TW202404004A - Device configured to weld an electronic element, method for welding an electronic element, and method for manufacturing a light-emitting diode display - Google Patents

Abstract

A device configured to weld an electronic element includes a carrying platform, a pressing element, a hermetic space generating mechanism, a gas extracting mechanism, and an energy generating mechanism. The carrying platform is configured to support a substrate. The pressing element is made of a flexible material. The hermetic space generating mechanism is capable of putting the pressing element on the carrying platform, so as to form a hermetic space between the pressing element and the carrying platform. The gas extracting mechanism is configured to extract gas from the hermetic space. The energy generating mechanism is disposed adjacent to the carrying platform, and capable of generating energy on the carrying platform. A method for welding an electronic element and a method for manufacturing a light-emitting diode display are also provided.

Description

Device for soldering electronic components, method of soldering electronic components and method of manufacturing light emitting diode display

The present invention relates to a device for joining electronic components, a method of joining electronic components and a method of manufacturing a display, and in particular, to a device for soldering electronic components, a method of soldering electronic components and a method of manufacturing a light emitting diode display. method.

Semiconductor components are usually grown on a growth substrate using epitaxy. However, as the various applications of semiconductor components change, the semiconductor components may not necessarily remain on the original growth substrate when they are finally placed on the finished product, but may be transferred. to a transfer substrate, and finally transferred to a target substrate to form a final product.

When a semiconductor element is to be transferred from a transfer substrate to a target substrate, one method is to face the front surfaces of the transfer substrate and the target substrate to each other and press the transfer substrate and the target substrate together.

The use of micro light-emitting diodes (micro-LEDs) in displays has become a future trend in the display industry. The manufacturing process uses the technology of transferring micro-light-emitting diode wafers from a transfer substrate to a target substrate. At present, this industry is still mainly used to produce small and medium-sized displays. Considering future development, it is bound to develop towards large-sized displays.

The future challenges of large-size displays lie in large-area lamination accuracy, laser form, production yield, related material selection, and defective pixel repair methods. Therefore, the development and research of large-size production equipment is also imperative.

The invention provides a device for welding electronic components, which can evenly press two substrates.

The present invention provides a method for welding electronic components, which can uniformly press together a carrier substrate and a target substrate.

The present invention provides a method for manufacturing a light-emitting diode display, which can manufacture a light-emitting diode display by uniformly pressing a carrier substrate and a target substrate.

An embodiment of the present invention provides a device for soldering electronic components, which includes a carrying platform, a pressing component, a closed space generating mechanism, an air extraction mechanism and an energy generating mechanism. The carrying platform is used to carry a substrate. The pressing element is made of flexible material. The closed space generating mechanism can place the resisting element on the bearing platform, so that a sealed space is formed between the resisting element and the bearing platform. The air extraction mechanism is used to evacuate the confined space. The energy generating mechanism is arranged adjacent to the bearing platform and can generate energy on the bearing platform.

An embodiment of the present invention provides a method for soldering electronic components, which includes: providing a carrier substrate, on one surface of the carrier substrate is supported an electronic component selectively having a solder thereon; providing a target substrate having A soldering surface has a position to be soldered on the soldering surface, and when there is no solder on the electronic component, a solder is applied to the position to be soldered, so that the surface of the carrier substrate carrying the electronic component faces the soldering surface of the target substrate and make the electronic components relative to the position to be welded; place the facing carrier substrate and target substrate into a closed space, where one end surface of the closed space close to the carrier substrate is made of flexible material; vacuum the closed space to make the flexible The end face of the plastic material presses against the surface of the carrier substrate that does not carry the electronic component; and an energy is applied to melt the solder to solidify the electronic component at the position to be soldered.

An embodiment of the present invention provides a method for manufacturing a light-emitting diode display, which includes using the above method to solder electronic components, and the electronic components are light-emitting diode wafers.

In the device for welding electronic components, the method of welding electronic components, and the method of manufacturing a light-emitting diode display according to the embodiments of the present invention, since flexible materials are used with a method of pumping air into a closed space, they can be pressed evenly Two substrates are used to achieve good welding effects, thereby improving the yield of manufacturing light-emitting diode displays.

1 to 5 are schematic cross-sectional views illustrating the process of a method of soldering electronic components according to an embodiment of the present invention. Referring to FIGS. 1 to 5 , the method of soldering electronic components in this embodiment includes the following steps. First, please refer to FIG. 1 , a carrier substrate 100 is provided, and an electronic component 110 with solder 112 selectively thereon is supported on a surface 102 of the carrier substrate 100 . In this embodiment, the carrying substrate 100 is, for example, a glass substrate or a transparent substrate made of other materials. However, in other embodiments, the carrying substrate 100 may also be a metal substrate or an opaque substrate made of other materials. In one embodiment, the plurality of electronic components 110 can be fixed on the carrier substrate 100 through the adhesive layer 120 . In this embodiment, the electronic component 110 is, for example, a light-emitting diode chip or other electronic component, which has at least one pad 114 , and the solder 112 is disposed on the pad 114 .

In addition, a target substrate 200 is provided, which has a soldering surface 202 and has a position 212 to be soldered on the soldering surface 202, and when there is no solder 112 on the electronic component 110, the solder 112 is applied to the position 212 to be soldered. In this embodiment, the target substrate 200 is a thin film transistor (TFT) substrate, and its soldering surface 202 is provided with pads 210 connected to conductive circuits of the TFT substrate, and the surface of the pads 210 is formed Position 212 to be welded. In other embodiments, the target substrate 200 may also be a silicon substrate, a circuit board, or other suitable substrate.

Afterwards, the surface 102 of the carrying substrate 100 carrying the electronic component is made to face the welding surface 202 of the target substrate 200, and the electronic component 110 is opposite to the position 212 to be welded. In this embodiment, an adsorption platform 300 can be used to adsorb the carrier substrate 100 , for example, by using vacuum adsorption to adsorb the surface 104 of the carrier substrate 100 that does not carry the electronic component 110 , where the surface 104 is relative to the surface 102 . In addition, in this embodiment, the image sensor 310 can be used to sense the alignment mark on the carrier substrate 100 through the through hole 302 of the adsorption platform 300, and to sense the alignment mark on the target substrate 200 below it through the carrier substrate 100. position mark, thereby aligning the electronic component 110 and the location to be welded 212 with each other.

Next, the adsorption platform 300 is placed on a carrying platform 400 for carrying the target substrate 200 to form a closed space S1 between the adsorption platform 300 and the carrying platform 400 . Then, the enclosed space S1 is evacuated, for example, evacuated. In this embodiment, the carrying platform 400 has an exhaust channel 410, one end of which is connected to the enclosed space S1, and the other end is connected to an air extraction mechanism 420, such as an air extraction pump. The air extraction mechanism 420 exhausts the gas in the sealed space S1 to the outside through the exhaust channel 410, so that the sealed space S1 reaches a vacuum state. When the sealed space S1 is evacuated, the gravity of the bearing substrate 100 will be greater than the adsorption force of the adsorption platform 300, causing the bearing substrate 100 to fall onto the target substrate 200, causing the vacuum of the sealed space S1 to be broken, as shown in Figure 3 Show. In this embodiment, when the carrier substrate 100 falls onto the target substrate 200 and faces the target substrate 200, the electronic component 110 contacts the to-be-soldered position 212 of the target substrate 200 through the solder 112.

After that, please refer to FIG. 4 , the facing carrier substrate 100 and the target substrate 200 are placed into a closed space S2 , where an end surface of the closed space S2 close to the carrier substrate 100 is made of a flexible material, that is, a flexible material. Pressure element 510. In this embodiment, the pressing element 510 is a flexible film, such as a silicone film. Next, please refer to FIG. 5 , the sealed space S2 is evacuated, so that the end surface of the flexible material (ie, the pressing element 510 ) presses the surface 104 of the carrying substrate 100 that does not carry the electronic component 110 . At this time, due to the significant drop in air pressure in the sealed space S2, the atmospheric pressure above the pressure element 510 will deform the pressure element 510 downward and bear on the surface 104 of the carrier substrate 100, so as to uniformly exert pressure on the carrier substrate 100. pressure. In addition, when the pressing element 510 presses the surface 104 of the carrying substrate 100, an energy 522 is applied to melt the solder 112, so that the electronic component 110 is soldered to the position 212 to be soldered. In this embodiment, the energy 522 is, for example, a laser beam. However, in other embodiments, the energy 522 may also be thermal energy or a non-coherent beam (ie, a beam other than a laser).

Referring to Figures 4 and 5, one embodiment of the present invention proposes a device 500 for welding electronic components, which includes a carrying platform 400, a pressing element 510, a closed space generating mechanism 530, an air extraction mechanism 420 and an energy Generating mechanism 520. The carrying platform 400 is used to carry a substrate, such as the target substrate 200 . The closed space generating mechanism 530 can place the pressing element 510 on the bearing platform 400 so that a sealed space S2 is formed between the pressing element 510 and the bearing platform 400 . The air extraction mechanism 420 is used to evacuate the confined space S2. In this embodiment, the air extraction mechanism 420 evacuates air through the bearing platform 400 , for example, through the exhaust channel 410 in the bearing platform 400 to evacuate the enclosed space S2 .

The energy generating mechanism 520 is disposed adjacent to the bearing platform 400 and can generate energy 522 on the bearing platform 400 . In this embodiment, the energy generating mechanism 520 is a laser generator for providing energy 522 (a laser beam in this embodiment). The energy generating mechanism 520 can move laterally to scan different electronic components 110 . Alternatively, in another embodiment, the energy generating mechanism 520 may provide an energy beam with a large cross-sectional area to irradiate multiple electronic components 110 simultaneously. However, in other embodiments, the energy generating mechanism 520 may also be a heater or a non-coherent light source. In this embodiment, the laser generator (ie, the energy generating mechanism 520 ) projects the laser beam (ie, the energy 522 ) onto the carrying platform 400 through the pressing element 510 to melt the solder 112 . However, in another embodiment, as shown in FIG. 6 , the laser generator (ie, the energy generating mechanism 520 ) projects the laser beam (ie, the energy 522 ) onto the bearing platform 400 through the bearing platform 400 to melt. Solder 112. Wherein, the carrying platform 400 can be penetrated by a laser beam, for example, or has a window that can be penetrated by a laser beam.

The method of soldering electronic components shown in FIGS. 1 to 5 or 6 can also be used as a method for manufacturing a light-emitting diode display, in which the electronic component 110 is a light-emitting diode, such as a micro-light-emitting diode, and the target substrate 200 is used as a light-emitting diode. Display substrate for end products. The electronic component 110 (ie, the light emitting diode) is disposed on the target substrate 200 and is electrically connected to the target substrate 200 . After the electronic component 110 is soldered to the target substrate 200, the adhesive layer 120 and the carrier substrate 100 can be removed, and the remaining target substrate 200 and the electronic component 110 thereon become a light-emitting diode display.

In the device 500 for welding electronic components, the method of welding electronic components, and the method of manufacturing a light-emitting diode display in this embodiment, since flexible materials are used with a method of pumping air into the closed space S2, they can be pressed evenly Two substrates are used to achieve good welding effects, thereby improving the yield of manufacturing light-emitting diode displays. In the steps of FIG. 2 to FIG. 3 , the closed space S1 is evacuated to cause the carrier substrate 100 to fall onto the target substrate 200 . This way, a bubble space is not easily formed between the carrier substrate 100 and the target substrate 200 , which affects manufacturing. Yield. In the step of FIG. 5 , the closed space S2 is evacuated so that the pressing element 510 is subjected to atmospheric pressure so that the supporting substrate 100 can be pressed evenly. Since it uses negative pressure, the equipment load does not need to consider the pressing load. When the electronic component 110 is welded to the target substrate 200 with energy 522, the pressing element maintains uniform pressure on the carrier substrate 100, so good welding quality can be achieved.

In addition, in this embodiment, the area of the carrier substrate 100 is larger than the area of the target substrate 200 , so a dummy sheet 220 can be placed around the target substrate 200 . In this way, when the carrier substrate 100 falls on the target substrate 200, the dummy piece 220 can support the edge of the carrier substrate 100 to prevent the edge of the carrier substrate 100 from bending. However, in another embodiment, when the area of the carrier substrate 100 is less than or equal to the area of the target substrate 200 , there is no need to place the dummy pieces 220 around the target substrate 200 .

To sum up, in the device for soldering electronic components, the method of soldering electronic components and the method of manufacturing a light-emitting diode display according to the embodiments of the present invention, due to the use of flexible materials and the method of pumping air into a closed space, Therefore, the two substrates can be pressed evenly to achieve a good welding effect, thereby improving the yield of manufacturing light-emitting diode displays.

100: Carrying substrate 102, 104: Surface 110:Electronic components 112:Solder 114: Pad 120:Adhesive layer 200:Target substrate 202:Welding surface 210: Pad 212: Position to be welded 220: Dumb film 300:Adsorption platform 302:Through hole 310:Image sensor 400: Bearing platform 410:Exhaust channel 420: Air extraction mechanism 500: Devices for soldering electronic components 510: Pressure element 520: Energy generating mechanism 522:Energy 530: Confined space generating mechanism S1, S2: Confined space

1 to 5 are schematic cross-sectional views illustrating the process of a method of soldering electronic components according to an embodiment of the present invention. 6 is a schematic cross-sectional view of a device for soldering electronic components according to another embodiment of the present invention.

100: Carrying substrate

102, 104: Surface

110:Electronic components

112:Solder

114: Pad

120:Adhesive layer

200:Target substrate

202:Welding surface

210: Pad

212: Position to be welded

220: Dumb film

400: Bearing platform

410:Exhaust channel

420: Air extraction mechanism

500: Devices for soldering electronic components

510: Pressure element

520: Energy generating mechanism

522:Energy

530: Confined space generating mechanism

S2: Confined space

Claims (13)

A device for soldering electronic components, which includes: a carrying platform, which is used to carry a substrate; A pressing element, which is made of flexible material; A closed space generating mechanism that can place the resisting element on the bearing platform so that a sealed space is formed between the resisting element and the bearing platform; An air extraction mechanism used to evacuate the confined space; and An energy generating mechanism is provided adjacent to the bearing platform and can generate energy on the bearing platform. The device for soldering electronic components as claimed in claim 1, wherein the resisting element is a flexible film. The device for soldering electronic components as described in claim 2, wherein the flexible film is a silicone film. The device for welding electronic components as claimed in claim 1, wherein the energy generating mechanism is a laser generator. The device for welding electronic components as described in claim 4, wherein the laser generator projects a laser beam onto the carrying platform through the pressing element. The device for welding electronic components as described in claim 4, wherein the laser generator projects a laser beam onto the carrying platform through the carrying platform. The device for soldering electronic components as described in claim 1, wherein the air extraction mechanism extracts air through the carrying platform. A method of soldering electronic components, which includes: Provide a carrier substrate, on one surface of the carrier substrate, an electronic component selectively having a solder thereon is supported; Provide a target substrate with a soldering surface, a position to be soldered on the soldering surface, and when there is no solder on the electronic component, apply a solder to the position to be soldered; Make the surface of the carrying substrate carrying the electronic component face the welding surface of the target substrate, and make the electronic component opposite to the position to be welded; Place the facing carrier substrate and the target substrate into a closed space, wherein an end surface of the closed space close to the carrier substrate is made of flexible material; Evacuate the closed space so that the end surface of the flexible material presses against the surface of the carrier substrate that does not carry the electronic component; and Applying energy to melt the solder, the electronic component is soldered to the position to be soldered. The method of soldering electronic components as described in claim 8, wherein when the carrying substrate faces the target substrate, the electronic component is brought into contact with the to-be-soldered position of the target substrate through the solder. The method of welding electronic components as described in claim 8, wherein the energy is a laser beam. The method of welding electronic components as described in claim 8, wherein the electronic component is a light-emitting diode chip. The method of soldering electronic components according to claim 8, wherein the target substrate is a thin film transistor substrate. A method of manufacturing a light-emitting diode display, which includes welding a light-emitting diode chip using the method described in claim 11.

Images