TW202411673A - System and method for boundary scan testing with test points of pins to be tested - Google Patents

Abstract

A system and a method for boundary scan testing with test points of pins to be tested. By finding a test point that is connected to a test pin and is closest to the test pin when determining the test pin of a target connector cannot be tested by boundary scan, transmitting a test signal to the target connector, receiving a result signal generated by the target connector when the test signal through the target connector, and comparing the test signal and the result signal to generate the test result, the system and the method can use boundary scan function to test connectors of computer products, and can achieve the effect of improving test range and test coverage of traditional boundary scan test to improve test efficiency and reduce test cost.

Description

System and method for performing boundary scanning test using test points of pins to be tested

A test system and method thereof, in particular, a system and method for performing boundary scanning test on test points of a pin to be tested.

Industry 4.0, also known as the fourth industrial revolution, does not simply create new industrial technologies, but focuses on integrating existing industrial technologies, sales processes and product experiences, building smart factories with adaptability, resource efficiency and ergonomics through artificial intelligence technology, and integrating customers and business partners in business processes and value processes to provide comprehensive after-sales services, thereby building a new intelligent industrial world with perception.

As the wave of Industry 4.0 sweeps the world, manufacturers are all using smart manufacturing to optimize production transformation and enhance their competitiveness. Smart manufacturing is based on sensing technology, network technology, automation technology, and artificial intelligence. Through the process of perception, human-machine interaction, decision-making, execution, and feedback, it realizes the intelligence of product design and manufacturing, enterprise management, and services.

The characteristics of the electronic assembly industry, such as small profits but quick turnover and fierce price competition, have led the industry to pursue more effective control and optimization of raw materials and production tools, so as to maximize the efficiency of factory production resources. For example, the boundary scanning test solution is used to test computer products.

Traditional boundary scanning test solutions can only work properly when the connector is connected to the boundary scanning component (such as CPU) on the motherboard and the boundary scanning component can normally support the boundary scanning function.

However, for some computer products such as notebook computers, the boundary scanning components configured on the computer products do not fully support the boundary scanning function, and the connector to be tested on the computer product may pass through the non-boundary scanning component. This will result in the inability to effectively use the boundary scanning function to test the connector using the traditional boundary scanning test solution.

In summary, it can be seen that the problem that computer products cannot use the boundary scanning function to test connectors has long existed in the prior art, so it is necessary to propose improved technical means to solve this problem.

In view of the problem that the prior art has a problem that computer products cannot use the boundary scanning function to test connectors, the present invention discloses a system and method for performing boundary scanning testing using the test points of the pins to be tested, wherein:

The system disclosed in the present invention for performing boundary scanning test on the test point of the pin to be tested comprises at least: a test device; a control device, which further comprises: an information acquisition module for acquiring component information of an electronic component connected to a target connector, the target connector and the electronic component being arranged on a circuit board; a mode determination module for determining whether the pin to be tested of the target connector can be subjected to boundary scanning according to the component information. The test point selection module is used to find the test point that is connected to the pin to be tested and is closest to the pin to be tested when the mode judgment module determines that the pin to be tested cannot be subjected to the boundary scan test; the test point connection module is used to connect the test point and the test device; the test control module is used to control the test device to send the test signal to the target connector so that the test device receives the result signal generated by the test signal passing through the target connector; the result judgment module is used to compare the test signal with the result signal and generate the test result.

Another system disclosed in the present invention for performing boundary scanning test on the test points of the pin to be tested includes at least: a control device, which further includes: an information acquisition module for acquiring component information of an electronic component connected to a target connector, the target connector and the electronic component being arranged on a circuit board; a mode judgment module for judging whether the pin to be tested of the target connector can be subjected to boundary scanning test according to the component information; a test point selection module for selecting the test points in the mode judgment; When the fault module determines that the pin to be tested cannot be subjected to a boundary scan test, it searches for a test point that is connected to the pin to be tested and is closest to the pin to be tested; the test device further includes: a test point connection module for connecting the test point and the test device; a test control module for sending a test signal to a target connector and receiving a result signal generated by the test signal passing through the target connector; and a result judgment module for comparing the test signal with the result signal and generating a test result.

The method disclosed in the present invention for performing boundary scanning test with the test point of the pin to be tested includes at least the following steps: obtaining component information of the electronic component connected to the target connector; when it is determined based on the component information that the pin to be tested of the target connector cannot be subjected to boundary scanning test, searching for the test point connected to the pin to be tested and closest to the pin to be tested; connecting the test point and the test device; controlling the test device to send a test signal to the target connector so that the test device receives the result signal generated by the test signal passing through the target connector; comparing the test signal with the result signal and generating a test result.

The system and method disclosed in the present invention are as described above. The difference between the present invention and the prior art is that when it is determined that the pin to be tested of the target connector cannot be subjected to a boundary scan test, the present invention searches for a test point that is connected to the pin to be tested and is closest to the pin to be tested, sends a test signal to the target connector, receives a result signal generated by the test signal passing through the target connector, and compares the test signal with the result signal to generate a test result, thereby solving the problems existing in the prior art and achieving the technical effect of improving the test range and test coverage of the traditional boundary scan test to improve the test efficiency and reduce the test cost.

The following will be used in conjunction with drawings and embodiments to explain in detail the features and implementation methods of the present invention. The content is sufficient to enable anyone familiar with the relevant technology to easily and fully understand the technical means used by the present invention to solve the technical problems and implement them accordingly, thereby achieving the effects that can be achieved by the present invention.

When it is determined that one or more pins to be tested of a connector cannot be directly tested using a boundary scan, the present invention can continue to test the connector using a boundary scan by coordinating test points between the connector and the connected electronic components corresponding to the pins to be tested that cannot be directly tested using a boundary scan.

The following first uses the system architecture diagram of the present invention, "Figure 1A", which is a system architecture diagram of the present invention for performing boundary scanning test with the test points of the pin to be tested. As shown in "Figure 1A", the system of the present invention includes a control device 100 and a test device 101. Among them, the control device 100 can be a computing device, and the control device 100 and the test device 101 can be connected through a physical connection line or a wired network or a wireless network to transmit data or signals to each other.

The control device 100 can determine whether each pin of the target connector 220 on the circuit board 200 can be subjected to a boundary scan test, and can select the connection position of each pin of the target connector 220 to be tested according to the determination result. In some embodiments, the control device 100 can also include an information acquisition module 110, a mode determination module 120, and a test point selection module 130.

The information acquisition module 110 is responsible for acquiring the component information of the electronic component 210, wherein the electronic component 210 is disposed on the circuit board 200 and connected to the target connector 220. The component information acquired by the information acquisition module 110 may include internal information of the electronic component 210, such as whether the electronic component 210 includes a boundary scan cell (BC) and connection pins corresponding to the boundary scan cell, etc.; the component information may also include external connection information of the electronic component 210, such as other electronic components directly and indirectly connected to each connection pin of the electronic component 210, etc., but the content included in the component information is not limited to the above.

Generally speaking, the information acquisition module 110 can read the component information of the electronic component 210 from a pre-established file or database based on the component identification data of the electronic component 210, but the present invention is not limited thereto. The above-mentioned component identification data includes but is not limited to data such as model, number and/or serial number that are sufficient to identify the electronic component 210. In some embodiments, the information acquisition module 110 can also capture an image containing the electronic component 210 and perform image recognition on the captured image to obtain the component identification data of the electronic component 210, or can provide relevant personnel to input the component identification data of the electronic component 210, but the method for the information acquisition module 110 to obtain the component identification data is not limited to the above. Similarly, the information acquisition module 110 can also obtain the component identification data of the target connector 220.

The mode determination module 120 is responsible for determining whether each pin to be tested of the target connector 220 disposed on the circuit board 200 can be subjected to a boundary scanning test according to the component information obtained by the information acquisition module 110. More specifically, the mode determination module 120 can determine whether each pin to be tested of the target connector 220 is directly connected to the electronic component 210 according to the component information, and can determine whether the connection pin on the electronic component 210 connected to the pin to be tested of the target connector 220 has a corresponding boundary scanning unit according to the component information. 10, and the connection pin on the electronic component 210 connected to the specific pin to be tested has a corresponding boundary scanning unit, the mode judgment module 120 can determine that the specific pin to be tested on the target connector 220 directly connected to the electronic component 210 can perform a boundary scanning test, otherwise, the mode judgment module 120 can determine that the specific pin to be tested cannot be subjected to a boundary scanning test. As shown in "FIG. 2", the connection pins 212a~d of the electronic component 210 have corresponding boundary scanning units 211a~d, and the connection pins 212a~c are directly connected to the pins to be tested 222a~c of the target connector 220, and the connection pin 212d is indirectly connected to the pin to be tested 222d of the target connector 220 through the electronic component 260 that does not support the boundary scanning function. In this way, the mode judgment module 120 can judge that the pins to be tested 222a~c can be subjected to boundary scanning test, and can judge that the pin to be tested 222d cannot be subjected to boundary scanning test.

In some embodiments, the mode determination module 120 may also determine that a specific pin to be tested on the target connector 220 can be subjected to a boundary scan test and the test result of the specific pin to be tested is not consistent with expectations, that is, the specific pin to be tested fails the boundary scan test, and thus determine that the specific pin to be tested cannot be subjected to a boundary scan test.

The test point selection module 130 is responsible for finding a test point that is connected to and closest to the pin to be tested that cannot be tested for each pin to be tested that cannot be tested for the boundary scan test when the mode judgment module 120 judges that one or more pins to be tested of the target connector 220 cannot be tested for the boundary scan test.

More specifically, the test point selection module 130 can obtain the position information of one or more test points on the connection line between the pin to be tested and the electronic component 210 that cannot be tested by the boundary scanning test (the position information of the test point is also represented by the test point position information in the present invention), and select the test point that is connected to the pin to be tested and closest to the pin to be tested according to the obtained test point position information. For example, the test point selection module 130 can be based on a pre-established file or data. The test point location information of the test point on the connection line of the electronic component 210 indirectly connected to the pin to be tested that cannot be subjected to the boundary scan test can be read from the library, or the test point location information of the test point on the connection line between the pin to be tested and the connection pins on the electronic component 210 that do not correspond to the boundary scan unit can be obtained, and one of the test point location information is selected from the obtained test point location information to select the test point corresponding to the selected test point location information.

The test point location information obtained by the test point selection module 130 can represent the corresponding test point, for example, the position of the corresponding test point on the circuit board 200 can be recorded, and the test point location information can represent the distance between the corresponding test point and the connected pin to be tested. In some embodiments, the test point selection module 130 can also capture an image including the test point and the target connector 220 according to the position of the test point and the target circuit board 220 on the circuit board 200 and perform image recognition on the captured image to obtain the connection pin of the electronic component 210 and the target connector 220. The test point selection module 130 can also obtain the connection pins of the electronic component 210 and the test pins of the target connector 220 after image recognition, and calculate the line length of the connection pins of the electronic component 210 and the test pins of the target connector 220 according to the ratio of the captured image. However, the method for the test point selection module 130 to obtain the distance between the test point and the connected test pins is not limited to the above.

In some embodiments, if the test point selection module 130 cannot obtain the test point location information on the connection line between the pin to be tested and the electronic component, the test point selection module 130 can also read the pad information of the pad (not shown) corresponding to the target connector 220 from a pre-established file or database, and obtain the test point connected to the pin to be tested on the pad corresponding to the target connector 220 according to the read pad information. The pad information represents the corresponding pad, and the pad information can record the connection relationship between each connection point in the corresponding pad and each pin to be tested of the target connector 220, that is, record the pin to be tested connected to each connection point.

When the mode determination module 120 determines that the pin to be tested of the target connector 220 can be subjected to a boundary scan test, the test point selection module 130 can also select input/output points corresponding to the pin to be tested on the electronic component 210 according to the component information obtained by the information acquisition module 110, and use the selected input/output points as test points of the pin to be tested.

The test device 101 can be connected to the circuit board 200 and can test the connected circuit board 200. In some embodiments, the test device 101 can also include a test control module 150, a result judgment module 160, and an attachable test point connection module 140.

The test point connection module 140 can connect the test point selected by the test point selection module 130 and the test device 101. For example, the test point connection module 140 can include a machine arm and a clamping part (neither shown in the figure), and control the clamping part to clamp the connection element of the test device 101, and control the machine arm to make the connection element clamped by the clamping part contact with the corresponding test point, thereby connecting the test device 101 and the test point; the test point connection module 140 can also control the machine arm to insert or be inserted into the corresponding test point by the clamping part, thereby connecting the test device 101 and the input and output points of the circuit board 200 as the test point. However, the way in which the test connection module 140 connects the test point and the test device 101 is not limited to the above.

The test control module 150 is responsible for generating a test signal. The test control module 150 can execute a corresponding program to generate a test signal corresponding to the target connector 220 according to a preset or component identification data of the target connector 220 obtained by the information acquisition module 110, or can execute a preset program to generate a test signal, but the method for the test control module 150 to generate a test signal is not limited to the above.

The test control module 150 is also responsible for sending the generated test signal after the test device 101 is connected to all the test points selected by the test point selection module 130, so that the test signal reaches the target connector 220 through each test point, and then generates a result signal through the target connector 220. The test control module 150 is also responsible for receiving the result signal.

The result judgment module 160 is responsible for comparing the test signal generated by the test control module 150 with the result signal received by the test control module 150, and generating a test result according to the comparison result. For example, the result judgment module 160 can respectively use the test signal and the result signal as two sets of binary data, and compare the two sets of data. When the two sets of data are exactly the same, it means that all the pins to be tested of the target connector 220 have passed the test. If the two sets of data are different, it means that the pins to be tested corresponding to the different bits in the two sets of data have not passed the test, and the pins to be tested corresponding to the same bits in the two sets of data have passed the test.

The present invention can also be as shown in the architecture of "Figure 1B", where all modules are set in the control device 100, and the test device 101 is only responsible for forwarding the test signal. At this time, after receiving the test signal generated by the test control module 150, the test device 101 can send the received test signal to the target connector 220, and can transmit the received result signal back to the test control module 150.

Next, an embodiment is used to explain the operating system and method of the present invention, and please refer to "Figure 3A" for the method flow chart of the present invention for performing boundary scanning test with the test point of the pin to be tested. In this embodiment, it is assumed that the circuit board 200 is a motherboard, and the target connector 220 can be a USB or HDMI connection interface, but the present invention is not limited to the above.

When the management personnel on the production line of the circuit board 200 want to use the present invention to test the target connector 220 disposed on the circuit board 200, the information acquisition module 110 of the control device 100 can obtain the component information of the electronic component 210 disposed on the circuit board 200 and connected to the target connector 220 (step 310). In this embodiment, it is assumed that the information acquisition module 110 can obtain the component information of all electronic components 210 on the circuit board 200 that support boundary scanning, such as the component information of the central processing unit.

After the information acquisition module 110 of the control device 100 acquires the component information of the electronic component 210, the mode determination module 120 of the control device 100 can determine whether each pin to be tested of the target connector 220 can be subjected to a boundary scan test according to the component information acquired by the information acquisition module 110 (step 320). In this embodiment, if the mode determination module 120 can determine whether each electronic component 210 is directly connected to one or more pins to be tested of the target connector 220 according to the content recorded in the component information of each electronic component 210, if one or more pins to be tested of the target connector 220 are not directly connected to the electronic component 210 supporting the boundary scanning on the circuit board 200, then the mode determination module 120 can determine that the pins to be tested of the target connector 220 cannot be tested. Boundary scan test; and if there is one or more pins to be tested of the target connector 220 that are directly connected to any electronic component 210 that supports boundary scan, the mode judgment module 120 can further determine whether the connection pin to which the pin to be tested is connected corresponds to a boundary scan unit. If not, the mode judgment module 120 can determine that the pin to be tested cannot be subjected to a boundary scan test. If so, the mode judgment module 1210 can determine that the pin to be tested can be subjected to a boundary scan test.

After the mode determination module 120 of the control device 100 determines whether each pin to be tested of the target connector 220 can be subjected to a boundary scan test, the test point selection module 130 of the control device 100 can search for or select test points corresponding to each pin to be tested of the target connector 220 . In this embodiment, it is assumed that the test point selection module 130 can select the input/output points (step 341) corresponding to the pins 222a~c to be tested on the target connector 220 that can be subjected to the boundary scan test, such as the connection pins 212a~c of the electronic component 210, according to the component information obtained by the information acquisition module 110 of the control device 100 as shown in the process of "FIG. 3B"; the test point selection module 130 can also search for the test point that is connected to the pin 222d to be tested on the target connector 220 that cannot be subjected to the boundary scan test and is closest to the pin 222d to be tested. (Step 330), for example, the test point selection module 130 can obtain the test point location information of each test point on the connection line between the pin to be tested 222d and the electronic component 210, and select the test point closest to the pin to be tested 222d according to the test point location information. If the test point selection module 130 cannot obtain the test point location information between the pin to be tested 222d and the electronic component 210, the test point selection module 130 can obtain the pad information of the pad corresponding to the target connector 220, and can obtain the test point on the pad connected to the pin to be tested 222d according to the obtained pad information.

After the test point selection module 130 of the control device 100 respectively searches or selects the test points corresponding to the pins to be tested of the target connector 220, the relevant personnel on the production line of the circuit board 200 can connect the test device 101 to the test points found or selected by the test point selection module 130 (steps 345, 350). In this embodiment, it is assumed that the relevant personnel can connect the connection components on the test device 101 that support the boundary scanning function to the input and output points corresponding to the pins to be tested 222a~c selected by the test point selection module 130 and capable of performing the boundary scanning test, such as the connection pins 212a~c on the electronic component 210. The relevant personnel can also contact the probe on the test device 101 with the test point corresponding to the pin to be tested 222d found by the test point selection module 130 and not capable of performing the boundary scanning test, so as to connect the test device 101 with each pin to be tested of the target connector 220.

After the test device 101 is connected to the test point found or selected by the test point selection module 130, the test device 101 can send a test signal to the target connector 220, and can receive the result signal generated by the test signal through the target connector 220 (step 360). In this embodiment, assuming that the test device 101 is only an intermediate device for transmitting signals, the test control module 150 of the control device 100 can generate a control signal and transmit it to the test device 101, so that the test device 101 can generate a corresponding test signal, and can transmit the generated test signal to each pin to be tested of the target connector 220 through the test point. (or the test control module 150 can generate a test signal and transmit it to the test device 101, and the test device 101 can transmit the received test signal to each pin to be tested of the target connector 220), so that the test signal passes through the target connector 220 to generate a result signal; and if the test device 101 is not just an intermediate device for forwarding signals, the test control module 150 of the test device 101 can directly generate a test signal, and can transmit the generated test signal to each pin to be tested of the target connector 220 through a test point, so that the test signal passes through the target connector to generate a result signal.

After the test device 101 receives the result signal, the control device 100 or the result determination module 160 of the test device 101 may compare the test signal generated by the test device 101 with the received result signal, and generate a test result according to the comparison result (step 370). In this embodiment, assuming that a short circuit 250 occurs between the connection line between the tested pin 222b and the connection pin 212b and the connection line between the tested pin 222c and the connection pin 212c, the result signals corresponding to the tested pins 222b and 222c may be different from the expected ones. Thus, the result determination module 160 can determine that the tested pins 222a and 222d pass the test, and the tested pins 222b~c fail the test.

Thus, through the present invention, when the pins to be tested of the target connector 220 on the circuit board 200 cannot be tested using the boundary scan test, the target connector can continue to be tested using the boundary scan at the test points between the target connector 220 and the connected electronic component 210 corresponding to the pins to be tested that cannot be tested using the boundary scan test.

In the above-mentioned embodiment, as shown in the process of "Figure 3C", after the result judgment module 160 of the control device 100 or the test device 101 compares the test signal with the result signal and generates the test result (step 370), the mode judgment module 120 of the control device 100 can further judge whether the test result of each pin to be tested is consistent with the expectation (step 325). If so, the present invention can be terminated. If not, the mode judgment module 120 can judge that the pin to be tested whose test result does not match the expected one cannot perform the boundary scan test, and then repeat the above steps 330~370 to test the pin to be tested whose test result does not match the expected one again. In this embodiment, the pins 222b~c to be tested are tested again. In this way, if the test results of the pins 222b~222c to be tested are consistent with expectations, the result judgment module 160 can judge that there is a problem with the connection line between the pins 222b/222c to be tested and the electronic component 210. If the test results of the pins 222b~222c to be tested are still not consistent with expectations, the result judgment module 160 can judge that there is a problem with the pin welding of the pins 222b/222c to be tested.

In summary, the difference between the present invention and the prior art lies in that when it is determined that the pin to be tested of the target connector cannot be subjected to the boundary scan test, the present invention searches for the test point that is connected to the pin to be tested and is closest to the pin to be tested, sends the test signal to the target connector, receives the result signal generated by the test signal passing through the target connector, and compares the test signal with the result signal to generate the test result. This technical means can solve the problem of the prior art that the computer product cannot use the boundary scan function to test the connector, thereby achieving the technical effect of improving the test range and test coverage of the traditional boundary scan test to improve the test efficiency and reduce the test cost.

Furthermore, the method of the present invention for performing boundary scanning test on the test points of the pins to be tested can be implemented in hardware, software or a combination of hardware and software, and can also be implemented in a centralized manner in a computer system or in a distributed manner with different components distributed in several interconnected computer systems.

Although the implementation methods disclosed in the present invention are as above, the contents described are not intended to directly limit the scope of patent protection of the present invention. Any person with common knowledge in the technical field to which the present invention belongs, without departing from the spirit and scope disclosed by the present invention, makes slight changes and modifications to the implementation of the present invention in form and details, which are all within the scope of patent protection of the present invention. The scope of patent protection of the present invention shall still be based on the scope defined in the attached patent application.

100: control device 101: test device 110: information acquisition module 120: mode judgment module 130: test point selection module 140: test point connection module 150: test control module 160: result judgment module 200: circuit board 210: electronic component 211a~211d: boundary scanning component 212a~212d: connection pin 220: target connector 222a~222d: pin to be tested 250: short circuit 260: electronic component Step 310: obtain component information of the electronic component connected to the target connector Step 320: Determine whether the pin to be tested of the target connector can be subjected to a boundary scan test based on the component information Step 325: Whether the test result of the pin to be tested is consistent with expectations Step 330: Find the test point that is connected to the pin to be tested and closest to the pin to be tested Step 341: Select the input and output points on the electronic component corresponding to the pin to be tested based on the component information Step 345: Connect the test device and the input and output points Step 350: Connect the test point and the test device Step 360: The test device sends a test signal to the target connector and receives the result signal generated by the test signal passing through the target connector Step 370: Compare the test signal and the result signal and generate the test result

FIG. 1A is a system architecture diagram of the present invention for performing a boundary scan test using a test point of a pin to be tested. FIG. 1B is a system architecture diagram of another system for performing a boundary scan test using a test point of a pin to be tested. FIG. 2 is a schematic diagram of the connection between a target connector and an electronic component according to an embodiment of the present invention. FIG. 3A is a flow chart of a method for performing a boundary scan test using a test point of a pin to be tested according to the present invention. FIG. 3B is a flow chart of an additional method for performing a boundary scan test using a test point of a pin to be tested according to the present invention. FIG. 3C is a flow chart of a method for retesting a pin to be tested according to the present invention.

Step 310: Obtain component information of the electronic component connected to the target connector

Step 320: Determine whether the pin to be tested of the target connector can be subjected to a boundary scan test based on the component information.

Step 330: Find the test point that is connected to the pin to be tested and closest to the pin to be tested

Step 350: Connect test points and test equipment

Step 360: The test device sends a test signal to the target connector and receives a result signal generated by the test signal passing through the target connector.

Step 370: Compare the test signal and the result signal and generate the test result

Claims (10)

A method for performing a boundary scan test using a test point of a pin to be tested, the method comprising at least the following steps: Obtaining component information of an electronic component connected to a target connector; When determining that a pin to be tested of the target connector cannot be subjected to a boundary scan test based on the component information, searching for a test point connected to the pin to be tested and closest to the pin to be tested; Connecting the test point to a test device; Controlling the test device to send a test signal to the target connector so that the test device receives a result signal generated by the test signal passing through the target connector; and Comparing the test signal with the result signal and generating a test result. A method for performing a boundary scan test using a test point of a pin to be tested as described in claim 1, wherein the method further includes the steps of determining that another pin to be tested of the target connector can be subjected to a boundary scan test based on the component information, selecting an input/output point on the electronic component corresponding to the other pin to be tested based on the component information, and connecting the test device and the input/output point. The method of performing a boundary scan test using a test point of a pin to be tested as described in claim 1, wherein the step of determining whether the pin to be tested of the target connector can be boundary scanned based on the component information is to determine based on the component information that the electronic component is directly connected to the pin to be tested, and that the connection pin connected to the pin to be tested has a corresponding boundary scan cell (Boundary Scan Cell, BC), it is determined that the pin to be tested can be subjected to a boundary scan test; otherwise, it is determined that the pin to be tested cannot be subjected to a boundary scan; or when it is determined that the pin to be tested can be subjected to a boundary scan test and the test result of the pin to be tested does not meet expectations, it is determined that the pin to be tested cannot be subjected to a boundary scan. A method for performing a boundary scan test on a test point of a pin to be tested as described in claim 1, wherein the step of finding the test point connected to and closest to the pin to be tested is to obtain the test point position information of each test point on the connection line between the pin to be tested and the electronic component, and select the test point connected to and closest to the pin to be tested based on each test point position information, or when the test point position information between the pin to be tested and the electronic component cannot be obtained, obtain a pad information of a pad corresponding to the target connector, and obtain the test point on the pad connected to the pin to be tested based on the pad information. A system for performing boundary scanning test at the test point of a pin to be tested is used to test a circuit board. The system at least includes: A test device; and A control device, which further includes: An information acquisition module for acquiring component information of an electronic component connected to a target connector, the target connector and the electronic component are arranged on the circuit board; A mode judgment module for judging whether a pin to be tested of the target connector can be subjected to boundary scanning test according to the component information; A test point selection module for finding a test point connected to the pin to be tested and closest to the pin to be tested when the mode judgment module judges that the pin to be tested cannot be subjected to boundary scanning test; A test point connection module for connecting the test point and the test device; A test control module for controlling the test device to send a test signal to the target connector so that the test device receives a result signal generated by the test signal passing through the target connector; and A result judgment module for comparing the test signal with the result signal and generating a test result. A system for performing boundary scan testing using test points of a pin to be tested as described in claim 5, wherein the test point selection module is further used to select an input/output point on the electronic component corresponding to another pin to be tested based on the component information when the mode judgment module determines that another pin to be tested of the target connector can be subjected to boundary scan testing, and the test point connection module is further used to connect the test device and the input/output point. A system for performing a boundary scan test at a test point of a pin to be tested as described in claim 5, wherein the mode judgment module determines that the pin to be tested can be subjected to a boundary scan test when the electronic component is directly connected to the pin to be tested and the connection pin connected to the pin to be tested has a corresponding boundary scan unit based on the component information; otherwise, the pin to be tested cannot be subjected to a boundary scan; or when the pin to be tested can be subjected to a boundary scan test and the test result of the pin to be tested is inconsistent with expectations, the pin to be tested cannot be subjected to a boundary scan. A system for performing a boundary scan test at a test point of a pin to be tested is used to test a circuit board. The system at least includes: A control device, which further includes: An information acquisition module, which is used to obtain component information of an electronic component connected to a target connector, and the target connector and the electronic component are arranged on the circuit board; A mode judgment module, which is used to judge whether a pin to be tested of the target connector can be subjected to a boundary scan test based on the component information; and A test point selection module, which is used to find a test point connected to the pin to be tested and closest to the pin to be tested when the mode judgment module judges that the pin to be tested cannot be subjected to a boundary scan test; and A test device, which further includes: A test point connection module for connecting the test point and the test device; A test control module for sending a test signal to the target connector and receiving a result signal generated by the test signal passing through the target connector; and A result judgment module for comparing the test signal with the result signal and generating a test result. A system for performing a boundary scan test using test points of a pin to be tested as described in claim 8, wherein the test point selection module is further used to select an input/output point on the electronic component corresponding to another pin to be tested based on the component information when the mode judgment module determines that another pin to be tested of the target connector can be subjected to a boundary scan test, and the test point connection module is further used to connect the test device and the input/output point. A system for performing a boundary scan test on a test point of a pin to be tested as described in claim 8, wherein the mode judgment module determines that the pin to be tested can be subjected to a boundary scan test when the electronic component is directly connected to the pin to be tested and the connection pin connected to the pin to be tested has a corresponding boundary scan unit based on the component information; otherwise, the pin to be tested cannot be subjected to a boundary scan; or when the pin to be tested can be subjected to a boundary scan test and the test result of the pin to be tested is inconsistent with expectations, the pin to be tested cannot be subjected to a boundary scan.

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