TWI812481B - System and method for supplying power to circuit board and test devices in sequence to test circuit board - Google Patents

System and method for supplying power to circuit board and test devices in sequence to test circuit board Download PDF

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TWI812481B
TWI812481B TW111136136A TW111136136A TWI812481B TW I812481 B TWI812481 B TW I812481B TW 111136136 A TW111136136 A TW 111136136A TW 111136136 A TW111136136 A TW 111136136A TW I812481 B TWI812481 B TW I812481B
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test
circuit board
test device
card
sequence
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TW202413972A (en
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段秋月
張琳
謝新穎
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英業達股份有限公司
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Abstract

A system and a method for supplying power to a circuit board and test devices in sequence to test the circuit board. By controlling to supply power to a circuit board to be tested, a board test device and expansion test device according a sequence, transmitting a test signal to the circuit board pass through the board test device and the expansion test device, generating a result signal based on the test signal by an electronic component connected to the circuit board, receiving the result signal trough the board test device, and generate a test result of the circuit board, the system and the method can supply power to circuit board and test devices of circuit board in sequence to avoid incorrect test result, and can achieve the effect of improving first pass yield of circuit board and increase test efficiency.

Description

依序供電給電路板與測試裝置以測試電路板之系統及方法System and method for sequentially supplying power to a circuit board and a test device to test the circuit board

一種測試系統及其方法,特別係指一種依序供電給電路板與測試裝置以測試電路板之系統及方法。A testing system and a method thereof, particularly a system and method for sequentially supplying power to a circuit board and a testing device to test the circuit board.

工業4.0(Industry 4.0),又稱為第四次工業革命,其並不是單單創造新的工業技術,而是著重於將現有的工業技術、銷售流程與產品體驗統合,透過人工智慧技術建立具有適應性、資源效率和人因工程學的智慧工廠,並在商業流程及價值流程中整合客戶以及商業夥伴,以提供完善的售後服務,進而建構出一個有感知意識的新型智慧型工業世界。Industry 4.0, also known as the fourth industrial revolution, does not simply create new industrial technologies, but focuses on integrating existing industrial technologies, sales processes and product experiences, and establishing adaptive industries through artificial intelligence technology. It integrates customers and business partners into business processes and value processes to provide comprehensive after-sales services, thereby building a new smart industrial world with awareness.

隨著工業4.0的浪潮襲捲全球,製造業者無不以智能製造優化生產轉型,提升競爭力。智慧製造是架構在感測技術、網路技術、自動化技術、與人工智慧的基礎上,透過感知、人機互動、決策、執行、與回饋的過程,來實現產品設計與製造、企業管理與服務的智慧化。As the wave of Industry 4.0 sweeps across the world, manufacturers are all using intelligent manufacturing to optimize production transformation and enhance competitiveness. Smart manufacturing is based on sensing technology, network technology, automation technology, and artificial intelligence. It realizes product design and manufacturing, enterprise management, and services through the process of perception, human-computer interaction, decision-making, execution, and feedback. of intelligence.

而電子業薄利多銷、產品價格競爭激烈的特性,讓業者追求對原物料及生產工具更有效的管控與最佳化,促使工廠生產資源效益最大化。其中,包含在產品製造完成後對產品的測試。The characteristics of the electronics industry, which include small profits but high turnover, and fierce product price competition, allow industry players to pursue more effective control and optimization of raw materials and production tools, thereby maximizing the efficiency of factory production resources. This includes testing the product after it is manufactured.

一般而言,在產品測試過程中,起初會供電給測試產品的測試裝置,若測試裝置有多個,通常會同時供電給所有的測試裝置。然而,對於部分的電路板而言,如主機板,若同時供電給與之連接的所有測試裝置,則由於各測試裝置與電路板間相互連接,在供電時可能會產生非預期的訊號,導致相連接的測試裝置及/或電路板無法正常通電或無法順利啟動或啟動後功能異常,如此,將導致產生錯誤的測試結果,除了降低直通率(First Pass Yield, FPY)外,還需要花費人力與時間進行異常確認與排除。Generally speaking, during product testing, power is initially supplied to the test device for testing the product. If there are multiple test devices, power is usually supplied to all test devices at the same time. However, for some circuit boards, such as motherboards, if power is supplied to all test devices connected to it at the same time, unexpected signals may be generated during power supply due to the interconnection between each test device and the circuit board, resulting in The connected test device and/or circuit board cannot be powered on normally or cannot be started smoothly or function abnormally after startup. This will lead to erroneous test results. In addition to reducing the First Pass Yield (FPY), it also requires a lot of manpower. Confirm and eliminate abnormalities with time.

綜上所述,可知先前技術中長期以來一直存在同時供電給電路板與其測試裝置可能導致無法進行測試或產生錯誤結果的問題,因此有必要提出改進的技術手段,來解決此一問題。In summary, it can be seen that there has long been a problem in the prior art that supplying power to a circuit board and its test device at the same time may result in failure to test or produce erroneous results. Therefore, it is necessary to propose improved technical means to solve this problem.

有鑒於先前技術存在同時供電給電路板與其測試裝置可能導致無法產生正確測試結果的問題,本發明遂揭露一種依序供電給電路板與測試裝置以測試電路板之系統及方法,其中:In view of the problem in the prior art that supplying power to the circuit board and its test device at the same time may result in failure to produce correct test results, the present invention discloses a system and method for sequentially supplying power to the circuit board and the test device to test the circuit board, wherein:

本發明所揭露之依序供電給電路板與測試裝置以測試電路板之系統,至少包含:測試機台,提供放置待測電路板;電源控制器;卡板測試裝置,與待測電路板連接;擴充測試裝置,與待測電路板連接;測試控制裝置,與卡板測試裝置與擴充測試裝置連接,用以控制電源控制器依第一順序供電給待測電路板、卡板測試裝置、及擴充測試裝置,並控制測試機台連接待測電路板與電子元件,及用以透過卡板測試裝置與擴充測試裝置傳送測試訊號至待測電路板,使測試訊號通過連接電子元件之待測電路板而產生結果訊號,並透過卡板測試裝置接收結果訊號,及依據結果訊號產生待測電路板之測試結果。The system disclosed by the present invention sequentially supplies power to a circuit board and a test device to test the circuit board. It at least includes: a test machine for placing the circuit board to be tested; a power controller; and a card board test device connected to the circuit board to be tested. ; The expansion test device is connected to the circuit board under test; the test control device is connected to the card board test device and the expansion test device, and is used to control the power controller to supply power to the circuit board under test, the card board test device, and Expand the test device, and control the test machine to connect the circuit board under test and the electronic component, and transmit the test signal to the circuit board under test through the card board test device and the expanded test device, so that the test signal passes through the circuit under test connected to the electronic component The board generates a result signal, receives the result signal through the card board test device, and generates test results of the circuit board under test based on the result signal.

本發明所揭露之依序供電給電路板與測試裝置以測試電路板之方法,其步驟至少包括:連接待測電路板與卡板測試裝置、待測電路板與擴充測試裝置,並放置待測電路板於測試機台上;測試控制裝置控制測試機台連接待測電路板與電子元件;測試控制裝置控制電源控制器依第一順序供電給待測電路板、卡板測試裝置、及擴充測試裝置;測試控制裝置透過卡板測試裝置與擴充測試裝置傳送測試訊號至待測電路板,使測試訊號通過連接電子元件之待測電路板而產生結果訊號,並透過卡板測試裝置接收結果訊號;測試控制裝置依據結果訊號產生待測電路板之測試結果。The method disclosed in the present invention sequentially supplies power to a circuit board and a test device to test the circuit board. The steps include at least: connecting the circuit board to be tested and the card board test device, the circuit board to be tested and the expansion test device, and placing the circuit board to be tested. The circuit board is on the test machine; the test control device controls the test machine to connect the circuit board under test and the electronic components; the test control device controls the power controller to supply power to the circuit board under test, the card board test device, and the extended test in the first order Device; the test control device transmits the test signal to the circuit board under test through the card board test device and the expansion test device, so that the test signal passes through the circuit board under test connected to the electronic component to generate a result signal, and receives the result signal through the card board test device; The test control device generates test results of the circuit board under test based on the result signal.

本發明所揭露之系統與方法如上,與先前技術之間的差異在於本發明透過測試控制裝置控制電源控制器依據順序供電給待測電路板、卡板測試裝置、及擴充測試裝置,並透過卡板測試裝置與擴充測試裝置傳送測試訊號至待測電路板,使測試訊號通過連接電子元件之待測電路板而產生結果訊號,及透過卡板測試裝置接收結果訊號以產生待測電路板之測試結果,藉以解決先前技術所存在的問題,並可以達成提高直通率及增加測試效率之技術功效。The system and method disclosed by the present invention are as described above. The difference between them and the prior art is that the present invention uses the test control device to control the power controller to supply power to the circuit board under test, the card board test device, and the expansion test device in sequence, and through the card The board test device and the expansion test device transmit the test signal to the circuit board under test, so that the test signal passes through the circuit board under test connected to the electronic component to generate a result signal, and the card board test device receives the result signal to generate the test of the circuit board under test. As a result, the problems existing in the previous technology can be solved, and the technical effects of improving the pass rate and increasing the test efficiency can be achieved.

以下將配合圖式及實施例來詳細說明本發明之特徵與實施方式,內容足以使任何熟習相關技藝者能夠輕易地充分理解本發明解決技術問題所應用的技術手段並據以實施,藉此實現本發明可達成的功效。The features and implementations of the present invention will be described in detail below with reference to the drawings and examples. The content is sufficient to enable any person familiar with the relevant art to easily fully understand the technical means used to solve the technical problems of the present invention and implement them accordingly, thereby achieving The effect that the present invention can achieve.

本發明可以在測試電路板時控制供電給電路板及測試電路板所需之測試裝置的順序,使得電路板與其他測試裝置能夠順利啟動且可以正常運作。The invention can control the order of power supply to the circuit board and the testing devices required for testing the circuit board when testing the circuit board, so that the circuit board and other testing devices can start smoothly and operate normally.

以下先以「第1A圖」本發明所提之依序供電給電路板與測試裝置以測試電路板之系統架構圖來說明本發明的系統運作。如「第1A圖」所示,本發明之系統含有電源控制器110、卡板測試裝置120、擴充測試裝置130、測試機台150、測試控制裝置160,其中,測試機台150、測試控制裝置160可以是計算設備。The system operation of the present invention will be explained below with reference to "Figure 1A", which is a system architecture diagram of sequentially supplying power to a circuit board and a test device to test the circuit board proposed by the present invention. As shown in "Figure 1A", the system of the present invention includes a power controller 110, a card board test device 120, an expansion test device 130, a test machine 150, and a test control device 160. Among them, the test machine 150 and the test control device 160 may be a computing device.

電源控制器110與卡板測試裝置120、擴充測試裝置130、測試機台150、測試控制裝置160、待測電路板101連接,可以接收測試控制裝置160所傳送的電源控制訊號,也可以依據所接收到的電源控制訊號選擇供電或停止供電(斷電)的目標(包含但不限於卡板測試裝置120、擴充測試裝置130、測試機台150、待測電路板101等測試裝置)。在部分的實施例中,電源控制器110也可以供電給測試機台150。其中,電源控制器110可以是可程式邏輯控制器(Programmable Logic Controller, PLC),電源控制訊號可以是PLC控制指令,但本發明並不以此為限。The power controller 110 is connected to the card board test device 120, the expansion test device 130, the test machine 150, the test control device 160, and the circuit board under test 101, and can receive the power control signal transmitted by the test control device 160, and can also control the power supply according to the test control device 160. The received power control signal selects the target of supplying power or stopping power supply (power outage) (including but not limited to test devices such as card board test device 120, expansion test device 130, test machine 150, circuit board under test 101, etc.). In some embodiments, the power controller 110 can also provide power to the testing machine 150 . The power controller 110 may be a programmable logic controller (PLC), and the power control signal may be a PLC control instruction, but the invention is not limited thereto.

卡板測試裝置120可以透過電源連接介面(圖中未示)與電源控制器110連接、透過訊號輸出入介面(圖中未示)與擴充測試裝置130及測試控制裝置160連接、透過測試介面(圖中未示)與待測電路板101連接。The card board test device 120 can be connected to the power controller 110 through a power connection interface (not shown in the figure), connected to the expansion test device 130 and the test control device 160 through a signal input/output interface (not shown in the figure), and connected to the test control device 160 through a test interface (not shown in the figure). (not shown in the figure) is connected to the circuit board 101 under test.

卡板測試裝置120負責在電源控制器110供電後啟動,並負責透過訊號輸出入介面接收測試控制裝置160所傳送的測試訊號,也可以將測試訊號的部分訊號透過另一個訊號輸出入介面傳送給擴充測試裝置130,及可以將另一部份的測試訊號透過測試介面傳送給待測電路板101;卡板測試裝置120也負責透過測試介面接收待測電路板101所傳回的結果訊號,並負責透過訊號輸出入介面將所接收到的結果訊號傳回測試控制裝置160。The card test device 120 is responsible for starting after the power controller 110 supplies power, and is responsible for receiving the test signal sent by the test control device 160 through the signal input and output interface. It can also send part of the test signal to the test device through another signal input and output interface. The expansion test device 130 can transmit another part of the test signal to the circuit board under test 101 through the test interface; the card board test device 120 is also responsible for receiving the result signal returned by the circuit board under test 101 through the test interface, and Responsible for transmitting the received result signal back to the test control device 160 through the signal input and output interface.

擴充測試裝置130可以透過電源連接介面(圖中未示)與電源控制器110連接、透過訊號輸出入介面(圖中未示)與卡板測試裝置120及測試控制裝置160連接。The expansion test device 130 can be connected to the power controller 110 through a power connection interface (not shown in the figure), and connected to the card board test device 120 and the test control device 160 through a signal input/output interface (not shown in the figure).

擴充測試裝置130負責在電源控制器110供電後啟動,並負責透過訊號輸出入介面接收測試控制裝置160所傳送的測試訊號,並可以將測試訊號的部分訊號透過另一個訊號輸出入介面傳送給卡板測試裝置120。The expansion test device 130 is responsible for starting after the power controller 110 is powered, and is responsible for receiving the test signal sent by the test control device 160 through the signal input and output interface, and can send part of the test signal to the card through another signal input and output interface. Board testing device 120.

測試機台150可以透過電源連接介面(圖中未示)與電源控制器110連接、透過實體連接線或有線網路或無線網路與測試控制裝置160連接,測試機台150並可以提供放置待測電路板101的測試位置以測試待測電路板101。The test machine 150 can be connected to the power controller 110 through a power connection interface (not shown in the figure), and connected to the test control device 160 through a physical connection cable or a wired network or a wireless network. The test machine 150 can also provide a place for waiting. Test the test position of the circuit board 101 to test the circuit board 101 under test.

測試機台150可以包含一個或多個電子元件151。電子元件151包含處理器模組、記憶體(DIMM)模組,但本發明並不以此為限,其中,處理器模組包含但不限於中央處理器(CPU)或其他處理晶片等。Testing station 150 may contain one or more electronic components 151 . The electronic component 151 includes a processor module and a memory (DIMM) module, but the invention is not limited thereto. The processor module includes but is not limited to a central processing unit (CPU) or other processing chips.

測試機台150可以決定與待測電路板101連接的電子元件151並決定與待測電路板101連接的位置。更詳細的,測試機台150可以依據測試控制裝置160所傳送之待測電路板101的卡板識別資料讀取與待測電路板101連接之電子元件151之元件識別資料與待測電路板101連接的位置資訊,並可以依據所讀出之元件識別資料取得電子元件151,及將所取得之電子元件151移動至所取得之位置資訊所表示的連接位置;測試機台150也可以接收測試控制裝置160所傳送之元件識別資料與位置資訊,並可以依據所接收到之元件識別資料取得電子元件151,及將所取得之電子元件151移動至所接收到之位置資訊所表示的連接位置。但本發明並不以此為限。The testing machine 150 can determine the electronic component 151 connected to the circuit board 101 under test and determine the position connected to the circuit board 101 under test. In more detail, the test machine 150 can read the component identification data of the electronic component 151 connected to the circuit board 101 and the circuit board 101 according to the card identification data of the circuit board 101 sent by the test control device 160 . The connected position information can be used to obtain the electronic component 151 based on the read component identification data, and the obtained electronic component 151 can be moved to the connection position represented by the obtained position information; the test machine 150 can also receive test control. The device 160 transmits the component identification data and position information, and can obtain the electronic component 151 based on the received component identification data, and move the obtained electronic component 151 to the connection position indicated by the received position information. However, the present invention is not limited to this.

測試機台150負責接收測試控制裝置160所傳送的連斷控制訊號,並負責所接收到的連斷控制訊號連接或分離電子元件151與放置於測試機台150之測試位置的待測電路板101。舉例來說,測試機台150可以在所接收到的連斷控制訊號表示開始連接時降下電子元件151,使得電子元件151與放置於測試位置的待測電路板101連接,或可以在所接收到的連斷控制訊號表示結束連接時升起電子元件151,使得電子元件151與放置於測試位置的待測電路板101分離而未連接。The testing machine 150 is responsible for receiving the connection control signal transmitted by the test control device 160 and is responsible for connecting or separating the electronic component 151 and the circuit board under test 101 placed at the test position of the testing machine 150 with the received connection control signal. . For example, the test machine 150 can lower the electronic component 151 when the received connection control signal indicates the start of connection, so that the electronic component 151 is connected to the circuit board under test 101 placed in the test position, or it can lower the electronic component 151 when the received connection control signal indicates the start of connection. The connection control signal indicates that the electronic component 151 is raised when the connection is completed, so that the electronic component 151 is separated from the circuit board under test 101 placed in the test position without being connected.

測試控制裝置160可以透過訊號輸出入介面(圖中未示)與電源控制器110、卡板測試裝置120、擴充測試裝置130連接,並可以透過實體連接線或有線或無線網路與測試機台150連接。The test control device 160 can be connected to the power controller 110, the card board test device 120, and the expansion test device 130 through a signal input/output interface (not shown in the figure), and can be connected to the test machine through a physical connection cable or a wired or wireless network. 150 connections.

測試控制裝置160負責決定第一順序,例如,測試控制裝置160可以執行測試腳本,藉以提供設定與待測電路板101對應的第一順序或載入預先設定的第一順序,但測試控制裝置160決定第一順序的方式並不以上述為限。The test control device 160 is responsible for determining the first order. For example, the test control device 160 can execute a test script to set the first order corresponding to the circuit board 101 under test or to load a preset first order. However, the test control device 160 The method of determining the first order is not limited to the above.

測試控制裝置160也負責依據所決定的第一順序產生對應的電源控制訊號,藉以控制電源控制器110依據所決定之第一順序依序供電給卡板測試裝置120、擴充測試裝置130、待測電路板101,進而避免卡板測試裝置120、擴充測試裝置130、及/或待測電路板101無法順利通電導致無法測試或造成卡板測試裝置120及/或擴充測試裝置130功能異常導致產生錯誤測試結果。另外,測試控制裝置160也可以依據所決定之第一順序的反向順序產生對應的電源控制訊號,藉以控制電源控制器110依據第一順序的反向順序依序停止供電給卡板測試裝置120、擴充測試裝置130、待測電路板101,進而避免卡板測試裝置120及/或擴充測試裝置130功能異常導致或干擾結果訊號而產生不正確的測試結果。The test control device 160 is also responsible for generating corresponding power control signals according to the determined first sequence, thereby controlling the power controller 110 to sequentially supply power to the card board test device 120, the expansion test device 130, and the test device according to the determined first sequence. circuit board 101, thereby preventing the card board test device 120, the expansion test device 130, and/or the circuit board under test 101 from being powered on smoothly, resulting in failure to test, or causing the card board test device 120 and/or the expansion test device 130 to function abnormally, resulting in errors. Test results. In addition, the test control device 160 can also generate a corresponding power control signal according to the determined reverse sequence of the first sequence, thereby controlling the power controller 110 to sequentially stop power supply to the card board testing device 120 according to the reverse sequence of the first sequence. , the expansion test device 130 and the circuit board to be tested 101, thereby preventing the card board test device 120 and/or the expansion test device 130 from causing abnormal functions or interfering with the result signal to produce incorrect test results.

在部分的實施例中,測試控制裝置160也可以在產生電源控制訊號並傳送給電源控制器110以控制電源控制器110依據第一順序供電給卡板測試裝置120、擴充測試裝置130、及待測電路板101時,判斷卡板測試裝置120是否傳回異常訊號;測試控制裝置160並可以在產生電源控制訊號並傳送給電源控制器110以控制電源控制器110依據第一順序供電的過程中接收到異常訊號時,依據所接收到的異常訊號產生與第一順序不同的第二順序,並依據第二順序再次產生電源控制訊號並傳送給電源控制器110以控制電源控制器110依據第二順序供電給卡板測試裝置120、擴充測試裝置130、及待測電路板101。甚至,測試控制裝置160可以在依據所產生之第二順序產生電源控制訊號並傳送給電源控制器110以控制電源控制器110依據第二順序供電的過程中再次判斷是否接收到異常訊號,若是,則測試控制裝置160可以重新決定與第一順序及第二順序都不同的第三順序,並依據第三順序控制電源控制器110供電,直到沒有收到異常訊號或沒有可以決定之排列順序為止。In some embodiments, the test control device 160 may also generate a power control signal and transmit it to the power controller 110 to control the power controller 110 to supply power to the card board test device 120, the expansion test device 130, and the waiting device according to the first sequence. When testing the circuit board 101, it is determined whether the card board testing device 120 returns an abnormal signal; the test control device 160 can generate a power control signal and transmit it to the power controller 110 to control the power supply of the power controller 110 according to the first sequence. When an abnormal signal is received, a second sequence different from the first sequence is generated according to the received abnormal signal, and the power control signal is generated again according to the second sequence and transmitted to the power controller 110 to control the power controller 110 according to the second sequence. Power is supplied to the card board test device 120, the expansion test device 130, and the circuit board under test 101 in sequence. Even, the test control device 160 can determine again whether an abnormal signal is received during the process of generating the power control signal according to the generated second sequence and transmitting it to the power controller 110 to control the power supply controller 110 according to the second sequence. If so, Then the test control device 160 can re-determine a third sequence that is different from the first sequence and the second sequence, and control the power supply controller 110 to provide power according to the third sequence until no abnormal signal is received or no sequence can be determined.

測試控制裝置160也負責產生連斷控制訊號,並負責將所產生的連斷控制訊號傳送給測試機台150以控制測試機台150連接或分離待測電路板101與一個或多個電子元件151。其中,測試控制裝置160可以在開始測試待測電路板101時產生表示開始連接的連斷控制訊號,藉以控制測試機台150連接待測電路板101與電子元件151;測試控制裝置160並可以在完成測試或中斷測試時產生表示結束連接的連斷控制訊號,藉以控制測試機台150分離待測電路板101與電子元件151。The test control device 160 is also responsible for generating connection control signals and transmitting the generated connection control signals to the test machine 150 to control the test machine 150 to connect or separate the circuit board under test 101 and one or more electronic components 151 . Among them, the test control device 160 can generate a connection control signal indicating the start of connection when starting to test the circuit board under test 101, thereby controlling the test machine 150 to connect the circuit board under test 101 and the electronic component 151; the test control device 160 can also When the test is completed or the test is interrupted, a connection control signal indicating the end of the connection is generated to control the testing machine 150 to separate the circuit board 101 under test and the electronic component 151 .

測試控制裝置160也負責產生測試訊號,在部分的實施例中,測試控制裝置還可以產生與測試訊號對應的預期訊號。測試控制裝置160並負責透過卡板測試裝置120與擴充測試裝置130傳送測試訊號至放置於測試機台150上之測試位置的待測電路板101,使所產生之測試訊號通過與電子元件151連接之待測電路板101而產生結果訊號,測試控制裝置160也負責透過卡板測試裝置120(與擴充測試裝置130)接收結果訊號。其中,測試控制裝置160所產生的測試訊號與待測電路板101對應,測試控制裝置160可以依據待測電路板101的識別資料產生對應的測試訊號。The test control device 160 is also responsible for generating test signals. In some embodiments, the test control device 160 can also generate expected signals corresponding to the test signals. The test control device 160 is also responsible for transmitting test signals to the circuit board under test 101 placed at the test position on the test machine 150 through the card board test device 120 and the expansion test device 130, so that the generated test signals are connected to the electronic components 151 The circuit board under test 101 generates a result signal, and the test control device 160 is also responsible for receiving the result signal through the card board test device 120 (and the expansion test device 130). The test signal generated by the test control device 160 corresponds to the circuit board 101 under test, and the test control device 160 can generate a corresponding test signal according to the identification data of the circuit board 101 under test.

測試控制裝置160也負責依據所接收到的結果訊號產生待測電路板之測試結果。舉例來說,測試控制裝置160可以比對結果訊號與測試訊號或比對結果訊號與預期訊號,並依據比對結果產生相對應的測試結果。The test control device 160 is also responsible for generating test results of the circuit board under test based on the received result signals. For example, the test control device 160 can compare the result signal with the test signal or the result signal with the expected signal, and generate corresponding test results based on the comparison result.

要說明的是,在「第1A圖」中,卡板測試裝置120與待測電路板101可以直接透過測試介面連接,但若卡板測試裝置120與待測電路板101無法直接透過測試介面連接,則本發明可以如「第1B圖」所示之另一種系統架構圖,在卡板測試裝置120與待測電路板101之間,透過轉接測試裝置140連接,也就是卡板測試裝置120與轉接測試裝置140連接,待測電路板101與轉接測試裝置140連接。其中,轉接測試裝置140可能不需要外部電源,例如可以是做為單純訊號轉送的轉接卡;轉接測試裝置140也可以需要外部電源才能進行訊號轉送,本發明沒有特別的限制。It should be noted that in "Figure 1A", the card board test device 120 and the circuit board under test 101 can be directly connected through the test interface, but if the card board test device 120 and the circuit board under test 101 cannot be directly connected through the test interface , then the present invention can be as shown in another system architecture diagram in "Figure 1B". The card board testing device 120 and the circuit board to be tested 101 are connected through a switching test device 140, that is, the card board testing device 120 Connected to the switching test device 140, the circuit board 101 to be tested is connected to the switching test device 140. Among them, the switching test device 140 may not require an external power supply, for example, it may be a switching card used for simple signal transmission; the switching testing device 140 may also require an external power supply for signal transmission, and the present invention has no particular limitations.

在「第1B圖」中,電源控制器110、卡板測試裝置120、擴充測試裝置130、測試機台150、測試控制裝置160大致上與上述相同,但電源控制器110可能需要額外供電給轉接測試裝置140,卡板測試裝置120需要透過轉接測試裝置140才能傳送測試訊號到待測電路板101及接收待測電路板101所產生的結果訊號,若轉接測試裝置140需要供電,則測試控制裝置160所產生的第一順序還可以包含轉接測試裝置140。In "Figure 1B", the power controller 110, the card test device 120, the expansion test device 130, the test machine 150, and the test control device 160 are substantially the same as above, but the power controller 110 may require additional power supply to the converter. Connected to the test device 140, the card board test device 120 needs to pass the switching test device 140 to transmit the test signal to the circuit board under test 101 and receive the result signal generated by the circuit board under test 101. If the switching test device 140 needs power, then The first sequence generated by the test control device 160 may also include the switching test device 140 .

接著以一個實施例來解說本發明的運作過程,並請參照「第2A圖」本發明所提之依序供電給電路板與測試裝置以測試電路板之方法流程圖。假設待測電路板101為主機板,但本發明並不以上述為限。Next, an embodiment will be used to explain the operation process of the present invention, and please refer to "Figure 2A" for the flow chart of the method of sequentially supplying power to a circuit board and a test device to test the circuit board according to the present invention. It is assumed that the circuit board 101 to be tested is a motherboard, but the present invention is not limited to the above.

若在待測電路板101的生產線上使用本發明,則在待測電路板101進入生產線上的測試區域時,生產線上的相關人員可以先連接待測電路板101與卡板測試裝置120及連接待測電路板101與擴充測試裝置130(步驟210)。在本實施例中,假設卡板測試裝置120可以與待測電路板101之控制接腳(pin)中的一部份接腳連接,且擴充測試裝置130可以與待測電路板101之控制接腳中的另一部份接腳連接。If the present invention is used on the production line of the circuit board to be tested 101, when the circuit board to be tested 101 enters the test area on the production line, relevant personnel on the production line can first connect the circuit board to be tested 101 to the card board testing device 120 and connect The circuit board to be tested 101 and the expanded test device 130 (step 210). In this embodiment, it is assumed that the card board test device 120 can be connected to some of the control pins of the circuit board 101 under test, and the expansion test device 130 can be connected to the control pins of the circuit board 101 under test. The other part of the foot is connected to the pins.

在待測電路板101與卡板測試裝置120及擴充測試裝置130連接後,測試控制裝置160可以控制測試機台150連接待測電路板101與電子元件151(步驟230)。在本實施例中,假設電子元件151包含中央處理器與記憶體模組,測試控制裝置160可以在判斷可以開始測試時,產生表示開始測試的連斷控制訊號並傳送給測試機台150,測試機台150可以判斷所接收到的連斷控制訊號表示開始測試而下壓中央處理器與記憶體模組等電子元件151,使得中央處理器插入待測電路板101的處理器連接器且記憶體模組插入待測電路板101的記憶體連接槽。After the circuit board under test 101 is connected to the card board test device 120 and the expansion test device 130, the test control device 160 can control the test machine 150 to connect the circuit board under test 101 to the electronic component 151 (step 230). In this embodiment, assuming that the electronic component 151 includes a central processing unit and a memory module, the test control device 160 can generate a continuity control signal indicating the start of the test and send it to the test machine 150 when it determines that the test can be started. The machine 150 can determine that the received disconnection control signal indicates the start of testing and press down the electronic components 151 such as the central processing unit and the memory module, so that the central processing unit is inserted into the processor connector of the circuit board 101 under test and the memory is The module is inserted into the memory connection slot of the circuit board 101 under test.

在測試機台150連接待測電路板101與電子元件151後,測試控制裝置160可以控制電源控制器110依據第一順序供電給卡板測試裝置120、擴充測試裝置130、及待測電路板101(步驟250)。在本實施例中,假設電源控制器110為可程式邏輯控制器,電源控制訊號為PLC控制指令,且測試控制裝置160可以取得待測電路板101的卡板識別資料(如型號),並執行與待測電路板101之卡板識別資料對應的測試腳本以決定第一順序,例如,卡板測試裝置120、擴充測試裝置130、待測電路板101。若測試腳本中所記載之PLC控制指令如「第4圖」之控制指令表400所示,則測試控制裝置160可以依據第一順序先產生與卡板測試裝置120對應的電源控制訊號「01 03 02 04 05 0A 0A」並傳送給電源控制器110,使得電源控制器110在接收到上述的電源控制訊號後依據所接收到的電源控制訊號判斷供電給卡板測試裝置120,進而讓卡板測試裝置120通電並啟動;在電源控制器110供電給卡板測試裝置120後可以傳回供電回報訊息給測試控制裝置160,之後,測試控制裝置160可以依據第一順序再次產生與擴充測試裝置130對應的電源控制訊號「01 03 02 04 05 0B 0A」並傳送給電源控制器110,使得電源控制器110在接收到電源控制訊號「01 03 02 04 05 0B 0A」後供電給擴充測試裝置130,進而讓擴充測試裝置130通電並啟動,接著,測試控制裝置160可以在接收到電源控制器110所傳回的供電回報訊息後,再次依據第一順序產生與待測電路板101對應的電源控制訊號「01 03 02 04 05 0C 0A」並傳送給電源控制器110,使得電源控制器110供電給待測電路板101,進而讓待測電路板101通電並啟動,如此,卡板測試裝置120、擴充測試裝置130、及待測電路板101將依序啟動,而非如習知的同時啟動。After the test machine 150 connects the circuit board 101 under test and the electronic component 151, the test control device 160 can control the power controller 110 to supply power to the card board test device 120, the expansion test device 130, and the circuit board under test 101 according to the first sequence. (Step 250). In this embodiment, it is assumed that the power controller 110 is a programmable logic controller, the power control signal is a PLC control command, and the test control device 160 can obtain the card identification data (such as model number) of the circuit board under test 101 and execute The test script corresponding to the card board identification data of the circuit board under test 101 determines the first order, for example, the card board test device 120, the expansion test device 130, and the circuit board under test 101. If the PLC control instructions recorded in the test script are as shown in the control instruction table 400 in "Figure 4", then the test control device 160 can first generate the power control signal "01 03" corresponding to the card board test device 120 according to the first sequence. 02 04 05 0A 0A" and sent to the power controller 110, so that the power controller 110, after receiving the above-mentioned power control signal, determines to supply power to the card board testing device 120 according to the received power control signal, thereby allowing the card board to be tested. The device 120 is powered on and started; after the power controller 110 supplies power to the card board test device 120, it can send back a power supply report message to the test control device 160. After that, the test control device 160 can generate the corresponding expansion test device 130 again according to the first sequence. The power control signal "01 03 02 04 05 0B 0A" is sent to the power controller 110, so that the power controller 110 supplies power to the expansion test device 130 after receiving the power control signal "01 03 02 04 05 0B 0A", and then Let the extended test device 130 be powered on and started. Then, after receiving the power supply report message returned by the power controller 110, the test control device 160 can generate the power control signal corresponding to the circuit board under test 101 according to the first sequence again. 01 03 02 04 05 0C 0A" and sent to the power controller 110, so that the power controller 110 supplies power to the circuit board under test 101, and then energizes and starts the circuit board under test 101. In this way, the card board test device 120, expanded test The device 130 and the circuit board under test 101 will be started sequentially instead of simultaneously as conventionally.

在電源控制器110依據測試控制裝置160所決定的第一順序供電給卡板測試裝置120、擴充測試裝置130、及待測電路板101後,測試控制裝置160可以透過卡板測試裝置120與擴充測試裝置130傳送測試訊號到待測電路板101,使得測試訊號通過與電子元件151連接之待測電路板101而產生結果訊號(步驟260)。在本實施例中,假設測試控制裝置160所執行之與待測電路板101卡板識別資料對應的測試腳本可以產生一個或多個測試訊號,並傳送給相連接的卡板測試裝置120與擴充測試裝置130,使得測試訊號通過卡板測試裝置120與擴充測試裝置130而抵達待測電路板101,並經過與待測電路板101連接之電子元件151對各個測試訊號進行運算或判斷等處理後產生相對應的一個或多個結果訊號。After the power controller 110 supplies power to the card board test device 120, the expansion test device 130, and the circuit board under test 101 according to the first sequence determined by the test control device 160, the test control device 160 can communicate with the expansion board through the card board test device 120. The test device 130 transmits the test signal to the circuit board under test 101, so that the test signal passes through the circuit board under test 101 connected to the electronic component 151 to generate a result signal (step 260). In this embodiment, it is assumed that the test script executed by the test control device 160 corresponding to the card identification data of the circuit board under test 101 can generate one or more test signals and send them to the connected card test device 120 and the expansion The test device 130 allows the test signals to pass through the card board test device 120 and the expansion test device 130 to reach the circuit board under test 101, and perform calculations or judgments on each test signal through the electronic components 151 connected to the circuit board under test 101. Generate one or more corresponding result signals.

在待測電路板101產生結果訊號後,測試控制裝置160可以透過卡板測試裝置120接收待測電路板101所產生的結果訊號,並可以依據所接收到的結果訊號產生待測電路板101的測試結果(步驟270)。After the circuit board under test 101 generates the result signal, the test control device 160 can receive the result signal generated by the circuit board under test 101 through the card board testing device 120, and can generate a signal of the circuit board under test 101 based on the received result signal. Test results (step 270).

如此,透過本發明,可以透過測試控制裝置160控制電源控制器110以一定順序供電給待測電路板101與測試待測電路板101的卡板測試裝置120與擴充測試裝置130,避免因為同時供電給待測電路板101、卡板測試裝置120與擴充測試裝置130而造成待測電路板101、卡板測試裝置120與擴充測試裝置130無法通電或啟動異常等狀況。In this way, through the present invention, the power controller 110 can be controlled by the test control device 160 to supply power to the circuit board under test 101 and the card board test device 120 and the expansion test device 130 for testing the circuit board under test 101 in a certain sequence, to avoid simultaneous power supply. The circuit board under test 101 , the card board test device 120 and the expansion test device 130 are caused to fail to power on or start abnormally, etc.

上述實施例中,在測試控制裝置160透過卡板測試裝置120接收待測電路板101所產生的結果訊號(步驟270)後,還可以如「第2B圖」所示之流程,測試控制裝置160可以控制電源控制器110依據所決定之第一順序的反向順序依序停止供電給待測電路板101、擴充測試裝置130、及卡板測試裝置120(步驟280)。例如,測試控制裝置160可以依據待測電路板101、擴充測試裝置130、及卡板測試裝置120的順序,依序產生「01 03 02 04 05 0C 0B」、「01 03 02 04 05 0B 0B」、「01 03 02 04 05 0A 0B」等電源控制訊號,並傳送給電源控制器110,使得電源控制器110依據所接收到的電源控制訊號由先至後停止供電給待測電路板101、擴充測試裝置130、及卡板測試裝置120。In the above embodiment, after the test control device 160 receives the result signal generated by the circuit board 101 under test through the card board test device 120 (step 270), the test control device 160 may also perform the process shown in "Figure 2B". The power controller 110 can be controlled to sequentially stop power supply to the circuit board under test 101, the expansion test device 130, and the card board test device 120 according to the reverse order of the determined first order (step 280). For example, the test control device 160 can sequentially generate "01 03 02 04 05 0C 0B" and "01 03 02 04 05 0B 0B" according to the order of the circuit board under test 101, the expansion test device 130, and the card board test device 120. , "01 03 02 04 05 0A 0B" and other power control signals, and are sent to the power controller 110, so that the power controller 110 stops supplying power to the circuit board under test 101 from first to last according to the received power control signal. Test device 130, and card board test device 120.

之後,測試控制裝置160可以控制測試機台150分離相連接之待測電路板101與電子元件151(步驟290)。例如,測試控制裝置160可以產生表示結束測試的連斷控制指令並將所產生的連斷控制指令傳送給測試機台150,使得測試機台在判斷所接收到的連斷控制指令表示結束測試後,升起中央處理器與記憶體模組等電子元件151,進而分離待測電路板101與電子元件151,藉以準備測試下一個電路板。Afterwards, the test control device 160 can control the test machine 150 to separate the connected circuit board 101 and the electronic component 151 (step 290). For example, the test control device 160 can generate a connection control command indicating the end of the test and transmit the generated connection control command to the test machine 150, so that the test machine determines that the received connection control command indicates the end of the test. , raise the electronic components 151 such as the central processing unit and the memory module, and then separate the circuit board to be tested 101 and the electronic components 151 to prepare for testing the next circuit board.

另外,上述實施例中,若卡板測試裝置120與待測電路板101無法直接連接,則如「第3圖」之流程所示,在生產線的人員可以連接卡板測試裝置120與擴充測試裝置130、連接卡板測試裝置120與轉接測試裝置140、並連接轉接測試裝置140與待測電路板101,並將直接或間接連接轉接測試裝置140、卡板測試裝置、擴充測試裝置130的待測電路板101放置於測試機台150上(步驟310)。In addition, in the above embodiment, if the card board test device 120 and the circuit board to be tested 101 cannot be directly connected, as shown in the process of "Figure 3", the personnel on the production line can connect the card board test device 120 and the expansion test device. 130. Connect the card board test device 120 and the transfer test device 140, and connect the transfer test device 140 and the circuit board under test 101, and directly or indirectly connect the transfer test device 140, the card board test device, and the expansion test device 130 The circuit board 101 under test is placed on the testing machine 150 (step 310).

而後,測試控制裝置160可以控制測試機台150連接電子元件151與待測電路板101(步驟330),並可以控制電源控制器110依據所決定的第一順序依序供電給卡板測試裝置120、擴充測試裝置130、轉接測試裝置140、及待測電路板101(步驟350)。若第一順序為卡板測試裝置120、擴充測試裝置130、轉接測試裝置140、待測電路板101,則測試控制裝置160可以依序產生「01 03 02 04 05 0A 0A」、「01 03 02 04 05 0B 0A」、「01 03 02 04 05 0C 0A」、「01 03 02 04 05 0D 0A」等電源控制訊號並傳送給電源控制器110,使得電源控制器110在接收到電源控制訊號後供電給卡板測試裝置120、擴充測試裝置130、轉接測試裝置140、及待測電路板101。Then, the test control device 160 can control the test machine 150 to connect the electronic component 151 and the circuit board under test 101 (step 330), and can control the power controller 110 to sequentially supply power to the card board test device 120 according to the determined first order. , the expansion test device 130, the switching test device 140, and the circuit board under test 101 (step 350). If the first sequence is the card board test device 120, the expansion test device 130, the switching test device 140, and the circuit board under test 101, then the test control device 160 can generate "01 03 02 04 05 0A 0A" and "01 03" in sequence. 02 04 05 0B 0A", "01 03 02 04 05 0C 0A", "01 03 02 04 05 0D 0A" and other power control signals are sent to the power controller 110, so that after receiving the power control signal, the power controller 110 Power is supplied to the card board test device 120, the expansion test device 130, the switching test device 140, and the circuit board to be tested 101.

接著,測試控制裝置160可以透過卡板測試裝置120、擴充測試裝置130、與轉接測試裝置140將所產生的測試訊號傳送到待測電路板101,使得測試訊號通過待測電路板101而產生結果訊號(步驟360),測試控制裝置160也可以透過轉接測試裝置140與卡板測試裝置120接收待測電路板101所產生的結果訊號,並依據所接收到的結果訊號產生待測電路板的測試結果(步驟370)。也就是說,測試控制裝置160可以將測試訊號輸出到相連接的卡板測試裝置120與擴充測試裝置130,使得測試訊號先通過卡板測試裝置120與擴充測試裝置130再通過轉接測試裝置140而抵達待測電路板101,進而讓與待測電路板101連接的電子元件151對抵達待測電路板101的測試訊號進行處理而產生對應的結果訊號並可以讓結果訊號通過待測電路板101與轉接測試裝置140而抵達卡板測試裝置120並由卡板測試裝置120傳回測試控制裝置160。Then, the test control device 160 can transmit the generated test signal to the circuit board under test 101 through the card board test device 120, the expansion test device 130, and the switching test device 140, so that the test signal is generated through the circuit board under test 101 Result signal (step 360). The test control device 160 can also receive the result signal generated by the circuit board under test 101 through the switching test device 140 and the card board test device 120, and generate the circuit board under test based on the received result signal. test results (step 370). That is to say, the test control device 160 can output the test signal to the connected card board test device 120 and the expansion test device 130 , so that the test signal first passes through the card board test device 120 and the expansion test device 130 and then passes through the switching test device 140 After arriving at the circuit board under test 101, the electronic component 151 connected to the circuit board under test 101 processes the test signal arriving at the circuit board under test 101 to generate a corresponding result signal and allows the result signal to pass through the circuit board under test 101. The signal is transferred to the test device 140 and then reaches the card test device 120 and is transmitted back to the test control device 160 from the card test device 120 .

之後,測試控制裝置160可以控制電源控制器110依據第一順序的反向順序停止供電給卡板測試裝置120、擴充測試裝置130、轉接測試裝置140、及待測電路板101(步驟380),並可以在電源控制器110停止供電給卡板測試裝置120、擴充測試裝置130、轉接測試裝置140、及待測電路板101後,控制測試機台150分離待測電路板101與電子元件151(步驟390)。其中,由於第一順序為卡板測試裝置120、擴充測試裝置130、轉接測試裝置140、及待測電路板101,因此,測試控制裝置160可以依據待測電路板101、轉接測試裝置140、擴充測試裝置130、卡板測試裝置120的順序產生表示斷電的電源控制訊號並將所產生的電源控制訊號傳送給電源控制器110,使得電源控制器110依據所接收到的電源控制訊號依序停止供電給待測電路板101、轉接測試裝置140、擴充測試裝置130、與卡板測試裝置120。After that, the test control device 160 can control the power controller 110 to stop supplying power to the card board test device 120, the expansion test device 130, the transfer test device 140, and the circuit board under test 101 according to the reverse order of the first order (step 380) , and can control the test machine 150 to separate the circuit board 101 under test and the electronic component after the power controller 110 stops supplying power to the card board test device 120, the expansion test device 130, the transfer test device 140, and the circuit board under test 101. 151 (step 390). Among them, since the first order is the card board test device 120, the expansion test device 130, the transfer test device 140, and the circuit board to be tested 101, therefore, the test control device 160 can be based on the circuit board to be tested 101, the transfer test device 140 The expansion test device 130 and the card board test device 120 sequentially generate a power control signal indicating a power outage and transmit the generated power control signal to the power controller 110, so that the power controller 110 operates according to the received power control signal. The power supply is sequentially stopped to the circuit board under test 101, the switching test device 140, the expansion test device 130, and the card board test device 120.

此外,本發明還可以如「第2C圖」之流程所示,在測試控制裝置160控制電源控制器110依據第一順序供電給卡板測試裝置120、擴充測試裝置130、待測電路板101(與轉接測試裝置140)(步驟250、350)後,測試控制裝置160可以判斷是否接收到卡板測試裝置120所傳回的異常訊號(步驟253),若否,表示卡板測試裝置120、擴充測試裝置130、待測電路板101(與轉接測試裝置140)都順利通電並正常啟動,若是,表示卡板測試裝置120、擴充測試裝置130、待測電路板101(與轉接測試裝置140)中至少其中一個無法順利通電或正常啟動,測試控制裝置160可以產生與第一順序不同的第二順序(步驟255),例如,產生擴充測試裝置130、卡板測試裝置120、待測電路板101(、轉接測試裝置140)的第二順序,並可以依據所產生的第二順序控制電源控制器110依序供電給擴充測試裝置130、卡板測試裝置120、待測電路板101(、轉接測試裝置140)(步驟257),也就是依序產生供電給擴充測試裝置130、卡板測試裝置120、待測電路板101(與轉接測試裝置140)的電源控制訊號並傳送給電源控制器110,使電源控制器110在接收到電源控制訊號後供電給對應的擴充測試裝置130、卡板測試裝置120、待測電路板101(或轉接測試裝置140)。In addition, the present invention can also control the power controller 110 in the test control device 160 to supply power to the card board test device 120, the expansion test device 130, and the circuit board under test 101 according to the first sequence as shown in the process of "Figure 2C" ( After switching to the test device 140) (steps 250 and 350), the test control device 160 can determine whether the abnormal signal returned by the card test device 120 is received (step 253). If not, it indicates that the card test device 120, The expanded test device 130, the circuit board under test 101 (and the switching test device 140) are all powered on smoothly and started normally. If so, it means that the card board testing device 120, the expanded testing device 130, the circuit board under test 101 (and the switching test device) 140) cannot be powered on or started normally, the test control device 160 can generate a second sequence (step 255) that is different from the first sequence, for example, generate the expanded test device 130, the card board test device 120, the circuit under test The second sequence of the board 101 (, switching test device 140), and can control the power controller 110 to sequentially supply power to the expansion test device 130, the card board test device 120, and the circuit board to be tested 101 ( , transfer test device 140) (step 257), that is, the power control signals for the expansion test device 130, the card board test device 120, the circuit board under test 101 (and the transfer test device 140) are sequentially generated and transmitted to The power controller 110 enables the power controller 110 to supply power to the corresponding expansion test device 130, the card board test device 120, and the circuit board to be tested 101 (or the switching test device 140) after receiving the power control signal.

綜上所述,可知本發明與先前技術之間的差異在於具有測試控制裝置控制電源控制器依據順序供電給待測電路板、卡板測試裝置、及擴充測試裝置,並透過卡板測試裝置與擴充測試裝置傳送測試訊號至待測電路板,使測試訊號通過連接電子元件之待測電路板而產生結果訊號,及透過卡板測試裝置接收結果訊號以產生待測電路板之測試結果之技術手段,藉由此一技術手段可以來解決先前技術所存在同時供電給電路板與其測試裝置可能導致無法產生正確測試結果的問題,進而達成提高直通率及增加測試效率的技術功效。In summary, it can be seen that the difference between the present invention and the prior art is that it has a test control device to control the power controller to supply power to the circuit board to be tested, the card board test device, and the expansion test device in sequence, and through the card board test device and The expanded test device transmits test signals to the circuit board under test, allows the test signal to pass through the circuit board under test connected to the electronic components to generate a result signal, and receives the result signal through the card board test device to generate the test result of the circuit board under test. , this technical means can be used to solve the problem in the previous technology that supplying power to the circuit board and its test device at the same time may lead to the inability to produce correct test results, thereby achieving the technical effects of improving the through rate and increasing the test efficiency.

再者,本發明之依序供電給電路板與測試裝置以測試電路板之方法,可實現於硬體、韌體、軟體或硬體、韌體與軟體之組合中,亦可在電腦系統中以集中方式實現或以不同元件散佈於若干互連之電腦系統的分散方式實現。Furthermore, the method of sequentially supplying power to the circuit board and the test device to test the circuit board of the present invention can be implemented in hardware, firmware, software or a combination of hardware, firmware and software, or in a computer system. It can be implemented in a centralized manner or in a decentralized manner with different components spread across several interconnected computer systems.

雖然本發明所揭露之實施方式如上,惟所述之內容並非用以直接限定本發明之專利保護範圍。任何本發明所屬技術領域中具有通常知識者,在不脫離本發明所揭露之精神和範圍的前提下,對本發明之實施的形式上及細節上作些許之更動潤飾,均屬於本發明之專利保護範圍。本發明之專利保護範圍,仍須以所附之申請專利範圍所界定者為準。Although the embodiments of the present invention are disclosed above, the content described is not intended to directly limit the scope of patent protection of the present invention. Anyone with ordinary knowledge in the technical field to which the present invention belongs can make slight modifications and modifications to the form and details of the implementation of the present invention without departing from the spirit and scope disclosed by the present invention, which shall fall under the patent protection of the present invention. Scope. The scope of patent protection for this invention must still be defined by the scope of the attached patent application.

101:待測電路板 110:電源控制器 120:卡板測試裝置 130:擴充測試裝置 140:轉接測試裝置 150:測試機台 151:電子元件 160:測試控制裝置 400:控制指令表 步驟210:連接待測電路板與卡板測試裝置、擴充測試裝置,並將待測電路板放置於測試機台上 步驟230:測試控制裝置控制測試機台連接待測電路板與電子元件 步驟250:測試控制裝置控制電源控制器依第一順序供電給待測電路板、卡板測試裝置、及擴充測試裝置 步驟253:測試控制裝置判斷是否接收到卡板測試裝置傳回之異常訊號 步驟255:測試控制裝置依據異常訊號產生不同之第二順序 步驟257:測試控制裝置控制電源控制器依第二順序供電給待測電路板、卡板測試裝置、及擴充測試裝置 步驟260:測試控制裝置透過卡板測試裝置與擴充測試裝置傳送控制訊號至待測電路板,使控制訊號通過連接電子元件之待測電路板而產生結果訊號 步驟270:測試控制裝置透過卡板測試裝置接收結果訊號,並依據結果訊號產生待測電路板之測試結果 步驟280:測試控制裝置控制電源控制器依據第一順序之反向順序停止供電給待測電路板、卡板測試裝置、及擴充測試裝置 步驟290:測試控制裝置控制測試機台分離待測電路板與電子元件 步驟310:連接待測電路板與轉接測試裝置、卡板測試裝置、擴充測試裝置,並將待測電路板放置於測試機台上 步驟330:測試控制裝置控制測試機台連接待測電路板與電子元件 步驟350:測試控制裝置控制電源控制器依第一順序供電給轉接測試裝置、待測電路板、卡板測試裝置、及擴充測試裝置 步驟360:測試控制裝置透過轉接測試裝置、卡板測試裝置與擴充測試裝置傳控制訊號至待測電路板,使控制訊號通過連接電子元件之待測電路板而產生結果訊號 步驟370:測試控制裝置透過轉接測試裝置與卡板測試裝置接收結果訊號,並依據結果訊號產生待測電路板之測試結果 步驟380:測試控制裝置控制電源控制器依據第一順序之反向順序停止供電給轉接測試裝置、待測電路板、卡板測試裝置、及擴充測試裝置 步驟390:測試控制裝置控制測試機台分離待測電路板與電子元件 101: Circuit board to be tested 110:Power controller 120:Card board test device 130:Expanded test device 140: Transfer test device 150:Testing machine 151:Electronic components 160: Test control device 400: Control command list Step 210: Connect the circuit board to be tested and the card board test device, expand the test device, and place the circuit board to be tested on the test machine Step 230: The test control device controls the test machine to connect the circuit board to be tested and the electronic component Step 250: The test control device controls the power controller to supply power to the circuit board under test, the card board test device, and the expansion test device in the first sequence. Step 253: The test control device determines whether it has received the abnormal signal returned by the card board testing device. Step 255: The test control device generates a different second sequence according to the abnormal signal Step 257: The test control device controls the power controller to supply power to the circuit board under test, the card board test device, and the expansion test device in the second sequence. Step 260: The test control device transmits the control signal to the circuit board under test through the card board test device and the expansion test device, so that the control signal passes through the circuit board under test connected to the electronic component to generate a result signal. Step 270: The test control device receives the result signal through the card board testing device, and generates the test result of the circuit board under test based on the result signal. Step 280: The test control device controls the power controller to stop supplying power to the circuit board under test, the card board test device, and the expansion test device according to the reverse sequence of the first sequence. Step 290: The test control device controls the test machine to separate the circuit board to be tested and the electronic components Step 310: Connect the circuit board to be tested to the switching test device, card board test device, and expansion test device, and place the circuit board to be tested on the test machine Step 330: The test control device controls the test machine to connect the circuit board to be tested and the electronic component Step 350: The test control device controls the power controller to supply power to the transfer test device, the circuit board to be tested, the card board test device, and the expansion test device in the first order. Step 360: The test control device transmits the control signal to the circuit board under test through the switching test device, the card board test device and the expansion test device, so that the control signal passes through the circuit board under test connected to the electronic component to generate a result signal. Step 370: The test control device receives the result signal through the switching test device and the card board test device, and generates the test result of the circuit board under test based on the result signal. Step 380: The test control device controls the power controller to stop supplying power to the transfer test device, the circuit board under test, the card board test device, and the expansion test device according to the reverse sequence of the first sequence. Step 390: The test control device controls the test machine to separate the circuit board to be tested and the electronic components

第1A圖為本發明所提之依序供電給電路板與測試裝置以測試電路板之系統架構圖。 第1B圖為本發明所提之另一種依序供電給電路板與測試裝置以測試電路板之系統架構圖。 第2A圖為本發明所提之依序供電給電路板與測試裝置以測試電路板之方法流程圖。 第2B圖為本發明所提之依序供電給電路板與測試裝置以測試電路板之附加方法流程圖。 第2C圖為本發明所提之產生供電之第二順序之方法流程圖。 第3圖為本發明所提之另一種依序供電給電路板與測試裝置以測試電路板之方法流程圖。 第4圖為本發明實施例所提之控制指令之示意表。 Figure 1A is a system architecture diagram for sequentially supplying power to a circuit board and a test device to test the circuit board according to the present invention. Figure 1B is another system architecture diagram for sequentially supplying power to a circuit board and a test device to test the circuit board according to the present invention. Figure 2A is a flow chart of the method of sequentially supplying power to a circuit board and a test device to test the circuit board according to the present invention. Figure 2B is a flow chart of an additional method of sequentially supplying power to a circuit board and a test device to test the circuit board according to the present invention. Figure 2C is a flow chart of the second sequence of generating power according to the present invention. Figure 3 is a flow chart of another method of sequentially supplying power to a circuit board and a test device to test the circuit board according to the present invention. Figure 4 is a schematic diagram of control instructions according to the embodiment of the present invention.

步驟210:連接待測電路板與卡板測試裝置、擴充測試裝置,並將待測電路板放置於測試機台上 Step 210: Connect the circuit board to be tested and the card board test device, expand the test device, and place the circuit board to be tested on the test machine

步驟230:測試控制裝置控制測試機台連接待測電路板與電子元件 Step 230: The test control device controls the test machine to connect the circuit board to be tested and the electronic component

步驟250:測試控制裝置控制電源控制器依第一順序供電給待測電路板、卡板測試裝置、及擴充測試裝置 Step 250: The test control device controls the power controller to supply power to the circuit board under test, the card board test device, and the expansion test device in the first sequence.

步驟260:測試控制裝置透過卡板測試裝置與擴充測試裝置傳送控制訊號至待測電路板,使控制訊號通過連接電子元件之待測電路板而產生結果訊號 Step 260: The test control device transmits the control signal to the circuit board under test through the card board test device and the expansion test device, so that the control signal passes through the circuit board under test connected to the electronic component to generate a result signal.

步驟270:測試控制裝置透過卡板測試裝置接收結果訊號,並依據結果訊號產生待測電路板之測試結果 Step 270: The test control device receives the result signal through the card board testing device, and generates the test result of the circuit board under test based on the result signal.

Claims (10)

一種依序供電給電路板與測試裝置以測試電路板之方法,該方法至少包含下列步驟:連接一待測電路板與一卡板測試裝置、該待測電路板與一擴充測試裝置,並放置該待測電路板於一測試機台上;一測試控制裝置控制該測試機台連接該待測電路板與至少一電子元件;該測試控制裝置控制一電源控制器依一第一順序供電給該待測電路板、該卡板測試裝置、及該擴充測試裝置;該測試控制裝置透過該卡板測試裝置與該擴充測試裝置傳送一測試訊號至該待測電路板,使該測試訊號通過連接該至少一電子元件之該待測電路板而產生一結果訊號,並透過該卡板測試裝置接收該結果訊號;及該測試控制裝置依據該結果訊號產生該待測電路板之測試結果。 A method for sequentially supplying power to a circuit board and a test device to test the circuit board. The method at least includes the following steps: connecting a circuit board to be tested and a card board test device, the circuit board to be tested and an expansion test device, and placing The circuit board under test is on a test machine; a test control device controls the test machine to connect the circuit board under test and at least one electronic component; the test control device controls a power controller to supply power to the circuit board in a first sequence The circuit board under test, the card board test device, and the expansion test device; the test control device sends a test signal to the circuit board under test through the card board test device and the expansion test device, so that the test signal passes through the connection to the circuit board under test. The circuit board under test of at least one electronic component generates a result signal, and receives the result signal through the card board testing device; and the test control device generates a test result of the circuit board under test based on the result signal. 如請求項1所述之依序供電給電路板與測試裝置以測試電路板之方法,其中連接該待測電路板與該卡板測試裝置、該待測電路板與該擴充測試裝置之步驟更包含連接該待測電路板與一轉接測試裝置及連接該轉接測試裝置及該卡板測試裝置之步驟,該測試控制裝置控制該電源控制器依該第一順序供電給該待測電路板、該卡板測試裝置、該擴充測試裝置之步驟更包含該測試控制裝置控制該電源控制器依該第一順序供電給該待測電路板、該卡板測試裝置、該擴充測試裝置、及該轉接測試裝置之步驟,該測試控制裝置透過該卡板測試裝置與該擴充測試裝置傳送該測試訊號至該待測電路板之步驟更包含該測試控制裝置透過該卡板測試裝置、該擴充測試裝置、及該轉接測試裝置傳送該 測試訊號至該待測電路板之步驟,該測試控制裝置透過該卡板測試裝置接收該結果訊號之步驟更包含該測試控制裝置透過該卡板測試裝置及該轉接測試裝置接收該結果訊號之步驟。 The method of sequentially supplying power to a circuit board and a test device to test the circuit board as described in claim 1, wherein the steps of connecting the circuit board under test and the card board test device, the circuit board under test and the expansion test device are more It includes the steps of connecting the circuit board to be tested and a switching test device and connecting the switching test device and the card board testing device. The test control device controls the power controller to supply power to the circuit board under test according to the first sequence. The steps of the card board test device and the expanded test device further include the test control device controlling the power controller to supply power to the circuit board to be tested, the card board test device, the expanded test device, and the first sequence The step of switching the test device, the step of the test control device transmitting the test signal to the circuit board under test through the card board test device and the expansion test device further includes the test control device through the card board test device, the expansion test device device, and the switching test device transmits the The step of sending the test signal to the circuit board under test, and the step of the test control device receiving the result signal through the card board test device further includes the step of the test control device receiving the result signal through the card board test device and the switching test device. steps. 如請求項1所述之依序供電給電路板與測試裝置以測試電路板之方法,其中該方法於該測試控制裝置控制該電源控制器依該第一順序供電之步驟前,更包含該測試控制裝置設定與該待測電路板對應之該第一順序之步驟。 The method of sequentially supplying power to a circuit board and a test device to test the circuit board as described in claim 1, wherein the method further includes the test before the test control device controls the power supply controller in the first sequence. The control device sets the steps of the first sequence corresponding to the circuit board under test. 如請求項1所述之依序供電給電路板與測試裝置以測試電路板之方法,其中該方法於該測試控制裝置透過該卡板測試裝置接收該結果訊號之步驟後,更包含該測試控制裝置控制該電源控制器依據該第一順序之反向順序停止供電給該待測電路板、該卡板測試裝置、及該擴充測試裝置,及控制該測試機台分離該待測電路板與該至少一電子元件之步驟。 The method of sequentially supplying power to a circuit board and a test device to test the circuit board as described in claim 1, wherein the method further includes the test control after the test control device receives the result signal through the card board test device. The device controls the power controller to stop power supply to the circuit board under test, the card board test device, and the expansion test device according to the reverse sequence of the first sequence, and controls the test machine to separate the circuit board under test from the circuit board under test. The steps of at least one electronic component. 如請求項1所述之依序供電給電路板與測試裝置以測試電路板之方法,其中該方法於該測試控制裝置控制該電源控制器依該第一順序供電給該待測電路板、該卡板測試裝置、及該擴充測試裝置之步驟後,更包含該測試控制裝置判斷該卡板測試裝置是否傳回一異常訊號,並於接收到該異常訊號時,依據該異常訊號產生不同之一第二順序,並控制該電源控制器以該第二順序供電給該待測電路板、該卡板測試裝置、及該擴充測試裝置之步驟。 The method of sequentially supplying power to a circuit board and a test device to test the circuit board as described in claim 1, wherein the method controls the power controller in the test control device to supply power to the circuit board under test, the circuit board under test, and the circuit board under test in the first sequence. After the steps of the card board test device and the expansion test device, the test control device further includes the test control device to determine whether the card board test device returns an abnormal signal, and when receiving the abnormal signal, generates one of the different signals based on the abnormal signal. In the second sequence, the power controller is controlled to supply power to the circuit board to be tested, the card board testing device, and the expanded testing device in the second sequence. 一種依序供電給電路板與測試裝置以測試電路板之系統,該系統至少包含:一測試機台,提供放置一待測電路板;一電源控制器;一卡板測試裝置,與該待測電路板連接; 一擴充測試裝置,與該待測電路板連接;及一測試控制裝置,與該卡板測試裝置與該擴充測試裝置連接,用以控制該電源控制器依一第一順序供電給該待測電路板、該卡板測試裝置、及該擴充測試裝置,並控制該測試機台連接該待測電路板與至少一電子元件,及用以透過該卡板測試裝置與該擴充測試裝置傳送一測試訊號至該待測電路板,使該測試訊號通過連接該至少一電子元件之該待測電路板而產生一結果訊號,並透過該卡板測試裝置接收該結果訊號,及依據該結果訊號產生該待測電路板之測試結果。 A system for sequentially supplying power to a circuit board and a testing device to test the circuit board. The system at least includes: a testing machine for placing a circuit board to be tested; a power controller; and a card board testing device and the circuit board to be tested. circuit board connections; An expansion test device is connected to the circuit board under test; and a test control device is connected to the card board test device and the expansion test device to control the power controller to supply power to the circuit under test in a first sequence. board, the card board test device, and the expansion test device, and control the test machine to connect the circuit board under test and at least one electronic component, and transmit a test signal through the card board test device and the expansion test device to the circuit board under test, causing the test signal to pass through the circuit board under test connected to the at least one electronic component to generate a result signal, receiving the result signal through the card board testing device, and generating the result signal based on the result signal Test results of the circuit board. 如請求項6所述之依序供電給電路板與測試裝置以測試電路板之系統,其中該系統更包含一轉接測試裝置,用以連接該待測電路板及該卡板測試裝置,該測試控制裝置更用以控制該電源控制器依該第一順序供電給該待測電路板、該卡板測試裝置、該擴充測試裝置、及該轉接測試裝置,及透過該卡板測試裝置、該擴充測試裝置、及該轉接測試裝置傳送該測試訊號至該待測電路板,並透過該卡板測試裝置及該轉接測試裝置接收該結果訊號之步驟。 As claimed in claim 6, the system for sequentially supplying power to a circuit board and a test device to test the circuit board, wherein the system further includes a switching test device for connecting the circuit board to be tested and the card board test device, the The test control device is further used to control the power controller to supply power to the circuit board to be tested, the card board test device, the expansion test device, and the transfer test device in the first sequence, and through the card board test device, The expansion test device and the transfer test device transmit the test signal to the circuit board under test, and receive the result signal through the card board test device and the transfer test device. 如請求項6所述之依序供電給電路板與測試裝置以測試電路板之系統,其中該測試控制裝置更用以設定與該待測電路板對應之該第一順序之步驟。 As claimed in claim 6, the system for sequentially supplying power to a circuit board and a test device to test the circuit board, wherein the test control device is further used to set the first sequence of steps corresponding to the circuit board under test. 如請求項6所述之依序供電給電路板與測試裝置以測試電路板之系統,其中該測試控制裝置更用以控制該電源控制器依據該第一順序之反向順序停止供電給該待測電路板、該卡板測試裝置、及該擴充測試裝置,並用以控制該測試機台分離該待測電路板與該至少一電子元件。 The system for sequentially supplying power to a circuit board and a test device to test the circuit board as described in claim 6, wherein the test control device is further used to control the power controller to stop supplying power to the waiting device according to the reverse sequence of the first sequence. Test the circuit board, the card board testing device, and the expanded testing device, and control the testing machine to separate the circuit board to be tested and the at least one electronic component. 如請求項6所述之依序供電給電路板與測試裝置以測試電路板之系統,其中該測試控制裝置更用以於控制該電源控制器依該第一順序供電給該待測電路板、該卡板測試裝置、及該擴充測試裝置時,判斷該卡板測試裝置是否傳回一異常訊號,並於接收到該異常訊號時,依據該異常訊號產生不同之一第二順序,並控制該電源控制器以該第二順序供電給該待測電路板、該卡板測試裝置、及該擴充測試裝置。 As claimed in claim 6, the system for sequentially supplying power to a circuit board and a test device to test the circuit board, wherein the test control device is further used to control the power controller to supply power to the circuit board under test in the first sequence, The card board test device and the expansion test device determine whether the card board test device returns an abnormal signal, and when receiving the abnormal signal, generate a different second sequence according to the abnormal signal, and control the The power controller supplies power to the circuit board under test, the card board testing device, and the expansion testing device in the second sequence.
TW111136136A 2022-09-23 2022-09-23 System and method for supplying power to circuit board and test devices in sequence to test circuit board TWI812481B (en)

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TW201326848A (en) * 2011-12-21 2013-07-01 Inventec Corp Auxiliary testing apparatus
TW201418735A (en) * 2012-11-02 2014-05-16 Wistron Corp Circuit board automated testing apparatus and method using the same
CN107797050A (en) * 2017-10-20 2018-03-13 郑州云海信息技术有限公司 A kind of method of location-server mainboard electrifying timing sequence abnormal state
CN112698182A (en) * 2020-12-10 2021-04-23 Oppo广东移动通信有限公司 Method, device, equipment, storage medium and system for monitoring power-on time sequence of jig

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201326848A (en) * 2011-12-21 2013-07-01 Inventec Corp Auxiliary testing apparatus
TW201418735A (en) * 2012-11-02 2014-05-16 Wistron Corp Circuit board automated testing apparatus and method using the same
CN107797050A (en) * 2017-10-20 2018-03-13 郑州云海信息技术有限公司 A kind of method of location-server mainboard electrifying timing sequence abnormal state
CN112698182A (en) * 2020-12-10 2021-04-23 Oppo广东移动通信有限公司 Method, device, equipment, storage medium and system for monitoring power-on time sequence of jig

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