TW202415161A - Bar code reproduction method of circuit board and bar code reproduction device of circuit board - Google Patents

Abstract

The invention discloses a bar code reproducing method of a circuit board and a bar code reproducing equipment of the circuit board. The barcode reproducing method of the circuit board includes an image capturing step, an area demarcation step, a removing step, an oxide layer removing step, a protective layer forming step and a bar code generating step. In the image capturing step, the area demarcation step and the removing step, a laser is used to remove the to-be-reproduced area of the circuit board. The area to be reproduced contains an incorrect barcode. The oxide layer removing step is to remove the oxide layer in the to-be-reproduced area. The protective layer forming step and the barcode generating step are to form a new protective layer in the to-be-reproduced area first, and then use a laser to form a correct barcode in the to-be-reproduced area. The invention can remove the wrong bar code of the circuit board, and form the correct bar code on the circuit board, so that the circuit board does not need to be scrapped.

Description

Circuit board barcode reproducing method and circuit board barcode reproducing device

The present invention relates to a barcode reproducing method, and more particularly to a barcode reproducing method for a circuit board and a barcode reproducing device for a circuit board.

In the prior art, the relevant circuit board manufacturers will form a two-dimensional barcode on the circuit board to control the circuit board. During the manufacturing process, if the two-dimensional barcode formed on the circuit board is found to be damaged, the circuit board will be directly scrapped, thus causing waste.

The present invention discloses a circuit board barcode reproducing method and circuit board barcode reproducing equipment, which are mainly used to improve the existing technology. If the two-dimensional barcode on the circuit board is damaged, the circuit board will be directly scrapped, thereby causing waste.

One embodiment of the present invention discloses a circuit board barcode remaking method, which is used to remove an erroneous barcode of a circuit board to be remade and form a correct barcode on the circuit board to be remade. The circuit board barcode remaking method comprises: an image capturing step: using an image capturing device to capture at least one image of the circuit board to be remade; an area calibration step: using a control The device finds an error barcode area of the error barcode of the circuit board to be remade in the image, and defines a remade area on the circuit board to be remade according to the error barcode area, and the remade area covers the entire error barcode area; a removal step: controlling a laser device to emit a laser to irradiate the remade area to remove all protective layers on the circuit board to be remade in the remade area. The invention discloses a method for producing a copper layer in a region of the circuit board to be remade, wherein after the laser emitted by the laser device irradiates an exposed region without a protective layer in the region to be remade, an oxide layer will be formed on the surface of the exposed region; the error barcode is composed of a plurality of exposed regions; an oxide layer removal step: removing all oxide layers in the region to be remade; a protective layer formation step: forming a new protective layer of a predetermined thickness in the region to be remade; the difference between the predetermined thickness and the thickness of the protective layer in the region not to be remade of the remade circuit board is less than 20 micrometers (μm); a barcode generation step: controlling the laser device to emit a laser, and removing part of the new protective layer in the region to be remade where the new protective layer is formed, so as to form the correct barcode.

One embodiment of the present invention discloses a circuit board barcode remaking device, which is used to remove an erroneous barcode on a circuit board to be remade and form a correct barcode on the circuit board to be remade. The circuit board barcode remaking device includes: an image capture device, a control device, a laser device, a deoxidation device and a protective layer forming device. The image capture device is used to capture the circuit board to be remade to generate an image; the control device is electrically connected to the image capture device, and the control device can find an error barcode area of the error barcode of the circuit board to be remade in the image, and determine a remade area on the circuit board to be remade according to the error barcode area, and the control device can generate coordinate information corresponding to the remade area; wherein the remade area covers the entire The laser device is electrically connected to the control device, and the control device can transmit coordinate information to the laser device. The laser device can irradiate the area to be remade according to the coordinate information to remove all protective layers of the circuit board to be remade in the area to be remade, so that a copper layer of the circuit board to be remade in the area to be remade is completely exposed; wherein, the laser emitted by the laser device passes through an exposed area without a protective layer in the area to be remade, and the exposed area An oxide layer will be formed on the surface of the area to be remade; the error barcode is composed of multiple exposed areas; the deoxidation device is electrically connected to the control device, the control device can transmit coordinate information to the deoxidation device, and the deoxidation device can remove all oxide layers in the area to be remade according to the coordinate information; the protective layer forming device is electrically connected to the control device, the control device can transmit coordinate information to the protective layer forming device, and the protective layer forming device can Mark information is provided to form a new protective layer of a predetermined thickness in the area to be remade; the difference between the predetermined thickness and the thickness of the protective layer of the remade circuit board in the non-to-be-remade area is less than 20 microns (μm); wherein the control device can control the protective layer forming device to control the laser device to emit a laser after forming a new protective layer of the predetermined thickness in the area to be remade, thereby forming a correct barcode in the area to be remade with the new protective layer.

In summary, the circuit board barcode remaking method and circuit board barcode remaking device of the present invention can remake the barcode of the circuit board if the barcode on the circuit is found to be damaged during the manufacturing process of the circuit board. This can effectively improve the waste problem in the prior art where the circuit board must be scrapped because the barcode on the circuit board is damaged.

To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and do not limit the protection scope of the present invention.

In the following description, if it is indicated to refer to a specific figure or as shown in a specific figure, it is only used to emphasize that most of the relevant content described in the subsequent description appears in the specific figure, but it does not limit the subsequent description to only refer to the specific figure.

Please refer to FIG. 1, which is a schematic diagram of the process of the circuit board barcode remaking method of the present invention. The circuit board barcode remaking method of the present invention is used to remove an erroneous barcode of a circuit board to be remade and form a correct barcode on the circuit board to be remade. The circuit board barcode remaking method includes:

An image capturing step S11: using an image capturing device to capture at least one image (picture) of the circuit board to be reproduced;

An area marking step S12: using a control device to find an error barcode area of the error barcode of the circuit board to be remade in the image, and defining an area to be remade on the circuit board to be remade according to the error barcode area, wherein the area to be remade covers the entire error barcode area;

A removal step S13: controlling a laser device to emit a laser to irradiate the area to be remade, so as to remove all protective layers of the circuit board to be remade in the area to be remade, and expose a copper layer of the circuit board to be remade in the area to be remade; wherein, after the laser emitted by the laser device irradiates an exposed area without the protective layer in the area to be remade, an oxide layer will be formed on the surface of the exposed area; the error barcode is composed of a plurality of exposed areas;

An oxidation layer removal step S14: removing all oxidation layers in the area to be reworked;

A protective layer forming step S15: forming a new protective layer of a predetermined thickness in the area to be reworked; the difference between the predetermined thickness and the thickness of the protective layer in the non-to-be-reworked area of the reworked circuit board is less than 20 micrometers (μM);

A barcode generation step S16: controlling the laser device to emit a laser, and removing part of the new protective layer in the area to be remade where the new protective layer is formed, so as to form the correct barcode.

Please refer to Figures 2 and 3 together. Figure 2 is a schematic diagram of a circuit board to be remade, and Figure 3 is a partial cross-sectional schematic diagram of a circuit board to be remade. The circuit board A to be remade includes a circuit area A1 and a non-circuit area (i.e., the area of the non-circuit area A1 in Figure 2). The circuit area A1 is used to set at least one electronic component A2, and the non-circuit area is an area of the circuit board A to be remade where no electronic components are set.

The surface of the non-circuit area of the circuit board A to be remade has a protective layer A3. For example, the protective layer A3 can be green (but not limited to) solder mask. The error barcode B is located in the non-circuit area, and the error barcode B is composed of areas without the protective layer A3. In other words, the error barcode B seen by the relevant personnel in the non-circuit area of the circuit board A to be remade is composed of multiple exposed copper areas of the circuit board A to be remade without the protective layer A3.

More specifically, the error barcode B on the circuit board A to be remade is formed by using a laser device 3 to irradiate specific positions of the non-circuit area of the circuit board A to be remade to remove the protective layer A3 at the specific positions, thereby exposing the copper layer A4 at the specific positions of the circuit board A to be remade, thereby forming a two-dimensional barcode.

As described above, since the barcode of the circuit board A to be remade is composed of the copper layer A4 exposed to the outside of the circuit board A to be remade, and in the removal step S13, the laser is irradiated to the entire area 112 to be remade of the circuit board A to be remade, therefore, the position in the area 112 to be remade where there is no protective layer A3 will be oxidized and form an oxide layer on its surface after being irradiated by the laser in the removal step S13. For this reason, it is necessary to use the oxide layer removal step S14 to first remove the oxide layer in the area 112 to be remade, so as to facilitate the formation of a new protective layer on the area 112 to be remade in the subsequent protective layer formation step S15. In other words, if the protective layer forming step S15 is directly performed without performing the oxidation layer removing step S14 after the removing step S13, the new protective layer may not be formed smoothly in the area to be remade, or the new protective layer in the area to be remade may appear uneven.

In actual application, in the oxide layer removal step S14, for example, a sandblasting device or a grinding device may be used to perform a sandblasting operation or a grinding operation on the area to be remade 112 to remove all oxide layers in the area to be remade 112. However, the method and device for removing the oxide layer are not limited to sandblasting or grinding and can be selected according to actual needs.

In one preferred embodiment, in the removal step S13, the laser device 3 may be controlled to emit a laser of a first energy, and in the barcode generation step S16, the laser device 3 may be controlled to emit a laser of a second energy. The first energy is greater than the second energy. That is, in the removal step S3, a relatively high-power laser is used to irradiate the area to be remade 112 to effectively remove all protective layers in the area to be remade 112, and in the barcode generation step S16, a relatively low-power laser may be used to remove part of the new protective layer to form a correct barcode.

It should be particularly emphasized that the second energy laser is capable of removing the new protective layer, thereby exposing part of the copper layer A4 of the circuit board A to be remade in the area 112 to be remade, thereby forming a correct barcode, and the power of the first energy laser is greater than the power of the second energy laser, thereby ensuring that in the removal step S13, the protective layer in the area 112 to be remade or the structure related to the protective layer can be removed, thereby exposing all the copper layer A4 of the circuit board A to be remade in the area 112 to be remade.

In more detail, the applicant has discovered through repeated experiments that if a laser with the same power as that used in the barcode generation step S16 is used in the removal step S13, then after the removal step S13, some of the protective layer or its related layered structure may still remain in the area to be remade 112. This will directly affect the new protective layer formed in the subsequent protective layer formation step S15.

Please refer to FIG. 4, which is a schematic diagram of an image captured by the image capture device. In practical applications, in the area calibration step S12, the control device may perform an image analysis on the image 11 to first find a boundary of the error barcode, and the range surrounded by the boundary is the error barcode area 111, and the control device may use the boundary plus a predetermined distance to determine the area to be reproduced 112, and after the control device determines the area to be reproduced 112, Generate coordinate information corresponding to the area to be remade 112, and transmit the coordinate information to the laser device; and in the removal step S13, the laser device 3 can move to the top of the corresponding position of the circuit board to be remade according to the coordinate information, and irradiate the area to be remade of the circuit board to be remade, so as to remove the area of the circuit board to be remade that originally has the error barcode and a part of the area outside the error barcode.

In practice, if in the removal step S12, only all protective layers within the boundary corresponding to the erroneous barcode B (i.e., the erroneous barcode area 111) are removed, it is possible that part of the barcode is not removed due to various measurement errors, movement errors, etc. Therefore, in the removal step S12 of the present invention, the control device controls the laser device to irradiate the area to be remade of the circuit board to be remade with a laser, rather than only irradiating the erroneous barcode area with a laser. In this way, it can be ensured that all erroneous barcodes of the circuit board to be remade are removed.

It is worth mentioning that in one of the preferred embodiments, before the protective layer forming step S1, a thickness obtaining step is also included: a thickness information including a predetermined thickness is obtained by using a control device; and in the protective layer forming step S15, a protective layer forming device is used to form a new protective layer of a predetermined thickness on the area to be remade according to the thickness information. For example, the control device may obtain the thickness information through a remote server, various computers, etc., or the control device may display a setting interface in a display device, and the control device is connected to an input device (such as a keyboard, a mouse, a touch screen, etc.), and the relevant personnel may operate the input device to input the thickness of the protective layer of the current circuit board to be remade in the setting interface, and the control device can generate the thickness information accordingly.

Similarly, before the barcode generation step S16, a correct barcode acquisition step may be included: a barcode information including a correct barcode is acquired by the control device; and in the barcode generation step S16, the laser device is made to form a correct barcode in the area to be remade where the new protective layer is formed according to the barcode information. In different embodiments, the control device may also acquire the thickness information and the barcode information from a remote server, various computers, etc. at the same time before the protective layer formation step S1.

As mentioned above, in a preferred embodiment, in the barcode generation step S16, the laser device can adjust the current power according to the thickness information, and remove part of the new protective layer in the area to be remade where the new protective layer is formed according to the barcode information. In this way, it can be ensured that the laser device can effectively remove part of the new protective layer in the area to be remade where the new protective layer is formed.

In practice, the thickness of the protective layer of the circuit board to be remade whose barcode needs to be remade may be exactly the same. Therefore, the thickness information of the protective layer of the current circuit board to be remade is obtained through the thickness acquisition step, and the protective layer forming device and the laser device respectively use the thickness information to form a new protective layer and remove the new protective layer. This can ensure that the protective layer forming device forms a new protective layer on the circuit board to be remade with approximately the same thickness as other areas that are not the areas to be remade, and can also ensure that the laser device can effectively remove part of the new protective layer in the barcode generation step S16 to form a relatively clear and correct barcode.

As described above, the circuit board barcode remaking method of the present invention can remove the erroneous barcode on the circuit board to be remade and re-form the correct barcode on the circuit board to be remade, so that the circuit board to be remade can be used again without being discarded.

Please refer to FIG5, which is a block diagram of the circuit board barcode remaking device of the present invention. The circuit board barcode remaking device 100 of the present invention is used to remove an erroneous barcode of a circuit board to be remade and form a correct barcode on the circuit board to be remade. The circuit board barcode remaking device 100 includes: an image capture device 1, a control device 2, a laser device 3, a deoxidation device 4 and a protective layer forming device 5. In actual application, the image capture device 1, the control device 2, the laser device 3, the deoxidation device 4 and the protective layer forming device 5 can be jointly arranged on a frame and covered by at least one casing, but is not limited thereto. In different embodiments, the image capture device 1, the control device 2 and the laser device 3 can be arranged in the same frame and casing, while the deoxidation device 4 and the protective layer forming device 5 are arranged in another frame and casing, and the circuit board can be transported between the two by means of a conveyor belt or the like.

In one specific embodiment, the control device 2 of the circuit board barcode reproducing device 100 can execute the circuit board barcode reproducing method of the present invention to remove an erroneous barcode of a circuit board to be reproducible and form a correct barcode on the circuit board to be reproducible.

The image capture device 1 is used to capture the image of the circuit board to be remade to generate an image 11. The image capture device 1 can be, for example, various cameras, video recorders, etc., which are not limited here. The control device 2 is electrically connected to the image capture device 1. The control device 2 can find an error barcode area of the error barcode of the circuit board to be remade in the image 11, and define an area to be remade on the circuit board to be remade according to the error barcode area, and the control device 2 can generate coordinate information corresponding to the area to be remade. For the description of the error barcode area and the area to be remade, please refer to the aforementioned embodiment, which will not be elaborated here. The control device 2 can be, for example, various computers, remote servers, etc., which are not limited here. In practical applications, the control device 2 can be, for example, various computers, remote servers, etc., which are not limited here.

The laser device 3 is electrically connected to the control device 2. The control device 2 can transmit coordinate information to the laser device 3. The laser device 3 can irradiate the area to be remade according to the coordinate information to remove all protective layers of the circuit board to be remade in the area to be remade, so that a copper layer of the circuit board to be remade in the area to be remade is completely exposed; wherein, after the laser emitted by the laser device 3 passes through an exposed area without a protective layer in the area to be remade, an oxide layer will be formed on the surface of the exposed area; the error barcode is composed of multiple exposed areas.

The deoxidation device 4 is electrically connected to the control device 2. The control device 2 can transmit coordinate information to the deoxidation device 4. The deoxidation device 4 can remove all oxide layers in the area to be remade according to the coordinate information. In practical applications, the deoxidation device 4 can be, for example, a sandblasting device or a grinding device. The sandblasting device or the grinding device can be controlled by the control device 2 to perform a sandblasting operation or a grinding operation on the area to be remade to remove all oxide layers in the area to be remade.

The protective layer forming device 5 is electrically connected to the control device 2. The control device 2 can transmit coordinate information to the protective layer forming device 5. The protective layer forming device 5 can form a new protective layer of a predetermined thickness in the area to be remade according to the coordinate information. The difference between the predetermined thickness and the thickness of the protective layer of the non-remade area of the remade circuit board is less than 20 microns (μM).

The control device 2 can control the protective layer forming device 5 to form a new protective layer of a predetermined thickness in the area to be remade, and then control the laser device 3 to emit a laser to form a correct barcode in the area to be remade with the new protective layer.

It is worth mentioning that in a preferred embodiment, the control device 2 can control the laser device 3 to emit a laser of a first energy to remove all protective layers of the circuit board to be remade in the area to be remade, and the control device 2 can control the laser device 3 to emit a laser of a second energy to form a correct barcode in the area to be remade with a new protective layer; wherein the first energy is greater than the second energy. For a detailed description of the first energy and the second energy, please refer to the description of the aforementioned embodiment, which will not be repeated here.

In actual application, the control device 2 can obtain a thickness information 200 including a predetermined thickness 201 and a barcode information 300 including a correct barcode 301 through a network or various input devices (such as a keyboard, a mouse, a touch device, etc.), and the control device 2 can transmit the thickness information 200 to the protective layer forming device 5, and the protective layer forming device 5 can form a new protective layer of a predetermined thickness on the area to be remade according to the thickness information 200. The control device 2 can also transmit the barcode information 300 to the laser device 3, and the laser device 3 can remove part of the new protective layer in the area to be remade where the new protective layer is formed according to the barcode information 300, so as to form a correct barcode in the area to be remade.

As described above, the circuit board barcode remaking device 100 of the present invention can first remove the erroneous barcode on the circuit board to be remade, and then form a correct barcode at approximately the same position on the circuit board to be remade, so that the circuit board to be remade with the erroneous barcode does not need to be scrapped.

The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the contents of the specification and drawings of the present invention are included in the protection scope of the present invention.

A: Circuit board to be remade A1: Circuit area A2: Electronic components A3: Protective layer A4: Copper layer B: Error barcode 100: Circuit board barcode remaking equipment 1: Image capture device 11: Image 111: Error barcode area 112: Area to be remade 2: Control device 3: Laser device 4: Deoxidation device 5: Protective layer forming device 200: Thickness information 201: Expected thickness 300: Barcode information 301: Correct barcode

FIG1 is a schematic diagram of the process of the barcode reproducing method of the circuit board of the present invention;

FIG2 is a schematic top view of a circuit board to be remade;

FIG3 is a partial cross-sectional diagram of an erroneous barcode of a circuit board to be remade;

FIG4 is a schematic diagram of an image captured by an image capturing device in the circuit board barcode reproducing method of the present invention;

FIG. 5 is a block diagram of a circuit board barcode reproducing device according to the present invention.

S11~S16: Process steps

Claims (10)

A circuit board barcode remaking method is used to remove the erroneous barcode of the circuit board to be remade and form a correct barcode on the circuit board to be remade. The circuit board barcode remaking method comprises: Image capture step: using an image capture device to capture at least one image of the circuit board to be remade; Area calibration step: using a control device to find the erroneous barcode area of the erroneous barcode of the circuit board to be remade in the image, and according to the erroneous barcode area, define the area to be remade on the circuit board to be remade, and the area to be remade covers the entire erroneous barcode area; Removal step: control the laser device to emit laser, irradiate the area to be remade, so as to remove all protective layers of the circuit board to be remade in the area to be remade, and expose the copper layer of the circuit board to be remade in the area to be remade; wherein, after the laser emitted by the laser device irradiates the exposed area without protective layer in the area to be remade, an oxide layer will be formed on the surface of the exposed area; the error barcode is composed of multiple exposed areas; Oxide layer removal step: remove all the oxide layers in the area to be remade; Protective layer formation step: form a new protective layer of a predetermined thickness in the area to be remade; the difference between the predetermined thickness and the thickness of the protective layer of the remade circuit board in the non-area to be remade is less than 20 microns (μm); Barcode generation step: Control the laser device to emit laser, and remove part of the new protective layer in the area to be remade where the new protective layer is formed, so as to form the correct barcode. The barcode remaking method for a circuit board as described in claim 1, wherein, in the oxide layer removal step, a sandblasting device or a grinding device is used to perform a sandblasting operation or a grinding operation on the area to be remade to remove all the oxide layers in the area to be remade. The barcode remaking method for a circuit board as described in claim 1, wherein, before the protective layer forming step, it also includes a thickness acquisition step: using the control device to obtain thickness information including the predetermined thickness; in the protective layer forming step, a protective layer forming device is used to form the new protective layer of the predetermined thickness on the area to be remade based on the thickness information. The barcode remaking method for a circuit board as described in claim 3, wherein, before the barcode generation step, it also includes a correct barcode acquisition step: using the control device to obtain barcode information including the correct barcode; in the barcode generation step, the laser device is used to form the correct barcode in the area to be remade where the new protective layer is formed based on the barcode information and the thickness information, and the laser device can adjust the power of the emitted laser based on the thickness information. A barcode reproducing method for a circuit board as described in claim 1, wherein in the removal step, the laser device is controlled to emit a laser of a first energy, and in the barcode generating step, the laser device is controlled to emit a laser of a second energy, and the first energy is greater than the second energy. A barcode reproducing method for a circuit board as described in claim 1, wherein, in the area calibration step, the control device is used to perform image analysis on the image to find the boundary of the erroneous barcode, and the range surrounded by the boundary is the erroneous barcode area; the control device uses the boundary plus a predetermined distance to determine the area to be reproducible, and after the control device determines the area to be reproducible, it generates coordinate information corresponding to the area to be reproducible and transmits the coordinate information to the laser device; in the removal step, the laser device irradiates the area to be reproducible of the circuit board to be reproducible based on the coordinate information. A circuit board barcode remaking device is used to remove an erroneous barcode of a circuit board to be remade and form a correct barcode on the circuit board to be remade. The circuit board barcode remaking device comprises: An image capture device, which is used to capture the image of the circuit board to be remade to generate an image; A control device, which is electrically connected to the image capture device, and the control device can find the erroneous barcode area of the erroneous barcode of the circuit board to be remade in the image, and define the area to be remade on the circuit board to be remade according to the erroneous barcode area, and the control device can generate coordinate information corresponding to the area to be remade; wherein the area to be remade covers the entire erroneous barcode area; A laser device, which is electrically connected to the control device, the control device can transmit the coordinate information to the laser device, and the laser device can irradiate the area to be remade according to the coordinate information to remove all protective layers of the circuit board to be remade in the area to be remade, so as to expose the copper layer of the circuit board to be remade in the area to be remade; wherein, after the laser emitted by the laser device passes through the exposed area without protective layer in the area to be remade, an oxide layer will be formed on the surface of the exposed area; the error barcode is composed of multiple exposed areas; A deoxidation device, which is electrically connected to the control device, the control device can transmit the coordinate information to the deoxidation device, and the deoxidation device can remove all the oxide layers in the area to be remade according to the coordinate information; A protective layer forming device is electrically connected to the control device, the control device can transmit the coordinate information to the protective layer forming device, and the protective layer forming device can form a new protective layer of a predetermined thickness in the area to be remade according to the coordinate information; the difference between the predetermined thickness and the thickness of the protective layer of the remade circuit board in the non-area to be remade is less than 20 micrometers (μm); Wherein, the control device can control the protective layer forming device to form the new protective layer of the predetermined thickness in the area to be remade, and then control the laser device to emit a laser, and remove part of the new protective layer in the area to be remade where the new protective layer is formed, so as to form the correct barcode in the area to be remade. The barcode remaking equipment for a circuit board as described in claim 7, wherein the deoxidation device is a sandblasting device or a grinding device, and the sandblasting device or the grinding device can be controlled by the control device to perform sandblasting or grinding operations on the area to be remade to remove all the oxide layers in the area to be remade. The barcode remaking equipment for a circuit board as described in claim 7, wherein the control device is capable of obtaining thickness information including the predetermined thickness and barcode information including the correct barcode; the control device is capable of transmitting the thickness information to the protective layer forming device, and the protective layer forming device is capable of forming the new protective layer of the predetermined thickness on the area to be remade according to the thickness information; the control device is capable of transmitting the barcode information to the laser device, and the laser device is capable of removing part of the new protective layer in the area to be remade where the new protective layer is formed according to the barcode information and the thickness information, so as to form the correct barcode. The barcode remaking equipment for a circuit board as described in claim 7, wherein the control device can control the laser device to emit a laser of a first energy to remove all protective layers in the area to be remade of the circuit board to be remade, and the control device can control the laser device to emit a laser of a second energy to form the correct barcode in the area to be remade where the new protective layer is formed; wherein the first energy is greater than the second energy.

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