TW202334512A - System for a chemical and/or electrolytic surface treatment of a substrate - Google Patents
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- 239000000758 substrate Substances 0.000 title claims abstract description 70
- 238000004381 surface treatment Methods 0.000 title claims abstract description 21
- 239000000126 substance Substances 0.000 title claims abstract description 16
- 238000009826 distribution Methods 0.000 claims abstract description 68
- 238000006243 chemical reaction Methods 0.000 claims abstract description 19
- 230000001681 protective effect Effects 0.000 claims description 20
- 239000007921 spray Substances 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 7
- 238000000926 separation method Methods 0.000 claims description 5
- 229910021645 metal ion Inorganic materials 0.000 claims description 4
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 230000001568 sexual effect Effects 0.000 claims description 2
- 239000012528 membrane Substances 0.000 abstract description 10
- 239000007789 gas Substances 0.000 description 34
- 239000003792 electrolyte Substances 0.000 description 13
- 238000002347 injection Methods 0.000 description 10
- 239000007924 injection Substances 0.000 description 10
- 238000007747 plating Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 239000000203 mixture Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 229910007637 SnAg Inorganic materials 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000008188 pellet Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000007086 side reaction Methods 0.000 description 2
- 239000002000 Electrolyte additive Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000002894 chemical waste Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/04—Removal of gases or vapours ; Gas or pressure control
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Chemically Coating (AREA)
- Treatment Of Fiber Materials (AREA)
- Weting (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
Abstract
Description
本揭露係關於一種用於一基板之一化學及/或電解表面處理之系統。The present disclosure relates to a system for chemical and/or electrolytic surface treatment of a substrate.
當執行一基板之化學及/或電解表面處理(尤其係微電子行業中之電鍍程序)時,避免化學電解液混合物因副反應消耗而不是可用於沈積程序本身變得愈加重要,此等化學電解液混合物可係複雜且昂貴的並且經常含有對氧化敏感的添加劑。導致損失昂貴的電解液及其他問題(例如,增加化學廢料)的此等副反應經常歸因於由電解液添加劑與陽極接觸或(很少考慮地)電解液與空氣(其含有氧氣)接觸導致之氧化程序。When performing chemical and/or electrolytic surface treatments of a substrate (especially electroplating processes in the microelectronics industry), it becomes increasingly important to avoid chemical electrolyte mixtures that are consumed by side reactions rather than being available for the deposition process itself. These chemical electrolytes Fluid mixtures can be complex and expensive and often contain additives that are sensitive to oxidation. These side reactions, which result in expensive electrolyte losses and other problems (e.g., increased chemical waste), are often attributed to contact of electrolyte additives with the anode or (less often considered) contact of the electrolyte with air (which contains oxygen) The oxidation process.
對於其中應用了昂貴的化學電解液混合物之某些特定的鍍覆程序,例如,金(Au)、SnAg、Cu及/或其他金屬鍍覆,該問題係尤其嚴重的,該等化學電解液混合物含有對氧化敏感的添加劑分子。此等添加劑當與陽極或甚至與空氣(其含有氧氣)接觸時,可氧化且失效。This problem is particularly acute for certain plating processes, such as gold (Au), SnAg, Cu and/or other metal plating, in which expensive chemical electrolyte mixtures are used. Contains additive molecules that are sensitive to oxidation. These additives can oxidize and become ineffective when in contact with the anode or even air (which contains oxygen).
同時,按照所需標準在微電子行業中執行表面處理(比如電鍍程序)意味著儘可能快地在基板之整個表面區域上方達成極高均勻性沈積型態。At the same time, performing surface treatments in the microelectronics industry, such as electroplating processes, to the required standards means achieving extremely uniform deposition patterns over the entire surface area of the substrate as quickly as possible.
在許多情況下,複雜且昂貴的設備必須設計且可靠地構建、操作及維護成保證充分的鍍覆電解液分配並保證將電流分配至表面上來達成高處理速度,特別係在要同時達成高均勻性的情況下。舉例而言,為達成此目的,已知的系統通常構建成尤其確保自鍍覆室以良好旋轉對稱方式排放電解液。In many cases, complex and expensive equipment must be designed and reliably constructed, operated and maintained to ensure adequate distribution of the plating electrolyte and distribution of current to the surface to achieve high process speeds, especially if high uniformity is to be achieved at the same time. In sexual situations. For example, to achieve this purpose, known systems are generally designed to ensure, inter alia, a good rotationally symmetrical discharge of the electrolyte from the coating chamber.
然而,設置在電鍍室中用於提高所要鍍覆均勻性及鍍覆速度之硬體特徵,例如一HSP (高速鍍覆)系統、對稱的電解液排放系統或雙電解液(陽極液及陰極液)鍍覆系統,可導致電鍍室具有格外大的外尺寸。However, hardware features installed in the plating chamber to improve the desired plating uniformity and plating speed, such as an HSP (high speed plating) system, symmetrical electrolyte drainage system or dual electrolyte (anolyte and catholyte) ) plating system, which can result in the plating chamber having exceptionally large external dimensions.
因此,在甚至高速度下之沈積均勻性及/或對電解液混合物之保護方面,可需要提供一種用於一基板之一化學及/或電解表面處理之經改良系統,及/或一種經構形以相比於先前技術之系統允許一更緊湊大小及/或經簡化構形的系統。Therefore, in terms of deposition uniformity even at high speeds and/or protection of the electrolyte mixture, it may be desirable to provide an improved system for chemical and/or electrolytic surface treatment of a substrate, and/or a structural The shape allows for a more compact size and/or simplified configuration of the system compared to prior art systems.
此等問題中之一或多者藉由本揭露之獨立技術方案之標的物來解決,其中其他實施例併入附屬技術方案中。 One or more of these problems are solved by the subject matter of the independent technical solution of the present disclosure, with other embodiments being incorporated into the dependent technical solution.
用於一基板之一化學及/或電解表面處理之系統包括一陰極液室、一陽極液室、一分配主體及一陰極液出口。該分配主體係配置在該陰極液室中且該陰極液室係藉助一隔膜與該陽極液室分隔開,其中該隔膜係相對於該分配主體傾斜。該隔膜可係傾斜的以便合併及移除在陽極處產生之氣泡。藉由陽極液流動可支持氣泡之移除。該分配主體包括:噴射開口,其用於將一陰極液分配至欲處理之該基板上;及排放開口,其用於將該陰極液自該分配主體與該基板之間的一反應空間排放出。該陰極液出口係配置在該陰極液室處一偏心位置中。A system for chemical and/or electrolytic surface treatment of a substrate includes a catholyte chamber, an anolyte chamber, a distribution body and a catholyte outlet. The distribution main system is arranged in the catholyte chamber and the catholyte chamber is separated from the anolyte chamber by a diaphragm, wherein the diaphragm is inclined relative to the distribution main body. The separator can be tilted to incorporate and remove air bubbles generated at the anode. The removal of air bubbles is supported by anolyte flow. The distribution body includes: a spray opening for distributing a catholyte onto the substrate to be processed; and a discharge opening for discharging the catholyte from a reaction space between the distribution body and the substrate. . The catholyte outlet is arranged in an eccentric position of the catholyte chamber.
此構形之優點係:由於所主張之特徵之協同效應,系統允許在甚至高速度下確保沈積均勻性,且保護電解液混合物(亦即,陽極液及陰極液),並且簡化系統及/或減小系統之大小。偏心構形允許對系統進行簡化。理想之均勻性尤其可與其他特徵一起提供。此外,使用隔膜允許對陽極液區與陰極液區進行適當分隔。尤其係在與其他特徵組合時,隔膜可允許在均勻性及速度方面進行最佳處理,尤其係當與噴射開口及排放開口一起使用時。因此,對所主張之特徵之一組合可協同地提供在系統之大小/複雜性以及均勻及高速度處理方面同時理想之一構形。The advantages of this configuration are that due to the synergistic effect of the claimed features the system allows ensuring deposition uniformity even at high speeds and protecting the electrolyte mixture (i.e. anolyte and catholyte) and simplifying the system and/or Reduce system size. The eccentric configuration allows for simplification of the system. Desirable uniformity can be provided especially in conjunction with other features. Furthermore, the use of separators allows for proper separation of the anolyte and catholyte zones. Especially when combined with other features, diaphragms can allow optimal processing in terms of uniformity and speed, especially when used with injection openings and discharge openings. Thus, a combination of the claimed features may synergistically provide a configuration that is simultaneously desirable in terms of system size/complexity and uniform and high-speed processing.
一基板之化學及/或電解表面處理可包括一電鍍程序,特定而言,對金(Au)、SnAg、Cu及/或其他金屬之電鍍。Chemical and/or electrolytic surface treatment of a substrate may include an electroplating process, specifically electroplating of gold (Au), SnAg, Cu and/or other metals.
基板可包括一導體板、一半導體基板、一薄膜基板、一基本上板形狀之金屬或金屬化工件或者諸如此類。基板可係固持在一基板固持件中。The substrate may include a conductor plate, a semiconductor substrate, a thin film substrate, a substantially plate-shaped metal or metallized workpiece, or the like. The substrate may be held in a substrate holder.
在一基板之電解表面處理之情況下,基板與陽極經由一電流供應單元連接來分別地主要充當陰極及陽極。In the case of electrolytic surface treatment of a substrate, the substrate and the anode are connected via a current supply unit to primarily function as the cathode and the anode, respectively.
陽極液及陰極液係提供一電解液之功能之液體。Anolyte and catholyte are liquids that provide the function of an electrolyte.
術語「隔膜」可理解為一選擇性屏障,其允許某些部分(小分子、離子、其他小粒子等等)通過,但阻止或至少減少其他部分通過。The term "membrane" can be understood as a selective barrier that allows the passage of certain parts (small molecules, ions, other small particles, etc.) but prevents or at least reduces the passage of other parts.
當系統經配置用於既定用途時,隔膜可相對於一水平面傾斜。當系統經配置用於既定用途時,分配主體可水平地配置。此係一選用實施例。在此揭露中,此意味著噴射開口及排放開口係以一水平配置的陣列配置。此係一選用實施例。當系統經配置用於既定用途時,尤其係當分配主體係水平地配置時,噴射開口及/或排放開口可經配置以垂直地延伸。當系統經配置用於既定用途時,尤其係在一水平配置中,系統可經構形以將一基板固持為平行於分配主體。When the system is configured for its intended use, the membrane can be tilted relative to a horizontal plane. When the system is configured for the intended use, the allocation body may be configured horizontally. This is an optional embodiment. In this disclosure, this means that the injection openings and the discharge openings are arranged in a horizontally arranged array. This is an optional embodiment. When the system is configured for the intended use, in particular when the main distribution system is configured horizontally, the injection openings and/or the discharge openings may be configured to extend vertically. When the system is configured for its intended use, particularly in a horizontal configuration, the system may be configured to hold a substrate parallel to the dispensing body.
當系統經配置用於既定用途時,偏心位置可係指分配主體之一中心,尤其係垂直地延伸之一中心線。偏心位置可係指分配主體之一中心,尤其係沿垂直於分配主體之一縱向方向之一方向延伸之一中心線。當分配主體具有一圓柱形形狀時,偏心所指之中心可係圓柱軸線。When the system is configured for the intended use, the eccentric position may refer to a center of the distribution body, especially a centerline extending vertically. The eccentric position may refer to a center of the distribution body, in particular a center line extending in a direction perpendicular to the longitudinal direction of the distribution body. When the distribution body has a cylindrical shape, the center of the eccentricity may be the cylindrical axis.
隔膜可係一可滲透的離子選擇性陽極隔膜。其可經構形以允許在系統之陽極與陰極區之間進行離子連通,同時防止來自陽極區之特定的粒子或氣體氣泡(例如在陽極處產生之粒子)進入陰極液並到達基板,及/或防止來自陰極區之特定的粒子(例如陰極液中存在之粒子)進入陽極區並到達陽極。儘管如此,隔膜可允許傳輸電流並供應金屬離子來助益表面處理之效率。然而,當與其他所主張之特徵組合時,可協同地改良使用一隔膜之表面處理。The separator may be a permeable ion-selective anode separator. It can be configured to allow ionic communication between the anode and cathode regions of the system while preventing certain particles or gas bubbles from the anode region (such as those generated at the anode) from entering the catholyte and reaching the substrate, and/ Or prevent specific particles from the cathode region (such as particles present in the catholyte) from entering the anode region and reaching the anode. Nonetheless, the separator allows the transmission of electrical current and supplies metal ions to aid the efficiency of surface treatment. However, when combined with other claimed features, the surface treatment using a separator can be synergistically improved.
偏心配置提供一更簡單/複雜性更小並且實現自陰極液室更穩健且更可靠的陰極液射出、尤其係實現更低製作成本的系統。另外,非對稱的電解液射出使得電鍍室具有一超緊湊構造。可允許電鍍室之超緊湊構造的另一因素係分配主體在電阻率方面之一特殊構形,此可基於對通過分配主體之電通路進行幾何最佳化。除非與其他所主張之特徵進行組合,否則使用此一系統可導致非均勻性。The eccentric configuration provides a simpler/less complex system and allows for more robust and reliable catholyte injection from the catholyte chamber, and in particular allows for lower manufacturing costs. In addition, the asymmetric electrolyte injection allows the plating chamber to have an ultra-compact structure. Another factor that allows an ultra-compact construction of the electroplating chamber is a special configuration of the distribution body in terms of resistivity, which can be based on a geometric optimization of the electrical path through the distribution body. Use of this system may result in non-uniformity unless combined with other claimed features.
噴射開口允許透過噴射開口將陰極液朝向基板表面尤其均勻地分配,尤其係當與排放孔及視情況一排放環組合時。The spray opening allows a particularly uniform distribution of the catholyte towards the substrate surface through the spray opening, especially when combined with a drain hole and optionally a drain ring.
此外,排放孔及視情況排放環,尤其係與傾斜的隔膜一起,允許高效地使用上文提及之偏心陰極液出口。Furthermore, the drain hole and optionally the drain ring, especially together with the inclined diaphragm, allow efficient use of the above-mentioned eccentric catholyte outlet.
因此,可見所主張之特徵雖然各自具有其自身的某些優點,但可協同地提供一進一步改良。It can thus be seen that the claimed features, although each having certain advantages of its own, may synergistically provide a further improvement.
該陰極液室可具有一橫向側,該橫向側基本上垂直於該分配主體之一縱向方向延伸,且該陰極液出口可配置在該陰極液室之該橫向側中。The catholyte chamber may have a lateral side extending substantially perpendicularly to a longitudinal direction of the distribution body, and the catholyte outlet may be disposed in the lateral side of the catholyte chamber.
舉例而言,該橫向側可係陰極液室之一側壁。For example, the lateral side may be a side wall of the catholyte chamber.
分配主體之縱向方向可係配置噴射開口及/或排放開口所沿之方向中之一者。當分配主體係水平地配置時,縱向方向可水平地延伸。The longitudinal direction of the distribution body may be one of the directions along which the injection openings and/or the discharge openings are arranged. When the distribution main system is configured horizontally, the longitudinal direction may extend horizontally.
當系統經配置用於其既定用途時,陰極液出口可係配置在分配主體下面,尤其係在陰極液室之一/該橫向側中。換言之,陰極液出口可配置在分配主體與隔膜之間,尤其係在陰極液室之一/該橫向側中。更具體而言,當系統經配置用於其既定用途時,陰極液出口可在分配主體下面之一位置處與陰極液室相通,或者換言之,陰極液出口可在分配主體與隔膜之間的一位置處與陰極液室相通。When the system is configured for its intended use, the catholyte outlet may be arranged below the distribution body, in particular in one of the catholyte chambers/the lateral sides. In other words, the catholyte outlet can be arranged between the distribution body and the membrane, in particular in one of the catholyte chambers/the lateral side. More specifically, when the system is configured for its intended use, the catholyte outlet may communicate with the catholyte chamber at a location underneath the distribution body, or in other words, the catholyte outlet may be at a location between the distribution body and the separator. The location is connected with the catholyte chamber.
陰極液室之一橫截面可具有一楔形形狀。A cross-section of the catholyte chamber may have a wedge shape.
此意味著陰極液室之高度自陰極液室之一側至陰極液室之相對的側增加。楔形形狀可至少部分地由隔膜之傾斜配置引起。This means that the height of the catholyte chamber increases from one side of the catholyte chamber to the opposite side of the catholyte chamber. The wedge shape may result, at least in part, from the tilted configuration of the diaphragm.
當經配置用於既定用途時,陰極液室可具有一楔形形狀且係以使得陰極液室之下端自一水平位置傾斜出之一方式來配置。When configured for the intended use, the catholyte chamber may have a wedge shape and be configured in such a way that the lower end of the catholyte chamber tilts out from a horizontal position.
此一構形之優點可係:可容易地在楔形之一端處(例如,在陰極液室之用於排放陰極液之最低點處)收集陰極液。An advantage of this configuration may be that the catholyte can be easily collected at one end of the wedge (for example, at the lowest point of the catholyte chamber for draining the catholyte).
因此,可僅使用一個出口進行有效排放。Therefore, only one outlet can be used for efficient discharge.
該楔形形狀之陰極液室之一橫截面可具有一較長橫向側及一較短橫向側,且該陰極液出口可係配置在該陰極液室之該較長橫向側中。A cross-section of the wedge-shaped catholyte chamber may have a longer lateral side and a shorter lateral side, and the catholyte outlet may be disposed in the longer lateral side of the catholyte chamber.
特定而言,當系統經配置用於既定用途時,陰極液出口可係配置在較長橫向側之下端處。In particular, the catholyte outlet may be disposed at the lower end of the longer lateral side when the system is configured for the intended use.
作為一實例,當系統經配置用於既定用途時,陰極液室之上端可水平地配置。因此,陰極液室之較長橫向側相比於較短橫向側將向下延伸更遠。As an example, when the system is configured for its intended use, the upper end of the catholyte chamber may be configured horizontally. Therefore, the longer lateral sides of the catholyte chamber will extend further downward than the shorter lateral sides.
此一構形之優點可係:可容易地在陰極液室之一個點處(例如,在陰極液室之用於排放陰極液之最低點處)收集陰極液。An advantage of this configuration may be that the catholyte can be easily collected at one point in the catholyte chamber (for example, at the lowest point of the catholyte chamber for draining the catholyte).
因此,可僅使用一個出口進行有效排放。Therefore, only one outlet can be used for efficient discharge.
該陰極液出口可係配置在該陰極液室處一非旋轉對稱的位置中。The catholyte outlet may be arranged in a non-rotationally symmetrical position at the catholyte chamber.
該位置與之非旋轉對稱的軸線可係與基板表面正交且延伸穿過基板之中心之軸線。此意味著無需對陰極液出口進行構形及配置使得陰極液可均勻地圍繞基板自該室射出。舉例而言,陰極液出口無需係環形的。而是,該出口可經構形及配置使得其僅配置在用於陰極液之室之一側處。此簡化整個系統之構形。The axis of non-rotational symmetry with which the position is located may be an axis orthogonal to the surface of the substrate and extending through the center of the substrate. This means that the catholyte outlet does not need to be configured and arranged so that the catholyte can exit the chamber evenly around the substrate. For example, the catholyte outlet need not be annular. Rather, the outlet may be configured and arranged so that it is located only on one side of the chamber for the catholyte. This simplifies the configuration of the entire system.
在已知的系統中,此一配置本不會允許所需的均勻性。然而,由於陰極液透過分配主體之排放孔藉助噴射及排放流入,因此本揭露之系統仍允許均勻沈積。In known systems, this configuration would not have allowed the required uniformity. However, the system of the present disclosure still allows for uniform deposition because the catholyte flows in through the drain holes of the distribution body by spraying and draining.
該陰極液室可包括一排放環,該排放環係圍繞該分配主體配置以將該陰極液自該分配主體與該基板之間的該反應空間排放出。The catholyte chamber may include a discharge ring disposed around the distribution body to discharge the catholyte from the reaction space between the distribution body and the substrate.
此意味著,陰極液之一部分流將透過排放環排放出。因此,作為一實例,排放環可用作一溢流口,以維持反應空間中一恆定的陰極液液位,並排出反應空間中產生或輸送的任何氣泡。此排氣方法可係藉由一旋轉式基板固持件支持。This means that a portion of the catholyte flow will be discharged through the discharge ring. Thus, as an example, the drain ring can be used as an overflow to maintain a constant catholyte level in the reaction space and to vent any air bubbles generated or transported in the reaction space. This exhaust method can be supported by a rotating substrate holder.
該等排放開口及/或該排放環可經構形以將該陰極液基本上垂直於一欲處理基板表面排放。The discharge openings and/or the discharge ring may be configured to discharge the catholyte substantially perpendicular to a surface of a substrate to be processed.
垂直排放對於自該反應空間移除陰極液可係尤其高效的,藉此進一步提高均勻性。Vertical discharge can be particularly efficient at removing catholyte from the reaction space, thereby further improving uniformity.
特定而言,排放開口及/或排放環之此一構形可與經構形使得基板水平地配置之一系統(當該系統經配置用於既定用途時)一起使用。在彼情況下,開口及/或排放環可沿一垂直方向排放陰極液。藉此,排放受到重力的最佳幫助。In particular, such a configuration of the drain opening and/or drain ring may be used with a system configured such that the substrate is configured horizontally when the system is configured for its intended use. In that case, the opening and/or drain ring can drain the catholyte in a vertical direction. By this, the discharge is optimally assisted by gravity.
該等噴射開口可經構形以將該陰極液基本上垂直地分配至欲處理之該基板上。此允許一尤其均勻的表面處理結果。藉由採用一旋轉式基板固持件可達成一甚至更均勻的結果。The spray openings may be configured to distribute the catholyte substantially vertically onto the substrate to be processed. This allows a particularly uniform surface treatment result. An even more uniform result can be achieved by using a rotating substrate holder.
該等排放開口可自該分配主體之一面向基板表面延伸至該分配主體之一後表面,該後表面與該面向基板表面相對。The discharge openings may extend from a substrate-facing surface of the distribution body to a rear surface of the distribution body opposite the substrate-facing surface.
此意味著陰極液直接地通過分配主體到達其可被容易地收集及/或排放之一區域。This means that the catholyte passes directly through the distribution body to an area where it can be easily collected and/or discharged.
該等噴射開口可自該分配主體之該面向基板表面僅部分地延伸至該分配主體中且通向配置在該分配主體之一橫向側處之至少一個陰極液入口。The injection openings may extend only partially into the distribution body from the substrate-facing surface of the distribution body and lead to at least one catholyte inlet arranged at a lateral side of the distribution body.
此配置允許將陰極液最佳地供應至噴射開口且因此允許高均勻性表面處理。This configuration allows an optimal supply of catholyte to the injection openings and therefore allows a high uniformity of surface treatment.
該陰極液室可包括一保護性氣體系統以在該陰極液與周圍氛圍之間提供一保護性氣體幕。The catholyte chamber may include a protective gas system to provide a protective gas curtain between the catholyte and the surrounding atmosphere.
舉例而言,該保護性氣體系統可包括一氣體入口,特定而言配置在一共同平面中以便彼此面對之幾個氣體入口。該氣體入口或每一氣體入口可經構形以將氣體引入至將形成保護性氣體幕之區域中。For example, the protective gas system may include a gas inlet, in particular several gas inlets arranged in a common plane so as to face each other. The or each gas inlet may be configured to introduce gas into the area where a protective gas curtain will be formed.
該保護性氣體系統亦可包括用於該氣體之一排氣裝置。The protective gas system may also include an exhaust device for the gas.
舉例而言,氮氣可用作一保護性氣體。然而,可使用其他類型之氣體,特定而言保護該室免受來自周圍氛圍之氧氣進入的氣體。For example, nitrogen can be used as a protective gas. However, other types of gases may be used, in particular gases that protect the chamber from the ingress of oxygen from the surrounding atmosphere.
藉由使用保護性氣體系統,可保護陰極液免於劣化,尤其係免於氧化或其他化學反應。特定而言,藉由使用保護性氣體系統,可有效地保護陰極液中之對氧氣敏感的添加劑免受氧化組合物的影響。By using a protective gas system, the catholyte is protected from degradation, especially from oxidation or other chemical reactions. In particular, by using a protective gas system, oxygen-sensitive additives in the catholyte can be effectively protected from the effects of the oxidizing composition.
該系統可進一步包括:一陰極液循環系統,其用於使該陰極液在該陰極液室中循環;及一陽極液循環系統,其用於使該陽極液在該陽極液室中循環,其中該陰極液循環系統與該陽極液循環系統係分開的。The system may further include: a catholyte circulation system for circulating the catholyte in the catholyte chamber; and an anolyte circulation system for circulating the anolyte in the anolyte chamber, wherein The catholyte circulation system is separate from the anolyte circulation system.
該循環系統可包括用於陰極液及陽極液之儲存槽以及驅動陰極液及陽極液在該系統中循環之輸送裝置(例如泵)。使用單獨的循環系統會確保在整個系統中對陰極液及陽極液進行可靠的分離。此外,該循環可確保在陽極液/陰極液儲存槽中以及在陽極液/陰極液儲存槽上游之內嵌式氣泡分離器中進行一氣泡分離。The circulation system may include storage tanks for the catholyte and anolyte and delivery devices (eg, pumps) that drive the catholyte and anolyte to circulate through the system. The use of separate circulation systems will ensure reliable separation of catholyte and anolyte throughout the system. In addition, this circulation ensures a bubble separation in the anolyte/cathodeliquid storage tank and in the built-in bubble separator upstream of the anolyte/catholyte storage tank.
該隔膜可以是電流及金屬離子可滲透的。此允許高效的表面處理。The membrane may be electrically and metal ion permeable. This allows efficient surface treatment.
可提供、配置及構形可切換的分隔開的陽極,以便允許將該等陽極之電場構形為基板大小。可將該等陽極構形成用於一個、兩個或更多個不同的基板大小。Switchable spaced apart anodes may be provided, configured, and configured to allow the electric fields of the anodes to be configured to the size of the substrate. The anodes can be configured for one, two, or more different substrate sizes.
陽極液室可包括至少一個內陽極液入口,視情況額外的內陽極液入口或外陽極液入口,及至少一個陽極液出口,該等入口及出口係可選擇的,以調整向不同尺寸之基板之一陽極液流動。換言之,可存在多個入口及/或出口,例如,用於不同陽極液區帶、尤其係經構形以便允許獨立地啟動該等陽極液區帶之不同入口。The anolyte chamber may include at least one inner anolyte inlet, optionally additional inner anolyte inlets or outer anolyte inlets, and at least one anolyte outlet, which inlets and outlets are selectable to adjust to different sized substrates. One of the anolyte flows. In other words, there may be multiple inlets and/or outlets, for example different inlets for different anolyte zones, especially configured to allow independent actuation of such anolyte zones.
至少一個陽極液出口可係(例如)位於陽極液室中之最高點處。亦即,舉例而言,陽極液出口可經配置以便確保在操作中可在最高點處收集潛在氣體氣泡。特定而言,該系統可經構形使得(例如)主要由陽極產生之氣體氣泡可透過陽極液出口被移除,舉例而言,藉由陽極液循環流動支持。另一選擇係或另外,視情況,一陽極液出口亦可係配置在陽極液室之最低點處。亦即,一陽極液出口可經配置以便能夠將潛在粒子自陽極液室移除。利用上述特徵,可自陽極液室容易地移除氣泡及/或粒子。最高點及最低點各自係指用於既定操作之系統之一配置。At least one anolyte outlet may be, for example, located at the highest point in the anolyte chamber. That is, for example, the anolyte outlet may be configured to ensure that potential gas bubbles are collected at the highest point during operation. In particular, the system can be configured such that, for example, gas bubbles generated primarily by the anode can be removed through the anolyte outlet, for example, supported by a circulating anolyte flow. Alternatively or additionally, as appropriate, an anolyte outlet may be located at the lowest point of the anolyte chamber. That is, an anolyte outlet may be configured to enable removal of potential particles from the anolyte chamber. Utilizing the above features, bubbles and/or particles can be easily removed from the anolyte chamber. The high points and low points each refer to one configuration of the system for a given operation.
舉例而言,相比於外陽極液入口,一內陽極液入口可被配置成距陽極液室之中心更近。舉例而言,陽極液出口可係配置在與外陽極液入口相對之一位置處。因此,相比於陽極液透過外陽極液入口進入陽極液出口,當陽極液透過內陽極液入口進入時,其在途中將經過更短之距離。此意味著藉由選擇內陽極液入口或外陽極液入口,可調整向不同尺寸之基板的陽極液流動。For example, an inner anolyte inlet may be positioned closer to the center of the anolyte chamber than an outer anolyte inlet. For example, the anolyte outlet may be disposed at a position opposite the outer anolyte inlet. Therefore, when anolyte enters through the inner anolyte inlet, it will cover a shorter distance en route than when the anolyte enters through the outer anolyte inlet and into the anolyte outlet. This means that by selecting an inner anolyte inlet or an outer anolyte inlet, the anolyte flow to substrates of different sizes can be adjusted.
該系統可具有自50 mm至350 mm之一範圍中之一高度。The system can have a height ranging from 50 mm to 350 mm.
在一項實例中,該系統可具有在50 mm至80 mm、較佳地60 mm至70 mm之一範圍中之一高度。此允許一尤其緊湊的總體設置,同時,由於如本揭露中指定之構形,允許對陽極液及陰極液之可靠保護以及快速及均勻的表面處理。該高度係指當經配置用於既定用途時的系統的一高度。In one example, the system may have a height in the range of 50 mm to 80 mm, preferably 60 mm to 70 mm. This allows for a particularly compact overall arrangement and at the same time, due to the configuration as specified in this disclosure, reliable protection of the anolyte and catholyte as well as fast and uniform surface treatment. This height refers to the height of the system when configured for its intended use.
在一項實例中,例如其中使用丸粒(例如Cu、SnAg),該系統可具有自200 mm至350 mm、尤其係230 mm至260 mm之一範圍中之高度。In one example, such as where pellets (eg Cu, SnAg) are used, the system may have a height in the range from 200 mm to 350 mm, especially 230 mm to 260 mm.
在另一實施例中,例如其中使用惰性陽極,該系統可具有自50 mm至200 mm、更佳地80 mm至120 mm之一範圍中之高度。In another embodiment, for example where inert anodes are used, the system may have a height ranging from 50 mm to 200 mm, more preferably from 80 mm to 120 mm.
舉例而言,該高度可係指陽極液室、陰極液室及反應空間之一經組合高度。For example, the height may refer to the combined height of the anolyte chamber, catholyte chamber, and reaction space.
該系統可係一模組系統且該系統中之一或多個組件可設置有一快速改變的構形,其允許例如針對不同的基板大小或不同的程序要求對該系統進行有效調適。舉例而言,可在陽極處提供一可移除的漏斗。當對兩個或更多個不同大小的基板進行構形時,可在分段的陽極之間使用選用漏斗用於引導陽極室內部之電場。The system may be a modular system and one or more components of the system may be provided in a rapidly changing configuration, which allows efficient adaptation of the system, for example, to different substrate sizes or different process requirements. For example, a removable funnel may be provided at the anode. When configuring two or more substrates of different sizes, an optional funnel can be used between the segmented anodes to direct the electric field inside the anode chamber.
將理解,本揭露之一較佳的實施例亦可係附屬技術方案與獨立技術方案之任何組合。It will be understood that a preferred embodiment of the present disclosure may also be any combination of dependent technical solutions and independent technical solutions.
參考下文中所闡述之實施例,將明瞭並闡明本揭露之此等及其他態樣。These and other aspects of the present disclosure will be apparent from and elucidated with reference to the embodiments set forth hereinafter.
圖1a及圖1b示意性且例示性地展示根據本揭露之用於一基板11之一化學及/或電解表面處理之一系統10之一實施例。當該系統在使用時,基板11可被固持在一基板固持件中,該基板固持件為了圖解說明並未在此處展示且並非係本揭露之系統之部分。1a and 1b schematically and exemplarily show one embodiment of a system 10 for chemical and/or electrolytic surface treatment of a substrate 11 according to the present disclosure. When the system is in use, the substrate 11 may be held in a substrate holder, which is not shown here for illustration and is not part of the system of the present disclosure.
該系統包括用於陰極液13之一陰極液室12及用於陽極液15之一陽極液室14。藉助相對於分配主體16傾斜、配置在陰極液室12中之一隔膜18,陰極液室12與陽極液室14分隔開。舉例而言,可滲透電流及金屬離子之一隔膜可用作隔膜18。The system includes a catholyte chamber 12 for catholyte 13 and an anolyte chamber 14 for anolyte 15 . The catholyte chamber 12 is separated from the anolyte chamber 14 by a diaphragm 18 arranged in the catholyte chamber 12 and inclined relative to the distribution body 16 . For example, a membrane permeable to electrical current and metal ions may be used as membrane 18 .
應注意,在本揭露中,陽極液室可具有一個陽極液區帶或者可具有多個陽極液區帶,例如該等陽極液區帶之間具有分隔開的陽極及漏斗。當陽極液室具有多個陽極液區帶時,該等區帶可經構形以彼此獨立地啟動。舉例而言,可存在一內區帶及一外區帶,且內區帶可獨立於外區帶而啟動,例如,當外區帶被撤銷啟動時,內區帶可被啟動;或者當外區帶被啟動時,內區帶可被啟動。換言之,該系統可經構形用於對內區帶及外區帶之一選擇性啟動,例如使得內區帶與外區帶可基於一自動選擇及/或使用者選擇共同啟動或彼此獨立地啟動。舉例而言,內區帶可選擇性地單獨啟動或與外區帶一起啟動。可存在多個入口及/或出口,例如,用於不同陽極液區帶、尤其經構形以便允許獨立地啟動該等陽極液區帶之不同入口。It should be noted that in the present disclosure, the anolyte chamber may have one anolyte zone or may have multiple anolyte zones, such as with separated anodes and funnels between the anolyte zones. When the anolyte chamber has multiple anolyte zones, the zones can be configured to activate independently of each other. For example, there can be an inner zone and an outer zone, and the inner zone can be enabled independently of the outer zone, for example, the inner zone can be enabled when the outer zone is deactivated; or when the outer zone is deactivated. When the zone is activated, the inner zone can be activated. In other words, the system may be configured for selective activation of one of the inner and outer zones, such that the inner and outer zones may be activated together or independently of each other based on an automatic selection and/or user selection. Start. For example, the inner zone can be selectively enabled alone or together with the outer zone. There may be multiple inlets and/or outlets, for example different inlets for different anolyte zones, especially configured to allow independent actuation of such anolyte zones.
在圖解說明於圖1a中之實例中,陽極液室14展示為包括一內陽極液入口14a、一外陽極液入口14b及一陽極液出口14c,該等入口及出口係可選擇的以調整向不同尺寸的基板之一陽極液15流動。不同的陽極區帶可填充有丸粒,舉例而言該等丸粒可係Cu丸粒或SnAg丸粒。In the example illustrated in Figure 1a, the anolyte chamber 14 is shown as including an inner anolyte inlet 14a, an outer anolyte inlet 14b, and an anolyte outlet 14c, which inlets and outlets are optionally oriented. Anolyte 15 flows through one of the substrates of different sizes. Different anode zones may be filled with pellets, which may be Cu pellets or SnAg pellets, for example.
舉例而言,在本實施例中,陰極液室12之一橫截面具有一楔形形狀。舉例而言,在此實施例中,楔形形狀之陰極液室12之一橫截面具有一較長橫向側12a及一較短橫向側12b。然而,陰極液室12可具有其他橫截面形狀。For example, in this embodiment, a cross section of the catholyte chamber 12 has a wedge shape. For example, in this embodiment, the cross-section of the wedge-shaped catholyte chamber 12 has a longer lateral side 12a and a shorter lateral side 12b. However, catholyte chamber 12 may have other cross-sectional shapes.
該系統進一步包括一陰極液出口17。陰極液出口17係配置在陰極液室12處一偏心位置20中。更具體而言,在本實施例中,陰極液出口17係配置在陰極液室12之各橫向側中之一者中,作為一實例在陰極液室12之較長橫向側12a中。陰極液出口17亦係配置在陰極液室12處一非旋轉對稱的位置20中。然而,可設想其他配置。The system further includes a catholyte outlet 17. The catholyte outlet 17 is arranged in an eccentric position 20 in the catholyte chamber 12 . More specifically, in this embodiment, the catholyte outlet 17 is disposed in one of the lateral sides of the catholyte chamber 12 , as an example in the longer lateral side 12 a of the catholyte chamber 12 . The catholyte outlet 17 is also arranged in a non-rotationally symmetric position 20 in the catholyte chamber 12 . However, other configurations are envisioned.
如自該圖可見,當系統經配置用於其既定用途時,陰極液出口17可配置在分配主體16下面之一位置處,尤其係在陰極液室之一橫向側中。換言之,陰極液出口17可配置在分配主體16與隔膜18之間,尤其係在陰極液室之一橫向側中。更具體而言,當系統經配置用於其既定用途時,陰極液出口17可在分配主體16下面之一位置處與陰極液室相通,或者換言之,陰極液出口17可在分配主體16與隔膜18之間的一位置處與陰極液室相通。As can be seen from this figure, when the system is configured for its intended use, the catholyte outlet 17 can be arranged at a location underneath the distribution body 16, in particular in one of the lateral sides of the catholyte chamber. In other words, the catholyte outlet 17 can be arranged between the distribution body 16 and the membrane 18 , in particular in one of the lateral sides of the catholyte chamber. More specifically, when the system is configured for its intended use, the catholyte outlet 17 may communicate with the catholyte chamber at a location below the distribution body 16 or, in other words, the catholyte outlet 17 may communicate with the diaphragm between the distribution body 16 and the diaphragm. A position between 18 is connected with the catholyte chamber.
陰極液室12可視情況包括一保護性氣體系統12d以在陰極液與周圍氛圍之間提供一保護性氣體幕。保護性氣體亦可被注射至陽極液儲存槽及陰極液儲存槽中。Catholyte chamber 12 optionally includes a protective gas system 12d to provide a protective gas curtain between the catholyte and the surrounding atmosphere. Protective gas can also be injected into the anolyte storage tank and catholyte storage tank.
保護性氣體系統12d可經構形以在陰極液與周圍氛圍之間提供保護性氣體幕。保護性氣體系統12d可包括用於保護性氣體(例如用於氮氣)之入口以及用於保護性氣體及/或其他氣體(例如,作為程序之部分形成之氣體)之一出口。Protective gas system 12d may be configured to provide a protective gas curtain between the catholyte and the surrounding atmosphere. The protective gas system 12d may include an inlet for the protective gas (eg, for nitrogen) and an outlet for the protective gas and/or other gases (eg, gases formed as part of the process).
如上文提及,該系統進一步包括配置在陰極液室12中之分配主體16。As mentioned above, the system further includes a distribution body 16 disposed in the catholyte chamber 12 .
一反應空間19係配置在分配主體16與基板11之間。A reaction space 19 is arranged between the distribution body 16 and the substrate 11 .
分配主體16包括噴射開口16a,其用於將陰極液13分配至欲處理之基板11上。特定而言,噴射開口16a可經構形以將陰極液13基本上垂直地分配至欲處理之基板11上。然而,可設想偏離垂直方向之方向。The distribution body 16 includes a spray opening 16 a for distributing the catholyte 13 onto the substrate 11 to be processed. In particular, the spray openings 16a may be configured to distribute the catholyte 13 substantially vertically onto the substrate 11 to be processed. However, directions away from the vertical are conceivable.
在圖1a中,噴射開口16a圖解說明為自分配主體16之面向基板表面16c僅部分地延伸至分配主體16中且通向配置在分配主體16之一橫向側16f處之一陰極液入口16e。In Figure 1a, the injection opening 16a is illustrated as extending only partially into the distribution body 16 from a substrate facing surface 16c of the distribution body 16 and leading to a catholyte inlet 16e disposed at one lateral side 16f of the distribution body 16.
分配主體進一步包括排放開口16b,其用於將陰極液13自分配主體16與基板11之間的反應空間19排放出。The distribution body further includes a discharge opening 16 b for discharging the catholyte 13 from the reaction space 19 between the distribution body 16 and the substrate 11 .
在圖1a中,排放開口16b展示為自分配主體16之一面向基板表面16c延伸至分配主體16之一後表面16d,該後表面與面向基板表面16c相對。然而,可設想其他配置。In Figure la, the discharge opening 16b is shown extending from one of the substrate facing surfaces 16c of the dispensing body 16 to a rear surface 16d of the dispensing body 16 opposite the substrate facing surface 16c. However, other configurations are envisioned.
排放開口16b可經構形以將陰極液13基本上垂直於一欲處理基板表面11a排放。然而,可設想偏離垂直方向之方向。Discharge opening 16b may be configured to discharge catholyte 13 substantially perpendicularly to a substrate surface 11a to be processed. However, directions away from the vertical are conceivable.
陰極液室12之上文提及之橫向側12a及12b可基本上垂直於面向基板表面16c延伸。The above-mentioned lateral sides 12a and 12b of the catholyte chamber 12 may extend substantially perpendicular to the substrate-facing surface 16c.
分配主體16之一縱向方向21藉由一虛線指示在圖1a中。在此特定實例中,陰極液室12之上文提及之橫向側12a及12b可基本上垂直於分配主體16之縱向方向21延伸。One longitudinal direction 21 of the dispensing body 16 is indicated in Figure 1a by a dashed line. In this particular example, the above-mentioned lateral sides 12 a and 12 b of the catholyte chamber 12 may extend substantially perpendicularly to the longitudinal direction 21 of the distribution body 16 .
在圖1a中,系統10僅作為一實例展示,具有一陰極液室12,其包括圍繞分配主體16配置以將陰極液13自分配主體16與基板11之間的反應空間19排放出之一排放環12c。排放環12c經構形以將陰極液13基本上垂直於一欲處理基板表面11a排放。In Figure 1a, system 10 is shown by way of example only, having a catholyte chamber 12 including a discharge disposed about distribution body 16 to discharge catholyte 13 from reaction space 19 between distribution body 16 and substrate 11 Ring 12c. Discharge ring 12c is configured to discharge catholyte 13 substantially perpendicularly to a substrate surface 11a to be processed.
視情況,系統10可包括:一陰極液循環系統24,用於使陰極液13在陰極液室12中循環;及一陽極液循環系統25,用於使陽極液15在陽極液室14中循環。如在圖1a中圖解說明,該等循環系統可包括一陰極液槽24a及一陽極液槽25a,以及(未圖解說明之)泵或其他輸送裝置。箭頭24b僅示意性地圖示陰極液之一流動方向,且箭頭25b圖示陽極液之一流動方向。陰極液循環系統24與陽極液循環系統25係分開的。Optionally, system 10 may include: a catholyte circulation system 24 for circulating catholyte 13 in catholyte chamber 12; and an anolyte circulation system 25 for circulating anolyte 15 in anolyte chamber 14. . As illustrated in Figure 1a, the circulation systems may include a catholyte tank 24a and an anolyte tank 25a, as well as (not illustrated) pumps or other delivery devices. The arrow 24b only schematically illustrates a flow direction of the catholyte, and the arrow 25b illustrates a flow direction of the anolyte. The catholyte circulation system 24 and the anolyte circulation system 25 are separate.
在此內容脈絡中,應注意,由於用2D來圖示3D系統,因此在各圖中用於陽極液之一入口與用於陰極液之一入口重疊。亦即,用於陽極液之一入口(流動方向藉由箭頭25b指示)被展示為沿觀看方向係配置在用於陰極液之一入口(流動方向藉由箭頭24b指示)前面。In the context of this content, it should be noted that since the 3D system is illustrated in 2D, one inlet for the anolyte overlaps with one for the catholyte in each figure. That is, an inlet for the anolyte (flow direction indicated by arrow 25b) is shown arranged in front of an inlet for catholyte (flow direction indicated by arrow 24b) in the viewing direction.
圖1b展示與上文在圖1a之內容脈絡中所闡述之系統相似的一系統。該圖1b中對氣泡27之存在及移動進行圖解說明。此外,可以看到陰極液及陽極液並非完全地填充各槽,因此在各別槽中存在一液面高度28。如上文提及,亦可將保護性氣體注射至陽極液及陰極液槽中。在此實例中,藉由箭頭指示對N 2之注射。氣泡透過一各別排氣孔自槽放出。亦在圖1b中展示用於泵吸陰極液及陽極液之例示性泵29以及用來移除氣泡之內嵌式氣體抽取器30。 Figure 1b shows a system similar to that described above in the context of Figure 1a. The presence and movement of bubbles 27 are illustrated in Figure 1b. Furthermore, it can be seen that the catholyte and anolyte do not completely fill each tank, so there is a liquid level of 28 in each tank. As mentioned above, protective gas can also be injected into the anolyte and catholyte tanks. In this example, the injection of N2 is indicated by the arrow. The air bubbles are released from the tank through a separate vent. Also shown in Figure Ib is an exemplary pump 29 for pumping the catholyte and anolyte and an inline gas extractor 30 for removing air bubbles.
圖2示意性且例示性地展示圖1a或圖1b之系統之部分之一經放大視圖。特定而言,圖2用來提供包含分配主體16及隔膜18之系統部分之一經放大視圖。亦指示一隔膜載板18a。應注意,隔膜可係支撐在兩個方向上,其中陰極液室12包含一支撐板,該支撐板在既定操作中係一上支撐件。Figure 2 shows schematically and exemplarily an enlarged view of one of the parts of the system of Figure 1a or Figure 1b. Specifically, FIG. 2 is used to provide an enlarged view of a portion of the system including the distribution body 16 and the diaphragm 18 . A diaphragm carrier plate 18a is also indicated. It should be noted that the membrane can be supported in two directions, with the catholyte chamber 12 including a support plate which in a given operation serves as an upper support.
圖3a至圖3c示意性地展示根據本揭露之穿過一系統(特定而言,出於圖解說明之目的,穿過圖1a或圖1b之系統)之陰極液及陽極液流動。如上文所闡述,陽極液室14可包括一內陽極液入口14a、一外陽極液入口14b及一陽極液出口14c,該等入口及出口係可選擇的以調整向不同尺寸之基板之一陽極液15流動。在圖3a之情況下,選擇了內陽極液入口14a,而在圖3b中共同選擇了內陽極液入口及外陽極液入口。Figures 3a-3c schematically illustrate catholyte and anolyte flow through a system (specifically, for purposes of illustration, through the system of Figure 1a or Figure 1b) in accordance with the present disclosure. As discussed above, the anolyte chamber 14 may include an inner anolyte inlet 14a, an outer anolyte inlet 14b, and an anolyte outlet 14c, which inlets and outlets are selectable to adjust an anode to different sizes of substrates. Liquid 15 flows. In the case of Figure 3a, the inner anolyte inlet 14a is selected, whereas in Figure 3b the inner anolyte inlet and the outer anolyte inlet are jointly selected.
應注意,為避免一雜亂的視圖,在圖3a及圖3b中僅展示自陰極液離開反應空間之點的陰極液流動。圖3c展示向分配主體中且穿過分配主體之陰極液流動。It should be noted that in order to avoid a cluttered view, only the catholyte flow from the point where the catholyte leaves the reaction space is shown in Figures 3a and 3b. Figure 3c shows catholyte flow into and through the distribution body.
應注意,圖1至圖3之系統亦包含為避免雜亂而省略之一陽極及一陰極。It should be noted that the systems of Figures 1-3 also include an anode and a cathode which are omitted to avoid clutter.
應注意,在較佳的實施例中,通常可選擇陰極之大小以便匹配陽極大小及晶圓大小。It should be noted that in preferred embodiments, the cathode size is generally chosen to match the anode size and wafer size.
圖4示意性且例示性地展示根據一實施例之用於一基板之一化學及/或電解表面處理之一系統之一橫截面的一側視圖。該系統與圖1至圖3c中展示之系統有類似構形。然而,高度26比該等圖中小。此用來圖解說明所主張之系統10可具有一尤其緊湊的造型。Figure 4 schematically and exemplarily shows a cross-sectional side view of a system for chemical and/or electrolytic surface treatment of a substrate according to an embodiment. This system has a similar configuration to the system shown in Figures 1 to 3c. However, the height 26 is smaller than in these figures. This is used to illustrate that the claimed system 10 can have a particularly compact shape.
作為一實例,系統10可具有在50 mm至80 mm、較佳地60 mm至70 mm之一範圍中之一高度26。然而,可設想其他尺寸。As an example, system 10 may have a height 26 in a range of 50 mm to 80 mm, preferably 60 mm to 70 mm. However, other sizes are envisioned.
作為一實例,系統10可具有在50 mm至350 mm之一範圍中之一高度26。在一項實施例中,例如其中使用丸粒(例如Cu、SnAg),該高度可較佳地係在200 mm至350 mm、更佳地230 mm至260 mm之一範圍中。在另一實例中,其中使用惰性陽極,該高度可較佳地係在50 mm至200 mm、更佳地80 mm至120 mm之一範圍中。As an example, system 10 may have a height 26 in a range of 50 mm to 350 mm. In one embodiment, for example where pellets (eg Cu, SnAg) are used, the height may preferably range from 200 mm to 350 mm, more preferably from 230 mm to 260 mm. In another example, where an inert anode is used, the height may preferably be in the range of 50 mm to 200 mm, more preferably 80 mm to 120 mm.
舉例而言,該高度可係指陽極液室、陰極液室及反應空間之一經組合高度。For example, the height may refer to the combined height of the anolyte chamber, catholyte chamber, and reaction space.
儘管本揭露在各圖式及前述說明中已進行詳細地圖解說明及闡述,但此圖解及說明應視為圖解說明性或例示性的而非限制性的。本揭露並不限於所揭露之實施例。根據對各圖式、本揭露及附屬技術方案之研究,熟習此項技術者在實踐一所主張之揭露時可理解並實現所揭露之實施例之其他變化形式。Although the present disclosure has been illustrated and described in detail in the drawings and the foregoing description, such illustrations and descriptions are to be considered illustrative or illustrative and not restrictive. The present disclosure is not limited to the disclosed embodiments. Based on a study of the drawings, the disclosure and the accompanying technical solutions, those skilled in the art can understand and implement other variations of the disclosed embodiments when practicing a claimed disclosure.
在申請專利範圍中,詞語「包括(comprising)」並不排除其他元件或步驟,且不定冠詞「一(a)或(an)」並不排除複數含義。在互不相同之附屬技術方案中引用特定措施之此一事實並不指示無法有利地使用此等措施之一組合。申請專利範圍中之任何元件符號不應被解釋為對範疇進行限制。In the scope of the patent application, the word "comprising" does not exclude other elements or steps, and the indefinite article "a (a) or (an)" does not exclude the plural meaning. The fact that particular measures are cited in mutually different sub-technical solutions does not indicate that a combination of these measures cannot be used to advantage. Any element symbols in the claimed scope should not be construed as limiting the scope.
10:系統 11:基板 11a:欲處理基板表面 12:陰極液室/楔形形狀之陰極液室 12a:較長橫向側/橫向側 12b:較短橫向側/橫向側 12c:排放環 12d:保護性氣體系統 13:陰極液 14:陽極液室 14a:內陽極液入口 14b:外陽極液入口 14c:陽極液出口 15:陽極液 16:分配主體 16a:噴射開口 16b:排放開口 16c:面向基板表面 16d:後表面 16e:陰極液入口 16f:橫向側 17:陰極液出口 18:隔膜 18a:隔膜載板 19:反應空間 20:偏心位置/非旋轉對稱的位置 21:縱向方向 24:陰極液循環系統 24a:陰極液槽 24b:箭頭 25:陽極液循環系統 25a:陽極液槽 25b:箭頭 26:高度 27:氣泡 28:液面高度 29:例示性泵 30:內嵌式氣體抽取器 10:System 11:Substrate 11a: To treat the substrate surface 12: Catholyte chamber/wedge-shaped catholyte chamber 12a: Longer lateral side/transverse side 12b:Shorter lateral side/lateral side 12c: Emission ring 12d: Protective gas system 13: Catholyte 14:Anolyte chamber 14a:Inner anolyte inlet 14b: External anolyte inlet 14c: Anolyte outlet 15:Anolyte 16: Distribution subject 16a: Jet opening 16b: Discharge opening 16c: Facing the substrate surface 16d: rear surface 16e: Catholyte inlet 16f: Lateral side 17: Catholyte outlet 18: Diaphragm 18a: Diaphragm carrier plate 19:Reaction space 20: Eccentric position/non-rotationally symmetrical position 21:Portrait direction 24: Catholyte circulation system 24a: Catholyte tank 24b:arrow 25:Anolyte circulation system 25a: Anolyte tank 25b:arrow 26:Height 27: Bubbles 28:Liquid level height 29: Exemplary pump 30: Built-in gas extractor
下文將參考附圖對本揭露之例示性實施例進行闡述:Exemplary embodiments of the present disclosure will be described below with reference to the accompanying drawings:
圖1a示意性且例示性地展示根據一實施例之用於一基板之一化學及/或電解表面處理之一系統之一橫截面的一側視圖;Figure 1a schematically and exemplarily shows a cross-sectional side view of a system for chemical and/or electrolytic surface treatment of a substrate according to an embodiment;
圖1b示意性且例示性地展示根據一實施例之用於一基板之化學及/或電解表面處理之一系統之一橫截面的一側視圖;Figure 1b schematically and exemplarily shows a cross-sectional side view of a system for chemical and/or electrolytic surface treatment of a substrate according to an embodiment;
圖2 示意性且例示性地展示圖1a或圖1b之系統之部分之一經放大視圖;Figure 2 shows schematically and exemplarily an enlarged view of one of the parts of the system of Figure 1a or Figure 1b;
圖3a至圖3c示意性地展示穿過圖1a或圖1b之系統之陰極液及陽極液流動;Figures 3a to 3c schematically illustrate catholyte and anolyte flow through the system of Figure 1a or Figure 1b;
圖4 示意性且例示性地展示根據一實施例之用於一基板之一化學及/或電解表面處理之一系統之一橫截面的一側視圖。Figure 4 schematically and exemplarily shows a cross-sectional side view of a system for chemical and/or electrolytic surface treatment of a substrate according to an embodiment.
10:系統 10:System
11:基板 11:Substrate
11a:欲處理基板表面 11a: To treat the substrate surface
12:陰極液室/楔形形狀之陰極液室 12: Catholyte chamber/wedge-shaped catholyte chamber
12a:較長橫向側/橫向側 12a: Longer lateral side/transverse side
12b:較短橫向側/橫向側 12b:Shorter lateral side/lateral side
12c:排放環 12c: Emission ring
12d:保護性氣體系統 12d: Protective gas system
13:陰極液 13: Catholyte
14:陽極液室 14:Anolyte chamber
14a:內陽極液入口 14a:Inner anolyte inlet
14b:外陽極液入口 14b: External anolyte inlet
14c:陽極液出口 14c: Anolyte outlet
15:陽極液 15:Anolyte
16:分配主體 16: Distribution subject
16a:噴射開口 16a: Jet opening
16b:排放開口 16b: Discharge opening
16c:面向基板表面 16c: Facing the substrate surface
16d:後表面 16d: rear surface
16f:橫向側 16f: Lateral side
17:陰極液出口 17: Catholyte outlet
18:隔膜 18: Diaphragm
19:反應空間 19:Reaction space
20:偏心位置/非旋轉對稱的位置 20: Eccentric position/non-rotationally symmetrical position
21:縱向方向 21:Portrait direction
24:陰極液循環系統 24: Catholyte circulation system
24a:陰極液槽 24a: Catholyte tank
24b:箭頭 24b:arrow
25:陽極液循環系統 25:Anolyte circulation system
25a:陽極液槽 25a: Anolyte tank
25b:箭頭 25b:arrow
27:氣泡 27: Bubbles
28:液面高度 28:Liquid level height
29:例示性泵 29: Exemplary pump
30:內嵌式氣體抽取器 30: Built-in gas extractor
Claims (15)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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EP22153761.6 | 2022-01-27 | ||
EP22153761.6A EP4219799A1 (en) | 2022-01-27 | 2022-01-27 | System for a chemical and/or electrolytic surface treatment of a substrate |
PCT/EP2022/085151 WO2023143797A1 (en) | 2022-01-27 | 2022-12-09 | System for a chemical and/or electrolytic surface treatment of a substrate |
WOPCT/EP2022/085151 | 2022-12-09 |
Publications (1)
Publication Number | Publication Date |
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TW202334512A true TW202334512A (en) | 2023-09-01 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112100152A TW202334512A (en) | 2022-01-27 | 2023-01-04 | System for a chemical and/or electrolytic surface treatment of a substrate |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP4219799A1 (en) |
KR (1) | KR20240141794A (en) |
CN (1) | CN118613608A (en) |
TW (1) | TW202334512A (en) |
WO (1) | WO2023143797A1 (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG10202004261TA (en) * | 2012-05-14 | 2020-06-29 | Novellus Systems Inc | Cross flow manifold for electroplating apparatus |
US11001934B2 (en) * | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
EP3868923A1 (en) * | 2020-02-19 | 2021-08-25 | Semsysco GmbH | Electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate |
-
2022
- 2022-01-27 EP EP22153761.6A patent/EP4219799A1/en active Pending
- 2022-12-09 KR KR1020247028365A patent/KR20240141794A/en unknown
- 2022-12-09 CN CN202280090167.4A patent/CN118613608A/en active Pending
- 2022-12-09 WO PCT/EP2022/085151 patent/WO2023143797A1/en unknown
-
2023
- 2023-01-04 TW TW112100152A patent/TW202334512A/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR20240141794A (en) | 2024-09-27 |
WO2023143797A1 (en) | 2023-08-03 |
CN118613608A (en) | 2024-09-06 |
EP4219799A1 (en) | 2023-08-02 |
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