TW202415200A - Variable management control system of dissipation shroud - Google Patents

Abstract

A dissipation shroud includes a bottom plate, a top plate, a wind guiding wall, a wind guiding groove, and a plurality of blades. The top plate is disposed over the bottom plate. The wind guiding wall is connected between the bottom plate and the top plate. The wind guiding wall has a plurality of ventilation apertures. The wind guiding groove passes through the wind guiding wall between the bottom plate and the top plate. The blades are disposed in the ventilation apertures, and the blades are pivotally connected to the wind guiding wall in the ventilation apertures.

Description

Heat dissipation hood and its variable management and control system

The present disclosure relates to a heat dissipation hood and a versatile management and control system thereof.

As the processing speed and performance of servers increase, the heat dissipation performance of the server has a greater impact on the performance of the entire system. The heat dissipation components of the server system can no longer reserve enough space to accommodate various electronic components. The lack of heat conductivity will cause the electronic components (such as the central processing unit (CPU)) to throttle or overheat. Therefore, in order to improve the heat dissipation performance, it is necessary to increase the air flow and heat dissipation area. In existing servers, the heat source is transferred from the heat plate to the heat pipe and then taken away by the fan. If the heat dissipation performance is to be improved, the heat dissipation area must be increased. The more load the computer or other electronic components have, the more power they consume and the more heat they generate. However, the configuration of the heat dissipation components of the existing server system can no longer meet the heat dissipation requirements of high-load electronic components.

Therefore, how to propose a heat dissipation hood and its variable management control system to achieve a more flexible and variable control effect is one of the problems that the industry is eager to invest research and development resources to solve.

In view of this, one purpose of the present disclosure is to provide a heat dissipation hood that can solve the above problems.

In order to achieve the above-mentioned purpose, according to one embodiment of the present disclosure, a heat dissipation hood includes a bottom plate, a top plate, an air guide wall, an air guide slot, and a plurality of fan blades. The top plate is arranged above the bottom plate. The air guide wall is connected between the bottom plate and the top plate. The air guide wall has a plurality of vents. The air guide slot passes through the air guide wall between the bottom plate and the top plate. The fan blade is arranged in the vent, and the fan blade is connected to the air guide wall in the vent.

In one or more embodiments of the present disclosure, the heat dissipation hood further includes two first side walls, two second side walls, and two third side walls. The first side wall is connected to both ends of the bottom plate. The second side wall is connected to the bottom plate between the first side walls. The third side wall is connected to the bottom plate between the first side walls. The air guide groove is at least defined by the top plate, one of the two second side walls, and one of the two third side walls, or at least defined by the top plate, the other of the two second side walls, and the other of the two third side walls.

In one or more embodiments of the present disclosure, the wind guide wall is connected between one of the two first side walls and one of the two second side walls, between the other of the two first side walls and the other of the two second side walls, and between the two third side walls.

In one or more embodiments of the present disclosure, the vent is disposed on a side of the air guide wall close to one of the two first side walls.

In one or more embodiments of the present disclosure, the heat dissipation hood further includes a plurality of connecting rods, baffles, and actuating elements. The connecting rods are connected to the fan blades. The baffles are connected to the connecting rods. The actuating element is disposed on the baffles and actuates the fan blades via the baffles and the connecting rods.

In order to achieve the above-mentioned purpose, according to one embodiment of the present disclosure, a multi-variable management and control system of a heat dissipation hood includes a heat dissipation hood, a fan and a processing unit. The heat dissipation hood includes a plurality of fan blades and an actuator. The fan blades are arranged in a plurality of vents of the heat dissipation hood. The actuator is configured to actuate the fan blades. The fan is adjacent to the heat dissipation hood. The processing unit is connected to the fan and the heat dissipation hood. The processing unit includes a thermal sensor and a temperature control element. The thermal sensor is configured to sense the temperature of the processing unit. The temperature control element is configured to control the fan and the actuator based on the temperature.

In one or more embodiments of the present disclosure, the heat dissipation hood further includes a plurality of connecting rods and baffles. The connecting rods are connected to the fan blades. The baffles are connected to the connecting rods, and the actuating element is disposed on the baffles.

In one or more embodiments of the present disclosure, the temperature control element is configured to: when the temperature of the processing unit is maintained constant, control the fan to reduce the fan's operating rate, and control the actuator to actuate the fan blades to increase the opening rate of the vent.

In one or more embodiments of the present disclosure, the temperature control element is configured to: when the temperature of the processing unit rises, control the fan to increase the fan's operating rate or control the actuator to actuate the fan blades to increase the opening rate of the vent.

In one or more embodiments of the present disclosure, the temperature control element is configured to: when the temperature of the processing unit drops, control the fan to reduce the fan's operating rate or control the actuator to actuate the fan blades to reduce the opening rate of the vent.

In summary, in the heat dissipation hood disclosed in the present invention, since the heat dissipation hood has an air guide groove, the airflow of the fan can be guided to the area of electronic components (for example, the central processing unit area) through the air guide groove. In the heat dissipation hood disclosed in the present invention, since the heat dissipation hood has an air vent, the airflow of the fan can be guided to the area of electronic components (for example, the memory card area) through the air vent. In the heat dissipation hood disclosed in the present invention, since the air vent is provided with adjustable fan blades, the opening rate of the air vent can be adjusted. In the variable management and control system of the heat dissipation hood disclosed in the present invention, since the variable management and control system includes a temperature control element, when the temperature of the processing unit changes, the temperature control element can control the fan to adjust the operation rate of the fan, so as to reduce the workload of the fan in time and extend the service life of the fan. In the multi-variable management and control system of the heat dissipation hood disclosed in the present invention, since the heat dissipation hood has a linkage rod, a baffle and an actuator, when the temperature of the processing unit changes, the actuator can be controlled by the temperature control element to adjust the swing of the fan blade to adjust the change of the opening rate of the vent. In this way, the multi-variable management and control system can control the fan and the fan blade according to the temperature of the processing unit to flexibly adjust the heat dissipation performance of the server system and avoid the problem of heat backflow.

The above description is only used to explain the problem to be solved by the present disclosure, the technical means for solving the problem, and the effects produced, etc. The specific details of the present disclosure will be introduced in detail in the following implementation method and related drawings.

The following will disclose multiple embodiments of the present disclosure with drawings. For the purpose of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present disclosure. In other words, in some embodiments of the present disclosure, these practical details are not necessary. In addition, in order to simplify the drawings, some commonly used structures and components will be depicted in the drawings in a simple schematic manner. The same reference numerals will be used to represent the same or similar components in all drawings.

The structure, function and connection relationship between each component included in the heat dissipation hood 100 of this embodiment will be described in detail below.

Please refer to FIG. 1. FIG. 1 is a schematic diagram of a heat dissipation hood 100 according to an embodiment of the present disclosure. In this embodiment, the heat dissipation hood 100 is disposed in a server chassis (not shown) and is adjacent to a plurality of fans (not shown) and electronic components (not shown, such as a central processing unit (CPU) and a memory (DIMM)). More specifically, the heat dissipation hood 100 is disposed between the fans and the electronic components and is configured to direct the airflow of the fans to the electronic components through the heat dissipation hood 100. In this embodiment, as shown in FIG. 1 , the heat dissipation hood 100 includes a bottom plate 110, a first side wall 120L, a first side wall 120R, a second side wall 122, a third side wall 124, a top plate 130, an air guide wall 140, and an air guide slot TN. The first side wall 120L and the first side wall 120R are connected to both ends of the bottom plate 110. The second side wall 122 is located between the first side wall 120L and the first side wall 120R and is connected to the bottom plate 110. The third side wall 124 is located between the first side wall 120L and the first side wall 120R and is connected to the bottom plate 110. The top plate 130 is connected to the first side wall 120L, the first side wall 120R, the second side wall 122, and the third side wall 124, and the top plate 130 is located above the bottom plate 110. The wind guide wall 140 is connected between the bottom plate 110 and the top plate 130. As shown in FIG. 1, the wind guide wall 140 also has a plurality of vents VO. In some embodiments, as shown in FIG. 1, the wind guide wall 140 is connected between the first side wall 120L and the second side wall 122. Alternatively, in some embodiments, as shown in FIG. 1, the wind guide wall 140 is connected between the first side wall 120R and the second side wall 122. Alternatively, in some embodiments, as shown in FIG. 1 , the air guide wall 140 is connected between two third side walls 124. The air guide slot TN is located between the bottom plate 110 and the top plate 130 and passes through the air guide wall 140. In some embodiments, as shown in FIG. 1 , the air guide slot TN is defined by at least the top plate 130, the second side wall 122, and the third side wall 124.

In some embodiments, the wind guide wall 140 extends in a first direction (e.g., direction X). In some embodiments, the first side wall 120L, the first side wall 120R, the second side wall 122, and the third side wall 124 extend in a second direction (e.g., direction Y). In some embodiments, the first direction is perpendicular to the second direction. In some embodiments, the first side wall 120L, the first side wall 120R, the second side wall 122, and the third side wall 124 extend from the bottom plate 110 along a third direction (e.g., direction Z) to the top plate 130.

In some embodiments, the number of the first sidewall 120L and the number of the first sidewall 120R are each one. In some embodiments, the number of the second sidewall 122 and the number of the third sidewall 124 are each two. However, the present disclosure is not intended to limit the number of the first sidewall 120L, the first sidewall 120R, the second sidewall 122, and the third sidewall 124.

Please refer to FIG. 2. FIG. 2 is a partial schematic diagram of a heat dissipation hood 100 according to one embodiment of the present disclosure. As shown in FIG. 2, the heat dissipation hood 100 further includes a plurality of fan blades 142. The fan blades 142 are located in the vent VO. In some embodiments, the fan blades 142 are pivotally connected to the wind guide wall 140 so that the fan blades 142 can swing relative to the wind guide wall 140. It should be noted that although FIG. 2 only shows that the fan blades 142 are provided in the vent VO between the first side wall 120R and the second side wall 122, in fact, the fan blades 142 can be provided in each vent VO on the wind guide wall 140.

The following will describe in detail how the fan blades 142 of this embodiment swing relative to the wind guide wall 140.

Please refer to FIG. 3. FIG. 3 is a schematic diagram of the vent VO and the fan blade 142 according to one embodiment of the present disclosure. In the present embodiment, as shown in FIG. 3, the fan blade 142 is located in the vent VO and is pivotally connected to the wind guide wall 140. In some embodiments, the fan blade 142 can be selectively actuated. For example, the phase of the fan blade 142 can be adjusted manually, but the present disclosure is not limited to this. From the perspective of FIG. 3, since the fan blade 142 is located in the vent VO, the fan blade 142 occupies a partial cross-sectional area of the vent VO. In the present embodiment, since the fan blade 142 occupies a relatively small portion of the cross-sectional area of the vent VO, the vent VO has a relatively large opening ratio in the scenario shown in FIG. 3. In a usage scenario, if the temperature of the processing unit rises, the user can manually adjust the phase of the fan blade 142 so that the vent VO has a larger opening rate, so that the air flow of the fan has a larger flux at the vent VO, thereby appropriately reducing the temperature of the processing unit.

Please refer to FIG. 4. FIG. 4 is another schematic diagram of the vent VO and the fan blade 142 according to one embodiment of the present disclosure. From the perspective of FIG. 4, since the fan blade 142 is located in the vent VO, the fan blade 142 occupies a portion of the cross-sectional area of the vent VO. In more detail, the fan blade 142 can be selectively actuated so that the fan blade 142 can be swung to occupy a relatively large portion of the cross-sectional area of the vent VO, thereby making the vent VO have a relatively small opening ratio in the scenario shown in FIG. 4. In a usage scenario, if the temperature of the processing unit decreases, the user can manually adjust the phase of the fan blade 142 so that the vent VO has a smaller opening ratio, so that the flux of the fan airflow in the vent VO is smaller, thereby appropriately reducing the temperature of the processing unit.

Next, another implementation method of swinging the fan blade 142 relative to the wind guide wall 140 of the present disclosure will be described in detail.

Please refer to FIG. 5. FIG. 5 is a schematic diagram of an actuator AE, an air vent VO, and a fan blade 142 according to an embodiment of the present disclosure. In this embodiment, as shown in FIG. 5, the heat dissipation hood 100 further includes an actuator AE. The actuator AE is disposed adjacent to the fan blade 142. The actuator AE is configured to actuate the fan blade 142.

Please refer to FIG. 6. FIG. 6 is a cross-sectional schematic diagram of the actuator element AE actuating the fan blade 142 according to one embodiment of the present disclosure. FIG. 6 shows another embodiment in which the fan blade 142 is swung relative to the wind guide wall 140 in more detail. In this embodiment, as shown in FIG. 6, the heat dissipation hood 100 further includes a plurality of connecting rods 144 and a baffle 146. The connecting rod 144 is connected to the fan blade 142. In more detail, each connecting rod 144 is respectively connected to each fan blade 142. As shown in FIG. 6, the baffle 146 is connected to the connecting rod 144. In more detail, the above-mentioned connecting rod 144 can be, for example, arranged on the baffle 146 at equal intervals. In the embodiment where the linkage rod 144 is evenly spaced on the baffle 146, the fan blades 142 are evenly spaced in the vent VO. In some embodiments, as shown in FIG. 6 , the actuating element AE is disposed on the baffle 146. With the aforementioned structural configuration, since the actuating element AE is disposed on the baffle 146, the actuating element AE can drive the linkage rod 144 to actuate the fan blades 142 via the baffle 146. Specifically, the actuating element AE can swing the fan blades 142 relative to the air guide wall 140 via the baffle 146 and the linkage rod 144. In one usage scenario, when the actuator AE receives a signal related to the temperature of the processing unit, for example, from the processing unit, the actuator AE can actuate the baffle 146 based on the signal related to the temperature of the processing unit (for example, move the baffle 146 relative to the air guide wall 140), and the connecting rod 144 disposed on the baffle 146 then links the fan blade 142 to make it swing relative to the air guide wall 140 to adjust the opening ratio of the vent VO.

In some embodiments, as shown in FIG. 6 , the linkage rod 144 and the actuating element AE are disposed on opposite sides of the baffle 146 . However, the present disclosure is not limited thereto.

In some implementations, the actuator AE may be a motor, a pneumatic valve, a solenoid valve, or other similar actuators.

In some embodiments, the fan blade 142 can be plastic or other similar materials. In some embodiments, the fan blade 142 can be a plastic heat sink or other similar heat dissipation materials. In some embodiments, the fan blade 142 can be a sheet, a strip or other similar shapes.

In some embodiments, the blades 142 are elongated and extend in a first direction (eg, direction X).

In some embodiments, the number of the blades 142 is the same as the number of the connecting rods 144. In some embodiments, as shown in FIG. 6 , the number of the blades 142 in the vent VO is five, but the present disclosure is not limited thereto. In some embodiments, the number of the blades 142 may be less than five or greater than five. For example, as shown in FIG. 1 , the number of the blades 142 in the vent VO between the two third side walls 124 may be three.

In some embodiments, the fan blade 142 swings relative to the wind guide wall 140 along a rotation axis parallel to the first direction (e.g., direction X), but the disclosure is not limited thereto. In some embodiments, the fan blade 142 swings relative to the wind guide wall 140 along a rotation axis parallel to the direction in which the wind guide wall 140 extends from the bottom plate 110 to the top plate 130.

Next, a heat dissipation hood 100A according to an embodiment of the present disclosure will be described.

Please refer to FIG. 7. FIG. 7 is a top view of a heat dissipation hood 100A according to an embodiment of the present disclosure. The structural configuration of the heat dissipation hood 100A in FIG. 7 is substantially the same as the structural configuration of the heat dissipation hood 100 in FIG. 1. The difference between the heat dissipation hood 100A and the heat dissipation hood 100 is that the heat dissipation hood 100A has a vent VO only on one side of its air guide wall 140 close to the first side wall 120R. Specifically, the heat dissipation hood 100A does not have a vent VO between the first side wall 120L and the second side wall 122, and the heat dissipation hood 100A has only two vents VO on one side (i.e., the right side) close to the first side wall 120R on the air guide wall 140 located between the two third side walls 124. For example, in the process of manufacturing the heat dissipation hood 100A, the vent VO may not be formed between the first side wall 120L and the second side wall 122, and the vent VO may not be formed on one side (i.e., the left side) of the air guide wall 140 located between the two third side walls 124 close to the first side wall 120L. Alternatively, in some embodiments, the user may attach a sheet of Mylar, for example, to cover the vent VO on the side of the air guide wall 140 located between the first side wall 120L and the second side wall 122 and between the two third side walls 124 of the heat dissipation hood 100 near the first side wall 120L, so as to form a heat dissipation hood 100A that can achieve the same effect. In a usage scenario, if the electronic components (e.g., central processing unit (CPU) and memory (DIMM)) near the first side wall 120R in the server chassis have a relatively large heat dissipation requirement, the heat dissipation hood 100A may be used to appropriately reduce the temperature of the electronic components.

Next, another implementation of the heat dissipation hood 100 disclosed herein will be described.

Please refer to FIG. 8. FIG. 8 is a top view of a heat dissipation hood 100B according to an embodiment of the present disclosure. The structural configuration of the heat dissipation hood 100B in FIG. 7 is substantially the same as the structural configuration of the heat dissipation hood 100 in FIG. 1. The difference between the heat dissipation hood 100B and the heat dissipation hood 100 is that the heat dissipation hood 100B has a vent VO only on one side of its air guide wall 140 close to the first side wall 120L. Specifically, the heat dissipation hood 100B does not have a vent VO between the first side wall 120R and the second side wall 122, and the heat dissipation hood 100B has only two vents VO on one side (i.e., the left side) close to the first side wall 120L on the air guide wall 140 located between the two third side walls 124. For example, in the process of manufacturing the heat dissipation hood 100B, the vent VO may not be formed between the first side wall 120R and the second side wall 122, and the vent VO may not be formed on one side (i.e., the right side) of the air guide wall 140 located between the two third side walls 124 close to the first side wall 120R. Alternatively, in some embodiments, the user may attach a sheet of Mylar, for example, to cover the vent VO on the side of the air guide wall 140 located between the first side wall 120R and the second side wall 122 and between the two third side walls 124 of the heat dissipation hood 100 near the first side wall 120R, so as to form a heat dissipation hood 100B that can achieve the same effect. In a usage scenario, if the electronic components (for example, the central processing unit (CPU) and the memory (DIMM)) near the first side wall 120L in the server chassis have a relatively large heat dissipation requirement, the heat dissipation hood 100B may be used to appropriately reduce the temperature of the electronic components.

It should be noted that the structural configuration of each component of the heat dissipation hood 100A in FIG. 7 and the heat dissipation hood 100B in FIG. 8 is only given as an example for simple explanation. In practice, the manufacturer can form one or more vents VO at different positions on the air guide wall 140 according to different usage requirements to enhance the heat dissipation performance of the electronic components.

Next, the relationship between the operating rate of the fan and the opening rate of the vent VO in different usage scenarios of the present disclosure will be described.

Please refer to FIG. 9. FIG. 9 is a table showing the relationship between the fan operation rate and the opening rate of the vent VO according to an embodiment of the present disclosure. More specifically, FIG. 9 shows the configuration of several fan operation rates and the opening rate of the vent VO under a constant temperature state of the processing unit. In a usage scenario, if the temperature of the processing unit is kept constant, the processing unit can simultaneously control the phase of the fan and the fan blade 142 disposed in the vent VO. For example, the processing unit can control the operation rate of the fan to be 25% and the opening rate of the vent VO to be 100%, or can control the operation rate of the fan to be 50% and the opening rate of the vent VO to be 50%, or can control the operation rate of the fan to be 75% and the opening rate of the vent VO to be 25%, or can control the operation rate of the fan to be 100% and the opening rate of the vent VO to be 0%. In the implementation mode of the configuration with a relatively low operation rate of the fan, the working load of the fan can be reduced and the service life of the fan can be extended.

Please refer to FIG. 10. FIG. 10 is a table showing the relationship between the processing unit temperature, the fan operating rate, and the vent VO opening rate according to one embodiment of the present disclosure. In more detail, FIG. 10 illustrates the configuration of several fan operating rates and the vent VO opening rates of the processing unit under different temperature conditions. In a usage scenario, the processing unit can control the phase of the fan blade 142 disposed in the vent VO according to the change of its temperature. Specifically, when the processing unit temperature is higher, the vent VO opening rate is also higher, and when the processing unit temperature is lower, the vent VO opening rate is also lower. For example, as shown in FIG. 10, when the temperature of the processing unit is high, the processing unit can control the operation rate of the fan to be 100% and the opening rate of the vent VO to be 100%, or when the temperature of the processing unit is second highest, the processing unit can control the operation rate of the fan to be 100% and the opening rate of the vent VO to be 90%, or when the temperature of the processing unit is second lowest, the processing unit can control the operation rate of the fan to be 100% and the opening rate of the vent VO to be 80%, or when the temperature of the processing unit is low, the processing unit can control the operation rate of the fan to be 100% and the opening rate of the vent VO to be 70%. In the above embodiment of the configuration in which the operation rate of the fan is maintained constant, the phase of the fan blade 142 in the vent VO can be adaptively changed according to the temperature of the processing unit.

Next, how the variable management control system 1100 of the heat dissipation hood 100 according to one embodiment of the present disclosure controls the fan F and each component of the heat dissipation hood 100 will be described in detail.

Please refer to Figure 11. Figure 11 is a schematic diagram of a variable management and control system 1100 according to one embodiment of the present disclosure. In this embodiment, the variable management and control system 1100 includes a processing unit PU, a fan F and a heat dissipation hood 100. The processing unit PU is connected to the fan F and the heat dissipation hood 100. The processing unit PU includes a thermal sensor TS and a temperature control element TC. The fan F is arranged adjacent to the heat dissipation hood 100. The heat dissipation hood 100 includes at least an actuator element AE and a fan blade 142. In some embodiments, the heat dissipation hood 100 further includes a linkage rod 144 and a baffle 146. It should be noted that the other components of the heat dissipation hood 100 have been described in detail above, so they will not be repeated here. In some embodiments, the multi-variable management control system 1100 uses an algorithm that uses the reading of the temperature sensed by the thermal sensor TS of the processing unit PU as its input parameter. When the temperature control element TC receives the above input parameter, it will periodically evaluate the temperature around the area of the processing unit PU (i.e., the temperature sensed by the thermal sensor TS), and apply the above algorithm to control the fan F and the fan blades 142 based on the above temperature judgment. Through the above structural configuration, the thermal sensor TS of the processing unit PU senses the temperature of the processing unit PU, and the temperature control element TC of the processing unit PU controls the fan F and the actuator AE based on the above temperature. Specifically, the temperature control element TC is configured to control the fan F to adjust the operating rate of the fan F, and control the actuator AE to actuate the fan blades 142 to adjust the opening rate of the vent VO. The fan F provides air flow through the heat dissipation hood 100 to the processing unit PU to dissipate heat from the processing unit PU.

Please refer to Figure 9 and Figure 11 at the same time. In a usage scenario, when the temperature of the processing unit PU is kept constant, the temperature control element TC controls the fan F to reduce the operating rate of the fan F, and controls the actuator AE to actuate the blade 142 to increase the opening rate of the vent VO. Alternatively, the temperature control element TC controls the fan F to increase the operating rate of the fan F, and controls the actuator AE to actuate the blade 142 to reduce the opening rate of the vent VO.

Please refer to Figure 10 and Figure 11. In one use scenario, when the temperature of the processing unit PU rises, the temperature control element TC controls the actuator element AE to actuate the fan blade 142 to increase the opening rate of the vent VO. When the temperature of the processing unit PU drops, the temperature control element TC controls the actuator element AE to actuate the fan blade 142 to reduce the opening rate of the vent VO.

Alternatively, in other embodiments, when the temperature of the processing unit PU rises, the temperature control element TC controls the fan F to increase the operating rate of the fan F. When the temperature of the processing unit PU drops, the temperature control element TC controls the fan F to reduce the operating rate of the fan F.

In some embodiments, the thermal sensor TS can be a temperature sensor or other similar sensor.

In some implementations, the temperature control element TC may be a baseboard management controller (BMC) chip or other similar temperature control elements.

In some implementations, the algorithm described above may be related to a thermal throttling algorithm in the BMC specification.

From the above detailed description of the specific implementation of the present disclosure, it can be clearly seen that in the heat dissipation hood of the present disclosure, since the heat dissipation hood has an air guide groove, the wind flow of the fan can be directed to the area of the electronic components (for example, the central processing unit area) through the air guide groove. In the heat dissipation hood of the present disclosure, since the heat dissipation hood has an air vent, the wind flow of the fan can be directed to the area of the electronic components (for example, the memory card area) through the air vent. In the heat dissipation hood of the present disclosure, since the air vent is provided with an adjustable fan blade, the opening rate of the air vent can be adjusted. In the multi-variable management and control system of the heat dissipation hood disclosed in the present invention, since the multi-variable management and control system includes a temperature control element, when the temperature of the processing unit changes, the temperature control element can control the fan to adjust the fan's operating rate, so as to timely reduce the fan's workload and extend the fan's service life. In the multi-variable management and control system of the heat dissipation hood disclosed in the present invention, since the heat dissipation hood has a linkage rod, a baffle and an actuator, when the temperature of the processing unit changes, the actuator can be controlled by the temperature control element to adjust the swing of the fan blades to adjust the change in the opening rate of the vent. In this way, the multi-variable management and control system can control the fan and the fan blades according to the temperature of the processing unit to flexibly adjust the heat dissipation performance of the server system and avoid the problem of heat backflow.

In one embodiment of the present disclosure, the heat dissipation hood of the present disclosure can be applied to a server, which can be used for artificial intelligence (AI) computing, edge computing, and can also be used as a 5G server, cloud server, or Internet of Vehicles server.

Although the present disclosure has been disclosed in the above implementation form, it is not intended to limit the present disclosure. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be determined by the scope of the attached patent application.

100,100A,100B: heat dissipation hood 110: bottom plate 120L,120R: first side wall 122: second side wall 124: third side wall 130: top plate 140: air guide wall 142: fan blade 144: linkage rod 146: baffle 1100: variable management control system AE: actuator element F: fan PU: processing unit TC: temperature control element TN: air guide slot TS: thermal sensor VO: vent X,Y,Z: direction

In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more clearly understandable, the attached drawings are described as follows: FIG. 1 is a schematic diagram of a heat dissipation hood according to an embodiment of the present disclosure. FIG. 2 is a partial schematic diagram of a heat dissipation hood according to an embodiment of the present disclosure. FIG. 3 is a schematic diagram of a vent and a fan blade according to an embodiment of the present disclosure. FIG. 4 is another schematic diagram of a vent and a fan blade according to an embodiment of the present disclosure. FIG. 5 is a schematic diagram of an actuating element, a vent and a fan blade according to an embodiment of the present disclosure. FIG. 6 is a cross-sectional schematic diagram of an actuating element actuating a fan blade according to an embodiment of the present disclosure. FIG. 7 is a top view of a heat dissipation hood according to an embodiment of the present disclosure. FIG. 8 is a top view of a heat dissipation hood according to an embodiment of the present disclosure. FIG. 9 shows a table showing the relationship between the fan operation rate and the vent opening rate according to one embodiment of the present disclosure. FIG. 10 shows a table showing the relationship between the processing unit temperature, the fan operation rate and the vent opening rate according to one embodiment of the present disclosure. FIG. 11 shows a functional block diagram of a multi-variable management control system according to one embodiment of the present disclosure.

100: Heat dissipation hood

110: Base plate

120L,120R: First side wall

122: Second side wall

124: Third side wall

130: Top plate

140: Wind deflector wall

TN: air guide slot

VO:Ventilation vent

X,Y,Z: Direction

Claims (10)

A heat dissipation hood comprises: a bottom plate; a top plate disposed above the bottom plate; an air guide wall connected between the bottom plate and the top plate and having a plurality of vents; an air guide slot passing through the air guide wall between the bottom plate and the top plate; and a plurality of fan blades disposed in the vents, and the fan blades are pivotally connected to the air guide wall in the vents. The heat dissipation hood as described in claim 1 further comprises: Two first side walls connected to the two ends of the bottom plate; Two second side walls connected to the bottom plate between the two first side walls; and Two third side walls connected to the bottom plate between the two first side walls, wherein the air guide groove is defined by at least the top plate, one of the two second side walls and one of the two third side walls, or at least the top plate, the other of the two second side walls and the other of the two third side walls. A heat dissipation hood as described in claim 2, wherein the air guide wall is connected between one of the two first side walls and one of the two second side walls, between the other of the two first side walls and the other of the two second side walls, and between the two third side walls. A heat dissipation hood as described in claim 3, wherein the vents are arranged on one side of the air guide wall close to the one of the two first side walls. The heat dissipation hood as described in claim 1 further comprises: A plurality of linkage rods connected to the fan blades; A baffle connected to the linkage rods; and An actuating element disposed on the baffle and actuating the fan blades via the baffle and the linkage rods. A variable management control system for a heat dissipation hood, comprising: A heat dissipation hood, comprising: A plurality of fan blades, arranged in a plurality of vents of the heat dissipation hood; and An actuating element, configured to actuate the fan blades; A fan, adjacent to the heat dissipation hood; and A processing unit, connected to the fan and the heat dissipation hood and comprising a thermal sensor and a temperature control element, wherein the thermal sensor is configured to sense a temperature of the processing unit, and the temperature control element is configured to control the fan and the actuating element based on the temperature. A variable management control system as described in claim 6, wherein the heat dissipation hood further comprises: a plurality of linkage rods connected to the fan blades; and a baffle connected to the linkage rods, and the actuating element is disposed on the baffle. A variable management control system as described in claim 6, wherein the temperature control element is configured to: When the temperature of the processing unit is kept constant, control the fan to reduce a running rate of the fan, and control the actuator to actuate the fan blades to increase an opening rate of the vents. A variable management control system as described in claim 6, wherein the temperature control element is configured to: When the temperature of the processing unit rises, control the fan to increase an operating rate of the fan or control the actuator to actuate the fan blades to increase an opening rate of the vents. A variable management control system as described in claim 6, wherein the temperature control element is configured to: When the temperature of the processing unit drops, control the fan to reduce an operating rate of the fan or control the actuator to actuate the fan blades to reduce an opening rate of the vents.

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