TW202400315A - 用於乾燥及／或清潔鍋狀空心體，特別是用於半導體晶圓或用於ｅｕｖ微影光罩的運輸容器之裝置和方法 - Google Patents
用於乾燥及／或清潔鍋狀空心體，特別是用於半導體晶圓或用於ｅｕｖ微影光罩的運輸容器之裝置和方法 Download PDFInfo
- Publication number
- TW202400315A TW202400315A TW112116750A TW112116750A TW202400315A TW 202400315 A TW202400315 A TW 202400315A TW 112116750 A TW112116750 A TW 112116750A TW 112116750 A TW112116750 A TW 112116750A TW 202400315 A TW202400315 A TW 202400315A
- Authority
- TW
- Taiwan
- Prior art keywords
- hollow body
- space
- wall
- cover
- fluid
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 49
- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 235000012431 wafers Nutrition 0.000 title claims abstract description 25
- 238000001035 drying Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000001900 extreme ultraviolet lithography Methods 0.000 title claims abstract description 13
- 239000012530 fluid Substances 0.000 claims abstract description 117
- 238000006073 displacement reaction Methods 0.000 claims abstract description 79
- 238000011010 flushing procedure Methods 0.000 claims abstract description 53
- 238000010438 heat treatment Methods 0.000 claims description 18
- 239000011796 hollow space material Substances 0.000 claims description 18
- 238000003973 irrigation Methods 0.000 claims description 17
- 230000002262 irrigation Effects 0.000 claims description 17
- 230000005855 radiation Effects 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 5
- 230000003993 interaction Effects 0.000 claims description 4
- 230000008569 process Effects 0.000 description 11
- 239000002245 particle Substances 0.000 description 10
- 238000012545 processing Methods 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000011109 contamination Methods 0.000 description 6
- 239000000356 contaminant Substances 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005192 partition Methods 0.000 description 5
- 238000011049 filling Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009227 antibody-mediated cytotoxicity Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
- B08B9/027—Cleaning the internal surfaces; Removal of blockages
- B08B9/04—Cleaning the internal surfaces; Removal of blockages using cleaning devices introduced into and moved along the pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102022111370.1 | 2022-05-06 | ||
| DE102022111370 | 2022-05-06 | ||
| DE102022122723.5A DE102022122723A1 (de) | 2022-05-06 | 2022-09-07 | Vorrichtung und Verfahren zum Trocknen und/oder Reinigen von topfförmigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer oder für EUV-Lithografie-Masken |
| DE102022122723.5 | 2022-09-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202400315A true TW202400315A (zh) | 2024-01-01 |
| TWI854635B TWI854635B (zh) | 2024-09-01 |
Family
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2023213456A1 (de) | 2023-11-09 |
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