TW202347046A - Exposure device, exposure method, and manufacturing method of object preventing the slit light from irradiating outside the imaging area of a substrate during the scanning exposure of the imaging area - Google Patents
Exposure device, exposure method, and manufacturing method of object preventing the slit light from irradiating outside the imaging area of a substrate during the scanning exposure of the imaging area Download PDFInfo
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F7/70558—Dose control, i.e. achievement of a desired dose
Abstract
Description
本發明涉及曝光裝置、曝光方法以及物品的製造方法。The present invention relates to an exposure device, an exposure method, and a manufacturing method of an article.
作為在半導體器件等的製造步驟中使用的光微影裝置,已知有進行相對於藉由了原版的狹縫光掃描基板從而將原版的圖案轉印到基板上的、所謂的掃描曝光的曝光裝置。在這樣的曝光裝置中,通常而言,一邊使基板等速移動一邊進行基板的掃描曝光,但為了提高吞吐量(生產率),期望的是一邊使基板加速或減速一邊進行基板的掃描曝光。在專利文獻1中提出了如下技術:一邊按照由正弦波構成的驅動曲線(速度曲線、加速度曲線)來驅動基板,一邊在基板的速度和加速度以正弦波變化的區間對基板進行曝光。這樣的技術有時被稱為正弦波曝光。
[先前技術文獻]
[專利文獻]
As a photolithography apparatus used in the manufacturing process of semiconductor devices and the like, it is known to perform so-called scanning exposure in which a substrate is scanned through a slit of a master plate to transfer a pattern of the master plate to the substrate. device. In such an exposure apparatus, scanning exposure of the substrate is generally performed while moving the substrate at a constant speed. However, in order to improve throughput (productivity), it is desirable to perform scanning exposure of the substrate while accelerating or decelerating the substrate.
[專利文獻1]:日本專利第5406861號公報[Patent Document 1]: Japanese Patent No. 5406861
[發明欲解決之課題][Problem to be solved by the invention]
在曝光裝置中,在對基板的拍攝區域的掃描曝光中,需要防止向該拍攝區域的外側照射狹縫光。期望的是,即使在一邊使基板加速或減速一邊對基板的拍攝區域進行掃描曝光的情況下,也防止向該拍攝區域的外側照射狹縫光。In the exposure device, during scanning exposure of the imaging area of the substrate, it is necessary to prevent slit light from being irradiated to the outside of the imaging area. It is desirable to prevent the slit light from being irradiated to the outside of the imaging area even when the imaging area of the substrate is scanned and exposed while accelerating or decelerating the substrate.
因此,本發明的目的在於提供一種有利於防止在基板的拍攝區域的掃描曝光中向該拍攝區域的外側照射狹縫光的技術。 [供解決課題之手段] Therefore, an object of the present invention is to provide a technology that is advantageous in preventing slit light from being irradiated to the outside of an imaging region of a substrate during scanning exposure of the imaging region. [Means for solving problems]
為了實現上述目的,作為本發明的一方面的曝光裝置一邊相對於狹縫光掃描基板,一邊進行所述基板的拍攝區域的掃描曝光,其特徵在於,該曝光裝置具備:載置台,保持並移動所述基板;遮光構件,被插拔於所述狹縫光的光路;以及控制部,按照規定所述載置台的驅動的驅動曲線控制所述載置台的驅動,並且控制所述遮光構件向所述狹縫光的光路的插拔,所述驅動曲線被構成為在所述掃描曝光的初期使所述載置台加速,所述控制部在所述掃描曝光的初期從所述狹縫光的光路拔出所述遮光構件時,追隨所述驅動曲線中的所述載置台的加速地對所述遮光構件進行加速驅動,以防止所述狹縫光向所述拍攝區域的外側的照射。In order to achieve the above object, an exposure device as one aspect of the present invention performs scanning exposure of an imaging area of the substrate while scanning the substrate with slit light, and is characterized in that the exposure device includes a mounting table that is held and moved. the substrate; a light-shielding member that is inserted into and removed from the optical path of the slit light; and a control unit that controls the driving of the mounting table according to a driving curve that specifies the driving of the mounting table, and controls the direction of the light-shielding member to the desired position. Inserting and removing the optical path of the slit light, the driving curve is configured to accelerate the mounting table in the early stage of the scanning exposure, and the control unit switches from the optical path of the slit light in the early stage of the scanning exposure. When the light-shielding member is pulled out, the light-shielding member is accelerated and driven to follow the acceleration of the mounting table in the driving curve to prevent the slit light from being irradiated to the outside of the imaging area.
本發明的進一步的目的或其他方面以下將藉由參照所附附圖說明的優選的實施方式而明確。 [發明之效果] Further objects or other aspects of the present invention will be clarified below by describing the preferred embodiments with reference to the accompanying drawings. [Effects of the invention]
根據本發明,例如能夠提供一種有利於防止在基板的拍攝區域的掃描曝光中向該拍攝區域的外側照射狹縫光的技術。According to the present invention, for example, it is possible to provide a technology that is advantageous in preventing slit light from being irradiated to the outside of an imaging region of a substrate during scanning exposure of the imaging region.
以下,參照所附附圖對實施方式進行詳細說明。需要說明的是,以下的實施方式並不對申請專利範圍所涉及的發明進行限定。在實施方式中記載了多個特徵,但這些多個特徵並非全部是發明所必須的,另外,多個特徵也可以任意組合。並且,在所附附圖中,對相同或同樣的結構標注相同的附圖標記,省略重複的說明。Hereinafter, embodiments will be described in detail with reference to the attached drawings. It should be noted that the following embodiments do not limit the invention within the scope of the patent application. Although a plurality of features are described in the embodiments, not all of these features are essential to the invention, and the plurality of features may be arbitrarily combined. In addition, in the accompanying drawings, the same or similar structures are denoted by the same reference numerals, and repeated descriptions are omitted.
在本說明書及所附附圖中,以將與基板的表面(上表面)平行的方向設為XY平面的XYZ坐標系來表示方向。將與XYZ坐標系中的X軸、Y軸以及Z軸分別平行的方向設為X方向、Y方向以及Z方向,將繞X軸的旋轉、繞Y軸的旋轉以及繞Z軸的旋轉分別設為θX、θY以及θZ。與X軸、Y軸、Z軸相關的控制和驅動(移動)分別是指關於與X軸平行的方向、與Y軸平行的方向、與Z軸平行的方向的控制或驅動(移動)。另外,與θX軸、θY軸、θZ軸相關的控制或驅動分別是指關於繞與X軸平行的軸的旋轉、繞與Y軸平行的軸的旋轉、繞與Z軸平行的軸的旋轉的控制或驅動。In this specification and the accompanying drawings, directions are represented by an XYZ coordinate system in which the direction parallel to the surface (upper surface) of the substrate is an XY plane. Let the directions parallel to the X-axis, Y-axis and Z-axis in the XYZ coordinate system be the X-direction, Y-direction and Z-direction respectively, and set the rotation around the are θX, θY and θZ. Control and drive (movement) related to the X-axis, Y-axis, and Z-axis respectively refer to control or drive (movement) in the direction parallel to the X-axis, the direction parallel to the Y-axis, and the direction parallel to the Z-axis. In addition, the control or driving related to the θX axis, θY axis, and θZ axis refers to the rotation about the axis parallel to the X axis, the rotation about the axis parallel to the Y axis, and the rotation about the axis parallel to the Z axis, respectively. control or drive.
<第1實施方式>
對本發明的第1實施方式進行說明。圖1是表示本實施方式的曝光裝置100的結構例的概略圖。曝光裝置100一邊相對於狹縫光(曝光的光)使遮罩102(原版)和基板104相對地掃描,一邊將遮罩102的圖案轉印到基板104。本實施方式的曝光裝置100是將基板104上的光照射區域(曝光區域)設為矩形形狀或圓弧狀的狹縫形狀,使遮罩102與基板104相對地進行高速掃描而高精度地對大視場角進行曝光的步進掃描方式的曝光裝置。這樣的曝光裝置100也被稱為掃描曝光裝置或掃描器。
<First Embodiment>
The first embodiment of the present invention will be described. FIG. 1 is a schematic diagram showing a structural example of the
如圖1所示,曝光裝置100具有曝光光源113、照明光學系統106、投影光學系統101、遮罩載置台103、基板載置台105、掩蔽單元112(遮光部)以及控制部111。遮罩載置台103和基板載置台105能夠構成用於將遮罩102和基板104相對於彼此定位的定位裝置。在此,在本實施方式中,曝光光源113作為曝光裝置100的構成要素而設置,但也可以不是曝光裝置100的構成要素。As shown in FIG. 1 , the
照明光學系統106使用從準分子雷射器等產生脈衝光的曝光光源113射出的光,對遮罩102進行照明。照明光學系統106例如包括光束成形光學系統、光學積分器、准直透鏡、反射鏡等,高效地透射或反射遠紫外區域的脈衝光,作為狹縫光(曝光的光)射出。光束成形光學系統(生成部)具有將入射光的截面形狀(尺寸)整形為預先確定的形狀(例如矩形形狀或圓弧狀)的機構(例如狹縫),使用來自曝光光源113的光生成狹縫光。狹縫光具有規定遮罩102上的照明區域、即基板104上的光照射區域的截面形狀。在本實施方式的情況下,光束成形光學系統構成為使用來自曝光光源113的光,生成截面形狀為矩形形狀的狹縫光。另外,光學積分器使光的配光特性均勻而以均勻的照度對遮罩102進行照明。The illumination
從照明光學系統106射出的狹縫光入射到掩蔽單元112。掩蔽單元112是用於規定遮罩102上的照明區域、即基板104上的光照射區域的單元。在本實施方式的情況下,掩蔽單元112具有相對於狹縫光在掃描方向上配置的至少2片掩蔽葉片(遮光構件)。而且,掩蔽單元112在控制部111的控制下,將遮光葉片在狹縫光的光路上進行插拔,以防止向進行掃描曝光的拍攝區域的外側照射狹縫光。關於掩蔽單元112的具體的結構例將在以後敘述。在此,在本實施方式中,掩蔽單元112配置在照明光學系統106與遮罩102之間的光路上,但只要配置在與投影光學系統101的物面和像面共軛的面上即可。例如,掩蔽單元112也可以配置在遮罩102與投影光學系統101之間、或者投影光學系統101與基板104之間等。另外,掩蔽單元112也可以作為照明光學系統106的構成要素而設置在照明光學系統106內。The slit light emitted from the illumination
投影光學系統101將由照明光學系統106照明的遮罩102的圖案的像投影到基板104上。在圖1中,投影光學系統101的光軸AX沿Z方向延伸,投影光學系統101的像面成為與Z方向垂直的面(即,XY平面)。藉由了掩蔽單元112的狹縫光被照射到遮罩102,遮罩102的圖案的像以投影光學系統101的倍率(例如,1/4、1/2、1/5)形成於投影光學系統101的像面。The projection
基板104例如是在其表面塗布有抗蝕劑(感光劑)的晶圓。在基板104排列有在之前的曝光處理中形成的具有相同的圖案構造的多個拍攝區域。基板載置台105是保持並移動基板104的載置台,具有保持(吸附、固定)基板104的卡盤。基板載置台105能夠包括能夠分別在X方向和Y方向上水準移動的XY載置台和能夠在與投影光學系統101的光軸AX平行的Z方向(基板104的高度方向)上移動的Z載置台。而且,基板載置台105還能夠包括能夠在繞X軸的θX方向和繞Y軸的θY方向上旋轉(傾斜)的調平載置台和能夠在繞Z軸的θZ方向上旋轉的旋轉載置台。這樣,基板載置台105能夠構成用於使遮罩102的圖案的像與基板104的拍攝區域一致的6軸驅動系統。基板載置台105在X方向、Y方向和Z方向上的位置能夠總是由配置於基板載置台105的條狀鏡108和干涉儀110測量。The
遮罩102由遮罩載置台103保持。遮罩載置台103在與投影光學系統101的光軸AX垂直的面內沿Y方向(箭頭103a的方向)掃描。此時,遮罩載置台103以遮罩載置台103的Y方向的位置始終維持目標位置的方式被掃描(校正驅動)。遮罩載置台103的X方向和Y方向的位置經常由配置於遮罩載置台103的條狀鏡107和干涉儀109測量。The
控制部111例如由包括CPU(Central Processing Unit,中央處理單元)等處理器和記憶體等存儲部的計算機構成,綜合地控制曝光裝置100的各部分。為了使來自遮罩102的圖案的光在基板104的預定區域(拍攝區域)成像,控制部111控制保持遮罩102的遮罩載置台103和保持基板104的基板載置台105。例如,控制部111經由遮罩載置台103和基板載置台105,調整遮罩102和基板104在XY面內的位置(XY方向的位置以及θZ方向的旋轉)、Z方向的位置(θX方向以及θY方向各自的旋轉)。另外,控制部111使遮罩載置台103和基板載置台105相對於投影光學系統101同步地進行掃描。這樣,控制部111控制曝光處理(掃描曝光),在該曝光處理中,藉由一邊基板載置台105相對於光照射區域掃描基板104,一邊對基板104的拍攝區域分別進行曝光。例如,在沿箭頭103a的方向掃描遮罩載置台103的情況下,基板載置台105沿箭頭105a的方向以校正了投影光學系統101的倍率(縮小倍率)的速度進行掃描。The
能夠基於遮罩載置台103的位置、基板載置台105的位置以及基板104上的各拍攝區域相對於基板載置台105的位置來執行遮罩102的圖案在XY平面內的對位。遮罩載置台103的位置和基板載置台105的位置如前所述,分別由干涉儀109和干涉儀110測量。藉由利用對準觀測器(未示出)檢測設於基板載置台105的標記的位置和形成於基板104的對準標記的位置,來獲得基板104上的各拍攝區域相對於基板載置台105的位置。Alignment of the pattern of the
[掩蔽單元的結構、控制]
在曝光裝置中,在基板104的拍攝區域的掃描曝光中,需要防止向該拍攝區域的外側照射狹縫光。因此,在本實施方式的曝光裝置100中,設有具有遮光葉片(遮光構件)的掩蔽單元112。在掩蔽單元112中,在控制部111的控制下,遮光葉片與遮罩載置台103和基板載置台105同步地被進行掃描(驅動),以防止向拍攝區域的外側照射狹縫光。
[Structure and control of masking unit]
In the exposure device, during scanning exposure of the imaging area of the
在此,掃描曝光能夠定義為狹縫光的至少一部分照射到基板104(拍攝區域)上而使基板104曝光的狀態。另外,遮罩102、基板104以及掩蔽單元112的遮光葉片的掃描方向(掃描曝光中的驅動方向)為同一方向。但是,在圖1的例子中,由於在掩蔽單元112與遮罩102之間光路被反射鏡MR折彎,因此遮罩102和基板104的掃描方向成為Y方向,掩蔽單元112的遮光葉片的掃描方向成為Z方向。Here, scanning exposure can be defined as a state in which at least part of the slit light is irradiated onto the substrate 104 (imaging area) to expose the
圖2是表示掩蔽單元112的結構例的概略圖。掩蔽單元112包括用於在掃描方向(Z方向)上遮蔽狹縫光204的2片遮光葉片205、206,以及在掃描方向(Z方向)上驅動該2片遮光葉片205、206的驅動機構200。驅動機構200例如能夠由線性馬達構成,該線性馬達具有在掃描方向上延伸的定子201和能夠沿著定子201在掃描方向上移動的動子202、203。需要說明的是,掩蔽單元112也可以還包括用於在與掃描方向正交的方向(X方向)上遮蔽狹縫光204的2片遮光葉片。FIG. 2 is a schematic diagram showing a structural example of the
遮光葉片205(第2遮光構件)由動子202機械地保持,遮光葉片206(第1遮光構件)由動子203機械地保持。驅動機構200藉由使動子202沿著定子201在掃描方向上移動而能夠在掃描方向上驅動遮光葉片205,藉由使動子203沿著定子201在掃描方向上移動而能夠在掃描方向上驅動遮光葉片206。驅動機構200能夠構成為獨立地驅動遮光葉片205(動子202)和遮光葉片206(動子203)。另外,驅動機構200以與遮罩載置台103和基板載置台105同步地使遮光葉片205、206在狹縫光的光路上插拔(插入或拔出)的方式由控制部111控制。The light-shielding blade 205 (the second light-shielding member) is mechanically held by the mover 202 , and the light-shielding blade 206 (the first light-shielding member) is mechanically held by the mover 203 . The driving mechanism 200 can drive the light shielding blade 205 in the scanning direction by moving the mover 202 in the scanning direction along the stator 201, and can drive the light shielding blade 205 in the scanning direction by moving the mover 203 in the scanning direction along the stator 201. The light shielding blade 206 is driven. The drive mechanism 200 can be configured to independently drive the light-shielding blade 205 (motor 202) and the light-shielding blade 206 (motor 203). In addition, the driving mechanism 200 is controlled by the
接下來,參照圖3A~圖3B,對掃描曝光中的掩蔽單元112(遮光葉片205、206的驅動)的控制例進行說明。圖3A~圖3B是經時地表示遮光葉片205、206相對於狹縫光204(遮罩102上的照明區域)的動作以及光照射區域302在基板104的拍攝區域301上的移動的示意圖。在圖3A~圖3B中,左圖表示掃描曝光中的遮光葉片205、206的動作,右圖表示拍攝區域301上的光照射區域302的移動。另外,在圖3A~圖3B中,遮光葉片205、206及拍攝區域301的掃描方向以箭頭表示。如前所述,遮光葉片205、206與遮罩載置台103和基板載置台105同步地被驅動,以防止在基板104的拍攝區域的掃描曝光中向該拍攝區域的外側照射狹縫光。需要說明的是,在本實施方式中,加速能夠定義為使速度的絕對值增加,減速能夠定義為使速度的絕對值減少。Next, a control example of the masking unit 112 (driving of the light-shielding blades 205 and 206) during scanning exposure will be described with reference to FIGS. 3A and 3B. 3A and 3B are schematic diagrams showing the movement of the light shielding blades 205 and 206 with respect to the slit light 204 (illumination area on the mask 102) and the movement of the light irradiation area 302 on the imaging area 301 of the
在掃描曝光(曝光動作)開始前,如圖3A的(階段1)所示,由於遮光葉片205完全遮蔽狹縫光204,因此狹縫光(曝光的光)不會照射到基板上的拍攝區域301。當掃描曝光開始時,如圖3A的(階段2)所示,遮光葉片205與基板載置台105在掃描方向上同步地被驅動,遮光葉片205從狹縫光204的光路逐漸被拔出。然後,狹縫光204的一部分逐漸開始通過掩蔽單元112。即,開始向拍攝區域301照射狹縫光,拍攝區域301上的光照射區域302逐漸擴大。此時,以不對掃描方向上的拍攝區域301的外側照射狹縫光的方式,追隨拍攝區域301中的掃描方向側的端部(前端)的移動而控制遮光葉片205的驅動。Before the scanning exposure (exposure operation) starts, as shown in (Phase 1) of FIG. 3A , since the light shielding blade 205 completely blocks the slit light 204 , the slit light (exposure light) does not irradiate the imaging area on the substrate. 301. When scanning exposure starts, as shown in FIG. 3A (stage 2), the light shielding blade 205 is driven in synchronization with the substrate mounting table 105 in the scanning direction, and the light shielding blade 205 is gradually pulled out of the optical path of the slit light 204 . Then, a portion of the slit light 204 gradually begins to pass through the
若遮光葉片205從狹縫光204完全被拔出,則如圖3A的(階段3)所示,狹縫光的整體被照射到拍攝區域301,光照射區域302成為最大。此時,遮光葉片205開始減速並停止,接著遮光葉片206開始加速。然後,當來到掃描方向的相反方向上的拍攝區域301的端部(後端)時,如圖3B的(階段4)所示,開始遮光葉片206對狹縫光204的遮蔽。When the light-shielding blade 205 is completely pulled out from the slit light 204, as shown in FIG. 3A (stage 3), the entire slit light is irradiated into the imaging area 301, and the light irradiation area 302 becomes the largest. At this time, the light-shielding blade 205 starts to decelerate and stops, and then the light-shielding blade 206 starts to accelerate. Then, when the end (rear end) of the imaging area 301 in the opposite direction to the scanning direction is reached, as shown in (Phase 4) of FIG. 3B , the shielding blade 206 starts shielding the slit light 204 .
當遮光葉片206對狹縫光204的遮蔽開始時,如圖3B的(階段5)所示,遮光葉片206逐漸插入於狹縫光204的光路,狹縫光204開始逐漸被遮蔽。即,拍攝區域301上的光照射區域302逐漸變窄。此時,以不對該相反方向上的拍攝區域301的外側照射狹縫光的方式,追隨拍攝區域301中的該相反方向側的端部(後端)的移動而控制遮光葉片206的驅動。然後,當狹縫光204被遮光葉片206完全遮蔽時,如圖3B的(階段6)所示,遮光葉片206開始減速並停止。在此,在針對下一拍攝區域的掃描曝光中,掃描方向反轉,因此按照(階段6)~(階段1)的順序執行。能夠對基板104上的多個拍攝區域中的各個拍攝區域執行這樣的掃描曝光。When the shielding blade 206 starts to shield the slit light 204, as shown in (stage 5) of FIG. 3B, the shielding blade 206 is gradually inserted into the optical path of the slit light 204, and the slit light 204 begins to be gradually shielded. That is, the light irradiation area 302 on the imaging area 301 gradually becomes narrower. At this time, the driving of the light shielding blade 206 is controlled following the movement of the end (rear end) of the opposite direction side of the imaging area 301 so that the outside of the imaging area 301 in the opposite direction is not irradiated with slit light. Then, when the slit light 204 is completely blocked by the light shielding blade 206, as shown in (Phase 6) of FIG. 3B, the light shielding blade 206 starts to decelerate and stops. Here, in the scanning exposure for the next imaging area, the scanning direction is reversed, so (stage 6) to (stage 1) are performed in order. Such scanning exposure can be performed on each of a plurality of imaging areas on the
接下來,參照圖9對一邊使基板104等速移動一邊對基板104進行掃描曝光的情況下(以下,有時表述為等速曝光)的遮光葉片205、206的驅動控制例進行說明。圖9是表示在對第N個拍攝區域和第(N+1)個拍攝區域進行等速曝光的情況下的基板載置台105和遮光葉片205、206的驅動控制例的圖。第N個拍攝區域是基板104中的多個拍攝區域中的1個(第1拍攝區域),以下有時表述為「Nshot」。另外,第(N+1)個拍攝區域是基板104中的多個拍攝區域中的在接著Nshot之後進行掃描曝光的拍攝區域(第2拍攝區域),以下有時表述為「(N+1)shot」。Next, a driving control example of the light-shielding blades 205 and 206 in the case of performing scanning exposure on the
在此,基板載置台105和遮光葉片205、206的驅動由控制部111控制。控制部111按照規定基板載置台105的驅動的驅動曲線來控制基板載置台105的驅動,並且與其並行地,控制驅動機構200使遮光葉片205、206向狹縫光的光路的插拔。基板載置台105的驅動曲線包含位置曲線、速度曲線以及加速度曲線中的至少1個,以下,對使用速度曲線作為驅動曲線的例子進行說明。Here, the
控制部111在Nshot的掃描曝光開始之前將基板載置台105加速驅動至最高速度Vws,當達到最高速度Vws時,以保持恒定速度的方式對基板載置台105進行等速驅動。曝光區間901是對拍攝區域照射狹縫光而進行該拍攝區域的掃描曝光的區間。在圖9的例子中的曝光區間901中,基板載置台105被等速驅動。The
另一方面,控制部111以在Nshot的掃描曝光的開始之前、即在曝光區間901的開始之前達到最高速度Va的方式對遮光葉片205進行加速驅動。遮光葉片205的最大速度Va成為藉由將基板載置台105的速度Vws乘以一定的光學倍率(例如,投影光學系統101的倍率)而得到的值。On the other hand, the
如圖3A~圖3B中所述,在拍攝區域的掃描曝光中,需要使拍攝區域的外側(例如,相鄰拍攝區域)不被照射狹縫光。因此,控制部111在作為拍攝區域的掃描曝光(曝光區間901)的初期的擴大區間902中,以追隨(同步)基板載置台105的等速驅動的方式,即,以追隨Nshot的前端的移動的方式等速驅動遮光葉片205。擴大區間902是從狹縫光的光路逐漸拔出遮光葉片(205或206)而擴展(擴大)拍攝區域上的光照射區域的區間。當遮光葉片205從狹縫光拔出而擴大區間902結束時,控制部111對遮光葉片205進行減速驅動而使其停止。As described in FIGS. 3A and 3B , in the scanning exposure of the imaging area, it is necessary to prevent the outside of the imaging area (for example, the adjacent imaging area) from being irradiated with the slit light. Therefore, the
接下來,控制部111以在狹縫光(光照射區域)到達Nshot的後端之前達到最高速度Vb的方式對遮光葉片206進行加速驅動。然後,控制部111在拍攝區域的掃描曝光(曝光區間901)的末期即縮小區間903中,以追隨(同步)基板載置台105的等速驅動的方式,即,以追隨Nshot的後端的移動的方式等速驅動遮光葉片206。縮小區間903是將遮光葉片(205或206)逐漸插入到狹縫光的光路而縮窄(縮小)拍攝區域上的光照射區域的區間。當遮光葉片206完全遮蔽狹縫光而縮小區間903結束時,控制部111對遮光葉片206進行減速驅動而使其停止。這樣,進行Nshot的掃描曝光。Next, the
在Nshot的掃描曝光結束後,開始(N+1)拍攝的掃描曝光。控制部111在結束Nshot的掃描曝光(曝光區間901)後,使基板載置台105減速,並且開始向相反方向的加速。然後,控制部111在(N+1)shot的掃描曝光開始之前將基板載置台105加速驅動至最高速度-Vws,當達到最高速度-Vws時,以保持恒定速度的方式對基板載置台105進行等速驅動。After the scanning exposure of Nshot ends, the scanning exposure of (N+1) shooting starts. After completing the scanning exposure of Nshot (exposure interval 901), the
另一方面,控制部111以在(N+1)shot的掃描曝光的開始之前、即在曝光區間901的開始之前達到最高速度-Va的方式對遮光葉片206進行加速驅動。然後,在擴大區間902中,以追隨(同步)基板載置台105的等速驅動、即追隨(N+1)shot的前端的移動的方式對遮光葉片206進行等速驅動。當擴大區間902結束時,對遮光葉片206進行減速驅動而使其停止。接下來,控制部111以在狹縫光(光照射區域)到達(N+1)shot的後端之前達到最高速度-Vb的方式對遮光葉片205進行加速驅動。然後,在縮小區間903中,以追隨(同步)基板載置台105的等速驅動的方式,即,以追隨(N+1)shot的後端的移動的方式對遮光葉片205進行等速驅動。在縮小區間903結束時,對遮光葉片205進行減速驅動而使其停止。這樣,進行(N+1)shot的掃描曝光。藉由重複上述那樣的基板載置台105和遮光葉片205、206的驅動,分別進行基板104中的多個拍攝區域的掃描曝光。On the other hand, the
順便提及,在曝光裝置100中,為了提高吞吐量(生產率),提出了一邊使基板104加速或減速一邊進行基板104的掃描曝光的方式。例如,已知被稱為正弦波曝光的掃描曝光的方式。在正弦波曝光中,一邊按照正弦波狀的驅動曲線(例如速度曲線)驅動基板載置台105,一邊在該驅動曲線中的包含基板載置台105的加速和減速的一部分區間中進行各拍攝區域的掃描曝光。也就是說,在正弦波曝光中,在進行各拍攝區域的掃描曝光的曝光區間中,在擴大區間使基板載置台105加速,在縮小區間使基板載置台105減速。而且,在應用正弦波曝光來進行拍攝區域的掃描曝光的情況下,也需要防止向該拍攝區域的外側照射狹縫光。Incidentally, in the
因此,在本實施方式的曝光裝置100中,在拍攝區域的掃描曝光的初期(擴大區間)從狹縫光的光路拔出遮光葉片時,追隨基板載置台105的加速而對遮光葉片進行加速驅動。另外,在拍攝區域的掃描曝光的末期(縮小區間)向狹縫光的光路插入遮光葉片時,追隨基板載置台105的減速而對遮光葉片進行減速驅動。以下,對正弦波曝光中的基板載置台105和遮光葉片205、206的驅動控制例進行說明。Therefore, in the
[實施例1]
圖4是表示在正弦波曝光中進行Nshot和(N+1)shot的掃描曝光的情況下的基板載置台105及遮光葉片205、206的驅動控制例的圖。圖4中的曝光區間401、擴大區間402以及縮小區間403分別與使用圖9所述的曝光區間901、擴大區間902以及縮小區間903對應。在此,控制部111基於基板載置台105的正弦波狀的驅動曲線,事先生成用於追隨(同步)基板載置台105的驅動而驅動遮光葉片205、206的驅動曲線(例如速度曲線)。該驅動曲線在圖4中用虛線表示,以下有時表述為葉片驅動曲線。
[Example 1]
FIG. 4 is a diagram showing an example of drive control of the substrate mounting table 105 and the light-shielding blades 205 and 206 when scanning exposure of N shot and (N+1) shot is performed in sine wave exposure. The
控制部111按照正弦波狀的驅動曲線(速度曲線)來驅動基板載置台105。由此,能夠縮短各拍攝區域的掃描曝光所需的時間(曝光時間),提高吞吐量。需要說明的是,曝光區間401是進行拍攝區域的掃描曝光的區間。The
另一方面,控制部111以在Nshot的掃描曝光的開始之前、即曝光區間401的開始之前達到葉片驅動曲線的速度的方式,對遮光葉片205進行加速驅動。此時,使用藉由與葉片驅動曲線不同的計算式計算出的驅動曲線,以比追隨基板載置台105的加速度時的追隨加速度(虛線)大的加速度對遮光葉片205進行加速驅動。然後,在擴大區間402中,切換為葉片驅動曲線,以追隨(同步)基板載置台105的加速的方式,即,以追隨Nshot的前端的移動的方式,按照葉片驅動曲線對遮光葉片205進行加速驅動。在擴大區間402結束時,切換為以與葉片驅動曲線不同的計算式計算出的驅動曲線,以比追隨基板載置台105的減速度時的追隨減速度(虛線)大的減速度來對遮光葉片205進行減速驅動而使其停止。此時,在Nshot的掃描曝光(曝光區間401)結束之前使遮光葉片205停止為佳。On the other hand, the
接下來,控制部111以在狹縫光到達Nshot的後端之前達到葉片驅動曲線的速度的方式,對遮光葉片206進行加速驅動。此時,使用藉由與葉片驅動曲線不同的計算式計算出的驅動曲線,以比追隨基板載置台105的加速度時的追隨加速度(虛線)大的加速度對遮光葉片206進行加速驅動。然後,在縮小區間403中,切換為葉片驅動曲線,以追隨(同步)基板載置台105的減速的方式,即,以追隨Nshot的後端的移動的方式,按照葉片驅動曲線對遮光葉片206進行減速驅動。在縮小區間403結束時,切換為藉由與葉片驅動曲線不同的計算式計算出的驅動曲線,以比追隨基板載置台105的減速度時的追隨減速度(虛線)大的減速度對遮光葉片206進行減速驅動而使其停止。此時,在(N+1)shot的掃描曝光(曝光區間401)開始之前使遮光葉片206停止為佳。這樣,進行Nshot的掃描曝光。Next, the
在Nshot的掃描曝光結束後,開始(N+1)拍攝的掃描曝光。控制部111以在(N+1)shot的掃描曝光的開始之前、即曝光區間401的開始之前達到葉片驅動曲線的速度的方式,對遮光葉片206進行加速驅動。此時,使用藉由與葉片驅動曲線不同的計算式計算出的驅動曲線,以比追隨基板載置台105的加速度時的追隨加速度(虛線)大的加速度對遮光葉片206進行加速驅動。然後,在擴大區間402中,切換為葉片驅動曲線,以追隨(同步)基板載置台105的加速驅動的方式,即,以追隨(N+1)shot的前端的移動的方式,按照葉片驅動曲線對遮光葉片206進行加速驅動。在擴大區間402結束時,切換為藉由與葉片驅動曲線不同的計算式計算出的驅動曲線,以比追隨基板載置台105的減速度時的追隨減速度(虛線)大的減速度來對遮光葉片206進行減速驅動而使其停止。此時,在(N+1)shot的掃描曝光(曝光區間401)結束之前使遮光葉片206停止為佳。After the scanning exposure of Nshot ends, the scanning exposure of (N+1) shooting starts. The
接下來,控制部111以在狹縫光到達(N+1)shot的後端之前達到葉片驅動曲線的速度的方式,對遮光葉片205進行加速驅動。此時,使用藉由與葉片驅動曲線不同的計算式計算出的驅動曲線,以比追隨基板載置台105的加速度時的追隨加速度(虛線)大的加速度對遮光葉片205進行加速驅動。然後,在縮小區間403中,切換為葉片驅動曲線,以追隨(同步)基板載置台105的減速驅動的方式,即,以追隨(N+1)shot的後端的移動的方式,按照葉片驅動曲線對遮光葉片205進行減速驅動。在縮小區間403結束時,切換為藉由與葉片驅動曲線不同的計算式計算出的驅動曲線,以比追隨基板載置台105的減速度時的追隨減速度(虛線)大的減速度對遮光葉片205進行減速驅動而使其停止。此時,在下一掃描曝光開始之前使遮光葉片205停止為佳。這樣,進行(N+1)shot的掃描曝光。Next, the
在此,在圖4的例子中,例如若著眼於遮光葉片206,則控制為在Nshot(拍攝)的掃描曝光與(N+1)shot的掃描曝光之間產生遮光葉片206的停止期間ts。然後,以該遮光葉片206的停止期間ts比基板載置台105的停止期間長的方式控制遮光葉片206的驅動。另外,在Nshot(拍攝)的掃描曝光與(N+1)shot的掃描曝光之間,以比追隨基板載置台105的減速度時的追隨減速度(虛線)大的減速度使遮光葉片206減速並停止。另外,之後,以比追隨基板載置台105的加速度時的追隨加速度(虛線)大的加速度對遮光葉片206進行加速。藉由這樣進行遮光葉片206的驅動控制,能夠縮短遮光葉片206的驅動行程,因此,從削減曝光裝置100的裝置成本、避免大型化的觀點出發,能夠變得有利。需要說明的是,對於遮光葉片205,也能夠進行與遮光葉片206同樣的驅動控制。Here, in the example of FIG. 4 , for example, focusing on the light-shielding blade 206 , control is performed so that a stop period ts of the light-shielding blade 206 occurs between the scanning exposure of the N shot (shooting) and the scanning exposure of the (N+1) shot. Then, the driving of the light-shielding blade 206 is controlled so that the stop period ts of the light-shielding blade 206 is longer than the stop period of the substrate mounting table 105 . In addition, between the scanning exposure of the N shot (shooting) and the scanning exposure of the (N+1) shot, the light shielding blade 206 is decelerated at a deceleration greater than the following deceleration (dashed line) when following the deceleration of the
[實施例2]
在上述的實施例1中,說明了在拍攝區域彼此的掃描曝光之間(即,Nshot的掃描曝光與(N+1)shot的掃描曝光之間)使遮光葉片205、206停止的例子。在本實施例2中,參照圖5說明在拍攝區域彼此的掃描曝光的期間,追隨(同步)基板載置台105的驅動地驅動遮光葉片205、206中的一者的例子。圖5是表示在正弦波曝光中進行Nshot和(N+1)shot的掃描曝光的情況下的基板載置台105及遮光葉片205、206的驅動控制例的圖。需要說明的是,本實施例2基本上繼承上述實施例1,除了以下提及的事項以外,能夠遵循實施例1。
[Example 2]
In the above-mentioned
在本實施例2中,從Nshot的掃描曝光結束到(N+1)shot的掃描曝光開始的期間,按照葉片驅動曲線,追隨(同步)基板載置台105的驅動地驅動遮光葉片206。即,控制部111在從Nshot的縮小區間403的開始到(N+1)shot的擴大區間402的結束為止的期間(區間502),按照葉片驅動曲線,追隨(同步)基板載置台105的驅動地驅動遮光葉片206。然後,當(N+1)shot的擴大區間402結束時,切換為藉由與葉片驅動曲線不同的計算式計算出的驅動曲線。然後,以比追隨基板載置台105的減速度時的追隨減速度(虛線)大的減速度對遮光葉片206進行減速驅動而使其停止。In the second embodiment, from the end of the scanning exposure of the N shot to the start of the scanning exposure of the (N+1) shot, the light shielding blade 206 is driven to follow (synchronize with) the driving of the substrate mounting table 105 according to the blade driving curve. That is, the
另外,對於遮光葉片205也同樣,在(N+1)shot的掃描曝光結束到(N+2)shot的掃描曝光開始的期間,按照葉片驅動曲線,追隨基板載置台105的驅動地驅動遮光葉片205。即,控制部111在從(N+1)shot中的縮小區間403的開始到(N+2)shot中的擴大區間402的結束為止的期間,按照葉片驅動曲線,追隨(同步)基板載置台105的驅動地驅動遮光葉片205。然後,當(N+2)shot的擴大區間402結束時,切換為藉由與葉片驅動曲線不同的計算式計算出的驅動曲線。然後,以比追隨基板載置台105的減速度時的追隨減速度(虛線)大的減速度對遮光葉片205進行減速驅動而使其停止。In addition, the same applies to the light-shielding blade 205. During the period from the completion of the scanning exposure of the (N+1) shot to the start of the scanning exposure of the (N+2) shot, the light-shielding blade 205 is driven to follow the driving of the substrate mounting table 105 according to the blade driving curve. 205. That is, the
需要說明的是,(N+2)shot是在接著(N+1)shot之後進行掃描曝光的拍攝區域。在圖5中,未圖示關於(N+2)shot的掃描曝光(曝光區間401)的驅動控制,但可以理解為與關於Nshot的掃描曝光(曝光區間401)同樣的驅動控制。在該情況下,從(N+1)shot中的縮小區間403的開始到(N+2)shot中的擴大區間402的結束之間的區間可以理解為將圖5中的區間503和區間501合起來的區間。It should be noted that the (N+2) shot is a shooting area that is scanned and exposed after the (N+1) shot. In FIG. 5 , the drive control for the scanning exposure (exposure interval 401 ) of the (N+2) shot is not shown, but it can be understood as the same drive control as the scanning exposure (exposure interval 401 ) of the N shot. In this case, the interval from the start of the reduced
在切換遮光葉片205、206的驅動曲線時,由於遮光葉片205、206的速度、加速度/減速度急劇變化,因此遮光葉片205、206容易產生振動。根據本實施例2,例如當著眼於遮光葉片206時,在Nshot的掃描曝光與(N+1)shot的掃描曝光之間,遮光葉片206的驅動以追隨按照正弦波狀的驅動曲線的基板載置台105的驅動的方式被控制。由此,能夠降低在驅動曲線的切換時產生的振動。When switching the driving curves of the light-shielding blades 205 and 206, the speed and acceleration/deceleration of the light-shielding blades 205 and 206 change rapidly, so the light-shielding blades 205 and 206 easily vibrate. According to the second embodiment, for example, when focusing on the light-shielding blade 206, between the scanning exposure of N shot and the scanning exposure of (N+1) shot, the driving of the light-shielding blade 206 follows the substrate carrier according to the sinusoidal drive curve. The driving mode of the
圖6是表示基板載置台105和遮光葉片205、206的加速度曲線的圖。遮光葉片205在擴大區間402中能夠以對於基板載置台的加速度Aws乘以光學倍率(例如投影光學系統101的倍率)而得到的加速度Aa被驅動,以追隨(同步)基板載置台105的驅動。而且,為了使驅動行程以及驅動時間最小,在擴大區間402結束後,以驅動機構200的能夠硬輸出的最高加速度Aa_max進行減速驅動為佳。另一方面,為了使遮光葉片206在縮小區間403追隨(同步)基板載置台105,在從遮光葉片205開始驅動起經過一定時間後開始驅動。由於在經過一定時間後開始驅動,因此遮光葉片206為了在狹縫光到達拍攝區域的後端之前追隨(同步)基板載置台105的驅動,需要達到對於基板載置台105的速度乘以光學倍率而得到的速度。因而,遮光葉片206使用驅動機構200的能夠硬輸出的最高加速度Ab_max,以達到基板載置台105的速度的方式被加速。在遮光葉片206的速度達到基板載置台105的速度之後,以基板載置台105的加速度Aws乘以光學倍率而得到的加速度Ab進行驅動。在縮小區間403結束後,保持原樣地繼續追隨(同步)基板載置台105,追隨(同步)基板載置台105而被驅動,直到(N+1)Shot的擴大區間402結束為止。FIG. 6 is a diagram showing acceleration curves of the substrate mounting table 105 and the light shielding blades 205 and 206 . The light-shielding blade 205 can be driven in the expanded
如上所述,本實施方式的曝光裝置100在拍攝區域的掃描曝光的初期(擴大區間)從狹縫光的光路拔出遮光葉片時,追隨基板載置台105的加速而對遮光葉片進行加速驅動。另外,在拍攝區域的掃描曝光的末期(縮小區間)向狹縫光的光路插入遮光葉片時,追隨基板載置台的減速而對遮光葉片進行減速驅動。由此,在一邊使基板104加速或減速一邊進行基板104的拍攝區域的掃描曝光的情況下(例如正弦波曝光),能夠適當地驅動遮光葉片205、206,防止向該拍攝區域的外側照射狹縫光。As described above, the
<第2實施方式>
對本發明的第2實施方式進行說明。在第1實施方式中,說明了根據擴大區間402和縮小區間403的開始時和/或結束時執行(決定)遮光葉片205、206的驅動曲線的切換的例子。在第2實施方式中,對根據遮光葉片205、206的位置、速度或加速度來執行(決定)遮光葉片205、206的驅動曲線的切換的例子進行說明。需要說明的是,本實施方式基本上繼承第1實施方式,除了以下提及的事項以外,能夠遵循第1實施方式。
<Second Embodiment>
A second embodiment of the present invention will be described. In the first embodiment, an example has been described in which switching of the driving curves of the light shielding blades 205 and 206 is performed (determined) based on the start time and/or end time of the
圖7是表示基板載置台105和遮光葉片205、206的加速度曲線的圖。在上述的第1實施方式中,在擴大區間402和縮小區間403的開始時和/或結束時執行了遮光葉片205、206的驅動曲線的切換。另一方面,在本實施方式中,如圖7所示,在遮光葉片205、206的加速度變為零的時機執行遮光葉片205、206的驅動曲線的切換。FIG. 7 is a diagram showing acceleration curves of the substrate mounting table 105 and the light shielding blades 205 and 206 . In the above-described first embodiment, the driving curves of the light shielding blades 205 and 206 are switched at the beginning and/or end of the
如前所述,在切換遮光葉片205、206的驅動曲線時,由於遮光葉片205、206的速度、加速度急劇變化,因此遮光葉片205、206容易產生振動。特別是,若在施加一定的加速度的狀態下使驅動曲線變化,則與此相應地,施加於遮光葉片205、206的力的變化變大。因而,當在加速度較大的時機切換驅動曲線時,與此相應地,可能會在遮光葉片205、206產生較大的振動。另外,若在擴大區間402、縮小區間403中在遮光葉片205、206產生大的振動,則在拍攝區域的端部難以進行準確的遮光,對該拍攝區域的外側(例如相鄰拍攝區域)進行曝光,有可能產生不良。As mentioned above, when the driving curves of the light-shielding blades 205 and 206 are switched, the speed and acceleration of the light-shielding blades 205 and 206 change rapidly, so the light-shielding blades 205 and 206 tend to vibrate. In particular, if the drive curve is changed while a certain acceleration is applied, the change in the force applied to the light-shielding blades 205 and 206 becomes larger accordingly. Therefore, when the driving curve is switched at a timing of large acceleration, correspondingly large vibration may be generated in the light-shielding blades 205 and 206 . In addition, if large vibration occurs in the light shielding blades 205 and 206 in the expanded
藉由如本實施方式那樣在遮光葉片205、206的加速度成為零的時機切換驅動曲線,能夠使在驅動曲線的切換時施加於遮光葉片205、206的力的變化為最小限度。也就是說,能夠減少遮光葉片205、206的振動。但是,在曝光區間401(縮小區間403)結束後,追隨(同步)基板載置台105的遮光葉片205、206驅動(正弦波驅動)仍繼續,因此與第1實施方式相比,遮光葉片205、206的驅動行程變大。因而,即使遮光葉片205、206的加速度不一定為零,也可以在所期望的驅動行程的範圍內任意決定進行驅動曲線的切換的加速度的值,以使振動成為最小限度。同樣地,切換驅動曲線的時機也可以將任意的位置、速度作為指標。By switching the drive curve at the timing when the acceleration of the light shielding blades 205 and 206 becomes zero as in this embodiment, the change in the force applied to the light shielding blades 205 and 206 when the drive curve is switched can be minimized. In other words, the vibration of the light shielding blades 205 and 206 can be reduced. However, after the end of the exposure section 401 (reduction section 403), the driving (sinusoidal wave driving) of the light shielding blades 205 and 206 following (synchronizing) the substrate mounting table 105 continues. Therefore, compared with the first embodiment, the light shielding blades 205 and 206 are The driving stroke of 206 becomes larger. Therefore, even if the acceleration of the light-shielding blades 205 and 206 is not necessarily zero, the acceleration value for switching the drive curve can be determined arbitrarily within the range of the desired drive stroke so as to minimize the vibration. Similarly, any position and speed can be used as indicators for the timing of switching the drive curve.
<第3實施方式>
對本發明的第3實施方式進行說明。在本實施方式中,對在第1實施方式中說明的曝光裝置100中的曝光動作進行說明。需要說明的是,本實施方式基本上繼承第1實施方式,除了以下提及的事項以外,能夠遵循第1實施方式。另外,本實施方式也可以繼承第2實施方式。
<3rd Embodiment>
A third embodiment of the present invention will be described. In this embodiment, the exposure operation in the
圖8是表示曝光裝置100中的曝光動作的流程圖。圖8的流程圖的各步驟能夠由控制部111執行。FIG. 8 is a flowchart showing the exposure operation in the
在步驟S801中,控制部111使用未圖示的基板搬運機構,將基板104搬運到基板載置台105上。接下來,在步驟S802中,控制部111使用未圖示的對準觀測器(檢測部)來檢測基板104上的標記的位置,由此進行基板104的對準。在本步驟S802中,能夠執行全域對準,該全域對準藉由檢測基板104中的多個拍攝區域中的幾個樣本拍攝區域的標記的位置,對其檢測結果進行統計處理,從而得到多個拍攝區域的排列資訊。In step S801, the
在步驟S803中,控制部111生成(決定、計算)基板載置台105的驅動曲線以及遮光葉片205、206的葉片驅動曲線。各驅動曲線的生成能夠基於步驟S802中的基板104的對準結果(例如排列資訊)來進行。接下來,在步驟804中,控制部111決定遮光葉片205、206的驅動曲線的切換時機。該切換時機的決定能夠如在第1~第2實施方式中說明的那樣進行。In step S803, the
在步驟S805中,控制部111執行基板104的掃描曝光。控制部111基於在步驟S803中決定的驅動曲線和在步驟S804中決定的切換時機來驅動基板載置台105和遮光葉片205和206。由此,能夠對基板104中的多個拍攝區域分別進行掃描曝光。接下來,在步驟S806中,控制部111使用未圖示的基板搬運機構,從基板載置台105上回收(搬出)基板104。In step S805, the
<物品的製造方法的實施方式> 本發明的實施方式的物品的製造方法例如適合於製造半導體器件等微器件、具有微細構造的元件等物品。本實施方式的物品的製造方法包括:使用上述曝光裝置在塗布於基板的感光劑上形成潛像圖案的步驟(對基板進行曝光的步驟);對形成有潛像圖案的基板進行加工(顯影)的步驟;以及從加工後的基板製造物品的步驟。進而,該製造方法包括其他公知的步驟(氧化、成膜、蒸鍍、摻雜、平坦化、蝕刻、抗蝕劑剝離、切割、接合、封裝等)。本實施方式的物品的製造方法與以往的方法相比,在物品的性能、品質、生產率、生產成本的至少1個方面是有利的。 <Embodiments of the manufacturing method of articles> The method for manufacturing articles according to the embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having fine structures. The method of manufacturing an article according to this embodiment includes: forming a latent image pattern on the photosensitive agent coated on the substrate using the exposure device (step of exposing the substrate); and processing (developing) the substrate on which the latent image pattern is formed. the steps; and the steps of manufacturing an article from the processed substrate. Furthermore, this manufacturing method includes other well-known steps (oxidation, film formation, evaporation, doping, planarization, etching, resist stripping, cutting, bonding, packaging, etc.). The article manufacturing method of this embodiment is advantageous in at least one aspect of article performance, quality, productivity, and production cost compared with conventional methods.
<其他實施例> 本發明也能夠藉由將實現上述實施方式的1個以上的功能的程序經由網絡或存儲介質供給至系統或裝置,由該系統或裝置的計算機中的1個以上的處理器讀出並執行程序的處理來實現。另外,也能夠藉由實現1個以上的功能的電路(例如ASIC)來實現。 <Other Examples> The present invention can also be achieved by supplying a program that implements one or more functions of the above-described embodiment to a system or device via a network or a storage medium, and having one or more processors in a computer of the system or device read and execute the program. processing to achieve. In addition, it can also be realized by a circuit (such as an ASIC) that realizes one or more functions.
發明不限於上述實施方式,在不脫離發明的精神和範圍的情況下,能夠進行各種變更和變形。因而,為了公開發明的範圍而添附申請專利範圍。The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the patent application scope is attached in order to disclose the scope of the invention.
100:曝光裝置 101:投影光學系統 102:遮罩(原版) 103:遮罩載置台 104:基板 105:基板載置台 106:照明光學系統 112:掩蔽單元 200:驅動機構 205,206:遮光葉片 100:Exposure device 101:Projection optical system 102: Mask (original version) 103: Mask mounting table 104:Substrate 105:Substrate mounting table 106: Illumination optical system 112: Masking unit 200:Driving mechanism 205,206: Shading blades
[圖1]是表示曝光裝置的結構例的概略圖。 [圖2]是表示掩蔽單元的結構例的概略圖。 [圖3A]是經時地表示遮光葉片相對於狹縫光的動作以及基板的拍攝區域上的光照射區域的移動的示意圖。 [圖3B]是經時地表示遮光葉片相對於狹縫光的動作以及基板的拍攝區域上的光照射區域的移動的示意圖。 [圖4]是表示第1實施方式(實施例1)中的基板載置台和遮光葉片的驅動控制例的圖。 [圖5]是表示第1實施方式(實施例2)中的基板載置台和遮光葉片的驅動控制例的圖。 [圖6]是表示第1實施方式(實施例2)中的基板載置台和遮光葉片的加速度曲線的圖。 [圖7]是表示第2實施方式中的基板載置台和遮光葉片的加速度曲線的圖。 [圖8]是表示曝光裝置中的曝光動作的流程圖。 [圖9]是表示進行等速曝光的情況下的基板載置台和遮光葉片的驅動控制例的圖。 [Fig. 1] is a schematic diagram showing a structural example of an exposure device. [Fig. 2] is a schematic diagram showing a structural example of a masking unit. 3A is a schematic diagram illustrating the movement of the light-shielding blade with respect to the slit light and the movement of the light irradiation area on the imaging area of the substrate over time. 3B is a schematic diagram showing the movement of the light-shielding blade with respect to the slit light and the movement of the light irradiation area on the imaging area of the substrate over time. [Fig. 4] Fig. 4 is a diagram showing an example of drive control of the substrate mounting table and the light-shielding blade in the first embodiment (Example 1). [Fig. 5] Fig. 5 is a diagram showing an example of drive control of the substrate mounting table and the light-shielding blade in the first embodiment (Example 2). [Fig. 6] Fig. 6 is a diagram showing acceleration curves of the substrate mounting table and the light-shielding blade in the first embodiment (Example 2). [Fig. 7] Fig. 7 is a diagram showing acceleration curves of the substrate mounting table and the light-shielding blade in the second embodiment. [Fig. 8] is a flowchart showing the exposure operation in the exposure device. [Fig. 9] Fig. 9 is a diagram showing an example of drive control of the substrate mounting table and the light-shielding blade when performing constant-speed exposure.
100:曝光裝置 100:Exposure device
101:投影光學系統 101:Projection optical system
102:遮罩(原版) 102: Mask (original version)
103:遮罩載置台 103: Mask mounting table
104:基板 104:Substrate
105:基板載置台 105:Substrate mounting table
106:照明光學系統 106: Illumination optical system
107,108:條狀鏡 107,108: Strip mirror
109,110:干涉儀 109,110:Interferometer
111:控制部 111:Control Department
112:掩蔽單元 112: Masking unit
113:曝光光源 113: Exposure light source
AX:光軸 AX: optical axis
MR:反射鏡 MR: Reflector
Claims (14)
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