TW202334352A - Silicone adhesive, adhesive sheet and double-sided adhesive sheet - Google Patents
Silicone adhesive, adhesive sheet and double-sided adhesive sheet Download PDFInfo
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- TW202334352A TW202334352A TW111138778A TW111138778A TW202334352A TW 202334352 A TW202334352 A TW 202334352A TW 111138778 A TW111138778 A TW 111138778A TW 111138778 A TW111138778 A TW 111138778A TW 202334352 A TW202334352 A TW 202334352A
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- Prior art keywords
- adhesive
- sheet
- adhesive layer
- silicone
- peeling
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- 239000013464 silicone adhesive Substances 0.000 title claims abstract description 39
- 239000000853 adhesive Substances 0.000 title claims description 117
- 230000001070 adhesive effect Effects 0.000 title claims description 114
- HFHDHCJBZVLPGP-UHFFFAOYSA-N schardinger α-dextrin Chemical class O1C(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(O)C2O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC2C(O)C(O)C1OC2CO HFHDHCJBZVLPGP-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229920000858 Cyclodextrin Polymers 0.000 claims abstract description 21
- 125000002252 acyl group Chemical group 0.000 claims abstract description 4
- 239000012790 adhesive layer Substances 0.000 claims description 126
- 229920001296 polysiloxane Polymers 0.000 claims description 28
- 238000007259 addition reaction Methods 0.000 claims description 17
- 239000002985 plastic film Substances 0.000 claims description 17
- 229920006255 plastic film Polymers 0.000 claims description 16
- GDSRMADSINPKSL-HSEONFRVSA-N gamma-cyclodextrin Chemical class OC[C@H]([C@H]([C@@H]([C@H]1O)O)O[C@H]2O[C@@H]([C@@H](O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O3)[C@H](O)[C@H]2O)CO)O[C@@H]1O[C@H]1[C@H](O)[C@@H](O)[C@@H]3O[C@@H]1CO GDSRMADSINPKSL-HSEONFRVSA-N 0.000 claims description 8
- WHGYBXFWUBPSRW-FOUAGVGXSA-N beta-cyclodextrin Chemical class OC[C@H]([C@H]([C@@H]([C@H]1O)O)O[C@H]2O[C@@H]([C@@H](O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O3)[C@H](O)[C@H]2O)CO)O[C@@H]1O[C@H]1[C@H](O)[C@@H](O)[C@@H]3O[C@@H]1CO WHGYBXFWUBPSRW-FOUAGVGXSA-N 0.000 claims description 7
- 238000006757 chemical reactions by type Methods 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 206010040844 Skin exfoliation Diseases 0.000 description 78
- -1 polydimethylsiloxane Polymers 0.000 description 43
- 238000000576 coating method Methods 0.000 description 21
- 239000011248 coating agent Substances 0.000 description 18
- 239000004205 dimethyl polysiloxane Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 18
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 18
- 239000003795 chemical substances by application Substances 0.000 description 13
- 229920002050 silicone resin Polymers 0.000 description 13
- 239000007788 liquid Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- 239000010410 layer Substances 0.000 description 11
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 9
- 230000007547 defect Effects 0.000 description 9
- 238000005259 measurement Methods 0.000 description 9
- 230000003746 surface roughness Effects 0.000 description 9
- 125000003342 alkenyl group Chemical group 0.000 description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 6
- 239000003522 acrylic cement Substances 0.000 description 6
- 229940080345 gamma-cyclodextrin Drugs 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000008103 glucose Substances 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000001116 FEMA 4028 Substances 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 5
- 235000011175 beta-cyclodextrine Nutrition 0.000 description 5
- 229960004853 betadex Drugs 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000003085 diluting agent Substances 0.000 description 5
- 239000011737 fluorine Substances 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- 125000000524 functional group Chemical group 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 4
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- KJIFKLIQANRMOU-UHFFFAOYSA-N oxidanium;4-methylbenzenesulfonate Chemical compound O.CC1=CC=C(S(O)(=O)=O)C=C1 KJIFKLIQANRMOU-UHFFFAOYSA-N 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 239000011162 core material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000002791 glucosyl group Chemical group C1([C@H](O)[C@@H](O)[C@H](O)[C@H](O1)CO)* 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920001450 Alpha-Cyclodextrin Polymers 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004129 EU approved improving agent Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- GZETWZZNDACBTQ-UHFFFAOYSA-N [Cl].C=C Chemical group [Cl].C=C GZETWZZNDACBTQ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- HFHDHCJBZVLPGP-RWMJIURBSA-N alpha-cyclodextrin Chemical compound OC[C@H]([C@H]([C@@H]([C@H]1O)O)O[C@H]2O[C@@H]([C@@H](O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O3)[C@H](O)[C@H]2O)CO)O[C@@H]1O[C@H]1[C@H](O)[C@@H](O)[C@@H]3O[C@@H]1CO HFHDHCJBZVLPGP-RWMJIURBSA-N 0.000 description 1
- 229940043377 alpha-cyclodextrin Drugs 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 229940097362 cyclodextrins Drugs 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 239000002683 reaction inhibitor Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
本發明是有關於一種矽酮系黏著劑、使用此矽酮系黏著劑的黏著片及雙面黏著片。The present invention relates to a silicone adhesive, an adhesive sheet and a double-sided adhesive sheet using the silicone adhesive.
從過去至今已知有各種類型用於將部件彼此以面對面方式接著的黏著片,且已知作為黏著片的一種的無基材雙面黏著片。無基材雙面黏著片,一般而言,是在不具有成為芯材的基材的黏著劑層的雙面上,分別積層對此黏著劑層的剝離力相對較低的輕剝離膜與對此黏著劑層的剝離力相對較高的重剝離膜而形成。Various types of adhesive sheets for joining components face-to-face have been known from the past, and a substrate-less double-sided adhesive sheet is known as one type of adhesive sheet. Generally speaking, base-less double-sided adhesive sheets are made by laminating a light-peel film with a relatively low peeling force on the adhesive layer on both sides of an adhesive layer that does not have a base material that serves as the core material. The peeling force of this adhesive layer is relatively high and is formed by a heavy peeling film.
在上述無基材雙面黏著片中,首先剝離輕剝離膜,將露出的黏著劑層的其中一面接著到一個部件。然後,剝離重剝離膜,將露出的黏著劑層的另一面接著到其他部件,藉此將部件彼此以面對面方式接著。In the above-mentioned double-sided adhesive sheet without a base material, the light release film is first peeled off, and one side of the exposed adhesive layer is adhered to a component. Then, the re-release film is peeled off, and the other side of the exposed adhesive layer is bonded to other components, thereby bonding the components face to face.
然而,作為無基材雙面黏著片的問題點,可以列舉當剝離輕剝離膜時,可能會發生原本應該留在重剝離膜側的黏著劑層被輕剝離膜拉扯並追隨輕剝離膜的剝離不良現象(所謂的黏連)。However, a problem with base-less double-sided adhesive sheets is that when the light release film is peeled off, the adhesive layer that should be left on the heavy release film side may be pulled by the light release film and follow the peeling of the light release film. Undesirable phenomenon (so-called adhesion).
為了防止如上所述的剝離不良,以往是增大重剝離膜的剝離力與輕剝離膜的剝離力的差(例如,參照專利文獻1)。 [先前技術文件] [專利文獻] In order to prevent the peeling failure as described above, the difference in peeling force between the heavy peeling film and the light peeling film has been conventionally increased (for example, see Patent Document 1). [Prior Technical Document] [Patent Document]
[專利文獻1] 日本專利特開平7-041736號公報[Patent Document 1] Japanese Patent Application Laid-Open No. 7-041736
[發明所欲解決的問題][Problem to be solved by the invention]
然而,當黏著片的黏著劑層是由矽酮系黏著劑所形成時,如果使用以矽酮系剝離劑進行剝離處理的剝離膜,則矽酮彼此之間的親和性高,剝離力增加,上述的剝離不良會更顯著地發生。However, when the adhesive layer of the adhesive sheet is formed of a silicone-based adhesive, if a release film that is peeled off with a silicone-based release agent is used, the affinity between the silicones will be high and the peeling force will increase. The above-mentioned peeling failure will occur more significantly.
因此,在使用矽酮系黏著劑的黏著片中,通常使用以氟系剝離劑進行剝離處理的剝離膜。但是,由於以氟系剝離劑進行剝離處理的剝離膜的價格較高,因此存在製造成本增加的問題。因此,需要一種黏著片,特別是無基材雙面黏著片,其能夠使用未經過上述剝離處理的膜作為剝離膜。Therefore, in an adhesive sheet using a silicone-based adhesive, a release film subjected to release treatment with a fluorine-based release agent is usually used. However, there is a problem in that the production cost increases because the release film subjected to release treatment using a fluorine-based release agent is expensive. Therefore, there is a need for an adhesive sheet, particularly a base-less double-sided adhesive sheet, which can use a film that has not undergone the above-mentioned release treatment as a release film.
本發明是鑑於這樣的實際情況而完成的,其目的在於提供一種能夠將剝離片良好地剝離的矽酮系黏著劑、黏著片及雙面黏著片。 [用以解決問題的手段] The present invention has been made in view of such actual circumstances, and an object thereof is to provide a silicone-based adhesive, an adhesive sheet, and a double-sided adhesive sheet that enable the release sheet to be peeled off satisfactorily. [Means used to solve problems]
為了達成上述目的,第一、本發明提供一種含有修飾化環糊精的矽酮系黏著劑(發明1)。In order to achieve the above object, first, the present invention provides a silicone-based adhesive containing modified cyclodextrin (Invention 1).
在上述發明(發明1)中,藉由含有修飾化環糊精,由上述矽酮系黏著劑所形成的黏著劑層的表面粗糙度變大。因此,與積層在上述黏著劑層上的剝離片的接觸面積變小,將此剝離片從上述黏著劑層剝離時,能夠良好地剝離。亦即,剝離片的剝離時,黏著劑層不會追隨上述剝離片,而能夠抑制黏連等的剝離不良發生。In the above-mentioned invention (Invention 1), by containing modified cyclodextrin, the surface roughness of the adhesive layer formed of the above-mentioned silicone-based adhesive becomes larger. Therefore, the contact area with the release sheet laminated on the adhesive layer becomes smaller, and when the release sheet is peeled off from the adhesive layer, the release sheet can be peeled off satisfactorily. That is, when the release sheet is peeled off, the adhesive layer does not follow the release sheet, and the occurrence of peeling defects such as sticking can be suppressed.
在上述發明(發明1)中,較佳為上述修飾化環糊精為修飾化β-環糊精及修飾化γ-環糊精中的至少一種(發明2)。In the above invention (Invention 1), it is preferable that the modified cyclodextrin is at least one of modified β-cyclodextrin and modified γ-cyclodextrin (Invention 2).
在上述發明(發明1、2)中,較佳為上述修飾化環糊精為藉由醯基修飾的環糊精(發明3)。In the above inventions (Inventions 1 and 2), it is preferable that the modified cyclodextrin is a cyclodextrin modified with a acyl group (Invention 3).
在上述發明(發明1~3)中,較佳為加成反應型矽酮系黏著劑(發明4)。Among the above inventions (Inventions 1 to 3), an addition reaction type silicone-based adhesive (Invention 4) is preferred.
第二、本發明提供一種黏著片,其為至少具有黏著劑層的黏著片,其特徵在於,上述黏著劑層是由上述矽酮系黏著劑(發明1~4)所形成(發明5)。Secondly, the present invention provides an adhesive sheet having at least an adhesive layer, characterized in that the adhesive layer is formed of the silicone adhesive (Inventions 1 to 4) (Invention 5).
在上述發明(發明5)中,較佳為上述黏著劑層的表面的算術平均粗糙度(Ra)為4 nm以上(發明6)。In the above invention (Invention 5), it is preferable that the arithmetic mean roughness (Ra) of the surface of the adhesive layer is 4 nm or more (Invention 6).
第三、本發明提供一種雙面黏著片,其為具備黏著劑層、積層在上述黏著劑層的一側的面上的第一剝離片與積層在上述黏著劑層的另一側的面上的第二剝離片的雙面黏著片,其特徵在於,上述黏著劑層由上述矽酮系黏著劑(發明1~4)所形成(發明7)。Third, the present invention provides a double-sided adhesive sheet, which is provided with an adhesive layer, a first release sheet laminated on one side of the adhesive layer, and a first release sheet laminated on the other side of the adhesive layer. The double-sided adhesive sheet of the second release sheet is characterized in that the adhesive layer is formed of the silicone adhesive (Inventions 1 to 4) (Invention 7).
在上述發明(發明7)中,將上述第一剝離片或上述第二剝離片剝離而露出的上述黏著劑層的表面的算術平均粗糙度(Ra) 較佳為4 nm以上(發明8)。In the above invention (Invention 7), the arithmetic mean roughness (Ra) of the surface of the adhesive layer exposed by peeling off the first release sheet or the second release sheet is preferably 4 nm or more (Invention 8).
在上述發明(發明7、8)中,較佳為上述第一剝離片及上述第二剝離片是未實施剝離處理的塑膠薄膜(發明9)。 [發明功效] In the above-mentioned inventions (Inventions 7 and 8), it is preferable that the first release sheet and the second release sheet are plastic films that have not been subjected to release processing (Invention 9). [Invention effect]
根據本發明的矽酮系黏著劑、黏著片及雙面黏著片,能夠將剝離片良好地剝離。According to the silicone-based adhesive agent, adhesive sheet and double-sided adhesive sheet of the present invention, the release sheet can be peeled off satisfactorily.
在下文中,將針對本發明的實施形態進行說明。 [矽酮系黏著劑] 本發明的一實施形態的矽酮系黏著劑是含有修飾化環糊精的矽酮系黏著劑。藉由含有此修飾化環糊精,上述矽酮系黏著劑所形成的黏著劑層的表面粗糙度變大。具體而言,算術平均粗糙度(Ra)為4 nm以上。因此,與積層在上述黏著劑層上的剝離片的接觸面積變小,將此剝離片從上述黏著劑層剝離時,能夠良好地剝離。亦即,剝離片的剝離時,黏著劑層不會追隨上述剝離片,而能夠抑制黏連等的剝離不良發生。 Hereinafter, embodiments of the present invention will be described. [Silicone adhesive] The silicone-based adhesive according to one embodiment of the present invention is a silicone-based adhesive containing modified cyclodextrin. By containing this modified cyclodextrin, the surface roughness of the adhesive layer formed by the silicone-based adhesive increases. Specifically, the arithmetic mean roughness (Ra) is 4 nm or more. Therefore, the contact area with the release sheet laminated on the adhesive layer becomes smaller, and when the release sheet is peeled off from the adhesive layer, the release sheet can be peeled off satisfactorily. That is, when the release sheet is peeled off, the adhesive layer does not follow the release sheet, and the occurrence of peeling defects such as sticking can be suppressed.
即使剝離片是未經剝離處理的塑膠薄膜 ,也能達到上述效果。因此,不需要使用以氟系剝離劑進行剝離處理的剝離片,能夠降低製造成本。再者,即使在無基材雙面黏著片的情況時也能夠達成上述效果。具體而言,從藉由兩片未經剝離處理的塑膠薄膜包夾上述黏著劑層的無基材雙面黏著片,將其中一側的塑膠薄膜剝離時,能夠不發生黏連等的剝離不良,將上述塑膠薄膜良好地剝離。Even if the peeling sheet is a plastic film without peeling treatment, the above effect can be achieved. Therefore, there is no need to use a release sheet subjected to release treatment with a fluorine-based release agent, and the manufacturing cost can be reduced. Furthermore, the above effects can be achieved even when there is no double-sided adhesive sheet as a base material. Specifically, when peeling off one side of the plastic film from the base-less double-sided adhesive sheet in which the above-mentioned adhesive layer is sandwiched by two pieces of plastic film that has not been peeled off, no peeling defects such as sticking will occur. , peel off the above plastic film well.
在此,由本實施形態的矽酮系黏著劑所形成的黏著劑層的表面粗糙度,若使用一般的塗佈方法,則在塗佈後如上文所述地增大。即使在黏著劑層上積層剝離片並剝離上述剝離片之後,此種表面粗糙度也能夠維持。再者,即使將矽酮系黏著劑的塗佈對象的剝離片從形成於其上的黏著劑層剝離之後,上述的表面粗糙度也能夠維持 。Here, if a general coating method is used, the surface roughness of the adhesive layer formed from the silicone-based adhesive of this embodiment will increase as described above after coating. Such surface roughness can be maintained even after laminating a release sheet on the adhesive layer and peeling off the release sheet. Furthermore, even after the release sheet to which the silicone-based adhesive is applied is peeled off from the adhesive layer formed thereon, the above-mentioned surface roughness can be maintained.
本實施形態的矽酮系黏著劑,具體而言,含有矽酮系黏著主劑與修飾化環糊精。The silicone-based adhesive according to this embodiment specifically contains a silicone-based adhesive main agent and modified cyclodextrin.
1.矽酮系黏著主劑 本實施形態的矽酮系黏著主劑,可以是縮合型矽酮黏著劑,也可以是加成反應型矽酮黏著劑,從與修飾化環糊精的相容性、加工性等的觀點考慮,以加成反應型矽酮黏著劑為佳。 1. Silicone adhesive agent The silicone adhesive main agent in this embodiment may be a condensation type silicone adhesive or an addition reaction type silicone adhesive, from the viewpoint of compatibility with modified cyclodextrin, processability, etc. , the addition reaction type silicone adhesive is preferred.
加成反應型矽酮黏著劑,較佳為含有由在一個分子具有至少兩個烯基的第一聚二甲基矽氧烷以及在一個分子具有至少兩個氫化矽烷基的第二聚二甲基矽氧烷所得到的加成反應型矽酮樹脂、與矽酮樹脂 。The addition reaction type silicone adhesive preferably contains a first polydimethylsiloxane having at least two alkenyl groups in one molecule and a second polydimethylsiloxane having at least two hydrogenated silyl groups in one molecule. Addition reaction type silicone resin and silicone resin obtained from siloxane.
作為第一聚二甲基矽氧烷中所含的烯基,可以列舉,例如,乙烯基、烯丙基、丙烯基、丁烯基、戊烯基、己烯基、庚烯基、辛烯基等的一價烴基,其中以乙烯基為特佳。Examples of the alkenyl group contained in the first polydimethylsiloxane include vinyl, allyl, propenyl, butenyl, pentenyl, hexenyl, heptenyl, and octene. Monovalent hydrocarbon groups such as vinyl groups, among which vinyl groups are particularly preferred.
在第一聚二甲基矽氧烷中的烯基含量(相對於鍵結到矽原子的甲基的數量的烯基的數量的比例),以0.005~0.1莫耳%為佳,特別是以0.01~0.05莫耳%為佳。烯基以存在於分子鏈的兩末端為佳,也可以存在於側鏈。第一聚二甲基矽氧烷的一個分子中至少包含兩個烯基,進一步而言,若烯基的含量為上述範圍,則能夠形成交聯密度高的交聯結構,且能夠得到黏著力與剝離片的剝離性之間的平衡優異的黏著劑層。The alkenyl group content (the ratio of the number of alkenyl groups relative to the number of methyl groups bonded to silicon atoms) in the first polydimethylsiloxane is preferably 0.005 to 0.1 mol%, especially 0.01~0.05 mol% is preferred. The alkenyl group preferably exists at both ends of the molecular chain, but may also exist in the side chain. One molecule of the first polydimethylsiloxane contains at least two alkenyl groups. Furthermore, if the content of the alkenyl groups is within the above range, a cross-linked structure with high cross-link density can be formed and adhesive force can be obtained. An adhesive layer with an excellent balance between peelability and peelability.
第一聚二甲基矽氧烷的聚合度(矽氧烷鍵結的數量),以200~5,000為佳,特別是以500~3,000為佳。再者,在第二聚二甲基矽氧烷中的氫化矽烷基的含量,在一個分子中以2~300個為佳,特別是以4~200個為佳。第二聚二甲基矽氧烷的聚合度,以50~2,000為佳,特別是以100~1,500為佳。此外,相對於第一聚二甲基矽氧烷100質量份的第二聚二甲基矽氧烷的調配比,以0.01~20質量份為佳,特別是以0.1~10質量份為佳。若各官能基的含量以及相對於第一聚二甲基矽氧烷的第二聚二甲基矽氧烷的調配比為上述範圍,則第一聚二甲基矽氧烷與第二聚二甲基矽氧烷的加成反應可以良好地進行。The degree of polymerization (number of siloxane bonds) of the first polydimethylsiloxane is preferably 200 to 5,000, especially 500 to 3,000. Furthermore, the content of hydrogenated silyl groups in the second polydimethylsiloxane is preferably 2 to 300 per molecule, particularly preferably 4 to 200. The degree of polymerization of the second polydimethylsiloxane is preferably 50 to 2,000, particularly preferably 100 to 1,500. In addition, the blending ratio of the second polydimethylsiloxane relative to 100 parts by mass of the first polydimethylsiloxane is preferably 0.01 to 20 parts by mass, and particularly preferably 0.1 to 10 parts by mass. If the content of each functional group and the blending ratio of the second polydimethylsiloxane to the first polydimethylsiloxane are within the above range, then the first polydimethylsiloxane and the second polydimethylsiloxane will be The addition reaction of methylsiloxane proceeds favorably.
又,第一聚二甲基矽氧烷以不具有氫化矽烷基為佳,第二聚二甲基矽氧烷以不具有烯基為佳。Moreover, it is preferable that the first polydimethylsiloxane does not have a hydrogenated silyl group, and the second polydimethylsiloxane does not have an alkenyl group.
作為矽酮樹脂,可以使用,例如,由作為單官能矽氧烷單元[(CH 3) 3SiO 1/2]的M單元與作為四官能矽氧烷單元[SiO 4/2]的Q單元所形成的MQ樹脂。 M單元/Q單元的莫耳比,以0.6~1.7為佳。此矽酮樹脂具有對矽酮系黏著劑賦予黏著性的作用。 As the silicone resin, for example, a resin composed of an M unit as a monofunctional siloxane unit [(CH 3 ) 3 SiO 1/2 ] and a Q unit as a tetrafunctional siloxane unit [SiO 4/2 ] can be used. Formed MQ resin. The molar ratio of M unit/Q unit is preferably 0.6 to 1.7. This silicone resin has the function of imparting adhesiveness to the silicone-based adhesive.
相對於加成反應型矽酮樹脂100質量份,矽酮樹脂的調配量,以1~200質量份為佳,以5~120質量份為更佳,特別是以10~80質量份為佳,進一步以20~40質量份為佳。藉此,能夠在黏著力與剝離片的剝離性之間實現良好的平衡。Relative to 100 parts by mass of the addition reaction type silicone resin, the blending amount of the silicone resin is preferably 1 to 200 parts by mass, more preferably 5 to 120 parts by mass, and especially 10 to 80 parts by mass. More preferably, it is 20 to 40 parts by mass. This can achieve a good balance between the adhesive force and the peelability of the release sheet.
上述加成反應型矽酮黏著劑,以含有觸媒為佳。作為觸媒,只要能夠使上述加成反應型矽酮樹脂固化(第一聚二甲基矽氧烷與第二聚二甲基矽氧烷的加成反應)即可,沒有特別限定,其中以鉑族金屬系化合物為佳。作為鉑族金屬系化合物,可以列舉,例如,微粒子狀鉑、吸附在碳粉載體上的微粒子狀鉑、氯鉑酸、醇改質氯鉑酸、氯鉑酸的烯烴錯合物、鈀、銠等。藉由含有此種的觸媒,能夠更有效地進行加成反應型矽酮樹脂的固化反應。The above-mentioned addition reaction type silicone adhesive preferably contains a catalyst. The catalyst is not particularly limited as long as it can cure the addition reaction type silicone resin (addition reaction of the first polydimethylsiloxane and the second polydimethylsiloxane). Among them, Platinum group metal compounds are preferred. Examples of platinum group metal compounds include fine particulate platinum, fine particulate platinum adsorbed on a carbon powder carrier, chloroplatinic acid, alcohol-modified chloroplatinic acid, olefin complexes of chloroplatinic acid, palladium, and rhodium. wait. By containing such a catalyst, the curing reaction of the addition reaction type silicone resin can be performed more efficiently.
相對於上述加成反應型矽酮樹脂100質量份的觸媒的調配量,鉑份以0.01~3質量份為佳,特別是以0.05~2質量份為佳,進一步以0.1~1質量份為佳。藉此,能夠在黏著力與剝離片的剝離性之間實現良好的平衡。The proportion of platinum relative to 100 parts by mass of the catalyst for the addition reaction type silicone resin is preferably 0.01 to 3 parts by mass, particularly 0.05 to 2 parts by mass, and further preferably 0.1 to 1 part by mass. good. This can achieve a good balance between the adhesive force and the peelability of the release sheet.
上述加成反應型矽酮黏著劑,除了上述成分之外,還可以含有交聯劑、反應抑制劑、著色劑、密著改善劑等的各種添加劑。The above-mentioned addition reaction type silicone adhesive may contain, in addition to the above-mentioned components, various additives such as cross-linking agents, reaction inhibitors, colorants, and adhesion improving agents.
2.修飾化環糊精 本實施形態的修飾化環糊精是環糊精的羥基的至少一部分被其他官能基取代。 2. Modified cyclodextrin In the modified cyclodextrin of this embodiment, at least part of the hydroxyl groups of the cyclodextrin is substituted with other functional groups.
一般而言,作為環糊精,已知葡萄糖構成單元為5個以上之物。作為在本實施形態中的修飾化環糊精的骨架的環糊精,可以是葡萄糖構成單元為5個的環糊,可以是葡萄糖構成單元為6個的α-環糊精,可以是葡萄糖構成單元為7個的β-環糊精,也可以是葡萄糖構成單位為8個的γ-環糊精。其中,本實施形態中的修飾化環糊精,從使黏著劑層的表面粗糙度如上述般提高的觀點考慮,以β-環糊精經過修飾化之物(修飾化β-環糊精)及γ-環糊精經過修飾化之物(修飾化γ-環糊精)中的至少一種為佳。Generally, cyclodextrins are known to have five or more glucose structural units. The cyclodextrin as the skeleton of the modified cyclodextrin in this embodiment may be a cyclodextrin having 5 glucose constituent units, an α-cyclodextrin having 6 glucose constituent units, or a cyclodextrin having a glucose constituent unit. β-cyclodextrin with 7 units may also be γ-cyclodextrin with 8 glucose units. Among them, the modified cyclodextrin in this embodiment is a modified β-cyclodextrin (modified β-cyclodextrin) from the viewpoint of improving the surface roughness of the adhesive layer as described above. It is preferable that at least one kind of modified γ-cyclodextrin (modified γ-cyclodextrin) is used.
在本實施形態的修飾化環糊精中,作為修飾環糊精的官能基(羥基被取代的官能基),可以列舉,例如,甲氧基、乙氧基等的烷氧基、乙醯基等的醯基等等。其中,從使黏著劑層的表面粗糙度如上述般提高的觀點考慮,以醯基為佳,特別是以乙醯基為佳。In the modified cyclodextrin of the present embodiment, examples of the functional group of the modified cyclodextrin (functional group in which a hydroxyl group is substituted) include, for example, alkoxy groups such as methoxy group and ethoxy group, and acetyl group. Wait and wait. Among these, from the viewpoint of improving the surface roughness of the adhesive layer as described above, a acyl group is preferred, and an acetyl group is particularly preferred.
在本實施形態中的修飾化環糊精的修飾化度,以大於2.5為佳,特別是以2.7以上為佳,進一步以2.8以上為佳。另一方面,上述修飾化度的上限值,沒有特別限定,可以是3.0以下,特別可以是2.99以下,進一步可以是2.98以下。又,在本說明書中所謂的修飾化環糊精的修飾化度,是指相當於每一個葡萄糖結構單元被其他官能基取代的羥基的數量。因此,如果在一個葡萄糖結構單元中的三個羥基全部被取代,則修飾化度為3.0。The degree of modification of the modified cyclodextrin in this embodiment is preferably greater than 2.5, particularly preferably 2.7 or more, and further preferably 2.8 or more. On the other hand, the upper limit of the degree of modification is not particularly limited, but may be 3.0 or less, particularly 2.99 or less, and further may be 2.98 or less. In addition, the degree of modification of modified cyclodextrin in this specification refers to the number of hydroxyl groups substituted by other functional groups per glucose structural unit. Therefore, if all three hydroxyl groups in one glucose structural unit are substituted, the degree of modification is 3.0.
在本實施形態的矽酮系黏著劑中,修飾化環糊精,可以單獨使用一種,也可以組合使用兩種以上。In the silicone-based adhesive agent of this embodiment, one type of modified cyclodextrin may be used alone, or two or more types may be used in combination.
在本實施形態的矽酮系黏著劑中的修飾化環糊精的含量,以0.1質量%以上為佳,以0.3質量%以上為更佳,特別是以0.5質量%以上為佳,進一步以1質量%以上為佳。藉此,能夠有效地提高黏著劑層的表面粗糙度。再者,在本實施形態的矽酮系黏著劑中的修飾化環糊精的含量,以30質量%以下為佳,以20質量%以下為更佳,特別是以15質量%以下為佳,進一步以10質量%以下為佳。藉此,本實施形態的矽酮系黏著劑容易發揮所期望的黏著力,同時容易發揮所期望的剝離性。The content of modified cyclodextrin in the silicone-based adhesive of this embodiment is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, particularly preferably 0.5% by mass or more, and further preferably 1% by mass or more. Quality % or more is preferred. Thereby, the surface roughness of the adhesive layer can be effectively improved. Furthermore, the content of modified cyclodextrin in the silicone-based adhesive of this embodiment is preferably 30 mass% or less, more preferably 20 mass% or less, and particularly preferably 15 mass% or less. Furthermore, it is preferably 10% by mass or less. Thereby, the silicone-based adhesive agent of this embodiment can easily exhibit a desired adhesive force and also can easily exhibit a desired releasability.
[黏著片]
圖1繪示本發明一實施形態的黏著片1的剖面圖。如圖1所示,本實施形態的黏著片1具備黏著劑層11、積層在黏著劑層11的一側的面上的基材12與積層在黏著劑層11的另一側的面上的剝離片13。
[adhesive sheet]
FIG. 1 shows a cross-sectional view of an adhesive sheet 1 according to an embodiment of the present invention. As shown in FIG. 1 , the adhesive sheet 1 of this embodiment includes an
1.構成要素
(1) 黏著劑層
黏著劑層11由上述實施形態的矽酮系黏著劑所形成。黏著劑層11的厚度,以1~1000 μm為佳,以3~500 μm為更佳,特別是以5~100 μm為佳,進一步以10~50 μm為佳,其中以15~35 μm為佳。藉由使黏著劑層11的厚度成為上述範圍,能夠在黏著力與剝離片13的剝離性之間實現良好的平衡。
1. Components
(1) Adhesive layer
The
黏著劑層11的剝離片13側的表面的算術平均粗糙度(Ra),以4 nm以上為佳,以6 nm以上為更佳,特別是以7 nm以上為佳,進一步以8 nm為佳,其中以9 nm以上為佳。藉此,能夠將剝離片13從黏著劑層11良好地剝離。可以藉由通常方法塗佈上述實施形態的矽酮系黏著劑,而得到如上述那般大的算術平均粗糙度(Ra)。The arithmetic mean roughness (Ra) of the surface of the
再者,黏著劑層11的剝離片13側的表面的算術平均粗糙度(Ra),以100 nm以下為佳,以80 nm以下為佳,特別是以60 nm以下為佳,進一步以40 nm以下為佳,其中以20 nm以下為佳。藉此,使黏著劑層11變得容易發揮所期望的黏著力。又,在本說明書中的黏著劑層的表面的算術平均粗糙度(Ra)的測定方法的細節,如後述的試驗例中所記載。Furthermore, the arithmetic mean roughness (Ra) of the surface of the
(2)基材
作為在本實施形態中的基材12,沒有特別限定,能夠使用作為一般的黏著片的基材所使用的材料。可以列舉,例如,聚對苯二甲酸乙二醇酯、聚對苯二甲酸丁二醇酯、聚萘二甲酸乙二醇酯等的聚酯薄膜、聚胺甲酸乙酯薄膜、聚乙烯薄膜、聚丙烯薄膜、三乙醯纖維素等的纖維素薄膜、聚氯乙烯薄膜、聚偏二氯乙烯薄膜、聚乙烯醇薄膜、乙烯乙酸乙烯酯共聚物薄膜、聚苯乙烯薄膜、聚碳酸酯薄膜、丙烯酸樹脂薄膜、降莰烯樹脂薄膜、環烯烴樹脂薄膜等的塑膠薄膜;由上述的樹脂所形成的塑膠板;使用人造絲、丙烯酸、聚酯等的纖維的織布或不織布;合成紙;高級紙、玻璃紙、浸漬紙、銅版紙等的紙類;鋁、銅等的金屬體;聚胺甲酸乙酯發泡體、聚乙烯發泡體等的發泡體;上述這些的兩種以上的積層板等。
(2)Substrate
The
又,基材12可以是能夠從黏著劑層11剝離之物(例如,剝離片)。在基材12為剝離片的情況下,本實施形態的黏著片1成為後述的雙面黏著片。Moreover, the
基材12的厚度因其種類而異,以5~300 μm為佳,以10~200 μm為更佳,特別是以15~100 μm為佳。The thickness of the
(3)剝離片
作為在本實施形態中的剝離片13,以使用塑膠薄膜為佳。作為塑膠薄膜,可以列舉,例如,聚對苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯等的聚酯,聚丙烯、聚甲基戊烯等的聚烯烴,聚氯乙烯,氯乙烯共聚物,聚乙酸乙烯酯,乙烯乙酸乙烯酯,離子聚合物樹脂,乙烯・(甲基)丙烯酸酯共聚物,聚胺甲酸乙酯,聚苯乙烯,聚碳酸酯,聚醯亞胺,氟樹脂等所形成的塑膠薄膜。這些塑膠薄膜,可以是單層,也可以是相同或不同種類的兩層以上的多層。再者,這些塑膠薄膜可以是單軸延伸或雙軸延伸之物。其中,以聚酯薄膜為佳,特別是以聚對苯二甲酸乙二醇酯薄膜為佳。聚對苯二甲酸乙二醇酯薄膜在加工時、使用時等期間,不易產生塵埃,因此不僅能夠有效地防止因塵埃等而引起的塗佈不良,並且因為價格相對較便宜,而能夠有助於生產成本的降低成本。
(3) Peel-off sheet
In this embodiment, a plastic film is preferably used as the
從能夠從黏著劑層11良好地剝離的觀點考慮,上述塑膠薄膜,以未進行剝離處理的塑膠薄膜為佳。在使用未進行剝離處理的塑膠薄膜的情況下,由於不需要剝離處理,因此可以減少所使用的材料(剝離劑),有助於生產成本的降低成本。特別是,由於可以更不浪費地使用資源,且成為環境友善的技術、生產方法之一,因此能夠有助於永續發展目標(SDGs)的達成。然而,也可以使用除了矽酮系剝離劑之外的剝離劑,例如,能夠使用經過氟系剝離劑進行剝離處理的塑膠薄膜。From the viewpoint of being able to be peeled off from the
剝離片13的厚度,從剝離性、操作性等的觀點考慮,以5~300 μm為佳,以10~200 μm為更佳,特別是以15~100 μm為佳,進一步以20~50 μm為佳。The thickness of the
2.製造方法
本實施形態的黏著片1的製造方法沒有特別限定。作為黏著片1的一個製造例,可以對基材12上塗佈含有上述矽酮系黏著劑及根據需要的稀釋劑的黏著劑塗佈液之後,使其乾燥、固化而形成黏著劑層11。
2. Manufacturing method
The manufacturing method of the adhesive sheet 1 of this embodiment is not specifically limited. As an example of manufacturing the adhesive sheet 1 , an adhesive coating liquid containing the above-mentioned silicone adhesive and a diluent if necessary is applied to the
黏著劑塗佈液的塗佈,可以藉由通常方法進行,例如,可以藉由棒式塗佈法、刮刀塗佈法、 滾軸塗佈法、刀片塗佈法、模具塗佈法、凹版塗佈法而進行。Coating of the adhesive coating liquid can be carried out by common methods, for example, it can be carried out by rod coating, blade coating, roller coating, blade coating, die coating, gravure coating. To spread the law.
作為上述稀釋劑,沒有特別限制,可以使用各式各樣的稀釋劑。可以使用,例如,甲苯、己烷、庚烷等的烴化合物,丙酮,乙酸乙酯,甲基乙基酮,甲基異丁基酮及上述之混合物等。The diluent is not particularly limited, and various diluents can be used. For example, hydrocarbon compounds such as toluene, hexane, and heptane, acetone, ethyl acetate, methyl ethyl ketone, methyl isobutyl ketone, and mixtures thereof can be used.
在矽酮系黏著劑為加成反應型矽酮黏著劑的情況下,較佳為使已塗佈的黏著劑塗佈液熱固化。這種情況下的加熱溫度,以80~180℃為佳,加熱時間,以30~240秒左右為佳。When the silicone adhesive is an addition reaction type silicone adhesive, it is preferable to thermally cure the applied adhesive coating liquid. In this case, the heating temperature is preferably 80 to 180°C, and the heating time is preferably about 30 to 240 seconds.
如上所述地進行而形成黏著劑層11之後,將剝離片13貼合於上述黏著劑層11,而得到黏著片1。After the
即使是藉由如上所述的通常塗佈方法,黏著劑層11的剝離片13側的表面的算術平均粗糙度(Ra)也會增大為4 nm以上。再者,即使是在將剝離片13積層在黏著劑層12上並且將此剝離片13剝離之後,此算術平均粗糙度(Ra)也可以維持。藉由此種將黏著劑層11的表面的算術平均粗糙度(Ra)增大,當將剝離片13從黏著劑層11剝離時,能夠良好地剝離。Even by the normal coating method as described above, the arithmetic mean roughness (Ra) of the surface of the
[雙面黏著片]
圖2繪示本發明的一實施形態的雙面黏著片2的剖面圖。如圖2所示,本實施形態的雙面黏著片2具備黏著劑層11、積層在黏著劑層11的一側的面上的第一剝離片21與積層在黏著劑層11的另一側的面上的第二剝離片22。
[Double-sided adhesive sheet]
FIG. 2 shows a cross-sectional view of the double-sided adhesive sheet 2 according to an embodiment of the present invention. As shown in FIG. 2 , the double-sided adhesive sheet 2 of this embodiment includes an
在本實施形態中,作為一個示範例,將第二剝離片22作為構成黏著劑層11的矽酮系黏著劑的塗佈液所塗佈的對象,並將第一剝離片21作為貼合在所形成的黏著劑層11上之物,但是,本發明不限於此。In this embodiment, as an example, the
1.構成要素
(1) 黏著劑層
黏著劑層11由上述實施形態的矽酮系黏著劑所形成。黏著劑層11的厚度與黏著片1的黏著劑層11的厚度相同。
1. Components
(1) Adhesive layer
The
黏著劑層11的第一剝離片21側的表面的算術平均粗糙度(Ra)與上述黏著片1的剝離片13側的表面的算術平均粗糙度(Ra)相同。藉此,能夠將第一剝離片21從第二剝離片22上的黏著劑層11良好地剝離,且能夠抑制黏連等的剝離不良的發生。The arithmetic mean roughness (Ra) of the surface of the
另一方面,黏著劑層11的第二剝離片22側的表面的算術平均粗糙度(Ra),以4 nm以上為佳,以4.5 nm以上為更佳,特別是以5 nm以上為佳,進一步以5.5 nm以上為佳。藉此,能夠將第二剝離片22從(貼附於被黏著體的)黏著劑層11良好地剝離。On the other hand, the arithmetic mean roughness (Ra) of the surface of the
再者,黏著劑層11的第二剝離片22側的表面的算術平均粗糙度(Ra),以100 nm以下為佳,以80 nm以下為較佳,特別是以60 nm以下為佳,進一步以 40 nm以下為更佳,其中以20 nm以下為佳。藉此,使黏著劑層11變得容易發揮所期望的黏著力。Furthermore, the arithmetic mean roughness (Ra) of the surface of the
在本實施形態的雙面黏著片2中的黏著劑層11,以不具有作為芯材的基材為佳,亦即,本實施形態的雙面黏著片2,以無基材雙面黏著片為佳。無基材雙面黏著片,特別是,最初將剝離片剝離時容易發生黏連的剝離不良,但是,若為本實施形態的雙面黏著片2,則能夠抑制如此的剝離不良的發生。The
(2)第一剝離片及第二剝離片
第一剝離片21及第二剝離片22的材料及厚度與上述的黏著片1的剝離片13相同。
(2) First release sheet and second release sheet
The materials and thickness of the
在本實施形態的雙面黏著片2中,較佳為第二剝離片22對黏著劑層11的剝離力大於第一剝離片21對黏著劑層11的剝離力。藉此,在將第一剝離片21從黏著劑層11剝離時,能夠有效地抑制黏著劑層11受到第一剝離片21的牽引而從第二剝離片22剝離之黏連的發生。將構成黏著劑層11的矽酮系黏著劑的塗佈液塗佈在第二剝離片22上,將第一剝離片21貼合在所形成的黏著劑層11上,藉此能夠如上所述地調整剝離力。In the double-sided adhesive sheet 2 of this embodiment, it is preferable that the peeling force of the
在本實施形態中的第一剝離片21對黏著劑層11的剝離力,以1~200 mN/25mm為佳,以5~150 mN/25mm為更佳,特別是以10~100 mN/25m為佳, 進一步以15~70 mN/25 mm為佳,以20~50 mN/25 mm為最佳。藉此,當首先將第一剝離片21從黏著劑層11剝離時,能夠無問題地容易地將第一剝離片21剝離。再者,能夠防止第一剝離片21非預期的地從黏著劑層11剝離。又,在本說明書中的剝離力測定方法的細節,如後述的試驗例中所記載。In this embodiment, the peeling force of the
在本實施形態中的第二剝離片22對黏著劑層11的剝離力,以5~300 mN/25mm為佳,以10~210 mN/25mm為更佳,特別是以15~110 mN/25mm為更佳,進一步以25~80 mN/25mm為佳,其中以30~60 mN/25mm為佳。藉此,當將第一剝離片21從黏著劑層11剝離時,能夠有效地抑制黏著劑層11從第二剝離片22剝離。再者,能夠無問題地容易地將第二剝離片22從貼附在被黏著體上的黏著劑層11剝離。In this embodiment, the peeling force of the
第一剝離片21與第二剝離片22的剝離力之差,以1~150 mN/25mm為佳,以5~100 mN/25mm為更佳,特別是以7~80 mN/25mm為佳,進一步以10~50 mN/25 mm為佳,以12~30 mN/25 mm為最佳。藉此,能夠不發生黏連等而無問題地將第一剝離片21從黏著劑層11剝離。The difference in peeling force between the
2.雙面黏著片的製造方法
作為本實施形態的雙面黏著片2的一個較佳的製造例,可以在第二剝離片22上塗佈含有上述的矽酮系黏著劑及所期望的稀釋劑的黏著劑塗佈液之後,使其乾燥、固化而形成著劑層11。具體而言,可以與上述黏著片1同樣地進行而形成黏著劑層11。在形成黏著劑層11後,將第一剝離片21貼合於此黏著劑層11,而得到雙面黏著片2。
2. Manufacturing method of double-sided adhesive sheet
As a preferred manufacturing example of the double-sided adhesive sheet 2 of this embodiment, the adhesive coating liquid containing the above-mentioned silicone adhesive and a desired diluent can be applied to the
藉由使用上述的矽酮系黏著劑,即使是利用以往的塗佈方法,黏著劑層11的第一剝離片21側的表面的算術平均粗糙度(Ra)也能夠提高到4 nm以上。再者,即使在將第一剝離片21積層在黏著劑層22上,並且將上述第一剝離片21剝離之後,此算術平均粗糙度(Ra)也可以維持。藉由如此地將黏著劑層11的表面的算術平均粗糙度(Ra)增大,在將第一剝離片21從黏著劑層11剝離時,黏著劑層11不會追隨第一剝離片21而從第二剝離片22剝離,因此能夠抑制黏連等的剝離不良發生。By using the silicone-based adhesive described above, the arithmetic mean roughness (Ra) of the surface of the
[另一實施形態] 本發明的另一實施形態的黏著片至少具有黏著劑層,其中此黏著劑層是由矽酮系黏著劑所形成,並且此黏著劑層的表面的算術平均粗糙度(Ra)為4 nm以上。本實施形態的黏著片,可以是雙面黏著片,也可以是無基材雙面黏著片。 [Another embodiment] An adhesive sheet according to another embodiment of the present invention at least has an adhesive layer, wherein the adhesive layer is formed of a silicone adhesive, and the arithmetic mean roughness (Ra) of the surface of the adhesive layer is 4 nm or more. . The adhesive sheet of this embodiment may be a double-sided adhesive sheet or a double-sided adhesive sheet without a base material.
藉由如此使黏著劑層的表面的算術平均粗糙度(Ra)成為4 nm以上的粗糙度,與積層在此黏著劑層上的剝離片的接觸面積會變小,當將此剝離片從上述黏著劑層剝離時,能夠良好地剝離。亦即,上述黏著劑層不會跟隨・附著此剝離片,而能夠抑制黏連等的剝離不良發生。By setting the arithmetic mean roughness (Ra) of the surface of the adhesive layer to a roughness of 4 nm or more, the contact area with the release sheet laminated on the adhesive layer becomes smaller. When the release sheet is removed from the above-mentioned When the adhesive layer is peeled off, it can be peeled off well. That is, the above-mentioned adhesive layer does not follow or adhere to the peeling sheet, and can prevent peeling defects such as adhesion from occurring.
構成上述黏著劑層的矽酮系黏著劑,以上述實施形態的矽酮系黏著劑為佳,但並不限定於此。The silicone adhesive constituting the adhesive layer is preferably the silicone adhesive of the above embodiment, but is not limited thereto.
上述以外的結構與上述黏著片1或雙面黏著片2相同。The structure other than the above is the same as that of the adhesive sheet 1 or the double-sided adhesive sheet 2 mentioned above.
以上所說明的實施形態是為了更容易理解本發明而記載,並非意圖限定本發明而記載。因此,上述實施形態所揭示的各要素旨在包括屬於本發明的技術範圍的所有設計變更及均等物。The embodiments described above are described for easier understanding of the present invention and are not intended to limit the present invention. Therefore, each element disclosed in the above-mentioned embodiment is intended to include all design changes and equivalents falling within the technical scope of the present invention.
例如,黏著劑層11可以是具有芯材之物。For example, the
又,在本說明書中,當記載「X~Y」(其中X、Y為任意的數字)時,除非另有說明,否則是指「X以上Y以下」的意思,同時亦包含「較佳為比X更大」或「較佳為比Y更小」的意思。再者,當記載「X以上」(其中X為任意的數字)時,除非另有說明,否則包含「較佳為比X更大」的意思;當記載「Y以下」(其中Y為任意的數字)時,除非另有說明,否則包含「較佳為比Y更小」的意思。 [實施例] In addition, in this specification, when "X~Y" (where X and Y are arbitrary numbers) are written, unless otherwise stated, it means "above X and below Y", and also includes "preferably It means "bigger than X" or "preferably smaller than Y". Furthermore, when "X or more" (where X is an arbitrary number) is written, it means "preferably larger than ), unless otherwise stated, it means "preferably smaller than Y". [Example]
在下文中,將藉由實施例更具體地說明本發明,但本發明的範圍並非受到這些實施例所限定。In the following, the present invention will be explained in more detail through examples, but the scope of the present invention is not limited by these examples.
[製備例1] 將β-環糊精(Nacalai Tesque公司製造) 1.8 g及作為觸媒的對甲苯磺酸一水合物47 mg,加入作為溶劑的乙酸異丙烯酯8.5 ml,並在70℃使其反應16小時。減壓蒸餾除去反應溶液,將所得到的固體用10質量%碳酸鈉水溶液洗淨後,用氯仿萃取,藉由丙酮使其再結晶,得到白色固體狀的乙醯化β-環糊精2.5g。 [Preparation Example 1] 1.8 g of β-cyclodextrin (manufactured by Nacalai Tesque) and 47 mg of p-toluenesulfonic acid monohydrate as a catalyst were added to 8.5 ml of isopropylene acetate as a solvent, and the mixture was reacted at 70° C. for 16 hours. The reaction solution was distilled off under reduced pressure, and the obtained solid was washed with 10% by mass sodium carbonate aqueous solution, extracted with chloroform, and recrystallized with acetone to obtain 2.5 g of acetylated β-cyclodextrin as a white solid. .
將所得到的乙醯化β-環糊精的一部分溶解於氘代氯仿中,藉由 1H-NMR (日本電子公司製造,商品名「核磁共振裝置JNM-LA400/WB」)進行分析。分析的結果,藉由在 1H-NMR圖譜中的5.1 ppm附近的源自於葡萄糖環的第1位的碳所連接的質子的波峰與2.1 ppm附近的源自於乙醯基的波峰的積分比,計算得到的修飾化度為2.98。 A part of the obtained acetylated β-cyclodextrin was dissolved in deuterated chloroform, and analyzed by 1 H-NMR (trade name "Nuclear Magnetic Resonance Equipment JNM-LA400/WB" manufactured by JEOL Ltd.). The analysis result is the integration of the peak derived from the proton connected to the first carbon of the glucose ring at around 5.1 ppm in the 1 H-NMR spectrum and the peak derived from the acetyl group at around 2.1 ppm. Ratio, the calculated degree of modification is 2.98.
[製備例2] 將γ-環糊精(Nacalai Tesque公司製造) 2 g及作為觸媒的對甲苯磺酸一水合物47mg,加入作為溶劑的乙酸異丙烯酯8.5 ml,並在70℃使其反應16小時。減壓蒸餾除去反應溶液,將所得到的固體用10質量%碳酸鈉水溶液洗淨後,用氯仿萃取,藉由丙酮使其再結晶,得到白色固體狀的乙醯化γ-環糊精2.5g。 [Preparation Example 2] 2 g of γ-cyclodextrin (manufactured by Nacalai Tesque) and 47 mg of p-toluenesulfonic acid monohydrate as a catalyst were added to 8.5 ml of isopropylene acetate as a solvent, and the mixture was reacted at 70° C. for 16 hours. The reaction solution was distilled off under reduced pressure, and the obtained solid was washed with 10% by mass sodium carbonate aqueous solution, extracted with chloroform, and recrystallized with acetone to obtain 2.5 g of acetylated γ-cyclodextrin as a white solid. .
將所得到的乙醯化γ-環糊精的一部分溶解於氘代氯仿中,藉由 1H-NMR (日本電子公司製造,商品名「核磁共振裝置JNM-LA400/WB」)進行分析。分析的結果,藉由在 1H-NMR圖譜中的5.1 ppm附近的源自於葡萄糖環的第1位的碳所連接的質子的波峰與2.1 ppm附近的源自於乙醯基的波峰的積分比,計算得到的修飾化度為2.97。 A part of the obtained acetylated γ-cyclodextrin was dissolved in deuterated chloroform, and analyzed by 1 H-NMR (trade name "Nuclear Magnetic Resonance Equipment JNM-LA400/WB" manufactured by JEOL Ltd.). The analysis result is the integration of the peak derived from the proton connected to the first carbon of the glucose ring at around 5.1 ppm in the 1 H-NMR spectrum and the peak derived from the acetyl group at around 2.1 ppm. Ratio, the calculated degree of modification is 2.97.
[實施例1] 1.黏著劑塗佈液的製備 將加成反應型矽酮樹脂(信越化學股份公司製造,「KS-847H」) 100質量份(固體成分換算;以下亦相同)、矽酮樹脂(Dow Corning・Toray公司製造,「SD- 4584」) 30質量份、鉑觸媒(Dow Corning・Toray公司製造,「SRX 212 CATALYST」) 0.5質量份、在製備例2中所製備的乙醯化γ-環糊精3質量份與作為稀釋劑的甲基乙基酮混合,將此作為黏著劑塗佈液。 [Example 1] 1. Preparation of adhesive coating liquid Add 100 parts by mass of addition reaction type silicone resin (manufactured by Shin-Etsu Chemical Co., Ltd., "KS-847H") (solid content conversion; the same applies below), silicone resin (manufactured by Dow Corning Toray Co., Ltd., "SD-4584") ) 30 parts by mass, 0.5 parts by mass of platinum catalyst (manufactured by Dow Corning Toray Co., Ltd., "SRX 212 CATALYST"), 3 parts by mass of acetylated γ-cyclodextrin prepared in Preparation Example 2 and diluent Mix methyl ethyl ketone and use this as an adhesive coating liquid.
2.雙面黏著片的製造 將在上述步驟1所得到的黏著劑塗佈液,利用刮刀塗佈機塗佈到作為第二剝離片的聚對苯二甲酸乙二醇酯薄膜(三菱化學公司製造,產品名「DIAFOIL T100-50S」,厚度50 μm)的一面上。然後,在120℃下對塗佈層進行加熱處理2分鐘,而形成厚度25 μm的塗佈層。 2. Manufacturing of double-sided adhesive sheets The adhesive coating liquid obtained in step 1 above was applied to a polyethylene terephthalate film (manufactured by Mitsubishi Chemical Corporation, product name "DIAFOIL T100- 50S", thickness 50 μm) on one side. Then, the coating layer was heat-treated at 120° C. for 2 minutes to form a coating layer with a thickness of 25 μm.
之後,將上述所得到的第二剝離片上的黏著劑層與作為第一剝離片的聚對苯二甲酸乙二醇酯薄膜(三菱化學公司製造,產品名「DIAFOIL T100-50S」,厚度50 μm)貼合,藉此製造具有厚度25 μm的黏著劑層的雙面黏著片,亦即,由第一剝離片/黏著劑層(厚度:25 μm)/第二剝離片的結構所形成的無基材雙面黏著片。又,黏著劑層的厚度,是根據JIS K7130,使用定壓厚度測定器(Teclock公司製造,產品名「PG-02」)所測定的值。After that, the adhesive layer on the second release sheet obtained above was combined with a polyethylene terephthalate film (manufactured by Mitsubishi Chemical Corporation, product name "DIAFOIL T100-50S", thickness 50 μm) as the first release sheet. ), thereby manufacturing a double-sided adhesive sheet with an adhesive layer of thickness 25 μm, that is, a seamless adhesive sheet formed by the structure of the first release sheet/adhesive layer (thickness: 25 μm)/the second release sheet. The base material is double-sided adhesive sheet. In addition, the thickness of the adhesive layer is a value measured using a constant pressure thickness measuring device (manufactured by Teclock Corporation, product name "PG-02") in accordance with JIS K7130.
[實施例2~3、比較例1] 根據表1所示而變更黏著劑塗佈液的構成成分的種類及調配量,除此之外,以與實施例1相同的方式製造無基材雙面黏著片。 [Examples 2 to 3, Comparative Example 1] A base-less double-sided adhesive sheet was produced in the same manner as in Example 1 except that the types and amounts of components of the adhesive coating liquid were changed as shown in Table 1.
[參考例1] 作為第一剝離片,使用在聚對苯二甲酸乙二醇酯薄膜的一面經過矽酮系剝離劑進行剝離處理的剝離片(琳得科公司製造,產品名「SP-PET751130」),將此第一剝離片的剝離處理面貼合到第二剝離片上的黏著劑層,除此之外,以與實施例1相同的方式製造無基材雙面黏著片。 [Reference example 1] As the first release sheet, a release sheet in which one side of a polyethylene terephthalate film was peeled off with a silicone-based release agent (product name "SP-PET751130" manufactured by Lintec Corporation) was used. A substrate-free double-sided adhesive sheet was produced in the same manner as in Example 1, except that the release-treated surface of the first release sheet was bonded to the adhesive layer on the second release sheet.
[試驗例1] (表面粗糙度的測定) 使用雙面膠帶將在實施例、比較例及參考例中所製造的無基材雙面黏著片的第二剝離片側固定在玻璃板上。之後,將第一剝離片從無基材雙面黏著片剝離,針對所露出的黏著劑層的表面(第一剝離片側),使用光學干涉式表面形狀觀察裝置(日本Veeco公司製造,產品名稱「NT1100」),在PSI模式下以50倍率進行觀察,並測定算術平均粗糙度(Ra) (nm)。此時,從表面形狀圖像中取得10處的120 μm × 120 μm的範圍的圖像,在各個圖像中測定算術平均粗糙度(Ra) (nm),將這些數值的平均值作為算術平均粗糙度(Ra) (nm)。結果顯示於表2。 [Test Example 1] (Measurement of surface roughness) The second release sheet side of the base-less double-sided adhesive sheet produced in Examples, Comparative Examples, and Reference Examples was fixed to the glass plate using double-sided tape. After that, the first release sheet is peeled off from the base-material-free double-sided adhesive sheet, and an optical interference type surface shape observation device (manufactured by Veeco Japan, product name " NT1100"), observe in PSI mode at 50 times magnification, and measure the arithmetic mean roughness (Ra) (nm). At this time, 10 images in the range of 120 μm × 120 μm were obtained from the surface shape image, the arithmetic mean roughness (Ra) (nm) was measured in each image, and the average of these values was regarded as the arithmetic mean. Roughness (Ra) (nm). The results are shown in Table 2.
再者,針對黏著劑層的第二剝離片側的表面的算術平均粗糙度(Ra) (nm),也以與上述相同的方式進行測定。結果顯示於表2。In addition, the arithmetic mean roughness (Ra) (nm) of the surface of the adhesive layer on the second release sheet side was also measured in the same manner as above. The results are shown in Table 2.
[試驗例2] (剝離力的測定) 將在實施例、比較例及參考例中所製造的無基材雙面黏著片裁切成25 mm寬、100 mm長。之後,將第二剝離片剝離,並將露出的黏著劑層貼合於無鹼玻璃(康寧公司製造,產品名「Eagle XG」),而得到測定樣品。 [Test Example 2] (Measurement of Peeling Force) The substrate-free double-sided adhesive sheet produced in the Examples, Comparative Examples and Reference Examples was cut into a width of 25 mm and a length of 100 mm. Thereafter, the second release sheet was peeled off, and the exposed adhesive layer was bonded to alkali-free glass (product name "Eagle XG" manufactured by Corning Incorporated) to obtain a measurement sample.
針對所得到的測定樣品,使用拉伸試驗機(Orientec公司製造,產品名「TENSILON 」) ,在剝離速度300 mm/min、剝離角度180度的條件下將第一剝離片從黏著劑層剝離,測定第一剝離片的剝離力(N/25mm)。上述以外的測定條件是根據JIS Z0237:2009而進行測定。結果顯示於表2。又,在參考例1中,第一剝離片與黏著劑層之間的密著性強,以致於黏著劑層與無鹼玻璃之間發生剝離,而無法測定第一剝離片與黏著劑層之間的剝離力。For the obtained measurement sample, a tensile testing machine (manufactured by Orientec, product name "TENSILON") was used to peel the first peeling sheet from the adhesive layer at a peeling speed of 300 mm/min and a peeling angle of 180 degrees. The peeling force (N/25mm) of the first peeling sheet was measured. Measurement conditions other than the above are measured in accordance with JIS Z0237:2009. The results are shown in Table 2. Furthermore, in Reference Example 1, the adhesion between the first peeling sheet and the adhesive layer was so strong that peeling occurred between the adhesive layer and the alkali-free glass, and the relationship between the first peeling sheet and the adhesive layer could not be measured. the peeling force between them.
再者,針對第二剝離片的剝離力(mN/25mm),也以與上述相同的方式進行測定。結果顯示於表2。又,在比較例1中,第二剝離片與黏著劑層之間的密著性強,以致於黏著劑層與無鹼玻璃之間發生剝離,而無法測定第二剝離片與黏著劑層之間的剝離力。In addition, the peeling force (mN/25mm) of the 2nd peeling sheet was also measured in the same manner as above. The results are shown in Table 2. Furthermore, in Comparative Example 1, the adhesion between the second peeling sheet and the adhesive layer was so strong that peeling occurred between the adhesive layer and the alkali-free glass, and the relationship between the second peeling sheet and the adhesive layer could not be measured. the peeling force between them.
[試驗例3] (轉印性的評價) 藉由溶液聚合法使丙烯酸正丁酯99質量份及丙烯酸4-羥基丁酯1質量份共聚合,製備丙烯酸酯聚合物(重量平均分子量:150萬)。 [Test Example 3] (Evaluation of Transferability) 99 parts by mass of n-butyl acrylate and 1 part by mass of 4-hydroxybutyl acrylate were copolymerized by a solution polymerization method to prepare an acrylate polymer (weight average molecular weight: 1.5 million).
上述重量平均分子量(Mw),是使用凝膠滲透層析法(GPC)在以下條件下測定(GPC測定)的聚苯乙烯換算的重量平均分子量。 <測定條件> ・GPC測定裝置:東曹公司製造,HLC-8020 ・GPC管柱(按以下順序通過):東曹公司製造 TSK guard column HXL-H TSK gel GMHXL (x 2) TSK gel G2000HXL ・測定溶劑:四氫呋喃 ・測定溫度:40℃ The weight average molecular weight (Mw) mentioned above is a weight average molecular weight in terms of polystyrene measured using gel permeation chromatography (GPC) under the following conditions (GPC measurement). <Measurement conditions> ・GPC measurement device: Made by Tosoh Corporation, HLC-8020 ・GPC string (passed in the following order): manufactured by Tosoh Corporation TSK guard column HXL-H TSK gel GMHXL (x 2) TSK gel G2000HXL ・Measurement solvent: Tetrahydrofuran ・Measuring temperature: 40℃
將在上述所得到的(甲基)丙烯酸酯聚合物100質量份(固體成分換算值,以下亦相同)與作為交聯劑(B)的三羥甲基丙烷改質伸苯二甲基二異氰酸酯(綜研化學公司製造,商品名「TD-75」) 0.2質量份混合,充分攪拌,用甲基乙基酮稀釋,藉此得到丙烯酸系黏著劑塗佈液。100 parts by mass of the (meth)acrylate polymer obtained above (solid content conversion value, the same applies below) was mixed with trimethylolpropane-modified polypylenedimethyl diisocyanate as the cross-linking agent (B). (manufactured by Soken Chemical Co., Ltd., trade name "TD-75") 0.2 parts by mass was mixed, thoroughly stirred, and diluted with methyl ethyl ketone to obtain an acrylic adhesive coating liquid.
將所得到的丙烯酸系黏著劑塗佈液塗佈在玻璃板上之後,在130℃下加熱處理1分鐘,形成厚度25 μm的丙烯酸系黏著劑層。The obtained acrylic adhesive coating liquid was applied to a glass plate and then heat-treated at 130° C. for 1 minute to form an acrylic adhesive layer with a thickness of 25 μm.
將第二剝離片從在實施例、比較例及參考例中所製造的無基材雙面黏著片剝離,將露出的黏著劑層(矽酮黏著劑層)貼合至上述的丙烯酸黏著劑層。之後,在室溫下靜置24小時,並將其作為樣品。The second peeling sheet was peeled off from the base-less double-sided adhesive sheet produced in the Examples, Comparative Examples and Reference Examples, and the exposed adhesive layer (silicone adhesive layer) was bonded to the above-mentioned acrylic adhesive layer. . After that, it was left to stand at room temperature for 24 hours and used as a sample.
使用拉伸試驗機(Orientec公司製造,產品名「TENSILON 」) ,在剝離速度300 mm/min、剝離角度90度的條件下,將第一剝離片從上述樣品的矽酮黏著劑層剝離。此時,將可以維持矽酮黏著劑層轉印到丙烯酸系黏著劑層的狀態且毫無問題地剝離第一剝離片者,評價為轉印性良好(○);矽酮黏著劑層與第一剝離片一起從丙烯酸系黏著劑層剝離者,評價為轉印性不良(×)。 結果顯示於表2。A tensile testing machine (manufactured by Orientec, product name "TENSILON") was used to peel the first peeling piece from the silicone adhesive layer of the above sample at a peeling speed of 300 mm/min and a peeling angle of 90 degrees. At this time, if the state of the silicone adhesive layer being transferred to the acrylic adhesive layer can be maintained and the first release sheet can be peeled off without any problem, the transferability is evaluated as good (○); If a peeling sheet is peeled off from the acrylic adhesive layer at the same time, it is evaluated as poor transferability (×). The results are shown in Table 2.
[表1]
[表2]
由表2可知,在實施例中所製造的無基材雙面黏著片,黏著劑層(矽酮黏著劑層)的轉印性良好,由聚對苯二甲酸乙二醇酯薄膜所形成的剝離片的剝離性優異。 [產業利用性] As can be seen from Table 2, the substrate-free double-sided adhesive sheet produced in the Example has good transferability of the adhesive layer (silicone adhesive layer), and the adhesive layer formed of polyethylene terephthalate film The release sheet has excellent releasability. [Industrial Applicability]
本發明的矽酮系黏著劑、黏著片及雙面黏著片,適合用於貼合,例如,在曲面顯示器・曲面玻璃・功能性/裝飾薄膜等等的部件。The silicone adhesive, adhesive sheet and double-sided adhesive sheet of the present invention are suitable for lamination, for example, in curved displays, curved glass, functional/decorative films, etc.
1:黏著片 11:黏著劑層 12:基材 13:剝離片 2:雙面黏著片 21:第一剝離片 22:第二剝離片 1: Adhesive sheet 11: Adhesive layer 12:Substrate 13: peel off piece 2:Double-sided adhesive sheet 21: First peeling piece 22: Second peeling piece
[圖1]是本發明一實施形態的黏著片的剖面圖。 [圖2]是本發明一實施形態的雙面黏著片的剖面圖。 [Fig. 1] is a cross-sectional view of an adhesive sheet according to an embodiment of the present invention. [Fig. 2] is a cross-sectional view of a double-sided adhesive sheet according to an embodiment of the present invention.
1:黏著片 1: Adhesive sheet
11:黏著劑層 11: Adhesive layer
12:基材 12:Substrate
13:剝離片 13: peel off piece
Claims (9)
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JP2021214736 | 2021-12-28 | ||
JP2021-214736 | 2021-12-28 |
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TW111138778A TW202334352A (en) | 2021-12-28 | 2022-10-13 | Silicone adhesive, adhesive sheet and double-sided adhesive sheet |
Country Status (2)
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TW (1) | TW202334352A (en) |
WO (1) | WO2023127219A1 (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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DE4009621A1 (en) * | 1990-03-26 | 1991-10-02 | Henkel Kgaa | (ALPHA) -CYANACRYLATE ADHESIVE COMPOSITIONS |
DE4414128A1 (en) * | 1994-04-22 | 1995-10-26 | Consortium Elektrochem Ind | Partially acylated beta-cyclodextrins |
SE0303179D0 (en) * | 2003-11-26 | 2003-11-26 | Astrazeneca Ab | Novel compounds |
WO2015151224A1 (en) * | 2014-03-31 | 2015-10-08 | リンテック株式会社 | Adhesive composition, adhesive, and adhesive sheet |
JP6646083B2 (en) * | 2018-02-07 | 2020-02-14 | リンテック株式会社 | Adhesive sheet |
JP6676706B2 (en) * | 2018-06-26 | 2020-04-08 | リンテック株式会社 | Adhesive sheet |
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2022
- 2022-10-04 WO PCT/JP2022/037115 patent/WO2023127219A1/en unknown
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