CN117677043A - Bar code reproducing method and bar code reproducing equipment for circuit board - Google Patents
Bar code reproducing method and bar code reproducing equipment for circuit board Download PDFInfo
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- CN117677043A CN117677043A CN202211005624.3A CN202211005624A CN117677043A CN 117677043 A CN117677043 A CN 117677043A CN 202211005624 A CN202211005624 A CN 202211005624A CN 117677043 A CN117677043 A CN 117677043A
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- bar code
- circuit board
- area
- protective layer
- remade
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000011241 protective layer Substances 0.000 claims abstract description 98
- 239000010410 layer Substances 0.000 claims abstract description 63
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000007254 oxidation reaction Methods 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000010191 image analysis Methods 0.000 claims description 2
- 238000005422 blasting Methods 0.000 claims 4
- 238000004064 recycling Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 238000005488 sandblasting Methods 0.000 description 5
- 239000002699 waste material Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Abstract
The invention discloses a bar code reproducing method of a circuit board and bar code reproducing equipment of the circuit board. The bar code reproducing method of the circuit board comprises an image capturing step, a region calibrating step, a removing step, an oxide layer removing step, a protective layer forming step and a bar code generating step. In the image capturing step, the region calibrating step and the removing step, laser is utilized to remove the region to be remade of the remade circuit board. The area to be reproduced contains the wrong bar code. The step of removing the oxide layer is to remove the oxide layer in the area to be reworked. The protective layer forming step and the bar code generating step are to form a new protective layer in the area to be remade before forming a correct bar code in the area to be remade by utilizing laser. The invention can remove the wrong bar code of the circuit board and form the correct bar code on the circuit board, so that the circuit board does not need to be scrapped.
Description
Technical Field
The present invention relates to a method for reproducing bar codes, and more particularly, to a method for reproducing bar codes of a circuit board and a device for reproducing bar codes of a circuit board.
Background
In the prior art, related circuit board manufacturers form two-dimensional bar codes on circuit boards, so as to perform related control on the circuit boards. In the manufacturing process, if the two-dimensional bar code formed on the circuit board is found to be damaged, the circuit board is directly scrapped, so that waste is caused.
Disclosure of Invention
The invention discloses a bar code reproducing method and bar code reproducing equipment of a circuit board, which are mainly used for improving the problem that the circuit board is directly scrapped if a two-dimensional bar code on the circuit board is damaged in the prior art, thereby causing waste.
One embodiment of the invention discloses a bar code reproducing method of a circuit board, which is used for removing an error bar code of a circuit board to be reproduced and forming a correct bar code on the circuit board to be reproduced, and the bar code reproducing method of the circuit board comprises the following steps: an image capturing step: capturing at least one image of the circuit board to be reproduced by using an image capturing device; a region calibration step: a control device is utilized to find out an error bar code area of the error bar code of the circuit board to be reproduced in the image, and a region to be reproduced is defined in the circuit board to be reproduced according to the error bar code area, and the region to be reproduced covers the whole error bar code area; a removal step: controlling a laser device to emit laser to irradiate the region to be reworked so as to remove all protection layers of the circuit board to be reworked in the region to be reworked, and exposing the whole copper layer of the circuit board to be reworked in the region to be reworked; after the laser emitted by the laser device irradiates an exposed area without a protective layer in the area to be remade, an oxide layer is formed on the surface of the exposed area; the error bar code consists of a plurality of exposed areas; a step of removing oxide layer: removing all oxide layers in the area to be remade; a protective layer forming step: forming a new protective layer with a preset thickness in the area to be remade; the difference between the predetermined thickness and a thickness of the protective layer of the non-remade area of the remade circuit board is less than 20 micrometers (mum); a bar code generation step: and controlling the laser device to emit laser, and removing part of the new protective layer in the to-be-reproduced area with the new protective layer so as to form the correct bar code.
One embodiment of the invention discloses bar code reproducing apparatus for removing an erroneous bar code of a circuit board to be reproduced and forming a correct bar code on the circuit board to be reproduced, the bar code reproducing apparatus for a circuit board comprising: an image capturing device, a control device, a laser device, a de-oxidation device and a protective layer forming device. The image capturing device is used for capturing images of the circuit board to be reproduced so as to generate an image; the control device is electrically connected with the image acquisition device, can find out an error bar code area of an error bar code of the circuit board to be remade in the image, and define an area to be remade in the circuit board to be remade according to the error bar code area, and can generate coordinate information corresponding to the area to be remade; wherein the area to be reproduced covers the whole error bar code area; the laser device is electrically connected with the control device, the control device can transmit coordinate information to the laser device, and the laser device can irradiate the region to be reworked according to the coordinate information so as to remove all protection layers of the circuit board to be reworked in the region to be reworked, so that the copper layer of the circuit board to be reworked in the region to be reworked is entirely exposed; after laser emitted by the laser device passes through an exposed area without a protective layer in the area to be reproduced, an oxide layer is formed on the surface of the exposed area; the error bar code consists of a plurality of exposed areas; the deoxidation device is electrically connected with the control device, the control device can transmit coordinate information to the deoxidation device, and the deoxidation device can remove all oxide layers in the area to be reproduced according to the coordinate information; the protective layer forming device is electrically connected with the control device, the control device can transmit coordinate information to the protective layer forming device, and the protective layer forming device can form a new protective layer with a preset thickness in the area to be reproduced according to the coordinate information; the difference between the predetermined thickness and a thickness of the protective layer of the non-remade area of the remade circuit board is less than 20 micrometers (mum); the control device can control the laser device to emit laser after the protective layer forming device is controlled to form a new protective layer with a preset thickness in the area to be reworked, and form a correct bar code in the area to be reworked with the new protective layer.
In summary, in the method and the device for reproducing the bar code of the circuit board, if the bar code on the circuit is found to be damaged in the manufacturing process of the circuit board, the bar code of the circuit board can be reproduced again, so that the problem of waste caused by scrapping the circuit board due to the damaged bar code of the circuit board in the prior art can be effectively solved.
For a further understanding of the nature and the technical aspects of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are included to illustrate and not to limit the scope of the invention.
Drawings
FIG. 1 is a schematic flow chart of a bar code reproduction method of a circuit board according to the present invention;
FIG. 2 is a schematic top view of a circuit board to be reworked;
FIG. 3 is a schematic partial cross-sectional view of an erroneous bar code of a circuit board to be reproduced;
FIG. 4 is a schematic diagram of an image captured by an image capturing device of a bar code reproduction method of a circuit board according to the present invention;
fig. 5 is a block diagram of a bar code reproduction apparatus of a circuit board according to the present invention.
Symbol description
A: circuit board to be remade
A1: line area
A2: electronic component
A3: protective layer
A4: copper layer
B: error bar code
100: bar code reproducing equipment for circuit board
1: image capturing device
11: image processing apparatus
111: error barcode region
112: area to be remade
2: control device
3: laser device
4: deoxidation device
5: protective layer forming device
200: thickness information
201: a predetermined thickness
300: bar code information
301: correct bar code
Detailed Description
In the following description, reference is made to or as illustrated in the accompanying drawings, which are for the purpose of emphasis instead of limiting the description to the specific drawings in which the relevant content is presented for the most part.
Fig. 1 is a schematic flow chart of a bar code reproduction method of a circuit board according to the present invention. The bar code reproducing method of the circuit board is used for removing an error bar code of the circuit board to be reproduced and forming a correct bar code on the circuit board to be reproduced, and the bar code reproducing method of the circuit board comprises the following steps:
an image capturing step S11: capturing at least one image (image) of the circuit board to be reproduced by using an image capturing device;
a region calibration step S12: a control device is utilized to find out an error bar code area of the error bar code of the circuit board to be reproduced in the image, and a region to be reproduced is defined in the circuit board to be reproduced according to the error bar code area, and the region to be reproduced covers the whole error bar code area;
a removal step S13: controlling a laser device to emit laser to irradiate the region to be reworked so as to remove all protection layers of the circuit board to be reworked in the region to be reworked, and exposing the whole copper layer of the circuit board to be reworked in the region to be reworked; after the laser emitted by the laser device irradiates an exposed area without a protective layer in the area to be remade, an oxide layer is formed on the surface of the exposed area; the error bar code consists of a plurality of exposed areas;
a step S14 of removing oxide layer: removing all oxide layers in the area to be remade;
a protective layer forming step S15: forming a new protective layer with a preset thickness in the area to be remade; the difference between the predetermined thickness and a thickness of the protective layer of the non-remade area of the remade circuit board is less than 20 micrometers (mum);
a bar code generation step S16: and controlling the laser device to emit laser, and removing part of the new protective layer in the to-be-reproduced area with the new protective layer so as to form the correct bar code.
Referring to fig. 2 and 3 together, fig. 2 is a schematic diagram of a circuit board to be reworked, and fig. 3 is a schematic partial cross-sectional view of the circuit board to be reworked. The circuit board a to be reworked includes a circuit area A1 and a non-circuit area (i.e. the area of the non-circuit area A1 in fig. 2), wherein the circuit area A1 is used for disposing at least one electronic component A2, and the non-circuit area is the area of the circuit board a to be reworked, which is not disposed with the electronic component.
The surface of the non-circuit area of the circuit board a to be reworked has a protective layer A3, for example, the protective layer A3 may be a green (but not limited to) solder mask. The error bar code B is located in the non-circuit area, and the error bar code B is formed by the areas without the protective layer A3, that is, the error bar code B is seen by the related personnel in the non-circuit area of the circuit board A to be remade, and is formed by a plurality of copper exposure areas without the protective layer A3 of the circuit board A to be remade.
More specifically, the error bar code B on the circuit board a to be reworked is formed by irradiating a specific position of the non-circuit area of the circuit board a to be reworked with the laser device 3 to remove the protective layer A3 at the specific position, so that the copper layer A4 of the circuit board a to be reworked at the specific position is exposed, thereby forming a two-dimensional bar code.
As described above, the bar code of the circuit board a to be reworked is formed by the copper layer A4 exposed outside of the circuit board a to be reworked, and in the removing step S13, the laser irradiates the entire area 112 to be reworked of the circuit board a to be reworked, so that the area 112 to be reworked is not originally provided with the protective layer A3, and in the removing step S13, the surface of the circuit board a to be reworked is oxidized after the irradiation of the laser, thereby forming an oxide layer. For this reason, the oxide layer in the region to be reworked 112 needs to be removed first by the oxide layer removing step S14, so as to facilitate the new protection layer to be formed on the region to be reworked 112 in the subsequent protection layer forming step S15. In other words, if the step S13 is removed, the step S14 of removing the oxide layer is not performed, but the step S15 of forming the protective layer is directly performed, there may be a problem that the new protective layer cannot be smoothly formed in the region to be reworked, or the new protective layer in the region to be reworked may be in an uneven state.
In practical application, in the deoxidizing layer step S14, for example, a sand blasting device or a polishing device is used to perform a sand blasting operation or a polishing operation on the region to be reworked 112 to remove all the oxide layers in the region to be reworked 112, but the manner and device for removing the oxide layers are not limited by sand blasting or polishing, and can be selected according to practical requirements.
In one preferred embodiment, in the removing step S13, the laser device 3 is controlled to emit a laser beam with a first energy, and in the barcode generating step S16, the laser device 3 is controlled to emit a laser beam with a second energy. Wherein the first energy is greater than the second energy. That is, in the removing step S3, the area to be reworked 112 is irradiated with a relatively high power laser to effectively remove all the protection layers in the area to be reworked 112, and in the barcode generating step S16, a part of the new protection layers may be removed by using a relatively low power laser to form a correct barcode.
It should be emphasized that the laser of the second energy is capable of removing the new protection layer, so that the copper layer A4 of the circuit board a to be reworked in the area 112 to be reworked is exposed, and the correct bar code is formed, and the power of the laser of the first energy is higher than that of the laser of the second energy, so that the protection layer or the structure related to the protection layer in the area 112 to be reworked can be removed in the removing step S13, and all the copper layers A4 of the circuit board a to be reworked in the area 112 to be reworked are exposed.
More specifically, the applicant has found through repeated experiments that if the laser beam with the same power as that of the barcode generating step S16 is used in the removing step S13, after the removing step S13, a part of the non-removed protective layer or the layer structure related to the non-removed protective layer may still remain in the to-be-reworked area 112, which directly affects the new protective layer formed in the subsequent protective layer forming step S15.
Please refer to fig. 4, which is a schematic diagram illustrating an image captured by the image capturing device. In practical application, in the region calibration step S12, the control device may perform an image analysis on the image 11 to find a boundary of the error bar code, where the boundary surrounds the error bar code region 111, and the control device may determine the region 112 to be remarked by adding a predetermined distance to the boundary, and after the control device determines the region 112 to be remarked, generate coordinate information corresponding to the region 112 to be remarked, and transmit the coordinate information to the laser device; in the removing step S13, the laser device 3 can move to the upper portion of the corresponding position of the circuit board to be reworked according to the coordinate information, and irradiates the area to be reworked of the circuit board to be reworked, thereby removing the area of the circuit board to be reworked originally having the error bar code and the area of a part of the periphery of the error bar code.
In practice, if in the removing step S12, only all the protection layers in the boundary corresponding to the error bar code B (i.e. the error bar code area 111) are removed, the problem that part of bar codes are not removed may occur due to various measurement errors, movement errors, etc., so in the removing step S12 of the present invention, the control device controls the laser device to irradiate the laser to the area to be reproduced of the circuit board, instead of only irradiating the error bar code area, which can ensure that the error bar codes of the circuit board to be reproduced are removed.
It should be noted that, in one preferred embodiment, before the protective layer forming step S1, a thickness obtaining step is further included: obtaining thickness information including a predetermined thickness by using the control device; in the protective layer forming step S15, a protective layer forming apparatus is made to form a new protective layer with a predetermined thickness on the area to be reworked according to the thickness information. For example, the control device may obtain thickness information through a remote server, various computers, etc., or the control device may display a setting interface in the display device, and the control device is connected to an input device (such as a keyboard, a mouse, a touch screen, etc.), and the related personnel may input the thickness of the protective layer of the current circuit board to be remarked in the setting interface by operating the input device, and the control device can generate the thickness information accordingly.
Similarly, before the barcode generation step S16, a correct barcode acquisition step may be further included: obtaining bar code information containing the correct bar code by using the control device; in the barcode generating step S16, the laser device forms a correct barcode in the area to be reproduced where the new protective layer is formed according to the barcode information. In various embodiments, the control device may also obtain the thickness information and the bar code information from a remote server, various computers, etc. before the protective layer forming step S1.
In the preferred embodiment, in the barcode generating step S16, the laser device may adjust the current power according to the thickness information, and remove a portion of the new protective layer in the to-be-reworked area where the new protective layer is formed according to the barcode information, so as to ensure that the laser device can effectively remove a portion of the new protective layer in the to-be-reworked area where the new protective layer is formed.
In practice, the thicknesses of the protective layers of the circuit board to be reworked, which needs to be reworked, may be completely the same, so that the thickness information of the protective layer of the current circuit board to be reworked is obtained through the thickness obtaining step, and the protective layer forming device and the laser device respectively use the thickness information to form a new protective layer and remove the new protective layer, so that the protective layer forming device can be ensured to form a new protective layer with the thickness approximately the same as that of other areas which are not areas to be reworked on the circuit board to be reworked, and the laser device can be ensured to effectively remove part of the new protective layer in the barcode generating step S16, so as to form a relatively clear correct barcode.
According to the bar code reproducing method of the circuit board, the error bar code on the circuit board to be reproduced can be removed, and the correct bar code is formed on the circuit board to be reproduced again, so that the circuit board to be reproduced can be reused without being scrapped.
Referring to fig. 5, a block diagram of a bar code reproduction apparatus of a circuit board according to the present invention is shown. The bar code reproducing apparatus 100 for a circuit board according to the present invention is used for removing an incorrect bar code of a circuit board to be reproduced and forming a correct bar code on the circuit board to be reproduced. The bar code reproduction apparatus 100 of a circuit board includes: an image capturing device 1, a control device 2, a laser device 3, a de-oxidation device 4 and a protective layer forming device 5. In practical applications, the image capturing device 1, the control device 2, the laser device 3, the deoxidizing device 4 and the protection layer forming device 5 may be disposed on a frame together and covered by at least one casing, but not limited thereto. In various embodiments, the image capturing device 1, the control device 2 and the laser device 3 may be disposed in the same frame and housing, and the oxidation removing device 4 and the protective layer forming device 5 may be disposed in another frame and housing, and the circuit board may be conveyed therebetween by a conveyor belt or the like.
In one embodiment, the control device 2 of the bar code reproducing apparatus 100 for a circuit board can execute the above-mentioned method for reproducing bar codes for a circuit board according to the present invention, thereby removing the wrong bar code of the circuit board to be reproduced and forming the correct bar code on the circuit board to be reproduced.
The image capturing device 1 is used for capturing images of a circuit board to be reproduced to generate an image 11. The image capturing device 1 may be, for example, a camera, a video recorder, etc., which is not limited thereto. The control device 2 is electrically connected with the image capturing device 1, the control device 2 can find out an error bar code area of an error bar code of the circuit board to be reproduced in the image 11, and define an area to be reproduced in the circuit board to be reproduced according to the error bar code area, and the control device 2 can generate coordinate information corresponding to the area to be reproduced. For the description of the error bar code area and the area to be reproduced, please refer to the foregoing embodiments, and the description thereof is omitted. The control device 2 may be, for example, a computer, a remote server, etc., and is not limited thereto. In practical applications, the control device 2 may be, for example, various computers, remote servers, etc., which are not limited herein.
The laser device 3 is electrically connected with the control device 2, the control device 2 can transmit coordinate information to the laser device 3, the laser device 3 can irradiate the region to be reworked according to the coordinate information so as to remove all protection layers of the circuit board to be reworked in the region to be reworked, and the whole copper layer of the circuit board to be reworked in the region to be reworked is exposed; after the laser emitted by the laser device 3 passes through an exposed area without a protective layer in the area to be reproduced, an oxide layer is formed on the surface of the exposed area; the error bar code is composed of a plurality of exposed areas.
The de-oxidation device 4 is electrically connected with the control device 2, the control device 2 can transmit coordinate information to the de-oxidation device 4, and the de-oxidation device 4 can remove all oxide layers in the area to be reworked according to the coordinate information. In practical applications, the deoxidizing device 4 may be, for example, a sand blasting device or a polishing device, which can be controlled by the control device 2 to perform a sand blasting operation or a polishing operation on the area to be reworked to remove all the oxide layers in the area to be reworked.
The protection layer forming device 5 is electrically connected with the control device 2, the control device 2 can transmit coordinate information to the protection layer forming device 5, and the protection layer forming device 5 can form a new protection layer with a preset thickness in the area to be reworked according to the coordinate information. The difference between the predetermined thickness and a thickness of the protective layer of the non-reworked area of the reworked circuit board is less than 20 micrometers (μm).
The control device 2 can control the laser device 3 to emit a laser after the protective layer forming device 5 forms a new protective layer with a preset thickness in the area to be reworked, so as to form a correct bar code in the area to be reworked with the new protective layer.
It should be noted that, in the preferred embodiment, the control device 2 can control the laser device 3 to emit a laser of a first energy to remove all protection layers of the circuit board to be reworked in the area to be reworked, and the control device 2 can control the laser device 3 to emit a laser of a second energy to form a correct bar code in the area to be reworked in which the new protection layer is formed; wherein the first energy is greater than the second energy. For detailed descriptions of the first energy and the second energy, please refer to the descriptions of the foregoing embodiments, and the detailed descriptions are omitted herein.
In practical applications, the control device 2 can obtain a thickness information 200 including a predetermined thickness 201 and a bar code information 300 including a correct bar code 301 through a network or various input devices (such as a keyboard, a mouse, a touch device, etc.), and the control device 2 can transmit the thickness information 200 to the protection layer forming device 5, and the protection layer forming device 5 can form a new protection layer with a predetermined thickness on the area to be reworked according to the thickness information 200. The control device 2 can also transmit the bar code information 300 to the laser device 3, and the laser device 3 can remove part of the new protective layer in the area to be reworked with the new protective layer according to the bar code information 300 so as to form a correct bar code in the area to be reworked.
As described above, the bar code reproducing apparatus 100 for a circuit board according to the present invention can remove the error bar code on the circuit board to be reproduced first, and then form the correct bar code on the same position on the circuit board to be reproduced, so that the circuit board to be reproduced with the error bar code can be rejected.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, so that all equivalent technical changes made by the specification and drawings of the present invention are included in the scope of the invention.
Claims (10)
1. A bar code reproducing method of a circuit board is used for removing an error bar code of the circuit board to be reproduced and forming a correct bar code on the circuit board to be reproduced, and the bar code reproducing method of the circuit board comprises the following steps:
an image capturing step: capturing at least one image of the circuit board to be reproduced by using an image capturing device;
and (3) area calibration: finding out an error bar code area of the error bar code of the circuit board to be remade by using a control device in the image, and defining a region to be remade in the circuit board to be remade according to the error bar code area, wherein the region to be remade covers the whole error bar code area;
and (3) removing: controlling a laser device to emit laser, irradiating the region to be remade, and removing all protective layers of the circuit board to be remade in the region to be remade, so that the copper layer of the circuit board to be remade in the region to be remade is entirely exposed; after the laser emitted by the laser device irradiates an exposed area without a protective layer in the area to be remade, an oxide layer is formed on the surface of the exposed area; the error bar code consists of a plurality of exposed areas;
removing an oxidation layer: removing all the oxide layers in the region to be remade;
and a protective layer forming step: forming a new protective layer with a preset thickness in the area to be remade; the difference between the predetermined thickness and the thickness of the protective layer of the reworked circuit board in the areas not to be reworked is less than 20 micrometers (μm);
a bar code generation step: and controlling the laser device to emit laser, and removing part of the new protective layer in the to-be-reproduced area formed with the new protective layer so as to form the correct bar code.
2. The bar code reproduction method of claim 1, wherein in the oxide layer removing step, a blasting operation or a grinding operation is performed on the region to be reproduced by using a blasting device or a grinding device to remove all the oxide layer in the region to be reproduced.
3. The bar code reproduction method of a circuit board according to claim 1, further comprising, before the protective layer forming step, a thickness obtaining step of: acquiring thickness information including the predetermined thickness by using the control device; in the protective layer forming step, a protective layer forming device forms the new protective layer with the preset thickness on the area to be remade according to the thickness information.
4. The bar code reproduction method of the circuit board according to claim 3, further comprising, before the bar code generation step, a correct bar code acquisition step of: obtaining bar code information containing the correct bar code by using the control device; in the bar code generation step, the laser device forms the correct bar code in the to-be-reproduced area formed with the new protective layer according to the bar code information and the thickness information, and the laser device can adjust the power of the emitted laser according to the thickness information.
5. The bar code reproduction method of a circuit board according to claim 1, wherein in the removing step, the laser device is controlled to emit laser light of a first energy, and in the bar code generating step, the laser device is controlled to emit laser light of a second energy, the first energy being greater than the second energy.
6. The bar code reproduction method of a circuit board according to claim 1, wherein in the region calibration step, the control device is used to perform image analysis on the image to find out the boundary of the error bar code, and the range surrounded by the boundary is the error bar code region; the control device utilizes the boundary to add a preset distance to order the region to be remade, and after the control device orders the region to be remade, coordinate information corresponding to the region to be remade is generated and transmitted to the laser device; in the removing step, the laser device irradiates the region to be remapped of the circuit board to be remapped according to the coordinate information.
7. A bar code reproducing apparatus for removing an erroneous bar code of a circuit board to be reproduced and forming a correct bar code on the circuit board to be reproduced, the bar code reproducing apparatus for a circuit board comprising:
the image capturing device is used for capturing images of the circuit board to be reproduced so as to generate images;
the control device is electrically connected with the image acquisition device, can find out an error bar code area of the error bar code of the circuit board to be remade in the image, and can define a region to be remade in the circuit board to be remade according to the error bar code area, and the control device can generate coordinate information corresponding to the region to be remade; wherein the area to be remade covers the whole error bar code area;
the laser device is electrically connected with the control device, the control device can transmit the coordinate information to the laser device, and the laser device can irradiate the region to be reworked according to the coordinate information so as to remove all protective layers of the circuit board to be reworked in the region to be reworked, so that the copper layer of the circuit board to be reworked in the region to be reworked is entirely exposed; after laser emitted by the laser device passes through an exposed area without a protective layer in the area to be remade, an oxide layer is formed on the surface of the exposed area; the error bar code consists of a plurality of exposed areas;
the deoxidizing device is electrically connected with the control device, the control device can transmit the coordinate information to the deoxidizing device, and the deoxidizing device can remove all the oxide layers in the area to be remade according to the coordinate information;
the protective layer forming device is electrically connected with the control device, the control device can transmit the coordinate information to the protective layer forming device, and the protective layer forming device can form a new protective layer with a preset thickness in the area to be reworked according to the coordinate information; the difference between the predetermined thickness and the thickness of the protective layer of the reworked circuit board in the areas not to be reworked is less than 20 micrometers (μm);
the control device can control the laser device to emit laser after the protective layer forming device is controlled to form the new protective layer with the preset thickness in the area to be reworked, and remove part of the new protective layer in the area to be reworked with the new protective layer so as to form the correct bar code in the area to be reworked.
8. The bar code recycling apparatus of circuit board of claim 7, wherein the oxidation removing means is a blasting means or a grinding means, which can be controlled by the control means to perform a blasting operation or a grinding operation on the area to be recycled to remove all the oxide layer in the area to be recycled.
9. The bar code reproduction apparatus of claim 7, wherein the control means is capable of acquiring thickness information including the predetermined thickness and bar code information including the correct bar code; the control device can transmit the thickness information to the protective layer forming device, and the protective layer forming device can form the new protective layer with the preset thickness on the area to be remarked according to the thickness information; the control device can transmit the bar code information to the laser device, and the laser device can remove part of the new protective layer in the to-be-reproduced area formed with the new protective layer according to the bar code information and the thickness information so as to form the correct bar code.
10. The bar code recycling apparatus of circuit board of claim 7, wherein said control means is capable of controlling said laser means to emit laser light of a first energy to remove all protective layers of said circuit board to be recycled in said area to be recycled, and said control means is capable of controlling said laser means to emit laser light of a second energy to form said correct bar code in said area to be recycled in which said new protective layer is formed; wherein the first energy is greater than the second energy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211005624.3A CN117677043A (en) | 2022-08-22 | 2022-08-22 | Bar code reproducing method and bar code reproducing equipment for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211005624.3A CN117677043A (en) | 2022-08-22 | 2022-08-22 | Bar code reproducing method and bar code reproducing equipment for circuit board |
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| Publication Number | Publication Date |
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| CN117677043A true CN117677043A (en) | 2024-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211005624.3A Pending CN117677043A (en) | 2022-08-22 | 2022-08-22 | Bar code reproducing method and bar code reproducing equipment for circuit board |
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| CN (1) | CN117677043A (en) |
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