TW202348411A - Mica multilayer plate - Google Patents

Abstract

The invention relates to a mica multilayer plate (10), preferably for a use as insulation plate in an electrochemical cell assembly, the mica multilayer plate comprising a plurality of mica layers (12) overlying one another along a stacking direction (14), wherein at least one of said plurality of mica layers (12) is a perforated mica layer (16), said at least one perforated mica layer having at least one machined hole. The invention also relates to a method of manufacturing a mica multilayer plate and to an electrochemical cell assembly comprising a mica multilayer plate.

Description

Mica multilayer board

This invention relates to the field of mica materials for thermal and electrical insulation. More specifically, the present invention relates to the field of mica plates and electrochemical cell assemblies containing such mica plates.

Mica materials are used in a range of insulating applications such as thermal and electrical insulation. Typically, mica is arranged in a plate-like geometry and consists of multiple layers of mica bonded together with a binder material.

An exemplary field for use of mica is the field of electrochemical cell stacks, such as fuel cell stacks or electrolyser cell stacks. Fuel cells are energy conversion devices that allow electrochemical fuel to be converted into electricity. Electrolyzer cells operate in reverse mode, which is a fuel cell that uses electricity to produce chemicals. Reversible batteries can operate in two modes. A solid oxide cell (SOC) is a special type of electrochemical cell and can operate as a solid oxide fuel cell (SOFC) or as a solid oxide electrolyzer cell (SOEC). SOFC uses an electrochemical conversion process to oxidize fuel to generate electricity. SOECs are SOCs that operate in reverse mode compared to SOFCs and are commonly used to generate chemicals using electricity (eg electrolysis of water).

Typically, many of these electrochemical cells are stacked on top of each other to form a cell "stack," in which the stacked cells are held compressively between end plates disposed on opposite ends of the fuel cell stack. In these stacks, a mica plate is typically disposed between each end plate and the stack of battery repeating units to insulate the end plate from the stack.

Although highly electrically insulating in nature, the electrical insulating ability of mica decreases at high operating temperatures, such as when used in a SOC (the operating temperature of an SOC is typically in the range of 600°C to 1000°C). More specifically, thermally activated ionic conductivity can occur at high operating temperatures, thereby increasing the risk of undesirable leakage currents.

The present invention seeks to improve the electrical insulating properties of mica materials, particularly mica sheets.

According to the present invention, a mica multilayer plate is provided, preferably used as an insulating plate in an electrochemical cell assembly. The mica multilayer board includes a plurality of planarly extending mica layers overlapping each other along a stacking direction. That is, the mica layers are preferably stacked on each other along the stacking direction. According to the present invention, at least one of the plurality of mica layers is a porous mica layer, and the at least one porous mica layer has at least one processing hole (ie, at least one through hole) extending along the stacking direction.

The mica multilayer sheets proposed here allow improved electrical insulation over a wide temperature range. Furthermore, the multi-layer design presented here allows for a reduction in material thickness compared to conventional mica sheets with the same insulating properties. More specifically, due to at least one hole in the at least one porous mica layer, local cavities can be formed in the mica multilayer plate, thereby reducing the number of possible conductive paths. Additionally, the multi-layer concept allows for the provision of undercuts and enclosed cavities that cannot be achieved through mechanical cutting. In the context of this application, the term "machined holes" does not include microscopically small defects or holes that naturally occur in mica materials. In other words, a machined hole is a cavity or recess intentionally added to the final multilayer material. Preferably, each of the mica layers has the same outer dimensions (ie, the same planar range perpendicular to the stacking direction).

Preferably, each of the mica layers includes or consists of mica paper. In the context of this application, the term "mica paper" is used in its generic sense to mean a plate-like aggregate of mica particles. Mica paper is typically made by grinding mica material into fine particles, preparing an aqueous suspension or slurry of the mica particles, and then forming it into paper (eg, paper sheets) by conventional papermaking techniques. Preferably, each mica layer of the mica paper, especially the mica multilayer plate, has a thickness of at least 10 μm and/or at most 500 μm, preferably at most 300 μm and even more preferably at most 200 μm along the stacking direction. thickness.

Preferably, some or each of the porous mica layers contains a plurality of pores, that is, two or more pores. The two or more holes should be separated from each other by the mica material. The plurality of holes can be arbitrarily arranged along the layer plane. Alternatively, the plurality of holes may be arranged in an array (ie, a pattern of repeating geometric shapes) along the plane of the layer, such as in a hexagonal or square array. The latter allows the layer properties to be adjusted in a defined way.

According to a general aspect, at least one of the plurality of mica layers may be a non-porous mica layer, and the at least one non-porous mica layer preferably differs from the at least one porous mica layer in that the at least one non-porous mica layer There is no machined hole.

In certain embodiments, a first outer surface (eg, a top surface) and/or an opposing second outer surface (eg, a bottom surface) of the mica multilayer sheet may be provided by a non-porous mica layer. In other words, the first and/or second surface does not have a machined hole, thus providing a flat outer surface. In some embodiments, the top layer of the mica multi-layer board and/or the bottom layer of the mica multi-layer board may be a non-porous mica layer or a group of non-porous mica layers.

Alternatively, a first outer surface (eg, a top surface) and/or an opposite second outer surface (eg, a bottom surface) of the mica multilayer sheet may be provided by a porous mica layer. Therefore, the first and/or the second surface may have at least one hole. This has the advantage that a contact area of the mica multilayer sheet, for example to one end face of an electrochemical cell assembly (see below), can be reduced, thus improving the electrical insulation by reducing possible electrical paths. In some embodiments, a top layer of the mica multi-layer plate and/or a bottom layer of the mica multi-layer plate may be a porous mica layer or a group of porous mica layers.

The multilayer concept presented here also allows tuning of the physical properties of the mica multilayer boards. For example, positioning porous and/or nonporous mica layers relative to each other in a defined and/or stacking sequence can affect the Young's modulus and/or air permeability of the mica multilayer sheet. Furthermore, anisotropic electrical insulation properties can be obtained.

The mica multilayer plate may include at least two porous mica layers with the same hole configuration, and the at least two porous mica layers are arranged in the multilayer plate with different rotational orientations around the stacking direction.

Alternatively or additionally, the mica multilayer sheet may include at least a first and a second porous mica layer, the first and second porous mica layers having different pore configurations. In other words, the first and second porous mica layers may have different numbers of pores, the pores may have a different shape, the pores may have different sizes, and/or the pores may be arranged at different locations along the mica layer. (The first and second porous mica layers should have the same outer dimensions). As mentioned above, this allows tailoring the properties of the mica multilayer sheet.

In one embodiment, a first outer surface (eg, top surface) of the mica multilayer sheet may be provided by a first non-porous mica layer, and an opposing second outer surface (eg, bottom surface) of the mica multilayer sheet may be provided by a first non-porous mica layer. Two non-porous mica layers are provided, wherein at least two porous mica layers or at least two sets of porous mica layers are disposed between the first and second non-porous mica layers, and wherein at least one other non-porous mica layer or at least Another set of non-porous mica layers is disposed between the at least two porous mica layers.

In certain embodiments, a plurality of non-porous mica layers or groups of non-porous mica layers and a plurality of porous mica layers or groups of porous mica layers may be stacked in an alternating manner along the stacking direction. Thus, a plurality of internal cavities can be formed within the mica multilayer sheet, thereby allowing for better insulating properties as described above.

According to a preferred embodiment, the mica multilayer plate may include a stacking group of porous mica layers, that is, a group of porous mica layers stacked on each other along the stacking direction. Preferably, the porous mica layers of the stack are assembled and directly stacked on each other such that the pores of a subset of adjacent porous mica layers of the stack at least partially overlap each other, thereby forming a preferred At least one through hole or cavity extends through the stack group along the stacking direction. Therefore, the air trapped in the at least one through hole or cavity can improve the thermal insulation properties of the mica multilayer board. Preferably, each of the porous mica layers of the stacked group includes a plurality of holes such that a plurality of through holes or cavities are formed in the stacked group. Preferably, the holes of adjacent layers of the stack are arranged coaxially with each other, thereby forming through holes extending through the full thickness of the stack. Preferably, the porous mica layers of the stack have the same hole configuration, that is, the same hole number, the same hole shape, and the same hole position. This makes manufacturing easy since only one porous mica layer needs to be provided.

In some embodiments, the stacked group of porous mica layers may be provided with a first non-porous mica layer or a first group of non-porous mica layers and a second non-porous mica layer or a second group of non-porous mica layers. between. That is, the stack may be sandwiched between a first non-porous mica layer and a second non-porous mica layer. Therefore, the at least one through hole formed in the stacked group is closed on both sides, thereby forming at least one closed cavity in the mica multilayer plate. The first non-porous mica layer or first set of non-porous mica layers may form a base portion of the mica multilayer sheet. The second non-porous mica layer or second set of non-porous mica layers may form a top portion of the mica multilayer sheet.

In certain embodiments, the mica multilayer sheet may include a set of nonporous mica layers stacked on each other along the stacking direction, the set of nonporous mica layers forming a base or top portion of the mica multilayer sheet, and the porous mica Stacked groups of layers may form a top or base portion of the multilayer board. Accordingly, the mica multilayer sheet may include openings on one side (ie, through holes formed in the stack) that allow gaseous components (eg, adhesive components) to exit the mica multilayer sheet during thermal loading.

In some embodiments, the stacked set of porous mica layers may be disposed between a first porous mica layer or a first set of porous mica layers and a second porous mica layer or a second set of porous mica layers. , the first and second porous mica layers or the first and second groups of porous mica layers are combined and/or configured into a subgroup of pores in the first and second porous mica layers, which are smaller than Preferably, all of the pores do not overlap with pores in the porous mica layers of the stacked set of porous mica layers. In this configuration, enclosed cavities can be formed within the multilayer sheet without using a non-porous mica layer.

Some or all of the pores of an individual porous mica layer may have the same shape when viewed along the stacking direction, such as square, circular, or anisotropic shapes. This allows the same cutting tool to be used to prepare the holes, thus reducing manufacturing costs.

To obtain good electrical insulating properties, it is advantageous if, for some or each of the porous mica layers, the surface area of the layer plane occupied by the pores or pores is equal to the surface area of the layer defined by the external dimensions of the porous mica layer. The ratio of the total area of the porous mica layer is at least 20%, preferably at least 30%. For improved mechanical stability, it is advantageous if the ratio is at most 90%.

Preferably, adjacent mica layers are bonded with an adhesive material. The adhesive is formulated not to degas at high temperatures, or at least to decompose with minimal gas evolution. Preferably, the adhesive includes an inorganic base material, such as polysiloxane. Polysiloxane (and siloxane) is a mixed organic-inorganic material that decomposes into inorganic materials and gases at high temperatures.

According to a general aspect, the at least one machined hole in the porous mica layer may be formed by cutting or die-cutting individual mica layers, for example using a cutting plotter.

The present invention also relates to a method of manufacturing mica multilayer boards. The characteristics and advantages described above with respect to mica multilayer boards can also be applied to this manufacturing method. The method includes the step of providing a plurality of mica layers, preferably the plurality of mica layers comprise or consist of mica paper. The method further includes a step of processing, in particular cutting, at least one of the plurality of mica layers to form at least one hole (ie, a through hole) in the material of the at least one mica layer. The method further includes a step of overlapping the plurality of treated and/or untreated (ie porous and non-porous) mica layers along a stacking direction. Optionally, the method may include a step of applying an adhesive between the mica layers before stacking them on top of each other.

In certain embodiments, the step of forming the at least one hole may include a step of cutting, laser cutting, plotting, or die cutting, preferably rotary die cutting, the at least one mica layer.

The present invention also relates to an electrochemical cell assembly, which includes a stack of cell repeating units and at least one mica multilayer plate as described above. The features and advantages described above regarding the mica multilayer sheet can also be applied to the electrochemical cell assembly. Preferably, the stack of battery repeating units includes a plurality of electrochemical cells (battery repeating units) stacked on one another along the stacking direction.

More specifically, the present invention relates to an electrochemical cell assembly comprising a stack of cell repeating units and at least one insulating plate, wherein the at least one insulating plate comprises a mica multilayer plate as defined above, and wherein The stack of battery repeat units and the at least one insulating plate are stacked on each other along a stacking direction.

The present invention also relates to an electrochemical cell assembly, which includes a first end plate, a stack of battery repeating units, and a second end plate. The stack of battery repeating units includes a plurality of electrochemical cells (battery repeating units) stacked on one another along a stacking direction. The stacking system of battery repeating units is disposed between the first end plate and the second end plate. The electrochemical cell assembly further includes a first mica multilayer plate constructed as above and disposed between the first end plate and the stack of battery repeating units and/or a first mica multilayer plate constructed as above and disposed at the second end A second mica multilayer sheet between the sheet and the stack of battery repeating units.

The end plates may be metal plates.

The battery repeating units may be fuel cell cells, electrolyser cells or reversible battery cells. The battery repeating units may be metal-supported electrochemical cells. The battery repeating units may be solid oxide fuel cells or solid oxide electrolyzer cells. The battery cells may each include a plurality of layers including a mechanical support layer, an electrochemically active layer, and optionally a spacer or interconnect. The electrochemically active layers may include a fuel electrode layer, an electrode layer, and an air or oxidant electrode layer. The electrochemically active layers may be deposited (eg as a thin coating or film) on the mechanical support layer and supported by the mechanical support layer, eg by a metal support plate such as a metal foil. In addition to the battery repeat units, the stack of battery repeat units may include other components, such as electrical connectors, electrical contact plates (eg, unipolar plates), or sealing gaskets.

Other embodiments can be derived from the following description and figures.

FIG. 1 schematically shows an example of a mica multilayer board 10 . The mica multilayer board 10 includes a plurality of mica layers 12 stacked on each other along a stacking direction 14 . Preferably, the mica layer 12 is bonded with an adhesive material (commonly known in the art).

Each of the mica layers 12 includes or is composed of a mica paper. More specifically, each mica layer 12 may be composed of a single mica sheet. Alternatively, each mica layer 12 may comprise a plurality of mica sheets stacked on top of each other along the stacking direction 14 and optionally bonded with an adhesive material. Preferably, each mica layer 12 has a thickness of at least 10 μm and/or usually at most 200 μm.

At least one of the mica layers 12 is a porous mica layer 16 having at least one machined through hole 18 formed, for example, by cutting or punching the mica layer 12 . Please refer to FIG. 2 , which shows a top view of an example of the porous mica layer 16 . In this example, the porous mica layer 16 includes a plurality of pores 18 that are separated from each other by the mica material 20 and arranged in an array. Exemplarily, the holes 18 are square.

In embodiments not shown, the holes 18 may be configured in any manner and/or have different shapes, such as circular, rectangular, elliptical, etc., and/or have different sizes. Additionally, a porous mica layer 16 may contain more or fewer pores 18 .

Preferably, a ratio between the surface area occupied by the pore or pores 18 and the total area of the porous mica layer 16 defined by the external dimensions of the porous mica layer 16 is at least 20%, more typically at least 30% and /or tie up to 90%.

The mica multilayer sheet 10 may additionally include at least one non-porous mica layer 22 that is one of the mica layers 12 without machined holes 18 . In the example of FIG. 1 , the top layer 24 of the mica multilayer board 10 is a non-porous mica layer 22 . Therefore, a first outer surface 26 (top surface 26) of the mica multilayer sheet 10 is provided by a non-porous mica layer 22.

Please refer to Figures 3 to 6, which show different examples of a mica multilayer board 10.

In the example of FIG. 3 , a top layer 24 and a bottom layer 28 are both non-porous mica layers 22 or groups of non-porous mica layers 22 . Therefore, a top surface 26 (first outer surface 26) and a bottom surface 30 (second outer surface 30) are both provided by a non-porous mica layer 22. In this example, a set of 32 porous mica layers 16 (the difference from the non-porous mica layer 22 is only schematically shown in FIG. 3 by different hatching) is sandwiched between the top and bottom of the mica multilayer plate 10. There are 22 holes in the mica layer. The porous mica layers 16 may have the same pore configuration or different pore configurations. For example, the porous mica layers 16 may be constructed as shown in FIG. 2 .

Figure 4 shows another example of a mica multilayer board 10. In this example, the top layer 24 and the bottom layer 28 of the mica multi-layer plate 10 are also non-porous mica layers 22 or groups of non-porous mica layers 22. Thus, a top surface 26 (first outer surface 26) is provided by a first non-porous mica layer 24 and a bottom surface 30 (second outer surface 30) is provided by a second non-porous mica layer 28. In addition, two porous mica layers 16 or two groups of porous mica layers 16 are arranged between the first non-porous mica layer 24 or the first group of non-porous mica layers 22 and the second non-porous mica layer 28 or the second group of non-porous mica layers. between mica layers 22. In addition, another non-porous mica layer 22 or another group of non-porous mica layers 22 is disposed between the porous mica layers 16 or multiple groups of porous mica layers. Therefore, in the example of FIG. 4 , the porous mica layers 16 and the non-porous mica layers 22 are stacked on each other in an alternating manner along the stacking direction 14 . The porous mica layers 16 may have the same pore configuration or may have different pore configurations, as exemplarily shown in FIG. 4 by different hatching.

Please refer to FIG. 5 , which shows another example of a mica multilayer board 10 , which includes: a set 34 of non-porous mica layers 22 forming a base portion 36 of the mica multilayer board 10 ; and forming the mica multilayer board 10 A top portion 40 includes a set of 38 non-porous mica layers 22 . The groups 34, 38 preferably comprise a plurality of non-porous mica layers 22 stacked on one another along the stacking direction 14. Furthermore, a plurality of porous mica layers 16 are provided stacked on one another along the stacking direction 14 to form a stacked group 42 sandwiched between the nonporous mica layers 22 of the groups 34 , 38 .

As shown in FIG. 5 , the porous mica layers 16 of the stack group 42 preferably have the same configuration of pores 18 and are stacked on each other along the stacking direction 14 such that the pores 18 of adjacent porous mica layers 16 are exemplified in a coaxial manner. overlap. Therefore, an inner cavity 44 is formed in the mica multilayer panel 10 . As mentioned above, the cavities 44 can trap air in the mica multilayer board 10 , thereby enhancing the insulation properties of the mica multilayer board 10 .

Although advantageous, the porous mica layers 16 of the stack 42 do not necessarily need to have the same configuration of pores 18 . For example, the porous mica layers 16 of the stack 42 may be configured such that only a subset of the pores of adjacent porous mica layers at least partially overlap each other.

In an embodiment not shown, the base portion 36 and/or the top portion 40 may be formed of a porous mica layer 16 or a group of porous mica layers 16 composed of a porous mica layer 16 or a group of porous mica layers. Such that the holes 18 of the porous mica layer 16 or the group of porous mica layers 16 do not overlap with the cavities 44 formed in the stack group 42, that is, they do not overlap with the holes 18 of the porous mica layers 16 of the stack group 42. .

Please refer to FIG. 6 , which shows another example of a mica multilayer plate 10 . The difference between this embodiment and the embodiment of FIG. 5 is that the set 38 of non-porous mica layers 22 forming the top portion 40 is omitted. Therefore, in the example of FIG. 6 , the stack 42 forms the top portion 40 of the mica multilayer sheet 10 . In this configuration, the cavities 44 are open on one side, thus allowing gas to evaporate.

The above-mentioned mica multilayer board 10 can be manufactured by a method, which method includes the following steps: Provides multiple mica layers 12; By processing at least one of the plurality of mica layers 12 to form at least one hole 18 in the material of the at least one mica layer 12 (eg, by cutting, optionally laser cutting, plotting, or Die cutting, optionally rotary die cutting) to provide at least one porous mica layer 16; The plurality of mica layers 12 (ie, including the porous mica layer 16 and optionally the non-porous mica layer 22) are overlapped with each other along the stacking direction 14.

Figure 7 shows a schematic outline of an example of an electrochemical cell assembly 100 (simplified to illustrate key features of the invention). The electrochemical cell assembly includes a first end plate 102, a second end plate 104, and a stack 106 of battery repeat units. The stack 106 of battery repeat units is disposed between the first end plate 102 and the third end plate 102. between the two end plates 104. The stack 106 includes a plurality of battery repeating units 108 stacked on one another along the stacking direction 14 . As mentioned above, the battery repeating units 108 may be fuel cells or electrolyser cells.

Preferably, the stack 104 is held between the end plates 104 and 106 in a compressed manner. Accordingly, the electrochemical cell assembly 100 may include additional compression devices (not shown) known to those skilled in the art, such as tension rods, compression springs or bolts, clamps, or other devices for compression.

The electrochemical cell assembly 100 further includes a first mica multilayer sheet 10 disposed between the first end plate 102 and the stack 106 of battery repeating units 108 and a first mica multilayer sheet 10 disposed between the second end plate 104 and the battery repeating unit. A second mica multilayer plate 10 between the stacks 106 of 108 . The mica multilayer boards 10 (only schematically shown in FIG. 7 ) can be constructed according to any of the above examples.

10:Mica multilayer board 12:Mica layer 14:Stacking direction 16: Porous mica layer 18: Processing (through) hole; hole 20:Mica material 22: Non-porous mica layer 24: Top layer; first non-porous mica layer 26: First outer surface; top surface 28: Bottom layer; second non-porous mica layer 30: Second outer surface; bottom surface 32,34,38:Group 36:Base part 40:Top part 42:Stacking group 44: (inner) cavity 100:Electrochemical battery assembly 102:First end plate 104:Second end plate 106:Stacked body 108: Battery repeating unit

In the picture: Figure 1 shows a simplified outline of a mica multilayer board from a perspective view; Figure 2 shows a top view of an example of a porous mica layer; Figure 3 shows a simplified outline of one embodiment of a mica multilayer board from an exploded perspective view; Figure 4 shows a simplified outline of another embodiment of a mica multilayer board from an exploded perspective view; Figure 5 shows a cross-sectional view of another embodiment of a mica multilayer board; Figure 6 shows a cross-sectional view of yet another embodiment of a mica multilayer board; Figure 7 shows a simplified outline of one embodiment of an electrochemical cell assembly.

10:Mica multilayer board

12:Mica layer

14:Stacking direction

16: Porous mica layer

22: Non-porous mica layer

24: Top layer; first non-porous mica layer

26: First outer surface; top surface

28: Bottom layer; second non-porous mica layer

30: Second outer surface; bottom surface

32:Group

Claims (24)

A mica multilayer plate (10), preferably used as an insulating plate in an electrochemical cell assembly (100), the mica multilayer plate (10) includes a plurality of mica layers overlapping each other along a stacking direction (14) (12), wherein at least one of the plurality of mica layers (12) is a porous mica layer (16), the at least one porous mica layer (16) having at least one machined hole (18). The mica multilayer plate (10) of claim 1, wherein some or each of the porous mica layers (16) includes a plurality of holes (18). The mica multilayer board (10) of claim 1 or 2, wherein at least one of the plurality of mica layers (12) is a non-porous mica layer (22). Such as the mica multilayer board (10) of claim 3, wherein a first outer surface (26) and/or an opposite second outer surface (30) of the mica multilayer board (10) are made of a non-porous mica layer (22) )supply. The mica multilayer board (10) of any one of claims 1 to 3, wherein a first outer surface (26) and/or an opposite second outer surface (30) of the mica multilayer board (10) is composed of a Porous mica layer (16) is provided. The mica multilayer plate (10) of any one of claims 1 to 5, wherein the mica multilayer plate (10) includes at least two porous mica layers (16) with the same hole configuration, and the at least two porous mica layers (16) have the same hole configuration. The layers (16) are arranged in different rotational orientations about the stacking direction (14). The mica multilayer plate (10) of any one of claims 1 to 6, wherein the mica multilayer plate (10) includes at least two porous mica layers (16) with different hole configurations. The mica multilayer board (10) as claimed in any one of items 3 to 7, wherein: A first outer surface (26) of the mica multilayer plate (10) is provided by a first non-porous mica layer (22); An opposing second outer surface (30) of the mica multilayer plate (10) is provided by a second non-porous mica layer (22); At least two porous mica layers (16) are disposed between the first and second non-porous mica layers (22) and At least one other non-porous mica layer (22) is disposed between the at least two porous mica layers (16). Such as the mica multilayer plate (10) of any one of claims 3 to 8, wherein a plurality of non-porous mica layers (22) or a plurality of groups of non-porous mica layers (22) and a plurality of porous mica layers (16) or a plurality of groups of porous mica The layers (16) are stacked in an alternating manner along the stacking direction (14). The mica multilayer board (10) of any one of claims 1 to 9, wherein the mica multilayer board (10) includes a stacked group (42) of porous mica layers (16), and the stacked group (42) Equally porous mica layers (16) are assembled and stacked on each other such that a subset of pores (18) of adjacent porous mica layers (16) at least partially overlap each other. The mica multilayer plate (10) of the previous claim, wherein the stacked group (42) of the porous mica layer (16) can be disposed in a first group forming a base portion (36) of the mica multilayer plate (10) Between the non-porous mica layer (22) of (34) and a second set (38) of non-porous mica layers (22) forming a top portion (40) of the mica multilayer plate (10). The mica multilayer board (10) of claim 10, wherein the mica multilayer board (10) includes a group (34) of non-porous mica layers (22) forming a base portion (36) of the mica multilayer board (10). ) and wherein the stacked set (42) of porous mica layers (16) forms a top portion (40) of the multilayer plate (10). The mica multilayer plate (10) of claim 10, wherein the stacking group (42) of the porous mica layer (16) is provided with a first porous mica layer (16) and a second porous mica layer (16) The first and second porous mica layers (16) are assembled and/or configured into a subset of the first and second porous mica layers (16), with the pores (18) not in contact with each other. The pores (18) in the stack (42) of porous mica layers (16) overlap. The mica multilayer plate (10) of any one of claims 10 to 13, wherein the porous mica layers (16) of the stack group (42) have the same hole configuration. For the mica multilayer plate (10) of any one of claims 2 to 14, the plurality of holes (18) of a porous mica layer (16) are arranged in an array. A mica multilayer plate (10) as claimed in any one of claims 1 to 15, wherein some or all of the pores (18) of an individual porous mica layer (16) have the same shape when viewed along the stacking direction 14 . The mica multilayer plate (10) of any one of claims 1 to 16, wherein for some or each of the porous mica layers (16), the hole (18) or the holes (18) occupy The ratio of the surface area to the total area of the porous mica layer (16) defined by the outer dimensions of the porous mica layer (16) is at least 20%, preferably at least 30% and/or at most 90%. The mica multilayer board (10) of any one of claims 1 to 17, wherein each of the plurality of mica layers (12) includes or consists of mica paper, preferably having a thickness of at least 10 μm and/or at most 500 μm. One thickness. The mica multilayer board (10) of any one of claims 1 to 18, wherein adjacent mica layers (12) are bonded by an adhesive. The mica multilayer plate (10) of any one of claims 1 to 19, wherein the at least one hole (18) in a porous mica layer (16) is made by cutting or punching an individual mica layer (12) to form. A method of manufacturing the mica multilayer board (10) of any one of claims 1 to 20, the method comprising the following steps: Provides multiple mica layers (12); treating at least one of the plurality of mica layers (12) to form at least one hole (18) in the material of the at least one mica layer (12); The plurality of mica layers (12) are overlapped with each other along a stacking direction (14). The method of claim 21, wherein the step of forming the at least one hole (18) includes at least cutting, optionally laser cutting, plotting, or die cutting, optionally rotary die cutting, the at least one mica Layer(12). An electrochemical cell assembly (100) comprising a stack (106) of battery repeating units (108) and at least one insulating plate, the stack (106) of battery repeating units (108) and the at least one insulating plate are stacked on each other along a stacking direction (14), wherein the at least one insulating plate includes a mica multilayer plate (10) according to any one of claims 1 to 20. An electrochemical cell assembly (100) containing: a first end plate (102); a stack (106) of battery repeat units (108) comprising a plurality of battery repeat units (108) stacked on one another along a stacking direction (14); and a second end plate (104), The stack (106) of battery repeating units (108) is disposed between the first end plate (102) and the second end plate (104), The electrochemical cell assembly (100) further includes: The first mica multilayer plate (10) of any one of claims 1 to 20 is disposed between the first end plate (102) and the stack (106) of the battery repeating unit (108) and/ or; A second mica multilayer plate (10) according to any one of claims 1 to 20, which is disposed between the second end plate (104) and the stack (106) of battery repeating units (108).