TW202408785A - Optical shaping apparatus,reduction projection optical component for optical shaping apparatus, and method for manufacturing optical shaping object - Google Patents

Optical shaping apparatus,reduction projection optical component for optical shaping apparatus, and method for manufacturing optical shaping object Download PDF

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TW202408785A
TW202408785A TW112111665A TW112111665A TW202408785A TW 202408785 A TW202408785 A TW 202408785A TW 112111665 A TW112111665 A TW 112111665A TW 112111665 A TW112111665 A TW 112111665A TW 202408785 A TW202408785 A TW 202408785A
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light
shaping
liquid tank
light source
resin
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酒巻俊一
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日商三井化學股份有限公司
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本發明之光造形裝置,包含:蓄積液狀之光硬化性樹脂之液槽、將具備區隔壁及容納於區隔壁中之發光元件之單一畫素複數配置成規律矩陣狀且單一畫素之最大寬度在200μm以下之光源裝置、配置於光源裝置與液槽之間,利用從單一畫素放射之光形成向光硬化性樹脂照射之點狀光,並透過複數之點狀光在液槽內之形成區域形成曝光像之光學元件,以及支持透過曝光像而硬化之光硬化性樹脂之樹脂硬化層,並向上下方向移動之載台。The optical forming device of the present invention comprises: a liquid tank storing liquid photocurable resin, a light source device in which a plurality of single pixels having partition walls and light-emitting elements accommodated in the partition walls are arranged in a regular matrix and the maximum width of the single pixel is less than 200 μm, an optical element arranged between the light source device and the liquid tank, which uses light emitted from the single pixel to form a point light irradiated to the photocurable resin and forms an exposure image in a formation area in the liquid tank through the plurality of point lights, and a resin curing layer of the photocurable resin cured through the exposure image, and a stage that supports the resin curing layer and moves in the vertical direction.

Description

光造形裝置、光造形裝置用之縮小投影光學零件、及光造形物之製造方法Light shaping device, reduced projection optical component for light shaping device, and method for manufacturing light shaping object

本發明係關於一種光造形裝置、光造形裝置用之縮小投影光學零件、及光造形物之製造方法。The present invention relates to a light shaping device, a reduced projection optical component used in the light shaping device, and a method for manufacturing a light shaping object.

習知如國際公開第2018/154847號之光造形裝置,作為用以造形具有三維形狀之立體構造物之裝置。國際公開第2018/154847號之光造形裝置,具有光源裝置及將從光源裝置放射之光集光之光學元件。又,設置蓄積有對紫外線產生反應之液狀光硬化性樹脂之容器作為液槽。A conventional light shaping device such as International Publication No. 2018/154847 is known as a device for shaping a three-dimensional structure with a three-dimensional shape. The light shaping device of International Publication No. 2018/154847 has a light source device and an optical element that collects light emitted from the light source device. Furthermore, a container storing a liquid photocurable resin that reacts to ultraviolet rays is provided as a liquid tank.

國際公開第2018/154847號中,光源裝置具有放射出紫外線之複數之發光元件,以及作為區隔鄰接之發光元件之分隔壁之區隔壁。區隔壁及容納於區隔壁所包圍之區域內之發光元件形成單一畫素。In International Publication No. 2018/154847, a light source device has a plurality of light-emitting elements that emit ultraviolet rays, and a partition wall that serves as a partition wall to separate adjacent light-emitting elements. The partition wall and the light-emitting elements contained in the area surrounded by the partition wall form a single pixel.

又,國際公開第2018/154847號中,光學元件藉由將從單一畫素放射之紫外線集光,形成向光硬化性樹脂照射之點狀光。點狀光係沿著與液槽之液面直交之方向,從液槽之上側對液面進行照射。又,本說明書中,亦將與液面直交之方向簡單稱為「照射方向」。In addition, in International Publication No. 2018/154847, the optical element collects ultraviolet light emitted from a single pixel to form a point light that irradiates the photocurable resin. The point light irradiates the liquid surface from the upper side of the liquid tank in a direction perpendicular to the liquid surface of the liquid tank. In addition, in this specification, the direction perpendicular to the liquid surface is also simply referred to as the "irradiation direction".

透過複數之點狀光之照射,在液槽內之形成區域形成以期望之二維形狀圖案設計之曝光像。透過紫外線之照射,使形成有曝光像之形成區域之光硬化性樹脂產生光硬化反應。其結果,在形成區域形成具有既定厚度且具有與曝光像相同之二維形狀圖案之樹脂硬化層。By irradiating with multiple point lights, an exposure image designed with a desired two-dimensional shape pattern is formed in the formation area in the liquid tank. By irradiating with ultraviolet rays, the photocurable resin in the formation area formed with the exposure image undergoes a photocuring reaction. As a result, a resin cured layer having a predetermined thickness and the same two-dimensional shape pattern as the exposure image is formed in the formation area.

又,於國際公開第2018/154847號之光造形裝置,設有從下側支持形成之樹脂硬化層之載台。載台維持支持著樹脂硬化層之狀態並向液槽之內部下沉,同時對於樹脂硬化層之上側之液狀光硬化性樹脂照射紫外線。藉由反覆進行載台之下沉及紫外線之照射,使複數之樹脂硬化層沿著上下方向積層,其結果,最終可得到具有期望之三維形狀之立體造形物。Furthermore, the light shaping device disclosed in International Publication No. 2018/154847 is provided with a stage that supports the formed resin hardened layer from the lower side. The stage sinks into the liquid tank while maintaining the state of supporting the resin hardened layer, and at the same time, the liquid photocurable resin on the upper side of the resin hardened layer is irradiated with ultraviolet rays. By repeatedly carrying out the stage sinking and ultraviolet irradiation, a plurality of resin hardened layers are stacked in the up and down direction. As a result, a three-dimensional molded object with a desired three-dimensional shape can finally be obtained.

特許文獻1:國際公開第2018/154847號Patent Document 1: International Publication No. 2018/154847

[發明欲解決之課題][Problems to be solved by the invention]

此處,依本案發明人之研究結果,發現供給至放射紫外線之發光元件之功率相同時,沿著照射方向看時之單一畫素之最大寬度愈寬,在單一畫素之寬度方向中央對光硬化性樹脂照射之照射光之指向性愈降低。Here, according to the research results of the inventors of this case, it is found that when the power supplied to the light-emitting element emitting ultraviolet rays is the same, the wider the maximum width of a single pixel when viewed along the irradiation direction, the lower the directivity of the irradiation light irradiating the photocurable resin in the center of the width direction of the single pixel.

換言之,單一畫素之最大寬度愈寬,朝向照射方向以外之方向而不貢獻於曝光之光的光量愈增加。故,國際公開第2018/154847號之光造形裝置中,根據單一畫素之最大寬度,有光之利用效率降低之疑慮。In other words, the wider the maximum width of a single pixel, the more light that is directed in directions other than the irradiation direction and does not contribute to exposure increases. Therefore, in the light shaping device of International Publication No. 2018/154847, there is a concern that the efficiency of light utilization is reduced due to the maximum width of a single pixel.

又,光造形裝置中,若形成區域中之曝光像亦即造形用影像之光能密度變小,則必須延長光造形之照射時間,其結果會使造形速度降低。亦即,光之利用效率仍有改善之餘地。又,在本說明書中,光能密度表示每單位面積之光能。In addition, in the optical forming device, if the light energy density of the exposure image in the forming area, i.e., the forming image, becomes smaller, the exposure time of the optical forming must be extended, which results in a decrease in the forming speed. In other words, there is still room for improvement in the efficiency of light utilization. In addition, in this specification, light energy density means light energy per unit area.

本發明係著眼於上述情況而完成,並可改善光之利用效率。 [解決課題之手段] The present invention is made with the above situation in mind and can improve the efficiency of light utilization. [Methods for solving the problem]

用以解決上述課題之手段包含以下態樣。Means used to solve the above problems include the following aspects.

<1>一種光造形裝置,包含:液槽,蓄積液狀之光硬化性樹脂;光源裝置,將具備區隔壁及容納於區隔壁之中的發光元件之單一畫素複數配置成規律之矩陣狀,單一畫素之最大寬度在200μm以下;光學元件,配置在光源裝置與液槽之間,利用從單一畫素放射出之光形成向光硬化性樹脂照射之點狀光,並透過複數之點狀光在液槽內之形成區域形成曝光像;以及,載台,支持透過曝光像而硬化之光硬化性樹脂之樹脂硬化層,並向上下方向移動。<1> A light shaping device, including: a liquid tank that stores liquid photocurable resin; and a light source device that arranges a plurality of single pixels having partition walls and light-emitting elements accommodated in the partition walls into a regular matrix shape , the maximum width of a single pixel is less than 200 μm; the optical element is arranged between the light source device and the liquid tank, and uses the light emitted from a single pixel to form point-like light that is irradiated to the photocurable resin, and passes through a plurality of points The exposure image is formed in the area where the light-like light is formed in the liquid tank; and the stage supports the resin cured layer of the photocurable resin that is cured through the exposure image, and moves in the up and down direction.

<2>如上述<1>所述之光造形裝置,其中,光學元件具有將從單一畫素放射之光集光之微透鏡,微透鏡之間距在發光元件之光源波長[nm]以上、單一畫素之間距以下。<2> The light shaping device as described in <1> above, wherein the optical element has a microlens for collecting light emitted from a single pixel, and the distance between the microlenses is greater than the wavelength [nm] of the light source of the light-emitting element and less than the distance between the single pixels.

<3>如上述<1>或<2>所述之光造形裝置,其中,光學元件具有將從單一畫素放射之光集光之微透鏡,並對單一畫素配置複數之微透鏡。<3> The light shaping device according to the above <1> or <2>, wherein the optical element has a microlens that collects light emitted from a single pixel, and a plurality of microlenses are arranged for a single pixel.

<4>如上述<2>或<3>所述之光造形裝置,其中,微透鏡在俯視下為圓形狀,微透鏡之間距係發光元件之光源波長[nm]的2倍以上。<4> The light shaping device according to the above <2> or <3>, wherein the microlenses are circular in plan view, and the distance between the microlenses is at least twice the wavelength [nm] of the light source of the light-emitting element.

<5>如上述<1>所述之光造形裝置,其中,光學元件係光圈,其具有將從單一畫素放射之光收窄之複數之狹縫,並利用狹縫形成向光硬化性樹脂照射之點狀光。<5> The light shaping device as described in <1> above, wherein the optical element is an aperture having a plurality of slits for narrowing light emitted from a single pixel, and the slits are used to form point-shaped light that irradiates the photocurable resin.

<6>如上述<1>~<5>中任一項所述之光造形裝置,其中,光源裝置配置於液槽之下側,樹脂硬化層支持於載台之底面側,載台可在支持樹脂硬化層之狀態下上升。<6> The light shaping device according to any one of the above <1> to <5>, wherein the light source device is disposed below the liquid tank, the resin hardened layer is supported on the bottom side of the stage, and the stage can be placed on It rises while supporting the resin hardened layer.

<7>如上述<1>~<6>中任一項所述之光造形裝置,其中,設有分別對應於複數之發光元件之開關元件。<7> The light shaping device according to any one of the above <1> to <6>, wherein switching elements respectively corresponding to the plurality of light-emitting elements are provided.

<8>一種光造形裝置,包含:液槽,蓄積液狀之光硬化性樹脂;光源裝置,具有由複數之單一畫素形成之投影面,並從投影面投影出欲造形之光造形物之面積的N倍(其中N>1)之造形用影像;縮小投影光學零件,配置於光源裝置之投影面與液槽之底面之間,將造形用影像之面積縮小成1/M(其中M>1)並投影至液槽內之造形形成面;以及,載台,支持透過造形形成面之上的造形用影像而硬化之光硬化性樹脂之樹脂硬化層,並向上下方向移動。<8>A photoforming device comprises: a liquid tank storing liquid photocurable resin; a light source device having a projection surface formed by a plurality of single pixels, and projecting a forming image of N times (where N>1) the area of the photoformed object to be formed from the projection surface; a reduction projection optical component arranged between the projection surface of the light source device and the bottom surface of the liquid tank, reducing the area of the forming image to 1/M (where M>1) and projecting it onto the forming surface in the liquid tank; and a carrier supporting a resin hardening layer of the photocurable resin hardened by the forming image on the forming surface, and moving in the up-down direction.

<9>如上述<8>所述之光造形裝置,其中,縮小投影光學零件具備配置於光源裝置之側之第一光集束構件,以及將第一光集束構件所集束之光的光軸向與造形形成面直交之方向修正之光軸修正構件。<9> The light shaping device according to the above <8>, wherein the reduction projection optical component includes a first light condensing member disposed on the side of the light source device, and an optical axis direction of the light concentrated by the first light condensing member. An optical axis correction member for correcting the direction perpendicular to the molding surface.

<10>如上述<9>所述之光造形裝置,其中,縮小投影光學零件在第一光集束構件與光軸修正構件之間具備折射率大於空氣之第二光集束構件。<10> The light shaping device according to the above <9>, wherein the reduction projection optical component includes a second light focusing member having a refractive index greater than that of air between the first light focusing member and the optical axis correction member.

<11>如上述<8>~<10>中任一項所述之光造形裝置,其中,N為3以上。<11> The optical shaping device according to any one of the above <8> to <10>, wherein N is 3 or more.

<12>如上述<8>~<11>中任一項所述之光造形裝置,其中,光源裝置配置於液槽之下側;樹脂硬化層支持於載台之底面側,載台可在支持樹脂硬化層之狀態下上升。<12> The light shaping device according to any one of the above <8> to <11>, wherein the light source device is arranged below the liquid tank; the resin hardened layer is supported on the bottom side of the stage, and the stage can be placed on It rises while supporting the resin hardened layer.

<13>一種光造形物之製造方法,包含以下步驟:從光源裝置之由複數之單一畫素形成之投影面投影出欲造形之光造形物之面積的N倍(其中N>1)之造形用影像之步驟;以及,利用縮小投影光學零件將造形用影像之面積縮小至1/M(其中M>1),並將面積縮小後之造形用影像投影至蓄積有液狀之光硬化性樹脂之液槽內之造形形成面,而將光硬化性樹脂硬化之步驟。<13>A method for manufacturing a light-shaped object comprises the following steps: a step of projecting a shaping image with an area N times (where N>1) of the area of the light-shaped object to be shaped from a projection surface formed by a plurality of single pixels of a light source device; and a step of reducing the area of the shaping image to 1/M (where M>1) by using a reduction projection optical component, and projecting the reduced shaping image onto a shaping surface in a liquid tank containing liquid photocurable resin, thereby curing the photocurable resin.

<14>一種光造形裝置用之縮小投影光學零件,係用於一種光造形裝置,該光造形裝置包含:液槽,蓄積液狀之光硬化性樹脂;光源裝置,具有由複數之單一畫素形成之投影面,並從投影面投影出欲造形之光造形物之面積的N倍(其中N>1)之造形用影像;以及載台,支持透過造形用影像而硬化之光硬化性樹脂之樹脂硬化層,並向上下方向移動;該縮小投影光學零件,係配置於光源裝置之投影面與液槽之底面之間,其將造形用影像之面積縮小至1/M(其中M>1)並投影至液槽內之造形形成面。 [發明效果] <14> A reduced projection optical component for a light shaping device is used in a light shaping device, the light shaping device comprising: a liquid tank storing liquid photocurable resin; a light source device having a projection surface formed by a plurality of single pixels, and projecting a shaping image of N times (where N>1) the area of the light shaping object to be shaped from the projection surface; and a stage supporting a resin hardening layer of the photocurable resin hardened by the shaping image and moving in the up-down direction; the reduced projection optical component is arranged between the projection surface of the light source device and the bottom surface of the liquid tank, and it reduces the area of the shaping image to 1/M (where M>1) and projects it onto the shaping surface in the liquid tank. [Effect of the invention]

透過本發明,可改善光之利用效率。The present invention can improve the light utilization efficiency.

以下利用第1實施態樣~第3實施態樣說明本發明之實施態樣。在以下圖式之記載中,對於相同之部分及類似之部分,標示相同之符號或類似之符號。但,圖式僅為示意圖,厚度及平面尺寸之關係、各裝置及各構件之厚度之比率等與現實不同。從而,具體之厚度及尺寸應參酌以下說明而判定。又,各圖式之間亦包含彼此之尺寸關係及比率不同之部分。又,若說明書中未特別限定,則本發明之各構成要素之個數不限於1個,亦可存在複數。The embodiments of the present invention will be described below using the first to third embodiments. In the description of the following drawings, the same parts or similar parts are designated with the same symbols or similar symbols. However, the drawings are only schematic diagrams, and the relationship between thickness and plane size, the ratio of the thickness of each device and each member, etc. are different from reality. Therefore, the specific thickness and size should be determined with reference to the following description. In addition, each drawing also includes parts with different dimensional relationships and ratios. In addition, unless otherwise specified in the specification, the number of each component of the present invention is not limited to one, and a plurality may exist.

[第1實施態樣] <光造形裝置> 首先,參照圖1~圖11說明依第1實施態樣之光造形裝置10。如圖1所示,光造形裝置10具有液槽12、載台14、將載台14垂吊之垂吊構件16,以及光照射裝置20。 [First Implementation] <Light Shaping Device> First, the light shaping device 10 according to the first implementation is described with reference to FIGS. 1 to 11. As shown in FIG. 1, the light shaping device 10 includes a liquid tank 12, a stage 14, a hanging member 16 for hanging the stage 14, and a light irradiation device 20.

(液槽) 液槽12具有底部及側壁,且整體而言由具有透光性之素材製作。液槽12中蓄積液狀之光硬化性樹脂18。又,本發明中,無須使整個液槽皆具有透光性。本發明中,至少在底部或側壁之中光照射裝置所照射之光通過之部分具有透光性即可。 (Liquid tank) The liquid tank 12 has a bottom and a side wall, and is generally made of a light-transmitting material. The liquid tank 12 stores a liquid photocurable resin 18. In the present invention, it is not necessary to make the entire liquid tank light-transmitting. In the present invention, at least the portion of the bottom or side wall through which the light irradiated by the light irradiation device passes is light-transmitting.

(載台) 載台14支持透過曝光像而硬化之光硬化性樹脂18之樹脂硬化層,並向圖1中之上下方向移動。亦即,載台14可在支持樹脂硬化層之狀態下上升及下降。又,第1實施態樣中,硬化之樹脂硬化層在載台14之底面側經由支持銷32受到支持。亦即,第1實施態樣中,光造形裝置10係垂吊型之3D列印機。 (Carrier) The carrier 14 supports the resin hardening layer of the photocurable resin 18 hardened by the exposure image, and moves in the up and down direction in FIG. 1. That is, the carrier 14 can rise and fall while supporting the resin hardening layer. In addition, in the first embodiment, the hardened resin hardening layer is supported on the bottom side of the carrier 14 via the support pins 32. That is, in the first embodiment, the optical shaping device 10 is a hanging type 3D printer.

(光照射裝置) 光照射裝置20係設於圖1中之液槽12之下側,並通過具有透光性之液槽12之底部,向載台14之底面側照射光。又,第1實施態樣中,例示面曝光方法亦即DLP(Digital Light Processing,數位光處理)方法之光造形之情況,但本發明之光造形不限於DLP方法,只要係面曝光方法即可。 (Light irradiation device) The light irradiation device 20 is disposed below the liquid tank 12 in FIG. 1 and irradiates light to the bottom side of the carrier 14 through the bottom of the liquid tank 12 which is light-transmissive. In the first embodiment, the light shaping of the surface exposure method, i.e., the DLP (Digital Light Processing) method, is exemplified, but the light shaping of the present invention is not limited to the DLP method, as long as it is a surface exposure method.

光照射裝置20具備框體22、設於框體22內側之光源裝置24,以及在框體22之內側配置於光源裝置24與液槽12之間之光學元件26。光造形物之製造時,將預先作成之造形用影像資料輸入光照射裝置20。造形用影像資料例如係由CAD軟體或CAM軟體等製作。光照射裝置20基於輸入之造形用影像資料,向浸漬於液槽12內之載台14之下側,例如選擇性照射紫外線等光造形所需之既定之波長之光。The light irradiation device 20 includes a frame 22 , a light source device 24 provided inside the frame 22 , and an optical element 26 disposed between the light source device 24 and the liquid tank 12 inside the frame 22 . When manufacturing a photo-shaped object, pre-created image data for modeling is input to the light irradiation device 20 . The image data for modeling is produced by, for example, CAD software or CAM software. The light irradiation device 20 selectively irradiates the underside of the stage 14 immersed in the liquid tank 12 with light of a predetermined wavelength required for light modeling, such as ultraviolet light, based on the input image data for modeling.

(光源裝置) 如圖2所示,光源裝置24具備基板24A、區隔壁24B、發光元件24C、密封材24D及保護層24E。光源裝置24對於光硬化性樹脂18之形成區域18A,從複數之單一畫素23一起出射光。又,圖2中,為方便說明,省略圖1中例示之框體22之圖示。 (Light source device) As shown in FIG. 2 , the light source device 24 includes a substrate 24A, a partition wall 24B, a light-emitting element 24C, a sealing material 24D, and a protective layer 24E. The light source device 24 emits light from a plurality of single pixels 23 together with respect to the formation area 18A of the photocurable resin 18. In FIG. 2 , for the convenience of explanation, the illustration of the frame 22 illustrated in FIG. 1 is omitted.

(基板) 基板24A例如係玻璃基板或樹脂基板。基板24A中設有用以驅動發光元件24C之各種電路、TFT(Thin Film Transistor,薄膜電晶體)等開關元件、掃描線、信號線及電源線等各種配線。各種電路之圖示省略。又,圖5中例示後續說明之開關元件36、X電極構件X1、X2及Y電極構件Y1、Y2。 (Substrate) The substrate 24A is, for example, a glass substrate or a resin substrate. The substrate 24A is provided with various circuits for driving the light-emitting element 24C, switch elements such as TFT (Thin Film Transistor), scanning lines, signal lines, power lines and other wiring. The illustrations of various circuits are omitted. In addition, FIG. 5 illustrates the switch element 36, X electrode components X1, X2 and Y electrode components Y1, Y2 described later.

(區隔壁) 區隔壁24B例如由樹脂材料或金屬材料形成。區隔壁24B如圖3所示,分別沿著X方向及Y方向設置複數。X方向與Y方向互相直交。故,在俯視下,X方向之區隔壁24B與Y方向之區隔壁24B呈現格子狀。區隔壁24B所包圍之格子之內側之空間中,設有1個發光元件24C。 (Next door to the area) The partition wall 24B is formed of, for example, a resin material or a metal material. As shown in FIG. 3 , a plurality of partition walls 24B are provided along the X direction and the Y direction. The X direction and the Y direction are orthogonal to each other. Therefore, in a plan view, the partition walls 24B in the X direction and the partition walls 24B in the Y direction present a grid shape. One light-emitting element 24C is provided in the space inside the grid surrounded by the partition wall 24B.

(發光元件) 發光元件24C在俯視下複數排列成規律之矩陣狀。發光元件24C例如係微發光二極體(micro Light Emitting Diode,microLED)。發光元件24C容納於區隔壁24B與區隔壁24B之中。發光元件24C放射出具有約400nm之波長之紫外光。又,本發明中,發光元件不限於微LED,例如可適當採用有機LED等發出可將光硬化性樹脂18硬化之波長之光之元件。 (Light-emitting element) The light-emitting elements 24C are arranged in a regular matrix in a top view. The light-emitting element 24C is, for example, a micro light emitting diode (microLED). The light-emitting element 24C is accommodated between the partition walls 24B and the partition walls 24B. The light-emitting element 24C emits ultraviolet light having a wavelength of about 400nm. In addition, in the present invention, the light-emitting element is not limited to a microLED, and for example, an element that emits light of a wavelength that can cure the photocurable resin 18, such as an organic LED, can be appropriately used.

又,本發明中用於作為發光元件之微LED不受電性控制。換言之,微LED即為放射出曝光用之光的光源本身,且微LED之放射光直接用於作為曝光用之光。關於此點,例如用於作為液晶顯示器之背光之微LED會透過施加於液晶之電壓而電性控制通過液晶之光量。亦即,本發明之發光元件之光的使用用途及使用狀態,與液晶顯示器之微LED之光的使用用途及使用狀態不同。In addition, the micro-LED used as the light-emitting element in the present invention is not electrically controlled. In other words, the micro LED is the light source itself that emits the light for exposure, and the emitted light of the micro LED is directly used as the light for exposure. In this regard, for example, micro-LEDs used as backlights for liquid crystal displays electrically control the amount of light passing through the liquid crystal by applying a voltage to the liquid crystal. That is to say, the use purpose and use state of the light of the light-emitting element of the present invention are different from the use purpose and use state of the light of the micro LED of the liquid crystal display.

第1實施態樣中,複數配置排列成矩陣狀之發光元件24C係以與液槽12內之光硬化性樹脂18相向之方式配置。圖3中,例示配置成X方向4個且Y方向2個之矩陣狀之狀態,但本發明中之發光元件之個數及配置圖案可任意設定。In the first embodiment, the plurality of light emitting elements 24C arranged in a matrix are arranged to face the photocurable resin 18 in the liquid tank 12. FIG3 shows a matrix arrangement of 4 elements in the X direction and 2 elements in the Y direction, but the number and arrangement pattern of the light emitting elements in the present invention can be set arbitrarily.

(密封材) 密封材24D例如可由環氧樹脂或矽氧樹脂等可透光之具有透光性之樹脂等製作。如圖2所示,密封材24D將發光元件24C密封於區隔壁24B之內側。 (Sealing material) The sealing material 24D may be made of a light-transmissive resin such as epoxy resin or silicone resin. As shown in FIG. 2 , the sealing material 24D seals the light-emitting element 24C inside the partition wall 24B.

(保護層) 保護層24E在圖2中設於區隔壁24B之上。保護層24E保護發光元件24C。保護層24E例如可由可透光之具有透光性之樹脂薄膜等製作。 (Protective layer) The protective layer 24E is provided on the partition wall 24B in FIG. 2 . The protective layer 24E protects the light-emitting element 24C. The protective layer 24E can be made of, for example, a light-transmitting resin film or the like.

(單一畫素) 如圖2所示,第1實施態樣中之「單一畫素23」,係由在內側包含發光元件24C,且由被區隔壁24B包圍四周之區域構成。故,與發光元件24C同樣,單一畫素23在俯視下複數配置成規律之矩陣狀。 (Single pixel) As shown in FIG. 2 , the "single pixel 23" in the first embodiment is composed of a region including a light-emitting element 24C on the inner side and surrounded by partition walls 24B. Therefore, like the light-emitting element 24C, the single pixel 23 is arranged in a regular matrix shape in a top view.

單一畫素23之間距例如係鄰接之單一畫素23之中心間隔。又,單一畫素23之間距與鄰接之區隔壁24B之中心間隔相等。又,第1實施態樣中,單一畫素23在俯視下為正方形狀,故單一畫素23之間距與單一畫素23之最大寬度W1相等。第1實施態樣中,單一畫素23之最大寬度W1設定為5μm以上、200μm以下。The distance between single pixels 23 is, for example, the center distance between adjacent single pixels 23 . In addition, the distance between single pixels 23 is equal to the center distance between adjacent partition walls 24B. Furthermore, in the first embodiment, the single pixel 23 has a square shape in plan view, so the distance between the single pixels 23 is equal to the maximum width W1 of the single pixel 23 . In the first embodiment, the maximum width W1 of a single pixel 23 is set to 5 μm or more and 200 μm or less.

單一畫素23之最大寬度W1未滿5μm時,單一畫素23過小而使製造成本提高。又,單一畫素23之最大寬度W1超過200μm時,會降低曝光像之解析度。特別從提升解析度之觀點而言,單一畫素23之最大寬度W1較佳為100μm以下。又,本發明中,單一畫素之最大寬度W1亦可未滿5μm。又,本發明中,單一畫素之最大寬度W1亦可超過200μm。When the maximum width W1 of the single pixel 23 is less than 5 μm, the single pixel 23 is too small and the manufacturing cost increases. In addition, when the maximum width W1 of a single pixel 23 exceeds 200 μm, the resolution of the exposed image will be reduced. Especially from the viewpoint of improving resolution, the maximum width W1 of a single pixel 23 is preferably 100 μm or less. Furthermore, in the present invention, the maximum width W1 of a single pixel may be less than 5 μm. Furthermore, in the present invention, the maximum width W1 of a single pixel may also exceed 200 μm.

又,第1實施態樣中,X方向之最大寬度W1與Y方向之最大寬度W1相等,但本發明不限於此,X方向之最大寬度亦可與Y方向之最大寬度不同。亦即,本發明中,單一畫素在俯視下之形狀亦可係矩形狀。又,單一畫素之形狀不限於矩形狀,亦可係圓形狀或其他多邊形狀等任意之幾何形狀。Furthermore, in the first embodiment, the maximum width W1 in the X direction is equal to the maximum width W1 in the Y direction, but the present invention is not limited thereto, and the maximum width in the X direction may be different from the maximum width in the Y direction. That is, in the present invention, the shape of a single pixel in a top view may also be a rectangle. Furthermore, the shape of a single pixel is not limited to a rectangle, and may be any geometric shape such as a circle or other polygonal shape.

(光學元件) 光學元件26如圖2所示,具備基部26A及設於基部26A之其中一面之上之微透鏡26B。第1實施態樣中,光學元件26在液槽12之下側配置於光源裝置24與液槽12之間。光學元件26利用從單一畫素23放射之光形成向光硬化性樹脂18照射之點狀光。透過複數之點狀光,在液槽12內之形成區域18A形成曝光像。 (Optical element) As shown in FIG. 2 , the optical element 26 has a base 26A and a microlens 26B disposed on one side of the base 26A. In the first embodiment, the optical element 26 is disposed between the light source device 24 and the liquid tank 12 at the lower side of the liquid tank 12. The optical element 26 uses light emitted from a single pixel 23 to form a point light irradiated to the photocurable resin 18. Through a plurality of point lights, an exposure image is formed in the formation area 18A in the liquid tank 12.

(基部) 基部26A係板狀構件。基部26A可由透光性之玻璃或樹脂材料等製作。 (Base) The base 26A is a plate-shaped member. The base 26A can be made of a light-transmitting glass or resin material.

(微透鏡) 微透鏡26B可由透光性之玻璃或樹脂材料等製作。第1實施態樣之微透鏡26B作為光學元件,將從單一畫素23放射之光集光,而形成向光硬化性樹脂18照射之點狀光。又,本發明中,光學元件亦可係微透鏡以外之種類之透鏡及反射鏡等其他集光裝置。 (Microlens) The microlens 26B can be made of a light-transmitting glass or resin material. The microlens 26B of the first embodiment serves as an optical element to collect light emitted from a single pixel 23 and form a point light that irradiates the photocurable resin 18. In addition, in the present invention, the optical element can also be other light-collecting devices such as lenses and reflectors other than microlenses.

第1實施態樣中,基部26A與微透鏡26B係一體成形。又,本發明中,微透鏡26B亦可與基部26A分別形成,並且與基部26A接合。In the first embodiment, the base 26A and the microlens 26B are integrally formed. Furthermore, in the present invention, the microlens 26B may be formed separately from the base 26A, and may be bonded to the base 26A.

如圖3所示,微透鏡26B在俯視下係圓形狀。又,如圖2所示,微透鏡26B係向上側突出之半球狀。第1實施態樣中,微透鏡26B之直徑皆相同。又,本發明中,複數之微透鏡26B之形狀及尺寸亦可相異。又,在對應於單一畫素之一群組之複數之微透鏡26B之中,各自的形狀及尺寸亦可彼此相異。As shown in FIG. 3 , the microlens 26B has a circular shape in plan view. Furthermore, as shown in FIG. 2 , the microlens 26B has a hemispherical shape protruding upward. In the first embodiment, the diameters of the microlenses 26B are all the same. Furthermore, in the present invention, the shapes and sizes of the plurality of microlenses 26B may also be different. In addition, the shapes and sizes of the plurality of microlenses 26B corresponding to a group of single pixels may also be different from each other.

微透鏡26B在俯視下係在基部26A之上複數設置成矩陣狀。圖3中所例示之光學元件26中,對於單一畫素23,將4個微透鏡26B配置成1個微透鏡陣列。又,本發明中,對應於單一畫素之微透鏡26B之個數可為1個,或者亦可為任意之複數個。又,如圖2所示,第1實施態樣中,1個微透鏡陣列之寬度W2與密封材之寬度W3大致相等。The microlenses 26B are arranged in a matrix on the base 26A in a top view. In the optical element 26 illustrated in FIG3 , four microlenses 26B are arranged as one microlens array for a single pixel 23. In the present invention, the number of microlenses 26B corresponding to a single pixel can be one, or any number. In the first embodiment, as shown in FIG2 , the width W2 of one microlens array is substantially equal to the width W3 of the sealing material.

(微透鏡之間距) 接著,說明微透鏡之間距。第1實施態樣中,單一畫素23內之微透鏡26B之間距(例如中心間隔)係設定為發光元件24C之光源波長[nm]以上、單一畫素23之間距以下。若微透鏡26B之間距未滿光源波長,難以適當發揮作為透鏡之集光機能。另一方面,若微透鏡之間距超過單一畫素之間距,會使微透鏡之尺寸過大,故增加製造成本之負擔。 (distance between microlenses) Next, the distance between microlenses will be described. In the first embodiment, the distance between the microlenses 26B in a single pixel 23 (for example, the center distance) is set to be greater than the light source wavelength [nm] of the light-emitting element 24C and less than the distance between the single pixels 23 . If the distance between the microlenses 26B is less than the wavelength of the light source, it will be difficult to properly perform the light collecting function of the lens. On the other hand, if the distance between microlenses exceeds the distance between single pixels, the size of the microlenses will be too large, thus increasing the manufacturing cost burden.

又,第1實施態樣中,微透鏡26B之間距設定在發光元件24C之光源波長[nm]的2倍以上,如此從可抑制干涉條紋之觀點而言更佳。例如,若光源波長為約400nm,則微透鏡26B之間距可設定在約800nm以上、1μm以下之範圍內。In the first embodiment, the spacing of the microlenses 26B is set to be at least twice the wavelength [nm] of the light source of the light emitting element 24C, which is more preferable from the perspective of suppressing interference fringes. For example, if the wavelength of the light source is about 400nm, the spacing of the microlenses 26B can be set to be within a range of about 800nm or more and 1μm or less.

又,第1實施態樣中,微透鏡26B在單一畫素23內無間隙地配置,故如圖3所示,單一畫素23內之微透鏡26B之間距與微透鏡26B之直徑D實質相等。亦即,第1實施態樣中,所謂單一畫素23內之微透鏡26B之間距在光源波長以上,等同於微透鏡26B之直徑D在光源波長以上。Furthermore, in the first embodiment, the microlenses 26B are arranged without gaps in the single pixel 23. Therefore, as shown in FIG. 3, the distance between the microlenses 26B in the single pixel 23 is substantially equal to the diameter D of the microlenses 26B. . That is, in the first embodiment, the distance between the microlenses 26B in the so-called single pixel 23 is greater than the wavelength of the light source, which is equivalent to the diameter D of the microlens 26B being greater than the wavelength of the light source.

但,在微透鏡26B之間存在間隙時,較佳使單一畫素23內之微透鏡之間距中微透鏡之直徑所佔的比例較大。具體而言,單一畫素23內之微透鏡26B之直徑D在微透鏡26B之間距中所佔的比例,較佳在70%以上,更佳在80%以上,又更佳在90%以上,進一步更佳在95%以上。特別係在單一畫素23內之微透鏡26B之間距之長度與光源波長相等時,1個間距中之微透鏡26B之直徑D所佔的比例較佳如上所述在70%以上之範圍內。However, when there is a gap between the microlenses 26B, it is preferable that the distance between the microlenses in a single pixel 23 accounts for a larger proportion of the diameter of the microlenses. Specifically, the proportion of the diameter D of the microlens 26B in a single pixel 23 to the distance between the microlenses 26B is preferably more than 70%, more preferably more than 80%, and still more preferably more than 90%. Even better is above 95%. Especially when the length of the distance between microlenses 26B in a single pixel 23 is equal to the wavelength of the light source, the proportion of the diameter D of the microlenses 26B in one pitch is preferably in the range of more than 70% as mentioned above.

又,本發明中,即使微透鏡之直徑未滿光源波長,只要單一畫素內之微透鏡之間距在波長以上即可。即使微透鏡之直徑未滿光源波長,只要微透鏡間之間隙小,仍可將來自光源裝置之單一畫素之放射光集光。換言之,只要微透鏡間之間隙小至可將來自單一畫素之放射光集光之程度,在單一畫素內鄰接之微透鏡之間所形成之間距可設定為光源波長以上。Furthermore, in the present invention, even if the diameter of the microlens is less than the wavelength of the light source, as long as the distance between the microlenses in a single pixel is greater than the wavelength. Even if the diameter of the microlenses is less than the wavelength of the light source, as long as the gap between the microlenses is small, the emitted light from a single pixel of the light source device can still be collected. In other words, as long as the gap between microlenses is small enough to collect the emitted light from a single pixel, the distance formed between adjacent microlenses in a single pixel can be set to be greater than the wavelength of the light source.

(曝光用光) 接著,說明透過微透鏡形成之曝光用光。如圖4A所示,對於在內側包含1個發光元件24C之單一畫素23僅配置1個微透鏡26B時,形成區域18A之成像底面亦即造形形成面19之曝光像,可區分為中央區域RC及周緣區域RP。 (light for exposure) Next, the exposure light formed through the microlens will be described. As shown in FIG. 4A , when only one microlens 26B is configured for a single pixel 23 including one light-emitting element 24C inside, the exposure image of the imaging bottom surface of the forming area 18A, that is, the molding forming surface 19, can be divided into a central area. RC and peripheral area RP.

中央區域RC具有將透鏡之外緣直接投射至造形形成面19之形狀。又,周緣區域RP位於中央區域RC之周緣。向周緣區域RP照射之光能不貢獻於曝光。The central region RC has a shape such that the outer edge of the lens is directly projected onto the molding surface 19 . Furthermore, the peripheral area RP is located on the periphery of the central area RC. The light energy irradiated to the peripheral area RP does not contribute to the exposure.

另一方面,如圖4B所示,對單一畫素23配置4個微透鏡26B時,從左側之微透鏡26B照射之光之中,從光軸C偏心之光的一部分到達鄰接之右側的微透鏡26B側之曝光像內側之重疊區域RO。又,圖4B之剖面圖中呈現2個微透鏡26B。微透鏡26B之光軸C平行於圖4A及圖4B中之上下方向。故,相較於如圖4A之僅配置1個微透鏡26B之情況,抑制不貢獻於曝光之點狀光之光量減低。On the other hand, as shown in FIG. 4B , when four microlenses 26B are arranged for a single pixel 23 , among the light irradiated from the microlens 26B on the left, part of the light eccentric from the optical axis C reaches the adjacent microlens 26B on the right. The overlapping area RO inside the exposed image on the lens 26B side. In addition, two microlenses 26B are shown in the cross-sectional view of FIG. 4B. The optical axis C of the microlens 26B is parallel to the up-down direction in FIGS. 4A and 4B. Therefore, compared with the case where only one microlens 26B is arranged as shown in FIG. 4A , the amount of point light that does not contribute to exposure is suppressed from decreasing.

(開關元件) 如圖5所示,第1實施態樣中,設置與複數之發光元件24C分別對應之開關元件36。具體而言,複數之單一畫素23中的各個經由對應之開關元件36連接於分別設定於各個單一畫素23之X電極構件X1、X2及Y電極構件Y1、Y2。X電極構件X1、X2與Y電極構件Y1、Y2互相直交。 (switching element) As shown in FIG. 5 , in the first embodiment, switching elements 36 respectively corresponding to the plurality of light-emitting elements 24C are provided. Specifically, each of the plurality of single pixels 23 is connected to the X electrode members X1 and X2 and the Y electrode members Y1 and Y2 respectively set in each single pixel 23 via a corresponding switch element 36 . The X electrode members X1 and X2 and the Y electrode members Y1 and Y2 are orthogonal to each other.

圖5中之上段,例示左右方向上鄰接配置之2個單一畫素23連接於第1X電極構件X1,圖5中之下段,例示左右方向上鄰接配置之2個單一畫素23連接於第2X電極構件X2之情況。又,圖5中之左側,例示上下方向上鄰接配置之2個單一畫素23連接於第1Y電極構件Y1,圖5中之右側,例示上下方向上鄰接配置之2個單一畫素23連接於第2Y電極構件Y2之情況。透過開關元件36,可對作為對象之每個單一畫素23,提升光之照射與光之非照射之切換精度。又,本發明中,開關元件36並非必須。The upper section of FIG. 5 illustrates two single pixels 23 adjacently arranged in the left-right direction and connected to the 1X electrode member X1. The lower section of FIG. 5 illustrates two single pixels 23 adjacently arranged in the left-right direction connected to the 2X The case of electrode member X2. In addition, the left side of FIG. 5 illustrates two single pixels 23 that are adjacently arranged in the vertical direction and are connected to the first Y electrode member Y1. The right side of FIG. 5 illustrates that the two single pixels 23 that are adjacently arranged in the vertical direction are connected to the first Y electrode member Y1. The case of the second Y electrode member Y2. Through the switching element 36, the accuracy of switching between light irradiation and light non-irradiation can be improved for each single pixel 23 as the object. In addition, in the present invention, the switching element 36 is not essential.

<光造形物之製造方法> 接著,說明依第1實施態樣之光造形物之製造方法。如圖1所示,透過來自光照射裝置20之光照射,在包含載台14下側之光硬化性樹脂18之液面並且具有固定厚度之形成區域18A中,可將光硬化性樹脂18藉由光聚合而選擇性硬化。其結果,形成光造形物之樹脂硬化層。並且,藉由垂吊構件16向圖1中之上側移動,載台14對應於設定之樹脂硬化層之厚度而上升。 <Method of manufacturing light sculpture> Next, a method of manufacturing the light-shaped object according to the first embodiment will be described. As shown in FIG. 1 , through light irradiation from the light irradiation device 20 , the photocurable resin 18 can be irradiated by the light irradiation device 20 in the formation region 18A that includes the liquid surface of the photocurable resin 18 on the lower side of the stage 14 and has a fixed thickness. Selectively hardened by photopolymerization. As a result, a resin cured layer of the photo-modelled object is formed. Furthermore, as the hanging member 16 moves upward in FIG. 1 , the stage 14 rises in accordance with the set thickness of the resin cured layer.

載台14上升後,藉由利用光照射裝置20照射光,在先前形成之樹脂硬化層之下,積層後續之樹脂硬化層。如圖6所示,第1實施態樣中,透過液槽光聚合法造形出光造形物30。又,光造形物30可係任意之產業製品。After the stage 14 is raised, the light irradiation device 20 irradiates light to deposit a subsequent resin hardening layer under the previously formed resin hardening layer. As shown in FIG6 , in the first embodiment, the light-emitting structure 30 is formed by liquid tank photopolymerization. The light-emitting structure 30 can be any industrial product.

又,第1實施態樣中,圖6中例示透過從載台14之底面延伸之支持銷32將造形中之光造形物30向下垂吊之狀態,但本發明中,支持銷32非必須。藉由重複載台14之上升及光照射裝置20之光照射,最終將光造形物30以垂吊於載台14之下側之狀態造形。In the first embodiment, FIG. 6 shows a state where the optical object 30 being formed is suspended downward by the support pins 32 extending from the bottom surface of the stage 14, but in the present invention, the support pins 32 are not necessary. By repeating the lifting of the stage 14 and the light irradiation of the light irradiation device 20, the optical object 30 is finally formed in a state of being suspended from the lower side of the stage 14.

又,本發明中,例如亦可採用在將光造形物支持於圖1中之載台14之上側之狀態下,使載台14向液槽12之中下降而將樹脂硬化層積層於上下方向之方式。但,使載台14向液槽12之中下降而將樹脂硬化層積層於上下方向時,光係從液槽12之上側朝向載台14之頂面照射。形成曝光像之形成區域18A位於載台14之頂面與液槽12之液面之間。故,形成區域18A之光硬化性樹脂18之頂面與空氣中之氧接觸。氧會使光硬化性樹脂18不易硬化。Furthermore, in the present invention, for example, while the photo-modelled object is supported on the upper side of the stage 14 in FIG. 1 , the stage 14 is lowered into the liquid tank 12 to stack the resin cured layer in the up and down direction. way. However, when the stage 14 is lowered into the liquid tank 12 and the resin cured layer is stacked in the vertical direction, light is irradiated from the upper side of the liquid tank 12 toward the top surface of the stage 14 . The formation area 18A for forming the exposure image is located between the top surface of the stage 14 and the liquid surface of the liquid tank 12 . Therefore, the top surface of the photocurable resin 18 forming the region 18A is in contact with oxygen in the air. Oxygen makes it difficult for the photocurable resin 18 to harden.

另一方面,如第1實施態樣般,在圖1中藉由使載台14上升而將樹脂硬化層積層於上下方向之情況,從液槽12之下側向載台14之底面照射光。形成區域18A係位於圖1中之載台14之底面下側之光硬化性樹脂18。亦即,載台14將空氣遮蔽,故形成區域18A之光硬化性樹脂18不會與空氣中之氧接觸。On the other hand, as in the first embodiment, when the resin curing layer is deposited in the vertical direction by raising the stage 14 in FIG1 , light is irradiated from the lower side of the liquid tank 12 to the bottom surface of the stage 14. The photo-curable resin 18 of the formation area 18A is located below the bottom surface of the stage 14 in FIG1 . That is, the stage 14 shields the air, so the photo-curable resin 18 of the formation area 18A does not come into contact with oxygen in the air.

(第1變形例) 如圖7所示,對應於單一畫素23之微透鏡陣列之寬度W2,可在單一畫素23中之密封材24D之寬度W3以上。圖7中,例示對於單一畫素23將4個微透鏡26B配置成矩陣狀而作為1個微透鏡陣列之情況。又,圖7中,例示1個微透鏡陣列之寬度W2與單一畫素23之間距亦即單一畫素23之最大寬度W1相同之情況。 (First modification) As shown in FIG. 7 , the width W2 of the microlens array corresponding to a single pixel 23 can be greater than the width W3 of the sealing material 24D in the single pixel 23 . FIG. 7 illustrates a case where four microlenses 26B are arranged in a matrix for a single pixel 23 to form one microlens array. In addition, FIG. 7 illustrates a case where the width W2 of one microlens array is the same as the distance between single pixels 23, that is, the maximum width W1 of a single pixel 23.

微透鏡陣列之寬度W2較佳設定為單一畫素23之間距以下。微透鏡陣列之寬度W2若超過單一畫素23之間距,有即使鄰接之單一畫素23為非照射狀態,仍有光到達對應於鄰接之單一畫素23之曝光像之位置之疑慮。The width W2 of the microlens array is preferably set to be less than the pitch of a single pixel 23. If the width W2 of the microlens array exceeds the pitch of a single pixel 23, there is a concern that light may reach the position corresponding to the exposure image of the adjacent single pixel 23 even if the adjacent single pixel 23 is in a non-irradiated state.

(第2變形例) 如圖8所示,微透鏡26B在俯視下可係正方形狀。亦即,第2變形例之微透鏡26B係長方體狀。又,本發明中,微透鏡之形狀可採用俯視下之矩形狀等其他任意幾何形狀。 (Second modification) As shown in FIG. 8 , the microlens 26B may be square in plan view. That is, the microlens 26B of the second modification example has a rectangular parallelepiped shape. In addition, in the present invention, the shape of the microlens can be a rectangular shape in plan view or any other geometric shape.

(第3變形例) 如圖9及圖10所示,微透鏡陣列可由在俯視下以3×3之狀態配置成矩陣狀之9個微透鏡26B構成。第3變形例中,9個微透鏡26B對應於單一畫素23。 (Third modification) As shown in FIGS. 9 and 10 , the microlens array may be composed of nine microlenses 26B arranged in a 3×3 matrix in a plan view. In the third modification example, nine microlenses 26B correspond to a single pixel 23.

(第4變形例) 如圖11所示,微透鏡陣列由9個微透鏡26B構成之情況下,1個微透鏡26B之形狀亦可採用任意之幾何形狀。在圖11中,例示與第2變形例所說明之情況同樣設置在俯視下為正方形狀之微透鏡26B之情況。 (4th modification) As shown in FIG. 11 , when the microlens array is composed of nine microlenses 26B, the shape of one microlens 26B can be any geometric shape. FIG. 11 illustrates a case in which a microlens 26B having a square shape in plan view is provided similarly to the case described in the second modification example.

(作用效果) 第1實施態樣中,單一畫素23之最大寬度W1設定在200μm以下,故抑制光之指向性降低。故,相較於最大寬度W1超過200μm之情況,可抑制光硬化反應中之光之利用效率降低。其結果,可改善光之利用效率。 (Effect) In the first embodiment, the maximum width W1 of a single pixel 23 is set to 200 μm or less, thereby suppressing the decrease in light directivity. Therefore, compared with the case where the maximum width W1 exceeds 200 μm, the reduction in light utilization efficiency in the photohardening reaction can be suppressed. As a result, light utilization efficiency can be improved.

又,第1實施態樣中,藉由設定微透鏡26B之間距之上限值及下限值,可兼顧曝光所需之照射光之形成與光學元件26之製造成本負擔之抑制。Furthermore, in the first embodiment, by setting the upper limit value and the lower limit value of the distance between the microlenses 26B, it is possible to achieve both the formation of the irradiation light required for exposure and the suppression of the manufacturing cost burden of the optical element 26 .

又,第1實施態樣中,可透過微透鏡26B照射直線化之點狀光。又,對於來自單一畫素23之光配置複數之微透鏡26B。故,從1個微透鏡26B照射之光之中從光軸C偏心之光的一部分,到達鄰接於1個微透鏡26B之微透鏡26B側之曝光像內側之重疊區域RO。其結果,相較於僅配置1個微透鏡26B之情況,可抑制點狀光之光量減低。故,可將樹脂硬化層精細地造形。In the first embodiment, linearized point light can be irradiated through the microlens 26B. In addition, a plurality of microlenses 26B are arranged for light from a single pixel 23. Therefore, a portion of the light eccentric from the optical axis C among the light irradiated from one microlens 26B reaches the overlapping area RO inside the exposure image on the microlens 26B side adjacent to one microlens 26B. As a result, the reduction in the amount of point light can be suppressed compared to the case where only one microlens 26B is arranged. Therefore, the resin hardening layer can be finely shaped.

又,第1實施態樣中,微透鏡26B為圓形狀,且微透鏡26B之間距係發光元件24C之光源波長[nm]的2倍以上。故,從微透鏡26B出射之光不發生干涉,其結果,不會在光造形物之表面產生波紋圖案。Furthermore, in the first embodiment, the microlenses 26B have a circular shape, and the distance between the microlenses 26B is more than twice the light source wavelength [nm] of the light emitting element 24C. Therefore, the light emitted from the microlens 26B does not interfere, and as a result, a ripple pattern is not generated on the surface of the optical sculpture.

又,第1實施態樣中,藉由使載台14上升而將樹脂硬化層積層於上下方向,故相較於使載台14向液槽12之中下降之情況,可減低形成具有1層之厚度之樹脂硬化層所需之能量。In the first embodiment, the resin hardened layer is deposited in the vertical direction by raising the stage 14. Therefore, compared with the case where the stage 14 is lowered into the liquid tank 12, the energy required to form the resin hardened layer having a thickness of one layer can be reduced.

又,第1實施態樣中,可透過開關元件36以主動矩陣驅動形式照射光。故,相較於點矩陣驅動形式,提高設計圖案之解析度,其結果,可提升立體造形物之造形精度。Furthermore, in the first embodiment, light can be irradiated through the switching element 36 in an active matrix driving mode. Therefore, compared with the point matrix driving method, the resolution of the design pattern is improved, and as a result, the shaping accuracy of the three-dimensional shaped object can be improved.

[第2實施態樣] 接著,參照圖12及圖13說明依第2實施態樣之光造形裝置10。依第2實施態樣之光造形裝置,具有液槽、光源裝置、光圈38及載台。在第2實施態樣中,與第1實施態樣同樣將光源裝置之單一畫素23之最大寬度W1設定在200μm以下。 [Second implementation mode] Next, the light shaping device 10 according to the second embodiment will be described with reference to FIGS. 12 and 13 . The light shaping device according to the second embodiment includes a liquid tank, a light source device, an aperture 38 and a stage. In the second embodiment, similarly to the first embodiment, the maximum width W1 of a single pixel 23 of the light source device is set to 200 μm or less.

依第2實施態樣之光造形裝置10,在將光圈38作為光學元件配置在光源裝置與液槽之間,而取代第1實施態樣中說明之作為光學元件26之微透鏡26B之點上與第1實施態樣相異。亦即,如微透鏡之集光裝置及如光圈之光圈裝置皆包含於本發明之「光學元件」。第2實施態樣中之光圈38以外之構件,具有與第1實施態樣中之同名構件相同之構成及機能。故,以下,主要對於光圈38進行說明,並省略關於其他構件之構成之重複說明。According to the light shaping device 10 of the second embodiment, the aperture 38 is disposed as an optical element between the light source device and the liquid tank in place of the microlens 26B as the optical element 26 described in the first embodiment. It is different from the first embodiment. That is, light collecting devices such as microlenses and aperture devices such as diaphragms are included in the "optical element" of the present invention. The components other than the aperture 38 in the second embodiment have the same structure and function as the components with the same name in the first embodiment. Therefore, below, the aperture 38 will be mainly described, and repeated descriptions of the structures of other components will be omitted.

如圖12及圖13所示,光圈38係具有複數之狹縫38A之板狀光圈裝置。光圈38例如可由樹脂等製作。第2實施態樣中,狹縫38A在俯視下係矩形狀,但本發明中狹縫之形狀不限於此,例如亦可係長橢圓形狀等其他任意之形狀。As shown in Fig. 12 and Fig. 13, the aperture 38 is a plate-shaped aperture device having a plurality of slits 38A. The aperture 38 can be made of resin, etc. In the second embodiment, the slits 38A are rectangular in a plan view, but the shape of the slits in the present invention is not limited thereto, and can be any other shape such as an oblong shape.

依第2實施態樣之光造形物之製造方法中,光圈38透過狹縫38A,利用從單一畫素23放射之光形成向光硬化性樹脂18照射之包含直線光之點狀光。透過形成之複數之點狀光,在液槽12內之形成區域18A形成曝光像。依第2實施態樣之光造形物之製造方法中之其他步驟,與依第1實施態樣之光造形物之製造方法相同,故省略重複說明。In the method of manufacturing a light-shaped object according to the second embodiment, the aperture 38 passes through the slit 38A, and uses the light emitted from the single pixel 23 to form point-shaped light including linear light that is irradiated to the photocurable resin 18 . Through the formed plural point-shaped lights, an exposure image is formed in the formation area 18A in the liquid tank 12 . The other steps in the method of manufacturing the light-shaped object according to the second embodiment are the same as the method of manufacturing the light-shaped object according to the first embodiment, so repeated explanations are omitted.

(作用效果) 第2實施態樣中,與第1實施態樣之情況同樣將單一畫素23之最大寬度W1設定在200μm以下,故抑制光之指向性降低。故,相較於最大寬度W1超過200μm之情況,可抑制光硬化反應中之光之利用效率降低。其結果,可改善光之利用效率。 (Effect) In the second embodiment, the maximum width W1 of a single pixel 23 is set to less than 200 μm as in the first embodiment, thereby suppressing the reduction of the directivity of light. Therefore, compared with the case where the maximum width W1 exceeds 200 μm, the reduction of the light utilization efficiency in the photocuring reaction can be suppressed. As a result, the light utilization efficiency can be improved.

又,第2實施態樣中,將具有狹縫38A之光圈38作為光學元件使用,以形成向光硬化性樹脂18照射之點狀光。光圈38相較於例如透鏡等集光裝置,可更便宜地製作,故可減低成本。第2實施態樣之其他作用效果與第1實施態樣之情況相同,故省略重複說明。In the second embodiment, an aperture 38 having a slit 38A is used as an optical element to form a point light irradiated to the photocurable resin 18. The aperture 38 can be manufactured more cheaply than a light collecting device such as a lens, so the cost can be reduced. The other effects of the second embodiment are the same as those of the first embodiment, so repeated description is omitted.

[第3實施態樣] <光造形裝置> 接著,參照圖14及圖15說明依第3實施態樣之光造形裝置11。如圖14所示,光造形裝置11具有液槽12、載台14、將載台14垂吊之垂吊構件16,以及光照射裝置50。 [Third Implementation] <Light Shaping Device> Next, the light shaping device 11 according to the third implementation will be described with reference to FIG. 14 and FIG. 15 . As shown in FIG. 14 , the light shaping device 11 includes a liquid tank 12, a stage 14, a hanging member 16 for hanging the stage 14, and a light irradiation device 50.

又,在依第3實施態樣之光造形裝置11中,與第1實施態樣及第2實施態樣同名之構件具有相同之構成及機能。第3實施態樣中,主要對於與第1實施態樣及第2實施態樣相異之點進行說明,並適當省略相同之構成及作用效果之重複說明。In addition, in the light shaping device 11 according to the third embodiment, the members with the same names as those in the first embodiment and the second embodiment have the same structure and function. In the third embodiment, the points that are different from the first embodiment and the second embodiment will be mainly described, and repeated descriptions of the same configurations and functions and effects will be appropriately omitted.

(載台) 載台14支持透過將欲造形之光造形物之面積縮小至1/M而成之造形用影像亦即曝光像而硬化之光硬化性樹脂18之樹脂硬化層,並在圖14中之上下方向移動。M係大於1之正實數,亦即M>1。載台14可在支持樹脂硬化層之狀態下上升及下降。 (Carrier) The carrier 14 supports the resin hardening layer of the photocurable resin 18 which is hardened by the image for forming, i.e., the exposure image, which is formed by reducing the area of the light-shaped object to be formed to 1/M, and moves in the up and down directions in FIG. 14. M is a positive real number greater than 1, i.e., M>1. The carrier 14 can rise and fall while supporting the resin hardening layer.

本說明書中,「欲造形之光造形物之面積」表示作為對象之光造形物之各層之造形面之目標面積。又,「各層」表示「藉由逐層透過光照射硬化並依序積層而造形出之光造形物中的各層」。亦即,本說明書所使用之「光造形物」,可用於表示最終取得之整個立體造形物,亦可用於表示包含於造形中之光造形物之複數之樹脂硬化層中的各層。In this specification, "the area of the optical object to be formed" means the target area of the forming surface of each layer of the optical object. In addition, "each layer" means "each layer in the optical object formed by curing through light irradiation layer by layer and stacking in sequence". That is, the "optical object" used in this specification can be used to represent the entire three-dimensional object finally obtained, and can also be used to represent each layer of the multiple resin cured layers included in the optical object being formed.

(光照射裝置) 光照射裝置50設於圖14中之液槽12之下側,並通過具有透光性之液槽12之底部向載台14之底面側照射光。又,第3實施態樣中,例示面曝光方法亦即DLP方法之光造形之情況,但本發明之光造形不限於DLP方法。 (Light irradiation device) The light irradiation device 50 is disposed below the liquid tank 12 in FIG. 14 and irradiates light to the bottom side of the carrier 14 through the bottom of the light-transmitting liquid tank 12. In addition, in the third embodiment, the surface exposure method, i.e., the light forming of the DLP method, is exemplified, but the light forming of the present invention is not limited to the DLP method.

又,本發明中,光照射裝置與液槽,可沿著造形形成面19之面方向相對移動。例如,可使光照射裝置在平行於曝光面之面內進行二維移動,而進行光掃描。Furthermore, in the present invention, the light irradiation device and the liquid tank can move relatively along the surface direction of the molding surface 19 . For example, the light irradiation device can be moved two-dimensionally in a plane parallel to the exposure surface to perform light scanning.

光照射裝置50具備光源裝置54及配置於光源裝置54與液槽12之間的光學元件56。光源裝置54與光學元件56透過密封盒58而一體化。在光造形物之製造時,將預先作成之造形用影像資料輸入光照射裝置50。The light irradiation device 50 includes a light source device 54 and an optical element 56 arranged between the light source device 54 and the liquid tank 12 . The light source device 54 and the optical element 56 are integrated through the sealing box 58 . When manufacturing a photo-shaped object, preliminarily created image data for modeling is input to the light irradiation device 50 .

光照射裝置50與第1實施態樣之光照射裝置20之情況相同,基於輸入之造形用影像資料,透過未圖式之發光元件,向浸漬於液槽12內之載台14之下側,選擇性地照射光造形所需之既定波長之光。The light irradiation device 50 is the same as the light irradiation device 20 of the first embodiment. Based on the input image data for forming, the light of a predetermined wavelength required for light forming is selectively irradiated to the lower side of the carrier 14 immersed in the liquid tank 12 through a light-emitting element not shown.

(光源裝置) 光源裝置54具有由複數之單一畫素53形成之投影面55。光源裝置54從投影面55投影出欲造形之光造形物31之面積的N倍之造形用影像。N係大於1之正實數,亦即N>1。面積之擴大例如可透過分別將使用之複數之畫素之面積擴大而實現,或者,可透過增加使用之複數之畫素之個數而實現。又,亦可組合使用之單一畫素之面積之擴大及個數之增加。 (light source device) The light source device 54 has a projection surface 55 formed by a plurality of single pixels 53 . The light source device 54 projects a shaping image that is N times the area of the light sculpture 31 to be shaped from the projection surface 55 . N is a positive real number greater than 1, that is, N>1. The expansion of the area can be achieved, for example, by respectively expanding the areas of the plurality of pixels used, or by increasing the number of the plurality of pixels used. In addition, the area and number of single pixels that can be used in combination can also be expanded.

圖14中,例示包含於光源裝置24之複數之單一畫素53在密封盒58之底部58A之上沿著X方向(亦即,圖14中之左右方向)配置之狀態。又,圖14中,為易於辨識,以虛線箭頭例示僅有複數之單一畫素53之中的一部分發光之狀態。但,實際之光造形時,係以使對應於期望之造形用影像之單一畫素53適當發光之方式控制光源裝置24。光源裝置24從複數之單一畫素53一起放射出光。FIG. 14 illustrates a state in which a plurality of single pixels 53 included in the light source device 24 are arranged along the X direction (ie, the left-right direction in FIG. 14 ) on the bottom 58A of the sealed box 58 . In addition, in FIG. 14 , for easy recognition, a dotted arrow is used to illustrate a state in which only a part of the plurality of single pixels 53 emits light. However, during actual light shaping, the light source device 24 is controlled so that a single pixel 53 corresponding to a desired shaping image emits light appropriately. The light source device 24 emits light from a plurality of single pixels 53 together.

(單一畫素) 第3實施態樣之單一畫素53,具有配置於未圖式之基板之上之發光元件。又,複數之發光元件中的各個,在基板之上被未圖式之密封材密封於由未圖式之區隔壁包圍四周之區域之內側。第3實施態樣中,單一畫素53在俯視下係正方形狀。區隔壁中與基板為相反側之圖14中之上側,設有未圖式之保護層。 (Single pixel) The single pixel 53 of the third embodiment has a light-emitting element arranged on an unpatterned substrate. In addition, each of the plurality of light-emitting elements is sealed by an unpatterned sealing material on the substrate inside a region surrounded by unpatterned partition walls. In the third embodiment, the single pixel 53 is square in a plan view. An unpatterned protective layer is provided on the upper side of the partition wall in FIG. 14 which is the opposite side to the substrate.

(區隔壁) 雖未圖示,區隔壁分別沿著圖14中之X方向及沿著貫穿圖14之紙面之方向延伸之Y方向設置複數。故,在俯視下,X方向之區隔壁與Y方向之區隔壁呈現格子狀。雖未圖示,圖14中之區隔壁之上設有保護層。 (Partition walls) Although not shown, multiple partition walls are provided along the X direction in FIG. 14 and along the Y direction extending through the paper surface of FIG. 14. Therefore, in a top view, the partition walls in the X direction and the partition walls in the Y direction appear in a lattice shape. Although not shown, a protective layer is provided on the partition walls in FIG. 14.

發光元件之發光波長例如可在紫外線區域亦即約365nm至紅外線區域亦即約1770nm之範圍內任意設定。例如,發光元件為次毫米LED或微LED時,可照射365nm之紫外線區域之光。The wavelength of light emitted by the light emitting element can be set arbitrarily within the range of about 365 nm in the ultraviolet region to about 1770 nm in the infrared region. For example, when the light emitting element is a sub-millimeter LED or a micro LED, light in the ultraviolet region of 365 nm can be irradiated.

此處,光硬化性樹脂之透明度較高時,以紫外線區域以外之其他波長之光可能無法產生充分的硬化反應。紫外線區域之波長之光,在即使光硬化性樹脂之透明度較高仍容易使光硬化性樹脂硬化之點上有利。Here, when the transparency of the photocurable resin is high, sufficient curing reaction may not occur with light of wavelengths other than the ultraviolet range. Light with a wavelength in the ultraviolet range is advantageous in that it is easy to harden the photocurable resin even if the transparency of the photocurable resin is high.

(光學元件) 如圖14所示,第3實施態樣中,光學元件56在液槽12之下側配置於光源裝置24與液槽12之間。又,本發明中,光學元件亦可配置於液槽12之上側。 (Optical element) As shown in FIG. 14 , in the third embodiment, the optical element 56 is disposed between the light source device 24 and the liquid tank 12 at the lower side of the liquid tank 12. In addition, in the present invention, the optical element may also be disposed at the upper side of the liquid tank 12.

(縮小投影光學零件) 光學元件56具有光造形裝置用之縮小投影光學零件57。縮小投影光學零件57具備密封盒58、第一光集束構件57A、第二光集束構件57B及光軸修正構件57C。縮小投影光學零件57將造形用影像41之光集束。 (Reduced projection optical component) The optical element 56 has a reduced projection optical component 57 for a light shaping device. The reduced projection optical component 57 has a sealing box 58, a first light focusing component 57A, a second light focusing component 57B, and an optical axis correction component 57C. The reduced projection optical component 57 focuses the light of the shaping image 41.

縮小投影光學零件57配置在光源裝置24之投影面55與液槽12之底面之間。縮小投影光學零件57將具有光造形物31之面積的N倍(其中N>1)之面積之造形用影像,以將該造形用影像之面積縮小至1/M(其中M>1)之狀態投影至液槽12內之造形形成面19。第3實施態樣中,N係3以上且M係3以上。亦即,造形用影像之面積設定為3倍以上,且縮小投影光學零件57之縮小率設定為1/3以下。The reduction projection optical component 57 is arranged between the projection surface 55 of the light source device 24 and the bottom surface of the liquid tank 12 . The reduction projection optical component 57 reduces the area of the modeling image to N times the area of the light modeling object 31 (where N > 1), so that the area of the modeling image is reduced to 1/M (where M > 1). It is projected onto the shaping surface 19 in the liquid tank 12 . In the third embodiment, N is 3 or more and M is 3 or more. That is, the area of the modeling image is set to 3 times or more, and the reduction ratio of the reduction projection optical component 57 is set to 1/3 or less.

故,第3實施態樣中,相較於不改變光造形物31之造形用影像之面積而直接以原面積亦即1倍之面積投影之情況,可將光能密度提升至9倍以上。又,從提升光能密度之觀點而言,縮小率較佳為1/4以下。又,從提升光能密度之觀點而言,縮小率更佳為1/5以下。Therefore, in the third embodiment, compared with the case where the area of the image for forming the light forming object 31 is not changed and the original area, i.e., 1 times the area, is directly projected, the light energy density can be increased to more than 9 times. In addition, from the perspective of increasing the light energy density, the reduction ratio is preferably 1/4 or less. In addition, from the perspective of increasing the light energy density, the reduction ratio is more preferably 1/5 or less.

另一方面,若縮小率超過1/3,較不易得到光能密度之提升效果。又,本發明中,縮小投影光學零件對於造形用影像之縮小率係任意。亦即,本發明中,大於1之N之數值可小於3。On the other hand, if the reduction ratio exceeds 1/3, it is difficult to obtain the effect of increasing the light energy density. In addition, in the present invention, the reduction ratio of the reduced projection optical component to the image for shaping is arbitrary. That is, in the present invention, the value of N greater than 1 can be less than 3.

又,本發明中,N與M可相同,或者亦可相異。又,亦可係N<M,例如N=3且M=4。N<M之情況,縮小投影至形成區域之造形用影像之面積,比面積擴大前之最初的光造形物之面積亦即目標面積小。換言之,本發明中,造形區域中之曝光像之造形用影像之面積可小於最初之目標面積。In addition, in the present invention, N and M may be the same or different. In addition, N<M may also be satisfied, for example, N=3 and M=4. In the case of N<M, the area of the modeling image that is reduced and projected onto the formation area is smaller than the area of the initial light modeling object before area expansion, that is, the target area. In other words, in the present invention, the area of the sculpting image of the exposed image in the sculpting area can be smaller than the initial target area.

N<M之情況,造形用影像中每單位面積之單一畫素之個數亦即畫素密度相較於M≦N之情況增加。又,本說明書中,「畫素密度」表示包含於在投影面中以互相直交的2軸定義各邊之正方形狀區域且一邊之長度為1英吋之單位區域中的發光元件之單一畫素之個數。When N < M, the number of single pixels per unit area in the image for shaping, i.e., the pixel density, increases compared to the case of M ≦ N. In addition, in this specification, "pixel density" means the number of single pixels of the light-emitting element contained in a unit area of a square area whose sides are defined by two mutually orthogonal axes on the projection plane and the length of one side is 1 inch.

(密封盒) 在密封盒58之內側,分別密封第一光集束構件57A、第二光集束構件57B及光軸修正構件57C。密封盒58例如可由樹脂等製作。密封盒58具有底部58A、周壁部58B及頂蓋部58C。頂蓋部58C具有透光性。 (sealed box) Inside the sealing box 58, the first light focusing member 57A, the second light focusing member 57B and the optical axis correction member 57C are sealed respectively. The sealing box 58 can be made of resin, for example. The sealed box 58 has a bottom portion 58A, a peripheral wall portion 58B, and a top cover portion 58C. The top cover part 58C has translucency.

周壁部58B之形狀,在可將構成縮小投影光學零件57之構件一體化地密封於內側之條件下,可適當變更。例如,第一光集束構件57A之側壁可作為密封盒58之周壁部58B的一部分使用。或者,第一光集束構件57A之底部58A可作為密封盒58之底部的一部分或全部使用。亦即,本發明中,密封盒並非必須。The shape of the peripheral wall portion 58B can be appropriately changed under the condition that the members constituting the reduction projection optical component 57 can be integrally sealed inside. For example, the side wall of the first light condensing member 57A may be used as a part of the peripheral wall portion 58B of the sealing box 58 . Alternatively, the bottom 58A of the first light focusing member 57A may be used as part or all of the bottom of the sealing box 58 . That is, in the present invention, the sealed box is not essential.

(第一光集束構件) 第一光集束構件57A配置在密封盒58之內側中夾著頂蓋部58C且與液槽12為相反側之光源裝置24之側。第3實施態樣之第一光集束構件57A例如係凹型之集束透鏡。又,本發明中,第一光集束構件57A不限於集束透鏡。本發明中,具有透光性且可將造形用影像41之光集束之其他構件或裝置亦可作為第一光集束構件採用。 (First light focusing component) The first light focusing component 57A is disposed on the side of the light source device 24 on the opposite side of the liquid tank 12 and sandwiching the top cover 58C in the inner side of the sealing box 58. The first light focusing component 57A of the third embodiment is, for example, a concave focusing lens. In addition, in the present invention, the first light focusing component 57A is not limited to a focusing lens. In the present invention, other components or devices that are light-transmissive and can focus the light of the image 41 for forming can also be used as the first light focusing component.

(第二光集束構件) 第二光集束構件57B配置在第一光集束構件57A與光軸修正構件57C之間。第3實施態樣之第二光集束構件57B具備折射率大於空氣之折射率之第二光集束構件57B。又,本發明中,第二光集束構件之折射率亦可在空氣之折射率以下。又,本發明中,第二光集束構件並非必須。 (Second light condensing member) The second light focusing member 57B is arranged between the first light focusing member 57A and the optical axis correction member 57C. The second light focusing member 57B of the third embodiment has a refractive index greater than that of air. Furthermore, in the present invention, the refractive index of the second light condensing member may be lower than the refractive index of air. In addition, in the present invention, the second light condensing member is not essential.

第3實施態樣之第二光集束構件57B例如係丙烯系或環氧系之硬化素材亦即固體之素材。第二光集束構件57B具有與第一光集束構件57A之折射率相異之折射率。第二光集束構件57B之折射率例如約1.5。又,本發明中,第二光集束構件57B不限於丙烯系之硬化素材。本發明中,具有透光性且可將造形用影像之光集束之其他構件或裝置亦可作為第二光集束構件採用。The second light concentrating member 57B of the third embodiment is, for example, an acrylic or epoxy hardened material, that is, a solid material. The second light focusing member 57B has a refractive index different from that of the first light focusing member 57A. The refractive index of the second light focusing member 57B is about 1.5, for example. Furthermore, in the present invention, the second light condensing member 57B is not limited to the acrylic cured material. In the present invention, other members or devices that are light-transmissive and can concentrate the light for forming images can also be used as the second light-concentrating member.

又,本發明中,第二光集束構件57B可係固體,或者,亦可係不具有光硬化性之液體。本發明中,作為第二光集束構件57B,例如可採用純水、滑油、二碘甲烷(CH 2I 2)、有機鹵化物、丙烯系硬化材料等。丙烯系硬化材料在一般而言容易入手且較易於處理之點上有利。 Furthermore, in the present invention, the second light condensing member 57B may be solid, or may be a liquid without photocurability. In the present invention, as the second light condensing member 57B, for example, pure water, lubricating oil, diiodomethane (CH 2 I 2 ), organic halide, acryl-based hardening material, etc. can be used. Acrylic hardened materials are advantageous in that they are generally easy to obtain and relatively easy to handle.

第3實施態樣中,第一光集束構件57A與第二光集束構件57B在密封盒58之內側密合。故,相較於第一光集束構件57A與第二光集束構件57B不密合而在第一光集束構件57A與第二光集束構件57B之間形成間隙之情況,可減低對於光之折射率之影響。又,本發明中,第一光集束構件57A與第二光集束構件57B之密合並非必須。In the third embodiment, the first light focusing member 57A and the second light focusing member 57B are closely connected inside the sealing box 58 . Therefore, compared with the case where the first light focusing member 57A and the second light focusing member 57B are not in close contact and a gap is formed between the first light focusing member 57A and the second light focusing member 57B, the refractive index for light can be reduced. the influence. Furthermore, in the present invention, the close contact between the first light focusing member 57A and the second light focusing member 57B is not essential.

又,第3實施態樣中,例示第一光集束構件57A與第二光集束構件57B之雙方包含於縮小投影光學零件57之情況。但,本發明中,亦可僅由第一光集束構件57A與第二光集束構件57B之中的任一方構成縮小投影光學零件。In the third embodiment, the case where both the first light focusing member 57A and the second light focusing member 57B are included in the reduced projection optical component 57 is exemplified. However, in the present invention, the reduced projection optical component may be constituted by only one of the first light focusing member 57A and the second light focusing member 57B.

(光軸修正構件) 光軸修正構件57C修正從第二光集束構件57B輸入之光的光軸,以使由第一光集束構件57A集束之光的光軸沿著與形成區域18A之造形形成面19直交之方向。亦即,本發明中,集束之光的光軸不必與造形形成面19嚴格地直交。作為光軸修正構件57C,例如可使用凸透鏡等任意之光學裝置。又,本發明中,光軸修正構件並非必須。 (Optical axis correction member) The optical axis correction member 57C corrects the optical axis of the light input from the second light focusing member 57B so that the optical axis of the light concentrated by the first light focusing member 57A is along the direction perpendicular to the shaping surface 19 of the formation region 18A. That is, in the present invention, the optical axis of the concentrated light does not have to be strictly orthogonal to the shaping surface 19 . As the optical axis correction member 57C, for example, any optical device such as a convex lens can be used. In addition, in the present invention, the optical axis correction member is not essential.

又,第3實施態樣中,例示第一光集束構件57A與光軸修正構件57C彼此係不同構件之情況,但本發明中,第一光集束構件與光軸修正構件亦可由1個構件構成。Furthermore, in the third embodiment, the first light focusing member 57A and the optical axis correcting member 57C are exemplified as different members. However, in the present invention, the first light focusing member and the optical axis correcting member may also be composed of one member. .

<光造形物之製造方法> (光造形之概要) 接著,參照圖14、圖16~圖19,說明依第3實施態樣之光造形物之製造方法。首先,例如透過CAM軟體等造形用影像資料作成裝置,在光造形之前預先作成光造形物31之面積的N倍之造形用影像資料40A。作成之造形用影像資料40A輸入至光造形裝置11。 <Production method of optically formed objects> (Overview of optical forming) Next, referring to FIG. 14 and FIG. 16 to FIG. 19, the production method of optically formed objects according to the third embodiment is described. First, before optical forming, image data 40A for forming N times the area of the optically formed object 31 is prepared in advance by a forming image data preparation device such as CAM software. The prepared forming image data 40A is input to the optical forming device 11.

如圖14所示,與第1實施態樣之情況相同,透過光照射裝置50之光照射,在包含載台14下側之光硬化性樹脂18之液面且具有固定厚度之形成區域18A,透過光聚合將光硬化性樹脂18選擇性硬化。其結果,形成光造形物之樹脂硬化層。然後,藉由使垂吊構件16向圖14中之上側移動,使載台14以設定之樹脂硬化層之厚度之量上升。又,與第1實施態樣之情況相同,載台14上升後,利用光照射裝置50照射光,而在先前形成之樹脂硬化層之下積層後續之樹脂硬化層。As shown in FIG. 14 , similarly to the first embodiment, the light irradiation device 50 selectively hardens the photocurable resin 18 by photopolymerization in the formation area 18A having a fixed thickness and a liquid surface of the photocurable resin 18 on the lower side of the carrier 14. As a result, a resin hardening layer of the photo-shaped object is formed. Then, by moving the hanging member 16 to the upper side in FIG. 14 , the carrier 14 is raised by the set thickness of the resin hardening layer. Again, similarly to the first embodiment, after the carrier 14 is raised, the light irradiation device 50 is used to irradiate light, and a subsequent resin hardening layer is deposited under the previously formed resin hardening layer.

(樹脂硬化層之形成) 接著,具體說明第3實施態樣之光造形中的各樹脂硬化層之形成。如圖17所示,將第一樹脂硬化層31A光造形時,造形用影像資料40A之面積(換言之,外形之尺寸)與從光源裝置24之投影面55投影之造形用影像41A之面積大致相同。 (Formation of resin hardened layer) Next, the formation of each resin cured layer in the optical modeling of the third embodiment will be described in detail. As shown in FIG. 17 , when the first resin hardened layer 31A is photo-shaped, the area of the modeling image data 40A (in other words, the size of the outer shape) is substantially the same as the area of the modeling image 41A projected from the projection surface 55 of the light source device 24 .

另一方面,蓄積有光硬化性樹脂18之液槽12內之造形形成面19之上的造形用影像42A之面積,透過利用縮小投影光學零件57之縮小投影,相較於投影面55上之面積縮小至1/N。亦即,第3實施態樣中,例示說明縮小率與擴大率相等亦即M=N時之情況。又,本發明中,縮小率不限於M=N之情況。亦即,造形用影像之面積可縮小至1/M(其中N≠M)。On the other hand, the area of the molding image 42A on the molding surface 19 in the liquid tank 12 in which the photocurable resin 18 is stored is reduced by the reduction projection using the reduction projection optical component 57, compared to the area on the projection surface 55. The area is reduced to 1/N. That is, in the third embodiment, the case where the reduction ratio and the expansion ratio are equal, that is, M=N, is exemplified. In addition, in the present invention, the reduction ratio is not limited to the case of M=N. That is, the area of the image for modeling can be reduced to 1/M (where N≠M).

接著,如圖18所示,在對積層於第一樹脂硬化層31A之上之第二樹脂硬化層31B進行光造形時,造形用影像資料40B之面積與從光源裝置24之投影面55投影之造形用影像41B之面積亦大致相同。另一方面,蓄積有光硬化性樹脂18之液槽12內之造形形成面19之上的造形用影像42B之面積,透過利用縮小投影光學零件57之縮小投影,相較於投影面55上之面積縮小至1/N。Next, as shown in FIG. 18 , when the second resin cured layer 31B laminated on the first resin cured layer 31A is photo-shaped, the area of the modeling image data 40B is the same as the area projected from the projection surface 55 of the light source device 24 The area of the modeling image 41B is also approximately the same. On the other hand, the area of the molding image 42B on the molding surface 19 in the liquid tank 12 in which the photocurable resin 18 is stored is reduced by the reduction projection using the reduction projection optical component 57, compared to the area on the projection surface 55. The area is reduced to 1/N.

如圖17及圖18所示,第3實施態樣中,後續之第二樹脂硬化層31B之圖案與在前之第一樹脂硬化層31A之圖案相異。在圖19中,例示積層了具有固定厚度之第一樹脂硬化層31A及具有固定厚度之第二樹脂硬化層31B之光造形物的一部分。As shown in FIGS. 17 and 18 , in the third embodiment, the pattern of the subsequent second resin cured layer 31B is different from the pattern of the preceding first resin cured layer 31A. In FIG. 19 , a part of the photo-sculpture in which the first resin cured layer 31A having a fixed thickness and the second resin cured layer 31B having a fixed thickness are laminated is illustrated.

透過包含縮小投影之上述一系列步驟,構成依第3實施態樣之利用光造形裝置11之光造形物之製造方法。又,圖17~圖19中之樹脂硬化層之形狀係例示,本發明中,樹脂硬化層之形狀係任意而不限於此。又,第3實施態樣之圖16中之支持銷32,如第1實施態樣中之說明,在本發明中並非必須。Through the above-mentioned series of steps including reducing the projection, a method for manufacturing a light-shaped object using the light-shaping device 11 according to the third embodiment is constructed. In addition, the shape of the resin cured layer in FIGS. 17 to 19 is an illustration. In the present invention, the shape of the resin cured layer is arbitrary and is not limited thereto. In addition, the support pin 32 in FIG. 16 of the third embodiment is not essential in the present invention as described in the first embodiment.

又,如第1實施態樣中之說明,本發明中,例如亦可採用在將光造形物支持於圖14中之載台14之上側之狀態下使載台14向液槽12之中下降,藉此將樹脂硬化層積層於上下方向之方式。但,如第1實施態樣中之說明,使載台14向液槽12之中下降而將樹脂硬化層積層於上下方向時,氧會使光硬化性樹脂18不易硬化。In addition, as described in the first embodiment, in the present invention, for example, the stage 14 can be lowered into the liquid tank 12 while the photo-shaped object is supported on the upper side of the stage 14 in FIG. 14 , whereby the resin cured layer is laminated in the up and down direction. However, as described in the first embodiment, when the stage 14 is lowered into the liquid tank 12 and the resin cured layer is laminated in the up and down direction, oxygen will make it difficult for the photocurable resin 18 to harden.

另一方面,如第3實施態樣,使載台14上升而將樹脂硬化層積層於上下方向時,與第1實施態樣之情況相同,載台14將空氣遮蔽,故形成區域18A之光硬化性樹脂18不會接觸空氣中之氧。On the other hand, as in the third embodiment, when the stage 14 is raised and the resin cured layer is laminated in the up and down direction, the stage 14 blocks the air, so that the light in the area 18A is formed, as in the first embodiment. The curable resin 18 does not come into contact with oxygen in the air.

(作用效果) 第3實施態樣中,從光源裝置24之投影面55投影具有光造形物31之面積之N倍之面積之造形用影像41A、41B。故,相較於從光源裝置之投影面投影具有光造形物31之面積之1倍之面積之造形用影像之裝置,所使用之單一畫素53之個數增加至N倍。並且,第3實施態樣中,透過縮小投影光學零件57,將造形用影像41A、41B之面積縮小至1/N並投影至液槽12內之造形形成面19。 (Effect) In the third embodiment, modeling images 41A and 41B having an area N times the area of the light modeling object 31 are projected from the projection surface 55 of the light source device 24 . Therefore, compared to a device that projects a shaping image with an area that is twice the area of the light sculpture 31 from the projection surface of the light source device, the number of single pixels 53 used is increased to N times. Furthermore, in the third embodiment, by reducing the projection optical component 57 , the areas of the modeling images 41A and 41B are reduced to 1/N and projected onto the modeling forming surface 19 in the liquid tank 12 .

故,相較於將具有光造形物31之面積之1倍之面積之造形用影像直接投影至液槽12內之造形形成面19之情況,可提升作為造形區域之形成區域18A中之光能密度。其結果,可改善光之利用效率。Therefore, compared with the case where a patterning image having an area twice the area of the optical patterning object 31 is directly projected onto the patterning forming surface 19 in the liquid tank 12, the light energy density in the patterning area 18A as the patterning area can be increased. As a result, the light utilization efficiency can be improved.

又,液槽12內之造形形成面19中的造形用影像41A、41B之畫素密度為n倍時,光能密度增加為n的平方(n 2)倍。其結果,可提升光造形之造形速度。 Furthermore, when the pixel density of the patterning images 41A and 41B on the patterning forming surface 19 in the liquid tank 12 is increased by n times, the light energy density increases by n squared (n 2 ) times. As a result, the patterning speed of the light patterning can be increased.

又,光造形之對象物例如係人用牙科造形物時,就一般口腔之尺寸而言,作為造形區域之形成區域通常需要對角線長度約5.6英吋(亦即約70mm×124mm)之矩形狀造形形成面。此處,例如SLA(Stereo lithography,立體光造形)方法般,準備可形成具有實際約50μm之細小畫素間距之曝光用光之光源裝置時,為實現細小之畫素間距,例如可能增設微反射鏡等追加構件。故,裝置之構成複雜化,其結果容易使成本提高。Furthermore, when the object of optical shaping is, for example, a dental object for a human, the shaping area generally requires a rectangular shaping surface with a diagonal length of about 5.6 inches (i.e., about 70 mm×124 mm) in terms of the size of a general oral cavity. Here, when preparing a light source device that can form exposure light with an actual fine pixel pitch of about 50 μm, such as the SLA (Stereo lithography) method, additional components such as micro-reflectors may be added to achieve a fine pixel pitch. Therefore, the structure of the device becomes complicated, which results in an increase in cost.

另一方面,第3實施態樣中,將光源裝置24之投光面之造形用影像之面積擴大至N倍。故,例如在光源裝置24中之投影面55之尺寸為約25英吋且實際之畫素間距為約250μm,但在縮小後之造形用影像42中,對於對角線長度約5.6英吋之形成區域,仍可得到約50μm之畫素間距。其結果,無須增設追加構件等,並且可將具有較大面積之單一畫素作為單位畫素使用,故可更低價地構成裝置。故,依第3實施態樣之光造形裝置11適用於牙科造形物之光造形。On the other hand, in the third embodiment, the area of the shaping image on the projection surface of the light source device 24 is enlarged to N times. Therefore, for example, the size of the projection surface 55 in the light source device 24 is about 25 inches and the actual pixel pitch is about 250 μm, but in the reduced shaping image 42, for the formation area with a diagonal length of about 5.6 inches, a pixel pitch of about 50 μm can still be obtained. As a result, there is no need to add additional components, etc., and a single pixel with a larger area can be used as a unit pixel, so the device can be constructed at a lower price. Therefore, the optical shaping device 11 according to the third embodiment is suitable for optical shaping of dental shapes.

又,第3實施態樣中,亦可增加投影出面積擴大至N倍之造形用影像41A、41B之複數之單一畫素之個數。隨著投影出造形用影像41A、41B之複數之單一畫素之個數增加,可更加提升造形形成面19之上之造形用影像42A、42B之畫素密度。Furthermore, in the third embodiment, the number of single pixels that project the modeling images 41A and 41B whose area is expanded to N times may be increased. As the number of single pixels that project the shaping images 41A and 41B increases, the pixel density of the shaping images 42A and 42B on the shaping forming surface 19 can be further increased.

又,第3實施態樣中,透過第一光集束構件57A,可將造形用影像41A、41B之面積縮小至1/N。又,透過光軸修正構件57C,可將光之光軸向直交於造形形成面19之方向修正。Furthermore, in the third embodiment, the area of the modeling images 41A and 41B can be reduced to 1/N through the first light condensing member 57A. In addition, the optical axis of the light can be corrected in a direction perpendicular to the molding surface 19 through the optical axis correcting member 57C.

又,第3實施態樣中,透過第一光集束構件57A與第二光集束構件57B之2個光集束構件之組合,形成縮小投影光學零件57整體之折射率。故,相較於縮小投影光學零件57僅具有1個第一光集束構件57A之情況,更容易調整縮小投影光學零件57整體之折射率。又,相較於縮小投影光學零件57僅具有1個第一光集束構件57A之情況,面積縮小後之造形用影像41A、41B不易變形。Furthermore, in the third embodiment, the refractive index of the entire projection optical component 57 is reduced by a combination of two light focusing members, the first light focusing member 57A and the second light focusing member 57B. Therefore, compared with the case where the reduction projection optical component 57 has only one first light focusing member 57A, it is easier to adjust the refractive index of the entire reduction projection optical component 57 . In addition, compared with the case where the reduced projection optical component 57 has only one first light concentrating member 57A, the modeling images 41A and 41B with reduced area are less likely to be deformed.

又,第3實施態樣中,擴大率及縮小率之N之值係3以上,故例如即使係N為3以上之量產品之發光元件之LED,亦可提升光能密度。Furthermore, in the third embodiment, the value of N of the expansion ratio and the reduction ratio is greater than 3, so even if the value of N is greater than 3 for a mass-produced light-emitting element LED, the light energy density can be improved.

又,第3實施態樣中,使載台14上升而將樹脂硬化層積層於上下方向,故相較於使載台14向液槽12之中下降之情況,可減低形成具有1層之厚度之樹脂硬化層所需之能量。第3實施態樣之其他作用效果與第1實施態樣及第2實施態樣相同,故省略重複說明。Furthermore, in the third embodiment, the stage 14 is raised to stack the resin cured layer in the up and down direction. Therefore, compared with the case where the stage 14 is lowered into the liquid tank 12, the thickness of one layer can be reduced. The energy required for the resin hardened layer. Other functions and effects of the third implementation aspect are the same as those of the first implementation aspect and the second implementation aspect, so repeated descriptions are omitted.

(第5變形例) 例如,本發明中,光造形裝置中之光學元件56可相對於造形形成面19旋轉。如圖20所示,依第5變形例之光造形裝置11A,具有使包含光學元件56之光照射裝置50旋轉之旋轉支持部34。又,旋轉支持部34不僅可在沿著圖20中之左右方向延伸之X方向上旋轉,亦可在沿著貫穿圖20之紙面之方向延伸之Y方向上旋轉。 (Fifth variant) For example, in the present invention, the optical element 56 in the light forming device can rotate relative to the forming surface 19. As shown in FIG20, the light forming device 11A according to the fifth variant has a rotating support portion 34 for rotating the light irradiation device 50 including the optical element 56. In addition, the rotating support portion 34 can rotate not only in the X direction extending along the left-right direction in FIG20, but also in the Y direction extending along the direction passing through the paper surface of FIG20.

又,第3實施態樣中,例示包含光源裝置24及光學元件56之光照射裝置50整體受到旋轉支持部34支持之情況,但本發明不限於此,亦可僅對於光學元件56以可旋轉之狀態支持。依第5變形例之光造形裝置11A之其他構成,與依第3實施態樣之光造形裝置11相同,故省略重複說明。In the third embodiment, the light irradiation device 50 including the light source device 24 and the optical element 56 is supported by the rotation support portion 34 as a whole, but the present invention is not limited thereto, and only the optical element 56 may be supported in a rotatable state. The other components of the light shaping device 11A according to the fifth variation are the same as those of the light shaping device 11 according to the third embodiment, and thus repeated descriptions are omitted.

在第5變形例中,與第3實施態樣相同,亦可提升光造形之光能密度。再者,藉由光照射裝置50旋轉,例如相較於光照射裝置50僅照射直交於造形形成面19之光之情況,可擴大光之照射範圍。第5變形例之其他作用效果與第3實施態樣相同,故省略重複說明。In the fifth variation, the light energy density of the light shaping can be increased as in the third embodiment. Furthermore, by rotating the light irradiation device 50, for example, the irradiation range of the light can be expanded compared to the case where the light irradiation device 50 irradiates only the light perpendicular to the shaping forming surface 19. The other effects of the fifth variation are the same as those of the third embodiment, so repeated descriptions are omitted.

(對於其他光造形方法之適用) 又,第3實施態樣中,例示透過DLP方法實現光造形之情況,但本發明不限於DLP方法,例如亦可適用於LCD(Liquid Crystal Display,液晶顯示)方法及微LED方法等其他方法。 (Applicability to other light shaping methods) In the third embodiment, the case of implementing light shaping through the DLP method is exemplified, but the present invention is not limited to the DLP method, and can also be applied to other methods such as the LCD (Liquid Crystal Display) method and the micro LED method.

此處,DLP方法通常要求構成光照射裝置之構件具有較高之耐久性,以承受較高之光能。故,易使成本提高。另一方面,將造形形成面上之造形用影像相較於從投影面投影出之造形用影像收縮之本發明中,無須將光照射裝置之耐久性提高至DLP方法之程度。故,例如可藉由組合本發明與LCD方法及微LED方法,抑制光造形裝置之成本。Here, the DLP method generally requires the components constituting the light irradiation device to have higher durability to withstand higher light energy. Therefore, it is easy to increase the cost. On the other hand, in the present invention in which the modeling image on the modeling forming surface is shrunk compared to the modeling image projected from the projection surface, there is no need to improve the durability of the light irradiation device to the level of the DLP method. Therefore, for example, the cost of the light shaping device can be suppressed by combining the present invention with the LCD method and the micro-LED method.

特別係一般的LCD方法之光造形裝置中,來自光源之穿透率損失較大,故有無法得到光造形所需之光能之情況。例如,一般的LCD方法中,光能密度有停留在約2mJ/cm 2之情況。另一方面,DLP方法可實現約16mJ/cm 2之光能密度。 Especially in the light shaping device using the general LCD method, the transmittance loss from the light source is large, so the light energy required for light shaping may not be obtained. For example, in a general LCD method, the light energy density may stay at about 2mJ/cm 2 . On the other hand, the DLP method can achieve a light energy density of approximately 16mJ/ cm2 .

故,藉由在一般的LCD方法之光造形裝置中組合將造形形成面上之造形用影像相較於從投影面投影出之造形用影像收縮之本發明,可得到DLP方法之同等以上之光照射強度。例如,縮小率為1/2.8時,亦即,得到約8倍之面積比時,假設不產生光損失,則與DLP方法同樣可得到約16mJ/cm 2之光能密度。 Therefore, by combining the present invention that shrinks the image for shaping on the shaping surface compared to the image for shaping projected from the projection surface with the light shaping device of the general LCD method, the light irradiation intensity equal to or higher than that of the DLP method can be obtained. For example, when the reduction ratio is 1/2.8, that is, when the area ratio is about 8 times, assuming that no light loss occurs, the light energy density of about 16mJ/ cm2 can be obtained, which is the same as the DLP method.

<其他實施態樣> 本發明已由上述實施態樣進行說明,但本發明不受到構成上述內容之一部分之論述及圖式限定。本發明所屬領域中具通常知識者應可從本發明思及各種代替實施態樣、實施例及運用技術。 <Other implementation forms> The present invention has been described based on the above-mentioned embodiments, but the present invention is not limited by the discussion and drawings that form part of the above content. A person of ordinary skill in the art to which this invention pertains should be able to contemplate various alternative implementations, examples, and application techniques from this invention.

例如,可將圖1~圖20中例示之構成部分組合而構成本發明。如上所述,本發明包含上述未記載之各種實施態樣等,並且本發明之技術範圍僅從上述說明受到適當之申請專利範圍之發明必要技術特徵限定。For example, the present invention can be constituted by combining the components illustrated in Figures 1 to 20. As described above, the present invention includes various embodiments not described above, and the technical scope of the present invention is limited only by the essential technical features of the invention in the appropriate patent application scope from the above description.

本說明書中參照而援用2022年3月28日提出申請之日本專利申請2022-052538號及2023年2月24日提出申請之日本專利申請2023-027677號之全部內容。The entire contents of Japanese Patent Application No. 2022-052538 filed on March 28, 2022 and Japanese Patent Application No. 2023-027677 filed on February 24, 2023 are incorporated by reference in this specification.

本說明書中記載之所有文獻、專利申請案及技術標準係和具體且個別記載引用各個文獻、專利申請案及技術標準作為參照時為相同程度地引用於本說明書中作為參照。All documents, patent applications, and technical standards described in this specification are incorporated by reference into this specification to the same extent as if each individual document, patent application, or technical standard was cited by reference specifically and individually.

10:光造形裝置 11,11A:光造形裝置 12:液槽 14:載台 16:垂吊構件 18:光硬化性樹脂 18A:形成區域 19:造形形成面 20:光照射裝置 22:框體 23:單一畫素 24:光源裝置 24A:基板 24B:區隔壁 24C:發光元件 24D:密封材 24E:保護層 26:光學元件 26A:基部 26B:微透鏡 30:光造形物 31:光造形物 31A:第一樹脂硬化層 31B:第二樹脂硬化層 32:支持銷 34:旋轉支持部 36:開關元件 38:光圈 38A:狹縫 40A,40B:造形用影像資料 41A,41B:造形用影像 42A,42B:造形用影像 50:光照射裝置 53:單一畫素 54:光源裝置 55:投影面 56:光學元件 57:縮小投影光學零件 57A:第一光集束構件 57B:第二光集束構件 57C:光軸修正構件 58:密封盒 58A:底部 58B:周壁部 58C:頂蓋部 C:光軸 D:直徑 RC:中央區域 RO:重疊區域 RP:周緣區域 W1:最大寬度 W2:寬度 W3:寬度 X1,X2:X電極構件 Y1,Y2:Y電極構件 10:Light shaping device 11,11A:Light shaping device 12:Liquid tank 14: Carrier platform 16: Hanging components 18: Photocurable resin 18A: Formation area 19: Shaping forming surface 20:Light irradiation device 22:Frame 23:Single pixel 24:Light source device 24A:Substrate 24B:Next door 24C:Light-emitting element 24D:Sealing material 24E:Protective layer 26:Optical components 26A:Base 26B: Microlens 30:Light sculpture 31:Light sculpture 31A: First resin hardened layer 31B: Second resin hardened layer 32: Support pin 34: Rotation support part 36: Switching element 38:Aperture 38A:Slit 40A, 40B: Image data for modeling 41A, 41B: Image for modeling 42A, 42B: Image for modeling 50:Light irradiation device 53:Single pixel 54:Light source device 55:Projection surface 56:Optical components 57: Reduction of projection optical parts 57A: First light focusing component 57B: Second light focusing member 57C: Optical axis correction component 58:Sealed box 58A: Bottom 58B: Peripheral wall 58C:Top cover C: Optical axis D: diameter RC: Central Region RO: overlapping area RP: peripheral area W1: maximum width W2: Width W3: Width X1,X2:X electrode components Y1, Y2: Y electrode components

圖1係剖切液槽之一部分及光照射裝置以說明依第1實施態樣之光造形裝置之正視圖。 圖2係說明依第1實施態樣之光照射裝置之光源裝置及光學元件之圖3中之2-2線剖面圖。 圖3係說明依第1實施態樣之光照射裝置之光源裝置及光學元件之俯視圖。 圖4A係說明設於與單一畫素對應之單位區域之光學元件為1個微透鏡時之光學元件之動作之圖。 圖4B係說明設於與單一畫素對應之單位區域之光學元件為複數之微透鏡時之光學元件之動作之圖。 圖5係說明依第1實施態樣之光照射裝置之開關元件之俯視圖。 圖6係剖切液槽之一部分及光照射裝置以說明利用依第1實施態樣之光造形裝置進行之光造形物之製造方法之圖。 圖7係說明依第1變形例之光照射裝置之光源裝置及光學元件之俯視圖。 圖8係說明依第2變形例之光照射裝置之光源裝置及光學元件之俯視圖。 圖9係說明依第3變形例之光照射裝置之光源裝置及光學元件之俯視圖。 圖10係說明依第3變形例之光照射裝置之光源裝置及光學元件之圖9中之10-10線剖面圖。 圖11係說明依第4變形例之光照射裝置之光源裝置及光學元件之俯視圖。 圖12係說明依第2實施態樣之光照射裝置之光源裝置及光學元件之俯視圖。 圖13係說明依第2實施態樣之光照射裝置之光源裝置及光學元件之圖12中之13-13線剖面圖。 圖14係剖切液槽之一部分及光照射裝置以說明依第3實施態樣之光造形裝置之正視圖。 圖15係說明依第3實施態樣之光照射裝置之光學元件之立體圖。 圖16係剖切液槽之一部分及光照射裝置以說明利用依第3實施態樣之光造形裝置進行之光造形物之製造方法之圖。 圖17係說明用以將第一樹脂硬化層光造形之影像資料、M=N時之光源裝置中之具有光造形物之面積的N倍之面積之造形用影像,以及在光學元件中面積被縮小至1/M之曝光像亦即造形用影像之圖。 圖18係說明用以將第二樹脂硬化層光造形之影像資料、M=N時之光源裝置中之具有光造形物之面積的N倍之面積之造形用影像,以及在光學元件中面積被縮小至1/N之曝光像亦即造形用影像之圖。 圖19係說明在光造形中積層了第一樹脂硬化層與第二樹脂硬化層之狀態之立體圖。 圖20係剖切液槽之一部分及光照射裝置以說明依第5變形例之光造形裝置之圖。 FIG. 1 is a front view of the light shaping device according to the first embodiment, with a portion of the liquid tank and the light irradiation device cut away. FIG. 2 is a cross-sectional view along line 2-2 in FIG. 3 illustrating the light source device and optical elements of the light irradiation device according to the first embodiment. FIG. 3 is a top view illustrating the light source device and optical elements of the light irradiation device according to the first embodiment. 4A is a diagram illustrating the operation of the optical element when the optical element provided in the unit area corresponding to a single pixel is one microlens. 4B is a diagram illustrating the operation of the optical element when the optical element provided in the unit area corresponding to a single pixel is a plurality of microlenses. FIG. 5 is a top view illustrating the switching element of the light irradiation device according to the first embodiment. 6 is a cross-sectional view of a part of the liquid tank and the light irradiation device to explain the method of manufacturing a photo-shaped object using the photo-shaping device according to the first embodiment. 7 is a top view illustrating the light source device and optical elements of the light irradiation device according to the first modification. 8 is a top view illustrating the light source device and optical elements of the light irradiation device according to the second modification. FIG. 9 is a top view illustrating the light source device and optical elements of the light irradiation device according to the third modification. FIG. 10 is a cross-sectional view along line 10-10 in FIG. 9 illustrating the light source device and optical elements of the light irradiation device according to the third modification. FIG. 11 is a top view illustrating the light source device and optical elements of the light irradiation device according to the fourth modification example. FIG. 12 is a top view illustrating the light source device and optical elements of the light irradiation device according to the second embodiment. FIG. 13 is a cross-sectional view along line 13-13 in FIG. 12 illustrating the light source device and optical elements of the light irradiation device according to the second embodiment. FIG. 14 is a front view showing a part of the liquid tank and the light irradiation device cut away to illustrate the light shaping device according to the third embodiment. FIG. 15 is a perspective view illustrating the optical elements of the light irradiation device according to the third embodiment. 16 is a cross-sectional view of a part of the liquid tank and the light irradiation device to explain the method of manufacturing a photo-shaped object using the photo-shaping device according to the third embodiment. 17 illustrates the image data used to photo-shape the first resin hardened layer, the shaping image having an area N times the area of the photo-shaped object in the light source device when M=N, and the optical element in which the area is The exposure image reduced to 1/M is the image used for modeling. 18 illustrates the image data used to photo-shape the second resin hardened layer, the shaping image having an area N times the area of the photo-shaped object in the light source device when M=N, and the area in the optical element being The exposure image reduced to 1/N is the image used for modeling. FIG. 19 is a perspective view illustrating a state in which a first resin cured layer and a second resin cured layer are laminated during photolithography. FIG. 20 is a cross-sectional view of a part of the liquid tank and the light irradiation device to illustrate the light shaping device according to the fifth modification.

10:光造形裝置 10: Light shaping device

12:液槽 12: Liquid tank

14:載台 14: Carrier

16:垂吊構件 16: Hanging components

18:光硬化性樹脂 18: Photocurable resin

18A:形成區域 18A: Formation area

19:造形形成面 19: Shaping forming surface

20:光照射裝置 20:Light irradiation device

22:框體 22: Frame

24:光源裝置 24:Light source device

26:光學元件 26:Optical components

Claims (14)

一種光造形裝置,包含: 液槽,蓄積液狀之光硬化性樹脂; 光源裝置,將包含區隔壁及容納於該區隔壁之中的發光元件之單一畫素複數配置成規律的矩陣狀,且該單一畫素之最大寬度在200μm以下; 光學元件,配置於該光源裝置與該液槽之間,利用從該單一畫素放射之光形成向該光硬化性樹脂照射之點狀光,並透過複數之該點狀光在該液槽內之形成區域形成曝光像;以及, 載台,支持透過該曝光像而硬化之該光硬化性樹脂之樹脂硬化層,並向上下方向移動。 A light shaping device comprising: Liquid tank, which accumulates liquid light-hardening resin; The light source device arranges a plurality of single pixels including partition walls and light-emitting elements accommodated in the partition walls into a regular matrix, and the maximum width of the single pixel is less than 200 μm; An optical element is arranged between the light source device and the liquid tank, uses the light emitted from the single pixel to form point-shaped light that is irradiated to the photocurable resin, and transmits a plurality of the point-shaped lights in the liquid tank. The forming area forms the exposed image; and, The stage supports the resin cured layer of the photocurable resin cured by the exposure image, and moves in the up and down direction. 如請求項1所述之光造形裝置,其中, 該光學元件,具有將從該單一畫素放射之光集光之微透鏡; 該微透鏡之間距,在該發光元件之光源波長[nm]以上、該單一畫素之間距以下。 The light shaping device according to claim 1, wherein, The optical element has a microlens that collects light emitted from the single pixel; The distance between the microlenses is above the light source wavelength [nm] of the light-emitting element and below the distance between single pixels. 如請求項1或2所述之光造形裝置,其中, 該光學元件,具有將從該單一畫素放射之光集光之微透鏡; 對於該單一畫素配置複數之該微透鏡。 The light shaping device according to claim 1 or 2, wherein, The optical element has a microlens that collects light emitted from the single pixel; A plurality of the microlenses are configured for the single pixel. 如請求項2所述之光造形裝置,其中, 該微透鏡在俯視下係圓形狀; 該微透鏡之間距,係該發光元件之光源波長[nm]的2倍以上。 The light shaping device according to claim 2, wherein, The microlens is circular in plan view; The distance between the microlenses is more than twice the wavelength [nm] of the light source of the light-emitting element. 如請求項1所述之光造形裝置,其中, 該光學元件係光圈,其具有將從該單一畫素放射之光收窄之複數之狹縫,並利用該狹縫形成向該光硬化性樹脂照射之點狀光。 The light shaping device according to claim 1, wherein, The optical element is an aperture that has a plurality of slits that narrow the light emitted from the single pixel, and uses the slits to form point-like light that is irradiated to the photocurable resin. 如請求項1或2所述之光造形裝置,其中, 該光源裝置配置於該液槽之下側; 該樹脂硬化層被支持於該載台之底面側; 該載台,可在支持著該樹脂硬化層之狀態下上升。 The light shaping device according to claim 1 or 2, wherein, The light source device is arranged on the lower side of the liquid tank; The resin hardened layer is supported on the bottom side of the carrier; The stage can rise while supporting the resin hardened layer. 如請求項1或2所述之光造形裝置,其中, 設置分別對應於複數之該發光元件之開關元件。 The light shaping device according to claim 1 or 2, wherein, Switch elements respectively corresponding to a plurality of the light-emitting elements are provided. 一種光造形裝置,包含: 液槽,蓄積液狀之光硬化性樹脂; 光源裝置,具有由複數之單一畫素形成之投影面,並從該投影面投影出欲造形之光造形物之面積的N倍(其中N>1)之造形用影像; 縮小投影光學零件,配置於該光源裝置之該投影面與該液槽之底面之間,其將該造形用影像之面積縮小至1/M(其中M>1)並向該液槽內之造形形成面投影;以及, 載台,支持透過該造形形成面之上的造形用影像而硬化之該光硬化性樹脂之樹脂硬化層,並向上下方向移動。 A light shaping device comprises: a liquid tank storing liquid photocurable resin; a light source device having a projection surface formed by a plurality of single pixels, and projecting a shaping image of N times (where N>1) the area of the light shaping object to be shaped from the projection surface; a reduced projection optical component disposed between the projection surface of the light source device and the bottom surface of the liquid tank, which reduces the area of the shaping image to 1/M (where M>1) and projects it onto the shaping surface in the liquid tank; and, a stage supporting the resin curing layer of the photocurable resin cured by the shaping image on the shaping surface, and moving in the up-down direction. 如請求項8所述之光造形裝置,其中, 該縮小投影光學零件,包含: 第一光集束構件,配置於該光源裝置之側;以及, 光軸修正構件,將由該第一光集束構件集束後之光之光軸向直交於該造形形成面之方向修正。 The light shaping device according to claim 8, wherein, The reduced projection optical parts include: The first light focusing component is arranged on the side of the light source device; and, The optical axis correcting member corrects the optical axis of the light concentrated by the first light condensing member in a direction perpendicular to the shaping surface. 如請求項9所述之光造形裝置,其中, 該縮小投影光學零件,在該第一光集束構件與該光軸修正構件之間更包含折射率大於空氣之折射率之第二光集束構件。 The light shaping device according to claim 9, wherein, The reduction projection optical component further includes a second light focusing component with a refractive index greater than that of air between the first light focusing component and the optical axis correction component. 如請求項8~10中任一項所述之光造形裝置,其中, N為3以上。 A light shaping device as described in any one of claim 8 to claim 10, wherein N is greater than or equal to 3. 如請求項8~10中任一項所述之光造形裝置,其中, 該光源裝置配置於該液槽之下側; 該樹脂硬化層,被支持於該載台之底面側; 該載台,可在支持著該樹脂硬化層之狀態下上升。 A light shaping device as described in any one of claims 8 to 10, wherein: the light source device is disposed below the liquid tank; the resin hardening layer is supported on the bottom side of the carrier; the carrier can rise while supporting the resin hardening layer. 一種光造形物之製造方法,包含以下步驟: 從由光源裝置之複數之單一畫素形成之投影面,投影出欲造形之光造形物之面積的N倍(其中N>1)之造形用影像之步驟;以及, 利用縮小投影光學零件,將該造形用影像之面積縮小至1/M(其中M>1),並將面積縮小後之該造形用影像投影至蓄積有液狀之光硬化性樹脂之液槽內之造形形成面,而將該光硬化性樹脂硬化之步驟。 A method for manufacturing a light-shaped object comprises the following steps: A step of projecting a shaping image of N times (where N>1) the area of the light-shaped object to be shaped from a projection surface formed by a plurality of single pixels of a light source device; and A step of reducing the area of the shaping image to 1/M (where M>1) by using a reduction projection optical component, and projecting the reduced shaping image onto a shaping surface in a liquid tank containing liquid photocurable resin, and curing the photocurable resin. 一種光造形裝置用之縮小投影光學零件,係在光造形裝置中使用之光學元件,該光造形裝置包含: 液槽,蓄積液狀之光硬化性樹脂; 光源裝置,具有由複數之單一畫素形成之投影面,並從該投影面投影出欲造形之光造形物之面積的N倍(其中N>1)之造形用影像;以及, 載台,支持透過該造形用影像而硬化之該光硬化性樹脂之樹脂硬化層,並向上下方向移動; 該光造形裝置用之縮小投影光學零件,配置於該光源裝置之該投影面與該液槽之底面之間,其將該造形用影像之面積縮小至1/M(其中M>1)並向該液槽內之造形形成面投影。 A reduced projection optical component for a light shaping device is an optical element used in the light shaping device, and the light shaping device includes: a liquid tank storing liquid photocurable resin; a light source device having a projection surface formed by a plurality of single pixels, and projecting a shaping image of N times (where N>1) the area of the light shaping object to be shaped from the projection surface; and, a carrier supporting a resin hardening layer of the photocurable resin hardened by the shaping image and moving in the up-down direction; the reduced projection optical component for the light shaping device is arranged between the projection surface of the light source device and the bottom surface of the liquid tank, and it reduces the area of the shaping image to 1/M (where M>1) and projects it onto the shaping surface in the liquid tank.
TW112111665A 2022-03-28 2023-03-28 Optical shaping apparatus,reduction projection optical component for optical shaping apparatus, and method for manufacturing optical shaping object TW202408785A (en)

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