TW202404440A - Circuit board structure, manufacturing method and thermal conductive block thereof in which the thermal conductive block can be roughened together with the circuit board to simplify the manufacturing process - Google Patents

Abstract

The present invention provides a circuit board structure, which includes a circuit board and a thermal conductive block. The circuit board has a top surface, a bottom surface and at least one trough penetrating from the top surface to the bottom surface. The thermal conductive block includes a thermal conductive body and a plurality of connecting parts. The thermal conductive body is located in the at least one trough. The connecting parts are extended from the thermal conductive body and connected to the wall of the at least one trough. The thermally conductive block is adapted to be roughened simultaneously together with the circuit board. The present invention also provides a method for manufacturing a circuit board structure and a thermal conductive block.

Description

Circuit board structure, manufacturing method and thermal conductive block

The invention provides a circuit board roughening technology, in particular to a circuit board structure with a thermal conductive function, a manufacturing method thereof, and a thermal conductive block.

The circuit board carries chips and passive components, and is laid out with circuits. Heat will accumulate during long-term operation. If the heat is not dissipated in time, the circuit board itself or the components it carries will be damaged. Copper is often used in circuit board heat dissipation due to its high thermal conductivity. Copper blocks can be embedded into the circuit board to dissipate heat from the circuit board.

Although the conventional technology discloses a structure of embedding a copper block into a circuit board, the copper block and the circuit board to be embedded in the conventional technology must be separately roughened, resulting in a complicated manufacturing process, an increase in cost, and problems of low reliability.

In order to solve the problems of the prior art, the inventor proposes a circuit board structure, a manufacturing method thereof, and a thermal conductive block, so that the thermal conductive block can be roughened together with the circuit board, thereby simplifying the manufacturing process, reducing costs, and increasing reliability.

In order to achieve the above and other objects, one aspect of the present invention provides a circuit board structure, which includes a circuit board and a thermal conductive block. The circuit board has a top surface, a bottom surface, and at least one slot penetrating from the top surface to the bottom surface. The thermal conductive block includes a thermal conductive body and a plurality of connecting parts. The thermal conductive body is located in the at least one slot. The connecting portions extend from the thermally conductive body and are connected to the at least one grooved groove wall. The thermally conductive block is adapted to be roughened simultaneously with the circuit board.

In order to achieve the above and other objects, another aspect of the present invention provides a method for manufacturing a circuit board structure, which includes the following steps: providing a circuit board having a top surface, a bottom surface and a circuit board extending from the top surface to the circuit board. At least one slot on the bottom surface; provide a thermal conductive block, the thermal conductive block includes a thermal conductive body and a plurality of connecting parts extending from the thermal conductive body, press the thermal conductive body from the top surface into the at least one slot, and make each A portion of the connecting portion is deformed and pressed into the at least one slot and connected to the groove wall of the slot. The portions of the connecting portion that are not pressed into the at least one slot form a plurality of rivet structures on the top surface. To fix the thermal conductive body in the at least one slot; and roughen the thermal conductive block and the circuit board together.

In order to achieve the above and other purposes, yet another aspect of the present invention provides the above-mentioned thermal block.

In one embodiment, the top end and the bottom end of the thermally conductive body are flush with the top surface and the bottom surface respectively, and the top end of each connecting portion is flush with the top end of the thermally conductive body.

In one embodiment, the bottom end of each connecting portion is located in the at least one slot, so that there is a gap between the heat conductive body and the groove wall of the at least one slot.

In one embodiment, the circuit board structure may further include a colloid. The colloid fills the gap.

In one embodiment, the thermal conductive block may further include a rivet structure. The rivet structure is provided on the top surface and connected to the connecting part.

In one embodiment, the connecting portions are arranged around the outer periphery of the thermally conductive body. Before the thermally conductive body is placed in the at least one slot, each connecting portion is: equidistant from the top and bottom of the thermally conductive body, Flush with the bottom end of the heat conductive body, or flush with the bottom end and top end of the heat conductive body.

In one embodiment, the thermally conductive block is entirely made of ductile metal.

In one embodiment, the thermal conductive body of the thermal conductive block includes a ceramic body and a malleable metal-clad layer covering the ceramic body, and the connecting portions extend integrally to the metal-clad layer.

Therefore, the circuit board structure of the embodiment of the present invention is manufactured by placing the heat conductive body of the heat conductive block into at least one slot, and during the placement process, a part of the connecting portion is pressed into at least one slot. A part of the connecting portion that has not been pressed in forms a rivet structure on the top surface of the circuit board to provide support for the thermal conductive body, so that the thermal conductive block can be roughened together with the circuit board, thereby simplifying the manufacturing process and The purpose of reducing costs and increasing reliability.

In order to fully understand the purpose, characteristics and effects of the present invention, the present invention is described in detail through the following specific embodiments and the accompanying drawings, as follows:

Please refer to Figures 1 and 2. As shown in step S6 of Figure 1 and step S4' of Figure 2, one aspect of the present invention provides a circuit board structure 100, which includes a circuit board 101 and a thermal conductive block 103. The circuit board 101 has a top surface 104, a bottom surface 105, and at least one slot 106 penetrating from the top surface 104 to the bottom surface 105. The thermal conductive block 103 includes a thermal conductive body 107 and a plurality of connecting parts 108 . The heat conductive body 107 is located in the at least one slot 106 . The connecting portions 108 extend from the thermally conductive body 107 and are connected to the groove wall of the at least one slot 106 . The thermal conductive block 103 is suitable for roughening simultaneously with the circuit board 101 . The circuit board 101 may be a double-layer circuit board, including a first metal layer 118, a second metal layer 119, and a board body 120 located between the first metal layer 118 and the second metal layer 119. But it is not limited to this, the circuit board 101 may also only include insulating materials or have multi-layer circuits. The material of the plate body 120 can be FR4, but is not limited thereto. The circuit board 101 may further include a first electroplating layer 102 . The first electroplating layer 102 is conformably disposed on the circuit board 101 and covers the first metal layer 118 and the second metal layer 119 to form the top surface 104 , the bottom surface 105 and the at least one slot 106 wall. But it is not limited to this. If the first electroplating layer 102 is not provided, the top surface 104 and the bottom surface 105 can also be directly located on the board body 120 of the circuit board 101 .

As shown in Figures 1 and 2, another aspect of the present invention provides a method for manufacturing a circuit board structure, which includes the following steps:

Step S1: Provide the circuit board 101 and the thermal conductive block 103.

Step S2: Press the heat conductive body 107 from the top surface 104 into the at least one slot 106, and deform a part of each connecting portion 108 to press into the at least one slot 106 to connect to the at least one slot. On the groove wall of the slot 106, the portions of the connecting portions 108 that are not pressed into the at least one slot 106 form a plurality of rivet structures 109 on the top surface 104 to fix the heat conductive body 107 in the at least one slot 106. . After the thermally conductive body 107 is pressed into the at least one slot 106 from the top surface 104, the bottom end of each connecting portion 108 is located in the at least one slot 106, so that the thermally conductive body 107 is in contact with the at least one slot 106. There is a gap S between the walls.

Step S3: roughen the thermal conductive block 103 and the circuit board 101 together. Such as browning or ultra-coarse. The first electroplating layer 102 of the circuit board 101 has been roughened together with the thermal conductive block 103 .

As shown in FIGS. 3 to 6 , yet another aspect of the present invention provides the above-mentioned thermal conductive block 103 .

As mentioned above, the circuit board structure of the embodiment of the present invention is manufactured by pressing the heat conductive body 107 of the heat conductive block 103 into at least one slot 106, and during the press-in process, a part of the connecting portion 108 is pressed in. At least one slot 106 and a portion of the connecting portion 108 that is not pressed in form a rivet structure 109 on the top surface 104 of the circuit board 101 to provide support for the heat conduction body 107 so that the heat conduction block 103 can be connected to the heat conduction block 103 . The circuit board 101 is roughened together to achieve the purpose of simplifying the manufacturing process, reducing costs and increasing reliability.

As shown in Figure 1, after the pressing process of step S2, the at least one slot 106 is not filled but has a gap S. After the roughening step of step S3, the following steps can be continued:

Step S4: Fill the gap S with a colloid GL. The colloid GL can be insulating glue, conductive glue or thermally conductive glue. The colloid GL can take over the function of the rivet structures 109 to fix the thermally conductive body 107 in the at least one slot 106 .

Step S5: Perform a planarization process to remove the rivet structures 109, make the tops of the thermal conductive body 107 and the connecting portion 108 flush with the top surface 104, and remove the overflow from the gap S remaining in the The colloid GL on the bottom surface 105 makes the bottom ends of the thermal conductive body 107 and the colloid GL flush with the bottom surface 105 . The rivet structures 109 and the cured colloid GL can be scrubbed using abrasive tools such as abrasive belts or brush wheels. Then, a second electroplating layer 110 is used to cover the top surface 104 and the top of the thermal conductive body 107 and the connecting part 108, and a third electroplating layer 111 is used to cover the bottom surface 105 and the colloid GL. In the case of the first electroplating layer 102 , the second electroplating layer 110 covers the portion of the first electroplating layer 102 corresponding to the top surface 104 , and the third electroplating layer 111 covers the portion of the first electroplating layer 102 corresponding to the bottom surface 105 part. But it doesn't stop there.

Step S6: Cover the second electroplating layer 110 and the third electroplating layer 111 with a stack including a dielectric layer 112 and a metal layer 113 respectively. The circuit board structure 100 can continue to undergo further manufacturing processes.

As shown in Figure 2, after the pressing process of step S2, the at least one slot 106 is not filled and has a gap S. After the roughening step of step S3, the following steps can be continued:

Step S4': Fill the gap S with the dielectric layer 112 by, for example, laminating a build-up layer. The dielectric layer 112 extends integrally to cover the bottom surface 105 . The dielectric layer 112 also covers the top surface 104 and the rivet structures 109 . In the case of the first electroplating layer 102 , the dielectric layer 112 covers the portion of the first electroplating layer 102 corresponding to the top surface 104 and the portion corresponding to the bottom surface 105 . But it doesn't stop there. Then, the metal layer 113 can be respectively covered on the dielectric layer 112 on both sides. The circuit board structure 100 can continue to undergo further manufacturing processes. Different from the embodiment of FIG. 1 , the rivet structure 109 is not removed in this embodiment.

As shown in FIGS. 3 to 5 , in one embodiment, the entire thermal conductive block 103 may be made of ductile metal, such as copper. Before the thermally conductive body 107 is placed into at least one slot 106 in FIG. 1 or FIG. 2 , the connecting parts 108 are arranged around the outer periphery of the thermally conductive body 107 , and the maximum distance between the two opposite connecting parts 108 is greater than that in FIG. 1 or 2 . The width of at least one slot 106 of FIG. 2 . The connecting portions 108 can be disposed on the thermally conductive body 107: equidistant from the top and bottom of the thermally conductive body 107 (as shown in Figure 3), flush with the bottom end of the thermally conductive body 107 (as shown in Figure 4), or flush with each other. Flat to the bottom and top of the thermal conductive body (as shown in Figure 5). In addition, although the heat conductive body 107 and the connecting portion 108 in FIGS. 3 to 5 are shown as rectangular shapes, they are not limited thereto and can be made into circular or other irregular shapes according to actual needs.

As shown in FIG. 6 , in one embodiment, the thermal conductive body 107 of the thermal conductive block 103 may include a ceramic body 114 and a malleable metal-coated layer 115 covering the ceramic body 114 , and the connecting portions 108 are integrated. Extending from the metallization layer 115 . The ceramic body 114 has high thermal conductivity and therefore can be applied to the thermal block 103 . However, the thermal conductive block 103 can also be coated with other blocks with high thermal conductivity.

As shown in FIGS. 7 and 8 , by applying the manufacturing steps of FIGS. 1 and 2 , the outermost metal layer 113 or the inner metal layer or other structures of the circuit board structure 100 can be patterned and processed with laser. The radiation via hole 116 is connected to the thermal block 103 (as shown in Figure 8), the first electroplating layer 102 (as shown in Figure 8), the second electroplating layer 110 (as shown in Figure 7), or the third electroplating layer 111 (as shown in Figure 7). The thermal block 103 can also be partially removed to have a groove 117 . The circuit board 101 of the circuit board structure 100 in FIGS. 7 and 8 is a multi-layer circuit board, but this is only for illustration and does not limit the circuit board forms to which the present invention can be applied.

The present invention has been disclosed above with preferred embodiments. However, those skilled in the art should understand that the embodiments are only used to illustrate the present invention and should not be interpreted as limiting the scope of the present invention. It should be noted that any changes and substitutions that are equivalent to this embodiment should be considered to be within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope of the patent application.

100: Circuit board structure 101:Circuit board 102: First plating layer 103:Thermal block 104:Top surface 105: Bottom 106: Grooving 107: Thermal conductive body 108:Connection part 109:Rivet structure 110: Second plating layer 111: The third plating layer 112: Dielectric layer 113:Metal layer 114:Ceramic body 115: Metal plated layer 116:Laser via 117: Groove 118: First metal layer 119: Second metal layer 120:Plate body GL: colloid S: gap S1: Steps S2: Step S3: Steps S4: Steps S4’: Step S5: Steps S6: Steps

Figure 1 is a schematic diagram of a manufacturing method of a circuit board structure according to a specific embodiment of the present invention. FIG. 2 is a second schematic diagram of a manufacturing method of a circuit board structure according to a specific embodiment of the present invention. Figure 3 is a schematic three-dimensional view of a thermal conductive block according to a specific embodiment of the present invention. Figure 4 is a second schematic three-dimensional view of a thermal conductive block according to a specific embodiment of the present invention. FIG. 5 is a third schematic perspective view of a thermal conductive block according to a specific embodiment of the present invention. Figure 6 is a schematic cross-sectional view of a thermal conductive block according to a specific embodiment of the present invention. FIG. 7 is a schematic cross-sectional view of a circuit board structure completed by applying the process of FIG. 1 . FIG. 8 is a schematic cross-sectional view of the circuit board structure completed by applying the process of FIG. 2 .

100: Circuit board structure

101:Circuit board

102: First plating layer

103:Thermal block

104:Top surface

105: Bottom

106: Grooving

107: Thermal conductive body

108:Connection part

109:Rivet structure

110: Second plating layer

111: The third plating layer

112: Dielectric layer

113:Metal layer

118: First metal layer

119: Second metal layer

120:Plate body

GL: colloid

S: gap

S1: Steps

S2: Step

S3: Steps

S4: Steps

S5: Steps

S6: Steps

Claims (10)

A circuit board structure containing: A circuit board having a top surface, a bottom surface, and at least one slot penetrating from the top surface to the bottom surface; and A thermally conductive block, which includes a thermally conductive body and a plurality of connecting parts. The thermally conductive body is located in the at least one slot. The connecting parts extend from the thermally conductive body and are connected to the groove wall of the at least one slot. The thermally conductive block is adapted to Roughening is performed simultaneously with the board. The circuit board structure as claimed in claim 1, wherein the top and bottom ends of the thermally conductive body are flush with the top surface and the bottom surface respectively, and the top ends of each connecting portion are flush with the top of the thermally conductive body. The circuit board structure of claim 1, wherein the bottom end of each connecting portion is located in the at least one slot, so that there is a gap between the heat conductive body and the groove wall of the at least one slot. The circuit board structure as claimed in claim 3 further includes a colloid, and the colloid fills the gap. The circuit board structure of claim 3, wherein the heat conductive block further includes a rivet structure, the rivet structure is provided on the top surface and connected to the connecting part. A method for manufacturing a circuit board structure, including the following steps: Provide a circuit board having a top surface, a bottom surface and at least one slot penetrating from the top surface to the bottom surface; Provide a thermally conductive block, the thermally conductive block includes a thermally conductive body and a plurality of connecting parts extending from the thermally conductive body, press the thermally conductive body from the top surface into the at least one slot, and make a part of each connecting part The deformation is pressed into the at least one slot and connected to the groove wall of the at least one slot. The portions of the connecting portions that are not pressed into the at least one slot form a plurality of rivet structures on the top surface to secure the thermal conductive body. fixed in the at least one slot; and The thermal block is roughened together with the circuit board. A thermal conductive block as described in claim 1. The heat-conducting block of claim 7, wherein the connecting portions are arranged around the outer periphery of the heat-conducting body, and before the heat-conducting body is placed in the at least one slot, each of the connecting portions is: connected to the top end of the heat-conducting body and The bottom end is equidistant and flush with the bottom end of the thermal conductive body, or flush with the bottom end and top end of the thermal conductive body. The thermal conductive block as described in claim 7, wherein the thermal conductive block is entirely made of ductile metal, or the thermal conductive body of the thermal conductive block includes a ceramic body and a ductile metal coating covering the ceramic body. The connecting parts extend integrally on the metal-plated layer. The heat-conducting block of claim 7, wherein the heat-conducting body of the heat-conducting block is adapted to be pressed into the at least one slot from the top surface, and a portion of each connecting portion is deformed and pressed into the at least one slot. and connected to the groove wall of the at least one groove. The portions of the connecting portions that are not pressed into the at least one groove form a plurality of rivet structures on the top surface to fix the thermally conductive body in the at least one groove. , so that the thermal conductive block and the circuit board are roughened synchronously.

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