TWI812481B - System and method for supplying power to circuit board and test devices in sequence to test circuit board - Google Patents
System and method for supplying power to circuit board and test devices in sequence to test circuit board Download PDFInfo
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Abstract
Description
一種測試系統及其方法,特別係指一種依序供電給電路板與測試裝置以測試電路板之系統及方法。A testing system and a method thereof, particularly a system and method for sequentially supplying power to a circuit board and a testing device to test the circuit board.
工業4.0(Industry 4.0),又稱為第四次工業革命,其並不是單單創造新的工業技術,而是著重於將現有的工業技術、銷售流程與產品體驗統合,透過人工智慧技術建立具有適應性、資源效率和人因工程學的智慧工廠,並在商業流程及價值流程中整合客戶以及商業夥伴,以提供完善的售後服務,進而建構出一個有感知意識的新型智慧型工業世界。Industry 4.0, also known as the fourth industrial revolution, does not simply create new industrial technologies, but focuses on integrating existing industrial technologies, sales processes and product experiences, and establishing adaptive industries through artificial intelligence technology. It integrates customers and business partners into business processes and value processes to provide comprehensive after-sales services, thereby building a new smart industrial world with awareness.
隨著工業4.0的浪潮襲捲全球,製造業者無不以智能製造優化生產轉型,提升競爭力。智慧製造是架構在感測技術、網路技術、自動化技術、與人工智慧的基礎上,透過感知、人機互動、決策、執行、與回饋的過程,來實現產品設計與製造、企業管理與服務的智慧化。As the wave of Industry 4.0 sweeps across the world, manufacturers are all using intelligent manufacturing to optimize production transformation and enhance competitiveness. Smart manufacturing is based on sensing technology, network technology, automation technology, and artificial intelligence. It realizes product design and manufacturing, enterprise management, and services through the process of perception, human-computer interaction, decision-making, execution, and feedback. of intelligence.
而電子業薄利多銷、產品價格競爭激烈的特性,讓業者追求對原物料及生產工具更有效的管控與最佳化,促使工廠生產資源效益最大化。其中,包含在產品製造完成後對產品的測試。The characteristics of the electronics industry, which include small profits but high turnover, and fierce product price competition, allow industry players to pursue more effective control and optimization of raw materials and production tools, thereby maximizing the efficiency of factory production resources. This includes testing the product after it is manufactured.
一般而言,在產品測試過程中,起初會供電給測試產品的測試裝置,若測試裝置有多個,通常會同時供電給所有的測試裝置。然而,對於部分的電路板而言,如主機板,若同時供電給與之連接的所有測試裝置,則由於各測試裝置與電路板間相互連接,在供電時可能會產生非預期的訊號,導致相連接的測試裝置及/或電路板無法正常通電或無法順利啟動或啟動後功能異常,如此,將導致產生錯誤的測試結果,除了降低直通率(First Pass Yield, FPY)外,還需要花費人力與時間進行異常確認與排除。Generally speaking, during product testing, power is initially supplied to the test device for testing the product. If there are multiple test devices, power is usually supplied to all test devices at the same time. However, for some circuit boards, such as motherboards, if power is supplied to all test devices connected to it at the same time, unexpected signals may be generated during power supply due to the interconnection between each test device and the circuit board, resulting in The connected test device and/or circuit board cannot be powered on normally or cannot be started smoothly or function abnormally after startup. This will lead to erroneous test results. In addition to reducing the First Pass Yield (FPY), it also requires a lot of manpower. Confirm and eliminate abnormalities with time.
綜上所述,可知先前技術中長期以來一直存在同時供電給電路板與其測試裝置可能導致無法進行測試或產生錯誤結果的問題,因此有必要提出改進的技術手段,來解決此一問題。In summary, it can be seen that there has long been a problem in the prior art that supplying power to a circuit board and its test device at the same time may result in failure to test or produce erroneous results. Therefore, it is necessary to propose improved technical means to solve this problem.
有鑒於先前技術存在同時供電給電路板與其測試裝置可能導致無法產生正確測試結果的問題,本發明遂揭露一種依序供電給電路板與測試裝置以測試電路板之系統及方法,其中:In view of the problem in the prior art that supplying power to the circuit board and its test device at the same time may result in failure to produce correct test results, the present invention discloses a system and method for sequentially supplying power to the circuit board and the test device to test the circuit board, wherein:
本發明所揭露之依序供電給電路板與測試裝置以測試電路板之系統,至少包含:測試機台,提供放置待測電路板;電源控制器;卡板測試裝置,與待測電路板連接;擴充測試裝置,與待測電路板連接;測試控制裝置,與卡板測試裝置與擴充測試裝置連接,用以控制電源控制器依第一順序供電給待測電路板、卡板測試裝置、及擴充測試裝置,並控制測試機台連接待測電路板與電子元件,及用以透過卡板測試裝置與擴充測試裝置傳送測試訊號至待測電路板,使測試訊號通過連接電子元件之待測電路板而產生結果訊號,並透過卡板測試裝置接收結果訊號,及依據結果訊號產生待測電路板之測試結果。The system disclosed by the present invention sequentially supplies power to a circuit board and a test device to test the circuit board. It at least includes: a test machine for placing the circuit board to be tested; a power controller; and a card board test device connected to the circuit board to be tested. ; The expansion test device is connected to the circuit board under test; the test control device is connected to the card board test device and the expansion test device, and is used to control the power controller to supply power to the circuit board under test, the card board test device, and Expand the test device, and control the test machine to connect the circuit board under test and the electronic component, and transmit the test signal to the circuit board under test through the card board test device and the expanded test device, so that the test signal passes through the circuit under test connected to the electronic component The board generates a result signal, receives the result signal through the card board test device, and generates test results of the circuit board under test based on the result signal.
本發明所揭露之依序供電給電路板與測試裝置以測試電路板之方法,其步驟至少包括:連接待測電路板與卡板測試裝置、待測電路板與擴充測試裝置,並放置待測電路板於測試機台上;測試控制裝置控制測試機台連接待測電路板與電子元件;測試控制裝置控制電源控制器依第一順序供電給待測電路板、卡板測試裝置、及擴充測試裝置;測試控制裝置透過卡板測試裝置與擴充測試裝置傳送測試訊號至待測電路板,使測試訊號通過連接電子元件之待測電路板而產生結果訊號,並透過卡板測試裝置接收結果訊號;測試控制裝置依據結果訊號產生待測電路板之測試結果。The method disclosed in the present invention sequentially supplies power to a circuit board and a test device to test the circuit board. The steps include at least: connecting the circuit board to be tested and the card board test device, the circuit board to be tested and the expansion test device, and placing the circuit board to be tested. The circuit board is on the test machine; the test control device controls the test machine to connect the circuit board under test and the electronic components; the test control device controls the power controller to supply power to the circuit board under test, the card board test device, and the extended test in the first order Device; the test control device transmits the test signal to the circuit board under test through the card board test device and the expansion test device, so that the test signal passes through the circuit board under test connected to the electronic component to generate a result signal, and receives the result signal through the card board test device; The test control device generates test results of the circuit board under test based on the result signal.
本發明所揭露之系統與方法如上,與先前技術之間的差異在於本發明透過測試控制裝置控制電源控制器依據順序供電給待測電路板、卡板測試裝置、及擴充測試裝置,並透過卡板測試裝置與擴充測試裝置傳送測試訊號至待測電路板,使測試訊號通過連接電子元件之待測電路板而產生結果訊號,及透過卡板測試裝置接收結果訊號以產生待測電路板之測試結果,藉以解決先前技術所存在的問題,並可以達成提高直通率及增加測試效率之技術功效。The system and method disclosed by the present invention are as described above. The difference between them and the prior art is that the present invention uses the test control device to control the power controller to supply power to the circuit board under test, the card board test device, and the expansion test device in sequence, and through the card The board test device and the expansion test device transmit the test signal to the circuit board under test, so that the test signal passes through the circuit board under test connected to the electronic component to generate a result signal, and the card board test device receives the result signal to generate the test of the circuit board under test. As a result, the problems existing in the previous technology can be solved, and the technical effects of improving the pass rate and increasing the test efficiency can be achieved.
以下將配合圖式及實施例來詳細說明本發明之特徵與實施方式,內容足以使任何熟習相關技藝者能夠輕易地充分理解本發明解決技術問題所應用的技術手段並據以實施,藉此實現本發明可達成的功效。The features and implementations of the present invention will be described in detail below with reference to the drawings and examples. The content is sufficient to enable any person familiar with the relevant art to easily fully understand the technical means used to solve the technical problems of the present invention and implement them accordingly, thereby achieving The effect that the present invention can achieve.
本發明可以在測試電路板時控制供電給電路板及測試電路板所需之測試裝置的順序,使得電路板與其他測試裝置能夠順利啟動且可以正常運作。The invention can control the order of power supply to the circuit board and the testing devices required for testing the circuit board when testing the circuit board, so that the circuit board and other testing devices can start smoothly and operate normally.
以下先以「第1A圖」本發明所提之依序供電給電路板與測試裝置以測試電路板之系統架構圖來說明本發明的系統運作。如「第1A圖」所示,本發明之系統含有電源控制器110、卡板測試裝置120、擴充測試裝置130、測試機台150、測試控制裝置160,其中,測試機台150、測試控制裝置160可以是計算設備。The system operation of the present invention will be explained below with reference to "Figure 1A", which is a system architecture diagram of sequentially supplying power to a circuit board and a test device to test the circuit board proposed by the present invention. As shown in "Figure 1A", the system of the present invention includes a
電源控制器110與卡板測試裝置120、擴充測試裝置130、測試機台150、測試控制裝置160、待測電路板101連接,可以接收測試控制裝置160所傳送的電源控制訊號,也可以依據所接收到的電源控制訊號選擇供電或停止供電(斷電)的目標(包含但不限於卡板測試裝置120、擴充測試裝置130、測試機台150、待測電路板101等測試裝置)。在部分的實施例中,電源控制器110也可以供電給測試機台150。其中,電源控制器110可以是可程式邏輯控制器(Programmable Logic Controller, PLC),電源控制訊號可以是PLC控制指令,但本發明並不以此為限。The
卡板測試裝置120可以透過電源連接介面(圖中未示)與電源控制器110連接、透過訊號輸出入介面(圖中未示)與擴充測試裝置130及測試控制裝置160連接、透過測試介面(圖中未示)與待測電路板101連接。The card
卡板測試裝置120負責在電源控制器110供電後啟動,並負責透過訊號輸出入介面接收測試控制裝置160所傳送的測試訊號,也可以將測試訊號的部分訊號透過另一個訊號輸出入介面傳送給擴充測試裝置130,及可以將另一部份的測試訊號透過測試介面傳送給待測電路板101;卡板測試裝置120也負責透過測試介面接收待測電路板101所傳回的結果訊號,並負責透過訊號輸出入介面將所接收到的結果訊號傳回測試控制裝置160。The
擴充測試裝置130可以透過電源連接介面(圖中未示)與電源控制器110連接、透過訊號輸出入介面(圖中未示)與卡板測試裝置120及測試控制裝置160連接。The
擴充測試裝置130負責在電源控制器110供電後啟動,並負責透過訊號輸出入介面接收測試控制裝置160所傳送的測試訊號,並可以將測試訊號的部分訊號透過另一個訊號輸出入介面傳送給卡板測試裝置120。The
測試機台150可以透過電源連接介面(圖中未示)與電源控制器110連接、透過實體連接線或有線網路或無線網路與測試控制裝置160連接,測試機台150並可以提供放置待測電路板101的測試位置以測試待測電路板101。The
測試機台150可以包含一個或多個電子元件151。電子元件151包含處理器模組、記憶體(DIMM)模組,但本發明並不以此為限,其中,處理器模組包含但不限於中央處理器(CPU)或其他處理晶片等。
測試機台150可以決定與待測電路板101連接的電子元件151並決定與待測電路板101連接的位置。更詳細的,測試機台150可以依據測試控制裝置160所傳送之待測電路板101的卡板識別資料讀取與待測電路板101連接之電子元件151之元件識別資料與待測電路板101連接的位置資訊,並可以依據所讀出之元件識別資料取得電子元件151,及將所取得之電子元件151移動至所取得之位置資訊所表示的連接位置;測試機台150也可以接收測試控制裝置160所傳送之元件識別資料與位置資訊,並可以依據所接收到之元件識別資料取得電子元件151,及將所取得之電子元件151移動至所接收到之位置資訊所表示的連接位置。但本發明並不以此為限。The
測試機台150負責接收測試控制裝置160所傳送的連斷控制訊號,並負責所接收到的連斷控制訊號連接或分離電子元件151與放置於測試機台150之測試位置的待測電路板101。舉例來說,測試機台150可以在所接收到的連斷控制訊號表示開始連接時降下電子元件151,使得電子元件151與放置於測試位置的待測電路板101連接,或可以在所接收到的連斷控制訊號表示結束連接時升起電子元件151,使得電子元件151與放置於測試位置的待測電路板101分離而未連接。The
測試控制裝置160可以透過訊號輸出入介面(圖中未示)與電源控制器110、卡板測試裝置120、擴充測試裝置130連接,並可以透過實體連接線或有線或無線網路與測試機台150連接。The
測試控制裝置160負責決定第一順序,例如,測試控制裝置160可以執行測試腳本,藉以提供設定與待測電路板101對應的第一順序或載入預先設定的第一順序,但測試控制裝置160決定第一順序的方式並不以上述為限。The
測試控制裝置160也負責依據所決定的第一順序產生對應的電源控制訊號,藉以控制電源控制器110依據所決定之第一順序依序供電給卡板測試裝置120、擴充測試裝置130、待測電路板101,進而避免卡板測試裝置120、擴充測試裝置130、及/或待測電路板101無法順利通電導致無法測試或造成卡板測試裝置120及/或擴充測試裝置130功能異常導致產生錯誤測試結果。另外,測試控制裝置160也可以依據所決定之第一順序的反向順序產生對應的電源控制訊號,藉以控制電源控制器110依據第一順序的反向順序依序停止供電給卡板測試裝置120、擴充測試裝置130、待測電路板101,進而避免卡板測試裝置120及/或擴充測試裝置130功能異常導致或干擾結果訊號而產生不正確的測試結果。The
在部分的實施例中,測試控制裝置160也可以在產生電源控制訊號並傳送給電源控制器110以控制電源控制器110依據第一順序供電給卡板測試裝置120、擴充測試裝置130、及待測電路板101時,判斷卡板測試裝置120是否傳回異常訊號;測試控制裝置160並可以在產生電源控制訊號並傳送給電源控制器110以控制電源控制器110依據第一順序供電的過程中接收到異常訊號時,依據所接收到的異常訊號產生與第一順序不同的第二順序,並依據第二順序再次產生電源控制訊號並傳送給電源控制器110以控制電源控制器110依據第二順序供電給卡板測試裝置120、擴充測試裝置130、及待測電路板101。甚至,測試控制裝置160可以在依據所產生之第二順序產生電源控制訊號並傳送給電源控制器110以控制電源控制器110依據第二順序供電的過程中再次判斷是否接收到異常訊號,若是,則測試控制裝置160可以重新決定與第一順序及第二順序都不同的第三順序,並依據第三順序控制電源控制器110供電,直到沒有收到異常訊號或沒有可以決定之排列順序為止。In some embodiments, the
測試控制裝置160也負責產生連斷控制訊號,並負責將所產生的連斷控制訊號傳送給測試機台150以控制測試機台150連接或分離待測電路板101與一個或多個電子元件151。其中,測試控制裝置160可以在開始測試待測電路板101時產生表示開始連接的連斷控制訊號,藉以控制測試機台150連接待測電路板101與電子元件151;測試控制裝置160並可以在完成測試或中斷測試時產生表示結束連接的連斷控制訊號,藉以控制測試機台150分離待測電路板101與電子元件151。The
測試控制裝置160也負責產生測試訊號,在部分的實施例中,測試控制裝置還可以產生與測試訊號對應的預期訊號。測試控制裝置160並負責透過卡板測試裝置120與擴充測試裝置130傳送測試訊號至放置於測試機台150上之測試位置的待測電路板101,使所產生之測試訊號通過與電子元件151連接之待測電路板101而產生結果訊號,測試控制裝置160也負責透過卡板測試裝置120(與擴充測試裝置130)接收結果訊號。其中,測試控制裝置160所產生的測試訊號與待測電路板101對應,測試控制裝置160可以依據待測電路板101的識別資料產生對應的測試訊號。The
測試控制裝置160也負責依據所接收到的結果訊號產生待測電路板之測試結果。舉例來說,測試控制裝置160可以比對結果訊號與測試訊號或比對結果訊號與預期訊號,並依據比對結果產生相對應的測試結果。The
要說明的是,在「第1A圖」中,卡板測試裝置120與待測電路板101可以直接透過測試介面連接,但若卡板測試裝置120與待測電路板101無法直接透過測試介面連接,則本發明可以如「第1B圖」所示之另一種系統架構圖,在卡板測試裝置120與待測電路板101之間,透過轉接測試裝置140連接,也就是卡板測試裝置120與轉接測試裝置140連接,待測電路板101與轉接測試裝置140連接。其中,轉接測試裝置140可能不需要外部電源,例如可以是做為單純訊號轉送的轉接卡;轉接測試裝置140也可以需要外部電源才能進行訊號轉送,本發明沒有特別的限制。It should be noted that in "Figure 1A", the card
在「第1B圖」中,電源控制器110、卡板測試裝置120、擴充測試裝置130、測試機台150、測試控制裝置160大致上與上述相同,但電源控制器110可能需要額外供電給轉接測試裝置140,卡板測試裝置120需要透過轉接測試裝置140才能傳送測試訊號到待測電路板101及接收待測電路板101所產生的結果訊號,若轉接測試裝置140需要供電,則測試控制裝置160所產生的第一順序還可以包含轉接測試裝置140。In "Figure 1B", the
接著以一個實施例來解說本發明的運作過程,並請參照「第2A圖」本發明所提之依序供電給電路板與測試裝置以測試電路板之方法流程圖。假設待測電路板101為主機板,但本發明並不以上述為限。Next, an embodiment will be used to explain the operation process of the present invention, and please refer to "Figure 2A" for the flow chart of the method of sequentially supplying power to a circuit board and a test device to test the circuit board according to the present invention. It is assumed that the
若在待測電路板101的生產線上使用本發明,則在待測電路板101進入生產線上的測試區域時,生產線上的相關人員可以先連接待測電路板101與卡板測試裝置120及連接待測電路板101與擴充測試裝置130(步驟210)。在本實施例中,假設卡板測試裝置120可以與待測電路板101之控制接腳(pin)中的一部份接腳連接,且擴充測試裝置130可以與待測電路板101之控制接腳中的另一部份接腳連接。If the present invention is used on the production line of the circuit board to be tested 101, when the circuit board to be tested 101 enters the test area on the production line, relevant personnel on the production line can first connect the circuit board to be tested 101 to the card
在待測電路板101與卡板測試裝置120及擴充測試裝置130連接後,測試控制裝置160可以控制測試機台150連接待測電路板101與電子元件151(步驟230)。在本實施例中,假設電子元件151包含中央處理器與記憶體模組,測試控制裝置160可以在判斷可以開始測試時,產生表示開始測試的連斷控制訊號並傳送給測試機台150,測試機台150可以判斷所接收到的連斷控制訊號表示開始測試而下壓中央處理器與記憶體模組等電子元件151,使得中央處理器插入待測電路板101的處理器連接器且記憶體模組插入待測電路板101的記憶體連接槽。After the circuit board under
在測試機台150連接待測電路板101與電子元件151後,測試控制裝置160可以控制電源控制器110依據第一順序供電給卡板測試裝置120、擴充測試裝置130、及待測電路板101(步驟250)。在本實施例中,假設電源控制器110為可程式邏輯控制器,電源控制訊號為PLC控制指令,且測試控制裝置160可以取得待測電路板101的卡板識別資料(如型號),並執行與待測電路板101之卡板識別資料對應的測試腳本以決定第一順序,例如,卡板測試裝置120、擴充測試裝置130、待測電路板101。若測試腳本中所記載之PLC控制指令如「第4圖」之控制指令表400所示,則測試控制裝置160可以依據第一順序先產生與卡板測試裝置120對應的電源控制訊號「01 03 02 04 05 0A 0A」並傳送給電源控制器110,使得電源控制器110在接收到上述的電源控制訊號後依據所接收到的電源控制訊號判斷供電給卡板測試裝置120,進而讓卡板測試裝置120通電並啟動;在電源控制器110供電給卡板測試裝置120後可以傳回供電回報訊息給測試控制裝置160,之後,測試控制裝置160可以依據第一順序再次產生與擴充測試裝置130對應的電源控制訊號「01 03 02 04 05 0B 0A」並傳送給電源控制器110,使得電源控制器110在接收到電源控制訊號「01 03 02 04 05 0B 0A」後供電給擴充測試裝置130,進而讓擴充測試裝置130通電並啟動,接著,測試控制裝置160可以在接收到電源控制器110所傳回的供電回報訊息後,再次依據第一順序產生與待測電路板101對應的電源控制訊號「01 03 02 04 05 0C 0A」並傳送給電源控制器110,使得電源控制器110供電給待測電路板101,進而讓待測電路板101通電並啟動,如此,卡板測試裝置120、擴充測試裝置130、及待測電路板101將依序啟動,而非如習知的同時啟動。After the
在電源控制器110依據測試控制裝置160所決定的第一順序供電給卡板測試裝置120、擴充測試裝置130、及待測電路板101後,測試控制裝置160可以透過卡板測試裝置120與擴充測試裝置130傳送測試訊號到待測電路板101,使得測試訊號通過與電子元件151連接之待測電路板101而產生結果訊號(步驟260)。在本實施例中,假設測試控制裝置160所執行之與待測電路板101卡板識別資料對應的測試腳本可以產生一個或多個測試訊號,並傳送給相連接的卡板測試裝置120與擴充測試裝置130,使得測試訊號通過卡板測試裝置120與擴充測試裝置130而抵達待測電路板101,並經過與待測電路板101連接之電子元件151對各個測試訊號進行運算或判斷等處理後產生相對應的一個或多個結果訊號。After the
在待測電路板101產生結果訊號後,測試控制裝置160可以透過卡板測試裝置120接收待測電路板101所產生的結果訊號,並可以依據所接收到的結果訊號產生待測電路板101的測試結果(步驟270)。After the circuit board under
如此,透過本發明,可以透過測試控制裝置160控制電源控制器110以一定順序供電給待測電路板101與測試待測電路板101的卡板測試裝置120與擴充測試裝置130,避免因為同時供電給待測電路板101、卡板測試裝置120與擴充測試裝置130而造成待測電路板101、卡板測試裝置120與擴充測試裝置130無法通電或啟動異常等狀況。In this way, through the present invention, the
上述實施例中,在測試控制裝置160透過卡板測試裝置120接收待測電路板101所產生的結果訊號(步驟270)後,還可以如「第2B圖」所示之流程,測試控制裝置160可以控制電源控制器110依據所決定之第一順序的反向順序依序停止供電給待測電路板101、擴充測試裝置130、及卡板測試裝置120(步驟280)。例如,測試控制裝置160可以依據待測電路板101、擴充測試裝置130、及卡板測試裝置120的順序,依序產生「01 03 02 04 05 0C 0B」、「01 03 02 04 05 0B 0B」、「01 03 02 04 05 0A 0B」等電源控制訊號,並傳送給電源控制器110,使得電源控制器110依據所接收到的電源控制訊號由先至後停止供電給待測電路板101、擴充測試裝置130、及卡板測試裝置120。In the above embodiment, after the
之後,測試控制裝置160可以控制測試機台150分離相連接之待測電路板101與電子元件151(步驟290)。例如,測試控制裝置160可以產生表示結束測試的連斷控制指令並將所產生的連斷控制指令傳送給測試機台150,使得測試機台在判斷所接收到的連斷控制指令表示結束測試後,升起中央處理器與記憶體模組等電子元件151,進而分離待測電路板101與電子元件151,藉以準備測試下一個電路板。Afterwards, the
另外,上述實施例中,若卡板測試裝置120與待測電路板101無法直接連接,則如「第3圖」之流程所示,在生產線的人員可以連接卡板測試裝置120與擴充測試裝置130、連接卡板測試裝置120與轉接測試裝置140、並連接轉接測試裝置140與待測電路板101,並將直接或間接連接轉接測試裝置140、卡板測試裝置、擴充測試裝置130的待測電路板101放置於測試機台150上(步驟310)。In addition, in the above embodiment, if the card
而後,測試控制裝置160可以控制測試機台150連接電子元件151與待測電路板101(步驟330),並可以控制電源控制器110依據所決定的第一順序依序供電給卡板測試裝置120、擴充測試裝置130、轉接測試裝置140、及待測電路板101(步驟350)。若第一順序為卡板測試裝置120、擴充測試裝置130、轉接測試裝置140、待測電路板101,則測試控制裝置160可以依序產生「01 03 02 04 05 0A 0A」、「01 03 02 04 05 0B 0A」、「01 03 02 04 05 0C 0A」、「01 03 02 04 05 0D 0A」等電源控制訊號並傳送給電源控制器110,使得電源控制器110在接收到電源控制訊號後供電給卡板測試裝置120、擴充測試裝置130、轉接測試裝置140、及待測電路板101。Then, the
接著,測試控制裝置160可以透過卡板測試裝置120、擴充測試裝置130、與轉接測試裝置140將所產生的測試訊號傳送到待測電路板101,使得測試訊號通過待測電路板101而產生結果訊號(步驟360),測試控制裝置160也可以透過轉接測試裝置140與卡板測試裝置120接收待測電路板101所產生的結果訊號,並依據所接收到的結果訊號產生待測電路板的測試結果(步驟370)。也就是說,測試控制裝置160可以將測試訊號輸出到相連接的卡板測試裝置120與擴充測試裝置130,使得測試訊號先通過卡板測試裝置120與擴充測試裝置130再通過轉接測試裝置140而抵達待測電路板101,進而讓與待測電路板101連接的電子元件151對抵達待測電路板101的測試訊號進行處理而產生對應的結果訊號並可以讓結果訊號通過待測電路板101與轉接測試裝置140而抵達卡板測試裝置120並由卡板測試裝置120傳回測試控制裝置160。Then, the
之後,測試控制裝置160可以控制電源控制器110依據第一順序的反向順序停止供電給卡板測試裝置120、擴充測試裝置130、轉接測試裝置140、及待測電路板101(步驟380),並可以在電源控制器110停止供電給卡板測試裝置120、擴充測試裝置130、轉接測試裝置140、及待測電路板101後,控制測試機台150分離待測電路板101與電子元件151(步驟390)。其中,由於第一順序為卡板測試裝置120、擴充測試裝置130、轉接測試裝置140、及待測電路板101,因此,測試控制裝置160可以依據待測電路板101、轉接測試裝置140、擴充測試裝置130、卡板測試裝置120的順序產生表示斷電的電源控制訊號並將所產生的電源控制訊號傳送給電源控制器110,使得電源控制器110依據所接收到的電源控制訊號依序停止供電給待測電路板101、轉接測試裝置140、擴充測試裝置130、與卡板測試裝置120。After that, the
此外,本發明還可以如「第2C圖」之流程所示,在測試控制裝置160控制電源控制器110依據第一順序供電給卡板測試裝置120、擴充測試裝置130、待測電路板101(與轉接測試裝置140)(步驟250、350)後,測試控制裝置160可以判斷是否接收到卡板測試裝置120所傳回的異常訊號(步驟253),若否,表示卡板測試裝置120、擴充測試裝置130、待測電路板101(與轉接測試裝置140)都順利通電並正常啟動,若是,表示卡板測試裝置120、擴充測試裝置130、待測電路板101(與轉接測試裝置140)中至少其中一個無法順利通電或正常啟動,測試控制裝置160可以產生與第一順序不同的第二順序(步驟255),例如,產生擴充測試裝置130、卡板測試裝置120、待測電路板101(、轉接測試裝置140)的第二順序,並可以依據所產生的第二順序控制電源控制器110依序供電給擴充測試裝置130、卡板測試裝置120、待測電路板101(、轉接測試裝置140)(步驟257),也就是依序產生供電給擴充測試裝置130、卡板測試裝置120、待測電路板101(與轉接測試裝置140)的電源控制訊號並傳送給電源控制器110,使電源控制器110在接收到電源控制訊號後供電給對應的擴充測試裝置130、卡板測試裝置120、待測電路板101(或轉接測試裝置140)。In addition, the present invention can also control the
綜上所述,可知本發明與先前技術之間的差異在於具有測試控制裝置控制電源控制器依據順序供電給待測電路板、卡板測試裝置、及擴充測試裝置,並透過卡板測試裝置與擴充測試裝置傳送測試訊號至待測電路板,使測試訊號通過連接電子元件之待測電路板而產生結果訊號,及透過卡板測試裝置接收結果訊號以產生待測電路板之測試結果之技術手段,藉由此一技術手段可以來解決先前技術所存在同時供電給電路板與其測試裝置可能導致無法產生正確測試結果的問題,進而達成提高直通率及增加測試效率的技術功效。In summary, it can be seen that the difference between the present invention and the prior art is that it has a test control device to control the power controller to supply power to the circuit board to be tested, the card board test device, and the expansion test device in sequence, and through the card board test device and The expanded test device transmits test signals to the circuit board under test, allows the test signal to pass through the circuit board under test connected to the electronic components to generate a result signal, and receives the result signal through the card board test device to generate the test result of the circuit board under test. , this technical means can be used to solve the problem in the previous technology that supplying power to the circuit board and its test device at the same time may lead to the inability to produce correct test results, thereby achieving the technical effects of improving the through rate and increasing the test efficiency.
再者,本發明之依序供電給電路板與測試裝置以測試電路板之方法,可實現於硬體、韌體、軟體或硬體、韌體與軟體之組合中,亦可在電腦系統中以集中方式實現或以不同元件散佈於若干互連之電腦系統的分散方式實現。Furthermore, the method of sequentially supplying power to the circuit board and the test device to test the circuit board of the present invention can be implemented in hardware, firmware, software or a combination of hardware, firmware and software, or in a computer system. It can be implemented in a centralized manner or in a decentralized manner with different components spread across several interconnected computer systems.
雖然本發明所揭露之實施方式如上,惟所述之內容並非用以直接限定本發明之專利保護範圍。任何本發明所屬技術領域中具有通常知識者,在不脫離本發明所揭露之精神和範圍的前提下,對本發明之實施的形式上及細節上作些許之更動潤飾,均屬於本發明之專利保護範圍。本發明之專利保護範圍,仍須以所附之申請專利範圍所界定者為準。Although the embodiments of the present invention are disclosed above, the content described is not intended to directly limit the scope of patent protection of the present invention. Anyone with ordinary knowledge in the technical field to which the present invention belongs can make slight modifications and modifications to the form and details of the implementation of the present invention without departing from the spirit and scope disclosed by the present invention, which shall fall under the patent protection of the present invention. Scope. The scope of patent protection for this invention must still be defined by the scope of the attached patent application.
101:待測電路板 110:電源控制器 120:卡板測試裝置 130:擴充測試裝置 140:轉接測試裝置 150:測試機台 151:電子元件 160:測試控制裝置 400:控制指令表 步驟210:連接待測電路板與卡板測試裝置、擴充測試裝置,並將待測電路板放置於測試機台上 步驟230:測試控制裝置控制測試機台連接待測電路板與電子元件 步驟250:測試控制裝置控制電源控制器依第一順序供電給待測電路板、卡板測試裝置、及擴充測試裝置 步驟253:測試控制裝置判斷是否接收到卡板測試裝置傳回之異常訊號 步驟255:測試控制裝置依據異常訊號產生不同之第二順序 步驟257:測試控制裝置控制電源控制器依第二順序供電給待測電路板、卡板測試裝置、及擴充測試裝置 步驟260:測試控制裝置透過卡板測試裝置與擴充測試裝置傳送控制訊號至待測電路板,使控制訊號通過連接電子元件之待測電路板而產生結果訊號 步驟270:測試控制裝置透過卡板測試裝置接收結果訊號,並依據結果訊號產生待測電路板之測試結果 步驟280:測試控制裝置控制電源控制器依據第一順序之反向順序停止供電給待測電路板、卡板測試裝置、及擴充測試裝置 步驟290:測試控制裝置控制測試機台分離待測電路板與電子元件 步驟310:連接待測電路板與轉接測試裝置、卡板測試裝置、擴充測試裝置,並將待測電路板放置於測試機台上 步驟330:測試控制裝置控制測試機台連接待測電路板與電子元件 步驟350:測試控制裝置控制電源控制器依第一順序供電給轉接測試裝置、待測電路板、卡板測試裝置、及擴充測試裝置 步驟360:測試控制裝置透過轉接測試裝置、卡板測試裝置與擴充測試裝置傳控制訊號至待測電路板,使控制訊號通過連接電子元件之待測電路板而產生結果訊號 步驟370:測試控制裝置透過轉接測試裝置與卡板測試裝置接收結果訊號,並依據結果訊號產生待測電路板之測試結果 步驟380:測試控制裝置控制電源控制器依據第一順序之反向順序停止供電給轉接測試裝置、待測電路板、卡板測試裝置、及擴充測試裝置 步驟390:測試控制裝置控制測試機台分離待測電路板與電子元件 101: Circuit board to be tested 110:Power controller 120:Card board test device 130:Expanded test device 140: Transfer test device 150:Testing machine 151:Electronic components 160: Test control device 400: Control command list Step 210: Connect the circuit board to be tested and the card board test device, expand the test device, and place the circuit board to be tested on the test machine Step 230: The test control device controls the test machine to connect the circuit board to be tested and the electronic component Step 250: The test control device controls the power controller to supply power to the circuit board under test, the card board test device, and the expansion test device in the first sequence. Step 253: The test control device determines whether it has received the abnormal signal returned by the card board testing device. Step 255: The test control device generates a different second sequence according to the abnormal signal Step 257: The test control device controls the power controller to supply power to the circuit board under test, the card board test device, and the expansion test device in the second sequence. Step 260: The test control device transmits the control signal to the circuit board under test through the card board test device and the expansion test device, so that the control signal passes through the circuit board under test connected to the electronic component to generate a result signal. Step 270: The test control device receives the result signal through the card board testing device, and generates the test result of the circuit board under test based on the result signal. Step 280: The test control device controls the power controller to stop supplying power to the circuit board under test, the card board test device, and the expansion test device according to the reverse sequence of the first sequence. Step 290: The test control device controls the test machine to separate the circuit board to be tested and the electronic components Step 310: Connect the circuit board to be tested to the switching test device, card board test device, and expansion test device, and place the circuit board to be tested on the test machine Step 330: The test control device controls the test machine to connect the circuit board to be tested and the electronic component Step 350: The test control device controls the power controller to supply power to the transfer test device, the circuit board to be tested, the card board test device, and the expansion test device in the first order. Step 360: The test control device transmits the control signal to the circuit board under test through the switching test device, the card board test device and the expansion test device, so that the control signal passes through the circuit board under test connected to the electronic component to generate a result signal. Step 370: The test control device receives the result signal through the switching test device and the card board test device, and generates the test result of the circuit board under test based on the result signal. Step 380: The test control device controls the power controller to stop supplying power to the transfer test device, the circuit board under test, the card board test device, and the expansion test device according to the reverse sequence of the first sequence. Step 390: The test control device controls the test machine to separate the circuit board to be tested and the electronic components
第1A圖為本發明所提之依序供電給電路板與測試裝置以測試電路板之系統架構圖。 第1B圖為本發明所提之另一種依序供電給電路板與測試裝置以測試電路板之系統架構圖。 第2A圖為本發明所提之依序供電給電路板與測試裝置以測試電路板之方法流程圖。 第2B圖為本發明所提之依序供電給電路板與測試裝置以測試電路板之附加方法流程圖。 第2C圖為本發明所提之產生供電之第二順序之方法流程圖。 第3圖為本發明所提之另一種依序供電給電路板與測試裝置以測試電路板之方法流程圖。 第4圖為本發明實施例所提之控制指令之示意表。 Figure 1A is a system architecture diagram for sequentially supplying power to a circuit board and a test device to test the circuit board according to the present invention. Figure 1B is another system architecture diagram for sequentially supplying power to a circuit board and a test device to test the circuit board according to the present invention. Figure 2A is a flow chart of the method of sequentially supplying power to a circuit board and a test device to test the circuit board according to the present invention. Figure 2B is a flow chart of an additional method of sequentially supplying power to a circuit board and a test device to test the circuit board according to the present invention. Figure 2C is a flow chart of the second sequence of generating power according to the present invention. Figure 3 is a flow chart of another method of sequentially supplying power to a circuit board and a test device to test the circuit board according to the present invention. Figure 4 is a schematic diagram of control instructions according to the embodiment of the present invention.
步驟210:連接待測電路板與卡板測試裝置、擴充測試裝置,並將待測電路板放置於測試機台上 Step 210: Connect the circuit board to be tested and the card board test device, expand the test device, and place the circuit board to be tested on the test machine
步驟230:測試控制裝置控制測試機台連接待測電路板與電子元件 Step 230: The test control device controls the test machine to connect the circuit board to be tested and the electronic component
步驟250:測試控制裝置控制電源控制器依第一順序供電給待測電路板、卡板測試裝置、及擴充測試裝置 Step 250: The test control device controls the power controller to supply power to the circuit board under test, the card board test device, and the expansion test device in the first sequence.
步驟260:測試控制裝置透過卡板測試裝置與擴充測試裝置傳送控制訊號至待測電路板,使控制訊號通過連接電子元件之待測電路板而產生結果訊號 Step 260: The test control device transmits the control signal to the circuit board under test through the card board test device and the expansion test device, so that the control signal passes through the circuit board under test connected to the electronic component to generate a result signal.
步驟270:測試控制裝置透過卡板測試裝置接收結果訊號,並依據結果訊號產生待測電路板之測試結果 Step 270: The test control device receives the result signal through the card board testing device, and generates the test result of the circuit board under test based on the result signal.
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