TW202406659A - Laser machining apparatus capable of controlling the state of laser light without reducing productivity - Google Patents

Laser machining apparatus capable of controlling the state of laser light without reducing productivity Download PDF

Info

Publication number
TW202406659A
TW202406659A TW112128168A TW112128168A TW202406659A TW 202406659 A TW202406659 A TW 202406659A TW 112128168 A TW112128168 A TW 112128168A TW 112128168 A TW112128168 A TW 112128168A TW 202406659 A TW202406659 A TW 202406659A
Authority
TW
Taiwan
Prior art keywords
laser light
laser
light
unit
axis direction
Prior art date
Application number
TW112128168A
Other languages
Chinese (zh)
Inventor
岩城邦明
藤澤竹弘
田中祐樹
松井希和
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW202406659A publication Critical patent/TW202406659A/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)

Abstract

Provided is a laser machining apparatus capable of controlling the state of laser light without reducing productivity. The laser machining apparatus includes: a laser oscillator 30 that generates laser light 21; a condenser lens 32 that condenses the laser light 21 generated by the laser oscillator 30; a separation member 33 that separates the laser light 21 generated by the laser oscillator 30 into a laser light 22 for inspection and a laser light 22 for processing used to focus on the workpiece 100; the light receiving part 40 that receives the laser light 22 for inspection separated by the component 33; the detection unit 50 that obtains information on the intensity of the laser light 22 and relevant information of the pulse waveform of the laser light 22 from the laser light 22 received by the light receiving part 40; and a control unit 54 that outputs the information obtained by the detection unit 50 .

Description

雷射加工裝置Laser processing equipment

本發明有關於一種雷射加工裝置。The invention relates to a laser processing device.

為了分割半導體晶圓等的板狀物來做成晶片，已知有將對板狀物具有穿透性之波長的雷射光聚光照射於板狀物的內部來形成改質層，並以此改質層為起點來進行分割之方法，或是藉由照射對板狀物具有吸收性之波長的雷射光來使其燒蝕而進行分割之方法等(參照專利文獻1、2)。在這樣的加工方法中，為了使加工品質穩定，掌握雷射加工裝置的雷射光的狀態是非常重要的。 先前技術文獻 專利文獻 In order to divide a plate-like object such as a semiconductor wafer into wafers, it is known to condense and irradiate the inside of the plate-like object with a laser light having a wavelength that is penetrating to the plate-like object, thereby forming a modified layer. A method of dividing the plate-shaped object by using the modified layer as a starting point, or a method of dividing the plate-shaped object by ablation by irradiating it with laser light having a wavelength that is absorbent (see Patent Documents 1 and 2). In such a processing method, in order to stabilize the processing quality, it is very important to grasp the state of the laser light of the laser processing device. Prior technical literature patent documents

專利文獻1：日本特許第3408805號公報 專利文獻2：日本特開平10-305420號公報 Patent Document 1: Japanese Patent No. 3408805 Patent Document 2: Japanese Patent Application Publication No. 10-305420

發明欲解決之課題The problem to be solved by the invention

然而，以往，測定雷射光的強度之功率計必須以遮擋雷射光的方式來設置。因此，為了測定必須停止加工，而有生產性會降低之問題。又，為了觀測雷射光的脈衝波形或脈衝遺漏等，必須將光電二極體設置在可以接收散射光的位置並連接於示波器(oscilloscope)，並以目視方式來確認，不僅和強度測定同樣地會導致生產性降低，也是不勝其煩的作業。However, in the past, the power meter used to measure the intensity of laser light had to be set up to block the laser light. Therefore, processing must be stopped for measurement, and there is a problem that productivity is reduced. In addition, in order to observe the pulse waveform or pulse omission of laser light, it is necessary to install the photodiode in a position that can receive scattered light, connect it to an oscilloscope, and confirm it visually. This is not only the same as the intensity measurement, but This results in a decrease in productivity and is a very troublesome task.

本發明是有鑒於所述之問題點而作成的發明，其目的在於提供一種可以在不使生產性降低的情形下掌握雷射光的狀態之雷射加工裝置。 用以解決課題之手段 The present invention was made in view of the above-mentioned problems, and an object thereof is to provide a laser processing apparatus that can grasp the state of laser light without reducing productivity. means to solve problems

為了解決上述課題並達成目的，本發明的雷射加工裝置的特徵在於具備：雷射振盪器，生成雷射光；聚光透鏡，將藉由該雷射振盪器所生成之雷射光聚光；分離構件，將藉由該雷射振盪器所生成之雷射光分離成檢查用的雷射光、與用於聚光於被加工物之加工用的雷射光；光接收部，接收藉由該分離構件所分離出之檢查用的雷射光；檢測單元，從藉由該光接收部所接收到之雷射光，取得和該雷射光的強度有關之資訊、與和該雷射光的脈衝波形有關之資訊；及控制部，輸出以該檢測單元所取得之資訊。In order to solve the above problems and achieve the object, the laser processing apparatus of the present invention is characterized by having: a laser oscillator to generate laser light; a condenser lens to condense the laser light generated by the laser oscillator; and to separate the laser light. a member that separates the laser light generated by the laser oscillator into laser light for inspection and laser light for processing that is focused on the workpiece; and the light receiving unit receives the laser light generated by the separation member. The separated laser light for inspection; the detection unit obtains information related to the intensity of the laser light and information related to the pulse waveform of the laser light from the laser light received through the light receiving part; and The control unit outputs the information obtained by the detection unit.

又，本發明之雷射加工裝置亦可更具備用於將藉由該分離構件所分離出之檢查用的雷射光分歧之分歧鏡，該光接收部具有：熱感測器，接收經該分歧鏡所分歧出之其中一道雷射光，並測定該雷射光的平均輸出；及光偵測器(photodetector)，接收經該分歧鏡所分歧出之另一道雷射光，來取得和該雷射光的脈衝波形有關之資訊。In addition, the laser processing device of the present invention may further include a branching mirror for dividing the inspection laser light separated by the separation member, and the light receiving part has a thermal sensor that receives the light through the branching. One of the laser lights branched out by the mirror, and the average output of the laser light is measured; and a photodetector receives the other laser light branched out by the branch mirror to obtain the pulse of the laser light. Information about the waveform.

又，在本發明之雷射加工裝置中，亦可配設成：該熱感測器接收經該分歧鏡所反射之雷射光，該光偵測器接收已穿透該分歧鏡的雷射光。Furthermore, the laser processing device of the present invention may also be configured such that the thermal sensor receives the laser light reflected by the branching mirror, and the light detector receives the laser light that has penetrated the branching mirror.

又，在本發明的雷射加工裝置中，亦可在該分歧鏡與該光偵測器之間配設ND濾波器。Furthermore, in the laser processing device of the present invention, an ND filter may be disposed between the branch mirror and the photodetector.

又，在本發明之雷射加工裝置中，以該檢測單元所取得之和該雷射光的脈衝波形有關之資訊，亦可包含有關於有無脈衝遺漏之資訊，且該控制部依據該雷射光的平均輸出，自動地設定用於檢測脈衝遺漏的閾值。 發明效果 In addition, in the laser processing device of the present invention, the information related to the pulse waveform of the laser light obtained by the detection unit may also include information on whether there is a pulse omission, and the control unit is based on the pulse waveform of the laser light. Averaging the output automatically sets the threshold for detecting missing pulses. Invention effect

本發明可以在不使生產性降低的情形下掌握雷射光的狀態。The present invention can grasp the state of laser light without reducing productivity.

用以實施發明之形態Form used to implement the invention

針對用於實施本發明之形態(實施形態)，一面參照圖式一面詳細地說明。本發明並非因以下的實施形態所記載之內容而受到限定之發明。又，在以下所記載之構成要素中，包含所屬技術領域中具有通常知識者可以容易地設想得到的構成要素、實質上相同的構成要素。此外，以下所記載之構成是可合宜組合的。又，只要在不脫離本發明之要旨的範圍內，可進行構成的各種省略、置換或變更。Modes (embodiments) for implementing the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the structural elements described below include structural elements that can be easily imagined by a person with ordinary skill in the relevant technical field and substantially the same structural elements. In addition, the structures described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in the structure may be made within the scope that does not deviate from the gist of the present invention.

[實施形態] 首先，依據圖式來說明本發明的實施形態之雷射加工裝置1的整體構成。圖1是顯示實施形態之雷射加工裝置1之構成例的立體圖。在以下的說明中，X軸方向是水平面上的一個方向。Y軸方向是在水平面上正交於X軸方向之方向。Z軸方向是正交於X軸方向以及Y軸方向之方向。實施形態之雷射加工裝置1為：加工進給方向為X軸方向，分度進給方向為Y軸方向，聚光點位置調整方向為Z軸方向。 [Embodiment] First, the overall structure of the laser processing apparatus 1 according to the embodiment of the present invention will be described based on the drawings. FIG. 1 is a perspective view showing a structural example of the laser processing apparatus 1 according to the embodiment. In the following description, the X-axis direction is a direction on the horizontal plane. The Y-axis direction is the direction orthogonal to the X-axis direction on the horizontal plane. The Z-axis direction is a direction orthogonal to the X-axis direction and the Y-axis direction. In the laser processing device 1 of the embodiment, the processing feed direction is the X-axis direction, the indexing feed direction is the Y-axis direction, and the focusing point position adjustment direction is the Z-axis direction.

如圖1所示，雷射加工裝置1具備保持工作台10、雷射光照射單元20、移動單元60、拍攝單元70與顯示單元80。實施形態之雷射加工裝置1是藉由對加工對象即被加工物100照射雷射光21來對被加工物100進行加工之裝置。藉由雷射加工裝置1進行之被加工物100的加工可為例如：藉由隱形切割在被加工物100的內部形成改質層之改質層形成加工、在被加工物100的正面形成溝之溝加工、或沿著分割預定線將被加工物100切斷之切斷加工等。As shown in FIG. 1 , the laser processing apparatus 1 includes a holding table 10 , a laser irradiation unit 20 , a moving unit 60 , an imaging unit 70 and a display unit 80 . The laser processing device 1 of the embodiment is a device that processes the object 100 , which is the object to be processed, by irradiating the object 100 with the laser light 21 . The processing of the workpiece 100 by the laser processing apparatus 1 may be, for example, a modified layer forming process in which a modified layer is formed inside the workpiece 100 by stealth cutting, or a groove is formed on the front surface of the workpiece 100 . Groove processing, or cutting processing to cut the workpiece 100 along the planned dividing line, etc.

被加工物100可為例如以矽(Si)、藍寶石(Al 2O 3)、砷化鎵(GaAs)、碳化矽(SiC)或鉭酸鋰(LiTaO 3)等作為基板之圓板狀的半導體器件晶圓、光器件晶圓等之晶圓。再者，在實施形態中，被加工物100雖然是圓板狀，但在本發明中亦可並非為圓板狀。被加工物100是例如在被加工物100的背面貼附可供環狀的框架110貼附且直徑比被加工物100的外徑更大之膠帶111，而以被支撐在框架110的開口內之狀態來搬送及加工。 The workpiece 100 may be, for example, a disc-shaped semiconductor using silicon (Si), sapphire (Al 2 O 3 ), gallium arsenide (GaAs), silicon carbide (SiC), or lithium tantalate (LiTaO 3 ) as a substrate. Device wafers, optical device wafers, etc. Furthermore, in the embodiment, the workpiece 100 is in the shape of a disc, but in the present invention, it may not be in the shape of a disc. The workpiece 100 is, for example, a tape 111 with a diameter larger than the outer diameter of the workpiece 100 that is attached to the back of the workpiece 100 to allow the annular frame 110 to be attached, so as to be supported in the opening of the frame 110 conditions for transportation and processing.

保持工作台10以保持面11來保持被加工物100。保持面11是由多孔陶瓷等所形成之圓板形狀。保持面11在實施形態中是和水平方向平行之平面。保持面11例如透過真空吸引路徑而和真空吸引源連接。保持工作台10會吸引保持已載置在保持面11上之被加工物100。在保持工作台10的周圍配置有複數個夾具部12，前述夾具部12會夾持支撐被加工物100之環狀的框架110。The holding table 10 holds the workpiece 100 with the holding surface 11 . The holding surface 11 has a disk shape formed of porous ceramics or the like. In the embodiment, the holding surface 11 is a flat surface parallel to the horizontal direction. The holding surface 11 is connected to a vacuum suction source through a vacuum suction path, for example. The holding table 10 attracts and holds the workpiece 100 placed on the holding surface 11 . A plurality of clamp parts 12 are arranged around the holding table 10, and the clamp parts 12 clamp an annular frame 110 that supports the workpiece 100.

保持工作台10藉由旋轉單元13而繞著和Z軸方向平行的軸心旋轉。旋轉單元13被X軸方向移動板14支撐。旋轉單元13以及保持工作台10是透過X軸方向移動板14，而被後述之X軸方向移動單元61在X軸方向上移動。旋轉單元13以及保持工作台10是透過X軸方向移動板14、X軸方向移動單元61以及Y軸方向移動板15，而被Y軸方向移動單元62在Y軸方向上移動。The holding table 10 rotates around an axis parallel to the Z-axis direction by the rotation unit 13 . The rotation unit 13 is supported by the X-axis direction moving plate 14 . The rotation unit 13 and the holding table 10 are moved in the X-axis direction by an X-axis direction moving unit 61 described later through the X-axis direction moving plate 14 . The rotation unit 13 and the holding table 10 are moved in the Y-axis direction by the Y-axis direction moving unit 62 through the X-axis direction moving plate 14 , the X-axis direction moving unit 61 and the Y-axis direction moving plate 15 .

雷射光照射單元20是對已保持在保持工作台10的保持面11之被加工物100照射雷射光21之單元。在雷射光照射單元20當中，至少聚光透鏡32(參照圖2)會被後述之Z軸方向移動單元63所支撐，前述Z軸方向移動單元63設置在從雷射加工裝置1的裝置本體2豎立設置之柱3上。關於雷射光照射單元20的具體的構成例，將在後述中詳細地說明。The laser irradiation unit 20 is a unit that irradiates the workpiece 100 held on the holding surface 11 of the holding table 10 with the laser light 21 . In the laser irradiation unit 20 , at least the condenser lens 32 (see FIG. 2 ) is supported by a Z-axis direction moving unit 63 which will be described later. The Z-axis direction moving unit 63 is provided on the device body 2 from the laser processing device 1 Stand on pillar 3 of the setting. A specific structural example of the laser irradiation unit 20 will be described in detail later.

移動單元60是使雷射光21的聚光點相對於已保持在保持工作台10之被加工物100相對地移動之單元。移動單元60包含X軸方向移動單元61、Y軸方向移動單元62與Z軸方向移動單元63。The moving unit 60 is a unit that relatively moves the focus point of the laser light 21 relative to the workpiece 100 held on the holding table 10 . The moving unit 60 includes an X-axis direction moving unit 61, a Y-axis direction moving unit 62, and a Z-axis direction moving unit 63.

X軸方向移動單元61是使保持工作台10與雷射光照射單元20的聚光點在加工進給方向即X軸方向上相對地移動之單元。在實施形態中，X軸方向移動單元61使保持工作台10在X軸方向上移動。在實施形態中，X軸方向移動單元61是設置在雷射加工裝置1的裝置本體2上。X軸方向移動單元61是將X軸方向移動板14支撐成在X軸方向上移動自如。The X-axis direction moving unit 61 is a unit that relatively moves the holding table 10 and the focusing point of the laser irradiation unit 20 in the processing feed direction, that is, in the X-axis direction. In the embodiment, the X-axis direction moving unit 61 moves the holding table 10 in the X-axis direction. In the embodiment, the X-axis direction moving unit 61 is provided on the device body 2 of the laser processing device 1 . The X-axis direction moving unit 61 supports the X-axis direction moving plate 14 so as to be movable in the X-axis direction.

Y軸方向移動單元62是使保持工作台10與雷射光照射單元20的聚光點在分度進給方向即Y軸方向上相對地移動之單元。在實施形態中，Y軸方向移動單元62使保持工作台10在Y軸方向上移動。在實施形態中，Y軸方向移動單元62是設置在雷射加工裝置1的裝置本體2上。Y軸方向移動單元62將Y軸方向移動板15支撐成在Y軸方向上移動自如。The Y-axis direction moving unit 62 is a unit that relatively moves the holding table 10 and the focusing points of the laser irradiation unit 20 in the Y-axis direction, which is the indexing feed direction. In the embodiment, the Y-axis direction moving unit 62 moves the holding table 10 in the Y-axis direction. In the embodiment, the Y-axis direction moving unit 62 is provided on the device body 2 of the laser processing device 1 . The Y-axis direction moving unit 62 supports the Y-axis direction moving plate 15 so as to be movable in the Y-axis direction.

Z軸方向移動單元63是使保持工作台10與雷射光照射單元20的聚光點在聚光點位置調整方向即Z軸方向上相對地移動之單元。在實施形態中，Z軸方向移動單元63使雷射光照射單元20的至少聚光透鏡32在Z軸方向上移動。在實施形態中，Z軸方向移動單元63是設置在雷射加工裝置1之自裝置本體2豎立設置之柱3上。Z軸方向移動單元63將雷射光照射單元20的至少聚光透鏡32支撐成在Z軸方向上移動自如。The Z-axis direction moving unit 63 is a unit that relatively moves the focusing points of the holding table 10 and the laser irradiation unit 20 in the Z-axis direction, which is the direction of adjusting the focusing point position. In the embodiment, the Z-axis direction moving unit 63 moves at least the condenser lens 32 of the laser irradiation unit 20 in the Z-axis direction. In the embodiment, the Z-axis direction moving unit 63 is installed on the column 3 of the laser processing device 1 that is erected from the device body 2 . The Z-axis direction moving unit 63 supports at least the condenser lens 32 of the laser light irradiation unit 20 so as to be movable in the Z-axis direction.

在實施形態中，X軸方向移動單元61、Y軸方向移動單元62以及Z軸方向移動單元63各自包含習知的滾珠螺桿、習知的脈衝馬達與習知的導軌。滾珠螺桿設置成繞著軸心旋轉自如。脈衝馬達使滾珠螺桿繞著軸心旋轉。X軸方向移動單元61的導軌將X軸方向移動板14支撐成在X軸方向上移動自如。X軸方向移動單元61的導軌是固定在Y軸方向移動板15而設置。Y軸方向移動單元62的導軌將Y軸方向移動板15支撐成在Y軸方向上移動自如。Y軸方向移動單元62的導軌是固定在裝置本體2而設置。Z軸方向移動單元63的導軌將雷射光照射單元20的至少聚光透鏡32支撐成在Z軸方向上移動自如。Z軸方向移動單元63的導軌是固定在柱3上而設置。In the embodiment, the X-axis direction moving unit 61, the Y-axis direction moving unit 62, and the Z-axis direction moving unit 63 each include a conventional ball screw, a conventional pulse motor, and a conventional guide rail. The ball screw is configured to rotate freely around its axis. The pulse motor rotates the ball screw around its axis. The guide rail of the X-axis direction moving unit 61 supports the X-axis direction moving plate 14 so as to be movable in the X-axis direction. The guide rail of the X-axis direction moving unit 61 is fixed to the Y-axis direction moving plate 15 and provided. The guide rail of the Y-axis direction moving unit 62 supports the Y-axis direction moving plate 15 so as to be movable in the Y-axis direction. The guide rail of the Y-axis direction moving unit 62 is fixed to the device body 2 and provided. The guide rail of the Z-axis direction moving unit 63 supports at least the condenser lens 32 of the laser irradiation unit 20 so as to be movable in the Z-axis direction. The guide rail of the Z-axis direction moving unit 63 is fixed on the column 3 .

拍攝單元70對已保持在保持工作台10之被加工物100進行拍攝。拍攝單元70包含CCD(電荷耦合器件，Charge Coupled Device)相機或紅外線相機。拍攝單元70是例如以相鄰於雷射光照射單元20的聚光透鏡32(參照圖2)的方式固定。拍攝單元70拍攝被加工物100來得到用於完成校準之圖像，並將所得到的圖像輸出，其中前述校準是進行被加工物100與雷射光照射單元20之對位。The imaging unit 70 photographs the workpiece 100 held on the holding table 10 . The photographing unit 70 includes a CCD (Charge Coupled Device) camera or an infrared camera. The imaging unit 70 is fixed, for example, adjacent to the condenser lens 32 (see FIG. 2 ) of the laser irradiation unit 20 . The photographing unit 70 photographs the object 100 to obtain an image for completing calibration, and outputs the obtained image. The calibration is to align the object 100 with the laser irradiation unit 20 .

顯示單元80是藉由液晶顯示裝置等所構成之顯示部。顯示單元80可使例如加工條件的設定畫面、拍攝單元70所拍攝到之被加工物100的狀態、加工動作的狀態等顯示於顯示面。在顯示單元80的顯示面包含觸控面板的情況下，顯示單元80亦可包含輸入部。輸入部可受理操作人員登錄加工內容資訊等之各種操作。輸入部亦可為鍵盤等的外部輸入裝置。顯示單元80可藉由來自輸入部等的操作而切換顯示於顯示面之資訊或圖像。The display unit 80 is a display portion composed of a liquid crystal display device or the like. The display unit 80 can display, for example, a processing condition setting screen, the state of the workpiece 100 photographed by the imaging unit 70 , the state of the processing operation, and the like on the display surface. When the display surface of the display unit 80 includes a touch panel, the display unit 80 may also include an input unit. The input unit can accept various operations such as the operator's registration of processing content information. The input unit may be an external input device such as a keyboard. The display unit 80 can switch information or images displayed on the display surface by operations from an input unit or the like.

其次，說明雷射光照射單元20的具體的構成。圖2是顯示圖1所示之雷射光照射單元20的概略構成例的示意圖。如圖2所示，雷射光照射單元20包含雷射振盪器30與聚光透鏡32。Next, the specific structure of the laser light irradiation unit 20 will be described. FIG. 2 is a schematic diagram showing an example of the schematic configuration of the laser light irradiation unit 20 shown in FIG. 1 . As shown in FIG. 2 , the laser irradiation unit 20 includes a laser oscillator 30 and a condenser lens 32 .

雷射振盪器30會生成並射出具有用於加工被加工物100之預定的波長的雷射光21。雷射光照射單元20所照射之雷射光21是對被加工物100具有穿透性或吸收性之波長的雷射光。雷射振盪器30具有雷射振盪部31，前述雷射振盪部31包含振盪產生並放大雷射光21之雷射介質。又，實施形態之雷射振盪器30是將分離構件33、光接收部40、檢測單元50與控制部54設置在殼體的內部。The laser oscillator 30 generates and emits laser light 21 with a predetermined wavelength for processing the object 100 . The laser light 21 irradiated by the laser light irradiation unit 20 is laser light with a wavelength that is penetrating or absorbing to the workpiece 100 . The laser oscillator 30 has a laser oscillation part 31 , and the laser oscillation part 31 includes a laser medium that generates oscillation and amplifies the laser light 21 . In addition, in the laser oscillator 30 of the embodiment, the separation member 33, the light receiving unit 40, the detection unit 50 and the control unit 54 are installed inside the casing.

分離構件33是設置在雷射振盪部31與聚光透鏡32之間的雷射光21的光路上。分離構件33會將在雷射振盪部31中所生成之雷射光21分離成檢查用的雷射光22與加工用的雷射光23。The separation member 33 is provided on the optical path of the laser light 21 between the laser oscillation unit 31 and the condenser lens 32 . The separation member 33 separates the laser light 21 generated by the laser oscillation unit 31 into the inspection laser light 22 and the processing laser light 23.

實施形態之分離構件33例如包含玻璃，可讓雷射光21中的99%以上穿透且讓小於1百分比反射。亦即，實施形態之分離構件33是將反射後之雷射光21作為檢查用的雷射光22而引導到光接收部40，並將穿透後之雷射光21作為加工用的雷射光23而引導到聚光透鏡32。再者，分離構件33亦可包含反射鏡，在此情況下，只要配置成將反射後之雷射光21作為為加工用的雷射光23而引導到聚光透鏡32，並將穿透後之雷射光21作為檢查用的雷射光22而引導到光接收部40即可。The separation member 33 of the embodiment is made of glass, for example, and can transmit more than 99% of the laser light 21 and reflect less than 1%. That is, the separation member 33 of the embodiment guides the reflected laser light 21 to the light receiving part 40 as the inspection laser light 22, and guides the transmitted laser light 21 as the processing laser light 23. to the condenser lens 32. Furthermore, the separation member 33 may also include a reflecting mirror. In this case, it may be configured to guide the reflected laser light 21 to the condenser lens 32 as the laser light 23 for processing, and to guide the transmitted laser light 21 to the condenser lens 32 . The emitted light 21 may be guided to the light receiving unit 40 as the laser light 22 for inspection.

光接收部40會接收藉由分離構件33所分離出之檢查用的雷射光22。實施形態的光接收部40包含藉由將光訊號轉換成電氣訊號來檢測光之光偵測器(光檢測器)。此外，亦可在光接收部40的前段配置有使光量衰減之濾波器。濾波器包含例如在預定的波長帶中不用選擇波長地將光量去掉一定量而穿透之ND(中性密度，Neutral Density)濾波器。光接收部40會將對應於所接收到之光的電氣訊號輸出至檢測單元50。The light receiving unit 40 receives the inspection laser light 22 separated by the separation member 33 . The light receiving unit 40 of the embodiment includes a photodetector (photodetector) that detects light by converting an optical signal into an electrical signal. In addition, a filter that attenuates the amount of light may be disposed in front of the light receiving unit 40 . The filter includes, for example, an ND (Neutral Density) filter that passes a certain amount of light without selecting a wavelength in a predetermined wavelength band. The light receiving part 40 outputs an electrical signal corresponding to the received light to the detection unit 50 .

檢測單元50是取得藉由光接收部40所接收到之檢查用的雷射光22的資訊之單元。檢測單元50包含訊號放大部51、脈衝波形資訊取得部52與光強度資訊取得部53。訊號放大部51將從光接收部40所取得之電氣訊號放大並輸出至脈衝波形資訊取得部52以及光強度資訊取得部53。The detection unit 50 is a unit that acquires information on the inspection laser light 22 received by the light receiving unit 40 . The detection unit 50 includes a signal amplification part 51, a pulse waveform information acquisition part 52 and a light intensity information acquisition part 53. The signal amplifying part 51 amplifies the electrical signal acquired from the light receiving part 40 and outputs it to the pulse waveform information acquiring part 52 and the light intensity information acquiring part 53 .

脈衝波形資訊取得部52會取得和有關於雷射光22的脈衝波形之資訊對應之光強度的電氣訊號。光強度資訊取得部53會取得和有關於雷射光22的強度之資訊對應之光強度的電氣訊號。再者，脈衝波形資訊取得部52以及光強度資訊取得部53是以類比訊號來取得各自的資訊。脈衝波形資訊取得部52以及光強度資訊取得部53會將和已取得之各資訊對應之類比訊號輸出至控制部54。The pulse waveform information acquisition unit 52 acquires an electrical signal of light intensity corresponding to the information on the pulse waveform of the laser light 22 . The light intensity information acquisition unit 53 acquires an electrical signal of light intensity corresponding to the information on the intensity of the laser light 22 . Furthermore, the pulse waveform information acquisition unit 52 and the light intensity information acquisition unit 53 acquire their respective information using analog signals. The pulse waveform information acquisition unit 52 and the light intensity information acquisition unit 53 output analog signals corresponding to the acquired information to the control unit 54 .

控制部54是包含作為運算機構之運算處理裝置、作為記憶機構之記憶裝置、及作為通訊機構之輸入輸出介面裝置的電腦。運算處理裝置包含例如CPU(中央處理單元，Central Processing Unit)等之微處理器。記憶裝置具有HDD(硬碟驅動機，Hard Disk Drive)、ROM(唯讀記憶體，Read Only Memory)或RAM(隨機存取記憶體，Random Access Memory)等之記憶體。運算處理裝置依據已保存於記憶裝置之預定的程式來進行各種運算。運算處理裝置依照運算結果，透過輸入輸出介面裝置將各種控制訊號輸出至上述之各構成要素。The control unit 54 is a computer including an arithmetic processing device as a computing device, a memory device as a memory device, and an input-output interface device as a communication device. The arithmetic processing device includes a microprocessor such as a CPU (Central Processing Unit). The memory device has memory such as HDD (Hard Disk Drive), ROM (Read Only Memory) or RAM (Random Access Memory). The arithmetic processing device performs various operations according to a predetermined program stored in the memory device. The computing processing device outputs various control signals to the above-mentioned components through the input and output interface device according to the computing results.

控制部54會對從脈衝波形資訊取得部52以及光強度資訊取得部53取得之類比訊號進行AD轉換。此外，控制部54會將光強度的AD值換算為功率值。藉此，控制部54從脈衝波形資訊取得部52取得之和有關於雷射光22的脈衝波形之資訊對應之光強度的電氣訊號，可得到峰值輸出的時間推移資訊。又，控制部54從光強度資訊取得部53取得之和有關於雷射光22的強度之資訊對應之光強度的電氣訊號，可得到平均輸出的時間推移資訊。The control unit 54 performs AD conversion on the analog signal acquired from the pulse waveform information acquisition unit 52 and the light intensity information acquisition unit 53 . In addition, the control unit 54 converts the AD value of the light intensity into a power value. Thereby, the control unit 54 obtains the electrical signal of the light intensity corresponding to the information on the pulse waveform of the laser light 22 from the pulse waveform information acquisition unit 52, and can obtain the time transition information of the peak output. Furthermore, the control unit 54 obtains the electrical signal of the light intensity corresponding to the information on the intensity of the laser light 22 from the light intensity information acquisition unit 53, thereby obtaining the time transition information of the average output.

控制部54是依據以檢測單元50所取得之有關於檢查用的雷射光22的強度之資訊，來取得雷射光22的平均輸出的時間推移。檢查用的雷射光22與加工用的雷射光23，因為在分離構件33中以預定的比例被分離，所以可藉由雷射光22的平均輸出的時間推移，來推定加工用的雷射光23的平均輸出的時間推移。亦即，可以依據加工用的雷射光23的平均輸出的時間推移，來檢測例如雷射光23的強度的非預期之降低等之裝置的異常。The control unit 54 obtains the time transition of the average output of the laser light 22 based on the information on the intensity of the inspection laser light 22 obtained by the detection unit 50 . Since the laser light 22 for inspection and the laser light 23 for processing are separated at a predetermined ratio by the separation member 33, the intensity of the laser light 23 for processing can be estimated based on the time transition of the average output of the laser light 22. Average output over time. That is, an abnormality of the device such as an unexpected decrease in the intensity of the laser light 23 can be detected based on the time transition of the average output of the laser light 23 for processing.

又，控制部54是依據以檢測單元50所取得之有關於檢查用的雷射光22的脈衝波形之資訊，來取得雷射光22的峰值輸出的時間推移。檢查用的雷射光22與加工用的雷射光23，因為在分離構件33中以預定的比例被分離，所以可藉由雷射光22的峰值輸出的時間推移，來推定加工用的雷射光23的峰值輸出的時間推移。亦即，控制部54可以依據加工用的雷射光23的峰值輸出的時間推移，來檢測例如雷射光23的脈衝遺漏等之裝置的異常。Furthermore, the control unit 54 obtains the time transition of the peak output of the laser light 22 based on the information on the pulse waveform of the inspection laser light 22 obtained by the detection unit 50 . Since the inspection laser light 22 and the processing laser light 23 are separated at a predetermined ratio by the separation member 33, the peak output of the laser light 22 can be estimated based on the time transition of the peak output of the processing laser 23. Time lapse of peak output. That is, the control unit 54 can detect device abnormalities such as missing pulses of the laser light 23 based on the time transition of the peak output of the processing laser light 23 .

在此，亦可為：檢測單元50的脈衝波形資訊取得部52所取得之有關於雷射光22的脈衝波形之資訊，包含有關於有無脈衝遺漏之資訊。有無脈衝遺漏之檢測，是藉由針對預定的閾值，判定每個脈衝之峰值輸出是否低於閾值來進行。實施形態之控制部54是依據雷射光22的平均輸出的時間推移，而自動地設定用於進行脈衝遺漏的檢測之閾值。藉此，即使在雷射光21的照射過程中變更加工條件，使得適當的閾值改變的情況下，仍可對應。Here, the information about the pulse waveform of the laser light 22 acquired by the pulse waveform information acquisition unit 52 of the detection unit 50 may include information about whether there is a pulse missing. The detection of missing pulses is performed by determining whether the peak output of each pulse is lower than the threshold based on a predetermined threshold. The control unit 54 of the embodiment automatically sets the threshold for detecting pulse omission based on the time transition of the average output of the laser light 22 . Accordingly, even if the processing conditions are changed during the irradiation of the laser light 21 so that the appropriate threshold value is changed, the process can still be handled.

聚光透鏡32使從雷射振盪器30所射出之雷射光21聚光於已保持在保持工作台10的保持面11之被加工物100，來照射於被加工物100。聚光透鏡32是將從雷射振盪部31所射出且已入射至分離構件33之雷射光21當中，穿透分離構件33之加工用的雷射光23聚光於被加工物100。The condenser lens 32 condenses the laser light 21 emitted from the laser oscillator 30 onto the workpiece 100 held on the holding surface 11 of the holding table 10, and irradiates the workpiece 100. The condenser lens 32 condenses the processing laser light 23 that has passed through the separation member 33 out of the laser light 21 emitted from the laser oscillation unit 31 and entered the separation member 33 onto the workpiece 100 .

在圖2所示之實施形態的雷射光照射單元20中，雖然在雷射振盪器30的內部配置有光接收部40以及檢測單元50，但在本發明中並非限定於此形態。圖3是顯示雷射光照射單元20-1的其他的概略構成例的示意圖。如圖3所示，雷射光照射單元20-1和實施形態的雷射光照射單元20相比較，不同之點在於：具備雷射振盪器30-1來取代雷射振盪器30。In the laser irradiation unit 20 of the embodiment shown in FIG. 2 , the light receiving unit 40 and the detection unit 50 are disposed inside the laser oscillator 30 . However, the present invention is not limited to this form. FIG. 3 is a schematic diagram showing another schematic configuration example of the laser light irradiation unit 20-1. As shown in FIG. 3 , the laser irradiation unit 20 - 1 is different from the laser irradiation unit 20 of the embodiment in that it includes a laser oscillator 30 - 1 instead of the laser oscillator 30 .

雷射振盪器30-1在內部不具備分離構件33、光接收部40、檢測單元50以及控制部54。亦即，雷射光照射單元20-1是在雷射振盪器30-1的外部具備分離構件33、光接收部40、檢測單元50以及控制部54。分離構件33將從雷射振盪器30-1射出後之雷射光21分離成檢查用的雷射光22與加工用的雷射光23。關於其他構成零件，因為和圖2所示之雷射光照射單元20的構成零件同樣，所以省略說明。The laser oscillator 30 - 1 does not include the separation member 33 , the light receiving unit 40 , the detection unit 50 and the control unit 54 inside. That is, the laser irradiation unit 20-1 includes the separation member 33, the light receiving unit 40, the detection unit 50, and the control unit 54 outside the laser oscillator 30-1. The separation member 33 separates the laser light 21 emitted from the laser oscillator 30-1 into inspection laser light 22 and processing laser light 23. Regarding other components, they are the same as those of the laser irradiation unit 20 shown in FIG. 2 , so description thereof is omitted.

實施形態之光接收部40雖然包含光偵測器，但在本發明中，亦可更包含熱感測器。圖4是顯示光接收部40-1的其他的概略構成例的示意圖。光接收部40-1包含各自接收藉由分歧鏡41所分歧出之雷射光24、25之熱感測器42與光偵測器43。Although the light receiving part 40 in the embodiment includes a photodetector, in the present invention, it may further include a thermal sensor. FIG. 4 is a schematic diagram showing another schematic configuration example of the light receiving unit 40-1. The light receiving part 40-1 includes a thermal sensor 42 and a light detector 43 that respectively receive the laser lights 24 and 25 branched by the branching mirror 41.

分歧鏡41會將已藉由分離構件33分離之檢查用的雷射光22分歧。分歧鏡41是將經分歧之其中一道雷射光22作為雷射光24而引導至熱感測器42，並且將經分歧之另一道雷射光22作為雷射光25而引導至光偵測器43。分歧鏡41是例如將99%左右之雷射光22反射之反射鏡。分歧鏡41會讓雷射光22的99%左右反射而作為雷射光24來引導至熱感測器42，並讓其餘的1百分比左右穿透而引導至光偵測器43。The branching mirror 41 branches the inspection laser light 22 separated by the separation member 33 . The branching mirror 41 guides one of the branched laser lights 22 as laser light 24 to the thermal sensor 42 , and guides the other branched laser light 22 as laser light 25 to the photodetector 43 . The branching mirror 41 is a reflecting mirror that reflects about 99% of the laser light 22, for example. The branching mirror 41 reflects approximately 99% of the laser light 22 and guides it to the thermal sensor 42 as laser light 24, and allows the remaining 1% to pass through and guide it to the light detector 43.

熱感測器42會接收藉由分歧鏡41所分歧出之其中一道雷射光24並測定雷射光24的平均輸出。實施形態的熱感測器42是接收藉由分歧鏡41所反射之雷射光24。The thermal sensor 42 receives one of the laser beams 24 branched by the branching mirror 41 and measures the average output of the laser light 24 . The thermal sensor 42 of the embodiment receives the laser light 24 reflected by the branching mirror 41 .

光偵測器43會接收藉由分歧鏡41所分歧出之另一道雷射光25來取得有關於雷射光25的脈衝波形之資訊。實施形態的光偵測器43是接收穿透分歧鏡41之雷射光25。The light detector 43 will receive another laser light 25 split by the split mirror 41 to obtain information about the pulse waveform of the laser light 25 . The photodetector 43 of the embodiment receives the laser light 25 that passes through the branching mirror 41 .

如圖4所示，在分歧鏡41的前段配設有聚光透鏡44以及波長選擇濾波器45。又，可在分歧鏡41與光偵測器43之間配設ND濾波器46。As shown in FIG. 4 , a condenser lens 44 and a wavelength selective filter 45 are provided in front of the branch mirror 41 . In addition, an ND filter 46 may be disposed between the branch mirror 41 and the photodetector 43 .

聚光透鏡44會讓以分離構件33所分離出之檢查用的雷射光22朝向光偵測器43的光接收面來聚光。已穿透聚光透鏡44之雷射光22會穿透波長選擇濾波器45、分歧鏡41以及ND濾波器46，而入射至光偵測器43。The condenser lens 44 condenses the inspection laser light 22 separated by the separation member 33 toward the light receiving surface of the photodetector 43 . The laser light 22 that has passed through the condenser lens 44 will pass through the wavelength selection filter 45 , the split mirror 41 and the ND filter 46 , and then enter the light detector 43 .

波長選擇濾波器45是配置在聚光透鏡44與分歧鏡41之間的檢查用的雷射光22的光路上。波長選擇濾波器45是讓檢查用的雷射光22當中僅預定的波長穿透之濾波器。波長選擇濾波器45可為例如帶通濾波器、分光濾鏡(dichroic filter)、長波通濾波器(long pass filter)以及短波通濾波器(short pass filter)之任一者，或組合了這些構成之濾波器。帶通濾波器是任意地選擇特定之波長並使其穿透之濾波器。分光濾鏡是反射特定的波長範圍之光，並使其餘的波長範圍之光穿透之濾鏡。長波通濾波器是使波長比預定的波長更長之光穿透之濾波器。短波通濾波器是使波長比預定的波長更短之光穿透之濾波器。實施形態之波長選擇濾波器45僅供可在熱感測器42及光偵測器43中測定之波長穿透。The wavelength selective filter 45 is disposed on the optical path of the inspection laser light 22 between the condenser lens 44 and the branching mirror 41 . The wavelength selection filter 45 is a filter that allows only a predetermined wavelength to pass through the inspection laser light 22 . The wavelength selection filter 45 may be, for example, any one of a bandpass filter, a dichroic filter, a long pass filter, a short pass filter, or a combination of these. The filter. A bandpass filter is a filter that arbitrarily selects a specific wavelength and passes it through. A dichroic filter is a filter that reflects light in a specific wavelength range and transmits light in other wavelength ranges. A long pass filter is a filter that transmits light with a wavelength longer than a predetermined wavelength. A shortpass filter is a filter that transmits light with a wavelength shorter than a predetermined wavelength. The wavelength selection filter 45 of the embodiment transmits only wavelengths measurable by the thermal sensor 42 and the light detector 43 .

ND濾波器46是讓已被分歧鏡41分歧之雷射光25的光量去掉一定量而穿透。藉此，可以降低入射到光偵測器43之雷射光25的光量。The ND filter 46 removes a certain amount of light from the laser light 25 that has been split by the split mirror 41 and passes through the laser light 25 . Thereby, the amount of laser light 25 incident on the photodetector 43 can be reduced.

在此，說明在具備光接收部40之雷射加工裝置1中，自動地設定用於檢測脈衝遺漏的閾值93之方法，其中前述光接收部40具有熱感測器42以及光偵測器43之雙方。圖5是顯示圖4所示之熱感測器42所接收到之雷射光24的平均輸出的推移之一例的圖表。圖6是顯示圖4所示之光偵測器43所接收到之雷射光25的輸出的推移之一例的圖表。在圖5以及圖6所示之一例中，是設成在中途將雷射加工條件從第一加工條件91變更成第二加工條件92之構成。Here, a method of automatically setting the threshold 93 for detecting pulse omission in the laser processing apparatus 1 provided with the light receiving unit 40 having the thermal sensor 42 and the photodetector 43 is explained. both sides. FIG. 5 is a graph showing an example of the transition of the average output of the laser light 24 received by the thermal sensor 42 shown in FIG. 4 . FIG. 6 is a graph showing an example of the transition of the output of the laser light 25 received by the photodetector 43 shown in FIG. 4 . In the example shown in FIGS. 5 and 6 , the laser processing condition is changed from the first processing condition 91 to the second processing condition 92 midway.

控制部54是依據熱感測器42所取得之雷射光24的平均輸出，來推定如圖5所示之加工用的雷射光23的平均輸出的推移。如圖5所示，在以第一加工條件91執行雷射加工之期間，雷射光23的平均輸出為大致固定。又，在以第二加工條件92執行雷射加工之期間，雷射光23的平均輸出為大致固定。又，藉由從第一加工條件91轉換到第二加工條件92，雷射光23的平均輸出會改變(在圖5所示之一例中為減少)。The control unit 54 estimates the transition of the average output of the processing laser light 23 as shown in FIG. 5 based on the average output of the laser light 24 acquired by the thermal sensor 42 . As shown in FIG. 5 , while the laser processing is performed under the first processing condition 91 , the average output of the laser light 23 is substantially constant. In addition, while the laser processing is performed under the second processing condition 92, the average output of the laser light 23 is substantially constant. In addition, by switching from the first processing condition 91 to the second processing condition 92, the average output of the laser light 23 will change (decrease in the example shown in FIG. 5).

又，控制部54是依據如圖6所示之光偵測器43所取得之包含雷射光25的峰值輸出之波形資料，來推定加工用的雷射光23的峰值輸出的推移。在以第一加工條件91執行雷射加工之期間，雷射光23的脈衝波形大致是一定的。又，在以第二加工條件92執行雷射加工之期間，雷射光23的脈衝波形大致是一定的。又，藉由從第一加工條件91轉換到第二加工條件92，雷射光23的脈衝波形會改變(在圖6所示之一例中為峰值減少)。In addition, the control unit 54 estimates the transition of the peak output of the processing laser light 23 based on the waveform data including the peak output of the laser light 25 obtained by the photodetector 43 as shown in FIG. 6 . While the laser processing is performed under the first processing condition 91, the pulse waveform of the laser light 23 is substantially constant. In addition, while the laser processing is performed under the second processing condition 92, the pulse waveform of the laser light 23 is substantially constant. In addition, by switching from the first processing condition 91 to the second processing condition 92, the pulse waveform of the laser light 23 changes (in the example shown in FIG. 6, the peak value decreases).

控制部54是將圖5所示之熱感測器42所取得之雷射光24的平均輸出乘以預定的係數後之值，設定為圖6所示之光偵測器43所取得之雷射光25的波形資料的脈衝遺漏的閾值93。從而，所設定之閾值93會在雷射光23的平均輸出改變之時間點改變，亦即從第一加工條件91轉換到第二加工條件92之時間點改變。The control unit 54 multiplies the average output of the laser light 24 obtained by the thermal sensor 42 shown in FIG. 5 by a predetermined coefficient, and sets the value obtained by the light detector 43 shown in FIG. 6 The waveform data has a pulse miss threshold of 25 and 93. Therefore, the set threshold 93 will change at the time point when the average output of the laser light 23 changes, that is, the time point changes from the first processing condition 91 to the second processing condition 92 .

如以上所說明，在實施形態之雷射加工裝置1中，是設為可藉由將雷射光21的一部分分離成檢查用的雷射光22並接收此雷射光22，而同時進行雷射光22的強度測定與脈衝觀測。在此方法中，因為將雷射光21的一部分分離成檢測用的雷射光22，並且將雷射光21的大部分作為加工用的雷射光23來使用，所以變得可一邊加工一邊掌握雷射光21的狀態，而變得可提升生產性。As described above, in the laser processing apparatus 1 of the embodiment, it is configured to separate a part of the laser light 21 into the inspection laser light 22 and receive the laser light 22 while simultaneously processing the laser light 22 . Intensity determination and pulse observation. In this method, a part of the laser light 21 is separated into the detection laser light 22 and most of the laser light 21 is used as the processing laser light 23. Therefore, it becomes possible to grasp the laser light 21 while processing. state, which can improve productivity.

例如，依據所偵測到之雷射光22的平均輸出的推移以及輸出的推移，可以根據這些推移低於已事先設定之閾值之情形，來推定加工用的雷射光23的輸出之降低以及脈衝遺漏。在雷射光22的輸出已降低的情況下、或觀測到脈衝遺漏的情況下，可停止加工以避免被加工物100的全部損失。又，也可將觀測到異常之瞬間的前後的各種感測器值保存為日誌(log)，並使用於異常解析。在此，所謂的各種感測器值，可包含對雷射振盪器30內部的光學元件所施加之電壓或電流、溫度等之資訊、光學檢測箱(optical box)內的溫度或濕度等之資訊。又，可以藉由累積這些資料，而利用在預知或防止不良發生上。For example, based on the detected change in the average output of the laser light 22 and the change in the output, it is possible to estimate the decrease in the output of the processing laser light 23 and the missing pulse based on the situation that these changes are lower than a preset threshold. . When the output of the laser light 22 has decreased, or when missing pulses are observed, processing can be stopped to avoid total loss of the workpiece 100 . In addition, various sensor values before and after the moment when an abnormality is observed may be saved as a log and used for abnormality analysis. Here, the so-called various sensor values may include information such as voltage or current applied to the optical element inside the laser oscillator 30, temperature, etc., information such as temperature or humidity in the optical box (optical box), etc. . In addition, by accumulating this data, it can be used to predict or prevent the occurrence of defects.

又，藉由偵測雷射光22的平均輸出以及輸出的推移，並依據平均輸出而自動設定用於檢測脈衝遺漏之閾值，也可適用在以下情況：在加工中變更加工條件，且適當的閾值改變。In addition, by detecting the average output of the laser light 22 and the transition of the output, and automatically setting the threshold for detecting pulse omission based on the average output, it can also be applied to the following situation: the processing conditions are changed during processing, and an appropriate threshold is used. change.

再者，本發明並非限定於上述實施形態之發明。亦即，在不脫離本發明之要點的範圍內，可以進行各種變形來實施。例如，控制部54亦可僅輸出以檢測單元50所取得之資訊，亦可依據所輸出之資訊來讓操作人員判斷裝置是否正常地運作。例如，亦可僅為控制部54輸出依據熱感測器42所取得之平均輸出而設定之用於檢測脈衝遺漏的閾值、與光偵測器43所取得之波形資料，亦可為操作人員依據所輸出的資訊，來判斷有無脈衝遺漏。In addition, this invention is not limited to the invention of the said embodiment. That is, various modifications can be made without departing from the gist of the present invention. For example, the control unit 54 may only output the information obtained by the detection unit 50 , or may allow the operator to determine whether the device is operating normally based on the output information. For example, the control unit 54 may only output the threshold for detecting pulse omission set based on the average output obtained by the thermal sensor 42 and the waveform data obtained by the light detector 43 , or it may be used by the operator based on The output information is used to determine whether there is any missing pulse.

1:雷射加工裝置 2:裝置本體 3:柱 10:保持工作台 11:保持面 12:夾具部 13:旋轉單元 14:X軸方向移動板 15:Y軸方向移動板 20,20-1:雷射光照射單元 21,22,23,24,25:雷射光 30,30-1:雷射振盪器 31:雷射振盪部 32:聚光透鏡 33:分離構件 40,40-1:光接收部 41:分歧鏡 42:熱感測器 43:光偵測器 44:聚光透鏡 45:波長選擇濾波器 46:ND濾波器 50:檢測單元 51:訊號放大部 52:脈衝波形資訊取得部 53:光強度資訊取得部 54:控制部 60:移動單元 61:X軸方向移動單元 62:Y軸方向移動單元 63:Z軸方向移動單元 70:拍攝單元 80:顯示單元 91:第一加工條件 92:第二加工條件 93:閾值 100:被加工物 110:框架 111:膠帶 X,Y,Z:方向 1: Laser processing device 2:Device body 3: column 10: Keep the workbench 11: Keep the surface 12: Fixture Department 13: Rotation unit 14: X-axis direction moving plate 15: Y-axis direction moving plate 20,20-1:Laser light irradiation unit 21,22,23,24,25:Laser light 30,30-1:Laser oscillator 31:Laser oscillation part 32: condenser lens 33: Separate components 40,40-1:Light receiving part 41:Divergence mirror 42:Thermal sensor 43:Light detector 44: condenser lens 45:Wavelength selection filter 46:ND filter 50:Detection unit 51: Signal amplifier section 52: Pulse waveform information acquisition part 53: Light intensity information acquisition department 54:Control Department 60:Mobile unit 61: X-axis direction moving unit 62: Y-axis direction moving unit 63:Z-axis direction moving unit 70: Shooting unit 80: Display unit 91: First processing conditions 92: Second processing conditions 93:Threshold 100: Processed object 110:Frame 111:Tape X,Y,Z: direction

圖1是顯示實施形態的雷射加工裝置之構成例的立體圖。 圖2是顯示圖1所示之雷射光照射單元的概略構成例的示意圖。 圖3是顯示雷射光照射單元的其他的概略構成例的示意圖。 圖4是顯示光接收部的其他的概略構成例的示意圖。 圖5是顯示圖4所示之熱感測器所接收到之雷射光的平均輸出的推移之一例的圖表。 圖6是顯示圖4所示之光偵測器所接收之雷射光的輸出的推移之一例的圖表。 FIG. 1 is a perspective view showing a structural example of the laser processing apparatus according to the embodiment. FIG. 2 is a schematic diagram showing an example of the schematic configuration of the laser light irradiation unit shown in FIG. 1 . FIG. 3 is a schematic diagram showing another schematic configuration example of the laser light irradiation unit. FIG. 4 is a schematic diagram showing another schematic configuration example of the light receiving unit. FIG. 5 is a graph showing an example of transition of the average output of laser light received by the thermal sensor shown in FIG. 4 . FIG. 6 is a graph showing an example of transition of the laser light output received by the light detector shown in FIG. 4 .

10:保持工作台 10: Keep the workbench

20:雷射光照射單元 20:Laser light irradiation unit

21,22,23:雷射光 21,22,23:Laser light

30:雷射振盪器 30:Laser oscillator

31:雷射振盪部 31:Laser oscillation part

32:聚光透鏡 32: condenser lens

33:分離構件 33: Separate components

40:光接收部 40:Light receiving part

50:檢測單元 50:Detection unit

51:訊號放大部 51: Signal amplifier section

52:脈衝波形資訊取得部 52: Pulse waveform information acquisition part

53:光強度資訊取得部 53: Light intensity information acquisition department

54:控制部 54:Control Department

100:被加工物 100: Processed object

Claims (5)

一種雷射加工裝置，其特徵在於具備： 雷射振盪器，生成雷射光； 聚光透鏡，將藉由該雷射振盪器所生成之雷射光聚光； 分離構件，將藉由該雷射振盪器所生成之雷射光分離成檢查用的雷射光、與用於聚光於被加工物之加工用的雷射光； 光接收部，接收藉由該分離構件所分離出之檢查用的雷射光； 檢測單元，從藉由該光接收部所接收到之雷射光，取得和該雷射光的強度有關之資訊、與和該雷射光的脈衝波形有關之資訊；及 控制部，輸出以該檢測單元所取得之資訊。 A laser processing device, characterized by: Laser oscillator generates laser light; The condenser lens condenses the laser light generated by the laser oscillator; a separation member that separates the laser light generated by the laser oscillator into laser light for inspection and laser light for processing that is focused on the workpiece; The light receiving part receives the inspection laser light separated by the separation member; The detection unit obtains information related to the intensity of the laser light and information related to the pulse waveform of the laser light from the laser light received through the light receiving part; and The control unit outputs the information obtained by the detection unit. 如請求項1之雷射加工裝置，其更具備用於將藉由該分離構件所分離出之檢查用的雷射光分歧之分歧鏡， 該光接收部具有： 熱感測器，接收經該分歧鏡所分歧出之其中一道雷射光，並測定該雷射光的平均輸出；及 光偵測器，接收經該分歧鏡所分歧出之另一道雷射光，來取得和該雷射光的脈衝波形有關之資訊。 The laser processing device of claim 1 further includes a split mirror for dividing the inspection laser light separated by the separation member, The light receiving part has: The thermal sensor receives one of the laser lights branched by the branch mirror and measures the average output of the laser light; and The light detector receives another laser light split by the split mirror to obtain information related to the pulse waveform of the laser light. 如請求項2之雷射加工裝置，其配設成： 該熱感測器接收經該分歧鏡所反射之雷射光， 該光偵測器接收已穿透該分歧鏡之雷射光。 For example, the laser processing device of claim 2 is configured as follows: The thermal sensor receives the laser light reflected by the bifurcation mirror, The light detector receives the laser light that has penetrated the bifurcation mirror. 如請求項3之雷射加工裝置，其中在該分歧鏡與該光偵測器之間配設ND濾波器。The laser processing device of claim 3, wherein an ND filter is disposed between the branching mirror and the light detector. 如請求項1至4中任一項之雷射加工裝置，其中以該檢測單元所取得之和該雷射光的脈衝波形有關之資訊，包含有關於有無脈衝遺漏之資訊， 該控制部依據該雷射光的平均輸出，自動地設定用於檢測脈衝遺漏的閾值。 As claimed in any one of claims 1 to 4, the laser processing device, wherein the information obtained by the detection unit and related to the pulse waveform of the laser light includes information about whether there is a missing pulse, The control unit automatically sets a threshold for detecting pulse omission based on the average output of the laser light.
TW112128168A 2022-08-02 2023-07-27 Laser machining apparatus capable of controlling the state of laser light without reducing productivity TW202406659A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-123263 2022-08-02
JP2022123263A JP2024020801A (en) 2022-08-02 2022-08-02 Laser processing device

Publications (1)

Publication Number Publication Date
TW202406659A true TW202406659A (en) 2024-02-16

Family

ID=89666589

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112128168A TW202406659A (en) 2022-08-02 2023-07-27 Laser machining apparatus capable of controlling the state of laser light without reducing productivity

Country Status (4)

Country Link
JP (1) JP2024020801A (en)
KR (1) KR20240018366A (en)
CN (1) CN117483938A (en)
TW (1) TW202406659A (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10305420A (en) 1997-03-04 1998-11-17 Ngk Insulators Ltd Method for fabricating matrix made up of oxide single crystal and method for manufacturing functional device

Also Published As

Publication number Publication date
CN117483938A (en) 2024-02-02
JP2024020801A (en) 2024-02-15
KR20240018366A (en) 2024-02-13

Similar Documents

Publication Publication Date Title
US10533954B2 (en) Apparatus and methods for combined brightfield, darkfield, and photothermal inspection
JP5538072B2 (en) Defect inspection method and apparatus
US8124909B2 (en) Laser processing apparatus
KR102584062B1 (en) Laser processing device amd method of verifying output thereof
TWI768091B (en) Height detection device and laser processing device
US6226079B1 (en) Defect assessing apparatus and method, and semiconductor manufacturing method
US7952701B2 (en) Surface inspection method and inspecting device using the same
JP5579574B2 (en) Defect inspection method and apparatus
US20200384571A1 (en) Laser oscillator support table and adjustment method of laser oscillator support table
JP2017067613A (en) Inspection device and inspection method
JP7418169B2 (en) laser processing equipment
TW202406659A (en) Laser machining apparatus capable of controlling the state of laser light without reducing productivity
JP7475211B2 (en) Inspection method for laser processing equipment
JPS62112322A (en) Laser annealing device
KR20210058657A (en) Image capturing device
JP7356235B2 (en) laser processing equipment
JP4036713B2 (en) Nondestructive inspection equipment
JP7266430B2 (en) Laser processing equipment
US20230152241A1 (en) Simultaneous back and/or front and/or bulk defect detection
TW202313235A (en) Laser processing device capable of detecting an abnormality of a spatial light modulator at high speed
JP2024071062A (en) Laser irradiation device
JP2022099713A (en) Laser processing device
JP2024068849A (en) Laser beam adjustment method and laser irradiation device
JP2024016673A (en) Laser processing device
JP2023030432A (en) temperature measuring device