TW202405355A - Heating device and heating plate - Google Patents

Heating device and heating plate Download PDF

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TW202405355A
TW202405355A TW112139116A TW112139116A TW202405355A TW 202405355 A TW202405355 A TW 202405355A TW 112139116 A TW112139116 A TW 112139116A TW 112139116 A TW112139116 A TW 112139116A TW 202405355 A TW202405355 A TW 202405355A
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heating
plate
heated
plates
temperature
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TWI841497B (en
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神吉利彰
上川敬二
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日商九州日昌股份有限公司
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D11/00Arrangement of elements for electric heating in or on furnaces
    • F27D11/02Ohmic resistance heating
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1339Gaskets; Spacers; Sealing of cells
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
  • Furnace Details (AREA)
  • Liquid Crystal (AREA)
  • Control Of Resistance Heating (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)

Abstract

The present invention provides a heating device that achieves high temperature uniformity in a plane of a large-area plate-shaped or sheet-shaped object to be heated. This heating device comprises a plurality of heating plates vertically disposed at intervals, and a heating space demarcated by heating surfaces of heating plates vertically facing each other. Each of the heating plates has a rectangular metallic plate, and a plurality of heater elements (11A-11C) which are embedded in the metallic plate and on which heating wires (13A-13C) are routed. The heater elements (11A-11C) are arranged in an arrangement direction L of the metallic plate, and each extend in an extension direction W orthogonal to the arrangement direction L. The plurality of heater elements (11A-11C) vary in width in the arrangement direction L, and in the extension direction W, the respective routing densities of the heating wires (13A-13C) of the plurality of heater elements (11A-11C) vary.

Description

加熱裝置及加熱板Heating devices and heating plates

本發明係有關於一種加熱裝置,其用於玻璃基板、半導體導線架,或是其他金屬板、合成樹脂板等等各種板狀構件或片狀構件之熱處理。The present invention relates to a heating device that is used for heat treatment of glass substrates, semiconductor lead frames, or other metal plates, synthetic resin plates, and other plate-shaped or sheet-shaped components.

對於作為液晶顯示面板等等之構成構件而較大型之玻璃基板進行熱處理之裝置,已提案有如下的加熱爐,其在爐主體內,於上下方向隔著固定間隔,配置許多的層架狀加熱器,並以在該等層架狀加熱器之間所形成之各個空間部分,分別用作乾燥室;該層架狀加熱器,係由兩面加熱式之遠紅外線面板加熱器所構成,該兩面加熱式之遠紅外線面板加熱器係藉由散熱片之加熱,而從兩面輻射出遠紅外線(參照專利文獻1。)As a device for heat-treating relatively large glass substrates that are components of liquid crystal display panels, etc., a heating furnace has been proposed, in which many rack-like heating racks are arranged at fixed intervals in the upper and lower directions within the furnace body. The space parts formed between the rack-shaped heaters are used as drying chambers respectively; the rack-shaped heaters are composed of far-infrared panel heaters with double-sided heating. Heating-type far-infrared panel heaters radiate far-infrared rays from both sides by heating the heat sink (see Patent Document 1.)

於專利文獻1所記載之加熱爐的情況,由於配置著許多由兩面加熱式之遠紅外線面板加熱器所構成的層架狀加熱器,所以其優點係能以這些層架狀加熱器之間形成的各個空間部(乾燥室),有效率地進行加熱。In the case of the heating furnace described in Patent Document 1, since many rack-shaped heaters composed of double-sided heating far-infrared panel heaters are arranged, the advantage is that it can be formed between these rack-shaped heaters. Each space part (drying chamber) is heated efficiently.

然而,配置於上下方向之許多層架狀加熱器所發出之熱能,由於會在加熱爐內上升,而有集中在靠近爐內之頂板壁面附近區域的傾向;所以爐內上部區域之溫度,會高於爐內下部區域之溫度,而極為難以去除此種爐內上部區域與爐內下部區域之間的溫差。However, the heat energy emitted by the many shelf-like heaters arranged in the up and down direction will rise in the heating furnace and tend to be concentrated in the area near the roof wall surface in the furnace; therefore, the temperature in the upper area of the furnace will Higher than the temperature in the lower area of the furnace, it is extremely difficult to remove the temperature difference between the upper area in the furnace and the lower area in the furnace.

專利文獻2揭露一種加熱裝置,其構成係具備:在以隔熱材料所圍出的空間內隔著距離而配置成相向的複數個加熱用壁體、設於加熱用壁體的發熱手段、在加熱用壁體之間隔著距離而配置之複數個傳熱用壁體、在傳熱用壁體之間配置成層架狀的複數個熱輻射構件、以及在上下方向相鄰的熱輻射構件之間設置的被加熱物之加熱空間。 於專利文獻2所揭露的加熱裝置,由於係以設在垂直方向的加熱用壁體加熱,所以能容納在加熱空間內之被加熱物的尺寸有限。專利文獻2所揭露的技術,原本就沒有設想到要均勻地加熱大面積之板狀或片狀被加熱物,所以難以使大面積之被加熱物,以面內均勻之溫度進行加熱。 [習知技術文獻] [專利文獻] Patent Document 2 discloses a heating device, which is configured to include a plurality of heating walls arranged to face each other at a distance in a space surrounded by a heat insulating material, a heating means provided on the heating wall, and A plurality of heat transfer walls arranged with a distance between the heating walls, a plurality of heat radiation members arranged in a shelf shape between the heat transfer walls, and between the heat radiation members adjacent in the vertical direction Set the heating space of the heated object. Since the heating device disclosed in Patent Document 2 is heated by a heating wall provided in a vertical direction, the size of the object to be heated that can be accommodated in the heating space is limited. The technology disclosed in Patent Document 2 was not originally intended to uniformly heat a large-area plate or sheet-shaped object, so it is difficult to heat a large-area object at a uniform temperature within the surface. [Known technical documents] [Patent Document]

[專利文獻1]日本特開2001-317872號公報 [專利文獻2]日本特開2005-352306號公報 [Patent Document 1] Japanese Patent Application Publication No. 2001-317872 [Patent Document 2] Japanese Patent Application Publication No. 2005-352306

[發明所欲解決的問題][Problem to be solved by the invention]

一般而言,若要在廣大的面內精度良好地使溫度分佈均勻,由於加熱裝置係配置於大氣中,常常受到外在干擾影響,所以十分困難。若要設置許多加熱器及許多溫度感測器以進行面內溫度管理,是有可能使廣大面積精度良好地均勻加熱,但裝置的成本就會墊高。再者,若要設置許多加熱器及許多溫度感測器,則也會難以於上下方向堆疊加熱空間。Generally speaking, it is very difficult to uniformly distribute the temperature over a wide surface with good accuracy because the heating device is placed in the atmosphere and is often affected by external interference. If many heaters and many temperature sensors are installed for in-plane temperature management, it is possible to heat a large area evenly with good accuracy, but the cost of the device will increase. Furthermore, if many heaters and many temperature sensors are installed, it will be difficult to stack the heating spaces in the vertical direction.

本發明所欲解決之課題,係提供一種加熱裝置,能以低成本而使得大面積之板狀或片狀被加熱物均勻地加熱。 [解決問題之技術手段] The problem to be solved by the present invention is to provide a heating device that can uniformly heat a large-area plate-shaped or sheet-shaped object to be heated at low cost. [Technical means to solve problems]

本發明之加熱裝置,具備: 複數之加熱板,於上下方向隔著間隔而配置;以及 加熱空間,藉由於上下方向相向之該加熱板的加熱面所區劃而成,用以容納被加熱物; 各個該加熱板,具有 矩形之金屬製板、以及 複數之發熱體元件,內置於該金屬製板,並配設有發熱絲; 該複數之發熱體元件,係於該金屬製板的第1方向排列,並且在正交於該第1方向的第2方向上各自延伸; 該複數之發熱體元件,於該第1方向,其寬度有所變化、或其排列間隔有所變化; 於該第2方向,該複數之發熱體元件之各個的該發熱絲,配線密度有所變化。 [發明之效果] The heating device of the present invention has: A plurality of heating plates are arranged at intervals in the up and down direction; and The heating space is divided by the heating surfaces of the heating plate facing each other in the up and down direction, and is used to accommodate the object to be heated; Each of the heating plates has Rectangular metal plates, and A plurality of heating elements are built into the metal plate and equipped with heating wires; The plurality of heating elements are arranged in the first direction of the metal plate, and each extends in a second direction orthogonal to the first direction; The width of the plurality of heating elements changes in the first direction, or the arrangement interval changes; In the second direction, the wiring density of the heating wires of each of the plurality of heating elements changes. [Effects of the invention]

若藉由本發明,由於係在相向之加熱板之間區劃出加熱空間,並使得內置於加熱板的發熱體元件之構成最佳化,所以可以使得大面積之板狀或片狀被加熱物均勻地加熱。According to the present invention, since a heating space is defined between opposing heating plates and the structure of the heating element built in the heating plate is optimized, a large-area plate-like or sheet-like object to be heated can be uniformly heated Ground heating.

以下,根據圖式,針對作為本發明實施形態之加熱裝置1,進行說明。 如圖1〜圖7所示,加熱裝置1,具有於上下方向等間隔配置之複數片矩形的加熱板10,並具有以相向之加熱板10、10所區劃出而用以容納板狀或片狀之被加熱物20的加熱空間30。更進一步地,還具有用以調節各個加熱板10之溫度的溫度調節裝置40。又,雖然使加熱板10於上下方向等間隔配置,但並不限定於此,亦可並非等間隔。 Hereinafter, the heating device 1 as an embodiment of the present invention will be described based on the drawings. As shown in Figures 1 to 7, the heating device 1 has a plurality of rectangular heating plates 10 arranged at equal intervals in the up and down direction, and is divided by opposing heating plates 10, 10 to accommodate plates or sheets. The heating space 30 of the object to be heated 20 is shaped like this. Furthermore, there is also a temperature adjusting device 40 for adjusting the temperature of each heating plate 10 . In addition, although the heating plates 10 are arranged at equal intervals in the up and down direction, the heating plates 10 are not limited to this, and the intervals may not be equal.

圖1繪示加熱裝置1之正面;複數之加熱板10,其正面側之左右端部係以左右一對支持板50L、50R所支撐,同時其背面側之左右端部亦同樣地以左右一對支持板50L、50R所支撐。正面側及背面側之一對支持板50L、50R之各個,係彼此相向而配置;於該等相向面,係於上下方向等間隔(相當於加熱空間30之高度)地在水平方向上形成複數之剖面矩形之凹槽51(參照圖1及圖2)。於這些複數之凹槽51,分別嵌入有加熱板10的正面側及背面側之左右端部,使各個加熱板10在上下方向定位。容納於加熱空間30內的被加熱物,係以上下之加熱板10加熱。Figure 1 shows the front side of the heating device 1; the left and right ends of the plurality of heating plates 10 on the front side are supported by a pair of left and right support plates 50L and 50R, and the left and right ends of the back side are similarly supported by a pair of left and right support plates 50L and 50R. Supported by support plates 50L and 50R. Each of the pair of support plates 50L and 50R on the front side and the back side is arranged facing each other; on the facing surfaces, a plurality of supporting plates are formed in the horizontal direction at equal intervals (corresponding to the height of the heating space 30) in the up and down direction. The groove 51 has a rectangular cross section (refer to Figures 1 and 2). The left and right ends of the front side and the back side of the heating plate 10 are respectively embedded in these plural grooves 51 so that each heating plate 10 is positioned in the up and down direction. The object to be heated contained in the heating space 30 is heated by the upper and lower heating plates 10 .

加熱空間30的正面側及背面側有開口,而加熱空間30的兩個側面,也於支持板50L、50L之間及支持板50R、50R之間有開口。亦即,加熱空間30的四方有開口。 藉由在各加熱空間30具備開口部,就能使加熱裝置1所進行之熱處理步驟與其他步驟連續性的銜接。 The heating space 30 has openings on the front side and the back side, and the two sides of the heating space 30 also have openings between the support plates 50L and 50L and between the support plates 50R and 50R. That is, the heating space 30 has openings on four sides. By having an opening in each heating space 30, the heat treatment step performed by the heating device 1 can be continuously connected with other steps.

於各一對支持板50L、50R的相向面,更進一步地,以未圖示之螺釘等,將剖面L字形之帶狀的導條構件60L、60R,固定在比起凹槽51稍微上方處(參照圖1~3、及圖11);該導條構件60L、60R係用以將被加熱物20引導至加熱空間30內。導條構件60L、60R,係朝向加熱裝置1的前後方向L(參照圖3)水平配設。於導條構件60L、60R的近前側(加熱裝置1的前側,於圖3係左側),安裝有誘導構件61L、61R,用以將被加熱物20順暢地導引至加熱空間30內。On the opposing surfaces of each pair of support plates 50L and 50R, further, strip-shaped guide members 60L and 60R having an L-shaped cross section are fixed slightly above the groove 51 with screws (not shown). (Refer to FIGS. 1 to 3 and 11 ); the guide members 60L and 60R are used to guide the object 20 to be heated into the heating space 30 . The guide bar members 60L and 60R are arranged horizontally toward the front-rear direction L (see FIG. 3 ) of the heating device 1 . Guidance members 61L and 61R are installed on the near side of the guide bar members 60L and 60R (the front side of the heating device 1, the left side in FIG. 3) to smoothly guide the object 20 to be heated into the heating space 30.

加熱裝置1之正面側及背面側的一對支持板50L、50R各自的上端側及下端側,分別以頂板71及底板72連結。底板72的底面分別安裝有較短的腳柱構件73L、73R,這些腳柱構件73L、73R的下端部則固定於中板74。於中板74的底面,分別安裝有較長的腳柱構件75L、75R,這些腳柱構件75L、75R的下端部則固定於基台76。The upper and lower end sides of the pair of support plates 50L and 50R on the front and rear sides of the heating device 1 are connected by a top plate 71 and a bottom plate 72 respectively. Short leg members 73L and 73R are respectively installed on the bottom surface of the bottom plate 72 , and the lower ends of these leg members 73L and 73R are fixed to the middle plate 74 . Longer leg members 75L and 75R are respectively installed on the bottom surface of the middle plate 74 , and the lower ends of these leg members 75L and 75R are fixed to the base 76 .

較佳係使加熱裝置1之正面側的左右一對支持板50L、50R,以及其背面側的左右一對支持板50L、50R由不鏽鋼形成,並使頂板71、底板72、腳柱構件73L、73R、中板74、腳柱構件75L、75R及基台76,由材質相同於左右一對支持板50L、50R的不鏽鋼形成,但並不限定於此,亦可由鋁或鋁合金(或者是為了抑制輻射熱之發散而施作無光澤表面處理的鋁或鋁合金)形成。Preferably, the pair of left and right support plates 50L, 50R on the front side of the heating device 1 and the pair of left and right support plates 50L, 50R on the back side of the heating device 1 are made of stainless steel, and the top plate 71, the bottom plate 72, the leg members 73L, 73R, the middle plate 74, the leg members 75L, 75R and the base 76 are made of stainless steel with the same material as the pair of left and right support plates 50L, 50R, but are not limited thereto, and may also be made of aluminum or aluminum alloy (or for Formed by aluminum or aluminum alloys with a matte surface treatment to suppress the dissipation of radiant heat.

如圖4A所示,將板狀之被加熱物20,從誘導構件61L、61R側水平地插入加熱空間30內。如圖4B所示,被加熱物20會以夾在上下之加熱板10之間的狀態而受到加熱。在加熱處理後,被加熱物20會如圖4C所示,從相反於誘導構件61L、61R側的背面側之開口,沿水平方向搬出。As shown in FIG. 4A , the plate-shaped object to be heated 20 is horizontally inserted into the heating space 30 from the induction member 61L, 61R side. As shown in FIG. 4B , the object 20 to be heated is heated while being sandwiched between the upper and lower heating plates 10 . After the heat treatment, the object 20 to be heated is moved out in the horizontal direction from the opening on the back side opposite to the side of the induction members 61L and 61R, as shown in FIG. 4C .

在此,針對本實施形態之加熱板10,進行說明。 加熱板10,如圖5〜圖7所示,內置有3個發熱體元件11A、11B、11C。在此,將排列有發熱體元件11A、11B、11C的方向視作排列方向L(第1方向),將發熱體元件11A、11B、11C的延伸方向視作延伸方向W(第2方向)。 發熱體元件11A、11B、11C之各個係所謂的面狀加熱器,其為於大致矩形之雲母等電絶緣性的片狀物12A、12B、12C,配線有成鋸齒狀的發熱絲13A、13B、13C。 於發熱體元件11A、11B、11C,在片狀物12A、12B之延伸方向W上,相較於中央區域W2,其兩側之端部區域W1、W1的發熱絲13A、13B、13C的配線密度較高。 發熱體元件11A、11B、11C之排列方向L的寬度,係中央區域L2之發熱體元件11B相對較寬,而兩端部區域L1之發熱體元件11A、11C的寬度相對較窄。發熱體元件11A、11C係相同構成,而寬度及配線密度之分佈亦屬彼此相同。 加熱板10,係以不鏽鋼合金等的金屬製板15A、15B夾住發熱體元件11A、11B、11C之兩面而構成。金屬製板15A、15B,其周緣部係以焊接等而彼此接合。構成加熱板10之兩面的金屬製板15A、15B,會是同樣之溫度分佈。 Here, the heating plate 10 of this embodiment will be described. The heating plate 10, as shown in FIGS. 5 to 7, has three heating elements 11A, 11B, and 11C built therein. Here, the direction in which the heating elements 11A, 11B, and 11C are arranged is regarded as the arrangement direction L (first direction), and the extending direction of the heating elements 11A, 11B, and 11C is regarded as the extending direction W (the second direction). Each of the heating element elements 11A, 11B, and 11C is a so-called planar heater, which is made of a substantially rectangular electrically insulating sheet 12A, 12B, or 12C of mica or the like, with heating wires 13A, 13B wired in a zigzag shape. ,13C. In the heating element elements 11A, 11B, 11C, in the extending direction W of the sheets 12A, 12B, the wiring of the heating wires 13A, 13B, 13C in the end regions W1, W1 on both sides of the central region W2 Density is higher. The width of the heating element 11A, 11B, and 11C in the arrangement direction L is that the heating element 11B in the central region L2 is relatively wide, while the width of the heating element 11A and 11C in both end regions L1 is relatively narrow. The heating element elements 11A and 11C have the same structure, and the distributions of width and wiring density are also the same. The heating plate 10 is configured by sandwiching both surfaces of the heating element elements 11A, 11B, and 11C with metal plates 15A and 15B made of stainless steel alloy or the like. The metal plates 15A and 15B have their peripheral portions joined to each other by welding or the like. The metal plates 15A and 15B constituting both sides of the heating plate 10 have the same temperature distribution.

於本實施形態,係使內置於加熱板10之發熱體元件為複數,並使各發熱體元件的發熱絲,從延伸方向W上的一個端部配置到另一個端部。然後,藉由變化發熱體元件之排列方向L的寬度,同時也變化延伸方向W的配線密度,而使得加熱板10之發熱量的面內分佈,能夠因應承受自加熱板10所設置之環境的外在干擾。藉由使得加熱板10之發熱量的面內分佈,因應環境外在干擾而最佳化,同時組合上述之溫度調節裝置40,而得以實現加熱板10之溫度的高度面內均勻性。又,加熱板10之發熱體元件的構成僅為一例,可以因應環境外在干擾而進行各種改變,自不需贅言。In this embodiment, a plurality of heating elements are built into the heating plate 10, and the heating wires of each heating element are arranged from one end in the extending direction W to the other end. Then, by changing the width of the heating elements in the arrangement direction L and also changing the wiring density in the extension direction W, the in-plane distribution of the heat generated by the heating plate 10 can be adapted to withstand the environment in which the heating plate 10 is installed. External distractions. By optimizing the in-plane distribution of the heat generated by the heating plate 10 in response to external environmental disturbances and combining the above-mentioned temperature adjustment device 40, a high degree of in-plane uniformity of the temperature of the heating plate 10 can be achieved. In addition, the structure of the heating element of the heating plate 10 is just an example, and it goes without saying that it can be changed in various ways in response to external interference in the environment.

在各個加熱板10,設有由熱電偶等所構成之溫度感測器14A、14B。 溫度感測器14A,係在排列方向L上,設於發熱體元件11B的中央Ct;溫度感測器14B,係設在其中一個端部區域L1的發熱體元件11A之大致中央。溫度感測器之個數並不限定於此,但1片加熱板10至少需要設置一個溫度感測器。 於發熱體元件11C,並未配設溫度感測器。發熱體元件11C,係與發熱體元件11A左右對稱地形成,與發熱體元件11A的大小及構造相同。發熱體元件11C上之溫度分佈,可以從發熱體元件11A的檢測溫度推估。亦即,藉由使複數之發熱體元件的配置或構成,相對於排列方向L及延伸方向W之各自的中央線對稱,可以削減溫度感測器的數量。 Each heating plate 10 is provided with temperature sensors 14A and 14B composed of thermocouples and the like. The temperature sensor 14A is located in the center Ct of the heating element 11B in the arrangement direction L. The temperature sensor 14B is located approximately in the center of the heating element 11A in one of the end regions L1. The number of temperature sensors is not limited to this, but one heating plate 10 needs to be equipped with at least one temperature sensor. The heating element 11C is not provided with a temperature sensor. The heating element 11C is formed bilaterally symmetrically with the heating element 11A, and has the same size and structure as the heating element 11A. The temperature distribution on the heating element 11C can be estimated from the detected temperature of the heating element 11A. That is, by making the arrangement or structure of the plurality of heating elements symmetrical with respect to the respective center lines of the arrangement direction L and the extension direction W, the number of temperature sensors can be reduced.

如圖5所示,從加熱板10之延伸方向W之一端的面,使得對發熱絲13A、13B、13C供給電流之電源線16導出至外部;而用以將溫度感測器14A、14B連接至溫度調節裝置40的纜線17,也從加熱板10之延伸方向W之一端的面導出至外部。此點使得在堆疊加熱板10時,不會讓電源線16及纜線17干擾加熱板10,因此有很大的益處。As shown in FIG. 5 , from the surface of one end of the heating plate 10 in the extending direction W, the power wire 16 that supplies current to the heating wires 13A, 13B, and 13C is led to the outside; and is used to connect the temperature sensors 14A and 14B. The cable 17 to the temperature adjustment device 40 is also led out from the surface of one end of the heating plate 10 in the extending direction W to the outside. This feature prevents the power cord 16 and the cable 17 from interfering with the heating plate 10 when the heating plates 10 are stacked, which is of great benefit.

圖1所示之溫度調節裝置40,分別電性連接著各加熱板10的發熱絲13A、13B、13C,而可以分別獨立地控制對各發熱絲13A、13B、13C供給之電力。具體而言,溫度調節裝置40,係獨立地控制複數之加熱板10的複數之發熱體元件11A、11B、11C各自之發熱量,以使設於複數之加熱板10之各個的溫度感測器14A、14B的檢測溫度,能追隨目標溫度。 於一片加熱板10之溫度調節,在例如中央區域之溫度高於目標溫度、而端部區域之溫度低於目標溫度的情況下,係藉由相對性減少對於中央區域L2之發熱絲13B的供給電力、並相對性增加對於雙方之端部區域L1之發熱絲13A、13C的供給電力,而可以不論環境外在干擾,皆使該加熱板10的面內之溫度分佈均勻化。 若堆疊了複數之加熱板10,則由於熱能會從下方朝向上方上升,所以配置於上方的加熱板10之溫度,會高於配置於下方的加熱板10。溫度調節裝置40會控制電力供給,而相對性減少配置於上方的加熱板10之發熱體元件11A、11B、11C各自之發熱量,並相對性增加配置於下方的加熱板10之發熱體元件11A、11B、11C各自之發熱量,而使複數之加熱板10的全體之溫度均勻化。 其結果,在加熱裝置1之全部的加熱空間30,皆可均勻地加熱大面積的板狀或片狀之被加熱物20。 The temperature regulating device 40 shown in FIG. 1 is electrically connected to the heating wires 13A, 13B, and 13C of each heating plate 10, and can independently control the power supplied to each of the heating wires 13A, 13B, and 13C. Specifically, the temperature adjustment device 40 independently controls the heating amounts of the plurality of heating elements 11A, 11B, and 11C of the plurality of heating plates 10 so that the temperature sensors provided on each of the plurality of heating plates 10 The detection temperatures of 14A and 14B can follow the target temperature. The temperature of a heating plate 10 is adjusted by relatively reducing the supply of the heating wire 13B to the central area L2 when, for example, the temperature in the central area is higher than the target temperature and the temperature in the end area is lower than the target temperature. The power supplied to the heating wires 13A and 13C in both end regions L1 is relatively increased, so that the temperature distribution within the surface of the heating plate 10 can be uniformized regardless of external interference from the environment. If a plurality of heating plates 10 are stacked, the temperature of the heating plate 10 arranged above will be higher than that of the heating plate 10 arranged below because the heat energy will rise from below to above. The temperature regulating device 40 controls the power supply to relatively reduce the calorific value of each of the heating elements 11A, 11B, and 11C of the heating plate 10 arranged above, and to relatively increase the heating element 11A of the heating plate 10 arranged below. , 11B, and 11C respectively, thereby making the entire temperature of the plurality of heating plates 10 uniform. As a result, the large-area plate-shaped or sheet-shaped object to be heated 20 can be heated uniformly in the entire heating space 30 of the heating device 1 .

內置於加熱板10之發熱體元件11A、11B、11C,亦可係例如以下說明之面狀加熱器、或帶狀加熱器。 面狀加熱器,可依發熱絲之材質或形狀,而舉出例如下述2種,以作為一例。 1)線材型 材質:Ni-Cr系(鎳鉻絲)、Fe-Cr-AI系(鐵-鉻-鋁絲)、鐵鉻鋁電阻絲等 例如,將線材狀之發熱絲捲繞於絶緣物,或是平貼於絶緣物平面而配線者。若是將線材捲繞於絶緣物之類型,可以藉由變化捲繞的間距而得以疏密捲繞。再者,若是使線材平貼於絶緣物平面之類型,則可以藉由線材的佈局而確保緻密面。 2)帶狀類型(亦稱為加熱帶) 材質:Ni-Cr系(鎳鉻線)、Fe-Cr-AI系(鐵-鉻-鋁線)、不鏽鋼線等 此係將帶狀之發熱絲捲繞於絶緣物、或是由片狀經蝕刻而配線成平面狀者。若是對絶緣物捲繞帶狀物之類型,可以藉由變化捲繞的間距而得以緻密捲繞。再者,若是藉由蝕刻而成型之類型,則可以藉由圖案佈局而實現疏密面。 The heating element elements 11A, 11B, and 11C built in the heating plate 10 may be, for example, planar heaters or strip heaters described below. The following two types of planar heaters can be cited as examples, depending on the material or shape of the heating wire. 1) Wire type Material: Ni-Cr series (nickel-chromium wire), Fe-Cr-AI series (iron-chromium-aluminum wire), iron-chromium-aluminum resistance wire, etc. For example, a wire-shaped heating wire is wound around an insulator, or laid flat against the plane of the insulator for wiring. If the wire is wound around an insulator, it can be wound more densely by changing the winding pitch. Furthermore, if it is a type where the wires are flat against the plane of the insulator, a dense surface can be ensured by the layout of the wires. 2) Band type (also called heating band) Material: Ni-Cr series (nickel-chromium wire), Fe-Cr-AI series (iron-chromium-aluminum wire), stainless steel wire, etc. This is a method of winding a strip-shaped heating wire around an insulator, or etching a sheet and wiring it into a flat shape. If it is the type of winding tape for insulation, dense winding can be achieved by changing the winding pitch. Furthermore, if it is a type formed by etching, dense and dense surfaces can be achieved through pattern layout.

於上述實施形態,係將發熱體元件11A、11B、11C形成為三個區域,分別有發熱絲13A、13B、13C之配線密度較為疏鬆的中央區域W2、以及配線密度較為緻密的兩側之端部區域W1、W1;但當然不限定於此,可以形成更多區域。再者,構成加熱板10之發熱體元件的數量亦不限定於3個,也可排列4個以上而形成。更進一步地,關於發熱絲13A、13B、13C之配線密度,係設為相較於寬度方向上的中央區域W2,要使兩側之端部區域W1階段性地變密;但當然亦可係由寬度方向之中央,朝向兩側端部逐步地變密。In the above embodiment, the heating elements 11A, 11B, and 11C are formed into three regions, including the central region W2 where the wiring density of the heating wires 13A, 13B, and 13C is relatively loose, and the ends on both sides where the wiring density is relatively dense. regions W1, W1; but of course, it is not limited to this, and more regions can be formed. Furthermore, the number of heating element elements constituting the heating plate 10 is not limited to three, and four or more heating elements may be arranged. Furthermore, the wiring density of the heating wires 13A, 13B, and 13C is set so that the end regions W1 on both sides become denser in stages compared with the central region W2 in the width direction; but of course, it may also be It gradually becomes denser from the center in the width direction to the ends on both sides.

其他實施形態 加熱板10,雖揭露了在2片金屬製板之間夾著面狀加熱器者;但亦可係在1片金屬板,內置棒狀加熱器者。 如圖8~圖10所示之加熱板100,係在大致矩形之1片金屬製板101,於排列方向L排列複數之孔洞102,而這些孔洞係在正交於排列方向L的延伸方向W上延伸。於複數之孔洞102,分別插入棒狀加熱器103。 棒狀加熱器103在排列方向L的排列間隔,係由中央Ct至其兩端E,一路變化成逐漸縮窄。棒狀加熱器103,係相對於中央Ct而左右對稱地配置。又,複數之孔洞102,較佳係通孔,但當然亦可非通孔,只要考量棒狀加熱器103之性能等再適當決定即可。 如圖10所示,棒狀加熱器103在延伸方向W上,係兩端部區域W1、W1的棒狀加熱器103之發熱絲103A的配線密度比中央區域W2更高。 於本實施形態,作為內置於加熱板100之發熱體元件的棒狀加熱器103為複數,並使各棒狀加熱器103,從加熱板100之延伸方向W上的一個端部配置到另一個端部。然後,藉由變化發熱體元件之排列方向L的排列間隔,同時也變化延伸方向W的配線密度,而使得加熱板100之發熱量的面內分佈,能夠因應承受自加熱板100所設置之環境的外在干擾。藉由將加熱板100之發熱量的面內分佈,因應環境外在干擾而最佳化,同時組合上述之溫度調節裝置40,而得以實現加熱板100之溫度的高度面內均勻性。 Other implementation forms The heating plate 10 is disclosed as having a planar heater sandwiched between two metal plates; it may also be attached to one metal plate and a rod-shaped heater is built-in. The heating plate 100 shown in FIGS. 8 to 10 is a generally rectangular metal plate 101 with a plurality of holes 102 arranged in the arrangement direction L, and these holes are arranged in the extending direction W orthogonal to the arrangement direction L. Extend up. Rod-shaped heaters 103 are inserted into the plurality of holes 102 respectively. The arrangement intervals of the rod heaters 103 in the arrangement direction L gradually narrow from the center Ct to both ends E. The rod-shaped heater 103 is arranged symmetrically with respect to the center Ct. In addition, the plurality of holes 102 are preferably through holes, but of course they may not be through holes. It can be appropriately determined by considering the performance of the rod-shaped heater 103 and so on. As shown in FIG. 10 , in the extending direction W of the rod-shaped heater 103 , the wiring density of the heating wires 103A in the two end regions W1 and W1 of the rod-shaped heater 103 is higher than that in the central region W2 . In this embodiment, there are a plurality of rod-shaped heaters 103 as heating element elements built into the heating plate 100, and each rod-shaped heater 103 is arranged from one end to the other in the extending direction W of the heating plate 100. Ends. Then, by changing the arrangement spacing of the heating element elements in the arrangement direction L, and also changing the wiring density in the extension direction W, the in-plane distribution of the heat generated by the heating plate 100 can be adapted to withstand the environment in which the heating plate 100 is installed. external interference. By optimizing the in-plane distribution of the heat generated by the heating plate 100 in response to external environmental disturbances and combining the above-mentioned temperature adjustment device 40, a high degree of in-plane uniformity of the temperature of the heating plate 100 can be achieved.

在加熱板100,如圖9所示,係在排列方向L上的中央Ct、以及其中一個端部,配設溫度感測器104A、104B。溫度感測器104A、104B,可以埋設於加熱板100,亦可固定於加熱板100之表面。又,關於棒狀加熱器103之發熱絲103A之配線密度,係設為相較於中央區域W2,要使兩側之端部區域W1階段性地變密;但當然亦可係由寬度方向之中央,朝向兩側端部逐步地變密。As shown in FIG. 9 , the heating plate 100 is provided with temperature sensors 104A and 104B at the center Ct in the arrangement direction L and at one of its ends. The temperature sensors 104A and 104B can be embedded in the heating plate 100 or fixed on the surface of the heating plate 100 . In addition, the wiring density of the heating wire 103A of the rod-shaped heater 103 is set so that the end regions W1 on both sides become denser in stages compared with the central region W2; however, of course, the wiring density may also be increased in the width direction. Center, gradually becoming denser towards both ends.

在此,針對棒狀加熱器103之具體例,進行說明。 作為棒狀加熱器構造,就一例而言,可舉出以下物件。 1)捲軸捲繞型 此係在氧化鎂的捲軸外周,捲繞線材狀之發熱絲者。藉此,由於透過捲繞於捲軸,就連細的發熱絲亦能因應,使得能夠讓容量之範圍設定得較大的發熱絲,穩定地固定,所以可以對加熱器全體施行引伸成形加工,且可以有高溫規格。 2)空芯型 此係無捲軸地使線材狀之發熱絲,成形為線圈狀者。藉此,由於係線圈狀,成型後,形狀穩定之發熱絲需要有機械性的強度,所以熱容量的範圍小。又,雙方皆是在發熱體與外周之圓筒狀金屬之間,隔著用以絶緣的粉末狀之氧化鎂。 Here, a specific example of the rod heater 103 will be described. As an example of a rod-shaped heater structure, the following can be mentioned. 1) Reel winding type This is a wire-shaped heating wire wound around the outer periphery of a magnesium oxide reel. With this, even thin heating wires can be accommodated by being wound on a spool, so that heating wires with a large capacity range can be stably fixed, so the entire heater can be stretched and formed. High temperature specifications are available. 2) Hollow core type This is a method of forming a wire-like heating wire into a coil shape without a reel. Therefore, since it is coil-shaped, the heating wire needs to have mechanical strength to stabilize its shape after molding, so the range of heat capacity is small. In addition, powdered magnesium oxide is sandwiched between the heating element and the outer cylindrical metal for insulation.

被加熱物20,不論是片狀之物、或是板狀之物皆可。被加熱物20,藉由未圖示之起重機或機械手臂等而插入加熱空間30內。此時,左右之誘導構件61L、61R要以不損及被加熱物20的形式而將其導引至加熱空間30內。The object 20 to be heated may be a sheet-like object or a plate-like object. The object 20 to be heated is inserted into the heating space 30 by a crane or a robotic arm (not shown). At this time, the left and right guiding members 61L and 61R guide the object to be heated 20 into the heating space 30 without damaging it.

在此,針對被加熱物20,進行說明。 一般而言,被加熱物(工件)有以下2種類型。 1)硬型(亦稱為板型) 強韌的片狀物。基板、塑膠板、玻璃板等等即屬此類。此類型的被加熱物(工件)可以整個直接放進爐內加熱。而在爐內的固持方法,是使固持構件抵住被加熱物(工件)中可供接觸之部位。若為基板,就代表要固持的是基板廢邊部。固持構件,係誘導件、或是後述之設置於加熱板10上側之面的銷桿等等。此類型的工件,亦可藉由上述導條構件60L、60R直接固持。 2)軟型(亦稱為片型) 柔韌的片狀物。 薄膜或箔狀物、橡膠片等等即屬此類。此類型的被加熱物(工件)在搬運的考量上,無法整個直接放進爐內,所以會以設置於治具的形態來投片加熱。而在爐內的固持方法,係指治具之固持。固持構件與上述1)相同。 Here, the object to be heated 20 will be described. Generally speaking, there are the following two types of objects to be heated (workpieces). 1) Hard type (also called plate type) Strong flakes. Substrates, plastic boards, glass boards, etc. fall into this category. This type of heated object (workpiece) can be placed directly into the furnace for heating. The holding method in the furnace is to make the holding member resist the contactable part of the heated object (workpiece). If it is a substrate, it means that the waste edge of the substrate is to be held. The holding member is an induction member or a pin rod provided on the upper surface of the heating plate 10 as will be described later, or the like. This type of workpiece can also be directly held by the above-mentioned guide members 60L and 60R. 2) Soft type (also called sheet type) Flexible flakes. Films or foils, rubber sheets, etc. fall into this category. This type of heated object (workpiece) cannot be placed directly into the furnace due to transportation considerations, so it is placed in a jig for heating. The holding method in the furnace refers to the holding of the fixture. The holding member is the same as 1) above.

圖12繪示,在被加熱物20為板狀物的情況下,為了使被加熱物20插入加熱空間30內之際,不會直接碰觸到加熱板10、100,而在該發熱體的外側,朝向長度方向直列狀而等間隔地豎立設置複數之銷桿81。Figure 12 shows that when the object to be heated 20 is a plate-shaped object, in order to prevent the object to be heated 20 from directly touching the heating plates 10 and 100 when it is inserted into the heating space 30, the heating element is On the outside, a plurality of pin rods 81 are erected in a straight line and at equal intervals in the length direction.

圖13繪示,在被加熱物20為柔軟之片狀物的情況下,將被加熱物20之周緣部固定於矩形框狀的治具82,並在被加熱物20安裝於治具82的狀態下,而得以放入加熱空間30。Figure 13 shows that when the object to be heated 20 is a soft sheet, the peripheral part of the object to be heated 20 is fixed to the rectangular frame-shaped jig 82, and the object to be heated 20 is installed on the jig 82. state, and can be placed into the heating space 30.

圖14繪示,為了使得固定於圖13所示治具82之被加熱物20,在被引導至加熱空間30內之際,不會直接碰觸到加熱板10、100,而在該發熱體的外側,朝向長度方向直列狀地豎立設置複數之銷桿81。FIG. 14 shows that in order to prevent the heated object 20 fixed to the fixture 82 shown in FIG. 13 from directly touching the heating plates 10 and 100 when it is guided into the heating space 30, the heating element is On the outside, a plurality of pin rods 81 are erected in a straight line toward the length direction.

於本實施形態,容納被加熱物20的加熱空間30,係由其上下,如前文所述般,藉由各自的加熱板10而均勻地受到加熱,而使各個加熱空間30內毫無不勻整地均等加熱。In this embodiment, the heating space 30 accommodating the object to be heated 20 is uniformly heated from its top to bottom by its respective heating plate 10, so that there is no unevenness in each heating space 30. The ground is heated evenly.

又,本實施形態的加熱裝置1,亦可更進一步地具備對其複數之加熱空間30內供給惰性氣體或特定氣體的氣體供給手段90(圖17參照)。氣體供給手段90,係在各加熱空間30之背面側的開口,配設在橫向具有一整排複數之噴出口91的噴出噴嘴裝置92。各個噴出噴嘴裝置92,係在寬度方向W上延伸的方箱狀之物,在其靠近加熱空間30側的那一面,等間隔地形成有複數之噴出口91。噴出噴嘴裝置92之各個,從其背面,經由供給管路93,而從未圖示之氣體供給源,得到氣體供給。一旦有氣體供給過來,就會在噴出噴嘴裝置92內,左右均等地分散,並由各噴出口91均等地噴出氣體。由於所供給之氣體,可以將加熱空間30內的空氣置換成惰性氣體或特定氣體,所以可以藉由導入惰性氣體而防止被加熱物20氧化、或利用與所導入之特定氣體的反應而對被加熱物20施行表面處理。Furthermore, the heating device 1 of this embodiment may further include gas supply means 90 for supplying an inert gas or a specific gas into the plurality of heating spaces 30 (see FIG. 17 ). The gas supply means 90 is an ejection nozzle device 92 having a plurality of ejection ports 91 arranged in a row at the opening on the back side of each heating space 30. Each discharge nozzle device 92 is a square box-shaped object extending in the width direction W, and has a plurality of discharge ports 91 formed at equal intervals on the side close to the heating space 30 side. Each of the ejection nozzle devices 92 is supplied with gas from a gas supply source (not shown) through a supply pipe 93 from its back surface. Once the gas is supplied, it will be evenly dispersed left and right in the discharge nozzle device 92 , and the gas will be discharged equally from each discharge port 91 . Since the supplied gas can replace the air in the heating space 30 with an inert gas or a specific gas, the oxidation of the object to be heated 20 can be prevented by introducing the inert gas, or the object to be heated 20 can be oxidized by reaction with the introduced specific gas. The heated object 20 is subjected to surface treatment.

於本實施形態之加熱裝置1,係以支持板支持著設置成層架狀的複數之加熱板10或100,並構成為使支持板之間,亦即該裝置的前後左右開放。藉此,會使被加熱物20經由加熱裝置1之前後的進出更為容易;還可以視需要,讓被加熱物20也能從該裝置之左右進出,而使其進出更為容易。In the heating device 1 of this embodiment, a plurality of heating plates 10 or 100 arranged in a shelf shape are supported by support plates, and the space between the support plates, that is, the front, rear, left and right sides of the device are open. In this way, the heated object 20 can be moved in and out of the heating device 1 more easily. If necessary, the heated object 20 can also be moved in and out from the left and right sides of the device, making it easier to move in and out.

在從加熱裝置1之背面對加熱空間30內供給氣體的情況下,可以取代從加熱板10或100的前後加以支持的左右之支持板50L、50R,而分別在各該裝置之側面,設置覆蓋側面全體的一整片之側面支持板83L、83R,而得以將氣體鎖在加熱空間30內(參照圖15~18)。When the gas is supplied from the back of the heating device 1 to the heating space 30, instead of the left and right support plates 50L and 50R supporting the heating plate 10 or 100 from the front and back, a cover may be provided on the side of each device. The entire side surface supports the plates 83L and 83R to lock the gas in the heating space 30 (see FIGS. 15 to 18 ).

於本實施形態,為了固持被加熱物20,而舉出導條構件60L、60R以作為一例,但並不限定於此;例如可以在支持板50L、50R設置從上下夾住被加熱物20的夾持構件,或在支持板50L、50R直接形成固持凹槽,並以支持板50L、50R固持被加熱物20。 [產業上之可利用性] In this embodiment, the guide members 60L and 60R are used as an example to hold the object 20 to be heated. However, the guide members 60L and 60R are not limited thereto. For example, the support plates 50L and 50R may be provided with support plates 50L and 50R to sandwich the object 20 from above and below. The clamping member may directly form holding grooves in the support plates 50L and 50R, and hold the heated object 20 with the support plates 50L and 50R. [Industrial availability]

本發明之加熱裝置,可廣泛運用於對玻璃基板、半導體導線架、或其他金屬板或合成樹脂板等等各種板狀構件或片狀構件進行熱處理之產業領域。The heating device of the present invention can be widely used in industrial fields that perform heat treatment on glass substrates, semiconductor lead frames, or other metal plates or synthetic resin plates and other plate-shaped or sheet-shaped components.

1:加熱裝置 10:加熱板 11A,11B,11C:發熱體元件 12A,12B,12C:片狀物 13A,13B,13C:發熱絲 14A,14B:溫度感測器 15A,15B:金屬製板 16:電源線 17:纜線 20:被加熱物 30:加熱空間 40:溫度調節裝置 50L,50R:支持板 51:凹槽 60L,60R:導條構件 61L,61R:誘導構件 71:頂板 72:底板 73L,73R:腳柱構件 74:中板 75L,75R:腳柱構件 76:基台 81:銷桿 82:治具 83L,83R:側面支持板 90:氣體供給手段 91:噴出口 92:噴出噴嘴裝置 93:供給管路 100:加熱板 101:金屬製板 102:孔洞 103:棒狀加熱器 103A:發熱絲 104A,104B:溫度感測器 W:延伸方向 L:排列方向 A,B,D:箭頭 Ct:中央 L1,W1:端部區域 L2,W2:中央區域 1:Heating device 10:Heating plate 11A, 11B, 11C: Heating element 12A, 12B, 12C: flakes 13A, 13B, 13C: Heating wire 14A, 14B: Temperature sensor 15A, 15B: Metal plate 16:Power cord 17:Cable 20: Heated object 30: Heating space 40:Temperature regulating device 50L, 50R: support board 51: Groove 60L, 60R: guide bar components 61L, 61R: induced components 71: Top plate 72: Base plate 73L,73R: foot column components 74:Medium plate 75L, 75R: foot column components 76:Abutment 81: Pin rod 82:Jig 83L, 83R: Side support plate 90:Gas supply means 91:Spout 92:Ejection nozzle device 93: Supply pipeline 100:Heating plate 101:Metal plates 102:hole 103: Rod heater 103A: Heating wire 104A, 104B: Temperature sensor W: extension direction L: Arrangement direction A,B,D:arrow Ct:Central L1,W1: end area L2, W2: Central area

[圖1]繪示本發明一實施形態之加熱裝置的前視圖。 [圖2]擴大繪示圖1中以箭頭A所示圓形圍住之部分的圖式。 [圖3]圖1所示加熱裝置的側視圖。 [圖4A]繪示在圖1所示加熱裝置的加熱空間放入被加熱物而設置之情景,係擴大繪示圖3中以箭頭B所示橢圓圍住之部分的側視圖。 [圖4B]繪示在圖1所示加熱裝置的加熱空間設置了被加熱物時之情景,係對應於圖4A的側視圖。 [圖4C]繪示從圖1所示加熱裝置的加熱空間取出被加熱物之情景,係對應於圖4A的側視圖。 [圖5]繪示圖1所示加熱裝置所採用之加熱板之一實施形態的俯視圖。 [圖6]圖5所示加熱板的前視圖。 [圖7]示意性繪示在圖5所示加熱板之內部設置的發熱絲元件之配線之情景的俯視圖。 [圖8]繪示圖1所示加熱裝置所採用之加熱板之另一實施形態的前視圖。 [圖9]圖8所示加熱板的俯視圖。 [圖10]圖8所示加熱板之內部所設置之棒狀加熱器的概略圖。 [圖11]繪示被加熱物、引導該被加熱物至加熱空間的導條構件、以及加熱板的分解立體圖。 [圖12]繪示為了使被加熱物不會直接接觸加熱空間內之加熱板的加熱面,而在發熱體豎立銷桿之情景的立體圖。 [圖13]示意性繪示當被加熱物係片狀物狀的情況下,將該被加熱物固定於框體而沿著導條構件引導至加熱空間的分解立體圖。 [圖14]繪示在片狀物狀之被加熱物固定於框體的情況下,為了使框體不會直接接觸加熱空間內之加熱板,而於加熱板對應治具之位置豎立銷桿之情景的立體圖。 [圖15]繪示圖1所示加熱裝置,為了對加熱空間內供給氣體,而在該加熱空間之深處具備設有複數個氣體供給孔之背板之情景的前視圖。 [圖16]繪示對加熱空間內供給惰性氣體之情景的側視圖。 [圖17]圖5中之C-C線剖面圖。 [圖18]擴大繪示圖17中以箭頭D所示圓形圍住之部分的擴大圖。 [Fig. 1] shows a front view of a heating device according to an embodiment of the present invention. [Fig. 2] An enlarged view of the portion enclosed by the circle indicated by arrow A in Fig. 1. [Fig. [Fig. 3] A side view of the heating device shown in Fig. 1. [Fig. 4A] shows a scene in which an object to be heated is placed in the heating space of the heating device shown in Fig. 1 and is an enlarged side view of the portion enclosed by an ellipse indicated by arrow B in Fig. 3. [Fig. 4B] illustrates a scene when an object to be heated is placed in the heating space of the heating device shown in Fig. 1, which is a side view corresponding to Fig. 4A. [Fig. 4C] illustrates the scene of taking out the heated object from the heating space of the heating device shown in Fig. 1, which corresponds to the side view of Fig. 4A. [Fig. 5] A top view of an embodiment of the heating plate used in the heating device shown in Fig. 1. [Fig. [Fig. 6] A front view of the heating plate shown in Fig. 5. [Fig. 7] A top view schematically illustrating the wiring of the heating wire element provided inside the heating plate shown in Fig. 5. [Fig. [Fig. 8] A front view of another embodiment of the heating plate used in the heating device shown in Fig. 1. [Fig. [Fig. 9] A top view of the heating plate shown in Fig. 8. [Fig. 10] A schematic view of a rod-shaped heater installed inside the heating plate shown in Fig. 8. [Fig. [Fig. 11] An exploded perspective view showing the object to be heated, the guide bar member that guides the object to be heated to the heating space, and the heating plate. [Fig. 12] A perspective view showing a situation in which a pin rod is erected on the heating element so that the object to be heated does not directly contact the heating surface of the heating plate in the heating space. [Fig. 13] Fig. 13 is a schematic exploded perspective view illustrating when the object to be heated is a sheet-like object, the object to be heated is fixed to the frame and guided to the heating space along the guide bar member. [Figure 14] shows that when the sheet-like object to be heated is fixed to the frame, in order to prevent the frame from directly contacting the heating plate in the heating space, a pin rod is erected at the position of the heating plate corresponding to the jig. A three-dimensional view of the scene. [Fig. 15] A front view illustrating a situation in which the heating device shown in Fig. 1 is provided with a back plate provided with a plurality of gas supply holes deep in the heating space in order to supply gas into the heating space. [Fig. 16] A side view showing the supply of inert gas in the heated space. [Fig. 17] Cross-sectional view of line C-C in Fig. 5. [Fig. 18] An enlarged view of a portion surrounded by a circle indicated by an arrow D in Fig. 17. [Fig.

11A,11B,11C:發熱體元件 11A, 11B, 11C: Heating element

12A,12B,12C:片狀物 12A, 12B, 12C: flakes

13A,13B,13C:發熱絲 13A, 13B, 13C: Heating wire

16:電源線 16:Power cord

W:延伸方向 W: extension direction

L:排列方向 L: Arrangement direction

L1,W1:端部區域 L1,W1: end area

L2,W2:中央區域 L2, W2: Central area

Claims (1)

一種加熱裝置,包含: 至少三片以上之加熱板,於上下方向隔著既定之間隔而配置;以及, 加熱空間,藉由於上下方向相向之該加熱板的加熱面所區劃而成,用以容納被加熱物; 於上下方向相鄰之該加熱空間,被該加熱板分離; 該加熱板分別包含: 矩形之金屬製板;以及, 複數之發熱體元件,內置於該金屬製板,並配設有發熱絲; 該加熱裝置更包含: 溫度感測器,設在該複數之加熱板中之各個;以及, 溫度控制手段,獨立控制該複數之加熱板的複數之發熱體元件各自之發熱量,以使得設在各該複數之加熱板的溫度感測器之檢測溫度,追隨目標溫度; 該溫度控制手段,進行以下控制: 相對地減少配置於上方之該加熱板之複數之發熱體元件各自之發熱量,並相對地增加配置於下方之該加熱板之複數之發熱體元件各自之發熱量。 A heating device containing: At least three or more heating plates are arranged at predetermined intervals in the up and down direction; and, The heating space is divided by the heating surfaces of the heating plate facing each other in the up and down direction, and is used to accommodate the object to be heated; The heating spaces adjacent in the vertical direction are separated by the heating plate; The heating plate contains: Rectangular metal plates; and, A plurality of heating elements are built into the metal plate and equipped with heating wires; The heating device also includes: A temperature sensor is provided in each of the plurality of heating plates; and, Temperature control means independently controls the calorific value of each of the plurality of heating elements of the plurality of heating plates, so that the detected temperature of the temperature sensor provided on each of the plurality of heating plates follows the target temperature; This temperature control means performs the following controls: The calorific value of each of the plurality of heating element elements of the heating plate arranged above is relatively reduced, and the calorific value of each of the plurality of heating element elements of the heating plate arranged below is relatively increased.
TW112139116A 2018-11-16 2019-10-28 Heating device and heating plate TWI841497B (en)

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