TW202413253A - Sheet material recovery method and sheet material recovery apparatus - Google Patents
Sheet material recovery method and sheet material recovery apparatus Download PDFInfo
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- 238000011084 recovery Methods 0.000 title claims abstract description 109
- 238000000034 method Methods 0.000 title claims abstract description 86
- 239000000463 material Substances 0.000 title claims description 86
- 238000004804 winding Methods 0.000 claims abstract description 234
- 230000007246 mechanism Effects 0.000 claims abstract description 75
- 230000008569 process Effects 0.000 claims description 76
- 238000005096 rolling process Methods 0.000 claims description 17
- 238000004064 recycling Methods 0.000 claims description 13
- 230000001681 protective effect Effects 0.000 description 78
- 235000012431 wafers Nutrition 0.000 description 71
- 238000005520 cutting process Methods 0.000 description 44
- 238000001179 sorption measurement Methods 0.000 description 27
- 239000002390 adhesive tape Substances 0.000 description 25
- 230000002829 reductive effect Effects 0.000 description 25
- 230000002093 peripheral effect Effects 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 16
- 239000002699 waste material Substances 0.000 description 12
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- 230000001070 adhesive effect Effects 0.000 description 4
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- 239000000853 adhesive Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 2
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
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- 230000002441 reversible effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
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- 238000007872 degassing Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C9/00—Details of labelling machines or apparatus
- B65C9/0006—Removing backing sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B33/00—Packaging articles by applying removable, e.g. strippable, coatings
- B65B33/02—Packaging small articles, e.g. spare parts for machines or engines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C9/00—Details of labelling machines or apparatus
- B65C9/08—Label feeding
- B65C9/18—Label feeding from strips, e.g. from rolls
- B65C9/1803—Label feeding from strips, e.g. from rolls the labels being cut from a strip
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C9/00—Details of labelling machines or apparatus
- B65C9/08—Label feeding
- B65C9/18—Label feeding from strips, e.g. from rolls
- B65C9/1865—Label feeding from strips, e.g. from rolls the labels adhering on a backing strip
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H18/00—Winding webs
- B65H18/08—Web-winding mechanisms
- B65H18/10—Mechanisms in which power is applied to web-roll spindle
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
- B65H35/04—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators
- B65H35/06—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators from or with blade, e.g. shear-blade, cutters or perforators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
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- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
Description
本發明係關於用於將以黏著帶為例的片材捲取成卷狀並回收之片材回收方法及片材回收裝置,該片材係被供給到以半導體晶圓(以下,適當稱為「晶圓」)或基板為例之工件。The present invention relates to a sheet material recycling method and a sheet material recycling device for rolling up a sheet material such as an adhesive tape into a roll and recycling it, wherein the sheet material is supplied to a workpiece such as a semiconductor wafer (hereinafter, appropriately referred to as a "wafer") or a substrate.
在製造半導體製品的工序中,係對以晶圓或基板為例的工件,使用片材進行各種處理。作為一例,係在晶圓的表面進行電路圖案形成處理之後,為了保護電路圖案而在晶圓的表面進行貼附保護用黏著帶(保護帶)之處理。亦即,將成為片狀的保護帶從供給用筒管朝晶圓放出且供給,利用貼附輥將保護帶貼附於晶圓的表面。在晶圓的表面貼附有保護帶之後,藉由沿著晶圓的外形切斷保護帶,保護帶被切下成晶圓的形狀(例如,參照專利文獻1)。在晶圓貼附保護帶後,實施將晶圓的背面整體均一地研削而加以薄型化之背面研磨處理等。In the process of manufacturing semiconductor products, various processes are performed on workpieces such as wafers or substrates using sheets. As an example, after a circuit pattern is formed on the surface of a wafer, a protective adhesive tape (protective tape) is attached to the surface of the wafer to protect the circuit pattern. That is, a sheet-shaped protective tape is unloaded and supplied from a supply bobbin toward the wafer, and the protective tape is attached to the surface of the wafer using an attachment roller. After the protective tape is attached to the surface of the wafer, the protective tape is cut into the shape of the wafer by cutting it along the outer shape of the wafer (for example, refer to patent document 1). After the protective tape is attached to the wafer, a back grinding process is performed to grind the entire back side of the wafer uniformly to make it thinner.
又,作為使用片材之處理的其他例,在將貼附於晶圓的保護帶從晶圓剝離之情況,將成為片狀的剝離用黏著帶(剝離帶)從供給用筒管朝晶圓放出並供給,利用貼附輥將剝離帶貼附於保護帶的表面。接著,以尖銳的邊緣構件將貼附於保護帶的剝離帶一邊折返一邊剝離,藉此將剝離帶與保護帶一體地從晶圓剝離(例如,參照專利文獻2)。As another example of processing using a sheet material, in the case of peeling off a protective tape attached to a wafer from the wafer, a peeling adhesive tape (peeling tape) in sheet form is unloaded and supplied from a supply bobbin toward the wafer, and the peeling tape is attached to the surface of the protective tape by an attachment roller. Then, the peeling tape attached to the protective tape is peeled off while being folded back by a sharp edge member, thereby peeling off the peeling tape and the protective tape from the wafer as a whole (for example, refer to Patent Document 2).
習知的構成中,朝晶圓放出且供給的片材係在進行各種處理後,從晶圓進一步朝片材回收裝置被送出並回收。作為一例,在將保護帶貼附在晶圓的帶貼附裝置中,沿著晶圓的外形被切下後之不要的保護帶係從晶圓朝片材回收裝置被送出。在片材回收裝置配設有可旋轉的捲取軸,藉由在片材的前端固定於捲取軸的狀態下使捲取軸旋轉,片材會逐漸被捲取軸捲取成卷狀。一旦捲取於捲取軸的保護帶成為一定量以上時,在片材回收裝置中保護帶會被切斷,捲取於捲取軸之前端側的保護帶與被供給到晶圓之後端側的保護帶會被分離。成為卷狀之前端側的保護帶,係從捲取軸被以手動拔取並回收。In the known structure, the sheet material released and supplied to the wafer is sent out from the wafer to the sheet material recovery device and recovered after various processes. For example, in a tape attaching device that attaches a protective tape to a wafer, the unnecessary protective tape that has been cut off along the outer shape of the wafer is sent out from the wafer to the sheet material recovery device. The sheet material recovery device is equipped with a rotatable winding shaft, and the winding shaft is rotated in a state where the front end of the sheet material is fixed to the winding shaft, and the sheet material is gradually rolled up by the winding shaft into a roll. Once the protective tape wound on the take-up shaft exceeds a certain amount, the protective tape is cut in the sheet recovery device, and the protective tape wound on the front end of the take-up shaft and the protective tape fed to the rear end of the wafer are separated. The protective tape on the front end of the roll is manually pulled out from the take-up shaft and recovered.
在將保護帶從晶圓剝離的帶剝離裝置中,與保護帶成為一體的片狀剝離帶係從晶圓朝片材回收裝置被送出,呈卷狀被捲取於片材回收裝置所具備的捲取軸。當捲取於捲取軸的剝離帶成為一定量以上時,在片材回收裝置中剝離帶會被切斷,接著,成為卷狀之前端側的剝離帶係從捲取軸被以手動拔取並回收。In the tape stripping device that strips the protective tape from the wafer, the sheet-shaped stripping tape integrated with the protective tape is fed from the wafer to the sheet recovery device and is rolled up on a reel provided in the sheet recovery device. When the stripping tape rolled up on the reel exceeds a certain amount, the stripping tape is cut in the sheet recovery device, and then the stripping tape at the leading end of the roll is manually pulled out from the reel and recovered.
又,有在以保護帶或剝離帶為例之黏著帶的黏著面,添設有非黏著性的剝離襯墊之情況。於此情況,在使用黏著帶之前,先將剝離襯墊從黏著帶剝離。從黏著帶被剝離的剝離襯墊也是朝剝離襯墊用的片材回收裝置被送出,呈卷狀被捲取於片材回收裝置所具備的捲取軸並以手動回收。 [先前技術文獻] [專利文獻] In addition, there is a case where a non-adhesive peeling pad is added to the adhesive surface of an adhesive tape such as a protective tape or a peeling tape. In this case, the peeling pad is peeled off from the adhesive tape before using the adhesive tape. The peeling pad peeled off from the adhesive tape is also sent to a sheet recovery device for the peeling pad, and is rolled up in a roll on a winding shaft provided in the sheet recovery device and recovered manually. [Prior technical literature] [Patent literature]
[專利文獻1]日本特開2013-232583號公報 [專利文獻2]日本特開2002-124494號公報 [Patent Document 1] Japanese Patent Publication No. 2013-232583 [Patent Document 2] Japanese Patent Publication No. 2002-124494
[發明欲解決之課題][Problems to be solved by the invention]
然而,上述習知的構成中會有如下之問題。亦即,在使片材捲繞於捲取軸並回收之情況,係一邊對片材朝放出方向賦予張力,片材一邊以密接於捲取軸的外周之方式逐漸捲取。因此,由於作用於捲取成卷狀的片材與捲取軸之間的摩擦力會變大,所以難以將卷狀的片材從捲取軸拔取並回收。However, the above-mentioned known structure has the following problem. That is, when the sheet is wound around the take-up shaft and recovered, the sheet is gradually wound in a manner of being in close contact with the outer circumference of the take-up shaft while tension is applied to the sheet in the unwinding direction. Therefore, the friction force acting between the rolled sheet and the take-up shaft increases, making it difficult to pull the rolled sheet from the take-up shaft and recover it.
尤其,當為了抵抗該摩擦力而將卷狀的片材強硬地拉引且拔取而回收時,由於以手動拉引片材之際會有較大的力沿著軸向以外的方向作用於捲取軸,所以會擔心捲取軸的軸向從初始狀態的方向偏斜之情況。一旦捲取軸偏斜,捲取片材的方向就會偏斜,因此片材的回收精確度及回收效率會降低。In particular, when the rolled sheet is pulled and extracted for recovery by force in order to resist the frictional force, a large force acts on the winding shaft in a direction other than the axial direction when the sheet is pulled manually, so there is a concern that the axial direction of the winding shaft may deviate from the initial state. Once the winding shaft deviates, the direction of the rolled sheet will deviate, thereby reducing the recovery accuracy and recovery efficiency of the sheet.
本發明係有鑑於此種情況而研創者,其主要目的在於提供一種可避免對捲取軸造成負擔,並可容易地將片材捲取且回收之片材回收方法及片材回收裝置。 [用以解決課題之手段] The present invention was developed in view of this situation, and its main purpose is to provide a sheet material recovery method and a sheet material recovery device that can avoid burdening the winding shaft and can easily roll up and recover the sheet material. [Means for solving the problem]
本發明為了達成此種目的,採用如下之構成。 亦即,本發明係一種片材回收方法,係將被放出且供給到工件的片材加以捲取回收,其特徵為具備: 薄片固定過程,使前述片材的前端固定於固定構件,該固定構件配設於捲取部; 捲取過程,在前述片材的前端被固定於前述捲取部的狀態下使前述捲取部旋轉以使前述片材朝前述捲取部捲取成卷狀; 間隙形成過程,藉由使前述捲取部的直徑比前述捲取過程中之前述捲取部的直徑還小,而在前述捲取部與前述片材之間產生間隙部; 固定解除過程,使前述片材的前端固定於前述捲取部的狀態解除;以及 回收過程,將捲取成卷狀的前述片材從前述捲取部拔取並回收。 In order to achieve this purpose, the present invention adopts the following structure. That is, the present invention is a sheet material recovery method, which is to roll up and recover the sheet material that has been released and supplied to the workpiece, and is characterized by having: a sheet fixing process, in which the front end of the sheet material is fixed to a fixing member, and the fixing member is arranged on the winding section; a winding process, in which the winding section is rotated in a state where the front end of the sheet material is fixed to the winding section so that the sheet material is rolled up toward the winding section; a gap forming process, in which a gap portion is generated between the winding section and the sheet material by making the diameter of the winding section smaller than the diameter of the winding section in the winding process; a fixing release process, in which the state in which the front end of the sheet material is fixed to the winding section is released; and a recovery process, in which the sheet material rolled up in a roll is pulled out from the winding section and recovered.
(作用・效果)根據此構成,在進行了將片材朝捲取部捲取成卷狀的捲取過程之後,進行間隙形成過程。藉由進行間隙形成過程,捲取部的直徑會變小,所以會在捲取部與片材之間形成間隙部。藉由形成間隙部,產生於捲取成卷狀的片材與捲取部的外周之間之摩擦力大幅降低。因此,將片材從捲取部拔取並回收之回收過程中,可將成為卷狀的片材容易地從捲取部拔取。又,可防止操作者為了抵抗摩擦力將片材拔取,而沿著與軸向不同的方向對捲取部賦予無用的力之情事,所以可避免捲取軸偏斜而使片材的回收效率降低。(Function and Effect) According to this configuration, after the winding process of winding the sheet into a roll on the winding section is performed, the gap forming process is performed. By performing the gap forming process, the diameter of the winding section is reduced, so a gap portion is formed between the winding section and the sheet. By forming the gap portion, the friction force generated between the sheet wound into a roll and the outer periphery of the winding section is greatly reduced. Therefore, in the recovery process of pulling the sheet from the winding section and recovering it, the rolled sheet can be easily pulled out from the winding section. In addition, it can prevent the operator from applying useless force to the winding section in a direction different from the axial direction in order to resist the friction force to pull out the sheet, so it can be avoided that the winding axis deviates and reduces the recovery efficiency of the sheet.
又,上述的發明中,較佳為, 具備:突出形成過程,藉由使配設於前述捲取部的突出構件朝前述捲取部的徑向突出,而使前述捲取部的直徑增大;及 突出解除過程,將藉由前述突出形成過程使前述突出構件突出於前述捲取部的徑向之狀態解除; 前述捲取過程係在藉由前述突出形成過程使前述突出構件突出於前述捲取部的徑向之狀態下,使前述片材朝前述捲取部捲取成卷狀, 前述間隙形成過程係利用前述突出解除過程將前述突出構件突出於前述捲取部的徑向之狀態解除,藉此使前述捲取部的直徑比前述捲取過程中之前述捲取部的直徑還小。 Furthermore, in the above invention, it is preferred that: it comprises: a protrusion forming process, in which the diameter of the aforementioned winding section is increased by making the protrusion member provided on the aforementioned winding section protrude in the radial direction of the aforementioned winding section; and a protrusion releasing process, in which the state in which the aforementioned protrusion member protrudes in the radial direction of the aforementioned winding section by the aforementioned protrusion forming process is released; the aforementioned winding process is to roll the aforementioned sheet material toward the aforementioned winding section in a state in which the aforementioned protrusion member protrudes in the radial direction of the aforementioned winding section by the aforementioned protrusion forming process; the aforementioned gap forming process is to release the state in which the aforementioned protrusion member protrudes in the radial direction of the aforementioned winding section by the aforementioned protrusion releasing process, thereby making the diameter of the aforementioned winding section smaller than the diameter of the aforementioned winding section in the aforementioned winding process.
(作用・效果)根據此構成,捲取部具備有突出構件,藉由進行使該突出部座突出於捲取部的徑向之突出形成過程,捲取部的直徑會增大。且,在捲取部的直徑藉由突出形成過程增大的狀態下,進行使片材朝捲取部捲取成卷狀之捲取過程。(Function and Effect) According to this structure, the take-up section has a protruding member, and the diameter of the take-up section is increased by performing a protrusion forming process in which the protrusion is made to protrude in the radial direction of the take-up section. And, in a state in which the diameter of the take-up section is increased by the protrusion forming process, a take-up process is performed in which the sheet is taken up into a roll shape toward the take-up section.
捲取過程完成後,進行突出解除過程。在突出解除過程中,解除突出構件突出於前述捲取部的徑向之狀態。藉由解除突出構件突出於前述捲取部的徑向之狀態,捲取部的直徑會變得比捲取過程中之捲取部的直徑還小,所以會在片材與捲取部之間形成間隙部。由於藉由使突出構件朝捲取部的徑向進退移動,可形成間隙部,所以可容易地使形成間隙部之機構自動化。因此,可減少產生於片材與捲取部之間的摩擦力,並可減少將片材回收時以手動進行的操作。After the winding process is completed, the protrusion release process is performed. In the protrusion release process, the state in which the protruding member protrudes beyond the radial direction of the aforementioned winding section is released. By releasing the state in which the protruding member protrudes beyond the radial direction of the aforementioned winding section, the diameter of the winding section becomes smaller than the diameter of the winding section during the winding process, so a gap portion is formed between the sheet and the winding section. Since the gap portion can be formed by moving the protruding member forward and backward in the radial direction of the winding section, the mechanism for forming the gap portion can be easily automated. Therefore, the friction generated between the sheet and the winding section can be reduced, and the manual operation when the sheet is recovered can be reduced.
又,上述發明中,前述固定構件係以設置於前述突出構件較佳。Furthermore, in the above invention, the fixing member is preferably disposed on the protruding member.
(作用・效果)根據此構成,由於固定構件係設置於突出構件,所以可用單一構件執行突出形成過程與薄片固定過程。因此,可容易實現本發明之片材回收裝置的單純化及小型化。(Function and Effect) According to this structure, since the fixing member is provided on the protruding member, the protrusion forming process and the sheet fixing process can be performed by a single member. Therefore, the sheet material recovery device of the present invention can be easily simplified and miniaturized.
又,上述發明中,較佳為,前述固定過程係藉由利用空氣吸引方式或靜電吸引方式使前述固定構件吸附前述片材的前端,而使前述片材的前端固定於前述固定構件。Furthermore, in the above invention, it is preferred that the fixing process is to fix the front end of the sheet material to the fixing member by using air suction or electrostatic suction to make the fixing member absorb the front end of the sheet material.
(作用・效果)根據此構成,固定構件係以藉由空氣吸引方式或靜電吸引方式吸附片材的前端之方式構成。藉由吸附片材的前端,固定構件可將片材的前端更確實地固定。又,藉由解除吸附,片材的前端固定於固定構件的狀態可迅速且確實地被解除。因此,藉由控制吸引的開啟及關閉之單純的構成,可迅速且精確度佳地執行薄片固定過程及固定解除過程。(Function and Effect) According to this structure, the fixing member is configured to adsorb the front end of the sheet by air suction or electrostatic suction. By adsorbing the front end of the sheet, the fixing member can more securely fix the front end of the sheet. In addition, by releasing the adsorption, the state in which the front end of the sheet is fixed to the fixing member can be quickly and securely released. Therefore, by a simple structure that controls the opening and closing of the suction, the sheet fixing process and the fixing release process can be performed quickly and accurately.
本發明為了達成此種目的,亦可採用如下之構成。 亦即,本發明係將對工件放出且供給之片材予以捲取回收之片材回收裝置,其特徵為具備: 捲取部,捲取前述片材; 薄片固定構件,配設於前述捲取部且使前述片材的前端固定; 捲取機構,在前述片材的前端固定於前述薄片固定構件的狀態下使前述捲取部旋轉以使前述片材朝前述捲取部捲取成卷狀; 間隙形成機構,使前述捲取部的直徑比利用前述捲取機構將前述片材朝前述捲取部捲取的狀態下之前述捲取部的直徑還小,藉此在捲取成卷狀的前述片材與前述捲取部之間形成間隙部;以及 固定解除機構,使前述片材的前端固定於前述薄片固定構件的狀態解除。 In order to achieve this purpose, the present invention may also adopt the following structure. That is, the present invention is a sheet material recovery device for recovering the sheet material released and supplied to the workpiece, and is characterized by having: A winding section for winding the sheet material; A sheet fixing member disposed on the winding section and fixing the front end of the sheet material; A winding mechanism for rotating the winding section in a state where the front end of the sheet material is fixed to the sheet fixing member so that the sheet material is rolled up toward the winding section; A gap forming mechanism for making the diameter of the winding section smaller than the diameter of the winding section in a state where the sheet material is rolled up toward the winding section by the winding mechanism, thereby forming a gap section between the sheet material rolled up into a roll and the winding section; and The fixing release mechanism releases the state in which the front end of the aforementioned sheet is fixed to the aforementioned sheet fixing member.
(作用・效果)根據此構成,在使片材朝捲取部捲取成卷狀後,藉由間隙形成機構使捲取部的直徑變小。藉由使捲取部的直徑變小,可在捲取部與片材之間形成間隙部。藉由形成間隙部,產生於捲取成卷狀的片材與捲取部的外周之間的摩擦力會大幅降低。因此,在將片材從捲取部拔取並回收之際,可將成為卷狀的片材容易地從捲取部拔取。可防止操作者為了抵抗摩擦力將片材拔取而朝向與軸向不同的方向對捲取部賦予無用的力之情況,所以可避免捲取軸偏斜而使片材的回收效率降低。 [發明之效果] (Function and effect) According to this structure, after the sheet is rolled up on the winding section, the diameter of the winding section is reduced by the gap forming mechanism. By reducing the diameter of the winding section, a gap section can be formed between the winding section and the sheet. By forming the gap section, the friction generated between the sheet rolled up and the outer periphery of the winding section is greatly reduced. Therefore, when the sheet is pulled out from the winding section and recovered, the rolled sheet can be easily pulled out from the winding section. The operator can be prevented from applying useless force to the winding section in a direction different from the axial direction in order to resist the friction force to pull out the sheet, so the winding shaft can be prevented from being skewed and reducing the recovery efficiency of the sheet. [Effect of the invention]
根據本發明之片材回收方法及片材回收裝置,在進行將片材朝捲取部捲取成卷狀之捲取過程後,進行間隙形成過程。藉由進行間隙形成過程,捲取部的直徑會變小,所以可在捲取部與片材之間形成間隙部。藉由形成間隙部,產生於捲取成卷狀的片材與捲取部的外周之間的摩擦力會大幅降低。因此,在將片材從捲取部拔取並回收之回收過程中,可將成為卷狀的片材容易地從捲取部拔取。According to the sheet material recycling method and sheet material recycling device of the present invention, after the winding process of rolling the sheet material into a roll shape on the winding section is performed, the gap forming process is performed. By performing the gap forming process, the diameter of the winding section is reduced, so that a gap portion can be formed between the winding section and the sheet material. By forming the gap portion, the friction force generated between the sheet material rolled into a roll shape and the outer periphery of the winding section is greatly reduced. Therefore, in the recycling process of pulling out the sheet material from the winding section and recycling it, the rolled sheet material can be easily pulled out from the winding section.
又,可防止操作者為抵抗摩擦力將片材拔取而沿著與軸向不同的方向對捲取部賦予無用的力之情事,所以可避免捲取軸偏斜而使片材的回收效率降低。亦即,可一邊避免對捲取軸造成負擔,一邊將片材捲取回收。In addition, the operator can be prevented from applying useless force to the take-up section in a direction different from the axial direction in order to pull out the sheet against the friction force, thereby avoiding the take-up shaft from deflecting and reducing the efficiency of sheet recovery. In other words, the sheet can be recovered while avoiding burdening the take-up shaft.
[用以實施發明的形態] [實施例1] [Form for implementing the invention] [Example 1]
以下,參照圖式,說明本發明的實施例1。圖1係表示具備實施例1的片材回收裝置之黏著帶貼附裝置1的基本構成之前視圖。此外,在表示黏著帶貼附裝置1的圖中,關於支持各種構成的支持手段、及使各種構成驅動的驅動手段等,係省略了圖示。Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. Fig. 1 is a front view showing the basic structure of the adhesive tape applying device 1 of the sheet material recovery device of Embodiment 1. In addition, in the figure showing the adhesive tape applying device 1, the supporting means for supporting various structures and the driving means for driving various structures are omitted.
黏著帶貼附裝置1係用以將保護帶PT貼附於半導體晶圓W(以下,僅簡稱為「晶圓W」)的表面側。保護帶PT係保護晶圓W的表面所形成的電路圖案之電路保護用黏著帶。在實施例1中,晶圓W相當於本發明的工件。The adhesive tape attaching device 1 is used to attach the protective tape PT to the surface side of the semiconductor wafer W (hereinafter, simply referred to as "wafer W"). The protective tape PT is a circuit protection adhesive tape for protecting the circuit pattern formed on the surface of the wafer W. In the embodiment 1, the wafer W is equivalent to the workpiece of the present invention.
此外,本實施例中所謂「上游」及「下游」係定義為沿著保護帶PT的放出方向L。亦即「上游」意指在保護帶PT的放出方向L上靠近後述的帶供給部3之側。In addition, the so-called "upstream" and "downstream" in this embodiment are defined along the feeding direction L of the protective tape PT. That is, "upstream" means the side close to the tape supply unit 3 described later in the feeding direction L of the protective tape PT.
<整體構成的說明> 本實施例的黏著帶貼附裝置1係如圖1所示,具備有:帶供給部3、張力機構4、保持台5、帶貼附單元7、帶切斷單元9、帶剝離單元11、帶回收部13、及襯墊回收部15。 <Description of the overall structure> The adhesive tape applying device 1 of this embodiment is shown in FIG1 and includes: a tape supply unit 3, a tension mechanism 4, a holding table 5, a tape applying unit 7, a tape cutting unit 9, a tape stripping unit 11, a tape recovery unit 13, and a pad recovery unit 15.
帶供給部3具備有供給筒管19及剝離輥21等。於供給筒管19裝填有原材卷20。保護帶PT係以添設有剝離襯墊(分離片)S的狀態捲繞於原材卷20。保護帶PT係如圖4所示,具備有非黏著性基材B、和具有黏著性的黏著層C積層而成之構成。且,剝離襯墊S係添設於保護帶PT中的黏著層C之側。帶供給部3係對晶圓W(朝向晶圓W)放出並供給添設有剝離襯墊S的保護帶PT。實施例1中,保護帶PT及剝離襯墊S的各者相當於本發明中的片材。The tape supply section 3 has a supply bobbin 19 and a peeling roller 21, etc. The supply bobbin 19 is loaded with a raw material roll 20. The protective tape PT is wound around the raw material roll 20 with a peeling pad (separation sheet) S added thereto. As shown in FIG. 4 , the protective tape PT has a structure in which a non-adhesive base material B and an adhesive layer C having adhesive properties are laminated. Furthermore, the peeling pad S is added to the side of the adhesive layer C in the protective tape PT. The tape supply section 3 discharges and supplies the protective tape PT with the peeling pad S added thereto to the wafer W (towards the wafer W). In Embodiment 1, each of the protective tape PT and the peeling pad S corresponds to the sheet material in the present invention.
供給筒管19係與電磁制動器23連動連結而被施加適度的旋轉阻力。電磁制動器23係防止添設有剝離襯墊S的保護帶PT從供給筒管19過量地放出並供給。The supply bobbin 19 is linked to an electromagnetic brake 23 so that an appropriate rotation resistance is applied. The electromagnetic brake 23 prevents the protection tape PT provided with the peeling pad S from being excessively unwound and supplied from the supply bobbin 19.
剝離輥21係將剝離襯墊S從保護帶PT剝離,並且將被剝離的剝離襯墊S朝襯墊回收部15引導。The peeling roller 21 peels the peeling liner S from the protective tape PT and guides the peeled peeling liner S toward the liner recovery unit 15 .
張力機構4係如圖1所示,具備有使擺動臂25振動之缸體27。擺動臂25係於固定軸的主軸支承惰輥28,於自由端側具備有張力輥29。張力機構4係構成為與缸體27的作動連動而擺動之擺動臂25的自由端側的張力輥29下降,將保護帶PT朝下方往下推,藉以朝保護帶PT的放出方向L賦予張力。As shown in FIG. 1 , the tension mechanism 4 includes a cylinder 27 for vibrating a swing arm 25. The swing arm 25 supports an idler roller 28 on the main shaft of the fixed shaft, and includes a tension roller 29 on the free end side. The tension mechanism 4 is configured such that the tension roller 29 on the free end side of the swing arm 25 that swings in conjunction with the operation of the cylinder 27 descends, pushing the protective tape PT downward, thereby applying tension in the release direction L of the protective tape PT.
保持台5係圖1所示,具備有基部17和晶圓保持部31。基部17係構成為與晶圓保持部31的下部連接,可進行升降移動。晶圓保持部31係將表面側形成有電路圖案的晶圓W,以電路形成面朝上的狀態載置並加以保持。As shown in FIG1 , the holding table 5 includes a base 17 and a wafer holding portion 31. The base 17 is connected to the lower portion of the wafer holding portion 31 and is movable up and down. The wafer holding portion 31 holds and places a wafer W having a circuit pattern formed on its surface with the circuit pattern formed on the surface facing upward.
於晶圓保持部31的上面,為了使後述的刀刃9c沿著晶圓W的外形迴旋移動以將保護帶PT切斷,而形成有切刀行進溝33。本實施例中作為晶圓保持部31,係使用吸附保持晶圓W之夾盤台,但作為晶圓保持部31的構成,並不限定於此。A cutter travel groove 33 is formed on the upper surface of the wafer holding part 31 so that the blade 9c described later can rotate along the outer shape of the wafer W to cut the protective tape PT. In this embodiment, a chuck table that adsorbs and holds the wafer W is used as the wafer holding part 31, but the structure of the wafer holding part 31 is not limited to this.
帶貼附單元7係於被載置並吸附保持於保持台5之晶圓W的電路面貼附保護帶PT。帶貼附單元7係如圖1所示,具備有:可動台34,沿著未圖示的軌道在左右水平往復移動;及貼附輥35,在連接於可動台34的托架(bracket)樞轉。The tape attaching unit 7 attaches the protective tape PT to the conductive surface of the wafer W placed and held by suction on the holding table 5. As shown in FIG. 1 , the tape attaching unit 7 includes a movable table 34 that reciprocates horizontally left and right along a track (not shown) and an attaching roller 35 that pivots on a bracket connected to the movable table 34.
帶切斷單元9係於可驅動升降之可動台9a的下部,裝備有可繞位於保持台5的中心上之縱軸心P驅動迴旋的支持臂9b。又,於此支持臂9b的自由端側,裝設有刀尖朝下的切刀(cutter)9c。帶切斷單元9係配置於保持台5的上方,帶切斷單元9從初始位置下降而朝切斷位置移動,藉此以切刀9c的刀尖進入設於保持台5的切刀行進溝33之方式調整了各者的位置。亦即,構成為藉由支持臂9b以縱軸心P為迴旋中心迴旋,切刀9c沿著晶圓W的外周移動而將黏著帶T切下。The tape cutting unit 9 is provided at the lower part of a movable table 9a which can be driven to rise and fall, and is provided with a support arm 9b which can be driven to rotate around a longitudinal axis P located at the center of the holding table 5. Furthermore, a cutter 9c with a blade tip facing downward is provided at the free end side of the support arm 9b. The tape cutting unit 9 is arranged above the holding table 5, and the tape cutting unit 9 is lowered from an initial position and moves toward a cutting position, thereby adjusting the positions of each in such a way that the blade tip of the cutter 9c enters a cutter travel groove 33 provided on the holding table 5. That is, the support arm 9b is configured to rotate around the longitudinal axis P as the rotation center, and the cutter 9c moves along the outer periphery of the wafer W to cut off the adhesive tape T.
帶剝離單元11係使被切刀9c切下且貼附於晶圓W表面之保護帶PT(保護帶PTw)、與廢棄帶PTn分離,該廢棄帶PTn係保護帶PTw被切下後之不要的保護帶PT。帶剝離單元11具備有與第1張力機構4協同作動以維持黏著帶DT的張力之導輥46和夾輥(nip roller)47。The tape stripping unit 11 separates the protective tape PT (protective tape PTw) cut by the cutter 9c and attached to the surface of the wafer W from the waste tape PTn, which is the unnecessary protective tape PT after the protective tape PTw is cut off. The tape stripping unit 11 has a guide roller 46 and a nip roller 47 that cooperate with the first tensioning mechanism 4 to maintain the tension of the adhesive tape DT.
夾輥47係由可進行升降移動之壓輥(pinch roller)47a及藉由馬達驅動之進給輥47b所構成。帶剝離單元11係以可沿著未圖示的軌道在左右水平往復移動之方式構成。The pinch roller 47 is composed of a pinch roller 47a that can move up and down and a feed roller 47b that is driven by a motor. The tape stripping unit 11 is configured to be able to reciprocate horizontally in the left and right directions along a track (not shown).
帶回收部13係配設於帶剝離單元11的下游,成為捲取廢棄帶DTn的捲取機構49在捲取方向旋轉驅動。捲取機構49係構成為被未圖示的馬達控制正反地旋轉驅動。The tape recovery section 13 is disposed downstream of the tape stripping unit 11, and a take-up mechanism 49 for taking up the waste tape DTn is driven and rotated in a take-up direction. The take-up mechanism 49 is controlled and driven and rotated forward and reversely by a motor (not shown).
此外,黏著帶貼附裝置1進一步具備有控制部40和輸入部50。控制部40具備有CPU(中央演算處理裝置)等,集中控制黏著帶貼附裝置1的各種動作。作為輸入部50的例子,可列舉控制板(console panel)或鍵盤等,作業者可使用輸入部50輸入各種指示。輸入到輸入部50的指示內容被傳送到控制部40,控制部40可依據該指示進行各種集中控制。In addition, the adhesive tape applying device 1 further includes a control unit 40 and an input unit 50. The control unit 40 includes a CPU (central processing unit) and the like, and centrally controls various operations of the adhesive tape applying device 1. Examples of the input unit 50 include a console panel or a keyboard, and the operator can input various instructions using the input unit 50. The instruction content input to the input unit 50 is transmitted to the control unit 40, and the control unit 40 can perform various centralized controls according to the instruction.
<片材回收裝置的構成> 在此,針對相當於實施例1的片材回收裝置之襯墊回收部15的構成進行說明。襯墊回收部15係如圖2(a)等所示,具備有捲取機構51和切斷機構53。捲取機構51係將剝離襯墊S捲取並回收,具備有旋轉板55和捲取部57。旋轉板55係構成為被未圖示的馬達控制正反地旋轉驅動。捲取部57整體而言係延伸於z方向的圓筒狀的構件,豎立設置於旋轉板55的中央部。捲取部57係連同旋轉板55一起繞z方向的軸旋轉,藉此可將剝離襯墊S捲取於捲取部57的側面。 <Structure of sheet material recovery device> Here, the structure of the pad recovery section 15 of the sheet material recovery device corresponding to Example 1 is described. The pad recovery section 15 is as shown in FIG. 2(a) and the like, and has a winding mechanism 51 and a cutting mechanism 53. The winding mechanism 51 winds up and recovers the peeled pad S, and has a rotating plate 55 and a winding section 57. The rotating plate 55 is configured to be driven to rotate forward and reverse by a motor not shown in the figure. The winding section 57 is a cylindrical member extending in the z direction as a whole, and is vertically arranged in the center of the rotating plate 55. The winding portion 57 rotates together with the rotating plate 55 around the axis in the z direction, thereby rolling up the peeling pad S on the side of the winding portion 57.
構成捲取部57的外廓之筒狀構件58係成為中空,在呈曲面狀之筒狀構件58的側面形成有貫通孔59。實施例1中,如圖2等所示,在筒狀構件58的側面中相當於上側的位置形成有貫通孔59。又,於捲取部57的內部,配設有最大直徑調節機構61。最大直徑調節機構61係構成為可通過貫通孔59在捲取部57的徑向進退移動。本實施例中,由於貫通孔59形成為朝上,所以最大直徑調節機構61係構成為在圖2等的上下方向(符號G所示之方向)往復移動。在實施例1的捲取機構51中,構成為最大直徑調節機構61係通過貫通孔59在捲取部57的徑向進退移動,藉以使捲取部57之最大直徑的長度成為可變。The cylindrical member 58 constituting the outer contour of the take-up portion 57 is hollow, and a through hole 59 is formed on the side surface of the curved cylindrical member 58. In Embodiment 1, as shown in FIG. 2 and the like, a through hole 59 is formed on the side surface of the cylindrical member 58 at a position corresponding to the upper side. In addition, a maximum diameter adjustment mechanism 61 is provided inside the take-up portion 57. The maximum diameter adjustment mechanism 61 is configured to be able to move forward and backward in the radial direction of the take-up portion 57 through the through hole 59. In this embodiment, since the through hole 59 is formed to face upward, the maximum diameter adjustment mechanism 61 is configured to move back and forth in the up and down directions (directions indicated by symbol G) in FIG. 2 and the like. In the winding mechanism 51 of the first embodiment, the maximum diameter adjustment mechanism 61 is configured to move radially forward and backward in the winding portion 57 through the through hole 59, so that the length of the maximum diameter of the winding portion 57 becomes variable.
最大直徑調節機構61係如圖3所示,具備有突出構件63、缸體65和馬達67。缸體65係連接於突出構件63及馬達67,缸體65係以與馬達67的正反旋轉連動,朝捲取部57的徑向G伸縮動作之方式構成。亦即,突出構件63係成為依據缸體65的伸縮動作,可朝捲取部57的徑向G進退移動(可升降移動)。馬達67係如圖5(a)等所示般固定配置於筒狀構件58的內部。As shown in FIG3 , the maximum diameter adjustment mechanism 61 includes a protruding member 63, a cylinder 65, and a motor 67. The cylinder 65 is connected to the protruding member 63 and the motor 67, and the cylinder 65 is configured to extend and retract in the radial direction G of the take-up portion 57 in conjunction with the forward and reverse rotation of the motor 67. That is, the protruding member 63 is configured to be able to move forward and backward (and move up and down) in the radial direction G of the take-up portion 57 according to the extension and retraction of the cylinder 65. The motor 67 is fixedly arranged inside the cylindrical member 58 as shown in FIG5(a) and the like.
突出構件63具有大致長方體的形狀,其上面係成為曲面。突出構件63係於上面與剝離襯墊S抵接,將剝離襯墊S逐漸捲繞於捲取部57。以突出構件63上面的曲率與筒狀構件58側面的曲率相同者較佳。透過各者的面的曲率相同,使最大直徑調節機構61進退移動來調節突出構件63的位置,藉此可使突出構件63的上面與筒狀構件58的側面精確度佳地齊平。The protruding member 63 has a substantially rectangular parallelepiped shape, and its upper surface is a curved surface. The protruding member 63 contacts the peeling pad S on the upper surface, and gradually winds the peeling pad S around the winding portion 57. It is preferred that the curvature of the upper surface of the protruding member 63 is the same as the curvature of the side surface of the cylindrical member 58. By making the curvatures of the respective surfaces the same, the maximum diameter adjustment mechanism 61 is moved forward and backward to adjust the position of the protruding member 63, thereby making the upper surface of the protruding member 63 and the side surface of the cylindrical member 58 accurately aligned.
藉由缸體65伸張,突出構件63係通過貫通孔59而朝筒狀構件58的外側突出,且從初始位置朝突出位置移動。突出構件63朝突出位置移動而比筒狀構件58的側面更朝外側突出的狀態係如圖2(a)或圖5(a)所示。以下,將突出構件63已朝突出位置移動的狀態設為「突出狀態」。By the extension of the cylinder 65, the protruding member 63 protrudes toward the outer side of the cylindrical member 58 through the through hole 59 and moves from the initial position to the protruding position. The state in which the protruding member 63 moves toward the protruding position and protrudes further toward the outer side than the side surface of the cylindrical member 58 is shown in FIG. 2(a) or FIG. 5(a). Hereinafter, the state in which the protruding member 63 has moved toward the protruding position is referred to as the "protruding state".
藉由缸體65收縮,突出構件63係通過貫通孔59而埋没於筒狀構件58的內部,從突出位置朝初始位置移動。藉由突出構件63朝初始位置移動,突出狀態會被解除。又,藉由突出構件63朝初始位置移動,以筒狀構件58的外周面(側面)與突出構件63的外面(圖3中為上面)成為齊平之方式,調整初始位置的高度。突出構件63朝初始位置移動而埋没於筒狀構件58的內部的狀態係如圖2(b)或圖5(b)所示。以下,將突出構件63已朝初始位置移動的狀態稱為「埋没狀態」。As the cylinder body 65 contracts, the protruding member 63 is buried in the interior of the cylindrical member 58 through the through hole 59 and moves from the protruding position to the initial position. As the protruding member 63 moves toward the initial position, the protruding state is released. Furthermore, as the protruding member 63 moves toward the initial position, the height of the initial position is adjusted in such a way that the outer peripheral surface (side surface) of the cylindrical member 58 and the outer surface of the protruding member 63 (the top surface in FIG. 3 ) become flush. The state in which the protruding member 63 moves toward the initial position and is buried in the interior of the cylindrical member 58 is shown in FIG. 2(b) or FIG. 5(b). Hereinafter, the state in which the protruding member 63 has moved toward the initial position is referred to as the "buried state."
在突出構件63成為突出狀態之情況,捲取部57的最大直徑在圖5(a)中成為符號D1所示之長度。實施例1中,朝z方向延伸之筒狀構件58的中心軸Q到突出構件63的上面之距離,係相當於捲取部57的最大直徑。因此,在突出構件63成為突出狀態之情況,捲取部57的最大直徑的長度D1係比中心軸Q到筒狀構件58的外周面之距離E還長。When the protruding member 63 is in the protruding state, the maximum diameter of the roll-up portion 57 becomes the length indicated by the symbol D1 in FIG. 5( a). In Embodiment 1, the distance from the center axis Q of the cylindrical member 58 extending in the z direction to the top of the protruding member 63 is equivalent to the maximum diameter of the roll-up portion 57. Therefore, when the protruding member 63 is in the protruding state, the length D1 of the maximum diameter of the roll-up portion 57 is longer than the distance E from the center axis Q to the outer peripheral surface of the cylindrical member 58.
在突出構件63成為埋没狀態之情況,捲取部57的最大直徑在圖5(b)中成為符號D2所示的長度。在實施例1中突出構件63成為埋没狀態之情況,筒狀構件58的側面(外周面)與突出構件63的上面成為齊平。因此,在突出構件63成為埋没狀態之情況,捲取部57的最大直徑的長度D2係與從中心軸Q到筒狀構件58的外周面之距離E相等。藉此,突出狀態之捲取部57的最大直徑(長度D1)係比埋没狀態下之捲取部57的最大直徑(長度D2)還長。如此,構成為藉由在實施例1中使突出構件63進退移動,可調節捲取部57的最大直徑的長度。符號D1或符號D2所示之捲取部57的最大直徑相當於本實施例中之「捲取部的直徑」。When the protruding member 63 is buried, the maximum diameter of the roll-up portion 57 becomes the length indicated by the symbol D2 in FIG. 5( b). In Embodiment 1, when the protruding member 63 is buried, the side surface (peripheral surface) of the cylindrical member 58 is flush with the top surface of the protruding member 63. Therefore, when the protruding member 63 is buried, the length D2 of the maximum diameter of the roll-up portion 57 is equal to the distance E from the center axis Q to the peripheral surface of the cylindrical member 58. Thus, the maximum diameter (length D1) of the roll-up portion 57 in the protruding state is longer than the maximum diameter (length D2) of the roll-up portion 57 in the buried state. Thus, the length of the maximum diameter of the roll-up portion 57 can be adjusted by moving the protruding member 63 forward and backward in Embodiment 1. The maximum diameter of the roll-up portion 57 indicated by symbol D1 or symbol D2 is equivalent to the "diameter of the roll-up portion" in this embodiment.
在突出構件63的上面,形成有複數個吸附孔69。吸附孔69的各者係使突出構件63貫通於上下方向之貫通孔,透過流路70而與吸引裝置71連接。亦即,構成為藉由吸引裝置71作動,突出構件63係透過吸附孔69吸附保持剝離襯墊S。圖3中,為了方便說明,將配設於突出構件63之12個吸附孔69僅其中一者為貫通孔之意旨以虛線表示,並且與吸引裝置71連接。然而,實際上,全部的吸附孔69係貫通至突出構件63的底面,而與吸引裝置71連接。吸引裝置71係配設於筒狀構件58的內部。但是,圖12等中,為了方便說明,記載了吸引裝置71係在捲取部57的外側。A plurality of adsorption holes 69 are formed on the top of the protruding member 63. Each of the adsorption holes 69 is a through hole that allows the protruding member 63 to pass through the up-down direction, and is connected to the suction device 71 through the flow path 70. That is, the protruding member 63 is configured to adsorb and hold the peeling pad S through the adsorption holes 69 when the suction device 71 is actuated. In Figure 3, for the sake of convenience, only one of the 12 adsorption holes 69 provided on the protruding member 63 is a through hole, which is indicated by a dotted line and is connected to the suction device 71. However, in reality, all of the adsorption holes 69 are passed through the bottom surface of the protruding member 63 and are connected to the suction device 71. The suction device 71 is provided inside the cylindrical member 58. However, in FIG. 12 and the like, for convenience of explanation, the suction device 71 is shown on the outer side of the take-up portion 57.
切斷機構53係將被捲取機構51引導的剝離襯墊S在寬度方向切斷,具備有切刀保持器72和切刀73。切刀保持器72係以藉由未圖示的驅動機構,可在接近被捲取機構51所引導的剝離襯墊S之方向、與該剝離襯墊S的寬度方向分別往復移動之方式構成。切刀73係配設於切刀保持器72的前端,連同切刀保持器72一起朝各方向往復移動。The cutting mechanism 53 cuts the peeling pad S guided by the winding mechanism 51 in the width direction, and has a cutter holder 72 and a cutter 73. The cutter holder 72 is configured to be reciprocated in a direction approaching the peeling pad S guided by the winding mechanism 51 and in the width direction of the peeling pad S by a driving mechanism (not shown). The cutter 73 is disposed at the front end of the cutter holder 72, and reciprocates in all directions together with the cutter holder 72.
實施例1中,在襯墊回收部15的附近,剝離襯墊S係以寬度方向成為z方向之方式搬送。又,在襯墊回收部15的附近,由於剝離襯墊S的放出方向M係與y方向平行,所以與剝離襯墊S的面垂直之方向為x方向。亦即,與剝離襯墊S接近或分離之方向係相當於x方向。因此,實施例1中,切刀保持器72係以連同切刀73一起可朝x方向及z方向往復移動之方式構成。In the first embodiment, the peeling pad S is conveyed in the vicinity of the pad recovery section 15 in such a manner that the width direction becomes the z direction. Also, in the vicinity of the pad recovery section 15, since the release direction M of the peeling pad S is parallel to the y direction, the direction perpendicular to the surface of the peeling pad S is the x direction. That is, the direction approaching or separating from the peeling pad S is equivalent to the x direction. Therefore, in the first embodiment, the cutter holder 72 is constructed in such a manner that it can reciprocate in the x direction and the z direction together with the cutter 73.
藉由切刀保持器72朝x方向移動,切斷機構53係朝x方向在退避位置與切斷位置之間往復移動。退避位置係切刀73相對於剝離襯墊S分離的位置。此外,圖1係表示切斷機構53移動至退避位置之狀態。切斷位置係以切刀73可切斷剝離襯墊S的程度,接近剝離襯墊S之位置。藉由在切斷機構53朝切斷位置移動的狀態下使切刀保持器72朝z方向移動,藉此切刀73將剝離襯墊S在寬度方向切斷。By moving the cutter holder 72 in the x direction, the cutting mechanism 53 reciprocates between the retreat position and the cutting position in the x direction. The retreat position is a position where the cutter 73 is separated from the peeling liner S. In addition, FIG. 1 shows a state where the cutting mechanism 53 moves to the retreat position. The cutting position is a position close to the peeling liner S to the extent that the cutter 73 can cut the peeling liner S. By moving the cutter holder 72 in the z direction while the cutting mechanism 53 moves to the cutting position, the cutter 73 cuts the peeling liner S in the width direction.
<貼附動作的概要> 此處,說明使用黏著帶貼附裝置1,用以將保護帶PT貼附於晶圓W上之一連串的基本動作。圖6(a)係說明將保護帶PT貼附於晶圓W的工序之流程圖。 <Overview of the attaching operation> Here, a series of basic operations for attaching the protective tape PT to the wafer W using the adhesive tape attaching device 1 are described. FIG. 6(a) is a flow chart illustrating the process of attaching the protective tape PT to the wafer W.
貼附指令一發出時,首先使工件載置於保持台5。亦即,收納於既定的收納部之晶圓W係在對準台進行對位後,藉由未圖示的晶圓搬送機構載置於保持台5。載置於保持台5所具備的晶圓保持部31之晶圓W被迴旋,且在以晶圓W的中心位於保持台5的中心上之方式被對位的狀態下被吸附保持。(步驟S1)。When the attaching command is issued, the workpiece is first placed on the holding table 5. That is, the wafer W stored in the predetermined storage portion is placed on the holding table 5 by a wafer transfer mechanism (not shown) after being aligned on the alignment table. The wafer W placed on the wafer holding portion 31 provided on the holding table 5 is rotated and held by suction in a state where the center of the wafer W is positioned on the center of the holding table 5 (step S1).
此時,帶貼附單元7、帶切斷單元9及帶剝離單元11的各者係移動到圖7所示的初始位置。亦即,帶貼附單元7移動到保持台5的右側,帶剝離單元11移動到保持台5的左側。又,帶切斷單元9係在保持台5的上方待機。At this time, the tape attaching unit 7, the tape cutting unit 9 and the tape stripping unit 11 are moved to the initial position shown in Fig. 7. That is, the tape attaching unit 7 moves to the right side of the holding table 5, and the tape stripping unit 11 moves to the left side of the holding table 5. The tape cutting unit 9 is on standby above the holding table 5.
此外,帶供給部3中,添設有剝離襯墊S的保護帶PT係從裝填於供給筒管19的原材卷20朝下游被放出並供給。接著,藉由剝離輥21將剝離襯墊S從保護帶PT剝離。剝離襯墊S經剝離後的保護帶PT,係被引導至帶貼附單元7及帶剝離單元11。從保護帶PT被剝離後的剝離襯墊S,係朝襯墊回收部15被引導。Furthermore, in the tape supply section 3, the protective tape PT to which the peeling pad S is added is unwound and supplied downstream from the raw material roll 20 loaded on the supply bobbin 19. Then, the peeling pad S is peeled off from the protective tape PT by the peeling roller 21. The protective tape PT after the peeling pad S is peeled off is guided to the tape attaching unit 7 and the tape peeling unit 11. The peeling pad S after being peeled off from the protective tape PT is guided toward the pad recovery section 15.
使工件載置於保持台5後,如圖8所示,帶貼附單元7的貼附輥35係將黏著帶T一邊往下方推壓一邊在晶圓W上往前方(圖8中為左方)轉動,從虛線所示的初始位置朝實線所示的終端位置移動。藉此,保護帶PT被貼附於晶圓W的表面整體(步驟S2)。After the workpiece is placed on the holding table 5, as shown in FIG8, the attaching roller 35 of the tape attaching unit 7 pushes the adhesive tape T downward while rotating forward (to the left in FIG8) on the wafer W, moving from the initial position shown by the dotted line to the terminal position shown by the solid line. Thus, the protective tape PT is attached to the entire surface of the wafer W (step S2).
保護帶PT被貼附於晶圓W後,如圖9所示,在上方待機的帶切斷單元9下降,從虛線所示的初始位置朝實線所示的切斷位置移動。接著,帶切斷單元9朝切斷位置下降,藉此切刀9c在保持台5的切刀行進溝33刺入保護帶PT。After the protective tape PT is attached to the wafer W, as shown in FIG9 , the tape cutting unit 9 waiting above descends and moves from the initial position shown by the dotted line to the cutting position shown by the solid line. Then, the tape cutting unit 9 descends toward the cutting position, whereby the cutter 9 c penetrates the protective tape PT in the cutter travel groove 33 of the holding table 5 .
當切刀9c一刺入保護帶PT時,支持臂9b便以縱軸心P作為迴旋中心而迴旋。伴隨地,切刀9c一邊沿著晶圓W的外周緣滑接一邊迴旋移動,保護帶PT沿著晶圓的外形被切斷(步驟S3)。When the cutter 9c penetrates the protective tape PT, the support arm 9b rotates with the longitudinal axis P as the rotation center. Concomitantly, the cutter 9c rotates while sliding along the outer periphery of the wafer W, and the protective tape PT is cut along the outer shape of the wafer (step S3).
沿著晶圓W外形之保護帶PT的切斷一結束,帶切斷單元9便上升至原本的待機位置為止。帶貼附單元7從終端位置返回初始位置。帶貼附單元7朝初始位置返回,並且如圖10所示,帶剝離單元11朝後方(圖10中右方)移動。亦即,帶剝離單元11係從圖10中虛線所示的初始位置朝實線所示的終端位置往右方移動。Once the cutting of the protective tape PT along the outer shape of the wafer W is completed, the tape cutting unit 9 rises to the original standby position. The tape attaching unit 7 returns to the initial position from the terminal position. The tape attaching unit 7 returns to the initial position, and as shown in FIG10 , the tape stripping unit 11 moves backward (to the right in FIG10 ). That is, the tape stripping unit 11 moves to the right from the initial position shown by the dotted line in FIG10 to the terminal position shown by the solid line.
帶剝離單元11係一邊朝終端位置移動,一邊將保護帶PT中之在晶圓W上被切下切斷而殘留的廢棄帶PTn捲起並剝離(步驟S4)。此外,針對保護帶PT中之被貼附於晶圓W表面的部分,賦予符號PTw以與廢棄帶PTn作區別。The tape stripping unit 11 rolls up and strips the waste tape PTn remaining after being cut off from the wafer W in the protective tape PT while moving toward the terminal position (step S4). In addition, the portion of the protective tape PT attached to the surface of the wafer W is given a symbol PTw to distinguish it from the waste tape PTn.
當帶剝離單元11到達終端位置而結束剝離作業時,帶剝離單元11便從終端位置返回初始位置。此時,廢棄帶Tn朝下游被放出並朝帶回收部13引導,藉由捲取機構49捲取成卷狀而回收。When the tape stripping unit 11 reaches the terminal position and finishes the stripping operation, the tape stripping unit 11 returns to the initial position from the terminal position. At this time, the waste tape Tn is released downstream and guided toward the tape recovery section 13, and is rolled up by the winding mechanism 49 and recovered.
接著,廢棄帶Tn朝下游被放出,同時一定量的保護帶PT從配置於帶供給部3的原材卷20被放出。接著,剝離襯墊S係被剝離輥21從保護帶PT剝離,一定量的保護帶PT被引導至帶貼附單元7及帶剝離單元11。從保護帶PT被剝離的一定量的剝離襯墊S,係朝襯墊回收部15被引導並回收。Then, the waste tape Tn is released downstream, and at the same time, a certain amount of the protective tape PT is released from the raw material roll 20 arranged in the tape supply part 3. Then, the peeling pad S is peeled off from the protective tape PT by the peeling roller 21, and a certain amount of the protective tape PT is guided to the tape applying unit 7 and the tape peeling unit 11. The certain amount of the peeling pad S peeled off from the protective tape PT is guided to the pad recovery part 15 and recovered.
至步驟S4為止的各處理一結束,在保持台5的吸附便被解除。吸附解除之後,貼附有保護帶PTw的晶圓W係被晶圓搬送機構所搬送並回收至未圖示的晶圓回收部(步驟S5)。以上,完成1次的黏著帶貼附處理。以下,重複進行步驟S1至步驟S5的工序,直到保護帶PT被貼附於既定片數的晶圓W為止。Once the processes up to step S4 are completed, the adsorption of the holding table 5 is released. After the adsorption is released, the wafer W with the protective tape PTw attached is transported by the wafer transport mechanism and recovered to the wafer recovery unit (not shown) (step S5). Above, one adhesive tape attachment process is completed. Hereinafter, the process from step S1 to step S5 is repeated until the protective tape PT is attached to a predetermined number of wafers W.
<片材的回收工序的說明> 在此,針對用以使從保護帶PT剝離的剝離襯墊S藉由襯墊回收部15回收之一連串的工序進行說明。圖6(b)係說明回收剝離襯墊S的工序之流程圖。 <Description of the sheet material recovery process> Here, a series of processes for recovering the peeling pad S peeled off from the protective tape PT by the pad recovery unit 15 will be described. FIG6(b) is a flow chart for describing the process of recovering the peeling pad S.
步驟T1(使捲取部的直徑增大) 在開始進行貼附保護帶PT的動作之前,必須進行使剝離襯墊S引導至襯墊回收部15並加以固定之操作,使得襯墊回收部15可捲取剝離襯墊S。接著,在實施例1中,在使剝離襯墊S固定於襯墊回收部15之前,進行使捲取部57的直徑增大之操作。實施例1中,藉由使突出構件63上升而使捲取部57的直徑增大。亦即,控制部40係使最大直徑調節機構61所具備的馬達67旋轉。藉由馬達67旋轉,缸體65會伸長且突出構件63從埋没位置朝突出位置上升移動。 Step T1 (increasing the diameter of the take-up section) Before starting the operation of attaching the protective tape PT, the peeling pad S must be guided to the pad recovery section 15 and fixed so that the pad recovery section 15 can take up the peeling pad S. Next, in Embodiment 1, before the peeling pad S is fixed to the pad recovery section 15, the diameter of the take-up section 57 is increased. In Embodiment 1, the diameter of the take-up section 57 is increased by raising the protruding member 63. That is, the control section 40 rotates the motor 67 of the maximum diameter adjustment mechanism 61. As the motor 67 rotates, the cylinder 65 is extended and the protruding member 63 moves upward from the buried position to the protruding position.
藉由突出構件63朝突出位置移動,襯墊回收部15的狀態係從圖2(b)所示的埋没狀態變成圖2(a)所示的突出狀態。亦即,藉由突出構件63上升,成為形成有吸附孔69的突出構件63的上面朝筒狀構件58的外側突出之狀態。藉由突出構件63從埋没狀態變成突出狀態,如圖2(a)及圖2(b)所示,捲取部57的最大直徑係從D2朝D1增大。As the protruding member 63 moves toward the protruding position, the state of the pad recovery portion 15 changes from the buried state shown in FIG. 2(b) to the protruding state shown in FIG. 2(a). That is, as the protruding member 63 rises, the upper surface of the protruding member 63 formed with the adsorption hole 69 protrudes toward the outer side of the cylindrical member 58. As the protruding member 63 changes from the buried state to the protruding state, as shown in FIG. 2(a) and FIG. 2(b), the maximum diameter of the take-up portion 57 increases from D2 to D1.
步驟T2(固定片材的前端) 在使突出構件63上升到突出位置以使捲取部57的直徑增大後,進行使剝離襯墊S的前端固定於捲取部57之操作。亦即,如圖11所示,將藉由剝離輥21從保護帶PT剝離的剝離襯墊S抽出,使剝離襯墊S的前端部St朝襯墊回收部15引導。剝離襯墊S被搬送的方向係如符號M所示。接著,進一步將剝離襯墊S抽出,如圖12所示,使剝離襯墊S的前端部St接近形成有吸附孔69之突出構件63的上面。 Step T2 (Fixing the front end of the sheet) After the protruding member 63 is raised to the protruding position to increase the diameter of the winding section 57, the front end of the peeling pad S is fixed to the winding section 57. That is, as shown in FIG11, the peeling pad S peeled off from the protective tape PT by the peeling roller 21 is pulled out, and the front end St of the peeling pad S is guided toward the pad recovery section 15. The direction in which the peeling pad S is conveyed is indicated by the symbol M. Then, the peeling pad S is further pulled out, and as shown in FIG12, the front end St of the peeling pad S is close to the top of the protruding member 63 formed with the adsorption hole 69.
在使剝離襯墊S的前端部St接近突出構件63的上面之狀態下,如圖13所示,控制部40係使吸引裝置71作動。吸引裝置71係透過吸附孔69吸引空氣Ar,藉以使剝離襯墊S的前端部St與吸附孔69之間的空間減壓。因此,藉由吸引裝置71作動,剝離襯墊S的前端部St會被吸附保持於突出構件63的上面。如此,實施例1中,藉由空氣吸引方式,剝離襯墊S的前端部St會被固定於捲取部57。藉由剝離襯墊S固定於捲取部57,而形成從帶供給部3朝襯墊回收部15自動地搬送剝離襯墊S之路徑。In a state where the front end St of the peeling pad S is close to the top of the protruding member 63, as shown in FIG13, the control unit 40 activates the suction device 71. The suction device 71 sucks air Ar through the suction holes 69 to reduce the pressure in the space between the front end St of the peeling pad S and the suction holes 69. Therefore, by the actuation of the suction device 71, the front end St of the peeling pad S is sucked and held on the top of the protruding member 63. In this way, in Example 1, the front end St of the peeling pad S is fixed to the take-up portion 57 by air suction. By fixing the peeling liner S to the take-up portion 57, a path for automatically conveying the peeling liner S from the tape supply portion 3 to the liner recovery portion 15 is formed.
步驟T3(片材的捲取) 在使剝離襯墊S的前端St固定於襯墊回收部15之後,開始進行將保護帶PT貼附於晶圓W之操作,並且開始進行將剝離襯墊S利用襯墊回收部15進行捲取之操作。亦即,控制部40係一邊將吸引裝置71控制在開啟(on)的狀態,一邊使旋轉板55繞著z方向的軸旋轉。如圖14所示,由於捲取部57的筒狀構件58係連同旋轉板55一起繞著z方向的軸旋轉,所以固定於捲取部57的剝離襯墊S係沿著筒狀構件58的側面捲繞而逐漸被捲取。此外,圖14係表示從圖13所示的狀態,使捲取部57逆時鐘旋轉270°之狀態。 Step T3 (rolling up the sheet) After the front end St of the peeling pad S is fixed to the pad recovery unit 15, the operation of attaching the protective tape PT to the wafer W is started, and the operation of rolling up the peeling pad S using the pad recovery unit 15 is started. That is, the control unit 40 controls the suction device 71 to be turned on while rotating the rotating plate 55 around the axis in the z direction. As shown in FIG14, since the cylindrical member 58 of the winding section 57 rotates together with the rotating plate 55 around the axis in the z direction, the peeling pad S fixed to the winding section 57 is wound along the side of the cylindrical member 58 and is gradually wound. In addition, FIG14 shows the state in which the winding section 57 is rotated 270° counterclockwise from the state shown in FIG13.
實施例1的襯墊回收部15,係在開始步驟T3之前使突出構件63朝突出位置上升,使突出構件63突出至比筒狀構件58更靠外側。亦即,在步驟T3開始前,捲取部57的最大直徑增大為D1,變得比筒狀構件58之外徑的長度E更長。In the liner recovery unit 15 of the first embodiment, the protruding member 63 is raised to the protruding position before starting step T3, so that the protruding member 63 protrudes to the outside of the cylindrical member 58. That is, before starting step T3, the maximum diameter of the winding unit 57 increases to D1, which becomes longer than the length E of the outer diameter of the cylindrical member 58.
因此,當使最大直徑增大為D1的捲取部57旋轉以使剝離襯墊S逐漸捲取時,至少抵接於突出構件63的剝離襯墊S,係從筒狀構件58的側面離開而逐漸捲繞於突出構件63的上面(外周面)。亦即,至少一部分的剝離襯墊S沒有密接於筒狀構件58的側面,而成為從筒狀構件58的側面離開的狀態。因此,藉由在使突出構件63突出至筒狀構件58的外側以使捲取部57的最大直徑比筒狀構件58的外徑的長度E還長的狀態下逐漸捲取剝離襯墊S,剝離襯墊S被捲取的周長與筒狀構件58的外周的長度相較之下,係因應突出構件63突出於筒狀構件58的外側之部分的長度而變長。Therefore, when the roll-up portion 57 whose maximum diameter is increased to D1 is rotated to gradually roll up the peeling pad S, at least the peeling pad S that is in contact with the protruding member 63 is separated from the side surface of the cylindrical member 58 and is gradually wound around the upper surface (outer peripheral surface) of the protruding member 63. That is, at least a portion of the peeling pad S is not in close contact with the side surface of the cylindrical member 58, but is separated from the side surface of the cylindrical member 58. Therefore, by gradually rolling up the peeling pad S in a state where the protruding member 63 is made to protrude to the outside of the cylindrical member 58 so that the maximum diameter of the rolling portion 57 is longer than the length E of the outer diameter of the cylindrical member 58, the circumference of the rolled-up peeling pad S is compared with the length of the outer circumference of the cylindrical member 58, which is longer in accordance with the length of the portion of the protruding member 63 protruding from the outside of the cylindrical member 58.
隨著進行使保護帶PT貼附於晶圓W的工序,保護帶PT從帶供給部3逐次被放出。因應保護帶PT被放出的量,藉由剝離輥21將剝離襯墊S從保護帶PT剝離,剝離襯墊沿著放出方向M逐次被搬送。捲取部57係依據剝離襯墊S被搬送的速度適當地旋轉,將朝襯墊回收部15送出的剝離襯墊S捲取。As the process of attaching the protective tape PT to the wafer W is performed, the protective tape PT is successively discharged from the tape supply unit 3. According to the amount of the protective tape PT discharged, the peeling pad S is peeled off from the protective tape PT by the peeling roller 21, and the peeling pad is successively transported along the discharge direction M. The take-up unit 57 rotates appropriately according to the speed at which the peeling pad S is transported, and takes up the peeling pad S sent to the pad recovery unit 15.
隨著持續進行捲取剝離襯墊S的動作,被捲取於捲取部57之剝離襯墊S的量會漸漸增加,如圖15所示,成為卷(roll)狀的剝離襯墊S被捲繞於捲取部57之狀態。關於成為卷狀的剝離襯墊S,在圖15等中係標註符號SR來表示。As the peeling liner S is rolled up, the amount of the peeling liner S rolled up by the roll-up unit 57 gradually increases, and as shown in FIG15 , the peeling liner S is rolled up by the roll-up unit 57. The peeling liner S rolled up is denoted by reference symbol SR in FIG15 and the like.
步驟T3的動作係持續進行直到捲繞於捲取部57之剝離襯墊S的量超過預定的閾値為止。該閾値係可因應捲取部57能夠捲取剝離襯墊S的最大容量來適當制定。在捲繞於捲取部57之剝離襯墊S的量超過閾値之情況,從步驟T3朝步驟T4進行。捲繞於捲取部57之剝離襯墊S的量,就一例而言,係可藉由檢測捲取部57的旋轉數之旋轉感測器、或檢測所捲繞之剝離襯墊S的卷SR的厚度之感測器等來測定。The operation of step T3 is continued until the amount of the peeling pad S wound on the take-up section 57 exceeds a predetermined threshold value. The threshold value can be appropriately determined in response to the maximum capacity of the peeling pad S that the take-up section 57 can roll up. When the amount of the peeling pad S wound on the take-up section 57 exceeds the threshold value, the process proceeds from step T3 to step T4. The amount of the peeling pad S wound around the take-up section 57 can be measured, for example, by a rotation sensor that detects the number of rotations of the take-up section 57 or a sensor that detects the thickness of the roll SR of the wound peeling pad S.
步驟T4(片材的切斷) 在捲繞於捲取部57之剝離襯墊S的量超過閾値之情況,必須將積存於捲取部57之剝離襯墊S的卷SR從襯墊回收部15去除。為了將卷SR從襯墊回收部15去除,進行步驟T4至步驟T6的工序。 Step T4 (cutting of the sheet) When the amount of the peeling pad S wound on the take-up section 57 exceeds the threshold value, the roll SR of the peeling pad S accumulated on the take-up section 57 must be removed from the pad recovery section 15. In order to remove the roll SR from the pad recovery section 15, the process from step T4 to step T6 is performed.
在步驟T4的工序中,將片材亦即剝離襯墊S沿寬度方向切斷。首先,控制部40係控制未圖示的驅動機構以使切斷機構53朝接近剝離襯墊S的方向移動。亦即,如圖16所示,切斷機構53係從虛線所示的初始位置朝實線所示的切斷位置沿x方向移動。藉由朝切斷位置移動,切刀73的刀刃在前視圖觀察下係與剝離襯墊S交叉。In the process of step T4, the sheet material, i.e., the peeling pad S, is cut in the width direction. First, the control unit 40 controls the driving mechanism (not shown) to move the cutting mechanism 53 in the direction approaching the peeling pad S. That is, as shown in FIG. 16 , the cutting mechanism 53 moves in the x direction from the initial position shown by the dotted line to the cutting position shown by the solid line. By moving to the cutting position, the blade of the cutter 73 intersects with the peeling pad S in the front view.
在切斷機構53朝切斷位置移動後,控制部40係控制驅動機構以使切斷機構53朝剝離襯墊S的寬度方向(實施例1中的z方向)移動。亦即,藉由切斷機構53朝z方向水平移動,切刀73會將剝離襯墊S朝寬度方向切斷。其結果,如圖17所示,捲取於捲取部57之剝離襯墊的卷SR會與和帶供給部3相接之後續的剝離襯墊S(以下,設為「後續襯墊Sd」)分離。藉由將剝離襯墊S切斷以使卷SR與後續襯墊Sd分離,而完成步驟T4的工序。After the cutting mechanism 53 moves to the cutting position, the control unit 40 controls the driving mechanism to move the cutting mechanism 53 in the width direction (z direction in the first embodiment) of the stripping pad S. That is, by the horizontal movement of the cutting mechanism 53 in the z direction, the cutter 73 cuts the stripping pad S in the width direction. As a result, as shown in FIG. 17 , the stripping pad roll SR wound on the winding unit 57 is separated from the subsequent stripping pad S (hereinafter referred to as "subsequent pad Sd") connected to the tape supply unit 3. The process of step T4 is completed by cutting the peeling liner S to separate the roll SR from the subsequent liner Sd.
步驟T5(減少捲取部的直徑) 在使剝離襯墊S沿寬度方向切斷後,進行使捲取部57的直徑減少之操作。實施例1中,藉由使最大直徑調節機構61所具備的突出構件63下降,使捲取部57的直徑減少。首先,控制部40係使吸引裝置71停止,以使透過吸附孔69吸附保持剝離襯墊S的前端部St之情況解除。接著,控制部40控制馬達67的旋轉以使缸體65收縮。藉由缸體65收縮,突出構件63係如圖18所示般從突出位置朝埋没位置下降。由於透過吸附孔69吸附保持前端部St的吸附保持之情況被解除,所以形成有吸附孔69的突出構件63係從前端部St分離而埋没於筒狀構件58的內部。 Step T5 (reducing the diameter of the take-up section) After the peeling pad S is cut in the width direction, the operation of reducing the diameter of the take-up section 57 is performed. In Embodiment 1, the diameter of the take-up section 57 is reduced by lowering the protruding member 63 provided in the maximum diameter adjustment mechanism 61. First, the control section 40 stops the suction device 71 to release the situation in which the front end portion St of the peeling pad S is adsorbed and held through the adsorption hole 69. Then, the control section 40 controls the rotation of the motor 67 to shrink the cylinder 65. As the cylinder 65 shrinks, the protruding member 63 descends from the protruding position to the buried position as shown in FIG. 18. Since the suction holding of the front end portion St by the suction hole 69 is released, the protruding member 63 formed with the suction hole 69 is separated from the front end portion St and buried inside the cylindrical member 58.
步驟T3中,在捲取部57的最大直徑變得比筒狀構件58的外徑E還長的狀態下,將剝離襯墊S以捲取部57逐漸捲取。因此,在步驟T3中所形成之卷SR的內周的長度,係比筒狀構件58的外周的長度還長。在突出構件63朝突出位置上升的情況,卷SR的內周承受因突出構件63所致之朝向外側的力F。因此,剝離襯墊S的卷SR,會成為偏向靠近突出構件63之側(圖18中為上側)的形狀。換言之,在步驟T3中,在遠離突出構件63之側(圖18中為下側)呈現卷SR和筒狀構件58的外周面密接之傾向。In step T3, the stripping pad S is gradually rolled up by the roll-up portion 57 in a state where the maximum diameter of the roll-up portion 57 becomes longer than the outer diameter E of the cylindrical member 58. Therefore, the length of the inner circumference of the roll SR formed in step T3 is longer than the length of the outer circumference of the cylindrical member 58. When the protruding member 63 rises toward the protruding position, the inner circumference of the roll SR receives the outward force F caused by the protruding member 63. Therefore, the roll SR of the stripping pad S becomes a shape that is biased toward the side close to the protruding member 63 (the upper side in FIG. 18). In other words, in step T3, the roll SR and the outer peripheral surface of the cylindrical member 58 are inclined to be in close contact with each other on the side away from the protruding member 63 (the lower side in FIG. 18 ).
在此當使突出構件63下降至埋没位置時,則如圖18所示,存在有處於突出狀態的突出構件63之空間係成為間隙部Vb。又,當使突出構件63下降到埋没位置時,藉由突出構件63將卷SR朝外側推壓的力F會變成不作用。因此,因力F所產生之剝離襯墊S的偏移會被解消,間隙部Vb逐漸擴展到卷SR與捲取部57之間的空間整體。其結果,如圖19所示,藉由使突出構件63下降到埋没位置,會在筒狀構件58的外周整體與卷SR的內周整體之間形成間隙部Vb。亦即,藉由使突出構件63下降到埋没位置,會在捲取部57與剝離襯墊S接觸的部分整體形成間隙部Vb,所以在剝離襯墊S所接觸之筒狀構件58的外周整體,產生於捲取部57與剝離襯墊S的卷SR之間的摩擦力會消失或大幅減少。藉由使捲取部57的直徑減少以在捲取部57與剝離襯墊S之間的空間整體形成間隙部Vb,而完成步驟T5的工序。Here, when the protruding member 63 is lowered to the buried position, as shown in FIG18, the space where the protruding member 63 is in the protruding state becomes the gap portion Vb. In addition, when the protruding member 63 is lowered to the buried position, the force F that pushes the roll SR outward by the protruding member 63 becomes ineffective. Therefore, the displacement of the peeling pad S caused by the force F is eliminated, and the gap portion Vb gradually expands to the entire space between the roll SR and the winding portion 57. As a result, as shown in FIG19, by lowering the protruding member 63 to the buried position, a gap portion Vb is formed between the entire outer periphery of the tubular member 58 and the entire inner periphery of the roll SR. That is, by lowering the protruding member 63 to the buried position, the gap portion Vb is formed in the entire portion where the take-up portion 57 contacts the peeling pad S, so the friction force generated between the take-up portion 57 and the roll SR of the peeling pad S is eliminated or greatly reduced in the entire outer periphery of the cylindrical member 58 that contacts the peeling pad S. By reducing the diameter of the take-up portion 57 to form the gap portion Vb in the entire space between the take-up portion 57 and the peeling pad S, the process of step T5 is completed.
步驟T6(片材的回收) 在使捲取部57的直徑減少以使間隙部Vb形成於捲取部57與剝離襯墊S之間後,將捲取於捲取部57的剝離襯墊S回收。亦即,如圖20所示,將捲取於捲取部57而積存之剝離襯墊S的卷SR沿捲取部57的軸向(實施例1中為z方向)抽出,藉此將卷SR從捲取部57回收。抽出卷SR的方向,在圖20中係標註符號H來表示。 Step T6 (sheet recovery) After reducing the diameter of the winding section 57 so that the gap Vb is formed between the winding section 57 and the peeling pad S, the peeling pad S wound on the winding section 57 is recovered. That is, as shown in FIG20, the roll SR of the peeling pad S wound on the winding section 57 and accumulated is pulled out along the axial direction of the winding section 57 (z direction in Embodiment 1), thereby recovering the roll SR from the winding section 57. The direction of pulling out the roll SR is indicated by the reference symbol H in FIG20.
從捲取部57被回收之剝離襯墊S的卷SR,係可通過開閉門75等朝黏著帶貼附裝置1的外部取出。將卷SR從捲取部57抽出以使捲取部57與卷SR分離的操作亦可以手動來進行,亦可使用作業機器人等自動地進行。The roll SR from which the liner S is removed and recovered from the take-up section 57 can be taken out of the adhesive tape applying device 1 through the door 75 or the like. The operation of pulling the roll SR out of the take-up section 57 to separate the take-up section 57 from the roll SR can be performed manually or automatically using a working robot or the like.
在進行步驟T6的操作之時點,突出構件63下降至埋没位置,間隙部Vb係涵蓋捲取部57與剝離襯墊S的卷SR之間之大致整個區域而擴大。因此,在將卷SR從捲取部57抽出之際,產生於卷SR和捲取部57(筒狀構件58的側面)之間的摩擦力會消失或大幅降低。因此,在不會受到作用於卷SR與捲取部57之間的摩擦力所產生之妨害的情況下,操作者藉由沿z方向施加較小的力,可容易地將卷SR從捲取部57抽出。因此,可避免在進行抽出的操作之際因施加過量的力,而使捲取部57的軸或形狀等偏斜。At the time of performing the operation of step T6, the protruding member 63 descends to the buried position, and the gap portion Vb is expanded to cover substantially the entire area between the take-up portion 57 and the roll SR of the stripping pad S. Therefore, when the roll SR is pulled out from the take-up portion 57, the friction force generated between the roll SR and the take-up portion 57 (the side surface of the tubular member 58) disappears or is greatly reduced. Therefore, the operator can easily pull the roll SR out of the take-up portion 57 by applying a small force in the z direction without being hindered by the friction force acting between the roll SR and the take-up portion 57. Therefore, it is possible to avoid the axis or shape of the take-up portion 57 being deflected due to the application of excessive force during the extraction operation.
又,由於在進行步驟T6的操作之時點,突出構件63係下降至埋没位置,所以突出構件63的上面與筒狀構件58的外周面會齊平。亦即,在將卷SR從捲取部57抽出的操作中,可避免突出構件63從筒狀構件58的外周面往外側突出的部分干擾到卷SR之情況。因此,可進一步降低在將卷SR從捲取部57抽出的操作上所需要的力。Furthermore, since the protruding member 63 is lowered to the buried position at the time of the operation of step T6, the upper surface of the protruding member 63 is flush with the outer peripheral surface of the cylindrical member 58. That is, in the operation of pulling out the roll SR from the take-up portion 57, the portion of the protruding member 63 protruding outward from the outer peripheral surface of the cylindrical member 58 can be prevented from interfering with the roll SR. Therefore, the force required for the operation of pulling out the roll SR from the take-up portion 57 can be further reduced.
藉由從步驟T1到T6之一連串的工序,完成以捲取部57捲取剝離襯墊S,並將捲取成卷狀的剝離襯墊S回收之操作。在持續進行將保護帶PT貼附於既定片數的晶圓W之操作的情況,從步驟T6返回步驟T1以重複進行步驟T1至步驟T6的操作。亦即,使突出構件63再度朝突出位置上升(步驟T1)。接著,將圖20等所示的後續襯墊Sd沿放出方向M抽出,使後續襯墊Sd的前端部引導至突出構件63的上面,使吸引裝置71作動以使該前端部固定於突出構件63的上面(步驟T2)。以下,執行步驟T3至步驟T6的操作以將剝離襯墊S再度回收。By a series of processes from step T1 to T6, the peeling pad S is rolled up by the take-up unit 57, and the peeling pad S rolled up is recovered. While the operation of attaching the protective tape PT to a predetermined number of wafers W is continued, the operation from step T6 to step T1 is returned to repeat the operation from step T1 to step T6. That is, the protruding member 63 is raised toward the protruding position again (step T1). Then, the subsequent pad Sd shown in FIG. 20 is pulled out along the release direction M, and the front end of the subsequent pad Sd is guided to the top of the protruding member 63, and the suction device 71 is activated to fix the front end to the top of the protruding member 63 (step T2). Next, the operations from step T3 to step T6 are performed to recycle the peeled liner S.
<基於實施例1的構成所產生之效果> 在習知的片材回收裝置中使片材捲繞於捲取軸而回收之情況,係一邊對片材沿放出方向賦予張力,一邊使片材以密接於捲取軸的外周之方式逐漸捲取。亦即,在捲取片材之際在片材與捲取軸之間沒有形成間隙,在沒有形成間隙的狀態下進行將片材從捲取軸拔取之作業。其結果,由於作用在捲取成卷狀的片材與捲取軸之間的摩擦力會變大,所以難以將卷狀的片材從捲取軸拔取並回收。又,因應賦予至片材之張力的大小,在片材的卷會作用朝內側收縮的力。因此,作用於片材的卷與捲取軸之間之摩擦力會進一步增大。 <Effects Produced Based on the Structure of Example 1> In the known sheet recovery device, when the sheet is wound around the winding shaft for recovery, the sheet is gradually wound in a manner that the sheet is in close contact with the outer circumference of the winding shaft while applying tension to the sheet in the unwinding direction. That is, when the sheet is wound, no gap is formed between the sheet and the winding shaft, and the sheet is pulled out from the winding shaft without forming a gap. As a result, since the friction force acting between the rolled sheet and the winding shaft becomes larger, it is difficult to pull the rolled sheet from the winding shaft and recover it. In addition, depending on the amount of tension applied to the sheet, a force that contracts inward will act on the roll of the sheet. Therefore, the friction between the roll of the sheet and the winding shaft will further increase.
尤其,為了抵抗該摩擦力而將卷狀的片材強硬地拉引且拔取而回收時,由於將片材以手動拉引之際會對捲取軸朝軸向以外作用大的力,所以會擔心捲取軸的軸向從初始狀態的方向偏斜之情況。一旦捲取軸偏斜,捲取片材的方向就會偏斜,因此片材的回收精確度及回收效率會降低。In particular, when the rolled sheet is pulled and extracted for collection by force to resist the frictional force, a large force other than the axial direction is applied to the winding shaft when the sheet is pulled manually, so there is a concern that the axial direction of the winding shaft may deviate from the initial state. Once the winding shaft deviates, the direction of the rolled sheet will deviate, thereby reducing the accuracy and efficiency of sheet collection.
透過本案發明人的致力檢討,作為用以解決因作用於片材的卷和捲取軸之間的摩擦力所產生的問題之構成,首先,考慮如以下之比較例的構成。亦即,比較例的片材回收裝置100係如圖21所示,具備有中空圓筒狀的捲取軸RF和固定銷Jp。Through the inventors' diligent research, as a structure for solving the problem caused by the friction between the roll of sheet material and the winding shaft, first, the structure of the following comparative example is considered. That is, the sheet material recovery device 100 of the comparative example is provided with a hollow cylindrical winding shaft RF and a fixing pin Jp as shown in FIG. 21 .
在捲取軸RF的外周面,沿捲取軸RF的軸向(在此為z方向)形成有引導溝Dc。就一例而言,固定銷Jp係以金屬構成,具備有外側固定部J1、內側固定部J2和把持部J3。外側固定部J1係以下側的一部分嵌合於引導溝Dc之方式構成的棒狀構件。內側固定部J2係以沿著z方向抵接於捲取軸RF的內周面之方式構成的棒狀構件。把持部J3整體而言係呈圓弧狀彎曲的構件,連接著外側固定部J1與內側固定部J2。操作者係把持把持部J3來進行固定銷Jp的操作。A guide groove Dc is formed on the outer peripheral surface of the winding shaft RF along the axial direction of the winding shaft RF (here, the z direction). For example, the fixing pin Jp is made of metal and has an outer fixing portion J1, an inner fixing portion J2, and a holding portion J3. The outer fixing portion J1 is a rod-shaped component that is configured such that a portion of the lower side is engaged with the guide groove Dc. The inner fixing portion J2 is a rod-shaped component that is configured such that it abuts against the inner peripheral surface of the winding shaft RF along the z direction. The holding portion J3 is a component that is curved in an arc shape as a whole, and connects the outer fixing portion J1 and the inner fixing portion J2. The operator holds the holding portion J3 to operate the fixing pin Jp.
如圖22所示,外側固定部J1的直徑N1係以變得比引導溝Dc的深度K1還長之方式構成。又,在固定銷Jp中,外側固定部J1與內側固定部J2之間的距離N2,係以比形成有引導溝Dc的部分中之捲取軸RF的厚度K2變得稍微短之方式構成。因此,在將固定銷Jp沿著引導溝Dc插入捲取軸RF的情況,外側固定部J1及內側固定部J2係將形成有引導溝Dc之部分的捲取軸RF以從上下方向把持之方式固定。As shown in FIG. 22 , the diameter N1 of the outer fixing portion J1 is configured to be longer than the depth K1 of the guide groove Dc. In addition, in the fixing pin Jp, the distance N2 between the outer fixing portion J1 and the inner fixing portion J2 is configured to be slightly shorter than the thickness K2 of the winding shaft RF in the portion where the guide groove Dc is formed. Therefore, when the fixing pin Jp is inserted into the winding shaft RF along the guide groove Dc, the outer fixing portion J1 and the inner fixing portion J2 fix the winding shaft RF in the portion where the guide groove Dc is formed by holding it from the upper and lower directions.
使用比較例的片材回收裝置100將剝離襯墊S捲取回收之操作係如以下所示。首先,如圖23所示,使剝離襯墊S的前端部St引導至捲取軸RF的外周面中形成有引導溝Dc的部分。其後,如圖24所示,使外側固定部J1中比內側固定部J2更朝z方向突出的部分,從上方嵌合於引導溝Dc。藉由該嵌合操作,剝離襯墊S的前端部St係被外側固定部J1推抵至引導溝Dc。此外,由於外側固定部J1的直徑N1比引導溝Dc的深度K1還長,所以在使外側固定部J1嵌合於引導溝Dc之情況,會成為外側固定部J1的一部分從捲取軸RF的外周面朝外側突出之狀態。換言之,關於y方向,外側固定部J1的一部分係從捲取軸RF的外周面突出。The operation of rolling up and recycling the stripping pad S using the sheet recovery device 100 of the comparative example is as follows. First, as shown in FIG23, the front end portion St of the stripping pad S is guided to the portion where the guide groove Dc is formed in the outer peripheral surface of the winding shaft RF. Thereafter, as shown in FIG24, the portion of the outer fixing portion J1 that protrudes further in the z direction than the inner fixing portion J2 is engaged with the guide groove Dc from above. By this engagement operation, the front end portion St of the stripping pad S is pushed against the guide groove Dc by the outer fixing portion J1. Furthermore, since the diameter N1 of the outer fixing portion J1 is longer than the depth K1 of the guide groove Dc, when the outer fixing portion J1 is fitted into the guide groove Dc, a portion of the outer fixing portion J1 protrudes outward from the outer peripheral surface of the winding shaft RF. In other words, a portion of the outer fixing portion J1 protrudes from the outer peripheral surface of the winding shaft RF in the y direction.
在使外側固定部J1的一部分嵌合於引導溝Dc後,以外側固定部J1沿著引導溝Dc朝z方向滑動之方式,使固定銷Jp對捲取軸RF朝z方向插入。關於z方向,外側固定部J1的整體嵌合於引導溝Dc的狀態係如圖25所示。如圖26所示,藉由將固定銷Jp朝z方向插入,內側固定部J2以抵接於捲取軸RF的內周面之方式插入。After a part of the outer fixing part J1 is fitted into the guide groove Dc, the fixing pin Jp is inserted into the winding shaft RF in the z direction so that the outer fixing part J1 slides in the z direction along the guide groove Dc. The state in which the outer fixing part J1 is fitted into the guide groove Dc in the z direction is shown in FIG25. As shown in FIG26, by inserting the fixing pin Jp in the z direction, the inner fixing part J2 is inserted so as to abut against the inner peripheral surface of the winding shaft RF.
由於外側固定部J1與內側固定部J2之間的距離N2,係比形成有引導溝Dc的部分中之捲取軸RF的厚度K2稍短,所以外側固定部J1係透過剝離襯墊S的前端部St將捲取軸RF從外側推壓,同時內側固定部J2係將捲取軸RF從內側推壓。因此,剝離襯墊S的前端部St係藉固定銷Jp固定於捲取軸RF。Since the distance N2 between the outer fixing portion J1 and the inner fixing portion J2 is slightly shorter than the thickness K2 of the winding shaft RF in the portion where the guide groove Dc is formed, the outer fixing portion J1 pushes the winding shaft RF from the outside through the front end portion St of the peeling pad S, and the inner fixing portion J2 pushes the winding shaft RF from the inside. Therefore, the front end portion St of the peeling pad S is fixed to the winding shaft RF by the fixing pin Jp.
在使剝離襯墊S的前端部St固定於捲取軸RF後,使捲取軸RF旋轉以使剝離襯墊S被捲取於捲取軸RF。剝離襯墊S係如圖27所示般地涵蓋捲取軸RF的外周面與外側固定部J1的外周面逐漸捲繞,而形成卷SR。After the front end St of the peeling pad S is fixed to the winding shaft RF, the winding shaft RF is rotated to wind the peeling pad S around the winding shaft RF. The peeling pad S is gradually wound around the outer peripheral surface of the winding shaft RF and the outer peripheral surface of the outer fixing portion J1 as shown in FIG. 27 to form a roll SR.
在將固定銷Jp插入捲取軸RF以使外側固定部J1從捲取軸RF的外周面朝外側突出的狀態下捲取剝離襯墊S。亦即,被捲取的剝離襯墊S的周長係比捲取軸RF的筒狀構件的周長還長。因此,如圖27所示,在外側固定部J1的周圍,於剝離襯墊S的卷SR與捲取軸RF的筒狀構件的外周面之間形成間隙部Vb。The peeling pad S is wound up in a state where the fixing pin Jp is inserted into the winding shaft RF so that the outer side fixing portion J1 protrudes outward from the outer peripheral surface of the winding shaft RF. That is, the circumference of the peeling pad S to be wound up is longer than the circumference of the cylindrical member of the winding shaft RF. Therefore, as shown in FIG. 27 , a gap portion Vb is formed between the roll SR of the peeling pad S and the outer peripheral surface of the cylindrical member of the winding shaft RF around the outer side fixing portion J1.
在捲取了一定量的剝離襯墊S後,將固定銷Jp沿z方向抽出而拔取。藉由固定銷Jp被拔取,如圖28所示,在曾存在有外側固定部J1的部分,新形成間隙部Vb。且,藉由固定銷Jp被拔取,剝離襯墊S固定於捲取軸RF的狀態會被解除,所以間隙部Vb會逐漸擴展到捲取軸RF與卷SR之間的空間整體。After a certain amount of the peeling pad S is wound, the fixing pin Jp is pulled out in the z direction. As the fixing pin Jp is pulled out, a gap portion Vb is newly formed in the portion where the outer fixing portion J1 existed, as shown in FIG. 28. Furthermore, as the fixing pin Jp is pulled out, the state in which the peeling pad S is fixed to the winding shaft RF is released, so the gap portion Vb gradually expands to the entire space between the winding shaft RF and the roll SR.
將固定銷Jp拔取以使剝離襯墊S的固定解除後,將剝離襯墊S的卷SR從捲取軸RF朝z方向拔取而回收。由於在捲取軸RF與卷SR之間的空間整體形成有間隙部Vb,所以可降低產生捲取軸RF與卷SR之間的摩擦力。After the fixing pin Jp is pulled out to release the fixing of the peeling pad S, the roll SR of the peeling pad S is pulled out from the winding shaft RF in the z direction and recovered. Since the gap Vb is formed as a whole in the space between the winding shaft RF and the roll SR, the friction force generated between the winding shaft RF and the roll SR can be reduced.
如此,在比較例的片材回收裝置100中也是,可降低產生於捲取軸與卷SR之間的摩擦力,所以可容易地將剝離襯墊S的卷SR從捲取軸RF拔取。然而,在使用固定銷Jp之比較例的構成中,每次進行使剝離襯墊S固定於捲取軸RF的工序時,都必須進行將固定銷Jp以手動插入捲取軸RF之操作。又,每次將剝離襯墊S固定於捲取軸RF的狀態解除時,必須進行將固定銷Jp以手動拔取之操作。如此,由於在比較例中以手動進行的操作變多,所以回收片材的操作會長期化及複雜化。In this way, also in the sheet recovery device 100 of the comparative example, the friction force generated between the take-up shaft and the roll SR can be reduced, so the roll SR of the stripping pad S can be easily extracted from the take-up shaft RF. However, in the configuration of the comparative example using the fixing pin Jp, each time the process of fixing the stripping pad S to the take-up shaft RF is performed, the fixing pin Jp must be manually inserted into the take-up shaft RF. Furthermore, each time the state in which the stripping pad S is fixed to the take-up shaft RF is released, the fixing pin Jp must be manually extracted. In this way, since the number of manual operations in the comparative example increases, the operation of recovering the sheets becomes prolonged and complicated.
此外,一旦重複進行將固定銷Jp以手動拔取插入的操作時,也會擔心有固定銷Jp及捲取軸RF變得容易劣化之問題。作為一例,會發生因固定銷Jp與捲取軸RF的摩擦而使各者變形之問題。又,在進行固定銷Jp的插入操作或拔取操作之際,會對捲取軸RF朝向與軸向不同的方向施加因手動產生的力。因此,會產生捲取軸RF的軸偏斜而使剝離襯墊S的捲取精確度降低之問題。尤其,由於外側固定部J1與內側固定部J2之間的距離N2係與捲取軸RF的厚度K2相同或稍短,所以在使固定銷Jp插入捲取軸RF之際,容易對捲取軸RF朝向與軸向不同的方向施加大的力。Furthermore, if the fixing pin Jp is repeatedly inserted and removed manually, there is a concern that the fixing pin Jp and the winding shaft RF may be easily deteriorated. For example, the fixing pin Jp and the winding shaft RF may be deformed due to friction. Also, during the insertion or removal of the fixing pin Jp, a force generated by the manual operation is applied to the winding shaft RF in a direction different from the axial direction. Therefore, the winding shaft RF may be deflected, which may reduce the winding accuracy of the stripping pad S. In particular, since the distance N2 between the outer fixing portion J1 and the inner fixing portion J2 is the same as or slightly shorter than the thickness K2 of the winding shaft RF, when the fixing pin Jp is inserted into the winding shaft RF, a large force is easily applied to the winding shaft RF in a direction different from the axial direction.
再者,在比較例中以固定銷Jp的外側固定部J1將剝離襯墊S的前端部St從外側推壓而固定之後,將剝離襯墊S涵蓋外側固定部J1的外側及捲取軸RF的外側而捲繞。亦即,如圖27所示,固定銷Jp的外側固定部J1係成為被剝離襯墊S從上下兩側挾持的狀態。Furthermore, in the comparative example, after the front end portion St of the peeling pad S is pressed and fixed from the outside by the outer side fixing portion J1 of the fixing pin Jp, the peeling pad S is wound around the outer side of the outer side fixing portion J1 and the outer side of the winding shaft RF. That is, as shown in FIG. 27 , the outer side fixing portion J1 of the fixing pin Jp is clamped by the peeling pad S from both the upper and lower sides.
在剝離襯墊S以容易延伸的材料構成之情況,剝離襯墊S會對因剝離襯墊S的放出方向M被賦予的張力,一邊在放出方向M延伸一邊被捲繞。因此,對於夾著外側固定部J1的兩側之剝離襯墊S的每一者,會作用欲從延伸的狀態返回的力亦即復原力。When the peeling pad S is made of a material that is easily stretched, the peeling pad S is rolled up while being stretched in the stretching direction M in response to the tension applied in the stretching direction M of the peeling pad S. Therefore, a force that attempts to return from the stretched state, i.e., a restoring force, acts on each of the peeling pads S on both sides sandwiching the outer fixing portion J1.
其結果,由於在以與拔取固定銷Jp的方向(z方向)垂直之方向(捲取軸RF的徑向),力會朝外側固定部J1作用,所以難以將固定銷Jp朝z方向拔取。在剝離襯墊S的復原力作用於外側固定部J1之情況,為了抵抗該復原力,操作者會一邊以強的力壓制捲取軸RF一邊將固定銷Jp拔取。其結果,朝捲取軸RF作用與軸向不同的力而使軸等變形之情事變得容易發生。As a result, since a force acts on the outer fixing portion J1 in a direction perpendicular to the direction (z direction) in which the fixing pin Jp is extracted (radial direction of the winding shaft RF), it is difficult to extract the fixing pin Jp in the z direction. When the restoring force of the peeling pad S acts on the outer fixing portion J1, the operator will pull out the fixing pin Jp while pressing the winding shaft RF with a strong force to resist the restoring force. As a result, a force different from the axial direction acts on the winding shaft RF, and the shaft or the like is easily deformed.
另一方面,實施例1中藉由使用最大直徑調節機構61,來自動地調節捲取部57的直徑。亦即,藉由將突出構件63配設於捲取部57的內部,使突出構件63朝捲取部57的徑向進退移動,來調節捲取部57的直徑。具體而言,使突出構件63突出於比捲取部57的筒狀構件58更靠外側,在使捲取部57的直徑增大的狀態下進行捲取剝離襯墊S之操作。藉由使捲取部57的直徑增大,剝離襯墊S被捲繞的周長會變長。On the other hand, in the first embodiment, the diameter of the take-up portion 57 is automatically adjusted by using the maximum diameter adjustment mechanism 61. That is, the diameter of the take-up portion 57 is adjusted by arranging the protruding member 63 inside the take-up portion 57 and moving the protruding member 63 forward and backward in the diameter direction of the take-up portion 57. Specifically, the protruding member 63 is made to protrude further outward than the cylindrical member 58 of the take-up portion 57, and the operation of taking up the peeling pad S is performed in a state where the diameter of the take-up portion 57 is increased. By increasing the diameter of the take-up portion 57, the circumference of the peeling pad S being wound becomes longer.
接著,在以捲取部57捲取了剝離襯墊S後,將剝離襯墊S固定於捲取部57的狀態解除,並且藉由使突出構件63埋設於筒狀構件58而使捲取部57的直徑減少。藉由使捲取部57的直徑減少,捲取部57的周長也會被減少。亦即,使突出構件63埋没後之捲取部57的周長,係比藉由捲取操作所形成之剝離襯墊S的卷SR的內周的長度還短。又,剝離襯墊S固定於捲取部57的狀態被解除。其結果,間隙部Vb係涵蓋捲取部57與卷SR之間的空間整體逐漸擴大,所以可使產生於捲取部57與卷SR之間的摩擦力消失或大幅減少。Next, after the peeling pad S is rolled up by the roll-up portion 57, the state in which the peeling pad S is fixed to the roll-up portion 57 is released, and the diameter of the roll-up portion 57 is reduced by burying the protruding member 63 in the cylindrical member 58. By reducing the diameter of the roll-up portion 57, the circumference of the roll-up portion 57 is also reduced. That is, the circumference of the roll-up portion 57 after the protruding member 63 is buried is shorter than the length of the inner circumference of the roll SR of the peeling pad S formed by the rolling operation. In addition, the state in which the peeling pad S is fixed to the roll-up portion 57 is released. As a result, the gap portion Vb covers the entire space between the winding portion 57 and the roll SR and gradually expands, so that the friction generated between the winding portion 57 and the roll SR can be eliminated or greatly reduced.
突出構件63係從捲取部57的內部朝外部突出,剝離襯墊S捲繞在成為突出狀態的突出構件63的上面。亦即,與比較例不同,在實施例1中,剝離襯墊S只會接觸突出構件63的其中一面。又,因剝離襯墊S的張力所產生的復原力,會對突出構件63作用於捲取部57的徑向(從外側朝向內側的方向)。亦即,實施例1中,突出構件63不會成為被剝離襯墊S挾持的狀態,又,復原力作用的方向係與突出構件63移動的方向相同。因此,突出構件63的進退移動不會受到剝離襯墊S的張力阻礙。因此,即便在剝離襯墊S以容易延伸的材料所構成的情況,也可精確度佳地執行調節捲取部57的直徑之操作。The protruding member 63 protrudes from the inside of the roll-up portion 57 to the outside, and the peeling pad S is wound around the protruding member 63 in the protruding state. That is, unlike the comparative example, in the first embodiment, the peeling pad S only contacts one side of the protruding member 63. In addition, the restoring force generated by the tension of the peeling pad S acts on the protruding member 63 in the radial direction of the roll-up portion 57 (from the outside to the inside). In other words, in the first embodiment, the protruding member 63 will not be clamped by the peeling pad S, and the direction in which the restoring force acts is the same as the direction in which the protruding member 63 moves. Therefore, the forward and backward movement of the protruding member 63 is not hindered by the tension of the peeling pad S. Therefore, even in the case where the peeling pad S is made of a material that is easily stretched, the operation of adjusting the diameter of the take-up portion 57 can be performed with good accuracy.
又,由於突出構件63的進退移動可自動控制,所以在實施例1的構成中可自動地調節捲取部57的直徑。因此,能夠實現可容易將剝離襯墊S回收之回收操作,並且能夠將該回收操作的各工序更高度地自動化。又,藉由使調節捲取部57的直徑之操作自動化,可避免操作者對捲取部57施力。因此,可防止捲取部57的軸變形之情況、或捲取部57變形之情況發生。Furthermore, since the forward and backward movement of the protruding member 63 can be automatically controlled, the diameter of the take-up portion 57 can be automatically adjusted in the configuration of the first embodiment. Therefore, a recovery operation that can easily recover the peeled liner S can be realized, and each process of the recovery operation can be more highly automated. Furthermore, by automating the operation of adjusting the diameter of the take-up portion 57, it is possible to avoid the operator applying force to the take-up portion 57. Therefore, it is possible to prevent the shaft of the take-up portion 57 from being deformed or the take-up portion 57 from being deformed.
在突出構件63形成有吸附孔69,透過吸附孔69吸附保持剝離襯墊S的前端部St。亦即,由於突出構件63亦發揮作為使剝離襯墊S固定於捲取部57的固定構件之功能,所以可使襯墊回收部15的構成更單純化。 [實施例2] The protruding member 63 is provided with an adsorption hole 69, through which the front end portion St of the peeling pad S is adsorbed and held. That is, since the protruding member 63 also functions as a fixing member for fixing the peeling pad S to the winding portion 57, the structure of the pad recovery portion 15 can be made simpler. [Example 2]
其次,說明本發明的實施例2。實施例1中係採用藉由使突出構件63朝捲取部57的徑向進退移動來切換突出狀態與埋没狀態,使最大直徑調節機構61調節捲取部57的直徑之構成作為例子來作說明。實施例2中,係採用捲取部57A所具備的筒狀構件58A能夠膨脹,藉由切換膨脹狀態與收縮狀態而使最大直徑調節機構61調節捲取部57的直徑之構成為例來作說明。此外,實施例2的黏著帶貼附裝置與實施例1的裝置基本上的構成是共通的。因此,限於與實施例1中所說明的黏著帶貼附裝置1相同的構成標註相同符號,針對不同的構成部分作詳細說明。實施例1與實施例2相當於本發明的片材回收裝置之襯墊回收部15的構成是不同的。Next, the second embodiment of the present invention will be described. In the first embodiment, the structure in which the maximum diameter adjustment mechanism 61 adjusts the diameter of the take-up portion 57 by moving the protruding member 63 radially forward and backward toward the take-up portion 57 to switch between the protruding state and the buried state is used as an example for explanation. In the second embodiment, the structure in which the maximum diameter adjustment mechanism 61 adjusts the diameter of the take-up portion 57 by switching between the expanded state and the contracted state is used as an example for explanation. In addition, the adhesive tape attaching device of the second embodiment has the same basic structure as the device of the first embodiment. Therefore, the same reference numerals are used for the same components as those of the adhesive tape applying device 1 described in Example 1, and the different components are described in detail. The configuration of the pad recovery unit 15 of the sheet recovery device of the present invention is different between Example 1 and Example 2.
實施例2中的襯墊回收部15A係如圖29所示,具備有捲取機構51A和切斷機構53。捲取機構51A具備有旋轉板55和捲取部57A。As shown in Fig. 29, the pad collecting section 15A in the second embodiment includes a winding mechanism 51A and a cutting mechanism 53. The winding mechanism 51A includes a rotating plate 55 and a winding section 57A.
捲取部57A具備有筒狀構件58A和最大直徑調節機構61A。筒狀構件58A係構成捲取部57A的外廓,且內部成為中空之圓筒狀構件。筒狀構件58A的內部空間呈密閉,由因應內部空間的氣壓可膨脹及收縮之材料所構成。作為構成筒狀構件58A的材料之一例,可列舉橡膠等。如圖29及圖30所示,在筒狀構件58A的側面形成有吸附孔69,吸附孔69係透過流路70而與吸引裝置71連接。實施例2中,吸引裝置71係配設於筒狀構件58A的內部。The winding portion 57A has a cylindrical member 58A and a maximum diameter adjustment mechanism 61A. The cylindrical member 58A constitutes the outer contour of the winding portion 57A, and is a cylindrical member with a hollow interior. The internal space of the cylindrical member 58A is closed, and is made of a material that can expand and contract according to the air pressure in the internal space. As an example of a material constituting the cylindrical member 58A, rubber and the like can be cited. As shown in Figures 29 and 30, an adsorption hole 69 is formed on the side of the cylindrical member 58A, and the adsorption hole 69 is connected to the suction device 71 through a flow path 70. In Embodiment 2, the suction device 71 is arranged inside the cylindrical member 58A.
最大直徑調節機構61A具備有氣體供給孔79和氣體供給裝置80。實施例2中,氣體供給孔79係如圖29所示般形成於筒狀構件58A的正面側(頂部),但配設氣體供給孔79的位置亦可適當變更。氣體供給孔79係與對筒狀構件58A的內部供給氣體之氣體供給裝置80連通連接。藉由對氣體供給裝置80供給至筒狀構件58A的內部空間之氣體量進行調節,可適當控制筒狀構件58A的內部空間的氣壓。此外,在圖30等之前視圖觀察下的縱剖面圖中,為了方便說明,記載了氣體供給孔79在筒狀構件58A的下側(側面)。The maximum diameter adjustment mechanism 61A has a gas supply hole 79 and a gas supply device 80. In Embodiment 2, the gas supply hole 79 is formed on the front side (top) of the cylindrical component 58A as shown in FIG. 29, but the position of the gas supply hole 79 can also be appropriately changed. The gas supply hole 79 is connected to the gas supply device 80 that supplies gas to the interior of the cylindrical component 58A. By adjusting the amount of gas supplied to the internal space of the cylindrical component 58A by the gas supply device 80, the air pressure of the internal space of the cylindrical component 58A can be appropriately controlled. In addition, in the longitudinal sectional view observed in the previous view such as FIG. 30, for the convenience of explanation, the gas supply hole 79 is recorded on the lower side (side) of the cylindrical component 58A.
當氣體對筒狀構件58A的內部空間之供給量上升時,筒狀構件58A的內部空間的氣壓會上升。當筒狀構件的內壓上升時,筒狀構件58A會膨脹,捲取部57A的直徑會增大。當氣體對筒狀構件58A的內部空間之供給量降低時,筒狀構件58A的內部空間的氣壓會降低。當筒狀構件的內壓降低時,筒狀構件58A會收縮,捲取部57A的直徑會減少。When the amount of gas supplied to the inner space of the cylindrical member 58A increases, the air pressure in the inner space of the cylindrical member 58A increases. When the inner pressure of the cylindrical member increases, the cylindrical member 58A expands, and the diameter of the roll-up portion 57A increases. When the amount of gas supplied to the inner space of the cylindrical member 58A decreases, the air pressure in the inner space of the cylindrical member 58A decreases. When the inner pressure of the cylindrical member decreases, the cylindrical member 58A contracts, and the diameter of the roll-up portion 57A decreases.
如此,最大直徑調節機構61A係以藉由調節氣體供給裝置80對筒狀構件58A的內部空間所供給的氣體量,而使捲取部57A的直徑可改變之方式構成。此外,圖30係表示氣體供給裝置80沒有對筒狀構件58A的內部空間供給氣體,筒狀構件58A呈收縮的狀態(收縮狀態)中之捲取部57A的縱剖面圖。將捲取部57A為收縮狀態之情況下捲取部57的直徑(筒狀構件58A的直徑)設為J1。圖31係表示藉由氣體供給裝置80將氣體供給到筒狀構件58A的內部空間,筒狀構件58A呈膨脹的狀態(膨脹狀態)下之捲取部57A的縱剖面圖。將捲取部57A為膨脹狀態的情況下之捲取部57的直徑(筒狀構件58A的直徑)設為J2。J2係大於J1的値。In this way, the maximum diameter adjustment mechanism 61A is configured so that the diameter of the take-up portion 57A can be changed by adjusting the amount of gas supplied to the inner space of the cylindrical member 58A by the gas supply device 80. In addition, FIG. 30 is a longitudinal cross-sectional view of the take-up portion 57A in a state (contracted state) where the gas supply device 80 does not supply gas to the inner space of the cylindrical member 58A and the cylindrical member 58A is in a contracted state. The diameter of the take-up portion 57 (the diameter of the cylindrical member 58A) when the take-up portion 57A is in the contracted state is set to J1. Fig. 31 is a longitudinal cross-sectional view of the take-up portion 57A in a state where the cylindrical member 58A is inflated (inflated state) by supplying gas to the inner space of the cylindrical member 58A through the gas supply device 80. The diameter of the take-up portion 57A in the inflated state (the diameter of the cylindrical member 58A) is assumed to be J2. J2 is a value greater than J1.
<實施例2中之回收工序的說明> 在此,實施例2中,係針對用以使從保護帶PT剝離的剝離襯墊S藉襯墊回收部15A回收之一連串的工序進行說明。實施例2中將剝離襯墊S回收之工序的概要,係與圖6(b)所示的流程圖同樣。但是,關於調節捲取部57的直徑之過程等的詳情,實施例1與實施例2是不同的。因此,關於實施例2中之剝離襯墊S的回收工序,與實施例1共通的部分係簡化說明,針對不同的構成部分詳細敘述。 <Description of the recovery process in Example 2> Here, in Example 2, a series of processes for recovering the peeling pad S peeled from the protective tape PT by the pad recovery section 15A are described. The outline of the process of recovering the peeling pad S in Example 2 is the same as the flow chart shown in Figure 6 (b). However, the details of the process of adjusting the diameter of the take-up section 57, etc., are different between Example 1 and Example 2. Therefore, regarding the recovery process of the peeling pad S in Example 2, the parts common to Example 1 are simplified, and the different components are described in detail.
步驟T1(使捲取部的直徑增大) 在開始進行貼附保護帶PT的動作之前,與實施例1同樣地進行使捲取部57A的直徑增大之操作。然而,實施例2中,藉由將捲取部57A從收縮狀態切換成膨脹狀態,使捲取部57A的直徑增大。亦即,控制部40係使最大直徑調節機構61所具備的氣體供給裝置80作動。藉由氣體供給裝置80作動,氣體As經由氣體供給孔79被供給到筒狀構件58A的內部空間。 Step T1 (increasing the diameter of the take-up portion) Before starting the action of attaching the protective tape PT, the operation of increasing the diameter of the take-up portion 57A is performed in the same manner as in Example 1. However, in Example 2, the diameter of the take-up portion 57A is increased by switching the take-up portion 57A from the contracted state to the expanded state. That is, the control unit 40 activates the gas supply device 80 provided in the maximum diameter adjustment mechanism 61. By activating the gas supply device 80, the gas As is supplied to the internal space of the cylindrical member 58A through the gas supply hole 79.
藉由氣體As被供給到筒狀構件58A的內部空間,捲取部57A的狀態會從圖30所示的收縮狀態變化成圖31所示的膨脹狀態。亦即,藉由氣體被供給到筒狀構件58A的內部空間,筒狀構件58A的內壓會逐漸上升。接著,藉由筒狀構件58A的內壓上升,筒狀構件58A的外壁部會逐漸膨脹。藉由捲取部57A從收縮狀態被切換成膨脹狀態,如圖30及圖31所示,捲取部57的最大直徑會從J1增大到J2。一旦捲取部57A變成膨脹狀態,控制部40便使氣體供給裝置80所進行之氣體As的供給停止,將未圖示的閥關閉,該未圖示的閥係配設在將氣體供給孔79與氣體供給裝置80連接的流路。By supplying gas As to the inner space of the cylindrical member 58A, the state of the roll-up portion 57A changes from the contracted state shown in FIG. 30 to the expanded state shown in FIG. 31. That is, by supplying gas to the inner space of the cylindrical member 58A, the internal pressure of the cylindrical member 58A gradually increases. Then, by the increase in the internal pressure of the cylindrical member 58A, the outer wall of the cylindrical member 58A gradually expands. By switching the roll-up portion 57A from the contracted state to the expanded state, as shown in FIG. 30 and FIG. 31, the maximum diameter of the roll-up portion 57 increases from J1 to J2. Once the take-up portion 57A becomes inflated, the control unit 40 stops the supply of gas As by the gas supply device 80 and closes a valve (not shown) disposed in the flow path connecting the gas supply hole 79 and the gas supply device 80.
步驟T2(固定片材的前端) 在藉由氣體供給裝置80使捲取部57A變化成膨脹狀態,使捲取部57A的直徑增大之後,進行使剝離襯墊S的前端固定於捲取部57A之操作。即便在實施例2中也是與實施例1同樣,藉由空氣吸引方式使剝離襯墊S的前端部St固定於捲取部57A。亦即,將藉由剝離輥21從保護帶PT剝離的剝離襯墊S抽出,將剝離襯墊S的前端部St朝襯墊回收部15A引導。接著,如圖32所示,使剝離襯墊S的前端部St接近筒狀構件58A所形成的吸附孔69。 Step T2 (fixing the front end of the sheet) After the reel 57A is changed into an expanded state by the gas supply device 80 and the diameter of the reel 57A is increased, the front end of the peeling pad S is fixed to the reel 57A. Even in Embodiment 2, the front end St of the peeling pad S is fixed to the reel 57A by air suction as in Embodiment 1. That is, the peeling pad S peeled from the protective tape PT by the peeling roller 21 is pulled out, and the front end St of the peeling pad S is guided toward the pad recovery section 15A. Next, as shown in FIG32, the front end portion St of the peeling pad S is brought close to the adsorption hole 69 formed in the cylindrical member 58A.
在使剝離襯墊S的前端部St接近吸附孔69的狀態下,如圖33所示,控制部40使吸引裝置71作動。吸引裝置71係透過吸附孔69吸引空氣Ar,使剝離襯墊S的前端部St與吸附孔69之間的空間減壓。因此,藉由吸引裝置71作動,剝離襯墊S的前端部St被吸附保持於筒狀構件58A的側面。When the front end St of the peeling pad S is brought close to the adsorption hole 69, as shown in Fig. 33, the control unit 40 activates the suction device 71. The suction device 71 sucks air Ar through the adsorption hole 69 to reduce the pressure in the space between the front end St of the peeling pad S and the adsorption hole 69. Therefore, by the operation of the suction device 71, the front end St of the peeling pad S is adsorbed and held on the side surface of the cylindrical member 58A.
步驟T3(片材的捲取) 在使剝離襯墊S的前端St固定於捲取部57A後,開始進行將保護帶PT貼附於晶圓W的操作,並且開始進行利用襯墊回收部15捲取剝離襯墊S之操作。亦即,控制部40係一邊將吸引裝置71控制成開啟的狀態,一邊使旋轉板55繞著z方向的軸旋轉。如圖34所示,由於捲取部57A係連同旋轉板55一起繞著z方向的軸旋轉,所以剝離襯墊S會沿著筒狀構件58A的側面被捲繞而逐漸捲取。 Step T3 (rolling up the sheet) After the front end St of the peeling pad S is fixed to the winding section 57A, the operation of attaching the protective tape PT to the wafer W is started, and the operation of rolling up the peeling pad S using the pad recovery section 15 is started. That is, the control section 40 controls the suction device 71 to be turned on while rotating the rotating plate 55 around the axis in the z direction. As shown in FIG. 34, since the winding section 57A rotates around the axis in the z direction together with the rotating plate 55, the peeling pad S is wound along the side of the cylindrical member 58A and gradually rolled up.
實施例2的襯墊回收部15A係在開始步驟T3前,使捲取部57A從收縮狀態變化成膨脹狀態,使捲取部57A的最大直徑從J1增大為J2。在使捲取部57A成為收縮狀態以捲取剝離襯墊S之情況,剝離襯墊S被捲取的周長係以最大直徑J1作為半徑之圓周的長度。In the liner recovery section 15A of the second embodiment, the reeling section 57A is changed from the contracted state to the expanded state before starting step T3, and the maximum diameter of the reeling section 57A is increased from J1 to J2. When the reeling section 57A is contracted to reel in the peeling liner S, the circumference of the reeling liner S is the length of the circumference of the circle with the maximum diameter J1 as the radius.
另一方面,在使捲取部57A成為膨脹狀態以捲取剝離襯墊S之情況,剝離襯墊S被捲取的周長會成為以最大直徑J2作為半徑之圓周的長度。亦即,在使捲取部57A的最大直徑增大的狀態下使捲取部57A旋轉以逐漸捲取剝離襯墊S,藉此剝離襯墊S被捲取的周長也會增大。換言之,藉由在步驟T3開始前使捲取部57A的最大直徑增大,步驟T3中剝離襯墊S被捲取的周長,會變得比收縮狀態下之筒狀構件58A的外周的長度更長。On the other hand, when the roll-up portion 57A is expanded to roll up the peeling pad S, the circumference of the peeling pad S rolled up becomes the length of the circumference of the circle having the maximum diameter J2 as the radius. That is, when the roll-up portion 57A is rotated to gradually roll up the peeling pad S while the maximum diameter of the roll-up portion 57A is increased, the circumference of the peeling pad S rolled up also increases. In other words, by increasing the maximum diameter of the winding portion 57A before starting step T3, the circumference of the stripping pad S wound in step T3 becomes longer than the length of the outer circumference of the tubular member 58A in the contracted state.
隨著持續進行捲取剝離襯墊S的動作,被捲取部57捲取之剝離襯墊S的量會逐漸增加,與實施例1同樣地,在捲取部57A的周圍形成剝離襯墊S的卷SR。As the action of rolling up the peeling pad S continues, the amount of the peeling pad S rolled up by the rolling portion 57 gradually increases, and similarly to the first embodiment, a roll SR of the peeling pad S is formed around the rolling portion 57A.
步驟T4(片材的切斷) 在被捲繞於捲取部57之剝離襯墊S的量超過閾値之情況,為了將剝離襯墊S的卷SR從襯墊回收部15去除,而進行步驟T4至步驟T6的工序。 Step T4 (cutting of the sheet) When the amount of the peeling pad S wound on the winding section 57 exceeds the threshold value, the process from step T4 to step T6 is performed in order to remove the roll SR of the peeling pad S from the pad recovery section 15.
步驟T4一開始,便與實施例1同樣地將剝離襯墊S沿寬度方向切斷。控制部40係使切斷機構53從初始位置朝切斷位置移動,進一步使切斷機構53朝剝離襯墊S的寬度方向移動。藉由使切斷機構53朝寬度方向(z方向)水平移動,切刀73係將剝離襯墊S朝寬度方向逐漸切斷。其結果,被捲取部57捲取之剝離襯墊的卷SR係與後續襯墊Sd分離(參照圖17)。藉由切斷剝離襯墊S以使卷SR與後續襯墊Sd分離,而完成步驟T4的工序。At the beginning of step T4, the peeling pad S is cut along the width direction in the same manner as in Embodiment 1. The control unit 40 moves the cutting mechanism 53 from the initial position to the cutting position, and further moves the cutting mechanism 53 in the width direction of the peeling pad S. By moving the cutting mechanism 53 horizontally in the width direction (z direction), the cutter 73 gradually cuts the peeling pad S in the width direction. As a result, the roll SR of the peeling pad taken up by the take-up unit 57 is separated from the subsequent pad Sd (refer to FIG. 17 ). The process of step T4 is completed by cutting and peeling the liner S to separate the roll SR from the subsequent liner Sd.
步驟T5(使捲取部的直徑減少) 當卷SR與後續襯墊Sd藉由剝離襯墊S的切斷而被分離時,進行使捲取部57A的直徑減少之操作。在實施例2中,藉由將捲取部57A從膨脹狀態接換成收縮狀態,使捲取部57A的直徑減少。首先,控制部40係使吸引裝置71停止,以使透過吸附孔69之剝離襯墊S的前端部St之吸附保持解除。接著,控制部40係將配設於將氣體供給裝置80與氣體供給孔79的流路連接的閥打開以使筒狀構件58A的內部空間除氣。藉由筒狀構件58A的內部空間被除氣,筒狀構件58A的內壓會降低而使筒狀構件58A的外壁部收縮,捲取部57A成為收縮狀態。 Step T5 (reducing the diameter of the take-up portion) When the roll SR and the subsequent pad Sd are separated by cutting the stripping pad S, the operation of reducing the diameter of the take-up portion 57A is performed. In Embodiment 2, the diameter of the take-up portion 57A is reduced by switching the take-up portion 57A from an expanded state to a contracted state. First, the control unit 40 stops the suction device 71 to release the adsorption of the front end portion St of the stripping pad S through the adsorption hole 69. Next, the control unit 40 opens the valve provided in the flow path connecting the gas supply device 80 and the gas supply hole 79 to degas the internal space of the tubular member 58A. By degassing the inner space of the cylindrical member 58A, the inner pressure of the cylindrical member 58A is reduced, causing the outer wall of the cylindrical member 58A to shrink, and the roll-up portion 57A becomes a shrunken state.
藉由捲取部57A從膨脹狀態被切換成收縮狀態,如圖35所示,捲取部57A的最大直徑從J2減少為J1。在步驟T3中所形成之卷SR的內周的長度,係以步驟T3中之捲取部57A的最大直徑J2作為半徑之圓周的長度,相當於膨脹狀態下之捲取部57A的外周的長度。By switching the winding portion 57A from the expanded state to the contracted state, the maximum diameter of the winding portion 57A is reduced from J2 to J1 as shown in Fig. 35. The length of the inner circumference of the roll SR formed in step T3 is the length of the circumference of the circle having the maximum diameter J2 of the winding portion 57A in step T3 as the radius, which is equivalent to the length of the outer circumference of the winding portion 57A in the expanded state.
另一方面,藉由捲取部57A成為收縮狀態,捲取部57A的外周的長度係成為以J1作為半徑之圓周的長度。亦即,藉由將捲取部57A切換成收縮狀態以使最大直徑減少,剝離襯墊S的卷SR的內周的長度、與捲取部57A的外周的長度會產生差。因此,如圖35所示,因應以J2作為半徑的圓周、和以J1作為半徑的圓周之長度差,在剝離襯墊S的卷SR與捲取部57A之間產生間隙部Vb。On the other hand, when the winding section 57A is in the contracted state, the length of the outer circumference of the winding section 57A becomes the length of the circumference with J1 as the radius. That is, when the winding section 57A is switched to the contracted state to reduce the maximum diameter, a difference is generated between the length of the inner circumference of the roll SR of the peeling pad S and the length of the outer circumference of the winding section 57A. Therefore, as shown in FIG. 35 , a gap portion Vb is generated between the roll SR of the peeling pad S and the winding section 57A in accordance with the difference in length between the circumference with J2 as the radius and the circumference with J1 as the radius.
將捲取部57A從膨脹狀態切換成收縮狀態時,捲取部57A便會朝向中心Q均一地收縮。因此,間隙部Vb係以涵蓋捲取部57A的外周整體均一地擴展之方式形成。由於在捲取部57A與剝離襯墊S接觸的部分整體形成間隙部Vb,所以在剝離襯墊S所接觸之筒狀構件58A的外周整體,產生於捲取部57A與剝離襯墊S的卷SR之間之摩擦力會消失或大幅降低。When the roll-up portion 57A is switched from the expanded state to the contracted state, the roll-up portion 57A contracts uniformly toward the center Q. Therefore, the gap portion Vb is formed so as to uniformly expand over the entire periphery of the roll-up portion 57A. Since the gap portion Vb is formed over the entire portion where the roll-up portion 57A contacts the peeling pad S, the friction force generated between the roll-up portion 57A and the roll SR of the peeling pad S is eliminated or greatly reduced over the entire periphery of the cylindrical member 58A contacted by the peeling pad S.
步驟T6(片材的回收) 在使捲取部57A的直徑減少以在捲取部57A與剝離襯墊S之間形成有間隙部Vb後,與實施例1同樣地,將捲取於捲取部57A的剝離襯墊S回收。亦即,藉由將被捲取於捲取部57A而積存之剝離襯墊S的卷SR,在捲取部57A的軸向(實施例2中為z方向)抽出,而將卷SR從捲取部57A回收(參照圖20)。 Step T6 (sheet recovery) After the diameter of the winding section 57A is reduced to form a gap portion Vb between the winding section 57A and the peeling pad S, the peeling pad S wound on the winding section 57A is recovered in the same manner as in Embodiment 1. That is, the roll SR of the peeling pad S wound on the winding section 57A and accumulated is pulled out in the axial direction of the winding section 57A (z direction in Embodiment 2), and the roll SR is recovered from the winding section 57A (refer to FIG. 20).
藉由從步驟T1至T6為止之一連串的工序,完成以襯墊回收部15A的捲取部57A捲取剝離襯墊S,並將捲成卷狀的剝離襯墊S回收之操作。在持續進行將保護帶PT貼附於既定片數的晶圓W之操作的情況,從步驟T6返回步驟T1以重複進行步驟T1至步驟T6的操作。Through a series of processes from step T1 to step T6, the peeling pad S is rolled up by the reeling section 57A of the pad recovery section 15A, and the rolled peeling pad S is recovered. When the protective tape PT is continuously attached to a predetermined number of wafers W, the process returns from step T6 to step T1 to repeat the process from step T1 to step T6.
如此,實施例2的襯墊回收部15A係藉由具備對供給至筒狀構件58A內部的氣體量進行控制之最大直徑調節機構61A,可得到與實施例1之襯墊回收部15同樣的效果。亦即,藉由對氣體供給裝置80供給至筒狀構件58A內部的氣體量進行控制以將捲取部57A在膨脹狀態與收縮狀態之間適當地切換,可在機械的控制下調節捲取部57A的最大直徑的長度。In this way, the pad recovery part 15A of the second embodiment can obtain the same effect as the pad recovery part 15 of the first embodiment by having the maximum diameter adjustment mechanism 61A for controlling the amount of gas supplied to the inside of the cylindrical member 58A. That is, by controlling the amount of gas supplied to the inside of the cylindrical member 58A by the gas supply device 80 to appropriately switch the roll-up part 57A between the expanded state and the contracted state, the maximum diameter length of the roll-up part 57A can be adjusted under mechanical control.
接著,藉由在捲取部57A的最大直徑較長的狀態下以捲取部57A捲取剝離襯墊S,而形成內周長度較長之剝離襯墊S的卷SR。在形成有卷SR之後,藉由將捲取部57A的最大直徑調節成比卷SR形成前更短的長度,可涵蓋剝離襯墊S的卷SR與捲取部57A之間的空間整體形成間隙部Vb。其結果,可使產生於捲取部57與卷SR之間的摩擦力消失或大幅降低,所以可確實地避免將卷SR抽出並使之從捲取部57A分離的操作被該摩擦力所阻礙。Next, the peeling pad S is rolled up by the roll-up portion 57A in a state where the maximum diameter of the roll-up portion 57A is long, thereby forming a roll SR of the peeling pad S having a long inner circumference. After the roll SR is formed, the maximum diameter of the roll-up portion 57A is adjusted to be shorter than before the roll SR is formed, so that the gap portion Vb is formed to cover the entire space between the roll SR of the peeling pad S and the roll-up portion 57A. As a result, the friction force generated between the roll-up portion 57 and the roll SR can be eliminated or greatly reduced, so that the operation of pulling out the roll SR and separating it from the roll-up portion 57A can be reliably prevented from being hindered by the friction force.
與實施例1中使突出構件63進退移動的操作同樣,在實施例2中調節氣體對於筒狀構件58A內部的供給量之操作,係可在機械的控制下自動地進行。亦即,由於不需要手動進行調節捲取部57A的直徑之操作,所以能夠實現可容易回收剝離襯墊S的回收操作,同時能夠將該回收操作的各工序更高度地自動化。又,藉由將調節捲取部57的直徑之操作自動化,可避免操作者對捲取部57施力。藉此,可防止捲取部57的軸偏斜之情事、或捲取部57變形之情事發生。Similar to the operation of moving the protruding member 63 forward and backward in the first embodiment, the operation of adjusting the amount of gas supplied to the inside of the cylindrical member 58A in the second embodiment can be automatically performed under mechanical control. That is, since there is no need to manually adjust the diameter of the take-up portion 57A, the recovery operation of easily recovering the peeled liner S can be realized, and at the same time, each process of the recovery operation can be more highly automated. In addition, by automating the operation of adjusting the diameter of the take-up portion 57, it is possible to avoid the operator applying force to the take-up portion 57. In this way, the occurrence of the deflection of the axis of the take-up portion 57 or the deformation of the take-up portion 57 can be prevented.
又,因剝離襯墊S的張力所產生的復原力,係從剝離襯墊S對筒狀構件58A作用於捲取部57A的徑向(從外側朝內側的方向)。且,筒狀構件58A膨脹或收縮的方向也同樣為捲取部57A的徑向。因此,筒狀構件58A膨脹或收縮的動作,不會被剝離襯墊S的張力所阻礙。因此,即便在剝離襯墊S以容易延伸的材料所構成之情況,也可精確度佳地執行調節捲取部57的直徑之操作。Furthermore, the restoring force generated by the tension of the peeling pad S acts on the cylindrical member 58A from the peeling pad S to the diameter of the roll-up portion 57A (from the outside to the inside). Moreover, the direction in which the cylindrical member 58A expands or contracts is also the diameter of the roll-up portion 57A. Therefore, the expansion or contraction of the cylindrical member 58A is not hindered by the tension of the peeling pad S. Therefore, even if the peeling pad S is made of a material that is easily stretched, the operation of adjusting the diameter of the roll-up portion 57 can be performed with good accuracy.
實施例1中在捲取部57的全周中形成有突出構件63的部分,最大直徑從D2增大為D1。另一方面,由於在實施例2中使筒狀構件58A整體膨脹,所以捲取部57A的最大直徑會涵蓋捲取部57A的全周從J1增大為J2。因此,捲取於捲取部57A而形成之剝離襯墊S的卷SR的形狀成為直徑的長度之偏移少的中空圓筒狀。因此,由於可使捲取剝離襯墊S時作用於剝離襯墊S之張力的偏移減少,所以可使因襯墊回收部15A所致之剝離襯墊S的捲取精確度進一步提升。In Embodiment 1, a portion of the protruding member 63 is formed in the entire circumference of the take-up portion 57, and the maximum diameter increases from D2 to D1. On the other hand, in Embodiment 2, since the tubular member 58A is expanded as a whole, the maximum diameter of the take-up portion 57A increases from J1 to J2 covering the entire circumference of the take-up portion 57A. Therefore, the shape of the roll SR of the peeling pad S formed by being wound on the take-up portion 57A becomes a hollow cylindrical shape with a small deviation in the length of the diameter. Therefore, since the deviation of the tension acting on the peeling pad S when the peeling pad S is rolled up can be reduced, the winding accuracy of the peeling pad S caused by the pad recovery portion 15A can be further improved.
<其他實施形態> 此外,此次所揭示的實施形態,其全部的點係為例示,並非用於限制。本發明的範圍並非上述實施形態的說明,而是由申請專利範圍所示,又,包含與申請專利範圍均等的意味及範圍內的所有變更(變形例)。舉例來說,本發明係可以如下方式變形實施。 <Other implementation forms> In addition, all the implementation forms disclosed this time are illustrative and not limiting. The scope of the present invention is not the description of the above-mentioned implementation forms, but is shown by the scope of the patent application, and includes all changes (variations) within the meaning and scope that are equivalent to the scope of the patent application. For example, the present invention can be implemented in the following ways.
(1)各實施例中雖例示襯墊回收部15作為片材回收裝置,但本發明之片材回收裝置的構成亦可適用於帶回收部13。亦即,帶回收部13所具備的捲取機構49係具備與襯墊回收部15所具備的捲取機構51同樣的構成。於此情況,在帶回收部13中捲取機構49所具備之捲取部的直徑增大的狀態下捲取廢棄帶PTn後,使捲取機構49所具備之捲取部的直徑減少而在捲取部與廢棄帶PTn的卷之間形成間隙部。藉由形成該間隙部,可避免在將廢棄帶PTn的卷從捲取機構49抽出並回收之工序中,在廢棄帶PTn的卷與捲取機構49之間產生摩擦力。又,將廢棄帶PTn回收的工序可更高度地自動化。(1) Although the pad recovery section 15 is illustrated as the sheet recovery device in each embodiment, the structure of the sheet recovery device of the present invention can also be applied to the tape recovery section 13. That is, the winding mechanism 49 provided in the tape recovery section 13 has the same structure as the winding mechanism 51 provided in the pad recovery section 15. In this case, after the waste tape PTn is wound up in a state where the diameter of the winding section provided in the winding mechanism 49 in the tape recovery section 13 is increased, the diameter of the winding section provided in the winding mechanism 49 is reduced to form a gap portion between the winding section and the roll of the waste tape PTn. By forming the gap, it is possible to avoid the generation of friction between the roll of waste tape PTn and the take-up mechanism 49 in the process of extracting and recovering the roll of waste tape PTn from the take-up mechanism 49. In addition, the process of recovering the waste tape PTn can be more highly automated.
(2)實施例1中係作成使吸附孔69形成於突出構件63,突出構件63兼具吸附構件之構成,但不限於此。亦即,如圖36所示,亦可在筒狀構件58中與形成有貫通孔59的位置不同的位置形成吸附孔69。在圖36所示的例子中,在筒狀構件58的側面中相當於上側的位置配置貫通孔59及突出構件63,另一方面,在筒狀構件58的側面中相當於下側的位置形成有吸附孔69。(2) In Example 1, the adsorption hole 69 is formed in the protruding member 63, and the protruding member 63 also serves as the adsorption member, but the present invention is not limited to this. That is, as shown in FIG. 36 , the adsorption hole 69 may be formed at a position different from the position where the through hole 59 is formed in the cylindrical member 58. In the example shown in FIG. 36 , the through hole 59 and the protruding member 63 are arranged at a position corresponding to the upper side of the side surface of the cylindrical member 58, and on the other hand, the adsorption hole 69 is formed at a position corresponding to the lower side of the side surface of the cylindrical member 58.
即便在這樣的構成中,藉由一邊經由吸附孔69使剝離襯墊S的前端部St固定於捲取部57,一邊涵蓋移動至突出位置之突出構件63的外面(上面)與筒狀構件58的外周面捲繞剝離襯墊S,仍可一邊使剝離襯墊S被捲取的周長增大,一邊使剝離襯墊S捲取於捲取部57。Even in such a configuration, by fixing the front end portion St of the peeling pad S to the winding portion 57 via the adsorption hole 69 and wrapping the peeling pad S around the outer surface (upper surface) of the protruding member 63 moved to the protruding position and the outer peripheral surface of the tubular member 58, the peeling pad S can be rolled up on the winding portion 57 while increasing the circumference of the rolled-up peeling pad S.
(3)實施例1中,突出構件63的數量並不限於一個,亦可配設複數個。又,亦可使複數個突出構件63並列配置於捲取部57的軸向(z方向),亦可涵蓋捲取部57的圓周方向配置複數個。作為一例,亦可在筒狀構件58的側面中相當於上側的位置與相當於下側的位置,配置貫通孔59及突出構件63。(3) In the first embodiment, the number of the protruding member 63 is not limited to one, and a plurality of protruding members 63 may be provided. In addition, a plurality of protruding members 63 may be arranged in parallel in the axial direction (z direction) of the take-up portion 57, or a plurality of protruding members 63 may be arranged in the circumferential direction of the take-up portion 57. As an example, the through hole 59 and the protruding member 63 may be arranged at a position corresponding to the upper side and a position corresponding to the lower side in the side surface of the cylindrical member 58.
(4)各實施例中,吸附孔69並不限於藉由空氣吸引方式使剝離襯墊S吸附保持於捲取部57之構成。作為一例,係利用靜電來進行吸附保持,亦可藉由靜電吸引方式使剝離襯墊S吸附保持於捲取部57。在採用靜電吸引方式之情況,作為吸引裝置71的一例,係可使用使吸附孔69帶靜電之裝置。(4) In each embodiment, the adsorption hole 69 is not limited to the configuration that allows the peeling pad S to be adsorbed and held on the take-up portion 57 by air suction. As an example, the peeling pad S may be adsorbed and held by electrostatic attraction, or the peeling pad S may be adsorbed and held on the take-up portion 57 by electrostatic attraction. When the electrostatic attraction is adopted, as an example of the attraction device 71, a device that charges the adsorption hole 69 with static electricity may be used.
(5)各實施例中,進行步驟T1的時間點(timing)並不限於在步驟T2之前。只要在進行步驟T3之前增大捲取部57的直徑即可,步驟T1的操作亦可與步驟T2同時進行,亦可在步驟T2與步驟T3之間進行。(5) In each embodiment, the timing of performing step T1 is not limited to before step T2. As long as the diameter of the winding portion 57 is increased before performing step T3, the operation of step T1 may be performed simultaneously with step T2 or between step T2 and step T3.
1:黏著帶貼附裝置 3:帶供給部 4:張力機構 5:保持台 7:帶貼附單元 9:帶切斷單元 11:帶剝離單元 13:帶回收部 15:襯墊回收部 20:原材卷 21:剝離輥 27:缸體 28:惰輥 29:張力輥 31:晶圓保持部 33:切刀行進溝 35:貼附輥 49:捲取機構 51:捲取機構 53:切斷機構 55:旋轉板 57:捲取部 58:筒狀構件 59:貫通孔 61:最大直徑調節機構 63:突出構件 65:缸體 67:馬達 69:吸附孔 70:流路 71:吸引裝置 72:切刀保持器 73:切刀 75:開閉門 79:氣體供給孔 80:氣體供給裝置 W:晶圓(工件) S:剝離襯墊 PT:保護帶 Vb:間隙部 SR:卷 1: Adhesive tape attaching device 3: Tape supply unit 4: Tension mechanism 5: Holding table 7: Tape attaching unit 9: Tape cutting unit 11: Tape stripping unit 13: Tape recovery unit 15: Pad recovery unit 20: Raw material roll 21: Stripping roller 27: Cylinder 28: Idle roller 29: Tension roller 31: Wafer holding unit 33: Cutter travel groove 35: Attaching roller 49: Winding mechanism 51: Winding mechanism 53: Cutting mechanism 55: Rotating plate 57: Winding unit 58: Cylindrical member 59: Through hole 61: Maximum diameter adjustment mechanism 63: protruding member 65: cylinder 67: motor 69: suction hole 70: flow path 71: suction device 72: cutter holder 73: cutter 75: opening and closing door 79: gas supply hole 80: gas supply device W: wafer (workpiece) S: peeling pad PT: protective tape Vb: gap part SR: roll
圖1係表示具備實施例1的片材回收裝置之黏著帶貼附裝置的基本構成之前視圖。 圖2係表示實施例1的片材回收裝置之概略構成之立體圖,(a)係成為突出狀態的片材回收裝置之立體圖,(b)係成為埋没狀態的片材回收裝置之立體圖。 圖3係實施例1之最大直徑調節機構之立體圖。 圖4係表示實施例1中之添設有剝離襯墊之保護帶的構成之剖面圖。 圖5係表示實施例1之捲取部的構成之在前視圖觀察下之縱剖面圖;(a)係突出狀態下的縱剖面圖,(b)係埋没狀態下的縱剖面圖。 圖6係表示實施例1的裝置的動作之流程圖;(a)係表示將保護帶貼附於晶圓的動作的概要之流程圖,(b)係表示將剝離襯墊捲取並回收的動作之流程圖。 圖7係說明實施例1的步驟S1之圖。 圖8係說明實施例1的步驟S2之圖。 圖9係說明實施例1的步驟S3之圖。 圖10係說明實施例1的步驟S4之圖。 圖11係說明實施例1的步驟T2之立體圖。 圖12係說明實施例1的步驟T2之在前視圖觀察下的縱剖面圖。 圖13係說明實施例1的步驟T2之在前視圖觀察下的縱剖面圖。 圖14係說明實施例1的步驟T3之在前視圖觀察下的縱剖面圖。 圖15係說明實施例1的步驟T3之在前視圖觀察下的縱剖面圖。 圖16係說明實施例1的步驟T4之在前視圖觀察下的縱剖面圖。 圖17係說明實施例1的步驟T4之在前視圖觀察下的縱剖面圖。 圖18係說明實施例1的步驟T5之在前視圖觀察下的縱剖面圖。 圖19係說明實施例1的步驟T5之在前視圖觀察下的縱剖面圖。 圖20係說明實施例1的步驟T6之立體圖。 圖21係表示比較例的片材回收裝置的構成之立體圖。 圖22係表示比較例的片材回收裝置的構成之在左側視圖觀察下的縱剖面圖。 圖23係表示比較例的片材回收裝置的操作之在前視圖觀察下的縱剖面圖。 圖24係表示比較例的片材回收裝置的操作之在前視圖觀察下的縱剖面圖。 圖25係表示比較例的片材回收裝置的操作之立體圖。 圖26係表示比較例的片材回收裝置的操作之在前視圖觀察下的縱剖面圖。 圖27係表示比較例的片材回收裝置的操作之在前視圖觀察下的縱剖面圖。 圖28係表示比較例的片材回收裝置的操作之在前視圖觀察下的縱剖面圖。 圖29係表示實施例2的片材回收裝置的概略構成之立體圖。 圖30係實施例2中成為收縮狀態之片材回收裝置的構成之在前視圖觀察下的縱剖面圖。 圖31係實施例2中成為膨脹狀態之片材回收裝置的構成之在前視圖觀察下的縱剖面圖。 圖32係說明實施例2的步驟T2之在前視圖觀察下的縱剖面圖。 圖33係說明實施例2的步驟T2之在前視圖觀察下的縱剖面圖。 圖34係說明實施例2的步驟T3之在前視圖觀察下的縱剖面圖。 圖35係說明實施例2的步驟T4之在前視圖觀察下的縱剖面圖。 圖36係說明變形例的片材回收裝置之在前視圖觀察下的縱剖面圖。 FIG. 1 is a front view showing the basic structure of the adhesive tape attaching device of the sheet material recovery device of Example 1. FIG. 2 is a perspective view showing the schematic structure of the sheet material recovery device of Example 1, (a) is a perspective view of the sheet material recovery device in a protruding state, and (b) is a perspective view of the sheet material recovery device in a buried state. FIG. 3 is a perspective view of the maximum diameter adjustment mechanism of Example 1. FIG. 4 is a cross-sectional view showing the structure of the protective tape with a peeling pad added in Example 1. FIG. 5 is a longitudinal cross-sectional view showing the structure of the take-up portion of Example 1 observed from the front view; (a) is a longitudinal cross-sectional view in a protruding state, and (b) is a longitudinal cross-sectional view in a buried state. FIG. 6 is a flowchart showing the operation of the device of Embodiment 1; (a) is a flowchart showing the outline of the operation of attaching the protective tape to the wafer, and (b) is a flowchart showing the operation of rolling up and recovering the peeling pad. FIG. 7 is a diagram illustrating step S1 of Embodiment 1. FIG. 8 is a diagram illustrating step S2 of Embodiment 1. FIG. 9 is a diagram illustrating step S3 of Embodiment 1. FIG. 10 is a diagram illustrating step S4 of Embodiment 1. FIG. 11 is a three-dimensional diagram illustrating step T2 of Embodiment 1. FIG. 12 is a longitudinal cross-sectional diagram illustrating step T2 of Embodiment 1 when viewed from the front. FIG. 13 is a longitudinal cross-sectional diagram illustrating step T2 of Embodiment 1 when viewed from the front. FIG. 14 is a longitudinal cross-sectional view of step T3 of Example 1 observed from the front view. FIG. 15 is a longitudinal cross-sectional view of step T3 of Example 1 observed from the front view. FIG. 16 is a longitudinal cross-sectional view of step T4 of Example 1 observed from the front view. FIG. 17 is a longitudinal cross-sectional view of step T4 of Example 1 observed from the front view. FIG. 18 is a longitudinal cross-sectional view of step T5 of Example 1 observed from the front view. FIG. 19 is a longitudinal cross-sectional view of step T5 of Example 1 observed from the front view. FIG. 20 is a stereoscopic view of step T6 of Example 1. FIG. 21 is a perspective view showing the structure of the sheet recovery device of the comparative example. FIG. 22 is a longitudinal sectional view showing the structure of the sheet recovery device of the comparative example when viewed from the left side. FIG. 23 is a longitudinal sectional view showing the operation of the sheet recovery device of the comparative example when viewed from the front. FIG. 24 is a longitudinal sectional view showing the operation of the sheet recovery device of the comparative example when viewed from the front. FIG. 25 is a perspective view showing the operation of the sheet recovery device of the comparative example. FIG. 26 is a longitudinal sectional view showing the operation of the sheet recovery device of the comparative example when viewed from the front. FIG. 27 is a longitudinal sectional view showing the operation of the sheet recovery device of the comparative example when viewed from the front. FIG. 28 is a longitudinal sectional view showing the operation of the sheet recovery device of the comparative example when viewed from the front. FIG. 29 is a perspective view showing the schematic structure of the sheet recovery device of Example 2. FIG. 30 is a longitudinal sectional view showing the structure of the sheet recovery device in the contracted state in Example 2 when viewed from the front. FIG. 31 is a longitudinal sectional view showing the structure of the sheet recovery device in the expanded state in Example 2 when viewed from the front. FIG. 32 is a longitudinal sectional view showing step T2 of Example 2 when viewed from the front. FIG. 33 is a longitudinal sectional view showing step T2 of Example 2 when viewed from the front. FIG. 34 is a longitudinal sectional view showing step T3 of Example 2 when viewed from the front. FIG. 35 is a longitudinal cross-sectional view of step T4 of Example 2 when viewed from the front. FIG. 36 is a longitudinal cross-sectional view of a sheet material recovery device of a modified example when viewed from the front.
1:黏著帶貼附裝置 1: Adhesive tape attachment device
3:帶供給部 3: With supply department
4:張力機構 4: Tension mechanism
5:保持台 5: Keep the table
7:帶貼附單元 7: With attachment unit
9:帶切斷單元 9: With cutting unit
9a:可動台 9a: Movable table
9b:支持臂 9b: Support arm
9c:切刀 9c: Cutter
11:帶剝離單元 11: With stripping unit
13:帶回收部 13: With recycling department
15:襯墊回收部 15: Pad recycling department
17:基部 17: Base
19:供給筒管 19: Supply bobbin
20:原材卷 20: Raw material roll
21:剝離輥 21: Peel off the roller
23:電磁制動器 23: Electromagnetic brake
25:擺動臂 25: Swing arm
27:缸體 27: Cylinder body
28:惰輥 28: Idle Roller
29:張力輥 29: Zhang Lijuan
31:晶圓保持部 31: Wafer holding unit
33:切刀行進溝 33: Cutter travel groove
34:可動台 34: Movable table
35:貼附輥 35: Attachment roller
40:控制部 40: Control Department
46:導輥 46: Guide roller
47:夾輥 47: Clamp Roller
47a:壓輥 47a: Pressure roller
47b:進給輥 47b: Feed roller
49:捲取機構 49: Winding mechanism
50:輸入部 50: Input section
53:切斷機構 53: Cutting mechanism
57:捲取部 57: Rolling section
75:開閉門 75: Open and close the door
L:保護帶PT的放出方向 L: Release direction of protective tape PT
M:放出方向 M: Release direction
P:縱軸心 P: Longitudinal axis
PT:保護帶 PT: Protective tape
PTn:廢棄帶 PTn: waste tape
S:剝離襯墊 S: Peel off the liner
W:晶圓 W: Wafer
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022082902A JP2023170838A (en) | 2022-05-20 | 2022-05-20 | Sheet material recovery method and sheet material recovery device |
JP2022-082902 | 2022-05-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202413253A true TW202413253A (en) | 2024-04-01 |
Family
ID=88772450
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112104380A TW202413253A (en) | 2022-05-20 | 2023-02-08 | Sheet material recovery method and sheet material recovery apparatus |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2023170838A (en) |
KR (1) | KR20230162530A (en) |
CN (1) | CN117087971A (en) |
TW (1) | TW202413253A (en) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4502547B2 (en) | 2000-08-07 | 2010-07-14 | 日東電工株式会社 | Method and apparatus for removing protective tape of semiconductor wafer |
JP6087515B2 (en) | 2012-05-01 | 2017-03-01 | 日東電工株式会社 | Semiconductor wafer protective tape cutting method and protective tape cutting device |
-
2022
- 2022-05-20 JP JP2022082902A patent/JP2023170838A/en active Pending
-
2023
- 2023-02-08 TW TW112104380A patent/TW202413253A/en unknown
- 2023-03-13 CN CN202310236788.5A patent/CN117087971A/en active Pending
- 2023-04-07 KR KR1020230045818A patent/KR20230162530A/en unknown
Also Published As
Publication number | Publication date |
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KR20230162530A (en) | 2023-11-28 |
JP2023170838A (en) | 2023-12-01 |
CN117087971A (en) | 2023-11-21 |
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