TW202343038A - Photosensitive composition, optical filter, image display device, and solid-state imaging device - Google Patents

Abstract

An object of the present invention is to provide a photosensitive composition, an optical filter, an image display device, and a solid-state imaging device. The photosensitive composition can provide a coating film with an excellent alkali developability, an excellent pattern shape and an excellent resistance. The photosensitive composition includes an alkali-soluble resin (A), a polymerizable compound (B), and a photopolymerization initiator (C). The photopolymerization initiator (C) includes an oxime-based photopolymerization initiator (C1) represented by the following general formula (1), and a photopolymerization initiator (C2) other than the oxime-based photopolymerization initiator (C1). The photopolymerization initiator (C2) includes one or more selected from the group consisting of acetophenone-based photopolymerization initiators, acylphosphine oxide-based photopolymerization initiators, and imidazole-based photopolymerization initiators.

Description

Photosensitive compositions, optical filters, image display devices, and solid-state imaging devices

The present invention relates to a photosensitive composition and an optical filter using the photosensitive composition.

A type of filter used in image display devices, solid-state imaging devices, etc., is a filter segment in which two or more types of fine band-shaped filter segments with different hues are formed on a transparent substrate such as a glass substrate. Arrange them parallel to each other (in a stripe shape) or crosswise. Alternatively, two or more fine filter segments with different hues may be arranged in sequence in each of the longitudinal and transverse directions. The filter segments have a small size ranging from several micrometers to hundreds of micrometers, and are neatly arranged in a prescribed arrangement for each hue.

Currently, regarding the manufacturing method of a color filter, the filter segment pattern of the first color is obtained through the following steps: coating a photosensitive composition on a transparent substrate such as glass, and drying to remove the solvent from the coating film; The step of irradiating the coating film with radiation through a photomask having a desired pattern shape to harden it (hereinafter referred to as exposure); and then cleaning and removing the unexposed portion of the coating film (hereinafter referred to as exposure) development); and thereafter, if necessary, a heat treatment (hereinafter referred to as post-baking) step in order to fully harden the cured film. And by performing the same operation as this, filter segment patterns of other colors are formed, thereby completing the color filter.

In the development step, an alkaline developer is used as the developer, and the unexposed parts are cleaned and removed. At this time, there is a problem that the exposed part is missing or peeled off, causing defects in the pattern shape. Furthermore, if the content of the photopolymerization initiator is increased in order to improve the adhesion of the pattern, the developability is deteriorated and development residue is generated.

In addition, in recent years, as image display devices have been miniaturized and have a higher number of picture elements, the area per picture element has tended to become smaller, and color filters have been required to be thinner.

Furthermore, even if the color filter is thinned, the spectral characteristics need to be maintained at the current level. Therefore, it is necessary to increase the concentration of the colorant contained in the picture element of the color filter, which leads to a relatively small amount of components required for hardening, resulting in deterioration of the pattern shape and solvent resistance of the coating film.

As a measure to improve alkali developability, Patent Document 1 discloses a resist composition containing a fluorine-based surfactant with a specific structure. In addition, as a measure to improve pattern defects during development, a colored composition containing a polymerizable compound having an alkylene oxide structure is disclosed. In addition, as a measure to improve pattern formability when containing a high concentration of colorant, a colored photosensitive resin composition containing a polyfunctional thiol compound and an acetophenone compound is disclosed. [Prior art documents] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2016-102212 [Patent Document 2] Japanese Patent Application Publication No. 2014-142582 [Patent Document 3] Japanese Patent Application Laid-Open No. 2004-83857

[Problem to be solved by the invention] However, none of the compositions of Patent Documents 1 to 3 can fully satisfy alkali developability, pattern shape, and solvent resistance of the coating film.

An object of the present invention is to provide a photosensitive composition capable of obtaining a coating film that is excellent in alkali developability and pattern shape and has excellent solvent resistance. [Technical means to solve problems]

[1] The present invention is a photosensitive composition, including: an alkali-soluble resin (A), a polymerizable compound (B), and a photopolymerization initiator (C). In the photosensitive composition, the photopolymerization initiator The agent (C) contains an oxime-based photopolymerization initiator (C1) represented by the following general formula (1), and a photopolymerization initiator (C2) other than the oxime-based photopolymerization initiator (C1). The photopolymerization initiator The agent (C2) contains at least one selected from the group consisting of an acetophenone-based photopolymerization initiator, a acylphosphine oxide-based photopolymerization initiator, and an imidazole-based photopolymerization initiator. General formula (1) [Chemical formula 1] (In the general formula (1), R ₁ represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a carbon number Heterocyclyl group with 2 to 20 carbon atoms; R ₂ represents an alkyl group with 3 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or an alkyl group with 2 to 20 carbon atoms. Heterocyclic group; R ₃ represents an alkyl group with 3 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or a heterocyclic ring with 2 to 20 carbon atoms. group; R ₄ represents a benzyl group which may have a substituent, n represents 1) [2] The photosensitive composition according to [1], wherein the oxime-based photopolymerization initiator (C1) and the The mass ratio of photopolymerization initiators (C2) other than the oxime-based photopolymerization initiator (C1) is 90:10 to 10:90. [3] The photosensitive composition according to [1] or [2], further containing a sensitizer (D). [4] The photosensitive composition according to any one of [1] to [3], further containing a thiol tether transfer agent (E). [5] The photosensitive composition according to any one of [1] to [4], wherein the alkali-soluble resin (A) contains an alkali-soluble resin (A1), and the alkali-soluble resin (A1) contains An alicyclic hydrocarbon-containing monomer unit (a1) and a carboxyl group-containing monomer unit (a2). [6] The photosensitive composition according to any one of [1] to [5], wherein the alkali-soluble resin (A1) contains 5 moles in all structural units of the alkali-soluble resin (A1). % to 60 mol% of the alicyclic hydrocarbon-containing monomer unit (a1). [7] An optical filter having: a substrate; and a filter segment formed of the photosensitive composition according to any one of [1] to [6]. [8] An image display device having the optical filter according to [7]. [9] A solid-state imaging element having the optical filter according to [7]. [Effects of the invention]

According to the present invention, a photosensitive composition capable of obtaining a coating film having excellent alkali developability and pattern shape and excellent solvent resistance can be provided. In addition, the present invention can provide an optical filter, an image display device, and a solid-state imaging element.

Hereinafter, the form of the photosensitive composition used for carrying out this invention is demonstrated in detail. In addition, the present invention is not limited to the following embodiments, and may be modified and implemented within a range that can solve the problems. In this specification, the so-called "(meth)acrylyl", "(meth)acrylic acid", "(meth)acrylic acid", "(meth)acrylate" or "(meth)acrylamide" ”, unless otherwise specified, respectively means “acrylyl and/or methacrylic acid”, “acrylic acid and/or methacrylic acid”, “acrylic acid and/or methacrylic acid”, and “acrylate ester” and/or methacrylate", or "acrylamide and/or methacrylamide". In addition, "C.I." means the Color Index (C.I.; published by The Society of Dyers and Colourists). The polymerizable unsaturated group is an ethylenically unsaturated double bond. In addition, regarding the molecular weight of the compound in the present invention, for a low molecular compound whose molecular weight can be determined, it is a value calculated by calculation (formula weight) or by electrospray ionization-mass spectrometry (ESI-MS). ) is the polystyrene-equivalent weight average molecular weight measured by gel permeation chromatography using tetrahydrofuran as a solvent for a compound with a molecular weight distribution. The polymerizable compound (B) is a compound that forms a film by hardening. A monomer is a compound that forms a resin by polymerization. The monomer is in an unreacted state, and the monomer unit is in a state in which the monomer is polymerized to form a resin.

<Photosensitive composition> One embodiment of the present invention relates to a photosensitive composition. The photosensitive composition of the present invention includes an alkali-soluble resin (A), a polymerizable compound (B), and a photopolymerization initiator (C). In the photosensitive composition, the photopolymerization initiator (C) includes the following: An oxime-based photopolymerization initiator (C1) represented by the general formula (1), and a photopolymerization initiator (C2) other than the oxime-based photopolymerization initiator (C1), wherein the photopolymerization initiator (C2) contains a photopolymerization initiator selected from the group consisting of: One or more types of acetophenone-based photopolymerization initiators, acylphosphine oxide-based photopolymerization initiators, and imidazole-based photopolymerization initiators. The photosensitive composition of the present invention can form a pattern, and is preferably used after forming a film and photocuring the composition. The film is preferably incorporated into an optical device such as an image display device or a solid-state imaging element, for example. General formula (1) [Chemical formula 2]

In the general formula (1), R ₁ represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or 2 carbon atoms. ~20 heterocyclyl. R ₂ represents an alkyl group having 3 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. R ₃ represents an alkyl group having 3 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. R ₄ represents a benzyl group which may have a substituent, and n represents 1.

Hereinafter, the components contained or which can be contained in the photosensitive composition of one embodiment are demonstrated in detail.

[Photopolymerization initiator (C)] The photosensitive composition of the present invention contains an oxime-based photopolymerization initiator (C1) represented by the general formula (1), and a photopolymerization initiator (C2) other than the oxime-based photopolymerization initiator (C1) (excluding the oxime (other than photopolymerization initiator) as the photopolymerization initiator (C). It is presumed that the combination of a highly sensitive oxime-based photopolymerization initiator (C1) represented by the general formula (1) and a (low-sensitivity) photopolymerization initiator (C2) different in sensitivity from the oxime-based photopolymerization initiator (C1), Surprisingly, it is possible to form a cured film in which a tough part and a relatively soft part coexist. Therefore, a coating film having excellent alkali developability, pattern shape, and excellent solvent resistance can be obtained.

(Oxime-based photopolymerization initiator (C1)) The oxime-based photopolymerization initiator (C1) is a compound represented by the following general formula (1). By containing the oxime-based photopolymerization initiator (C1), the sensitivity is improved, and the pattern shape and solvent resistance are improved. General formula (1) [Chemical formula 3]

(In the general formula (1), R ₁ represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a carbon number Heterocyclyl group with 2 to 20 carbon atoms; R ₂ represents an alkyl group with 3 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or an alkyl group with 2 to 20 carbon atoms. Heterocyclic group; R ₃ represents an alkyl group with 3 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or a heterocyclic ring with 2 to 20 carbon atoms. group; R ₄ represents a benzyl group which may have a substituent, n represents 1)

In the general formula (1), R ₁ represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or 2 carbon atoms. ~20 heterocyclyl. Examples of the alkyl group having 1 to 20 carbon atoms include linear alkyl groups, branched alkyl groups, cyclic alkyl groups, and groups in which these are bonded. Examples include: methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, isopentyl, hexyl, heptyl, octyl, isooctyl, 2-ethyl Hexyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecyl, hexadecyl, cyclopentyl, cyclopentylmethyl, cyclohexyl, cyclohexylmethyl, etc. . Examples of the aryl group having 6 to 30 carbon atoms include phenyl, tolyl, xylyl, ethylphenyl, naphthyl, and anthracenyl. Examples of the arylalkyl group having 7 to 30 carbon atoms include benzyl group, α-methylbenzyl group, α,α-dimethylbenzyl group, phenylethyl group, and the like. Examples of the heterocyclic group having 2 to 20 carbon atoms include pyridyl, pyrimidinyl, furyl, tetrahydrofuryl, dioxolyl, imidazolidinyl, oxazolidinyl, pyridinyl, morpholinyl, etc. . Among them, from the viewpoint of coating film resistance, a methyl group, an ethyl group or a phenyl group is preferable, and a methyl group or an ethyl group is more preferable.

In the general formula (1), R ₂ represents an alkyl group having 3 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or an alkyl group having 2 to 20 carbon atoms. Heterocyclyl. Examples of the alkyl group having 3 to 20 carbon atoms include linear alkyl groups, branched alkyl groups, cyclic alkyl groups, and groups in which these are bonded. Examples include: propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, isopentyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, nonyl, Isononyl, decyl, isodecyl, undecyl, dodecyl, hexadecyl, cyclopentyl, cyclopentylmethyl, cyclohexyl, cyclohexylmethyl, etc. Examples of the aryl group having 6 to 30 carbon atoms include phenyl, tolyl, xylyl, ethylphenyl, naphthyl, and anthracenyl. Examples of the arylalkyl group having 7 to 30 carbon atoms include benzyl group, α-methylbenzyl group, α,α-dimethylbenzyl group, phenylethyl group, and the like. Examples of the heterocyclic group having 2 to 20 carbon atoms include pyridyl, pyrimidinyl, furyl, tetrahydrofuryl, dioxolyl, imidazolidinyl, oxazolidinyl, pyridinyl, morpholinyl, etc. . Among the above, from the viewpoint of pattern shape and coating film resistance, an alkyl group having 3 to 20 carbon atoms is preferred, an alkyl group having 3 to 8 carbon atoms is more preferred, and a pentyl group is even more preferred.

In the general formula (1), R ₃ represents an alkyl group having 3 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or an alkyl group having 2 to 20 carbon atoms. Heterocyclyl. Examples of the alkyl group having 3 to 20 carbon atoms include linear alkyl groups, branched alkyl groups, cyclic alkyl groups, and groups in which these are bonded. Examples include: propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, isopentyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, nonyl, Isononyl, decyl, isodecyl, undecyl, dodecyl, hexadecyl, cyclopentyl, cyclopentylmethyl, cyclohexyl, cyclohexylmethyl, etc. Examples of the aryl group having 6 to 30 carbon atoms include phenyl, tolyl, xylyl, ethylphenyl, naphthyl, and anthracenyl. Examples of the arylalkyl group having 7 to 30 carbon atoms include benzyl group, α-methylbenzyl group, α,α-dimethylbenzyl group, phenylethyl group, and the like. Examples of the heterocyclic group having 2 to 20 carbon atoms include pyridyl, pyrimidinyl, furyl, tetrahydrofuryl, dioxolyl, imidazolidinyl, oxazolidinyl, pyridinyl, morpholinyl, etc. . Among the above, from the viewpoint of pattern shape and coating film resistance, a branched alkyl group having 3 to 15 carbon atoms is preferred, a branched alkyl group having 5 to 12 carbon atoms is more preferred, and a branched alkyl group having 5 to 12 carbon atoms is even more preferred. 3-methylbutyl, 2-ethylhexyl.

In the general formula (1), R ₄ represents an arbitrary monovalent substituent. Examples of arbitrary monovalent substituents include: alkyl groups having 1 to 20 carbon atoms such as methyl and ethyl groups; alkoxy groups having 1 to 20 carbon atoms such as methoxy and ethoxy groups; F, Cl, Br, Halogen atoms such as I; hydroxyl groups with 1 to 20 carbon atoms; alkyl ester groups with 1 to 20 carbon atoms; alkoxycarbonyl groups with 1 to 20 carbon atoms; halogenated alkyl groups with 1 to 20 carbon atoms, carbon Aromatic ring group with 4 to 20 atoms; amino group; aminoalkyl group with 1 to 20 carbon atoms; hydroxyl; nitro; cyano group; benzyl group which may have a substituent; thiophene which may have a substituent Thenoyl, etc. Examples of substituents that the benzyl group or thiophenyl group may have include alkyl groups having 1 to 10 carbon atoms, alkoxy groups having 1 to 10 carbon atoms, and alkoxycarbonyl groups having 1 to 10 carbon atoms. . The number of substituents that the benzyl group or thiophenyl group may have is preferably 1 to 3. Among them, from the viewpoint of reactivity, a benzyl group which may have a substituent is preferred, and a benzyl group whose substituent is an alkoxycarbonyl group is more preferred.

In general formula (1), n represents an integer from 0 to 3. Among these, from the viewpoint of radical generation efficiency, 0 or 1 is preferred, and 1 is more preferred.

A known method can be used for the production method of the oxime-based photopolymerization initiator (C1). For example, methods described in International Publication No. 2008/078678, International Publication No. 2014/050738, Japanese Patent Publication No. 2016-519675, and the like are included.

Specific examples of the compounds represented by general formula (1) are shown below. In addition, the present invention is not limited to these.

[Chemical 4] Chemical formula (2) Chemical formula (3) Chemical formula (4) Chemical formula (5) Chemical formula (6) Chemical formula (7)

Among the compounds of Chemical Formula (2) to Chemical Formula (7), the compound of Chemical Formula (7) is preferred from the viewpoint of pattern shape and solvent resistance of the coating film.

The oxime-based photopolymerization initiator (C1) can be used alone or in combination of two or more types.

(Photopolymerization initiator (C2)) The photopolymerization initiator (C2) is a photopolymerization initiator other than the oxime-based photopolymerization initiator (C1) represented by the general formula (1). By containing a photopolymerization initiator other than the oxime-based photopolymerization initiator (C1), a soft part can be formed in the cured film, and alkali developability and pattern shape can be improved. From the viewpoint of alkali developability and pattern shape, the photopolymerization initiator (C2) is preferably an acetophenone-based photopolymerization initiator, a phosphine oxide-based polymerization initiator, and an imidazole-based polymerization initiator, and is more preferably a benzene-based photopolymerization initiator. Ethyl ketone photopolymerization initiator.

Specific examples of the photopolymerization initiator (C2) include: 4-phenoxydichloroacetophenone, 4-tert-butyl-dichloroacetophenone, diethoxyacetophenone, 1-(4-iso Propylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexylphenylketone, 2-methyl-1-[4-(methylthio)phenyl]-2- Morpholinopropan-1-one, 2-(dimethylamino)-1-[4-(4-morpholino)phenyl]-2-(phenylmethyl)-1-butanone, or 2 -(Dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone and other acetophenones Polymerization initiators; Benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether or benzyl dimethyl ketal; Benzophenone, benzoyl benzoic acid, methyl benzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4-benzoyl- Benzophenone photopolymerization initiators such as 4'-methyldiphenyl sulfide or 3,3',4,4'-tetrakis(tert-butylperoxycarbonyl)benzophenone; 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(triazine) Chloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-piperonyl-4,6-bis(trichloromethyl)-s-triazine , 2,4-bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2- (4-methoxy-naphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2,4-trichloromethyl-(piperonyl)-6-triazine, or Triazine series photopolymerization initiators such as 2,4-trichloromethyl-(4'-methoxystyryl)-6-triazine; 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, or diphenyl-2,4 , 6-Trimethylbenzoylphosphine oxide and other acylphosphine photopolymerization initiators; 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o-bromophenyl)-4,4',5,5 '-Tetraphenylbiimidazole, 2,2'-bis(o,p-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o-chlorobenzene) base)-4,4',5,5'-tetrakis(m-methoxyphenyl)biimidazole, 2,2'-bis(o,o'-dichlorophenyl)-4,4',5, 5'-tetraphenylbiimidazole, 2,2'-bis(o-nitrophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o-methylbenzene) methyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o-trifluorophenyl)-4,4',5,5'-tetraphenylbiimidazole and other imidazoles It is a photopolymerization initiator, etc.

Examples of commercially available acetophenone-based photopolymerization initiators include: "Omnirad 907" (2-methyl-1-[4-(methylthio)) manufactured by IGM Resins Phenyl]-2-morpholinopropan-1-one), "Omnirad 369" (2-(dimethylamino)-1-[4-(4-morpholino)benzene base]-2-(phenylmethyl)-1-butanone), "Omnirad (Omnirad) 379EG" (2-(dimethylamino)-2-[(4-methylphenyl) Methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone), commercially available products of phosphine oxide-based polymerization initiators include those manufactured by IGM Resins. "Omnirad 819" (bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide), "Omnirad TPO" (diphenyl- 2,4,6-Trimethylbenzoylphosphine oxide), etc.

The photopolymerization initiator (C2) can be used alone or in combination of two or more types.

From the viewpoint of alkali developability, pattern shape, and coating film resistance, the mass ratio of the oxime-based photopolymerization initiator (C1) and the photopolymerization initiator (C2) other than the oxime-based photopolymerization initiator (C1) is preferably 90:10 to 10:90, more preferably 80:20 to 20:80, even more preferably 70:30 to 30:70.

From the viewpoint of photocurability, the content of the photopolymerization initiator (C) is preferably 1 to 100 parts by mass, and more preferably 3 to 50 parts by mass relative to 100 parts by mass of the polymerizable compound (B). , and more preferably 5 to 25 parts by mass.

[Photopolymerization initiator (C3) other than (C1) and (C2)] The photosensitive composition of the present invention may contain a photopolymerization initiator (C3) other than the oxime-based photopolymerization initiator (C1) and the photopolymerization initiator (C2) (hereinafter, also referred to as Known as other photopolymerization initiators (C3)).

Examples of other photopolymerization initiators (C3) include IRGACURE OXE-01, IRGACURE OXE-02, IRGACURE OXE-03 manufactured by BASF Japan. IRGACURE OXE-04, adeka arkls N-1919, adeka arkls NCI-730, ADEKA manufactured by ADEKA adeka arkls NCI-831, adeka arkls NCI-930, TRONLY TR-PBG-301, TRONLY TR-PBG- manufactured by Changzhou Qianli New Materials Company 304. TRONLY TR-PBG-305, TRONLY TR-PBG-309, TRONLY TR-PBG-314, TRONLY TR-PBG-345, TRONLY TR-PBG- 346. TRONLY TR-PBG-358, TRONLY TR-PBG-380, TRONLY TR-PBG-365, TRONLY TR-PBG-610, TRONLY TR-PBG- 3054, TRONLY TR-PBG-3057, OMNIRAD 1312, OMNIRAD 1314, OMNIRAD 1316 manufactured by IGM Resins, Samyang SPI-02, SPI-03, SPI-04, SPI-05, SPI-06, SPI-07 manufactured by Samyang Corporation, DFI-020, DFI-306, EOX- manufactured by Daito Chemix Company 01 etc.

[Alkali-soluble resin (A)] The photosensitive composition of the present invention contains alkali-soluble resin (A).

The alkali-soluble resin (A) only needs to be a resin that is soluble in an alkali developer, and a known resin can be used. Alkali-soluble resin (A) can be classified into non-photosensitive alkali-soluble resin and photosensitive alkali-soluble resin. The alkali-soluble resin (A) has an alkali-soluble group such as a carboxyl group, a phosphate group, a sulfonic acid group, a hydroxyl group, and a phenolic hydroxyl group. Among these, a carboxyl group is preferred. Examples of the non-photosensitive alkali-soluble resin include acrylic resin having an acidic group, α-olefin/maleic acid (anhydride) copolymer, styrene/styrenesulfonic acid copolymer, ethylene/(meth)acrylic acid copolymer, Or isobutylene/maleic acid (anhydride) copolymer, etc. The photosensitive alkali-soluble resin is an alkali-soluble resin having a polymerizable unsaturated group. In addition, the alkali-soluble resin (A) may contain a thermosetting group such as an epoxy group or an oxetanyl group.

From the viewpoint of developability, the weight average molecular weight (Mw) of the alkali-soluble resin (A) is preferably 2,000 to 40,000, more preferably 3,000 to 30,000, and still more preferably 4,000 to 20,000. In addition, the value of Mw/Mn is preferably 10 or less. The moderate weight average molecular weight (Mw) improves the adhesion to the substrate and the solubility for development.

The acid value of the alkali-soluble resin (A) is preferably 50 mgKOH/g to 200 mgKOH/g, more preferably 70 mgKOH/g to 180 mgKOH/g, and still more preferably 90 mgKOH/g to 170 mgKOH/g. With a moderate acid value, adhesion to the substrate and development solubility are improved.

In 100% by mass of non-volatile components of the photosensitive composition, the content of the alkali-soluble resin (A) is preferably 1% to 80% by mass, more preferably 5% to 60% by mass, and even more preferably 10% to 10% by mass. 50% by mass.

The alkali-soluble resin (A) can be used alone or in combination of two or more types.

From the viewpoint of pattern shape and solvent resistance of the coating film, the alkali-soluble resin (A) preferably contains a photosensitive alkali-soluble resin.

(Alkali-soluble resin (A1)) From the viewpoint of pattern shape and solvent resistance of the coating film, the photosensitive composition of the present invention preferably contains an alkali-soluble resin (A1) containing an alicyclic ring as the alkali-soluble resin (A). The monomer unit (a1) of the formula hydrocarbon and the monomer unit (a2) containing a carboxyl group. That is, it is presumed that an alicyclic hydrocarbon structure having a high glass transition temperature and having both flexibility and rigidity can form a strong film with excellent adhesion. Furthermore, it is presumed that by further combining a highly sensitive oxime-based photopolymerization initiator (C1) represented by the general formula (1) and a (low-sensitivity) photopolymerization initiator (low sensitivity) different from the oxime-based photopolymerization initiator (C1) C2) can form a cured film in which tough parts and soft parts coexist, so it can form a film with excellent alkali developability, pattern shape, and solvent resistance.

[Alicyclic hydrocarbon-containing monomer unit (a1)] Examples of monomers containing alicyclic hydrocarbons include: (meth)isobornyl acrylate, (meth)acrylic acid cyclohexyl, (meth)acrylic acid dicyclopentyl ester, (meth)acrylic acid bicyclohexyl Pentenyl ester, dicyclopentyloxyethyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, adamantyl (meth)acrylate, etc. Among these, from the viewpoint of pattern formation, dicyclopentyl (meth)acrylate, dicyclopentenyl (meth)acrylate, and dicyclopentyloxyethyl (meth)acrylate are preferred. ester.

[Carboxyl group-containing monomer unit (a2)] Examples of the carboxyl group-containing monomer include acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid, and the like. In addition, a monomer containing a hydroxyl group and a carboxyl group in the same molecule, such as α-(hydroxymeth)acrylic acid, may be used together. Among these, acrylic acid and methacrylic acid are preferred.

[Other single unit units (a3)] The alkali-soluble resin (A1) may contain other monomer units (a3) in addition to the alicyclic hydrocarbon-containing monomer unit (a1) and the carboxyl group-containing monomer unit (a2).

Examples of other monomers include: (methyl)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, and n-butyl (meth)acrylate , Isobutyl (meth)acrylate, tert-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, stearyl (meth)acrylate, lauryl (meth)acrylate, (meth)acrylate Phenyl acrylate, benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, phenoxydiethylene glycol (meth)acrylate, methoxypolypropylene glycol (meth)acrylate , ethoxypolyethylene glycol (meth)acrylate and other (meth)acrylates; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate or 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate or (meth)acrylic acid 3-hydroxybutyl ester, or 4-hydroxybutyl (meth)acrylate, glycerol mono(meth)acrylate, or cyclohexanedimethanol mono(meth)acrylate and other hydroxyl-containing (methyl) Acrylics; Polyether mono(meth)acrylate obtained by addition polymerization of ethylene oxide, propylene oxide and/or butylene oxide and hydroxyalkyl (meth)acrylate, or polyether mono(meth)acrylate added with polyγ- Polyester mono(meth)acrylates such as valerolactone, polyε-caprolactone, and/or poly12-hydroxystearic acid; Glycidyl (meth)acrylate, methylglycidyl (meth)acrylate, 2-glycidyloxyethyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate and (meth)acrylate (meth)acrylates containing epoxy groups such as 3,4-epoxycyclohexyl acrylate; (Meth)acrylamide, N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N-isopropyl(meth)acrylamide , diacetone (meth)acrylamide, or acrylylmorpholine and other (meth)acrylamides; Styrenes such as styrene or α-methylstyrene; Vinyl ethers such as ethyl vinyl ether, n-propyl vinyl ether, isopropyl vinyl ether, n-butyl vinyl ether, or isobutyl vinyl ether; Fatty acid vinyl esters such as vinyl acetate or vinyl propionate; Phenylmaleimide, methylmaleimide, ethylmaleimide, 1,2-bismaleimideethane, 1,6-bismaleimidehexane, 3-Maleimide propionic acid, 6,7-methylenedioxy-4-methyl-3-maleimide coumarin, 4,4'-bismaleimide diphenyl Methane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, N,N'-1,3-phenylene dimaleimide, N,N'- 1,4-phenylene dimaleimide, N-(1-pyrenyl)maleimide, N-(2,4,6-trichlorophenyl)maleimide, N- (4-Aminophenyl)maleimide, N-(4-nitrophenyl)maleimide, N-benzylmaleimide, N-bromomethyl-2,3- Dichloromaleimide, N-succinimide-3-maleimide benzoate, N-succinimide-3-maleimide propionate, N-succinimide Succinimidyl-4-maleimidobutyrate, N-succinimidyl-6-maleimidecaproate, N-[4-(2-benzimidazolyl)phenyl ] N-substituted maleimines such as maleimine, 9-maleimide acridine; 2-(Meth)acryloxyethyl acid phosphate is obtained by reacting the hydroxyl group of the above-mentioned hydroxyl-containing (meth)acrylate with a phosphoric acid esterification agent such as phosphorus pentoxide or polyphosphoric acid. Compounds such as (meth)acrylates containing phosphate ester groups, etc.

The alkali-soluble resin (A1) only needs to contain an alicyclic hydrocarbon-containing monomer unit (a1) and a carboxyl group-containing monomer unit (a2), and its synthesis method is not limited. Hereinafter, method (i) and method (ii) which are preferred synthesis methods will be described.

＜Method (i)＞ Method (i) For example, the alkali-soluble resin (A1) can be synthesized by synthesizing a copolymer of an alicyclic hydrocarbon-containing monomer and a carboxyl group-containing monomer.

＜Method (ii)＞ Regarding the method (ii), for example, a copolymer of an alicyclic hydrocarbon-containing monomer and an epoxy group-containing monomer is synthesized. Then, a carboxyl group-containing monomer is added to the epoxy group of the copolymer, and the generated hydroxyl group is subjected to an esterification reaction with an acid anhydride, whereby the alkali-soluble resin (A1) can be synthesized.

Examples of the epoxy group-containing monomer include: (glycidylmeth)acrylate, methylglycidyl(meth)acrylate, 2-glycidoxyethyl(meth)acrylate, and (methyl)acrylate. 3,4-epoxybutyl acrylate, and 3,4-epoxycyclohexyl (meth)acrylate. Among these, from the viewpoint of reactivity, glycidyl (meth)acrylate is preferred.

Examples of acid anhydrides include tetrahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, succinic anhydride, maleic anhydride, and the like. These can be used individually or in combination of 2 or more types.

From the viewpoint of the pattern shape and the solvent resistance of the coating film, the content of the alicyclic hydrocarbon-containing monomer unit (a1) in all the structural units of the alkali-soluble resin (A1) is preferably 5 mol % to 60 mol %. Mol%, more preferably 10 mol% to 50 mol%.

From the viewpoint of the pattern shape and the solvent resistance of the coating film, the content of the alkali-soluble resin (A1) in 100 mass% of the alkali-soluble resin (A) is preferably 50 mass% or more, and more preferably 70 mass% or more.

(Alkali-soluble resin (A2)) The photosensitive composition of the present invention may contain an alkali-soluble resin (A2) other than the alkali-soluble resin (A1) as the alkali-soluble resin (A).

[Polymerizable compound (B)] The photosensitive composition of the present invention contains the polymerizable compound (B).

Examples of the polymerizable compound (B) include monomers and oligomers. Examples of the polymerizable unsaturated group include vinyl, (meth)allyl, (meth)acrylyl, (meth)acryloxy, and the like. Examples of the polymerizable compound (B) include a lactone-modified polymerizable compound (B1), a polymerizable compound (B2) having an acid group, and a polymerizable compound (B3) having a urethane bond (where , except (B2)), other polymerizable compounds (B4), etc.

(Lactone-modified polymeric compound (B1)) From the viewpoint of solvent resistance of the coating film, the photosensitive composition of the present invention preferably contains a lactone-modified polymerizable compound (B1).

The lactone-modified polymerizable compound (B1) is a compound having a structure modified with lactone in the molecule. The lactone-modified polymerizable compound (B1) can be obtained by combining trimethylolethane, di-trimethylolethane, trimethylolpropane, di-trimethylolpropane, and pentaerythritol. , tripentaerythritol, glycerin, diglycerol, trimethylol melamine and other polyols are esterified with (meth)acrylic acid and ε-caprolactone or other lactone compounds. The lactone-modified polymerizable compound (B1) is preferably a compound represented by the following general formula (8).

General formula (8) [Chemistry 5]

(In the general formula (8), all six R are groups represented by the following general formula (9), or one to five of the six R are groups represented by the following general formula (9), and the rest are A group represented by the following general formula (10))

General formula (9) [Chemical formula 6]

(In the general formula (9), R ¹ represents a hydrogen atom or a methyl group, m is an integer of 1 or 2, and * is a bond bonded to the oxygen atom of the general formula (8))

General formula (10) [Chemical formula 7]

(In the general formula (10), R ¹ represents a hydrogen atom or a methyl group, and * is a bond bonded to the oxygen atom of the general formula (8))

The lactone-modified polymerizable compound (B1) is commercially available, for example, as the KAYARAD DPCA series manufactured by Nippon Kayaku Co., Ltd., and examples thereof include: DPCA-20 (in the general formula (8) to In the formula (10), m=1, the number of groups represented by the general formula (9)=2, and all R ¹ are hydrogen atoms), DPCA-30 (in the general formula (8) to the general formula ( 10), a compound in which m=1, the number of groups represented by the general formula (9) = 3, and all R ¹ are hydrogen atoms), DPCA-60 (in the general formula (8) to the general formula (10) , m=1, the number of groups represented by the general formula (9) = 6, and all R ¹ are hydrogen atoms), DPCA-120 (in the general formulas (8) to (10), Compounds in which m=2, the number of groups represented by general formula (9)=6, and ^R1 is all hydrogen atoms), etc.

From the viewpoint of the solvent resistance of the coating film, the lactone-modified polymerizable compound (B1) is preferably one in which m=1 and general formula (9) in the general formulas (8) to (10) The number of represented groups is 2 to 6, and all R ¹ are hydrogen atoms. More preferably, the compound represented by general formula (8) to general formula (10), m=1, and general formula (9) A compound in which the number of groups = 2 or 3 and R ¹ is all hydrogen atoms.

From the viewpoint of solvent resistance of the coating film, the content of the lactone-modified polymerizable compound (B1) in 100 mass% of the polymerizable compound (B) is preferably 5 to 80 mass%, and more preferably 10 mass% to 70 mass%, and more preferably 20 mass% to 60 mass%.

(Polymerizable compound (B2) having an acid group) From the viewpoint of alkali developability and pattern shape, the photosensitive composition of the present invention preferably contains the polymerizable compound (B2) having an acid group. Examples of the acid group of the polymerizable compound (B2) having an acid group include a sulfonic acid group, a carboxyl group, a phosphate group, and the like. Among these, a carboxyl group is preferred.

Examples of the polymerizable compound (B2) having an acid group include: esterified products of polyhydric alcohols and free hydroxyl-containing poly(meth)acrylates of (meth)acrylic acid and dicarboxylic acids; polycarboxylic acids and (meth) Esterified products of monohydroxyalkyl acrylate, etc. Examples of the polyhydric alcohol include ethylene glycol, propylene glycol, polyethylene glycol, polypropylene glycol, glycerin, trimethylolpropane, di-trimethylolpropane, pentaerythritol, dipentaerythritol, and the like. Examples of dicarboxylic acids include malonic acid, succinic acid, maleic acid, glutaric acid, phthalic acid, itaconic acid, and the like. Examples of the polycarboxylic acid include trimellitic acid, pyromellitic acid, and the like. Examples of (meth)acrylic acid monohydroxyalkyl esters include: (meth)acrylic acid 2-hydroxyethyl ester, (meth)acrylic acid 2-hydroxypropyl ester, (meth)acrylic acid 2-hydroxybutyl ester, (meth)acrylic acid 2-hydroxybutyl ester, (meth)acrylic acid 2-hydroxyalkyl ester, base) 4-hydroxybutyl acrylate, pentaerythritol triacrylate, 2-hydroxy-3-acrylyloxypropyl methacrylate, etc.

Commercially available products of the polymerizable compound (B2) having an acid group include: Viscoat #2500P manufactured by Osaka Organic Co., Ltd., Aronix M-5300 manufactured by Toa Gosei Co., Ltd., Aronix ) M-5400, Aronix M-5700, Aronix M-510, Aronix M-520, Aronix M-521, etc.

From the viewpoint of alkali developability and pattern shape, the content of the polymerizable compound (B2) having an acid group in 100% by mass of the polymerizable compound (B) is preferably 5 to 80% by mass, and more preferably 10% by mass. mass% to 70 mass%, and more preferably 20 mass% to 60 mass%.

(Polymerizable compound (B3) having a urethane bond) From the viewpoints of alkali developability, pattern shape, and solvent resistance of the coating film, the photosensitive composition of the present invention preferably contains the polymerizable compound (B3) having a urethane bond.

Examples of the polymerizable compound (B3) having a urethane bond include urethane (meth)acrylate obtained by reacting (meth)acrylate having a hydroxyl group and a polyfunctional isocyanate, or Urethane (meth)acrylate obtained by reacting a polyol with a polyfunctional isocyanate and further reacting with a (meth)acrylate having a hydroxyl group, etc.

Examples of the (meth)acrylate having a hydroxyl group include: (2-hydroxyethylmeth)acrylate, 4-hydroxybutyl (meth)acrylate, trimethylolpropane di(meth)acrylate, Pentaerythritol tri(meth)acrylate, di-trimethylolpropane tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol ethylene oxide modified penta(meth)acrylate, Dipentaerythritol propylene oxide modified penta(meth)acrylate, dipentaerythritol caprolactone modified penta(meth)acrylate, glyceryl acrylate methacrylate, glyceryl dimethacrylate, methacrylic acid 2- Hydroxy-3-acrylylpropyl ester, reaction product of epoxy group-containing compound and carboxyl (meth)acrylate, hydroxyl-containing polyol polyacrylate, etc.

Examples of the polyfunctional isocyanate include toluene diisocyanate, diphenylmethylene diisocyanate, and xylene diisocyanate as aromatic diisocyanates, and trimethylene diisocyanate and tetramethylene diisocyanate as aliphatic diisocyanates. Isocyanate, hexamethylene diisocyanate, isophorone diisocyanate which is an alicyclic diisocyanate, or these biuret forms, isocyanurate forms, trimethylolpropane adducts, etc.

From the viewpoint of developability, it is further preferred that the polymerizable compound (B3) having a urethane bond has an acid group. Examples of the acid group include a sulfonic acid group, a carboxyl group, a phosphate group, and the like. Among them, a carboxyl group is preferred.

A method of introducing an acid group into the polymerizable compound (B3) having a urethane bond can be synthesized, for example, by reacting the (meth)acrylate having a hydroxyl group with the polyfunctional isocyanate. , and then a mercapto compound having a carboxyl group is added to the product.

Examples of the mercapto compound having a carboxyl group include thioglycolic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, o-mercaptobenzoic acid, 2-mercaptonicotinic acid, mercaptosuccinic acid, and the like.

From the viewpoint of alkali developability, pattern shape, and solvent resistance of the coating film, the content of the polymerizable compound (B3) having a urethane bond and an acid group in 100% by mass of the polymerizable compound (B) The content is preferably from 5% to 80% by mass, more preferably from 10% to 70% by mass, and even more preferably from 20% to 60% by mass.

(Other polymerizable compounds (B4)) Examples of other polymerizable compounds (B4) include: (methyl)acrylate, ethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, ( Cyclohexyl methacrylate, β-carboxyethyl (meth)acrylate, polyethylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, triethylene glycol Di(meth)acrylate, polypropylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, phenoxytetraethylene glycol (meth)acrylate, phenoxyhexaethyl Glycol (meth)acrylate, trimethylolpropane propylene oxide (PO) modified tri(meth)acrylate, trimethylolpropane ethylene oxide (EO) modified Tri(meth)acrylate, isocyanuric acid EO modified di(meth)acrylate, isocyanuric acid EO modified tri(meth)acrylate, di-trimethylolpropane tetra(meth)acrylate Acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, 1,6-hexanediol diglycidyl ether di(meth)acrylate, bisphenol A diglycidyl ether di(meth)acrylate acrylate, neopentyl glycol diglycidyl ether di(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, tricyclodecyl(meth)acrylic acid ester, (meth)acrylate of hydroxymethylated melamine, epoxy (meth)acrylate, urethane acrylate and other acrylates and methacrylates, styrene, vinyl acetate, hydroxyethyl vinyl ether, ethylene glycol divinyl ether, pentaerythritol trivinyl ether, (meth)acrylamide, N-hydroxymethyl(meth)acrylamide, N-vinylformamide, acrylonitrile wait.

Examples of commercially available products of other polymerizable compounds (B4) include: KAYARAD R-128H, KAYARAD R526, KAYARAD PEG400DA manufactured by Nippon Kayaku Co., Ltd. KAYARAD MAND, KAYARAD NPGDA, KAYARAD R-167, KAYARAD HX-220, KAYARAD R-551 , KAYARAD R712, KAYARAD R-604, KAYARAD R-684, KAYARAD GPO-303, KAYARAD TMPTA, KAYARAD DPHA, KAYARAD DPEA-12, KAYARAD DPHA-2C, KAYARAD D-310, KAYARAD ) D-330, and Aronix M-303, Aronix M-305, Aronix M-306, and Aronix M-309 manufactured by Toagosei Corporation , Aronix M-310, Aronix M-321, Aronix M-325, Aronix M-350, Aronix M-360 , Aronix M-313, Aronix M-315, Aronix M-400, Aronix M-402, Aronix M-403 , Aronix M-404, Aronix M-405, Aronix M-406, Aronix M-450, Aronix M-452 , Aronix M-408, Aronix M-211B, Aronix M-101A, Viscoat #310HP, Viscoat# manufactured by Osaka Organic Company 335HP, Viscoat #700, Viscoat #295, Viscoat #330, Viscoat #360, Viscoat #GPT, Viscoat #400, Viscoat #405, AH-600, AT-600 manufactured by Kyeisha Chemical Co., Ltd., NK ester A-9300, NK ester ABE-300, NK manufactured by Shin Nakamura Chemical Co., Ltd. Ester (NK ester) A-DOG, NK ester (NK ester) A-DCP, NK ester (NK ester) A-BPE-4, Eberoclita (NK ester) manufactured by Daicel-Allnex Company EBECRYL) 40, EBECRYL 130, EBECRYL 140, EBECRYL 145, OGSOL EA-0200, OGSOL manufactured by Osaka Gas Chemical Co., Ltd. (OGSOL) 0300 etc.

The polymerizable compound (B) can be used alone or in combination of two or more types.

From the viewpoint of alkali developability, pattern shape, and solvent resistance of the coating film, the polymerizable compound (B) is preferably selected from the group consisting of a lactone-modified polymerizable compound (B1) and a polymerizable compound having an acid group. (B2), and more preferably two or more types of the group consisting of the polymerizable compound (B3) having a urethane bond.

The content of the polymerizable compound (B) is preferably 1 to 60 mass%, and more preferably 2 to 50 mass% in 100 mass% of nonvolatile components of the photosensitive composition.

[Sensitizer (D)] From the viewpoint of pattern shape, the photosensitive composition of the present invention preferably contains a sensitizer (D).

Examples of the sensitizer (D) include: unsaturated ketones represented by chalcone compounds and dibenzalacetone; 1,2-dibenzoyl compounds represented by benzoyl and camphorquinone; Ketone compounds, benzoin-based compounds, fluorene-based compounds, naphthoquinone-based compounds, anthraquinone-based compounds, xanthene-based compounds, thianthene-based compounds, xanthone-based compounds, thioxanthone-based compounds, coumarin compounds, ketocoumarin-based compounds, cyanine-based compounds, merocyanine-based compounds, oxocyanine-based compounds and other polymethine pigments, acridine-based compounds, azine-based compounds, thiazine-based compounds, oxanine-based compounds Azine-based compounds, indoline-based compounds, azulene-based compounds, azulenium-based compounds, squarylium-based compounds, porphyrin-based compounds, tetraphenylporphyrin-based compounds, triarylmethane-based compounds, tetraphenyl Porphyrin-based compounds, tetrapyrazinoporphyrazine-based compounds, phthalocyanine-based compounds, tetraazaporphyrazine-based compounds, tetraquinoxalinoporphyrazine-based compounds, naphthalocyanine-based compounds, Subphthalocyanine compounds, pyranium compounds, thiopyrylium compounds, tetraphyrin compounds, annulene compounds, spiropyran compounds, spirooxazine compounds, sulfur Spiropyran compounds, metal aromatic hydrocarbon complexes, organic ruthenium complexes, or benzophenone compounds, etc. Among these, from the viewpoint of pattern formation properties, the thioxanthone compound (D1) or the benzophenone compound (D2) is preferable, and the benzophenone compound (D2) is more preferable.

(Thiaxantrone-based compound (D1)) Examples of the thioxanthone-based compound (D1) include 2,4-diethyl thioxanthone, 2-chlorothioxanthone, 2,4-dichlorothioxanthone, and 2-isopropylsulfonate. Heteranthrone, 4-isopropyl thioxanthone, 1-chloro-4-propoxy thioxanthone, etc. Among these, 2,4-diethylthianthone is preferred.

(Benzophenone compound (D2)) Examples of the benzophenone compound (D2) include 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 2- Aminobenzophenones, etc. Among these, 4,4'-bis(diethylamino)benzophenone is preferred.

The sensitizer (D) can be used individually or in combination of 2 or more types.

From the viewpoint of the pattern shape, the content of the sensitizer (D) is preferably 5 to 300 parts by mass, and more preferably 10 to 200 parts by mass relative to 100 parts by mass of the photopolymerization initiator (C).

[thiol tether transfer agent (E)] From the viewpoint of coating film resistance, the photosensitive composition of the present invention preferably contains a thiol chain transfer agent (E).

The thiol chain transfer agent (E) is preferably a polyfunctional thiol having two or more thiol groups (SH groups). Furthermore, the thiol chain transfer agent more preferably has four or more SH groups. When the number of functional groups increases, photohardening from the surface to the deepest part of the film becomes easier.

Examples of polyfunctional thiols include hexanedithiol, decanedithiol, 1,4-butanediol disulfidepropionate, 1,4-butanediol disulfideglycolate, and ethylene glycol disulfide. Glycolate, ethylene glycol dithiopropionate, trimethylolpropane trithioglycolate, trimethylolpropane trithiopropionate, trimethylolpropane tris(3-mercaptobutanate) acid ester), pentaerythritol tetrathioglycolate, pentaerythritol tetrathiopropionate, trimercaptopropionate tris(2-hydroxyethyl)isocyanurate, 1,4-dimethylmercaptobenzene, 2, 4,6-trimercapto-s-triazine, 2-(N,N-dibutylamino)-4,6-dimercapto-s-triazine, etc. Preferred examples include ethylene glycol bisthiopropionate , trimethylolpropane trithiopropionate, pentaerythritol tetrathiopropionate, etc.

The thiol chain transfer agent (E) can be used alone or in combination of two or more.

The content of the thiol chain transfer agent (E) is preferably 1 to 10 mass%, and more preferably 2 to 8 mass% in 100 mass% of the nonvolatile components of the photosensitive composition.

[Coloring agent (F)] The photosensitive composition of the present invention may contain a colorant (F). The coloring agent (F) may be either a pigment or a dye, and may be used in combination.

(pigment) Pigments exemplify compounds classified as pigments in the Color Index. Examples of red pigments include: C.I. Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32 ,37,38,41,47,48,48:1,48:2,48:3,48:4,49,49:1,49:2,50:1,52:1,52:2,53 ,53:1,53:2,53:3,57,57:1,57:2,58:4,60,63,63:1,63:2,64,64:1,68,69,81 ,81:1,81:2,81:3,81:4,83,88,90:1,101,101:1,104,108,108:1,109,112,113,114,122,123 ,144,146,147,149,151,166,168,169,170,172,173,174,175,176,177,178,179,181,184,185,187,188,190,193,194 ,200,202,206,207,208,209,210,214,216,220,221,224,230,231,232,233,235,236,237,238,239,242,243,245,247 ,249,250,251,253,254,255,256,257,258,259,260,262,263,264,265,266,267,268,269,270,271,272,273,274,275 , 276, 277, 278, 279, 280, 281, 282, 283, 284, 285, 286, 287, 291, 295, 296, pigments described in Japanese Patent Laid-Open No. 2014-134712, Japanese Patent No. 6368844 Pigments, etc. described in the gazette. Among these, from the viewpoint of heat resistance, light resistance, and transmittance, C.I. Pigment Red 48: 1, 122, 177, 224, 242, 269, 254, 291, 295, 296, Japanese Patent Laid-Open 2014 -134712, the pigment described in Japanese Patent No. 6368844, more preferably C.I. Pigment Red 177, 254, 291, 295, 296, the pigment described in Japanese Patent Laid-Open No. 2014-134712, Pigments described in Japanese Patent No. 6368844.

Examples of orange pigments include C.I. Pigment Orange 36, 38, 43, 64, 71, 73, and the like.

Examples of yellow pigments include: C.I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 12, 13, 14, 15, 16, 17, 18, 24, 31, 32, 34, 35 ,35:1,36,36:1,37,37:1,40,42,43,53,55,60,61,62,63,65,73,74,77,81,83,93,94 ,95,97,98,100,101,104,106,108,109,110,113,114,115,116,117,118,119,120,123,126,127,128,129,138,139 ,147,150,151,152,153,154,155,156,161,162,164,166,167,168,169,170,171,172,173,174,175,176,177,179,180 , 181, 182, 185, 187, 188, 192, 193, 194, 196, 198, 199, 213, 214, 231, 233, pigments described in Japanese Patent Laid-Open No. 2012-226110, etc. Among these, the pigments described in C.I. Pigment Yellow 138, 139, 150, 185, 231, 233 and Japanese Patent Application Laid-Open No. 2012-226110 are preferred.

Examples of green pigments include: C.I. Pigment Green 1, 2, 4, 7, 8, 10, 13, 14, 15, 17, 18, 19, 26, 36, 37, 45, 48, 50, 51 , 54, 55, 58, 59, 62, 63, etc. Among these, C.I. Pigment Green 36, 58, 59, 62, and 63 are preferred.

Examples of blue pigments include: C.I. pigment blue 1, 1:2, 9, 14, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 17, 19, 25, 27, 28, 29, 33, 35, 36, 56, 56: 1, 60, 61, 61: 1, 62, 63, 66, 67, 68, 71, 72, 73, 74, 75, 76, 78, 79, etc. Among these, C.I. Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, and 15:6 are preferred.

Examples of purple pigments include: C.I. Pigment Violet (pigment violet) 1, 1:1, 2, 2:2, 3, 3:1, 3:3, 5, 5:1, 14, 15, 16, 19, 23 , 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49, 50, etc. Among these, C.I. Pigment Violet 19 and 23 are preferred.

Specific examples of the black pigment include: C.I. pigment black (pigment black) 1, 6, 7, 12, 20, 31, etc. In addition, at least two or more pigments selected from the group consisting of red pigments, yellow pigments, blue pigments, green pigments, and purple pigments may be used as the black colorant.

Among the pigments, examples of inorganic pigments include titanium oxide, barium sulfate, zinc white, lead sulfate, chromium yellow, zinc yellow, iron oxide (red iron (III) oxide), cadmium red, ultramarine blue, Prussian blue, chromium oxide green, Cobalt green, umber, synthetic iron black, etc.

(dye) Examples of dyes include acid dyes, direct dyes, basic dyes, salt-forming dyes, oil-soluble dyes, disperse dyes, reactive dyes, mordant dyes, vat dyes, sulfur dyes, and the like. In addition, derivatives of these and lake pigments obtained by lake-forming dyes are also included.

The acid dye preferably has an acidic group such as a sulfonic acid group or a carboxyl group. In addition, a salt-forming compound is preferably a salt of an acidic dye and a nitrogen-containing compound such as a quaternary ammonium salt compound, a tertiary amine compound, a secondary amine compound or a primary amine compound. In addition, a salt-forming compound that is a salt of a resin component having these functional groups and an acidic dye is also preferred. In addition, the salt-forming compound is modified into a sulfonamide compound by sulfonamidation, whereby a photosensitive composition excellent in resistance (light resistance, solvent resistance) can be easily obtained. In addition, a salt-forming compound of an acid dye and a compound having an onium salt group is also preferred because of its excellent resistance (light resistance, solvent resistance). Furthermore, the compound having an onium salt group is preferably a resin having a cationic group.

The basic dye can be used as it is, but it is preferably a salt-forming compound that forms a salt with an organic acid or perchloric acid or a metal salt thereof. Salt-forming compounds of basic dyes are preferred because they have excellent resistance (light resistance, solvent resistance) or affinity with pigments. In addition, among the salt-forming compounds of basic dyes, the anionic component functioning as a counterion is preferably an organic sulfonic acid, an organic sulfuric acid, a fluorine group-containing phosphorus anion compound, a fluorine group-containing boron anion compound, or a cyano group-containing anion compound. A salt-forming compound obtained by salting a nitrogen anion compound, an anionic compound containing a conjugate base of an organic acid having a halogenated hydrocarbon group, and an acidic dye. In addition, if the salt-forming compound contains a polymerizable unsaturated group in the molecule, the resistance will be further improved.

Examples of the chemical structure of the dye include those selected from the group consisting of azo dyes, disazo dyes, azomethine dyes (indoaniline dyes, indophenol dyes, etc.), dipyrrolynes Methyl dyes, quinone dyes (benzoquinone dyes, naphthoquinone dyes, anthraquinone dyes, anthrapyridone dyes, etc.), carbonium dyes (diphenylmethane dyes, triphenyl dyes, etc.) Methane dyes, xanthene dyes, acridine dyes, etc.), quinone imine dyes (oxazine dyes, thiazine dyes, etc.), azine dyes, polymethine dyes (oxocyanine dyes, etc.) dyes, merocyanine dyes, arylidene dyes, styrene-based dyes, cyanine dyes, squarylium dyes, croconium dyes, etc.), quinophthalone Dyes, phthalocyanine dyes, subphthalocyanine dyes, ionone dyes, indigo dyes, thioindigo dyes, quinoline dyes, nitro dyes, nitroso dyes, rhodamine (rhodamine)-based dyes and these metal complex-based dyes are pigment structures of dyes, but are not particularly limited to these.

Among these dye structures, from the viewpoint of color characteristics such as hue, color separability, and color unevenness, those derived from azo dyes, xanthene dyes, cyanine dyes, and triphenylmethane dyes are preferred. , anthraquinone-based dyes, dipyrromethene-based dyes, squarylium-based dyes, quinophthalone-based dyes, phthalocyanine-based dyes, and subphthalocyanine-based dyes, more preferably, the pigment structure is derived from selected Pigment structure derived from xanthene-based dyes, cyanine-based dyes, triphenylmethane-based dyes, anthraquinone-based dyes, dipyrromethene-based dyes, and phthalocyanine-based dyes.

The coloring agent (F) can be used alone or in combination of two or more types.

The content of the colorant (F) is preferably 5% to 70% by mass, and more preferably 10% to 60% by mass in 100% by mass of nonvolatile components of the photosensitive composition.

(Miniaturization of pigments) The pigment is preferably used after being finely divided. The method of miniaturization is not particularly limited, and for example, any of wet grinding, dry grinding, and dissolution and precipitation methods can be used. Among these, salt milling treatment using a kneader method, which is one type of wet grinding, is preferred. The average primary particle size of the finely divided pigment measured using a transmission electron microscope (TEM) is preferably 5 nm to 90 nm. In addition, from the viewpoint of dispersion and contrast ratio, the average primary particle diameter is more preferably 10 nm to 70 nm.

The so-called salt mill treatment refers to the following treatment: using a kneader, two-rod roll mill, three-rod roll mill, ball mill, grinding A mixture of pigments, water-soluble inorganic salts, and water-soluble organic solvents is mechanically kneaded with an attritor, sand mill, etc. while heating, and then washed with water to remove the water-soluble inorganic salts and water-soluble organic solvents. Water-soluble organic solvent. Water-soluble inorganic salts function as crushing aids. The high hardness of the inorganic salts is used to crush the pigments during salt grinding. By optimizing the conditions for salt milling treatment of pigments, it is possible to obtain pigments that have a very fine primary particle size, a narrow distribution range, and a sharp fine distribution.

Examples of water-soluble inorganic salts include sodium chloride, potassium chloride, sodium sulfate, etc. In terms of price, the water-soluble inorganic salt is preferably sodium chloride (table salt). In terms of both processing efficiency and production efficiency, the usage amount of the water-soluble inorganic salt is preferably 50 to 2,000 parts by mass, and more preferably 300 to 1,000 parts by mass relative to 100 parts by mass of the pigment.

The water-soluble organic solvent functions to moisten the pigment and the water-soluble inorganic salt, and is a solvent that dissolves (mixes) in water and does not substantially dissolve the inorganic salt used. However, since the temperature rises during salt milling and the solvent easily evaporates, a high boiling point solvent having a boiling point of 120° C. or higher is preferred from the viewpoint of safety. For example, 2-methoxyethanol, 2-butoxyethanol, 2-(isoamyloxy)ethanol, 2-(hexyloxy)ethanol, diethylene glycol, diethylene glycol monoethyl ether, Diethylene glycol monobutyl ether, triethylene glycol, triethylene glycol monomethyl ether, liquid polyethylene glycol, 1-methoxy-2-propanol, 1-ethoxy-2-propanol , dipropylene glycol, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, liquid polypropylene glycol, etc. The usage amount of the water-soluble organic solvent is preferably 5 to 1,000 parts by mass, and more preferably 50 to 500 parts by mass relative to 100 parts by mass of the pigment.

During the salt grinding process, resin can be added as needed. The type of the resin is not particularly limited, and examples include natural resin, modified natural resin, synthetic resin, synthetic resin modified by natural resin, and the like. Among these, those that are solid at room temperature and water-insoluble are preferred, and those that are partially soluble in the organic solvent are preferred. The added amount of the resin is preferably 2 to 200 parts by mass relative to 100 parts by mass of the pigment.

[Pigment Derivatives (G)] The photosensitive composition of the present invention may contain a dye derivative (G).

The dye derivative (G) is a compound having an acidic group, a basic group, a neutral group, etc. in the organic dye residue. Examples of the dye derivative (G) include compounds having an acidic substituent such as a sulfo group, a carboxyl group, and a phosphate group; and amine salts of these or compounds having a basic substituent such as a sulfonamide group or a tertiary amine group at the terminal Compounds; compounds with neutral substituents such as phenyl or phthalimide alkyl groups. Examples of organic pigments include: diketopyrrolopyrrole pigments, anthraquinone pigments, quinacridone pigments, dioxazine pigments, ionone pigments, perylene pigments, thiazide-indigo pigments, and trioxazine pigments. Indole pigments such as oxazine pigments, benzimidazolone pigments, and benzisoindole; isoindoline pigments, isoindolinone pigments, quinphthalone pigments, naphthol pigments, and reducing pigments Pigments, metal complex pigments, azo pigments such as azo, disazo, polyazo, etc.

Specific examples include known dye derivatives described in the following publications, etc. Examples of diketopyrrolopyrrole dye derivatives include: Japanese Patent Application Laid-Open No. 2001-220520, International Publication No. 2009/081930, International Publication No. 2011/052617, International Publication No. 2012/102399, Japanese Patent Publication No. 2017-156397; examples of phthalocyanine pigment derivatives include: Japanese Patent Publication No. 2007-226161, International Publication No. 2016/ 163351, Japanese Patent Application Publication No. 2017-165820, Japanese Patent Application Publication No. 5753266; examples of anthraquinone pigment derivatives include: Japanese Patent Application Publication No. 63-264674, Japanese Patent Application Publication No. 09-272812, Japanese Patent Application Publication No. 10-245501, Japanese Patent Application Publication No. 10-265697, Japanese Patent Application Publication No. 2007-079094, International Publication No. 2009/025325; examples of quinacridone pigment derivatives include: Japan Japanese Patent Application Publication No. Sho 48-54128, Japanese Patent Application Publication No. 03-9961, and Japanese Patent Application Publication No. 2000-273383; examples of the dioxazine-based pigment derivatives include Japanese Patent Application Publication No. 2011-162662; Examples of the indigo-based pigment derivatives include Japanese Patent Application Laid-Open No. 2007-314785; examples of triazine-based pigment derivatives include Japanese Patent Application Publication No. Sho 61-246261, Japanese Patent Application Publication No. 11-199796, and Japanese Patent Application Publication No. 11-199796. Japanese Patent Laid-Open No. 2003-165922, Japanese Patent Laid-Open No. 2003-168208, Japanese Patent Laid-Open No. 2004-217842, Japanese Patent Laid-Open No. 2007-314681; examples of the benzoisoindole-based pigment derivatives include Japan Japanese Patent Application Publication No. 2009-57478; quinophthalone-based pigment derivatives include: Japanese Patent Application Publication No. 2003-167112, Japanese Patent Application Publication No. 2006-291194, Japanese Patent Application Publication No. 2008-31281, Japan Japanese Patent Application Publication No. 2012-226110; naphthol-based pigment derivatives include: Japanese Patent Application Publication No. 2012-208329 and Japanese Patent Application Publication No. 2014-5439; azo-based pigment derivatives include: Japanese Patent Application Publication No. Japanese Patent Application Publication No. 2001-172520 and Japanese Patent Application Publication No. 2012-172092; examples of acidic substituents include Japanese Patent Application Publication No. 2004-307854; examples of basic substituents include Japanese Patent Application Publication No. 2002-201377 and Japan Japanese Patent Application Publication No. 2003-171594, Japanese Patent Application Publication No. 2005-181383, and Japanese Patent Application Publication No. 2005-213404. In addition, in these documents, the pigment derivative may be described as a derivative, a pigment derivative, a dispersant, a pigment dispersant, or simply a compound, etc. However, the organic pigment residue described above has an acidic group. , basic group, neutral group and other substituent compounds have the same meaning as pigment derivatives.

The pigment derivative (G) can be used alone or in combination of two or more types.

The content of the pigment derivative (G) is preferably 1 to 20 parts by mass, and more preferably 2 to 10 parts by mass relative to 100 parts by mass of the colorant (F).

[Dispersion resin (H)] The photosensitive composition of the present invention may contain dispersion resin (H).

The dispersion resin (H) is preferably a resin having an adsorption group with high affinity for the colorant (F). The adsorption group preferably has one or more types of a basic group and an acidic group, and from the viewpoint of developability, it is preferable that it has an acidic group.

Examples of the basic group include a primary amine group, a secondary amine group, a tertiary amine group, a quaternary ammonium salt group, a nitrogen atom-containing group such as a nitrogen-containing heterocycle, and the like.

Examples of acidic groups include carboxyl groups, phosphate groups, sulfonic acid groups, and the like. Among these, a carboxyl group and a phosphate group are preferred from the viewpoint of adsorption to pigments and developability.

Examples of resin types of the dispersion resin (H) include: urethane resin; polycarboxylate esters such as polyacrylate, unsaturated polyamide, polycarboxylic acid, polycarboxylic acid (partial) amine salt, and polycarboxylic acid Ammonium salts, polycarboxylic acid alkylamine salts, polysiloxanes, long-chain polyaminoamide phosphates, hydroxyl-containing polycarboxylic acid esters, or modifications of these; by poly(lower alkylene imine ) and polyester having free carboxyl groups formed by the reaction of amide or its salt, etc.; (meth)acrylic acid-styrene copolymer, (meth)acrylic acid-(meth)acrylate copolymer, styrene- Maleic acid copolymer, polyvinyl alcohol, polyvinylpyrrolidone and other water-soluble resins or water-soluble polymer compounds; polyester series, modified polyacrylate series, ethylene oxide/propylene oxide addition compounds, phosphate ester series wait.

Examples of the molecular structure of the dispersion resin (H) include a random structure, a block structure, a graft structure, a comb structure, a star structure, and the like. Among these, a block structure or a comb structure is preferred from the viewpoint of dispersion stability.

Examples of commercially available dispersion resins (H) include Disperbyk-101, Disperbyk-103, and Disperbyk manufactured by BYK-Chemie Japan. Disperbyk-107, Disperbyk-108, Disperbyk-110, Disperbyk-111, Disperbyk -116, Disperbyk -130, Disperbyk -140, Disperbyk -154, Disperbyk -161, Disper Disperbyk-162, Disperbyk-163, Disperbyk-164, Disperbyk-165, Disperbyk- 166.Disperbyk-167.Disperbyk-168.Disperbyk-170.Disperbyk-171.Disperbyk Disperbyk-174, Disperbyk-180, Disperbyk-181, Disperbyk-182, Disperbyk-183 , Disperbyk (Disperbyk)-184, Disperbyk (Disperbyk)-185, Disperbyk (Disperbyk)-190, Disperbyk (Disperbyk)-2000, Disperbyk (Disperbyk)-2001, Disperbyk (Disperbyk)-2009, Disperbyk (Disperbyk)-2010, Disperbyk (Disperbyk)-2020, Disperbyk (Disperbyk)-2025, Disperbyk-2050, Disperbyk-2070, Disperbyk-2095, Disperbyk-2150, Disperbyk ( Disperbyk-2155, Disperbyk-2163, Disperbyk-2164, or Anti-Terra-U203, Anti-Terra- U204, or BYK-P104, BYK-P104S, BYK-220S, or Lactimon, Lactimon-WS or Bykumen, etc., manufactured by Lubrizol Corporation of Japan SOLSPERSE-3000, SOLSPERSE-9000, SOLSPERSE-13000, SOLSPERSE-13240, SOLSPERSE-13650, SOLSPERSE-13940, SOLSPERSE-16000, SOLSPERSE-17000, SOLSPERSE-18000, SOLSPERSE-20000, SOLSPERSE-21000, SOLSPERSE-24000, SOLSPERSE-26000, SOLSPERSE-27000, SOLSPERSE-28000, SOLSPERSE-31845, SOLSPERSE-32000, SOLSPERSE-32500, SOLSPERSE-32550, SOLSPERSE-33500, SOLSPERSE-32600, SOLSPERSE-34750, SOLSPERSE-35100, SOLSPERSE-36600, SOLSPERSE-38500, SOLSPERSE-41000, SOLSPERSE-41090, SOLSPERSE-53095, SOLSPERSE-55000, SOLSPERSE-56000, SOLSPERSE-76500, etc., EFKA-46, EFKA-47, EFKA-48, EFKA manufactured by BASF Japan (EFKA)-452, EFKA (EFKA)-4008, EFKA (EFKA)-4009, EFKA (EFKA)-4010, EFKA (EFKA)-4015, EFKA (EFKA)-4020 , EFKA (EFKA)-4047, EFKA (EFKA)-4050, EFKA (EFKA)-4055, EFKA (EFKA)-4060, EFKA (EFKA)-4080, EFKA ( EFKA)-4400, EFKA-4401, EFKA-4402, EFKA-4403, EFKA-4406, EFKA-4408, EFKA-4300, EFKA-4310, EFKA-4320, EFKA-4330, EFKA-4340, EFKA )-450, EFKA-451, EFKA-453, EFKA-4540, EFKA-4550, EFKA-4560, EFKA-4800, EFKA-5010, EFKA-5065, EFKA-5066, EFKA-5070, EFKA -7500, EFKA (EFKA) -7554, EFKA (EFKA) -1101, EFKA (EFKA) -120, EFKA (EFKA) -150, EFKA (EFKA) -1501, EFKA EFKA-1502, EFKA-1503, etc., Ajisper PA111, Ajisper PB711, Ajisper manufactured by Ajinomoto Fine-Techno Ajisper PB821, Ajisper PB822, Ajisper PB824, etc., Japanese Patent Application Publication No. 2008-029901, Japanese Patent Application Publication No. 2009-155406, Japanese Patent Application Publication No. Publication No. 2010-185934, Japanese Patent Publication No. 2011-157416, International Publication No. 2008/007776, Japanese Patent Publication No. 2008-029901, Japanese Patent Publication No. 2009-155406, Japanese Patent Publication No. 2010 -Resins described in Japanese Patent Application Publication No. 185934, Japanese Patent Application Publication No. 2011-157416, Japanese Patent Application Publication No. 2009-251481, Japanese Patent Application Publication No. 2007-23195, Japanese Patent Application Publication No. 1996-143651, etc.

The dispersion resin (H) can be used alone or in combination of two or more types.

From the viewpoint of dispersion stability, the content of the dispersion resin (H) is preferably 3 to 200 parts by mass, and more preferably 5 to 100 parts by mass relative to 100 parts by mass of the colorant (F).

[Thermosetting compound (I)] The photosensitive composition of the present invention may contain a thermosetting compound (I). Accordingly, the thermosetting compound (I) reacts in the heating step and the cross-linking density increases, thereby improving the heat resistance.

The thermosetting compound (I) may be a low molecular compound or a high molecular compound such as resin. Examples of the thermosetting compound (I) include epoxy compounds, oxetane compounds, benzoguanamine compounds, rosin-modified maleic acid compounds, rosin-modified fumaric acid compounds, melamine compounds, and urea compounds. and phenolic compounds. Among these, epoxy compounds and oxetane compounds are preferred.

(Epoxy compound (I1)) Examples of the epoxy compound (I1) include bisphenols (bisphenol A, bisphenol F, bisphenol S, bisphenol, bisphenol AD, etc.), phenols (phenol, alkyl-substituted phenol, aromatic substituted phenol, Naphthol, alkyl-substituted naphthol, dihydroxybenzene, alkyl-substituted dihydroxybenzene, dihydroxynaphthalene, etc.) and various aldehydes (formaldehyde, acetaldehyde, alkyl aldehydes, benzaldehyde, alkyl-substituted benzaldehyde, hydroxybenzaldehyde , naphtaldehyde, glutaraldehyde, o-phthalaldehyde, crotonaldehyde, cinnamaldehyde, etc.); phenols and various diene compounds (dicyclopentadiene, terpenes, vinylcyclohexene, norbornyl Polymers of dienes, vinylnorbornene, tetrahydroindene, divinylbenzene, divinylbiphenyl, diisopropenylbiphenyl, butadiene, isoprene, etc.); phenols and ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone, acetophenone, benzophenone, etc.); phenols and aromatic dimethyl alcohols (phenylene glycol, α, α, α', Condensation polymers of α'-benzenedimethanol, biphenyl dimethanol, α,α,α',α'-biphenyl dimethanol, etc.); phenols and aromatic dichloromethyls (α,α'-dichloromethyl Condensation polymers of xylene, dichloromethylbiphenyl, etc.); condensation polymers of bisphenols and various aldehydes; glycidyl ether-based epoxy resins and alicyclic epoxy resins obtained by glycidifying alcohols, etc. , heterocyclic epoxy resin, aliphatic epoxy resin, glycidyl amine epoxy resin, glycidyl ester epoxy resin, etc.

Examples of commercially available products include: EPICOAT 807, EPICOAT 815, EPICOAT 825, and EPICOAT 827 manufactured by Oil Case Epoxy Company , EPICOAT 828, EPICOAT 190P, EPICOAT 191P, TECHMORE VG3101L manufactured by Mitsui Chemicals, EPPN-201 manufactured by Nippon Chemical Company , EPPN-501H, EPPN-502H, EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1020, EPICOAT 1004, EPICOAT 1256, manufactured by Japan Epoxy Resin Company JER1032H60, JER157S65, JER157S70, JER152, JER154, CELLOXIDE 2021 and EHPE-3150 manufactured by Daicel Chemical Industries, Ltd., DENACOL manufactured by Nagase ChemteX EX-211, DENACOL EX-212, DENACOL EX-252, DENACOL EX-313, DENACOL EX-314, DENACOL DENACOL EX-321, DENACOL EX-411, DENACOL EX-421, DENACOL EX-512, DENACOL EX -521, DENACOL EX-611, DENACOL EX-612, DENACOL EX-614, DENACOL EX-614B, DENACOL DENACOL EX-622, DENACOL EX-711, DENACOL EX-721, TEPIC-L, TEPIC manufactured by Nissan Chemical Industries, Ltd. )-H, TEPIC-S, etc.

From the viewpoint of the heat resistance of the cured film, the content of the epoxy compound (I1) is preferably 0.5 to 50 mass%, and more preferably 1 to 50 mass% in 100% by mass of non-volatile components of the photosensitive composition. 40% by mass.

(Oxetane compound (I2)) The oxetane compound (I2) is a known compound having an oxetanyl group. Examples of the oxetane compound include monofunctional oxetane compounds, difunctional oxetane compounds, and trifunctional or higher functional oxetane compounds.

Examples of monofunctional oxetane compounds include (3-ethyloxetan-3-yl)methyl acrylate and (3-ethyloxetan-3-yl)methyl methacrylate. Ester, 3-ethyl-3-hydroxymethyloxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-( Phenoxymethyl)oxetane, 3-ethyl-3-(2-methacryloxymethyl)oxetane, 3-ethyl-3-{[3-(tri Ethoxysilyl)propoxy]methyl}oxetane, etc.

Examples of commercially available products include OXE-10 and OXE-30 manufactured by Osaka Organic Chemical Industry Co., Ltd., OXT-101 and OXT-212 manufactured by Toagosei Co., Ltd., and the like.

Examples of bifunctional oxetane compounds include: 4,4'-bis[(3-ethyl-3-oxetanyl)methoxymethyl]biphenyl), 1,4-bis[( 3-ethyl-3-oxetanyl)methoxymethyl]benzene, 1,4-bis{[(3-ethyl-3-oxetanyl)methoxy]methyl}benzene , Bis[1-ethyl(3-oxetanyl)]methyl ether, Bis[1-ethyl(3-oxetanyl)]methyl ether-3-ethyl-3-hydroxymethyl ethyl oxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(2-phenoxymethyl)oxetane Butane, 3,7-bis(3-oxetanyl)-5-oxa-nonane, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl] Ethane, 1,3-bis[(3-ethyl-3-oxetanylmethoxy)methyl]propane, ethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, di Cyclopentenyl bis(3-ethyl-3-oxetanylmethyl) ether, triethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, tetraethylene glycol bis(3- Ethyl-3-oxetanylmethyl) ether, 1,4-bis(3-ethyl-3-oxetanylmethoxy)butane, 1,6-bis(3-ethyl-3-oxo) Heterocyclobutylmethoxy)hexane, polyethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, ethylene oxide (EO) modified bisphenol A bis(3-ethyl-3 -Oxetanyl methyl) ether, propylene oxide (PO) modified bisphenol A bis (3-ethyl-3-oxetanyl methyl) ether, EO modified hydrogenated bisphenol A bis (3-ethyl) -3-oxetanylmethyl) ether, PO modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, EO modified bisphenol F (3-ethyl-3-oxygen Heterocyclobutyl methyl) ether, etc.

Examples of commercially available products include OXBP and OXTP manufactured by Ube Kosan Co., Ltd., OXT-121 and OXT-221 manufactured by Toagosei Co., Ltd., and the like.

Examples of trifunctional or higher oxetane compounds include: pentaerythritol tris(3-ethyl-3-oxetanylmethyl) ether, pentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, Dipentaerythritol hexa(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol penta(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol tetrakis(3-ethyl-3-oxo) Heterocyclobutylmethyl) ether, caprolactone-modified dipentaerythritol hexa(3-ethyl-3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol penta(3-ethyl-3-oxeterocycle) Butylmethyl) ether, di-trimethylolpropane tetrakis (3-ethyl-3-oxetanylmethyl) ether, resin containing an oxetanyl group (for example, those described in Japanese Patent No. 3783462 Oxetane-modified phenol novolac resin, etc.) or a polymer obtained by radical polymerization of (meth)acrylic monomers such as OXE-30.

The content of the oxetane compound (I2) is preferably 0.5% to 50% by mass, and more preferably 1% to 40% by mass in 100% by mass of non-volatile components of the photosensitive composition.

Melamine compounds are compounds with a melamine ring structure. The melamine compound is preferably a methylol-type or ether-type compound, and more preferably a melamine compound in which the average number of methylol groups and/or ether groups per melamine ring is 5.0 or more. If it has a moderate number of hydroxymethyl groups or ether groups, it is easy to obtain just the right heat resistance.

Examples of commercially available products include: NIKALAC MW-30HM, NIKALAC MW-390, NIKALAC MW-100LM, and NIKALAC MX manufactured by Sanwa Chemical Co., Ltd. -750LM, NIKALAC MW-30M, NIKALAC MW-30, NIKALAC MW-22, NIKALAC MS-21, NIKALAC MS -11. NIKALAC MW-24X, NIKALAC MS-001, NIKALAC MX-002, NIKALAC MX-730, NIKALAC MX -750, NIKALAC MX-708, NIKALAC MX-706, NIKALAC MX-042, NIKALAC MX-45, NIKALAC MX -500, NIKALAC MX-520, NIKALAC MX-43, NIKALAC MX-417, NIKALAC MX-410, Japan Cytec CYMEL 232, CYMEL 235, CYMEL 236, CYMEL 238, CYMEL 285, CYMEL manufactured by Industries ) 300, CYMEL 301, CYMEL 303, CYMEL 350, CYMEL 370, etc.

Among these, NIKALAC MW-30HM, NIKALAC MW-390, and NIKALAC manufactured by Samhwa Chemical Co., Ltd. have an average number of hydroxymethyl and/or ether groups per melamine ring of 5.0 or more. (NIKALAC) MW-100LM, NIKALAC (NIKALAC) MX-750LM, NIKALAC (NIKALAC) MW-30M, NIKALAC (NIKALAC) MW-30, NIKALAC (NIKALAC) MW-22, NIKALAC (NIKALAC) MS-21, NIKALAC (NIKALAC) MS-11, NIKALAC (NIKALAC) MW-24X, NIKALAC (NIKALAC) MW-45, Cytec manufactured by Japan Cytec Industries CYMEL 232, CYMEL 235, CYMEL 236, CYMEL 238, CYMEL 300, CYMEL 301, CYMEL (CYMEL) 303, CYMEL (CYMEL) 350, etc. are preferred in terms of increasing cross-linking density.

The thermosetting compound (I) can be used alone or in combination of two or more types.

[Hardening agent (hardening accelerator)] In order to assist the hardening of the thermosetting compound (I), the photosensitive composition of the present invention may use a hardening agent (hardening accelerator) together.

Examples of the curing agent include amine compounds, acid anhydrides, active esters, carboxylic acid compounds, sulfonic acid compounds, and the like. Examples of the hardening agent include amine compounds (such as dicyandiamine, benzyldimethylamine, 4-(dimethylamino)-N,N-dimethylbenzylamine, 4-methoxy- N,N-dimethylbenzylamine, 4-methyl-N,N-dimethylbenzylamine, etc.), quaternary ammonium salt compounds (such as triethylbenzyl ammonium chloride, etc.), blocked isocyanate compounds ( such as dimethylamine, etc.), imidazole derivatives, bicyclic amidine compounds and their salts (such as imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole , 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole, etc.), phosphorus compounds (such as triphenylphosphine etc.), S-triazine derivatives (such as 2,4-diamino-6-methacryloxyethyl-S-triazine, 2-vinyl-2,4-diamino-S -Triazine, 2-vinyl-4,6-diamino-S-triazine/isocyanuric acid adduct, 2,4-diamino-6-methacryloxyethyl- S-triazine/isocyanuric acid adduct, etc.), etc.

The hardening agent can be used alone or in combination of two or more types.

The content of the curing agent is preferably 0.01 to 15 parts by mass relative to 100 parts by mass of the thermosetting compound (I).

[Polymerization inhibitor (J)] The photosensitive composition of the present invention may contain a polymerization inhibitor (J).

Examples of the polymerization inhibitor (J) include catechol, resorcinol, 1,4-hydroquinone, 2-methylcatechol, 3-methylcatechol, and 4-methylcatechol. catechol, 2-ethyl catechol, 3-ethyl catechol, 4-ethyl catechol, 2-propyl catechol, 3-propyl catechol , 4-propyl catechol, 2-n-butyl catechol, 3-n-butyl catechol, 4-n-butyl catechol, 2-tert-butyl catechol, Alkyl catechol compounds such as 3-tert-butylcatechol, 4-tert-butylcatechol, and 3,5-di-tert-butylcatechol; 2-methylresorcinol , 4-methylresorcinol, 2-ethylresorcinol, 4-ethylresorcinol, 2-propylresorcinol, 4-propylresorcinol, 2-n-butyl Alkyl resorcinol compounds such as methylresorcinol, 4-n-butylresorcinol, 2-tert-butylresorcinol, and 4-tert-butylresorcinol; methylhydroquinone Alkyl hydroquinone compounds such as phenol, ethyl hydroquinone, propyl hydroquinone, tert-butyl hydroquinone, 2,5-di-tert-butyl hydroquinone, etc.; tributylphosphine , trioctylphosphine, tricyclohexylphosphine, triphenylphosphine, tribenzylphosphine and other phosphine compounds; trioctylphosphine oxide, triphenylphosphine oxide and other phosphine oxide compounds; triphenylphosphite, trinonyl Phosphite compounds such as phenyl phosphite; pyrogallol, phloroglucin, etc.

The content of the polymerization inhibitor (J) is preferably 0.01 to 0.4 mass% in 100% by mass of non-volatile components of the photosensitive composition.

[UV absorber (K)] The photosensitive composition of the present invention may contain an ultraviolet absorber (K).

The ultraviolet absorber (K) is an organic compound with ultraviolet absorbing function. Examples include benzotriazole-based organic compounds, triazine-based organic compounds, benzophenone-based organic compounds, and salicylic acid ester-based compounds. Organic compounds, cyanoacrylate-based organic compounds, salicylate-based organic compounds, etc.

Examples of benzotriazole compounds include: 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-tert-butylphenyl)-2H-benzotriazole Azole, 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, 2-(3-tert-butyl-5-methyl- 2-Hydroxyphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-5'-tert-octylphenyl)benzotriazole, 5% 2-methoxy-1-methyl Ethyl acetate with 95% phenylpropionic acid and 3-(2H-benzotriazol-2-yl)-(1,1-dimethylethyl)-4-hydroxyl and C7-9 side chain and Mixture of linear alkyl esters, 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzo Triazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, methyl 3-(3- (2H-benzotriazole-2-yl)-5-tert-butyl-4-hydroxyphenyl)propionate/polyethylene glycol 300 reaction product, 2-(2H-benzotriazole-2 -yl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)-4- (1,1,3,3-Tetramethylbutyl)phenol], 2-(2H-benzotriazol-2-yl)-p-cresol, 2-(5-chloro-2H-benzotriazole -2-yl)-6-tert-butyl-4-methylphenol, 2-(3,5-di-tert-pentyl-2-hydroxyphenyl)benzotriazole, 2-[2-hydroxy-5- [2-(methacryloxy)ethyl]phenyl]-2H-benzotriazole, octyl-3[3-tert-butyl-4-hydroxy-5-(5-chloro-2H- Benzotriazole-2-yl)phenyl]propionate, 2-ethylhexyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazole-2) -yl)phenyl]propionate.

Examples of commercially available products include: TINUVIN P, TINUVIN PS, TINUVIN 234, TINUVIN 326, and TINUVIN manufactured by BASF Japan. TINUVIN 329, TINUVIN 384-2, TINUVIN 900, TINUVIN 928, TINUVIN 99-2, TINUVIN 1130, Adekastab LA-29, Adekastab LA-31RG, Adekastab LA-32, Adekastab manufactured by ADEKA (Adekastab) LA-36, KEMISORB 71, KEMISORB 73, KEMISORB 74, KEMISORB manufactured by Chemipro Kasei Company (KEMISORB) 79, KEMISORB 279, RUNA-93 manufactured by Otsuka Chemical Company, etc.

Examples of triazine compounds include: 2,4-bis(2,4-dimethylphenyl)-6-(2-hydroxy-4-n-octyloxyphenyl)-1,3,5-tris Azine, 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-[3-(dodecyloxy)- 2-Hydroxypropoxy]phenol, 2-(2,4-dihydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine and (2 Reaction product of -ethylhexyl)-glycidyl ester, 2,4-bis[2-hydroxy-4-butoxyphenyl]-6-(2,4-dibutoxyphenyl)-1 ,3,5-triazine, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-(hexyloxy)phenol, 2-(4,6-di Phenyl-1,3,5-triazin-2-yl)-5-[2-(2-ethylhexyloxy)ethoxy]phenol, 2,4,6-tris(2-hydroxy -4-hexyloxy-3-methylphenyl)-1,3,5-triazine, etc.

Examples of commercially available products include: KEMISORB 102 manufactured by Chemipro Kasei, TINUVIN 400 and TINUVIN manufactured by BASF Japan ) 405, TINUVIN 460, TINUVIN 477, TINUVIN 479, TINUVIN 1577ED, Eddie Costapo (made by ADEKA) Adekastab LA-46, Adekastab LA-F70, CYASORB UV-1164 manufactured by Sun Chemical, etc.

Examples of benzophenone compounds include 2,4-di-hydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, and 2-hydroxy-4-methoxybenzophenone- 5-Sulfonic acid-3, 2-hydroxy-4-n-octyloxybenzophenone, 2,2'-di-hydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4 ,4'-dimethoxybenzophenone, 4-dodeoxy-2-hydroxybenzophenone, 2-hydroxy-4-octadecyloxybenzophenone, 2,2'-dihydroxy -4,4'-dimethoxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, 2-hydroxy-4-methoxy-2'-carboxybenzophenone wait.

Examples of commercially available products include: KEMISORB 10, KEMISORB 11, KEMISORB 11S, and KEMISORB manufactured by Chemipro Kasei Co., Ltd. (KEMISORB) 12. KEMISORB 111, manufactured by Shipro Kasei. SEESORB 101. SEESORB 107, manufactured by ADEKA. Adekastab 1413, UV-12 manufactured by Sun Chemical, etc.

Examples of the salicylate-based compound include phenyl salicylate, p-octylphenyl salicylate, p-tert-butylphenyl salicylate, and the like.

The content of the ultraviolet absorber (K) is preferably 5 to 70 mass % in the total of 100 mass % of the photopolymerization initiator (C) and the ultraviolet absorber (K).

[Antioxidant (L)] The photosensitive composition of the present invention may contain an antioxidant (L).

Antioxidant (L) prevents the photopolymerization initiator (C) or thermosetting compound (I) contained in the photosensitive composition from being generated by thermal hardening or the thermal step during annealing of indium tin oxide (ITO) Yellowing caused by oxidation. Especially when the colorant (F) concentration of the photosensitive coloring composition is high, the content of the polymerizable compound (B) is relatively reduced, so if the photopolymerization initiator (C) is increased or the thermosetting compound ( I), the hardened film will easily turn yellow. Therefore, by containing an antioxidant, yellowing of the cured film caused by oxidation during the heating step is prevented.

Examples of the antioxidant (L) include hindered phenol-based, hindered amine-based, phosphorus-based, sulfur-based and hydroxylamine-based compounds. Furthermore, in this specification, the antioxidant is preferably a compound that does not contain a halogen atom.

Among these, hindered phenol-based antioxidants, hindered amine-based antioxidants, phosphorus-based antioxidants, and sulfur-based antioxidants are preferred.

Examples of hindered phenol antioxidants include: 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H, 3H,5H)-trione, 1,1,3-tris-(2'-methyl-4'-hydroxy-5'-tert-butylphenyl)-butane, 4,4'-butylene-bis -(2-tert-butyl-5-methylphenol), 3-(3,5-di-tert-butyl-4-hydroxyphenyl)stearyl propionate, pentaerythritol tetrakis[3-(3,5-di -tert-butyl-4-hydroxyphenyl)propionate], 3,9-bis[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy ]-1,1-dimethylethyl]-2,4,8,10-tetraxaspiro[5.5]undecane, 1,3,5-tris(3,5-di-tert-butyl-4 -Hydroxyphenylmethyl)-2,4,6-trimethylbenzene, 1,3,5-tris(3-hydroxy-4-tert-butyl-2,6-dimethylbenzyl)-1, 3,5-Triazine-2,4,6(1H,3H,5H)-trione, 2,2'-methylenebis(6-tert-butyl-4-ethylphenol), 2,2' -Thiodiethyl bis-(3,5-di-tert-butyl-4-hydroxyphenyl)-propionate, N,N-hexamethylene bis(3,5-di-tert-butyl-4- Hydroxy-hydroxycinnamamide), isooctyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 4,6-bis(dodecylthiomethyl)- O-cresol, calcium salt of 3,5-di-tert-butyl-4-hydroxybenzylphosphonate monoethyl ester, 4,6-bis(octylthiomethyl)-o-cresol, bis[3-( 3-(Methyl-4-hydroxy-5-tert-butylphenyl)propionate]ethylenedioxydiethylene ester, 1,6-hexanediol bis[3-(3,5-di tert-butyl-4-hydroxyphenyl)propionate], 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-tert-butylaniline)-1,3, 5-Triazine, 2,2'-thio-bis-(6-tert-butyl-4-methylphenol), 2,5-di-tert-pentyl-hydroquinone, 2,6-di-tert-butyl- 4-Nonylphenol, 2,2'-isobutylidene-bis-(4,6-dimethyl-phenol), 2,2'-methylene-bis-(6-(1-methyl- Cyclohexyl)-p-cresol), 2,4-dimethyl-6-(1-methyl-cyclohexyl)-phenol, etc.

Examples of commercially available products include Adekastab AO-20, Adekastab AO-30, and Adekastab AO- manufactured by ADEKA. 40. Adekastab AO-50, Adekastab AO-60, Adekastab AO-80, Adekastab AO-330, KEMINOX 101, KEMINOX 179, KEMINOX 76, KEMINOX 9425 manufactured by Chemipro, BASF Japan IRGANOX 1010, IRGANOX 1035, IRGANOX 1076, IRGANOX 1098, IRGANOX 1135, manufactured by Japan) company IRGANOX 1330, IRGANOX 1726, IRGANOX 1425WL, IRGANOX 1520L, IRGANOX 245, IRGANOX ( IRGANOX) 259, IRGANOX 3114, IRGANOX 5057, IRGANOX 565, CYANOX CY-1790 manufactured by Sun Chemical Company , CYANOX CY-2777, etc.

Examples of hindered amine antioxidants include: tetrakis(1,2,2,6,6-pentamethyl-4-piridinyl)-1,2,3,4-butanetetracarboxylate, tetrakis(2 ,2,6,6-tetramethyl-4-piridyl)1,2,3,4-butanetetracarboxylate, bis(1,2,2,6,6-pentamethyl-4- Dimethyl) sebacate, bis(2,2,6,6-tetramethyl-4-pidiyl) sebacate, bis(1-undecyloxy-2,2,6, 6-Tetramethylpyridin-4-yl)carbonate, 1,2,2,6,6-pentamethyl-4-pyridinyl methacrylate, 2,2,6,6-tetramethyl -Condensation polymer of 4-pyridyl methacrylate, dimethyl succinate and 1-(2-hydroxyethyl)-4-hydroxy-2,2,6,6-tetramethylpyridine, poly[ [6-[(1,1,3,3-tetramethylbutyl)amino]-s-triazine-2,4-diyl]-[(2,2,6,6-tetramethyl-4 -pyridyl)imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-pyridyl)imino]], 4-hydroxy-2,2,6 , the ester of 6-tetramethyl-1-pyridinethanol and 3,5,5-trimethylhexanoic acid, N,N'-4,7-tetra[4,6-bis{N-butyl-N -(1,2,2,6,6-pentamethyl-4-pyridinyl)amino}-1,3,5-triazin-2-yl]-4,7-diazadecane- 1,10-Diamine, bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piridinyl)sebacate, and 1,1-dimethylethyl The reaction product of hydroperoxide and octane, bis(1,2,2,6,6-pentamethyl-4-piridyl)[[3,5-bis(1,1-dimethylethyl methyl)-4-hydroxyphenyl]methyl]butyl malonate, methyl 1,2,2,6,6-pentamethyl-4-piridinyl sebacate, poly[[6- Morpholino-s-triazine-2,4-diyl]-[(2,2,6,6-tetramethyl-4-piridinyl)imino]-hexamethylene-[(2, 2,6,6-Tetramethyl-4-piridyl)imino]], 2,2,6,6-tetramethyl-4-piridinyl-C12-21 and C18 unsaturated fatty acid esters , N,N'-bis(2,2,6,6-tetramethyl-4-piridinyl)-1,6-hexamethylenediamine, 2-methyl-2-(2,2, 6,6-Tetramethyl-4-piridyl)amino-N-(2,2,6,6-tetramethyl-4-piridinyl)propamide, etc.

Examples of commercially available products include Adekastab LA-52, Adekastab LA-57, and Adekastab LA- manufactured by ADEKA. 63P, Adekastab LA-68, Adekastab LA-72, Adekastab LA-77Y, Adekastab LA-77G, Adekastab LA-81, Adekastab LA-82, Adekastab LA-87, Adekastab LA-402F, Adeka Adekastab LA-502XP, KAMISTAB 29, KAMISTAB 62, KAMISTAB manufactured by Chemipro Kasei Company 77. KAMISTAB 94, TINUVIN 111FDL, TINUVIN 123, TINUVIN 144, TINUVIN manufactured by BASF Japan ) 249, TINUVIN 292, TINUVIN 5100, CYASORB UV-3346, CYASORB UV-3529, manufactured by Sun Chemical Company CYASORB UV-3853, etc.

Examples of phosphorus-based antioxidants include bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, and 2,2'-methylene Bis(4,6-di-tert-butylphenyl) 2-ethylhexyl phosphite, tris(2,4-di-tert-butylphenyl) phosphite, tris(nonylphenyl) phosphite, Tetrakis (C12～C15 alkyl)-4,4'-isopropylidene diphenyl diphosphite, diphenyl mono(2-ethylhexyl) phosphite, diphenyl isodecyl phosphite , tris(isodecyl)phosphite, triphenylphosphite, tetrakis(2,4-di-tert-butylphenyl)-4,4-biphenyldiphosphonate, tris(tridecyl) ) Phosphite, phenylisooctylphosphite, phenylisodecylphosphite, phenylbis(tridecyl)phosphite, diphenylisooctylphosphite, diphenyldecylphosphite Trialkyl phosphite, 4,4'-isopropylidenephenolalkyl phosphite, trinonylphenyl phosphite, tris-dinonylphenyl phosphite, tris(biphenyl) Phosphite, di(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, di(nonylphenyl)pentaerythritol diphosphite, phenylbisphenol A pentaerythritol diphosphite, tetrakis-10 Trialkyl 4,4'-butylene bis(3-methyl-6-tert-butylphenol) diphosphite, hexa-tridecyl 1,1,3-tris(2-methyl-4- Hydroxy-5-tert-butylphenyl)butane triphosphite, 3,5-di-tert-butyl-4-hydroxybenzylphosphite diethyl ester, bis(4-tert-butylphenyl)phosphite Sodium, 2,2-methylene-bis(4,6-di-tert-butylphenyl)-sodium phosphite, 1,3-bis(diphenoxyphosphonyloxy)-benzene, ethyl phosphite Bis(2,4-di-tert-butyl-6-methylphenyl) ester, etc.

Examples of commercially available products include Adekastab PEP-36, Adekastab PEP-8, and Adekastab HP- manufactured by ADEKA. 10. Adekastab (Adekastab) 2112, Adekastab (Adekastab) 1178, Adekastab (Adekastab) 1500, Adekastab (Adekastab) C, Adekastab (Adekastab) 135A, Adekastab 3010, Adekastab TPP, manufactured by BASF Japan, IRGAFOS 168, manufactured by Clariant chemicals Hostanox P-EPQ, etc.

Examples of sulfur-based antioxidants include: 2,2-bis{[3-(dodecylthio)-1-oxopropoxy]methyl}propane-1,3-diylbis[3-( Dodecylthio)propionate], 3,3'-Ditridecyl thiodipropionate, 2,2-Thio-diethylenebis[3-(3,5- Di-tert-butyl-4-hydroxyphenyl)propionate], 2,4-bis[(octylthio)methyl]-o-cresol, 2,4-bis[(laurylthio)methyl] -O-cresol, etc.

Examples of commercially available products include Adekastab AO-412S, Adekastab AO-503 manufactured by ADEKA, and Chemipro Kasei. KEMINOX PLS, etc.

The antioxidant (L) can be used alone or in combination of two or more types.

The content of the antioxidant (L) is preferably 0.5 to 5.0 mass% in 100% by mass of non-volatile components of the photosensitive composition. When contained in an appropriate amount, transmittance, spectral characteristics and sensitivity are improved.

[Leveling agent (M)] The photosensitive composition of the present invention may contain a leveling agent (M). This further improves the wettability and dryness with respect to the substrate during coating.

Examples of the leveling agent (M) include silicone surfactants, fluorine surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and amphoteric surfactants.

Examples of silicone surfactants include linear polymers containing siloxane bonds and modified siloxane polymers in which organic groups are introduced into side chains or terminals.

Examples of commercially available products include BYK-300, BYK-306, BYK-310, BYK-313, BYK-315N, BYK-320, BYK-322, BYK-323, manufactured by BYK-Chemie. BYK-330, BYK-331, BYK-333, BYK-342, BYK-345, BYK-346, BYK-347, BYK-348, BYK-349, BYK-370, BYK-377, BYK-378, BYK- 3455, BYK-UV3510, BYK-UV3570, manufactured by Toray Dow Corning, FZ-7002, FZ-2110, FZ-2122, FZ-2123, FZ-2191, FZ-5609, manufactured by Shin-Etsu Chemical Industry Co., Ltd. X-22-4952, -4515, KF-6004, KP-341, etc.

Examples of fluorine-based surfactants include surfactants and leveling agents having a fluorocarbon chain.

Examples of commercially available products include: Surflon S-242, Surflon S-243, Surflon S-420, and Surflon manufactured by AGC Seimi Chemical Co., Ltd. Surflon S-611, Surflon S-651, Surflon S-386, Megafac F-253 and Megafac manufactured by DIC F-477, Megafac F-551, Megafac F-552, Megafac F-555, Megafac F-558, Megafac F-560, Megafac Megafac F-570, Megafac F-575, Megafac F-576, Megafac R-40-LM, Megafac R-41, Megafac ) RS-72-K, Megafac DS-21, FC-4430 and FC-4432 manufactured by Sumitomo 3M Corporation, EF-PP31N09, EF-PP33G1, EF-PP32C1 manufactured by Mitsubishi Materials Electronics Corporation, NEO Ftergent 602A manufactured by NEOS Company, etc.

Examples of nonionic surfactants include polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene alkyl ether, polyoxyethylene Ethylene myristyl ether, polyoxyethylene octyl dodecyl ether, polyoxyalkylene alkyl ether, polyoxyphenylene distyrenated phenyl ether, polyoxyethylene tribenzylphenyl ether, poly Oxyethylene polyoxypropylene glycol, polyoxyalkylene alkenyl ether, polyoxyethylene nonyl phenyl ether, polyoxyethylene alkyl ether phosphate, sorbitan monolaurate, sorbitan monopalm Acid ester, sorbitan monostearate, sorbitan distearate, sorbitan tristearate, sorbitan monooleate, sorbitan trioleate , sorbitan sesquioleate, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan monostearate, Oxyethylene sorbitan tristearate, polyoxyethylene sorbitan monooleate, polyoxyethylene sorbitan triisostearate, polyoxyethylene tetraoleic acid sorbitol, propane Alcohol monostearate, glycerin monooleate, polyethylene glycol monolaurate, polyethylene glycol monostearate, polyethylene glycol distearate, polyethylene glycol monooil Acid ester, polyoxyethylene hardened castor oil, polyoxyethylene alkylamine, alkyl alkanolamide, alkyl imidazoline, etc.

Examples of commercially available products include Emulgen 103, Emulgen 104P, Emulgen 106, Emulgen 108, Emulgen 109P and Emulgen manufactured by Kao Corporation. ) 120, Emulgen 123P, Emulgen 130K, Emulgen 147, Emulgen 150, Emulgen 210P, Emulgen 220, Emulgen 306P, Emulgen 320P, Emulgen 350, Emulgen 404, Emulgen 408, Emulgen 409PV, Emulgen 420, Emulgen 430 , Emulgen 705, Emulgen 707, Emulgen 709, Emulgen 1108, Emulgen 1118S-70, Emulgen 1135S-70, Emulgen ( Emulgen) 1150S-60, Emulgen 2020G-HA, Emulgen 2025G, Emulgen LS-106, Emulgen LS-110, Emulgen LS-114, Emulgen Emulgen MS-110, Emulgen A-60, Emulgen A-90, Emulgen B-66, Emulgen PP-290, Latemul ) PD-420, Latemul (Latemul) PD-430, Latemul (Latemul) PD-430S, Latemul (Latemul) PD-450, Rheodol (Rheodol) SP-L10, Lai Rheodol SP-P10, Rheodol SP-S10V, Rheodol SP-S20, Rheodol SP-S30V, Rheodol SP-O10V, Rheodol SP-O30V, Rheodol Super SP-L10, Rheodol AS-10V, Rheodol AO-10V, Rheodol AO-15V, Rheodol TW-L120, Rheodol TW-L106, Rheodol TW-P120, Rheodol )TW-S120V, Rheodol TW-S320V, Rheodol TW-O120V, Rheodol TW-O106V, Rheodol TW-IS399C, Rheodol Super TW-L120, Rheodol 430V, Rheodol 440V, Rheodol 460V, Rheodol MS-50, Rheodol MS-60, Rheodol MO-60, Rheodol MS-165V, Emanon 1112, Emanon 3199V, Emanon ( Emanon 3299V, Emanon 3299RV, Emanon 4110, Emanon CH-25, Emanon CH-40, Emanon CH-60(K), Ami Amiet 102, Amiet 105, Amiet 105A, Amiet 302, Amiet 320, Aminon PK-02S, Amiet Aminon L-02, Homogenol L-95, Adeka Pluronic (registered trademark) L-23, Adeka Pluronic manufactured by ADEKA (Adeka Pluronic) L-31, Adeka Pluronic (Adeka Pluronic) L-44, Adeka Pluronic (Adeka Pluronic) L-61, Adeka Pluronic (Adeka Pluronic) L-62, Adeka Pluronic Adeka Pluronic L-64, Adeka Pluronic L-71, Adeka Pluronic L-72, Adeka Pluronic L-101, Adeka Pluronic Adeka Pluronic L-121, Adeka Pluronic TR-701, Adeka Pluronic TR-702, Adeka Pluronic TR-704 , Adeka Pluronic TR-913R, (meth)acrylic (co)polymer Polyflow No. 75, Polyflow manufactured by Kyoeisha Chemical Co., Ltd. No.90, Polyflow No.95, etc.

Examples of cationic surfactants include alkylamine salts, alkyl quaternary ammonium salts such as lauryltrimethylammonium chloride, stearyltrimethylammonium chloride, and cetyltrimethylammonium chloride; Ethylene oxide adducts of these.

Examples of commercially available products include Acetamine 24, Quartamin 24P, Quartamin 60W, and Quartamin 86P CONC manufactured by Kao Corporation.

Examples of anionic surfactants include polyoxyethylene alkyl ether sulfate, sodium dodecyl benzene sulfonate, alkali salts of styrene-acrylic acid copolymer, sodium alkyl naphthalene sulfonate, and alkyl diphenyl ether. Sodium disulfonate, monoethanolamine lauryl sulfate, triethanolamine lauryl sulfate, ammonium lauryl sulfate, monoethanolamine stearate, sodium stearate, sodium lauryl sulfate, monoethanolamine of styrene-acrylic acid copolymer, polyoxyethylene Vinyl alkyl ether phosphate, etc.

Examples of commercially available products include Ftergent 100 and Ftergent 150 manufactured by NEOS, and ADEKA HOPE manufactured by ADEKA. YES-25, ADEKA COL TS-230E, ADEKA COL PS-440E, ADEKA COL EC-8600, etc.

Examples of amphoteric surfactants include alkyl groups such as laurylamide propyl betaine, lauryl betaine, cocamidopropyl betaine, stearyl betaine, and alkyldimethylaminoacetate betaine. Betaine; alkyl amine oxides such as lauryl dimethyl amine oxide, etc.

Examples of commercially available products include: AMPHITOL 20AB, AMPHITOL 20BS, AMPHITOL 24B, AMPHITOL 55AB, AMPHITOL 86B manufactured by Kao Corporation. AMPHITOL 20Y-B, AMPHITOL 20N, etc.

The leveling agent (M) can be used alone or in combination of two or more.

The content of the leveling agent (M) is preferably 0.001% by mass to 2.0% by mass, and more preferably 0.005% by mass to 1.0% by mass in 100% by mass of non-volatile components of the photosensitive composition. By being within the above range, the balance between the coating properties and the adhesiveness of the photosensitive composition is further improved.

[Storage Stabilizer (N)] The photosensitive composition of the present invention may contain a storage stabilizer (N). This stabilizes the viscosity of the photosensitive composition over time.

Examples of storage stabilizers (N) include: quaternary ammonium chloride such as benzyltrimethyl chloride and diethylhydroxylamine; organic acids such as lactic acid and oxalic acid and their methyl ethers; tert-butylcatechol; Ethylphosphine, tetraphenyl and other organic phosphines, phosphites, etc.

The storage stabilizer (N) can be used alone or in combination of two or more types.

The content of the storage stabilizer (N) is preferably 0.1% by mass to 10% by mass in 100% by mass of non-volatile components of the photosensitive composition.

[Adhesion improving agent (O)] The photosensitive composition of the present invention may contain an adhesion improving agent (O). This improves the adhesion between the film and the base material. In addition, it is easy to form a pattern with a narrow width using photolithography.

Examples of the close contact improving agent (O) include a silane coupling agent and the like. Examples of silane coupling agents include vinyl silanes such as vinyltrimethoxysilane and vinyltriethoxysilane; 3-methacryloxypropylmethyldimethoxysilane and 3-methylpropene Methyloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-propyloxysilane (meth)acrylic silanes such as propyltrimethoxysilane; 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane , 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane and other epoxy silanes; N -2-(Aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-amino Propyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylene)propylamine, N-phenyl -Aminosilanes such as 3-aminopropyltrimethoxysilane and hydrochloride of N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane; 3- Thiols such as mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane; styryls such as p-styryltrimethoxysilane; 3-ureidopropyltriethoxysilane, etc. Silane coupling agents such as urea-based; thioethers such as bis(triethoxysilylpropyl)tetrasulfide; isocyanates such as 3-isocyanatepropyltriethoxysilane.

The adhesion improving agent (O) can be used alone or in combination of two or more types.

In 100% by mass of non-volatile components of the photosensitive composition, the content of the close contact improving agent (O) is preferably 0.01% by mass to 10% by mass, and more preferably 0.05% by mass to 5% by mass.

[Organic solvent (P)] The photosensitive composition of the present invention may contain an organic solvent (P).

Examples of the organic solvent (P) include 1,2,3-trichloropropane, 1-methoxy-2-propanol, ethyl lactate, 1,3-butanediol, 1 ,3-butylene glycol (1,3-butylene glycol), 1,3-butylene glycol diacetate, 1,4-dioxane, 2-heptanone, 2-methyl-1,3-propanediol , 3,5,5-trimethyl-2-cyclohexen-1-one, 3,3,5-trimethylcyclohexanone, ethyl 3-ethoxypropionate, 3-methyl-1 ,3-Butanediol, 3-methoxy-3-methyl-1-butanol, 3-methoxy-3-methylbutyl acetate, 3-methoxybutanol, 3-methyl Oxybutyl acetate, 4-heptanone, m-xylene, m-diethylbenzene, m-dichlorobenzene, N,N-dimethylacetamide, N,N-dimethylformamide, n-butyl alcohol, n-butylbenzene, n-propyl acetate, N-methylpyrrolidone, o-xylene, o-chlorotoluene, o-diethylbenzene, o-dichlorobenzene, p-chlorotoluene, p-diethylbenzene, Sec-butylbenzene, tert-butylbenzene, γ-butyrolactone, isobutyl alcohol, isophorone, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, ethylene glycol monoisopropyl ether, ethylene glycol Monoethyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monotert-butyl ether, ethylene glycol monobutyl ether, ethylene glycol monobutyl ether acetate, ethylene glycol monopropyl ether, ethylene glycol monohexyl ether , Ethylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, diisobutyl ketone, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoisopropyl ether, diethyl Diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether, cyclohexanol, cyclohexanol acetate, cyclohexanone, Dipropylene glycol dimethyl ether, dipropylene glycol methyl ether acetate, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monomethyl ether, diacetone alcohol, triacetin, triacetin Propylene glycol monobutyl ether, tripropylene glycol monomethyl ether, propylene glycol diacetate, propylene glycol phenyl ether, propylene glycol monoethyl ether, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether, propylene glycol monopropyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether Ether acetate, propylene glycol monomethyl ether propionate, benzyl alcohol, methyl isobutyl ketone, methylcyclohexanol, n-amyl acetate, n-butyl acetate, isoamyl acetate, isobutyl acetate, acetic acid Propyl ester, dibasic acid ester, etc. Among these, from the viewpoint of pigment dispersibility and alkali-soluble resin solubility, ethyl lactate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, and ethylene glycol monomethyl ether acetate are preferred. , glycol acetates such as ethylene glycol monoethyl ether acetate; alcohols such as benzyl alcohol and diacetone alcohol or ketones such as cyclohexanone.

The organic solvent (P) can be used alone or in combination of two or more.

[Production method of photosensitive composition] The photosensitive composition of the present invention can be produced, for example, by adding a colorant (F), an alkali-soluble resin (A), a dispersion resin (H), a pigment derivative (G), an organic solvent (P), and the like, and A dispersion treatment is performed to produce a dispersion, and then a polymerizable compound (B), a photopolymerization initiator (C), and the like are prepared and mixed in the dispersion. In addition, the timing of preparing each material is arbitrary. Alternatively, multiple dispersion steps can be performed.

Examples of the disperser that performs the dispersion treatment include a two-roller mill, a three-roller mill, a ball mill, a horizontal sand mill, a vertical sand mill, an annular type bead mill, and a grinder.

The average dispersed particle size (secondary particle size) of the colorant (F) in the dispersion is preferably 30 nm to 200 nm, and more preferably 40 nm to 200 nm. If it has a moderate particle diameter, it is easy to obtain a photosensitive composition with high dispersion stability.

The average dispersed particle size (secondary particle size) can be measured using, for example, Nikkiso's micro track UPA- which uses a dynamic light scattering method (fast Fourier transform (FFT) power spectrum method). For EX150, set the particle transmittance to absorption mode, set the particle shape to aspherical, and set the D50 particle size to the average diameter. The diluting solvent for measurement is preferably an organic solvent used for dispersion. When measuring a sample treated with ultrasonic waves immediately after sample preparation, it is easy to obtain results with small deviation, which is preferable.

The photosensitive composition is preferably separated into coarse particles of 5 μm or more, preferably 1 μm or more, and further preferably 0.5 μm or more by centrifugal separation, filtration with a sintered filter or a membrane filter, etc. and removal of mixed dust. The photosensitive composition of the present invention preferably does not substantially contain particles of 0.5 μm or more, and more preferably does not contain particles of 0.3 μm or less.

＜Optical filter＞ The optical filter of the present invention includes a substrate and a filter segment formed of the photosensitive composition of the present invention. Optical filters can be used for a variety of purposes. In this specification, the optical filter is preferably a color filter. In the case of a color filter, the filter segments have a red filter segment, a green filter segment, and a blue filter segment by appropriately selecting the type of colorant (F) to be used. Instead of or in addition to the filter section, a magenta filter section, a cyan filter section, a yellow filter section, a white filter section and a black filter section can also be provided. In addition, it is possible to have a transparent filter segment without using colorant (F). Examples of the substrate include transparent substrates and reflective substrates. An example of the transparent substrate is a glass substrate. Examples of the reflective substrate include a substrate using an aluminum electrode or a metal thin film as a reflective surface.

[Method of manufacturing optical filter] The optical filter can be produced by, for example, the following steps: (1) applying a photosensitive composition on a substrate to form a layer (coating) of the composition; and exposing a spacer mask to pattern the layer. (2); alkali development of the unexposed portion to form a patterned cured film (3); and (4) heat treatment (post-baking) of the pattern.

Hereinafter, the manufacturing method of the optical filter will be described in detail. (step (1)) The step (1) of forming the composition layer is to apply the photosensitive composition on the substrate by methods such as spin coating, roll coating, slit coating, cast coating, or inkjet coating, using an oven, a heating plate, etc. as necessary. , dry (pre-bake) at a temperature of 50°C to 120°C for 10 seconds to 120 seconds. Examples of the substrate include a glass substrate and a silicon substrate. For example, the silicon substrate may have imaging elements such as a Charge Coupled Device (CCD) and a Complementary Metal Oxide Semiconductor (CMOS) formed on the surface. In addition, if necessary, an undercoat layer may be provided on the substrate for the purpose of improving adhesion with the upper layer, preventing diffusion of substances, and flattening the surface of the substrate. The film thickness of the layer is preferably 0.05 μm to 10.0 μm, more preferably 0.3 μm to 5 μm.

(step (2)) In the exposure step, for example, an exposure device such as a stepper is used to expose a specific pattern to the layer obtained in step (1) through a mask. A cured film is thus obtained. Examples of radiation used for exposure include ultraviolet rays such as g-rays, h-rays, and i-rays.

(step (3)) The cured film obtained in step (2) is subjected to an alkali development treatment so that the layer of the composition in the unexposed portion is dissolved into the alkali aqueous solution and only the hardened portion remains, thereby obtaining a patterned cured film. Examples of the developer include sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, ammonia, ethylamine, diethylamine, dimethylethanolamine, tetramethylammonium hydroxide, tetramethylammonium hydroxide, Basic compounds such as ethylammonium hydroxide, choline, pyrrole, pyridine, 1,8-diazabicyclo-[5.4.0]-7-undecene. The concentration of the developer is preferably 0.001 mass% to 10 mass%, and more preferably 0.01 mass% to 1 mass%. The pH of the alkali developer is preferably 11 to 13, more preferably 11.5 to 12.5. If used at a moderate pH, roughening or peeling of the pattern is suppressed, and the residual film rate after development is improved.

Examples of the development method include a dipping method, a spray method, a puddle method, and the like. The development temperature is preferably 15°C to 40°C. In addition, after alkali development, it is preferable to wash with pure water.

(step (4)) The heat treatment (post-baking) is to fully harden the patterned cured film obtained in step (3) by heating. The heating temperature for post-baking is preferably 100°C to 300°C, more preferably 150°C to 250°C. In addition, the heating time is preferably about 2 minutes to 1 hour, and more preferably about 3 minutes to 30 minutes.

<Image display device> The image display device of the present invention includes the optical filter of the present invention. Examples of the image display device include a liquid crystal display, an organic electroluminescence (EL) display, and the like. The form used for the image display device is not particularly limited as long as it functions as an image display device. For example, the structure described in "Next Generation Liquid Crystal Display Technology (written by Tatsuo Uchida, Industrial Research Council, published in 1994)" can be cited. The definition of an image display device or the details of each image display device are described in, for example, "Electronic Display Devices (written by Akio Sasaki, Industrial Research Council, published in 1990)" and "Display Devices (written by Junaki Ibuki)" , Industrial Books (shares), issued in 1989)" and so on.

＜Solid-state imaging device＞ The solid-state imaging element of the present invention includes the optical filter of the present invention. The form used for the solid-state imaging element is not particularly limited. For example, it may have a structure in which a plurality of photodiodes constituting the light-receiving area of the solid-state imaging element (CCD image sensor, CMOS image sensor, etc.) are provided on a base material. The pole body and the transmission electrode including polycrystalline silicon, etc. have a light-shielding film on the photodiode and the transmission electrode that opens only to the light-receiving part of the photodiode, and the light-shielding film has a light-shielding film covering the entire surface of the light-shielding film and the photodiode. A device protective film composed of silicon nitride or the like is formed in the form of a light receiving portion, and has an optical filter on the device protective film. Furthermore, the device protective film may be provided with a light condensing member (for example, a microlens, etc.; the same applies below) below the filter (on the side close to the base material), or the filter may be provided with a light condensing member. structure etc. In addition, the filter may have a structure in which a cured film forming each colored picture element is embedded in a space divided by partition walls into a grid shape, for example. In this case, the partition wall preferably has a low refractive index relative to each colored primitive. The imaging device including the solid-state imaging element of the present invention can be used in various applications such as digital cameras, electronic devices with imaging functions (mobile phones, smart phones, etc.), vehicle-mounted cameras, and surveillance cameras. [Example]

Hereinafter, the present invention will be described in more detail using examples. However, the present invention is not limited to these. In addition, "part" means "mass part" and "%" means "mass %". In addition, in the present invention, the non-volatile matter or the non-volatile matter concentration refers to the quality residual component after leaving it to stand in an oven for 30 minutes at 280°C.

Before the Examples, each measurement method will be described.

The weight average molecular weight (Mw), number average molecular weight (Mn), and acid value (mgKOH/g) of the resin are as follows.

(Average molecular weight of alkali-soluble resin and dispersion resin) The number average molecular weight (Mn) and weight average molecular weight (Mw) of the alkali-soluble resin and dispersion resin are measured using gel permeation chromatography (GPC) equipped with a refractive index (Refractive Index, RI) detector. As a device, HLC-8220GPC (manufactured by Tosoh Corporation) was used, two separation columns were connected in series, and two "TSK-GEL SUPER HZM-N" (TSK-GEL SUPER) were used as fillers in both columns. HZM-N)" connection was used, and the oven temperature was 40°C, using tetrahydrofuran (THF) solution as the eluent, and the flow rate was 0.35 ml/min. The sample was dissolved in a solvent containing 1% by mass of the eluent, and 20 μl was injected. The average molecular weight is a polystyrene converted value.

(Acid value of alkali-soluble resin and dispersion resin) Add 80 ml of acetone and 10 ml of water to 0.5 g to 1 g of alkali-soluble resin and dispersion resin solutions and stir to dissolve them uniformly. Use 0.1 mol/L potassium hydroxide (KOH) aqueous solution as the titrant and use an automatic A titration device ("COM-555" manufactured by Hiranuma Sangyo Co., Ltd.) was used to titrate and measure the acid value (mgKOH/g). Furthermore, the acid value per unit nonvolatile component of the resin was calculated based on the acid value of the resin solution and the nonvolatile component concentration of the resin solution.

(Amine value of dispersion resin) The amine value of the dispersion resin is a value obtained by converting the measured total amine value (mgKOH/g) into non-volatile content in accordance with the method of American Society for Testing Materials (ASTM) D 2074.

＜Manufacturing of colorant (F)＞ (Microfine red pigment (F-1)) 100 parts of C.I. Pigment Red 254, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were put into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.), and kneaded at 60° C. for 6 hours. Next, the kneaded mixture was put into warm water, heated to about 80°C and stirred for 1 hour to form a slurry, filtered and washed with water to remove sodium chloride and diethylene glycol, and then heated at 80°C. It was dried for a day and night and then pulverized to obtain a finely divided red pigment (F-1).

(Microfine red pigment (F-2)) 100 parts of C.I. Pigment Red 177, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were put into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.), and kneaded at 60° C. for 6 hours. Next, the kneaded mixture was put into warm water, heated to about 80°C and stirred for 1 hour to form a slurry, filtered and washed with water to remove sodium chloride and diethylene glycol, and then heated at 80°C. It was dried for a day and night and then pulverized to obtain a finely divided red pigment (F-2).

(Microfine blue pigment (F-3)) Put 100 parts of C.I. Pigment Blue 15:6, 1,000 parts of sodium chloride and 100 parts of diethylene glycol into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and knead at 50°C. 12 hours. The mixture was poured into 3,000 parts of warm water, and stirred with a high-speed mixer for about 1 hour while heating to about 70°C to form a slurry. It was filtered and washed repeatedly to remove salt and solvent, and then heated at 80°C. It was dried for 24 hours and pulverized to obtain a finely divided blue pigment (F-3).

(Microfine purple pigment (F-4)) 100 parts of C.I. Pigment Violet 23, 1,200 parts of sodium chloride and 100 parts of diethylene glycol were put into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded at 80° C. for 6 hours. Next, the kneaded product was put into 8,000 parts of warm water and stirred for 2 hours while heating to 80° C. to form a slurry. Filtration and water washing were repeated to remove sodium chloride and diethylene glycol, and then It was dried at 85°C for 24 hours and pulverized to obtain a finely divided purple pigment (F-4).

(Microfine green pigment (F-5)) 100 parts of C.I. Pigment Green 58, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were put into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho), and kneaded at 70° C. for 6 hours. The kneaded product was put into 3000 parts of warm water, heated to 70°C and stirred for 1 hour to form a slurry, filtered and washed with water to remove sodium chloride and diethylene glycol, and then heated at 80°C. It was dried for a day and night and then pulverized to obtain a finely divided green pigment (F-5).

(Microfinized green pigment (F-6)) According to the Example of Japanese Patent Application Laid-Open No. 2017-111398, a green pigment (F-6) of the following chemical formula (11) was obtained. 100 parts of green pigment (F-6), 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were put into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho), and kneaded at 70° C. for 6 hours. The kneaded product was put into 3000 parts of warm water, heated to 70°C and stirred for 1 hour to form a slurry, filtered and washed with water to remove sodium chloride and diethylene glycol, and then heated at 80°C. It was dried for a day and night and then pulverized to obtain a finely divided green pigment (F-6). Chemical formula (11) [Chemical 8]

(Microfine yellow pigment (F-7)) 100 parts of C.I. Pigment Yellow 150, 700 parts of sodium chloride, and 180 parts of diethylene glycol were put into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho), and kneaded at 80° C. for 6 hours. The mixture was poured into 2,000 parts of warm water, heated to 80°C and stirred for 1 hour to form a slurry, filtered and washed repeatedly to remove sodium chloride and diethylene glycol, and then dried at 80°C. day and night, and then pulverized to obtain a finely divided yellow pigment (F-7).

(Microfine yellow pigment (F-8)) Put 100 parts of C.I. Pigment Yellow 139 ("Novoperm Yellow P-M3R" manufactured by Clariant Company), 800 parts of crushed sodium chloride and 100 parts of diethylene glycol into The mixture was kneaded in a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho) at 70°C for 12 hours. Add the mixture to 3000 parts of warm water, stir it with a high-speed mixer for about 1 hour while heating it to about 70° C., and make a slurry. Filter and wash with water repeatedly to remove sodium chloride and diethylene glycol. Thereafter, the mixture was dried at 80°C for one day and night, and then pulverized to obtain a finely divided yellow pigment (F-8).

(Microfine yellow pigment (F-9)) Put 100 parts of C.I. Pigment Yellow 185 ("Paliotol Yellow D1155" manufactured by BASF Japan), 700 parts of crushed sodium chloride and 180 parts of diethylene glycol into stainless steel The mixture was kneaded in a 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) at 80° C. for 6 hours. Next, the kneaded product was put into 8 liters of warm water, heated to 80° C. and stirred for 2 hours to form a slurry, filtered and washed with water to remove sodium chloride and diethylene glycol, and then It was dried at 85°C for one day and night and then pulverized to obtain a finely divided yellow pigment (F-9).

(Miniaturized yellow pigment (F-10)) According to the Example of Japanese Patent Application Laid-Open No. 2012-226110, a yellow pigment (F-10) of the following chemical formula (12) was obtained. 100 parts of yellow pigment (F-10), 700 parts of pulverized sodium chloride and 180 parts of diethylene glycol were put into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded at 80°C for 6 hours. Next, the kneaded product was put into 8 liters of warm water, heated to 80° C. and stirred for 2 hours to form a slurry, filtered and washed with water to remove sodium chloride and diethylene glycol, and then It was dried at 85°C for one day and night and then pulverized to obtain a finely divided yellow pigment (F-10). Chemical formula (12) [Chemical 9]

The average primary particle size of the finely divided pigments is all within the range of 5 nm to 120 nm.

(Dye (F-11)) The dye (F-11), which is a salt-forming compound containing C.I. Acid Red 52 and resin 1 having a cationic group in the side chain, was produced according to the following procedure. Put 67.3 parts of methyl ethyl ketone into a four-necked separable flask including a thermometer, a stirrer, a distillation tube, and a cooler, and heat it to 75°C under a nitrogen stream. In addition, 34.0 parts of methyl methacrylate, 28.0 parts of n-butyl methacrylate, 28.0 parts of 2-ethylhexyl methacrylate, 10.0 parts of dimethylaminoethyl methacrylate, and 2,2'- After making 6.5 parts of azobis(2,4-dimethylvaleronitrile) and 25.1 parts of methyl ethyl ketone uniform, put them into a dropping funnel, and install the dropping funnel in a four-neck detachable flask. , and continued to drip for 2 hours. Two hours after the completion of the dropwise addition, it was confirmed that the polymerization yield was 98% or more based on the nonvolatile content, and the weight average molecular weight (Mw) was 6,830, and the mixture was cooled to 50°C. 3.2 parts of methyl chloride and 22.0 parts of ethanol were added thereto, and the mixture was reacted at 50° C. for 2 hours, then heated to 80° C. over 1 hour, and further reacted for 2 hours. Resin 1 having a cationic group in the side chain having an ammonium group was obtained in this way, with a resin component of 47% by mass. The obtained resin had an ammonium salt value of 34 mgKOH/g. Next, 30 parts of the resin 1 having a cationic group in the side chain was added to 2,000 parts of water in terms of nonvolatile content, and the mixture was thoroughly stirred and mixed, and then heated to 60°C. On the other hand, an aqueous solution in which 10 parts of C.I. Acid Red 52 was dissolved in 90 parts of water was prepared, and this was added dropwise to the previous resin solution little by little. After the dropwise addition, the mixture was stirred at 60° C. for 120 minutes to fully proceed with the reaction. Regarding the confirmation of the end point of the reaction, the reaction solution was added dropwise to the filter paper, and the time when the bleeding disappeared was regarded as the end point, and it was judged that the salt-forming compound was obtained. After cooling to room temperature while stirring, filtering with suction and washing with water, the salt-forming compound remaining on the filter paper was removed from the water using a dryer and dried to obtain 32 parts of C.I. Acid Red 52 with a side chain. The salt-forming compound of the cationic resin 1 is a dye (F-11). At this time, the content of the component derived from C.I. acid red 52 in the dye (F-11) was 25% by mass.

<Manufacture of alkali-soluble resin (A)> (Alkali-soluble resin (A1-1) solution) Introduce 333 parts of propylene glycol monomethyl ether acetate (hereinafter referred to as PGMAc (propylene glycol monomethyl ether acetate)) into a flask including a stirrer, thermometer, reflux cooling tube, dropping funnel and nitrogen introduction tube, so that the environment inside the flask is replaced with air After becoming nitrogen, raise the temperature to 100°C, and then add 70.5 parts of benzyl methacrylate (0.40 mol), 71.1 parts of glycidyl methacrylate (0.50 mol), and 22.0 parts of dicyclopentyl methacrylate. (0.10 mole) and 164 parts of PGMAc, a solution obtained by adding 3.6 parts of azobisisobutyronitrile was added dropwise to the flask from the dropping funnel over 2 hours, and stirring was continued at 100°C for 5 hours. Next, the atmosphere in the flask was changed from nitrogen to air, and 43.0 parts of methacrylic acid [0.5 mol, (100 mol% relative to the glycidyl group of glycidyl methacrylate used in this reaction)], 0.9 parts of tris-dimethylaminomethylphenol and 0.145 parts of hydroquinone were put into the flask, and the reaction was continued for 6 hours at 110°C. The reaction was completed when the acid value of the non-volatile component became 1 mgKOH/g. Next, 60.9 parts of tetrahydrophthalic anhydride (0.40 mol) and 0.8 parts of triethylamine were added, and the reaction was carried out at 120°C for 3.5 hours to obtain a photosensitive resin solution with an acid value of 80 mgKOH/g. After cooling to room temperature, approximately 2 parts of the photosensitive resin solution were sampled, heated and dried at 180°C for 20 minutes, and the nonvolatile content was measured. The nonvolatile content in the previously synthesized photosensitive resin solution was 20% by mass. PGMAc was added to prepare a photosensitive alkali-soluble resin (A1-1) solution containing an alicyclic hydrocarbon-containing monomer unit (a1) and a carboxyl group-containing monomer unit (a2). The weight average molecular weight (Mw) is 12,000.

(Alkali-soluble resin (A1-2) solution) 182 parts of PGMAc was introduced into a flask including a stirrer, a thermometer, a reflux cooling tube, a dropping funnel, and a nitrogen inlet tube. After the environment in the flask was replaced with nitrogen from air, the temperature was raised to 100°C, and then the solution containing benzyl methacrylate was added. Add azobisisobutyronitrile 3.6 to a mixture of 70.5 parts (0.40 mol), 43.0 parts methacrylic acid (0.5 mol), 22.0 parts dicyclopentyl methacrylate (0.10 mol), and 136 parts PGMAc. The solution formed by 100 parts was added dropwise from the dropping funnel to the flask over 2 hours, and stirring was continued at 100° C. for 5 hours. Next, the atmosphere in the flask was replaced from nitrogen to air, and 35.5 parts of glycidyl methacrylate [0.25 mol, (50 mol% relative to the carboxyl group of methacrylic acid used in this reaction)], tri- 0.9 parts of dimethylaminomethylphenol and 0.145 parts of hydroquinone were put into the flask, and the reaction was continued for 6 hours at 110°C to obtain a photosensitive resin solution with an acid value of 79 mgKOH/g. After cooling to room temperature, approximately 2 parts of the photosensitive resin solution were sampled, heated and dried at 180°C for 20 minutes, and the nonvolatile content was measured. The nonvolatile content in the previously synthesized photosensitive resin solution was 20% by mass. PGMAc was added to prepare a photosensitive alkali-soluble resin (A1-1) solution containing an alicyclic hydrocarbon-containing monomer unit (a1) and a carboxyl group-containing monomer unit (a2). The weight average molecular weight (Mw) is 13,000.

(Alkali-soluble resin (A2-1) solution) Put 196 parts of cyclohexanone into a reaction vessel equipped with a thermometer, a cooling tube, a nitrogen introduction tube, a dropper tube and a stirring device in a detachable four-necked flask, raise the temperature to 80°C, and replace the reaction vessel with nitrogen. After that, 37.2 parts of n-butyl methacrylate, 12.9 parts of 2-hydroxyethyl methacrylate, 12.0 parts of methacrylic acid, and p-cumylphenol ethylene oxide modified acrylate ( A mixture of 20.7 parts of "Aronix M110" manufactured by Toagosei Co., Ltd. and 1.1 parts of 2,2'-azobisisobutyronitrile. After the dropwise addition was completed, the reaction was continued for another 3 hours to obtain an acrylic resin solution. After cooling to room temperature, approximately 2 parts of the resin solution were sampled, heated and dried at 180°C for 20 minutes, and the non-volatile content was measured. PGMAc was added to the previously synthesized resin solution so that the non-volatile content became 20% by mass, and a non-volatile content was prepared. Photosensitive alkali-soluble resin (A2-1) solution. The weight average molecular weight (Mw) is 26,000.

(Alkali-soluble resin (A2-2) solution) Put 207 parts of cyclohexanone into a reaction vessel equipped with a thermometer, a cooling tube, a nitrogen introduction tube, a dropper tube and a stirring device in a detachable four-necked flask, raise the temperature to 80°C, and replace the reaction vessel with nitrogen. Then, 20 parts of methacrylic acid, 20 parts of benzyl methacrylate, and p-cumylphenol ethylene oxide-modified acrylate ("Aronix" manufactured by Toagosei Co., Ltd.) were added dropwise from the dropper over 2 hours. A mixture of 20 parts of M110"), 25 parts of methyl methacrylate, 8.5 parts of 2-hydroxyethyl methacrylate, and 1.33 parts of 2,2'-azobisisobutyronitrile. After completion of the dropwise addition, the reaction was continued for another 3 hours to obtain a copolymer resin solution. Next, the total amount of the copolymer solution obtained was stirred while stopping the nitrogen gas and injecting dry air for 1 hour. After cooling to room temperature, 2-methacrylyl group was added dropwise at 70° C. over 3 hours. A mixture of 6.5 parts of oxyethyl isocyanate (Karenz MOI manufactured by Showa Denko Co., Ltd.), 0.08 parts of dibutyltin laurate, and 26 parts of cyclohexanone. After the dropwise addition, the reaction was continued for another hour, and cyclohexanone was added so that the non-volatile content of the resin solution became 20% by mass, thereby preparing a photosensitive alkali-soluble resin (A2-2) solution. The weight average molecular weight (Mw) is 18,000, and the non-volatile acid value is 130 mgKOH/g.

＜Manufacturing of dispersion resin (H)＞ (Dispersion resin (H-1) solution) In a reaction container including a gas introduction pipe, a thermometer, a condenser, and a stirrer, put 10 parts of methacrylic acid, 100 parts of methyl methacrylate, 70 parts of isobutyl methacrylate, and 20 parts of benzyl methacrylate. 50 parts of PGMAc, and replaced with nitrogen. Heat and stir the reaction vessel to 50°C, and add 12 parts of 3-mercapto-1,2-propanediol. The temperature was raised to 90° C., and a solution obtained by adding 0.1 part of 2,2'-azobisisobutyronitrile to 90 parts of PGMAc was reacted for 7 hours. Through non-volatile content measurement, it was confirmed that 95% of the products reacted. Add 19 parts of pyromellitic anhydride, 50 parts of PGMAc, 50 parts of cyclohexanone, and 0.4 parts of 1,8-diazabicyclo-[5.4.0]-7-undecene as a catalyst, and heat at 100°C Let it react for 7 hours. Through the measurement of the acid value, it was confirmed that more than 98% of the acid anhydride was half-esterified, and the reaction was completed. In the non-volatile content measurement, PGMAc was added and diluted so that the non-volatile content became 30%, thereby obtaining an acid value of 70 mgKOH/g. A dispersion resin (H-1) solution with a weight average molecular weight of 8,500.

(Dispersed resin (H-2) solution) 108 parts of 1-thioglycerol, 174 parts of pyromellitic anhydride, 650 parts of PGMAc, and 0.2 parts of monobutyltin oxide as a catalyst was replaced with nitrogen and reacted at 120°C for 5 hours (first step). By measuring the acid value, it was confirmed that more than 95% of the acid anhydride was half-esterified. Next, 160 parts of the compound obtained in the first step in terms of nonvolatile content, 200 parts of 2-hydroxypropyl methacrylate, 200 parts of ethyl acrylate, 150 parts of tert-butyl acrylate, and 2-methyl acrylate were charged. 200 parts of oxyethyl ester, 200 parts of methyl acrylate, 50 parts of methacrylic acid, and 663 parts of PGMAc. Heat the reaction vessel to 80°C and add 2,2'-azobis(2,4-dimethylpentane). Nitrile) 1.2 parts, react for 12 hours (second step). Through non-volatile content measurement, it was confirmed that 95% of the products reacted. Finally, 500 parts of a PGMAc diluted solution containing 50% of the non-volatile content of the compound obtained in the second step, 27.0 parts of 2-methacryloyloxyethyl isocyanate (MOI (methacryloyloxyethyl isocyanate)), and p-benzene were charged. 0.1 part of diphenol was added, and the reaction was carried out until it was confirmed by IR that the peak at 2270 cm ^-1 based on the isocyanate group disappeared (the third step). After confirming that the peak disappeared, the reaction solution was cooled, and the nonvolatile content was adjusted using PGMAc to obtain a dispersion resin (H-2) solution with a nonvolatile content of 30%. The obtained dispersion resin (H-2) solution had an acid value of 68 mgKOH/g, an unsaturated double bond equivalent of 1,593, and a weight average molecular weight of 13,000.

(Dispersion resin (H-3) solution) Put 30 parts of methyl methacrylate, 30 parts of n-butyl methacrylate, 20 parts of hydroxyethyl methacrylate, and tetramethylethyl methacrylate into a reaction device equipped with a gas introduction pipe, a condenser, a stirring blade, and a thermometer. 13.2 parts of diamine, and stirred at 50° C. for 1 hour while flowing nitrogen gas to replace the system with nitrogen. Next, 9.3 parts of ethyl bromoisobutyrate, 5.6 parts of cuprous chloride, and 133 parts of PGMAc were charged, and the temperature was raised to 110° C. under a nitrogen gas flow to initiate polymerization of the first block (B block). After 4 hours of polymerization, the polymerization solution was sampled and the nonvolatile content was measured. It was confirmed that the polymerization conversion rate was 98% or more in terms of the nonvolatile content. Next, 61 parts of PGMAc and 20 parts of 1,2,2,6,6-pentamethylpyridine methacrylate (Hitachi Chemical Co., Ltd.) as the second block (A block) monomer were put into the reaction device. Manufactured by Industrial Co., Ltd. (FANCRYL FA-711MM), stir while maintaining 110°C in a nitrogen atmosphere to continue the reaction. Two hours after the addition of 1,2,2,6,6-pentamethylpyridine methacrylate, the polymerization solution was sampled and the non-volatile content was measured. The second block was confirmed to be converted based on the non-volatile content ( A block) has a polymerization conversion rate of more than 98%, and the reaction solution is cooled to room temperature to stop the polymerization. For nonvolatile content measurement, PGMAc was added and diluted so that the nonvolatile content was 30%, thereby obtaining a dispersion resin (H-3) with an amine value per unit of nonvolatile content of 57 mgKOH/g and a number average molecular weight of 4,500 (Mn). ) solution.

(Dispersion resin (H-4) solution) To a 500 mL round-bottomed four-neck detachable flask including a cooling tube, an addition funnel, a nitrogen inlet, a mechanical stirrer, and a digital thermometer, add 250 parts by mass of tetrahydrofuran (THF) and dioxin as an initiator through the addition funnel. 5.81 parts by mass of methylketene methyltrimethylsilyl acetal, fully replaced with nitrogen. Inject 0.5 parts by mass of a 1 mol/L acetonitrile solution of tetrabutylammonium m-chlorobenzoate as a catalyst using a syringe, and dropwise add formazan as a solvophilic block monomer using an addition funnel over 60 minutes. 19.7 parts by mass of 2-hydroxyethyl acrylate, 7.5 parts by mass of 2-ethylhexyl methacrylate, 12.9 parts by mass of n-butyl methacrylate, 10.7 parts by mass of benzyl methacrylate, 30.9 parts by mass of methyl methacrylate share. The temperature was maintained at less than 40°C by cooling the reaction flask using an ice bath. One hour later, 18.3 parts by mass of dimethylaminopropylmethacrylamide, which is a block monomer having a colored material adsorption function, was added dropwise over 20 minutes. After reacting for 1 hour, 1 part by mass of methanol was added to stop the reaction. The obtained block copolymer THF solution was reprecipitated in hexane, and then purified by filtration and vacuum drying. Next, in a 100 mL round-bottomed flask, 15.0 parts by mass of the obtained block copolymer was dissolved in 35 parts by mass of PGMAc, and 1.1 parts by mass of phenylphosphonic acid as a salt-forming component (relative to dimethylamine) was added (0.5 molar equivalent of propylmethacrylamide), stirred at a reaction temperature of 30°C for 20 hours, and adjusted by adding PGMAc to obtain a dispersion resin (H-4) solution with a non-volatile content of 30%.

<Production of polymerizable compound (B)> (Polymerizable compound (B3-1) solution having a urethane bond) Five-necked flask including a stirrer, reflux cooling tube, nitrogen introduction tube, thermometer, and dropper Put 400 parts of dipentaerythritol pentaacrylate, 100 parts of PGMAc, and 0.5 parts of N,N-dimethylbenzylamine into the medium, raise the temperature to 70°C, and drop 66 parts of toluene diisocyanate and 66 parts of PGMAc from the dropper over 2 hours. portions of the mixture. After the dropwise addition, the reaction was carried out at a temperature of 50°C to 70°C for 8 hours, and it was confirmed by IR that the absorption of isocyanate at 2180 cm ^-1 disappeared. Then, 35 parts of thioglycolic acid and 0.6 part of 4-methoxyphenol were charged, and the reaction was carried out at a temperature of 50°C to 60°C for 6 hours. The non-volatile content was adjusted to 50% by mass to obtain a solution of the polymerizable compound (B3-1) having a urethane bond.

＜Manufacture of dispersion＞ (Dispersion 1) After the following raw materials were stirred and mixed so as to become uniform, an eiger mill (mini model M manufactured by Eiger Japan) was used using zirconia beads with a diameter of 0.5 mm. -250 MKII") was dispersed for 3 hours, and then filtered through a filter with a pore size of 1.0 μm to prepare dispersion 1. The organic solvent (P-1) is PGMAc. Micronized blue pigment (F-3): 9.05 parts by mass Micronized purple pigment (F-4): 0.31 parts by mass Dye (F-11): 4.16 parts by mass Pigment derivative (G-1): 1.04 parts by mass Dispersion resin (H-1) solution: 3.47 parts by mass Alkali-soluble resin (A2-1) solution: 2.00 parts by mass Organic solvent (P-1): 79.97 parts by mass

Pigment derivative (G-1): The following structure [Chemical 11] pc represents phthalocyanine skeleton.

Dispersions 2 to 9 were prepared in the same manner as dispersion 1 except that the raw materials and amounts described in Table 1 were changed.

[Table 1] Table 1 Dispersion 1 Dispersion 2 Dispersion 3 Dispersion 4 Dispersion 5 Dispersion 6 Dispersion 7 Dispersion 8 Dispersion 9 Colorants (F) (F-1) 14.00 (F-2) 14.00 (F-3) 9.05 (F-4) 0.31 (F-5) 10.00 (F-6) 10.00 (F-7) 10.00 (F-8) 10.00 (F-9) 10.00 (F-10) 10.00 (F-11) 4.16 Pigment derivatives (G) (G-1) 1.04 (G-2) 4.00 4.00 4.00 (G-3) 2.00 Dispersion resin (H) (H-1) 3.47 7.00 10.00 10.00 10.00 10.00 10.00 (H-2) 10.00 10.00 7.00 10.00 10.00 (H-3) 7.00 7.00 (H-4) 10.00 10.00 10.00 Alkali-soluble resin (A) (A2-1) 2.00 10.00 10.00 10.00 10.00 10.00 10.00 Organic solvent (P) (P-1) 79.97 63.00 63.00 66.00 56.00 56.00 56.00 64.00 66.00

Pigment derivative (G-2) in Table 1: following structure [Chemical 12]

Pigment derivative (G-3) in Table 1: following structure [Chemical 13]

＜Manufacture of photosensitive composition＞ [Example 1] (Photosensitive composition 1) The following raw materials were mixed and stirred, and filtered through a filter with a pore size of 1.0 μm to obtain photosensitive composition 1. Dispersion 1 : 28.85 parts by mass Alkali-soluble resin (A1-1) solution: 10.00 parts by mass Polymerizable compound (B1-1): 3.00 parts by mass Polymerizable compound (B2-1): 3.00 parts by mass Polymeric compound (B3-1) solution: 2.00 parts by mass Oxime photopolymerization initiator (C1-1): 0.50 parts by mass Photopolymerization initiator (C2-1): 0.50 parts by mass Sensitizer (D2-1): 0.25 parts by mass Thiol chain transfer agent (E): 0.35 parts by mass Thermosetting compound (I): 0.50 parts by mass Polymerization inhibitor (J): 0.01 parts by mass Leveling agent (M): 1.00 parts by mass Organic solvent (P): 50.04 parts by mass

[Example 2 to Example 31, Comparative Example 1 to Comparative Example 3] (Photosensitive composition 2 to photosensitive composition 34) Photosensitive compositions 2 to 34 were produced in the same manner as in Example 1, except that the photosensitive composition 1 of Example 1 was changed to the raw materials and amounts described in Tables 2-1 to 2-4. .

[table 2-1] table 2-1 Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Example 10 Photosensitive composition 1 2 3 4 5 6 7 8 9 10 dispersion 1 28.85 28.85 28.85 28.85 28.85 28.85 28.85 28.85 28.85 28.85 Alkali-soluble resin (A) (A1) (A1-1) 10.00 10.00 10.00 10.00 10.00 10.00 10.00 10.00 10.00 10.00 (A1-2) (A2) (A2-1) (A2-2) Polymeric compound (B) (B1) (B1-1) 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 (B2) (B2-1) 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 (B3) (B3-1) 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 (B4) (B4-1) Photopolymerization initiator (C) (C1) (C1-1) 0.50 (C1-2) 0.50 (C1-3) 0.50 (C1-4) 0.50 (C1-5) 0.50 (C1-6) 0.50 0.50 0.50 0.50 0.10 (C2) (C2-1) 0.50 (C2-2) 0.50 0.50 0.50 0.50 0.50 0.50 0.90 (C2-3) 0.50 (C2-4) 0.50 (C3) (C3-1) Sensitizer (D) (D1) (D1-1) (D2) (D2-1) 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 Thiol tether transfer agent (E) 0.35 0.35 0.35 0.35 0.35 0.35 0.35 0.35 0.35 0.35 Thermosetting compound (I) 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 Polymerization inhibitor (J) 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Leveling agent (M) 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 Organic solvent (P) 50.04 50.04 50.04 50.04 50.04 50.04 50.04 50.04 50.04 50.04

[Table 2-2] Table 2-2 Example 11 Example 12 Example 13 Example 14 Example 15 Example 16 Example 17 Example 18 Example 19 Example 20 Photosensitive composition 11 12 13 14 15 16 17 18 19 20 dispersion 1 28.85 28.85 28.85 28.85 28.85 28.85 28.85 28.85 28.85 28.85 Alkali-soluble resin (A) (A1) (A1-1) 10.00 10.00 10.00 10.00 10.00 10.00 10.00 (A1-2) 10.00 (A2) (A2-1) 10.00 (A2-2) 10.00 Polymeric compound (B) (B1) (B1-1) 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 (B2) (B2-1) 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 (B3) (B3-1) 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 (B4) (B4-1) Photopolymerization initiator (C) (C1) (C1-1) (C1-2) (C1-3) (C1-4) (C1-5) (C1-6) 0.20 0.80 0.90 0.25 0.75 0.50 0.50 0.50 0.50 0.50 (C2) (C2-1) (C2-2) 0.80 0.20 0.10 0.25 0.75 0.50 0.50 0.50 0.50 0.50 (C2-3) (C2-4) (C3) (C3-1) Sensitizer (D) (D1) (D1-1) 0.25 (D2) (D2-1) 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 Thiol tether transfer agent (E) 0.35 0.35 0.35 0.35 0.35 0.35 0.35 0.35 0.35 0.35 Thermosetting compound (I) 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 Polymerization inhibitor (J) 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Leveling agent (M) 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 Organic solvent (P) 50.04 50.04 50.04 50.54 49.54 50.04 50.04 50.04 50.29 50.04

[Table 2-3] Table 2-3 Example 21 Example 22 Example 23 Example 24 Example 25 Example 26 Example 27 Example 28 Example 29 Example 30 Photosensitive composition twenty one twenty two twenty three twenty four 25 26 27 28 29 30 dispersion 1 28.85 28.85 28.85 28.85 28.85 28.85 28.85 2 30.00 3 30.00 4 0.30 5 2.00 6 2.00 7 2.25 6.25 8 17.00 9 15.00 Alkali-soluble resin (A) (A1) (A1-1) 10.00 10.00 10.00 10.00 10.00 10.00 10.00 10.00 10.00 10.00 (A1-2) (A2) (A2-1) (A2-2) Polymeric compound (B) (B1) (B1-1) 3.00 3.00 3.50 3.00 3.00 3.00 3.00 (B2) (B2-1) 3.00 3.00 3.50 3.00 3.00 3.00 (B3) (B3-1) 2.00 2.00 3.50 4.00 2.00 2.00 2.00 (B4) (B4-1) 3.50 3.50 3.50 2.00 7.00 Photopolymerization initiator (C) (C1) (C1-1) (C1-2) (C1-3) (C1-4) (C1-5) (C1-6) 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 (C2) (C2-1) (C2-2) 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.36 (C2-3) (C2-4) (C3) (C3-1) Sensitizer (D) (D1) (D1-1) (D2) (D2-1) 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 Thiol tether transfer agent (E) 0.35 0.35 0.35 0.35 0.35 0.35 0.35 0.35 Thermosetting compound (I) 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 Polymerization inhibitor (J) 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Leveling agent (M) 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 Organic solvent (P) 50.39 50.64 51.04 51.04 51.04 49.04 51.04 42.64 42.64 46.74

[Table 2-4] Table 2-4 Example 31 Comparative example 1 Comparative example 2 Comparative example 3 Photosensitive composition 31 32 33 34 dispersion 1 28.85 28.85 28.85 Alkali-soluble resin (A) (A1) (A1-1) 10.00 10.00 10.00 10.00 (A1-2) (A2) (A2-1) 0.60 (A2-2) Polymeric compound (B) (B1) (B1-1) 3.00 3.00 3.00 3.00 (B2) (B2-1) 3.00 3.00 3.00 3.00 (B3) (B3-1) 2.00 2.00 2.00 2.00 (B4) (B4-1) Photopolymerization initiator (C) (C1) (C1-1) (C1-2) (C1-3) (C1-4) (C1-5) (C1-6) 0.50 1.00 (C2) (C2-1) (C2-2) 0.50 1.00 0.50 (C2-3) (C2-4) (C3) (C3-1) 0.50 Sensitizer (D) (D1) (D1-1) (D2) (D2-1) 0.25 0.25 0.25 0.25 Thiol tether transfer agent (E) 0.35 0.35 0.35 0.35 Thermosetting compound (I) 0.50 0.50 0.50 0.50 Polymerization inhibitor (J) 0.01 0.01 0.01 0.01 Leveling agent (M) 1.00 1.00 1.00 1.00 Organic solvent (P) 78.29 50.04 50.04 50.04

Each raw material described in Table 2-1 to Table 2-4 is as follows.

[Polymerizable compound (B)] (Lactone-modified polymeric compound (B1)) B1-1: KAYARAD DPCA-30 (manufactured by Nippon Chemical Co., Ltd.)

(Polymerizable compound (B2) having an acid group) B2-1: Aronix M-520 (manufactured by Toa Gosei Corporation)

(Other polymerizable compounds (B4)) B4-1: Aronix M-402 (manufactured by Toa Gosei Corporation)

[Photopolymerization initiator (C)] (Oxime-based photopolymerization initiator (C1)) C1-1: compound of the chemical formula (2) C1-2: compound of the chemical formula (3) C1-3: compound of the chemical formula (4) C1-4: compound of the chemical formula (5) C1-5: compound of the chemical formula (6) C1-6: compound of the chemical formula (7)

(Photopolymerization initiator (C2)) C2-1: Omnirad 369 (manufactured by IGM Resins, acetophenone-based photopolymerization initiator) C2-2: Omnirad 907 (manufactured by IGM Resins, acetophenone-based photopolymerization initiator) C2-3: Omnirad TPO (manufactured by IGM Resins, hydroxyphosphine oxide photopolymerization initiator) C2-4: 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole (imidazole photopolymerization initiator)

[Sensitizer (D)] D-1: Kayacure DETX-S (manufactured by Nippon Kayaku Co., Ltd., thioxanthone-based compound) D-2: CHEMARK DEABP (manufactured by Chemark Chemical Co., Ltd., benzophenone compound)

[thiol tether transfer agent (E)] E-1: Trimethylolpropane tris(3-mercaptobutyrate) E-2: Pentaerythritol tetrakis (3-mercaptopropionate) The above (E-1) and (E-2) were mixed in the same amount respectively to prepare a thiol chain transfer agent (E).

[Thermosetting compound (I)] (Epoxy compound (I1)) I1-1: EHPE-3150 (manufactured by Daicel) I1-2: DENACOL EX-611 (manufactured by Nagase ChemteX) I1-3: Triglycidyl isocyanurate The above (I1-1) to (I1-3) were mixed in the same amount respectively to prepare a thermosetting compound (I).

[Polymerization inhibitor (J)] J-1: 4-methylcatechol J-2: Methylhydroquinone J-3: tert-butylhydroquinone The above (J-1) to (J-3) were mixed in the same amount respectively to prepare a polymerization inhibitor (J).

[Leveling agent (M)] M-1: BYK-330 (manufactured by BYK-Chemie) M-2: Megafac F-551 (manufactured by DIC Corporation) The mixed solution obtained by mixing 1 part each of the above (M-1) and (M-2) and dissolving it in 98 parts of PGMAc was used as a leveling agent (M).

[Organic solvent (P)] P-1: Propylene glycol monomethyl ether acetate 30 parts P-2: 30 parts of cyclohexanone P-3: 10 parts of ethyl 3-ethoxypropionate P-4: Propylene glycol monomethyl ether 10 parts P-5: 10 parts of cyclohexanol acetate P-6: 10 parts of dipropylene glycol methyl ether acetate The above (P-1) to (P-6) are mixed in the said mass parts respectively to prepare the organic solvent (P).

<Evaluation of photosensitive composition> The obtained photosensitive compositions 1 to 34 (Examples 1 to 31, Comparative Examples 1 to 3) were evaluated for alkali developability, pattern shape, and solvent resistance by the following methods. . The evaluation results are shown in Table 3.

[Evaluation of alkali developability] The obtained photosensitive composition was coated on a 100 mm vertical × 100 mm horizontal, 0.7 mm thick glass substrate using a spin coater so that the dry film thickness became 2.0 μm (Corning) Manufactured by Eagle 2000), pre-bake at 90°C for 120 seconds. Then, an ultrahigh-pressure mercury lamp was used to perform ultraviolet exposure with a cumulative light intensity of 30 mJ/cm ² , and the ultraviolet light was exposed through a photomask with a stripe pattern of 100 μm width. Furthermore, after the substrate was cooled to room temperature, spray development was performed using a 0.04 mass% potassium hydroxide aqueous solution at 23°C at two development time levels (40 seconds and 70 seconds), and the substrate was washed with ion-exchanged water and air-dried. The obtained substrate was post-baked at 230° C. for 30 minutes in a clean oven to form a stripe-like pattern on the substrate. The pattern was observed using an optical microscope, and the development residue and the presence of defects in the unexposed areas were evaluated. The evaluation criteria are shown below. In addition, 2 or more can be used practically. 3: When the development time is 70 seconds, there is no development residue in the unexposed parts and no pattern defects. 2: When the development time is 70 seconds, development residue or pattern defects occur in the unexposed areas. 1: When the development time is 40 seconds, development residue or pattern defects occur in the unexposed areas.

<Evaluation of Pattern Shape> The obtained photosensitive composition was applied to a 0.7 mm thick glass substrate (Corning) by spin coating so that the film thickness after drying would be 2.0 μm. Eagle 2000 (manufactured by the company) was dried on a heating plate at 70°C for 1 minute. Then, after the substrate was cooled to room temperature, a high-pressure mercury lamp was used to separate photomasks with stripe patterns of 100 μm width (pitch 200 μm) and 10 μm width (pitch 20 μm) at an illumination intensity of 30 mW/cm ² and a cumulative The light intensity was 40 mJ/cm ² for exposure. Thereafter, the substrate was spray developed using a developer containing 0.12% by mass of nonionic surfactant and 0.04% by mass of potassium hydroxide at 23°C, washed with ion-exchanged water, air-dried, and dried in a clean oven. Heating was performed at 230° C. for 30 minutes to obtain a substrate for pattern shape evaluation. Spray development is performed on a film formed of each photosensitive composition in the shortest time possible to form a pattern without any development residue. Regarding the obtained pattern, the pattern shape was confirmed using a scanning electron microscope ("S-3000H" manufactured by Hitachi High Tech). For evaluation, a cross-sectional SEM image of a stripe-type pattern with a width of 100 μm was taken, and the taper angle between the base material and the end of the pattern cross-section was measured to evaluate the cross-sectional shape. The evaluation criteria are shown below. In addition, 3 or more can be used practically. 5: The cone angle is more than 30 degrees and less than 50 degrees 4: The cone angle is more than 50 degrees and less than 60 degrees 3: The cone angle is less than 30 degrees or more than 60 degrees and less than 70 degrees 2: The cone angle is more than 70 degrees and less than 90 degrees Degree 1: The cone angle is more than 90 degrees

[Solvent resistance evaluation] The substrate for pattern shape evaluation was immersed in N-methylpyrrolidone at room temperature for 30 minutes, then washed with ion-exchanged water and air-dried, and a stripe pattern portion with a width of 100 μm was observed using an optical microscope. The evaluation criteria are shown below. In addition, 2 or more can be used practically. 4: No change in appearance or color. 3: Slight wrinkles occur, but there is no change in color. 2: Wrinkles etc. appear on some parts, but there is no change in color. 1: Peeling or fading occurs.

[table 3] table 3 Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Example 10 Photosensitive composition 1 2 3 4 5 6 7 8 9 10 Alkali developability evaluation 3 3 3 3 3 3 3 3 3 3 Pattern shape evaluation 4 4 4 4 4 5 5 4 4 4 Solvent resistance evaluation 3 3 3 3 3 4 4 4 3 2 Example 11 Example 12 Example 13 Example 14 Example 15 Example 16 Example 17 Example 18 Example 19 Example 20 Photosensitive composition 11 12 13 14 15 16 17 18 19 20 Alkali developability evaluation 3 3 2 3 3 3 3 3 3 3 Pattern shape evaluation 5 4 3 4 4 5 3 4 3 5 Solvent resistance evaluation 3 4 5 3 4 4 2 3 4 4 Example 21 Example 22 Example 23 Example 24 Example 25 Example 26 Example 27 Example 28 Example 29 Example 30 Photosensitive composition twenty one twenty two twenty three twenty four 25 26 27 28 29 30 Alkali developability evaluation 3 3 3 3 3 3 2 3 3 3 Pattern shape evaluation 4 3 4 5 5 5 3 5 5 5 Solvent resistance evaluation 3 3 4 3 4 4 4 4 4 4 Example 31 Comparative example 1 Comparative example 2 Comparative example 3 Photosensitive composition 31 32 33 34 Alkali developability evaluation 3 3 1 1 Pattern shape evaluation 5 2 2 2 Solvent resistance evaluation 4 1 3 4

without

without

Claims (9)

A photosensitive composition, including: alkali-soluble resin (A), polymerizable compound (B), and photopolymerization initiator (C). In the photosensitive composition, the photopolymerization initiator (C) includes the following The oxime-based photopolymerization initiator (C1) represented by the general formula (1) and the photopolymerization initiator (C2) other than the oxime-based photopolymerization initiator (C1), the photopolymerization initiator (C2) includes selected One or more of the group consisting of a free acetophenone-based photopolymerization initiator, a phosphine oxide-based photopolymerization initiator, and an imidazole-based photopolymerization initiator; General formula (1) In the general formula (1), R ₁ represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or 2 carbon atoms. ~20 heterocyclic group; R ₂ represents an alkyl group with 3 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or an alkyl group with 2 to 20 carbon atoms. Heterocyclic group; R ₃ represents an alkyl group with 3 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms. ; R ₄ represents a benzyl group which may have a substituent, and n represents 1. The photosensitive composition according to claim 1, wherein the mass ratio of the oxime-based photopolymerization initiator (C1) and the photopolymerization initiator (C2) other than the oxime-based photopolymerization initiator (C1) is 90:10～10:90. The photosensitive composition according to claim 1, further containing a sensitizer (D). The photosensitive composition according to claim 1, further containing a thiol tether transfer agent (E). The photosensitive composition according to claim 1, wherein the alkali-soluble resin (A) contains an alkali-soluble resin (A1), and the alkali-soluble resin (A1) contains an alicyclic hydrocarbon-containing monomer unit ( a1) and carboxyl-containing monomer unit (a2). The photosensitive composition according to claim 5, wherein the alkali-soluble resin (A1) contains 5 to 60 mol% of the total structural units of the alkali-soluble resin (A1). A monomer unit (a1) of an alicyclic hydrocarbon. An optical filter having: a substrate; and a filter segment formed of the photosensitive composition according to any one of claims 1 to 5. An image display device having the optical filter described in claim 7. A solid-state imaging element having the optical filter according to claim 7.