JP3503218B2 - Projection exposure apparatus and exposure method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a projection exposure apparatus used for forming a fine pattern of a semiconductor integrated circuit or the like, and more particularly to a projection exposure apparatus for exposing a mask pattern image on a wafer by a scanning exposure method. .

[0002]

2. Description of the Related Art When a semiconductor device, a liquid crystal display device or the like is manufactured by a lithography process, a pattern image of a photomask or a reticle (hereinafter referred to as "reticle") is exposed under exposure light through a projection optical system. A projection exposure apparatus that projects on a photosensitive substrate is used. In such a projection exposure apparatus, there is an increasing demand for a larger field for exposing a larger chip pattern image on a reticle onto a photosensitive substrate. In order to meet the demand for a larger field, a so-called slit scan exposure method is effective in which the reticle and the photosensitive substrate are scanned in synchronization with, for example, a slit-shaped or arc-shaped illumination area. As a result, an image of a pattern wider than the illuminated area on the reticle can be exposed on the photosensitive substrate.

FIG. 5 shows a conventional projection exposure apparatus of the slit scan exposure system. In FIG. 5 (a), a surface plate BS is provided on a base 1 via anti-vibration springs 2A and 2B, and a surface plate BS is provided thereon. 1st made of Invar (alloy with low expansion coefficient)
Column 3 is placed. Y in the first column 3
The stage 4 and the X stage 5 are placed, and the X stage 5
A wafer W as a photosensitive substrate is held on the top. A lens barrel 6 is fixed to the upper part of the first column 3, and the projection optical system PL is housed inside the lens barrel 6. Y stage 4
Position the wafer W in a direction perpendicular to the paper surface of FIG. 5 within a plane (horizontal plane) perpendicular to the optical axis of the projection optical system PL, and X
The stage 5 positions the wafer W in the X direction perpendicular to the Y axis in the horizontal plane. Although illustration is omitted, the wafer W is placed between the X stage 5 and the wafer W in the projection optical system P.
A Z stage for positioning in the Z direction, which is the optical axis direction of L, is also interposed.

A second column 7 made of Invar is fixed on the first column 3, a reticle scanning stage 8 slidable in the X direction is mounted on the second column 7, and transferred onto the reticle scanning stage 8. The reticle R having a pattern for use is held. The pattern on the reticle R is illuminated with the exposure light IL emitted from the illumination optical system 9, and the pattern image on the reticle R is transferred to the wafer W via the projection optical system PL.
It is projected onto and exposed. In this case, the illumination area on the reticle R by the illumination optical system 9 has, for example, a rectangular slit shape, and the entire pattern area on the reticle R is not illuminated only by the illumination area.

Therefore, during exposure, the reticle scanning stage 7 is driven to move the reticle R with respect to the illumination area in a direction perpendicular to the longitudinal direction of the illumination area.
Scan at a constant speed V1 in the direction. In synchronization with this, the X stage 5 is driven to scan the wafer W in the −X direction at a constant speed V2 with respect to the reticle image in the illumination area. Wafer W from reticle R by projection optical system PL
The speed V2 is β · V1 where β is the projection magnification on. In this manner, by synchronously scanning the reticle R and the wafer W, the image of the entire pattern of the reticle R is projected and exposed on the wafer W. Then, by driving the Y stage 4 and the X stage 5, the next exposure area on the wafer W moves into the exposure field of the projection optical system PL. At this time, vibrations generated by driving the reticle scanning stage 8, the Y stage 4, and the X stage 5 are damped by the first column 3 and the second column 7. In addition, vibration from the floor side where the base 1 is installed is caused by the vibration-proof spring 2A.
And 2B.

By the way, in the apparatus as described above, it is necessary to scan the reticle R and the wafer W at a constant velocity, respectively. From the stationary state of the stage to the constant velocity scan, or from the constant velocity scan to the stage. Until the stationary state is reached, the X stage 5 and the reticle scanning stage 9
First column 3 and second supporting each against
From column 7, for example, as shown by the arrow in FIG.
It is necessary to give a predetermined driving force. That is, for example, assuming that the masses of the reticle scanning stage 8 and the X stage 5 are M1 and M2, respectively, the reticle scanning stage 8 and the X stage 5 are
The acceleration given to the stage 5 is a1 (t) and a, respectively.
2 (t), the driving forces applied to the reticle scanning stage 8 and the X stage 5 are represented by M1 · a1 (t) and M2 · a2 (t), respectively (for simplicity, errors due to friction and the like are excluded). ). Then, as shown in (1) and (3) of FIG. 5B, each stage has a constant scanning speed V.
The driving force continues to be applied until reaching 1, V2.
At the time of acceleration of each stage, due to the reaction of the applied driving force, the corresponding second column 7 and the first column 3 have forces F1 (= −M1 · a1 (t)) and F in the opposite directions.
2 (= -M2 · a2 (t)) will be added,
For example, A of the second column 7 on the optical axis of the projection optical system PL
At the point and the point B of the first column 3, vibrations as shown in (2) and (4) of FIG. Then, such movements are synergized to generate a large rotational vibration as shown in (5) of FIG. 5B in the entire body including the first column 3 and the second column 7, and the first column 3 and the second column 7 are generated. There was a risk that the entire body including the 2 column 8 would tilt. In some cases, the fragile portion may be deformed or destroyed. In addition, in the present specification, a device portion such as the first column 3 and the second column 7 in which vibration is generated by the movement of each stage, in other words, a portion which is a target of damping the vibration by the device of the present invention. We will collectively refer to it as the body.

As described above, in the conventional scanning type exposure apparatus, rotational vibration occurs in the body when the stage is accelerated,
The relative positional relationship between the reticle R and the wafer W changes,
Overlay accuracy when the pattern on the reticle R is overlaid on a circuit pattern already formed on the wafer W to be exposed, and the pattern image when the image of the reticle pattern of the first layer is exposed on the wafer This is a problem because the array accuracy of is deteriorated. Then, in order to solve such a problem, a method of incorporating a vibration-proof structure in a body to suppress vibration, a method of reducing acceleration of a stage to reduce the occurrence of vibration have been developed so far. Also,
A method of actively controlling vibration by an external vibration control structure has also been developed. For example, JP-A-6-163
In Japanese Patent No. 353, as shown in FIG. 6, a fixed column 10 is provided outside the surface plate BS on which the body including the first column 3 and the second column 7 is mounted, and the fixed column 10 is provided. Energizing means 1 such as an electromagnet at the contact point between the body 10 and the body 1
By arranging 1a, 11b, 11c and 11d and applying a force for canceling the reaction generated in the body BD by the acceleration of the stage to the body BD from the biasing means 11a, 11b, 11c and 11d, the vibration of the body is activated. A restraining structure is disclosed. Note that, in FIG. 6, members having the same functions and actions as those of FIG. 5 are designated by the same reference numerals and duplicate description thereof is omitted.

[0008]

However, in the conventional measures against vibration as described above, when a vibration isolator such as a spring is attached to the body, the natural vibration caused by the spring constant of the spring itself is generated. On the contrary, there is a problem that it is difficult to synchronize the reticle stage and the wafer stage. Further, the method of reducing the vibration of the body by reducing the acceleration of the stage has a problem that the scanning time for each shot of the stage becomes long and the overall throughput decreases. Furthermore, in the method of actively controlling the vibration of the body by the external vibration control structure, there is a problem that the whole apparatus becomes large-scale and the control is difficult, and accordingly the cost increases. It is also possible to make the body itself a structure with high rigidity, but it is difficult to design and there is a problem that the structure of the column becomes complicated.

The present invention has been made in view of the problems of the above-described conventional exposure apparatus, and when the stage on which the wafer or reticle is mounted is accelerated, the reaction force of the driving force of the body causes the body to react. It is an object of the present invention to provide a new and improved projection exposure apparatus capable of obtaining high alignment accuracy by canceling or minimizing the vibration generated in the.

[0010]

As shown in FIG. 1, a projection exposure apparatus to which the present invention is applied holds an illuminating optical system (9) for illuminating an illumination area having a predetermined shape and a reticle (R). Then, the reticle stage (8) that relatively scans the reticle (R) with respect to the illumination area, the reticle base (7) on which the reticle stage (8) is mounted, and the reticle (R in the illumination area. ) A projection optical system (PL) for projecting an image of the pattern on the photosensitive substrate (W) such as a wafer, and a photosensitive substrate (W) for holding the photosensitive substrate (W) and conjugating the conjugate image of the illuminated area. Substrate stage (5) that relatively scans
And a substrate base (3) on which the substrate stage (5) is placed, the reticle (R) and the photosensitive substrate (relative to the illumination area illuminated by the illumination optical system (9). By synchronously scanning W), it is possible to project the image of the pattern on the reticle (R) onto the photosensitive substrate (W). Then, in order to solve the above-mentioned problems, the apparatus of the present invention shifts a predetermined timing from the acceleration of either the reticle stage (8) or the substrate stage (5) when performing scanning, and the mask stage (8) or The substrate stage (5) is configured to accelerate the other one.

In this case, the reticle base (8) is used as the predetermined timing for shifting the acceleration start time of each stage.
The vibration of the vibration system (BD) can be set in advance according to the vibration system including the substrate base (5), that is, the body (BD) in which the vibration is excited by the motion of each stage. Then, at that time, the timing of shifting the acceleration may be set in advance as a time point at which the sign of the rotational acceleration of the vibration system (BD) of the exposure apparatus is reversed.

Further, the projection exposure apparatus configured as described above is provided with an acceleration sensor (20) for detecting the acceleration of the vibration system (BD) including the reticle base (8) and the substrate base (5), and each stage is provided. The predetermined timing for shifting the acceleration start time of the vibration system (B) is adjusted according to the acceleration of the vibration system (BD) detected by the acceleration sensor (20).
It is also possible to decide to damp the vibration of D). Then, at that time, the vibration system (B) detected by the acceleration sensor (36, 40) detects the timing of shifting the acceleration.
It can also be set as the time when the sign of the rotational acceleration in D) is reversed. Further, the exposure method according to the present invention is a pattern
The mask (R) having a screen and the photosensitive substrate (W)
To expose the pattern on the photosensitive substrate (W)
Of the mask (R) during scanning in the exposure method
Start the acceleration timing and the acceleration of the photosensitive substrate (W)
The start acceleration timing is shifted by a predetermined timing
Scanning exposure is performed. This predetermined timing is a mass
Also calculated in advance from the acceleration pattern of KU (R)
It can also be used as a mask (R) and photosensitive substrate
(W) and the main body (BD) on which the
It may be determined based on vibration.

[0013]

According to the present invention, as shown in FIG. 2A, for example, in order to scan the reticle stage in the X direction, as shown in FIG.
As shown in (1) of (b), reticle stage (8)
Is accelerated in the -X direction as a reaction (F1) of the acceleration of the stage (8) at the point A of the second column (7).
Vibration as shown in (2) of (b) is generated. And
Due to the vibration of the second column (7), rotational vibration as shown in (5) of FIG. 2B is excited in the entire body (BD). At that time, unlike the conventional exposure apparatus, the wafer stage (5) is held stationary. And
When the wafer stage (5) is accelerated in the X direction as shown in (3) of FIG. 2 (b) with a predetermined timing offset, the reaction of the acceleration of the stage (5) at point B of the first column (3). As (F2), vibration as shown in (4) of FIG. 2B is generated. However, the vibration is (2) in Fig. 2 (b).
Since the vibration of the second column (7) shown in FIG. 2 is canceled, the rotational vibration excited in the body (BD) is canceled or damped as shown in (5) of FIG. 2B. It As described above, according to the present invention, it is possible to improve the alignment accuracy without using a large-scale external vibration damping device or reducing the acceleration of the stage.

When the acceleration pattern of the reticle stage (8) is known in advance, the acceleration pattern is applied to the vibration system including the reticle stage (8) and the wafer stage (5), that is, the body (BD). The vibration pattern to excite can be calculated. By setting the acceleration timing of the wafer stage (5) in advance, for example, as the time when the sign of the rotational acceleration of the body is reversed so that the vibration of the body is attenuated according to the vibration pattern excited in the body (BD). The vibration of the body (BD) can be effectively canceled or damped.

When the acceleration pattern of the reticle stage (8) is not known in advance, the acceleration pattern is applied to the vibration system including the reticle stage (8) and the wafer stage (5), that is, the body (BD). Since the vibration pattern to be excited cannot be calculated, an acceleration sensor is provided in the body (BD) to measure the excited vibration pattern in real time, and the body (B
The vibration of the body (BD) is effective by starting the acceleration of the wafer stage (5), for example, when the sign of the rotational acceleration of the measured body (BD) is reversed so as to damp the vibration of D). Can be canceled or attenuated. In the above description, the example in which the reticle stage (8) is accelerated prior to the wafer stage (5) has been shown, but it goes without saying that the same effect can be obtained in the opposite case. .

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a projection exposure apparatus constructed according to the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 shows a configuration of a scanning projection exposure apparatus to which the present invention can be applied. In FIG. 1, in the plane parallel to the reticle R, the X axis is in the direction perpendicular to the paper surface of FIG. 1, and the paper surface of FIG. The Y axis is taken in the parallel direction, the Z axis is taken perpendicularly to the XY plane, and the relative scanning direction during scanning exposure is taken as the X direction. In the following description, components having substantially the same functions as those described with reference to FIG. 5 will be assigned the same reference numerals and detailed description thereof will be omitted.

The exposure illumination light from the mercury lamp 20 is focused on the second focus by the elliptical mirror 21. At the second focus, a rotary shutter 23 that switches between blocking and transmitting illumination light by a motor 22 is arranged. Shutter 23
The illumination light flux that has passed through is reflected by the mirror 24, becomes a substantially parallel light flux via the input lens 25, and enters the fly-eye lens system 26. A large number of secondary light source images are formed on the exit side of the fly-eye lens system 26, and the illumination light from each secondary light source image enters a lens system (condenser lens) 28. The movable blade BL of the reticle blind mechanism 29 is arranged on the rear focal plane of the lens system 28 (the plane conjugate with the pattern plane of the reticle R in the illumination optical system). The movable blade BL is composed of a plurality of blades, each of which can be independently moved by the drive system 30, and the shape of the opening AP is defined by the edge of each blade BL into a slit shape or an arc shape. In that case, the opening AP
The shape and size of are defined so as to be included in the circular image field of the projection optical system PL.

At the position of the blind mechanism 29, the illumination light has a uniform illuminance distribution, and the illumination light that has passed through the aperture AP of the blind mechanism 29 has the lens system 31, the mirror 32, and the like.
Also, the reticle R is irradiated through the main condenser lens 33. At this time, the blade B of the blind mechanism 29
The image of the aperture AP defined by L is formed on the pattern surface of the lower surface of the reticle R. In this way, the reticle R that has received the illumination light defined by the opening AP is held on the reticle stage 8 that can move at least at a constant speed in the X direction on the second column 7. The reticle stage 8 is moved by the driver 34 to X
One-dimensional scanning movement in the direction, minute rotation movement for yawing correction, etc. are performed. Further, at one end of the reticle stage 8, a moving mirror 36 that reflects the measurement beam from the laser interferometer 35 is provided.
Is fixed, and the position of the reticle R in the X direction is set to the laser interferometer 3
5 is measured in real time. Further, the second column 7 is provided with an acceleration sensor 36 for measuring in real time the rotational acceleration of the second column 7 generated when the reticle stage 8 is accelerated or decelerated.

The image of the pattern formed on the reticle R is
The image is formed on the wafer W after being reduced to, for example, 1/5 by the projection optical system PL. The wafer W is mounted on the wafer stage WS which is movable on the first column 3 in the XYZ directions. The wafer stage WS includes an X stage 4 movable in the X direction and a Y stage 5 movable in the Y direction.
And a Z stage (not shown) movable in the Z direction. In the illustrated example, the X stage is the drive system 37.
The other stages are also driven and controlled independently by a drive system (not shown). A movable mirror 39 that reflects the length measurement beam from the laser interferometer 38 is fixed to one end of the wafer stage WS, and the coordinate position of the wafer stage WS is determined by the laser interferometer 38.
Is measured in real time by. Further, in the first column 3, the first columns generated when the wafer stage WS is accelerated and decelerated.
An acceleration sensor 40 for measuring the rotational acceleration of the column 3 in real time is installed.

Next, the operation of driving the scanning projection exposure apparatus configured as described above based on the present invention will be described. The sequence and control of the operation are comprehensively managed by the main control section 41. It The basic operation of the main control unit 41 is the position information from the laser interferometers 35 and 38 and the drive system 3
The reticle stage 8 and the wafer stage W at the time of scan exposure based on the speed information from the tacho generators in 4, 37 and the like and the acceleration information from the acceleration sensors 36 and 40.
S and S are kept at a predetermined speed ratio (a value corresponding to the projection magnification of the projection optical system PL), and the relative positional relationship between the reticle pattern and the wafer pattern is relatively moved within a predetermined alignment error. . At this time, according to the present invention, the vibration of the body BD can be effectively canceled or damped, so that the alignment accuracy between the reticle pattern and the wafer pattern can be improved.

First, referring to FIG. 3, the first stage,
That is, a method of canceling or damping body vibration when the acceleration pattern for accelerating the reticle stage 8 is known in advance will be described. For example, if the reticle stage 8 having a mass of M1 is driven at the acceleration a1 (t), the driving force applied to the reticle stage 8 from the driving system 34 is
It is represented by M1 × a1 (t). At the same time, a reaction force F1 = −M1 × a1 (t) in the direction opposite to the driving force is generated in the entire body BD including the first column 3 and the second column 7. On the other hand, the equation of motion that defines the vibration of the body BD when the force F1 is applied can be expressed as shown in Expression (1).

[0022]

[Equation 1]

Therefore, if a force for canceling the rotational acceleration of the body in the opposite direction is applied to the body at a predetermined timing, it is possible to minimize the swing of the body represented by the above equation of motion. Of course, it is also possible to apply such an external force by an external mechanism. In this respect, according to the present invention, the reticle stage 8 sets the acceleration timing of the second stage, which is an essential operation during scanning exposure, that is, the wafer stage 5. By delaying the timing, the acceleration of the wafer stage 5 is used as a force for canceling the rotational acceleration of the body in the opposite direction. Therefore, it is possible to suppress the shake of the body without providing a special device for canceling the shake of the body and without reducing the throughput. That is, for example, the wafer stage 5
Assuming that the wafer stage 5 is driven in a direction relatively opposite to the reticle stage 8 with an acceleration a2 (t), the driving force applied from the drive system 37 to the wafer stage 5 is It is represented by M2 × a2 (t). At the same time, a force F2 = −M2 × a2 (t) in the direction opposite to F1 is generated as a reaction force on the entire body BD including the first column 3 and the second column 7, so this force F2
Can be used to cancel the shaking of the body BD that has already occurred due to the acceleration of the reticle stage 8.

The timing for accelerating the wafer stage 5 is based on information such as the mass of the body BD including the first column 3 and the second column 7, the spring constant, and the acceleration pattern of the reticle stage 8, for example, as shown in FIG. As shown in (5) of (b), as the time (t1) at which the sign of the rotational acceleration of the body BD reverses from positive to negative, the main control unit 41.
It is possible to obtain and store in advance by calculation. During the actual scan exposure, the main controller 4
The acceleration timing information stored in No. 1 is read out, the reticle stage 8 is accelerated, and then the predetermined timing (t
1) By delaying and accelerating the wafer stage 5,
It is possible to suppress the swing of the body BD. Note that FIG.
In (b), the acceleration timing of the wafer stage 5 which is the second stage is shown as the time when the reticle stage 8 which is the first stage shifts to the uniform velocity scanning, but this is an example of the operation of the present invention. It goes without saying that the present invention is not limited to such an example.

The operation when the acceleration pattern of the reticle stage 8 is known in advance has been described above with reference to FIG. 3, but the present invention is applicable to the case where the acceleration pattern of the reticle stage 8 is not known in advance. Can also be applied.
That is, as shown in FIG. 4, the body B is used by utilizing the information from the acceleration sensors 36 and 40 installed on the body BD.
It is possible to suppress the shaking of D. In this case, the vibration of the body BD that occurs when the reticle stage 8 is accelerated or decelerated, that is, its rotational acceleration can be measured in real time. Therefore, an external force that suppresses the shake of the body BD according to the output from the acceleration sensor. To give
The wafer stage 5 can be driven. More specifically, for example, when the reticle stage 8 is accelerated or decelerated, the body B
The rotational acceleration generated in D is monitored, and (5) in FIG.
As shown in (4), when the sign of the rotational acceleration is inverted from positive to negative (t1) as a trigger, the acceleration of the wafer stage 5 is started, whereby the swing of the body BD can be suppressed.

In the above description of the operation, the case where the reticle stage 8 is accelerated prior to the wafer stage 5 has been taken as an example, but the present invention is not limited to such an embodiment. It is also applicable to a case where the reticle stage 8 is accelerated in advance and the vibration generated in the body BD due to the acceleration is offset by an external force generated by the reticle stage 8 which is accelerated with a predetermined timing delay. Needless to say.

Further, during scan exposure by the projection exposure apparatus, uneven exposure amount in the scanning direction may occur on the wafer W until each stage accelerates and becomes uniform velocity scanning. Therefore, at the start of scanning. Although it is necessary to perform a prescan (running) for a predetermined distance, the body BD vibration damping operation according to the present invention can be performed during such a prescan, so the acceleration timings of the reticle stage 8 and the wafer stage 5 are shifted. However, it has little effect on throughput.

Further, in the above embodiment, the damping operation of the vibration of the body BD generated at the start of the exposure scanning has been described, but the present invention is also applicable to the vibration of the body BD generated at the end of the exposure scanning. In this case, the braking of the reticle stage 8 is performed by applying the braking negative acceleration to the wafer stage 5 with a predetermined timing shift from the time when the braking negative acceleration is applied to the reticle stage 8. It is possible to damp vibrations that sometimes occur in the body BD. Also in this case, when the braking pattern of the reticle stage 8 is known in advance, the braking timing of the wafer stage 5 can be calculated in advance, and the braking pattern of the reticle stage 8 can be calculated in advance. If not known, the wafer stage 5 can be braked according to the rotational acceleration of the body measured by the acceleration sensors 36 and 40.

Further, in the above-described embodiment, the so-called scan exposure method, in which the exposure is performed while the reticle stage 8 and the wafer stage 5 are relatively scanned, has been described as an example, but the present invention is limited to such a scan exposure method. It is not limitedly applied. According to the present invention, when static exposure is performed by a scanning type projection exposure apparatus having first and second stages capable of relative scanning with each other, for example, a vertically long reticle is stepped to form a plurality of patterns on the wafer. It is naturally applicable to the case where the exposure is performed so as to be connected to each other. Then, even in such a case, according to the present invention, by shifting the stepping timing of the first stage and the second stage, the step of the stage that follows the vibration of the body BD generated by the step operation of the preceding stage It can be suppressed by the operation, and the settling time of the stage is shortened to improve the throughput.

Furthermore, in the above embodiment, the apparatus of the present invention is used alone without using any other vibration isolation mechanism (except the vibration isolation pads 2A and 2B for preventing the transmission of vibrations from the base 1). The case where the vibration of the body BD is attenuated has been described as an example. However, this is a stage that can be driven by another vibration isolation mechanism, for example, a feed screw disclosed in Japanese Patent Laid-Open No. 4-181198. And a stator provided on the base on which the stage moves,
In order to cancel the force generated when the stage is decelerated, a mechanism in which a linear motor generates a force in the opposite direction to the force is used in combination with the device of the present invention, and is applied so as to enhance the vibration damping or vibration damping effect. It goes without saying that it does not hinder.

[0031]

As described above, the projection exposure of the present invention
According to the apparatus , by shifting the acceleration timings of the first stage and the second stage for relatively scanning the mask and the photosensitive substrate, the vibration of the body generated by the preceding accelerated stage is delayed. It can be damped by the force generated by the accelerated stage. As described above, according to the projection exposure apparatus of the present invention , the flow of a series of operations inevitably involved in the scanning exposure operation is performed without using any external vibration control mechanism and without reducing the throughput. Since the vibration of the body can be effectively dampened, the weight and cost of the device can be reduced, and at the same time, the alignment can be performed with high accuracy. Further, by applying the present invention to a step-and-repeat type projection exposure apparatus, the force generated during stepping of each stage is similarly offset by shifting the timing of the start of the stepping, and the settling time of the stage can be shortened. Can also be obtained. Further, according to the exposure method of the present invention
If so, the acceleration timing to start the mask acceleration and the photosensitive substrate
Predetermined timing to start the acceleration of the plate
Scanning exposure is performed with a shift, so especially scanning projection exposure
In the device, the alignment accuracy between the mask and the photosensitive substrate
Can be increased.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing the outline of an embodiment of a projection exposure apparatus according to the present invention.

FIG. 2 is an explanatory diagram showing an outline of the operation of the projection exposure apparatus according to the present invention.

FIG. 3 is an explanatory view showing a first embodiment of the projection exposure apparatus according to the present invention.

FIG. 4 is an explanatory diagram showing a second embodiment of the projection exposure apparatus according to the present invention.

FIG. 5 is an explanatory diagram showing an outline of the operation of a conventional projection exposure apparatus.

FIG. 6 is an explanatory diagram showing an outline of a vibration control mechanism of a conventional projection exposure apparatus.

[Explanation of symbols]

R reticle W wafer PL projection optical system BD body 3 First column 5 Wafer stage 7 Second column 8 reticle stage 34 Reticle stage drive system 37 Wafer stage drive system 41 Main control unit

Claims (8)

(57) [Claims] 1. An illumination optical system for illuminating an illumination area having a predetermined shape, a mask stage for holding a mask and scanning the mask relative to the illumination area, and mounting the mask stage. A mask base, a projection optical system for projecting an image of a pattern on the mask in the illuminated area onto a photosensitive substrate, and the photosensitive substrate being held for the conjugate image of the illuminated area. It has a substrate stage for relatively scanning the photosensitive substrate and a substrate base on which the substrate stage is mounted, and synchronizes the mask and the photosensitive substrate relatively to the illumination area. In the projection exposure apparatus for projecting the image of the pattern on the mask onto the photosensitive substrate by scanning, the predetermined timing is deviated from the acceleration of either the mask stage or the substrate stage. , The mask station Or the substrate stage is configured to accelerate the other one,
Projection exposure device. 2. The mask base is set at the predetermined timing.
The projection exposure apparatus according to claim 1, wherein the projection exposure apparatus is preset so as to damp vibrations of a vibration system including the substrate and the substrate base. 3. The projection exposure apparatus according to claim 2, wherein the predetermined timing is preset as a time point when the sign of the rotational acceleration of the vibration system is reversed. 4. An acceleration sensor for detecting an acceleration of a vibration system including the mask base and the substrate base is provided, and the predetermined timing is based on an output from the acceleration sensor. Projection exposure apparatus according to claim 1, characterized in that it is determined to damp vibrations. 5. The projection exposure apparatus according to claim 4, wherein the predetermined timing is a time point when the sign of the rotational acceleration of the vibration system detected by the acceleration sensor is reversed. 6. A mask having a pattern and a photosensitive substrate are provided.
The pattern is exposed on the photosensitive substrate by relatively scanning.
In the light exposure method, An acceleration tie that starts accelerating the mask during the scan.
And the acceleration timing to start the acceleration of the photosensitive substrate
Scanning exposure is performed by shifting To
A characteristic exposure method. 7. The predetermined timing is applied to the mask.
Characterized by being obtained in advance from the speed pattern
The exposure method according to claim 6. 8. The predetermined timing is before and after the mask.
At the time of the scanning exposure of the main body on which the photosensitive substrate is placed,
7. The method according to claim 6, wherein it is determined based on vibration.
The exposure method described.