CN116152210A - PCB defect correction method and circuit board manufacturing method - Google Patents
PCB defect correction method and circuit board manufacturing method Download PDFInfo
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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- G01N21/84—Systems specially adapted for particular applications
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- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention discloses a PCB defect correction method and a circuit board manufacturing method, wherein the correction method comprises the following steps: inputting a design document of the circuit board to be detected into AOI equipment, wherein the design document comprises size design information of each object on the circuit board; scanning the circuit board by utilizing the AOI equipment to obtain a scanning image, and acquiring the current set pixel unit size of the AOI equipment; in response to a detection request for a target object on a circuit board, determining the number of pixels occupied by the target object in a requested metering direction in a scanned image; calculating the size of the target object in the direction of the request measurement according to the current pixel unit size of the AOI equipment and the pixel number occupied by the target object; comparing the size of the target object in the request metering direction with the size of the target object in the design document, if the size difference exceeds a preset difference threshold, determining that the target object has defects, determining the process type of the target object according to the design document, and correcting the process parameters of the target object.
Description
The application is a divisional application of the invention application of 2022, 06 and 20 days, 2022106966763, and the invention is named as a PCB defect detection method, a circuit board metering measurement method and a manufacturing method.
Technical Field
The invention relates to the field of PCB detection, in particular to a PCB defect correction method and a circuit board manufacturing method.
Background
Automatic optical inspection (Automated Optical Inspection, AOI for short) equipment has become an important inspection tool and process quality control tool for ensuring product quality in electronic manufacturing industry, which is configured with a wire sweep camera to perform wire sweep on a circuit board, and then splice sub-images of the wire sweep to obtain a complete PCB scan image.
The conventional means for detecting the defects of the PCB is that the AOI equipment compares the detection points with qualified parameters in a database, and detects the defects on the tested product through image processing.
However, the accuracy of the current AI detection model is insufficient, so that detection errors occur sometimes, and the accuracy of defect identification is affected.
The above disclosure of background art is only for aiding in understanding the inventive concept and technical solution of the present invention, and it does not necessarily belong to the prior art of the present patent application, nor does it necessarily give technical teaching; the above background should not be used to assess the novelty and creativity of the present application without explicit evidence that the above-mentioned content was disclosed prior to the filing date of the present patent application.
Disclosure of Invention
The invention aims to provide a method for detecting defects of a PCB and correcting technological parameters of an object with defects, wherein the scanning image of an AOI device is utilized to rapidly carry out two-dimensional measurement on the object on the PCB, and circuit board measurement data is utilized as a basis for detecting the defects of the circuit board, so that the defect detection and identification accuracy is improved.
In order to achieve the above purpose, the invention adopts the following technical scheme:
a method of PCB defect correction comprising:
inputting a PCB design document of a circuit board to be detected into AOI equipment, wherein the PCB design document comprises size design information of each object on the circuit board;
scanning a circuit board to be detected by utilizing an AOI device to obtain a PCB scanning image, and obtaining the current set pixel unit size of the AOI device;
determining the number of pixels occupied by at least one target object in a request metering direction in the PCB scanning image in response to a trigger signal of a detection request of the target object;
calculating the size of the target object in the request metering direction in a multiplication mode according to the size of the pixel unit currently set by the AOI equipment and the pixel number occupied by the target object in the request metering direction;
comparing the calculation result of the dimension of the target object in the measurement requesting direction with the dimension design information of the target object in the PCB design document, if the dimension difference exceeds a preset difference threshold, determining that the target object of the circuit board has defects, determining the process type of the target object according to the PCB design document, and correcting the process parameters of the determined process type so as to reduce the dimension difference between the measurement dimension of the target object of the circuit board manufactured by the corrected process and the dimension design information of the target object in the PCB design document.
Further, if the line width measurement size of the bonding wire on the circuit board to be detected is smaller than the corresponding size design information, reducing the etching time technological parameters;
if the line width measurement size of the bonding wire on the circuit board to be detected is larger than the corresponding size design information, the etching time technological parameter is increased.
Further, the trigger signal of the detection request for a target object includes:
inputting the PCB scanning image and the corresponding PCB design image in the PCB design document into two-dimensional metering software in advance for display;
mapping and correlating the PCB scanning image with a PCB design image;
selecting a target object on a display interface of the PCB scanning image, and determining a metering direction; and determining a mapping object associated with the selected target object in the PCB design image.
Further, the trigger signal of the detection request for a target object includes:
inputting the PCB scanning image and the corresponding PCB design image in the PCB design document into two-dimensional metering software in advance for display;
mapping and correlating the PCB scanning image with a PCB design image;
selecting a mapping object associated with the target object mapping on a display interface of the PCB design image; and determining a target object associated with the selected mapped object in the PCB scan image and determining a metrology direction.
Further, in response to a trigger signal of a detection request for a delimited area, positioning all target objects in the delimited area and determining respective metering directions thereof, and determining the number of pixels occupied by each target object in the respective metering directions in the PCB scanning image;
and calculating the size of each target object in the direction of the requested measurement according to the currently set pixel unit size and the pixel number occupied by each target object in the delimited area.
Further, the target object is a straight line segment or a curve line segment, and the corresponding request metering direction is a line segment length extending direction or a line width direction; or alternatively, the process may be performed,
the target object is a polygon, and the corresponding request metering direction is the edge length direction.
Or the target object is circular, and the corresponding request metering direction is a radial direction.
Further, the PCB scan image is a gray scale image or a color image.
Further, in the process of scanning by the AOI device, counting the number of pixels occupied by each scanned object on the circuit board in the required metering direction in the PCB scanning image is performed until the number of pixels occupied by all objects on the circuit board in the required metering direction in the PCB scanning image and/or the size of all objects in the required metering direction are obtained after the scanning is completed.
Further, the number of pixels occupied by each scanned object on the circuit board in the requested metering direction in the PCB scan image is counted by:
positioning the starting end point of the target object in the metering direction, wherein the count is 1;
step to the next pixel block in the metering direction, stopping counting and stopping stepping if the gray value difference between the current pixel block and the pixel block in the last step exceeds a preset gray threshold value, otherwise, adding 1 to the count;
and repeating the step of stepping to the next pixel block in the metering direction until the gray value difference between the current pixel block and the pixel block in the previous step exceeds a preset gray threshold value, and taking the current counting result as the pixel number of the target object in the PCB scanning image in the metering direction.
According to another aspect of the present invention, there is provided a printed circuit board 2D metrology measurement method comprising:
acquiring a PCB scanning image obtained by scanning a target circuit board by an AOI device, and acquiring the current set pixel unit size of the AOI device;
selecting one or more target objects in the PCB scanning image, and determining the metering direction of the target objects;
determining the pixel number of the target object in the PCB scanning image in the corresponding metering direction; and calculating the size of the target object in the metering direction according to the size of the pixel unit currently set by the AOI equipment and the number of pixels occupied by the target object.
Further, the number of pixels occupied by a target object in its metering direction in the PCB scan image is determined by:
positioning the starting end point of the target object in the metering direction, wherein the count is 1;
step to the next pixel block in the metering direction, stopping counting and stopping stepping if the gray value difference between the current pixel block and the pixel block in the last step exceeds a preset gray threshold value, otherwise, adding 1 to the count;
and repeating the step of stepping to the next pixel block in the metering direction until the gray value difference between the current pixel block and the pixel block in the previous step exceeds a preset gray threshold value, and taking the current counting result as the pixel number of the target object in the PCB scanning image in the metering direction.
Further, the printed circuit board 2D metrology measurement method further includes:
mapping and correlating the PCB scanning image with a PCB design image in a design document of the target circuit board;
determining a mapping object associated with the selected target object in the PCB design image;
determining size design information of the mapping object in the design document;
and calculating the difference value of the dimension of the target object in the metering direction minus the dimension design information of the mapping object in the design document as the metering measurement result of the target object.
According to still another aspect of the present invention, there is provided a printed circuit board manufacturing method including:
setting various initial technological parameters according to the design document of the circuit board;
manufacturing a circuit board to be verified according to the initial process parameters;
performing defect correction on the circuit board by using the PCB defect correction method;
and if the circuit board is determined to have no defect, mass production is carried out according to the current technological parameters.
The technical scheme provided by the invention has the following beneficial effects:
a. two-dimensional metering measurement of the circuit board is carried out on the scanning image of the circuit board by the AOI equipment, and additional tools such as a camera and the like are not required to be configured;
b. the counting of the pixel number of the target object in the PCB scanning image in the request metering direction can be executed in the scanning process of the AOI equipment, the two-dimensional metering result data of the circuit board can be obtained quickly after the AOI equipment is scanned, the detection process of the AOI can not be influenced, and the efficiency of AOI circulation is greatly improved;
the scanning image of the aoi device is formed by stitching the captured images of the line scan camera, so that the scanning image theoretically has an unlimited number of measurement points compared to the limited pixels of the camera.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for 2D metrology-based PCB defect detection and correction, according to one exemplary embodiment of the present invention;
FIG. 2 is a schematic diagram of a printed circuit board 2D metrology measurement method provided by an exemplary embodiment of the present invention;
FIG. 3 is a schematic illustration of a metering interface of two-dimensional metering software provided in an exemplary embodiment of the present invention;
fig. 4 is a schematic flow chart of a printed circuit board manufacturing method based on 2D metrology according to an exemplary embodiment of the present invention.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, apparatus, article, or device that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed or inherent to such process, method, article, or device.
In one embodiment of the present invention, there is provided a method for detecting a defect of a PCB, referring to fig. 1, the method comprising:
inputting a PCB design document of a circuit board to be detected into AOI equipment, wherein the PCB design document comprises size design information of each object on the circuit board;
scanning a circuit board to be detected by utilizing an AOI device to obtain a PCB scanning image (which can be a gray level image or a color image), and obtaining the size of a pixel unit currently set by the AOI device;
determining the number of pixels occupied by at least one target object in a request metering direction in the PCB scanning image in response to a trigger signal of a detection request of the target object;
calculating the size of the target object in the direction of the request measurement according to the size of the pixel unit currently set by the AOI equipment and the number of pixels occupied by the target object;
comparing the calculation result of the size of the target object in the request measurement direction with the size design information of the target object in the PCB design document, and if the size difference exceeds a preset difference threshold, determining that the target object of the circuit board has defects.
In this embodiment, the PCB scan image and the corresponding PCB design image in the PCB design document are input into the two-dimensional metering software in advance for display, as shown in fig. 3, the upper part in fig. 3 is the PCB design image, and the lower part is the PCB scan image;
and mapping and associating the PCB scanning image with the PCB design image in two-dimensional metering software, namely selecting a certain object in the PCB scanning image, mapping the certain object to a corresponding object in the PCB design image, or otherwise selecting a certain object in the PCB design image, and mapping the certain object to a corresponding object in the PCB scanning image.
In one embodiment of the present invention, the trigger signal of the detection request for a target object is: selecting a target object on a display interface of the PCB scanning image, and determining a metering direction; and determining a mapping object associated with the selected target object in the PCB design image.
In another embodiment of the present invention, the trigger signal of the detection request for a target object is: selecting a mapping object associated with the target object mapping on a display interface of the PCB design image; and determining a target object associated with the selected mapped object in the PCB scan image and determining a metrology direction.
In summary, the target object may be a line segment, a circular area, a polygonal area, etc. in the PCB scan image, such as one target object may be selected in a single or multiple click or right click manner, or indirectly by selecting a mapped object in the PCB design image.
Different target objects can have different metering directions, for example, the target object is a straight line segment or a curve line segment, and the corresponding request metering direction is a line segment length extending direction or a line width direction; the target object is polygonal, and the corresponding request metering direction is the edge length direction; the target object is circular, and the corresponding request metering direction is the radial direction.
As shown in fig. 3, the selected target object is a straight line segment, and the requested metering direction is a line width direction. As can be seen in the popup window of the Measurement in fig. 3, the line width of the 2D Measurement in the PCB scan image is 3.59um, the dimension design information (Reference) of the associated mapping object in the corresponding PCB design image is 4.6um, and the dimension Difference (Difference) is-1.01 um. For example, the preset difference threshold is 0.5um, which means that the range of ±0.5um in the Reference size belongs to the tolerance range, and beyond the tolerance range, the process parameters of the target object need to be corrected, so that the size difference between the measured size of the target object of the circuit board manufactured by the corrected process and the size design information of the target object in the PCB design document is reduced, for example, in fig. 3, the line segment adopts an etching process, and if the line width of the 2D measurement is smaller than the Reference size, it is indicated that the etching is excessive, and the etching time process parameters should be reduced; otherwise, if the line width of the 2D measurement is larger than the Reference size, the etching is not in place, and the etching time process parameter should be increased.
In one embodiment of the invention, a plurality of target objects can be measured in batch in two dimensions, specifically, an input device such as a mouse is utilized to demarcate a region in a PCB scanning image, and the mapping region mapped into a PCB design image is associated in the same way so as to locate all the target objects in the demarcated region and determine the respective measuring directions of the target objects, and the number of pixels occupied by each target object in the respective measuring directions in the PCB scanning image is determined; and calculating the size of each target object in the direction of the requested measurement according to the currently set pixel unit size and the pixel number occupied by each target object in the delimited area.
The method can also be used for dividing the area in the PCB design image so as to locate all the design objects in the divided area, then, the design objects are associated and mapped into the PCB scanning image to obtain target objects which are associated and mapped with each design object, and then, the plurality of target objects are metered one by the metering method of the single target object, and the sizes of the target objects and the design (Reference) are compared in batches, so that the defect detection efficiency can be effectively improved.
Furthermore, in a particular embodiment, the counting step of the number of pixels of each object on the PCB in each metering direction is automatically performed during scanning of the AOI device, which allows two-dimensional metering result data of all objects on the PCB (in each respective metering direction) to be acquired immediately after the AOI device has completed scanning.
Specifically, the number of pixels occupied by each scanned object on the circuit board in the requested metering direction in the PCB scan image is counted by:
positioning the starting end point of the target object in the metering direction, wherein the count is 1;
step to the next pixel block in the metering direction, stopping counting and stopping stepping if the gray value difference between the current pixel block and the pixel block in the last step exceeds a preset gray threshold value, otherwise, adding 1 to the count;
and repeating the step of stepping to the next pixel block in the metering direction until the gray value difference between the current pixel block and the pixel block in the previous step exceeds a preset gray threshold value, and taking the current counting result as the pixel number of the target object in the PCB scanning image in the metering direction.
In one embodiment of the present invention, there is provided a printed circuit board 2D metrology measurement method, as shown in fig. 2, the metrology measurement method comprising:
acquiring a PCB scanning image obtained by scanning a target circuit board by an AOI device, and acquiring the current set pixel unit size of the AOI device;
selecting one or more target objects in the PCB scanning image, and determining the metering direction of the target objects;
determining the pixel number of the target object in the PCB scanning image in the corresponding metering direction; and calculating the size of the target object in the metering direction according to the size of the pixel unit currently set by the AOI equipment and the number of pixels occupied by the target object.
One of the concepts of the invention is that a line scanning camera of AOI is utilized to scan a PCB circuit board, then the images obtained by line scanning are spliced to obtain an overall PCB scanning image, the scanning resolution given by the AOI equipment can be converted into a single pixel size, or the AOI equipment directly gives the single pixel size, so that two-dimensional metering measurement is directly carried out in the PCB scanning image, namely, the number of pixels which are penetrated by a target object in the metering direction is multiplied by the side length of the single pixel, and the length of the target object in the metering direction is obtained. In this embodiment, the number of pixels occupied by a target object in the PCB scan image in the measurement direction thereof is determined by:
positioning the starting end point of the target object in the metering direction, wherein the count is 1;
step to the next pixel block in the metering direction, stopping counting and stopping stepping if the gray value difference between the current pixel block and the pixel block in the last step exceeds a preset gray threshold value, otherwise, adding 1 to the count;
and repeating the step of stepping to the next pixel block in the metering direction until the gray value difference between the current pixel block and the pixel block in the previous step exceeds a preset gray threshold value, and taking the current counting result as the pixel number of the target object in the PCB scanning image in the metering direction.
The 2D metering measurement method for the printed circuit board in this embodiment further includes:
mapping and correlating the PCB scanning image with a PCB design image in a design document of the target circuit board;
determining a mapping object associated with the selected target object in the PCB design image;
determining size design information of the mapping object in the design document;
and calculating the difference value of the dimension of the target object in the metering direction minus the dimension design information of the mapping object in the design document as the metering measurement result of the target object.
The present printed circuit board 2D metrology method embodiment and the above-described PCB defect detection method embodiment are based on the same inventive concept, and herein the printed circuit board 2D metrology method embodiment and the PCB defect detection method embodiment are combined with each other by a combination method.
In one embodiment of the present invention, there is provided a printed circuit board manufacturing method, as shown in fig. 4, including:
setting various initial technological parameters according to the design document of the circuit board;
manufacturing a circuit board to be verified according to the initial process parameters;
detecting the circuit board by using the method described in the PCB defect detection method embodiment;
if the circuit board is determined to have no defect, mass production is carried out according to the current technological parameters;
otherwise, determining the process type of the object with the defect according to the PCB design document; and correcting the process parameters of the determined process type so as to reduce the dimension difference between the measured dimension of the target object of the circuit board manufactured by the corrected process and the dimension design information of the target object in the design document.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing is merely exemplary of the application and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the application and are intended to be comprehended within the scope of the application.
Claims (10)
1. A method for correcting a defect of a PCB, comprising:
inputting a PCB design document of a circuit board to be detected into AOI equipment, wherein the PCB design document comprises size design information of each object on the circuit board;
scanning a circuit board to be detected by utilizing an AOI device to obtain a PCB scanning image, and obtaining the current set pixel unit size of the AOI device;
determining the number of pixels occupied by at least one target object in a request metering direction in the PCB scanning image in response to a trigger signal of a detection request of the target object;
calculating the size of the target object in the request metering direction in a multiplication mode according to the size of the pixel unit currently set by the AOI equipment and the pixel number occupied by the target object in the request metering direction;
comparing the calculation result of the dimension of the target object in the measurement requesting direction with the dimension design information of the target object in the PCB design document, if the dimension difference exceeds a preset difference threshold, determining that the target object of the circuit board has defects, determining the process type of the target object according to the PCB design document, and correcting the process parameters of the determined process type so as to reduce the dimension difference between the measurement dimension of the target object of the circuit board manufactured by the corrected process and the dimension design information of the target object in the PCB design document.
2. The method for correcting a PCB defect according to claim 1, wherein if the measured line width of the bonding wire on the circuit board to be inspected is smaller than the corresponding dimension design information, the etching time process parameter is reduced;
if the line width measurement size of the bonding wire on the circuit board to be detected is larger than the corresponding size design information, the etching time technological parameter is increased.
3. The method of claim 1, wherein the triggering signal of the detection request for a target object comprises:
inputting the PCB scanning image and the corresponding PCB design image in the PCB design document into two-dimensional metering software in advance for display;
mapping and correlating the PCB scanning image with a PCB design image;
selecting a target object on a display interface of the PCB scanning image, and determining a metering direction; and determining a mapping object associated with the selected target object in the PCB design image.
4. The method of claim 1, wherein the triggering signal of the detection request for a target object comprises:
inputting the PCB scanning image and the corresponding PCB design image in the PCB design document into two-dimensional metering software in advance for display;
mapping and correlating the PCB scanning image with a PCB design image;
selecting a mapping object associated with the target object mapping on a display interface of the PCB design image; and determining a target object associated with the selected mapped object in the PCB scan image and determining a metrology direction.
5. The method of claim 1, wherein in response to a trigger signal for a defined area detection request, locating all target objects within the defined area and determining their respective metering directions, determining the number of pixels occupied by each target object in the respective metering directions in the PCB scan image;
and calculating the size of each target object in the direction of the requested measurement according to the currently set pixel unit size and the pixel number occupied by each target object in the delimited area.
6. The method for correcting a PCB defect according to claim 1, wherein the target object is a straight line segment or a curved line segment, and the corresponding requested measurement direction is a line length extending direction or a line width direction; or alternatively, the process may be performed,
the target object is polygonal, and the corresponding request metering direction is the edge length direction; or alternatively, the process may be performed,
the target object is circular, and the corresponding request metering direction is a radial direction.
7. The method of claim 1, wherein the PCB scan image is a gray scale image or a color image.
8. The method according to any one of claims 1 to 7, wherein during scanning by the AOI device, a counting operation of the number of pixels occupied by each scanned object on the circuit board in the requested metering direction in the PCB scan image is performed until, after the scanning is completed, the number of pixels occupied by all objects on the circuit board in the requested metering direction in the PCB scan image and/or the size of all objects in the requested metering direction are acquired.
9. The PCB defect correction method of claim 8, wherein the number of pixels occupied by each scanned object on the circuit board in the requested metering direction in the PCB scan image is counted by:
positioning the starting end point of the target object in the metering direction, wherein the count is 1;
step to the next pixel block in the metering direction, stopping counting and stopping stepping if the gray value difference between the current pixel block and the pixel block in the last step exceeds a preset gray threshold value, otherwise, adding 1 to the count;
and repeating the step of stepping to the next pixel block in the metering direction until the gray value difference between the current pixel block and the pixel block in the previous step exceeds a preset gray threshold value, and taking the current counting result as the pixel number of the target object in the PCB scanning image in the metering direction.
10. A method of manufacturing a printed circuit board, comprising:
setting various initial technological parameters according to the design document of the circuit board;
manufacturing a circuit board to be verified according to the initial process parameters;
performing defect correction on the circuit board using the PCB defect correction method according to any one of claims 1 to 9;
and if the circuit board is determined to have no defect, mass production is carried out according to the current technological parameters.
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| CN202310175429.3A CN116152210A (en) | 2022-06-20 | 2022-06-20 | PCB defect correction method and circuit board manufacturing method |
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| CN202310175429.3A CN116152210A (en) | 2022-06-20 | 2022-06-20 | PCB defect correction method and circuit board manufacturing method |
| CN202210696676.3A CN114782436B (en) | 2022-06-20 | 2022-06-20 | PCB defect detection method, circuit board metering measurement method and manufacturing method |
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| US5506793A (en) * | 1994-01-14 | 1996-04-09 | Gerber Systems Corporation | Method and apparatus for distortion compensation in an automatic optical inspection system |
| CN105069770A (en) * | 2015-09-09 | 2015-11-18 | 苏州威盛视信息科技有限公司 | AOI image scanning detection processing method |
| CN106097361B (en) * | 2016-06-20 | 2020-06-19 | 昆山国显光电有限公司 | Defect area detection method and device |
| CN106327496B (en) * | 2016-08-26 | 2019-04-23 | 西安电子科技大学 | The detection system and method for PCB bare board blind hole defect based on AOI |
| CN113406093B (en) * | 2021-08-19 | 2021-11-30 | 苏州维嘉科技股份有限公司 | Optical detection equipment and method and device for measuring object attribute thereof |
| CN114581415A (en) * | 2022-03-08 | 2022-06-03 | 成都数之联科技股份有限公司 | Method and device for detecting defects of PCB, computer equipment and storage medium |
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