KR20240068600A - Apparatus for heating chemical liquid and system for treating substrate with the apparatus - Google Patents

Abstract

A chemical heating device that heats a chemical liquid using a heating element using a light source as a medium and a substrate processing system including the same are provided. The chemical heating device includes a flow path provided as a path through which a chemical liquid used to treat a substrate passes; A heating element disposed to surround at least a portion of the flow path; and a light source that irradiates light to the heating element, where the heating element generates heat using photon excitation and heats the chemical solution.

Description

Chemical heating device and substrate processing system comprising the same {Apparatus for heating chemical liquid and system for treating substrate with the apparatus}

The present invention relates to a chemical heating device and a substrate processing system including the same. More specifically, it relates to a chemical heating device that can be applied during substrate cleaning and a substrate processing system including the same.

The process of manufacturing semiconductor devices can be performed continuously within a semiconductor manufacturing facility and can be divided into pre-process and post-process. Semiconductor manufacturing facilities may be installed in a space generally defined as a fab to manufacture semiconductor devices.

The preprocess refers to the process of completing a chip by forming a circuit pattern on a wafer. The pre-process includes a deposition process that forms a thin film on the wafer, an exposure process that transfers photo resist onto the thin film using a photo mask, and a desired photo-lithography process on the wafer. An etching process that selectively removes unnecessary parts using chemicals or reactive gases to form a circuit pattern, an ashing process that removes photoresist remaining after etching, and a process that is connected to the circuit pattern. It may include an ion implantation process that implants ions into a part to give it the characteristics of an electronic device, and a cleaning process that removes contaminants from the wafer.

Post-process refers to the process of evaluating the performance of a product completed through the pre-process. The post-process includes a wafer inspection process that tests the operation of each chip on the wafer to select good and defective products, dicing, die bonding, wire bonding, molding, The final product characteristics and reliability are determined through the packaging process, which cuts and separates each chip to form the product shape through marking, electrical characteristics inspection, and burn-in inspection. It may include the final inspection process, etc.

Korean Patent Publication No. 10-2008-0014246 (Publication date: 2008.02.14.)

When the FAB process is performed to change the appearance of the wafer, chemical/physical residues remain on the wafer surface, and the process to remove these residues is the cleaning process.

The cleaning process can be broadly divided into three methods: wet cleaning using a chemical solution, dry cleaning using a medium other than a solution, and steam cleaning using steam, which is an intermediate form between wet cleaning and dry cleaning. This includes Vapor Cleaning), etc.

In the case of wet cleaning, the substrate can be cleaned using a chemical solution such as IPA or DI. In this case, the chemical solution can be used to clean the substrate after being heated. However, conventionally, a resistor is used to heat the chemical solution, and there is a problem in that the yield decreases due to an increase in particles during the cleaning process.

The problem to be solved by the present invention is to provide a chemical heating device that heats a chemical solution using a heating element using a light source as a medium, and a substrate processing system including the same.

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

One aspect of the chemical heating device of the present invention for achieving the above object is a flow path provided as a path through which a chemical solution used to treat a substrate passes; a heating element disposed to surround at least a portion of the flow path; and a light source that irradiates light to the heating element, wherein the heating element generates heat using photon excitation and heats the chemical solution.

The chemical heating device may further include a cover member that covers the heating element.

The cover member may transmit the light.

The cover member may be manufactured including quartz.

The heating element may be heated to a predetermined temperature before the chemical liquid passes through the flow path.

The heating element may be manufactured from a material that does not react with the chemical solution.

The heating element may be made of single crystal silicon.

The heating element may be manufactured including at least one of silicon (Si), silicon carbide (SiC), silicon dioxide (SiO2), and aluminum nitride (AlN).

The heating element may have either a cross shape or a ring shape in the width direction.

The chemical heating device further includes a temperature sensor connected to the discharge port of the flow path to measure the temperature of the chemical liquid, and can check whether the temperature of the heating element is increased based on the measured temperature of the chemical liquid.

The light source may include at least one of an LED source and an LD source.

When the heating element is disposed to surround a portion of the flow path, the chemical heating device may further include a side wall member disposed to surround the remaining portion.

The side wall member may be manufactured from a material that does not react with the chemical solution.

Another aspect of the chemical heating device of the present invention for achieving the above object is a flow path provided as a path through which the chemical solution used to treat the substrate passes; a heating element disposed to surround at least a portion of the flow path; A light source that irradiates light to the heating element; and a cover member that covers the heating element and transmits the light, wherein the heating element generates heat using photon excitation and heats the chemical solution.

One aspect of the substrate processing system of the present invention for achieving the above object includes: a chemical liquid storage device for storing a chemical liquid used to process a substrate; a spray member that sprays the chemical solution onto the substrate to treat the substrate; and a chemical heating device installed on a path through which the chemical liquid moves from the chemical liquid storage device to the spray member, wherein the chemical heating device includes: a flow path provided as a path through which the chemical liquid passes; a heating element disposed to surround at least a portion of the flow path; and a light source that irradiates light to the heating element, wherein the heating element generates heat using photon excitation and heats the chemical solution.

Specific details of other embodiments are included in the detailed description and drawings.

1 is a cross-sectional view schematically showing the internal structure of a substrate processing system according to an embodiment of the present invention.
FIG. 2 is a diagram illustrating the connection relationship between a chemical storage device, a chemical heating device, and an injection member that constitute a substrate processing system according to an embodiment of the present invention.
Figure 3 is a cross-sectional view showing the internal structure of a chemical heating device that constitutes a substrate processing system according to an embodiment of the present invention.
Figure 4 is a plan view showing the internal structure of a chemical heating device constituting a substrate processing system according to an embodiment of the present invention.
FIG. 5 is an example diagram for explaining various arrangement structures of light sources constituting the chemical heating device shown in FIGS. 3 and 4.
FIG. 6 is a first example diagram for explaining various shapes of heating elements constituting the chemical heating device shown in FIGS. 3 and 4.
FIG. 7 is a second example diagram for explaining various shapes of heating elements constituting the chemical heating device shown in FIGS. 3 and 4.
Figure 8 is a structural diagram of a first test setup for evaluating the performance of a chemical heating device constituting a substrate processing system according to an embodiment of the present invention.
Figure 9 is a structural diagram of a second test setup for evaluating the performance of a chemical heating device constituting a substrate processing system according to an embodiment of the present invention.
Figure 10 is a first test result showing the performance of a chemical heating device that constitutes a substrate processing system according to an embodiment of the present invention.
Figure 11 is a second test result showing the performance of the chemical heating device that constitutes the substrate processing system according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various different forms. The present embodiments are merely intended to ensure that the disclosure of the present invention is complete and to provide common knowledge in the technical field to which the present invention pertains. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

When an element or layer is referred to as “on” or “on” another element or layer, it refers not only to being directly on top of another element or layer, but also to intervening with another element or layer. Includes all. On the other hand, when an element is referred to as “directly on” or “directly on”, it indicates that there is no intervening element or layer.

Spatially relative terms such as “below”, “beneath”, “lower”, “above”, “upper”, etc. are used as a single term as shown in the drawing. It can be used to easily describe the correlation between elements or components and other elements or components. Spatially relative terms should be understood as terms that include different directions of the element during use or operation in addition to the direction shown in the drawings. For example, if an element shown in the drawings is turned over, an element described as “below” or “beneath” another element may be placed “above” the other element. Accordingly, the illustrative term “down” may include both downward and upward directions. Elements can also be oriented in other directions, so spatially relative terms can be interpreted according to orientation.

Although first, second, etc. are used to describe various elements, elements and/or sections, it is understood that these elements, elements and/or sections are not limited by these terms. These terms are merely used to distinguish one element, component or section from other elements, elements or sections. Accordingly, it goes without saying that the first element, first element, or first section mentioned below may also be a second element, second element, or second section within the technical spirit of the present invention.

The terminology used herein is for describing embodiments and is not intended to limit the invention. As used herein, singular forms also include plural forms, unless specifically stated otherwise in the context. As used herein, “comprises” and/or “comprising” refers to the presence of one or more other components, steps, operations and/or elements. or does not rule out addition.

Unless otherwise defined, all terms (including technical and scientific terms) used in this specification may be used with meanings that can be commonly understood by those skilled in the art to which the present invention pertains. Additionally, terms defined in commonly used dictionaries are not interpreted ideally or excessively unless clearly specifically defined.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, identical or corresponding components will be assigned the same reference numbers regardless of the reference numerals, and overlapping elements will be assigned the same reference numbers. The explanation will be omitted.

The present invention relates to a chemical heating device that heats a chemical liquid using a heating element using a light source as a medium, and a substrate processing system including the same. Specifically, in this embodiment, the chemical heating device may be implemented as a highly clean chemical heater using a photon excitation method. Hereinafter, the present invention will be described in detail with reference to the drawings.

1 is a cross-sectional view schematically showing the internal structure of a substrate processing system according to an embodiment of the present invention.

The substrate processing system 100 performs wet cleaning of the substrate. The substrate processing system 100 may clean the substrate using, for example, a chemical solution. The substrate processing system 100 may be provided in a process chamber within a semiconductor manufacturing facility.

When cleaning a substrate using a chemical solution, the substrate processing system 100 includes, for example, a cup 110, a support member 120, an elevating unit 130, an injection member 140, and a controller 150. It can be configured as follows.

The cup 110 provides a space where a process for processing the substrate W is performed. This cup 110 may be formed to have an open top.

The cup 110 may be configured to include an internal recovery container 111, a middle recovery container 112, and an external recovery container 113. At this time, each recovery tank 111, 112, and 113 can recover different treatment liquids among the treatment liquids used in the process.

The internal recovery container 111 may be provided in an annular ring shape surrounding the support member 120. At this time, the inner space 114 of the internal recovery container 111 may function as an inlet through which the treatment liquid flows into the internal recovery container 111.

The middle recovery container 112 may be provided in an annular ring shape surrounding the internal recovery container 111. At this time, the space 115 between the internal recovery container 111 and the intermediate recovery container 112 may function as an inlet that allows the treatment liquid to flow into the intermediate recovery container 112.

The external recovery container 113 may be provided in an annular ring shape surrounding the middle recovery container 112. At this time, the space 116 between the middle recovery container 112 and the external recovery container 113 may function as an inlet that allows the treatment liquid to flow into the external recovery container 113.

Each of the recovery bins 111, 112, and 113 may be connected to recovery lines 117, 118, and 119 extending vertically downward from the bottom thereof. Each recovery line (117, 118, 119) can discharge the treatment liquid flowing in through each recovery container (111, 112, 113) to the outside. The treatment liquid discharged to the outside may be treated for reuse through a treatment liquid regeneration system (not shown).

The support member 120 supports and rotates the substrate W during the process. This support member 120 may be placed inside the cup 110.

The support member 120 may include a body 121, a support pin 122, a guide pin 123, and a first support shaft 124.

The body 121 may have an upper surface that is generally circular when viewed from above. A first support shaft 124 that can be rotated by a motor 125 may be fixedly coupled to the bottom of the body 121. Meanwhile, a back nozzle (not shown) may be installed on the upper surface of the body 121.

The support pin 122 supports the bottom of the substrate W on the body 121. A plurality of such support pins 122 may be provided on the body 121.

A plurality of support pins 122 may be formed to protrude upward from the upper surface of the body 121. Additionally, a plurality of support pins 122 may be arranged at predetermined intervals on the edge of the upper surface of the body 121. For example, the plurality of support pins 122 may be arranged to have an overall annular ring shape by combining them with each other. Through this configuration, the plurality of support pins 122 can support the rear edge of the substrate W so that the substrate W is spaced a certain distance away from the upper surface of the body 121.

The guide pin 123 is also called a chuck pin, and supports the side of the substrate W so that the substrate W does not deviate laterally from its original position when the support member 120 rotates. Like the support pin 122, a plurality of guide pins 123 may be provided on the body 121, and may be formed to protrude upward from the upper surface of the body 121.

The guide pin 123 may be arranged farther away from the center of the body 121 than the support pin 122. The guide pin 123 may be provided to enable linear movement between the standby position and the support position along the radial direction of the body 121. Here, the standby position means a position farther away from the center of the body 121 compared to the support position.

The guide pin 123 may be positioned in a standby position when the substrate W is loaded/unloaded from the support member 120 and may be positioned in a support position when a process is performed on the substrate W. The guide pin 123 may be in contact with the side of the substrate W at the support position.

The lifting unit 130 moves the cup 110 straight up and down. As the cup 110 moves linearly in the up and down direction, the relative height of the cup 110 with respect to the support member 120 may change.

The lifting unit 130 may be configured to include a bracket 131, a moving shaft 132, and a first driver 133.

The bracket 131 is fixedly installed on the outer wall of the cup 110. This bracket 131 can be combined with a moving shaft 132 that moves in the vertical direction by the first driver 133.

When the substrate W is placed on the support member 120 or lifted from the support member 120, the cup 110 may be lowered so that the support member 120 protrudes toward the top of the cup 110. . Additionally, as the process progresses, the height of the cup 110 may be adjusted so that the processing liquid can flow into the preset recovery containers 111, 112, and 113 depending on the type of processing liquid supplied to the substrate W. .

For example, while treating the substrate W with the first processing liquid, the substrate W may be positioned at a height corresponding to the inner space 114 of the internal recovery container 111. Additionally, while treating the substrate W with the second treatment liquid, the substrate W may be positioned at a height corresponding to the space 115 between the internal recovery container 111 and the intermediate recovery container 112. Additionally, while treating the substrate W with the third treatment liquid, the substrate W may be positioned at a height corresponding to the space 116 between the middle recovery container 112 and the external recovery container 113.

Meanwhile, the lifting unit 130 can also move the support member 120 in the vertical direction instead of the cup 110.

The injection member 140 supplies processing liquid to the substrate W during the substrate processing process. For this purpose, the injection member 140 may be configured to include a nozzle supporter 141, a nozzle 142, a second support shaft 143, and a second driver 144.

One or more injection members 140 may be provided. When a plurality of spraying members 140 are provided, chemicals, rinse liquid, organic solvents, etc. may be provided through different spraying members 140. The rinse liquid may be the first fluid, and the organic solvent may be a mixture of isopropyl alcohol vapor and an inert gas, or may be an isopropyl alcohol liquid.

The nozzle support 141 may be provided along the second direction 20 in its longitudinal direction. The nozzle support 141 may be coupled to one end of the second support shaft 143 in a direction perpendicular to the longitudinal direction of the second support shaft 143. The second driver 144 may be coupled to the other end of the second support shaft 143.

The nozzle 142 may be installed on the bottom surface of the end of the nozzle support 141. This nozzle 142 can be moved to the process position and the standby position by the second driver 144. Here, the process position refers to an area vertically above the support member 120 that allows the nozzle 142 to discharge the processing liquid on the substrate W, and the standby position refers to an area vertically above the support member 120. This refers to the excluded area, that is, the area deviated outward from the vertically upper area of the support member 120.

The second support shaft 143 may be provided along the third direction 30 in its longitudinal direction. This second support shaft 143 may be coupled to the second driver 144 at its lower end.

The second driver 144 rotates and lifts the second support shaft 143. This second driver 144 is connected to the controller 150 and can be controlled by the controller 150.

Meanwhile, in FIG. 1, the controller 150 is shown connected to the second driver 144. However, this embodiment is not limited to this. The controller 150 is connected not only to the second driver 144 but also to the first driver 133 and can control the first driver 133 as well.

The injection member 140 may be connected to the chemical liquid storage device 210 to provide chemical liquid on the substrate W.

FIG. 2 is a diagram illustrating the connection relationship between a chemical storage device, a chemical heating device, and an injection member that constitute a substrate processing system according to an embodiment of the present invention. The following description refers to FIG. 2.

The chemical storage device 210 stores a chemical solution (eg, IPA, organic solvent, etc.) used to clean the substrate W. This chemical liquid storage device 210 may be connected to the injection member 140 through a pipe of a predetermined length in order to supply chemical liquid to the injection member 140.

The chemical heating device 220 heats the chemical liquid. The chemical heating device 220 may heat the chemical liquid moving from the chemical liquid storage device 210 to the spray member 140. For this purpose, the chemical heating device 220 may be installed on a pipe connecting the chemical liquid storage device 210 and the injection member 140.

The chemical heating device 220 can heat the chemical solution using a photon excitation method. Through this, the chemical heating device 220 can be implemented as a highly clean chemical heater. Hereinafter, the structure of the chemical heating device 220 will be described in detail.

FIG. 3 is a cross-sectional view showing the internal structure of a chemical heating device constituting a substrate processing system according to an embodiment of the present invention, and FIG. 4 is a cross-sectional view showing the internal structure of a chemical heating device constituting a substrate processing system according to an embodiment of the present invention. This is a floor plan showing the internal structure.

According to FIGS. 3 and 4 , the chemical heating device 220 may include a light source 310, a cover member 320, and a heating element (330).

The light source 310 irradiates light. This light source 310 may be disposed around the heating element 330 and irradiate light toward the heating element 330.

The heating element 330 may be inserted into the cover member 320. The light source 310 may be arranged to surround the entire outside of the cover member 320 in consideration of this structure. At this time, the light source 310 may be placed on the outside of the cover member 320 without contacting it.

However, this embodiment is not limited to this. The light source 310 can also be arranged to surround only an outer part of the cover member 320, as shown in FIG. 5. In this case, the light source 310 may be arranged to surround a portion of the outer side of the cover member 320 in consideration of the position of the heating element 330 within the cover member 320. FIG. 5 is an example diagram for explaining various arrangement structures of light sources constituting the chemical heating device shown in FIGS. 3 and 4.

This will be described again with reference to FIGS. 3 and 4.

The light source 310 may be implemented as an LED source or an LD source to irradiate light to the heating element 330. In this embodiment, the light source 310 may be implemented as any source as long as it can generate heat by irradiating light to the heating element 330. The light source 310 may also be implemented as, for example, a UV source or a halogen lamp.

The cover member 320 provides a movement path for chemical liquid (CL). For this purpose, the cover member 320 may be provided with a flow path 340 penetrating its interior.

The cover member 320 may contain a heating element 330 that generates heat by the light source 310. At this time, the heating element 330 may be built into the cover member 320 to surround the passage 340 through which the chemical liquid CL moves.

The cover member 320 may be made of a material that can transmit light so that the light irradiated by the light source 310 can reach the heating element 330. The cover member 320 may be manufactured using, for example, quartz.

The heating element 330 generates heat using light irradiated by the light source 310. The heating element 330 may transfer heat energy generated by heat generation to the chemical liquid CL when it moves through the flow path 340.

The heating element 330 may be built into the cover member 320 as described above. At this time, if the flow path 340 can be provided by the heating element 330 (for example, if the heating element 330 is formed to surround the flow path 340), the chemical heating device 220 may use the cover member 320. You do not need to provide a .

The heating element 330 may be inserted into the cover member 320 in a cross shape when viewed from the top (top view). However, this embodiment is not limited to this. The heating element 330 may be formed in any shape as long as it can be installed close to the flow path 340 to transfer heat energy to the chemical liquid CL. For example, the heating element 330 may be inserted into the cover member 320 in a ring shape when viewed from above, as shown in FIG. 6 . FIG. 6 is a first example diagram for explaining various shapes of heating elements constituting the chemical heating device shown in FIGS. 3 and 4.

The heating element 330 may be formed to surround the entire flow path 340 within the cover member 320. However, this embodiment is not limited to this. The heating element 330 may be formed to surround a portion of the flow path 340 within the cover member 320 as shown in FIG. 7 . In this case, a side wall member 350 that covers the remaining portion of the flow path 340 may be added to the cover member 320. The side wall member 350 may be formed of a material that does not react with the chemical liquid (CL). FIG. 7 is a second example diagram for explaining various shapes of heating elements constituting the chemical heating device shown in FIGS. 3 and 4.

The heating element 330 may be manufactured using a material that can absorb light in order to generate heat using light irradiated by the light source 310. Additionally, the heating element 330 may be manufactured using a material that does not react with the chemical liquid (CL). If the heating element 330 is manufactured from a material that can absorb light in this way and does not react with the chemical liquid (CL), it can achieve the effect of efficiently heating the chemical liquid (CL) without generating particles. there is.

The heating element 330 may be manufactured including a silicon (Si) component to achieve the above effects. For example, the heating element 330 may be made of single crystal silicon or may be made of components such as silicon carbide (SiC) or silicon dioxide (SiO2). However, this embodiment is not limited to this. The heating element 330 can also be manufactured including aluminum nitride (AlN).

When the heating element 330 is manufactured using a silicon component, it can be provided as a mechanism for generating heat by the light absorption rate (Intensity) of Si. In this embodiment, the heating element 330 may be heated to a reference temperature in advance before the chemical liquid passes through the flow path 340.

Meanwhile, since the heating element 330 generates heat using light irradiated by the light source 310, it can also achieve the effect of being able to use itself as a permanent heating element.

Meanwhile, when measuring the temperature of the chemical liquid (CL) to check whether the temperature of the heating element 330 has risen, the temperature of the chemical liquid (CL) can be measured by connecting a temperature sensor to the outlet of the flow path 340. .

As described above, the chemical heating device 220 is an immersion type heater that heats the chemical liquid (CL) using the photon absorption-induced heating element 330 according to the photon excitation method. It can be implemented as: Through this structure, the chemical heating device 220 can block the particle source at its source, thereby increasing semiconductor manufacturing efficiency. In addition, the chemical heating device 220 is a heating method using light emission and does not generate latent heat, so it has excellent stability and can be implemented as a high-efficiency, high-reliability heater with little loss in thermal conductivity and the like.

A conventional chemical heating device can heat a chemical solution using a resistor. This conventional chemical heating device coats the heat element made of nickel-chromium (Ni-Cr) alloy with Teflon to block the generation of metal particles (Teflon-Coated Ni). -Cr).

However, in the case of a conventional chemical heating device, the Teflon material (PTFE) coated on the heat element can elute particles at high temperatures. In addition, O-rings are applied to liquid contact parts such as PFA (tube), PTFE, and O-Ring (Viton + FEP), so they can provide a particle source. Therefore, when a conventional chemical heating device cleans a substrate using a chemical solution such as IPA or DI, the yield may decrease due to an increase in particles.

The chemical heating device 220 according to this embodiment can heat Si by generating heat by photon absorption by irradiating an LED source, LD source, etc. to Si, as described with reference to FIGS. 3 to 7. there is. The chemical heating device 220 can use single crystal Si, which does not react with the chemical (e.g., IPA), as a heat source, and no latent heat is generated when the LED turns off, minimizing the risk of IPA vaporization and explosion. can do.

In addition, the chemical heating device 220 according to this embodiment may constitute a liquid contact portion with PFA, a cover member 320 (e.g., Quartz), a heating element 330 (e.g., Si), etc. Accordingly, O-rings, PTFE, etc. that provide particle sources from the liquid contact area can be removed.

In addition, the chemical heating device 220 can achieve the effect of maintaining light transmittance while removing particle sources by applying a chemical bath made of quartz material.

Figure 8 is a structural diagram of a first test setup for evaluating the performance of a chemical heating device constituting a substrate processing system according to an embodiment of the present invention.

In order to evaluate the feasibility of the chemical heating device 220 according to this embodiment through a chemical temperature increase test, a heating element (Si Wafer; 420) is placed on a glass substrate (Glass; 410), and a light source (LED) is installed on the upper part. The heating element 420 was heated using Array;

A Ø300 Glass Bath with a thickness (t) of 7 mm was used as the glass substrate 410, and a Ø200 Si Wafer was used as the heating element 420. Additionally, a Ø300 LED Array heater was used as the light source 430.

Other test conditions are as follows.

- Distance between heating element (420) and light source (430): 30mm

- Chemical solution used: 3L of water

- Heating time: 5 to 10 minutes

After the heating time had elapsed, the temperature was measured on the upper surface of the heating element 420. As a result of the test, the upper surface of the heating element 420 rose by about 50 degrees in 5 minutes, and rose to about 75 degrees after 9 minutes based on the surface. When evaluating using IPA as a chemical solution, a faster temperature increase of the heating element 420 can be expected.

Figure 9 is a structural diagram of a second test setup for evaluating the performance of a chemical heating device constituting a substrate processing system according to an embodiment of the present invention.

Si temperature increase using an LED heater was evaluated according to the test setup structure shown in FIG. 9. A plurality of LEDs 510 are placed as light sources on the body 121 (e.g., a chuck), and a quartz window 520 in the form of a cover is placed on top to cover the plurality of LEDs 510. ) was composed. And, the substrate W was configured to be positioned on top of the support pin 122 and the guide pin 123.

The surface temperature of the substrate W was measured using the thermal imaging camera 530 according to the test setup structure shown in FIG. 9, and as shown in FIG. 10, the rising time (Rising Time) 640 elapsed. Afterwards, it was confirmed that the temperature increased to a certain temperature in each area (1 Point (610), 2 Point (620), and 3 Point (630)) of the substrate (W). Figure 10 is a first test result showing the performance of a chemical heating device that constitutes a substrate processing system according to an embodiment of the present invention. In the above, 1 Point (610) refers to a point in the center zone of the substrate (W), and 2 Point (620) refers to a point in the middle zone of the substrate (W). 3 Point (630) means one point in the edge zone of the substrate (W).

Meanwhile, as shown in FIG. 11, it was confirmed from the above test that control was possible with a V-shaped recipe between Center and Edge. Figure 11 is a second test result showing the performance of the chemical heating device constituting the substrate processing system according to an embodiment of the present invention.

Although embodiments of the present invention have been described with reference to the above and the attached drawings, those skilled in the art will understand that the present invention can be implemented in other specific forms without changing its technical idea or essential features. You will understand that it exists. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive.

100: substrate processing system 110: cup
111: internal recovery bin 112: middle recovery bin
113: external recovery bin 120: support member
121: body 122: support pin
123: Guide pin 124: First support shaft
130: lifting unit 140: spray member
150: Controller 210: Chemical storage device
220: Chemical heating device 310: Light source
320: cover member 330: heating element
340: Euro 350: Side wall member
410: Glass substrate 510: LED
520: Quartz window 530: Thermal imaging camera

Claims (14)

A flow path provided as a path through which the chemical solution used to treat the substrate passes;
a heating element disposed to surround at least a portion of the flow path; and
It includes a light source that irradiates light to the heating element,
The heating element absorbs the light, does not react with the chemical solution, and generates heat using photon excitation to heat the chemical solution. According to claim 1,
It further includes a cover member including the flow passage therein,
The heating element is inserted into the interior of the cover member,
The light source is installed outside the cover member and spaced apart from the cover member,
The light source is a chemical heating device arranged to surround part or all of the cover member depending on the position of the heating element within the cover member. According to claim 2,
The cover member is a chemical heating device that transmits the light. According to claim 3,
The cover member is a chemical heating device manufactured including quartz. According to claim 1,
A chemical heating device in which the heating element is heated to a predetermined temperature before the chemical liquid passes through the flow path. According to claim 1,
A chemical heating device in which the heating element is made of single crystal silicon. According to claim 1,
The heating element is a chemical heating device manufactured by including at least one of silicon (Si), silicon carbide (SiC), silicon dioxide (SiO2), and aluminum nitride (AlN). According to claim 1,
The heating element is a chemical heating device having either a cross shape or a ring shape in the width direction. According to claim 1,
It further includes a temperature sensor connected to the outlet of the flow path to measure the temperature of the chemical solution,
A chemical heating device that checks whether the temperature of the heating element is raised based on the measured temperature of the chemical liquid. According to claim 1,
The light source is a chemical heating device including at least one of an LED source and an LD source. According to claim 1,
When the heating element is disposed to surround a portion of the flow path, the chemical heating device further includes a side wall member disposed to surround the remaining portion. According to claim 11,
A chemical heating device in which the side wall member is made of a material that does not react with the chemical liquid. A flow path provided as a path through which the chemical solution used to treat the substrate passes;
a heating element disposed to surround at least a portion of the flow path;
a light source that irradiates light to the heating element; and
It includes a cover member including the flow passage therein,
The heating element absorbs the light and does not react with the chemical solution, generates heat using photon excitation to heat the chemical solution, and partially surrounds the flow path. a chemical liquid storage device that stores a chemical liquid used to process a substrate;
a spray member that sprays the chemical solution onto the substrate to treat the substrate; and
It includes a chemical heating device installed on a path along which the chemical liquid moves from the chemical liquid storage device to the spray member,
The chemical heating device,
A flow path provided as a path through which the chemical solution passes;
a heating element disposed to surround at least a portion of the flow path; and
It includes a light source that irradiates light to the heating element,
The heating element absorbs the light, does not react with the chemical solution, and generates heat using photon excitation to heat the chemical solution.

Images