TW202340660A - Refrigeration device and temperature adjustment system - Google Patents
Refrigeration device and temperature adjustment system Download PDFInfo
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- TW202340660A TW202340660A TW111147560A TW111147560A TW202340660A TW 202340660 A TW202340660 A TW 202340660A TW 111147560 A TW111147560 A TW 111147560A TW 111147560 A TW111147560 A TW 111147560A TW 202340660 A TW202340660 A TW 202340660A
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 235
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 125
- 239000003507 refrigerant Substances 0.000 claims abstract description 123
- 238000001816 cooling Methods 0.000 claims abstract description 28
- 230000006835 compression Effects 0.000 claims abstract description 15
- 238000007906 compression Methods 0.000 claims abstract description 15
- 239000012530 fluid Substances 0.000 claims description 28
- 238000011144 upstream manufacturing Methods 0.000 claims description 19
- 238000002347 injection Methods 0.000 description 13
- 239000007924 injection Substances 0.000 description 13
- 238000005265 energy consumption Methods 0.000 description 11
- 238000009833 condensation Methods 0.000 description 9
- 230000005494 condensation Effects 0.000 description 9
- 230000007613 environmental effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000004781 supercooling Methods 0.000 description 6
- 230000007704 transition Effects 0.000 description 5
- 238000007710 freezing Methods 0.000 description 4
- 230000008014 freezing Effects 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000009529 body temperature measurement Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 239000008399 tap water Substances 0.000 description 2
- 235000020679 tap water Nutrition 0.000 description 2
- 239000012267 brine Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000006903 response to temperature Effects 0.000 description 1
- 230000001932 seasonal effect Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B1/00—Compression machines, plants or systems with non-reversible cycle
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B6/00—Compression machines, plants or systems, with several condenser circuits
- F25B6/04—Compression machines, plants or systems, with several condenser circuits arranged in series
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B7/00—Compression machines, plants or systems, with cascade operation, i.e. with two or more circuits, the heat from the condenser of one circuit being absorbed by the evaporator of the next circuit
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- Physics & Mathematics (AREA)
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- Devices That Are Associated With Refrigeration Equipment (AREA)
- Other Air-Conditioning Systems (AREA)
Abstract
Description
本發明之實施形態,係有關於具備有複數之冷凍迴路之多元式的冷凍裝置以及調溫系統。An embodiment of the present invention relates to a multi-type refrigeration device and a temperature control system equipped with a plurality of refrigeration circuits.
身為多元式之冷凍裝置之例的二元冷凍裝置,係具備有高溫側冷凍迴路和低溫側冷凍迴路,並藉由高溫側冷凍迴路之蒸發器與低溫側冷凍迴路之冷凝器來構成能夠將彼此之冷媒作熱交換的級聯冷凝器。在級聯冷凝器處,係藉由在高溫側冷凍迴路處而於冷凝後作了膨脹的高溫側冷媒,來使在低溫側冷凍迴路處而被作了壓縮的低溫側冷媒作冷凝。對於被作了冷凝的低溫側冷媒,係賦予有大的過冷卻度,之後,其係被作膨脹並降溫。藉由此,若依據二元冷凍裝置,則係能夠將溫度控制對象一直冷卻至極為低溫之溫度區域(JP6727422B)。Binary refrigeration equipment, which is an example of a multi-type refrigeration equipment, is equipped with a high-temperature side refrigeration circuit and a low-temperature side refrigeration circuit, and is composed of an evaporator of the high-temperature side refrigeration circuit and a condenser of the low-temperature side refrigeration circuit. Cascade condensers that exchange heat with each other's refrigerants. At the cascade condenser, the high-temperature side refrigerant that has been expanded after condensation in the high-temperature side refrigeration circuit condenses the low-temperature side refrigerant that has been compressed in the low-temperature side refrigeration circuit. A large degree of supercooling is given to the condensed low-temperature side refrigerant, and then it is expanded and cooled. By this, if the binary refrigeration device is used, the temperature control object can be cooled down to an extremely low temperature region (JP6727422B).
二元冷凍裝置,由於係具備有2個的冷凍迴路,因此,通常其尺寸係變得較單元之冷凍裝置而更大。又,為了得到高的冷凍能力,係有必要使用高流量以及高壓縮比之壓縮機。於此情況,不但是尺寸會更進一步變大,零件成本也會變高,並且能量消耗量也會變多。Since the binary refrigeration device has two refrigeration circuits, its size is usually larger than that of the unit refrigeration device. In addition, in order to obtain high refrigeration capacity, it is necessary to use a compressor with high flow rate and high compression ratio. In this case, not only the size will further increase, but the cost of parts will also increase, and the energy consumption will also increase.
本案發明者,係針對「藉由以利用有水之冷卻器(以下,稱作水冷卻器)來將從低溫側冷凍迴路之壓縮機所流出的高溫高壓之低溫側冷媒輔助性地作冷卻,來在對於裝置全體之尺寸以及能量消耗量作抑制的同時,亦得到所期望的冷凍能力」一事進行了檢討。若是使用水冷卻器,則係亦能夠對於裝置所造成的環境負擔有所抑制。The inventor of this case aims at "auxiliary cooling of the high-temperature and high-pressure low-temperature side refrigerant flowing out from the compressor of the low-temperature side refrigeration circuit by using a water cooler (hereinafter referred to as a water cooler). We have examined the issue of obtaining the desired freezing capacity while suppressing the size and energy consumption of the entire device." If a water cooler is used, the environmental burden caused by the device can also be suppressed.
然而,例如當在低溫側冷凍迴路處以-70℃以下等之極低溫來使冷媒蒸發的情況或者是對於高冷凍能力之輸出有所需求的情況時,就連在高溫側冷凍迴路之蒸發器處也需要確保有大的冷凍能力。換言之,在低溫側冷凍迴路處係成為需要很大的冷凝負載。於此情況,若是藉由水冷卻器,則係並無法對於所期望的冷凝負載帶來多大的貢獻。因此,在被要求有極低溫或者是高冷凍能力的情況時,最終仍會成為需要大輸出或者是大型之高溫側冷凍迴路,就算是使用有水冷卻器,也難以有效地對於裝置尺寸以及能量消耗量作抑制。However, for example, when the refrigerant is evaporated at extremely low temperatures such as -70°C or below in the low-temperature side refrigeration circuit or when high refrigeration capacity output is required, the evaporator of the high-temperature side refrigeration circuit is connected. It is also necessary to ensure that there is a large freezing capacity. In other words, a large condensation load is required in the low-temperature side refrigeration circuit. In this case, if a water cooler is used, it will not make much contribution to the expected condensation load. Therefore, when extremely low temperatures or high refrigeration capacity are required, a high-temperature side refrigeration circuit with a large output or a large size will eventually be required. Even if a water cooler is used, it is difficult to effectively control the device size and energy. Consumption is suppressed.
又,在水冷卻器處所使用之水,係會因應於季節而產生溫度變動。因此,因應於在水冷卻器處所使用之水的溫度變動,係可能會產生對於對高溫側冷凍迴路所要求的冷凍能力作調整之必要性。在此種情況中的冷凍能力之調整幅度,若是考慮到控制之安定性,則較理想,係盡可能地相對於穩態性之運轉而為小。In addition, the water used in the water cooler will have temperature changes according to the seasons. Therefore, in response to temperature changes of the water used in the water cooler, it may be necessary to adjust the refrigeration capacity required of the high-temperature side refrigeration circuit. In this case, if the stability of the control is taken into consideration, it is ideal that the adjustment range of the refrigeration capacity should be as small as possible relative to the steady-state operation.
又,本案發明者,係亦得知了,高溫側冷凍迴路以及低溫側冷凍迴路之冷媒循環量的設定,係會對於在利用水冷卻器時之所期望之冷凍能力的安定之輸出、能量消耗量之抑制、壓縮機性能之合理性的設定以及裝置尺寸造成很大的影響。In addition, the inventor of the present case has also learned that the setting of the refrigerant circulation amount of the high-temperature side refrigeration circuit and the low-temperature side refrigeration circuit affects the stable output of the desired refrigeration capacity and energy consumption when using the water cooler. It has a great influence on the suppression of quantity, the reasonable setting of compressor performance and the size of the device.
而,本案發明者,係對於上述之問題與知識有所考慮地而進行努力研究,並發現了能夠在使用水冷卻器來對於大型化、能量消耗量以及環境負擔有所抑制的多元式之冷凍裝置中而安定地確保所期望的冷凍能力之條件。However, the inventors of the present case conducted diligent research taking into account the above-mentioned problems and knowledge, and discovered a multi-type refrigeration system that can suppress the increase in size, energy consumption, and environmental burden by using a water cooler. conditions to ensure the desired freezing capacity stably in the device.
本發明之課題,係在於提供一種對於大型化、能量消耗量以及環境負擔有所抑制並且能夠安定地得到所期望的冷凍能力之冷凍裝置以及調溫系統。An object of the present invention is to provide a refrigeration device and a temperature control system that can stably obtain desired refrigeration capabilities while suppressing enlargement, energy consumption, and environmental burden.
本發明之其中一個實施形態之冷凍裝置,係具備有高溫側冷凍迴路和低溫側冷凍迴路,並使前述高溫側冷凍迴路之蒸發器與前述低溫側冷凍迴路之冷凝器構成級聯冷凝器,於前述低溫側冷凍迴路處之壓縮機與冷凝器之間,係具備有將前述低溫側冷凍迴路所循環的低溫側冷媒藉由水來作冷卻之水冷卻器, 在將前述低溫側冷凍迴路之蒸發器之冷凍能力設為CL(Kw), 並將前述低溫側冷凍迴路之壓縮機之壓縮動力設為PA(Kw), 並將前述水冷卻器之冷卻能力設為CW(Kw), 並將前述高溫側冷凍迴路之蒸發器之冷凍能力設為CH(Kw), 並將前述高溫側冷凍迴路之冷媒循環量設為F1(Kg/hour), 並且將前述低溫側冷凍迴路之冷媒循環量設為F2(Kg/hour)時, 係以0.25×(CL+PA)≦CW≦0.4×(CL+PA)並且0.6×(CL+PA)≦CH≦0.75×(CL+PA)並且0.5×PA≦CW並且F1≦F2之關係,來進行運轉。 A refrigeration device according to one embodiment of the present invention is provided with a high-temperature side refrigeration circuit and a low-temperature side refrigeration circuit, and the evaporator of the high-temperature side refrigeration circuit and the condenser of the low-temperature side refrigeration circuit form a cascade condenser. Between the compressor and the condenser of the low-temperature side refrigeration circuit, there is a water cooler that cools the low-temperature side refrigerant circulated in the low-temperature side refrigeration circuit with water. Let the refrigeration capacity of the evaporator of the low-temperature side refrigeration circuit be CL (Kw), Let the compression power of the compressor of the low-temperature side refrigeration circuit be PA (Kw), And set the cooling capacity of the aforementioned water cooler to CW (Kw), And the refrigeration capacity of the evaporator of the aforementioned high-temperature side refrigeration circuit is set to CH (Kw), And set the refrigerant circulation volume of the aforementioned high-temperature side refrigeration circuit to F1 (Kg/hour), And when the refrigerant circulation volume of the low-temperature side refrigeration circuit is set to F2 (Kg/hour), Based on the relationship of 0.25×(CL+PA)≦CW≦0.4×(CL+PA) and 0.6×(CL+PA)≦CH≦0.75×(CL+PA) and 0.5×PA≦CW and F1≦F2, to operate.
其中一個實施形態之冷凍裝置,係亦可構成為:係以0.5×F2<F1≦0.7×F2之關係,來進行運轉。The refrigeration device in one embodiment may be configured to operate in the relationship of 0.5×F2<F1≦0.7×F2.
其中一個實施形態之冷凍裝置,係亦可構成為:係將前述高溫側冷凍迴路之冷媒循環量F1設為470Kg/hour以上600Kg/hour以下,並將前述低溫側冷凍迴路之冷媒循環量F2設為880Kg/hour以上920Kg/hour以下,而進行運轉。The refrigeration device according to one embodiment may be configured such that the refrigerant circulation amount F1 of the high-temperature side refrigeration circuit is set to 470Kg/hour or more and 600Kg/hour or less, and the refrigerant circulation amount F2 of the low-temperature side refrigeration circuit is set to It operates at a temperature of 880Kg/hour or more and 920Kg/hour or less.
係亦可構成為:前述水冷卻器,係以5℃以上28℃以下之範圍之水來冷卻前述低溫側冷媒。The system may be configured such that the water cooler cools the low-temperature side refrigerant with water in a range of 5°C or more and 28°C or less.
係亦可構成為:前述水冷卻器,係將從水源而來之水並不作調溫地而使其流通並冷卻前述低溫側冷媒。The system may be configured such that the water cooler circulates water from a water source without temperature adjustment to cool the low-temperature side refrigerant.
前述低溫側冷凍迴路之蒸發器之冷凍能力CL,係亦可為30Kw以下。The refrigeration capacity CL of the evaporator of the low-temperature side refrigeration circuit may also be 30Kw or less.
前述低溫側冷凍迴路之蒸發器之冷凍能力CL,係亦可為20Kw以上30Kw以下。The refrigeration capacity CL of the evaporator of the low-temperature side refrigeration circuit may also be 20Kw or more and 30Kw or less.
前述低溫側冷凍迴路之蒸發器之冷凍能力CL,係亦可為前述水冷卻器之冷卻能力CW的下限值之2倍以上3倍以下。The refrigeration capacity CL of the evaporator of the low-temperature side refrigeration circuit may be 2 to 3 times the lower limit of the cooling capacity CW of the water cooler.
又,在其中一個實施形態之冷凍裝置中,係亦可構成為,係更進而被設置有:低溫側熱氣迴路,係將從前述低溫側冷凍迴路之壓縮機所流出並通過前述水冷卻器以及前述低溫側冷凍迴路之冷凝器之前的低溫側冷媒,送至前述低溫側冷凍迴路之膨脹閥之下流側且蒸發器之上游側的部分處。Furthermore, the refrigeration apparatus according to one of the embodiments may be further provided with a low-temperature side hot gas circuit that flows out from the compressor of the low-temperature side refrigeration circuit and passes through the water cooler; The low-temperature side refrigerant before the condenser of the low-temperature side refrigeration circuit is sent to the downstream side of the expansion valve of the low-temperature side refrigeration circuit and the upstream side of the evaporator.
又,其中一個實施形態之調溫系統,係具備有:前述之冷凍裝置;和流體流通裝置,係使藉由前述低溫側冷凍迴路之蒸發器而被作冷卻的流體作流通。Furthermore, a temperature control system according to one embodiment includes: the above-mentioned refrigeration device; and a fluid circulation device that circulates the fluid cooled by the evaporator of the low-temperature side refrigeration circuit.
若依據本發明,則係能夠對於大型化、能量消耗量以及環境負擔有所抑制並且安定地得到所期望的冷凍能力。According to the present invention, it is possible to obtain the desired refrigeration capability stably while suppressing the increase in size, energy consumption, and environmental burden.
以下,參考所添附之圖面,針對其中一個實施形態作詳細說明。Below, one of the implementation forms is described in detail with reference to the attached drawings.
〈調溫系統及冷凍裝置之構成〉
圖1,係為對於具備有其中一個實施形態的冷凍裝置10之調溫系統S作概略性展示之圖。在圖1中所示之調溫系統S,係具備有冷凍裝置10、和水供給裝置100、和流體流通裝置200、以及控制器300。
〈Composition of temperature control system and refrigeration device〉
FIG. 1 is a diagram schematically showing a temperature control system S including a
冷凍裝置10,係為二元冷凍裝置。冷凍裝置10,係具備有高溫側冷凍迴路20與低溫側冷凍迴路30。冷凍裝置10,係藉由在高溫側冷凍迴路20與低溫側冷凍迴路30之間所構成之級聯冷凝器CC,來使高溫側冷凍迴路20所循環的高溫側冷媒與低溫側冷凍迴路30所循環的低溫側冷媒進行熱交換。The
高溫側冷凍迴路20,係具備有高溫側冷媒循環部25、和過冷卻迴路部26、以及高溫側熱氣迴路27,該高溫側冷媒循環部25,係將高溫側壓縮機21、高溫側冷凝器22、高溫側膨脹閥23以及高溫側蒸發器24以依此順序來使高溫側冷媒作循環的方式而作了連接。The high-temperature
過冷卻迴路部26,係具備有過冷卻流路26A、和被設置在過冷卻流路26A處之過冷卻控制閥26B、以及被設置在過冷卻流路26A處之過冷卻控制閥26B之下游側的位置處之過冷卻熱交換器26C。過冷卻流路26A,係將「在高溫側冷媒循環部25處之高溫側冷凝器22之下游側且高溫側膨脹閥23之上游側的部分」與高溫側壓縮機21作連接。The
過冷卻流路26A,係能夠將從高溫側冷凝器22所流出的高溫側冷媒之一部分送至高溫側壓縮機21處。過冷卻控制閥26B,係藉由成為開狀態,而使在過冷卻流路流路26A中流通的高溫側冷媒膨脹並降溫,之後,送至過冷卻熱交換器26C處。The
過冷卻熱交換器26C,係藉由從過冷卻控制閥26B所流出的高溫側冷媒,來將從高溫側冷凝器22而流動至高溫側膨脹閥23處之高溫側冷媒作冷卻。藉由此,係能夠對於從高溫側冷凝器22而流動至高溫側膨脹閥23處之高溫側冷媒賦予過冷卻度。The
高溫側熱氣迴路27,係具備有高溫側熱氣流路27A、和被設置在高溫側熱氣流路27A處之高溫側熱氣控制閥27B,該高溫側熱氣流路27A,係將「在高溫側冷媒循環部25處之高溫側壓縮機21之下游側且高溫側冷凝器22之上游側的部分」與「在高溫側冷媒循環部25處之高溫側膨脹閥23之下游側且高溫側蒸發器24之上游側的部分」作連接。The high-temperature side
高溫側熱氣流路27A,係能夠將從高溫側壓縮機21所流出的高溫側冷媒,送至高溫側膨脹閥23之下游側且高溫側蒸發器24之上游側之部分處。高溫側熱氣控制閥27B,係藉由成為開狀態,而能夠使在高溫側熱氣流路27A中而流通的高溫側冷媒與從高溫側膨脹閥23所流出之高溫側冷媒作混合。The high-temperature side hot
低溫側冷凍迴路30,係具備有低溫側冷媒循環部35、和低溫側熱氣迴路36、以及噴射迴路37,該低溫側冷媒循環部35,係將低溫側壓縮機31、低溫側冷凝器32、低溫側膨脹閥33以及低溫側蒸發器34以依此順序來使低溫側冷媒作循環的方式而作了連接。The low-temperature
低溫側熱氣迴路36,係具備有低溫側熱氣流路36A、和被設置在低溫側熱氣流路36A處之低溫側熱氣控制閥36B,該低溫側熱氣流路36A,係將「在低溫側冷媒循環部35處之低溫側壓縮機31之下游側且低溫側冷凝器32之上游側的部分」與「在低溫側冷媒循環部35處之低溫側膨脹閥33之下游側且低溫側蒸發器34之上游側的部分」作連接。The low-temperature side
低溫側熱氣流路36A,係能夠將從低溫側壓縮機31所流出的低溫側冷媒,送至低溫側膨脹閥33之下游側且低溫側蒸發器34之上游側之部分處。低溫側熱氣控制閥36B,係藉由成為開狀態,而能夠使在低溫側熱氣流路36A中而流通的低溫側冷媒與從低溫側膨脹閥33所流出之低溫側冷媒作混合。The low-temperature side hot
噴射迴路37,係具備有噴射流路37A、和被設置在噴射流路37A處之噴射控制閥37B,該噴射流路37A,係將「在低溫側冷媒循環部35處之低溫側冷凝器32之下游側且低溫側膨脹閥33之上游側的部分」與「在低溫側冷媒循環部35處之低溫側蒸發器34之下游側且低溫側壓縮機31之上游側的部分」作連接。The
噴射流路37A,係能夠將從低溫側冷凝器32所流出的低溫側冷媒,送至低溫側蒸發器34之下游側且低溫側壓縮機31之上游側之部分處。噴射控制閥37B,係藉由成為開狀態,而能夠使在噴射流路37A中而流通的低溫側冷媒與從低溫側蒸發器34所流出之低溫側冷媒作混合。The
上述之級聯冷凝器CC,係藉由高溫側冷凍迴路20之高溫側蒸發器24與低溫側冷凍迴路30之低溫側冷凝器32而被構成。於級聯冷凝器CC處,藉由高溫側膨脹閥23而被作膨脹並成為了低溫低壓之高溫側冷媒與從低溫側壓縮機31所流出的低溫側冷媒係進行熱交換。藉由此,從級聯冷凝器CC而流出的低溫側冷媒係作冷凝。之後,作了冷凝的低溫側冷媒,係藉由低溫側膨脹閥33而被膨脹並成為低溫低壓,而流入至低溫側蒸發器34中。高溫側冷媒與低溫側冷媒之種類,係並未特別作限定。例如,高溫側冷媒係亦可為R449A,低溫側冷媒係亦可為R508B。The above-mentioned cascade condenser CC is composed of the high-temperature side evaporator 24 of the high-temperature
又,低溫側冷凍迴路30係具備有水冷卻器38。水冷卻器38,係為熱交換器,並於內部而接收水與低溫側冷媒。之後,水冷卻器38,係藉由在內部所流通之水,來將在流入至級聯冷凝器CC(低溫側冷凝器32)中之前的低溫側冷媒作冷卻。亦即是,於冷凍裝置10處,從低溫側壓縮機31所流出了的低溫側冷媒,首先,係藉由水冷卻器38而被作冷卻,接著,係藉由級聯冷凝器CC而被作冷卻。藉由此,對於低溫側冷媒係賦予有大的過冷卻度。另外,低溫側熱氣流路36A,係構成為將從低溫側壓縮機31所流出的在通過水冷卻器38以及低溫側冷凝器32(級聯冷凝器CC)之前之低溫側冷媒,送至低溫側膨脹閥33之下游側且低溫側蒸發器34之上游側之部分處。In addition, the low-temperature
水冷卻器38所使用之水,係從水供給裝置100而被供給過來。水供給裝置100,係與水源101作連接,並將水源101之水送至水冷卻器38與高溫側冷凝器22處。水供給裝置100,係具備有水幫浦102,藉由水幫浦102之驅動,水係被送至水冷卻器38與高溫側冷凝器22處。The water used by the water cooler 38 is supplied from the
水源101,例如係亦可為自來水之供給部,亦可為工廠用水之供給部,亦可為水井,亦可為儲存有水之槽。在本實施形態中之水供給裝置100,係考慮到省能量化,而並未具備有對於水進行調溫之機器。亦即是,水冷卻器38,係將從水源101而來之水並不作調溫地而使其流通並冷卻低溫側冷媒。但是,係亦可使用有水之調溫機器。The
當水源101係為自來水之供給部、工廠用水之供給部、井、儲存有水之槽等的情況時,水供給裝置100所供給之水的溫度,在多數的地區,係因應於季節而可能會在5℃以上28℃以下之範圍中而變動。於此,水供給裝置100,係亦能夠以10L/min以上25L/min以下之範圍來使水流通。於此情況,由於水幫浦102之動力相對性而言係較被作抑制,因此,能量消耗量係被抑制。而,在身為上述之流量範圍的情況時,水供給裝置100之冷卻能力(Kw),係基於季節之因素而可能在概略10Kw以下16Kw之範圍中而變動。When the
圖示之水供給裝置100,係具備有從共通之水源101而分歧為二的第1供給路徑103A以及第2供給路徑103B。從第1供給路徑103A而來之水,係被供給至水冷卻器38處,從第2供給路徑103B而來之水,係被供給至高溫側冷凝器22處。又,在水冷卻器38中之水之排出口的下游側處,係被設置有定流量閥104。藉由此,流入至水冷卻器38中之水的流量係被控制為特定之值。另外,係亦可採用能夠藉由閥來對於水的流量作調整之構成。The
流體流通裝置200,係使在低溫側冷凍迴路30之低溫側蒸發器34處藉由低溫側冷媒而被作冷卻的流體作流通。所流通的流體,係亦可為鹵水等,但是,係並未特別作限定。The
流體流通裝置200,係具備有被與低溫側蒸發器34作連接之循環用流路201、和構成循環用流路201之一部分之三方向閥202、和旁通流路203、以及循環用幫浦204。低溫側蒸發器34,係具備有低溫側冷媒之通過部分、和流體之通過部分。循環用流路201,係具備有被與在低溫側蒸發器34中之流體之通過部分之其中一方的開口作連接之上游側流路201U、和被與在低溫側蒸發器34中之流體之通過部分之另外一方的開口作連接之下游側流路201D。The
三方向閥202,係藉由3個的埠(port)之中之2個的埠之間之部分,來構成下游側流路201D之一部分,在三方向閥202之剩餘之埠處,係被連接有旁通流路203。旁通流路203,係將三方向閥202與上游側流路201U作連接。循環用幫浦204,係被設置在上游側流路201U處。藉由驅動循環用幫浦204,流體係作流通。The three-
在流體流通裝置200處,因應於循環用幫浦204之驅動而流通的流體。係在低溫側蒸發器34處藉由低溫側冷媒而被作冷卻,從低溫側蒸發器34所流出的流體,係經由下游側流路201D而被送至未圖示之溫度控制對象處。而,通過了溫度控制對象後之流體,係經由上游側流路201U而回到低溫側蒸發器34處。又,三方向閥202,係能夠對於回到低溫側蒸發器34處之流體之流量與並不回到低溫側蒸發器34處地而被旁通(bypass)至低溫側蒸發器34之下游側處的流體之流量作調節。藉由此,係成為能夠對於「藉由低溫側蒸發器34而被作冷卻之流體」與「並不回到低溫側蒸發器34處地而被旁通至低溫側蒸發器34之下游側處之流體」之間的混合比作調節,而成為能夠對於送至溫度控制對象處的流體之溫度迅速地進行調節。At the
控制器300,係對於冷凍裝置10之構成機器以及流體流通裝置200之構成機器進行控制。具體而言,控制器300,係藉由對於高溫側壓縮機21之驅動狀態(旋轉數)進行控制,而能夠對於高溫側冷媒之循環量(Kg/hour)作控制。又,控制器300,係能夠對於高溫側熱氣控制閥27B之開閉以及開度作控制。又,控制器300,係藉由對於低溫側壓縮機31之驅動狀態(旋轉數)進行控制,而能夠對於低溫側冷媒之循環量(Kg/hour)作控制。又,控制器300,係能夠對於低溫側熱氣控制閥36B之開閉以及開度作控制。又,控制器300,係能夠對於噴射控制閥37B之開閉以及開度作控制。The
控制器300,例如係亦可藉由具備有CPU、ROM、RAM等之電腦來構成,並依循於被作了記憶的程式來對於上述各部之動作作控制。又,控制器300,係亦可藉由其他之處理器或電性電路(例如FPGA(Field Programmable Gate Alley)等)來構成之。The
〈運轉條件〉
接著,針對在本實施形態中之冷凍裝置10的運轉條件作說明。
亦即是,在本實施形態中之冷凍裝置10,在將低溫側冷凍迴路30之低溫側蒸發器34之冷凍能力設為CL(Kw),並將低溫側冷凍迴路30之低溫側壓縮機31之壓縮動力設為PA(Kw),並將水冷卻器38之冷卻能力設為CW(Kw),並將高溫側冷凍迴路20之高溫側蒸發器24之冷凍能力設為CH(Kw),並將高溫側冷凍迴路20之冷媒循環量設為F1(Kg/hour),並且將低溫側冷凍迴路30之冷媒循環量設為F2(Kg/hour)時,係以「0.25×(CL+PA)≦CW≦0.4×(CL+PA)並且0.6×(CL+PA)≦CH≦0.75×(CL+PA)並且0.5×PA≦CW並且F1≦F2」之關係,來進行運轉。
<Operating conditions>
Next, the operating conditions of the
特別是,關於高溫側冷凍迴路20之冷媒循環量F1以及低溫側冷凍迴路30之冷媒循環量F2,較理想,係以0.5×F2<F1≦0.7×F2之關係,來進行運轉。具體而言,例如當低溫側冷凍迴路30之低溫側蒸發器34之冷凍能力CL係為30Kw以下的情況時、詳細而言,當為20Kw以上30Kw以下的情況時,係亦可將高溫側冷凍迴路20之冷媒循環量F1設為400Kg/hour以上800Kg/hour以下,並將低溫側冷凍迴路30之冷媒循環量F2設為780Kg/hour以上1400Kg/hour以下,而進行運轉。In particular, the refrigerant circulation amount F1 of the high-temperature
更具體而言,例如當低溫側蒸發器34之冷凍能力CL係為20Kw以上24Kw的情況時,在「0.5×F2<F1≦0.7×F2之關係」下,係亦可將高溫側冷凍迴路20之冷媒循環量F1設為470Kg/hour以上600Kg/hour以下,並將低溫側冷凍迴路30之冷媒循環量F2設為880Kg/hour以上920Kg/hour以下,而進行運轉。另外,此種數值條件,係僅為其中一例,當然的,本發明係並非為被限定於此種條件。More specifically, for example, when the refrigeration capacity CL of the low-
圖2,係為對於低溫側冷凍迴路30之運轉狀態作說明之莫理耳線圖(Mollier chart)。參照圖2,在低溫側冷凍迴路30中,以藉由「1→2」所示之變遷,低溫側壓縮機31係將低溫側冷媒作壓縮。以藉由「2→3」所示之變遷,低溫側冷媒係藉由水冷卻器38而被作冷卻。以藉由「3→4」所示之變遷,低溫側冷媒係在級聯冷凝器CC處藉由高溫側冷媒而被作冷卻。以藉由「4→5」所示之變遷,低溫側冷媒,係藉由低溫側膨脹閥33而被膨脹並成為氣液混合狀態,而成為低溫低壓。之後,以藉由「5→1」所示之變遷,低溫側冷媒,係與流體流通裝置20所流通的流體進行熱交換。FIG. 2 is a Mollier chart illustrating the operating state of the low-temperature
在圖2中,係對於在運轉條件中所使用的低溫側冷凍迴路30之低溫側蒸發器34之冷凍能力CL(Kw)、低溫側冷凍迴路30之低溫側壓縮機31之壓縮動力PA(Kw)、水冷卻器38之冷卻能力CW(Kw)以及高溫側冷凍迴路20之蒸發器之冷凍能力CH(Kw)之各者所對應的範圍作展示。
壓縮動力PA,係藉由低溫側冷媒之冷媒循環量F2×(h2-h1)而被計算出來。h1,係為在圖2中之「1」點處的比焓。h2,係為在圖2中之「2」點處的比焓。
在求取本說明書中之壓縮動力PA時,比焓h1,係能夠根據低溫側冷媒之種類,與「藉由感測器來測定出從低溫側蒸發器34所流出之流入至低溫側壓縮機31中之前的低溫側冷媒之壓力以及溫度,並在與低溫側冷媒相對應之莫理耳線圖(p-h線圖,冷媒物性資料)上,特定出與所測定到的低溫側冷媒之壓力以及溫度相對應之位置」,而求取出來。
比焓h2,係能夠根據低溫側冷媒之種類,與「藉由感測器來測定出從低溫側壓縮機31所流出之流入至水冷卻器38中之前的低溫側冷媒之壓力以及溫度,並在與低溫側冷媒相對應之莫理耳線圖(p-h線圖,冷媒物性資料)上,特定出與所測定到的低溫側冷媒之壓力以及溫度相對應之位置」,而求取出來。
In FIG. 2 , the refrigeration capacity CL (Kw) of the low-temperature side evaporator 34 of the low-temperature
以上所說明了的運轉條件,控制器300,主要係藉由對於高溫側壓縮機21之驅動狀態(旋轉數)以及低溫側壓縮機31之驅動狀態(旋轉數)進行控制,而實現之。而,在以此運轉條件而進行運轉的情況時,冷凍裝置10,係成為能夠對於大型化、能量消耗量以及環境負擔有所抑制並且得到所期望的冷凍能力。以下,針對此事作詳細敘述。The above-described operating conditions are realized by the
首先,在「0.25×(CL+PA)≦CW≦0.4×(CL+PA)並且0.6×(CL+PA)≦CH≦0.75×(CL+PA)」之關係下,藉由低溫側蒸發器34之冷凍能力CL+低溫側壓縮機31之壓縮動力PA,低溫側冷凍迴路30所要求的冷凝負載(CL+PA)係被特定出來。而,在上述關係中,係特定出,在冷凝負載(CL+PA)中之水冷卻器38的冷卻能力CW(Kw)之負擔比例,係成為25%~40%。而,此一水冷卻器38之冷卻能力CW(Kw)之負擔比例,在「極力增大低溫側蒸發器34之冷凍能力CL,並對於高溫側壓縮機21之尺寸和高溫側冷凍迴路20之全體尺寸以及能量消耗量與環境負擔作抑制,並且使溫度控制之安定性提升」的觀點上,係成為有效之條件。First, under the relationship of "0.25×(CL+PA)≦CW≦0.4×(CL+PA) and 0.6×(CL+PA)≦CH≦0.75×(CL+PA)", through the low temperature side evaporator The refrigeration capacity CL of 34 + the compression power PA of the low-
另外,當水冷卻器38之冷卻能力CW(Kw)之負擔比例例如成為60%以上等一般地而變得過大的情況時,係並無法將被冷凝之低溫側冷媒充分地作過冷卻,而成為難以將低溫側蒸發器34之冷凍能力CL增大。另一方面,當水冷卻器38之冷卻能力CW(Kw)之負擔比例例如成為10%以下等一般地而變得過小的情況時,水冷卻器38之冷卻係不會有效地起作用,而會產生使用高性能之高溫側壓縮機的必要性。基於此種觀點,水冷卻器38之冷卻能力CW(Kw)之負擔比例乃成為25%~40%一事,在「極力增大低溫側蒸發器34之冷凍能力CL,並對於高溫側壓縮機21之尺寸和高溫側冷凍迴路20之全體尺寸作抑制」的觀點上,係成為良好。又,水冷卻器38之冷卻能力CW,由於係負擔在「並不需要壓縮動力地而被要求之冷凝負載」之中的較大之範圍,因此,對於能量消耗量以及環境負擔之抑制而言,係成為有利。In addition, when the burden ratio of the cooling capacity CW (Kw) of the water cooler 38 generally becomes too large, for example, 60% or more, the condensed low-temperature side refrigerant cannot be sufficiently subcooled, and It becomes difficult to increase the refrigeration capacity CL of the low
又,當水冷卻器38之冷卻能力CW(Kw)之負擔比例在25%~40%之範圍中而變動的情況時,高溫側冷凍迴路20之高溫側蒸發器24之冷凍能力CH,係相對於冷凝負載(CL+PA)而在60~75%之範圍中變動。此時,例如當作為基準之運轉狀態而想定為「相對於冷凝負載(CL+PA)而為60%之冷凍能力」的情況時,相對於水冷卻器38之冷卻能力CW之最大之變動的冷凍能力CH之變化率,係為25%。因此,當水冷卻器38之冷卻能力CW(Kw)之負擔比例係為25%~40%的情況時,就算是水冷卻器38之冷卻能力CW(Kw)發生了變動,也不需要對於高溫側冷凍迴路20之高溫側蒸發器24之冷凍能力CH作大幅度的調整。於此情況,由於係將高溫側壓縮機21之使用驅動範圍抑制在較為狹窄的範圍中,因此,係成為能夠將高溫側壓縮機21限定在關連於安定性而為理想之運轉範圍中地來進行運轉,又,係成為能夠不需要在壓縮機處而確保過度的高性能。其結果,在溫度控制之安定性的觀點上,係成為有利。In addition, when the burden ratio of the cooling capacity CW (Kw) of the water cooler 38 changes in the range of 25% to 40%, the refrigeration capacity CH of the high-temperature side evaporator 24 of the high-temperature
接著,在「0.5×PA≦CW」之關係中,係特定出,相對於低溫側壓縮機31之壓縮動力PA(Kw)的水冷卻器38之冷卻能力CW(Kw)的比例係為較大。亦即是,係特定出,相對於低溫側壓縮機31之壓縮動力PA(Kw)的水冷卻器38之冷卻能力CW(Kw)的比例,係為低溫側壓縮機31之壓縮動力PA(Kw)的一半以上。此關係,係與上述相同的,為代表「水冷卻器38之冷卻能力CW(Kw)係負擔在被要求之冷凝負載之中的較大之範圍」,並且,係成為能夠得到當高溫側冷凍迴路20發生故障或停止時的裝置保護功能。亦即是,假設就算是當高溫側冷凍迴路20發生故障或者是停止的情況時,亦同樣的,當水冷卻器38之冷卻能力CW(Kw)係為「0.5×PA」以上的情況時,藉由具備有將低溫側壓縮機31之壓縮動力PA之一半以上作抵消的能力,低溫側冷媒係較為早期性地被作冷卻,而能夠使配管等受到保護。基於此種觀點,「0.5×PA≦CW」之關係係為有效。Next, in the relationship "0.5×PA≦CW", it is determined that the ratio of the cooling capacity CW (Kw) of the water cooler 38 to the compression power PA (Kw) of the low-
又,在「F1≦F2」之關係下,高溫側冷凍迴路20之冷媒循環量F1(Kg/hour),係成為低溫側冷凍迴路30之冷媒循環量F2(Kg/hour)以下。一般而言,在二元冷凍裝置中,高溫側冷凍迴路之冷媒循環量係較低溫側冷凍迴路之冷媒循環量而更大。相對於此,在本實施形態中,高溫側冷凍迴路20之冷媒循環量F1(Kg/hour),係成為低溫側冷凍迴路30之冷媒循環量F2(Kg/hour)以下。於此情況,在高溫側冷凍迴路20之小型化和低成本化之觀點而言,係成為有利。特別是當以0.5×F2<F1≦0.7×F2之關係來進行運轉的方式而構成冷凍裝置10的情況時,在小型化和低成本化之觀點上,係成為極為有利。In addition, under the relationship "F1≦F2", the refrigerant circulation amount F1 (Kg/hour) of the high-temperature
例如,在如同上述一般之低溫側蒸發器34之冷凍能力CL為20Kw以上24Kw的情況時,係亦可將高溫側冷凍迴路20之冷媒循環量F1設為470Kg/hour以上600Kg/hour以下,並將低溫側冷凍迴路30之冷媒循環量F2設為880Kg/hour以上920Kg/hour以下,而進行冷凍裝置10之運轉。在此數值條件下之高溫側冷凍迴路20之冷媒循環量F1,係為在20Kw以上24Kw以下之一般性的二元冷凍裝置之高溫側冷凍迴路處通常並不會被採用的極少之設定。在本實施形態中,藉由使用水冷卻器38,係成為能夠設定此種極少的循環量之值。而,當設為0.5×F2<F1≦0.7×F2之關係、具體而言,當設定為例如上述一般之極少之高溫側冷凍迴路20之冷媒循環量F1的情況時,係能夠將高溫側冷凍迴路20有效地小型化。例如,係能夠將受液器省略,或者是就算是使用有受液器也能夠抑制為小的容量。因此,在高溫側冷凍迴路20之小型化和低成本化之觀點而言,係成為有利。
又,一般而言,二元冷凍裝置,係構成為將高溫側冷凍迴路以及低溫側冷凍迴路收容在1個的框體內。此時,在本實施形態中,係能夠將對於水冷卻器38而導入水的水供給裝置100之配管構件等亦收容在相同之框體內。此時,若是高溫側冷凍迴路20為大型,則係成為難以將水供給裝置100之配管構件等以良好之空間效率來作配置。相對於此,在本實施形態中,係藉由高溫側冷媒之使用量的抑制,來將高溫側冷凍迴路20之尺寸縮小,藉由此,係成為易於將裝置全體小型化。又,低溫側冷凍迴路30之低溫側蒸發器34之冷凍能力CL,係亦可為水冷卻器38之冷卻能力CW的下限值之2倍以上3倍以下。於此情況,係能夠使水冷卻器38有效地起作用,並且能夠得到良好的運轉性能以及溫度控制性能。本案發明者,係透過各種的模擬以及實驗,而發現到了此種條件。
For example, when the refrigeration capacity CL of the low-
如同以上所作了說明一般,在本實施形態中之冷凍裝置10,在將低溫側冷凍迴路30之低溫側蒸發器34之冷凍能力設為CL(Kw),並將低溫側冷凍迴路30之低溫側壓縮機31之壓縮動力設為PA(Kw),並將水冷卻器38之冷卻能力設為CW(Kw),並將高溫側冷凍迴路20之高溫側蒸發器24之冷凍能力設為CH(Kw),並將高溫側冷凍迴路20之冷媒循環量設為F1(Kg/hour),並且將低溫側冷凍迴路30之冷媒循環量設為F2(Kg/hour)時,係以「0.25×(CL+PA)≦CW≦0.4×(CL+PA)並且0.6×(CL+PA)≦CH≦0.75×(CL+PA)並且0.5×PA≦CW並且F1≦F2」之關係,來進行運轉。藉由此,則係能夠對於大型化、能量消耗量以及環境負擔有所抑制並且安定地得到所期望的冷凍能力。As described above, in the
特別是,關於高溫側冷凍迴路20之冷媒循環量F1以及低溫側冷凍迴路30之冷媒循環量F2,較理想,係以0.5×F2<F1≦0.7×F2之關係,來進行運轉。於此情況,在高溫側冷凍迴路20之小型化和低成本化之觀點而言,係成為有利。亦即是,在本實施形態中,係能夠將對於水冷卻器38而導入水的水供給裝置100之配管構件等亦收容在收容高溫側冷凍迴路20以及低溫側冷凍迴路30之框體內。此時,若是高溫側冷凍迴路20為大型,則係成為難以將水供給裝置100之配管構件等以良好之空間效率來作配置。相對於此,在本實施形態中,係藉由高溫側冷媒之使用量的抑制,來將高溫側冷凍迴路20之尺寸縮小,藉由此,係成為易於將裝置全體小型化。詳細而言,高溫側冷凍迴路20與低溫側冷凍迴路30,係為了構成級聯冷凝器CC而被作連接,水冷卻器38係與該些相接近地而被作配置。當在高溫側冷凍迴路20以及低溫側冷凍迴路30處之冷媒循環量係身為上述關係的情況時,在普通的設計中,低溫側冷凍迴路30係被設計為較高溫側冷凍迴路20而更大,於此情況,係能夠在如同「相對於低溫側冷凍迴路30而高溫側冷凍迴路20有所凹陷」一般的位置處的空間中,配置水供給裝置100之配管等。In particular, the refrigerant circulation amount F1 of the high-temperature
以上,雖係針對本發明之實施形態作了說明,但是,本發明係並不被限定於上述之實施形態。例如,在上述之實施形態中之冷凍裝置10,雖係為二元冷凍裝置,但是,本發明係亦可對於三元冷凍裝置作適用。於此情況,藉由水冷卻器38,中溫側冷凍迴路所循環之冷媒及/或低溫側冷凍迴路所循環之冷媒係被作冷卻。The embodiments of the present invention have been described above. However, the present invention is not limited to the above-mentioned embodiments. For example, although the
10:冷凍裝置 20:高溫側冷凍迴路 21:高溫側壓縮機 22:高溫側冷凝器 23:高溫側膨脹閥 24:高溫側蒸發器 25:高溫側冷媒循環部 26:過冷卻迴路部 26A:過冷卻流路 26B:過冷卻控制閥 26C:過冷卻熱交換器 27:高溫側熱氣迴路 27A:高溫側熱氣流路 27B:高溫側熱氣控制閥 30:低溫測冷凍迴路 31:低溫側壓縮機 32:低溫側冷凝器 33:低溫側膨脹閥 34:低溫側蒸發器 35:低溫側冷媒循環部 36:低溫側熱氣迴路 36A:低溫側熱氣流路 36B:低溫側熱氣控制閥 37:噴射迴路 37A:噴射流路 37B:噴射控制閥 38:水冷卻器 100:水供給裝置 101:水源 102:水幫浦 103A:第1供給路徑 103B:第2供給路徑 104:定流量閥 200:流體流通裝置 201:循環用流路 201D:下游側流路 201U:上游側流路 202:三方向閥 203:旁通流路 204:循環用幫浦 300:控制器 CC:級聯冷卻器 S:調溫裝置 10: Refrigeration device 20: High temperature side refrigeration circuit 21: High temperature side compressor 22: High temperature side condenser 23:High temperature side expansion valve 24:High temperature side evaporator 25: High temperature side refrigerant circulation department 26: Supercooling circuit part 26A: Supercooling flow path 26B: Subcooling control valve 26C: Subcooled heat exchanger 27: High temperature side hot gas circuit 27A: High temperature side hot air flow path 27B: High temperature side hot gas control valve 30: Low temperature measurement of refrigeration circuit 31: Low temperature side compressor 32: Low temperature side condenser 33: Low temperature side expansion valve 34:Low temperature side evaporator 35: Low temperature side refrigerant circulation department 36: Low temperature side hot gas circuit 36A: Low temperature side hot air flow path 36B: Low temperature side hot gas control valve 37:Injection circuit 37A: Jet flow path 37B:Injection control valve 38:Water cooler 100:Water supply device 101:Water source 102:Water pump 103A: 1st supply path 103B: Second supply path 104:Constant flow valve 200: Fluid circulation device 201: Circulation flow path 201D: Downstream side flow path 201U: Upstream side flow path 202: Three-way valve 203:Bypass flow path 204: Circulation pump 300:Controller CC: Cascade Cooler S: Temperature regulating device
[圖1]係為對於具備有其中一個實施形態的冷凍裝置之調溫系統作概略性展示之圖。 [圖2]係為對於構成在圖1中所示之冷凍裝置的低溫側冷凍迴路之運轉狀態作說明之莫理耳線圖(Mollier chart)。 [Fig. 1] is a diagram schematically showing a temperature control system including a refrigeration device according to one of the embodiments. [Fig. 2] is a Mollier chart illustrating the operating state of the low-temperature side refrigeration circuit included in the refrigeration device shown in Fig. 1. [Fig.
10:冷凍裝置 10: Refrigeration device
20:高溫側冷凍迴路 20: High temperature side refrigeration circuit
21:高溫側壓縮機 21: High temperature side compressor
22:高溫側冷凝器 22: High temperature side condenser
23:高溫側膨脹閥 23:High temperature side expansion valve
24:高溫側蒸發器 24:High temperature side evaporator
25:高溫側冷媒循環部 25: High temperature side refrigerant circulation department
26:過冷卻迴路部 26: Supercooling circuit part
26A:過冷卻流路 26A: Supercooling flow path
26B:過冷卻控制閥 26B: Subcooling control valve
26C:過冷卻熱交換器 26C: Subcooled heat exchanger
27:高溫側熱氣迴路 27: High temperature side hot gas circuit
27A:高溫側熱氣流路 27A: High temperature side hot air flow path
27B:高溫側熱氣控制閥 27B: High temperature side hot gas control valve
30:低溫測冷凍迴路 30: Low temperature measurement of refrigeration circuit
31:低溫側壓縮機 31: Low temperature side compressor
32:低溫側冷凝器 32: Low temperature side condenser
33:低溫側膨脹閥 33: Low temperature side expansion valve
34:低溫側蒸發器 34:Low temperature side evaporator
35:低溫側冷媒循環部 35: Low temperature side refrigerant circulation department
36:低溫側熱氣迴路 36: Low temperature side hot gas circuit
36A:低溫側熱氣流路 36A: Low temperature side hot air flow path
36B:低溫側熱氣控制閥 36B: Low temperature side hot gas control valve
37:噴射迴路 37:Injection circuit
37A:噴射流路 37A: Jet flow path
37B:噴射控制閥 37B:Injection control valve
38:水冷卻器 38:Water cooler
100:水供給裝置 100:Water supply device
101:水源 101:Water source
102:水幫浦 102:Water pump
103A:第1供給路徑 103A: 1st supply path
103B:第2供給路徑 103B: Second supply path
104:定流量閥 104:Constant flow valve
200:流體流通裝置 200: Fluid circulation device
201:循環用流路 201: Circulation flow path
201D:下游側流路 201D: Downstream side flow path
201U:上游側流路 201U: Upstream side flow path
202:三方向閥 202: Three-way valve
203:旁通流路 203:Bypass flow path
204:循環用幫浦 204: Circulation pump
300:控制器 300:Controller
CC:級聯冷卻器 CC: Cascade Cooler
S:調溫裝置 S: Temperature regulating device
Claims (10)
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WO2013035459A1 (en) * | 2011-09-08 | 2013-03-14 | 株式会社神戸製鋼所 | Heat pump |
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