TW202400993A - Pcb defect detection method, metrological measurement method and manufacture method for circuit board - Google Patents

Abstract

The present disclosure provides a PCB defect detection method, a metrological measurement method and a manufacture method for circuit board. The detection method comprises: inputting a PCB design document of a circuit board to be detected into an AOI device, wherein the PCB design document comprises designed dimension information of each object on the circuit board; scanning the circuit board to obtain a scanned image by the AOI device, and obtaining a pixel unit dimension currently set by the AOI device; in response to a trigger signal of a detection request for at least one target object, determining a number of pixels occupied by the target object in the direction of requesting measurement in the scanned image; according to the pixel unit dimension currently set by the AOI device and the number of pixels occupied by the target object, calculating a dimension of the target object in the direction of requesting measurement; comparing the dimension of the target object in the direction of requesting measurement with the dimension information of the target object in the design document; if a dimension difference thereof exceeds a preset difference threshold, it is determined that the target object of the circuit board is defective.

Description

PCB defect detection method, circuit board measurement method and production method

The invention relates to the field of PCB detection, and in particular to a PCB defect detection method, a circuit board measurement method and a manufacturing method.

Automated Optical Inspection (AOI) equipment has now become an important inspection tool and process quality control tool for the electronics manufacturing industry to ensure product quality. It is equipped with a wire scan camera to perform a line scan on the circuit board, and then scan the sub-sections of the line scan. Image stitching to obtain a complete PCB scanned image.

The conventional method of PCB defect detection is that AOI equipment compares the detection points with qualified parameters in the database, and through image processing, detects defects on the product being tested.

However, the current AI detection model is not accurate enough, causing detection errors to occur from time to time, affecting the accuracy of defect identification.

The disclosure of the above background technology content is only used to assist in understanding the inventive concepts and technical solutions of the present invention. It does not necessarily belong to the prior art of this patent application, nor does it necessarily provide technical guidance; in the absence of clear evidence that the above content is If the patent application has been published before the filing date, the above background technology should not be used to evaluate the novelty and inventiveness of the application.

The purpose of the invention is to provide a PCB defect detection method, circuit board metrology measurement method and production method, using the scanned image of the AOI device to quickly perform two-dimensional measurement of objects on the PCB, and using the circuit board metrology measurement data as a method to detect circuit board defects. basis to improve the accuracy of defect detection and identification.

In order to achieve the above objects, the technical solutions adopted by the present invention are as follows:

A PCB defect detection method, including:

Input the PCB design document of the circuit board to be inspected into the AOI device, where the PCB design document includes the size design information of each object on the circuit board;

Use the AOI device to scan the circuit board to be inspected, obtain the PCB scan image, and obtain the pixel unit size currently set by the AOI device;

In response to a trigger signal of a detection request for at least one target object, determining the number of pixels occupied by the target object in the requested measurement direction in the PCB scan image;

According to the currently set pixel unit size of the AOI device and the number of pixels occupied by the target object in the requested measurement direction, calculate the size of the target object in the requested measurement direction by multiplying the two;

Compare the calculation result of the size of the target object in the requested measurement direction with the size design information of the target object in the PCB design document. If the size difference exceeds a preset difference threshold, determine the circuit board The target object is defective.

Further, the trigger signal for a detection request for a target object includes:

In advance, the PCB scanned image and the corresponding PCB design image in the PCB design document are input into the two-dimensional metrology software for display;

Mapping and correlating the PCB scanned image with the PCB design image;

Select a target object on the display interface of the PCB scan image, and determine the measurement direction; and determine the mapping object associated with the selected target object in the PCB design image.

Further, the trigger signal for a detection request for a target object includes:

In advance, the PCB scanned image and the corresponding PCB design image in the PCB design document are input into the two-dimensional metrology software for display;

Mapping and correlating the PCB scanned image with the PCB design image;

Select the mapping object associated with the target object mapping on the display interface of the PCB design image; determine the target object associated with the selected mapping object in the PCB scan image, and determine the measurement direction.

Further, in response to a trigger signal for a demarcated area detection request, all target objects in the delimited area are located and their respective measurement directions are determined, and each target object is determined in its respective measurement direction in the PCB scan image. The number of pixels occupied in the direction;

According to the currently set pixel unit size and the number of pixels occupied by each target object in the demarcated area, the size of each target object in the requested measurement direction is calculated.

Further, the target object is a straight line segment or a curved line segment, and its corresponding requested measurement direction is the line segment length extension direction or line width direction; or,

The target object is a polygon, and its corresponding requested measurement direction is the edge side length direction; or,

The target object is a circle, and its corresponding requested measurement direction is a radial direction.

Further, if the size difference exceeds a preset difference threshold, determine the process type of the target object according to the PCB design document;

The process parameters are corrected for the determined process type so that the size difference between the measurement size of the target object of the circuit board produced by the corrected process and its size design information in the PCB design document is reduced.

Further, if the line width measurement size of the bonding wire on the circuit board to be detected is smaller than the corresponding size design information, the etching time process parameters are reduced;

If the line width measurement size of the bonding wire on the circuit board to be detected is larger than the corresponding size design information, the etching time process parameters are increased.

Further, the PCB scanned image is a grayscale image or a color image.

Further, during the scanning process of the AOI device, counting of the number of pixels occupied by each scanned object on the circuit board in the requested measurement direction in the PCB scan image is performed until the scanning is completed. The number of pixels occupied by all objects on the circuit board in the requested measurement direction in the PCB scan image and/or the size of all objects in the requested measurement direction are obtained.

Further, the number of pixels occupied by each scanned object on the circuit board in the requested measurement direction in the PCB scan image is counted in the following manner:

Locate the starting endpoint of the target object in its measurement direction, and the count is 1;

Step to the next pixel block in the measurement direction. If the difference in gray value between the current pixel block and the pixel block in the previous step exceeds the preset gray threshold, then stop counting and stepping, otherwise the count will increase automatically. 1;

Repeat the step of stepping to the next pixel block in the measurement direction until the difference in gray value between the current pixel block and the pixel block in the previous step exceeds the preset gray threshold, and then use the current counting result as the target The number of pixels the object occupies in the PCB scan image in its metering direction.

According to another aspect of the present invention, a 2D metrology measurement method for printed circuit boards is provided, including:

Obtain the PCB scan image obtained by scanning the target circuit board with the AOI device, and obtain the pixel unit size currently set by the AOI device;

Select one or more target objects in the PCB scan image and determine their measurement direction;

Determine the number of pixels occupied by the target object in the respective corresponding measurement directions in the PCB scan image;

According to the currently set pixel unit size of the AOI device and the number of pixels occupied by the target object in the requested measurement direction, the size of the target object in its measurement direction is calculated by multiplying the two.

Further, the number of pixels occupied by a target object in the measurement direction of the PCB scan image is determined in the following manner:

Locate the starting endpoint of the target object in its measurement direction, and the count is 1;

Step to the next pixel block in the measurement direction. If the difference in gray value between the current pixel block and the pixel block in the previous step exceeds the preset gray threshold, then stop counting and stepping, otherwise the count will increase automatically. 1;

Repeat the step of stepping to the next pixel block in the measurement direction until the difference in gray value between the current pixel block and the pixel block in the previous step exceeds the preset gray threshold, and then use the current counting result as the target The number of pixels the object occupies in the PCB scan image in its metering direction.

Further, the printed circuit board 2D metrology measurement method also includes:

Mapping and associating the PCB scanned image with the PCB design image in the design document of the target circuit board;

Determine the mapping object associated with the selected target object in the PCB design image;

Determine the size design information of the mapping object in the design document;

The calculation result of the size of the target object in its measurement direction minus the dimensional design information of the mapping object in the design document is used as the measurement result of the target object.

According to yet another aspect of the present invention, a printed circuit board manufacturing method is provided, including:

Set various initial process parameters according to the circuit board design document;

The circuit board to be verified is produced according to the initial process parameters;

Use the PCB defect detection method as mentioned above to detect the circuit board;

If it is determined that the circuit board does not have defects, mass production will be carried out according to the current process parameters;

Otherwise, determine the process type of the defective object according to the PCB design document; correct the process parameters for the determined process type so that the measurement size of the target object of the circuit board produced by the corrected process is the same as that in the design document The size difference between size design information is reduced.

The beneficial effects brought by the technical solution provided by the present invention are as follows:

a. Perform two-dimensional metrological measurement of the circuit board on the scanned image of the circuit board by the AOI equipment, without the need to configure additional tools such as cameras;

b. During the scanning process of the AOI device, the number of pixels occupied by the target object in the PCB scan image in the requested measurement direction can be counted. After the AOI device scans, the two-dimensional measurement result data of the circuit board can be quickly obtained. It will not affect the detection process of AOI itself, greatly improving the efficiency of AOI cycle;

c. The scanned image of the AOI device is stitched together from the images captured by the line scan camera, so that compared to the limited pixels of the camera, the scanned image theoretically has an unlimited number of measurement points.

In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only These are some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts should fall within the scope of protection of the present invention.

It should be noted that the terms "first", "second", etc. in the description of the invention, the patent scope of the invention, and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. . It is to be understood that the data so used are interchangeable under appropriate circumstances so that the embodiments of the invention described herein are capable of being practiced in sequences other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, apparatus, product or equipment that includes a series of steps or units and need not be limited to those explicitly listed. Those steps or units may instead include other steps or units not expressly listed or inherent to the processes, methods, products or devices.

In one embodiment of the present invention, a PCB defect detection method is provided. See Figure 1. The defect detection method includes:

Input the PCB design document of the circuit board to be inspected into the AOI device, where the PCB design document includes the size design information of each object on the circuit board;

Use the AOI device to scan the circuit board to be inspected, obtain the PCB scan image (which can be a grayscale image or a color image), and obtain the pixel unit size currently set by the AOI device;

In response to a trigger signal of a detection request for at least one target object, determining the number of pixels occupied by the target object in the requested measurement direction in the PCB scan image;

According to the currently set pixel unit size of the AOI device and the number of pixels occupied by the target object in the requested measurement direction, calculate the size of the target object in the requested measurement direction by multiplying the two;

Compare the calculation result of the size of the target object in the requested measurement direction with the size design information of the target object in the PCB design document. If the size difference exceeds a preset difference threshold, determine the circuit board The target object is defective.

In this embodiment, the PCB scanned image and the corresponding PCB design image in the PCB design document are input into the two-dimensional metrology software for display in advance, as shown in Figure 3. The upper part of Figure 3 is the PCB design image. Below is the scanned image of PCB;

In the two-dimensional metrology software, the PCB scan image and the PCB design image are mapped and associated, that is, selecting an object in the PCB scan image can be mapped to the corresponding object in the PCB design image, and vice versa. , selecting an object in the PCB design image can be mapped to the corresponding object in the PCB scan image.

In one embodiment of the present invention, the trigger signal for a detection request for a target object is: selecting the target object on the display interface of the PCB scan image, and determining the measurement direction; and determining the measurement direction in the PCB design image. The mapping object associated with the selected target object.

In another embodiment of the present invention, the trigger signal for a detection request for a target object is: selecting a mapping object associated with the target object mapping on the display interface of the PCB design image; and determining the mapping object in the PCB scan image. The target object in the image associated with the selected mapping object and determines the measurement direction.

In short, the target object can be a line segment, a circular area, a polygonal area, etc. in the PCB scanned image. For example, you can select a target object by clicking, multi-clicking, or right-clicking, or by selecting the target object on the PCB. Design the mapping object in the image to indirectly select the target object in the PCB scan image.

Different target objects can have different measurement directions. For example, if the target object is a straight line segment or a curve segment, its corresponding requested measurement direction is the line segment length extension direction or line width direction; if the target object is a polygon, its corresponding requested measurement direction is the edge length direction; if the target object is a circle, its corresponding requested measurement direction is the radial direction.

As shown in Figure 3, the selected target object is a straight line segment, and the requested measurement direction is the line width direction. As can be seen in the Measurement pop-up window in Figure 3, the line width of 2D measurement in the PCB scan image is 3.59 um, and the corresponding size design information (Reference) of the associated mapping object in the PCB design image is 4.6 um. The size difference (Difference) is -1.01 um. For example, the preset difference threshold is 0.5um, which means that the ±0.5um range of the Reference size belongs to the tolerance range. If it exceeds the tolerance range, the process parameters of the target object need to be corrected so that the corrected process can be produced. The size difference between the measurement size of the target object of the circuit board and its size design information in the PCB design document is reduced. For example, in Figure 3, this line segment uses an etching process. If the line width of the 2D measurement is smaller than the Reference size, it means that the etching process is used. If it is excessive, the etching time process parameters should be reduced; on the contrary, if the line width of 2D measurement is larger than the Reference size, it means that the etching is not in place, and the etching time process parameters should be increased.

In one embodiment of the present invention, multiple target objects can also be measured two-dimensionally in batches. The specific steps are to use an input device such as a mouse to demarcate areas in the PCB scan image, and similarly associate and map to the areas in the PCB design image. Mapping the area to locate all target objects in the demarcated area and determine their respective measurement directions, and determine the number of pixels occupied by each target object in the respective measurement directions in the PCB scan image; according to the current Based on the set pixel unit size and the number of pixels occupied by each target object in the delimited area, the size of each target object in the requested measurement direction is calculated.

You can also demarcate an area in the PCB design image to locate all the design objects in the delimited area, and then associate it with the PCB scan image to obtain the target objects associated with each design object, and then use the above single The measurement method of target objects measures multiple target objects one by one and compares and designs (reference) sizes in batches, which can effectively improve the efficiency of defect detection.

What's more, in a special embodiment, during the scanning process of the AOI device, the step of counting the number of pixels of each object on the PCB in each measurement direction is automatically performed, which makes it possible to count the number of pixels in each measurement direction immediately after the AOI device completes the scan. Obtain the two-dimensional measurement result data of all objects on the PCB (in each measurement direction).

Specifically, the number of pixels occupied by each scanned object on the circuit board in the requested measurement direction in the PCB scan image is counted in the following manner:

Locate the starting endpoint of the target object in its measurement direction, and the count is 1;

Step to the next pixel block in the measurement direction. If the difference in gray value between the current pixel block and the pixel block in the previous step exceeds the preset gray threshold, then stop counting and stepping, otherwise the count will increase automatically. 1;

Repeat the step of stepping to the next pixel block in the measurement direction until the difference in gray value between the current pixel block and the pixel block in the previous step exceeds the preset gray threshold, and then use the current counting result as the target The number of pixels the object occupies in the PCB scan image in its metering direction.

In one embodiment of the present invention, a 2D metrology measurement method for printed circuit boards is provided. As shown in Figure 2, the metrology measurement method includes:

Obtain the PCB scan image obtained by scanning the target circuit board with the AOI device, and obtain the pixel unit size currently set by the AOI device;

Select one or more target objects in the PCB scan image and determine their measurement direction;

Determine the number of pixels occupied by the target object in the respective corresponding measurement directions in the PCB scan image;

According to the currently set pixel unit size of the AOI device and the number of pixels occupied by the target object in the requested measurement direction, the size of the target object in its measurement direction is calculated by multiplying the two.

One of the ideas of the present invention is to use an AOI line scan camera to scan the PCB circuit board, and then splice the line scan images to obtain an overall PCB scan image. Using the scan resolution given by the AOI equipment, it can be converted into a single Pixel size, or the AOI device directly gives a single pixel size to perform two-dimensional metrology measurements directly in the PCB scan image, that is, the number of pixels "crossed" by the target object in the metrology direction, multiplied by the edge of a single pixel Length is the length of the target object in the measurement direction. In this embodiment, the number of pixels occupied by a target object in the measurement direction of the PCB scan image is determined in the following manner:

Locate the starting endpoint of the target object in its measurement direction, and the count is 1;

Step to the next pixel block in the measurement direction. If the difference in gray value between the current pixel block and the pixel block in the previous step exceeds the preset gray threshold, then stop counting and stepping, otherwise the count will increase automatically. 1;

Repeat the step of stepping to the next pixel block in the measurement direction until the difference in gray value between the current pixel block and the pixel block in the previous step exceeds the preset gray threshold, and then use the current counting result as the target The number of pixels the object occupies in the PCB scan image in its metering direction.

In this embodiment, the 2D metrology measurement method of the printed circuit board also includes:

Mapping and associating the PCB scanned image with the PCB design image in the design document of the target circuit board;

Determine the mapping object associated with the selected target object in the PCB design image;

Determine the size design information of the mapping object in the design document;

The calculation result of the size of the target object in its measurement direction minus the dimensional design information of the mapping object in the design document is used as the measurement result of the target object.

This embodiment of the 2D metrology and measurement method for printed circuit boards and the above embodiment of the PCB defect detection method are based on the same inventive concept. Herein, the embodiment of the 2D metrology and measurement method of printed circuit boards and the embodiment of the PCB defect detection method are combined with each other. .

In one embodiment of the present invention, a printed circuit board manufacturing method is provided. As shown in Figure 4, the manufacturing method includes:

Set various initial process parameters according to the circuit board design document;

The circuit board to be verified is produced according to the initial process parameters;

Use the method described in the above PCB defect detection method embodiment to detect the circuit board;

If it is determined that the circuit board does not have defects, mass production will be carried out according to the current process parameters;

Otherwise, determine the process type of the defective object according to the PCB design document; correct the process parameters for the determined process type so that the measurement size of the target object of the circuit board produced by the corrected process is the same as that in the design document The size difference between size design information is reduced.

It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that these entities or operations are mutually exclusive. any such actual relationship or sequence exists between them. Furthermore, the terms "comprises," "comprises," or any other variations thereof are intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus that includes a list of elements includes not only those elements, but also those not expressly listed other elements, or elements inherent to the process, method, article or equipment. Without further limitation, an element defined by the statement "comprises a..." does not exclude the presence of additional identical elements in a process, method, article, or apparatus that includes the stated element.

The above are only specific embodiments of the present application. It should be noted that those of ordinary skill in the technical field can also make several improvements and modifications without departing from the principles of the present application. These improvements and modifications can also be made. should be regarded as the scope of protection of this application.

without

In order to more clearly explain the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only for the purpose of describing the embodiments or the prior art. For some of the embodiments recorded in the application, those of ordinary skill in the art can also obtain other drawings based on these drawings without exerting creative efforts. Figure 1 is a schematic flow chart of a PCB defect detection method based on 2D metrology according to an exemplary embodiment of the present invention; Figure 2 is a schematic diagram of a 2D metrology measurement method for a printed circuit board according to an exemplary embodiment of the present invention; Figure 3 is a schematic diagram of the measurement interface of the two-dimensional measurement software provided by an exemplary embodiment of the present invention; Figure 4 is a schematic flow chart of a printed circuit board manufacturing method based on 2D metrology according to an exemplary embodiment of the present invention.

Claims (14)

A PCB defect detection method, which includes: Input the PCB design document of the circuit board to be inspected into the AOI device, where the PCB design document includes the size design information of each object on the circuit board; Use the AOI device to scan the circuit board to be inspected, obtain the PCB scan image, and obtain the pixel unit size currently set by the AOI device; In response to a trigger signal of a detection request for at least one target object, determining the number of pixels occupied by the target object in the requested measurement direction in the PCB scan image; According to the currently set pixel unit size of the AOI device and the number of pixels occupied by the target object in the requested measurement direction, calculate the size of the target object in the requested measurement direction by multiplying the two; Compare the calculation result of the size of the target object in the requested measurement direction with the size design information of the target object in the PCB design document. If the size difference exceeds a preset difference threshold, determine the circuit board The target object is defective. The PCB defect detection method as described in claim 1, wherein if the size difference exceeds a preset difference threshold, the process type of the target object is determined based on the PCB design document; The process parameters are corrected for the determined process type so that the size difference between the measurement size of the target object of the circuit board produced by the corrected process and its size design information in the PCB design document is reduced. The PCB defect detection method as described in claim 2, wherein if the line width measurement size of the bonding wire on the circuit board to be detected is smaller than the corresponding size design information, the etching time process parameters are reduced; If the line width measurement size of the bonding wire on the circuit board to be detected is larger than the corresponding size design information, the etching time process parameters are increased. The PCB defect detection method as described in claim 1, wherein the trigger signal for a detection request for a target object includes: In advance, the PCB scanned image and the corresponding PCB design image in the PCB design document are input into the two-dimensional metrology software for display; Mapping and correlating the PCB scanned image with the PCB design image; Select a target object on the display interface of the PCB scan image, and determine the measurement direction; and determine the mapping object associated with the selected target object in the PCB design image. The PCB defect detection method as described in claim 1, wherein the trigger signal for a detection request for a target object includes: In advance, the PCB scanned image and the corresponding PCB design image in the PCB design document are input into the two-dimensional metrology software for display; Mapping and correlating the PCB scanned image with the PCB design image; Select the mapping object associated with the target object mapping on the display interface of the PCB design image; determine the target object associated with the selected mapping object in the PCB scan image, and determine the measurement direction. The PCB defect detection method as described in claim 1, wherein, in response to a trigger signal for a delineated area detection request, all target objects in the delimited area are located and their respective measurement directions are determined, and each target object is determined to be in the delimited area. The number of pixels occupied in the respective measurement directions in the PCB scan image; According to the currently set pixel unit size and the number of pixels occupied by each target object in the demarcated area, the size of each target object in the requested measurement direction is calculated. The PCB defect detection method according to claim 1, wherein the target object is a straight line segment or a curved line segment, and its corresponding requested measurement direction is the line segment length extension direction or line width direction; or, The target object is a polygon, and its corresponding requested measurement direction is the edge side length direction; or, The target object is a circle, and its corresponding requested measurement direction is a radial direction. The PCB defect detection method according to claim 1, wherein the PCB scanned image is a grayscale image or a color image. The PCB defect detection method according to any one of claims 1 to 8, wherein during the scanning process of the AOI device, the requested measurement of each scanned object on the circuit board in the PCB scan image is performed. Count the number of pixels occupied in the direction until after the scanning is completed, the number of pixels occupied by all objects on the circuit board in the requested measurement direction in the PCB scan image and/or the number of pixels occupied by all objects in the requested measurement direction The dimensions on are obtained. The PCB defect detection method according to claim 9, wherein the number of pixels occupied by each scanned object on the circuit board in the requested measurement direction in the PCB scan image is counted in the following manner: Locate the starting endpoint of the target object in its measurement direction, and the count is 1; Step to the next pixel block in the measurement direction. If the difference in gray value between the current pixel block and the pixel block in the previous step exceeds the preset gray threshold, then stop counting and stepping, otherwise the count will increase automatically. 1; Repeat the step of stepping to the next pixel block in the measurement direction until the difference in gray value between the current pixel block and the pixel block in the previous step exceeds the preset gray threshold, and then use the current counting result as the target The number of pixels the object occupies in the PCB scan image in its metering direction. A 2D metrology measurement method for printed circuit boards, which includes: Obtain the PCB scan image obtained by scanning the target circuit board with the AOI device, and obtain the pixel unit size currently set by the AOI device; Select one or more target objects in the PCB scan image and determine their measurement direction; Determine the number of pixels occupied by the target object in the respective corresponding measurement directions in the PCB scan image; According to the currently set pixel unit size of the AOI device and the number of pixels occupied by the target object in the requested measurement direction, the size of the target object in its measurement direction is calculated by multiplying the two. The 2D metrology measurement method for printed circuit boards as described in claim 11, wherein the number of pixels occupied by a target object in the measurement direction of the PCB scan image is determined in the following manner: Locate the starting endpoint of the target object in its measurement direction, and the count is 1; Step to the next pixel block in the measurement direction. If the difference in gray value between the current pixel block and the pixel block in the previous step exceeds the preset gray threshold, then stop counting and stepping, otherwise the count will increase automatically. 1; Repeat the step of stepping to the next pixel block in the measurement direction until the difference in gray value between the current pixel block and the pixel block in the previous step exceeds the preset gray threshold, and then use the current counting result as the target The number of pixels the object occupies in the PCB scan image in its metering direction. The 2D metrology measurement method for printed circuit boards as described in claim 11, which also includes: Mapping and associating the PCB scanned image with the PCB design image in the design document of the target circuit board; Determine the mapping object associated with the selected target object in the PCB design image; Determine the size design information of the mapping object in the design document; The calculation result of the size of the target object in its measurement direction minus the dimensional design information of the mapping object in the design document is used as the measurement result of the target object. A printed circuit board manufacturing method, which includes: Set various initial process parameters according to the circuit board design document; The circuit board to be verified is produced according to the initial process parameters; Use the PCB defect detection method as described in any one of claims 1 to 10 to detect the circuit board; If it is determined that the circuit board does not have defects, mass production will be carried out according to the current process parameters; Otherwise, determine the process type of the defective object according to the design document of the circuit board; correct the process parameters for the determined process type so that the measurement size of the target object of the circuit board produced by the corrected process is the same as that in the design document The size difference between the size design information in the size is reduced.

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