TW202339044A - Apparatus for heating chemical liquid and system for treating substrate with the apparatus - Google Patents

Abstract

There are provided an apparatus for heating a chemical liquid that heats a chemical liquid using a heating element with a light source as a medium, and a system for treating a substrate with the apparatus. The apparatus for heating a chemical liquid includes: a flow path provided as a path through which a chemical liquid used to treat a substrate passes; a heating element disposed to surround at least a portion of the flow path; and a light source irradiating the heating element with light, wherein the heating element is heated using photon excitation, and heats the chemical liquid.

Description

Chemical liquid heating device and substrate processing system having the same

The present invention relates to a chemical liquid heating device and a substrate processing system having the heating device. More specifically, there is a chemical liquid heating device suitable for cleaning substrates and a substrate processing system having the heating device.

The process of manufacturing semiconductor components can be carried out continuously in semiconductor production equipment and is divided into pre-process and post-process.

Semiconductor production equipment is used to produce semiconductor components and is generally set up in a space defined as FAB.

The front-end process refers to the process of forming circuit patterns on the wafer to complete the chip. The pre-process will include the Deposition Process to form a thin film on the wafer, using a photo mask to transfer the photoresist to the thin film, and the Photo-Lithography Process to transfer the photoresist to the wafer. In order to form circuit patterns, chemicals or reactive gases are used to selectively remove unnecessary parts through the etching process (Etching Process), and the ashing process (Ashing) to remove the photoresist remaining after etching. (Ashing Process), the ion implantation process (Ion Implantation Process) that injects ions into the area connected to the circuit pattern so that it has the characteristics of electronic components, and the cleaning process (Cleaning Process) that removes contamination sources on the wafer.

The post-processing process is to evaluate the performance of the products completed by the previous process. The post-processing process is used to check whether each chip on the wafer will start and select good and defective wafer inspection processes, cutting (Dicing), die bonding (Die Bonding), wire bonding (Wire Bonding), packaging (Molding), and marking (Marking), etc., the packaging process of slicing or dividing each chip into product shapes (Package Process). After electrical characteristics inspection, burn-in inspection, etc., the final product characteristics and safety are determined. Check the manufacturing process, etc.

Problems solved:

When the FAB process is performed to cause changes in the wafer appearance, chemical/physical residues will remain on the wafer surface. The process to remove this residue is the cleaning process.

Cleaning processes are roughly divided into three types: wet cleaning using chemical solutions, and dry cleaning using media other than solutions. The intermediate type between wet cleaning and dry cleaning is steam. Vapor Cleaning, etc.

For wet cleaning, chemical liquids such as isopropyl alcohol (IPA) and deionized (DI) water can be used to clean the substrate. At this time, the chemical liquid can be used to clean the substrate after being heated. However, in the past, due to the use of resistors (resistors) to heat chemical liquids, impurities (particles) were produced during the cleaning process, resulting in lower yields.

The problem to be solved in the present invention is to provide a chemical liquid heating device that uses a heating element using a light source as a medium to heat a chemical liquid, and a substrate processing system having the heating device.

The subjects of the present invention are not limited to the above-mentioned subjects, and other subjects not mentioned above will be clearly understood by those skilled in the art from the following description.

Solution:

In order to achieve the above object, an aspect of the chemical liquid heating device of the present invention is a flow channel through which a chemical liquid used when processing a substrate passes; the flow channel (flow path) is arranged to surround at least a part thereof. and a light source that irradiates light on the above-mentioned heating element. The above-mentioned heating element generates heat by photon excitation and is heated in the above-mentioned chemical liquid.

The above-mentioned chemical liquid heating device will also include a covering accessory covering the above-mentioned heating element.

The above-mentioned covering fitting allows the above-mentioned light to pass through.

The above covering accessories can also be made containing Quartz.

The heating element may be heated to a predetermined temperature before the chemical liquid passes through the flow channel.

The above-mentioned heating element may also be made of a material that does not react with the above-mentioned chemical liquid.

The above-mentioned heating element can also be made of single crystal silicon.

The above-mentioned heating element is made from silicon (Si), silicon carbide (SiC), silicon dioxide (SiO ₂ ), and aluminum nitride (AlN), and contains at least one component thereof.

The above-mentioned heating element has one of a cross shape or an annular shape in the width direction.

The above-mentioned chemical liquid heating device further includes a temperature sensor connected to the discharge port of the above-mentioned flow channel and measuring the temperature of the above-mentioned chemical liquid. Based on the measured temperature of the above-mentioned chemical liquid, it can confirm whether the above-mentioned heating element has heated up.

The above-mentioned light source may include one of a light-emitting diode (LED) light source and a laser diode (LD) light source.

When the heating element is configured to surround part of the flow channel, the chemical liquid heating device may further include a side wall fitting to surround the remaining portion.

The above-mentioned side wall fittings can also be made of materials that do not react with the above-mentioned chemical liquid.

In order to achieve the above object, another embodiment of the chemical liquid heating device of the present invention is: a flow channel through which a chemical liquid for processing a substrate flows; a heating element arranged to surround at least a part of the flow channel; in the above-mentioned heat generating A light source that irradiates the body with light; and a covering accessory that covers the above-mentioned heating element and allows the above-mentioned light to pass through. The above-mentioned heating element uses photon excitation to generate heat and heat the above-mentioned chemical liquid.

In order to achieve the above object, an embodiment of the substrate processing system of the present invention is a chemical liquid device for storing a chemical liquid used when processing a substrate; a spray assembly for spraying the chemical liquid on the substrate to process the substrate; and includes the chemical liquid. A chemical liquid heating device is provided on the path from the chemical liquid storage device to the injection fitting. The chemical liquid heating device is a flow channel of the path through which the chemical liquid passes; and is configured to surround at least a part of the flow channel. A heating element; and including a light source that irradiates light on the heating element. The heating element generates heat by photon excitation and heats the chemical liquid.

Specific matters of other embodiments are included in the detailed description and drawings.

Preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings. The advantages and features of the present invention, as well as the methods for realizing them, will be more clear with reference to the following additional drawings and the embodiments described subsequently. However, the present invention is not limited to the embodiments disclosed below, and can also be presented in various forms. However, this embodiment will more completely inform the content of the present invention. In the technical field to which the present invention belongs, those with common knowledge This is equivalent to providing a complete notice of the scope of the invention, which is defined solely by the scope of the claims. The same symbols throughout this specification refer to the same component.

References to elements or components being on different layers or being referred to as "on" or "on" a layer do not only include being directly on top of other components or layers, but also being directly on top of other components or layers. All situations when there are other layers or other components in between. In contrast, a component that is "directly on" or "directly above" means that there are no other components or layers between it.

Relative words in space such as "below", "beneath", "lower", "above", "upper", etc. are shown in the figure. Briefly describe the correlation between one component or some components and other components or some components. When the spatially relative terms are used in the direction shown in the drawing or when used in motion, it should be understood that these terms also include the mutually different directions of the components. For example, when the components shown in the drawing are turned upside down, it is possible that components that were originally located "below" or "beneath" other components may become "above" other components. . Therefore, the illustrative word "below" can also include the meanings of below and above. Components can also be oriented in other directions, so spatially relative terms can be interpreted according to their oriented orientation.

Although the first and second elements are used to describe their components and/or sections, these components, components and/or sections will not be limited by their vocabulary. These words are used only to distinguish one component, component or section from other components, components or parts. Therefore, the first element, the first component or the first section mentioned below can of course be regarded as the second element, the second component or the second section in the technical thinking of the present invention.

The vocabulary used in this specification is for describing the embodiments and is not intended to limit the invention. The singular form in this specification may also include the plural form, unless otherwise mentioned.

The use of "comprises" and/or "includes" in the specification does not exclude the existence or existence of one or more other constituent elements, steps, operations and/or components for the mentioned components, steps, operations and/or components. Append.

If no other definition is made, all words (including technical and scientific words) used in this specification are used with the meaning commonly understood by those with ordinary knowledge in the technical field to which the present invention belongs. And if it is generally used and has been defined in the dictionary, its original meaning will not be exceeded or over-interpreted unless other clear definitions are made.

The embodiments of the present invention will be described in detail below with reference to the accompanying drawings. When describing with reference to the drawings, regardless of the drawing symbols, as long as the same or corresponding constituent elements are the same, the same reference numbers will be given, and their identification will be omitted. Make repeated instructions.

The present invention is a chemical liquid heating device that uses a light source as a medium to heat a chemical liquid, and a substrate processing system equipped with the same. Specifically, the chemical liquid heating device in this embodiment can also be implemented using a high-purity chemical liquid heater using photon excitation. The present invention will be described in detail below with reference to drawings and the like.

FIG. 1 is a schematic cross-sectional view of the internal structure of a substrate processing system according to an embodiment of the present invention.

The substrate processing system (100) uses wet cleaning (Wet Cleaning) substrates. The substrate processing system (100) is, for example, capable of cleaning the substrate using a chemical solution. The substrate processing system (100) is provided in a process chamber in a semiconductor manufacturing facility.

The substrate processing system (100) uses chemical liquid to clean the substrate and is composed of a cup (110), a supporting accessory (120), a lifting unit (130), a spray accessory (140) and a controller (150). .

The cup (110) provides a space for the substrate (W) processing process. Such a cup (110) has an open upper part.

The cup (110) may comprise an inner recycling bin (111), a middle recycling bin (112) and an outer recycling bin (113). At this time, each recovery barrel (111, 112, 113) can contain different treatment liquids used in the process.

The internal recycling bin (111) may be formed in a ring shape surrounding the supporting fitting (120). At this time, the inner space (114) of the internal recovery barrel (111) also serves as an inlet for the treatment liquid to flow into the internal recovery barrel (111).

The middle recycling bin (112) may also be formed in a ring shape surrounding the inner recycling bin (111). At this time, the space (115) between the inner recovery barrel (111) and the intermediate recovery barrel (112) can be used as an inlet for the treatment liquid to flow into the intermediate recovery barrel (112).

The outer recycling bin (113) may also be formed in the form of a ring surrounding the middle recycling bin (112). At this time, the space (116) between the middle recovery barrel (112) and the outer recovery barrel (113) can also be used as an inlet for the treatment liquid to flow into the outer recovery barrel (113).

Each recovery barrel (111, 112, 113) can be connected to a recovery pipeline (117, 118, 119) extending vertically below its bottom surface. Respective recovery lines (117, 118, 119) can discharge the inflowing treatment liquid to the outside through respective recovery barrels (111, 112, 113). The treatment liquid discharged to the outside is reused through the treatment liquid regeneration system (not shown).

The support accessory (120) supports the substrate (W) and allows the substrate (W) to rotate during the manufacturing process. This support fitting (120) can be arranged inside the cup (110).

The support accessories (120) may include the body (121), the support pin (122), the guide pin (123) and the first support shaft (124).

The body (121), viewed from above, mostly has a circular upper surface. The bottom surface of the body (121) is fixedly coupled with the first support shaft (124) that can be rotated by the motor (125). On the one hand, a back nozzle (not shown) can be provided on the top of the body (121).

The Support Pin (122) is the bottom surface that supports the base plate (W) on the body (121). There can be multiple support pins (122) on the body (121).

A plurality of support pins (122) may also be formed on the upper surface of the body (121), protruding toward the left. Furthermore, a plurality of support pins (122) are arranged at regular intervals on the edge of the upper surface of the body (121).

A plurality of support pins (122) can be arranged into a ring shape as a whole through combination with each other. Through these components, a plurality of support pins (122) move the base plate (W) away from the upper surface of the body (121) at a certain distance to support the rear edge of the base plate (W).

The guide pin (123), also known as the Chuck Pin, is used to prevent the base plate (W) from shifting from directly above to the side when the supporting accessory (120) rotates. support. This guide pin (123) is like a support pin (122), there may be a plurality of them on the body (121), and they are formed in a protruding shape upward on the upper surface of the body (121).

The guide pin (123) is disposed further from the center of the body (121) than the support pin (122). The guide pin (123) is provided in a linearly movable manner between the standby position and the support position according to the radial direction of the body (121). The standby position here means a position further away from the center of the body (121) than the support position.

The guide pin (123) is located in the standby position when the substrate (W) is loaded or unloaded (Loading/Unloading) on the supporting accessory (120). The substrate (W) will be located in the supporting position during the process. In the supporting position, the guide pin (123) can contact the side of the base plate (W).

The lifting unit (130) moves the cup (110) in a straight line in the up and down direction. As the cup (110) moves straight up and down, the relative height of the cup (110) to the supporting fitting (120) will change.

The lifting unit (130) may include a bracket (131), a moving axis (132) and a first drive (133).

Bracket (131) is provided fixed to the outer wall of cup (110). This Bracket (131) is combined with a moving axis (132) that moves in the up and down direction via the first driver (133).

When the base plate (W) is placed on the support fitting (120) or lifted up by the support fitting (120), the cup (110) can be lowered so that the support fitting (120) protrudes from the upper part of the cup (110). . And during the process, according to the type of processing liquid supplied to the substrate (W), the height of the cup (110) can be adjusted so that the processing liquid flows into the set recovery barrel (111, 112, 113).

For example, when the substrate (W) is treated with the first treatment liquid, the substrate (W) can be located at a height corresponding to the space (114) inside the internal recovery barrel (111). Furthermore, when the substrate (W) is treated with the second treatment liquid, the substrate (W) will be located at a height corresponding to the space (115) between the inner recovery barrel (111) and the intermediate recovery barrel (112). Furthermore, when the substrate (W) is treated with the third treatment liquid, the substrate (W) will be located at a height corresponding to the space (116) between the middle recovery barrel (112) and the outer recovery barrel (113).

In addition, the lifting unit (130) can also replace the cup (110) to support the accessory (120) to move up and down.

The spray accessory (140) supplies processing fluid to the substrate (W) during the substrate processing process. The spray accessory (140) may for this purpose consist of a nozzle support (141), a nozzle (142), a second support shaft (143) and a second driver (144).

There can be one or more spray accessories (140). When the spray parts (140) are provided in plural, they can be provided by different spray parts (140) such as chemical liquids, cleaning fluids, organic solvents, etc. The rinsing liquid may be the first fluid, an organic solvent, a mixture of isopropyl alcohol vapor and an inert gas, or isopropyl alcohol liquid.

The length direction of the nozzle support platform (141) may be along the second direction (20). The nozzle support base (141) is an end connected to the second support shaft (143) perpendicular to the length direction of the second support shaft (143). The second driver (144) can be coupled to the other end of the second support shaft (143).

The nozzle (142) can be arranged on the bottom surface of the rear end of the nozzle support platform (141). This nozzle (142) can be moved to the process position and the standby position by the second drive (144). Here, the process position means the vertical upper area of the support fitting (120) that allows the nozzle (142) to discharge the processing liquid onto the substrate (W), and the standby position means the vertical area of the support fitting (120). The area other than the upper area is the area separated from the vertical upper area of the support fitting (120) to the outside.

The length direction of the second support shaft (143) can be along the third direction (30). This second support shaft (143) is coupled to the second driver (144) at its lower end.

The second driver (144) can rotate and lift the second support shaft (143). This second driver (144) is connected to the controller (150) and is controlled by the controller (150).

Also shown in Figure 1, the controller (150) is connected to the second driver (144). However, this embodiment is not limited to this. The controller (150) can be connected not only to the 2nd drive (144) but also to the 1st drive (133) to drive the 1st drive (133).

The spray accessory (140) is for providing chemical liquid on the base plate (W) and is connected to the chemical liquid storage device (210).

FIG. 2 is a diagram illustrating the connection relationship between a chemical liquid storage device, a chemical liquid heating device and a spray accessory constituting a substrate processing system according to an embodiment of the present invention. The following description refers to Figure 2.

The chemical liquid storage device (210) stores chemical liquid (for example, IPA, organic solvent, etc.) for cleaning the substrate (W). The chemical liquid storage device (210) supplies chemical liquid to the spray fitting (140) and can be connected to the spray fitting (140) through a certain length of pipe.

Chemical liquid heating device (220) is used to heat chemical liquid. The chemical liquid heating device (220) can heat the chemical liquid moved from the chemical liquid storage device (210) to the spray assembly (140). For this purpose, the chemical liquid heating device (220) can be provided on the drain pipe connecting the chemical liquid storage device (210) and the injection fitting (140).

The chemical liquid heating device (220) can use photon excitation to heat the chemical liquid. Through this, the chemical liquid heating device (220) can be presented as a high-purity chemical liquid heater. The structure of the chemical liquid heating device (220) is described in detail below.

3 is a cross-sectional view illustrating the internal structure of a chemical liquid heating device constituting a substrate processing system according to an embodiment of the present invention. FIG. 4 is a chemical liquid heating device constituting a substrate processing system according to an embodiment of the present invention. A floor plan illustration of the interior structure.

According to Figures 3 and 4, the chemical liquid heating device (220) may include a light source (310), a covering assembly (320), and a heating element (330).

The light source (310) is for the illumination of light. This light source (310) is arranged around the heating element (330) and can irradiate the heating element (330) with light.

The heating element (330) can be inserted inside the covering fitting (320). The light source (310) can be configured to surround the entire outside of the covering accessory (320) taking into account this structure. At this time, the light source (310) can be configured to avoid contact with the outside of the covering fitting (320).

However, this embodiment does not limit it. The light source (310) is as shown in Figure 5, and it is also feasible to configure it to only cover part of the outside of the covering accessory (320). At this time, the light source (310) can consider the position of the heating element (330) in the covering accessory (320), and can be configured to cover the outer part of the covering accessory (320). FIG. 5 is a diagram illustrating examples of various arrangements of light sources constituting the chemical liquid heating device shown in FIGS. 3 and 4 .

Let's use Figure 3 and Figure 4 for explanation.

The light source (310) irradiates the heating element (330), which can be presented using an LED light source or an LD light source. In this embodiment, if the light source (310) can cause the heating element (330) to generate heat after irradiating light onto the heating element (330), any light source can be used for presentation. Light sources (310) such as UV light sources or halogen lamps are also possible.

The covering accessory (320) provides a moving path for chemical liquid (CL). For this purpose, the covering fitting (320) may be provided with a flow channel (340) extending through its interior.

The covering accessory (320) can contain a heating element (330) that generates heat through the light source (310). At this time, the heating element (330) can be built into the cover fitting (320) to surround the flow channel (340) where the chemical liquid (CL) moves.

Covering accessories (320) can be made of translucent materials, and covering accessories (320) are made of quartz (Quartz). So that the light irradiated by the light source (310) can penetrate into the heating element (330). Cover accessories (320) can be crafted from materials such as Quartz.

The heating element (330) generates heat using light irradiated by the light source (310). The heating element (330) transmits heat energy generated through the flow channel (340) to the chemical liquid (CL) when the chemical liquid (CL) moves.

The heating element (330) is as mentioned above and can be built into the cover fitting (320). At this time, if the flow channel (340) can be provided through the heating element (330) (for example, when the heating element (330) surrounds (encloses) the flow channel (340)), the chemical liquid heating device (220) does not have It doesn't hurt to cover the accessory (320).

The heating element (330) is inserted into the cover fitting (320) in a cross shape when viewed from the top side (Top-View). However, it is not limited to this Example. In order to transfer heat energy to the chemical liquid (CL), the heating element (330) can be arranged in the vicinity of the flow channel (340), and it can be formed in any shape. The heating element (330) may also be, as shown in Figure 6, when viewed from the upper side, and may also be inserted into the inside of the covering fitting (320) in a ring shape. FIG. 6 is a first example diagram for explaining various phenomena of the heating element constituting the chemical liquid heating device shown in FIGS. 3 and 4 .

The heating element (330) may be formed to completely surround the flow channel (340) within the covering fitting (320). However, this embodiment does not limit it. Heating element (330) is also available.

As shown in Figure 7, a part of the flow channel (340) is enclosed in the covering fitting (320). At this time, it is possible to add a side wall fitting (350) that covers the remaining portion of the flow channel (340) to the covering fitting (320). The side wall fittings (350) are made of materials that do not react with chemical liquid (CL). FIG. 7 is a second illustration for explaining various phenomena of the heating element constituting the chemical liquid heating device shown in FIGS. 3 and 4 .

The heating element (330) generates heat by the light irradiated by the light source (310), and is made of a material that absorbs light. Furthermore, the heating element (330) can be made of a material that does not react with the chemical liquid (CL). As mentioned above, if the heating element (330) is made of a material that absorbs light and does not react with the chemical liquid (CL). Impurities (Particles) will not be formed and the effect of heating chemical liquid (CL) can be effectively achieved.

In order to obtain the above-mentioned effects, the heating element (330) may also be manufactured by containing a silicon (Si) component. The heating element (330) may be made of single crystal silicon, or may include silicon carbide (SiC; Silicon Carbide), silicon dioxide (SiO ₂ ; Silicon Dioxide), or other components. However, this embodiment will not limit it. The heating element (330) can also be made of a component containing aluminum nitride (AlN; Aluminum Nitride).

When the heating element (330) is made of silicon, it generates heat energy based on the light absorption rate (Intensity) of Si. In this embodiment, the heating element (330) can raise the temperature in advance before the chemical liquid passes through the flow channel (340).

On the one hand, the heating element (330) generates heat by the light irradiated by the light source (310), and itself can be used as a permanent heating element (Permanent Heating Element).

On the one hand, in order to confirm whether the heating element (330) has heated up and measure the temperature of the chemical liquid (CL), a temperature sensor can be connected to the outlet (Outlet) of the flow channel (340) to measure the temperature of the chemical liquid (CL). ) temperature.

As described above, the chemical liquid heating device (220) is based on the photon excitation method and uses the Absorption-Induced heating element (330) to heat the chemical liquid (CL) by immersion. Heater presented. The chemical liquid heating device (220) has the above-mentioned structure and can block the impurity (particle) light source from the beginning, thereby achieving the effect of improving semiconductor production efficiency. Furthermore, the chemical liquid heating device (220) heats by emitting light without generating latent heat. It is highly stable and has low heat conduction loss, making it a highly reliable heater.

In the past, chemical liquid heating devices used resistors to heat chemical liquids. This kind of chemical liquid heating device blocks the generation of metal impurities (Metal Particles). The heat element (Heat Element) made of nickel-chromium (Ni-Cr) alloy is coated with Teflon. -Coated Ni-Cr).

However, in the past, the Teflon material (PTFE) coating on the heat element of chemical liquid heating devices would emit impurities at high temperatures. In addition, PFA (tube), PTFE, O-ring (Viton + FEP), etc. use O-rings for the wetted parts (fluid end), which may generate impurity (particle) light sources. Therefore, in the past, chemical liquid heating devices used chemical liquids such as IPA and deionized (DI) water to clean the substrates. At this time, the yield rate decreased due to the increase in impurities (particles).

According to the chemical liquid heating device (220) of this embodiment, as explained in Figures 3 to 7, the LED light source, LD light source, etc. are irradiated on silicon (Si) to generate thermal energy through photon excitation (Photon Absorption) to cause the silicon (Si) to Si) heating. The chemical liquid heating device (220) can use monocrystalline silicon (Si) that does not react with chemical liquids (such as isopropyl alcohol (IPA)) as a heat source, and does not generate latent heat when the LED is turned off, which can reduce the vaporization of IPA. or explosion risk.

The chemical liquid heating device (220) in this embodiment can be composed of PFA (Polyfluoroalkoxy, Chinese: tetrafluoroethylene), a covering component (320) such as quartz (Quartz), a heating element (330) such as silicon (Si), etc. The liquid part (fluid end) can be removed, and the impurities (partial) produced in the liquid part (fluid end) are the O-ring of the light source, PTFE (Polytetrafluoroethylene in Chinese: polytetrafluoroethylene), etc.

In addition, the chemical liquid heating device (220) can also use a chemical bath (Bath) made of quartz (Quartz) to remove impurities (particles) from the light source, while also achieving the effect of maintaining light transmittance.

Figure 8 is a diagram illustrating the chemical liquid heating components of the substrate processing system according to an embodiment of the present invention.

Structural diagram of the first test setup (set up) related to device performance evaluation. For the chemical liquid heating device (220) according to this embodiment, in order to evaluate its adequacy through a chemical liquid temperature rising test, a silicon wafer (Si Wafer; 420) is placed on the glass substrate (Glass; 410), and using The LED array (LED Array; 430) attempts to heat the heating element (420) on its upper part. ,

The glass substrate (410) uses a Ø300 glass bath with a thickness (t) of 7mm, and the heating element (420) uses a Ø200 silicon wafer (Si Wafer). And the light source (430) uses a Ø300 LED Array heater.

Other test conditions are as follows:

- Distance between heating element (420) and light source (430): 30mm

- Use chemical liquid: water 3L

- Heating time: 5 minutes ~ 10 minutes

After the heating time elapsed, we measured the temperature on the upper surface of the heating element (420). The test results show that the upper surface of the heating element (420) rises to 50 degrees after approximately 5 minutes, and based on the surface, rises to approximately 75 degrees after 9 minutes. When using IPA as a chemical liquid for evaluation, it can be expected that the heating element (420) will heat up more quickly.

9 is a structural diagram of a second test setup (set up) for evaluating the performance of a chemical liquid heating device constituting a substrate processing system according to an embodiment of the present invention.

According to the experimental setup (set up) structure marked in Figure 9, using the LED heater, we evaluate the temperature rise when using Si.

A plurality of LEDs (520) are arranged on the body (121) (such as a Chuck) as a light source, and a covering-shaped quartz round window (Quartz Window; 510) is made on the upper part to cover the plurality of LEDs ( 520). And use the Support Pin (122) and Guide Pin (123) to position the base plate (W) on top of it.

According to the test setup (set up) structure shown in Figure 9, using the thermal imager (530), when we measured the surface temperature of the substrate (W), after the Rising Time (640) as shown in Figure 10 A certain temperature rise can be confirmed in each area of the substrate (W) (Point 1 (610), Point 2 (620), Point 3 (630)). FIG. 10 is a first test report showing the performance of a chemical liquid heating device configured in a substrate processing system according to an embodiment of the present invention. From the above, point 1 (610) means the point on the center zone of the substrate (W), and point 2 (620) means the middle zone of the substrate (W). ) Point 3 Point (630) means a point on the edge zone of the substrate (W).

On the one hand, there is a picture as shown in Figure 11. From the above experiments, it can be found that there is a V-shaped recipe between the center area and the edge that can be controlled. FIG. 11 is a second test report on the performance of the chemical liquid heating device constituting the substrate processing system according to one embodiment of the present invention.

The embodiments of the present invention are described with reference to the above and attached drawings. However, those with common knowledge in the technical field to which the present invention belongs may adopt other specific forms without changing the technical thinking or essential features of the present invention. It is possible to present. Therefore, the above-mentioned embodiments are only examples in all aspects and are not limiting.

100:Substrate processing system 110:Cup 111: Internal recycling bin 112: Intermediate recycling bin 113:External recycling bin 120: Support accessories 121: Body 122: Support pin 123: Guide pin 124: 1st support shaft 130:Lifting unit 140:Jet accessories 150:Controller 210:Chemical liquid storage device 220:Chemical liquid heating device 310:Light source 320: Cover accessories 330: Heating element 340:Flow channel 350: Side wall accessories 410:Glass substrate 510: LED 520: Quartz round window 530:Thermal imager W: substrate CL: chemical liquid

FIG. 1 is a cross-sectional view schematically illustrating the internal structure of a substrate processing system according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating the connection relationship between the chemical liquid storage device, the chemical liquid heating device and the spray assembly constituting the substrate processing system according to an embodiment of the present invention.

3 is a cross-sectional view illustrating the internal structure of a chemical liquid heating device constituting a substrate processing system according to an embodiment of the present invention.

4 is a plan view illustrating the internal structure of a chemical liquid heating device constituting a substrate processing system according to an embodiment of the present invention.

FIG. 5 is an explanatory diagram illustrating various arrangements of light sources constituting the chemical liquid heating device shown in FIGS. 3 and 4 .

FIG. 6 is a first example diagram for explaining various phenomena of the heating element constituting the chemical liquid heating device shown in FIGS. 3 and 4 .

FIG. 7 is a second illustrative diagram illustrating various shapes of heating elements constituting the chemical liquid heating device shown in FIGS. 3 and 4 .

8 is a structural diagram of a first test setup (set up) for performance evaluation of a chemical liquid heating device constituting a substrate processing system according to one embodiment of the present invention.

FIG. 9 is a structural diagram of a second test setup (set up) for performance evaluation of the chemical liquid heating device constituting the substrate processing system according to one embodiment of the present invention.

FIG. 10 is a first test report showing performance results of a chemical liquid heating device constituting a substrate processing system according to an embodiment of the present invention.

FIG. 11 is a second test report showing performance results of a chemical liquid heating device constituting a substrate processing system according to an embodiment of the present invention.

220:Chemical liquid heating device

310:Light source

320: Cover accessories

330: Heating element

340:Flow channel

Claims (20)

A chemical liquid heating device including: A channel provides a path for a chemical liquid used when processing the substrate to flow; a heating element surrounding at least a part of the above-mentioned flow channel; and A light source irradiates light on the above-mentioned heating element, Wherein, the above-mentioned heating element generates heat by photon excitation to heat the above-mentioned chemical liquid. The chemical liquid heating device according to claim 1, wherein, It also includes a covering accessory that covers one of the above heating elements. The chemical liquid heating device according to claim 2, wherein, The above-mentioned covering fitting allows the above-mentioned light to pass through. The chemical liquid heating device according to claim 3, wherein, The above-mentioned covering accessories are made of quartz. The chemical liquid heating device according to claim 1, wherein, The temperature of the heating element is set to a predetermined temperature in advance before the chemical liquid passes through the flow channel. The chemical liquid heating device according to claim 1, wherein, The heating element is made of a material that does not react with the chemical liquid. The chemical liquid heating device according to claim 6, wherein, The above-mentioned heating element is made of single crystal silicon. The chemical liquid heating device according to claim 6, wherein the heating element contains at least one component of silicon (Si), silicon carbide (SiC), silicon dioxide (SiO ₂ ), and aluminum nitride (AlN). to manufacture. The chemical liquid heating device according to claim 1, wherein, The above-mentioned heating element has one of a cross shape or an annular shape in the width direction. The chemical liquid heating device according to claim 1, further comprising A temperature sensor is connected to the discharge port of the flow channel to measure the temperature of the chemical liquid, and the chemical liquid heating device confirms whether the heating element has heated up based on a measured temperature of the chemical liquid. The chemical liquid heating device according to claim 1, wherein, The above-mentioned light source is a light source including at least one of a light-emitting diode light source and a laser diode light source. The chemical liquid heating device according to claim 1, wherein, When the above-mentioned heating element is arranged to surround a part of the above-mentioned flow channel, a side wall fitting is further included to surround the above-mentioned remaining part. The chemical liquid heating device according to claim 12, wherein, The above-mentioned side wall fittings are made of materials that do not react with the above-mentioned chemical liquid. A chemical liquid heating device including: A channel, a path for the chemical liquid used to process the substrate to pass; A heating element configured to surround at least a portion of the flow channel; A light source that irradiates light on the above-mentioned heating element; and A covering accessory that covers the above-mentioned heating element and allows the above-mentioned light to pass through, Wherein, the above-mentioned heating element generates heat by photon excitation to heat the above-mentioned chemical liquid. A substrate processing system including: A chemical liquid storage device for storing a chemical liquid for processing the substrate; A spray accessory for spraying the chemical liquid on the substrate to process the substrate; and A chemical liquid heating device moves the chemical liquid from the chemical liquid storage device to the spray accessory, Wherein, the above-mentioned chemical liquid heating device, The flow channel for the passage of the above-mentioned chemical liquid; A heating element configured to surround at least a part of the flow channel; and and includes a light source that irradiates light on the above-mentioned heating element, The above-mentioned heating element uses photon excitation to generate heat to heat the above-mentioned chemical liquid. The substrate processing system according to claim 15, wherein the chemical liquid heating device further includes a covering fitting, and the covering fitting covers the heating element to allow the light to pass through. The substrate processing system according to claim 15, wherein, The heating element is heated to a preset temperature before the chemical liquid passes through the flow channel. The substrate processing system according to claim 15, wherein, The heating element is made of a material that does not react with the chemical liquid. The substrate processing system according to claim 15, wherein, The above-mentioned heating element has one of a cross shape or an annular shape in the width direction. The substrate processing system according to claim 15, wherein, The above-mentioned chemical liquid heating device also includes: A temperature sensor is connected to the discharge port of the above-mentioned flow channel to measure the temperature of the above-mentioned chemical liquid, The above-mentioned chemical liquid heating device confirms whether the temperature of the above-mentioned heating element is raised based on the measured temperature of the above-mentioned chemical liquid.

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