TW202334592A - Heat generating device and heat utilization system - Google Patents

Heat generating device and heat utilization system Download PDF

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TW202334592A
TW202334592A TW112103681A TW112103681A TW202334592A TW 202334592 A TW202334592 A TW 202334592A TW 112103681 A TW112103681 A TW 112103681A TW 112103681 A TW112103681 A TW 112103681A TW 202334592 A TW202334592 A TW 202334592A
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Taiwan
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heating
heating element
hydrogen
heat
groove
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TW112103681A
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Chinese (zh)
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下川英利
岩村康弘
伊藤岳彦
吉野英樹
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日商綠淨星球股份有限公司
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Publication of TW202334592A publication Critical patent/TW202334592A/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24VCOLLECTION, PRODUCTION OR USE OF HEAT NOT OTHERWISE PROVIDED FOR
    • F24V30/00Apparatus or devices using heat produced by exothermal chemical reactions other than combustion

Abstract

Provided are a heat generating device and a heat utilization system in which a decrease in heat generating efficiency is suppressed. The heat generating device is provided with: a wound heat generating body 31 which is composed of a winding of a sheet member composed of a multilayer film that generates heat by storage and release of hydrogen; and an affixing portion (upper affixing portion 32 and lower affixing portion 33) having a spiral groove (groove 322 and groove 332) that affixes an end of the wound heat generating body in the winding axis direction thereof. The heat utilization system is provided with a heat generating device, and a heat utilization device that utilizes a heat medium heated by the heat generating device as a heat source.

Description

發熱裝置及熱利用系統Heating device and heat utilization system

本發明關於一種發熱裝置及熱利用系統。The invention relates to a heating device and a heat utilization system.

已知吸存氫之合金具有於一定反應條件下重複吸存及釋放大量氫之特性,於該氫之吸存與釋放時伴隨較多之反應熱。提案有利用此種吸存氫之合金作為發熱部之發熱裝置之各種態樣(專利文獻1)。 [先前技術文獻] [專利文獻] It is known that hydrogen-absorbing alloys have the characteristic of repeatedly absorbing and releasing large amounts of hydrogen under certain reaction conditions, and the absorption and release of hydrogen are accompanied by greater reaction heat. Various forms of heating devices using such an alloy that absorbs hydrogen as a heating portion have been proposed (Patent Document 1). [Prior technical literature] [Patent Document]

[專利文獻1]國際公開第2020/122097號[Patent Document 1] International Publication No. 2020/122097

[發明所欲解決之問題][Problem to be solved by the invention]

於專利文獻1中,作為於發熱裝置中使用之發熱部之一態樣,揭示有將構成為板狀之發熱體以疏捲予以捲繞成之捲繞發熱體。於此種態樣中,因捲繞發熱體與框體之接觸、或相鄰之捲繞面彼此之接觸,引起接觸之部位熔合、有效發熱面積減少、發熱量下降,或熱逸散而有使發熱本身停止之虞。Patent Document 1 discloses a wound heating element in which a plate-shaped heating element is wound in a loose roll as an aspect of a heating portion used in a heating device. In this form, due to the contact between the winding heating element and the frame, or the contact between adjacent winding surfaces, the contact parts are fused, the effective heating area is reduced, the calorific value is reduced, or heat escapes. There is a risk of stopping the fever itself.

本發明係為了解決此種課題而完成者,目的在於提供一種抑制發熱效率下降之發熱裝置及熱利用系統。 [解決問題之技術手段] The present invention was completed in order to solve such a problem, and aims to provide a heating device and a heat utilization system that suppress a decrease in heating efficiency. [Technical means to solve problems]

本發明之一態樣之發熱裝置具備:捲繞發熱體,其係將由因氫之吸存與釋放而發熱之多層膜構成之板狀構件捲繞而構成;及固定部,其具備將捲繞發熱體之捲繞軸方向之端部固定之漩渦狀之槽。A heating device according to one aspect of the present invention is provided with: a wound heating element formed by winding a plate-like member composed of a multi-layer film that generates heat by absorbing and releasing hydrogen; and a fixing portion having the wound The spiral groove is fixed at the end of the heating element in the direction of the winding axis.

本發明之一態樣之熱利用系統具備:上述發熱裝置;與熱利用裝置,其利用由發熱裝置加熱之熱介質作為熱源。 [發明之效果] A heat utilization system according to one aspect of the present invention includes: the above-mentioned heating device; and a heat utilization device that uses a heat medium heated by the heating device as a heat source. [Effects of the invention]

根據本發明之一態樣之發熱裝置,捲繞發熱體之捲繞軸方向之端部收容於設置於固定部之槽。一般而言捲繞構成之板狀構件容易變形,但藉由將端部收容於槽,可防止捲繞發熱體與框體之接觸、或相鄰之捲繞面彼此之接觸,可抑制發熱效率下降。According to the heating device of one aspect of the present invention, the end of the winding axis direction of the winding heating element is accommodated in the groove provided in the fixing part. Generally speaking, plate-shaped members formed by winding are easily deformed, but by housing the ends in the grooves, it is possible to prevent the winding heating element from contacting the frame, or the adjacent winding surfaces from contacting each other, thereby suppressing the heating efficiency. decline.

以下,參照圖式對本發明之實施形態進行說明。Hereinafter, embodiments of the present invention will be described with reference to the drawings.

使用圖1,對用於本實施形態之發熱裝置之發熱體1之詳細構造進行說明。首先,使用圖1及圖2,對本申請案之各實施形態中共通之發熱體之構成及發熱機制進行說明。The detailed structure of the heating element 1 used in the heating device of this embodiment will be described using FIG. 1 . First, the structure and heating mechanism of the heating element common to each embodiment of the present application will be described using FIGS. 1 and 2 .

如圖1所示,發熱體1具有底座101與多層膜102。底座101由吸存氫之金屬、吸存氫之合金或質子導電體形成。作為吸存氫之金屬,例如可使用Ni、Pd、V、Nb、Ta、Ti等。作為吸存氫之合金,例如可使用、LaNi 5、CaCu 5、MgZn 2、ZrNi 2、ZrCr 2、TiFe、TiCo、Mg 2Ni、Mg 2Cu等。作為質子導電體,例如可使用BaCeO 3系(例如Ba(Ce 0.95Y 0.05)O 3-6)、SrCeO 3系(例如Sr(Ce 0.95Y 0.05)O 3-6)、CaZrO 3系(例如CaZr 0.95Y 0.05O 3-α)、SrZrO 3系(例如SrZr 0.9Y 0.1O 3-α)、β Al 2O 3、β Ga 2O 3等。 As shown in FIG. 1 , the heating element 1 has a base 101 and a multilayer film 102 . The base 101 is formed of a metal that absorbs hydrogen, an alloy that absorbs hydrogen, or a proton conductor. As a metal that absorbs hydrogen, for example, Ni, Pd, V, Nb, Ta, Ti, etc. can be used. As an alloy that absorbs hydrogen, for example, LaNi 5 , CaCu 5 , MgZn 2 , ZrNi 2 , ZrCr 2 , TiFe, TiCo, Mg 2 Ni, Mg 2 Cu, etc. can be used. As the proton conductor, for example, BaCeO 3 series (for example, Ba(Ce 0.95 Y 0.05 )O 3-6 ), SrCeO 3 series (for example, Sr(Ce 0.95 Y 0.05 )O 3-6 ), CaZrO 3 series (for example, CaZr 0.95 Y 0.05 O 3-α ), SrZrO 3 series (for example, SrZr 0.9 Y 0.1 O 3-α ), β Al 2 O 3 , β Ga 2 O 3 , etc.

多層膜102設置於底座101。於圖1中,雖僅於底座101之表面設置多層膜102,但多層膜102亦可設置於底座101之兩面。於本實施形態中,發熱構造體具有於底座101之兩面設置有多層膜102之發熱體1。The multilayer film 102 is provided on the base 101 . In FIG. 1 , although the multilayer film 102 is only provided on the surface of the base 101 , the multilayer film 102 can also be provided on both sides of the base 101 . In this embodiment, the heat-generating structure has the heat-generating element 1 provided with multi-layer films 102 on both sides of a base 101 .

多層膜102由以下形成:第1層103,其由吸存氫之金屬或吸存氫之合金形成;與第2層104,其由與第1層103不同之吸存氫之金屬、吸存氫之合金或陶瓷形成。於底座101、第1層103及第2層104之間,形成後述之異種物質界面105。於圖1中,多層膜102係於底座101之表面依序交替積層第1層103與第2層104而成。第1層103與第2層104分別為5層。另,第1層103與第2層104之各層之層數可適當變更。多層膜102亦可為於底座101之表面依序交替積層第2層104與第1層103而成者。多層膜102只要分別具有1層以上之第1層103與第2層104,形成1個以上之異種物質界面105即可。The multilayer film 102 is formed of the following: a first layer 103 made of a hydrogen-absorbing metal or a hydrogen-absorbing alloy; and a second layer 104 made of a hydrogen-absorbing metal different from the first layer 103. Hydrogen alloys or ceramics are formed. Between the base 101, the first layer 103, and the second layer 104, a dissimilar material interface 105 to be described later is formed. In FIG. 1 , the multi-layer film 102 is formed by laminating the first layer 103 and the second layer 104 sequentially and alternately on the surface of the base 101 . The first layer 103 and the second layer 104 are five layers respectively. In addition, the number of layers in each of the first layer 103 and the second layer 104 can be changed appropriately. The multilayer film 102 may also be formed by laminating the second layer 104 and the first layer 103 sequentially and alternately on the surface of the base 101 . The multilayer film 102 only needs to have at least one first layer 103 and a second layer 104 to form at least one dissimilar material interface 105 .

第1層103例如由Ni、Pd、Cu、Mn、Cr、Fe、Mg、Co、該等之合金中之任一種形成。形成第1層103之合金較佳為包含Ni、Pd、Cu、Mn、Cr、Fe、Mg、Co中2種以上之合金。作為形成第1層103之合金,亦可使用於Ni、Pd、Cu、Mn、Cr、Fe、Mg、Co中添加了添加元素之合金。The first layer 103 is formed of, for example, any one of Ni, Pd, Cu, Mn, Cr, Fe, Mg, Co, and alloys thereof. The alloy forming the first layer 103 is preferably an alloy containing two or more types of Ni, Pd, Cu, Mn, Cr, Fe, Mg, and Co. As an alloy forming the first layer 103, an alloy obtained by adding additive elements to Ni, Pd, Cu, Mn, Cr, Fe, Mg, or Co can also be used.

第2層104例如由Ni、Pd、Cu、Mn、Cr、Fe、Mg、Co、該等之合金、SiC中之任一種形成。形成第2層104之合金較佳為包含Ni、Pd、Cu、Mn、Cr、Fe、Mg、Co中2種以上之合金。作為形成第2層104之合金,亦可使用於Ni、Pd、Cu、Mn、Cr、Fe、Mg、Co中添加了添加元素之合金。The second layer 104 is formed of, for example, any one of Ni, Pd, Cu, Mn, Cr, Fe, Mg, Co, alloys thereof, and SiC. The alloy forming the second layer 104 is preferably an alloy containing two or more types of Ni, Pd, Cu, Mn, Cr, Fe, Mg, and Co. As an alloy for forming the second layer 104, an alloy obtained by adding additive elements to Ni, Pd, Cu, Mn, Cr, Fe, Mg, or Co can also be used.

作為第1層103與第2層104之組合,若將元素之種類表示為「第1層103-第2層104(第2層104-第1層103)」,則較佳為Pd-Ni、Ni-Cu、Ni-Cr、Ni-Fe、Ni-Mg、Ni-Co。於將第2層104設為陶瓷之情形時,「第1層103-第2層104」較佳為Ni-SiC。As the combination of the first layer 103 and the second layer 104, if the types of elements are expressed as "the first layer 103 - the second layer 104 (the second layer 104 - the first layer 103)", Pd-Ni is preferred. , Ni-Cu, Ni-Cr, Ni-Fe, Ni-Mg, Ni-Co. When the second layer 104 is made of ceramic, "the first layer 103 to the second layer 104" is preferably Ni-SiC.

如圖2所示,異種物質界面105使氫原子透過。圖2係顯示如下情況之概略圖:於使由面心立方構造之吸存氫之金屬形成之第1層103及第2層104吸存氫後,於加熱第1層103及第2層104時,第1層103中之金屬晶格中之氫原子,透過異種物質界面105移動至第2層104之金屬晶格中。As shown in FIG. 2 , the dissimilar material interface 105 allows hydrogen atoms to pass therethrough. FIG. 2 is a schematic diagram showing the following situation: after causing the first layer 103 and the second layer 104 formed of a hydrogen-absorbing metal with a face-centered cubic structure to absorb hydrogen, the first layer 103 and the second layer 104 are heated. At this time, the hydrogen atoms in the metal lattice in the first layer 103 move to the metal lattice in the second layer 104 through the dissimilar material interface 105.

第1層103之厚度與第2層104之厚度較佳為分別未達1000 nm。當第1層103與第2層104之各厚度為1000 nm以上時,氫難以透過多層膜102。又,藉由第1層103與第2層104之各厚度未達1000 nm,可維持不顯示塊體特性之奈米構造。第1層103與第2層104之各厚度更佳為未達500 nm。藉由第1層103與第2層104之各厚度未達500 nm,可維持完全不顯示塊體特性之奈米構造。The thickness of the first layer 103 and the thickness of the second layer 104 are preferably less than 1000 nm respectively. When the thickness of each of the first layer 103 and the second layer 104 is 1000 nm or more, it is difficult for hydrogen to penetrate the multilayer film 102 . In addition, since the thickness of each of the first layer 103 and the second layer 104 is less than 1000 nm, a nanostructure that does not exhibit bulk characteristics can be maintained. The thickness of each of the first layer 103 and the second layer 104 is preferably less than 500 nm. Since the thickness of each of the first layer 103 and the second layer 104 is less than 500 nm, a nanostructure that does not exhibit bulk characteristics at all can be maintained.

說明發熱體1之製造方法之一例。發熱體1可藉由如下製造:準備板狀之底座101,使用蒸鍍裝置,使成為第1層103或第2層104之吸存氫之金屬或吸存氫之合金成為氣相狀態,藉由凝聚或吸附,於底座101上交替成膜第1層103及第2層104。較佳為於真空狀態下連續成膜第1層103及第2層104。藉此,於第1層103及第2層104之間不形成自然氧化膜,而僅形成異種物質界面105。作為蒸鍍裝置,使用由物理方法蒸鍍吸存氫之金屬或吸存氫之合金之物理蒸鍍裝置。作為物理蒸鍍裝置,較佳為濺鍍裝置、真空蒸鍍裝置、CVD(Chemical Vapor Deposition:化學氣相沉積)裝置。又,亦可藉由電鍍法於底座101上析出吸存氫之金屬或吸存氫之合金,交替成膜第1層103及第2層104。An example of a method of manufacturing the heating element 1 will be described. The heating element 1 can be manufactured as follows: prepare a plate-shaped base 101, and use an evaporation device to bring the hydrogen-absorbing metal or hydrogen-absorbing alloy that becomes the first layer 103 or the second layer 104 into a gas phase state. The first layer 103 and the second layer 104 are alternately formed on the base 101 by aggregation or adsorption. It is preferable to continuously form the first layer 103 and the second layer 104 in a vacuum state. Thereby, no natural oxide film is formed between the first layer 103 and the second layer 104, but only the dissimilar material interface 105 is formed. As the vapor deposition device, a physical vapor deposition device that physically vaporizes a hydrogen-absorbing metal or a hydrogen-absorbing alloy is used. As the physical evaporation device, a sputtering device, a vacuum evaporation device, or a CVD (Chemical Vapor Deposition) device is preferred. Alternatively, a hydrogen-absorbing metal or a hydrogen-absorbing alloy may be deposited on the base 101 by an electroplating method to alternately form the first layer 103 and the second layer 104.

另,於圖1及圖2中,雖設置於底座101之多層膜102由第1層103及第2層104構成,但並不限定於此。多層膜102亦可進而具有第3層。第3層由與第1層103及第2層104不同之吸存氫之金屬、吸存氫之合金或陶瓷形成。另,於多層膜102中,只要包含1層以上之第3層即可。In addition, in FIGS. 1 and 2 , although the multilayer film 102 provided on the base 101 is composed of the first layer 103 and the second layer 104, it is not limited to this. The multilayer film 102 may further have a third layer. The third layer is formed of a hydrogen-absorbing metal, a hydrogen-absorbing alloy, or ceramic that is different from the first layer 103 and the second layer 104 . In addition, the multilayer film 102 only needs to include one or more third layers.

再者,設置於底座101之多層膜102除了第1層103、第2層104及第3層外,亦可進而具有第4層。第4層由與第1層103、第2層104及第3層不同之吸存氫之金屬、吸存氫之合金或陶瓷形成。另,於多層膜102中,與第3層同樣只要包含1層以上之第4層即可。Furthermore, the multilayer film 102 provided on the base 101 may further have a fourth layer in addition to the first layer 103, the second layer 104 and the third layer. The fourth layer is formed of a hydrogen-absorbing metal, a hydrogen-absorbing alloy, or ceramic that is different from the first layer 103, the second layer 104, and the third layer. In addition, the multilayer film 102 only needs to include one or more fourth layers in the same manner as the third layer.

(第1實施形態) 接著,使用圖3~圖7,說明第1實施形態之熱利用系統。於圖3顯示利用圖1、圖2所示之發熱體1之熱利用系統10。於熱利用系統10中,於發熱裝置11利用發熱體1。發熱裝置11構成為將具備發熱體1之發熱模組12收容於密閉容器13。藉由向密閉容器13供給氫系氣體,由底座101及多層膜102吸存氫。發熱體1即使停止向密閉容器13供給氫系氣體,亦維持由底座101及多層膜102吸存氫之狀態。 (First Embodiment) Next, the heat utilization system of the first embodiment will be described using FIGS. 3 to 7 . FIG. 3 shows a heat utilization system 10 using the heating element 1 shown in FIGS. 1 and 2 . In the heat utilization system 10 , the heating element 1 is used in the heating device 11 . The heating device 11 is configured to house the heating module 12 including the heating element 1 in a sealed container 13 . By supplying the hydrogen-based gas to the sealed container 13 , hydrogen is absorbed by the base 101 and the multilayer film 102 . Even if the heating element 1 stops supplying the hydrogen-based gas to the sealed container 13, the base 101 and the multilayer film 102 maintain a state in which hydrogen is absorbed.

於發熱體1中,當由設置於發熱模組12內之加熱器(未於圖3顯示)開始加熱時,吸存於底座101及多層膜102之氫被釋放,於多層膜102之內部一邊躍遷一邊進行量子擴散。已知氫較輕,一邊使某物質A與物質B之氫所占之部位(八面體或四面體)躍遷一邊進行量子擴散。發熱體1藉由於真空狀態下由加熱器進行加熱,而使氫因量子擴散而透過異種物質界面105,產生加熱器之加熱溫度以上之過量熱。發熱體1吸存氫系氣體所含之氫,藉由加熱器加熱,產生加熱器之加熱溫度以上之熱(以下稱為過量熱)。In the heating element 1, when heating is started by the heater (not shown in Figure 3) provided in the heating module 12, the hydrogen stored in the base 101 and the multi-layer film 102 is released, and on one side inside the multi-layer film 102 Quantum diffusion occurs during the transition. It is known that hydrogen is light, and quantum diffusion occurs while transitioning the sites (octahedron or tetrahedron) occupied by hydrogen in certain substances A and B. The heating element 1 is heated by a heater in a vacuum state, causing hydrogen to pass through the dissimilar material interface 105 due to quantum diffusion, thereby generating excess heat above the heating temperature of the heater. The heating element 1 absorbs hydrogen contained in the hydrogen-based gas and is heated by a heater to generate heat (hereinafter referred to as excess heat) that is higher than the heating temperature of the heater.

熱利用系統10將發熱裝置11作為熱源,使經由熱介質配管與發熱裝置11連接之熱利用裝置(未圖示)作動。如上所述,發熱模組12於收容於密閉容器13之狀態下,儲存於儲存容器14內。儲存容器14具備熱介質之流入口14a及流出口14b。當熱介質自熱利用裝置經由流入口14a流入存儲容器14時,於存儲容器14內,熱介質藉由發熱裝置11加熱。被加熱之熱介質自流出口14b再次供給至熱利用裝置。如此,熱利用裝置接收被加熱之熱介質,使用被加熱之熱介質使渦輪機等動作。藉由發熱模組12之過量熱,將熱介質設為例如50℃以上1500℃以下之範圍內之溫度。The heat utilization system 10 uses the heating device 11 as a heat source and operates a heat utilization device (not shown) connected to the heating device 11 via a heat medium pipe. As mentioned above, the heating module 12 is stored in the storage container 14 in a state of being accommodated in the airtight container 13 . The storage container 14 is provided with an inflow port 14a and an outflow port 14b for the heat medium. When the heat medium flows into the storage container 14 from the heat utilization device through the inlet 14a, the heat medium is heated by the heating device 11 in the storage container 14. The heated heat medium is supplied to the heat utilization device again from the outflow port 14b. In this way, the heat utilization device receives the heated heat medium, and uses the heated heat medium to operate the turbine or the like. Through the excess heat of the heating module 12, the heat medium is set to a temperature within a range of, for example, 50°C or more and 1500°C or less.

密閉容器13係中空之容器,於內部收容發熱模組12。密閉容器13例如由不銹鋼等形成。密閉容器13具有與後述之供給用配管15b連接之供給口13a、及與後述之排氣用配管16b連接之排氣口13b。密閉容器13例如由形成為筒狀之容器本體(未圖示)、設置於容器本體之上端之上蓋(未圖示)、及設置於容器本體之下端之下蓋(未圖示)形成。例如,供給口13a形成於下蓋,排氣口13b形成於上蓋。藉由容器本體、上蓋及下蓋之內表面,於密閉容器13之內部形成空間。經由供給用配管15b與供給口13a,向密閉容器13供給後述之氫系氣體。The sealed container 13 is a hollow container that houses the heating module 12 inside. The airtight container 13 is made of stainless steel, for example. The airtight container 13 has a supply port 13a connected to a supply piping 15b to be described later, and an exhaust port 13b connected to an exhaust piping 16b to be described later. The airtight container 13 is formed of, for example, a container body (not shown) formed in a cylindrical shape, an upper cover (not shown) provided at the upper end of the container body, and a lower cover (not shown) provided at the lower end of the container body. For example, the supply port 13a is formed in the lower cover, and the exhaust port 13b is formed in the upper cover. A space is formed inside the sealed container 13 by the inner surfaces of the container body, the upper cover, and the lower cover. The hydrogen-based gas described below is supplied to the sealed container 13 via the supply pipe 15b and the supply port 13a.

熱利用系統10進而具備氣體供給部15、氣體排氣部16、加熱器電源17及控制部18。控制部18藉由控制氣體供給部15、氣體排氣部16及加熱器電源17,驅動發熱裝置11。The heat utilization system 10 further includes a gas supply unit 15, a gas exhaust unit 16, a heater power supply 17, and a control unit 18. The control unit 18 drives the heating device 11 by controlling the gas supply unit 15 , the gas exhaust unit 16 and the heater power supply 17 .

氣體供給部15將氫系氣體供給至密閉容器13之內部。氣體供給部15具有氣瓶15a、供給用配管15b及供給用閥15c。氣瓶15a係以高壓貯存氫系氣體之容器。供給用配管15b將氣瓶15a與密閉容器13連接。供給用配管15b使貯存於氣瓶15a之氫系氣體向密閉容器13流通。供給用閥15c設置於供給用配管15b。供給用閥15c調整流通於供給用配管15b之氫系氣體之流量。供給用閥15c與控制部18電性連接。氫系氣體係包含氫之同位素之氣體。作為氫系氣體,可使用重氫氣體與輕氫氣體之至少一者。輕氫氣體係包含天然存在之輕氫與重氫之混合物,即輕氫之存在比為99.985%,重氫之存在比為0.015%之混合物。於之後之說明中,於不區分輕氫與重氫之情形時,記載為「氫」。The gas supply unit 15 supplies the hydrogen-based gas into the sealed container 13 . The gas supply part 15 has a gas cylinder 15a, a supply pipe 15b, and a supply valve 15c. The gas cylinder 15a is a container for storing hydrogen gas at high pressure. The supply pipe 15b connects the gas cylinder 15a and the sealed container 13. The supply pipe 15b circulates the hydrogen-based gas stored in the gas cylinder 15a to the sealed container 13. The supply valve 15c is provided in the supply pipe 15b. The supply valve 15c adjusts the flow rate of the hydrogen-based gas flowing through the supply pipe 15b. The supply valve 15c is electrically connected to the control unit 18. The hydrogen gas system contains gases that are isotopes of hydrogen. As the hydrogen-based gas, at least one of heavy hydrogen gas and light hydrogen gas can be used. The light hydrogen system contains a mixture of naturally occurring light hydrogen and heavy hydrogen, that is, a mixture in which the presence ratio of light hydrogen is 99.985% and the presence ratio of heavy hydrogen is 0.015%. In the following description, when there is no distinction between light hydrogen and heavy hydrogen, it is described as "hydrogen".

氣體排氣部16將密閉容器13之內部真空排氣。氣體供給部16具有真空泵16a、排氣用配管16b及排氣用閥16c。真空泵16a例如由渦輪分子泵與乾式真空泵形成。排氣用配管16b將真空泵16a與密閉容器13連接。排氣用配管16b使密閉容器13內部之氣體向真空泵16a流通。排氣用閥16c設置於排氣用配管16b。排氣用閥16c調整流通於排氣用配管16b之氣體之流量。真空泵16a與排氣用閥16c,係與控制部18電性連接。氣體排氣部16之排氣速度,例如可藉由調整渦輪分子泵之轉速而控制。The gas exhaust part 16 exhausts the vacuum inside the sealed container 13 . The gas supply unit 16 includes a vacuum pump 16a, an exhaust pipe 16b, and an exhaust valve 16c. The vacuum pump 16a is formed of, for example, a turbomolecular pump and a dry vacuum pump. The exhaust pipe 16b connects the vacuum pump 16a and the sealed container 13. The exhaust pipe 16b allows the gas inside the sealed container 13 to flow to the vacuum pump 16a. The exhaust valve 16c is provided in the exhaust pipe 16b. The exhaust valve 16c adjusts the flow rate of the gas flowing through the exhaust pipe 16b. The vacuum pump 16a and the exhaust valve 16c are electrically connected to the control unit 18. The exhaust speed of the gas exhaust part 16 can be controlled, for example, by adjusting the rotation speed of the turbomolecular pump.

加熱器電源17與發熱模組12內之加熱器(未於圖3顯示)電性連接,控制向加熱器之輸出電力而驅動加熱器。於該例中,如圖4所示,加熱器係形成為圓筒狀之電爐,且於加熱器之外周配置發熱體1。加熱器之加熱溫度例如較佳為300℃以上,更佳為500℃以上,進而更佳為600℃以上。The heater power supply 17 is electrically connected to the heater (not shown in Figure 3) in the heating module 12, and controls the output power to the heater to drive the heater. In this example, as shown in FIG. 4 , the heater is formed as a cylindrical electric furnace, and the heating element 1 is arranged on the outer periphery of the heater. The heating temperature of the heater is, for example, preferably 300°C or higher, more preferably 500°C or higher, and still more preferably 600°C or higher.

於發熱體1設置有溫度感測器(未圖示)。溫度感測器亦可設置於發熱體1之複數個部位。溫度感測器與控制部18電性連接,將與檢測出之溫度對應之信號輸出至控制部18。The heating element 1 is provided with a temperature sensor (not shown). Temperature sensors can also be installed at multiple locations of the heating element 1 . The temperature sensor is electrically connected to the control unit 18 and outputs a signal corresponding to the detected temperature to the control unit 18 .

控制部18控制熱利用系統10之各部之動作。控制部18例如主要具備運算裝置(Central Processing Unit:中央處理單元)、讀取專用記憶體(Read Only Memory:唯讀記憶體)或隨機存取記憶體(Random Access Memory:隨機存取記憶體)等記憶部。於運算裝置中,例如使用儲存於記憶部之程式或數據等來執行各種運算處理。The control unit 18 controls the operations of each unit of the heat utilization system 10 . The control unit 18 mainly includes, for example, a computing device (Central Processing Unit: central processing unit), a read-only memory (Read Only Memory: read-only memory), or a random access memory (Random Access Memory: random access memory). Waiting for the memory department. In the computing device, for example, programs or data stored in the memory are used to perform various computing processes.

控制部18與供給用閥15c、真空泵16a、排氣用閥16c、加熱器電源17、以及安裝於發熱體1及加熱器之溫度感測器電性連接。控制部18例如基於由溫度感測器檢測出之發熱體1之溫度,來調整加熱器電源17之輸出電力、氫系氣體之供給量、密閉容器13之壓力等,藉此進行過量熱輸出之控制。The control unit 18 is electrically connected to the supply valve 15c, the vacuum pump 16a, the exhaust valve 16c, the heater power supply 17, and the temperature sensor installed on the heating element 1 and the heater. For example, the control unit 18 adjusts the output power of the heater power supply 17, the supply amount of the hydrogen-based gas, the pressure of the sealed container 13, etc. based on the temperature of the heating element 1 detected by the temperature sensor, thereby performing excess heat output. control.

發熱裝置11藉由進行向密閉容器13之內部供給氫系氣體,使氫系氣體所包含之氫吸存於發熱體1。又,發熱裝置11藉由進行密閉容器13內部之真空排氣與發熱體1之加熱,釋放被吸存於發熱體1之氫。如此,發熱裝置11藉由於發熱體1中進行氫之吸存與釋放,產生過量熱。即,使用發熱裝置11之發熱方法具有:氫吸存步驟,其係藉由向密閉容器13之內部供給氫系氣體,使氫系氣體所含之氫吸存於發熱體1;及氫釋放步驟,其係藉由進行密閉容器13內部之真空排氣與發熱體1之加熱,使吸存於發熱體1之氫釋放。實際上氫吸存步驟與氫釋放步驟係重複進行。另,於氫吸存步驟中,進行向密閉容器13之內部供給氫系氣體之前,亦可藉由進行發熱體1之加熱,去除附著於發熱體1之水等。於氫釋放步驟中,例如於停止向密閉容器13之內部供給氫系氣體後,進行真空排氣與加熱。The heating device 11 supplies the hydrogen-based gas into the inside of the sealed container 13 so that the hydrogen contained in the hydrogen-based gas is occluded in the heating element 1 . In addition, the heating device 11 evacuates the inside of the sealed container 13 and heats the heating element 1 to release the hydrogen stored in the heating element 1 . In this way, the heating device 11 generates excess heat by absorbing and releasing hydrogen in the heating element 1 . That is, the heating method using the heating device 11 includes: a hydrogen absorbing step in which hydrogen contained in the hydrogen-based gas is supplied to the inside of the sealed container 13 so that the hydrogen contained in the hydrogen-based gas is absorbed and stored in the heating element 1; and a hydrogen releasing step. , which is to release the hydrogen stored in the heating element 1 by vacuum exhausting the interior of the sealed container 13 and heating the heating element 1 . In fact, the hydrogen storage step and the hydrogen release step are repeated. In addition, in the hydrogen storage step, before supplying the hydrogen-based gas into the inside of the sealed container 13, the heating element 1 can be heated to remove water etc. attached to the heating element 1. In the hydrogen release step, for example, after stopping the supply of hydrogen-based gas into the inside of the sealed container 13, vacuum exhaust and heating are performed.

圖4係發熱模組12之分解立體圖。圖5係發熱模組12之一部分的發熱構造體21之分解立體圖。於以下,雖使用圖中之上下左右方向進行說明,但發熱模組12之配置並非限定於下述說明所使用之方向者,可配置於任一方向。Figure 4 is an exploded perspective view of the heating module 12. FIG. 5 is an exploded perspective view of the heating structure 21 which is a part of the heating module 12 . In the following, although the up, down, left and right directions in the figure are used for description, the arrangement of the heating module 12 is not limited to the direction used in the following description, and can be arranged in any direction.

發熱模組12具備發熱構造體21、加熱器22、支柱23、上蓋24及下蓋25。發熱構造體21係具備發熱體1之中空構造,於中空部插入圓柱狀之加熱器22。發熱構造體21之端面由上蓋24及下蓋25封閉,上蓋24與下蓋25由支柱23連結。The heating module 12 includes a heating structure 21, a heater 22, a support 23, an upper cover 24, and a lower cover 25. The heating structure 21 has a hollow structure within the heating element 1, and a cylindrical heater 22 is inserted into the hollow portion. The end surface of the heating structure 21 is closed by an upper cover 24 and a lower cover 25 , and the upper cover 24 and the lower cover 25 are connected by pillars 23 .

構成發熱模組12之支柱23、上蓋24及下蓋25由多孔質體構成,藉此,於收容發熱模組12之密閉容器13內,於發熱模組12(支柱23、上蓋24及下蓋25)外部存在之氫系氣體可到達配置於發熱模組12內之發熱構造體21。另,支柱23、上蓋24及下蓋25亦可代替由多孔質體構成而具有氫系氣體可通過之孔,或除了由多孔質構成以外,又具有氫系氣體可通過之孔。如此,構成發熱模組12。The support 23, the upper cover 24 and the lower cover 25 that constitute the heating module 12 are made of a porous body. Thereby, in the airtight container 13 accommodating the heating module 12, the heat generating module 12 (the support 23, the upper cover 24 and the lower cover) 25) The hydrogen gas existing outside can reach the heating structure 21 arranged in the heating module 12 . In addition, the support 23, the upper cover 24, and the lower cover 25 may be made of a porous body and have pores through which the hydrogen-based gas can pass, or they may have pores through which the hydrogen-based gas can pass in addition to being made of porous materials. In this way, the heating module 12 is constructed.

如圖5所示,發熱構造體21具備捲繞發熱體31、上固定部32、下固定部33及導引件34。捲繞發熱體31係由將板狀構件地發熱體1捲繞而構成。捲繞發熱體31於經配置於其捲繞軸方向之中途附近之導引件34予以保持之狀態下,捲繞軸方向(上下方向)之端部藉由上固定部32與下固定部33固定。As shown in FIG. 5 , the heat-generating structure 21 includes a wound heating element 31 , an upper fixing part 32 , a lower fixing part 33 , and a guide 34 . The wound heating element 31 is formed by winding the heating element 1 which is a plate-shaped member. The winding heating element 31 is held by the guide 34 arranged near the middle of the winding axis direction, and the ends in the winding axis direction (up and down direction) are connected by the upper fixing part 32 and the lower fixing part 33 fixed.

詳細而言,捲繞發熱體31係將板狀之發熱體1捲繞(於該圖中為捲繞3周)而構成。上固定部32係於中心具備開口之圓盤狀之構件,於下側之端面具備渦漩狀之槽322。下固定部33係於中心具備開口之圓盤狀之構件,於上側之端面具備渦漩狀之槽332。上固定部32及下固定部33(固定部)成對構成。導引件34係於中心具備開口之圓盤狀之構件,具備於軸向貫通之渦漩狀之貫通槽342。Specifically, the wound heating element 31 is formed by winding the plate-shaped heating element 1 (three times in the figure). The upper fixing part 32 is a disc-shaped member with an opening in the center, and a spiral groove 322 on the lower end surface. The lower fixing part 33 is a disc-shaped member having an opening in the center, and has a spiral groove 332 on the upper end surface. The upper fixing part 32 and the lower fixing part 33 (fixing part) are constituted in pairs. The guide 34 is a disc-shaped member having an opening in the center, and is provided with a spiral through groove 342 penetrating in the axial direction.

圖6係上固定部32具備槽322之側之俯視圖。圖6所示之上固定部32之槽322之槽寬略大於捲繞發熱體31之厚度。構成為沿渦旋方向之槽長長於捲繞發熱體31之捲繞長度,於最外周朝向上固定部32之外周延伸,貫通外周面。FIG. 6 is a top view of the side of the upper fixing part 32 having the groove 322. As shown in FIG. 6 , the groove width of the groove 322 of the upper fixing part 32 is slightly larger than the thickness of the wound heating element 31 . The groove along the spiral direction is longer than the winding length of the winding heating element 31, extends from the outermost circumference toward the outer circumference of the upper fixed portion 32, and penetrates the outer circumferential surface.

下固定部33之槽332及導引件34之貫通槽342之形狀,具有與圖6所示之上固定部32之槽322同樣之渦漩構造。為了此種構成,於組裝了發熱構造體21之狀態下,於上固定部32之槽322收容捲繞發熱體31之上側端部,於下固定部33之槽332收容捲繞發熱體31之下側端部。且,捲繞發熱體31之軸向之中途部分藉由導引件34之貫通槽342固定。因槽322、332及貫通槽342之槽長較捲繞發熱體31之捲繞長度長,故可抑制因捲繞發熱體31加熱時之熱膨脹而產生伸長部分之歪曲。又,貫通槽342之槽,與上固定部32之槽322、下固定部33之槽332之大小(槽寬及槽長)相等。另,於本揭示,「相等」、「相同」不僅意指「完全相等」、「完全相同」,亦意指包含「大致相等」、「大致相同」,例如包含數%左右之誤差。藉由使槽322、332及貫通槽342之槽寬及槽長大致相同,可防止因捲繞發熱體31之撓曲等引起之與加熱器22之接觸、或捲繞發熱體31之相鄰捲繞面彼此之接觸。The shape of the groove 332 of the lower fixed part 33 and the through groove 342 of the guide 34 has the same spiral structure as the groove 322 of the upper fixed part 32 shown in FIG. 6 . For this structure, when the heat-generating structure 21 is assembled, the upper end of the wound heating element 31 is accommodated in the groove 322 of the upper fixing part 32, and the upper end of the wound heating element 31 is accommodated in the groove 332 of the lower fixing part 33. Lower end. Furthermore, the midway portion in the axial direction of the wound heating element 31 is fixed by the through groove 342 of the guide 34 . Since the groove lengths of the grooves 322, 332 and the through groove 342 are longer than the winding length of the wound heating element 31, distortion of the elongated portion due to thermal expansion of the wound heating element 31 when heated can be suppressed. In addition, the size (groove width and groove length) of the through groove 342 is equal to the groove 322 of the upper fixing part 32 and the groove 332 of the lower fixing part 33 . In addition, in this disclosure, "equal" and "identical" not only mean "completely equal" and "identical", but also include "approximately equal" and "approximately the same", for example, including an error of about a few %. By making the groove widths and groove lengths of the grooves 322 and 332 and the through groove 342 approximately the same, it is possible to prevent the coiled heating element 31 from coming into contact with the heater 22 due to deflection or the like, or from being adjacent to the coiled heating element 31 The winding surfaces are in contact with each other.

上固定部32、下固定部33及導引件34由非金屬材料、例如陶瓷形成。藉此,於發熱體1發熱時,可抑制於槽322、332及貫通槽342之熔合。The upper fixing part 32, the lower fixing part 33 and the guide 34 are formed of non-metallic materials, such as ceramics. Thereby, when the heating element 1 generates heat, fusion in the grooves 322 and 332 and the through groove 342 can be suppressed.

若再次參照圖4,於上固定部32之上表面設置有2個固定孔321,與設置於上蓋24之下表面之固定銷241嵌合。再者,於下固定部33之下表面設置有2個固定孔(未於圖4顯示),與設置於下蓋25之上表面之固定銷251嵌合。Referring again to FIG. 4 , two fixing holes 321 are provided on the upper surface of the upper fixing part 32 to engage with the fixing pins 241 provided on the lower surface of the upper cover 24 . Furthermore, two fixing holes (not shown in FIG. 4 ) are provided on the lower surface of the lower fixing part 33 to engage with the fixing pins 251 provided on the upper surface of the lower cover 25 .

支柱23係於周向之對向位置成對構成之於軸向延伸之板狀構件,具有具備彎曲之剖面之支柱本體231。支柱本體231之彎曲之內表面於組裝時,以沿發熱構造體21之上固定部32、下固定部33及導引件34之外周之方式接觸。再者,於支柱本體231,於軸向之中途之相同位置,具備向內周側突出之突出部232。於突出部232設置有沿軸向朝向上方延伸之固定銷233。The pillars 23 are plate-shaped members extending in the axial direction formed in pairs at opposite positions in the circumferential direction, and have a pillar body 231 with a curved cross-section. The curved inner surface of the pillar body 231 contacts along the outer periphery of the upper fixing part 32 , the lower fixing part 33 and the guide 34 of the heating structure 21 during assembly. Furthermore, the support body 231 is provided with a protruding portion 232 protruding toward the inner circumferential side at the same position in the middle of the axial direction. The protruding portion 232 is provided with a fixing pin 233 extending upward along the axial direction.

支柱23之固定銷233與設置於導引件34之下表面之固定孔嵌合。再者,支柱23構成為兩端部與於上蓋24之側面之一部分設置之槽242、及於下蓋25之側面之一部分設置之槽252嵌合。槽242、252構成為於上蓋24、下蓋25中,外周之一部分於軸向之一部分被切削。支柱23於軸向上較發熱構造體21於軸向更長,相對於發熱構造體21之端面突出之端部與槽242、252嵌合。The fixing pin 233 of the pillar 23 is fitted with the fixing hole provided on the lower surface of the guide member 34 . Furthermore, the support 23 is configured such that both ends thereof are fitted into the groove 242 provided in part of the side surface of the upper cover 24 and the groove 252 provided in part of the side surface of the lower cover 25 . The grooves 242 and 252 are formed in the upper cover 24 and the lower cover 25 so that part of the outer circumference is cut in part in the axial direction. The pillar 23 is longer in the axial direction than the heating structure 21 , and the end protruding relative to the end surface of the heating structure 21 is fitted into the grooves 242 and 252 .

如此,於發熱構造體21之上側端面由上蓋24封閉時,上固定部32之固定孔321與上蓋24之固定銷241嵌合。於發熱構造體21之下側端面由下蓋25封閉時,下固定部33之固定孔與下蓋25之固定銷251嵌合。為了此種構成,發熱構造體21對於支柱23、上蓋24及下蓋25固定。再者,藉由支柱23之固定銷233固定導引件34之位置,抑制導引件34之旋轉。In this way, when the upper end surface of the heating structure 21 is closed by the upper cover 24 , the fixing hole 321 of the upper fixing part 32 is fitted with the fixing pin 241 of the upper cover 24 . When the lower end surface of the heating structure 21 is closed by the lower cover 25 , the fixing hole of the lower fixing part 33 is fitted with the fixing pin 251 of the lower cover 25 . For such a structure, the heat-generating structure 21 is fixed to the support|pillar 23, the upper cover 24, and the lower cover 25. Furthermore, the position of the guide 34 is fixed by the fixing pin 233 of the support 23 to inhibit the rotation of the guide 34.

另,雖支柱23於該例中設置2個,但亦可設置3個以上。又,雖導引件34於該例中設置1個,但亦可設置2個以上。於設置複數個導引件34之情形時,支柱23亦可具備與導引件34之數量對應之突出部232及固定銷233。In addition, although two pillars 23 are provided in this example, three or more pillars may be provided. Furthermore, although one guide 34 is provided in this example, two or more guides 34 may be provided. When a plurality of guide members 34 are provided, the pillar 23 may also be provided with protrusions 232 and fixing pins 233 corresponding to the number of guide members 34 .

此處,雖說明了於上蓋24及下蓋25設置與支柱23嵌合之槽242、252之例,但並不限定於此。亦可不於上蓋24及下蓋25設置槽242、252,使軸向之長度於支柱23與發熱構造體21中大致相同。於該情形時,於發熱構造體21及支柱23之上部端面由上蓋24封閉時,上固定部32之固定孔321與上蓋24之固定銷241嵌合,於發熱構造體21及支柱23之下部端面由下蓋25封閉時,下固定部33之固定孔與下蓋25之固定銷251嵌合。且,支柱23藉由壓接或接著等固定於上蓋24及下蓋25。如此,發熱構造體21對於支柱23、上蓋24及下蓋25固定。Here, although the example in which the upper cover 24 and the lower cover 25 are provided with the grooves 242 and 252 for fitting the pillar 23 has been described, the invention is not limited to this. Alternatively, the grooves 242 and 252 may not be provided in the upper cover 24 and the lower cover 25 so that the axial lengths of the support 23 and the heating structure 21 are approximately the same. In this case, when the upper end surfaces of the heating structure 21 and the pillar 23 are closed by the upper cover 24, the fixing hole 321 of the upper fixing part 32 is fitted with the fixing pin 241 of the upper cover 24, and the lower part of the heating structure 21 and the pillar 23 is When the end surface is closed by the lower cover 25, the fixing hole of the lower fixing portion 33 is fitted with the fixing pin 251 of the lower cover 25. Furthermore, the pillar 23 is fixed to the upper cover 24 and the lower cover 25 by crimping or adhesion. In this way, the heat-generating structure 21 is fixed to the pillar 23, the upper cover 24, and the lower cover 25.

成對之固定部(上固定部32及下固定部33)使用設置於捲繞發熱體31之外側之支柱23固定。另,支柱23只要設置有突出部232及固定銷233,則不限定於具有彎曲之剖面之板狀構件,亦可為角柱狀或圓柱狀之構件。藉由使用此種支柱23,因於發熱構造體21中捲繞發熱體31之至少一部分露出,故可防止發熱模組12發熱時向外部之熱傳導效率下降。The pair of fixing parts (the upper fixing part 32 and the lower fixing part 33 ) are fixed using the pillars 23 provided outside the wound heating element 31 . In addition, as long as the support 23 is provided with the protruding portion 232 and the fixing pin 233, it is not limited to a plate-shaped member with a curved cross section, and may also be a rectangular prism-shaped or cylindrical member. By using such pillars 23, at least part of the wound heating element 31 is exposed in the heating structure 21, thereby preventing the heat conduction efficiency to the outside from being reduced when the heating module 12 generates heat.

圖7係發熱模組12之包含軸之平面之剖視圖。於該圖中,顯示通過上蓋24之固定銷241、下蓋25之固定銷251及支柱23之固定銷233之剖面。FIG. 7 is a cross-sectional view of the plane including the axis of the heating module 12 . In this figure, a cross section through the fixing pin 241 of the upper cover 24 , the fixing pin 251 of the lower cover 25 and the fixing pin 233 of the pillar 23 is shown.

於圓盤狀構件的上蓋24中,設置於上表面側之小徑之開口243、與設置於下表面側之大徑之開口244相互連通地設置。加熱器22收容於大徑之開口244之內部,於由2個開口243、244形成之階部卡止。如上所述,上蓋24於下表面側之外周部具備與支柱23嵌合之槽242。又,於上蓋24之下表面設置有固定銷241,固定銷241與設置於上固定部32之固定孔321嵌合。In the upper cover 24 of the disc-shaped member, a small-diameter opening 243 provided on the upper surface side and a large-diameter opening 244 provided on the lower surface side are provided in communication with each other. The heater 22 is accommodated inside the large-diameter opening 244 and is locked at the step formed by the two openings 243 and 244 . As described above, the upper cover 24 is provided with the groove 242 in the outer peripheral portion on the lower surface side that is fitted into the support column 23 . In addition, a fixing pin 241 is provided on the lower surface of the upper cover 24 , and the fixing pin 241 fits into the fixing hole 321 provided in the upper fixing part 32 .

同樣,於圓盤狀構件的下蓋25中,設置於下表面側之小徑之開口253、與設置於上表面側之大徑之開口254相互連通地設置。加熱器22收容於大徑之開口254之內部,於由2個開口253、254形成之階部卡止。如上所述,下蓋25於上表面側之外周部具備與支柱23嵌合之槽252。又,於下蓋25之上表面設置有固定銷251,固定銷251與設置於下固定部33之固定孔331嵌合。加熱器22經由通過上蓋24之開口243、244、及下蓋25之開口253、254之至少一者之配線,與加熱器電源17(圖3所示)連接。Similarly, in the lower cover 25 of the disc-shaped member, a small-diameter opening 253 provided on the lower surface side and a large-diameter opening 254 provided on the upper surface side are provided in communication with each other. The heater 22 is housed inside the large-diameter opening 254 and is locked at the step formed by the two openings 253 and 254 . As described above, the lower cover 25 is provided with the groove 252 in the outer peripheral portion on the upper surface side that is fitted into the support column 23 . Furthermore, a fixing pin 251 is provided on the upper surface of the lower cover 25 , and the fixing pin 251 fits into the fixing hole 331 provided in the lower fixing part 33 . The heater 22 is connected to the heater power supply 17 (shown in FIG. 3 ) via wiring passing through at least one of the openings 243 and 244 of the upper cover 24 and the openings 253 and 254 of the lower cover 25 .

於圖中,放大顯示支柱23之突出部232之部位。設置於突出部232之固定銷233,嵌合於設置於導引件34之下表面之固定孔341。In the figure, the protruding portion 232 of the pillar 23 is shown in an enlarged manner. The fixing pin 233 provided on the protruding portion 232 is fitted into the fixing hole 341 provided on the lower surface of the guide 34 .

捲繞發熱體31於捲繞軸方向上,上側之一端部由上固定部32之槽322固定,下側之另一端部由下固定部33之槽332固定。即,成對之固定部(上固定部32及下固定部33)所具備之槽(槽322及槽332),將捲繞發熱體31之軸向之兩端部固定。再者,捲繞發熱體31係於捲繞軸方向之中途,藉由導引件34之貫通槽342固定。In the direction of the winding axis, the upper end of the winding heating element 31 is fixed by the groove 322 of the upper fixing part 32 , and the other lower end is fixed by the groove 332 of the lower fixing part 33 . That is, the grooves (the grooves 322 and the grooves 332 ) provided in the pair of fixing parts (the upper fixing part 32 and the lower fixing part 33 ) fix both ends of the winding heating element 31 in the axial direction. Furthermore, the winding heating element 31 is fixed in the middle of the winding axis direction by the through groove 342 of the guide 34 .

因此種構成,故於組裝了發熱構造體21之狀態下,捲繞發熱體31係藉由上固定部32之槽322及下固定部33之槽332固定,且藉由導引件34之貫通槽342固定。藉此,可防止捲繞發熱體31與加熱器22之接觸、或因捲繞發熱體31之捲繞而相鄰對向之發熱體1彼此接觸。Due to this structure, when the heat-generating structure 21 is assembled, the wound heating element 31 is fixed through the groove 322 of the upper fixing part 32 and the groove 332 of the lower fixing part 33 and is penetrated by the guide 34 Groove 342 is fixed. Thereby, it is possible to prevent the wound heating element 31 from contacting the heater 22 or the adjacent and facing heating elements 1 from contacting each other due to the winding of the wound heating element 31 .

於上述實施形態中,雖上固定部32之槽322、下固定部33之槽332、及導引件34之貫通槽342,如圖6所示,係構成為於槽之長度方向上,於最外周朝向上固定部32之外周延伸,貫通外周面,但並不限定於此。如圖8所示,亦可不貫通外周面而構成為槽間隔恆定之渦漩狀。In the above embodiment, the groove 322 of the upper fixing part 32, the groove 332 of the lower fixing part 33, and the through groove 342 of the guide 34 are configured so as to extend in the length direction of the grooves as shown in FIG. 6 . The outermost periphery extends toward the outer periphery of the upper fixing portion 32 and penetrates the outer peripheral surface, but is not limited thereto. As shown in FIG. 8 , the grooves may be formed into a spiral shape with a constant groove interval without penetrating the outer peripheral surface.

(第2實施形態) 接著,使用圖9~圖11說明第2實施形態之熱利用系統。圖9係第2實施形態之熱利用系統所具有之發熱模組之分解立體圖,相當於第1實施形態之圖4。圖10係圖9所示之發熱模組所具備之發熱構造體之分解立體圖,相當於第1實施形態之圖5。圖11係圖9所示之發熱模組之剖視圖,相當於第1實施形態之圖7。 (Second Embodiment) Next, the heat utilization system of the second embodiment will be described using FIGS. 9 to 11 . FIG. 9 is an exploded perspective view of the heating module included in the heat utilization system of the second embodiment, which is equivalent to FIG. 4 of the first embodiment. Fig. 10 is an exploded perspective view of the heating structure included in the heating module shown in Fig. 9, which is equivalent to Fig. 5 of the first embodiment. Fig. 11 is a cross-sectional view of the heating module shown in Fig. 9, which is equivalent to Fig. 7 of the first embodiment.

如圖9所示,於第2實施形態中,與第1實施形態相比,支柱23被削除,於上蓋24及下蓋25中與支柱23之兩端部嵌合之槽242、252被削除。上蓋24具有大徑之圓盤構件、及設置於其上表面之小徑之圓盤構件。下蓋25具有大徑之圓盤構件、及設置於其下表面之小徑之圓盤構件。As shown in FIG. 9 , in the second embodiment, compared with the first embodiment, the pillars 23 are removed, and the grooves 242 and 252 in the upper cover 24 and the lower cover 25 that fit with both ends of the pillars 23 are removed. . The upper cover 24 has a large-diameter disc member and a small-diameter disc member provided on its upper surface. The lower cover 25 has a large-diameter disc member and a small-diameter disc member provided on its lower surface.

再者,如圖10所示,發熱構造體21之上固定部32,於下表面之渦漩狀之槽322之內側具備環狀槽41。同樣,導引件34於上表面之渦漩狀之貫通槽342之內側具備環狀槽42。另,環狀槽42於軸向上不貫通導引件34。且,於上固定部32與導引件34之間,設置有例如由熱傳導率優異之陶瓷等構成之柱狀構件(於該例中為中空圓柱狀)的上支持框體43。上支持框體43之上端部與設置於上固定部32之下表面之環狀槽41嵌合,下端部與設置於導引件34之上表面之環狀槽42嵌合。Furthermore, as shown in FIG. 10 , the upper fixing portion 32 of the heating structure 21 is provided with an annular groove 41 inside the spiral groove 322 on the lower surface. Similarly, the guide 34 is provided with an annular groove 42 inside the spiral through groove 342 on the upper surface. In addition, the annular groove 42 does not penetrate the guide 34 in the axial direction. Furthermore, an upper support frame 43 is provided between the upper fixing part 32 and the guide 34 and is a columnar member (in this example, a hollow cylindrical shape) made of, for example, ceramics having excellent thermal conductivity. The upper end of the upper support frame 43 is fitted with the annular groove 41 provided on the lower surface of the upper fixing part 32 , and the lower end is fitted with the annular groove 42 provided on the upper surface of the guide 34 .

同樣,發熱構造體21之下固定部33,於上表面之渦漩狀之槽332之內側具備環狀槽44。同樣,導引件34於下表面之貫通槽342之內側具備環狀槽(未於圖10顯示)。另,設置於導引件34之下表面之環狀槽,係與設置於上表面之環狀槽42同樣,於軸向上不貫通導引件34。且,於下固定部33與導引件34之間,設置有例如由熱傳導率優異之陶瓷等構成之柱狀構件(於該例中為中空圓柱狀)的下支持框體45。下支持框體45之下端部與下固定部33之環狀槽44嵌合,上端部與設置於導引件34之下表面之環狀槽嵌合。Similarly, the lower fixed portion 33 of the heating structure 21 is provided with an annular groove 44 inside the spiral groove 332 on the upper surface. Similarly, the guide 34 is provided with an annular groove (not shown in FIG. 10 ) inside the through groove 342 on the lower surface. In addition, the annular groove provided on the lower surface of the guide 34 is the same as the annular groove 42 provided on the upper surface and does not penetrate the guide 34 in the axial direction. Furthermore, between the lower fixing part 33 and the guide 34, a lower support frame 45 is provided, which is a columnar member (in this example, a hollow cylindrical shape) made of, for example, ceramics having excellent thermal conductivity. The lower end of the lower support frame 45 is fitted into the annular groove 44 of the lower fixing part 33 , and the upper end is fitted into the annular groove provided on the lower surface of the guide 34 .

再者參照圖11,顯示設置於引導件34之下表面、且未於圖10顯示之環狀槽46。如上所述,上支持框體43係上端部與上固定部32之環狀槽41嵌合,下端部與設置於導引件34之上表面之環狀槽42嵌合。下支持框體45之下端部與下固定部33之環狀槽44嵌合,上端部與設置於導引件34之下表面之環狀槽46嵌合。成對之固定部(上固定部32及下固定部33)使用設置於捲繞發熱體31之內側之柱狀構件(上支持框體43及下支持框體45)固定。Referring again to FIG. 11 , an annular groove 46 provided on the lower surface of the guide 34 and not shown in FIG. 10 is shown. As mentioned above, the upper end of the upper support frame 43 is fitted into the annular groove 41 of the upper fixing part 32 , and the lower end is fitted into the annular groove 42 provided on the upper surface of the guide 34 . The lower end of the lower support frame 45 is fitted into the annular groove 44 of the lower fixing part 33 , and the upper end is fitted into the annular groove 46 provided on the lower surface of the guide 34 . The paired fixing parts (upper fixing part 32 and lower fixing part 33 ) are fixed using columnar members (upper support frame 43 and lower support frame 45 ) provided inside the wound heating element 31 .

再者,如上所述,上蓋24具有大徑之圓盤構件與設置於該圓盤構件之上表面之小徑之圓盤構件。下蓋25具有大徑之圓盤構件與設置於該圓盤構件之下表面之小徑之圓盤構件。且,如圖11所示,上蓋24於貫通2個圓盤構件之軸向具備等徑之開口47。下蓋25於貫通2個圓盤構件之軸向具備等徑之開口48。Furthermore, as mentioned above, the upper cover 24 has a large-diameter disc member and a small-diameter disc member provided on the upper surface of the disc member. The lower cover 25 has a large-diameter disc member and a small-diameter disc member provided on the lower surface of the disc member. Furthermore, as shown in FIG. 11 , the upper cover 24 is provided with openings 47 of equal diameters in the axial direction penetrating the two disk members. The lower cover 25 is provided with openings 48 of equal diameters in the axial direction penetrating the two disc members.

開口47、48之內徑與加熱器22之外徑大致相等,加熱器22插入至上蓋24之開口47及下蓋25之開口48。上蓋24之上側之小徑之圓盤構件,於其側面具有到達開口47之貫通孔49。貫通孔49由側面側之大徑部與中心側之小徑部連通而構成,於兩者之間構成階部。螺栓50之頭部以由階部卡止之狀態收容於大徑部。再者,於貫通孔49之小徑部,於內表面設置螺合槽,螺栓50之螺合部與該螺合槽螺合。下蓋25之下側之小徑之圓盤構件,具有與上蓋24之上側之小徑之圓盤構件同樣之構成。即,於下蓋25之小徑之圓盤構件具有到達開口48之貫通孔51,於貫通孔51之大徑部收容螺栓52之頭部,於設置於貫通孔51之小徑部之螺合槽中與螺栓52之螺合部螺合。藉由該等螺栓50、52,可將加熱器22對於上蓋24及下蓋25固定。The inner diameter of the openings 47 and 48 is substantially equal to the outer diameter of the heater 22 , and the heater 22 is inserted into the opening 47 of the upper cover 24 and the opening 48 of the lower cover 25 . The small diameter disk member on the upper side of the upper cover 24 has a through hole 49 reaching the opening 47 on its side. The through hole 49 is configured such that a large diameter portion on the side side communicates with a small diameter portion on the center side, and a step portion is formed between the two. The head of the bolt 50 is accommodated in the large diameter portion in a state of being locked by the step portion. Furthermore, a threaded groove is provided on the inner surface of the small diameter portion of the through hole 49, and the threaded portion of the bolt 50 is threadedly engaged with the threaded groove. The small-diameter disc member on the lower side of the lower cover 25 has the same structure as the small-diameter disc member on the upper side of the upper cover 24 . That is, the small-diameter disc member of the lower cover 25 has a through-hole 51 reaching the opening 48. The large-diameter part of the through-hole 51 accommodates the head of the bolt 52, and the small-diameter part of the through-hole 51 is threaded. The groove is threaded with the threaded portion of the bolt 52 . The heater 22 can be fixed to the upper cover 24 and the lower cover 25 through the bolts 50 and 52 .

如此,於第2實施形態中,藉由將上支持框體43及下支持框體45設置於捲繞發熱體31與加熱器22之間,可防止捲繞發熱體31與加熱器22之接觸。藉由上支持框體43及下支持框體45,可固定上固定部32、下固定部33及導引件34之位置。藉由熱傳導率優異之上支持框體43及下支持框體45,可使加熱器22之熱均一化並向捲繞發熱體31傳遞。再者,因於發熱構造體21中捲繞發熱體31露出,故與第1實施形態同樣,可防止發熱模組12發熱時向外部之熱傳導效率下降。In this way, in the second embodiment, by disposing the upper support frame 43 and the lower support frame 45 between the wound heating element 31 and the heater 22, contact between the wound heating element 31 and the heater 22 can be prevented. . By the upper support frame 43 and the lower support frame 45, the positions of the upper fixing part 32, the lower fixing part 33 and the guide 34 can be fixed. By the upper support frame 43 and the lower support frame 45 having excellent thermal conductivity, the heat from the heater 22 can be uniformized and transferred to the wound heating element 31 . Furthermore, since the winding heating element 31 is exposed in the heating structure 21, it is possible to prevent the heat conduction efficiency to the outside from being reduced when the heating module 12 generates heat, as in the first embodiment.

只要不脫離本發明之廣義之精神與範圍,本發明可為各種實施形態及變化。又,上述實施形態係用於說明本發明者,並非限定本發明之範圍者。即,本發明之範圍並非以實施形態,而以申請專利範圍顯示。且,於申請專利範圍內及與其同等發明意義之範圍內實施之各種變化,均視為本發明之範圍內。The present invention can be implemented in various embodiments and modifications without departing from the broad spirit and scope of the present invention. In addition, the above-mentioned embodiment is used to illustrate the present invention and does not limit the scope of the present invention. That is, the scope of the present invention is shown not by the embodiments but by the patent claims. Furthermore, any changes made within the scope of the patent application and within the scope of equivalent inventive significance shall be deemed to be within the scope of the present invention.

1:發熱體 10:熱利用系統 11:發熱裝置 12:發熱模組 13:密閉容器 13a:供給口 13b:排氣口 14:存儲容器 14a:流入口 14b:流出口 15:氣體供給部 15a:氣瓶 15b:供給用配管 15c:供給用閥 16:氣體排氣部 16a:真空泵 16b:排氣用配管 16c:排氣用閥 17:加熱器電源 18:控制部 21:發熱構造體 22:加熱器 23:支柱 24:上蓋 25:下蓋 31:捲繞發熱體 32:上固定部 33:下固定部 34:導引件 41,42,44,46:環狀槽 43:上支持殼體 45:下支持殼體 47,48:開口 49:貫通孔 50:螺栓 51:貫通孔 52:螺栓 101:底座 102:多層膜 103:第1層 104:第2層 105:異種物質界面 231:支柱本體 232:突出部 233:固定銷 241:固定銷 242:槽 243:開口 244:開口 251:固定銷 252:槽 253:開口 254:開口 321:固定孔 322,332:槽 331:固定孔 341:固定孔 342:貫通槽 1: Heating element 10:Heat utilization system 11: Heating device 12: Heating module 13: Airtight container 13a: Supply port 13b:Exhaust port 14:Storage container 14a: Inlet 14b: Outlet 15:Gas supply department 15a:gas cylinder 15b: Supply piping 15c: Supply valve 16:Gas exhaust part 16a: Vacuum pump 16b: Exhaust piping 16c: Exhaust valve 17: Heater power supply 18:Control Department 21: Heating structure 22:Heater 23:Pillar 24: Upper cover 25:Lower cover 31: Coiled heating element 32: Upper fixed part 33: Lower fixed part 34: Guide parts 41,42,44,46: Annular groove 43: Upper support shell 45: Lower support shell 47,48:Open your mouth 49:Through hole 50:bolt 51:Through hole 52:bolt 101:Base 102:Multilayer film 103:Level 1 104:Layer 2 105: Foreign material interface 231: Pillar body 232:Protrusion 233: Fixed pin 241: Fixed pin 242:Slot 243:Open your mouth 244:Open your mouth 251: Fixed pin 252:Slot 253:Open your mouth 254:Open your mouth 321:Fixing hole 322,332: slot 331:Fixing hole 341:Fixing hole 342:Through groove

圖1係顯示於各實施形態共通之具有第1層與第2層之發熱體之構造之剖視圖。 圖2係用於說明過量熱產生之說明圖。 圖3係第1實施形態之熱利用系統之概略圖。 圖4係圖3所示之熱利用系統所具有之發熱模組之分解立體圖。 圖5係圖4所示之發熱模組所具備之發熱構造體之分解立體圖。 圖6係圖5所示之發熱構造體之固定部之俯視圖。 圖7係圖4所示之發熱模組之剖視圖。 圖8係其他例之發熱構造體之固定部之俯視圖。 圖9係第2實施形態之熱利用系統所具有之發熱模組之分解立體圖。 圖10係圖9所示之發熱模組所具備之發熱構造體之分解立體圖。 圖11係圖9所示之發熱模組之剖視圖。 FIG. 1 is a cross-sectional view showing the structure of a heating element having a first layer and a second layer common to each embodiment. Fig. 2 is an explanatory diagram for explaining the generation of excess heat. Fig. 3 is a schematic diagram of the heat utilization system of the first embodiment. FIG. 4 is an exploded perspective view of the heating module of the heat utilization system shown in FIG. 3 . FIG. 5 is an exploded perspective view of the heating structure included in the heating module shown in FIG. 4 . FIG. 6 is a top view of the fixing part of the heating structure shown in FIG. 5 . FIG. 7 is a cross-sectional view of the heating module shown in FIG. 4 . Fig. 8 is a top view of the fixing portion of the heating structure according to another example. FIG. 9 is an exploded perspective view of the heating module included in the heat utilization system of the second embodiment. FIG. 10 is an exploded perspective view of the heating structure included in the heating module shown in FIG. 9 . FIG. 11 is a cross-sectional view of the heating module shown in FIG. 9 .

21:發熱構造體 21: Heating structure

31:捲繞發熱體 31: Coiled heating element

32:上固定部 32: Upper fixed part

33:下固定部 33: Lower fixed part

34:導引件 34: Guide parts

322,332:槽 322,332: slot

342:貫通槽 342:Through groove

Claims (11)

一種發熱裝置,其包含: 捲繞發熱體,其係將由因氫之吸存與釋放而發熱之多層膜構成之板狀構件捲繞而構成;及 固定部,其具備將上述捲繞發熱體之捲繞軸方向之端部固定之漩渦狀之槽。 A heating device including: A wound heating element, which is formed by winding a plate-like member composed of a multi-layer film that generates heat due to the absorption and release of hydrogen; and The fixing part has a spiral groove for fixing the end of the winding axis direction of the winding heating element. 如請求項1之發熱裝置,其中上述捲繞發熱體係以至少一部分露出之方式配置。The heating device of claim 1, wherein the above-mentioned coiled heating system is configured in such a manner that at least part of it is exposed. 如請求項1之發熱裝置,其中上述固定部係成對構成,成對之上述固定部所具備之上述槽係固定上述捲繞發熱體之軸向之兩端部。The heating device according to claim 1, wherein the fixing parts are formed in pairs, and the grooves provided in the pairs of fixing parts are for fixing both axial ends of the wound heating element. 如請求項3之發熱裝置,其中成對之上述固定部係使用設置於上述捲繞發熱體之外側之支柱而固定。The heating device according to claim 3, wherein the pair of fixing parts are fixed using pillars provided on the outside of the wound heating element. 如請求項3之發熱裝置,其中成對之上述固定部戲使用設置於上述捲繞發熱體之內側之柱狀構件而固定。The heating device according to claim 3, wherein the pair of said fixing parts are fixed using a columnar member provided on the inner side of the said wound heating element. 如請求項1之發熱裝置,其中上述槽之槽長,長於上述捲繞發熱體之捲繞長度。The heating device of claim 1, wherein the groove length of the groove is longer than the winding length of the wound heating element. 如請求項1之發熱裝置,其進而包含導引件,該導引件配置於上述捲繞發熱體之軸向之中途,包含保持上述捲繞發熱體之漩渦狀之貫通槽。The heating device according to claim 1 further includes a guide disposed in the middle of the axial direction of the wound heating element and including a spiral-shaped through groove that holds the wound heating element. 如請求項7之發熱裝置,其中上述貫通槽之槽與上述固定部之槽大小相等。The heating device of claim 7, wherein the size of the through-slot is equal to the size of the slot of the fixing part. 如請求項1至8中任一項之發熱裝置,其中上述固定部由非金屬材料構成。The heating device according to any one of claims 1 to 8, wherein the fixing part is made of non-metallic material. 如請求項9之發熱裝置,其中上述固定部由陶瓷形成。The heating device of claim 9, wherein the fixing portion is made of ceramic. 一種熱利用系統,其包含:如請求項1至10中任一項所記載之發熱裝置;及熱利用裝置,其利用由上述發熱裝置加熱之熱介質來作為熱源。A heat utilization system including: the heating device according to any one of claims 1 to 10; and a heat utilization device that uses a heat medium heated by the heating device as a heat source.
TW112103681A 2022-02-04 2023-02-02 Heat generating device and heat utilization system TW202334592A (en)

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US2209577A (en) * 1936-06-25 1940-07-30 Benjamin B Schneider Centrifugal fluid-treating apparatus
JPS5682384A (en) * 1979-12-11 1981-07-06 Toshiba Corp Countercurrent type heat exchanger
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