥件的開關時間(如計時元件271)來控制該第一液體W1的量)及該酸洗液體供應裝置28(係用泵供應該第一液體W1進入該洗滌裝置1之該第一過濾裝置20)。Furthermore, in order to maintain the removal rate, please further refer to FIG. 3A , which is a schematic diagram of signal transmission of the acid-base monitoring mode of the present invention. As shown in FIG. 3A , the first filter device 20 of the washing device 1 for removing ammonia and organic matter of the present invention further comprises a monitoring module 25 (a pH value controller, such as a microcomputer pH analyzer, for monitoring pH value), an acid-base detector 26 (an industrial pH three-in-one electrode pH meter, for measuring the pH value when the first liquid W1 is added), an acid discharge control device 27 (a pneumatic valve that can control the switch and control the amount of the first liquid W1 by the switch time of the pneumatic valve (such as a timing element 271)) and the pickling liquid supply device 28 (a pump is used to supply the first liquid W1 into the first filter device 20 of the washing device 1).
其中該監控模組25及該酸鹼檢測儀26皆設置於該酸洗腔室21之內側,並位於該第一過濾件22之下方,該監控模組25進一步包含:一第一傳輸元件251(其係設置於該監控模組25之內),而該酸鹼檢測儀26係電性連接該監控模組25,並用於檢測通過該第一過濾件22之該第一液體W1之酸鹼值。The
而該排酸控制裝置27(包含一計時元件271及一第二傳輸元件272)設置於該酸洗腔室21之外側,係電性連接該監控模組25。而該酸洗液體供應裝置28(設置於該洗滌裝置1之外側,並包含一第三傳輸元件281),其係電性連接該排酸控制裝置27。The acid discharge control device 27 (comprising a
酸鹼監測模式:當該酸鹼檢測儀26檢測該第一液體W1之酸鹼值大於5時,該酸鹼檢測儀26會傳送一警示訊息通知該監控模組25,該監控模組25傳送一排除訊息S1至該排酸控制裝置27,在該排酸控制裝置27排除該酸洗腔室21之該第一液體W1時,該排酸控制裝置27會傳送一補充訊息S2至該酸洗液體供應裝置28,該酸洗液體供應裝置28補充該第一液體W1至該液體供應管路282(其一端連通該液體切換閥233,另一端連通該酸洗液體供應裝置28),並透過該液體切換閥233提供該第一液體W1至該第一管路232,以便維持該第一過濾裝置20內部之該第一液體W1之酸鹼值小於5。Acid-base monitoring mode: When the acid-
藉由上述模式,可以由該酸鹼檢測儀26來控制該第一液體W1之添加量來維持該酸洗腔室21內的pH值,也可以針對不同濃度之該氨氣N來直接調整該第一液體W1之添加量。Through the above mode, the amount of the first liquid W1 added can be controlled by the acid-
又,除了酸鹼監測模式外,亦會對酸性循環模式進行時間監控。請進一步參閱第3B圖,其係本發明之定時監測模式之訊號傳輸示意圖。如第3B圖所示,定時監測模式:當該計時元件271到達一預定時間值(本實施例較佳為4-8小時,可依據使用者之需求進行調整)時,該排酸控制裝置27將自動排除該酸洗腔室21之該第一液體W1,且該排酸控制裝置27傳送該補充訊息S2至該酸洗液體供應裝置28,該酸洗液體供應裝置28補充該第一液體W1至該液體供應管路282,並透過該液體切換閥233提供該第一液體W1至該第一管路232,以便維持該第一過濾裝置20內部之該第一液體W1之酸鹼值。In addition to the acid-base monitoring mode, the acid cycle mode is also time-monitored. Please refer to Figure 3B for a schematic diagram of signal transmission in the timing monitoring mode of the present invention. As shown in FIG. 3B , in the timing monitoring mode, when the
接續,請參閱下表,其係本實施例之實驗結果表。 表、實驗結果表 Next, please refer to the following table, which is the experimental results table of this embodiment. Table, Experimental Results Table
根據行政院環保署公布的「半導體製造業空氣污染管制及排放標準中」中第4條提及「半導體製造業產生之空氣污染物應由密閉排氣系統導入污染防制設備,並處理至符合下表規定後始得排放。」而其表中提及了揮發性有機物之排放標準為:排放削減率應大於90%或工廠總排放量應小於0.6 kg/hr(以甲烷為計算基準)。According to Article 4 of the "Air Pollution Control and Emission Standards for Semiconductor Manufacturing Industry" published by the Environmental Protection Administration of the Executive Yuan, "Air pollutants generated by the semiconductor manufacturing industry shall be introduced into pollution control equipment through a closed exhaust system and treated to meet the requirements of the following table before they can be discharged." The table mentions the emission standards for volatile organic compounds: the emission reduction rate shall be greater than 90% or the total factory emission shall be less than 0.6 kg/hr (based on methane).
然由,由上表可知,對照組皆使用水來進行沖洗模式,並未使用酸性液體,也未將酸性液體進行循環模式。其結果可知,IPA(為有機物之異丙醇)需要加大(由10 LPM變為16 LPM)其供水量(LPM,升/分鐘)才能使去除率達到90%以上,如此便會浪費其水資源。However, as can be seen from the table above, the control group used water for flushing mode, and did not use acidic liquid, nor did it circulate acidic liquid. The result shows that IPA (isopropyl alcohol for organic matter) needs to increase its water supply (LPM, liters/minute) (from 10 LPM to 16 LPM) to achieve a removal rate of more than 90%, which will waste its water resources.
而相比於本實施例之實驗組(除水沖洗外,使用酸性液體進行循環模式,其pH值分別為2.8、2.9),本實施例僅需使用10 LPM便可以將IPA(異丙醇)去除率達到90%以上。接續,根據行政院環保署公布的「固定污染源有害空氣污染物排放標準」中之附表二,其氨氣的容許濃度為小於50ppm。但由上表可知,對照組使用水來進行沖洗模式,不論其供水量如何增加,將無法將NH3(氨氣)的去除率達到95%以上(皆未小於50ppm),顯示其對照組不僅浪費水資源外,也無法提高NH3(氨氣)的去除率達到95%以上。而相比於本實施例之實驗組(除水沖洗外,使用酸性液體進行循環模式,其pH值分別為2.8、2.9),本實施例因為使用了酸性循環模式,便僅需使用10 LPM便可以將NH3(氨氣)去除率達到99%以上(NH3(氨氣)之濃度小於50ppm)。 由上述實驗可知,本發明將酸性循環模式搭配水沖洗模式的洗滌裝置,不僅在減省用水量的同時,還能將IPA(異丙醇)去除率達到90%以上外,也可以同步將NH3(氨氣)去除率達到99%以上。Compared with the experimental group of this embodiment (in addition to water flushing, an acidic liquid is used for circulation mode, and its pH value is 2.8 and 2.9 respectively), this embodiment only needs to use 10 LPM to achieve an IPA (isopropyl alcohol) removal rate of more than 90%. Continuing, according to Appendix 2 of the "Stationary Pollution Source Hazardous Air Pollutant Emission Standards" announced by the Environmental Protection Administration of the Executive Yuan, the allowable concentration of ammonia is less than 50ppm. However, it can be seen from the above table that the control group uses water for flushing mode. No matter how the water supply is increased, the NH3 (ammonia) removal rate cannot reach more than 95% (never less than 50ppm), indicating that the control group not only wastes water resources, but also cannot increase the NH3 (ammonia) removal rate to more than 95%. Compared with the experimental group of this embodiment (in addition to water flushing, an acidic liquid is used for circulation mode, and its pH value is 2.8 and 2.9 respectively), this embodiment uses an acidic circulation mode, so only 10 LPM is needed to achieve an NH3 (ammonia) removal rate of more than 99% (NH3 (ammonia) concentration is less than 50ppm). From the above experiments, it can be seen that the present invention combines the acidic circulation mode with the water flushing mode of the washing device, which not only reduces the water consumption, but also can achieve an IPA (isopropyl alcohol) removal rate of more than 90%, and can also simultaneously achieve an NH3 (ammonia) removal rate of more than 99%.
故本發明實為一具有新穎性、進步性及可供產業上利用者,應符合我國專利法專利申請要件無疑,爰依法提出發明專利申請,祈 鈞局早日賜准專利,至感為禱。Therefore, this invention is novel, progressive and can be used in the industry. It should undoubtedly meet the patent application requirements of the Patent Law of our country. Therefore, we have filed an invention patent application in accordance with the law and pray that the Bureau will approve the patent as soon as possible. I am deeply grateful.
惟以上所述者,僅為本發明之較佳實施例而已,並非用來限定本發明實施之範圍,舉凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本發明之申請專利範圍內。However, the above is only a preferred embodiment of the present invention and is not intended to limit the scope of implementation of the present invention. All equivalent changes and modifications made according to the shape, structure, features and spirit described in the patent application scope of the present invention should be included in the patent application scope of the present invention.
1:洗滌裝置 10:腔體 12:進氣口 121:進氣連通道 122:氣體連通道 14:出氣口 20:第一過濾裝置 21:酸洗腔室 211:第一過濾進氣口 212:第一過濾出氣口 22:第一過濾件 221:第一殼體 222:第一多孔元件 2221:第一觸媒材料 223:第一離子吸附元件 23:第一噴灑裝置 231:第一噴頭 232:第一管路 233:液體切換閥 24:循環管路 25:監控模組 251:第一傳輸元件 26:酸鹼檢測儀 27:排酸控制裝置 271:計時元件 272:第二傳輸元件 28:酸洗液體供應裝置 281:第三傳輸元件 282:液體供應管路 30:第二過濾裝置 31:水洗腔室 311:第二過濾進氣口 312:第二過濾出氣口 32:第二過濾件 321:第二殼體 322:第二多孔元件 3221:第二觸媒材料 323:第二離子吸附元件 33:第二噴灑裝置 331:第二噴頭 332:第二管路 34:水洗液體供應裝置 35:排水裝置 A:廢棄氣體 N:氨氣 P:間距 S1:排除訊息 S2:補充訊息 VOC:有機物 W1:第一液體 W2:第二液體 θ:角度 1: Washing device 10: Chamber 12: Air inlet 121: Air inlet channel 122: Gas channel 14: Air outlet 20: First filter device 21: Pickling chamber 211: First filter air inlet 212: First filter air outlet 22: First filter element 221: First shell 222: First porous element 2221: First catalyst material 223: First ion adsorption element 23: First spray device 231: First nozzle 232: First pipeline 233: Liquid switching valve 24: Circulation pipeline 25: Monitoring module 251: First transmission element 26: Acid and alkali detector 27: Acid discharge control device 271: Timing element 272: Second transmission element 28: Pickling liquid supply device 281: Third transmission element 282: Liquid supply pipeline 30: Second filter device 31: Water washing chamber 311: Second filter air inlet 312: Second filter air outlet 32: Second filter element 321: Second shell 322: Second porous element 3221: Second catalyst material 323: Second ion adsorption element 33: Second spray device 331: Second nozzle 332: Second pipeline 34: Water washing liquid supply device 35: Drainage device A: Waste gas N: Ammonia P: Pitch S1: Exclusion message S2: Supplementary message VOC: Organic matter W1: First liquid W2: Second liquid θ: Angle
第1A圖:其係本發明之實施例之結構示意圖;FIG. 1A is a schematic structural diagram of an embodiment of the present invention;
第1B圖:其係本發明之實施例之結構運作示意圖;FIG. 1B is a schematic diagram of the structure and operation of an embodiment of the present invention;
第2圖:其係本發明之離子吸附元件之結構放大示意圖;FIG. 2 is an enlarged schematic diagram of the structure of the ion adsorption element of the present invention;
第3A圖:其係本發明之酸鹼監測模式之訊號傳輸示意圖;以及FIG. 3A is a schematic diagram of signal transmission in the acid-base monitoring mode of the present invention; and
第3B圖:其係本發明之定時監測模式之訊號傳輸示意圖。Figure 3B is a schematic diagram of signal transmission in the timing monitoring mode of the present invention.
1:洗滌裝置 1: Washing device
10:腔體 10: Cavity
12:進氣口 12: Air intake
121:進氣連通道 121: Intake channel
122:氣體連通道 122: Gas connection channel
14:出氣口 14: Air outlet
20:第一過濾裝置 20: First filter device
21:酸洗腔室 21: Pickling chamber
211:第一過濾進氣口 211: First filter air inlet
212:第一過濾出氣口 212: First filter outlet
22:第一過濾件 22: First filter element
221:第一殼體 221: First shell
222:第一多孔元件 222: First porous element
2221:第一觸媒材料 2221: First catalyst material
223:第一離子吸附元件 223: First ion adsorption element
23:第一噴灑裝置 23: First spray device
231:第一噴頭 231: First nozzle
232:第一管路 232: First pipeline
233:液體切換閥 233: Liquid switching valve
24:循環管路 24: Circulation pipeline
25:監控模組 25: Monitoring module
26:酸鹼檢測儀 26: Acid and base detector
27:排酸控制裝置 27: Acid discharge control device
271:計時元件 271: Timing components
28:酸洗液體供應裝置 28: Pickling liquid supply device
282:液體供應管路 282: Liquid supply pipeline
30:第二過濾裝置 30: Second filter device
31:水洗腔室 31: Water washing chamber
311:第二過濾進氣口 311: Second filter air inlet
312:第二過濾出氣口 312: Second filter outlet
32:第二過濾件 32: Second filter element
321:第二殼體 321: Second shell
322:第二多孔元件 322: Second porous element
3221:第二觸媒材料 3221: Second catalyst material
323:第二離子吸附元件 323: Second ion adsorption element
33:第二噴灑裝置 33: Second spray device
331:第二噴頭 331: Second nozzle
332:第二管路 332: Second pipeline
34:水洗液體供應裝置 34: Washing liquid supply device
35:排水裝置 35: Drainage device
W1:第一液體 W1: First liquid
W2:第二液體 W2: Second liquid
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