TW202401643A - placement device - Google Patents
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- TW202401643A TW202401643A TW112109756A TW112109756A TW202401643A TW 202401643 A TW202401643 A TW 202401643A TW 112109756 A TW112109756 A TW 112109756A TW 112109756 A TW112109756 A TW 112109756A TW 202401643 A TW202401643 A TW 202401643A
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- 238000006748 scratching Methods 0.000 abstract 1
- 230000002393 scratching effect Effects 0.000 abstract 1
- 238000007689 inspection Methods 0.000 description 81
- 238000010586 diagram Methods 0.000 description 27
- 230000032258 transport Effects 0.000 description 26
- 230000007246 mechanism Effects 0.000 description 14
- 238000002955 isolation Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 238000012545 processing Methods 0.000 description 11
- 239000010408 film Substances 0.000 description 7
- 239000000428 dust Substances 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 235000012149 noodles Nutrition 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 101000873785 Homo sapiens mRNA-decapping enzyme 1A Proteins 0.000 description 1
- 241000699670 Mus sp. Species 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010438 granite Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 102100035856 mRNA-decapping enzyme 1A Human genes 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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Abstract
Description
本發明係有關於一種載置裝置。The invention relates to a placement device.
專利文獻1中揭示了一種光罩基板等之搬送件,其將可動框轉動自如地連結於可伸縮之固定框,於固定框及可動框之端部設置基板支持構件,於可動框之與固定框之連結部附近設有把手。使用二根該搬送件,將固定框彼此連結,藉此可搬送大型基板素材。 [現有技術文獻] [專利文獻] Patent Document 1 discloses a conveyor for photomask substrates, etc., which connects a movable frame to a telescopic fixed frame in a rotatable manner, and provides a substrate support member at the ends of the fixed frame and the movable frame, and between the movable frame and the fixed frame. There is a handle near the connecting part of the frame. Using two of these carriers to connect the fixed frames to each other, large substrate materials can be transported. [Prior art documents] [Patent Document]
專利文獻1:日本專利特開2001-168182號公報Patent document 1: Japanese Patent Application Publication No. 2001-168182
[發明所欲解決之課題][Problem to be solved by the invention]
專利文獻1所記載之搬送件係被用於將收容於殼體等中之光罩基板搬送至清洗固定架等裝置。由該搬送件所搬送之光罩基板被水平地載置於裝置內之載置面。The transport tool described in Patent Document 1 is used to transport a mask substrate accommodated in a casing or the like to a device such as a cleaning holder. The mask substrate conveyed by the conveyor is placed horizontally on a placement surface in the apparatus.
然而,於利用手動作業將光罩基板載置於載置面時,難以將光罩基板之姿勢維持為水平,有因使光罩基板碰撞載置面等而導致光罩基板缺損或載置面之一部分發生變形之虞。However, when manually placing the mask substrate on the mounting surface, it is difficult to maintain the attitude of the mask substrate in a horizontal position, and the mask substrate may collide with the mounting surface, resulting in damage to the mask substrate or the mounting surface. One part may be deformed.
本發明係有鑑於此種情況而完成,目的在於提供一種於載置板狀對象物時對象物等難以損傷之載置裝置。 [解決課題之手段] The present invention was made in view of this situation, and an object thereof is to provide a mounting device that is difficult to damage an object or the like when mounting a plate-shaped object. [Means to solve the problem]
為解決上述課題,本發明之載置裝置例如將板狀對象物水平地載置於設有孔之保持構件之載置平面,其特徵在於具備:基台,其可沿上下方向移動地設於上述保持構件之鉛直方向下側;第1移動部,其使上述基台沿上下方向移動;以及複數個柱狀部,其等被設於上述基台,上述柱狀部自上述基台朝鉛直方向朝上突出,於上述柱狀部之前端,設有載置上述對象物之第1載置部,當上述基台位於下端時,上述第1載置部較上述保持構件位於下側,當上述基台自上述下端朝上方移動時,上述柱狀部插入至上述孔,當上述基台位於上端時,上述第1載置部較上述載置平面位於上側。In order to solve the above-mentioned problems, the mounting device of the present invention places a plate-shaped object horizontally on a mounting plane of a holding member provided with a hole, for example, and is characterized in that it includes a base that is movable in the up and down direction. The lower side in the vertical direction of the above-mentioned holding member; a first moving part that moves the above-mentioned base in the up and down direction; and a plurality of columnar parts provided on the above-mentioned base, and the above-mentioned columnar parts move vertically from the above-mentioned base. The direction protrudes upward, and at the front end of the columnar portion, a first placing portion for placing the object is provided. When the base is located at the lower end, the first placing portion is located lower than the holding member. When the base moves upward from the lower end, the columnar portion is inserted into the hole. When the base is located at the upper end, the first placing portion is located above the placement plane.
根據本發明之載置裝置,於前端設有載置對象物之第1載置部之柱狀部自基台朝鉛直方向朝上突出,當基台位於上端時,第1載置部較載置平面位於上側。因此,作業者只要將對象物載置於第1載置部即可,而無須直接載置於載置平面。因此,於載置板狀對象物時,對象物或載置平面難以損傷。According to the mounting device of the present invention, the columnar portion of the first mounting portion for mounting the object is provided at the front end and protrudes upward from the base in the vertical direction. When the base is located at the upper end, the first mounting portion is larger than the mounting portion. Place the plane on the upper side. Therefore, the operator only needs to place the object on the first placement part, and does not need to place it directly on the placement surface. Therefore, when placing a plate-shaped object, the object or the placement surface is unlikely to be damaged.
亦可具備複數個第2移動部,該第2移動部具有設於上述基台之第1軌道、以及可沿著上述第1軌道移動地設置之移動構件,藉由於上述第2移動部分別設置上述柱狀部,從而上述柱狀部經由上述第2移動部而設於上述基台。藉此,可利用1個載置裝置來應對各種大小之對象物。It is also possible to provide a plurality of second moving parts. The second moving parts have a first rail provided on the above-mentioned base and a moving member disposed movably along the above-mentioned first rail. The second moving parts are respectively provided by the above-mentioned second moving parts. The columnar part is provided on the base via the second moving part. In this way, one mounting device can be used to handle objects of various sizes.
亦可具備驅動複數個上述移動構件之驅動部,上述第2移動部具有設於上述移動構件之皮帶,上述驅動部將複數個上述皮帶同時驅動相同的量。藉此,可使柱狀部同時移動相同的量。You may include a driving part that drives a plurality of the moving members, the second moving part has a belt provided on the moving member, and the driving part drives the plurality of belts by the same amount at the same time. Thereby, the columnar parts can be moved by the same amount at the same time.
上述第1載置部亦可具有高度不同之2個面、即作為上述柱狀部之前端面之第1面與自上述第1面朝下方低一階之第2面,上述第1面被設於上述第2面之外側,上述第2面係載置上述對象物之面,以朝向內側而高度變低之方式相對於水平方向傾斜1°~5°。藉此,被載置於第2面之對象物與第2面之接觸面積成為最小限,對象物之功能面即對象物膜面難以受到污染。The above-mentioned first placing part may have two surfaces with different heights, that is, the first surface as the front end surface of the above-mentioned columnar part and the second surface that is one step lower than the above-mentioned first surface, and the above-mentioned first surface is provided. Outside the above-mentioned second surface, the above-mentioned second surface is a surface on which the above-mentioned object is placed, and is inclined by 1° to 5° with respect to the horizontal direction in such a manner that the height becomes lower toward the inside. Thereby, the contact area between the object placed on the second surface and the second surface is minimized, and the functional surface of the object, that is, the object membrane surface is less likely to be contaminated.
連結上述第1面與上述第2面之面亦可以隨著變高而朝外側傾斜之方式相對於鉛直方向傾斜1°~5°。藉此,連結第1面和第2面之面與對象物之接觸面積成為最小限,對象物難以受到污染。The surface connecting the first surface and the second surface may be inclined by 1° to 5° with respect to the vertical direction so as to be inclined outward as the height increases. Thereby, the contact area between the first surface and the second surface and the object is minimized, and the object is less likely to be contaminated.
上述第1面亦可於內側之兩端設有切口,自鉛直方向上側觀察時,上述切口與以連結複數個上述柱狀部之外側之角的圓之中心點為中心之任意半徑之曲面重合。藉此,不僅可將矩形形狀之對象物,亦可將圓形狀之對象物載置於第2載置部。The above-mentioned first surface may also be provided with cutouts at both ends of the inner side. When viewed from the vertical direction, the above-mentioned cutouts coincide with a curved surface of any radius centered on the center point of a circle connecting the outer corners of a plurality of the above-mentioned columnar parts. . Thereby, not only a rectangular object but also a circular object can be placed on the second placing portion.
亦可具備設於上述基台之接近感測器,於上述保持構件之背面設有標記,上述接近感測器檢測上述保持構件,並且讀取上述標記。藉此,可使基台之中心與載置平面之中心一致,或者將柱狀部配置於與所載置之對象物之大小相符之位置。A proximity sensor may be provided on the base, and a mark may be provided on the back surface of the holding member. The proximity sensor may detect the holding member and read the mark. Thereby, the center of the base can be aligned with the center of the mounting plane, or the columnar portion can be arranged at a position that matches the size of the object to be mounted.
亦可具備:第2載置部,其自鉛直方向上側觀察時鄰接於上述基台而設;以及光罩搬送部,其具有可自下方保持上述對象物之臂、以及設有上述臂之第2軌道,且上述臂可沿著上述第2軌道移動。藉此,無須經由作業者便可將對象物載置於第1載置部,或者自第1載置部拆卸對象物。 [發明之效果] You may also include: a 2nd placement part which is provided adjacent to the said base when viewed from the vertical direction upper side; and a mask transfer part which has an arm which can hold the said object from below, and the 3rd arm provided with the said arm. 2 tracks, and the above-mentioned arm can move along the above-mentioned 2nd track. Thereby, the object can be placed on the first placing part or the object can be removed from the first placing part without going through an operator. [Effects of the invention]
根據本發明,於載置板狀對象物時對象物等難以損傷。According to the present invention, when placing a plate-shaped object, the object or the like is less likely to be damaged.
以下,參照圖式詳細說明本發明之實施方式。各圖式中,對於同一元件附註同一符號,對於重複部分省略說明。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each drawing, the same elements are denoted by the same symbols, and descriptions of overlapping parts are omitted.
本發明中之載置裝置係指將板狀之對象物水平地載置於具有載置平面之保持部之裝置。以下,作為對象物,以光罩為例進行說明。光罩係對感光性基板(例如於玻璃基板之單面形成鉻之薄膜並自其上塗佈有抗蝕劑者)上照射雷射等光而生成。對於感光性基板,一般使用熱膨脹率非常小(例如約5.5×10 -7/K左右)之石英玻璃。 The placement device in the present invention refers to a device that places a plate-shaped object horizontally on a holding portion having a placement surface. In the following description, a photomask is used as an object as an example. The photomask is produced by irradiating a photosensitive substrate (for example, a chromium thin film formed on one side of a glass substrate and a resist coated thereon) with light such as laser. For photosensitive substrates, quartz glass with a very small thermal expansion coefficient (for example, about 5.5×10 -7 /K) is generally used.
載置裝置中所用之光罩M有各種大小者。作為矩形形狀之光罩,使用5×5吋、6×6吋、7×7吋、9×9吋等,作為圓形狀之光罩,使用直徑7.25吋者。本發明可利用1個裝置來應對各種大小或複數個形狀之光罩M。The photomask M used in the mounting device comes in various sizes. For rectangular shaped masks, use 5×5 inches, 6×6 inches, 7×7 inches, 9×9 inches, etc., and for circular shaped masks, use those with a diameter of 7.25 inches. The present invention can use one device to cope with various sizes or multiple shapes of masks M.
<第1實施方式> 圖1係表示檢查裝置1之概略之立體圖。圖2係表示檢查裝置1之概略之俯視圖(自+z方向觀察之圖)。再者,圖1中,對於一部分構成省略了圖示。又,圖2中,透視了主要部分。 <First Embodiment> FIG. 1 is a perspective view schematically showing the inspection device 1 . FIG. 2 is a schematic plan view (viewed from the +z direction) of the inspection device 1 . In addition, in FIG. 1 , illustration of part of the structure is omitted. In addition, in Figure 2, the main part is seen through.
以下,將沿著鉛直方向之方向設為z方向,將鉛直朝上設為+z。又,將沿著水平方向之正交二方向設為x方向及y方向。Hereinafter, the direction along the vertical direction is referred to as the z direction, and the vertical direction upward is referred to as +z. In addition, let two orthogonal directions along the horizontal direction be the x direction and the y direction.
檢查裝置1主要具有載置裝置2、搬送裝置3、保持構件4、框10、檢查部50、除振台61以及台板62。於保持構件4,載置作為板狀對象物之光罩M。載置裝置2係將光罩M載置於保持構件4之裝置。搬送裝置3係將載置有光罩M之保持構件4搬入至檢查部50,或者自檢查部50搬出載置有光罩M之保持構件4之裝置。The inspection device 1 mainly includes a
框10覆蓋檢查部50、除振台61及台板62。又,檢查裝置1(框10之內部)藉由未圖示之溫度調整部保持為固定溫度。The frame 10 covers the inspection part 50 , the vibration isolation table 61 and the base plate 62 . In addition, the inspection device 1 (inside the frame 10 ) is maintained at a fixed temperature by a temperature adjustment unit (not shown).
框10具有設有開閉門12之正面部11。於正面部11設有開口部11a,在開閉門12關閉之狀態下,開閉門12覆蓋開口部11a。圖1圖示了開閉門12已關閉之狀態。開閉門12可沿上下方向(z方向)移動,可於覆蓋開口部11a之位置與未覆蓋開口部11a之位置之間移動。於正面部11設有軌道13,設於開閉門12之移動構件(省略圖示)藉由致動器14(參照圖14)而沿著軌道13移動,藉此,開閉門12沿z方向移動。The frame 10 has a front portion 11 provided with an opening and closing door 12 . The front part 11 is provided with an opening 11a, and when the opening and closing door 12 is closed, the opening and closing door 12 covers the opening 11a. FIG. 1 illustrates a state in which the opening and closing door 12 is closed. The opening and closing door 12 is movable in the up and down direction (z direction), and is movable between a position covering the opening 11a and a position not covering the opening 11a. A rail 13 is provided on the front portion 11 . A moving member (not shown) provided on the opening and closing door 12 moves along the rail 13 by an actuator 14 (see FIG. 14 ), whereby the opening and closing door 12 moves in the z direction. .
台板62係大致長方體形狀(厚板狀)之構件,由石頭(例如花崗岩)或低膨脹率之鑄件(例如鎳系之合金)所形成。台板62被載置於設置面(例如地板)上。The table plate 62 is a substantially rectangular parallelepiped-shaped (thick plate-shaped) member, and is formed of stone (such as granite) or a casting with a low expansion rate (such as a nickel-based alloy). The tabletop 62 is placed on an installation surface (for example, the floor).
於台板62上,載置有複數個(此處為3個)除振台61。圖3係表示除振台61之概略之圖,圖3(A)示意性地表示浮起時之樣子,圖3(B)示意性地表示落座時之樣子。除振台61主要具有底座611、框612以及移動構件613。A plurality of vibration isolation tables 61 (three in this case) are placed on the table 62 . FIG. 3 is a schematic view of the vibration isolation table 61. FIG. 3(A) schematically shows the state when it is floating, and FIG. 3(B) schematically shows the state when it is seated. The vibration isolation table 61 mainly includes a base 611, a frame 612, and a moving member 613.
框612被設於底座611,且具有孔612a。移動構件613可沿上下方向移動地設於孔612a。移動構件613主要具有棒狀構件613a、定位構件613b、613e以及板狀部613d。定位構件613b、613e例如為螺母,設於棒狀構件613a。定位構件613b於下側具有圓錐部613c。板狀部613d係設於定位構件613e之上側。The frame 612 is provided on the base 611 and has a hole 612a. The moving member 613 is provided in the hole 612a so as to be movable in the up and down direction. The moving member 613 mainly includes a rod-shaped member 613a, positioning members 613b and 613e, and a plate-shaped portion 613d. The positioning members 613b and 613e are nuts, for example, and are provided on the rod-shaped member 613a. The positioning member 613b has a tapered portion 613c on the lower side. The plate-shaped portion 613d is provided above the positioning member 613e.
於除振台61、此處係於移動構件613之上側,設有檢查部50。藉此,檢查部50經由除振台61而載置於台板62。藉由移動構件613沿上下方向移動,從而除振台61可使檢查部50沿鉛直方向移動。The inspection part 50 is provided on the vibration isolation table 61 above the moving member 613 here. Thereby, the inspection part 50 is mounted on the base plate 62 via the vibration isolation table 61. By moving the moving member 613 in the up and down direction, the vibration isolation table 61 can move the inspection part 50 in the vertical direction.
於將保持構件4插入至檢查部50及自檢查部50排出保持構件4之情形時,如圖3(B)所示,圓錐部613c抵接(落座)於框612,檢查部50藉由除振台61而下降。藉由圓錐部613c落座於框612,高度方向(z方向)及水平方向(xy方向)之定位之再現性變高,可順利地進行搬送裝置3對光罩M之搬入、搬出。When the holding
與此相對,於檢查部50中檢查光罩M之期間,如圖3(A)所示,使圓錐部613c自框612浮起。藉此,使檢查部50自台板62浮起以免檢查部50發生振動。板狀部613d被設於框612之內側,藉由板狀部613d抵接於框612,以免移動構件613自孔612a脫落。On the other hand, while the mask M is being inspected in the inspection unit 50 , the cone portion 613 c is raised from the frame 612 as shown in FIG. 3(A) . Thereby, the inspection part 50 is floated from the base plate 62, so that the inspection part 50 may not vibrate. The plate-shaped portion 613d is provided inside the frame 612, and the plate-shaped portion 613d is in contact with the frame 612 to prevent the moving member 613 from falling off from the hole 612a.
再者,除振台61之形態並不限於此。例如,亦可將除振台61設為主動除振台。Furthermore, the shape of the vibration isolation table 61 is not limited to this. For example, the vibration isolation table 61 may be an active vibration isolation table.
檢查部50主要具有第1載台51、保持部52、第2載台53、皮帶54、56以及軌道55、57。The inspection unit 50 mainly includes a first stage 51, a holding unit 52, a second stage 53, belts 54 and 56, and rails 55 and 57.
第2載台53係藉由致動器59a(參照圖14)驅動皮帶56而可沿著軌道57於x方向上移動地設置。第1載台51係被設於第2載台53,且藉由致動器59b(參照圖14)驅動皮帶54而可沿著軌道55於y方向上移動地設置。因此,第1載台51可於x方向及y方向上移動。The second stage 53 is provided so as to be movable in the x direction along the rail 57 by driving the belt 56 with the actuator 59a (see FIG. 14 ). The first stage 51 is provided on the second stage 53 and is movable in the y direction along the rail 55 by driving the belt 54 with the actuator 59b (see FIG. 14 ). Therefore, the first stage 51 can move in the x direction and the y direction.
保持部52係被設於第1載台51之上側(+z側)。保持部52被固定於第1載台51,將保持構件4保持於檢查部50之內部。關於保持部52,將於後文詳述。The holding portion 52 is provided on the upper side (+z side) of the first stage 51 . The holding part 52 is fixed to the first stage 51 and holds the holding
繼而,對載置裝置2進行說明。圖4係自正面觀察檢查裝置1時之局部放大圖。載置裝置2較正面部11設於近側(-y側)。保持構件4被載置於搬送裝置3之輥32。Next, the mounting
載置裝置2可藉由未圖示之驅動部而於z方向上移動。載置裝置2主要具有基台21、複數個柱狀部22、第1移動部23以及第2移動部24。圖4中,以實線表示載置裝置2位於下端之狀態,以二點鏈線表示位於上端之狀態。The
基台21為板狀,且被設於保持構件4之鉛直方向下側。基台21可藉由第1移動部23而沿上下方向移動地設置。第1移動部23具有軌道23a、移動構件23b以及致動器23c(參照圖14)。移動構件23b被設於基台21,並且可沿著軌道23a移動。因此,藉由致動器23c使移動構件23b沿著軌道23a於z方向上移動,從而第1移動部23使基台21於z方向上移動。The
柱狀部22為柱狀之構件,且經由第2移動部24而設於基台21。第2移動部24被設於基台21。柱狀部22係自基台21朝鉛直方向朝上地突出。於柱狀部22之前端,設有載置光罩M之載置部25(於後文詳述)。The columnar part 22 is a columnar member and is provided on the
藉由基台21於z方向上移動,柱狀部22及第2移動部24亦於z方向上移動。當基台21、柱狀部22及第2移動部24位於下端時,載置部25較保持構件4位於下側(參照圖4之實線)。又,當基台21、柱狀部22及第2移動部24位於上端時,載置部25較保持構件4位於上側(參照圖4之二點鏈線)。As the base 21 moves in the z direction, the columnar part 22 and the second moving part 24 also move in the z direction. When the
圖5係自斜前觀察檢查裝置1時之局部立體圖。圖5中,以實線表示載置裝置2位於下端之狀態,以二點鏈線表示位於上端之狀態。柱狀部22具有4根柱狀部22a、22b、22c、22d。當基台21、柱狀部22及第2移動部24自下端朝上方移動時,柱狀部22a、22b、22c、22d插入至本體部41之孔43。Figure 5 is a partial perspective view of the inspection device 1 when viewed obliquely from the front. In FIG. 5 , the solid line indicates the state in which the mounting
第2移動部24具有4個第2移動部24a、24b、24c、24d。於第2移動部24a、24b、24c、24d,分別設有柱狀部22a、22b、22c、22d。即,柱狀部22a、22b、22c、22d經由第2移動部24a、24b、24c、24d而設於基台21。The second moving part 24 has four second moving
第2移動部24a、24b、24c、24d分別具有軌道241a、241b、241c、241d、移動構件242a、242b、242c、242d、皮帶243a、243b、243c、243d以及皮帶輪244a、244b、244c、244d。The second moving
軌道241a、241b、241c、241d係設於基台21。基台21為矩形形狀,軌道241a、241b、241c、241d分別沿著基台21之對角線而設。
移動構件242a、242b、242c、242d分別設於軌道241a、241b、241c、241d,可沿著軌道241a、241b、241c、241d移動。The moving
柱狀部22a、22b、22c、22d分別設於移動構件242a、242b、242c、242d。因此,柱狀部22a、22b、22c、22d可沿著軌道241a、241b、241c、241d移動。The
於移動構件242a、242b、242c、242d,分別設有皮帶243a、243b、243c、243d。皮帶243a、243b、243c、243d分別捲繞於皮帶輪244a、244b、244c、244d,穿過設於基台21的孔21a而延伸至基台21之下方。即,皮帶243a、243b、243c、243d沿著軌道241a、241b、241c、241d朝向基台21之對角線內側拉伸移動構件242a、242b、242c、242d。
於基台21之下側設有驅動部。驅動部具有未圖示之皮帶捲繞部以及致動器24e(參照圖14)。於致動器24e,經由皮帶捲繞部而連結有皮帶243a、243b、243c、243d。致動器24e使皮帶243a、243b、243c、243d同時驅動相同的量。A driving part is provided on the lower side of the
於移動構件242a、242b、242c、242d,分別設有未圖示之彈性構件。該彈性構件沿著軌道241a、241b、241c、241d朝向基台21之對角線外側拉伸移動構件242a、242b、242c、242d。The moving
藉此,移動構件242a、242b、242c、242d經由皮帶243a、243b、243c、243d及彈性構件而沿著軌道241a、241b、241c、241d移動。具體而言,皮帶243a、243b、243c、243d克服彈性構件之彈力而拉伸移動構件242a、242b、242c、242d,藉此,移動構件242a、242b、242c、242d及柱狀部22a、22b、22c、22d朝內側移動。又,當藉由驅動部鬆弛皮帶243a、243b、243c、243d時,移動構件242a、242b、242c、242d及柱狀部22a、22b、22c、22d藉由彈性構件之彈力朝外側移動。Thereby, the moving
此時,由於驅動部使皮帶243a、243b、243c、243d同時驅動相同的量,因此移動構件242a、242b、242c、242d及柱狀部22a、22b、22c、22d同時移動相同的量。At this time, since the driving unit drives the
圖6係載置裝置2之柱狀部22a、22b、22c、22d及保持構件4之俯視圖。保持構件4係由鋁所形成,於表面形成有氧化覆膜。保持構件4具有本體部41以及設於本體部之抓握部42。本體部41之+z側之面為載置平面41a。本體部41具有沿z方向貫穿之孔43。孔43具有矩形形狀之孔43e以及分別設於孔43e之4角之孔43a、43b、43c、43d。孔43a、43b、43c、43d及孔43e一體化而形成孔43。Fig. 6 is a top view of the
基台21及本體部41係被配置為,當使載置裝置2上下移動時,於自+z方向觀察時,基台21之對角線與本體部41之對角線大致一致。柱狀部22a、22b、22c、22d分別插入至孔43a、43b、43c、43d。又,柱狀部22a、22b、22c、22d分別於孔43a、43b、43c、43d之內部沿著基台21及本體部41之對角線移動(參照圖6之箭頭)。The
於本體部41之背面,設有包含1個或複數個凹部41i之標記41j。本實施方式中,標記41j包含2個凹部41i。於基台21設有接近感測器26(參照圖14),接近感測器26檢測保持構件4,並且讀取設於本體部41之標記41j。本實施方式中,設有3個接近感測器26,接近感測器26分別檢測凹部42i之有無。於圖6所示之形態中,3個接近感測器26中的兩側之2個接近感測器26檢測凹部42i,中央之接近感測器26檢測無凹部42i之情況。On the back side of the main body part 41, there is a mark 41j including one or a plurality of recessed parts 41i. In this embodiment, the mark 41j includes two recessed portions 41i. The
標記41j根據光罩M之種類(形狀及大小)而不同。例如,如圖6所示,於兩側設有凹部42i,在於其等間未設有凹部42i之形態中,表示為6×6吋之光罩。又,例如於設有3個凹部42i之形態中,表示為9×9吋之光罩。再者,標記41j之形態並不限於此,接近感測器26之數量亦不限於此。接近感測器26只要設有至少1個即可。The mark 41j differs according to the type (shape and size) of the mask M. For example, as shown in FIG. 6 , recessed portions 42i are provided on both sides, and a form in which recessed portions 42i are not provided in between is represented as a 6×6-inch photomask. In addition, for example, in the form where three recessed portions 42i are provided, a 9×9-inch photomask is shown. Furthermore, the form of the mark 41j is not limited to this, and the number of proximity sensors 26 is not limited to this. At least one proximity sensor 26 is required.
於柱狀部22a、22b、22c、22d之前端,分別設有載置光罩M之載置部25a、25b、25c、25d。藉由使柱狀部22a、22b、22c、22d移動,可將各種大小之光罩M載置於載置部25。Mounting portions 25a, 25b, 25c, and 25d for mounting the photomask M are respectively provided at the front ends of the
圖7係表示載置裝置2之柱狀部22c及設於柱狀部22c之前端之載置部25c之概略之圖,圖7(A)係立體圖,圖7(B)係俯視圖,圖7(C)係圖7(B)之D-D剖面圖。再者,柱狀部22a、22b、22c、22d及載置部25a、25b、25c、25d之構造相同,因此省略柱狀部22a、22b、22d及載置部25a、25b、25d之說明。Fig. 7 is a schematic diagram showing the
柱狀部22c為柱狀(棒狀),於自鉛直方向上側(+z方向)觀察時(俯視時),以對角線d為軸呈線對稱,鄰接之2個面221、222所成之角度為直角。但柱狀部22c之形狀並不限於此。The
柱狀部22c係由難以變形之材料例如鐵所形成。載置部25c為載置光罩M且為於定位時使光罩M滑動,而由難以損傷光罩M之材料即聚醚醚酮材等樹脂材所形成。The
載置部25c具有高度不同之2個面251、252。面251為柱狀部22c之前端面,於本實施方式中為平面。面252為自面251朝下方(-z方向)低一階之面。載置光罩M者為面252。The placement part 25c has two surfaces 251 and 252 with different heights. The surface 251 is the front end surface of the
面251、252以對角線d為軸呈線對稱,鄰接之2個邊251a、251b所成之角度及鄰接之2個邊252a、252b所成之角度為直角。面251被設於面252之外側。此處,所謂外側,係指靠近基台21之周緣之側。即,面251設於基台21之周緣側,面252設於基台21之中心側。藉此,可將矩形形狀之光罩M載置於面252。但自+z方向觀察時之面251、252之形狀並不限於此。The surfaces 251 and 252 are linearly symmetrical with the diagonal line d as the axis, and the angle formed by the two adjacent sides 251a and 251b and the angle formed by the two adjacent sides 252a and 252b are right angles. The surface 251 is provided outside the surface 252. Here, the outer side refers to the side close to the peripheral edge of the
面252係以朝向內側(隨著遠離面251)而高度變低之方式,相對於水平方向傾斜角度θ1。即,面252係於中央(對角線d上)將2個面對接而成之複合面。角度θ1較佳為1°~5°,本實施方式中為3°。因此,載置於面252之光罩M與面252之接觸面積成為最小限,光罩M之功能面即膜面難以受到污染。The surface 252 is inclined at an angle θ1 with respect to the horizontal direction so that the height becomes lower toward the inside (as it moves away from the surface 251 ). That is, the surface 252 is a composite surface formed by connecting two surfaces at the center (on the diagonal line d). The angle θ1 is preferably 1° to 5°, and is 3° in this embodiment. Therefore, the contact area between the mask M placed on the surface 252 and the surface 252 is minimized, and the functional surface of the mask M, that is, the film surface is less likely to be contaminated.
又,連結面251與面252之面253、254以隨著變高而朝外側傾斜之方式,相對於鉛直方向傾斜角度θ2。角度θ2較佳為1°~5°,於本實施方式中為3°。因此,載置於面252之光罩M抵接於面253、254時之光罩M與面253、254之接觸面積成為最小限,光罩M難以受到污染。Furthermore, the surfaces 253 and 254 connecting the surface 251 and the surface 252 are inclined at an angle θ2 with respect to the vertical direction so as to be inclined outward as they become higher. The angle θ2 is preferably 1° to 5°, and is 3° in this embodiment. Therefore, when the mask M placed on the surface 252 comes into contact with the surfaces 253 and 254, the contact area between the mask M and the surfaces 253 and 254 is minimized, and the mask M is less likely to be contaminated.
於面251上,於內側之角設有圓弧形狀之凹部255。又,於面251上,於內側之兩端設有圓弧形狀之切口256、257。於自+z方向觀察時,切口256、257與以連結複數個柱狀部22(載置部25c)之外側之角258的圓之中心點O(參照圖6)為中心之任意半徑Ra之曲線重合。例如,半徑Ra為7.25吋(18.415 cm)之一半以上,例如為9.25 cm。藉此,可將直徑7.25吋之圓形狀之光罩M載置於面252。On the surface 251, an arc-shaped recess 255 is provided at an inner corner. Furthermore, on the surface 251, arc-shaped cutouts 256 and 257 are provided at both ends of the inner side. When viewed from the +z direction, the cutouts 256 and 257 are equal to the arbitrary radius Ra of the center point O (see FIG. 6 ) of the circle connecting the outer corners 258 of the plurality of columnar portions 22 (mounting portion 25c). The curves coincide. For example, the radius Ra is more than half of 7.25 inches (18.415 cm), such as 9.25 cm. Thereby, a circular-shaped photomask M with a diameter of 7.25 inches can be placed on the surface 252 .
繼而,使用圖8來說明搬送裝置3。圖8係表示檢查裝置1之概略之俯視圖,係將主要部分放大顯示之圖。搬送裝置3主要具有保持構件4、小齒輪31、輥32以及軌道33a、33b、33c、33d。Next, the conveying
搬送裝置3將載置有光罩M之保持構件4經由框10之開口部11a而自框10外部之第1位置I(參照虛線)搬送至框10內部之第2位置II(參照實線),且自第2位置II搬送至第1位置I。第1位置I係搬送裝置3之近側之端部(-y方向之端部)附近之任意位置。又,第2位置II係設有保持部52之位置,當保持構件4位於第2位置II時,保持構件4之前端面41b(參照圖6)抵接於保持部52之抵接面52c。The
軌道33a、33b、33c、33d係沿水平方向而設。軌道33a、33c被設於直線L1上,軌道33b、33d被設於直線L2上。直線L1、L2沿著保持構件4之搬送方向(y方向),直線L1與直線L2平行且高度(z方向之位置)相等。軌道33a、33b被設於框10之外部,軌道33c、33d被設於框10之內部。The
小齒輪31被分別設於軌道33a、33b、33c、33d。再者,設於軌道33a、33b、33c、33d之小齒輪31之數量並不限於圖示之形態。本實施方式中,於軌道33a、33b、33c、33d分別設有複數個小齒輪31,但對於軌道33c、33d,只要設有至少1個小齒輪31即可。對於軌道33a、33b,只要設有複數個小齒輪31即可。The pinion gears 31 are respectively provided on the
小齒輪31主要具有沿著z方向而設之旋轉軸31a以及可以旋轉軸31a為中心旋轉之小齒輪本體31b。小齒輪本體31b例如係模數為1之小齒輪。The
輥32於軌道33a、33b、33c、33d分別設有複數個。輥32主要具有與直線L1、L2大致正交之旋轉軸32a以及可以旋轉軸32a為中心旋轉之筒狀之輥本體32b。於旋轉軸32a與輥本體32b之間設有軸承。保持構件4被載置於複數個輥32。再者,設於軌道33a、33b、33c、33d之輥32之數量並不限於圖示之形態。A plurality of
返回圖6之說明。保持構件4之本體部41具有與載置平面41a鄰接之2個側面41c、41d。側面41c、41d與搬送方向大致平行。Return to the description of Figure 6. The main body 41 of the holding
抓握部42係設於當保持構件4位於第1位置I時夾著本體部41而與框10處於相反側(-y側)即與本體部41之前端面41b處於相反側之端部。抓握部42具有沿著x方向而設之棒狀之抓握棒42c、以及分別連結抓握棒42c之兩端與本體部41之板狀之連結部42a、42b。抓握棒42c例如為方棒。連結部42a、42b具有與保持構件4之搬送方向(y方向)大致平行之2個側面42d、42e。The grip portion 42 is provided at an end portion opposite to the frame 10 (-y side) across the main body portion 41 when the holding
圖9係表示保持構件4之概略之圖,圖9(A)係圖6之A-A剖面圖,圖9(B)係圖6之B箭頭圖,圖9(C)係圖6之C箭頭圖。側面41c、41d分別具有垂直面41e、41g以及傾斜面41f、41h。垂直面41e、41g係相對於載置平面41a而垂直之面。傾斜面41f、41h以隨著朝向載置平面41a而保持構件4之寬度變窄之方式相對於鉛直方向而傾斜。側面42d與垂直面41e位於同一面上,側面42e與垂直面41g位於同一面上。側面42d、42e之高度為垂直面41e、41g之高度之2~3倍左右。Fig. 9 is a schematic diagram showing the holding
齒條44被設於保持構件4之與搬送方向(y方向)大致平行之2個側面(側面41c、41d及側面42d、42e)。齒條44具有被設於側面41c、41d(此處為垂直面41e、41g)之齒條44c、44d以及被設於側面42d、42e之齒條44a、44b。齒條44a、44c位於同一面上,齒條44b、44d位於同一面上。齒條44a、44b、44c、44d之模數為1,且可咬合於小齒輪31。齒條44a、44b形成於整個側面42d、42e,齒條44c、44d設於整個垂直面41e、41g。側面42d、42e(連結部42a、42b)之高度高於垂直面41e、41g之高度,因此齒條44a、44b之高度高於齒條44c、44d之高度。The rack 44 is provided on two side surfaces (side surfaces 41c and 41d and side surfaces 42d and 42e) of the holding
返回圖8之說明。當保持構件4位於第1位置I時,設於軌道33a、33b之小齒輪31分別咬合於齒條44c、44d。當保持構件4自第1位置I朝向第2位置II朝+y方向移動而前端面41b臨近開口部11a時,小齒輪31咬合於齒條44a、44b、44c、44d。當保持構件4進一步朝+y方向移動時,設於軌道33c、33d之小齒輪31與設於軌道33a、33b之小齒輪31咬合於齒條44c、44d,設於軌道33a、33b之小齒輪31咬合於齒條44a、44b。如此,藉由小齒輪31咬合於齒條44a、44b、44c、44d,在保持構件4之x方向之定位得到保持之狀態下,保持構件4朝y方向受到搬送。Return to the description of Figure 8. When the holding
隨後,當保持構件4進一步朝+y方向移動而保持構件4之前端(前端面41b附近)插入至保持部52時,保持構件4之本體部41之側面41c插入至檢查部50之保持部52之軌道52a,保持構件4之本體部41之側面41d插入至保持部52之軌道52b。Subsequently, when the holding
圖10係示意性地表示側面41c插入至軌道52a之樣子之圖。軌道52a具有傾斜面52d,藉由傾斜面52d與傾斜面41f抵接,傾斜面41f即本體部41於x方向及z方向上受到定位。FIG. 10 is a diagram schematically showing the state in which the side surface 41c is inserted into the rail 52a. The rail 52a has an inclined surface 52d, and the inclined surface 52d is in contact with the inclined surface 41f. The inclined surface 41f, that is, the main body 41 is positioned in the x direction and the z direction.
返回圖8之說明。在保持構件4之前端面41b附近插入至保持部52之狀態下,設於軌道33a、33b之小齒輪31咬合於齒條44a、44b,設於軌道33c、33d之小齒輪31咬合於齒條44c、44d。直至此狀態為止,小齒輪31咬合於齒條44a、44b、44c、44d,因此力自小齒輪31朝向齒條44a、44b、44c、44d之傳遞容易。又,藉由小齒輪31咬合於齒條44a、44b、44c、44d以及本體部之周緣(側面41c、41d)插入至保持部52(軌道52a、52b),保持構件4於x方向上受到定位,因此於搬送時保持構件4不會沿x方向移動或者沿著xy平面旋轉。Return to the description of Figure 8. When the holding
隨後,當保持構件4朝+y方向移動至保持構件4之前端面41b位於抵接面52c附近(第2位置II附近)為止時,側面41c、41d之大部分插入至軌道52a、52b,設於軌道33c、33d之小齒輪31中的1個咬合於齒條44a、44b,與搬送時同樣地,保持構件4於x方向上受到定位。齒條44c、44d之齒寬小於小齒輪31之齒寬,但齒條44a、44b之齒寬大於小齒輪31之齒寬,因此力易自小齒輪31傳向齒條44a、44b,可使保持構件4沿y方向移動。Subsequently, when the holding
繼而,對搬送裝置3之小齒輪31之驅動進行說明。圖11係示意性地表示驅動小齒輪31之驅動部35之圖。圖11圖示了設於軌道33a、33c之驅動部35,但於軌道33b、33d亦與軌道33a、33c同樣地設有驅動部35(省略說明)。Next, the driving of the
驅動部35具有皮帶輪35a、皮帶35b以及致動器35c。皮帶輪35a被設於旋轉軸31a及致動器35c之旋轉軸。於皮帶輪35a上捲繞有皮帶35b。當使致動器35c驅動時,皮帶輪35a即旋轉軸31a及小齒輪本體31b經由皮帶35b而旋轉。The drive part 35 has a
藉由對設於軌道33a、33c之小齒輪31設置1個驅動部35,從而可使設於軌道33a、33c之所有小齒輪本體31b同時旋轉相同的量。又,藉由對設於軌道33b、33d之小齒輪31設置1個驅動部35,從而可使設於軌道33b、33d之所有小齒輪本體31b同時旋轉相同的量。By providing one driving part 35 for the pinion gears 31 provided on the
又,由於致動器35c可正反轉,因此可使小齒輪本體31b正反轉,藉此,可使保持構件4朝+y方向及-y方向移動。In addition, since the
圖12係示意性地表示保持構件4之本體部41之前端面41b位於檢查部50之保持部52之抵接面52c附近之狀態之圖。檢查部50具有空氣抽吸部58。空氣抽吸部58具有設於抵接面52c之連接器58a、以及接合於連接器58a之抽吸軟管58b。抽吸軟管58b連接於未圖示之抽吸泵。FIG. 12 is a diagram schematically showing a state in which the front end surface 41 b of the main body part 41 of the holding
於本體部41設有空氣孔45。空氣孔45之一端於前端面41b開口,另一端於載置平面41a開口。空氣孔45之於載置平面41a開口之開口部45a在自鉛直方向上側(+z方向)觀察時與光罩M重合。The main body 41 is provided with an air hole 45 . One end of the air hole 45 is opened on the front end surface 41b, and the other end is opened on the mounting plane 41a. The opening 45 a of the air hole 45 opening on the mounting plane 41 a overlaps with the photomask M when viewed from the vertical upper side (+z direction).
圖13係表示連接器58a之概略之圖。連接器58a主要具有接合部58c、筒狀部58d、58e以及彈性構件58f。於筒狀部58e之外周面形成有螺紋部58g,藉由螺紋部58g螺合於設於保持部52之未圖示之螺絲孔,從而將連接器58a設於抵接面52c。又,於筒狀部58e設有螺絲孔58h,抽吸軟管58b經由螺絲孔58h而設於筒狀部58e。FIG. 13 is a schematic diagram showing the connector 58a. The connector 58a mainly includes a joint portion 58c, cylindrical portions 58d and 58e, and an elastic member 58f. A threaded portion 58g is formed on the outer peripheral surface of the cylindrical portion 58e. The threaded portion 58g is screwed into a screw hole (not shown) provided in the holding portion 52, so that the connector 58a is installed on the contact surface 52c. Moreover, the cylindrical part 58e is provided with the screw hole 58h, and the suction hose 58b is provided in the cylindrical part 58e via the screw hole 58h.
接合部58c被設於筒狀部58d,且可接合於開口部45b(參照圖12)。於筒狀部58d與筒狀部58e之間設有彈性構件58f。因此,筒狀部58d及接合部58c可沿著中心軸ax移動。The joining part 58c is provided in the cylindrical part 58d, and is joinable to the opening part 45b (refer FIG. 12). An elastic member 58f is provided between the cylindrical part 58d and the cylindrical part 58e. Therefore, the cylindrical part 58d and the joint part 58c can move along the central axis ax.
返回圖12之說明。連接器58a以中心軸ax沿著y方向之方式設於抵接面52c。因此,當前端面41b位於抵接面52c之近側(-y側)數mm時,即,在前端面41b未抵接於抵接面52c之狀態下,接合部58c(參照圖13)接合於開口部45b。其結果,經由空氣抽吸部58及空氣孔45,光罩M朝向載置平面41a受到抽吸。Return to the description of Figure 12. The connector 58a is provided on the contact surface 52c such that the central axis ax is along the y direction. Therefore, when the front end surface 41 b is located several mm near the contact surface 52 c (-y side), that is, in a state where the front end surface 41 b is not in contact with the contact surface 52 c, the joint portion 58 c (see FIG. 13 ) is joined to the contact surface 52 c. opening 45b. As a result, the mask M is sucked toward the placement plane 41 a via the air suction part 58 and the air hole 45 .
隨後,經由小齒輪31來搬送保持構件4直至前端面41b抵接於抵接面52c為止。由於接合部58c可沿著y方向(搬送方向)移動,因此在接合部58c接合於空氣孔45之於前端面41b開口之開口部之狀態下,保持構件4朝+y方向受到搬送。當前端面41b抵接於抵接面52c時,光罩M朝向載置平面41a受到抽吸,因此以光罩M不會因前端面41b抵接於抵接面52c時之衝擊發生偏離之方式將光罩M保持於載置平面41a。Then, the holding
圖14係表示檢查裝置1之電性構成之方塊圖。檢查裝置1具有中央處理單元(Central Processing Unit,CPU)151、隨機存取記憶體(RandomAccess Memory,RAM)152、唯讀記憶體(Read Only Memory,ROM)153、輸入/輸出介面(I/F)154、通訊介面(I/F)155以及媒體介面(I/F)156,其等與致動器14、23c、24e、35c、59a、59b、接近感測器26等相互連接。FIG. 14 is a block diagram showing the electrical structure of the inspection device 1 . The inspection device 1 has a central processing unit (CPU) 151, a random access memory (Random Access Memory, RAM) 152, a read only memory (Read Only Memory, ROM) 153, and an input/output interface (I/F ) 154, communication interface (I/F) 155 and media interface (I/F) 156, which are interconnected with
CPU 151基於保存於RAM 152、ROM 153中之程式而動作,進行各部之控制。對於CPU 151,自接近感測器26等輸入訊號。自CPU 151輸出之訊號被輸出至致動器14、23c、24e、35c、59a、59b等。The CPU 151 operates based on the programs stored in the RAM 152 and ROM 153, and controls various components. For the CPU 151, signals are input from the proximity sensor 26 and so on. The signal output from the CPU 151 is output to the
RAM 152為揮發性記憶體。ROM 153為記憶有各種控制程式等之非揮發性記憶體。CPU 151基於保存於RAM 152、ROM 153中之程式而動作,進行各部之控制。又,ROM 153保存於檢查裝置1之啟動時CPU 151所進行之開機程式或依存於檢查裝置1之硬體之程式等。又,RAM 152保存CPU 151所執行之程式及CPU 151所使用之資料等。RAM 152 is volatile memory. ROM 153 is a non-volatile memory that stores various control programs and the like. The CPU 151 operates based on the programs stored in the RAM 152 and ROM 153, and controls various components. In addition, the ROM 153 stores a boot program executed by the CPU 151 when the inspection device 1 is started or a program that depends on the hardware of the inspection device 1 . In addition, the RAM 152 stores programs executed by the CPU 151 and data used by the CPU 151.
CPU 151經由輸入/輸出介面154來控制觸控面板、鍵盤、滑鼠等輸入/輸出裝置141。通訊介面155經由網路142而自其他機器接收資料並發送至CPU 151,並且將CPU 151所生成之資料經由網路142而發送至其他機器。The CPU 151 controls input/output devices 141 such as touch panels, keyboards, and mice through the input/output interface 154 . The communication interface 155 receives data from other machines through the network 142 and sends it to the CPU 151, and sends the data generated by the CPU 151 to other machines through the network 142.
媒體介面156讀取保存於儲存媒體143中之程式或資料並保存至RAM 152。再者,儲存媒體143例如為IC卡、SD卡等。The media interface 156 reads the programs or data stored in the storage medium 143 and saves them to the RAM 152 . Furthermore, the storage medium 143 is, for example, an IC card, an SD card, or the like.
再者,實現各功能之程式例如係自儲存媒體143被讀出,並經由RAM 152而安裝至檢查裝置1,且由CPU 151所執行。Furthermore, the program for realizing each function is, for example, read from the storage medium 143 , installed in the inspection device 1 via the RAM 152 , and executed by the CPU 151 .
CPU 151具有基於輸入訊號來控制檢查裝置1之各部之控制部151a之功能。控制部151a係藉由CPU 151執行所讀取之既定之程式而構建。關於控制部151a所進行之處理,將於後文詳述。The CPU 151 has a function of a control unit 151a that controls each component of the inspection device 1 based on input signals. The control unit 151a is constructed by the CPU 151 executing a read predetermined program. The processing performed by the control unit 151a will be described in detail later.
圖14所示之檢查裝置1之構成係當說明本實施方式之特徵時說明主要構成者,例如並非排除普遍性的資訊處理裝置所具備之構成者。檢查裝置1之構成元件亦可根據處理內容而分類為更多的構成元件,1個構成元件亦可執行複數個構成元件之處理。The structure of the inspection device 1 shown in FIG. 14 is a structure that explains the main components when describing the characteristics of the present embodiment, and does not exclude the structure of a universal information processing device, for example. The components of the inspection device 1 can also be classified into more components according to the processing content, and one component can also execute the processing of a plurality of components.
對如此般構成之檢查裝置1之作用進行說明。以下之處理主要由控制部151a進行。首先,作業者抓握保持構件4之抓握部42之抓握棒42c而提起保持構件4,將保持構件4載置於搬送裝置3之輥32。3個接近感測器26讀取標記41j,控制部151a基於其結果來控制搬送裝置3之致動器35c、載置裝置2之致動器24e。具體而言,控制部151a控制搬送裝置3之致動器35c來使保持構件4沿y方向移動,使基台21之中心與本體部41之中心一致。又,控制部151a控制載置裝置2之致動器24e來使載置裝置2之柱狀部22移動,將柱狀部22配置於與被載置於保持構件4之光罩M之大小相符之位置。The function of the inspection device 1 configured in this way will be described. The following processing is mainly performed by the control unit 151a. First, the operator grasps the grip bar 42c of the grip portion 42 of the holding
繼而,控制部151a控制載置裝置2之致動器23c來使載置裝置2之基台21朝+z方向移動,使設於載置裝置2之柱狀部22之前端之載置部25自保持構件4之本體部41之載置平面41a朝+z方向突出。藉此,光罩M可載置於載置部25。Then, the control part 151a controls the actuator 23c of the mounting
作業者使用未圖示之光罩抓握裝置將光罩M載置於載置部25。一旦經由輸入/輸出裝置141而輸入有指示,則控制部151a控制載置裝置2之致動器24e來使載置裝置2之柱狀部22朝內側移動1 mm左右,利用載置裝置2之載置部25夾持光罩M。由於載置部25之面252相對於水平方向傾斜角度θ1,因此於使柱狀部22朝內側移動時,僅光罩M之角與載置部25摩擦,光罩M之污染被限制為最低限。但該處理並非必須。The operator uses a mask gripping device (not shown) to place the mask M on the placement portion 25 . Once an instruction is input via the input/output device 141, the control unit 151a controls the actuator 24e of the
繼而,控制部151a控制載置裝置2之致動器23c來使載置裝置2之基台21朝-z方向移動,將載置於載置裝置2之載置部25之光罩M載置至載置平面41a。由於光罩M被載置部25夾持,因此光罩M不會因基台21之移動而移動。一旦基台21之位置來到既定之位置,即光罩M被載置於載置平面41a之位置,則控制部151a控制載置裝置2之致動器24e來使載置裝置2之柱狀部22朝外側移動,以解除載置部25對光罩M之夾持。藉此,藉由載置裝置2將光罩M載置至保持構件4。Then, the control part 151a controls the actuator 23c of the mounting
一旦基台21移動至-z端,則控制部151a控制搬送裝置3之致動器35c來驅動搬送裝置3之小齒輪31,將保持構件4朝+y方向搬送。此時,以加速度為0.1 g以下之方式控制致動器35c,以免載置於保持構件4之載置平面41a之光罩M於載置平面41a上發生偏離。Once the
一旦致動器35c之運轉電流值達到最大電流值(過載),即,保持構件4之本體部41之前端面41b抵接於保持部52之抵接面52c,則控制部151a使致動器35c停止。藉此,藉由搬送裝置3將保持構件4搬送至檢查裝置1之內部。Once the operating current value of the
根據本實施方式,於可沿上下方向移動地設置之基台21,以朝鉛直方向朝上突出之方式設有柱狀部22,於柱狀部22之前端設有載置部25,當基台21自下端朝上方移動時,柱狀部22插入至保持構件4之孔43內,當基台21位於上端時,載置部25較保持構件4之載置平面41a位於上側,因此作業者只要將光罩M載置於載置部25即可,而無須將光罩M直接載置於載置平面41a。因此,於載置板狀之光罩M時,光罩M或載置平面41a難以損傷。According to this embodiment, a columnar portion 22 is provided on the base 21 that is movable in the vertical direction so as to protrude upward in the vertical direction, and a mounting portion 25 is provided at the front end of the columnar portion 22. When the base 21 moves upward from the lower end, the columnar portion 22 is inserted into the
例如,於將光罩M以手動作業載置於載置平面41a之情形時,難以將光罩M之姿勢維持為水平,有因使光罩M碰撞載置平面41a等導致光罩M之一部分發生缺損或載置平面41a之一部分發生變形而產生塵埃之虞。與此相對,根據本實施方式,並非將光罩M直接載置於載置平面41a,而是將載置裝置2沿著水平方向載置於載置部25之光罩M在保持姿勢之狀態下載置於載置平面41a,因此可避免於載置板狀之光罩M時損傷光罩M或載置平面41a或者產生塵埃。For example, when the mask M is manually placed on the mounting surface 41a, it is difficult to maintain the posture of the mask M in a horizontal position, and the mask M may collide with the mounting surface 41a, causing a part of the mask M to be damaged. There is a risk that a chip may become damaged or a part of the mounting surface 41a may become deformed, thereby causing dust. In contrast, according to the present embodiment, the mask M is not placed directly on the placement plane 41a, but the
又,根據本實施方式,將柱狀部22a~22d經由第2移動部24a~24d而設於基台21,可沿著設於基台21之軌道241a~241d來移動柱狀部22a~22d,因此可利用1個載置裝置2來應對各種大小之光罩M。Moreover, according to this embodiment, the
又,根據本實施方式,使設於移動構件242a、242b、242c、242d之皮帶243a、243b、243c、243d同時驅動相同的量,因此可使柱狀部22a、22b、22c、22d同時移動相同的量。Furthermore, according to this embodiment, the
又,根據本實施方式,載置光罩M之面252以朝向內側而高度變低之方式相對於水平方向而傾斜角度θ1(1°~5°),因此被載置於面252之光罩M與面252之接觸面積成為最小限,光罩M之膜面難以受到污染。進而,連結面251與面252之面253、254以隨著變高而朝外側傾斜之方式相對於鉛直方向而傾斜角度θ2(1°~5°),因此載置於面252之光罩M抵接於面253、254時之光罩M與面253、254之接觸面積成為最小限,光罩M難以受到污染。Furthermore, according to the present embodiment, the surface 252 on which the mask M is placed is inclined at an angle θ1 (1° to 5°) with respect to the horizontal direction so that the height becomes lower toward the inside. Therefore, the mask M placed on the surface 252 is The contact area between M and surface 252 becomes the minimum, and the film surface of the photomask M is difficult to be contaminated. Furthermore, the surfaces 253 and 254 connecting the surface 251 and the surface 252 are inclined at an angle θ2 (1° to 5°) with respect to the vertical direction in such a manner that they are inclined outward as they become higher. Therefore, the mask M placed on the surface 252 When the mask M is in contact with the surfaces 253 and 254, the contact area with the surfaces 253 and 254 is minimized, and the mask M is less likely to be contaminated.
又,根據本實施方式,自+z方向觀察時,設於面251之切口256、257與以連結複數個柱狀部22(載置部25c)之外側之角258的圓之中心點O為中心之任意半徑Ra之曲線重合,因此不僅可將矩形形狀之光罩M,亦可將直徑為Ra×2之圓形狀之光罩M載置於載置部25。Furthermore, according to this embodiment, when viewed from the +z direction, the center point O of the notches 256 and 257 provided in the surface 251 and the circle connecting the outer corners 258 of the plurality of columnar portions 22 (mounting portions 25c) is Since the curves of any radius Ra of the center overlap, not only a rectangular mask M but also a circular mask M with a diameter of Ra×2 can be placed on the mounting part 25 .
又,根據本實施方式,於基台21設有接近感測器26,接近感測器26檢測保持構件4,並且讀取設於保持構件4背面之標記41j,因此可控制致動器35c來使保持構件4沿y方向移動,從而可使基台21之中心與本體部41之中心一致,又,可控制致動器24e來使柱狀部22移動,從而可將柱狀部22配置於與被載置於保持構件4之光罩M之大小相符之位置。Furthermore, according to this embodiment, the
又,根據本實施方式,於設於沿著搬送方向(y方向)之直線L1、L2上的軌道33a、33c及軌道33b、33d分別設置小齒輪31及輥32,將保持構件4載置於輥32,小齒輪31咬合於齒條44a、44b、44c、44d,因此可在將保持構件4定位於x方向之狀態下沿著直線L1、L2來搬送保持構件4。又,於保持構件4之搬送時,保持構件4不會沿x方向移動或者保持構件4不會沿著xy平面旋轉,因此保持構件4不會於檢查裝置1內碰撞保持部52等,其結果,可防止塵埃之產生。Furthermore, according to this embodiment, the
又,根據本實施方式,當保持構件4位於框10內部之第2位置II及其附近時,設於軌道33c、33d之小齒輪31中的至少1個咬合於齒條44a、44b,因此可自小齒輪31將力傳遞至保持構件4。因此,可使保持構件4確實地移動至第2位置II。Furthermore, according to the present embodiment, when the holding
又,根據本實施方式,側面41c、41d分別具有垂直面41e、41g與傾斜面41f、41h,傾斜面41f、41h與保持部52之傾斜面52d抵接,於垂直面41e、41g設有齒條44c、44d,因此既可於x方向及z方向上定位本體部41,又可沿y方向搬送保持構件4。Furthermore, according to this embodiment, the side surfaces 41c and 41d respectively have vertical surfaces 41e and 41g and inclined surfaces 41f and 41h. The inclined surfaces 41f and 41h are in contact with the inclined surface 52d of the holding part 52, and teeth are provided on the vertical surfaces 41e and 41g. The strips 44c and 44d can position the main body 41 in the x-direction and z-direction and transport the holding
又,根據本實施方式,抓握部42具有與垂直面41e、41g位於同一面上之側面42d、42e,於整個側面42d、42e形成有齒條44a、44b,因此於將保持構件4朝向+y方向按入第2位置II時,力易自小齒輪31傳向齒條44a、44b。Furthermore, according to this embodiment, the grip portion 42 has side surfaces 42d and 42e located on the same plane as the vertical surfaces 41e and 41g, and racks 44a and 44b are formed on the entire side surfaces 42d and 42e, so that the holding
又,根據本實施方式,於保持構件4之前端面41b所抵接之抵接面52c,設有空氣抽吸部58之連接器58a,連接器58a具有可沿y方向移動之接合部58c,因此在前端面41b未抵接於抵接面52c之狀態下,接合部58c接合於開口部45b,光罩M朝向載置平面41a受到抽吸。藉此,可避免光罩M因前端面41b抵接於抵接面52c時之衝擊而偏離。Furthermore, according to this embodiment, the connector 58a of the air suction part 58 is provided on the contact surface 52c where the front end surface 41b of the holding
又,根據本實施方式,於小齒輪31之旋轉軸31a設有皮帶輪35a,於設於軌道33a、33c之皮帶輪35a捲繞有1條皮帶35b,於設於軌道33b、33d之皮帶輪35a捲繞有1條皮帶35b,藉此,可使設於軌道33a、33c之所有小齒輪本體31b同時旋轉相同的量,且可使設於軌道33b、33d之所有小齒輪本體31b同時旋轉相同的量。Furthermore, according to this embodiment, a
再者,本實施方式中,使用致動器24f使基台21移動,使用致動器24e使柱狀部22移動,但致動器24e、24f並非必須,亦可由作業者以手動使基台21或柱狀部22移動。但即便於以手動使柱狀部22移動之情形時,理想的是亦具有可使4根柱狀部22同時移動之機構。Furthermore, in this embodiment, the actuator 24f is used to move the
又,本實施方式中,皮帶243a、243b、243c、243d克服彈性構件之彈力來拉伸移動構件242a、242b、242c、242d,藉此使移動構件242a、242b、242c、242d移動,但使移動構件242a、242b、242c、242d移動之機構並不限於此。例如亦可於軌道241a、241b、241c、241d之兩端附近設置皮帶輪,將皮帶243a、243b、243c、243d捲繞於該2個皮帶輪。其結果,藉由使皮帶243a、243b、243c、243d朝二方向移動,從而可使移動構件242a、242b、242c、242d朝內側及外側這二方向移動。Furthermore, in this embodiment, the
又,本實施方式中,使用致動器35c來搬送保持構件4,但致動器35c並非必須,亦可由作業者以手動來使保持構件4移動。於此情形時,小齒輪31可自由旋轉,藉由對應於保持構件4之移動來使小齒輪31旋轉,從而可進行保持構件4之x方向之定位,以免保持構件4於移動中旋轉。Moreover, in this embodiment, the
又,本實施方式中,使保持構件4由鋁所形成,且於表面形成有氧化覆膜,但保持構件4之構成並不限於此。圖15係表示變形例之保持構件之本體部41A之概略之剖面圖。本體部41A具有由鋁所形成之中央部41m以及由不鏽鋼或陶瓷所形成之外側部41n。中央部41m包含載置平面41a,於表面形成有氧化覆膜。外側部41n包含側面41c、41d。Furthermore, in this embodiment, the holding
載置光罩M之載置平面41a必須由形成有氧化覆膜之鋁所形成,但氧化覆膜存在易因衝擊而剝落之問題。因此,藉由使形成齒條44之外側部41n使用難以因衝擊而破損之不鏽鋼或陶瓷來形成,從而可大幅削減因齒條44與小齒輪31碰撞造成之塵埃之產生。The mounting plane 41 a on which the photomask M is mounted must be made of aluminum with an oxide film formed on it. However, there is a problem that the oxide film is easily peeled off due to impact. Therefore, by forming the outer side portion 41n of the rack 44 using stainless steel or ceramic that is difficult to be damaged by impact, the generation of dust caused by the collision between the rack 44 and the
<第2實施方式>
本發明之第2實施方式係軌道33a可沿x方向移動之形態。第1實施方式之檢查裝置1與第2實施方式之檢查裝置1A之差異僅為搬送裝置,因此以下僅對第2實施方式之檢查裝置中的搬送裝置進行說明。再者,對於與第1實施方式相同之部分標註相同之符號,並省略說明。
<Second Embodiment>
In the second embodiment of the present invention, the
圖16係表示檢查裝置1A之概略之俯視圖。再者,圖16中僅圖示了主要部分。搬送裝置3A主要具有保持構件4、小齒輪31、輥32、32A、軌道33a、33b、33c、33d以及軌道36。再者,圖16中省略軌道33c、33d以及設於軌道33c、33d之小齒輪31及輥32之圖示。FIG. 16 is a schematic plan view showing the inspection device 1A. In addition, only the main part is illustrated in FIG. 16 . The conveyance device 3A mainly includes the holding
軌道33a可沿著軌道36而於x方向上移動。於軌道33a上設有輥32A。輥32與輥32A之差異為x方向之寬度,輥32A之寬度寬於輥32之寬度。The
作業者在將保持構件4載置於搬送裝置3A之前,沿著軌道36使軌道33a朝-x方向移動。由於輥32A之寬度寬於輥32,因此即便軌道33a朝-x方向移動,亦可將保持構件4載置於輥32、32A上。Before placing the holding
作業者在將保持構件4載置於輥32、32A後,使軌道33a朝+x方向移動,使小齒輪31與齒條44咬合。隨後之處理與檢查裝置1同樣。After placing the holding
根據本實施方式,在將保持構件4載置於搬送裝置3A時,小齒輪31與齒條44亦可不咬合,因此可防止小齒輪31與齒條44碰撞而破損等。尤其,小齒輪31及齒條44之模數小至1,因此於不移動軌道33a之情形時,有於載置保持構件4時小齒輪31之齒與齒條44之齒不咬合而齒之一部分缺損,從而將塵埃帶入檢查裝置內部之虞,但藉由使軌道33a移動,可防止此種問題。According to this embodiment, when the holding
再者,本實施方式中,作業者沿著軌道36使軌道33a朝x方向移動,但搬送裝置3A亦可沿著軌道36使軌道33a移動。於此情形時,控制部151a只要根據來自輸入/輸出裝置141之指示等,經由未圖示之致動器來使軌道33a移動即可。Furthermore, in this embodiment, the operator moves the
<第3實施方式> 本發明之第3實施方式係自動將光罩M載置於載置部25之形態。第1實施方式之檢查裝置1與第3實施方式之檢查裝置1B之差異僅為載置裝置,因此以下僅對載置裝置進行說明。再者,對於與第1實施方式相同之部分,標註相同之符號並省略說明。 <3rd Embodiment> The third embodiment of the present invention is a form in which the photomask M is automatically placed on the placement portion 25 . The only difference between the inspection device 1 of the first embodiment and the inspection device 1B of the third embodiment is the mounting device, so only the mounting device will be described below. In addition, the same parts as those in the first embodiment are denoted by the same reference numerals, and descriptions thereof are omitted.
圖17係表示檢查裝置1B之概略之圖,圖17(A)為俯視圖,圖17(B)為前視圖。再者,圖17中僅圖示了主要部分。FIG. 17 is a schematic view of the inspection device 1B, with FIG. 17(A) being a top view and FIG. 17(B) being a front view. In addition, only the main part is illustrated in FIG. 17 .
檢查裝置1B所具備之載置裝置2A主要具有基台21、複數個柱狀部22、第1移動部23(圖17中省略圖示)、第2移動部24(圖17中省略圖示)、標線片標準機械介面盒(Reticle SMIF Pod)63、保管架70以及光罩搬送部80。標線片標準機械介面盒63及保管架70係自鉛直方向上側觀察時,於正面部11之近側(-y側)鄰接於基台21而設。本實施方式中,標線片標準機械介面盒63係於被載置於第1位置I之保持構件4之-x側,保管架70係於被載置於第1位置I之保持構件4之+x側,以夾著基台21之方式而設。The mounting device 2A included in the inspection device 1B mainly includes a
標線片標準機械介面盒63主要具有底座63a、載置部63b以及蓋63c。載置部63b被設於底座63a,於前端載置光罩M。載置部63b之形狀與載置部25同樣。蓋63c係以覆蓋載置部63b及光罩M之方式可開閉地設於底座63a。藉由將光罩M載置於載置部63b並關閉蓋63c,從而可防止光罩M之污染。又,可藉由未圖示之氮填充部而利用氮來充滿蓋63c之內部。The reticle standard mechanical interface box 63 mainly includes a base 63a, a placement part 63b and a cover 63c. The mounting portion 63b is provided on the base 63a, and the photomask M is mounted on the front end. The placement part 63b has the same shape as the placement part 25. The cover 63c is openably and closably provided on the base 63a so as to cover the mounting part 63b and the photomask M. By placing the mask M on the mounting portion 63b and closing the cover 63c, contamination of the mask M can be prevented. Furthermore, the inside of the cover 63c can be filled with nitrogen through a nitrogen filling portion (not shown).
保管架70主要具有框體71以及複數個光罩保管部72。光罩保管部72可藉由包含致動器73(參照圖18)之移動機構而沿z方向移動。再者,本實施方式中,保管架70具有5個光罩保管部72,但保管架70所具有之光罩保管部72之數量並不限於此。The storage rack 70 mainly includes a frame 71 and a plurality of mask storage parts 72 . The mask storage unit 72 can move in the z direction by a moving mechanism including an actuator 73 (see FIG. 18 ). Furthermore, in this embodiment, the storage rack 70 has five mask storage parts 72, but the number of the mask storage parts 72 included in the storage rack 70 is not limited to this.
光罩保管部72具有底座72a以及設於底座72a之載置部72b。底座72a係可藉由具有致動器72c(參照圖18)之移動機構(省略圖示)而沿x方向移動地設置。於載置部72b載置光罩M,光罩M與底座72a一同沿x方向移動。載置部72b之形狀與載置部25同樣。The mask storage part 72 has a base 72a and a placement part 72b provided in the base 72a. The base 72a is provided so that it can move in the x direction by a moving mechanism (not shown) having an actuator 72c (see FIG. 18 ). The photomask M is placed on the placing portion 72b, and the photomask M moves in the x direction together with the base 72a. The placement part 72b has the same shape as the placement part 25.
光罩搬送部80較標線片標準機械介面盒63、基台21及保管架70設於近側(-y側)。光罩搬送部80主要具有臂81、82以及軌道83。臂81、82為同一形狀,自下方保持光罩M。臂81、82具有大致U字形狀之部分,該部分沿著水平方向。因此,臂81、82使大致U字形狀之部分抵接於光罩M之背面而拿起光罩M,藉此,光罩M之姿勢被維持為水平方向。The mask transport part 80 is provided on the nearer side (-y side) than the reticle standard mechanical interface box 63, the
臂81、82被設於軌道83。藉由致動器84(參照圖18),臂81、82可沿著軌道83而於x方向上移動。The arms 81 and 82 are provided on the rail 83 . The arms 81 and 82 can move in the x direction along the rail 83 by the actuator 84 (see FIG. 18 ).
又,藉由包含致動器85(參照圖18)之移動機構(省略圖示),臂81、82可沿y方向移動,藉由包含致動器86(參照圖18)之移動機構(省略圖示),臂81、82可沿z方向移動。再者,移動機構亦可包含未圖示之軌道。In addition, the arms 81 and 82 can move in the y direction by a moving mechanism (not shown) including the actuator 85 (see FIG. 18 ), and by using a moving mechanism (not shown) including the actuator 86 (see FIG. 18 ) As shown in the figure), the arms 81 and 82 can move in the z direction. Furthermore, the moving mechanism may also include a track not shown in the figure.
圖18係表示檢查裝置1B之電性構成之方塊圖。檢查裝置1B具有中央處理單元(Central Processing Unit,CPU)151、隨機存取記憶體(Random Access Memory,RAM)152、唯讀記憶體(Read Only Memory,ROM)153、輸入/輸出介面(I/F)154、通訊介面(I/F)155以及媒體介面(I/F)156,其等與致動器14、24e、24f、35c、59a、59b、72c、73、84、85、86、接近感測器26等相互連接。FIG. 18 is a block diagram showing the electrical structure of the inspection device 1B. The inspection device 1B has a central processing unit (CPU) 151, a random access memory (Random Access Memory, RAM) 152, a read only memory (Read Only Memory, ROM) 153, and an input/output interface (I/ F) 154, communication interface (I/F) 155 and media interface (I/F) 156, which are related to
對如此般構成之檢查裝置1B之作用進行說明。以下處理主要由控制部151a進行。本實施方式中,將載置於保管架70之光罩保管部72之光罩M載置於保持構件4進行檢查,將檢查後之光罩M載置於標線片標準機械介面盒63。再者,標線片標準機械介面盒63係蓋63c打開,載置部63b露出。The function of the inspection device 1B configured in this way will be described. The following processing is mainly performed by the control unit 151a. In this embodiment, the mask M placed in the mask storage part 72 of the storage rack 70 is placed on the holding
首先,作業者抓握保持構件4之抓握部42之抓握棒42c而提起保持構件4,將保持構件4載置於搬送裝置3之輥32。3個接近感測器26讀取標記,控制部151a控制搬送裝置3之致動器35c來使保持構件4沿y方向移動,使基台21之中心與本體部41之中心一致。又,控制部151a控制載置裝置2A之致動器24e來使載置裝置2A之柱狀部22移動,將柱狀部22配置於與被載置於保持構件4之光罩M之大小相符之位置。First, the operator grasps the grip bar 42c of the grip portion 42 of the holding
繼而,控制部151a控制保管架70之致動器73,使載置有作為檢查對象之光罩M之光罩保管部72之高度(z方向之位置)與設於載置裝置2A之柱狀部22前端之載置部25之高度大致一致。圖16(B)中,自上起第2段光罩保管部72之高度與載置部25之高度大致一致。Next, the control unit 151 a controls the actuator 73 of the storage rack 70 so that the height (position in the z direction) of the mask storage unit 72 on which the mask M to be inspected is placed becomes equal to the columnar shape of the mounting device 2A. The height of the mounting portion 25 at the front end of the portion 22 is approximately the same. In FIG. 16(B) , the height of the mask storage part 72 in the second step from the top is substantially consistent with the height of the mounting part 25 .
繼而,控制部151a控制保管架70之致動器73,使載置有作為檢查對象之光罩M之光罩保管部72朝-x方向移動,以使光罩M露出於保管架70之框體71之外側。Next, the control unit 151a controls the actuator 73 of the storage rack 70 to move the mask storage unit 72 on which the mask M to be inspected is placed in the −x direction so that the mask M is exposed to the frame of the storage rack 70 Outside of body 71.
繼而,控制部151a控制光罩搬送部80之致動器84,沿著光罩搬送部80之軌道83來使光罩搬送部80之臂81、82沿x方向移動,使臂81與配置於框體71外側之光罩M之x方向之位置一致,使臂82與保持構件4(載置裝置2)之x方向之位置一致。Then, the control part 151a controls the actuator 84 of the mask conveying part 80 to move the arms 81 and 82 of the mask conveying part 80 in the x direction along the track 83 of the mask conveying part 80, so that the arm 81 is aligned with the The x-direction position of the photomask M outside the frame 71 is aligned so that the arm 82 and the holding member 4 (mounting device 2 ) are aligned with the x-direction position.
繼而,控制部151a控制光罩搬送部80之致動器86來使臂81、82沿z方向移動,使臂81、82之高度低於光罩M之高度。又,控制部151a控制光罩搬送部80之致動器85來使臂81、82朝+y方向移動,使保管架70之光罩保管部72及保持構件4(載置裝置2)與臂81、82之y方向之位置一致(參照圖16(A)之虛線)。Then, the control unit 151a controls the actuator 86 of the mask transport unit 80 to move the arms 81 and 82 in the z direction so that the heights of the arms 81 and 82 are lower than the height of the mask M. Furthermore, the control unit 151a controls the actuator 85 of the mask transport unit 80 to move the arms 81 and 82 in the +y direction, so that the mask storage unit 72 and the holding member 4 (mounting device 2) of the storage rack 70 are aligned with the arms. The positions of 81 and 82 in the y direction are consistent (refer to the dotted line in Figure 16(A)).
在光罩保管部72與臂81之y方向之位置以及保持構件4(載置裝置2)與臂82之y方向之位置一致後,控制部151a控制致動器86來使臂81、82朝+z方向移動,自光罩保管部72之載置部72b及載置部25拿起光罩M(參照圖16(B)之二點鏈線)。After the positions of the mask storage unit 72 and the arm 81 in the y direction and the positions of the holding member 4 (mounting device 2 ) and the arm 82 in the y direction match, the control unit 151 a controls the actuator 86 to move the arms 81 and 82 toward Move in the +z direction, and pick up the mask M from the mounting part 72b and the mounting part 25 of the mask storage part 72 (refer to the two-point chain line of FIG. 16(B)).
繼而,控制部151a控制光罩搬送部80之致動器84而沿著軌道83使臂81、82朝-x方向移動,使臂81與保持構件4(載置裝置2)之x方向之位置一致,且使臂82與標線片標準機械介面盒63之x方向之位置一致。Next, the control unit 151 a controls the actuator 84 of the mask transport unit 80 to move the arms 81 and 82 in the -x direction along the rail 83 to adjust the x-direction positions of the arms 81 and the holding member 4 (mounting device 2 ). The arm 82 is consistent with the x-direction position of the reticle standard mechanical interface box 63 .
於臂81與保持構件4(載置裝置2A)之x方向之位置以及臂82與標線片標準機械介面盒63之x方向之位置一致後,控制部151a控制光罩搬送部80之致動器86來使臂81、82朝-z方向移動,將光罩M載置於載置部25及標線片標準機械介面盒63之載置部63b。After the x-direction positions of the arm 81 and the holding member 4 (mounting device 2A) and the x-direction positions of the arm 82 and the reticle standard mechanical interface box 63 are consistent, the control unit 151 a controls the actuation of the mask transport unit 80 The device 86 is used to move the arms 81 and 82 in the -z direction, and the photomask M is placed on the placement portion 25 and the placement portion 63b of the reticle standard mechanical interface box 63.
藉此,將檢查前之光罩M載置於載置裝置2A之載置部25。隨後之檢查裝置1B之處理與檢查裝置1同樣,因此省略說明。Thereby, the photomask M before inspection is placed on the placement part 25 of the placement device 2A. The subsequent processing of the inspection device 1B is the same as that of the inspection device 1, so the description is omitted.
被載置於載置部25之光罩M係藉由檢查裝置1進行了檢查後之光罩M。因此,於載置部63b上載置檢查後之光罩M。隨後,作業者關閉標線片標準機械介面盒63之蓋63c,將檢查後之光罩M保存至標線片標準機械介面盒63之內部,將載置有光罩M之標線片標準機械介面盒63更換為空的標線片標準機械介面盒63。The photomask M placed on the placement portion 25 is the photomask M that has been inspected by the inspection device 1 . Therefore, the inspected photomask M is placed on the placement portion 63b. Subsequently, the operator closes the cover 63c of the reticle standard mechanical interface box 63, saves the inspected reticle M inside the reticle standard mechanical interface box 63, and places the reticle standard mechanical interface box 63 with the reticle M. The interface box 63 is replaced with an empty reticle standard mechanical interface box 63.
根據本實施方式,將載置部63b及載置部72b鄰接於基台21而設,利用臂81、82自下方保持光罩M而沿著軌道83使臂81、82移動,藉此,無須經由作業者便可將光罩M載置於載置部25或者自載置部25拆卸光罩M。According to this embodiment, the mounting portion 63b and the mounting portion 72b are provided adjacent to the
再者,本實施方式中,載置裝置2A具有標線片標準機械介面盒63、保管架70及光罩搬送部80,但只要具有標線片標準機械介面盒63及保管架70之其中任一者即可。例如,光罩搬送部80亦可自光罩保管部72之載置部72b將檢查前之光罩M搬送至載置部25,將檢查後之光罩M自載置部25搬送至光罩保管部72(載置部72b)。又,例如亦可將檢查後之光罩M自載置部25搬送至標線片標準機械介面盒63(載置部63b)。於該等情形時,光罩搬送部80只要具有1條臂81即可。Furthermore, in this embodiment, the mounting device 2A has the reticle standard mechanical interface box 63, the storage rack 70, and the mask transport part 80. However, as long as it has any of the reticle standard mechanical interface box 63 and the storage rack 70, Just one will do. For example, the mask transport unit 80 may transport the mask M before inspection from the mounting unit 72b of the mask storage unit 72 to the mounting unit 25, and may transport the mask M after inspection from the mounting unit 25 to the mask. Storage unit 72 (placement unit 72b). Furthermore, for example, the inspected mask M may be transported from the placement part 25 to the reticle standard mechanical interface box 63 (the placement part 63b). In such a case, the mask transport unit 80 only needs to have one arm 81 .
<第4實施方式>
本發明之第4實施方式係將搬送裝置之小齒輪31之一部分設於檢查部50之形態。第1實施方式之檢查裝置1與第4實施方式之檢查裝置1C之差異僅為搬送裝置,因此以下僅對第4實施方式之檢查裝置中的搬送裝置進行說明。再者,對於與第1實施方式相同之部分,標註相同之符號並省略說明。
<4th Embodiment>
The fourth embodiment of the present invention is a form in which a part of the
圖19係表示檢查裝置1C之概略之俯視圖。再者,圖19中僅圖示了主要部分。檢查裝置1C所具有之搬送裝置3B主要具有保持構件4、小齒輪31、31A、輥32、32B、軌道33a、33b、33c、33d、齒輪34以及切換機構37。再者,圖19中省略軌道33a、33b以及設於軌道33a、33b之小齒輪31及輥32之圖示。FIG. 19 is a schematic plan view showing the inspection device 1C. In addition, only the main part is illustrated in FIG. 19 . The conveying device 3B included in the inspection device 1C mainly includes the holding
小齒輪31A及輥32B被設於第1載台51A。小齒輪31A係於設於第1載台51A之旋轉軸可旋轉地設有小齒輪本體而構成。輥32B係於設於第1載台51A之旋轉軸可旋轉地設有輥本體而構成。The
第1載台51A相對於第1載台51,僅-y側之形狀不同,其他同樣。小齒輪31A及輥32B與第1載台51A一同沿x方向及y方向移動。圖19中,圖示了第1載台51A位於裝載位置(藉由搬送裝置3B搬入光罩M之位置)之狀態。The first stage 51A is the same as the first stage 51 except in the shape of the -y side. The
於設於軌道33c、33d之+y側之端附近之小齒輪31,設有切換機構37。切換機構37主要具有板狀構件371、彈性構件372以及止動銷373。A switching mechanism 37 is provided on the
板狀構件371可旋轉地設於小齒輪31之旋轉軸。於板狀構件371設有齒輪34。當板狀構件371以小齒輪31之旋轉軸為中心旋轉時,伴隨板狀構件371之旋轉,齒輪34之位置發生變化。齒輪34係於設於板狀構件371之旋轉軸34a可旋轉地設有齒輪本體34b而構成。The plate-shaped
彈性構件372例如為拉伸彈簧,對板狀構件371施加齒輪34靠近軌道33c、33d之方向(參照圖19之箭頭)之力。The elastic member 372 is, for example, a tension spring, and exerts a force on the plate-shaped
當第1載台51A不位於裝載位置時,板狀構件371藉由彈性構件372之彈力而旋轉(參照圖19之黑箭頭),板狀構件371抵接於止動銷373。當第1載台51A移動(朝-y方向移動)至裝載位置時,如圖19之空心箭頭所示,小齒輪31A亦與第1載台51A一同朝-y方向移動,小齒輪31A克服彈性構件372之彈力而按壓齒輪34即板狀構件371。藉此,齒輪34與小齒輪31A咬合。When the first stage 51A is not in the loading position, the plate-shaped
圖20係示意性地表示第1載台51A移動至裝載位置時之小齒輪31、31A及齒輪34之樣子之圖,圖20(A)表示即將到達裝載位置之前之樣子,圖20(B)表示裝載位置之樣子。Fig. 20 is a diagram schematically showing the state of the pinion gears 31, 31A and the
在即將到達裝載位置之前,如圖20(A)所示,齒輪34與小齒輪31A位於較咬合位置遠之位置。隨後,小齒輪31A沿圖20(A)之空心箭頭之方向朝向裝載位置移動。其結果,如圖20(B)所示,小齒輪31A移動至裝載位置,齒輪34與小齒輪31A準確咬合。Just before reaching the loading position, as shown in FIG. 20(A) , the
此時,彈性構件372經由小齒輪31A對第1載台51A彈力,但由於板狀構件371可克服彈性構件372之彈力而旋轉,因此不會對第1載台51A施加過剩的力。At this time, the elastic member 372 exerts elastic force on the first stage 51A via the
再者,在即將到達裝載位置之前,齒輪34之相位與小齒輪31A之相位有時不一致(參照圖20(A)之二點鏈線),但由於小齒輪31A可自由旋轉,因此小齒輪31A藉由彈性構件372之彈力而旋轉以與齒輪34之相位一致。Furthermore, just before reaching the loading position, the phase of the
對如此般構成之檢查裝置1C之作用進行說明。以下處理主要由控制部151a進行。再者,檢查裝置1C之電性構成與檢查裝置1同樣,因此省略說明。The function of the inspection device 1C configured in this way will be described. The following processing is mainly performed by the control unit 151a. In addition, since the electrical structure of the inspection device 1C is the same as that of the inspection device 1, description is omitted.
首先,控制部151a控制致動器59a、59b,如圖19所示般使第1載台51A移動至裝載位置,使齒輪34與小齒輪31A咬合。First, the control unit 151a controls the actuators 59a and 59b to move the first stage 51A to the loading position and engage the
隨後,與檢查裝置1之情形同樣,於將保持構件4載置於搬送裝置3B之輥32並將光罩M載置於保持構件4後,控制部151a控制搬送裝置3B之致動器35c來驅動搬送裝置3B之小齒輪31,將保持構件4朝+y方向搬送。由於小齒輪31、31A之相位一致(參照圖20),因此齒條44準確咬合至小齒輪31、31A,保持構件4被順利地搬送至保持部52。Then, similarly to the case of the inspection device 1 , after placing the holding
再者,當第1載台51A即小齒輪31A移動至裝載位置時,齒輪34之齒與小齒輪31A之齒相抵接,根據齒輪34之相位,亦可能有小齒輪31A無法旋轉之虞。於此情形時,小齒輪31A之齒按壓齒輪34之齒,藉由彈性構件372之彈力來維持小齒輪31A之齒與齒輪34之齒相抵接之狀態,直至小齒輪31及齒輪34開始驅動為止。當小齒輪31及齒輪34開始驅動(旋轉)時,小齒輪31A之齒與齒輪34之齒之抵接脫離,小齒輪31A之齒進入齒輪34之齒與齒之間。伴隨於此,藉由彈性構件372之彈力,齒輪34朝靠近小齒輪31A之方向移動,齒輪34與小齒輪31A咬合,小齒輪31與小齒輪31A之相位一致。Furthermore, when the first stage 51A, that is, the
隨後,與檢查裝置1之情形同樣,於保持構件4之本體部41之前端面41b抵接於保持部52之抵接面52c後,控制部151a使搬送裝置3B之致動器35c停止。藉此,藉由搬送裝置3B將保持構件4搬送至檢查裝置1C之內部。Then, similarly to the case of the inspection device 1 , after the front end surface 41 b of the main body part 41 of the holding
根據本實施方式,藉由將小齒輪31A設於第1載台51A,可使小齒輪31A靠近保持部52。藉此,不論抓握部42之大小如何,均可藉由小齒輪31A將保持構件4按入至最後。According to this embodiment, by providing the
再者,本實施方式中,齒輪34為1個,但齒輪34之數量並不限於1個。例如於軌道33c、33d與保持部52之距離遠之情形時,亦可藉由複數個齒輪來連結小齒輪31與小齒輪31A。Furthermore, in this embodiment, the number of
圖21係表示變形例的搬送裝置3C之概略之圖。圖21中,圖示了第1載台51A(圖21中省略圖示)即小齒輪31A位於裝載位置之狀態。搬送裝置3C主要具有保持構件4、小齒輪31、31A、輥32、32B、軌道33a、33b、33c、33d、齒輪34A以及切換機構37A。圖21中省略軌道33a、33b、設於軌道33a、33b之小齒輪31與輥32及輥32B之圖示。FIG. 21 is a schematic diagram showing a
於設於軌道33c、33d之+y側之端附近之小齒輪31,設有切換機構37A。切換機構37A主要具有板狀構件371A、彈性構件372(圖21中省略圖示)以及止動銷373。板狀構件371A與板狀構件371大小不同。A
板狀構件371A可旋轉地設於小齒輪31之旋轉軸。於板狀構件371A設有齒輪34A。齒輪34A具有3個齒輪341、342、343。齒輪341、342、343係分別於設於板狀構件371A之旋轉軸34a可旋轉地設有齒輪本體34b而構成。當板狀構件371A以小齒輪31之旋轉軸為中心旋轉時,伴隨板狀構件371A之旋轉,齒輪34A之位置發生變化。The plate-shaped
當第1載台51A不位於裝載位置時,藉由彈性構件372之彈力,板狀構件371A抵接於止動銷373。當第1載台51A移動至裝載位置時,小齒輪31A克服彈性構件372之彈力而推動齒輪343,齒輪343與小齒輪31A咬合。When the first stage 51A is not in the loading position, the plate-shaped
如本變形例般,藉由使用複數個齒輪341、342、343之數量,可拉遠軌道33c、33d與保持部52之距離,或者使小齒輪31A靠近保持部52。As in this modification, by using a plurality of
以上,參照圖式詳述了本發明之實施方式,但具體構成並不限於該實施方式,亦包含不脫離本發明之主旨之範圍之設計變更等。只要是所屬技術領域中具有通常知識者,便可對實施方式之各要素進行適當變更、追加、變換等。The embodiments of the present invention have been described in detail above with reference to the drawings. However, the specific configuration is not limited to the embodiments and includes design changes and the like within the scope of the invention. Anyone with ordinary knowledge in the relevant technical field can make appropriate changes, additions, transformations, etc. to each element of the embodiment.
又,本發明中,所謂「大致」,其概念不僅包含嚴格相同之情形,亦包含不失同一性之程度之誤差或變形。例如,所謂大致水平,其概念並不限於嚴格水平之情形,例如亦包含數度左右之誤差。又,例如於簡單地表達為平行、正交等之情形時,不僅包含嚴格平行、正交等情形,亦包含大致平行、大致正交等情形。又,本發明中,所謂「附近」,係指包含作為基準之位置附近之某範圍(可任意規定)之區域。例如,於言及A附近之情形時,係表示A附近之某範圍之區域且既可包含A亦可不包含A之概念。In addition, in the present invention, the concept of "approximately" includes not only strictly the same situation, but also includes errors or deformations to a degree that does not lose the identity. For example, the concept of the so-called approximate level is not limited to a strict level, but also includes an error of several degrees. For example, when simply expressed as parallel, orthogonal, etc., it includes not only strictly parallel, orthogonal, etc., but also approximately parallel, approximately orthogonal, etc. In addition, in the present invention, "nearby" refers to a certain range (which can be arbitrarily defined) including the vicinity of a reference position. For example, when talking about the situation near A, it means a certain range of area near A and may or may not include A.
1、1A、1B、1C:檢查裝置
2、2A:載置裝置
3、3A、3B、3C:搬送裝置
4:保持構件
10:框
11:正面部
11a:開口部
12:開閉門
13:軌道
14:致動器
21:基台
21a:孔
22、22a、22b、22c、22d:柱狀部
23:第1移動部
23a:軌道
23b:移動構件
23c:致動器
24、24a、24b、24c、24d:第2移動部
24e、24f:致動器
25、25a、25b、25c、25d:載置部
26:接近感測器
31、31A:小齒輪
31a:旋轉軸
31b:小齒輪本體
32、32A、32B:輥
32a:旋轉軸
32b:輥本體
33a、33b、33c、33d:軌道
34、34A:齒輪
34a:旋轉軸
34b:齒輪本體
35:驅動部
35a:皮帶輪
35b:皮帶
35c:致動器
36:軌道
37、37A:切換機構
41、41A:本體部
41a:載置平面
41b:前端面
41c、41d:側面
41e、41g:垂直面
41f、41h:傾斜面
41i:凹部
41j:標記
41m:中央部
41n:外側部
42:抓握部
42a、42b:連結部
42c:抓握棒
42d、42e:側面
42i:凹部
43、43a、43b、43c、43d、43e:孔
44、44a、44b、44c、44d:齒條
45:空氣孔
45a、45b:開口部
50:檢查部
51、51A:第1載台
52:保持部
52a、52b:軌道
52c:抵接面
52d:傾斜面
53:第2載台
54、56:皮帶
55、57:軌道
58:空氣抽吸部
58a:連接器
58b:抽吸軟管
58c:接合部
58d、58e:筒狀部
58f:彈性構件
58g:螺紋部
58h:螺絲孔
59、59a、59b:致動器
61:除振台
62:台板
62b:載置部
63:標線片標準機械介面盒
63a:底座
63b:載置部
63c:蓋
70:保管架
71:框體
72:光罩保管部
72a:底座
72b:載置部
72c、73:致動器
80:光罩搬送部
81、82:臂
83:軌道
84、85、86:致動器
141:輸入/輸出裝置
142:網路
143:儲存媒體
151:CPU
151a:控制部
152:RAM
153:ROM
154:輸入/輸出介面
155:通訊介面
156:媒體介面
221、222:面
241、241a、241b、241c、241d:軌道
242a、242b、242c、242d:移動構件
243a、243b、243c、243d:皮帶
244a、244b、244c、244d:皮帶輪
251、252:面
251a、251b:邊
252a、252b:邊
253、254:面
255:凹部
256、257:切口
258:角
341、342、343:齒輪
371、371A:板狀構件
372:彈性構件
373:止動銷
611:底座
612:框
612a:孔
613:移動構件
613a:棒狀構件
613b、613e:定位構件
613c:圓錐部
613d:板狀部
ax:中心軸
d:對角線
I:第1位置
II:第2位置
L1、L2:直線
M:光罩
Ra:半徑
θ1、θ2:角度
1, 1A, 1B, 1C:
[圖1]係表示檢查裝置1之概略之立體圖。
[圖2]係表示檢查裝置1之概略之俯視圖。
[圖3]係表示除振台61之概略之圖,圖3(A)示意性地表示浮起時之樣子,圖3(B)示意性地表示落座時之樣子。
[圖4]係自正面觀察檢查裝置1時之局部放大圖。
[圖5]係自斜前觀察檢查裝置1時之局部立體圖。
[圖6]係載置裝置2之柱狀部22a、22b、22c、22d及保持構件4之俯視圖。
[圖7]係表示載置裝置2之柱狀部22c及設於柱狀部22c之前端之載置部25c之概略之圖,圖7(A)係立體圖,圖7(B)係俯視圖,圖7(C)係圖7(B)之D-D剖面圖。
[圖8]係表示檢查裝置1之概略之俯視圖,係將主要部分放大顯示之圖。
[圖9]係表示保持構件4之概略之圖,圖9(A)係圖6之A-A剖面圖,圖9(B)係圖6之B箭頭圖,圖9(C)係圖6之C箭頭圖。
[圖10]係示意性地表示保持構件4之本體部41之側面41c抵接於檢查部50之保持部52之軌道52a之樣子之圖。
[圖11]係示意性地表示驅動搬送裝置3之小齒輪31之驅動部35之圖。
[圖12]係示意性地表示保持構件4之本體部41之前端面41b位於檢查部50之保持部52之抵接面52c附近之狀態之圖。
[圖13]係表示空氣抽吸部58之連接器58a之概略之圖。
[圖14]係表示檢查裝置1之電性構成之方塊圖。
[圖15]係表示變形例之保持構件之本體部41A之概略之剖面圖。
[圖16]係表示檢查裝置1A之概略之俯視圖。
[圖17]係表示檢查裝置1B之概略之圖,圖17(A)係俯視圖,圖17(B)係前視圖。
[圖18]係表示檢查裝置1B之電性構成之方塊圖。
[圖19]係表示檢查裝置1C之概略之俯視圖。
[圖20]係示意性地表示第1載台51A移動至裝載位置時之小齒輪31、31A及齒輪34之樣子之圖,圖20(A)表示即將到達裝載位置之前之樣子,圖20(B)表示裝載位置之樣子。
[圖21]係表示搬送裝置3C之概略之圖。
[Fig. 1] is a perspective view showing an outline of the inspection device 1.
[Fig. 2] is a plan view schematically showing the inspection device 1.
[Fig. 3] is a schematic diagram showing the vibration isolation table 61. Fig. 3(A) schematically shows the state when it is floating, and Fig. 3(B) schematically shows the state when it is seated.
[Fig. 4] is a partial enlarged view of the inspection device 1 when viewed from the front.
[Fig. 5] is a partial perspective view of the inspection device 1 when viewed obliquely from the front.
[Fig. 6] It is a top view of the
2:載置裝置 2: Mounting device
3:搬送裝置 3:Conveying device
4:保持構件 4: Keep components
21:基台 21:Abutment
21a:孔 21a:hole
22a、22b、22c、22d:柱狀部 22a, 22b, 22c, 22d: columnar part
24a、24b、24c、24d:第2移動部 24a, 24b, 24c, 24d: 2nd mobile unit
31:小齒輪 31:Pinion gear
32:輥 32:Roller
33a、33c:軌道 33a, 33c: orbit
43:孔 43:hole
241a、241b、241c、241d:軌道 241a, 241b, 241c, 241d: orbit
242a、242b、242c、242d:移動構件 242a, 242b, 242c, 242d: moving components
243a、243b、243c、243d:皮帶 243a, 243b, 243c, 243d: belt
244a、244b、244c、244d:皮帶輪 244a, 244b, 244c, 244d: Pulley
M:光罩 M: photomask
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2022103826A JP2024004247A (en) | 2022-06-28 | 2022-06-28 | Mounting device |
JP2022-103826 | 2022-06-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202401643A true TW202401643A (en) | 2024-01-01 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112109756A TW202401643A (en) | 2022-06-28 | 2023-03-16 | placement device |
Country Status (3)
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JP (1) | JP2024004247A (en) |
TW (1) | TW202401643A (en) |
WO (1) | WO2024004953A1 (en) |
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JP3485990B2 (en) * | 1995-02-09 | 2004-01-13 | 東京エレクトロン株式会社 | Transfer method and transfer device |
JP2001326267A (en) * | 2000-05-18 | 2001-11-22 | Sony Corp | Semiconductor processing apparatus |
JP2004083182A (en) * | 2002-08-26 | 2004-03-18 | Sharp Corp | Base board transporting device and manufacturing method for liquid crystal display device |
JP2004273702A (en) * | 2003-03-07 | 2004-09-30 | Nikon Corp | Apparatus and method for transfer, and exposure device |
JP4037777B2 (en) * | 2003-03-10 | 2008-01-23 | 東京エレクトロン株式会社 | Substrate transfer device |
JP2021150496A (en) * | 2020-03-19 | 2021-09-27 | 株式会社Screenホールディングス | Substrate processing system and substrate processing method |
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2022
- 2022-06-28 JP JP2022103826A patent/JP2024004247A/en active Pending
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JP2024004247A (en) | 2024-01-16 |
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