TW202340660A - Refrigeration device and temperature adjustment system - Google Patents

Refrigeration device and temperature adjustment system Download PDF

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TW202340660A
TW202340660A TW111147560A TW111147560A TW202340660A TW 202340660 A TW202340660 A TW 202340660A TW 111147560 A TW111147560 A TW 111147560A TW 111147560 A TW111147560 A TW 111147560A TW 202340660 A TW202340660 A TW 202340660A
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temperature side
low
refrigeration circuit
refrigeration
temperature
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TW111147560A
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山脇正勝
上田禎一郎
酒井勝敏
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日商伸和控制工業股份有限公司
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B1/00Compression machines, plants or systems with non-reversible cycle
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B6/00Compression machines, plants or systems, with several condenser circuits
    • F25B6/04Compression machines, plants or systems, with several condenser circuits arranged in series
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B7/00Compression machines, plants or systems, with cascade operation, i.e. with two or more circuits, the heat from the condenser of one circuit being absorbed by the evaporator of the next circuit

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Other Air-Conditioning Systems (AREA)

Abstract

This refrigeration device 10 comprises a high-temperature-side refrigeration circuit 20 and a low-temperature-side refrigeration circuit 30. A water cooler 38 is provided between a compressor and a condenser in the low-temperature-side refrigeration circuit 30. When the refrigeration capacity of an evaporator of the low-temperature-side refrigeration circuit 30 is CL (Kw), the compression power of the compressor of the low-temperature-side refrigeration circuit 30 is PA (Kw), the cooling capacity of the water cooler 38 is CW (Kw), the refrigeration capacity of an evaporator of the high-temperature-side refrigeration circuit 20 is CH (Kw), the refrigerant circulation amount of the high-temperature-side refrigeration circuit 20 is F1 (Kg/hour), and the refrigerant circulation amount of the low-temperature-side refrigeration circuit 30 is F2 (Kg/hour), the refrigeration device 10 operates so as to satisfy such relationships [0.25*(CL+PA) ≤ CW ≤ 0.4*(CL+PA), 0.6*(CL+PA) ≤ CH ≤ 0.75*(CL+PA), 0.5*PA ≤ CW, and F1 ≤ F2].

Description

冷凍裝置及調溫系統Refrigeration device and temperature control system

本發明之實施形態,係有關於具備有複數之冷凍迴路之多元式的冷凍裝置以及調溫系統。An embodiment of the present invention relates to a multi-type refrigeration device and a temperature control system equipped with a plurality of refrigeration circuits.

身為多元式之冷凍裝置之例的二元冷凍裝置,係具備有高溫側冷凍迴路和低溫側冷凍迴路,並藉由高溫側冷凍迴路之蒸發器與低溫側冷凍迴路之冷凝器來構成能夠將彼此之冷媒作熱交換的級聯冷凝器。在級聯冷凝器處,係藉由在高溫側冷凍迴路處而於冷凝後作了膨脹的高溫側冷媒,來使在低溫側冷凍迴路處而被作了壓縮的低溫側冷媒作冷凝。對於被作了冷凝的低溫側冷媒,係賦予有大的過冷卻度,之後,其係被作膨脹並降溫。藉由此,若依據二元冷凍裝置,則係能夠將溫度控制對象一直冷卻至極為低溫之溫度區域(JP6727422B)。Binary refrigeration equipment, which is an example of a multi-type refrigeration equipment, is equipped with a high-temperature side refrigeration circuit and a low-temperature side refrigeration circuit, and is composed of an evaporator of the high-temperature side refrigeration circuit and a condenser of the low-temperature side refrigeration circuit. Cascade condensers that exchange heat with each other's refrigerants. At the cascade condenser, the high-temperature side refrigerant that has been expanded after condensation in the high-temperature side refrigeration circuit condenses the low-temperature side refrigerant that has been compressed in the low-temperature side refrigeration circuit. A large degree of supercooling is given to the condensed low-temperature side refrigerant, and then it is expanded and cooled. By this, if the binary refrigeration device is used, the temperature control object can be cooled down to an extremely low temperature region (JP6727422B).

二元冷凍裝置,由於係具備有2個的冷凍迴路,因此,通常其尺寸係變得較單元之冷凍裝置而更大。又,為了得到高的冷凍能力,係有必要使用高流量以及高壓縮比之壓縮機。於此情況,不但是尺寸會更進一步變大,零件成本也會變高,並且能量消耗量也會變多。Since the binary refrigeration device has two refrigeration circuits, its size is usually larger than that of the unit refrigeration device. In addition, in order to obtain high refrigeration capacity, it is necessary to use a compressor with high flow rate and high compression ratio. In this case, not only the size will further increase, but the cost of parts will also increase, and the energy consumption will also increase.

本案發明者,係針對「藉由以利用有水之冷卻器(以下,稱作水冷卻器)來將從低溫側冷凍迴路之壓縮機所流出的高溫高壓之低溫側冷媒輔助性地作冷卻,來在對於裝置全體之尺寸以及能量消耗量作抑制的同時,亦得到所期望的冷凍能力」一事進行了檢討。若是使用水冷卻器,則係亦能夠對於裝置所造成的環境負擔有所抑制。The inventor of this case aims at "auxiliary cooling of the high-temperature and high-pressure low-temperature side refrigerant flowing out from the compressor of the low-temperature side refrigeration circuit by using a water cooler (hereinafter referred to as a water cooler). We have examined the issue of obtaining the desired freezing capacity while suppressing the size and energy consumption of the entire device." If a water cooler is used, the environmental burden caused by the device can also be suppressed.

然而,例如當在低溫側冷凍迴路處以-70℃以下等之極低溫來使冷媒蒸發的情況或者是對於高冷凍能力之輸出有所需求的情況時,就連在高溫側冷凍迴路之蒸發器處也需要確保有大的冷凍能力。換言之,在低溫側冷凍迴路處係成為需要很大的冷凝負載。於此情況,若是藉由水冷卻器,則係並無法對於所期望的冷凝負載帶來多大的貢獻。因此,在被要求有極低溫或者是高冷凍能力的情況時,最終仍會成為需要大輸出或者是大型之高溫側冷凍迴路,就算是使用有水冷卻器,也難以有效地對於裝置尺寸以及能量消耗量作抑制。However, for example, when the refrigerant is evaporated at extremely low temperatures such as -70°C or below in the low-temperature side refrigeration circuit or when high refrigeration capacity output is required, the evaporator of the high-temperature side refrigeration circuit is connected. It is also necessary to ensure that there is a large freezing capacity. In other words, a large condensation load is required in the low-temperature side refrigeration circuit. In this case, if a water cooler is used, it will not make much contribution to the expected condensation load. Therefore, when extremely low temperatures or high refrigeration capacity are required, a high-temperature side refrigeration circuit with a large output or a large size will eventually be required. Even if a water cooler is used, it is difficult to effectively control the device size and energy. Consumption is suppressed.

又,在水冷卻器處所使用之水,係會因應於季節而產生溫度變動。因此,因應於在水冷卻器處所使用之水的溫度變動,係可能會產生對於對高溫側冷凍迴路所要求的冷凍能力作調整之必要性。在此種情況中的冷凍能力之調整幅度,若是考慮到控制之安定性,則較理想,係盡可能地相對於穩態性之運轉而為小。In addition, the water used in the water cooler will have temperature changes according to the seasons. Therefore, in response to temperature changes of the water used in the water cooler, it may be necessary to adjust the refrigeration capacity required of the high-temperature side refrigeration circuit. In this case, if the stability of the control is taken into consideration, it is ideal that the adjustment range of the refrigeration capacity should be as small as possible relative to the steady-state operation.

又,本案發明者,係亦得知了,高溫側冷凍迴路以及低溫側冷凍迴路之冷媒循環量的設定,係會對於在利用水冷卻器時之所期望之冷凍能力的安定之輸出、能量消耗量之抑制、壓縮機性能之合理性的設定以及裝置尺寸造成很大的影響。In addition, the inventor of the present case has also learned that the setting of the refrigerant circulation amount of the high-temperature side refrigeration circuit and the low-temperature side refrigeration circuit affects the stable output of the desired refrigeration capacity and energy consumption when using the water cooler. It has a great influence on the suppression of quantity, the reasonable setting of compressor performance and the size of the device.

而,本案發明者,係對於上述之問題與知識有所考慮地而進行努力研究,並發現了能夠在使用水冷卻器來對於大型化、能量消耗量以及環境負擔有所抑制的多元式之冷凍裝置中而安定地確保所期望的冷凍能力之條件。However, the inventors of the present case conducted diligent research taking into account the above-mentioned problems and knowledge, and discovered a multi-type refrigeration system that can suppress the increase in size, energy consumption, and environmental burden by using a water cooler. conditions to ensure the desired freezing capacity stably in the device.

本發明之課題,係在於提供一種對於大型化、能量消耗量以及環境負擔有所抑制並且能夠安定地得到所期望的冷凍能力之冷凍裝置以及調溫系統。An object of the present invention is to provide a refrigeration device and a temperature control system that can stably obtain desired refrigeration capabilities while suppressing enlargement, energy consumption, and environmental burden.

本發明之其中一個實施形態之冷凍裝置,係具備有高溫側冷凍迴路和低溫側冷凍迴路,並使前述高溫側冷凍迴路之蒸發器與前述低溫側冷凍迴路之冷凝器構成級聯冷凝器,於前述低溫側冷凍迴路處之壓縮機與冷凝器之間,係具備有將前述低溫側冷凍迴路所循環的低溫側冷媒藉由水來作冷卻之水冷卻器, 在將前述低溫側冷凍迴路之蒸發器之冷凍能力設為CL(Kw), 並將前述低溫側冷凍迴路之壓縮機之壓縮動力設為PA(Kw), 並將前述水冷卻器之冷卻能力設為CW(Kw), 並將前述高溫側冷凍迴路之蒸發器之冷凍能力設為CH(Kw), 並將前述高溫側冷凍迴路之冷媒循環量設為F1(Kg/hour), 並且將前述低溫側冷凍迴路之冷媒循環量設為F2(Kg/hour)時, 係以0.25×(CL+PA)≦CW≦0.4×(CL+PA)並且0.6×(CL+PA)≦CH≦0.75×(CL+PA)並且0.5×PA≦CW並且F1≦F2之關係,來進行運轉。 A refrigeration device according to one embodiment of the present invention is provided with a high-temperature side refrigeration circuit and a low-temperature side refrigeration circuit, and the evaporator of the high-temperature side refrigeration circuit and the condenser of the low-temperature side refrigeration circuit form a cascade condenser. Between the compressor and the condenser of the low-temperature side refrigeration circuit, there is a water cooler that cools the low-temperature side refrigerant circulated in the low-temperature side refrigeration circuit with water. Let the refrigeration capacity of the evaporator of the low-temperature side refrigeration circuit be CL (Kw), Let the compression power of the compressor of the low-temperature side refrigeration circuit be PA (Kw), And set the cooling capacity of the aforementioned water cooler to CW (Kw), And the refrigeration capacity of the evaporator of the aforementioned high-temperature side refrigeration circuit is set to CH (Kw), And set the refrigerant circulation volume of the aforementioned high-temperature side refrigeration circuit to F1 (Kg/hour), And when the refrigerant circulation volume of the low-temperature side refrigeration circuit is set to F2 (Kg/hour), Based on the relationship of 0.25×(CL+PA)≦CW≦0.4×(CL+PA) and 0.6×(CL+PA)≦CH≦0.75×(CL+PA) and 0.5×PA≦CW and F1≦F2, to operate.

其中一個實施形態之冷凍裝置,係亦可構成為:係以0.5×F2<F1≦0.7×F2之關係,來進行運轉。The refrigeration device in one embodiment may be configured to operate in the relationship of 0.5×F2<F1≦0.7×F2.

其中一個實施形態之冷凍裝置,係亦可構成為:係將前述高溫側冷凍迴路之冷媒循環量F1設為470Kg/hour以上600Kg/hour以下,並將前述低溫側冷凍迴路之冷媒循環量F2設為880Kg/hour以上920Kg/hour以下,而進行運轉。The refrigeration device according to one embodiment may be configured such that the refrigerant circulation amount F1 of the high-temperature side refrigeration circuit is set to 470Kg/hour or more and 600Kg/hour or less, and the refrigerant circulation amount F2 of the low-temperature side refrigeration circuit is set to It operates at a temperature of 880Kg/hour or more and 920Kg/hour or less.

係亦可構成為:前述水冷卻器,係以5℃以上28℃以下之範圍之水來冷卻前述低溫側冷媒。The system may be configured such that the water cooler cools the low-temperature side refrigerant with water in a range of 5°C or more and 28°C or less.

係亦可構成為:前述水冷卻器,係將從水源而來之水並不作調溫地而使其流通並冷卻前述低溫側冷媒。The system may be configured such that the water cooler circulates water from a water source without temperature adjustment to cool the low-temperature side refrigerant.

前述低溫側冷凍迴路之蒸發器之冷凍能力CL,係亦可為30Kw以下。The refrigeration capacity CL of the evaporator of the low-temperature side refrigeration circuit may also be 30Kw or less.

前述低溫側冷凍迴路之蒸發器之冷凍能力CL,係亦可為20Kw以上30Kw以下。The refrigeration capacity CL of the evaporator of the low-temperature side refrigeration circuit may also be 20Kw or more and 30Kw or less.

前述低溫側冷凍迴路之蒸發器之冷凍能力CL,係亦可為前述水冷卻器之冷卻能力CW的下限值之2倍以上3倍以下。The refrigeration capacity CL of the evaporator of the low-temperature side refrigeration circuit may be 2 to 3 times the lower limit of the cooling capacity CW of the water cooler.

又,在其中一個實施形態之冷凍裝置中,係亦可構成為,係更進而被設置有:低溫側熱氣迴路,係將從前述低溫側冷凍迴路之壓縮機所流出並通過前述水冷卻器以及前述低溫側冷凍迴路之冷凝器之前的低溫側冷媒,送至前述低溫側冷凍迴路之膨脹閥之下流側且蒸發器之上游側的部分處。Furthermore, the refrigeration apparatus according to one of the embodiments may be further provided with a low-temperature side hot gas circuit that flows out from the compressor of the low-temperature side refrigeration circuit and passes through the water cooler; The low-temperature side refrigerant before the condenser of the low-temperature side refrigeration circuit is sent to the downstream side of the expansion valve of the low-temperature side refrigeration circuit and the upstream side of the evaporator.

又,其中一個實施形態之調溫系統,係具備有:前述之冷凍裝置;和流體流通裝置,係使藉由前述低溫側冷凍迴路之蒸發器而被作冷卻的流體作流通。Furthermore, a temperature control system according to one embodiment includes: the above-mentioned refrigeration device; and a fluid circulation device that circulates the fluid cooled by the evaporator of the low-temperature side refrigeration circuit.

若依據本發明,則係能夠對於大型化、能量消耗量以及環境負擔有所抑制並且安定地得到所期望的冷凍能力。According to the present invention, it is possible to obtain the desired refrigeration capability stably while suppressing the increase in size, energy consumption, and environmental burden.

以下,參考所添附之圖面,針對其中一個實施形態作詳細說明。Below, one of the implementation forms is described in detail with reference to the attached drawings.

〈調溫系統及冷凍裝置之構成〉 圖1,係為對於具備有其中一個實施形態的冷凍裝置10之調溫系統S作概略性展示之圖。在圖1中所示之調溫系統S,係具備有冷凍裝置10、和水供給裝置100、和流體流通裝置200、以及控制器300。 〈Composition of temperature control system and refrigeration device〉 FIG. 1 is a diagram schematically showing a temperature control system S including a refrigeration device 10 according to one of the embodiments. The temperature control system S shown in FIG. 1 is equipped with a refrigeration device 10, a water supply device 100, a fluid circulation device 200, and a controller 300.

冷凍裝置10,係為二元冷凍裝置。冷凍裝置10,係具備有高溫側冷凍迴路20與低溫側冷凍迴路30。冷凍裝置10,係藉由在高溫側冷凍迴路20與低溫側冷凍迴路30之間所構成之級聯冷凝器CC,來使高溫側冷凍迴路20所循環的高溫側冷媒與低溫側冷凍迴路30所循環的低溫側冷媒進行熱交換。The refrigeration device 10 is a binary refrigeration device. The refrigeration device 10 includes a high-temperature side refrigeration circuit 20 and a low-temperature side refrigeration circuit 30 . The refrigeration device 10 uses the cascade condenser CC formed between the high-temperature side refrigeration circuit 20 and the low-temperature side refrigeration circuit 30 to make the high-temperature side refrigerant circulated in the high-temperature side refrigeration circuit 20 and the low-temperature side refrigeration circuit 30 The refrigerant on the low temperature side of the cycle performs heat exchange.

高溫側冷凍迴路20,係具備有高溫側冷媒循環部25、和過冷卻迴路部26、以及高溫側熱氣迴路27,該高溫側冷媒循環部25,係將高溫側壓縮機21、高溫側冷凝器22、高溫側膨脹閥23以及高溫側蒸發器24以依此順序來使高溫側冷媒作循環的方式而作了連接。The high-temperature side refrigeration circuit 20 includes a high-temperature side refrigerant circulation unit 25, a subcooling circuit unit 26, and a high-temperature side hot gas circuit 27. The high-temperature side refrigerant circulation unit 25 combines the high-temperature side compressor 21 and the high-temperature side condenser. 22. The high-temperature side expansion valve 23 and the high-temperature side evaporator 24 are connected in this order to circulate the high-temperature side refrigerant.

過冷卻迴路部26,係具備有過冷卻流路26A、和被設置在過冷卻流路26A處之過冷卻控制閥26B、以及被設置在過冷卻流路26A處之過冷卻控制閥26B之下游側的位置處之過冷卻熱交換器26C。過冷卻流路26A,係將「在高溫側冷媒循環部25處之高溫側冷凝器22之下游側且高溫側膨脹閥23之上游側的部分」與高溫側壓縮機21作連接。The subcooling circuit unit 26 is provided with a subcooling flow path 26A, a subcooling control valve 26B provided in the subcooling flow path 26A, and a subcooling control valve 26B provided downstream of the subcooling flow path 26A. The subcooling heat exchanger 26C is located on the side. The subcooling flow path 26A connects "the portion on the downstream side of the high-temperature side condenser 22 and the upstream side of the high-temperature side expansion valve 23 in the high-temperature side refrigerant circulation section 25" to the high-temperature side compressor 21 .

過冷卻流路26A,係能夠將從高溫側冷凝器22所流出的高溫側冷媒之一部分送至高溫側壓縮機21處。過冷卻控制閥26B,係藉由成為開狀態,而使在過冷卻流路流路26A中流通的高溫側冷媒膨脹並降溫,之後,送至過冷卻熱交換器26C處。The subcooling flow path 26A can send part of the high-temperature side refrigerant flowing out from the high-temperature side condenser 22 to the high-temperature side compressor 21 . By opening the subcooling control valve 26B, the high-temperature side refrigerant flowing in the subcooling flow path 26A expands and cools down, and then sends the refrigerant to the subcooling heat exchanger 26C.

過冷卻熱交換器26C,係藉由從過冷卻控制閥26B所流出的高溫側冷媒,來將從高溫側冷凝器22而流動至高溫側膨脹閥23處之高溫側冷媒作冷卻。藉由此,係能夠對於從高溫側冷凝器22而流動至高溫側膨脹閥23處之高溫側冷媒賦予過冷卻度。The subcooling heat exchanger 26C cools the high-temperature side refrigerant flowing from the high-temperature side condenser 22 to the high-temperature side expansion valve 23 by the high-temperature side refrigerant flowing out from the subcooling control valve 26B. This makes it possible to provide a degree of subcooling to the high-temperature side refrigerant flowing from the high-temperature side condenser 22 to the high-temperature side expansion valve 23 .

高溫側熱氣迴路27,係具備有高溫側熱氣流路27A、和被設置在高溫側熱氣流路27A處之高溫側熱氣控制閥27B,該高溫側熱氣流路27A,係將「在高溫側冷媒循環部25處之高溫側壓縮機21之下游側且高溫側冷凝器22之上游側的部分」與「在高溫側冷媒循環部25處之高溫側膨脹閥23之下游側且高溫側蒸發器24之上游側的部分」作連接。The high-temperature side hot gas circuit 27 is provided with a high-temperature side hot gas flow path 27A, and a high-temperature side hot gas control valve 27B provided at the high-temperature side hot gas flow path 27A. "The portion downstream of the high-temperature side compressor 21 and upstream of the high-temperature side condenser 22 in the circulation section 25" and "the downstream side of the high-temperature side expansion valve 23 in the high-temperature side refrigerant circulation section 25 and the high-temperature side evaporator 24 Connect it to the "upstream part".

高溫側熱氣流路27A,係能夠將從高溫側壓縮機21所流出的高溫側冷媒,送至高溫側膨脹閥23之下游側且高溫側蒸發器24之上游側之部分處。高溫側熱氣控制閥27B,係藉由成為開狀態,而能夠使在高溫側熱氣流路27A中而流通的高溫側冷媒與從高溫側膨脹閥23所流出之高溫側冷媒作混合。The high-temperature side hot gas flow path 27A can send the high-temperature side refrigerant flowing out from the high-temperature side compressor 21 to the downstream side of the high-temperature side expansion valve 23 and the upstream side of the high-temperature side evaporator 24 . By opening the high-temperature side hot gas control valve 27B, the high-temperature side refrigerant flowing in the high-temperature side hot gas flow path 27A can be mixed with the high-temperature side refrigerant flowing out from the high-temperature side expansion valve 23 .

低溫側冷凍迴路30,係具備有低溫側冷媒循環部35、和低溫側熱氣迴路36、以及噴射迴路37,該低溫側冷媒循環部35,係將低溫側壓縮機31、低溫側冷凝器32、低溫側膨脹閥33以及低溫側蒸發器34以依此順序來使低溫側冷媒作循環的方式而作了連接。The low-temperature side refrigeration circuit 30 includes a low-temperature side refrigerant circulation part 35, a low-temperature side hot gas circuit 36, and an injection circuit 37. The low-temperature side refrigerant circulation part 35 combines a low-temperature side compressor 31, a low-temperature side condenser 32, The low-temperature side expansion valve 33 and the low-temperature side evaporator 34 are connected in this order to circulate the low-temperature side refrigerant.

低溫側熱氣迴路36,係具備有低溫側熱氣流路36A、和被設置在低溫側熱氣流路36A處之低溫側熱氣控制閥36B,該低溫側熱氣流路36A,係將「在低溫側冷媒循環部35處之低溫側壓縮機31之下游側且低溫側冷凝器32之上游側的部分」與「在低溫側冷媒循環部35處之低溫側膨脹閥33之下游側且低溫側蒸發器34之上游側的部分」作連接。The low-temperature side hot gas circuit 36 is provided with a low-temperature side hot gas flow path 36A and a low-temperature side hot gas control valve 36B provided at the low-temperature side hot gas flow path 36A. "The portion downstream of the low-temperature side compressor 31 and upstream of the low-temperature side condenser 32 in the circulation section 35" and "the downstream side of the low-temperature side expansion valve 33 in the low-temperature side refrigerant circulation section 35 and the low-temperature side evaporator 34 Connect it to the "upstream part".

低溫側熱氣流路36A,係能夠將從低溫側壓縮機31所流出的低溫側冷媒,送至低溫側膨脹閥33之下游側且低溫側蒸發器34之上游側之部分處。低溫側熱氣控制閥36B,係藉由成為開狀態,而能夠使在低溫側熱氣流路36A中而流通的低溫側冷媒與從低溫側膨脹閥33所流出之低溫側冷媒作混合。The low-temperature side hot gas flow path 36A can send the low-temperature side refrigerant flowing out from the low-temperature side compressor 31 to the downstream side of the low-temperature side expansion valve 33 and the upstream side of the low-temperature side evaporator 34 . By opening the low-temperature side hot gas control valve 36B, the low-temperature side refrigerant flowing in the low-temperature side hot gas flow path 36A can be mixed with the low-temperature side refrigerant flowing out from the low-temperature side expansion valve 33 .

噴射迴路37,係具備有噴射流路37A、和被設置在噴射流路37A處之噴射控制閥37B,該噴射流路37A,係將「在低溫側冷媒循環部35處之低溫側冷凝器32之下游側且低溫側膨脹閥33之上游側的部分」與「在低溫側冷媒循環部35處之低溫側蒸發器34之下游側且低溫側壓縮機31之上游側的部分」作連接。The injection circuit 37 is provided with an injection flow path 37A, which connects the low-temperature side condenser 32 in the low-temperature side refrigerant circulation section 35, and an injection control valve 37B provided in the injection flow path 37A. The portion downstream of the low-temperature side expansion valve 33 and upstream of the low-temperature side expansion valve 33 is connected to the portion downstream of the low-temperature side evaporator 34 and upstream of the low-temperature side compressor 31 at the low-temperature side refrigerant circulation section 35 .

噴射流路37A,係能夠將從低溫側冷凝器32所流出的低溫側冷媒,送至低溫側蒸發器34之下游側且低溫側壓縮機31之上游側之部分處。噴射控制閥37B,係藉由成為開狀態,而能夠使在噴射流路37A中而流通的低溫側冷媒與從低溫側蒸發器34所流出之低溫側冷媒作混合。The injection flow path 37A can send the low-temperature side refrigerant flowing out from the low-temperature side condenser 32 to the downstream side of the low-temperature side evaporator 34 and the upstream side of the low-temperature side compressor 31 . By opening the injection control valve 37B, the low-temperature side refrigerant flowing in the injection flow path 37A can be mixed with the low-temperature side refrigerant flowing out from the low-temperature side evaporator 34 .

上述之級聯冷凝器CC,係藉由高溫側冷凍迴路20之高溫側蒸發器24與低溫側冷凍迴路30之低溫側冷凝器32而被構成。於級聯冷凝器CC處,藉由高溫側膨脹閥23而被作膨脹並成為了低溫低壓之高溫側冷媒與從低溫側壓縮機31所流出的低溫側冷媒係進行熱交換。藉由此,從級聯冷凝器CC而流出的低溫側冷媒係作冷凝。之後,作了冷凝的低溫側冷媒,係藉由低溫側膨脹閥33而被膨脹並成為低溫低壓,而流入至低溫側蒸發器34中。高溫側冷媒與低溫側冷媒之種類,係並未特別作限定。例如,高溫側冷媒係亦可為R449A,低溫側冷媒係亦可為R508B。The above-mentioned cascade condenser CC is composed of the high-temperature side evaporator 24 of the high-temperature side refrigeration circuit 20 and the low-temperature side condenser 32 of the low-temperature side refrigeration circuit 30 . At the cascade condenser CC, the high-temperature side refrigerant expanded by the high-temperature side expansion valve 23 and became low temperature and low pressure exchanges heat with the low-temperature side refrigerant flowing out from the low-temperature side compressor 31 . Thereby, the low-temperature side refrigerant flowing out from the cascade condenser CC is condensed. Thereafter, the condensed low-temperature side refrigerant is expanded by the low-temperature side expansion valve 33 to become low temperature and low pressure, and flows into the low temperature side evaporator 34 . The types of high-temperature side refrigerant and low-temperature side refrigerant are not particularly limited. For example, the high-temperature side refrigerant system can also be R449A, and the low-temperature side refrigerant system can also be R508B.

又,低溫側冷凍迴路30係具備有水冷卻器38。水冷卻器38,係為熱交換器,並於內部而接收水與低溫側冷媒。之後,水冷卻器38,係藉由在內部所流通之水,來將在流入至級聯冷凝器CC(低溫側冷凝器32)中之前的低溫側冷媒作冷卻。亦即是,於冷凍裝置10處,從低溫側壓縮機31所流出了的低溫側冷媒,首先,係藉由水冷卻器38而被作冷卻,接著,係藉由級聯冷凝器CC而被作冷卻。藉由此,對於低溫側冷媒係賦予有大的過冷卻度。另外,低溫側熱氣流路36A,係構成為將從低溫側壓縮機31所流出的在通過水冷卻器38以及低溫側冷凝器32(級聯冷凝器CC)之前之低溫側冷媒,送至低溫側膨脹閥33之下游側且低溫側蒸發器34之上游側之部分處。In addition, the low-temperature side refrigeration circuit 30 is equipped with a water cooler 38 . The water cooler 38 is a heat exchanger and receives water and low-temperature side refrigerant inside. Thereafter, the water cooler 38 cools the low-temperature side refrigerant before flowing into the cascade condenser CC (low-temperature side condenser 32) by the water flowing inside. That is, in the refrigeration device 10, the low-temperature side refrigerant flowing out from the low-temperature side compressor 31 is first cooled by the water cooler 38, and then is cooled by the cascade condenser CC. for cooling. This provides a large degree of supercooling to the low-temperature side refrigerant system. In addition, the low-temperature side hot gas flow path 36A is configured to send the low-temperature side refrigerant flowing out from the low-temperature side compressor 31 before passing through the water cooler 38 and the low-temperature side condenser 32 (cascade condenser CC). On the downstream side of the side expansion valve 33 and on the upstream side of the low temperature side evaporator 34 .

水冷卻器38所使用之水,係從水供給裝置100而被供給過來。水供給裝置100,係與水源101作連接,並將水源101之水送至水冷卻器38與高溫側冷凝器22處。水供給裝置100,係具備有水幫浦102,藉由水幫浦102之驅動,水係被送至水冷卻器38與高溫側冷凝器22處。The water used by the water cooler 38 is supplied from the water supply device 100 . The water supply device 100 is connected to the water source 101, and sends the water from the water source 101 to the water cooler 38 and the high temperature side condenser 22. The water supply device 100 is equipped with a water pump 102. Driven by the water pump 102, water is sent to the water cooler 38 and the high-temperature side condenser 22.

水源101,例如係亦可為自來水之供給部,亦可為工廠用水之供給部,亦可為水井,亦可為儲存有水之槽。在本實施形態中之水供給裝置100,係考慮到省能量化,而並未具備有對於水進行調溫之機器。亦即是,水冷卻器38,係將從水源101而來之水並不作調溫地而使其流通並冷卻低溫側冷媒。但是,係亦可使用有水之調溫機器。The water source 101 may be, for example, a tap water supply unit, a factory water supply unit, a well, or a tank storing water. In the water supply device 100 in this embodiment, energy saving is taken into consideration, and the water supply device 100 is not equipped with a device for adjusting the temperature of the water. That is, the water cooler 38 circulates the water from the water source 101 without adjusting its temperature to cool the low-temperature side refrigerant. However, a temperature regulating machine with water can also be used.

當水源101係為自來水之供給部、工廠用水之供給部、井、儲存有水之槽等的情況時,水供給裝置100所供給之水的溫度,在多數的地區,係因應於季節而可能會在5℃以上28℃以下之範圍中而變動。於此,水供給裝置100,係亦能夠以10L/min以上25L/min以下之範圍來使水流通。於此情況,由於水幫浦102之動力相對性而言係較被作抑制,因此,能量消耗量係被抑制。而,在身為上述之流量範圍的情況時,水供給裝置100之冷卻能力(Kw),係基於季節之因素而可能在概略10Kw以下16Kw之範圍中而變動。When the water source 101 is a tap water supply unit, a factory water supply unit, a well, a tank storing water, etc., the temperature of the water supplied by the water supply device 100 may vary depending on the season in most areas. It will fluctuate in the range of above 5℃ and below 28℃. Here, the water supply device 100 can also circulate water in the range of 10 L/min or more and 25 L/min or less. In this case, since the power of the water pump 102 is relatively suppressed, the energy consumption is suppressed. However, in the case of the above flow rate range, the cooling capacity (Kw) of the water supply device 100 may vary within a range of approximately 10 Kw or less and 16 Kw based on seasonal factors.

圖示之水供給裝置100,係具備有從共通之水源101而分歧為二的第1供給路徑103A以及第2供給路徑103B。從第1供給路徑103A而來之水,係被供給至水冷卻器38處,從第2供給路徑103B而來之水,係被供給至高溫側冷凝器22處。又,在水冷卻器38中之水之排出口的下游側處,係被設置有定流量閥104。藉由此,流入至水冷卻器38中之水的流量係被控制為特定之值。另外,係亦可採用能夠藉由閥來對於水的流量作調整之構成。The water supply device 100 shown in the figure is provided with a first supply path 103A and a second supply path 103B that are branched into two from a common water source 101. The water from the first supply path 103A is supplied to the water cooler 38 , and the water from the second supply path 103B is supplied to the high temperature side condenser 22 . In addition, a constant flow valve 104 is provided on the downstream side of the water discharge port in the water cooler 38 . Thereby, the flow rate of the water flowing into the water cooler 38 is controlled to a specific value. In addition, the system may also adopt a structure in which the flow rate of water can be adjusted by a valve.

流體流通裝置200,係使在低溫側冷凍迴路30之低溫側蒸發器34處藉由低溫側冷媒而被作冷卻的流體作流通。所流通的流體,係亦可為鹵水等,但是,係並未特別作限定。The fluid circulation device 200 circulates the fluid cooled by the low-temperature side refrigerant in the low-temperature side evaporator 34 of the low-temperature side refrigeration circuit 30 . The circulating fluid may be brine, etc., but the fluid is not particularly limited.

流體流通裝置200,係具備有被與低溫側蒸發器34作連接之循環用流路201、和構成循環用流路201之一部分之三方向閥202、和旁通流路203、以及循環用幫浦204。低溫側蒸發器34,係具備有低溫側冷媒之通過部分、和流體之通過部分。循環用流路201,係具備有被與在低溫側蒸發器34中之流體之通過部分之其中一方的開口作連接之上游側流路201U、和被與在低溫側蒸發器34中之流體之通過部分之另外一方的開口作連接之下游側流路201D。The fluid circulation device 200 includes a circulation flow path 201 connected to the low-temperature side evaporator 34, a three-way valve 202 constituting a part of the circulation flow path 201, a bypass flow path 203, and a circulation valve. Pu204. The low-temperature side evaporator 34 has a low-temperature side refrigerant passage portion and a fluid passage portion. The circulation flow path 201 has an upstream side flow path 201U connected to one of the openings of the passage portion of the fluid in the low-temperature side evaporator 34, and a flow path 201U connected to the fluid in the low-temperature side evaporator 34. The downstream side flow path 201D is connected through the opening on the other side of the part.

三方向閥202,係藉由3個的埠(port)之中之2個的埠之間之部分,來構成下游側流路201D之一部分,在三方向閥202之剩餘之埠處,係被連接有旁通流路203。旁通流路203,係將三方向閥202與上游側流路201U作連接。循環用幫浦204,係被設置在上游側流路201U處。藉由驅動循環用幫浦204,流體係作流通。The three-way valve 202 forms a part of the downstream flow path 201D through the portion between two of the three ports. The remaining ports of the three-way valve 202 are A bypass flow path 203 is connected. The bypass flow path 203 connects the three-way valve 202 and the upstream side flow path 201U. The circulation pump 204 is provided in the upstream side flow path 201U. By driving the circulation pump 204, the fluid system circulates.

在流體流通裝置200處,因應於循環用幫浦204之驅動而流通的流體。係在低溫側蒸發器34處藉由低溫側冷媒而被作冷卻,從低溫側蒸發器34所流出的流體,係經由下游側流路201D而被送至未圖示之溫度控制對象處。而,通過了溫度控制對象後之流體,係經由上游側流路201U而回到低溫側蒸發器34處。又,三方向閥202,係能夠對於回到低溫側蒸發器34處之流體之流量與並不回到低溫側蒸發器34處地而被旁通(bypass)至低溫側蒸發器34之下游側處的流體之流量作調節。藉由此,係成為能夠對於「藉由低溫側蒸發器34而被作冷卻之流體」與「並不回到低溫側蒸發器34處地而被旁通至低溫側蒸發器34之下游側處之流體」之間的混合比作調節,而成為能夠對於送至溫度控制對象處的流體之溫度迅速地進行調節。At the fluid circulation device 200, the fluid circulates in response to the driving of the circulation pump 204. The low-temperature side evaporator 34 is cooled by the low-temperature side refrigerant, and the fluid flowing out from the low-temperature side evaporator 34 is sent to a temperature control target (not shown) through the downstream side flow path 201D. The fluid that has passed through the temperature control object returns to the low-temperature side evaporator 34 via the upstream side flow path 201U. In addition, the three-way valve 202 can bypass the flow rate of the fluid returning to the low-temperature side evaporator 34 to the downstream side of the low-temperature side evaporator 34 without returning to the low-temperature side evaporator 34 . The flow rate of the fluid at the place is adjusted. This makes it possible to bypass the fluid cooled by the low-temperature side evaporator 34 to the downstream side of the low-temperature side evaporator 34 without returning to the low-temperature side evaporator 34 By adjusting the mixing ratio between "fluids", the temperature of the fluid sent to the temperature control object can be quickly adjusted.

控制器300,係對於冷凍裝置10之構成機器以及流體流通裝置200之構成機器進行控制。具體而言,控制器300,係藉由對於高溫側壓縮機21之驅動狀態(旋轉數)進行控制,而能夠對於高溫側冷媒之循環量(Kg/hour)作控制。又,控制器300,係能夠對於高溫側熱氣控制閥27B之開閉以及開度作控制。又,控制器300,係藉由對於低溫側壓縮機31之驅動狀態(旋轉數)進行控制,而能夠對於低溫側冷媒之循環量(Kg/hour)作控制。又,控制器300,係能夠對於低溫側熱氣控制閥36B之開閉以及開度作控制。又,控制器300,係能夠對於噴射控制閥37B之開閉以及開度作控制。The controller 300 controls the components of the refrigeration device 10 and the components of the fluid circulation device 200 . Specifically, the controller 300 can control the circulation amount (Kg/hour) of the high-temperature side refrigerant by controlling the drive state (number of revolutions) of the high-temperature side compressor 21 . In addition, the controller 300 can control the opening and closing and the opening degree of the high-temperature side hot gas control valve 27B. In addition, the controller 300 can control the circulation amount (Kg/hour) of the low-temperature side refrigerant by controlling the drive state (number of revolutions) of the low-temperature side compressor 31 . In addition, the controller 300 can control the opening and closing and the opening degree of the low-temperature side hot gas control valve 36B. In addition, the controller 300 can control the opening and closing and the opening degree of the injection control valve 37B.

控制器300,例如係亦可藉由具備有CPU、ROM、RAM等之電腦來構成,並依循於被作了記憶的程式來對於上述各部之動作作控制。又,控制器300,係亦可藉由其他之處理器或電性電路(例如FPGA(Field Programmable Gate Alley)等)來構成之。The controller 300 can also be configured by a computer equipped with a CPU, ROM, RAM, etc., and controls the operations of the above-mentioned components according to a stored program. In addition, the controller 300 can also be configured by other processors or electrical circuits (such as FPGA (Field Programmable Gate Alley), etc.).

〈運轉條件〉 接著,針對在本實施形態中之冷凍裝置10的運轉條件作說明。 亦即是,在本實施形態中之冷凍裝置10,在將低溫側冷凍迴路30之低溫側蒸發器34之冷凍能力設為CL(Kw),並將低溫側冷凍迴路30之低溫側壓縮機31之壓縮動力設為PA(Kw),並將水冷卻器38之冷卻能力設為CW(Kw),並將高溫側冷凍迴路20之高溫側蒸發器24之冷凍能力設為CH(Kw),並將高溫側冷凍迴路20之冷媒循環量設為F1(Kg/hour),並且將低溫側冷凍迴路30之冷媒循環量設為F2(Kg/hour)時,係以「0.25×(CL+PA)≦CW≦0.4×(CL+PA)並且0.6×(CL+PA)≦CH≦0.75×(CL+PA)並且0.5×PA≦CW並且F1≦F2」之關係,來進行運轉。 <Operating conditions> Next, the operating conditions of the refrigeration device 10 in this embodiment will be described. That is, in the refrigeration device 10 in this embodiment, the refrigeration capacity of the low-temperature side evaporator 34 of the low-temperature side refrigeration circuit 30 is set to CL (Kw), and the low-temperature side compressor 31 of the low-temperature side refrigeration circuit 30 is The compression power is set to PA (Kw), the cooling capacity of the water cooler 38 is set to CW (Kw), the refrigeration capacity of the high-temperature side evaporator 24 of the high-temperature side refrigeration circuit 20 is set to CH (Kw), and When the refrigerant circulation amount of the high-temperature side refrigeration circuit 20 is set to F1 (Kg/hour), and the refrigerant circulation amount of the low-temperature side refrigeration circuit 30 is set to F2 (Kg/hour), "0.25×(CL+PA) ≦CW≦0.4×(CL+PA) and 0.6×(CL+PA)≦CH≦0.75×(CL+PA) and 0.5×PA≦CW and F1≦F2” to operate.

特別是,關於高溫側冷凍迴路20之冷媒循環量F1以及低溫側冷凍迴路30之冷媒循環量F2,較理想,係以0.5×F2<F1≦0.7×F2之關係,來進行運轉。具體而言,例如當低溫側冷凍迴路30之低溫側蒸發器34之冷凍能力CL係為30Kw以下的情況時、詳細而言,當為20Kw以上30Kw以下的情況時,係亦可將高溫側冷凍迴路20之冷媒循環量F1設為400Kg/hour以上800Kg/hour以下,並將低溫側冷凍迴路30之冷媒循環量F2設為780Kg/hour以上1400Kg/hour以下,而進行運轉。In particular, the refrigerant circulation amount F1 of the high-temperature side refrigeration circuit 20 and the refrigerant circulation amount F2 of the low-temperature side refrigeration circuit 30 are preferably operated in the relationship of 0.5×F2<F1≦0.7×F2. Specifically, for example, when the refrigeration capacity CL of the low-temperature side evaporator 34 of the low-temperature side refrigeration circuit 30 is 30 Kw or less, more specifically, when it is 20 Kw or more and 30 Kw or less, the high-temperature side can be refrigerated. The refrigerant circulation amount F1 of the circuit 20 is set to 400Kg/hour or more and 800Kg/hour or less, and the refrigerant circulation amount F2 of the low-temperature side refrigeration circuit 30 is set to 780Kg/hour or more and 1400Kg/hour or less, and the operation is performed.

更具體而言,例如當低溫側蒸發器34之冷凍能力CL係為20Kw以上24Kw的情況時,在「0.5×F2<F1≦0.7×F2之關係」下,係亦可將高溫側冷凍迴路20之冷媒循環量F1設為470Kg/hour以上600Kg/hour以下,並將低溫側冷凍迴路30之冷媒循環量F2設為880Kg/hour以上920Kg/hour以下,而進行運轉。另外,此種數值條件,係僅為其中一例,當然的,本發明係並非為被限定於此種條件。More specifically, for example, when the refrigeration capacity CL of the low-temperature side evaporator 34 is 20Kw or more and 24Kw, under the "relationship of 0.5×F2<F1≦0.7×F2", the high-temperature side refrigeration circuit 20 can also be The refrigerant circulation amount F1 is set to 470Kg/hour or more and 600Kg/hour or less, and the refrigerant circulation amount F2 of the low temperature side refrigeration circuit 30 is set to 880Kg/hour or more and 920Kg/hour or less, and the operation is performed. In addition, this numerical condition is only one example, and of course, the present invention is not limited to such conditions.

圖2,係為對於低溫側冷凍迴路30之運轉狀態作說明之莫理耳線圖(Mollier chart)。參照圖2,在低溫側冷凍迴路30中,以藉由「1→2」所示之變遷,低溫側壓縮機31係將低溫側冷媒作壓縮。以藉由「2→3」所示之變遷,低溫側冷媒係藉由水冷卻器38而被作冷卻。以藉由「3→4」所示之變遷,低溫側冷媒係在級聯冷凝器CC處藉由高溫側冷媒而被作冷卻。以藉由「4→5」所示之變遷,低溫側冷媒,係藉由低溫側膨脹閥33而被膨脹並成為氣液混合狀態,而成為低溫低壓。之後,以藉由「5→1」所示之變遷,低溫側冷媒,係與流體流通裝置20所流通的流體進行熱交換。FIG. 2 is a Mollier chart illustrating the operating state of the low-temperature side refrigeration circuit 30 . Referring to FIG. 2 , in the low-temperature side refrigeration circuit 30 , the low-temperature side compressor 31 compresses the low-temperature side refrigerant through the transition shown by "1→2". With the transition shown by "2→3", the low-temperature side refrigerant is cooled by the water cooler 38. With the transition shown by "3→4", the low-temperature side refrigerant is cooled by the high-temperature side refrigerant at the cascade condenser CC. With the transition indicated by "4→5", the low-temperature side refrigerant is expanded by the low-temperature side expansion valve 33 and becomes a gas-liquid mixed state, thereby becoming a low-temperature and low-pressure state. Thereafter, through the transition shown by "5→1", the low-temperature side refrigerant exchanges heat with the fluid flowing through the fluid circulation device 20.

在圖2中,係對於在運轉條件中所使用的低溫側冷凍迴路30之低溫側蒸發器34之冷凍能力CL(Kw)、低溫側冷凍迴路30之低溫側壓縮機31之壓縮動力PA(Kw)、水冷卻器38之冷卻能力CW(Kw)以及高溫側冷凍迴路20之蒸發器之冷凍能力CH(Kw)之各者所對應的範圍作展示。 壓縮動力PA,係藉由低溫側冷媒之冷媒循環量F2×(h2-h1)而被計算出來。h1,係為在圖2中之「1」點處的比焓。h2,係為在圖2中之「2」點處的比焓。 在求取本說明書中之壓縮動力PA時,比焓h1,係能夠根據低溫側冷媒之種類,與「藉由感測器來測定出從低溫側蒸發器34所流出之流入至低溫側壓縮機31中之前的低溫側冷媒之壓力以及溫度,並在與低溫側冷媒相對應之莫理耳線圖(p-h線圖,冷媒物性資料)上,特定出與所測定到的低溫側冷媒之壓力以及溫度相對應之位置」,而求取出來。 比焓h2,係能夠根據低溫側冷媒之種類,與「藉由感測器來測定出從低溫側壓縮機31所流出之流入至水冷卻器38中之前的低溫側冷媒之壓力以及溫度,並在與低溫側冷媒相對應之莫理耳線圖(p-h線圖,冷媒物性資料)上,特定出與所測定到的低溫側冷媒之壓力以及溫度相對應之位置」,而求取出來。 In FIG. 2 , the refrigeration capacity CL (Kw) of the low-temperature side evaporator 34 of the low-temperature side refrigeration circuit 30 and the compression power PA (Kw) of the low-temperature side compressor 31 of the low-temperature side refrigeration circuit 30 are used in the operating conditions. ), the cooling capacity CW (Kw) of the water cooler 38 and the refrigeration capacity CH (Kw) of the evaporator of the high-temperature side refrigeration circuit 20 are shown. The compression power PA is calculated from the refrigerant circulation amount F2×(h2-h1) of the low-temperature side refrigerant. h1 is the specific enthalpy at point "1" in Figure 2. h2 is the specific enthalpy at point "2" in Figure 2. When obtaining the compression power PA in this specification, the specific enthalpy h1 can be determined by measuring the inflow from the low-temperature side evaporator 34 to the low-temperature side compressor using a sensor based on the type of low-temperature side refrigerant. The pressure and temperature of the low-temperature side refrigerant before 31 are specified, and the measured pressure and temperature of the low-temperature side refrigerant are specified on the Morris line diagram (p-h line diagram, refrigerant physical property data) corresponding to the low-temperature side refrigerant. "The position corresponding to the temperature" is obtained. The specific enthalpy h2 can be determined by measuring the pressure and temperature of the low-temperature side refrigerant flowing out from the low-temperature side compressor 31 before flowing into the water cooler 38 by using sensors based on the type of low-temperature side refrigerant. On the Morris line diagram (p-h line diagram, refrigerant physical property data) corresponding to the low-temperature side refrigerant, the position corresponding to the measured pressure and temperature of the low-temperature side refrigerant is specified and obtained.

以上所說明了的運轉條件,控制器300,主要係藉由對於高溫側壓縮機21之驅動狀態(旋轉數)以及低溫側壓縮機31之驅動狀態(旋轉數)進行控制,而實現之。而,在以此運轉條件而進行運轉的情況時,冷凍裝置10,係成為能夠對於大型化、能量消耗量以及環境負擔有所抑制並且得到所期望的冷凍能力。以下,針對此事作詳細敘述。The above-described operating conditions are realized by the controller 300 mainly by controlling the drive state (number of revolutions) of the high-temperature side compressor 21 and the drive state (number of revolutions) of the low-temperature side compressor 31 . However, when operating under these operating conditions, the refrigeration device 10 can obtain a desired refrigeration capability while suppressing enlargement, energy consumption, and environmental burden. This matter is described in detail below.

首先,在「0.25×(CL+PA)≦CW≦0.4×(CL+PA)並且0.6×(CL+PA)≦CH≦0.75×(CL+PA)」之關係下,藉由低溫側蒸發器34之冷凍能力CL+低溫側壓縮機31之壓縮動力PA,低溫側冷凍迴路30所要求的冷凝負載(CL+PA)係被特定出來。而,在上述關係中,係特定出,在冷凝負載(CL+PA)中之水冷卻器38的冷卻能力CW(Kw)之負擔比例,係成為25%~40%。而,此一水冷卻器38之冷卻能力CW(Kw)之負擔比例,在「極力增大低溫側蒸發器34之冷凍能力CL,並對於高溫側壓縮機21之尺寸和高溫側冷凍迴路20之全體尺寸以及能量消耗量與環境負擔作抑制,並且使溫度控制之安定性提升」的觀點上,係成為有效之條件。First, under the relationship of "0.25×(CL+PA)≦CW≦0.4×(CL+PA) and 0.6×(CL+PA)≦CH≦0.75×(CL+PA)", through the low temperature side evaporator The refrigeration capacity CL of 34 + the compression power PA of the low-temperature side compressor 31, and the condensation load (CL + PA) required of the low-temperature side refrigeration circuit 30 are specified. However, in the above relationship, it is specified that the burden ratio of the cooling capacity CW (Kw) of the water cooler 38 in the condensation load (CL + PA) is 25% to 40%. However, the burden ratio of the cooling capacity CW (Kw) of the water cooler 38 is to increase the refrigeration capacity CL of the low-temperature side evaporator 34 as much as possible, and the size of the high-temperature side compressor 21 and the high-temperature side refrigeration circuit 20 This is an effective condition from the viewpoint of suppressing the overall size, energy consumption and environmental burden, and improving the stability of temperature control.

另外,當水冷卻器38之冷卻能力CW(Kw)之負擔比例例如成為60%以上等一般地而變得過大的情況時,係並無法將被冷凝之低溫側冷媒充分地作過冷卻,而成為難以將低溫側蒸發器34之冷凍能力CL增大。另一方面,當水冷卻器38之冷卻能力CW(Kw)之負擔比例例如成為10%以下等一般地而變得過小的情況時,水冷卻器38之冷卻係不會有效地起作用,而會產生使用高性能之高溫側壓縮機的必要性。基於此種觀點,水冷卻器38之冷卻能力CW(Kw)之負擔比例乃成為25%~40%一事,在「極力增大低溫側蒸發器34之冷凍能力CL,並對於高溫側壓縮機21之尺寸和高溫側冷凍迴路20之全體尺寸作抑制」的觀點上,係成為良好。又,水冷卻器38之冷卻能力CW,由於係負擔在「並不需要壓縮動力地而被要求之冷凝負載」之中的較大之範圍,因此,對於能量消耗量以及環境負擔之抑制而言,係成為有利。In addition, when the burden ratio of the cooling capacity CW (Kw) of the water cooler 38 generally becomes too large, for example, 60% or more, the condensed low-temperature side refrigerant cannot be sufficiently subcooled, and It becomes difficult to increase the refrigeration capacity CL of the low temperature side evaporator 34. On the other hand, when the burden ratio of the cooling capacity CW (Kw) of the water cooler 38 is generally too small, for example, 10% or less, the cooling system of the water cooler 38 does not function effectively, and It will be necessary to use a high-performance high-temperature side compressor. Based on this point of view, the burden ratio of the cooling capacity CW (Kw) of the water cooler 38 becomes 25% to 40%. In order to increase the refrigeration capacity CL of the low-temperature side evaporator 34 as much as possible, and to increase the cooling capacity CL of the high-temperature side compressor 21 This is good from the viewpoint of suppressing the size and the overall size of the high-temperature side refrigeration circuit 20. In addition, the cooling capacity CW of the water cooler 38 is within a wide range of the "condensation load required where compression power is not required". Therefore, it is important for the suppression of energy consumption and environmental burden. , the system becomes favorable.

又,當水冷卻器38之冷卻能力CW(Kw)之負擔比例在25%~40%之範圍中而變動的情況時,高溫側冷凍迴路20之高溫側蒸發器24之冷凍能力CH,係相對於冷凝負載(CL+PA)而在60~75%之範圍中變動。此時,例如當作為基準之運轉狀態而想定為「相對於冷凝負載(CL+PA)而為60%之冷凍能力」的情況時,相對於水冷卻器38之冷卻能力CW之最大之變動的冷凍能力CH之變化率,係為25%。因此,當水冷卻器38之冷卻能力CW(Kw)之負擔比例係為25%~40%的情況時,就算是水冷卻器38之冷卻能力CW(Kw)發生了變動,也不需要對於高溫側冷凍迴路20之高溫側蒸發器24之冷凍能力CH作大幅度的調整。於此情況,由於係將高溫側壓縮機21之使用驅動範圍抑制在較為狹窄的範圍中,因此,係成為能夠將高溫側壓縮機21限定在關連於安定性而為理想之運轉範圍中地來進行運轉,又,係成為能夠不需要在壓縮機處而確保過度的高性能。其結果,在溫度控制之安定性的觀點上,係成為有利。In addition, when the burden ratio of the cooling capacity CW (Kw) of the water cooler 38 changes in the range of 25% to 40%, the refrigeration capacity CH of the high-temperature side evaporator 24 of the high-temperature side refrigeration circuit 20 is relatively It varies in the range of 60 to 75% depending on the condensation load (CL+PA). At this time, for example, when the basic operating state is assumed to be "a refrigeration capacity of 60% relative to the condensation load (CL + PA)", the maximum variation with respect to the cooling capacity CW of the water cooler 38 is The change rate of freezing capacity CH is 25%. Therefore, when the burden ratio of the cooling capacity CW (Kw) of the water cooler 38 is 25% to 40%, even if the cooling capacity CW (Kw) of the water cooler 38 changes, there is no need to deal with high temperatures. The refrigeration capacity CH of the high-temperature side evaporator 24 of the side refrigeration circuit 20 is greatly adjusted. In this case, since the operating driving range of the high-temperature side compressor 21 is suppressed to a relatively narrow range, it is possible to limit the high-temperature side compressor 21 to an ideal operating range in terms of stability. This operation also ensures excessive high performance without the need for a compressor. As a result, this is advantageous from the viewpoint of the stability of temperature control.

接著,在「0.5×PA≦CW」之關係中,係特定出,相對於低溫側壓縮機31之壓縮動力PA(Kw)的水冷卻器38之冷卻能力CW(Kw)的比例係為較大。亦即是,係特定出,相對於低溫側壓縮機31之壓縮動力PA(Kw)的水冷卻器38之冷卻能力CW(Kw)的比例,係為低溫側壓縮機31之壓縮動力PA(Kw)的一半以上。此關係,係與上述相同的,為代表「水冷卻器38之冷卻能力CW(Kw)係負擔在被要求之冷凝負載之中的較大之範圍」,並且,係成為能夠得到當高溫側冷凍迴路20發生故障或停止時的裝置保護功能。亦即是,假設就算是當高溫側冷凍迴路20發生故障或者是停止的情況時,亦同樣的,當水冷卻器38之冷卻能力CW(Kw)係為「0.5×PA」以上的情況時,藉由具備有將低溫側壓縮機31之壓縮動力PA之一半以上作抵消的能力,低溫側冷媒係較為早期性地被作冷卻,而能夠使配管等受到保護。基於此種觀點,「0.5×PA≦CW」之關係係為有效。Next, in the relationship "0.5×PA≦CW", it is determined that the ratio of the cooling capacity CW (Kw) of the water cooler 38 to the compression power PA (Kw) of the low-temperature side compressor 31 is larger. . That is, the ratio of the cooling capacity CW (Kw) of the water cooler 38 to the compression power PA (Kw) of the low-temperature side compressor 31 is specified as the compression power PA (Kw) of the low-temperature side compressor 31 ) more than half. This relationship is the same as the above, and represents that "the cooling capacity CW (Kw) of the water cooler 38 is within a large range of the required condensation load", and it is able to obtain high-temperature side refrigeration. Device protection function when circuit 20 fails or stops. That is, even when the high-temperature side refrigeration circuit 20 breaks down or stops, similarly, when the cooling capacity CW (Kw) of the water cooler 38 is "0.5×PA" or more, By having the ability to offset more than half of the compression power PA of the low-temperature side compressor 31, the low-temperature side refrigerant system is cooled relatively early, and piping and the like can be protected. Based on this point of view, the relationship "0.5×PA≦CW" is valid.

又,在「F1≦F2」之關係下,高溫側冷凍迴路20之冷媒循環量F1(Kg/hour),係成為低溫側冷凍迴路30之冷媒循環量F2(Kg/hour)以下。一般而言,在二元冷凍裝置中,高溫側冷凍迴路之冷媒循環量係較低溫側冷凍迴路之冷媒循環量而更大。相對於此,在本實施形態中,高溫側冷凍迴路20之冷媒循環量F1(Kg/hour),係成為低溫側冷凍迴路30之冷媒循環量F2(Kg/hour)以下。於此情況,在高溫側冷凍迴路20之小型化和低成本化之觀點而言,係成為有利。特別是當以0.5×F2<F1≦0.7×F2之關係來進行運轉的方式而構成冷凍裝置10的情況時,在小型化和低成本化之觀點上,係成為極為有利。In addition, under the relationship "F1≦F2", the refrigerant circulation amount F1 (Kg/hour) of the high-temperature side refrigeration circuit 20 is equal to or less than the refrigerant circulation amount F2 (Kg/hour) of the low-temperature side refrigeration circuit 30. Generally speaking, in a binary refrigeration device, the refrigerant circulation volume of the high-temperature side refrigeration circuit is larger than the refrigerant circulation volume of the lower-temperature side refrigeration circuit. On the other hand, in this embodiment, the refrigerant circulation amount F1 (Kg/hour) of the high-temperature side refrigeration circuit 20 is equal to or less than the refrigerant circulation amount F2 (Kg/hour) of the low-temperature side refrigeration circuit 30 . This case is advantageous from the viewpoint of miniaturization and cost reduction of the high-temperature side refrigeration circuit 20 . In particular, when the refrigeration device 10 is configured to operate in the relationship of 0.5×F2<F1≦0.7×F2, it is extremely advantageous from the viewpoint of miniaturization and cost reduction.

例如,在如同上述一般之低溫側蒸發器34之冷凍能力CL為20Kw以上24Kw的情況時,係亦可將高溫側冷凍迴路20之冷媒循環量F1設為470Kg/hour以上600Kg/hour以下,並將低溫側冷凍迴路30之冷媒循環量F2設為880Kg/hour以上920Kg/hour以下,而進行冷凍裝置10之運轉。在此數值條件下之高溫側冷凍迴路20之冷媒循環量F1,係為在20Kw以上24Kw以下之一般性的二元冷凍裝置之高溫側冷凍迴路處通常並不會被採用的極少之設定。在本實施形態中,藉由使用水冷卻器38,係成為能夠設定此種極少的循環量之值。而,當設為0.5×F2<F1≦0.7×F2之關係、具體而言,當設定為例如上述一般之極少之高溫側冷凍迴路20之冷媒循環量F1的情況時,係能夠將高溫側冷凍迴路20有效地小型化。例如,係能夠將受液器省略,或者是就算是使用有受液器也能夠抑制為小的容量。因此,在高溫側冷凍迴路20之小型化和低成本化之觀點而言,係成為有利。 又,一般而言,二元冷凍裝置,係構成為將高溫側冷凍迴路以及低溫側冷凍迴路收容在1個的框體內。此時,在本實施形態中,係能夠將對於水冷卻器38而導入水的水供給裝置100之配管構件等亦收容在相同之框體內。此時,若是高溫側冷凍迴路20為大型,則係成為難以將水供給裝置100之配管構件等以良好之空間效率來作配置。相對於此,在本實施形態中,係藉由高溫側冷媒之使用量的抑制,來將高溫側冷凍迴路20之尺寸縮小,藉由此,係成為易於將裝置全體小型化。又,低溫側冷凍迴路30之低溫側蒸發器34之冷凍能力CL,係亦可為水冷卻器38之冷卻能力CW的下限值之2倍以上3倍以下。於此情況,係能夠使水冷卻器38有效地起作用,並且能夠得到良好的運轉性能以及溫度控制性能。本案發明者,係透過各種的模擬以及實驗,而發現到了此種條件。 For example, when the refrigeration capacity CL of the low-temperature side evaporator 34 is 20Kw or more and 24Kw as described above, the refrigerant circulation amount F1 of the high-temperature side refrigeration circuit 20 can also be set to 470Kg/hour or more and 600Kg/hour or less, and The refrigeration device 10 is operated by setting the refrigerant circulation amount F2 of the low-temperature side refrigeration circuit 30 to 880Kg/hour or more and 920Kg/hour or less. The refrigerant circulation amount F1 of the high-temperature side refrigeration circuit 20 under these numerical conditions is a very small setting that is usually not adopted in the high-temperature side refrigeration circuit of a general binary refrigeration device between 20Kw and 24Kw. In this embodiment, by using the water cooler 38, it is possible to set such a very small circulation amount. However, when the relationship of 0.5×F2<F1≦0.7×F2 is set, specifically, when the refrigerant circulation amount F1 of the high-temperature side refrigeration circuit 20 is generally very small as described above, the high-temperature side can be refrigerated. The circuit 20 is effectively miniaturized. For example, the liquid receiver can be omitted, or even if the liquid receiver is used, the capacity can be kept small. Therefore, it is advantageous from the viewpoint of miniaturization and cost reduction of the high-temperature side refrigeration circuit 20 . In addition, generally speaking, a binary refrigeration device is configured to accommodate a high-temperature side refrigeration circuit and a low-temperature side refrigeration circuit in one housing. At this time, in this embodiment, the piping members of the water supply device 100 that introduce water into the water cooler 38 can also be housed in the same housing. At this time, if the high-temperature side refrigeration circuit 20 is large, it will be difficult to arrange the piping components of the water supply device 100 with good space efficiency. On the other hand, in this embodiment, the size of the high-temperature side refrigeration circuit 20 is reduced by suppressing the usage amount of the high-temperature side refrigerant. This makes it easy to downsize the entire apparatus. In addition, the refrigeration capacity CL of the low-temperature side evaporator 34 of the low-temperature side refrigeration circuit 30 may be 2 to 3 times the lower limit of the cooling capacity CW of the water cooler 38 . In this case, the water cooler 38 can be effectively operated, and good operating performance and temperature control performance can be obtained. The inventor of this case discovered this condition through various simulations and experiments.

如同以上所作了說明一般,在本實施形態中之冷凍裝置10,在將低溫側冷凍迴路30之低溫側蒸發器34之冷凍能力設為CL(Kw),並將低溫側冷凍迴路30之低溫側壓縮機31之壓縮動力設為PA(Kw),並將水冷卻器38之冷卻能力設為CW(Kw),並將高溫側冷凍迴路20之高溫側蒸發器24之冷凍能力設為CH(Kw),並將高溫側冷凍迴路20之冷媒循環量設為F1(Kg/hour),並且將低溫側冷凍迴路30之冷媒循環量設為F2(Kg/hour)時,係以「0.25×(CL+PA)≦CW≦0.4×(CL+PA)並且0.6×(CL+PA)≦CH≦0.75×(CL+PA)並且0.5×PA≦CW並且F1≦F2」之關係,來進行運轉。藉由此,則係能夠對於大型化、能量消耗量以及環境負擔有所抑制並且安定地得到所期望的冷凍能力。As described above, in the refrigeration device 10 in this embodiment, the refrigeration capacity of the low-temperature side evaporator 34 of the low-temperature side refrigeration circuit 30 is set to CL (Kw), and the low-temperature side of the low-temperature side refrigeration circuit 30 is The compression power of the compressor 31 is set to PA (Kw), the cooling capacity of the water cooler 38 is set to CW (Kw), and the refrigeration capacity of the high-temperature side evaporator 24 of the high-temperature side refrigeration circuit 20 is set to CH (Kw). ), and when the refrigerant circulation amount of the high-temperature side refrigeration circuit 20 is set to F1 (Kg/hour), and the refrigerant circulation amount of the low-temperature side refrigeration circuit 30 is set to F2 (Kg/hour), "0.25×(CL +PA)≦CW≦0.4×(CL+PA) and 0.6×(CL+PA)≦CH≦0.75×(CL+PA) and 0.5×PA≦CW and F1≦F2” to operate. This makes it possible to obtain the desired refrigeration capability stably while suppressing enlargement, energy consumption, and environmental burden.

特別是,關於高溫側冷凍迴路20之冷媒循環量F1以及低溫側冷凍迴路30之冷媒循環量F2,較理想,係以0.5×F2<F1≦0.7×F2之關係,來進行運轉。於此情況,在高溫側冷凍迴路20之小型化和低成本化之觀點而言,係成為有利。亦即是,在本實施形態中,係能夠將對於水冷卻器38而導入水的水供給裝置100之配管構件等亦收容在收容高溫側冷凍迴路20以及低溫側冷凍迴路30之框體內。此時,若是高溫側冷凍迴路20為大型,則係成為難以將水供給裝置100之配管構件等以良好之空間效率來作配置。相對於此,在本實施形態中,係藉由高溫側冷媒之使用量的抑制,來將高溫側冷凍迴路20之尺寸縮小,藉由此,係成為易於將裝置全體小型化。詳細而言,高溫側冷凍迴路20與低溫側冷凍迴路30,係為了構成級聯冷凝器CC而被作連接,水冷卻器38係與該些相接近地而被作配置。當在高溫側冷凍迴路20以及低溫側冷凍迴路30處之冷媒循環量係身為上述關係的情況時,在普通的設計中,低溫側冷凍迴路30係被設計為較高溫側冷凍迴路20而更大,於此情況,係能夠在如同「相對於低溫側冷凍迴路30而高溫側冷凍迴路20有所凹陷」一般的位置處的空間中,配置水供給裝置100之配管等。In particular, the refrigerant circulation amount F1 of the high-temperature side refrigeration circuit 20 and the refrigerant circulation amount F2 of the low-temperature side refrigeration circuit 30 are preferably operated in the relationship of 0.5×F2<F1≦0.7×F2. This case is advantageous from the viewpoint of miniaturization and cost reduction of the high-temperature side refrigeration circuit 20 . That is, in this embodiment, the piping members of the water supply device 100 that introduce water into the water cooler 38 can also be housed in the housing housing the high temperature side refrigeration circuit 20 and the low temperature side refrigeration circuit 30 . At this time, if the high-temperature side refrigeration circuit 20 is large, it will be difficult to arrange the piping components of the water supply device 100 with good space efficiency. On the other hand, in this embodiment, the size of the high-temperature side refrigeration circuit 20 is reduced by suppressing the usage amount of the high-temperature side refrigerant. This makes it easy to downsize the entire apparatus. Specifically, the high-temperature side refrigeration circuit 20 and the low-temperature side refrigeration circuit 30 are connected to form the cascade condenser CC, and the water cooler 38 is arranged close to these. When the refrigerant circulation amounts in the high temperature side refrigeration circuit 20 and the low temperature side refrigeration circuit 30 have the above relationship, in a common design, the low temperature side refrigeration circuit 30 is designed to be the higher temperature side refrigeration circuit 20 instead of the higher temperature side refrigeration circuit 20 . In this case, the piping and the like of the water supply device 100 can be arranged in a space at a position where the high-temperature side refrigeration circuit 20 is recessed relative to the low-temperature side refrigeration circuit 30 .

以上,雖係針對本發明之實施形態作了說明,但是,本發明係並不被限定於上述之實施形態。例如,在上述之實施形態中之冷凍裝置10,雖係為二元冷凍裝置,但是,本發明係亦可對於三元冷凍裝置作適用。於此情況,藉由水冷卻器38,中溫側冷凍迴路所循環之冷媒及/或低溫側冷凍迴路所循環之冷媒係被作冷卻。The embodiments of the present invention have been described above. However, the present invention is not limited to the above-mentioned embodiments. For example, although the refrigeration device 10 in the above embodiment is a two-dimensional refrigeration device, the present invention can also be applied to a three-dimensional refrigeration device. In this case, the refrigerant circulated in the mid-temperature side refrigeration circuit and/or the refrigerant circulated in the low-temperature side refrigeration circuit is cooled by the water cooler 38 .

10:冷凍裝置 20:高溫側冷凍迴路 21:高溫側壓縮機 22:高溫側冷凝器 23:高溫側膨脹閥 24:高溫側蒸發器 25:高溫側冷媒循環部 26:過冷卻迴路部 26A:過冷卻流路 26B:過冷卻控制閥 26C:過冷卻熱交換器 27:高溫側熱氣迴路 27A:高溫側熱氣流路 27B:高溫側熱氣控制閥 30:低溫測冷凍迴路 31:低溫側壓縮機 32:低溫側冷凝器 33:低溫側膨脹閥 34:低溫側蒸發器 35:低溫側冷媒循環部 36:低溫側熱氣迴路 36A:低溫側熱氣流路 36B:低溫側熱氣控制閥 37:噴射迴路 37A:噴射流路 37B:噴射控制閥 38:水冷卻器 100:水供給裝置 101:水源 102:水幫浦 103A:第1供給路徑 103B:第2供給路徑 104:定流量閥 200:流體流通裝置 201:循環用流路 201D:下游側流路 201U:上游側流路 202:三方向閥 203:旁通流路 204:循環用幫浦 300:控制器 CC:級聯冷卻器 S:調溫裝置 10: Refrigeration device 20: High temperature side refrigeration circuit 21: High temperature side compressor 22: High temperature side condenser 23:High temperature side expansion valve 24:High temperature side evaporator 25: High temperature side refrigerant circulation department 26: Supercooling circuit part 26A: Supercooling flow path 26B: Subcooling control valve 26C: Subcooled heat exchanger 27: High temperature side hot gas circuit 27A: High temperature side hot air flow path 27B: High temperature side hot gas control valve 30: Low temperature measurement of refrigeration circuit 31: Low temperature side compressor 32: Low temperature side condenser 33: Low temperature side expansion valve 34:Low temperature side evaporator 35: Low temperature side refrigerant circulation department 36: Low temperature side hot gas circuit 36A: Low temperature side hot air flow path 36B: Low temperature side hot gas control valve 37:Injection circuit 37A: Jet flow path 37B:Injection control valve 38:Water cooler 100:Water supply device 101:Water source 102:Water pump 103A: 1st supply path 103B: Second supply path 104:Constant flow valve 200: Fluid circulation device 201: Circulation flow path 201D: Downstream side flow path 201U: Upstream side flow path 202: Three-way valve 203:Bypass flow path 204: Circulation pump 300:Controller CC: Cascade Cooler S: Temperature regulating device

[圖1]係為對於具備有其中一個實施形態的冷凍裝置之調溫系統作概略性展示之圖。 [圖2]係為對於構成在圖1中所示之冷凍裝置的低溫側冷凍迴路之運轉狀態作說明之莫理耳線圖(Mollier chart)。 [Fig. 1] is a diagram schematically showing a temperature control system including a refrigeration device according to one of the embodiments. [Fig. 2] is a Mollier chart illustrating the operating state of the low-temperature side refrigeration circuit included in the refrigeration device shown in Fig. 1. [Fig.

10:冷凍裝置 10: Refrigeration device

20:高溫側冷凍迴路 20: High temperature side refrigeration circuit

21:高溫側壓縮機 21: High temperature side compressor

22:高溫側冷凝器 22: High temperature side condenser

23:高溫側膨脹閥 23:High temperature side expansion valve

24:高溫側蒸發器 24:High temperature side evaporator

25:高溫側冷媒循環部 25: High temperature side refrigerant circulation department

26:過冷卻迴路部 26: Supercooling circuit part

26A:過冷卻流路 26A: Supercooling flow path

26B:過冷卻控制閥 26B: Subcooling control valve

26C:過冷卻熱交換器 26C: Subcooled heat exchanger

27:高溫側熱氣迴路 27: High temperature side hot gas circuit

27A:高溫側熱氣流路 27A: High temperature side hot air flow path

27B:高溫側熱氣控制閥 27B: High temperature side hot gas control valve

30:低溫測冷凍迴路 30: Low temperature measurement of refrigeration circuit

31:低溫側壓縮機 31: Low temperature side compressor

32:低溫側冷凝器 32: Low temperature side condenser

33:低溫側膨脹閥 33: Low temperature side expansion valve

34:低溫側蒸發器 34:Low temperature side evaporator

35:低溫側冷媒循環部 35: Low temperature side refrigerant circulation department

36:低溫側熱氣迴路 36: Low temperature side hot gas circuit

36A:低溫側熱氣流路 36A: Low temperature side hot air flow path

36B:低溫側熱氣控制閥 36B: Low temperature side hot gas control valve

37:噴射迴路 37:Injection circuit

37A:噴射流路 37A: Jet flow path

37B:噴射控制閥 37B:Injection control valve

38:水冷卻器 38:Water cooler

100:水供給裝置 100:Water supply device

101:水源 101:Water source

102:水幫浦 102:Water pump

103A:第1供給路徑 103A: 1st supply path

103B:第2供給路徑 103B: Second supply path

104:定流量閥 104:Constant flow valve

200:流體流通裝置 200: Fluid circulation device

201:循環用流路 201: Circulation flow path

201D:下游側流路 201D: Downstream side flow path

201U:上游側流路 201U: Upstream side flow path

202:三方向閥 202: Three-way valve

203:旁通流路 203:Bypass flow path

204:循環用幫浦 204: Circulation pump

300:控制器 300:Controller

CC:級聯冷卻器 CC: Cascade Cooler

S:調溫裝置 S: Temperature regulating device

Claims (10)

一種冷凍裝置,係具備有高溫側冷凍迴路和低溫側冷凍迴路,並使前述高溫側冷凍迴路之蒸發器與前述低溫側冷凍迴路之冷凝器構成級聯冷凝器, 於前述低溫側冷凍迴路處之壓縮機與冷凝器之間,係具備有將前述低溫側冷凍迴路所循環的低溫側冷媒藉由水來作冷卻之水冷卻器, 在將前述低溫側冷凍迴路之蒸發器之冷凍能力設為CL(Kw), 並將前述低溫側冷凍迴路之壓縮機之壓縮動力設為PA(Kw), 並將前述水冷卻器之冷卻能力設為CW(Kw), 並將前述高溫側冷凍迴路之蒸發器之冷凍能力設為CH(Kw), 並將前述高溫側冷凍迴路之冷媒循環量設為F1(Kg/hour), 並且將前述低溫側冷凍迴路之冷媒循環量設為F2(Kg/hour)時, 係以0.25×(CL+PA)≦CW≦0.4×(CL+PA)並且0.6×(CL+PA)≦CH≦0.75×(CL+PA)並且0.5×PA≦CW並且F1≦F2之關係,來進行運轉。 A refrigeration device is provided with a high-temperature side refrigeration circuit and a low-temperature side refrigeration circuit, and the evaporator of the high-temperature side refrigeration circuit and the condenser of the low-temperature side refrigeration circuit form a cascade condenser, Between the compressor and the condenser in the low-temperature side refrigeration circuit, there is a water cooler that cools the low-temperature side refrigerant circulated in the low-temperature side refrigeration circuit with water. Let the refrigeration capacity of the evaporator of the low-temperature side refrigeration circuit be CL (Kw), Let the compression power of the compressor of the low-temperature side refrigeration circuit be PA (Kw), And set the cooling capacity of the aforementioned water cooler to CW (Kw), And the refrigeration capacity of the evaporator of the aforementioned high-temperature side refrigeration circuit is set to CH (Kw), And set the refrigerant circulation volume of the aforementioned high-temperature side refrigeration circuit to F1 (Kg/hour), And when the refrigerant circulation volume of the low-temperature side refrigeration circuit is set to F2 (Kg/hour), Based on the relationship of 0.25×(CL+PA)≦CW≦0.4×(CL+PA) and 0.6×(CL+PA)≦CH≦0.75×(CL+PA) and 0.5×PA≦CW and F1≦F2, to operate. 如請求項1所記載之冷凍裝置,其中, 係以0.5×F2<F1≦0.7×F2之關係,來進行運轉。 A refrigeration device as described in claim 1, wherein, The operation is based on the relationship of 0.5×F2<F1≦0.7×F2. 如請求項2所記載之冷凍裝置,其中, 係將前述高溫側冷凍迴路之冷媒循環量F1設為470Kg/hour以上600Kg/hour以下,並將前述低溫側冷凍迴路之冷媒循環量F2設為880Kg/hour以上920Kg/hour以下,而進行運轉。 A refrigeration device as described in claim 2, wherein, The operation is performed by setting the refrigerant circulation amount F1 of the high-temperature side refrigeration circuit to 470Kg/hour or more and 600Kg/hour or less, and setting the refrigerant circulation amount F2 of the low-temperature side refrigeration circuit to 880Kg/hour or more and 920Kg/hour or less. 如請求項1~3中之任一項所記載之冷凍裝置,其中, 前述水冷卻器,係以5℃以上28℃以下之範圍之水來冷卻前述低溫側冷媒。 The refrigeration device described in any one of claims 1 to 3, wherein, The water cooler uses water in the range of 5°C to 28°C to cool the low-temperature side refrigerant. 如請求項1所記載之冷凍裝置,其中, 前述水冷卻器,係將從水源而來之水並不作調溫地而使其流通並冷卻前述低溫側冷媒。 A refrigeration device as described in claim 1, wherein, The water cooler circulates water from a water source without temperature adjustment to cool the low-temperature side refrigerant. 如請求項1所記載之冷凍裝置,其中, 前述低溫側冷凍迴路之蒸發器之冷凍能力CL,係為30Kw以下。 A refrigeration device as described in claim 1, wherein, The refrigeration capacity CL of the evaporator of the aforementioned low-temperature side refrigeration circuit is 30Kw or less. 如請求項6所記載之冷凍裝置,其中, 前述低溫側冷凍迴路之蒸發器之冷凍能力CL,係為20Kw以上30Kw以下。 A refrigeration device as described in claim 6, wherein, The refrigeration capacity CL of the evaporator of the aforementioned low-temperature side refrigeration circuit is 20Kw or more and 30Kw or less. 如請求項1所記載之冷凍裝置,其中, 前述低溫側冷凍迴路之蒸發器之冷凍能力CL,係為前述水冷卻器之冷卻能力CW的下限值之2倍以上3倍以下。 A refrigeration device as described in claim 1, wherein, The refrigeration capacity CL of the evaporator of the low-temperature side refrigeration circuit is not less than 2 times but not more than 3 times the lower limit of the cooling capacity CW of the water cooler. 如請求項1所記載之冷凍裝置,其中, 係更進而被設置有:低溫側熱氣迴路,係將從前述低溫側冷凍迴路之壓縮機所流出並通過前述水冷卻器以及前述低溫側冷凍迴路之冷凝器之前的低溫側冷媒,送至前述低溫側冷凍迴路之膨脹閥之下游側且蒸發器之上游側的部分處。 A refrigeration device as described in claim 1, wherein, The system is further provided with: a low-temperature side hot gas circuit, which sends the low-temperature side refrigerant flowing out from the compressor of the aforementioned low-temperature side refrigeration circuit and passing through the aforementioned water cooler and before the condenser of the aforementioned low-temperature side refrigeration circuit to the aforementioned low temperature side. The part on the downstream side of the expansion valve of the side refrigeration circuit and on the upstream side of the evaporator. 一種調溫系統,係具備有: 如請求項1所記載之冷凍裝置;和 流體流通裝置,係使藉由前述低溫側冷凍迴路之蒸發器而被作冷卻的流體作流通。 A temperature control system, the system has: A refrigeration device as described in claim 1; and The fluid circulation device circulates the fluid cooled by the evaporator of the low-temperature side refrigeration circuit.
TW111147560A 2021-12-13 2022-12-12 Refrigeration device and temperature adjustment system TW202340660A (en)

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