TW202342713A - Cleaning composition for metal mask and cleaning method using the same - Google Patents

Abstract

The present invention relates to a composition for cleaning a metal mask and a cleaning method using same. Particularly, disclosed are: a composition for cleaning a metal mask, comprising 70 to 90 wt% of a phosphonic acid metal chelating agent based on the total weight of the composition, and the residual amount of water; and a method for cleaning a metal mask using the composition for cleaning.

Description

Metal mask cleaning composition and cleaning method using same

The embodiments relate to a metal mask cleaning composition and a cleaning method using the same.

Organic Light Emitting Diodes (OLED) are electronic components in which organic compounds that emit light by receiving electrical energy are laminated in the form of thin films, and have various advantages for use as next-generation lighting and display materials. OLED displays are composed of several layers such as thin film transistor (TFT) elements, organic materials, encapsulation layers and cover windows, and this multi-layer structure can be formed by a deposition method using a mask. The masks used in the deposition process when manufacturing OLED displays include open masks (OM) and high-precision metal masks (Fine Metal Masks, FMM), and metal materials are usually used. In the display manufacturing process, an open mask is used in the process of forming a light-emitting layer by depositing an organic film on an OLED substrate, and a high-precision metal mask is a thin metal plate with ultra-fine holes (Hole), which plays the role of The function of inducing red (Red), green (Green), and blue (Blue) organic light-emitting materials to pass through the holes and deposit on the desired positions on the substrate respectively. Since the accuracy of deposition through such a mask is directly related to production yield, precise processing of the mask is important.

Typical methods for manufacturing metal masks include the etching method, which rolls a metal plate thin and then cuts off the unnecessary parts, or the electroforming method, which uses the principle of electroplating to electroplat on a patterned substrate. . However, there are other limitations such as selective etching, and in order to achieve high resolution 1000 ppi suitable for virtual reality (VR) and augmented reality (AR) implementations following Ultra High Definition (UHD) grade 800 ppi, by using laser drilling Laser patterning methods for creating patterns are receiving attention.

In the process of using laser for metal mask processing, a large amount of metal impurities and metal oxides will be produced due to the high temperature reaction of the laser. These metal oxides may be sandwiched on the processing surface of the metal mask and exist as defective pixels, and may contaminate the periphery of the processing pixels, making it difficult to ensure a uniform processing area.

This kind of removal of metal impurities and metal oxides is carried out in the prior art by using the RCA-2 cleaning process and the cleaning process including other inorganic acids. However, the process may have harmful effects on the metal due to the use of hydrochloric acid and other inorganic acids. The mask material itself has a strong corrosive effect, especially the cleaning equipment used in the cleaning process, which may also be corrosive and become a problem. In addition, since most inorganic acids are environmentally controlled substances, there are many restrictions on their application. Therefore, there is a need for a new cleaning composition and cleaning method that can solve the above problems.

[Prior technical literature]

[Technical Documentation]

(Patent document) KR 10-1761736 B

[Technical Issue]

In order to solve the above technical problems, the purpose of the embodiments is to provide a cleaning composition and a cleaning method that do not include environmentally controlled substances, and the cleaning composition serves as a base material of a metal mask for laser processing without damaging it. A cleaning composition capable of selective cleaning at the same time.

In order to solve the above technical problems, the embodiment proposes a metal mask cleaning composition, which includes 70 to 90 wt% of phosphonic acid metal chelating agent based on the total weight of the composition; and the remaining amount of water.

In addition, in a specific embodiment, a metal mask cleaning composition is provided, which further includes 0.001% to 1% by weight of a corrosion inhibitor based on the total weight of the composition.

In another specific embodiment, a metal mask cleaning composition is provided, which further includes 0.01% to 0.1% by weight of a corrosion inhibitor based on the total weight of the composition.

In the metal mask cleaning composition, the phosphonic acid metal chelating agent is characterized in that it includes diethylene triamine pentamethylene phosphonic acid (DTPMPA), aminotrimethylene phosphonic acid (ATMP), hydroxyethylene Diphosphonic acid (HEDP), hexamethylenediaminetetramethylenephosphonic acid (HMDTMPA), 2-phosphonic acid butane-1,2,4-tricarboxylic acid (PBTCA), and ethylenediaminetetramethylenephosphonic acid ( EDTMP).

Furthermore, in the metal mask cleaning composition, the corrosion inhibitor is characterized in that it includes benzotriazole, 1-Amino-benzotriazole, 1-hydroxybenzotriazole. At least one of the group consisting of triazole (1-Hydroxy-benzotriazole), 5-methylbenzotriazole (5-Methyl-1H-benzotriazole) and 5-carboxybenzotriazole (Benzotriazole-5-carboxylic acid) a.

In the metal mask cleaning composition, the cleaning may be to remove oxides formed when laser light is irradiated onto the metal mask.

In the metal mask cleaning composition, the oxide may be selected from iron (Fe), cobalt (Co), chromium (Cr), manganese (Mn), nickel (Ni), titanium (Ti), molybdenum ( An oxide of at least one metal in the group consisting of Mo), stainless steel (Steel Use Stainless, SUS) alloy, Inconel alloy, Kovar alloy, and Invar alloy.

In the metal mask cleaning composition, the base material of the metal mask may include iron (Fe), cobalt (Co), chromium (Cr), manganese (Mn), and nickel (Ni). At least one metal from the group consisting of titanium (Ti), molybdenum (Mo), stainless steel (SUS) alloy, Inconel alloy, Kovar alloy, and Invar alloy.

In addition, a method for cleaning a metal mask is provided, which includes the step of bringing the cleaning composition into contact with the metal mask.

The cleaning method according to a specific embodiment may be performed by contacting the cleaning composition with the metal mask using at least one of a spraying method, a dipping method, and an ultrasonic method.

The cleaning method according to a specific embodiment may include using the dipping method to perform a first step at a temperature of 10°C to 50°C for 5 minutes to 30 minutes.

The cleaning method according to a specific embodiment may include a second step performed by applying ultrasonic waves using distilled water at a temperature of 10°C to 50°C for 5 minutes to 30 minutes after the first step.

[beneficial effect]

The metal mask cleaning composition and cleaning method according to the embodiment can provide a cleaning composition and cleaning method that can selectively clean without damaging the base material of a laser-processed metal mask. In particular, the cleaning composition of the present invention and the cleaning method using the same can remove metal oxides with higher cleaning power without damaging the substrate of a laser-processed fine metal mask.

In addition, embodiments may provide cleaning compositions and cleaning methods that do not include environmentally regulated substances.

Hereinafter, in order to enable those skilled in the art to easily implement the present embodiment, this embodiment will be described in detail with reference to the accompanying drawings. When describing the embodiments, if it is judged that detailed description of relevant known components or functions may obscure the gist of the embodiments, the detailed description thereof will be omitted.

In addition, in this application, terms such as "comprising" or "having" are intended to indicate the presence of the features, numbers, steps, operations, constituent elements, parts or combinations thereof described in the specification, but it should be understood that the presence or addition of a or multiple other features, numbers, steps, operations, constituent elements, parts or combinations thereof. In this application, singular expressions may include plural expressions unless the context clearly dictates otherwise.

Hereinafter, the metal mask cleaning composition according to the embodiment and the cleaning method using the same will be described in detail.

The metal mask cleaning composition according to an embodiment includes 70 to 90 wt% of a phosphonic acid metal chelating agent based on the total weight of the composition; and the remaining amount of water.

The content of the phosphonate metal chelating agent is relatively high, that is, 70 to 90 wt% based on the total weight of the composition, so that improved metal mask cleaning ability can be exhibited. Strong acids such as sulfuric acid, phosphoric acid and hydrochloric acid included in existing cleaning compositions will produce harmful substances such as SO _x and NO _x during the cleaning process, and when the content is high, the properties of the strong acid will have an adverse effect on the corrosion of the metal mask. , but the metal mask cleaning composition of the embodiment can exhibit excellent cleaning ability without damaging the metal mask base material, and is not an environmentally controlled substance. In addition, the cleaning composition of the embodiment has the advantage of being non-corrosive to stainless steel (SUS) series ultrasonic tank materials.

In particular, the metal mask cleaning compositions of the embodiments can exhibit very effective cleaning capabilities while exhibiting a strong acidity of pH 1.0 or less by including a phosphonic acid metal chelating agent, particularly without damaging the invar. The metal mask of the substrate simultaneously exhibits high cleaning capabilities.

According to a specific embodiment, the phosphonic acid metal chelating agent is characterized in that it includes diethylene triamine pentamethylene phosphonic acid (DTPMPA), aminotrimethylene phosphonic acid (ATMP), hydroxyethylene diphosphonic acid ( HEDP), hexamethylenediaminetetramethylenephosphonic acid (HMDTMPA), 2-butane-1,2,4-tricarboxylic acid (PBTCA), and ethylenediaminetetramethylenephosphonic acid (EDTMP) One or more of the group.

As mentioned above, in the metal mask cleaning composition according to a specific embodiment including 70 to 90 wt% of phosphonic acid metal chelating agent based on the total weight of the composition; and the remaining amount of water, the The remaining amount of water refers to the remaining weight % after removing the metal chelating agent when the cleaning composition is 100% by weight.

The metal mask cleaning composition according to a specific embodiment may further include 0.001% to 1% by weight of a corrosion inhibitor based on the total weight of the composition, more preferably 0.01% by weight based on the total weight of the composition. to 0.1% by weight.

In other words, 70 to 90 wt% of the phosphonate metal chelating agent; 0.001 to 1 wt% of the corrosion inhibitor; and the remaining amount of water may be included based on the total weight of the composition. More preferably, 70% to 90% by weight of phosphonate metal chelating agent; 0.01% to 0.1% by weight of corrosion inhibitor agent; and the remaining amount of water may be included based on the total weight of the composition.

The remaining amount of water refers to the remaining weight % after excluding the contents of the phosphonic acid metal chelating agent and the corrosion inhibitor based on 100% by weight of the cleaning composition.

The metal mask cleaning composition according to a specific embodiment has the advantage of having almost no corrosion to the metal mask base material by including the corrosion inhibitor within the content range.

The corrosion inhibitor is characterized by including at least one of an azol-based (Azol)-based and an ethanolamine-based (Ethanolamine)-based corrosion inhibitor, but is not limited thereto.

The azole-based corrosion inhibitor may include at least one selected from the group consisting of triazole compounds, benzotriazole compounds, imidazole compounds, tetrazole compounds, thiazole compounds, oxazole compounds, and pyrazole compounds.

The ethanolamine-based corrosion inhibitor may include at least one selected from the group consisting of monoethanolamine, diethanolamine, and triethanolamine.

More preferably, the corrosion inhibitor includes a benzotriazole compound. Specifically, it may include a group selected from benzotriazole, 1-Amino-benzotriazole, 1-Hydroxy-benzotriazole, 5-methylbenzene One or more of the group consisting of 5-Methyl-1H-benzotriazole and 5-carboxybenzotriazole-5-carboxylic acid.

In particular, the metal mask cleaning composition of the embodiment more preferably includes 0.01 to 0.1 wt% of the benzotriazole compound based on the total weight of the composition. The metal mask cleaning composition having this composition In particular, metal masks made of Invar materials themselves do not exhibit etching or pitting (pit) corrosion, nor do they exhibit corrosion to cleaning equipment.

For example, the cleaning equipment may be SUS 304 or SUS 316, which is commonly used as a material for ultrasonic baths, but is not limited thereto.

The purpose of the metal mask cleaning composition according to a specific embodiment is to remove oxides formed when laser irradiates the metal mask during metal mask processing. That is, when a metal mask is irradiated with a laser, the metal mask base material is oxidized by the high-temperature reaction of the laser to generate a metal oxide, and the cleaning composition of the embodiment removes this oxide. Correspondingly, the oxide may be selected from iron (Fe), cobalt (Co), chromium (Cr), manganese (Mn), nickel (Ni), titanium (Ti), molybdenum (Mo), stainless steel (SUS) An oxide of at least one metal among alloys, Inconel alloys, Kovar alloys, and Invar alloys.

In addition, the base material of the metal mask may include iron (Fe), cobalt (Co), chromium (Cr), manganese (Mn), nickel (Ni), titanium (Ti), molybdenum (Mo), stainless steel At least one metal selected from (SUS) alloy, Inconel alloy, Kovar alloy, and Invar alloy.

For example, the metal mask substrate may be Invar alloy. The main components of Invar alloy are iron (Fe) and nickel (Ni). Compared with SUS alloy, its thermal expansion is small and the tension will not be significantly reduced even at high temperatures, so it is more preferably used as a metal mask base material. In addition, when the cleaning composition of the Example is used for a metal mask using an Invar alloy as a base material, it is more preferable because it has low corrosiveness and high cleaning properties.

In one aspect, a method for cleaning a metal mask according to a specific embodiment may be provided. For example, the cleaning method of the present invention includes the step of contacting a cleaning composition including 70 to 90 wt% of a phosphonic acid metal chelating agent based on the total weight of the composition; and the remaining amount of water with the metal mask.

The metal mask cleaning method according to a specific embodiment can be performed by contacting the cleaning composition with the metal mask using at least one of spraying, dipping and ultrasonic methods, but is not limited to the above method. The spraying method may be a method of spraying the cleaning composition onto a metal mask base material, and the dipping method may be a method of filling a cleaning tank with the cleaning composition and immersing the metal mask base material. The ultrasonic method can be performed by dipping the metal mask base material into the cleaning composition and applying ultrasonic waves.

In the metal mask cleaning method according to a specific embodiment, the step of contacting the cleaning composition with the metal mask can be performed by using a dipping method at a temperature of 10°C to 50°C for 5 minutes to 30 minutes, but Not limited to this.

In addition, the metal mask may be cleaned in a method in which the first step using the dipping method is further followed by a second step performed by applying ultrasonic waves using distilled water at a temperature of 10°C to 50°C for 5 minutes to 30 minutes. mold.

A metal mask cleaning method according to a specific embodiment may include 70% to 90% by weight of a phosphonic acid metal chelating agent based on the total weight of the composition; 0.01% to 0.1% by weight of a corrosion inhibitor; and the remaining amount. The step of contacting the metal mask with the aqueous cleaning composition, and all of the above cleaning methods can be used.

Hereinafter, a more detailed description will be given through examples. However, the following examples are only used to specifically illustrate the present invention and are not intended to limit the patentable scope of the invention. That is, those skilled in the art to which this embodiment belongs can easily make simple modifications or changes to the embodiments, and all such modifications or changes can be considered to be included within the scope of the embodiments.

<Example 1>

As follows, after manufacturing a metal mask cleaning composition according to the composition in the table, the metal mask is cleaned, and i) the corrosiveness of the ultrasonic bath (material SUS 304, 316) cleaning equipment is evaluated; ii) the metal mask Corrosiveness (etching), iii) Metal mask corrosiveness (pitting corrosiveness), and iv) Appearance cleanability.

1. Assessment methods

i) The evaluation of the corrosiveness of ultrasonic bath (material SUS 304, 316) cleaning equipment is to test whether the ultrasonic cleaning equipment is corroded due to the cleaning composition. After fixing each cleaning composition to 50°C, SUS 304 and 316 pieces were dipped, and the corrosiveness was observed and evaluated after 1 hour as follows.

[Table 1] ◎ No corrosion occurs ◯ There is no change in the appearance of the fragments, and hydrogen gas is produced after 30 minutes. △ The appearance of part of the fragments changes, and hydrogen gas is produced after 10 minutes. X The appearance of the fragments changes and hydrogen gas is produced immediately

ii) The assessment of metal mask corrosiveness (etchability) is to assess whether the metal mask substrate itself is etched. After immersing the laser-processed Invar fine metal mask (FMM) in each cleaning composition, the ultrasonic device was heated to 50°C and cleaned for 10 minutes, and the etching rate was observed and evaluated with SEM (cross-section) as follows.

[Table 2] ◎ Material is not etched ◯ Material etching (<0.3 μm) △ Material etching (<1.0 μm) X Material etching (>1.0 μm)

iii) The evaluation of metal mask corrosiveness (pit corrosion) is to evaluate whether pits (pits), that is, small holes, are formed in the metal mask base material. After immersing the laser-processed high-precision metal mask (FMM) made of Invar into each cleaning composition, the ultrasonic device was heated to 50°C and cleaned for 10 minutes, and the etching rate was observed and evaluated with SEM (cross-section) as follows .

[table 3] ◎ No corrosion occurs ◯ Pitting corrosion (<3 μm) △ Pitting corrosion (<5 μm) X Pitting corrosion (>5μm)

iv) In the evaluation of the apparent cleanability, each cleaning composition and the metal mask were put into an ultrasonic device, and then cleaned at 50° C. for 10 minutes, and the apparent cleanability was observed and evaluated as follows.

[Table 4] LV1 Good appearance gloss and cleaning power LV2 Appearance slightly darker, with some debris LV3 Dark appearance with many fragments LV4 No change in appearance and no cleaning effect

2. Cleaning test based on whether phosphate-based metal chelating agents are included

After preparing the cleaning composition according to the composition in Table 5 below, a cleaning test was performed. #1-1 to #1-8 include diethylene triamine pentamethylene phosphonic acid (DTPMPA), aminotrimethylene phosphonic acid (ATMP), hydroxyethylene diphosphonic acid (HEDP), and hexane diphosphonic acid, respectively. The case of amine tetramethylene phosphonic acid (HMDTMPA), 2-phosphonobutane-1,2,4-tricarboxylic acid (PBTCA), and ethylenediamine tetramethylenephosphonic acid (EDTMP), #2-1 To #2-6 are cases where strong acids commonly used in cleaning compositions (phosphoric acid, hydrochloric acid) are included, and #2-7 are cases where ethylenediaminetetraacetic acid (EDTA) is used as another chelating agent. In addition, as corrosion inhibitors, benzotriazole (BTA) or triethanolamine (TEA) is used.

[table 5] No. Active ingredients water corrosion inhibitor Total(weight%) Corrosiveness of cleaning equipment Corrosiveness (etchability) of metal masks Corrosion of metal masks (pitting corrosion) Cleanability (appearance) Kind Content(weight%) Content(weight%) Content(weight%) #1-1 DTPMPA 50 50 - 100 ◎ △ △ LV1 #1-2 ATMP 50 50 - 100 ◎ △ △ LV1 #1-3 HEDP 50 50 - 100 ◎ △ △ LV1 #1-4 HMDTMPA 50 50 - 100 ◎ △ △ LV1 #1-5 PBTCA 50 50 - 100 ◎ △ △ LV1 #1-6 EDTMP 50 50 - 100 ◎ △ △ LV1 #1-7 ATMP 50 49 BTA, 1 100 ◎ ◎ ◎ LV2 #1-8 ATMP 50 49 BTA, 1 100 ◎ ◯ ◎ LV3 #2-1 Phosphoric acid 10 90 - 100 ◯ X ◯ LV1 #2-2 Phosphoric acid 10 89 BTA, 1 100 ◯ X ◯ LV2 #2-3 Phosphoric acid 10 89 TEA, 1 100 ◯ X ◯ LV2 #2-4 hydrochloric acid 10 90 - 100 X X X LV1 #2-5 hydrochloric acid 10 89 BTA, 1 100 X X X LV1 #2-6 hydrochloric acid 10 89 TEA, 1 100 X X X LV1 #2-7 EDTA 50 50 - 100 ◎ ◎ ◎ LV4

From the above results, it was confirmed that the compositions #1-1 to #1-8 including the phosphate-based metal chelating agent showed more excellent effects in terms of cleaning properties and corrosive properties. Especially when strong acids such as phosphoric acid and hydrochloric acid are used, even in relatively small amounts (10% by weight), severe corrosion can occur on metal masks and cleaning equipment.

Figure 1 is a photo of ultrasonic cleaning equipment taken after cleaning with an existing cleaning composition. Specifically, the cleaning composition according to #2-4 was used, and it can be confirmed from Figure 1 that corrosion occurred in the ultrasonic bath after cleaning.

2A to 2B are photos taken before and after cleaning the metal mask to confirm the cleaning properties in appearance.

FIG. 2A is a photo of the metal mask after laser processing, which is the state before cleaning. Figure 2B shows the cleaning properties in appearance at the level of LV1 (good appearance gloss and cleaning power) according to Example 5 described later. Figure 2C corresponds to #1-7 in Table 5 and shows LV2 (slightly dark appearance with some fragments). (debris)) degree of appearance cleanability. Figure 2D corresponds to #1-8 in Table 5, indicating LV3 (dark appearance, many fragments) appearance cleaning properties, and Figure 2E corresponds to #2-7 in Table 5, indicating LV4 (No change in appearance, no cleaning effect) Appearance cleanability.

From Figure 2, it can be confirmed that the cleaning composition including the phosphonic acid-based metal chelating agent exhibits more excellent cleaning properties in appearance.

Based on the above results, in the following, cleaning compositions having various compositions including ATMP were manufactured and tested.

3. Test Example 1: Cleaning test based on phosphate metal chelate content

According to the composition of Table 6 below, prepare a cleaning composition by adjusting the content of phosphate metal chelate, and then conduct a cleaning test.

[Table 6] No. Active ingredients water corrosion inhibitor Total(weight%) Corrosiveness of cleaning equipment Corrosiveness (etchability) of metal masks Corrosion of metal masks (pitting corrosion) Cleanability (appearance) Kind Content(weight%) Content(weight%) Content(weight%) Comparative example 1 ATMP 30 70 - 100 ◎ X △ LV1 Comparative example 2 ATMP 50 50 - 100 ◎ △ △ LV1 Example 1 ATMP 70 30 - 100 ◎ ◯ ◯ LV1 Example 2 ATMP 80 20 - 100 ◎ ◯ ◎ LV1 Example 3 ATMP 90 10 - 100 ◎ ◯ ◎ LV1

In Examples 1 to 3 including 70% by weight or more of the phosphonic acid metal chelating agent, it was confirmed that the corrosivity of the ultrasonic bath cleaning equipment, the metal mask corrosivity ( Etching properties), metal mask corrosion properties (pitting corrosion properties), and appearance cleaning properties show excellent results.

3A and 3B are SEM photos before and after cleaning the metal mask using the composition according to Comparative Example 1, respectively. Figure 3A is a photo of the metal mask taken after laser processing and before cleaning. 3B is a photograph of a metal mask cleaned by using the composition of Comparative Example 1.

4 is an SEM photograph of a metal mask after cleaning by using the composition of Comparative Example 1 and Example 2. 4A is a photograph taken of a metal mask cleaned by using the composition according to Comparative Example 1, and FIG. 4B is a photograph taken of a metal mask cleaned by using the composition according to Example 2. Referring to FIG. 4A , it can be confirmed that pit corrosion occurs when the composition according to Comparative Example 1 is used for cleaning.

4. Test Example 2: Cleaning test based on phosphate-based metal chelate content

According to the composition of Table 7 below, BTA as a corrosion inhibitor is usually included at 0.01% by weight, but after the cleaning composition is manufactured by adjusting the content of the phosphate metal chelate, a cleaning test is performed.

[Table 7] No. Active ingredients water corrosion inhibitor Total(weight%) Corrosiveness of cleaning equipment Corrosiveness (etchability) of metal masks Corrosion of metal masks (pitting corrosion) Cleanability (appearance) Kind Content(weight%) Content(weight%) Content(weight%) Comparative example 3 ATMP 60 39.99 BTA, 0.01 100 ◎ ◎ ◎ LV2 Example 4 ATMP 70 29.99 BTA, 0.01 100 ◎ ◎ ◎ LV1~LV2 Example 5 ATMP 80 19.99 BTA, 0.01 100 ◎ ◎ ◎ LV1 Comparative example 4 ATMP 95 4.99 BTA, 0.01 100 ◎ ◎ ◎ LV2 Comparative example 5 ATMP 99.99 0 BTA, 0.01 100 ◎ ◎ ◎ LV2~LV3

As in the above-mentioned Test Example 1, in the case of Comparative Example 3 containing less than 70% by weight of the phosphonic acid metal chelating agent, it was confirmed that the cleanability was not good in appearance, and in the case of the comparative example containing more than 90% by weight of the phosphonic acid metal chelating agent In the case of Comparative Example 4 and Comparative Example 5, it was confirmed that the cleanability was not good in terms of appearance.

Figure 5 is a SEM photograph before and after cleaning a metal mask by using the composition of Example 5. 5A is a photograph taken of a metal mask before cleaning after laser processing, and FIG. 5B is a photograph taken of a metal mask cleaned by using the composition according to Example 5. In addition, FIG. 5C is a photograph taken of the metal mask before cleaning after laser processing, and FIG. 5D is a photograph taken of the metal mask cleaned by using the composition according to Example 5. Compared with Figure 3, it can be confirmed from the observation values that when the composition of Comparative Example 1 is used for cleaning, the corrosion degree of the metal mask itself is more serious.

FIG. 6A is an SEM photo after cleaning the metal mask using the composition of Comparative Example 4. FIG. 6B is an SEM photo after cleaning the metal mask using the composition of Comparative Example 5. It can be confirmed from Figures 6A and 6B that when the content of ATMP included in the cleaning composition exceeds 90% by weight, cleaning failure occurs in the fine areas. This is judged to be due to the increase in viscosity, which limits penetration into the fine areas, resulting in cleaning power. On the contrary, it decreases.

5. Test Example 3: Cleaning test based on corrosion inhibitor content

According to the composition of Table 8 below, the phosphate metal chelate is usually included at 80% by weight, but the cleaning composition is manufactured by adjusting the content of BTA as a corrosion inhibitor, and then a cleaning test is performed.

[Table 8] No. Active ingredients water corrosion inhibitor Total(weight%) Corrosiveness of cleaning equipment Corrosiveness (etchability) of metal masks Corrosion of metal masks (pitting corrosion) Cleanability (appearance) Kind Content(weight%) Content(weight%) Content(weight%) Example 2 ATMP 80 20 - 100 ◎ ◯ ◎ LV1 Example 5 ATMP 80 19.99 BTA, 0.01 100 ◎ ◎ ◎ LV1 Example 6 ATMP 80 19.95 BTA, 0.05 100 ◎ ◎ ◎ LV1 Example 7 ATMP 80 19.9 BTA, 0.1 100 ◎ ◎ ◎ LV1 Example 8 ATMP 80 19.8 BTA, 0.2 100 ◎ ◎ ◎ LV2 Example 9 ATMP 80 19.5 BTA, 0.5 100 ◎ ◎ ◎ LV2

From this, it can be confirmed that it is more preferable to include a corrosion inhibitor in terms of corrosiveness, but when the content is too high, the cleanability becomes poor in appearance.

The above description of the embodiments is illustrative only, and those skilled in the art will understand that various modifications and equivalent other embodiments may be made thereby. Therefore, the true protection scope of the present invention should be subject to the appended invention application patent scope. All differences within the equivalent scope recorded in the invention application patent scope should be deemed to be included in the protection scope defined by the invention application patent scope. .

without

Figure 1 is a photograph taken in an ultrasonic bath to confirm corrosiveness after cleaning using a conventional cleaning composition. 2A to 2E are photographs of a metal mask taken to confirm the apparent cleaning properties after cleaning using the cleaning composition according to one test example. Figures 3A and 3B are scanning electron microscope (SEM) photos of the metal mask before and after cleaning using the composition of Comparative Example 1 (before cleaning: Figure 3A, after cleaning: Figure 3B). FIG. 4A is an SEM photo after cleaning the metal mask using the composition of Comparative Example 1. Figure 4B is an SEM photo after cleaning the metal mask using the composition of Example 2. 5A and 5B are SEM photos before and after cleaning the metal mask using the composition according to Example 5 respectively. In addition, FIG. 5C and FIG. 5D are respectively SEM photos before and after cleaning the metal mask using the composition according to Example 5. FIG. 6A is an SEM photo after cleaning the metal mask using the composition of Comparative Example 4. FIG. 6B is an SEM photo after cleaning the metal mask using the composition of Comparative Example 5.

Claims (12)

A composition for metal mask cleaning, including: Based on the total weight of the composition, 70% to 90% by weight of phosphonate metal chelating agent; and remaining amount of water. The metal mask cleaning composition as described in claim 1 of the patent application, wherein: The composition further includes 0.001% to 1% by weight of a corrosion inhibitor, based on the total weight of the composition. The metal mask cleaning composition as described in claim 1 of the patent application, wherein: The composition further includes 0.01% to 0.1% by weight of a corrosion inhibitor, based on the total weight of the composition. The metal mask cleaning composition as described in claim 1 of the patent application, wherein: The phosphonic acid metal chelating agent includes one selected from the group consisting of diethylenetriamine penta(methylene phosphonic acid), DTPMPA), aminotrimethylene phosphonic acid (Aminotri(methylene phosphonic acid), ATMP), hydroxyl 1-hydroxyethylidene-1,1-diphosphonic acid (HEDP), Hexamethylenediamine tetra (methylene phosphonic acid), HMDTMPA, 2-butane-1 phosphonate, In the group consisting of 2-phosphonobutane-1,2,4-tricarboxylic acid (PBTCA) and ethylenediamine tetra (methylene phosphonic acid) (EDTMP) At least one. The metal mask cleaning composition as described in claim 2 of the patent application, wherein: The corrosion inhibitor includes benzotriazole, 1-Amino-benzotriazole, 1-Hydroxy-benzotriazole, 5-methyl At least one of the group consisting of benzotriazole (5-Methyl-1H-benzotriazole) and 5-carboxybenzotriazole (Benzotriazole-5-carboxylic acid). The metal mask cleaning composition as described in claim 1 of the patent application, wherein: The cleaning is to remove the oxide formed when the laser irradiates the metal mask. The metal mask cleaning composition as described in claim 6 of the patent application, wherein: The oxide is selected from iron (Fe), cobalt (Co), chromium (Cr), manganese (Mn), nickel (Ni), titanium (Ti), molybdenum (Mo), stainless steel (SUS) alloy, chromium-nickel An oxide of at least one metal from the group consisting of Inconel alloy, Kovar alloy, and Invar alloy. The metal mask cleaning composition as described in claim 1 of the patent application, wherein: The base material of the metal mask includes iron (Fe), cobalt (Co), chromium (Cr), manganese (Mn), nickel (Ni), titanium (Ti), molybdenum (Mo), At least one metal from the group consisting of stainless steel (SUS) alloy, Inconel alloy, Kovar alloy, and Invar alloy. A method for cleaning a metal mask, including the step of contacting a cleaning composition including 70 to 90 wt% of a phosphonic acid metal chelating agent based on the total weight of the composition and the remaining amount of water with the metal mask. The cleaning method of metal mask as described in claim 9 of the patent application, wherein: The composition further includes 0.01% to 0.1% by weight of a corrosion inhibitor, based on the total weight of the composition. The cleaning method of metal mask as described in claim 9 of the patent application, wherein: The cleaning method is performed by bringing the cleaning composition into contact with the metal mask using at least one of a spraying method, a dipping method, and an ultrasonic method. The metal mask cleaning composition as described in claim 11 of the patent application, wherein, The cleaning method includes using the dipping method to perform a first step at a temperature of 10°C to 50°C for 5 minutes to 30 minutes.