TW201923006A - Adhesive sheet capable of maintaining the re-workability and further increasing the adhesive force subsequently - Google Patents

Adhesive sheet capable of maintaining the re-workability and further increasing the adhesive force subsequently Download PDF

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TW201923006A
TW201923006A TW107119769A TW107119769A TW201923006A TW 201923006 A TW201923006 A TW 201923006A TW 107119769 A TW107119769 A TW 107119769A TW 107119769 A TW107119769 A TW 107119769A TW 201923006 A TW201923006 A TW 201923006A
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adhesive
polymer
weight
meth
adhesive sheet
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TWI741191B (en
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仲野武史
鈴木立也
佐佐木翔悟
家田博基
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日商日東電工股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062Copolymers with monomers not covered by C09J133/06
    • C09J133/066Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/25Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255Polyesters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385Acrylic polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2451/00Presence of graft polymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2467/00Presence of polyester
    • C09J2467/006Presence of polyester in the substrate

Abstract

The present invention provides an adhesive sheet, which is capable of maintaining the re-workability and further increasing the adhesive force subsequently even when a temperature of about 50 DEG C is applied at an initial stage of being attached to an adhered object. The present invention provides an adhesive sheet including an adhesive layer. The adhesive layer includes a polymer A and a polymer B serving as a copolymer of a monomer having a polyorganosiloxane skeleton and a (meth)acrylic monomer. The glass transition temperature Tml of the composition of the polymer B based on the composition of the (meth)acrylic monomer is 50 DEG C or more and 100 DEG C or less. The adhesive force N80 of the adhesive sheet, heated at 80 DEG C for 5 minutes after attachment, is 5 times or more than the adhesive force N50 of the adhesive sheet, laid aside at 50 DEG C for 30 minutes after attachment.

Description

黏著片材Adhesive sheet

本發明係關於一種黏著片材。 本申請案係主張基於2017年11月20日提出申請之日本專利申請案2017-222778號之優先權,且該申請案之全部內容作為參照組入至本說明書中。The present invention relates to an adhesive sheet. The present application claims priority to Japanese Patent Application No. 2017-222778, filed on Nov. 20, 2011, the entire content of which is hereby incorporated by reference.

黏著片材係藉由牢固地接著於被黏著體,而以被黏著體彼此之接著、物品對被黏著體之固定、被黏著體之補強等為目的而使用。先前,出於此種目的,使用有自貼附初期起發揮較高之黏著力之黏著片材。又,近來,如專利文獻1~3所示,提出有一種可於貼附於被黏著體之初期顯示出較低之黏著力且其後使黏著力大幅地上升之黏著片材。根據具有此種特性之黏著片材,可於黏著力上升前發揮對於抑制因黏著片材之貼錯或貼壞所導致之良率降低有用之重貼性(二次加工性),且於黏著力上升後發揮適於黏著片材之原本之使用目的之強黏著性。 [先前技術文獻] [專利文獻]The adhesive sheet is used for the purpose of adhering to the adherends, fixing the articles to the adherends, reinforcing the adherends, and the like by firmly adhering to the adherends. Previously, for this purpose, an adhesive sheet having a high adhesion from the initial stage of attachment was used. Further, as disclosed in Patent Documents 1 to 3, there has been proposed an adhesive sheet which can exhibit a low adhesive force at the initial stage of adhering to the adherend and then greatly increase the adhesive force. According to the adhesive sheet having such a characteristic, it is possible to exhibit a reproducibility (secondary workability) for suppressing a decrease in yield due to mislabeling or sticking of the adhesive sheet before the adhesion is increased, and to adhere thereto. When the force rises, it exerts a strong adhesiveness suitable for the original purpose of use of the adhesive sheet. [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本專利申請案公開2014-224227號公報 [專利文獻2]日本專利第5890596號公報 [專利文獻3]日本專利第5951153號公報[Patent Document 1] Japanese Patent Application Laid-Open No. Hei. No. Hei. No. 5,915, 596.

[發明所欲解決之問題][The problem that the invention wants to solve]

然,根據黏著片材之使用態樣,於貼附後,於進行至後續步驟後,因判斷貼錯或貼壞、或由後續步驟之影響所產生之位置偏移等而可能有產生二次加工之要求之情況。於此種情形時,於對貼附於被黏著體之黏著片材要求二次加工性之期間內,例如因伴隨製造製程所使用之裝置(搬送裝置、檢查裝置、其他各種處理裝置等)之作動之發熱之影響、或自接近之裝置之排熱、製造環境之溫度上升等偶發性之因素,而可能有對上述黏著片材施加40℃~50℃左右之溫度之情況。因此,本發明之目的在於提供一種黏著片材,其即便於貼附於被黏著體之初期施加50℃左右之溫度,亦可維持二次加工性,且其後使黏著力大幅地上升。 [解決問題之技術手段]However, depending on the use of the adhesive sheet, after the attachment, after proceeding to the subsequent step, there may be a second occurrence due to the judgment of the mislabeling or sticking, or the positional shift caused by the influence of the subsequent steps. The requirements for processing. In such a case, during the period in which the adhesive sheet attached to the adherend is required to have secondary workability, for example, a device (transporting device, inspection device, various other processing devices, etc.) used in the manufacturing process is used. The effect of the heat generated by the action, the heat generation of the device close to the device, and the rise in the temperature of the manufacturing environment may cause a temperature of about 40 ° C to 50 ° C to be applied to the adhesive sheet. Accordingly, an object of the present invention is to provide an adhesive sheet which can maintain secondary workability even when a temperature of about 50 ° C is applied to the initial stage of the adherend, and thereafter the adhesive force is greatly increased. [Technical means to solve the problem]

根據本說明書,提供一種包含黏著劑層之黏著片材。上述黏著劑層含有聚合物A、及作為具有聚有機矽氧烷骨架之單體與(甲基)丙烯酸系單體之共聚物的聚合物B。上述聚合物B之基於上述(甲基)丙烯酸系單體之組成的玻璃轉移溫度Tm1 為50℃以上且100℃以下。上述黏著片材於貼合於不鏽鋼板後於80℃下加熱5分鐘後之黏著力N80 為於貼合於不鏽鋼板後於50℃下保持30分鐘後之黏著力N50 的5倍以上。According to the present specification, an adhesive sheet comprising an adhesive layer is provided. The pressure-sensitive adhesive layer contains a polymer A and a polymer B as a copolymer of a monomer having a polyorganosiloxane chain and a (meth)acrylic monomer. The glass transition temperature T m1 of the polymer B based on the composition of the (meth)acrylic monomer is 50° C. or higher and 100° C. or lower. After the adhesive sheet was bonded to a stainless steel plate and heated at 80 ° C for 5 minutes, the adhesive force N 80 was 5 times or more of the adhesive force N 50 after being adhered to the stainless steel plate and kept at 50 ° C for 30 minutes.

該構成之黏著片材藉由含有玻璃轉移溫度Tm1 為50℃以上且100℃以下之聚合物B,可使黏著力N80 (以下亦稱為「加熱後黏著力」)相對於黏著力N50 提高至5倍以上(即,N80 /N50 ≧5)。藉此,於在貼附初期可能施加50℃左右之溫度之使用態樣中亦可顯示出良好之二次加工性,且藉由其後之加熱等而使黏著力大幅地上升。The adhesive sheet of this configuration can have an adhesive force N 80 (hereinafter also referred to as "post-heating adhesive force") with respect to the adhesive force N by containing the polymer B having a glass transition temperature T m1 of 50 ° C or more and 100 ° C or less. 50 is increased by more than 5 times (ie, N 80 /N 50 ≧ 5). Thereby, it is possible to exhibit good secondary workability in a use form in which a temperature of about 50 ° C may be applied in the initial stage of attachment, and the adhesion is greatly increased by heating or the like thereafter.

關於若干種態樣之黏著片材,上述黏著力N50 與貼合於不鏽鋼板後於23℃下放置30分鐘後之黏著力N23 之關係滿足下式:(N50 /N23 )<10。根據此種黏著片材,由於在貼附初期維持為室溫之情形與暴露於50℃左右為止之溫度之情形時之黏著力(進而二次加工性)之差異較小,故而就作業性或步驟管理之容易性之觀點而言較佳。With respect to a plurality of kinds of adhesive sheets, the adhesive force N 50 and the adhesive force N 23 after being placed at 23 ° C for 30 minutes after being attached to a stainless steel sheet satisfy the following formula: (N 50 /N 23 ) <10 . According to such an adhesive sheet, since the difference in adhesion (and thus secondary workability) when the temperature is maintained at room temperature at the initial stage of attachment and the temperature at about 50 ° C is small, workability or It is preferable from the viewpoint of ease of step management.

於若干種態樣中,上述聚合物A之玻璃轉移溫度TA 例如可為-80℃以上且未達0℃。此處所揭示之黏著片材可使用具有此種玻璃轉移溫度TA 之聚合物A而良好地實施。In some aspects, the glass transition temperature T A of the above polymer A may be, for example, -80 ° C or more and less than 0 ° C. The adhesive sheet disclosed herein can be suitably used using the polymer A having such a glass transition temperature T A .

於若干種態樣中,上述聚合物B之玻璃轉移溫度TB 例如可為-10℃以上且10℃以下。此處所揭示之黏著片材可使用具有此種玻璃轉移溫度TB 之聚合物B而良好地實施。In some aspects, the glass transition temperature T B of the above polymer B may be, for example, -10 ° C or more and 10 ° C or less. The adhesive sheet disclosed herein can be suitably used using the polymer B having such a glass transition temperature T B .

於若干種態樣中,上述聚合物B中之均聚物之玻璃轉移溫度高於170℃之單體之共聚比率可為30重量%以下。此處所揭示之黏著片材可使用此種共聚組成之聚合物B而良好地實施。In some embodiments, the copolymerization ratio of the monomer having a glass transition temperature of more than 170 ° C in the above polymer B may be 30% by weight or less. The adhesive sheet disclosed herein can be suitably used using the polymer B of such a copolymer composition.

於若干種態樣中,上述黏著劑層可含有相對於100重量份上述聚合物A為多於0重量份且10重量份以下之交聯劑。藉由使用交聯劑,可於50℃左右為止之溫度區域有效地調節貼附初期之黏著力。藉此,有容易獲得良好地兼顧貼附初期之二次加工性與黏著力上升後之強黏著性之黏著片材之傾向。In some aspects, the above adhesive layer may contain more than 0 parts by weight and 10 parts by weight or less of a crosslinking agent with respect to 100 parts by weight of the above polymer A. By using a crosslinking agent, the adhesion in the initial stage of attachment can be effectively adjusted in a temperature range of about 50 °C. As a result, there is a tendency to easily obtain an adhesive sheet which is excellent in both the secondary workability at the initial stage of attachment and the strong adhesiveness after the adhesion is increased.

於若干種態樣中,作為上述聚合物B,可良好地使用重量平均分子量(Mw)為10000以上且50000以下者。根據Mw處於上述範圍之聚合物B,容易獲得貼附初期之黏著力較低且加熱後黏著力較高之黏著片材。In the above-described polymer B, the weight average molecular weight (Mw) of 10,000 or more and 50,000 or less can be favorably used as the polymer B. According to the polymer B having the Mw in the above range, it is easy to obtain an adhesive sheet having a low adhesive strength at the initial stage of attachment and a high adhesive force after heating.

於若干種態樣中,上述黏著劑層中之上述聚合物B之含量可設為相對於100重量份上述聚合物A為0.05重量份以上且20重量份以下之範圍。根據上述範圍之含量,容易獲得貼附初期之黏著力較低且加熱後黏著力較高之黏著片材。In some aspects, the content of the polymer B in the adhesive layer may be in the range of 0.05 part by weight or more and 20 parts by weight or less based on 100 parts by weight of the polymer A. According to the content of the above range, it is easy to obtain an adhesive sheet having a low adhesive strength at the initial stage of attachment and a high adhesive force after heating.

此處所揭示之黏著片材可以具備具有第一面及第二面之支持基材且於該支持基材之至少上述第一面積層有上述黏著劑層之形態、即附基材之黏著片材之形態實施。此種附基材之黏著片材可成為操作性或加工性良好者。作為上述支持基材,例如可良好地採用厚度為30 μm以上者。The adhesive sheet disclosed herein may be provided with a support substrate having a first surface and a second surface, and at least the first surface layer of the support substrate has the adhesive layer, that is, an adhesive sheet attached to the substrate. The form is implemented. Such an adhesive sheet with a substrate can be excellent in workability or workability. As the support substrate, for example, a thickness of 30 μm or more can be favorably used.

再者,將上述各要素適當組合者亦可包含於藉由本日本專利申請案要求專利保護之發明之範圍內。Furthermore, the appropriate combination of the above-mentioned elements may be included in the scope of the invention claimed by the Japanese Patent Application.

以下,對本發明之較佳實施形態進行說明。關於本說明書中特別言及之事項以外且本發明之實施所需要之事項,業者可基於本說明書所記載之關於發明之實施之指示及申請時之技術常識而理解。本發明可基於本說明書所揭示之內容及該領域之技術常識而實施。 再者,於以下之圖式中,有對發揮相同作用之構件、部位標註相同符號進行說明之情況,有省略或簡化重複之說明之情況。又,圖式所記載之實施形態係為了清楚地說明本發明而模式化,未必準確地表示出實際提供之製品之尺寸或比例尺。Hereinafter, preferred embodiments of the present invention will be described. The matters necessary for the implementation of the present invention other than those specifically mentioned in the present specification can be understood based on the instructions for the implementation of the invention and the technical common sense at the time of application. The present invention can be implemented based on the contents disclosed in the present specification and the technical common sense in the field. In the following description, members and portions that perform the same functions are denoted by the same reference numerals, and the description thereof will be omitted or simplified. Further, the embodiments described in the drawings are modeled to clearly illustrate the present invention, and the dimensions or scales of the products actually provided are not necessarily accurately indicated.

又,於本說明書中,「丙烯酸系聚合物」係指於聚合物結構中含有源自(甲基)丙烯酸系單體之單體單元之聚合物,典型而言係指以超過50重量%之比率含有源自(甲基)丙烯酸系單體之單體單元之聚合物。又,(甲基)丙烯酸系單體係指於1分子中具有至少一個(甲基)丙烯醯基之單體。此處,「(甲基)丙烯醯基」係包括丙烯醯基及甲基丙烯醯基之含義。因此,此處所謂(甲基)丙烯酸系單體之概念可包含具有丙烯醯基之單體(丙烯酸系單體)與具有甲基丙烯醯基之單體(甲基丙烯酸系單體)之兩者。同樣地,於本說明書中,「(甲基)丙烯酸」係包括丙烯酸及甲基丙烯酸之含義,「(甲基)丙烯酸酯」係包括丙烯酸酯及甲基丙烯酸酯之含義。In the present specification, the term "acrylic polymer" means a polymer containing a monomer unit derived from a (meth)acrylic monomer in a polymer structure, and typically means more than 50% by weight. The ratio contains a polymer derived from a monomer unit of a (meth)acrylic monomer. Further, the (meth)acrylic monosystem refers to a monomer having at least one (meth)acrylonitrile group in one molecule. Here, "(meth)acryl fluorenyl" means the meaning of an acryl fluorenyl group and a methacryl fluorenyl group. Therefore, the concept of a (meth)acrylic monomer herein may include a monomer having an acrylonitrile group (acrylic monomer) and a monomer having a methacryl group (methacrylic monomer). By. Similarly, in the present specification, "(meth)acrylic acid" means acrylic acid and methacrylic acid, and "(meth)acrylate" means acrylate and methacrylate.

<黏著片材之構造例> 此處所揭示之黏著片材係包含黏著劑層而構成。此處所揭示之黏著片材可為於支持基材之單面或雙面積層有上述黏著劑層的附基材之黏著片材之形態,亦可為不具有支持基材之無基材之黏著片材之形態。以下,有時亦將支持基材簡稱為「基材」。<Example of Structure of Adhesive Sheet> The adhesive sheet disclosed herein is composed of an adhesive layer. The adhesive sheet disclosed herein may be in the form of an adhesive sheet attached to the substrate having the above-mentioned adhesive layer on one or both sides of the support substrate, or a substrate-free adhesive without the support substrate. The form of the sheet. Hereinafter, the support substrate may be simply referred to as "substrate".

將一實施形態之黏著片材之構造模式性地示於圖1。該黏著片材1係作為具備具有第一面10A及第二面10B之片狀之支持基材10、以及設置於該第一面10A側之黏著劑層21的附基材之單面黏著片材而構成。黏著劑層21固定於支持基材10之第一面10A側。黏著片材1係將黏著劑層21貼附於被黏著體而使用。如圖1所示,使用前(即貼附於被黏著體前)之黏著片材1可為黏著劑層21之表面(黏著面)21A抵接於至少與黏著劑層21對向之側成為剝離性表面(剝離面)之剝離襯墊31的形態之附剝離襯墊之黏著片材100之構成要素。作為剝離襯墊31,例如可良好地使用藉由在片狀之基材(襯墊基材)之單面設置利用剝離處理劑所形成之剝離層而以該單面成為剝離面之方式構成者。或者,亦可為省略剝離襯墊31,使用第二面10B成為剝離面之支持基材10,藉由將黏著片材1進行捲繞而使黏著面21A抵接於支持基材10之第二面10B之形態(捲筒形態)。於將黏著片材1貼附於被黏著體時,將剝離襯墊31或支持基材10之第二面10B自黏著面21A剝離,並將所露出之黏著面21A壓接於被黏著體。The structure of the adhesive sheet of one embodiment is schematically shown in Fig. 1. The adhesive sheet 1 is a single-sided adhesive sheet having a substrate having a sheet-like support substrate 10 having a first surface 10A and a second surface 10B and an adhesive layer 21 provided on the first surface 10A side. Made of wood. The adhesive layer 21 is fixed to the first surface 10A side of the support substrate 10. The adhesive sheet 1 is used by attaching the adhesive layer 21 to the adherend. As shown in Fig. 1, the adhesive sheet 1 before use (i.e., before being attached to the adherend) may be such that the surface (adhesive surface) 21A of the adhesive layer 21 abuts on at least the side opposite to the adhesive layer 21. The constituent elements of the adhesive sheet 100 with the release liner attached to the release liner 31 of the release surface (release surface). As the release liner 31, for example, a release layer formed by a release treatment agent may be provided on one surface of a sheet-form substrate (pad substrate), and the single surface may be a release surface. . Alternatively, the release liner 31 may be omitted, and the support substrate 10 having the second surface 10B as a release surface may be used, and the adhesive sheet 1 may be wound to bring the adhesive surface 21A into contact with the second support substrate 10. The form of the face 10B (reel form). When the adhesive sheet 1 is attached to the adherend, the release liner 31 or the second surface 10B of the support substrate 10 is peeled off from the adhesive surface 21A, and the exposed adhesive surface 21A is pressure-bonded to the adherend.

將另一實施形態之黏著片材之構造模式性地示於圖2。該黏著片材2係作為具備具有第一面10A及第二面10B之片狀之支持基材10、設置於該第一面10A側之黏著劑層21、以及設置於第二面10B側之黏著劑層22的附基材之雙面黏著片材而構成。黏著劑層(第一黏著劑層)21固定於支持基材10之第一面10A,黏著劑層(第二黏著劑層)22固定於支持基材10之第二面10B。黏著片材2係將黏著劑層21、22貼附於被黏著體之不同部位而使用。貼附黏著劑層21、22之部位可為不同構件之各者之部位,亦可為單一構件內之不同部位。如圖2所示,使用前之黏著片材2可為黏著劑層21之表面(第一黏著面)21A及黏著劑層22之表面(第二黏著面)22A抵接於至少與黏著劑層21、22對向之側分別成為剝離面之剝離襯墊31、32的形態之附剝離襯墊之黏著片材200之構成要素。作為剝離襯墊31、32,例如可良好地使用藉由在片狀之基材(襯墊基材)之單面設置由剝離處理劑所形成之剝離層而以該單面成為剝離面之方式構成者。或者,亦可省略剝離襯墊32,使用雙面成為剝離面之剝離襯墊31,藉由將其與黏著片材2重疊並捲繞成漩渦狀而構成第二黏著面22A抵接於剝離襯墊31之背面之形態(捲筒形態)之附剝離襯墊之黏著片材。The structure of the adhesive sheet of another embodiment is schematically shown in Fig. 2 . The adhesive sheet 2 is a support substrate 10 having a sheet shape having a first surface 10A and a second surface 10B, an adhesive layer 21 provided on the first surface 10A side, and a second surface 10B side. The adhesive layer 22 is composed of a double-sided adhesive sheet attached to a substrate. The adhesive layer (first adhesive layer) 21 is fixed to the first surface 10A of the support substrate 10, and the adhesive layer (second adhesive layer) 22 is fixed to the second surface 10B of the support substrate 10. The adhesive sheet 2 is used by attaching the adhesive layers 21 and 22 to different portions of the adherend. The portions to which the adhesive layers 21, 22 are attached may be portions of different members, or may be different portions within a single member. As shown in FIG. 2, the adhesive sheet 2 before use can be such that the surface (first adhesive surface) 21A of the adhesive layer 21 and the surface (second adhesive surface) 22A of the adhesive layer 22 abut against at least the adhesive layer. 21 and 22 are the constituent elements of the adhesive sheet 200 with the release liner in the form of the release liners 31 and 32 of the release surface, respectively. As the release liners 31 and 32, for example, a release layer formed of a release treatment agent may be provided on one surface of a sheet-form substrate (pad substrate), and the single surface may be a release surface. Constitute. Alternatively, the release liner 32 may be omitted, and the release liner 31 which is a release surface on both sides may be used, and the second adhesive surface 22A may be abutted against the release liner by being superposed on the adhesive sheet 2 and wound into a spiral shape. The adhesive sheet of the release liner attached to the back surface of the mat 31 (reel form).

將又一實施形態之黏著片材之構造模式性地示於圖3。該黏著片材3係作為包含黏著劑層21之無基材之雙面黏著片材而構成。黏著片材3係將包含黏著劑層21之一表面(第一面)之第一黏著面21A、與包含黏著劑層21之另一表面(第二面)之第二黏著面21B貼附於被黏著體之不同部位而使用。如圖3所示,使用前之黏著片材3可為第一黏著面21A及第二黏著面)21B抵接於至少與黏著劑層21對向之側分別成為剝離面之剝離襯墊31、32的形態之附剝離襯墊之黏著片材300之構成要素。或者,亦可省略剝離襯墊32,使用雙面成為剝離面之剝離襯墊31,藉由將其與黏著片材3重疊並捲繞成漩渦狀而構成第二黏著面21B抵接於剝離襯墊31之背面之形態(捲筒形態)之附剝離襯墊之黏著片材。The structure of the adhesive sheet of still another embodiment is schematically shown in Fig. 3. The adhesive sheet 3 is configured as a substrate-free double-sided adhesive sheet including the adhesive layer 21. The adhesive sheet 3 is attached to the first adhesive surface 21A including one surface (first surface) of the adhesive layer 21 and the second adhesive surface 21B including the other surface (second surface) of the adhesive layer 21. Used by different parts of the adhesive body. As shown in FIG. 3, the adhesive sheet 3 before use may have the first adhesive surface 21A and the second adhesive surface 21B abutting on the release liner 31 which is a release surface at least on the side opposite to the adhesive layer 21, The constituent elements of the adhesive sheet 300 of the release liner attached to the form of 32. Alternatively, the release liner 32 may be omitted, and the release liner 31 which is a release surface on both sides may be used, and the second adhesive surface 21B may be abutted against the release liner by being superposed on the adhesive sheet 3 and wound into a spiral shape. The adhesive sheet of the release liner attached to the back surface of the mat 31 (reel form).

再者,此處所謂黏著片材之概念可包括稱為黏著帶、黏著膜、黏著標籤等者。黏著片材可為捲筒形態,可為單片形態,亦可為根據用途或使用態樣而切斷為適當之形狀、進行沖切加工等者。此處所揭示之技術中之黏著劑層典型而言係連續地形成,但並不限定於此,例如亦可形成為點狀、條狀等規則或無規之圖案。Furthermore, the concept of an adhesive sheet herein may include an adhesive tape, an adhesive film, an adhesive label, and the like. The adhesive sheet may be in the form of a roll, and may be in the form of a single piece, or may be cut into an appropriate shape according to the use or use, and subjected to die cutting. The adhesive layer in the technique disclosed herein is typically formed continuously, but is not limited thereto. For example, it may be formed into a regular or random pattern such as a dot shape or a strip shape.

<黏著劑層> 此處所揭示之黏著片材具備黏著劑層,該黏著劑層含有聚合物A、及作為具有聚有機矽氧烷骨架之單體與(甲基)丙烯酸系單體之共聚物的聚合物B。此種黏著劑層可為由含有聚合物A或其前驅物與聚合物B之黏著劑組合物所形成者。黏著劑組合物之形態並無特別限制,例如可為水分散型、溶劑型、熱熔型、活性能量射線硬化型(例如光硬化型)等各種形態。<Adhesive Layer> The adhesive sheet disclosed herein has an adhesive layer containing a polymer A, and a copolymer of a monomer having a polyorganosiloxane skeleton and a (meth)acrylic monomer. Polymer B. Such an adhesive layer may be formed from an adhesive composition containing Polymer A or its precursor and Polymer B. The form of the adhesive composition is not particularly limited, and examples thereof include various forms such as a water dispersion type, a solvent type, a hot melt type, and an active energy ray hardening type (for example, a photocuring type).

(聚合物A) 作為聚合物A,可使用在黏著劑之領域公知之丙烯酸系聚合物、橡膠系聚合物、聚酯系聚合物、胺基甲酸酯系聚合物、聚醚系聚合物、聚矽氧系聚合物、聚醯胺系聚合物、氟系聚合物等於室溫區域顯示出橡膠彈性之各種聚合物之一種或兩種以上。(Polymer A) As the polymer A, an acrylic polymer, a rubber-based polymer, a polyester-based polymer, a urethane-based polymer, or a polyether-based polymer which is known in the field of an adhesive can be used. The polyoxymethylene-based polymer, the polyamine-based polymer, and the fluorine-based polymer are one or more selected from the group consisting of various polymers exhibiting rubber elasticity at room temperature.

聚合物A之玻璃轉移溫度TA 並無特別限定,於此處所揭示之黏著片材中可以獲得較佳之特性之方式選擇。於若干種態樣中,可良好地採用TA 未達0℃之聚合物A。含有此種聚合物A之黏著劑顯示出適度之流動性(例如該黏著劑中所含之聚合物鏈之運動性),因此適於實現兼具初期之低黏著性與加熱後之強黏著性之黏著片材。此處所揭示之黏著片材可使用TA 未達-10℃、未達-20℃、未達-30℃或未達-35℃之聚合物A而良好地實施。於若干種態樣中,TA 可未達-40℃,亦可未達-50℃。TA 之下限並無特別限制。就材料之獲取容易性或黏著劑層之凝聚力提高之觀點而言,通常可良好地採用TA 為-80℃以上、-70℃以上或-65℃以上之聚合物A。就抑制N50 之上升之觀點而言,於若干種態樣中,TA 例如可為-63℃以上,可為-55℃以上,可為-50℃以上,亦可為-45℃以上。The glass transition temperature T A of the polymer A is not particularly limited, and is selected in such a manner that a preferred property can be obtained in the adhesive sheet disclosed herein. In a number of ways, polymer A having a T A of less than 0 ° C can be suitably employed. The adhesive containing such a polymer A exhibits moderate fluidity (for example, the mobility of the polymer chain contained in the adhesive), and thus is suitable for achieving both initial low adhesion and strong adhesion after heating. Adhesive sheet. The adhesive sheet disclosed herein can be suitably used using Polymer A having a T A of less than -10 ° C, less than -20 ° C, less than -30 ° C or less than -35 ° C. In several aspects, the T A may be less than -40 ° C or less than -50 ° C. The lower limit of T A is not particularly limited. From the viewpoint of facilitating the availability of materials or improving the cohesive force of the adhesive layer, the polymer A having a T A of -80 ° C or more, -70 ° C or more, or -65 ° C or more is usually preferably used. From the viewpoint of suppressing the rise of N 50 , in some kinds of aspects, T A may be, for example, -63 ° C or higher, may be -55 ° C or higher, may be -50 ° C or higher, or may be -45 ° C or higher.

此處,於本說明書中,聚合物之玻璃轉移溫度(Tg)係指文獻或目錄等所記載之標稱值、或基於該聚合物之製備所使用之單體成分之組成根據Fox之式所求出之Tg。Fox之式係指如以下所示,共聚物之Tg與使構成該共聚物之單體各者進行均聚所獲得之均聚物之玻璃轉移溫度Tgi之關係式。 1/Tg=Σ(Wi/Tgi) 於上述Fox之式中,Tg表示共聚物之玻璃轉移溫度(單位:K),Wi表示該共聚物中之單體i之重量分率(重量基準之共聚比率),Tgi表示單體i之均聚物之玻璃轉移溫度(單位:K)。於Tg之特定之對象之聚合物為均聚物之情形時,該均聚物之Tg與對象之聚合物之Tg一致。Here, in the present specification, the glass transition temperature (Tg) of the polymer means a nominal value described in a literature or a catalog, or a composition based on the monomer component used in the preparation of the polymer according to the formula of Fox. Find the Tg. The formula of Fox means a relational expression of the glass transition temperature Tgi of the homopolymer obtained by homopolymerizing each of the monomers constituting the copolymer as shown below. 1/Tg=Σ(Wi/Tgi) In the above formula of Fox, Tg represents the glass transition temperature (unit: K) of the copolymer, and Wi represents the weight fraction of the monomer i in the copolymer (weight-based copolymerization) Ratio), Tgi represents the glass transition temperature (unit: K) of the homopolymer of monomer i. In the case where the polymer of the specific target of Tg is a homopolymer, the Tg of the homopolymer is identical to the Tg of the polymer of the object.

作為用於Tg之算出之均聚物之玻璃轉移溫度,設為使用公知資料所記載之值者。具體而言,可列舉「聚合物手冊(Polymer Handbook)」(第3版,John Wiley & Sons, Inc., 1989年)中之數值。關於上述聚合物手冊中記載有複數種值之單體,採用最高值。The glass transition temperature of the homopolymer used for the calculation of Tg is determined by using the values described in the publicly known materials. Specifically, the numerical value in "Polymer Handbook" (3rd edition, John Wiley & Sons, Inc., 1989) can be cited. The highest value is used for the monomer having a plurality of values described in the above polymer manual.

作為上述聚合物手冊中無記載之單體之均聚物之玻璃轉移溫度,除具有聚有機矽氧烷骨架之單體以外,設為使用藉由以下之測定方法所獲得之值。 具體而言,於具備溫度計、攪拌機、氮氣導入管及回流冷卻管之反應器中投入單體100重量份、2,2'-偶氮二異丁腈0.2重量份及作為聚合溶劑之乙酸乙酯200重量份,一面使氮氣流通一面攪拌1小時。於以此方式去除聚合系內之氧後,升溫至63℃,並使其反應10小時。繼而,冷卻至室溫,獲得固形物成分濃度33重量%之均聚物溶液。繼而,將該均聚物溶液流延塗佈於剝離襯墊上並進行乾燥而製作厚度約2 mm之試驗樣品(片狀之均聚物)。將該試驗樣品沖切為直徑7.9 mm之圓盤狀並利用平行板夾入,一面使用黏彈性試驗機(TA Instruments Japan公司製造,機種名「ARES」)賦予頻率1 Hz之剪切應變,一面於溫度區域-70℃~150℃以5℃/分鐘之升溫速度藉由剪切模式測定黏彈性,將相當於tanδ之峰頂溫度之溫度設為均聚物之Tg。The glass transition temperature of the homopolymer of the monomer which is not described in the above-mentioned polymer manual is a value obtained by the following measurement method, except for the monomer having a polyorganosiloxane skeleton. Specifically, 100 parts by weight of a monomer, 0.2 parts by weight of 2,2'-azobisisobutyronitrile, and ethyl acetate as a polymerization solvent are placed in a reactor equipped with a thermometer, a stirrer, a nitrogen gas introduction tube, and a reflux cooling tube. 200 parts by weight, and the mixture was stirred while allowing nitrogen gas to flow for 1 hour. After removing oxygen in the polymerization system in this manner, the temperature was raised to 63 ° C and allowed to react for 10 hours. Then, the mixture was cooled to room temperature to obtain a homopolymer solution having a solid content concentration of 33% by weight. Then, the homopolymer solution was cast-coated on a release liner and dried to prepare a test sample (sheet-like homopolymer) having a thickness of about 2 mm. The test sample was die-cut into a disk shape of 7.9 mm in diameter and sandwiched by a parallel plate, and a shear strain of 1 Hz was applied to the surface using a viscoelasticity tester (manufactured by TA Instruments Japan, model name "ARES"). The viscoelasticity was measured by a shearing mode at a temperature rising rate of -70 ° C to 150 ° C at a temperature of 5 ° C / min, and the temperature corresponding to the peak top temperature of tan δ was defined as the Tg of the homopolymer.

又,關於具有聚有機矽氧烷骨架之單體,將藉由對該單體進行DSC(示差掃描熱量測定)所獲得之值、更具體而言係依據下述實施例所記載之方法所獲得之值作為具有該聚有機矽氧烷骨架之單體之玻璃轉移溫度,應用Fox之式。Further, the monomer having a polyorganosiloxane skeleton is obtained by DSC (differential scanning calorimetry) of the monomer, more specifically, according to the method described in the following examples. The value is the glass transition temperature of the monomer having the polyorganosiloxane skeleton, and the formula of Fox is applied.

聚合物A之重量平均分子量(Mw)通常適宜為約5×104 以上,但並無特別限定。根據該Mw之聚合物A,容易獲得顯示出良好之凝聚性之黏著劑。於若干種態樣中,聚合物A之Mw例如可為10×104 以上,可為20×104 以上,亦可為30×104 以上。又,聚合物A之Mw通常適宜為約500×104 以下。該Mw之聚合物A容易形成顯示出適度之流動性(聚合物鏈之運動性)之黏著劑,因此適於實現貼附初期之黏著力較低且加熱後黏著力較高之黏著片材。The weight average molecular weight (Mw) of the polymer A is usually preferably about 5 × 10 4 or more, but is not particularly limited. According to the polymer A of the Mw, an adhesive which exhibits good cohesiveness is easily obtained. In some aspects, the Mw of the polymer A may be, for example, 10 × 10 4 or more, may be 20 × 10 4 or more, or may be 30 × 10 4 or more. Further, the Mw of the polymer A is usually suitably about 500 × 10 4 or less. The polymer A of Mw easily forms an adhesive which exhibits moderate fluidity (mobility of a polymer chain), and therefore is suitable for an adhesive sheet having a low adhesive strength at the initial stage of attachment and a high adhesive force after heating.

再者,於本說明書中,聚合物A及聚合物B之Mw可藉由凝膠滲透層析法(GPC)進行聚苯乙烯換算而求出。更具體而言,可依據下述實施例中所記載之方法及條件而測定Mw。Further, in the present specification, the Mw of the polymer A and the polymer B can be determined by polystyrene conversion by gel permeation chromatography (GPC). More specifically, Mw can be measured according to the methods and conditions described in the following examples.

作為此處所揭示之黏著片材中之聚合物A,可良好地採用丙烯酸系聚合物。若使用丙烯酸系聚合物作為聚合物A,則有容易獲得與聚合物B之良好之相容性之傾向。聚合物A與聚合物B之相容性良好可經由提高黏著劑層內之聚合物B之移動性而有助於初期黏著力之降低及加熱後黏著力之提高,因此較佳。As the polymer A in the adhesive sheet disclosed herein, an acrylic polymer can be preferably used. When an acrylic polymer is used as the polymer A, it is easy to obtain good compatibility with the polymer B. The good compatibility between the polymer A and the polymer B is preferable because it improves the mobility of the polymer B in the adhesive layer to contribute to the reduction of the initial adhesive force and the improvement of the adhesive force after heating.

丙烯酸系聚合物例如可為含有50重量%以上之源自(甲基)丙烯酸烷基酯之單體單元之聚合物、即用以製備該丙烯酸系聚合物之單體成分總量中之50重量%以上為(甲基)丙烯酸烷基酯之聚合物。作為(甲基)丙烯酸烷基酯,可良好地使用具有碳數1~20之(即,C1-20 之)直鏈或支鏈狀之烷基之(甲基)丙烯酸烷基酯。就容易獲得特性之平衡之方面而言,單體成分總量中之(甲基)丙烯酸C1-20 烷基酯之比率例如可為50重量%以上,可為60重量%以上,亦可為70重量%以上。就相同之原因而言,單體成分總量中之(甲基)丙烯酸C1-20 烷基酯之比率例如可為99.9重量%以下,可為98重量%以下,亦可為95重量%以下。於若干種態樣中,單體成分總量中之(甲基)丙烯酸C1-20 烷基酯之比率例如可為90重量%以下,可為85重量%以下,亦可為80重量%以下。The acrylic polymer may be, for example, a polymer containing 50% by weight or more of a monomer unit derived from an alkyl (meth) acrylate, that is, 50% by weight of the total amount of the monomer components for preparing the acrylic polymer. More than % is a polymer of an alkyl (meth)acrylate. As the alkyl (meth)acrylate, an alkyl (meth)acrylate having a linear or branched alkyl group having 1 to 20 carbon atoms (i.e., C 1-20 ) can be preferably used. In terms of the balance of the characteristics, the ratio of the C 1-20 alkyl (meth)acrylate in the total amount of the monomer components may be, for example, 50% by weight or more, and may be 60% by weight or more, or may be 70% by weight or more. For the same reason, the ratio of the C 1-20 alkyl (meth)acrylate in the total amount of the monomer components may be, for example, 99.9% by weight or less, 98% by weight or less, or 95% by weight or less. . In some aspects , the ratio of the C 1-20 alkyl (meth)acrylate in the total amount of the monomer components may be, for example, 90% by weight or less, may be 85% by weight or less, or may be 80% by weight or less. .

作為(甲基)丙烯酸C1-20 烷基酯之非限定性之具體例,可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸異硬脂酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯等。Specific examples of non-limiting examples of the C 1-20 alkyl (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, and propyl (meth)acrylate. Isopropyl acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, second butyl (meth)acrylate, tert-butyl (meth)acrylate, (meth)acrylic acid Amyl ester, isoamyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, (A) Isooctyl acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate Ester, dodecyl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, (methyl) Cetyl acrylate, heptadecyl (meth) acrylate, stearyl (meth) acrylate, isostearyl (meth) acrylate, pentadecyl (meth) acrylate, (a) Ethyl acrylate or the like.

於該等中,較佳為至少使用(甲基)丙烯酸C1-18 烷基酯,更佳為至少使用(甲基)丙烯酸C1-14 烷基酯。於若干種態樣中,丙烯酸系聚合物可含有選自(甲基)丙烯酸C4-12 烷基酯(較佳為丙烯酸C4-10 烷基酯,例如丙烯酸C6-10 烷基酯)中之至少一種作為單體單元。例如較佳為含有丙烯酸正丁酯(BA)及丙烯酸2-乙基己酯(2EHA)之一者或兩者之丙烯酸系聚合物,尤佳為至少含有2EHA之丙烯酸系聚合物。作為可良好地使用之其他(甲基)丙烯酸C1-18 烷基酯之例,可列舉:丙烯酸甲酯、甲基丙烯酸甲酯(MMA)、甲基丙烯酸正丁酯(BMA)、甲基丙烯酸2-乙基己酯(2EHMA)、丙烯酸異硬脂酯(ISTA)等。Among these, it is preferred to use at least a C 1-18 alkyl (meth)acrylate, more preferably at least a C 1-14 alkyl (meth)acrylate. In several aspects, the acrylic polymer may contain a C 4-12 alkyl (meth)acrylate (preferably a C 4-10 alkyl acrylate such as a C 6-10 alkyl acrylate). At least one of them is a monomer unit. For example, an acrylic polymer containing one or both of n-butyl acrylate (BA) and 2-ethylhexyl acrylate (2EHA) is preferable, and an acrylic polymer containing at least 2EHA is particularly preferable. Examples of other C 1-18 alkyl (meth)acrylate which can be suitably used include methyl acrylate, methyl methacrylate (MMA), n-butyl methacrylate (BMA), and methyl group. 2-ethylhexyl acrylate (2EHMA), isostearyl acrylate (ISTA), and the like.

構成丙烯酸系聚合物之單體單元亦可包含作為主成分之(甲基)丙烯酸烷基酯並且視需要包含能夠與(甲基)丙烯酸烷基酯進行共聚之其他單體(共聚性單體)。作為共聚性單體,可良好地使用具有極性基(例如羧基、羥基、含氮原子之環等)之單體。具有極性基之單體可有助於對丙烯酸系聚合物導入交聯點或提高丙烯酸系聚合物之凝聚力。共聚性單體可單獨使用一種或將兩種以上組合而使用。The monomer unit constituting the acrylic polymer may further contain, as a main component, an alkyl (meth)acrylate and, if necessary, another monomer (copolymerizable monomer) capable of copolymerizing with an alkyl (meth)acrylate. . As the copolymerizable monomer, a monomer having a polar group (for example, a carboxyl group, a hydroxyl group, a ring containing a nitrogen atom, or the like) can be preferably used. The monomer having a polar group can contribute to introduction of a crosslinking point to the acrylic polymer or increase cohesion of the acrylic polymer. The copolymerizable monomers may be used singly or in combination of two or more.

作為共聚性單體之非限定性之具體例,可列舉以下者。 含羧基單體:例如丙烯酸、甲基丙烯酸、丙烯酸羧基乙酯、丙烯酸羧基戊酯、伊康酸、順丁烯二酸、反丁烯二酸、丁烯酸、異丁烯酸等。 含酸酐基單體:例如順丁烯二酸酐、伊康酸酐。 含羥基單體:例如(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、(甲基)丙烯酸(4-羥基甲基環己基)甲酯等(甲基)丙烯酸羥基烷基酯等。 含有磺酸基或磷酸基之單體:例如苯乙烯磺酸、烯丙基磺酸、乙烯基磺酸鈉、2-(甲基)丙烯醯胺-2-甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、(甲基)丙烯酸磺丙酯、(甲基)丙烯醯氧基萘磺酸、2-羥基乙基丙烯醯基磷酸酯等。 含環氧基單體:例如(甲基)丙烯酸縮水甘油酯或(甲基)丙烯酸-2-乙基縮水甘油醚等含環氧基之丙烯酸酯、烯丙基縮水甘油醚、(甲基)丙烯酸縮水甘油醚等。 含氰基單體:例如丙烯腈、甲基丙烯腈等。 含異氰酸基單體:例如(甲基)丙烯酸2-異氰酸基乙酯等。 含醯胺基單體:例如(甲基)丙烯醯胺;N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N,N-二丙基(甲基)丙烯醯胺、N,N-二異丙基(甲基)丙烯醯胺、N,N-二(正丁基)(甲基)丙烯醯胺、N,N-二(第三丁基)(甲基)丙烯醯胺等N,N-二烷基(甲基)丙烯醯胺;N-乙基(甲基)丙烯醯胺、N-異丙基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-正丁基(甲基)丙烯醯胺等N-烷基(甲基)丙烯醯胺;N-乙烯基乙醯胺等N-乙烯基羧醯胺類;具有羥基與醯胺基之單體,例如N-(2-羥基乙基)(甲基)丙烯醯胺、N-(2-羥基丙基)(甲基)丙烯醯胺、N-(1-羥基丙基)(甲基)丙烯醯胺、N-(3-羥基丙基)(甲基)丙烯醯胺、N-(2-羥基丁基)(甲基)丙烯醯胺、N-(3-羥基丁基)(甲基)丙烯醯胺、N-(4-羥基丁基)(甲基)丙烯醯胺等N-羥基烷基(甲基)丙烯醯胺;具有烷氧基與醯胺基之單體,例如N-甲氧基甲基(甲基)丙烯醯胺、N-甲氧基乙基(甲基)丙烯醯胺、N-丁氧基甲基(甲基)丙烯醯胺等N-烷氧基烷基(甲基)丙烯醯胺;此外,N,N-二甲基胺基丙基(甲基)丙烯醯胺、N-(甲基)丙烯醯基&#134156;啉等。 具有含氮原子之環之單體:例如N-乙烯基-2-吡咯啶酮、N-甲基乙烯基吡咯啶酮、N-乙烯基吡啶、N-乙烯基哌啶酮、N-乙烯基嘧啶、N-乙烯基哌&#134116;、N-乙烯基吡&#134116;、N-乙烯基吡咯、N-乙烯基咪唑、N-乙烯基㗁唑、N-(甲基)丙烯醯基-2-吡咯啶酮、N-(甲基)丙烯醯基哌啶、N-(甲基)丙烯醯基吡咯啶、N-乙烯基&#134156;啉、N-乙烯基-3-&#134156;啉酮、N-乙烯基-2-己內醯胺、N-乙烯基-1,3-㗁 &#134116;-2酮、N-乙烯基-3,5-&#134156;啉二酮、N-乙烯基吡唑、N-乙烯基異㗁唑、N-乙烯基噻唑、N-乙烯基異噻唑、N-乙烯基嗒&#134116;等(例如N-乙烯基-2-己內醯胺等內醯胺類)。 具有丁二醯亞胺骨架之單體:例如N-(甲基)丙烯醯氧基亞甲基丁二醯亞胺、N-(甲基)丙烯醯基-6-氧基六亞甲基丁二醯亞胺、N-(甲基)丙烯醯基-8-氧基六亞甲基丁二醯亞胺等。 順丁烯二醯亞胺類:例如N-環己基順丁烯二醯亞胺、N-異丙基順丁烯二醯亞胺、N-月桂基順丁烯二醯亞胺、N-苯基順丁烯二醯亞胺等。 伊康醯亞胺類:例如N-甲基伊康醯亞胺、N-乙基伊康醯亞胺、N-丁基伊康醯亞胺、N-辛基伊康醯亞胺、N-2-乙基己基伊康醯亞胺、N-環己基伊康醯亞胺、N-月桂基伊康醯亞胺等。 (甲基)丙烯酸胺基烷基酯類:例如(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸N,N-二乙基胺基乙酯、(甲基)丙烯酸第三丁基胺基乙酯。 含烷氧基單體:例如(甲基)丙烯酸2-甲氧基乙酯、(甲基)丙烯酸3-甲氧基丙酯、(甲基)丙烯酸2-乙氧基乙酯、(甲基)丙烯酸丙氧基乙酯、(甲基)丙烯酸丁氧基乙酯、(甲基)丙烯酸乙氧基丙酯等(甲基)丙烯酸烷氧基烷基酯類;(甲基)丙烯酸甲氧基乙二醇酯、(甲基)丙烯酸甲氧基聚丙二醇酯等(甲基)丙烯酸烷氧基伸烷基二醇酯類。 乙烯酯類:例如乙酸乙烯酯、丙酸乙烯酯等。 乙烯醚類:例如甲基乙烯醚或乙基乙烯醚等乙烯基烷基醚。 芳香族乙烯基化合物:例如苯乙烯、α-甲基苯乙烯、乙烯基甲苯等。 烯烴類:例如乙烯、丁二烯、異戊二烯、異丁烯等。 具有脂環式烴基之(甲基)丙烯酸酯:例如(甲基)丙烯酸環戊酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異&#158665;酯、(甲基)丙烯酸二環戊酯等。 具有芳香族烴基之(甲基)丙烯酸酯:例如(甲基)丙烯酸苯酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸苄酯等。 此外,(甲基)丙烯酸四氫呋喃甲酯等含雜環之(甲基)丙烯酸酯、氯乙烯或含氟原子之(甲基)丙烯酸酯等含鹵素原子之(甲基)丙烯酸酯、聚矽氧(甲基)丙烯酸酯等含矽原子之(甲基)丙烯酸酯、由萜烯化合物衍生物醇所獲得之(甲基)丙烯酸酯等。Specific examples of non-limiting examples of the copolymerizable monomer include the following. A carboxyl group-containing monomer: for example, acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, methacrylic acid, and the like. An acid anhydride group-containing monomer: for example, maleic anhydride, itaconic anhydride. Hydroxy-containing monomers: for example, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, (meth)acrylic acid 12 a hydroxyalkyl (meth) acrylate such as hydroxylauryl ester or (4-hydroxymethylcyclohexyl)methyl (meth)acrylate. a monomer having a sulfonic acid group or a phosphoric acid group: for example, styrenesulfonic acid, allylsulfonic acid, sodium vinylsulfonate, 2-(methyl)acrylamido-2-methylpropanesulfonic acid, (methyl And acrylamide propyl sulfonic acid, sulfopropyl (meth) acrylate, (meth) propylene decyl naphthalene sulfonic acid, 2-hydroxyethyl propylene decyl phosphate, and the like. The epoxy group-containing monomer: an epoxy group-containing acrylate such as glycidyl (meth)acrylate or 2-ethyl glycidyl (meth)acrylate, allyl glycidyl ether, (methyl) Glycidyl ether and the like. A cyano group-containing monomer: for example, acrylonitrile, methacrylonitrile or the like. The isocyanate group-containing monomer: for example, 2-isocyanatoethyl (meth)acrylate or the like. Amidino group-containing monomer: for example, (meth)acrylamide; N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N,N- Dipropyl (meth) acrylamide, N, N-diisopropyl (meth) acrylamide, N, N-di(n-butyl) (meth) acrylamide, N, N- (t-butyl) N,N-dialkyl(meth)acrylamide such as (meth) acrylamide; N-ethyl (meth) acrylamide, N-isopropyl (methyl) N-alkyl (meth) acrylamide such as acrylamide, N-butyl (meth) acrylamide, N-n-butyl (meth) acrylamide; N-vinyl acetamide, etc. - Vinyl carbamides; monomers having a hydroxyl group and a guanamine group, such as N-(2-hydroxyethyl)(meth)acrylamide, N-(2-hydroxypropyl)(methyl)propene Indoleamine, N-(1-hydroxypropyl)(meth)acrylamide, N-(3-hydroxypropyl)(meth)acrylamide, N-(2-hydroxybutyl)(methyl) N-hydroxyalkyl (meth) acrylamide such as acrylamide, N-(3-hydroxybutyl)(meth)acrylamide, N-(4-hydroxybutyl)(meth)acrylamide a monomer having an alkoxy group and a guanamine group, such as N-methoxymethyl (meth) acrylamide, N-methoxyethyl (A) N-alkoxyalkyl (meth) acrylamide such as acrylamide or N-butoxymethyl (meth) acrylamide; in addition, N,N-dimethylaminopropyl ( Methyl) acrylamide, N-(methyl) propylene sulfhydryl &#134156; porphyrin and the like. a monomer having a ring containing a nitrogen atom: for example, N-vinyl-2-pyrrolidone, N-methylvinylpyrrolidone, N-vinylpyridine, N-vinylpiperidone, N-vinyl Pyrimidine, N-vinylpiped &#134116;, N-vinylpyran&#134116;, N-vinylpyrrole, N-vinylimidazole, N-vinylcarbazole, N-(methyl)acrylonitrile -2-pyrrolidone, N-(meth)acrylopylpiperidine, N-(methyl)propenylpyrrolidine, N-vinyl &#134156; porphyrin, N-vinyl-3-&# 134156; ketone, N-vinyl-2-caprolactam, N-vinyl-1,3-㗁&#134116;-2 ketone, N-vinyl-3,5-&#134156; Ketone, N-vinylpyrazole, N-vinylisoxazole, N-vinylthiazole, N-vinylisothiazole, N-vinyl oxime &#134116; etc. (eg N-vinyl-2-hexyl) Indoleamines such as indoleamine). a monomer having a butadiene imine skeleton: for example, N-(methyl)propenyloxymethylenebutaneimine, N-(methyl)propenyl-6-oxyhexamethylenebutene Diimine, N-(meth)acryloyl-8-oxyhexamethylenebutaneimine, and the like. Maleimide: for example, N-cyclohexylmethyleneimine, N-isopropyl maleimide, N-lauryl maleimide, N-benzene A cis-butenylene imine or the like. Ikonium imines: for example, N-methyl Ikonide, N-ethyl Ikonide, N-butyl Ikonide, N-octyl Icinoimine, N- 2-ethylhexylkampwine imine, N-cyclohexylkkonium imine, N-lauryl Ikonide, and the like. Aminoalkyl (meth)acrylates: for example, aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, N,N-di(meth)acrylate Ethylaminoethyl ester, tert-butylaminoethyl (meth)acrylate. Alkoxy-containing monomers: for example, 2-methoxyethyl (meth)acrylate, 3-methoxypropyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, (methyl) ) alkoxyalkyl (meth)acrylate such as propoxyethyl acrylate, butoxyethyl (meth)acrylate, ethoxypropyl (meth)acrylate; methoxy (meth)acrylate (A) alkoxyalkylene glycol (meth)acrylate, such as a glycol glycol ester or a methoxypolypropylene glycol (meth)acrylate. Vinyl esters: for example, vinyl acetate, vinyl propionate, and the like. Vinyl ethers: vinyl vinyl ethers such as methyl vinyl ether or ethyl vinyl ether. An aromatic vinyl compound: for example, styrene, α-methylstyrene, vinyltoluene or the like. Olefins: for example, ethylene, butadiene, isoprene, isobutylene, and the like. (meth) acrylate having an alicyclic hydrocarbon group: for example, cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, (meth) acrylate, &lt;158665; ester, (meth) acrylate Cyclopentyl ester and the like. The (meth) acrylate having an aromatic hydrocarbon group: for example, phenyl (meth) acrylate, phenoxyethyl (meth) acrylate, benzyl (meth) acrylate or the like. Further, a halogen-containing (meth) acrylate such as a heterocyclic-containing (meth) acrylate such as tetrahydrofuran methyl (meth)acrylate, a vinyl chloride or a fluorine atom-containing (meth) acrylate, or a polyoxyl group. (meth) acrylate containing a halogen atom such as (meth) acrylate, (meth) acrylate obtained from a terpene compound derivative alcohol, or the like.

於使用此種共聚性單體之情形時,其使用量並無特別限定,通常適宜設為單體成分總量之0.01重量%以上。就更良好地發揮由共聚性單體之使用所產生之效果之觀點而言,可將共聚性單體之使用量設為單體成分總量之0.1重量%以上,亦可設為1重量%以上。又,共聚性單體之使用量可設為單體成分總量之50重量%以下,較佳為設為40重量%以下。藉此,可防止黏著劑之凝聚力變得過高,提高常溫(25℃)下之黏著感。In the case of using such a copolymerizable monomer, the amount thereof to be used is not particularly limited, and it is usually suitably 0.01% by weight or more based on the total amount of the monomer components. The amount of the copolymerizable monomer used may be 0.1% by weight or more based on the total amount of the monomer components, or may be 1% by weight, from the viewpoint of exhibiting the effect of the use of the copolymerizable monomer more satisfactorily. the above. Further, the amount of the copolymerizable monomer used may be 50% by weight or less based on the total amount of the monomer components, and preferably 40% by weight or less. Thereby, the cohesive force of the adhesive can be prevented from becoming too high, and the adhesive feeling at normal temperature (25 ° C) can be improved.

於若干種態樣中,丙烯酸系聚合物較佳為含有選自由下述通式(M1)所表示之N-乙烯基環狀醯胺及含羥基單體(具有羥基與其他官能基之單體,例如可為具有羥基與醯胺基之單體)所組成之群中之至少一種單體作為單體單元。In some aspects, the acrylic polymer preferably contains an N-vinyl cyclic decylamine represented by the following formula (M1) and a hydroxyl group-containing monomer (a monomer having a hydroxyl group and other functional groups) For example, at least one monomer selected from the group consisting of a hydroxyl group and a mercapto group may be used as a monomer unit.

[化1]此處,上述通式(M1)中之R1 為二價有機基。[Chemical 1] Here, R 1 in the above formula (M1) is a divalent organic group.

藉由使用N-乙烯基環狀醯胺,可調整黏著劑之凝聚力或極性,提高加熱後黏著力。作為N-乙烯基環狀醯胺之具體例,可列舉:N-乙烯基-2-吡咯啶酮、N-乙烯基-2-哌啶酮、N-乙烯基-3-&#134156;啉酮、N-乙烯基-2-己內醯胺、N-乙烯基-1,3-㗁 &#134116;-2酮、N-乙烯基-3,5-&#134156;啉二酮等。尤佳為N-乙烯基-2-吡咯啶酮、N-乙烯基-2-己內醯胺。By using N-vinyl cyclic guanamine, the cohesive force or polarity of the adhesive can be adjusted to improve the adhesion after heating. Specific examples of the N-vinyl cyclic guanamine include N-vinyl-2-pyrrolidone, N-vinyl-2-piperidone, and N-vinyl-3-&#134156; Ketone, N-vinyl-2-caprolactam, N-vinyl-1,3-indole &lt;RTI ID=0.0&gt;&gt;&gt;&gt; More preferably, it is N-vinyl-2-pyrrolidone and N-vinyl-2-caprolactam.

N-乙烯基環狀醯胺之使用量並無特別限制,通常適宜設為用以製備丙烯酸系聚合物之單體成分總量之0.01重量%以上(較佳為0.1重量%以上、例如0.5重量%以上)。於若干種態樣中,N-乙烯基環狀醯胺之使用量可設為上述單體成分總量之1重量%以上,可設為5重量%以上,亦可設為10重量%以上。又,就提高常溫(25℃)下之黏著感或提高低溫下之柔軟性之觀點而言,N-乙烯基環狀醯胺之使用量通常適宜設為上述單體成分總量之40重量%以下,可設為30重量%以下,亦可設為20重量%以下。The amount of use of the N-vinyl cyclic guanamine is not particularly limited, and is usually suitably 0.01% by weight or more based on the total amount of the monomer components for preparing the acrylic polymer (preferably 0.1% by weight or more, for example, 0.5% by weight). %the above). In some cases, the amount of the N-vinyl cyclic guanamine used may be 1% by weight or more based on the total amount of the monomer components, and may be 5% by weight or more, or may be 10% by weight or more. Further, from the viewpoint of improving the adhesiveness at normal temperature (25 ° C) or improving the flexibility at low temperature, the amount of N-vinyl cyclic guanamine used is usually suitably 40% by weight based on the total amount of the above monomer components. Hereinafter, it may be 30% by weight or less, or may be 20% by weight or less.

藉由使用含羥基單體,可調整黏著劑之凝聚力或極性,提高加熱後黏著力。又,含羥基單體係提供與下述交聯劑(例如異氰酸酯系交聯劑)之反應點,可藉由交聯反應而提高黏著劑之凝聚力。By using a hydroxyl group-containing monomer, the cohesive force or polarity of the adhesive can be adjusted to improve the adhesion after heating. Further, the hydroxyl group-containing single system provides a reaction point with a crosslinking agent (for example, an isocyanate crosslinking agent), and the cohesive force of the adhesive can be improved by a crosslinking reaction.

作為含羥基單體,可良好地使用(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、N-(2-羥基乙基)(甲基)丙烯醯胺等。其中,作為較佳例,可列舉丙烯酸2-羥基乙酯(HEA)、丙烯酸4-羥基丁酯(4HBA)、N-(2-羥基乙基)丙烯醯胺(HEAA)。As the hydroxyl group-containing monomer, 2-hydroxyethyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, and N-(2-hydroxyethyl) can be preferably used. Base) (meth) acrylamide and the like. Among them, preferred examples thereof include 2-hydroxyethyl acrylate (HEA), 4-hydroxybutyl acrylate (4HBA), and N-(2-hydroxyethyl) acrylamide (HEAA).

含羥基單體之使用量並無特別限制,通常適宜設為用以製備丙烯酸系聚合物之單體成分總量之0.01重量%以上(較佳為0.1重量%以上、例如0.5重量%以上)。於若干種態樣中,含羥基單體之使用量可設為上述單體成分總量之1重量%以上,可設為5重量%以上,亦可設為10重量%以上。又,就提高常溫(25℃)下之黏著感或提高低溫下之柔軟性之觀點而言,含羥基單體之使用量通常適宜設為上述單體成分總量之40重量%以下,可設為30重量%以下,可設為20重量%以下,亦可設為10重量%以下或5重量%以下。The amount of the hydroxyl group-containing monomer to be used is not particularly limited, and is usually preferably 0.01% by weight or more (preferably 0.1% by weight or more, for example, 0.5% by weight or more) based on the total amount of the monomer components for preparing the acrylic polymer. In some cases, the amount of the hydroxyl group-containing monomer to be used may be 1% by weight or more based on the total amount of the monomer components, and may be 5% by weight or more, or may be 10% by weight or more. In addition, the amount of the hydroxyl group-containing monomer is usually preferably 40% by weight or less based on the total amount of the monomer components, from the viewpoint of improving the adhesiveness at normal temperature (25° C.) or improving the flexibility at a low temperature. 30% by weight or less may be 20% by weight or less, or may be 10% by weight or less or 5% by weight or less.

於若干種態樣中,作為共聚性單體,可將N-乙烯基環狀醯胺與含羥基單體併用。於此情形時,N-乙烯基環狀醯胺與含羥基單體之合計量例如可設為用以製備丙烯酸系聚合物之單體成分總量之0.1重量%以上,可設為1重量%以上,可設為5重量%以上,可設為10重量%以上,可設為15重量%以上,可設為20重量%以上,亦可設為25重量%以上。又,N-乙烯基環狀醯胺與含羥基單體之合計量例如可設為單體成分總量之50重量%以下,較佳為設為40重量%以下。In several aspects, as a copolymerizable monomer, N-vinyl cyclic guanamine can be used in combination with a hydroxyl group-containing monomer. In this case, the total amount of the N-vinyl cyclic guanamine and the hydroxyl group-containing monomer can be, for example, 0.1% by weight or more based on the total amount of the monomer components for preparing the acrylic polymer, and can be 1% by weight. The above may be 5% by weight or more, may be 10% by weight or more, may be 15% by weight or more, may be 20% by weight or more, or may be 25% by weight or more. Further, the total amount of the N-vinyl cyclic guanamine and the hydroxyl group-containing monomer can be, for example, 50% by weight or less based on the total amount of the monomer components, and preferably 40% by weight or less.

獲得丙烯酸系聚合物之方法並無特別限定,可適當採用溶液聚合法、乳化聚合法、塊體聚合法、懸濁聚合法、光聚合法等作為丙烯酸系聚合物之合成方法已知之各種聚合方法。於若干種態樣中,可良好地採用溶液聚合法。進行溶液聚合時之聚合溫度可根據所使用之單體及溶劑之種類、聚合起始劑之種類等而適當選擇,例如可設為20℃~170℃左右(典型為40℃~140℃左右)。The method for obtaining the acrylic polymer is not particularly limited, and various polymerization methods known as a method for synthesizing an acrylic polymer can be suitably employed, such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, a suspension polymerization method, or a photopolymerization method. . Among several kinds of conditions, solution polymerization can be preferably employed. The polymerization temperature at the time of solution polymerization can be appropriately selected depending on the type of the monomer and solvent to be used, the type of the polymerization initiator, and the like, and can be, for example, about 20 to 170 ° C (typically about 40 to 140 ° C). .

用於聚合之起始劑可根據聚合方法而自先前公知之熱聚合起始劑或光聚合起始劑等中適當選擇。聚合起始劑可單獨使用一種或將兩種以上組合而使用。The initiator for the polymerization can be appropriately selected from previously known thermal polymerization initiators or photopolymerization initiators and the like according to the polymerization method. The polymerization initiators may be used alone or in combination of two or more.

作為熱聚合起始劑,例如可列舉:偶氮系聚合起始劑(例如2,2'-偶氮二異丁腈、2,2'-偶氮雙-2-甲基丁腈、2,2'-偶氮雙(2-甲基丙酸)二甲酯、4,4'-偶氮雙-4-氰基戊酸、偶氮二異戊腈、2,2'-偶氮雙(2-脒基丙烷)二鹽酸鹽、2,2'-偶氮雙[2-(5-甲基-2-咪唑啉-2-基)丙烷]二鹽酸鹽、2,2'-偶氮雙(2-甲基丙脒)二硫酸鹽、2,2'-偶氮雙(N,N'-二亞甲基異丁基脒)二鹽酸鹽等);過硫酸鉀等過硫酸鹽;過氧化物系聚合起始劑(例如過氧化二苯甲醯、過氧化順丁烯二酸第三丁酯、過氧化月桂醯等);氧化還原系聚合起始劑等。熱聚合起始劑之使用量並無特別限制,例如相對於丙烯酸系聚合物之製備所使用之單體成分100重量份,可設為0.01重量份~5重量份、較佳為0.05重量份~3重量份之範圍內之量。Examples of the thermal polymerization initiator include an azo polymerization initiator (for example, 2,2'-azobisisobutyronitrile, 2,2'-azobis-2-methylbutyronitrile, 2, 2'-azobis(2-methylpropionic acid) dimethyl ester, 4,4'-azobis-4-cyanovaleric acid, azobisisovaleronitrile, 2,2'-azobis ( 2-mercaptopropane) dihydrochloride, 2,2'-azobis[2-(5-methyl-2-imidazolin-2-yl)propane] dihydrochloride, 2,2'-couple Nitrogen bis(2-methylpropionamidine) disulfate, 2,2'-azobis(N,N'-dimethyleneisobutylphosphonium) dihydrochloride, etc.; persulfate such as potassium persulfate a salt; a peroxide-based polymerization initiator (for example, benzamidine peroxide, tert-butyl peroxymaleate, laurel, etc.); a redox polymerization initiator; and the like. The amount of the thermal polymerization initiator to be used is not particularly limited. For example, it may be 0.01 parts by weight to 5 parts by weight, preferably 0.05 parts by weight, per 100 parts by weight of the monomer component used for the preparation of the acrylic polymer. An amount within the range of 3 parts by weight.

作為光聚合起始劑,並無特別限制,例如可使用安息香醚系光聚合起始劑、苯乙酮系光聚合起始劑、α-酮醇系光聚合起始劑、芳香族磺醯氯系光聚合起始劑、光活性肟系光聚合起始劑、安息香系光聚合起始劑、苯偶醯系光聚合起始劑、二苯甲酮系光聚合起始劑、縮酮系光聚合起始劑、9-氧硫𠮿系光聚合起始劑、醯基氧化膦系光聚合起始劑等。光聚合起始劑之使用量並無特別限制,例如相對於丙烯酸系聚合物之製備所使用之單體成分100重量份,可設為0.01重量份~5重量份、較佳為0.05重量份~3重量份之範圍內之量。The photopolymerization initiator is not particularly limited, and for example, a benzoin ether photopolymerization initiator, an acetophenone photopolymerization initiator, an α-keto alcohol photopolymerization initiator, an aromatic sulfonium chloride can be used. Photopolymerization initiator, photoactive oxime photopolymerization initiator, benzoin photopolymerization initiator, benzoin photopolymerization initiator, benzophenone photopolymerization initiator, ketal light Polymerization initiator, 9-oxopurine A photopolymerization initiator, a fluorenylphosphine oxide-based photopolymerization initiator, and the like. The amount of the photopolymerization initiator to be used is not particularly limited. For example, it may be 0.01 parts by weight to 5 parts by weight, preferably 0.05 parts by weight, per 100 parts by weight of the monomer component used for the preparation of the acrylic polymer. An amount within the range of 3 parts by weight.

於若干種態樣中,丙烯酸系聚合物可以對在如上所述之單體成分中調配聚合起始劑所得之混合物照射紫外線(UV)而使該單體成分之一部分聚合之部分聚合物(丙烯酸系聚合物漿液)之形態含有於用以形成黏著劑層之黏著劑組合物中。可將含有該丙烯酸系聚合物漿液之黏著劑組合物塗佈於特定之被塗佈體,照射紫外線而使聚合完成。即,上述丙烯酸系聚合物漿液可作為丙烯酸系聚合物之前驅物理解。此處所揭示之黏著劑層例如可使用含有上述丙烯酸系聚合物漿液與聚合物B之黏著劑組合物而形成。In some aspects, the acrylic polymer may irradiate ultraviolet light (UV) to a mixture obtained by formulating a polymerization initiator in the monomer component as described above to partially polymerize one of the monomer components (acrylic acid). The form of the polymer slurry) is contained in the adhesive composition for forming the adhesive layer. The adhesive composition containing the acrylic polymer slurry can be applied to a specific coated body, and the polymerization can be completed by irradiating ultraviolet rays. That is, the above acrylic polymer slurry can be understood as a precursor of an acrylic polymer. The adhesive layer disclosed herein can be formed, for example, by using an adhesive composition containing the above acrylic polymer slurry and polymer B.

(聚合物B) 此處所揭示之技術中之聚合物B係具有聚有機矽氧烷骨架之單體(以下亦稱為「單體S1」)與(甲基)丙烯酸系單體之共聚物。聚合物B藉由源自單體S1之聚有機矽氧烷結構之低極性及運動性,可作為抑制貼附於被黏著體之初期之黏著力,且藉由向高於50℃之溫度之加熱或隨著時間經過而使對被黏著體之黏著力上升之黏著力上升延遲劑發揮功能。作為單體S1,並無特別限定,可使用含有聚有機矽氧烷骨架之任意單體。單體S1藉由源自其結構之低極性而於使用前(貼附於被黏著體前)之黏著片材中促進聚合物B偏靠於黏著劑層表面,表現出貼合初期之輕剝離性(低黏著性)。作為單體S1,可良好地使用於單末端具有聚合性反應基之結構者。藉由此種單體S1與(甲基)丙烯酸系單體之共聚,形成於側鏈具有聚有機矽氧烷骨架之聚合物B。該結構之聚合物B藉由側鏈之運動性及移動容易性,容易成為初期黏著力較低且加熱後黏著力較高者。(Polymer B) The polymer B in the technique disclosed herein is a copolymer of a monomer having a polyorganosiloxane skeleton (hereinafter also referred to as "monomer S1") and a (meth)acrylic monomer. The low polarity and movability of the polymer B by the polyorganosiloxane structure derived from the monomer S1 can be used as an adhesive for inhibiting adhesion to the initial stage of the adherend, and by a temperature higher than 50 ° C. The adhesion-increasing retarder that increases the adhesion to the adherend due to heating or the passage of time functions. The monomer S1 is not particularly limited, and any monomer containing a polyorganosiloxane skeleton can be used. The monomer S1 promotes the polymer B to the surface of the adhesive layer by adhering to the low polarity of the structure and before use (attached to the adherend), and exhibits light peeling at the initial stage of bonding. Sex (low adhesion). As the monomer S1, it can be suitably used for a structure having a polymerizable reactive group at one terminal. The copolymer B having a polyorganosiloxane skeleton in a side chain is formed by copolymerization of such a monomer S1 and a (meth)acrylic monomer. The polymer B of this structure is likely to have a low initial adhesion and a high adhesion after heating due to the mobility of the side chain and the ease of movement.

作為單體S1,例如可使用下述通式(1)或(2)所表示之化合物。更具體而言,作為信越化學工業股份有限公司製造之單末端反應性聚矽氧油,可列舉X-22-174ASX、X-22-2426、X-22-2475、KF-2012等。單體S1可單獨使用一種或將兩種以上組合而使用。 [化2][化3]此處,上述通式(1)、(2)中之R3 為氫或甲基,R4 為甲基或一價有機基,m及n為0以上之整數。As the monomer S1, for example, a compound represented by the following formula (1) or (2) can be used. More specifically, examples of the single-end reactive polysiloxane oil manufactured by Shin-Etsu Chemical Co., Ltd. include X-22-174ASX, X-22-2426, X-22-2475, and KF-2012. The monomer S1 may be used alone or in combination of two or more. [Chemical 2] [Chemical 3] Here, in the above formulas (1) and (2), R 3 is hydrogen or a methyl group, R 4 is a methyl group or a monovalent organic group, and m and n are integers of 0 or more.

單體S1之官能基當量例如較佳為700 g/mol以上且未達15000 g/mol,更佳為800 g/mol以上且未達10000 g/mol,進而較佳為850 g/mol以上且未達6000 g/mol,尤佳為1500 g/mol以上且未達5000 g/mol。若單體S1之官能基當量未達700 g/mol,則可能有無法充分地抑制初期黏著力之情況。若單體S1之官能基當量為15000 g/mol以上,則可能有黏著力之上升變得不充分之情況。若單體S1之官能基當量為上述範圍內,則容易將黏著劑層內之相容性(例如與聚合物A之相容性)或移動性調節於適度之範圍內,容易實現以高水準兼顧初期之低黏著性與黏著力上升後之強黏著性之黏著片材。The functional group equivalent of the monomer S1 is, for example, preferably 700 g/mol or more and less than 15,000 g/mol, more preferably 800 g/mol or more and less than 10,000 g/mol, and further preferably 850 g/mol or more. It is less than 6000 g/mol, particularly preferably 1500 g/mol or more and less than 5000 g/mol. If the functional group equivalent of the monomer S1 is less than 700 g/mol, the initial adhesion may not be sufficiently suppressed. When the functional group equivalent of the monomer S1 is 15,000 g/mol or more, the increase in the adhesive strength may be insufficient. When the functional group equivalent of the monomer S1 is within the above range, it is easy to adjust the compatibility (for example, compatibility with the polymer A) or the mobility in the adhesive layer to an appropriate range, and it is easy to achieve a high level. Adhesive sheet with high adhesion and strong adhesion after the initial adhesion.

此處,「官能基當量」係指鍵結於每1個官能基之主骨架(例如聚二甲基矽氧烷)之重量。關於標記單位g/mol,換算成官能基1 mol。單體S1之官能基當量例如可根據基於核磁共振(NMR)之1 H-NMR(質子NMR)之光譜強度而算出。基於1 H-NMR之光譜強度之單體S1之官能基當量(g/mol)之算出可基於有關1 H-NMR光譜解析之一般結構解析方法,視需要參照日本專利第5951153號公報之記載而進行。Here, "functional group equivalent" means the weight of a main skeleton (for example, polydimethylsiloxane) bonded to each functional group. The label unit g/mol is converted into a functional group of 1 mol. The functional group equivalent of the monomer S1 can be calculated, for example, from the spectral intensity of 1 H-NMR (proton NMR) based on nuclear magnetic resonance (NMR). Based on the functional group equivalent of the sum of spectral intensities monomer S1 1 H-NMR of (g / mol) can be calculated from the general structure of the analysis method of the related analytical spectroscopy based on 1 H-NMR, as necessary of Japanese Patent Publication No. 5951153 describes the get on.

再者,於使用官能基當量不同之兩種以上之單體作為單體S1之情形時,作為單體S1之官能基當量,可使用算術平均值。即,包含官能基當量不同之n種單體(單體S11 、單體S12 ・・・單體S1n )的單體S1之官能基當量可藉由下述式進行計算。 單體S1之官能基當量(g/mol)=(單體S11 之官能基當量×單體S11 之調配量+單體S12 之官能基當量×單體S12 之調配量+・・・+單體S1n 之官能基當量×單體S1n 之調配量)/(單體S11 之調配量+單體S12 之調配量+・・・+單體S1n 之調配量)Further, when two or more kinds of monomers having different functional group equivalents are used as the monomer S1, an arithmetic mean value can be used as the functional group equivalent of the monomer S1. In other words, the functional group equivalent of the monomer S1 containing n kinds of monomers having different functional group equivalents (monomer S1 1 , monomer S1 2 ..., monomer S1 n ) can be calculated by the following formula. S1 functional group equivalent of the monomer (g / mol) = the amount of the functional formulation. 1 S1 (group equivalent of the monomer. 1 × S1 + monomer amount of the monomer of the formulations S1 2 S1 2 equivalents of the functional group monomer + × · · · S1 + n blending amount of the monomer n × S1-functional monomer equivalents) / (the amount of monomer formulation. 1 S1 + blending amount of the monomer 2 + S1 · S1 + n blending amount of monomer)

單體S1之含量相對於用以製備聚合物B之全部單體成分,例如可為5重量%以上,就更良好地發揮作為黏著力上升延遲劑之效果之觀點而言,較佳為設為10重量%以上,可設為15重量%以上,亦可設為20重量%以上。又,單體S1之含量就聚合反應性或相容性之觀點而言,相對於用以製備聚合物B之全部單體成分,適宜設為60重量%以下,可設為50重量%以下,可設為40重量%以下,亦可設為30重量%以下。若單體S1之含量少於5重量%,則可能有無法充分地抑制初期黏著力之情況。若單體S1之含量多於60重量%,則可能有黏著力之上升變得不充分之情況。The content of the monomer S1 is preferably 5% by weight or more based on the total monomer component for preparing the polymer B, and is more preferably used as an effect of the adhesion-increasing retardation agent. 10% by weight or more may be 15% by weight or more, and may be 20% by weight or more. In addition, the content of the monomer S1 is preferably 60% by weight or less, and may be 50% by weight or less, based on the polymerization reactivity or compatibility, with respect to all the monomer components for preparing the polymer B. It can be 40% by weight or less, and can be 30% by weight or less. When the content of the monomer S1 is less than 5% by weight, the initial adhesion may not be sufficiently suppressed. When the content of the monomer S1 is more than 60% by weight, the increase in the adhesion may be insufficient.

聚合物B之製備所使用之單體成分除了含有單體S1以外,亦含有能夠與單體S1進行共聚之(甲基)丙烯酸系單體。藉由使一種或兩種以上之(甲基)丙烯酸系單體與單體S1進行共聚,可良好地調節黏著劑層內之聚合物B之移動性。使單體S1與(甲基)丙烯酸系單體進行共聚亦可有助於改善聚合物B與聚合物A(例如丙烯酸系聚合物)之相容性。The monomer component used for the preparation of the polymer B contains a (meth)acrylic monomer copolymerizable with the monomer S1 in addition to the monomer S1. By copolymerizing one or two or more (meth)acrylic monomers with the monomer S1, the mobility of the polymer B in the adhesive layer can be favorably adjusted. Copolymerization of the monomer S1 with the (meth)acrylic monomer can also help to improve the compatibility of the polymer B with the polymer A (for example, an acrylic polymer).

於此處所揭示之技術中之聚合物B中,上述單體成分中所含之(甲基)丙烯酸系單體之組成較佳為以基於該(甲基)丙烯酸系單體之組成的玻璃轉移溫度Tm1 成為50℃以上且100℃以下之方式設定。根據Tm1 為50℃以上之聚合物B,有於含有該聚合物B之黏著片材中抑制N50 之上升之傾向。認為其原因在於,根據Tm1 為50℃以上之聚合物B,藉由聚合物B中所含之源自(甲基)丙烯酸系單體之單體單元而有效地抑制伴隨自室溫至50℃左右為止之溫度上升的聚有機矽氧烷結構部分之運動性或移動性之提高,可更良好地維持因上述聚有機矽氧烷結構部分之存在所產生之低黏著性。若Tm1 變得低於50℃,則抑制N50 之上升之效果減少。又,若Tm1 變得高於100℃,則有加熱後黏著力(N80 )降低之傾向。根據Tm1 為50℃以上且100℃以下之聚合物B,可使N80 相對於N50 大幅地上升。因此,Tm1 處於上述範圍之組成之聚合物B適於實現滿足N80 /N50 ≧5之黏著片材。In the polymer B in the technique disclosed herein, the composition of the (meth)acrylic monomer contained in the above monomer component is preferably a glass transition based on the composition of the (meth)acrylic monomer. The temperature T m1 is set to be 50 ° C or more and 100 ° C or less. According to the polymer B having a T m1 of 50 ° C or more, there is a tendency to suppress an increase in N 50 in the adhesive sheet containing the polymer B. The reason for this is that the polymer B having a T m1 of 50 ° C or higher is effectively inhibited from room temperature to 50 ° C by the monomer unit derived from the (meth)acrylic monomer contained in the polymer B. The improvement in the mobility or mobility of the polyorganosiloxane structure portion having a temperature rise from the left and right can better maintain the low adhesion due to the presence of the polyorganosiloxane structure. When T m1 becomes lower than 50 ° C, the effect of suppressing the rise of N 50 is reduced. Further, when T m1 becomes higher than 100 ° C, the adhesion (N 80 ) tends to decrease after heating. According to the polymer B having a T m1 of 50 ° C or more and 100 ° C or less, N 80 can be greatly increased with respect to N 50 . Therefore, the polymer B having a composition of T m1 in the above range is suitable for realizing an adhesive sheet satisfying N 80 /N 50 ≧5.

於若干種態樣中,玻璃轉移溫度Tm1 ,例如可為53℃以上,可為56℃以上,可為59℃以上,可為62℃以上,可為65℃以上,亦可為68℃以上或70℃以上。根據Tm1 更高之聚合物B,有抑制N50 之上升之效果變得更大之傾向。又,就使藉由向高於50℃之溫度區域之加熱所產生之黏著力之上升容易化之觀點而言,於若干種態樣中,Tm1 例如可為100℃以下,可為90℃以下,可為85℃以下,亦可為80℃以下或未達80℃。In some kinds of aspects, the glass transition temperature T m1 may be, for example, 53 ° C or more, may be 56 ° C or higher, may be 59 ° C or higher, may be 62 ° C or higher, may be 65 ° C or higher, or may be 68 ° C or higher. Or above 70 °C. According to the polymer B having a higher T m1 , there is a tendency that the effect of suppressing the increase in N 50 becomes larger. Further, from the viewpoint of facilitating an increase in the adhesive force generated by heating to a temperature region higher than 50 ° C, in some kinds of aspects, T m1 may be, for example, 100 ° C or lower, and may be 90 ° C. Hereinafter, it may be 85 ° C or less, or may be 80 ° C or less or less than 80 ° C.

此處,基於上述(甲基)丙烯酸系單體之組成的玻璃轉移溫度Tm1 係指基於聚合物B之製備所使用之單體成分中之僅(甲基)丙烯酸系單體之組成,藉由Fox之式所求出之Tg。Tm1 可將聚合物B之製備所使用之單體成分中之僅(甲基)丙烯酸系單體作為對象,應用上述Fox之式,根據各(甲基)丙烯酸系單體之均聚物之玻璃轉移溫度、與該(甲基)丙烯酸系單體之合計量中所占之各(甲基)丙烯酸系單體重量分率而算出。就容易發揮藉由適當地設定Tm1 所獲得之效果之觀點而言,用以製備聚合物B之全部單體成分中所占之單體S1與(甲基)丙烯酸系單體之合計量例如可為50重量%以上,可為70重量%以上,可為85重量%以上,可為90重量%以上,可為95重量%以上,亦可為實質上100重量%。Here, the glass transition temperature T m1 based on the composition of the above (meth)acrylic monomer means the composition of only the (meth)acrylic monomer in the monomer component used for the preparation of the polymer B, The Tg obtained by the formula of Fox. T m1 can be used as the target of only the (meth)acrylic monomer in the monomer component used for the preparation of the polymer B, and the above-mentioned Fox formula is used, and the homopolymer of each (meth)acrylic monomer is used. The glass transition temperature and the weight fraction of each (meth)acrylic monomer which is contained in the total amount of the (meth)acrylic monomer are calculated. The total amount of the monomer S1 and the (meth)acrylic monomer which are used in the preparation of all the monomer components of the polymer B, for example, is easy to exert the effect obtained by appropriately setting the T m1 . It may be 50% by weight or more, may be 70% by weight or more, may be 85% by weight or more, may be 90% by weight or more, may be 95% by weight or more, or may be substantially 100% by weight.

聚合物B之玻璃轉移溫度TB 並無特別限定,可以於此處所揭示之黏著片材中獲得較佳特性之方式選擇。聚合物B之TB 例如可未達50℃,可為30℃以下,可為20℃以下,可為15℃以下,亦可為10℃以下。若聚合物B之TB 變低,則有該聚合物B之移動性提高,藉由在高於50℃之溫度區域之加熱而容易使黏著力上升之傾向。又,於若干種態樣中,聚合物B之TB 例如可為-40℃以上,可為-30℃以上,可為-20℃以上,亦可為-10℃以上。若聚合物B之TB 變高,則有容易抑制N50 之傾向。The glass transition temperature T B of the polymer B is not particularly limited and can be selected in such a manner that preferred characteristics are obtained in the adhesive sheet disclosed herein. The T B of the polymer B may be, for example, less than 50 ° C, may be 30 ° C or less, may be 20 ° C or less, may be 15 ° C or less, or may be 10 ° C or less. When the T B of the polymer B is lowered, the mobility of the polymer B is improved, and the adhesion tends to increase easily by heating in a temperature region higher than 50 ° C. Further, in some aspects, the T B of the polymer B may be, for example, -40 ° C or higher, may be -30 ° C or higher, may be -20 ° C or higher, or may be -10 ° C or higher. When the T B of the polymer B becomes high, there is a tendency that N 50 is easily suppressed.

於此處所揭示之黏著片材之若干種態樣中,聚合物B較佳為均聚物之玻璃轉移溫度高於170℃之單體之共聚比率為30重量%以下。此處,本說明書中,所謂單體之共聚比率為X重量%以下,於未特別記載之情形時係包含該單體之共聚比率為0重量%之態樣、即該單體實質上未進行共聚之態樣之概念。又,實質上未進行共聚係指至少未意圖性地使上述單體共聚。若均聚物之玻璃轉移溫度高於170℃之單體之共聚比率較高,則聚合物B之移動性容易變得不足,可能有藉由向高於50℃之溫度區域之加熱所產生之黏著力之上升變得困難之情況。藉由將均聚物之玻璃轉移溫度高於170℃之單體之共聚比率設為未達30重量%,可實現N80 之提高及N50 /N80 之提高之至少一者之效果。In several aspects of the adhesive sheet disclosed herein, the polymer B preferably has a copolymerization ratio of a monomer having a glass transition temperature of higher than 170 ° C of a homopolymer of 30% by weight or less. Here, in the present specification, the copolymerization ratio of the monomer is not more than X% by weight, and when it is not particularly described, the copolymerization ratio of the monomer is 0% by weight, that is, the monomer is not substantially carried out. The concept of cohesion. Further, substantially no copolymerization means that the above monomers are copolymerized at least unintentionally. If the copolymerization ratio of the monomer having a glass transition temperature of higher than 170 ° C of the homopolymer is higher, the mobility of the polymer B tends to become insufficient, and there may be a heating by a temperature region higher than 50 ° C. The increase in adhesion becomes difficult. By setting the copolymerization ratio of the monomer having a glass transition temperature of the homopolymer of higher than 170 ° C to less than 30% by weight, at least one of an improvement in N 80 and an improvement in N 50 /N 80 can be achieved.

於若干種態樣中,用以製備聚合物B之單體成分之組成可以Tm1 變得高於TB 、即Tm1 -TB 變得大於0℃之方式設定。根據此種組成,容易良好地發揮藉由上述單體成分中所含之(甲基)丙烯酸系單體之組成而調節聚合物B之移動性之效果。Tm1 -TB 例如可為40℃~100℃左右,可為50℃~90℃左右,亦可為65℃~85℃左右。In several aspects, for the preparation of the polymer composition of the monomer component B is made higher than T m1 T can B, i.e. T m1 -T B becomes greater than 0 ℃ manner of setting. According to such a composition, the effect of adjusting the mobility of the polymer B by the composition of the (meth)acrylic monomer contained in the monomer component can be easily exhibited. T m1 - T B may be, for example, about 40 ° C to 100 ° C, may be about 50 ° C to 90 ° C, or about 65 ° C to 85 ° C.

就容易控制黏著劑層內之聚合物B之移動性之觀點而言,於若干種態樣中,用以製備聚合物B之單體成分之組成就與聚合物A之玻璃轉移溫度TA 之關係而言,可以Tm1 較TA 高20℃以上、即Tm1 -TA 成為20℃以上之方式設定。於若干種態樣中,Tm1 -TA 例如可為50℃~130℃,亦可為60℃~120℃左右或70℃~120℃左右。From the viewpoint of easily controlling the mobility of the polymer B in the adhesive layer, in some aspects, the composition of the monomer component used to prepare the polymer B is the glass transition temperature T A of the polymer A. The relationship can be set such that T m1 is higher than T A by 20° C. or higher, that is, T m1 −T A is 20° C. or higher. In some aspects , T m1 -T A may be, for example, 50 ° C to 130 ° C, or may be about 60 ° C to 120 ° C or about 70 ° C to 120 ° C.

作為用以製備聚合物B之單體成分中可使用之(甲基)丙烯酸系單體,例如可列舉(甲基)丙烯酸烷基酯。例如作為於聚合物A為丙烯酸系聚合物之情形時可使用之(甲基)丙烯酸烷基酯,可使用上述所例示之單體之一種或兩種以上作為聚合物B之共聚成分。於若干種態樣中,聚合物B可含有(甲基)丙烯酸C4-12 烷基酯(較佳為(甲基)丙烯酸C4-10 烷基酯,例如(甲基)丙烯酸C6-10 烷基酯)之至少一種作為單體單元。於其他若干種態樣中,聚合物B可含有甲基丙烯酸C1-18 烷基酯(較佳為甲基丙烯酸C1-14 烷基酯,例如甲基丙烯酸C1-10 烷基酯)之至少一種作為單體單元。構成聚合物B之單體單元例如可含有選自MMA、BMA及2EHMA中之一種或兩種以上。As the (meth)acrylic monomer which can be used for preparing the monomer component of the polymer B, for example, an alkyl (meth)acrylate can be mentioned. For example, as the alkyl (meth)acrylate which can be used when the polymer A is an acrylic polymer, one or two or more of the above-exemplified monomers can be used as a copolymerization component of the polymer B. In several aspects, the polymer B may contain a C 4-12 alkyl (meth)acrylate (preferably a C 4-10 alkyl (meth)acrylate such as ( 6 ) alkyl (meth)acrylate. At least one of the 10 alkyl esters is used as a monomer unit. In several other aspects, the polymer B may contain a C 1-18 alkyl methacrylate (preferably a C 1-14 alkyl methacrylate such as a C 1-10 alkyl methacrylate). At least one of them is a monomer unit. The monomer unit constituting the polymer B may contain, for example, one or more selected from the group consisting of MMA, BMA, and 2EHMA.

作為上述(甲基)丙烯酸系單體之其他例,可列舉具有脂環式烴基之(甲基)丙烯酸酯。例如可使用(甲基)丙烯酸環戊酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異&#158665;酯、(甲基)丙烯酸二環戊酯、(甲基)丙烯酸1-金剛烷基酯等。於若干種態樣中,聚合物B可含有選自甲基丙烯酸二環戊酯、甲基丙烯酸異&#158665;酯及甲基丙烯酸環己酯中之至少一種作為單體單元。Other examples of the (meth)acrylic monomer include a (meth) acrylate having an alicyclic hydrocarbon group. For example, cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, (meth)acrylic acid &lt;158665; ester, dicyclopentanyl (meth)acrylate, (meth)acrylic acid 1- Adamantyl ester and the like. In several aspects, the polymer B may contain at least one selected from the group consisting of dicyclopentanyl methacrylate, methacrylic acid &lt;158665; ester and cyclohexyl methacrylate as monomer units.

上述(甲基)丙烯酸烷基酯及上述具有脂環式烴基之(甲基)丙烯酸酯之使用量相對於用以製備聚合物B之全部單體成分,例如可為10重量%以上且95重量%以下,可為20重量%以上且95重量%以下,可為30重量%以上且90重量%以下,可為40重量%以上且90重量%以下,亦可為50重量%以上且85重量%以下。就藉由向高於50℃之溫度之加熱所產生之黏著力之上升容易性之觀點而言,使用(甲基)丙烯酸烷基酯可能變得有利。於若干種態樣中,具有脂環式烴基之(甲基)丙烯酸酯之使用量可未達用以製備聚合物B之單體成分中所含之(甲基)丙烯酸系單體之合計量之50重量%,可未達30重量%,可未達15重量%,可未達10重量%,亦可未達5重量%。亦可不使用具有脂環式烴基之(甲基)丙烯酸酯。The (meth)acrylic acid alkyl ester and the above-mentioned (meth) acrylate having an alicyclic hydrocarbon group are used in an amount of, for example, 10% by weight or more and 95% by weight based on the entire monomer component for preparing the polymer B. % or less may be 20% by weight or more and 95% by weight or less, may be 30% by weight or more and 90% by weight or less, may be 40% by weight or more and 90% by weight or less, or may be 50% by weight or more and 85% by weight or less the following. It is possible to use an alkyl (meth)acrylate from the viewpoint of easiness of the adhesion by heating to a temperature higher than 50 ° C. In some embodiments, the (meth) acrylate having an alicyclic hydrocarbon group may be used in an amount less than the total amount of the (meth)acrylic monomer contained in the monomer component used to prepare the polymer B. 50% by weight, may be less than 30% by weight, may be less than 15% by weight, may be less than 10% by weight, or may be less than 5% by weight. It is also possible not to use a (meth) acrylate having an alicyclic hydrocarbon group.

於若干種態樣中,用以製備聚合物B之單體成分較佳為至少含有MMA。使MMA共聚可成為用以將Tm1 調節為此處所揭示之較佳範圍之有用方法。又,根據使MMA共聚而成之聚合物B,容易獲得N80 /N50 較大之黏著片材。MMA於用以製備聚合物B之單體成分中所含之(甲基)丙烯酸系單體之合計量中所占之比率例如可為5重量%以上,可為10重量%以上,可為20重量%以上,可為30重量%以上,亦可為40重量%以上。於若干種態樣中,MMA於上述(甲基)丙烯酸系單體之合計量中所占之比率例如可超過50重量%,可超過55重量%,可超過60重量%,可超過65重量%,亦可超過70重量%。又,MMA於上述(甲基)丙烯酸系單體之合計量中所占之比率只要為Tm1 成為100℃以下之範圍即可,通常適宜為95重量%以下,可為90重量%以下,亦可為85重量%以下。In some aspects, the monomer component used to prepare polymer B preferably contains at least MMA. So MMA copolymerization will be a useful method for regulating T m1 disclosed in the preferred range for this location. Further, according to the polymer B obtained by copolymerizing MMA, it is easy to obtain an adhesive sheet having a large N 80 /N 50 . The ratio of the MMA to the total amount of the (meth)acrylic monomer contained in the monomer component for preparing the polymer B may be, for example, 5% by weight or more, may be 10% by weight or more, and may be 20 The weight% or more may be 30% by weight or more, and may be 40% by weight or more. In some aspects, the ratio of MMA to the total amount of the above (meth)acrylic monomers may be, for example, more than 50% by weight, may exceed 55% by weight, may exceed 60% by weight, and may exceed 65% by weight. It can also exceed 70% by weight. In addition, the ratio of the MMA to the total amount of the (meth)acrylic monomer may be in the range of T m1 to 100° C. or less, and is usually preferably 95% by weight or less, and may be 90% by weight or less. It may be 85% by weight or less.

作為構成聚合物B之單體單元中可與單體S1一起含有之單體之其他例,可列舉:作為於聚合物A為丙烯酸系聚合物之情形時可使用之單體之上述所例示之含羧基單體、含酸酐基單體、含羥基單體、含環氧基單體、含氰基單體、含異氰酸酯基單體、含醯胺基單體、具有含氮原子之環之單體、具有丁二醯亞胺骨架之單體、順丁烯二醯亞胺類、伊康醯亞胺類、(甲基)丙烯酸胺基烷基酯類、乙烯酯類、乙烯醚類、烯烴類、具有芳香族烴基之(甲基)丙烯酸酯、含有雜環之(甲基)丙烯酸酯、含有鹵素原子之(甲基)丙烯酸酯、由萜烯化合物衍生物醇所獲得之(甲基)丙烯酸酯等。Other examples of the monomer which can be contained together with the monomer S1 in the monomer unit constituting the polymer B include the above-exemplified examples of the monomer which can be used when the polymer A is an acrylic polymer. a monomer containing a carboxyl group, an acid anhydride group-containing monomer, a hydroxyl group-containing monomer, an epoxy group-containing monomer, a cyano group-containing monomer, an isocyanate group-containing monomer, a guanamine-containing monomer, and a ring having a nitrogen atom Monomers, monomers having a butylenediamine skeleton, maleimide, Ikonium imines, aminoalkyl (meth)acrylates, vinyl esters, vinyl ethers, olefins a (meth) acrylate having an aromatic hydrocarbon group, a (meth) acrylate containing a hetero ring, a (meth) acrylate containing a halogen atom, (meth) obtained from a decene compound derivative alcohol Acrylate and the like.

作為構成聚合物B之單體單元中可與單體S1一起含有之單體之進而其他例,可列舉:乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、二丙二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯等氧伸烷基二(甲基)丙烯酸酯;具有聚氧伸烷基骨架之單體,例如於聚乙二醇或聚丙二醇等聚氧伸烷基鏈之一末端具有(甲基)丙烯醯基、乙烯基、烯丙基等聚合性官能基,於另一末端具有醚結構(烷基醚、芳醚、芳基烷基醚等)之聚合性聚氧伸烷基醚;(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯、(甲基)丙烯酸丙氧基乙酯、(甲基)丙烯酸丁氧基乙酯、(甲基)丙烯酸乙氧基丙酯等(甲基)丙烯酸烷氧基烷基酯;(甲基)丙烯酸鹼金屬鹽等鹽;三羥甲基丙烷三(甲基)丙烯酸酯等多元(甲基)丙烯酸酯:偏二氯乙烯、(甲基)丙烯酸-2-氯乙酯等鹵化乙烯化合物;2-乙烯基-2-㗁唑啉、2-乙烯基-5-甲基-2-㗁唑啉、2-異丙烯基-2-㗁唑啉等含㗁唑啉基之單體;(甲基)丙烯醯基氮丙啶、(甲基)丙烯酸-2-氮丙啶基乙酯等含氮丙啶基之單體;(甲基)丙烯酸-2-羥基乙酯、(甲基)丙烯酸-2-羥基丙酯、內酯類與(甲基)丙烯酸-2-羥基乙酯之加成物等含羥基之乙烯基單體;氟取代(甲基)丙烯酸烷基酯等含氟乙烯基單體;2-氯乙基乙烯醚、單氯乙酸乙烯酯等含有反應性鹵素之乙烯基單體;如乙烯基三甲氧基矽烷、γ-(甲基)丙烯醯氧基丙基三甲氧基矽烷、烯丙基三甲氧基矽烷、三甲氧基矽烷基丙基烯丙胺、2-甲氧基乙氧基三甲氧基矽烷之含有有機矽之乙烯基單體;此外,可列舉:於使乙烯基聚合之單體末端具有自由基聚合性乙烯基之巨單體類等。該等可使單獨一種或加以組合而與單體S1共聚。Further examples of the monomer which can be contained together with the monomer S1 in the monomer unit constituting the polymer B include ethylene glycol di(meth)acrylate and diethylene glycol di(meth)acrylate. , triethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(methyl) An oxyalkylene di(meth)acrylate such as acrylate; a monomer having a polyoxyalkylene group, for example, one end of a polyoxyalkylene chain such as polyethylene glycol or polypropylene glycol (methyl) a polymerizable functional group such as an alkylene group, a vinyl group or an allyl group, and a polymerizable polyoxyalkylene ether having an ether structure (alkyl ether, aryl ether, arylalkyl ether or the like) at the other end; Methyl) methoxyethyl acrylate, ethoxyethyl (meth) acrylate, propoxyethyl (meth) acrylate, butoxyethyl (meth) acrylate, ethoxy (meth) acrylate Alkoxyalkyl (meth)acrylate such as propyl acrylate; salt such as alkali metal salt of (meth)acrylic acid; polyvalent (methyl) such as trimethylolpropane tri(meth)acrylate Acrylate: a vinyl halide compound such as vinylidene chloride or 2-chloroethyl (meth)acrylate; 2-vinyl-2-oxazoline, 2-vinyl-5-methyl-2-carbazole An oxazoline group-containing monomer such as a porphyrin or a 2-isopropenyl-2-oxazoline; (meth)acryloyl aziridine or 2-aziridine ethyl (meth)acrylate; Aziridine-based monomer; addition of 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, lactone and 2-hydroxyethyl (meth)acrylate a hydroxyl group-containing vinyl monomer; a fluorine-containing vinyl monomer such as a fluorine-substituted (meth)acrylic acid ester; a vinyl monomer containing a reactive halogen such as 2-chloroethyl vinyl ether or a monochloroacetic acid vinyl ester; For example; vinyl trimethoxy decane, γ-(meth) propylene methoxy propyl trimethoxy decane, allyl trimethoxy decane, trimethoxy decyl propyl allylamine, 2-methoxy The ethoxylated trimethoxy decane is a vinyl monomer containing an organic oxime; and a macromonomer having a radical polymerizable vinyl group at a monomer terminal which polymerizes a vinyl group, etc. are mentioned. These may be copolymerized with the monomer S1 either alone or in combination.

聚合物B之Mw並無特別限定。聚合物B之Mw例如可為1000以上,亦可為5000以上。若聚合物B之Mw過低,則可能有黏著力之上升變得不充分之情況。於若干種較佳態樣中,聚合物B之Mw例如可為10000以上,可為12000以上,可為15000以上,可為17000以上,亦可為20000以上。又,聚合物B之Mw例如可為100000以下,亦可為70000以下。若聚合物B之Mw過高,則可能有無法充分地抑制初期黏著力之情況。於若干種較佳態樣中,聚合物B之Mw例如可為50000以下,可未達50000,可未達40000,可未達35000,可為30000以下,可為28000以下,亦可為25000以下。若聚合物B之Mw為上述任一上限值及下限值之範圍內,則容易將於黏著劑層內之相容性或移動性調節為適度之範圍,容易實現以高水準兼顧貼附初期良好之二次加工性與黏著力上升後之強黏著性之黏著片材。The Mw of the polymer B is not particularly limited. The Mw of the polymer B may be, for example, 1,000 or more, or may be 5,000 or more. If the Mw of the polymer B is too low, the increase in the adhesion may be insufficient. In some preferred embodiments, the Mw of the polymer B may be, for example, 10,000 or more, may be 12,000 or more, may be 15,000 or more, may be 17,000 or more, or may be 20,000 or more. Further, the Mw of the polymer B may be, for example, 100,000 or less, or may be 70,000 or less. If the Mw of the polymer B is too high, the initial adhesion may not be sufficiently suppressed. In some preferred embodiments, the Mw of the polymer B may be, for example, 50,000 or less, may be less than 50,000, may be less than 40,000, may be less than 35,000, may be 30,000 or less, may be 28,000 or less, or may be 25,000 or less. . When the Mw of the polymer B is within the range of any of the above upper limit and lower limit, it is easy to adjust the compatibility or mobility in the adhesive layer to an appropriate range, and it is easy to achieve a high level of attachment. Adhesive sheet with good initial secondary workability and strong adhesion after adhesion.

聚合物B例如可藉由利用溶液聚合法、乳化聚合法、塊體聚合法、懸濁聚合法、光聚合法等公知方法使上述單體聚合而製作。The polymer B can be produced, for example, by polymerizing the above monomers by a known method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, a suspension polymerization method, or a photopolymerization method.

為了調整聚合物B之分子量,可使用鏈轉移劑。作為所使用之鏈轉移劑之例,可列舉:辛基硫醇、月桂基硫醇、第三壬基硫醇、第三(十二烷基)硫醇、巰基乙醇、α-硫甘油等具有巰基之化合物;硫代乙醇酸、硫代乙醇酸甲酯、硫代乙醇酸乙酯、硫代乙醇酸丙酯、硫代乙醇酸丁酯、硫代乙醇酸第三丁酯、硫代乙醇酸2-乙基己酯、硫代乙醇酸辛酯、硫代乙醇酸異辛酯、硫代乙醇酸癸酯、硫代乙醇酸十二烷基酯、乙二醇之硫代乙醇酸酯、新戊二醇之硫代乙醇酸酯、季戊四醇之硫代乙醇酸酯等硫代乙醇酸酯類;α-甲基苯乙烯二聚物等。In order to adjust the molecular weight of the polymer B, a chain transfer agent can be used. Examples of the chain transfer agent to be used include octyl mercaptan, lauryl mercaptan, third mercapto mercaptan, third (dodecyl) mercaptan, mercaptoethanol, and α-thioglycerol. a compound of thiol; thioglycolic acid, methyl thioglycolate, ethyl thioglycolate, propyl thioglycolate, butyl thioglycolate, tert-butyl thioglycolate, thioglycolic acid 2-ethylhexyl ester, octyl thioglycolate, isooctyl thioglycolate, decyl thioglycolate, lauryl thioglycolate, thioglycolate of ethylene glycol, neopentyl a thioglycolate such as a thioglycolate of a diol or a thioglycolate of pentaerythritol; an α-methylstyrene dimer or the like.

作為鏈轉移劑之使用量,並無特別限制,通常相對於單體100重量份,含有鏈轉移劑0.05重量份~20重量份,較佳為0.1重量份~15重量份,進而較佳為0.2重量份~10重量份。藉由如此調整鏈轉移劑之添加量,可獲得較佳之分子量之聚合物B。再者,鏈轉移劑可單獨使用一種或將兩種以上組合而使用。The amount of the chain transfer agent to be used is not particularly limited, and is usually 0.05 to 20 parts by weight, preferably 0.1 to 15 parts by weight, more preferably 0.2, based on 100 parts by weight of the monomer. Parts by weight to 10 parts by weight. By adjusting the amount of the chain transfer agent so adjusted, a polymer B of a preferred molecular weight can be obtained. Further, the chain transfer agent may be used singly or in combination of two or more.

聚合物B之使用量相對於聚合物A之使用量100重量份,例如可設為0.1重量份以上,就獲得更高之效果之觀點而言,可設為0.3重量份以上,可設為0.4重量份以上,亦可設為0.5重量份以上,但並無特別限定。就提高二次加工性等觀點而言,於若干種態樣中,相對於100重量份聚合物A之聚合物B之使用量可設為1重量份以上,可設為2重量份以上,亦可設為3重量份以上。又,相對於100重量份聚合物A之聚合物B之使用量例如可為75重量份以下,可為60重量份以下,亦可為50重量份以下。就避免黏著劑層之凝聚力過度降低之觀點而言,於若干種態樣中,相對於100重量份聚合物A之聚合物B之使用量例如可設為40重量份以下,亦可設為35重量份以下、30重量份以下或25重量份以下。就獲得更高之加熱後黏著力之觀點而言,於若干種態樣中,可將上述聚合物B之使用量設為20重量份以下,可設為17重量份以下,可設為15重量份以下,亦可設為10重量份以下。於此處所揭示之黏著片材之若干種態樣中,相對於100重量份聚合物A之聚合物B之使用量例如可未達10重量份,可為8重量份以下,可為5重量份以下或未達5重量份,可為4重量份以下,亦可為3重量份以下。The amount of the polymer B to be used is, for example, 0.1 part by weight or more based on 100 parts by weight of the polymer A, and may be 0.3 part by weight or more, and may be 0.4, from the viewpoint of obtaining a higher effect. The weight portion or more may be 0.5 parts by weight or more, but is not particularly limited. From the viewpoint of improving the secondary workability, the amount of the polymer B used in 100 parts by weight of the polymer A may be 1 part by weight or more, and may be 2 parts by weight or more. It can be set to 3 parts by weight or more. Further, the amount of the polymer B to be used in an amount of, for example, 75 parts by weight or less based on 100 parts by weight of the polymer A may be 60 parts by weight or less, or may be 50 parts by weight or less. From the viewpoint of avoiding an excessive decrease in the cohesive force of the adhesive layer, the amount of the polymer B used in 100 parts by weight of the polymer A may be, for example, 40 parts by weight or less, or may be 35. It is below the weight part, 30 parts by weight or less, or 25 parts by weight or less. From the viewpoint of obtaining a higher adhesion after heating, the amount of the polymer B used may be 20 parts by weight or less, 17 parts by weight or less, and 15 parts by weight. In the following, it may be 10 parts by weight or less. In several aspects of the adhesive sheet disclosed herein, the amount of the polymer B relative to 100 parts by weight of the polymer A may be, for example, less than 10 parts by weight, may be 8 parts by weight or less, and may be 5 parts by weight. The following may be less than 5 parts by weight, and may be 4 parts by weight or less, or may be 3 parts by weight or less.

黏著劑層於不會較大地損及此處所揭示之黏著片材之性能之範圍內,可視需要含有聚合物A及聚合物B以外之聚合物(任意聚合物)。此種任意聚合物之使用量通常適宜設為黏著劑層中所含之聚合物成分整體之20重量%以下,可為15重量%以下,可為10重量%以下。於若干種態樣中,上述任意聚合物之使用量可為上述聚合物成分整體之5重量%以下,可為3重量%以下,亦可為1重量%以下。亦可為實質上不含有聚合物A及聚合物B以外之聚合物之黏著劑層。The adhesive layer may contain a polymer (any polymer) other than the polymer A and the polymer B as needed within a range that does not greatly impair the performance of the adhesive sheet disclosed herein. The amount of the polymer to be used is usually 20% by weight or less based on the total amount of the polymer component contained in the adhesive layer, and may be 15% by weight or less, and may be 10% by weight or less. In some aspects, the amount of any of the above polymers may be 5% by weight or less based on the total amount of the polymer component, and may be 3% by weight or less, or may be 1% by weight or less. It may also be an adhesive layer which does not substantially contain a polymer other than the polymer A and the polymer B.

(交聯劑) 於黏著劑層中,可以調整凝聚力等為目的視需要使用交聯劑。作為交聯劑,可使用黏著劑之領域中公知之交聯劑,例如可列舉:環氧系交聯劑、異氰酸酯系交聯劑、聚矽氧系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、矽烷系交聯劑、烷基醚化三聚氰胺系交聯劑、金屬螯合物系交聯劑等。尤其可良好地使用異氰酸酯系交聯劑、環氧系交聯劑、金屬螯合物系交聯劑。交聯劑可單獨使用一種或將兩種以上組合而使用。(Crosslinking Agent) A crosslinking agent may be used as needed in order to adjust the cohesive force or the like in the adhesive layer. As the crosslinking agent, a crosslinking agent known in the field of an adhesive can be used, and examples thereof include an epoxy crosslinking agent, an isocyanate crosslinking agent, a polyfluorene crosslinking agent, and an oxazoline crosslinking agent. An aziridine-based crosslinking agent, a decane-based crosslinking agent, an alkyletherated melamine-based crosslinking agent, and a metal chelate-based crosslinking agent. In particular, an isocyanate crosslinking agent, an epoxy crosslinking agent, and a metal chelate crosslinking agent can be preferably used. The crosslinking agent may be used alone or in combination of two or more.

具體而言,作為異氰酸酯系交聯劑之例,可列舉:甲苯二異氰酸酯、六亞甲基二異氰酸酯、異佛爾酮二異氰酸酯、苯二甲基二異氰酸酯、氫化苯二甲基二異氰酸酯、二苯基(甲烷)二異氰酸酯、氫化二苯基(甲烷)二異氰酸酯、四甲基苯二甲基二異氰酸酯、萘二異氰酸酯、三苯基(甲烷)三異氰酸酯、聚亞甲基聚苯基異氰酸酯、及該等與三羥甲基丙烷等多元醇之加成物。或者,於1分子中具有至少1個以上之異氰酸酯基與1個以上之不飽和鍵之化合物、具體而言(甲基)丙烯酸2-異氰酸基乙酯等亦可用作異氰酸酯系交聯劑。該等可單獨使用一種或將兩種以上組合而使用。Specific examples of the isocyanate crosslinking agent include toluene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, benzodimethyl diisocyanate, hydrogenated dimethyl diisocyanate, and Phenyl (methane) diisocyanate, hydrogenated diphenyl (methane) diisocyanate, tetramethyl dimethyl diisocyanate, naphthalene diisocyanate, triphenyl (methane) triisocyanate, polymethylene polyphenyl isocyanate, And these adducts with polyols such as trimethylolpropane. Alternatively, a compound having at least one or more isocyanate groups and one or more unsaturated bonds in one molecule, specifically, 2-isocyanatoethyl (meth)acrylate or the like may be used as the isocyanate crosslinking. Agent. These may be used alone or in combination of two or more.

作為環氧系交聯劑,可列舉:雙酚A、表氯醇型環氧系樹脂、伸乙基縮水甘油醚、聚乙二醇二縮水甘油醚、甘油二縮水甘油醚、甘油三縮水甘油醚、1,6-己二醇縮水甘油醚、三羥甲基丙烷三縮水甘油醚、二縮水甘油基苯胺、二胺縮水甘油胺、N,N,N',N'-四縮水甘油基間苯二甲胺及1,3-雙(N,N-二縮水甘油基胺基甲基)環己烷等。該等可單獨使用一種或將兩種以上組合而使用。Examples of the epoxy-based crosslinking agent include bisphenol A, epichlorohydrin epoxy resin, ethyl diglycidyl ether, polyethylene glycol diglycidyl ether, glycerol diglycidyl ether, and glycerol triglycidyl alcohol. Ether, 1,6-hexanediol glycidyl ether, trimethylolpropane triglycidyl ether, diglycidylaniline, diamine glycidylamine, N,N,N',N'-tetraglycidyl Xylylenediamine and 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane. These may be used alone or in combination of two or more.

作為金屬螯合物化合物,可列舉作為金屬成分之鋁、鐵、錫、鈦、鎳等,作為螯合物成分之乙炔、乙醯乙酸甲酯、乳酸乙酯等。該等可單獨使用一種或將兩種以上組合而使用。Examples of the metal chelate compound include aluminum, iron, tin, titanium, nickel, and the like as a metal component, and acetylene, ethyl acetacetate, ethyl lactate, and the like as a chelate component. These may be used alone or in combination of two or more.

使用交聯劑之情形時之使用量並無特別限定,例如相對於100重量份聚合物A可設為超過0重量份之量。又,交聯劑之使用量相對於100重量份聚合物A,例如可設為0.01重量份以上,較佳為設為0.05重量份以上。藉由增大交聯劑之使用量,有抑制貼附初期之黏著力,提高二次加工性之傾向。於若干種態樣中,交聯劑之使用量相對於100重量份聚合物A可為0.1重量份以上,可為0.5重量份以上,亦可為1重量份以上。另一方面,就避免因過度之凝聚力提高所致之黏性降低之觀點而言,相對於100重量份聚合物A之交聯劑之使用量通常適宜設為15重量份以下,可設為10重量份以下,亦可設為5重量份以下。交聯劑之使用量不過多就容易實現N80 /N50 較高之黏著片材之觀點而言亦可能變得有利。The amount used in the case of using a crosslinking agent is not particularly limited, and for example, it may be set to be more than 0 part by weight based on 100 parts by weight of the polymer A. Further, the amount of the crosslinking agent used is, for example, 0.01 parts by weight or more, preferably 0.05 parts by weight or more, per 100 parts by weight of the polymer A. By increasing the amount of the crosslinking agent used, it is possible to suppress the adhesion at the initial stage of the adhesion and to improve the secondary workability. In some aspects, the crosslinking agent may be used in an amount of 0.1 part by weight or more based on 100 parts by weight of the polymer A, and may be 0.5 part by weight or more, or may be 1 part by weight or more. On the other hand, the amount of the crosslinking agent to be used with respect to 100 parts by weight of the polymer A is usually suitably 15 parts by weight or less, and can be set to 10, from the viewpoint of avoiding a decrease in viscosity due to an excessive increase in cohesive force. It may be 5 parts by weight or less in parts by weight or less. It may also be advantageous from the viewpoint that the use amount of the crosslinking agent is too large to easily achieve an adhesive sheet having a higher N 80 /N 50 .

此處所揭示之技術可以至少使用異氰酸酯系交聯劑作為交聯劑之態樣良好地實施。就容易實現兼具貼附初期良好之二次加工性與黏著力上升後之強黏著性之黏著片材之觀點而言,於若干種態樣中,異氰酸酯系交聯劑之使用量相對於100重量份聚合物A例如可設為0.1重量份以上且5重量份以下,可設為0.3重量份以上且4重量份以下,亦可設為0.5重量份以上且3重量份以下。The technique disclosed herein can be suitably carried out using at least an isocyanate crosslinking agent as a crosslinking agent. From the viewpoint of easily attaching an adhesive sheet having excellent secondary workability at the initial stage and strong adhesiveness after an increase in adhesion, the amount of the isocyanate crosslinking agent used is relatively 100 in several aspects. The component A by weight may be, for example, 0.1 parts by weight or more and 5 parts by weight or less, and may be 0.3 parts by weight or more and 4 parts by weight or less, and may be 0.5 parts by weight or more and 3 parts by weight or less.

於在黏著劑層含有含羥基單體作為單體單元之構成中使用異氰酸酯系交聯劑之情形時,含羥基單體之使用量WOH 相對於異氰酸酯系交聯劑之使用量WNCO 以重量基準計,可設為WOH /WNCO 成為2以上之量,但並無特別限定。藉由如此使相對於異氰酸酯系交聯劑之含羥基單體之使用量變多,可形成適於使加熱後黏著力相對於貼附初期之黏著力大幅地上升之交聯結構。於若干種態樣中,WOH /WNCO 可為3以上,可為5以上,可為10以上,可為20以上,可為30以上,亦可為50以上。WOH /WNCO 之上限並無特別限制。WOH /WNCO 例如可為500以下,可為200以下,亦可為100以下。In the case where an isocyanate crosslinking agent is used in the constitution in which the adhesive layer contains a hydroxyl group-containing monomer as a monomer unit, the amount of the hydroxyl group-containing monomer W OH is used relative to the isocyanate crosslinking agent W NCO by weight. The reference meter may be set to have an amount of W OH /W NCO of 2 or more, but is not particularly limited. By increasing the amount of the hydroxyl group-containing monomer to be used with the isocyanate crosslinking agent in this manner, it is possible to form a crosslinked structure which is suitable for greatly increasing the adhesion after heating to the adhesion at the initial stage of attachment. In some kinds of aspects, W OH /W NCO may be 3 or more, may be 5 or more, may be 10 or more, may be 20 or more, may be 30 or more, or may be 50 or more. The upper limit of W OH /W NCO is not particularly limited. The W OH /W NCO may be, for example, 500 or less, and may be 200 or less, or may be 100 or less.

為了使上述任一交聯反應更有效地進行,亦可使用交聯觸媒。作為交聯觸媒,例如可良好地使用錫系觸媒(尤其是二月桂酸二辛基錫)。交聯觸媒之使用量並無特別限制,例如相對於100重量份聚合物A可設為約0.0001重量份~1重量份。In order to carry out any of the above crosslinking reactions more efficiently, a crosslinking catalyst can also be used. As the crosslinking catalyst, for example, a tin-based catalyst (especially dioctyltin dilaurate) can be preferably used. The amount of the crosslinking catalyst to be used is not particularly limited, and may be, for example, about 0.0001 part by weight to 1 part by weight based on 100 parts by weight of the polymer A.

於黏著劑層中可視需要使用多官能性單體。多官能性單體藉由代替如上所述之交聯劑、或與該交聯劑組合使用,可有助於實現凝聚力之調整等目的。例如於由光硬化型黏著劑組合物所形成之黏著劑層中,可良好地使用多官能性單體。 作為多官能性單體,例如可列舉:乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,12-十二烷二醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、四羥甲基甲烷三(甲基)丙烯酸酯、(甲基)丙烯酸烯丙酯、(甲基)丙烯酸乙烯酯、二乙烯苯、環氧丙烯酸酯、聚酯丙烯酸酯、丙烯酸胺基甲酸酯、丁二醇(甲基)丙烯酸酯、己二醇二(甲基)丙烯酸酯等。其中,可良好地使用三羥甲基丙烷三(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯。多官能性單體可單獨使用一種或將兩種以上組合而使用。A polyfunctional monomer can be used as needed in the adhesive layer. The polyfunctional monomer can contribute to the adjustment of cohesive force by replacing the crosslinking agent as described above or in combination with the crosslinking agent. For example, in the adhesive layer formed of the photocurable adhesive composition, a polyfunctional monomer can be preferably used. Examples of the polyfunctional monomer include ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, and polypropylene glycol di(methyl). Acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, ethylene glycol di(methyl) Acrylate, 1,6-hexanediol di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, four Methyl hydroxymethane tri(meth) acrylate, allyl (meth) acrylate, vinyl (meth) acrylate, divinyl benzene, epoxy acrylate, polyester acrylate, urethane acrylate, Butylene glycol (meth) acrylate, hexane diol di(meth) acrylate, and the like. Among them, trimethylolpropane tri(meth)acrylate, 1,6-hexanediol di(meth)acrylate, and dipentaerythritol hexa(meth)acrylate can be preferably used. The polyfunctional monomer may be used singly or in combination of two or more.

多官能性單體之使用量根據其分子量或官能基數等而不同,通常相對於100重量份聚合物A適宜設為0.01重量份~3.0重量份左右之範圍。於若干種態樣中,多官能性單體之使用量相對於100重量份聚合物A,例如可為0.02重量份以上,亦可為0.03重量份以上。藉由增大多官能性單體之使用量,有抑制貼附初期之黏著力,提高二次加工性之傾向。另一方面,就避免因過度之凝聚力提高所致之黏性降低之觀點而言,多官能性單體之使用量相對於100重量份聚合物A可為2.0重量份以下,可為1.0重量份以下,亦可為0.5重量份以下。多官能性單體之使用量不過多就容易實現N80 /N50 較高之黏著片材之觀點而言亦可能變得有利。The amount of the polyfunctional monomer used varies depending on the molecular weight, the number of functional groups, and the like, and is usually in the range of about 0.01 part by weight to about 3.0 parts by weight based on 100 parts by weight of the polymer A. In some cases, the amount of the polyfunctional monomer used may be, for example, 0.02 parts by weight or more, or 0.03 parts by weight or more, per 100 parts by weight of the polymer A. By increasing the amount of the polyfunctional monomer used, it is possible to suppress the adhesion at the initial stage of the adhesion and to improve the secondary workability. On the other hand, the amount of the polyfunctional monomer to be used may be 2.0 parts by weight or less, and may be 1.0 part by weight, per 100 parts by weight of the polymer A, from the viewpoint of avoiding a decrease in viscosity due to an excessive increase in cohesive force. Hereinafter, it may be 0.5 parts by weight or less. It is also possible that the amount of the polyfunctional monomer used is too large to easily achieve an adhesive sheet having a higher N 80 /N 50 .

(黏著賦予樹脂) 黏著劑層中可視需要含有黏著賦予樹脂。作為黏著賦予樹脂,並無特別限制,例如可列舉:松香系黏著賦予樹脂、萜烯系黏著賦予樹脂、酚系黏著賦予樹脂、烴系黏著賦予樹脂、酮系黏著賦予樹脂、聚醯胺系黏著賦予樹脂、環氧系黏著賦予樹脂、彈性體系黏著賦予樹脂等。黏著賦予樹脂可單獨使用一種或將兩種以上組合而使用。(Adhesive-imparting resin) The adhesive-imparting resin may be contained in the adhesive layer as needed. The adhesiveness-imparting resin is not particularly limited, and examples thereof include a rosin-based adhesion-imparting resin, a terpene-based adhesion-imparting resin, a phenol-based adhesion-imparting resin, a hydrocarbon-based adhesion-imparting resin, a ketone-based adhesion-imparting resin, and a polyamide-based adhesive. A resin, an epoxy-based adhesion-imparting resin, an elastic system adhesion-imparting resin, and the like are provided. The adhesion-imparting resin may be used singly or in combination of two or more.

作為松香系黏著賦予樹脂,例如可列舉:松脂膠、木松香、妥爾油松香等未改性松香(生松香)、或藉由聚合、歧化、氫化等將該等未改性松香改性之改性松香(聚合松香、穩定化松香、歧化松香、完全氫化松香、部分氫化松香、或其他經化學改質之松香等),此外亦可列舉各種松香衍生物等。 作為上述松香衍生物,例如可列舉: 藉由使酚與松香類(未改性松香、改性松香或各種松香衍生物等)於酸觸媒下進行加成並進行熱聚合所獲得之松香酚系樹脂; 利用醇類使未改性松香酯化之松香之酯化合物(未改性松香酯)、或利用醇類使聚合松香、穩定化松香、歧化松香、完全氫化松香、部分氫化松香等改性松香酯化之改性松香之酯化合物(聚合松香酯、穩定化松香酯、歧化松香酯、完全氫化松香酯、部分氫化松香酯等)等松香酯系樹脂; 利用不飽和脂肪酸將未改性松香或改性松香(聚合松香、穩定化松香、歧化松香、完全氫化松香、部分氫化松香等)改性之不飽和脂肪酸改性松香系樹脂; 利用不飽和脂肪酸將松香酯系樹脂改性之不飽和脂肪酸改性松香酯系樹脂; 將未改性松香、改性松香(聚合松香、穩定化松香、歧化松香、完全氫化松香、部分氫化松香等)、不飽和脂肪酸改性松香系樹脂或不飽和脂肪酸改性松香酯系樹脂中之羧基進行還原處理之松香醇系樹脂; 未改性松香、改性松香、或各種松香衍生物等松香系樹脂(尤其是松香酯系樹脂)之金屬鹽等。Examples of the rosin-based adhesion-providing resin include unmodified rosin (raw rosin) such as rosin gum, wood rosin, and tall oil rosin, or modified unmodified rosin by polymerization, disproportionation, hydrogenation, or the like. Modified rosin (polymerized rosin, stabilized rosin, disproportionated rosin, fully hydrogenated rosin, partially hydrogenated rosin, or other chemically modified rosin, etc.), and various rosin derivatives and the like are also exemplified. Examples of the rosin derivative include rosin phenol obtained by adding phenol and rosin (unmodified rosin, modified rosin, or various rosin derivatives) under an acid catalyst and thermally polymerizing it. Resin; an ester compound of rosin esterified with an unmodified rosin by an alcohol (unmodified rosin ester), or a polymerized rosin, stabilized rosin, disproportionated rosin, fully hydrogenated rosin, partially hydrogenated rosin, etc. Rosin ester resin such as rosin esterified modified rosin ester compound (polymerized rosin ester, stabilized rosin ester, disproportionated rosin ester, fully hydrogenated rosin ester, partially hydrogenated rosin ester, etc.); unmodified with unsaturated fatty acid Unsaturated fatty acid modified rosin resin modified with rosin or modified rosin (polymerized rosin, stabilized rosin, disproportionated rosin, fully hydrogenated rosin, partially hydrogenated rosin, etc.); modified with rosin ester resin using unsaturated fatty acid Saturated fatty acid modified rosin ester resin; unmodified rosin, modified rosin (polymerized rosin, stabilized rosin, disproportionated rosin, fully hydrogenated rosin, partially hydrogenated Aromatic resin based on unsaturated fatty acid modified rosin resin or unsaturated fatty acid modified rosin ester resin; rosin alcohol resin; unmodified rosin, modified rosin, or various rosin derivatives A metal salt or the like of a resin (particularly a rosin ester resin).

作為萜烯系黏著賦予樹脂,例如可列舉:α-蒎烯聚合物、β-蒎烯聚合物、雙戊烯聚合物等萜烯系樹脂、或將該等萜烯系樹脂改性(酚改性、芳香族改性、氫化改性、烴改性等)之改性萜烯系樹脂(例如萜烯酚系樹脂、苯乙烯改性萜烯系樹脂、芳香族改性萜烯系樹脂、氫化萜烯系樹脂等)等。Examples of the terpene-based adhesion-imparting resin include a terpene-based resin such as an α-pinene polymer, a β-pinene polymer, and a dipentene polymer, or a modification of the terpene-based resin (phenolic modification) Modified terpene resin (for example, terpene phenol resin, styrene modified terpene resin, aromatic modified terpene resin, hydrogenation) Terpene resin, etc.).

作為酚系黏著賦予樹脂,例如可列舉:各種酚類(例如苯酚、間甲酚、3,5-二甲苯酚、對烷基苯酚、間苯二酚等)與甲醛之縮合物(例如烷基酚系樹脂、二甲苯甲醛系樹脂等)、利用鹼性觸媒使上述酚類與甲醛進行加成反應所獲得之可溶酚醛樹脂、或利用酸觸媒使上述酚類與甲醛進行縮合反應所獲得之酚醛清漆樹脂等。Examples of the phenol-based adhesion-imparting resin include condensates of various phenols (for example, phenol, m-cresol, 3,5-xylenol, p-alkylphenol, resorcin, etc.) and formaldehyde (for example, an alkyl group). a phenol resin, a xylene formaldehyde resin, or the like, a resol resin obtained by subjecting the phenol to formaldehyde with an alkali catalyst, or a condensation reaction of the phenol with formaldehyde by an acid catalyst The obtained novolak resin and the like.

作為烴系黏著賦予樹脂之例,可列舉:脂肪族系烴樹脂、芳香族系烴樹脂、脂肪族系環狀烴樹脂、脂肪族-芳香族系石油樹脂(苯乙烯-烯烴系共聚物等)、脂肪族-脂環族系石油樹脂、氫化烴樹脂、薰草咔系樹脂、薰草咔茚系樹脂等各種烴系樹脂。Examples of the hydrocarbon-based adhesion-imparting resin include an aliphatic hydrocarbon resin, an aromatic hydrocarbon resin, an aliphatic cyclic hydrocarbon resin, and an aliphatic-aromatic petroleum resin (styrene-olefin copolymer). Various hydrocarbon-based resins such as an aliphatic-alicyclic petroleum resin, a hydrogenated hydrocarbon resin, a chlorpyrifos resin, and a kasuga resin.

作為可良好地使用之聚合松香酯之市售品,可例示:荒川化學工業股份有限公司製造之商品名「Pensel D-125」、「Pensel D-135」、「Pensel D-160」、「Pensel KK」、「Pensel C」等,但並不限定於該等。As a commercial product of the polymerized rosin ester which can be used satisfactorily, the product name "Pensel D-125", "Pensel D-135", "Pensel D-160", "Pensel" manufactured by Arakawa Chemical Industry Co., Ltd. can be exemplified. KK", "Pensel C", etc., but not limited to these.

作為可良好地使用之萜烯酚系樹脂之市售品,可例示:Yasuhara Chemical股份有限公司製造之商品名「YS Polystar S-145」、「YS Polystar G-125」、「YS Polystar N125」、「YS Polystar U-115」、荒川化學工業股份有限公司製造之商品名「Tamanol 803L」、「Tamanol 901」、Sumitomo Bakelite股份有限公司製造之商品名「Sumilite resin PR-12603」等,但並不限定於該等。As a commercial item of a terpene phenol type resin which can be used suitably, the brand name "YS Polystar S-145", "YS Polystar G-125", "YS Polystar N125" by Yasuhara Chemical Co., Ltd., YS Polystar U-115, trade name "Tamanol 803L", "Tamanol 901" manufactured by Arakawa Chemical Industry Co., Ltd., and "Sumilite resin PR-12603" manufactured by Sumitomo Bakelite Co., Ltd., but not limited In these.

黏著賦予樹脂之含量並無特別限定,可以根據目的或用途而發揮適當之黏著性能之方式設定。相對於100重量份聚合物A之黏著賦予樹脂之含量(於含有兩種以上之黏著賦予樹脂之情形時為其等之合計量)例如可設為5~500重量份左右。The content of the adhesive-imparting resin is not particularly limited, and can be set in such a manner that appropriate adhesive properties can be exerted depending on the purpose or use. The content of the adhesion-imparting resin to 100 parts by weight of the polymer A (the total amount of the resin to be added in the case of containing two or more types of the adhesion-imparting resin) can be, for example, about 5 to 500 parts by weight.

作為黏著賦予樹脂,可良好地使用軟化點(軟化溫度)約80℃以上(較佳為約100℃以上、例如約120℃以上)者。根據具有上述下限值以上之軟化點之黏著賦予樹脂,容易獲得滿足N80 /N50 ≧5之黏著片材。軟化點之上限並無特別限制,例如可為約200℃以下(典型而言為180℃以下)。再者,黏著賦予樹脂之軟化點可基於JIS K2207所規定之軟化點試驗方法(環球法)進行測定。As the adhesion-imparting resin, a softening point (softening temperature) of about 80 ° C or higher (preferably, about 100 ° C or higher, for example, about 120 ° C or higher) can be preferably used. It is easy to obtain an adhesive sheet satisfying N 80 /N 50 ≧5 based on the adhesion-imparting resin having a softening point equal to or higher than the above lower limit. The upper limit of the softening point is not particularly limited and may be, for example, about 200 ° C or lower (typically 180 ° C or lower). Further, the softening point of the adhesion-imparting resin can be measured based on the softening point test method (ring and ball method) prescribed in JIS K2207.

此外,此處所揭示之技術中之黏著劑層亦可於不明顯妨礙本發明之效果之範圍內,視需要含有調平劑、塑化劑、軟化劑、著色劑(染料、顏料等)、填充劑、抗靜電劑、抗老化劑、紫外線吸收劑、抗氧化劑、光穩定劑、防腐劑等可用於黏著劑之公知添加劑。In addition, the adhesive layer in the technology disclosed herein may also contain a leveling agent, a plasticizer, a softener, a colorant (dye, pigment, etc.), and may be filled as needed within a range that does not significantly impair the effects of the present invention. Agents, antistatic agents, anti-aging agents, ultraviolet absorbers, antioxidants, light stabilizers, preservatives and the like can be used as known additives for the adhesive.

此處所揭示之構成黏著片材之黏著劑層可為黏著劑組合物之硬化層。即,該黏著劑層可藉由將水分散型、溶劑型、光硬化型、熱熔型等黏著劑組合物賦予(例如塗佈)至適當之表面後適當實施硬化處理而形成。於進行兩種以上之硬化處理(乾燥、交聯、聚合、冷卻等)之情形時,該等可同時、或多階段地進行。於使用單體成分之部分聚合物(丙烯酸系聚合物漿液)之黏著劑組合物中,典型而言,作為上述硬化處理,進行最終之共聚反應。即,將部分聚合物供於進一步之共聚反應而形成完全聚合物。例如,若為光硬化性黏著劑組合物,則實施光照射。視需要亦可實施交聯、乾燥等硬化處理。例如於必須以光硬化性黏著劑組合物進行乾燥之情形時,於乾燥後進行光硬化即可。於使用完全聚合物之黏著劑組合物中,典型而言,作為上述硬化處理,視需要實施乾燥(加熱乾燥)、交聯等處理。The adhesive layer constituting the adhesive sheet disclosed herein may be a hardened layer of the adhesive composition. That is, the pressure-sensitive adhesive layer can be formed by applying (for example, applying) an adhesive composition such as a water-dispersible type, a solvent-based type, a photo-curing type, or a hot-melt type to a suitable surface, followed by a suitable curing treatment. In the case where two or more kinds of hardening treatments (drying, crosslinking, polymerization, cooling, etc.) are carried out, these may be carried out simultaneously or in multiple stages. In the adhesive composition using a partial polymer (acrylic polymer slurry) of a monomer component, the final copolymerization reaction is typically carried out as the above-mentioned hardening treatment. That is, a portion of the polymer is supplied to a further copolymerization reaction to form a complete polymer. For example, in the case of a photocurable adhesive composition, light irradiation is performed. Hardening treatment such as cross-linking or drying may be carried out as needed. For example, when it is necessary to dry with a photocurable adhesive composition, photocuring may be performed after drying. In the adhesive composition using a complete polymer, for example, drying (heat drying), crosslinking, or the like is performed as the above-described hardening treatment.

黏著劑組合物之塗佈例如可使用凹版輥式塗佈機、逆輥塗佈機、接觸輥塗佈機、浸漬輥塗機、棒式塗佈機、刮刀塗佈機、噴霧塗佈機等常用之塗佈機而實施。For the application of the adhesive composition, for example, a gravure roll coater, a reverse roll coater, a contact roll coater, a dip roll coater, a bar coater, a knife coater, a spray coater, or the like can be used. It is implemented by a commonly used coater.

黏著劑層之厚度並無特別限定,例如可設為1 μm以上。於若干種態樣中,黏著劑層之厚度例如可為3 μm以上,可為5 μm以上,可為8 μm以上,可為10 μm以上,可為15 μm以上,亦可為20 μm以上或超過20 μm。藉由增大黏著劑層之厚度,有加熱後黏著力上升之傾向。又,於若干種態樣中,黏著劑層之厚度例如可為300 μm以下,可為200 μm以下,可為150 μm以下,可為100 μm以下,可為70 μm以下,可為50 μm以下,亦可為40 μm以下。黏著劑層之厚度不過大就黏著片材之薄型化或黏著劑層之凝聚破壞防止等觀點而言可能變得有利。再者,於在基材之第一面及第二面具有第一黏著劑層及第二黏著劑層之黏著片材之情形時,上述黏著劑層之厚度至少可應用於第一黏著劑層之厚度。第二黏著劑層之厚度亦可自相同之範圍選擇。又,於無基材之黏著片材之情形時,該黏著片材之厚度與黏著劑層之厚度一致。The thickness of the adhesive layer is not particularly limited, and may be, for example, 1 μm or more. In some aspects, the thickness of the adhesive layer may be, for example, 3 μm or more, may be 5 μm or more, may be 8 μm or more, may be 10 μm or more, may be 15 μm or more, or may be 20 μm or more or More than 20 μm. By increasing the thickness of the adhesive layer, there is a tendency for the adhesive force to rise after heating. Further, in some aspects, the thickness of the adhesive layer may be, for example, 300 μm or less, may be 200 μm or less, may be 150 μm or less, may be 100 μm or less, may be 70 μm or less, or may be 50 μm or less. It can also be 40 μm or less. If the thickness of the adhesive layer is too large, it may be advantageous from the viewpoints of thinning of the adhesive sheet or prevention of aggregation damage of the adhesive layer. Furthermore, in the case where the first adhesive layer and the second adhesive layer are provided on the first side and the second side of the substrate, the thickness of the adhesive layer can be applied to at least the first adhesive layer. The thickness. The thickness of the second adhesive layer can also be selected from the same range. Further, in the case of a substrate-free adhesive sheet, the thickness of the adhesive sheet is the same as the thickness of the adhesive layer.

構成黏著劑層之黏著劑之凝膠分率通常適宜處於20.0%~99.0%之範圍,較理想為處於30.0%~90.0%之範圍,但並無特別限定。藉由將凝膠分率設為上述範圍,容易實現以高水準兼顧貼附初期之二次加工性與黏著力上升後之強黏著性之黏著片材。凝膠分率係藉由以下之方法進行測定。The gel fraction of the adhesive constituting the adhesive layer is usually in the range of 20.0% to 99.0%, preferably in the range of 30.0% to 90.0%, but is not particularly limited. By setting the gel fraction to the above range, it is easy to achieve an adhesive sheet having a high level of compatibility between the secondary workability at the initial stage of adhesion and the strong adhesion after the adhesion is increased. The gel fraction was measured by the following method.

[凝膠分率之測定] 將約0.1 g之黏著劑樣品(重量Wg1 )利用平均孔徑0.2 μm之多孔質聚四氟乙烯膜(重量Wg2 )包裹成荷包狀,並利用風箏線(重量Wg3 )將口紮緊。作為上述多孔質聚四氟乙烯膜,使用商品名「Nitoflon(註冊商標)NTF1122」(日東電工股份有限公司,平均孔徑0.2 μm,氣孔率75%,厚度85 μm)或其相當品。將該包裹物浸漬於乙酸乙酯50 mL中,於室溫(典型為23℃)下保持7天而使黏著劑中之溶膠成分(乙酸乙酯可溶分)溶出至上述膜外。繼而,取出上述包裹物,擦去附著於外表面之乙酸乙酯後,使該包裹物於130℃下乾燥2小時,測定該包裹物之重量(Wg4 )。藉由將各值代入以下之式中,可算出黏著劑之凝膠分率GC 。 凝膠分率GC (%)=[(Wg4 -Wg2 -Wg3 )/Wg1 ]×100[Measurement of gel fraction] Approximately 0.1 g of the adhesive sample (weight Wg 1 ) was wrapped into a purse shape using a porous polytetrafluoroethylene film (weight Wg 2 ) having an average pore diameter of 0.2 μm, and a kite line (weight) was used. Wg 3 ) Tightening the mouth. As the porous polytetrafluoroethylene film, the trade name "Nitoflon (registered trademark) NTF1122" (Nitto Denko Co., Ltd., average pore diameter: 0.2 μm, porosity: 75%, thickness: 85 μm) or its equivalent was used. The wrap was immersed in 50 mL of ethyl acetate, and kept at room temperature (typically 23 ° C) for 7 days to elute the sol component (ethyl acetate soluble fraction) in the adhesive to the outside of the film. Then, the above-mentioned wrap was taken out, the ethyl acetate adhered to the outer surface was wiped off, and the wrap was dried at 130 ° C for 2 hours, and the weight (Wg 4 ) of the wrap was measured. The gel fraction G C of the adhesive can be calculated by substituting each value into the following formula. Gel fraction G C (%) = [(Wg 4 - Wg 2 - Wg 3 ) / Wg 1 ] × 100

<支持基材> 若干種態樣之黏著片材可為於支持基材之單面或雙面具備黏著劑層之附基材之黏著片材之形態。支持基材之材質並無特別限定,可根據黏著片材之使用目的或使用態樣等而適當選擇。作為可使用之基材之非限定性之例,可列舉:聚丙烯或乙烯-丙烯共聚物等以聚烯烴作為主成分之聚烯烴膜、聚對苯二甲酸乙二酯或聚對苯二甲酸丁二酯等以聚酯作為主成分之聚酯膜、以聚氯乙烯作為主成分之聚氯乙烯膜等塑膠膜;聚胺基甲酸酯發泡體、聚乙烯發泡體、聚氯丁二烯發泡體等包含發泡體之發泡體片材;各種纖維狀物質(可為麻、棉等天然纖維、聚酯、維尼綸等合成纖維、乙酸酯等半合成纖維等)之單獨或利用混紡等所形成之織布及不織布;日本紙、道林紙、牛皮紙、皺紋紙等紙類;鋁箔、銅箔等金屬箔等。亦可為將該等複合而成之構成之基材。作為此種複合基材之例,例如可列舉:積層有金屬箔與上述塑膠膜之構造之基材、玻璃布等經無機纖維強化之塑膠基材等。<Support Substrate> A plurality of types of adhesive sheets may be in the form of an adhesive sheet attached to a substrate having an adhesive layer on one side or both sides of the support substrate. The material of the support substrate is not particularly limited, and may be appropriately selected depending on the purpose of use of the adhesive sheet or the use state. Non-limiting examples of the substrate that can be used include a polyolefin film containing a polyolefin as a main component such as polypropylene or an ethylene-propylene copolymer, polyethylene terephthalate or polyterephthalic acid. a polyester film such as a polyester film containing polyester as a main component, a polyvinyl chloride film containing polyvinyl chloride as a main component, a polyurethane foam, a polyethylene foam, and a polychloroprene A foam sheet containing a foam such as a diene foam; various fibrous materials (may be natural fibers such as hemp and cotton, synthetic fibers such as polyester and vinylon, and semi-synthetic fibers such as acetate). Woven fabrics and non-woven fabrics formed by blending or the like; papers such as Japanese paper, Daolin paper, kraft paper, and crepe paper; metal foils such as aluminum foil and copper foil. It may also be a substrate composed of these composite materials. Examples of the composite base material include a base material having a metal foil and a structure of the plastic film, and a plastic base material reinforced with an inorganic fiber such as a glass cloth.

作為此處所揭示之黏著片材之基材,可良好地使用各種膜基材。上述膜基材可為如發泡體膜或不織布片材等般多孔質之基材,可為非多孔質之基材,亦可為積層有多孔質層與非多孔質層之構造之基材。於若干種態樣中,作為上述膜基材,可良好地使用包含能夠獨立地維持形狀之(自立型或非依存性之)樹脂膜作為基底膜者。此處所謂「樹脂膜」係指非多孔質之結構,且典型而言係指實質上不含氣泡之(無孔隙之)樹脂膜。因此,上述樹脂膜之概念區別於發泡體膜或不織布。作為上述樹脂膜,可良好地使用能夠獨立地維持形狀之(自立型、或非依存性)者。上述樹脂膜可為單層構造,亦可為兩層以上之多層構造(例如三層構造)。As the substrate of the adhesive sheet disclosed herein, various film substrates can be favorably used. The film substrate may be a porous substrate such as a foam film or a non-woven sheet, and may be a non-porous substrate or a substrate having a structure in which a porous layer and a non-porous layer are laminated. . In a plurality of aspects, as the film substrate, a resin film containing a (self-standing or non-dependent) resin film capable of independently maintaining a shape can be preferably used as the base film. The term "resin film" as used herein refers to a non-porous structure, and typically refers to a (non-porous) resin film that does not substantially contain bubbles. Therefore, the concept of the above resin film is different from that of a foam film or a nonwoven fabric. As the resin film, those capable of independently maintaining the shape (self-standing or non-dependent) can be used favorably. The resin film may have a single layer structure or a multilayer structure of two or more layers (for example, a three-layer structure).

作為構成樹脂膜之樹脂材料,例如可列舉:聚酯、聚烯烴、尼龍6、尼龍66、部分芳香族聚醯胺等聚醯胺(PA)、聚醯亞胺(PI)、聚醯胺醯亞胺(PAI)、聚醚醚酮(PEEK)、聚醚碸(PES)、聚苯硫醚(PPS)、聚碳酸酯(PC)、聚胺基甲酸酯(PU)、乙烯-乙酸乙烯酯共聚物(EVA)、聚四氟乙烯(PTFE)等氟樹脂、丙烯酸系樹脂、聚丙烯酸酯、聚苯乙烯、聚氯乙烯、聚偏二氯乙烯等樹脂。上述樹脂膜可為使用單獨含有此種樹脂之一種之樹脂材料所形成者,亦可為使用摻合有兩種以上之樹脂材料所形成者。上述樹脂膜可未經延伸,亦可為經延伸(例如單軸延伸或雙軸延伸)者。Examples of the resin material constituting the resin film include polyamine (PA) such as polyester, polyolefin, nylon 6, nylon 66, and partially aromatic polyamine, polyimine (PI), and polyamidoxime. Imine (PAI), polyetheretherketone (PEEK), polyether oxime (PES), polyphenylene sulfide (PPS), polycarbonate (PC), polyurethane (PU), ethylene vinyl acetate A resin such as an ester copolymer (EVA) or a fluororesin such as polytetrafluoroethylene (PTFE), an acrylic resin, a polyacrylate, a polystyrene, a polyvinyl chloride or a polyvinylidene chloride. The resin film may be formed by using a resin material containing one of the resins alone, or may be formed by using two or more kinds of resin materials. The above resin film may be unextended or may be extended (for example, uniaxially stretched or biaxially stretched).

作為構成樹脂膜之樹脂材料之較佳例,可列舉聚酯系樹脂、PPS樹脂及聚烯烴系樹脂。此處,所謂聚酯系樹脂係指以超過50重量%之比率含有聚酯之樹脂。同樣地,所謂PPS樹脂係指以超過50重量%之比率含有PPS之樹脂,所謂聚烯烴系樹脂係指以超過50重量%之比率含有聚烯烴之樹脂。Preferable examples of the resin material constituting the resin film include a polyester resin, a PPS resin, and a polyolefin resin. Here, the polyester resin refers to a resin containing polyester in a ratio of more than 50% by weight. Similarly, the PPS resin refers to a resin containing PPS in a ratio of more than 50% by weight, and the polyolefin resin refers to a resin containing polyolefin in a ratio of more than 50% by weight.

作為聚酯系樹脂,典型而言,使用含有將二羧酸與二醇進行縮聚所獲得之聚酯作為主成分之聚酯系樹脂。As the polyester-based resin, a polyester-based resin containing a polyester obtained by polycondensing a dicarboxylic acid and a diol as a main component is typically used.

作為構成上述聚酯之二羧酸,例如可列舉:鄰苯二甲酸、間苯二甲酸、對苯二甲酸、2-甲基對苯二甲酸、5-磺基間苯二甲酸、4,4'-二苯基二羧酸、4,4'-二苯基醚二羧酸、4,4'-二苯基酮二羧酸、4,4'-二苯氧基乙烷二羧酸、4,4'-二苯基碸二羧酸、1,4-萘二羧酸、1,5-萘二羧酸、2,6-萘二羧酸、2,7-萘二羧酸等芳香族二羧酸;1,2-環己烷二羧酸、1,3-環己烷二羧酸、1,4-環己烷二羧酸等脂環式二羧酸;丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十二烷酸等脂肪族二羧酸;順丁烯二酸、順丁烯二酸酐、反丁烯二酸等不飽和二羧酸;該等之衍生物(例如對苯二甲酸等上述二羧酸之低級烷基酯等)等。該等可單獨使用一種或將兩種以上組合而使用。就強度等觀點而言,較佳為芳香族二羧酸。其中,作為較佳之二羧酸,可列舉對苯二甲酸及2,6-萘二羧酸。例如較佳為構成上述聚酯之二羧酸中之50重量%以上(例如80重量%以上、典型為95重量%以上)為對苯二甲酸、2,6-萘二羧酸或該等之併用。上述二羧酸亦可實質上僅由對苯二甲酸構成、實質上僅由2,6-萘二羧酸構成、或實質上僅由對苯二甲酸及2,6-萘二羧酸構成。Examples of the dicarboxylic acid constituting the polyester include phthalic acid, isophthalic acid, terephthalic acid, 2-methylterephthalic acid, 5-sulfoisophthalic acid, and 4,4. '-Diphenyldicarboxylic acid, 4,4'-diphenyl ether dicarboxylic acid, 4,4'-diphenyl ketone dicarboxylic acid, 4,4'-diphenoxyethane dicarboxylic acid, Aromatic compounds such as 4,4'-diphenylstilbene dicarboxylic acid, 1,4-naphthalene dicarboxylic acid, 1,5-naphthalene dicarboxylic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid a dicarboxylic acid; an alicyclic dicarboxylic acid such as 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid or 1,4-cyclohexanedicarboxylic acid; malonic acid, amber An aliphatic dicarboxylic acid such as acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid or dodecanoic acid; maleic acid, maleic anhydride, anti An unsaturated dicarboxylic acid such as butenedioic acid; a derivative such as a lower alkyl ester of the above dicarboxylic acid such as terephthalic acid; and the like. These may be used alone or in combination of two or more. From the viewpoint of strength and the like, an aromatic dicarboxylic acid is preferred. Among them, preferred examples of the dicarboxylic acid include terephthalic acid and 2,6-naphthalene dicarboxylic acid. For example, it is preferred that 50% by weight or more (for example, 80% by weight or more, and typically 95% by weight or more) of the dicarboxylic acid constituting the polyester is terephthalic acid, 2,6-naphthalenedicarboxylic acid or the like. And use it. The dicarboxylic acid may be substantially composed only of terephthalic acid, substantially consisting of only 2,6-naphthalene dicarboxylic acid, or substantially only terephthalic acid and 2,6-naphthalene dicarboxylic acid.

作為構成上述聚酯之二醇,例如可列舉:乙二醇、二乙二醇、聚乙二醇、丙二醇、聚丙二醇、1,3-丙烷二醇、1,5-戊二醇、新戊二醇、1,4-丁二醇、1,6-己二醇、1,8-辛二醇、聚氧四亞甲基二醇等脂肪族二醇;1,2-環己二醇、1,4-環己二醇、1,1-環己烷二羥甲基、1,4-環己烷二羥甲基等脂環式二醇、苯二甲醇、4,4'-二羥基聯苯、2,2-雙(4'-羥基苯基)丙烷、雙(4-羥基苯基)碸等芳香族二醇等。該等可單獨使用一種或將兩種以上組合而使用。其中,就透明性等觀點而言,較佳為脂肪族二醇,尤佳為乙二醇。脂肪族二醇(較佳為乙二醇)於構成上述聚酯之二醇中所占之比率較佳為50重量%以上(例如80重量%以上、典型為95重量%以上)。上述二醇亦可實質上僅由乙二醇構成。Examples of the diol constituting the polyester include ethylene glycol, diethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol, 1,3-propanediol, 1,5-pentanediol, and neopentane. An aliphatic diol such as a diol, 1,4-butanediol, 1,6-hexanediol, 1,8-octanediol or polyoxytetramethylene glycol; 1,2-cyclohexanediol, An alicyclic diol such as 1,4-cyclohexanediol, 1,1-cyclohexanedimethylol, 1,4-cyclohexanedimethylol, benzenedimethanol, 4,4'-dihydroxyl An aromatic diol such as biphenyl, 2,2-bis(4'-hydroxyphenyl)propane or bis(4-hydroxyphenyl)fluorene. These may be used alone or in combination of two or more. Among them, from the viewpoint of transparency and the like, an aliphatic diol is preferred, and ethylene glycol is particularly preferred. The ratio of the aliphatic diol (preferably ethylene glycol) to the diol constituting the polyester is preferably 50% by weight or more (for example, 80% by weight or more, and typically 95% by weight or more). The above diol may also consist essentially of only ethylene glycol.

作為聚酯系樹脂之具體例,可列舉:聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丁二酯(PBT)、聚萘二甲酸乙二酯(PEN)、聚萘二甲酸丁二酯等。Specific examples of the polyester resin include polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), and polynaphthalene. Butylene formate and the like.

作為聚烯烴樹脂,可單獨使用一種聚烯烴、或將兩種以上之聚烯烴組合而使用。該聚烯烴例如可為α-烯烴之均聚物、兩種以上之α-烯烴之共聚物、一種或兩種以上之α-烯烴與其他乙烯基單體之共聚物等。作為具體例,可列舉:聚乙烯(PE)、聚丙烯(PP)、聚-1-丁烯、聚-4-甲基-1-戊烯、乙烯丙烯橡膠(EPR)等乙烯-丙烯共聚物、乙烯-丙烯-丁烯共聚物、乙烯-丁烯共聚物、乙烯-乙烯醇共聚物、乙烯-丙烯酸乙酯共聚物等。可使用低密度(LD)聚烯烴及高密度(HD)聚烯烴之任一者。作為聚烯烴樹脂膜之例,可列舉:未延伸聚丙烯(CPP)膜、雙軸延伸聚丙烯(OPP)膜、低密度聚乙烯(LDPE)膜、直鏈狀低密度聚乙烯(LLDPE)膜、中密度聚乙烯(MDPE)膜、高密度聚乙烯(HDPE)膜、摻合有兩種以上之聚乙烯(PE)之聚乙烯(PE)膜、摻合有聚丙烯(PP)與聚乙烯(PE)之PP/PE摻合膜等。As the polyolefin resin, one type of polyolefin or two or more types of polyolefins may be used alone. The polyolefin may be, for example, a homopolymer of an α-olefin, a copolymer of two or more kinds of α-olefins, a copolymer of one or two or more α-olefins and another vinyl monomer, or the like. Specific examples thereof include ethylene-propylene copolymers such as polyethylene (PE), polypropylene (PP), poly-1-butene, poly-4-methyl-1-pentene, and ethylene propylene rubber (EPR). An ethylene-propylene-butene copolymer, an ethylene-butene copolymer, an ethylene-vinyl alcohol copolymer, an ethylene-ethyl acrylate copolymer, or the like. Any of low density (LD) polyolefins and high density (HD) polyolefins can be used. Examples of the polyolefin resin film include an unstretched polypropylene (CPP) film, a biaxially oriented polypropylene (OPP) film, a low density polyethylene (LDPE) film, and a linear low density polyethylene (LLDPE) film. Medium density polyethylene (MDPE) film, high density polyethylene (HDPE) film, polyethylene (PE) film blended with two or more kinds of polyethylene (PE), blended with polypropylene (PP) and polyethylene (PE) PP/PE blended film, etc.

作為可良好地用作此處所揭示之黏著片材之基底膜之樹脂膜之具體例,可列舉PET膜、PEN膜、PPS膜、PEEK膜、CPP膜及OPP膜。作為就強度或尺寸穩定性之觀點而言較佳之基底膜之例,可列舉PET膜、PEN膜、PPS膜及PEEK膜。就基材之獲取容易性等觀點而言,尤佳為PET膜及PPS膜,其中較佳為PET膜。Specific examples of the resin film which can be suitably used as the base film of the adhesive sheet disclosed herein include a PET film, a PEN film, a PPS film, a PEEK film, a CPP film, and an OPP film. Examples of the base film which is preferable from the viewpoint of strength or dimensional stability include a PET film, a PEN film, a PPS film, and a PEEK film. From the viewpoints of ease of obtaining the substrate, etc., a PET film and a PPS film are preferable, and among them, a PET film is preferable.

於樹脂膜中,可於不明顯妨礙本發明之效果之範圍內,視需要調配光穩定劑、抗氧化劑、抗靜電劑、著色劑(染料、顏料等)、填充材、滑澤劑、抗黏連劑等公知之添加劑。添加劑之調配量並無特別限定,可根據黏著片材之用途等而適當設定。In the resin film, light stabilizers, antioxidants, antistatic agents, colorants (dyes, pigments, etc.), fillers, slip agents, anti-adhesives may be blended as needed within a range that does not significantly impair the effects of the present invention. A known additive such as a continuous agent. The amount of the additive to be added is not particularly limited and may be appropriately set depending on the use of the adhesive sheet or the like.

樹脂膜之製造方法並無特別限定。例如可適當採用擠出成形、吹脹成形、T模壓鑄成形、砑光輥成形等先前公知之一般之樹脂膜成形方法。The method for producing the resin film is not particularly limited. For example, a conventionally known general resin film forming method such as extrusion molding, inflation molding, T-die die-casting, or calender roll molding can be suitably employed.

上述基材可為實質上包含此種基底膜者。或者,上述基材亦可為除了包含上述基底膜以外,亦包含輔助層者。作為上述輔助層之例,可列舉:光學特性調整層(例如著色層、抗反射層)、用以對基材賦予所需之外觀之印刷層或層壓層、抗靜電層、底塗層、剝離層等表面處理層。The above substrate may be one that substantially comprises such a base film. Alternatively, the substrate may be an auxiliary layer in addition to the base film. Examples of the auxiliary layer include an optical property adjusting layer (for example, a coloring layer and an antireflection layer), a printing layer or a laminate layer for imparting a desired appearance to a substrate, an antistatic layer, and an undercoat layer. A surface treatment layer such as a release layer.

基材之厚度並無特別限定,可根據黏著片材之使用目的或使用態樣等而選擇。基材之厚度例如可為1000 μm以下。於若干種態樣中,就黏著片材之操作性或加工性之觀點而言,基材之厚度例如可為500 μm以下,可為300 μm以下,可為250 μm以下,亦可為200 μm以下。就應用黏著片材之製品之小型化或輕量化之觀點而言,於若干種態樣中,基材之厚度例如可為160 μm以下,可為130 μm以下,可為100 μm以下,可為90 μm以下,可為70 μm以下,可為50 μm以下,可為25 μm以下,可為10 μm以下,亦可為5 μm以下。若基材之厚度變小,則有黏著片材之柔軟性或對被黏著體之表面形狀之追隨性提高之傾向。又,就操作性或加工性等觀點而言,基材之厚度例如可為2 μm以上,可為5 μm以上,可為10 μm以上,可為20 μm以上,亦可為25 μm以上或超過25 μm。於若干種態樣中,基材之厚度例如可為30 μm以上,可為35 μm以上,可為55 μm以上,可為75 μm以上,亦可為120 μm以上。例如於可以被黏著體之補強、支持、衝擊緩和等為目的而使用之黏著片材中,可良好地採用厚度30 μm以上之基材。The thickness of the substrate is not particularly limited, and may be selected depending on the purpose of use of the adhesive sheet, the use state, and the like. The thickness of the substrate may be, for example, 1000 μm or less. In a plurality of aspects, the thickness of the substrate may be, for example, 500 μm or less, and may be 300 μm or less, 250 μm or less, or 200 μm from the viewpoint of handleability or workability of the adhesive sheet. the following. The thickness of the substrate may be, for example, 160 μm or less, and may be 130 μm or less, and may be 100 μm or less, from the viewpoint of miniaturization or weight reduction of the article to which the adhesive sheet is applied. 90 μm or less, 70 μm or less, 50 μm or less, 25 μm or less, 10 μm or less, or 5 μm or less. When the thickness of the base material is small, the flexibility of the adhesive sheet or the followability to the surface shape of the adherend tends to be improved. Further, the thickness of the substrate may be, for example, 2 μm or more, and may be 5 μm or more, 10 μm or more, 20 μm or more, or 25 μm or more, or more, from the viewpoints of workability and workability. 25 μm. In some cases, the thickness of the substrate may be, for example, 30 μm or more, 35 μm or more, 55 μm or more, 75 μm or more, or 120 μm or more. For example, in an adhesive sheet which can be used for reinforcement, support, impact relaxation, and the like of the adhesive, a substrate having a thickness of 30 μm or more can be preferably used.

視需要亦可對基材之第一面實施電暈放電處理、電漿處理、紫外線照射處理、酸處理、鹼處理、利用底塗劑(primer)之塗佈形成底塗層等先前公知之表面處理。此種表面處理可為用於提高黏著劑層對基材之抓固性之處理。例如於具備含有樹脂膜作為基底膜之基材之黏著片材中,可良好地採用經實施該抓固性提高處理之基材。上述表面處理可單獨應用或組合應用。底塗層之形成所使用之底塗劑之組成並無特別限定,可自公知者中適當選擇。底塗層之厚度並無特別限制,通常適宜為0.01 μm~1 μm左右,較佳為0.1 μm~1 μm左右。作為視需要可對基材之第一面實施之其他處理,可列舉抗靜電層形成處理、著色層形成處理、印刷處理等。If necessary, the first surface of the substrate may be subjected to a corona discharge treatment, a plasma treatment, an ultraviolet irradiation treatment, an acid treatment, an alkali treatment, or a primer coating to form a primer layer or the like. deal with. Such a surface treatment can be a treatment for improving the grip of the adhesive layer on the substrate. For example, in the adhesive sheet having the substrate including the resin film as the base film, the substrate subjected to the improvement in the gripping property can be suitably used. The above surface treatments can be applied individually or in combination. The composition of the primer used for the formation of the undercoat layer is not particularly limited, and can be appropriately selected from known ones. The thickness of the undercoat layer is not particularly limited, but is usually about 0.01 μm to 1 μm, preferably about 0.1 μm to 1 μm. Other treatments that can be performed on the first surface of the substrate as needed include an antistatic layer forming treatment, a colored layer forming treatment, a printing treatment, and the like.

於此處所揭示之黏著片材為僅於基材之第一面具有黏著劑層之單面黏著片材之形態之情形時,亦可對基材之第二面視需要實施剝離處理或抗靜電處理等先前公知之表面處理。例如可藉由利用剝離處理劑對基材之背面進行表面處理(典型而言,藉由設置利用剝離處理劑所形成之剝離層),而使捲繞成捲狀之形態之黏著片材之解捲力變輕。作為剝離處理劑,可使用聚矽氧系剝離處理劑、長鏈烷基系剝離處理劑、烯烴系剝離處理劑、氟系剝離處理劑、脂肪酸醯胺系剝離處理劑、硫化鉬、二氧化矽粉等。又,亦可以提高印字性、降低光反射性、提高重疊貼合性等為目的,對基材之第二面實施電暈放電處理、電漿處理、紫外線照射處理、酸處理、鹼處理等處理。又,於雙面黏著片材之情形時,視需要亦可對基材之第二面實施與作為可對基材之第一面實施之表面處理於上述中所例示者相同之表面處理。再者,對基材之第一面實施之表面處理與對第二面實施之表面處理可相同亦可不同。When the adhesive sheet disclosed herein is in the form of a single-sided adhesive sheet having an adhesive layer on the first side of the substrate, the second side of the substrate may be subjected to a peeling treatment or antistatic treatment as needed. Processing such as previously known surface treatments. For example, the surface of the substrate can be surface-treated by a release treatment agent (typically, by providing a release layer formed by a release treatment agent), and the adhesive sheet of the form wound into a roll can be obtained. The rolling force is lighter. As the release treatment agent, a polyfluorene-based release treatment agent, a long-chain alkyl release treatment agent, an olefin-based release treatment agent, a fluorine-based release treatment agent, a fatty acid amide-based release treatment agent, molybdenum sulfide, and cerium oxide can be used. Powder and so on. Further, for the purpose of improving printability, reducing light reflectivity, and improving lamination adhesion, the second surface of the substrate may be subjected to corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, acid treatment, alkali treatment, or the like. . Further, in the case of a double-sided adhesive sheet, the second surface of the substrate may be subjected to the same surface treatment as that exemplified above as the surface treatment which can be performed on the first surface of the substrate, as needed. Further, the surface treatment performed on the first side of the substrate may be the same as or different from the surface treatment performed on the second side.

<黏著片材> (黏著片材之特性等) 此處所揭示之黏著片材由於黏著力N80 (加熱後黏著力)相對於黏著力N50 之比、即N80 /N50 為5以上,故而於在貼附初期可能施加50℃左右之溫度之使用態樣中亦顯示出良好之二次加工性,且可藉由其後之加熱等而使黏著力大幅地上升。就獲得更高之效果之觀點而言,於若干種態樣中,N80 /N50 例如可為7以上,可為10以上,可為15以上,亦可為20以上。N80 /N50 之上限並無特別限制,就黏著片材之製造容易性或經濟性之觀點而言,例如可為80以下,可為60以下,可為50以下,亦可為40以下。此處所揭示之黏著片材可以N80 /N50 例如為5以上且60以下、7以上且50以下、或10以上且40以下之態樣良好地實施。<Adhesive sheet> (Characteristics of the adhesive sheet, etc.) The adhesive sheet disclosed herein has a ratio of the adhesive force N 80 (adhesive force after heating) to the adhesive force N 50 , that is, N 80 /N 50 is 5 or more. Therefore, in the use form in which a temperature of about 50 ° C is applied at the initial stage of attachment, good secondary workability is also exhibited, and the adhesion can be greatly increased by heating or the like thereafter. From the viewpoint of obtaining a higher effect, in some kinds of aspects, N 80 /N 50 may be, for example, 7 or more, may be 10 or more, may be 15 or more, or may be 20 or more. The upper limit of the N 80 /N 50 is not particularly limited, and may be, for example, 80 or less, and may be 60 or less, and may be 50 or less, or 40 or less, from the viewpoint of ease of production of the adhesive sheet or economy. The adhesive sheet disclosed herein can be suitably carried out in such a manner that N 80 /N 50 is 5 or more and 60 or less, 7 or more and 50 or less, or 10 or more and 40 or less.

於此處所揭示之黏著片材之若干種態樣中,黏著力N50 [N/25 mm]相對於黏著力N23 [N/25 mm]之比、即N50 /N23 例如可未達10,較佳為未達7,亦可未達5或未達4,但並無特別限定。根據N50 /N23 較小之黏著片材,於在貼附初期可能施加50℃左右之溫度之使用態樣中亦有發揮出良好之二次加工性之傾向。N50 /N23 之下限並無特別限定,通常為1.0以上,典型而言超過1.0,例如亦可為1.2以上。In several aspects of the adhesive sheet disclosed herein, the ratio of the adhesive force N 50 [N/25 mm] to the adhesive force N 23 [N/25 mm], that is, N 50 /N 23 may not be reached. 10, preferably less than 7, may not be 5 or less than 4, but is not particularly limited. The adhesive sheet having a small N 50 /N 23 tends to exhibit good secondary workability in a use form in which a temperature of about 50 ° C may be applied at the initial stage of attachment. The lower limit of N 50 /N 23 is not particularly limited, but is usually 1.0 or more, and typically exceeds 1.0, and may be, for example, 1.2 or more.

於此處所揭示之黏著片材之若干種態樣中,黏著力N80 [N/25 mm]相對於黏著力N23 [N/25 mm]之比、即N80 /N23 例如可為7以上,可為10以上,亦可為15以上,但並無特別限定。根據N80 /N23 較大之黏著片材,可以更高水準發揮出貼附初期之低黏著性及黏著力上升後之強黏著性。此處所揭示之黏著片材亦可以N80 /N23 為例如20以上、30以上或40以上之態樣良好地實施。N80 /N23 之上限並無特別限制,就黏著片材之製造容易性或經濟性之觀點而言,例如可為100以下,可為80以下,可為60以下,亦可為50以下。In several aspects of the adhesive sheet disclosed herein, the ratio of the adhesive force N 80 [N/25 mm] to the adhesive force N 23 [N/25 mm], that is, N 80 /N 23 can be, for example, 7 The above may be 10 or more, and may be 15 or more, but is not particularly limited. According to the N 80 /N 23 large adhesive sheet, the low adhesion at the initial stage of adhesion and the strong adhesion after the adhesion is increased can be exhibited at a higher level. The adhesive sheet disclosed herein can also be suitably carried out in such a manner that N 80 /N 23 is, for example, 20 or more, 30 or more, or 40 or more. The upper limit of the N 80 /N 23 is not particularly limited, and may be, for example, 100 or less, and may be 80 or less, and may be 60 or less, or 50 or less, from the viewpoint of ease of production of the adhesive sheet or economy.

此處,黏著力N23 [N/25 mm]係藉由如下方式獲得,即,於壓接於作為被黏著體之不鏽鋼(SUS)板並於23℃、50%RH之環境下放置30分鐘後,於剝離角度180度、拉伸速度300 mm/min之條件下測定180°剝離黏著力。黏著力N50 [N/25 mm]係藉由如下方式獲得,即,壓接於作為被黏著體之不鏽鋼(SUS)板並於50℃之環境下保持30分鐘,繼而於23℃、50%RH之環境下放置30分鐘後,於剝離角度180度、拉伸速度300 mm/min之條件下測定180°剝離黏著力。黏著力N80 [N/25 mm]係藉由如下方式獲得,即,壓接於作為被黏著體之SUS板並於80℃下加熱5分鐘,繼而於23℃、50%RH之環境下放置30分鐘後,於剝離角度180度、拉伸速度300 mm/min之條件下測定180°剝離黏著力。作為被黏著體,於黏著力N23 、N50 、N80 之任一者之測定中,均使用SUS304BA板。於測定時,視需要對測定對象之黏著片材貼附適當之襯底材(例如厚度25 μm左右之PET膜)而進行補強。黏著力N23 、N50 、N80 更具體而言可依據下述實施例所記載之方法進行測定。Here, the adhesive force N 23 [N/25 mm] is obtained by crimping on a stainless steel (SUS) plate as an adherend and placing it in an environment of 23 ° C, 50% RH for 30 minutes. Thereafter, the 180° peel adhesion was measured under the conditions of a peeling angle of 180 degrees and a tensile speed of 300 mm/min. The adhesive force N 50 [N/25 mm] was obtained by crimping on a stainless steel (SUS) plate as an adherend and holding it at 50 ° C for 30 minutes, followed by 23 ° C, 50%. After standing for 30 minutes in an RH environment, the 180° peel adhesion was measured under the conditions of a peeling angle of 180 degrees and a tensile speed of 300 mm/min. The adhesive force N 80 [N/25 mm] was obtained by crimping on a SUS plate as an adherend and heating at 80 ° C for 5 minutes, followed by placing at 23 ° C, 50% RH. After 30 minutes, the 180° peel adhesion was measured under the conditions of a peeling angle of 180 degrees and a stretching speed of 300 mm/min. As the adherend, a SUS304BA plate was used for the measurement of any of the adhesive forces N 23 , N 50 and N 80 . At the time of measurement, if necessary, a suitable substrate (for example, a PET film having a thickness of about 25 μm) is attached to the adhesive sheet to be measured and reinforced. More specifically, the adhesion forces N 23 , N 50 and N 80 can be measured according to the methods described in the following examples.

於此處所揭示之黏著片材之若干種態樣中,該黏著片材之黏著力N23 例如可為2.0 N/25 mm以下,可未達1.5 N/25 mm,可為1.2 N/25 mm以下,可為1.0 N/25 mm以下,亦可為0.8 N/25 mm以下,但並無特別限定。黏著力N23 較低就二次加工性之觀點而言較佳。黏著力N23 之下限並無特別限制,例如可為0.01 N/25 mm以上。就對被黏著體之貼附作業性、或防止黏著力上升前之位置偏移等之觀點而言,黏著力N23 通常適宜為0.1 N/25 mm以上。就加熱後黏著力之提高等觀點而言,於若干種態樣中,黏著力N23 例如可為0.2 N/25 mm以上,可為0.3 N/25 mm以上,可為0.4 N/25 mm以上,亦可為0.5 N/25 mm以上。In several aspects of the adhesive sheet disclosed herein, the adhesive sheet N 23 may be, for example, 2.0 N/25 mm or less, or less than 1.5 N/25 mm, and may be 1.2 N/25 mm. Hereinafter, it may be 1.0 N/25 mm or less, or may be 0.8 N/25 mm or less, but is not particularly limited. The lower adhesive strength N 23 is preferred from the viewpoint of secondary workability. The lower limit of the adhesive force N 23 is not particularly limited and may be, for example, 0.01 N/25 mm or more. The adhesive force N 23 is usually suitably 0.1 N/25 mm or more from the viewpoint of attaching workability to the adherend or preventing displacement of the position before the adhesion is increased. The adhesion force N 23 may be, for example, 0.2 N/25 mm or more, and may be 0.3 N/25 mm or more, and may be 0.4 N/25 mm or more, from the viewpoints of improvement in adhesion after heating, and the like. It can also be 0.5 N/25 mm or more.

於此處所揭示之黏著片材之若干種態樣中,該黏著片材之黏著力N50 例如可為7 N/25 mm以下,可為5 N/25 mm以下,可為4 N/25 mm以下,可為3.5 N/25 mm以下,亦可為3 N/25 mm以下、2.5 N/25 mm以下、或2 N/25 mm以下,但並無特別限定。黏著力N50 較低就於在貼附初期可能施加50℃左右之溫度之使用態樣中亦發揮良好之二次加工性之觀點而言較佳。黏著力N50 之下限並無特別限制,例如可為0.05 N/25 mm以上。就防止黏著力上升前之位置偏移等觀點而言,黏著力N50 通常適宜為0.1 N/25 mm以上。就加熱後黏著力之提高等觀點而言,於若干種態樣中,黏著力N50 例如可為0.2 N/25 mm以上,可為0.5 N/25 mm以上,亦可為0.7 N/25 mm以上。In several aspects of the adhesive sheet disclosed herein, the adhesive sheet has an adhesion force N 50 of, for example, 7 N/25 mm or less, 5 N/25 mm or less, and 4 N/25 mm. Hereinafter, it may be 3.5 N/25 mm or less, or may be 3 N/25 mm or less, 2.5 N/25 mm or less, or 2 N/25 mm or less, but is not particularly limited. The lower adhesive strength N 50 is preferable from the viewpoint of exhibiting good secondary workability in a use form in which a temperature of about 50 ° C may be applied at the initial stage of attachment. The lower limit of the adhesive force N 50 is not particularly limited and may be, for example, 0.05 N/25 mm or more. The adhesive force N 50 is usually suitably 0.1 N/25 mm or more from the viewpoint of preventing the positional shift before the adhesion is increased. The adhesion N 50 can be, for example, 0.2 N/25 mm or more, and can be 0.5 N/25 mm or more, or 0.7 N/25 mm, from the viewpoints of improvement in adhesion after heating, and the like. the above.

於此處所揭示之黏著片材之若干種態樣中,該黏著片材之黏著力N80 (加熱後黏著力)例如可為5 N/25 mm以上,可為7 N/25 mm以上,可為10 N/25 mm以上,可為13 N/25 mm以上,可為15 N/25 mm以上,亦可為17 N/25 mm以上,但並無特別限定。加熱後黏著力之上限並無特別限制。就黏著片材之製造容易性或經濟性之觀點而言,於若干種態樣中,加熱後黏著力例如可為70 N/25 mm以下,可為50 N/25 mm以下,亦可為40 N/25 mm以下。In some aspects of the adhesive sheet disclosed herein, the adhesive force N 80 (adhesive force after heating) of the adhesive sheet can be, for example, 5 N/25 mm or more, and can be 7 N/25 mm or more. It is 10 N/25 mm or more, and may be 13 N/25 mm or more, 15 N/25 mm or more, or 17 N/25 mm or more, but is not particularly limited. The upper limit of the adhesive force after heating is not particularly limited. From the viewpoints of ease of manufacture or economy of the adhesive sheet, in some cases, the adhesive force after heating may be, for example, 70 N/25 mm or less, 50 N/25 mm or less, or 40. N/25 mm or less.

於此處所揭示之黏著片材之若干種態樣中,黏著力N50 [N/25 mm]與黏著力N23 [N/25 mm]之差、即N50 -N23 通常較佳為未達5 N/25 mm,例如可未達4 N/25 mm,可未達3 N/25 mm,可未達2.5 N/25 mm,可未達2 N/25 mm,亦可未達1.5 N/25 mm,但並無特別限定。根據N50 -N23 較小之黏著片材,有於在貼附初期可能施加50℃左右之溫度之使用態樣中亦發揮出良好之二次加工性之傾向。N50 -N23 之下限並無特別限定,通常為0 N/25 mm以上,典型為超過0 N/25 mm,例如亦可為0.2 N/25 mm以上。In several aspects of the adhesive sheet disclosed herein, the difference between the adhesive force N 50 [N/25 mm] and the adhesive force N 23 [N/25 mm], that is, N 50 -N 23 is generally preferably not Up to 5 N/25 mm, eg up to 4 N/25 mm, less than 3 N/25 mm, less than 2.5 N/25 mm, less than 2 N/25 mm or less than 1.5 N /25 mm, but there is no special limit. The adhesive sheet having a small N 50 -N 23 tends to exhibit good secondary workability in a use form in which a temperature of about 50 ° C may be applied at the initial stage of attachment. The lower limit of N 50 -N 23 is not particularly limited and is usually 0 N/25 mm or more, typically more than 0 N/25 mm, and may be 0.2 N/25 mm or more.

此處所揭示之黏著片材之黏著力N80 [N/25 mm]與黏著力N50 [N/25 mm]之差相對於黏著力N50 [N/25 mm]與黏著力N23 [N/25 mm]之差的比、即(N80 -N50 )/(N50 -N23 )例如可為2以上,但並無特別限定。(N80 -N50 )/(N50 -N23 )之值更大意味著相對於可能施加50℃左右之溫度之使用態樣中之貼附初期之黏著力,加熱後黏著力之上升程度更大。於若干種態樣中,(N80 -N50 )/(N50 -N23 )例如可為3以上,可為5以上,可為7以上,可為10以上,可為15以上,亦可為20以上。(N80 -N50 )/(N50 -N23 )之上限並無特別限定,例如可為100以下。The difference between the adhesion of the adhesive sheet N 80 [N/25 mm] and the adhesive force N 50 [N/25 mm] relative to the adhesion force N 50 [N/25 mm] and the adhesion force N 23 [N The ratio of the difference of /25 mm], that is, (N 80 - N 50 ) / (N 50 - N 23 ) may be, for example, 2 or more, but is not particularly limited. A larger value of (N 80 -N 50 )/(N 50 -N 23 ) means an increase in the adhesion force after heating with respect to the adhesion at the initial stage of application in a state in which a temperature of about 50 ° C may be applied. Bigger. In some aspects, (N 80 -N 50 )/(N 50 -N 23 ) may be 3 or more, may be 5 or more, may be 7 or more, may be 10 or more, may be 15 or more, or may be It is 20 or more. The upper limit of (N 80 - N 50 ) / (N 50 - N 23 ) is not particularly limited, and may be, for example, 100 or less.

再者,此處所揭示之黏著片材之加熱後黏著力係表示該黏著片材之一特性者,且並非限定該黏著片材之使用態樣。換言之,此處所揭示之黏著片材之使用態樣並不限定於於80℃下進行5分鐘加熱之態樣,例如亦可用於未特別進行加熱至室溫區域(通常為20℃~30℃、典型為23℃~25℃)以上之處理之態樣。於該使用態樣中,亦可使黏著力長期地上升,實現牢固之接合。又,此處所揭示之黏著片材可藉由在貼附後之任意時刻在高於50℃之溫度下進行加熱處理而促進黏著力之上升。該加熱處理中之加熱溫度並無特別限定,可考慮作業性、經濟性、黏著片材之基材或被黏著體之耐熱性等而設定。上述加熱溫度例如可未達150℃,可為120℃以下,可為100℃以下,可為80℃以下,亦可為70℃以下。又,上述加熱溫度例如可設為55℃以上、60℃以上、或70℃以上,可設為80℃以上,亦可設為100℃以上。若利用更高之加熱溫度,則可藉由更短時間之處理而使黏著力上升。加熱時間並無特別限定,例如可為1小時以下,可為30分鐘以下,可為10分鐘以下,亦可為5分鐘以下。或者,亦可於黏著片材或被黏著體不發生顯著之熱劣化之限度內進行更長時間之加熱處理。再者,加熱處理可一次進行,亦可分為複數次進行。Furthermore, the post-heating adhesion of the adhesive sheet disclosed herein indicates one of the characteristics of the adhesive sheet, and does not limit the use of the adhesive sheet. In other words, the use of the adhesive sheet disclosed herein is not limited to the case of heating at 80 ° C for 5 minutes, and may be used, for example, for heating to room temperature (usually 20 ° C to 30 ° C, Typically, it is a treatment of 23 ° C to 25 ° C). In this aspect of use, the adhesion can be increased for a long period of time to achieve a firm bond. Further, the adhesive sheet disclosed herein can promote the increase in the adhesive force by heat treatment at a temperature higher than 50 ° C at any time after the attachment. The heating temperature in the heat treatment is not particularly limited, and can be set in consideration of workability, economy, heat resistance of the substrate to which the sheet is adhered, or the adherend. The heating temperature may be, for example, less than 150 ° C, may be 120 ° C or less, may be 100 ° C or less, may be 80 ° C or less, or may be 70 ° C or less. Further, the heating temperature may be, for example, 55° C. or higher, 60° C. or higher, or 70° C. or higher, and may be 80° C. or higher, or may be 100° C. or higher. If a higher heating temperature is used, the adhesion can be increased by a shorter period of time. The heating time is not particularly limited, and may be, for example, 1 hour or shorter, 30 minutes or shorter, or 10 minutes or shorter, or 5 minutes or shorter. Alternatively, the heat treatment may be carried out for a longer period of time in which the adhesive sheet or the adherend does not undergo significant thermal deterioration. Further, the heat treatment may be carried out once, or may be carried out in plural times.

(附基材之黏著片材) 於此處所揭示之黏著片材為附基材之黏著片材之形態之情形時,該黏著片材之厚度例如可為1000 μm以下,可為600 μm以下,可為350 μm以下,亦可為250 μm以下。就應用黏著片材之製品之小型化、輕量化、薄型化等觀點而言,於若干種態樣中,黏著片材之厚度例如可為200 μm以下,可為175 μm以下,可為140 μm以下,可為120 μm以下,亦可為100 μm以下(例如未達100 μm未満)。又,黏著片材之厚度就操作性等觀點而言,例如可為5 μm以上,可為10 μm以上,可為15 μm以上,可為20 μm以上,可為25 μm以上,亦可為30 μm以上。於若干種態樣中,黏著片材之厚度例如可為50 μm以上,可為60 μm以上,可為80 μm以上,可為100 μm以上,亦可為130 μm以上。黏著片材之厚度之上限並無特別限定。 再者,黏著片材之厚度係指貼附於被黏著體之部分之厚度。例如於圖1所示之構成之黏著片材1中,係指自黏著片材1之黏著面21A至基材10之第二面10B為止之厚度,不包含剝離襯墊31之厚度。(Adhesive sheet with a substrate) When the adhesive sheet disclosed herein is in the form of an adhesive sheet with a substrate, the thickness of the adhesive sheet may be, for example, 1000 μm or less, and may be 600 μm or less. It can be 350 μm or less or 250 μm or less. The thickness of the adhesive sheet can be, for example, 200 μm or less, and can be 175 μm or less, and can be 140 μm, in terms of miniaturization, weight reduction, and thinning of the product to which the adhesive sheet is applied. Hereinafter, it may be 120 μm or less, or may be 100 μm or less (for example, less than 100 μm). Further, the thickness of the adhesive sheet may be, for example, 5 μm or more, and may be 10 μm or more, 15 μm or more, 20 μm or more, 25 μm or more, or 30 in terms of operability. More than μm. In some cases, the thickness of the adhesive sheet may be, for example, 50 μm or more, 60 μm or more, 80 μm or more, 100 μm or more, or 130 μm or more. The upper limit of the thickness of the adhesive sheet is not particularly limited. Further, the thickness of the adhesive sheet refers to the thickness of the portion attached to the adherend. For example, in the adhesive sheet 1 having the configuration shown in FIG. 1, the thickness from the adhesive surface 21A of the adhesive sheet 1 to the second surface 10B of the substrate 10 does not include the thickness of the release liner 31.

此處所揭示之黏著片材例如可以支持基材之厚度Ts大於黏著劑層之厚度Ta之態樣、即Ts/Ta大於1之態樣良好地實施。Ts/Ta例如可為1.1以上,可為1.2以上,可為1.5以上,亦可為1.7以上,但並無特別限定。例如於可用於被黏著體之補強、支持、衝擊緩和等目的之黏著片材中,藉由增大Ts/Ta,有即便將黏著片材薄型化,亦容易發揮良好之效果之傾向。於若干種態樣中,Ts/Ta可為2以上(例如大於2),可為3以上,亦可為4以上。又,Ts/Ta例如可設為50以下,亦可設為20以下。就即便將黏著片材薄型化亦容易發揮較高之加熱後黏著力之觀點而言,Ts/Ta例如可為10以下,亦可為8以下。The adhesive sheet disclosed herein can be suitably carried out, for example, in such a manner that the thickness Ts of the substrate is larger than the thickness Ta of the adhesive layer, that is, the Ts/Ta is larger than 1. Ts/Ta may be, for example, 1.1 or more, and may be 1.2 or more, 1.5 or more, or 1.7 or more, but is not particularly limited. For example, in an adhesive sheet which can be used for the purpose of reinforcement, support, impact relaxation, etc. of the adherend, it is easy to exhibit a good effect by increasing the Ts/Ta even if the adhesive sheet is made thinner. In some aspects, Ts/Ta may be 2 or more (for example, more than 2), may be 3 or more, or may be 4 or more. Further, Ts/Ta can be, for example, 50 or less, or 20 or less. The Ts/Ta can be, for example, 10 or less, or 8 or less, from the viewpoint of easily exhibiting a high adhesion after heating, even if the pressure-sensitive adhesive sheet is made thinner.

上述黏著劑層較佳為固著於支持基材。上述固著係指於貼附於被黏著體後黏著力上升之黏著片材中,以該黏著片材自被黏著體剝離時不會產生黏著劑層與支持基材之界面之剝離之程度,黏著劑層對於支持基材顯示出充分之抓固性。根據黏著劑層固著於支持基材之附基材之黏著片材,可使被黏著體與支持基材牢固地一體化。藉此,例如可有效地發揮被黏著體之補強、支持、衝擊緩和等功能。作為黏著劑層固著於基材之黏著片材之一較佳例,可列舉如下黏著片材,即,於貼附於被黏著體後,表現出至少5 N/25 mm、較佳為10 N/25 mm以上、更佳為15 N/25 mm以上之黏著力(於剝離角度180度、拉伸速度300 mm/min之條件下測定之180°剝離黏著力),並且於自上述被黏著體剝離時不會產生黏著劑層與支持基材之間的剝離(抓固破壞)。加熱後黏著力(N80 )為15 N/25 mm以上且於該加熱後黏著力之測定時不會產生抓固破壞之黏著片材係屬於在基材上固著有黏著劑層之黏著片材之一較佳例。The above adhesive layer is preferably fixed to the support substrate. The above-mentioned fixing means an adhesive sheet in which the adhesive force is increased after being attached to the adherend, and the peeling of the interface between the adhesive layer and the supporting substrate is not caused when the adhesive sheet is peeled off from the adherend. The adhesive layer exhibits sufficient grip for the support substrate. The adherend and the support substrate can be firmly integrated according to the adhesive sheet to which the adhesive layer is fixed to the base material of the support substrate. Thereby, for example, functions such as reinforcement, support, and shock relaxation of the adherend can be effectively exhibited. A preferred example of the adhesive sheet to which the adhesive layer is fixed to the substrate is an adhesive sheet which exhibits at least 5 N/25 mm, preferably 10 after being attached to the adherend. Adhesion of N/25 mm or more, more preferably 15 N/25 mm or more (180° peel adhesion measured at a peeling angle of 180 degrees and a tensile speed of 300 mm/min), and adhered to the above Peeling (grab damage) between the adhesive layer and the support substrate does not occur when the body is peeled off. The adhesive sheet after heating (N 80 ) is 15 N/25 mm or more, and the adhesive sheet which does not cause scratch damage during the measurement of the adhesive force after heating belongs to the adhesive sheet having the adhesive layer fixed on the substrate. A preferred example of the material.

此處所揭示之黏著片材例如可藉由依序包括如下步驟之方法而良好地製造:使液狀之黏著劑組合物與基材之第一面接觸;及於該第一面上使上述黏著劑組合物硬化而形成黏著劑層。上述黏著劑組合物之硬化可伴有該黏著劑組合物之乾燥、交聯、聚合、冷卻等之一種或兩種以上。根據如此使液狀之黏著劑組合物於基材之第一面上硬化而形成黏著劑層之方法,與藉由將硬化後之黏著劑層貼合於基材之第一面而於該第一面上配置黏著劑層之方法相比,可提高黏著劑層對基材之抓固性。利用該情況,可良好地製造黏著劑層固著於基材之黏著片材。The adhesive sheet disclosed herein can be suitably produced, for example, by sequentially including the following steps: contacting the liquid adhesive composition with the first side of the substrate; and applying the adhesive to the first side. The composition hardens to form an adhesive layer. The curing of the above adhesive composition may be accompanied by one or more of drying, crosslinking, polymerization, cooling, and the like of the adhesive composition. The method of forming the adhesive layer by curing the liquid adhesive composition on the first surface of the substrate in this manner, and bonding the adhesive layer after curing to the first side of the substrate Compared with the method of disposing the adhesive layer on one side, the adhesion of the adhesive layer to the substrate can be improved. In this case, the adhesive sheet to which the adhesive layer is fixed to the substrate can be favorably produced.

於若干種態樣中,作為使液狀之黏著劑組合物與基材之第一面接觸之方法,可採用將上述黏著劑組合物直接塗佈於基材之第一面之方法。藉由使於基材之第一面上硬化之黏著劑層之第一面(黏著面)抵接於剝離面,可獲得該黏著劑層之第二面固著於基材之第一面且該黏著劑層之第一面抵接於剝離面之構成的黏著片材。作為上述剝離面,可利用剝離襯墊之表面或經剝離處理之基材背面等。In some aspects, as a method of bringing the liquid adhesive composition into contact with the first side of the substrate, a method of directly applying the above-described adhesive composition to the first side of the substrate may be employed. The second surface of the adhesive layer is fixed to the first side of the substrate by abutting the first surface (adhesive surface) of the adhesive layer hardened on the first surface of the substrate to the peeling surface The first surface of the adhesive layer abuts against the adhesive sheet formed by the peeling surface. As the peeling surface, the surface of the release liner or the back surface of the substrate subjected to the release treatment can be used.

又,例如於使用單體成分之部分聚合物(丙烯酸系聚合物漿液)之光硬化型黏著劑組合物之情形時,例如亦可於將該黏著劑組合物塗佈於剝離面後,於該塗佈之黏著劑組合物被覆基材之第一面,藉此使基材之第一面與未硬化之上述黏著劑組合物接觸,於該狀態下,對夾於基材之第一面與剝離面之間的黏著劑組合物進行光照射而使其硬化,藉此形成黏著劑層。Further, for example, in the case of using a photocurable adhesive composition of a partial polymer (acrylic polymer slurry) of a monomer component, for example, after the adhesive composition is applied to a release surface, The applied adhesive composition coats the first side of the substrate, whereby the first side of the substrate is brought into contact with the uncured adhesive composition, and in this state, the first side of the substrate is sandwiched The adhesive composition between the peeling faces is hardened by light irradiation, thereby forming an adhesive layer.

再者,上述所例示之方法並非限定此處所揭示之黏著片材之製造方法。於此處所揭示之黏著片材之製造時,可將能夠使黏著劑層固著於基材之第一面之適當方法單獨使用一種或組合兩種以上而使用。此種方法之例可列舉:如上所述使液狀之黏著劑組合物於基材之第一面上硬化而形成黏著劑層之方法、或對基材之第一面實施提高黏著劑層之抓固性之表面處理之方法等。例如於可藉由在基材之第一面設置底塗層等方法而使黏著劑層對基材之抓固性充分提高之情形時,亦可藉由將硬化後之黏著劑層貼合於基材之第一面之方法而製造黏著片材。又,藉由基材之材質之選擇或黏著劑之組成之選擇,亦可提高黏著劑層對基材之抓固性。又,藉由對在基材之第一面上具有黏著劑層之黏著片材應用高於室溫之溫度,可提高該黏著劑層對基材之抓固性。用於提高抓固性之溫度例如可為35℃~80℃左右,可為40℃~70℃以上程度,亦可為45℃~60℃左右。Furthermore, the method exemplified above does not limit the method of manufacturing the adhesive sheet disclosed herein. In the production of the adhesive sheet disclosed herein, one or a combination of two or more of them may be used alone or in combination of two or more suitable methods for fixing the adhesive layer to the first surface of the substrate. Examples of such a method include a method of curing a liquid adhesive composition on a first surface of a substrate to form an adhesive layer, or applying an adhesive layer to the first surface of the substrate. The method of surface treatment for grasping and the like. For example, when the adhesive layer is sufficiently improved on the substrate by a method such as providing an undercoat layer on the first surface of the substrate, the cured adhesive layer may be attached thereto. An adhesive sheet is produced by the method of the first side of the substrate. Moreover, the choice of the material of the substrate or the composition of the adhesive can also improve the grip of the adhesive layer on the substrate. Further, by applying a temperature higher than room temperature to the adhesive sheet having the adhesive layer on the first side of the substrate, the adhesion of the adhesive layer to the substrate can be improved. The temperature for improving the gripping property may be, for example, about 35 ° C to 80 ° C, may be 40 ° C to 70 ° C or higher, or may be about 45 ° C to 60 ° C.

於此處所揭示之黏著片材為具有設置於基材之第一面之第一黏著劑層與設置於該基材之第二面之第二黏著劑層之黏著片材(即,雙面接著性之附基材之黏著片材)之形態之情形時,第一黏著劑層與第二黏著劑層可為相同之構成,亦可為不同之構成。於第一黏著劑層與第二黏著劑層之構成不同之情形時,該不同例如可為組成之不同或結構(厚度、表面粗糙度、形成範圍、形成圖案等)之不同。例如第二黏著劑層亦可為不含聚合物B之黏著劑層。又,關於第二黏著劑層之表面(第二黏著面),N80 /N50 可未達5,可未達2,可未達1.5,亦可未達1。The adhesive sheet disclosed herein is an adhesive sheet having a first adhesive layer disposed on a first side of the substrate and a second adhesive layer disposed on a second side of the substrate (ie, double-sidedly In the case of the form of the adhesive sheet attached to the substrate, the first adhesive layer and the second adhesive layer may have the same composition or different configurations. In the case where the composition of the first adhesive layer and the second adhesive layer are different, the difference may be, for example, a difference in composition or a difference in structure (thickness, surface roughness, formation range, pattern formation, etc.). For example, the second adhesive layer may also be an adhesive layer free of polymer B. Further, regarding the surface (second adhesive surface) of the second adhesive layer, N 80 /N 50 may be less than 5, may be less than 2, may be less than 1.5, or may not be 1.

<附剝離襯墊之黏著片材> 此處所揭示之黏著片材可採用使黏著劑層之表面(黏著面)抵接於剝離襯墊之剝離面之黏著製品之形態。因此,藉由本說明書,可提供一種包含此處所揭示之任一黏著片材、與具有抵接於該黏著片材之黏著面之剝離面之剝離襯墊的附剝離襯墊之黏著片材(黏著製品)。<Adhesive sheet with release liner> The adhesive sheet disclosed herein may be in the form of an adhesive article in which the surface (adhesive surface) of the adhesive layer is brought into contact with the release surface of the release liner. Therefore, by means of the present specification, there is provided an adhesive sheet (adhesive sheet) comprising a release liner comprising any of the adhesive sheets disclosed herein and a release liner having a release surface abutting the adhesive surface of the adhesive sheet. product).

剝離襯墊之厚度並無特別限定,通常適宜為5 μm~200 μm左右。若剝離襯墊之厚度處於上述範圍內,則對黏著劑層之貼合作業性與自黏著劑層之剝離作業性優異,因此較佳。於若干種態樣中,剝離襯墊之厚度例如可為10 μm以上,可為20 μm以上,可為30 μm以上,亦可為40 μm以上。又,剝離襯墊之厚度就使自黏著劑層之剝離容易化之觀點而言,例如可為100 μm以下,亦可為80 μm以下。視需要亦可對剝離襯墊實施塗佈型、混練型、蒸鍍型等公知之抗靜電處理。The thickness of the release liner is not particularly limited, but is usually about 5 μm to 200 μm. When the thickness of the release liner is within the above range, the adhesion between the adhesive layer and the self-adhesive layer is excellent, and therefore it is preferable. In some aspects, the thickness of the release liner may be, for example, 10 μm or more, may be 20 μm or more, may be 30 μm or more, or may be 40 μm or more. Moreover, the thickness of the release liner can be, for example, 100 μm or less, or 80 μm or less from the viewpoint of facilitating the peeling of the adhesive layer. The release liner may be subjected to a known antistatic treatment such as a coating type, a kneading type, or a vapor deposition type as needed.

作為剝離襯墊,並無特別限定,例如可使用於樹脂膜或紙(可為層壓有聚乙烯等樹脂之紙)等襯墊基材之表面具有剝離層之剝離襯墊、或包含利用如氟系聚合物(聚四氟乙烯等)或聚烯烴系樹脂(聚乙烯、聚丙烯等)之低接著性材料所形成之樹脂膜的剝離襯墊等。就表面平滑性優異之方面而言,可良好地採用於作為襯墊基材之樹脂膜之表面具有剝離層之剝離襯墊、或包含利用低接著性材料所形成之樹脂膜之剝離襯墊。作為樹脂膜,只要為可保護黏著劑層之膜,則並無特別限定,例如可列舉:聚乙烯膜、聚丙烯膜、聚丁烯膜、聚丁二烯膜、聚甲基戊烯膜、聚氯乙烯膜、氯乙烯共聚物膜、聚酯膜(PET膜、PBT膜等)、聚胺基甲酸酯膜、乙烯-乙酸乙烯酯共聚物膜等。上述剝離層之形成例如可使用聚矽氧系剝離處理劑、長鏈烷基系剝離處理劑、烯烴系剝離處理劑、氟系剝離處理劑、脂肪酸醯胺系剝離處理劑、硫化鉬、二氧化矽粉等公知之剝離處理劑。尤佳為使用聚矽氧系剝離處理劑。The release liner is not particularly limited, and for example, a release liner having a release layer on the surface of a liner substrate such as a resin film or paper (which may be a resin laminated with a resin such as polyethylene) may be used, or may be used as A release liner of a resin film formed of a low-adhesive material of a fluorine-based polymer (such as polytetrafluoroethylene) or a polyolefin-based resin (such as polyethylene or polypropylene). In terms of excellent surface smoothness, it can be suitably used as a release liner having a release layer on the surface of a resin film as a liner substrate, or a release liner comprising a resin film formed using a low adhesion material. The resin film is not particularly limited as long as it is a film that can protect the adhesive layer, and examples thereof include a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, and a polymethylpentene film. A polyvinyl chloride film, a vinyl chloride copolymer film, a polyester film (PET film, PBT film, etc.), a polyurethane film, an ethylene-vinyl acetate copolymer film, or the like. For the formation of the release layer, for example, a polyoxynitride-based release treatment agent, a long-chain alkyl release treatment agent, an olefin-based release treatment agent, a fluorine-based release treatment agent, a fatty acid amide-based release treatment agent, molybdenum sulfide, and a dioxide can be used. A known release treatment agent such as tantalum powder. It is especially preferred to use a polyfluorene-based release treatment agent.

剝離層之厚度並無特別限制,通常適宜為0.01 μm~1 μm左右,較佳為0.1 μm~1 μm左右。剝離層之形成方法並無特別限定,可適當採用與所使用之剝離處理劑之種類等對應之公知方法。The thickness of the release layer is not particularly limited, but is usually about 0.01 μm to 1 μm, preferably about 0.1 μm to 1 μm. The method for forming the release layer is not particularly limited, and a known method corresponding to the type of the release treatment agent to be used or the like can be suitably employed.

<用途> 由本說明書提供之黏著片材例如於貼合於被黏著體後,於室溫至50℃左右之溫度區域(例如20℃~50℃),在短時間內將黏著力抑制為較低,其間可發揮良好之二次加工性,因此可有助於良率之抑制或包含該黏著片材之製品之高品質化。而且,上述黏著片材可藉由熟化(可為向高於50℃之溫度之加熱、經時、該等之組合等)而使黏著力大幅地上升。例如藉由在所期望之時刻進行加熱,可使黏著片材牢固地接著於被黏著體。利用此種特徵,此處所揭示之黏著片材可於各種領域以各種製品中所包含之構件之固定、接合、成形、裝飾、保護、補強、支持、衝擊緩和等為目的而良好地使用。<Application> The adhesive sheet provided by the present specification is, for example, bonded to the adherend, and is in a temperature range of from room temperature to about 50 ° C (for example, 20 ° C to 50 ° C), and the adhesive force is suppressed to be low in a short time. In the meantime, good secondary workability can be exerted, which contributes to the suppression of yield or the high quality of the product comprising the adhesive sheet. Further, the adhesive sheet can be greatly increased in adhesion by aging (may be heating to a temperature higher than 50 ° C, time-lapse, combinations thereof, etc.). For example, by heating at a desired timing, the adhesive sheet can be firmly adhered to the adherend. With such a feature, the adhesive sheet disclosed herein can be suitably used for the purpose of fixing, joining, forming, decorating, protecting, reinforcing, supporting, impact-relieving, etc. of members contained in various articles in various fields.

此處所揭示之黏著片材可以於具有第一面及第二面之膜狀基材之至少第一面設置有黏著劑層的附基材之黏著片材之形態,良好地用作貼附於被黏著體而對該被黏著體進行補強之補強膜。於該補強膜中,作為上述膜基材,可良好地使用包含樹脂膜作為基底膜者。又,就提高補強性能之觀點而言,上述黏著劑層較佳為固著於膜狀基材之第一面。 例如關於用於光學製品之光學構件、或用於電子製品之電子構件,高度之積體化、小型輕量化、薄型化不斷發展,可積層線膨脹係數或厚度不同之複數個較薄之光學構件/電子構件。藉由在此種構件貼附如上所述之補強膜,可對上述光學構件/電子構件賦予適度之剛性。藉此,於製造製程及/或製造後之製品中,可抑制因於上述線膨脹係數或厚度不同之複數個構件間可能產生之應力所導致之捲曲或彎曲。 又,於光學製品/電子製品之製造製程中,於如上所述對較薄之光學構件/電子構件進行切斷加工等形狀加工處理之情形時,藉由對該構件貼附補強膜而進行處理,可緩和伴隨加工之向光學構件/電子構件之局部之應力集中,可減少龜裂、破裂、積層構件之剝離等風險。對光學構件/電子構件貼附補強構件而進行操作亦可有助於該構件之搬送、積層、旋轉等時之局部之應力集中之緩和、或因該構件之自重所導致之彎折或彎曲之抑制等。 進而,包含上述補強膜之光學製品或電子製品等器件於在市場上供消費者使用之階段,即便於該器件掉落之情形、置於重量物之下之情形、飛來物碰撞之情形等被施加意外之應力之情形時,亦可藉由使該器件包含補強膜而緩和施加於器件之應力。因此,藉由使上述器件包含補強膜,可提高該器件之耐久性。The adhesive sheet disclosed herein may be in the form of an adhesive sheet with a base material provided with an adhesive layer on at least a first surface of the film-form substrate having the first surface and the second surface, and is preferably used as a sticker. A reinforced film that is reinforced by the adherend. In the reinforced film, as the film substrate, a resin film as a base film can be preferably used. Further, from the viewpoint of improving the reinforcing performance, the pressure-sensitive adhesive layer is preferably fixed to the first surface of the film-form substrate. For example, regarding an optical member for an optical product or an electronic member for an electronic product, a high degree of integration, small size, light weight, and thinning are continuously developed, and a plurality of thin optical members having different linear expansion coefficients or thicknesses can be laminated. / Electronic components. By attaching the reinforcing film as described above to such a member, it is possible to impart appropriate rigidity to the optical member/electronic member. Thereby, in the manufacturing process and/or the manufactured product, curling or bending due to stress which may occur between a plurality of members having different linear expansion coefficients or thicknesses can be suppressed. Further, in the manufacturing process of the optical product/electronic product, when the thin optical member/electronic member is subjected to a shape processing such as cutting processing as described above, the reinforcing film is attached to the member to be processed. The stress concentration to the optical member/electronic member accompanying the processing can be alleviated, and the risk of cracking, cracking, and peeling of the laminated member can be reduced. The operation of attaching the reinforcing member to the optical member/electronic member may also contribute to the relaxation of the local stress concentration during the conveyance, lamination, rotation, etc. of the member, or the bending or bending due to the weight of the member. Suppression, etc. Further, the optical product or the electronic product including the above-mentioned reinforcing film is used in the market for consumers, even in the case where the device is dropped, placed under a weight, a collision of a flying object, etc. In the case where an unexpected stress is applied, the stress applied to the device can also be alleviated by including the reinforced film in the device. Therefore, by including the above-described device with a reinforcing film, the durability of the device can be improved.

此外,此處所揭示之黏著片材例如可以貼附於構成各種攜帶型設備(可攜式設備)之構件之態樣而良好地使用。此處所謂「攜帶」,並不單指能夠攜帶,而係指具有個人(標準成人)能夠相對容易地搬運之程度之攜帶性。又,此處所謂攜帶型設備之例可包括:行動電話、智慧型手機、平板型個人電腦、筆記型個人電腦、各種隨身設備、數位相機、數位攝錄影機、音響設備(攜帶音樂播放器、錄音筆等)、計算機(計算器等)、攜帶型遊戲設備、電子辭典、電子記事本、電子書籍、車載用資訊設備、攜帶型收音機、攜帶型電視、攜帶型印表機、攜帶型掃描儀、攜帶型數據機等攜帶電子設備,此外,亦可包括機械式手錶或懷錶、手電筒、放大鏡等。構成上述攜帶電子設備之構件之例可包括用於液晶顯示器等薄層顯示器或膜型顯示器等之類之圖像顯示裝置的光學膜或顯示面板等。此處所揭示之黏著片材亦可以貼附於汽車、家電製品等中之各種構件之態樣良好地使用。Further, the adhesive sheet disclosed herein can be used satisfactorily, for example, in the form of members constituting various portable devices (portable devices). The term "carrying" as used herein does not mean merely being portable, but refers to the portability of a person (standard adult) who can carry it relatively easily. Moreover, examples of the portable device herein may include: a mobile phone, a smart phone, a tablet personal computer, a notebook personal computer, various portable devices, a digital camera, a digital video camera, and an audio device (with a music player) , recording pen, etc.), computer (calculator, etc.), portable game equipment, electronic dictionary, electronic notebook, electronic books, car information equipment, portable radio, portable TV, portable printer, portable scanning Instruments, portable data sets and other portable electronic devices, in addition, may also include mechanical watches or pocket watches, flashlights, magnifiers and so on. Examples of the member constituting the above-described portable electronic device may include an optical film or a display panel or the like for an image display device such as a thin layer display such as a liquid crystal display or a film type display. The adhesive sheet disclosed herein can also be used in a good manner by being attached to various members of automobiles, home electric appliances, and the like.

由本說明書所揭示之事項包含以下者。 (1)一種黏著片材,其係包含黏著劑層者, 上述黏著劑層含有聚合物A、及作為具有聚有機矽氧烷骨架之單體與(甲基)丙烯酸系單體之共聚物的聚合物B, 上述聚合物B之基於上述(甲基)丙烯酸系單體之組成的玻璃轉移溫度Tm1 為50℃以上且100℃以下, 貼合於不鏽鋼板後於80℃下加熱5分鐘後之黏著力N80 為貼合於不鏽鋼板後於50℃下保持30分鐘後之黏著力N50 的5倍以上。 (2)如上述(1)所記載之黏著片材,其中 上述黏著力N50 與貼合於不鏽鋼板後於23℃下保持30分鐘後之黏著力N23 之關係滿足下式: (N50 /N23 )<10。 (3)如上述(1)或(2)所記載之黏著片材,其中上述黏著力N80 為貼合於不鏽鋼板後於23℃下放置30分鐘後之黏著力N23 之10倍以上。 (4)如上述(1)至(3)中任一項所記載之黏著片材,其中 上述黏著力N23 [N/25 mm]、黏著力N50 [N/25 mm]及黏著力N80 [N/25 mm]滿足以下之關係式: (N80 -N50 )/(N50 -N23 )≧2。 (5)如上述(1)至(4)中任一項所記載之黏著片材,其中上述黏著力N23 為2.0 N/25 mm以下。 (6)如上述(1)至(5)中任一項所記載之黏著片材,其中上述黏著力N50 為4 N/25 mm以下。 (7)如上述(1)至(6)中任一項所記載之黏著片材,其中上述黏著力N80 為15 N/25 mm以上。The matters disclosed in the present specification include the following. (1) An adhesive sheet comprising an adhesive layer comprising the polymer A, and a copolymer of a monomer having a polyorganosiloxane skeleton and a (meth)acrylic monomer. Polymer B, the glass transition temperature T m1 of the polymer B based on the composition of the (meth)acrylic monomer is 50° C. or more and 100° C. or less, and is bonded to a stainless steel plate and then heated at 80° C. for 5 minutes. The adhesive force N 80 is 5 times or more of the adhesive force N 50 after being adhered to the stainless steel sheet and kept at 50 ° C for 30 minutes. (2) The adhesive sheet according to the above (1), wherein the adhesive force N 50 and the adhesive force N 23 after being held at 23 ° C for 30 minutes after being bonded to the stainless steel sheet satisfy the following formula: (N 50 /N 23 )<10. (3) The adhesive sheet according to the above (1) or (2), wherein the adhesive force N 80 is 10 times or more of the adhesive force N 23 after being placed on the stainless steel sheet and left at 23 ° C for 30 minutes. (4) The adhesive sheet according to any one of (1) to (3) above, wherein the adhesion force N 23 [N/25 mm], the adhesive force N 50 [N/25 mm], and the adhesive force N 80 [N/25 mm] satisfies the following relationship: (N 80 -N 50 )/(N 50 -N 23 )≧2. (5) The adhesive sheet according to any one of the above (1), wherein the adhesive force N 23 is 2.0 N/25 mm or less. (6) The adhesive sheet according to any one of the above (1), wherein the adhesive force N 50 is 4 N/25 mm or less. (7) The adhesive sheet according to any one of the above (1), wherein the adhesive force N 80 is 15 N/25 mm or more.

(8)如上述(1)至(7)中任一項所記載之黏著片材,其中上述聚合物A之玻璃轉移溫度TA 為-63℃以上且未達0℃。 (9)如上述(1)至(8)中任一項所記載之黏著片材,其中上述聚合物B之玻璃轉移溫度TB 為-10℃以上且10℃以下。 (10)如上述(1)至(9)中任一項所記載之黏著片材,其中上述聚合物B中之均聚物之玻璃轉移溫度高於170℃之單體之共聚比率為30重量%以下。 (11)如上述(1)至(10)中任一項所記載之黏著片材,其中上述黏著劑層含有相對於100重量份上述聚合物A為多於0重量份且10重量份以下之交聯劑。 (12)如上述(1)至(11)中任一項所記載之黏著片材,其中上述聚合物B之重量平均分子量為10000以上且50000以下。 (13)如上述(1)至(12)中任一項所記載之黏著片材,其中上述黏著劑層中之上述聚合物B之含量相對於100重量份上述聚合物A為0.05重量份以上且20重量份以下。(8) The adhesive sheet according to any one of the above (1), wherein the glass transition temperature T A of the polymer A is -63 ° C or more and less than 0 ° C. (9) The adhesive sheet according to any one of the above (1), wherein the polymer B has a glass transition temperature T B of -10 ° C or more and 10 ° C or less. (10) The adhesive sheet according to any one of the above (1), wherein a copolymerization ratio of a monomer having a glass transition temperature of more than 170 ° C in the polymer B of the polymer B is 30% by weight. %the following. The adhesive sheet according to any one of the above aspects, wherein the adhesive layer contains more than 0 parts by weight and 10 parts by weight or less per 100 parts by weight of the polymer A. Crosslinker. (12) The adhesive sheet according to any one of the above-mentioned (1), wherein the polymer B has a weight average molecular weight of 10,000 or more and 50,000 or less. The adhesive sheet according to any one of the above-mentioned (1), wherein the content of the polymer B in the adhesive layer is 0.05 parts by weight or more based on 100 parts by weight of the polymer A. And 20 parts by weight or less.

(14)如上述(1)至(13)中任一項所記載之黏著片材,其中上述聚合物A為丙烯酸系聚合物。 (15)如上述(14)所記載之黏著片材,其中用以製備上述丙烯酸系聚合物之單體成分包含含羥基單體。 (16)如上述(14)所記載之黏著片材,其中用以製備上述丙烯酸系聚合物之單體成分包含N-乙烯基環狀醯胺及含羥基單體。 (17)如上述(1)至(16)中任一項所記載之黏著片材,其中上述黏著劑層含有異氰酸酯系交聯劑。 (18)如上述(1)至(17)中任一項所記載之黏著片材,其中用以製備上述聚合物B之單體成分包含甲基丙烯酸甲酯(MMA)。 (19)如上述(18)所記載之黏著片材,其中MMA於上述單體成分中所含之(甲基)丙烯酸系單體之合計量中所占之比率為55重量%以上且95重量%以下。 (20)如上述(1)至(19)中任一項所記載之黏著片材,其中上述黏著劑層之厚度為3 μm以上且100 μm以下(例如20 μm以上且50 μm以下)。(14) The adhesive sheet according to any one of the above-mentioned (1), wherein the polymer A is an acrylic polymer. (15) The adhesive sheet according to the above (14), wherein the monomer component for preparing the acrylic polymer comprises a hydroxyl group-containing monomer. (16) The adhesive sheet according to the above (14), wherein the monomer component for preparing the acrylic polymer comprises N-vinyl cyclic decylamine and a hydroxyl group-containing monomer. The adhesive sheet according to any one of the above-mentioned (1), wherein the adhesive layer contains an isocyanate crosslinking agent. (18) The adhesive sheet according to any one of the above (1), wherein the monomer component for preparing the polymer B comprises methyl methacrylate (MMA). (19) The adhesive sheet according to the above (18), wherein the ratio of MMA to the total amount of the (meth)acrylic monomer contained in the monomer component is 55 wt% or more and 95 wt% %the following. The adhesive sheet according to any one of the above aspects, wherein the thickness of the adhesive layer is 3 μm or more and 100 μm or less (for example, 20 μm or more and 50 μm or less).

(21)如上述(1)至(20)中任一項所記載之黏著片材,其具備具有第一面及第二面之支持基材,且於該支持基材之至少上述第一面積層有上述黏著劑層。 (22)如上述(21)所記載之黏著片材,其中上述支持基材之厚度為30 μm以上。 (23)如上述(21)或(22)所記載之黏著片材,其中上述支持基材之厚度係上述黏著劑層之厚度之1.1倍以上且10倍以下。 (24)如上述(21)至(23)中任一項所記載之黏著片材,其中上述支持基材包含樹脂膜作為基底膜。 (25)如上述(24)所記載之黏著片材,其中上述基底膜係厚度35 μm以上(例如厚度35 μm以上且500 μm以下)之聚酯膜。 (26)如上述(21)至(25)中任一項所記載之黏著片材,其中上述黏著劑層係固著於上述支持基材之上述第一面。 (27)如上述(21)至(26)中任一項所記載之黏著片材,其係貼附於被黏著體而用於該被黏著體之補強。 (28)如上述(1)至(27)中任一項所記載之黏著片材,其中上述黏著劑層之表面(黏著面)抵接於水接觸角100度以上之剝離性表面。The adhesive sheet according to any one of the above aspects, comprising the support substrate having the first surface and the second surface, and at least the first surface of the support substrate The above adhesive layer is laminated. (22) The adhesive sheet according to the above (21), wherein the support substrate has a thickness of 30 μm or more. (23) The adhesive sheet according to the above aspect (21), wherein the thickness of the support substrate is 1.1 times or more and 10 times or less the thickness of the pressure-sensitive adhesive layer. The adhesive sheet according to any one of the above-mentioned (21), wherein the support substrate comprises a resin film as a base film. (25) The adhesive sheet according to the above (24), wherein the base film is a polyester film having a thickness of 35 μm or more (for example, a thickness of 35 μm or more and 500 μm or less). The adhesive sheet according to any one of the above-mentioned (21), wherein the adhesive layer is fixed to the first surface of the support substrate. (27) The adhesive sheet according to any one of the above (21) to (26), which is attached to the adherend and used for reinforcement of the adherend. The adhesive sheet according to any one of the above aspects, wherein the surface (adhesive surface) of the pressure-sensitive adhesive layer abuts on a peeling surface having a water contact angle of 100 or more.

(29)一種附剝離襯墊之黏著片材,其包含如上述(1)至(28)中任一項所記載之黏著片材、與具有抵接於上述黏著片材之黏著面之剝離性表面之剝離襯墊,且 上述剝離性表面之水接觸角為100度以上。 (30)如上述(29)所記載之附剝離襯墊之黏著片材,其中上述剝離性表面係藉由聚矽氧系剝離處理劑所形成之剝離層之表面。 [實施例](29) An adhesive sheet comprising a release liner, comprising the adhesive sheet according to any one of the above (1) to (28), and a release property having an adhesive surface abutting on the adhesive sheet The release liner of the surface, and the water contact angle of the above peelable surface is 100 degrees or more. (30) The adhesive sheet with a release liner according to the above (29), wherein the peelable surface is a surface of a release layer formed by a polyoxynitride-based release treatment agent. [Examples]

以下,對關於本發明之若干種實施例進行說明,但並非意圖將本發明限定於該具體例所示者。再者,以下之說明中之「份」及「%」若無特別說明,則為重量基準。In the following, several embodiments of the invention are described, but the invention is not intended to be limited to the specific examples. In addition, the "parts" and "%" in the following description are based on weight unless otherwise specified.

(聚合物A1之製備) 於具備攪拌翼、溫度計、氮氣導入管及冷卻器之四口燒瓶中,添加2EHA60份、N-乙烯基-2-吡咯啶酮(NVP)15份、甲基丙烯酸甲酯(MMA)10份、丙烯酸2-羥基乙酯(HEA)15份、及作為聚合溶劑之乙酸乙酯200份,於60℃下於氮氣環境下攪拌2小時後,投入作為熱聚合起始劑之AIBN0.2份,於60℃下進行6小時反應而獲得聚合物A1之溶液。該聚合物A1之Mw為110萬。(Preparation of Polymer A1) In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen introduction tube, and a cooler, 60 parts of 2EHA, 15 parts of N-vinyl-2-pyrrolidone (NVP), and methacrylic acid were added. 10 parts of ester (MMA), 15 parts of 2-hydroxyethyl acrylate (HEA), and 200 parts of ethyl acetate as a polymerization solvent, and stirred at 60 ° C for 2 hours under a nitrogen atmosphere, and then charged as a thermal polymerization initiator. 0.2 part of AIBN was reacted at 60 ° C for 6 hours to obtain a solution of polymer A1. The polymer A1 had a Mw of 1.1 million.

(聚合物B1之製備) 於具備攪拌翼、溫度計、氮氣導入管、冷卻器、滴液漏斗之四口燒瓶中,投入甲苯100份、MMA40份、甲基丙烯酸正丁酯(BMA)20份、甲基丙烯酸2-乙基己酯(2EHMA)20份、官能基當量為900 g/mol之含有聚有機矽氧烷骨架之甲基丙烯酸酯單體(商品名:X-22-174ASX,信越化學工業股份有限公司製造)8.7份、官能基當量為4600 g/mol之含有聚有機矽氧烷骨架之甲基丙烯酸酯單體(商品名:KF-2012,信越化學工業股份有限公司製造)11.3份及作為鏈轉移劑之硫代乙醇酸甲酯0.51份。繼而,於70℃下於氮氣環境下攪拌1小時後,投入作為熱聚合起始劑之AIBN0.2份,於70℃下反應2小時後,投入作為熱聚合起始劑之AIBN0.1重量份,繼而使其於80℃下反應5小時。如此獲得聚合物B1之溶液。該聚合物B1之Mw為22000。(Preparation of the polymer B1) Into a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas introduction tube, a cooler, and a dropping funnel, 100 parts of toluene, 40 parts of MMA, and 20 parts of n-butyl methacrylate (BMA) were placed. 20 parts of 2-ethylhexyl methacrylate (2EHMA) and a methacrylate monomer containing a polyorganosiloxane skeleton having a functional group equivalent of 900 g/mol (trade name: X-22-174ASX, Shin-Etsu Chemical Co., Ltd. Industrial Co., Ltd.) 8.7 parts of a methacrylate monomer containing a polyorganosiloxane skeleton (trade name: KF-2012, manufactured by Shin-Etsu Chemical Co., Ltd.), 11.3 parts, having a functional group equivalent of 4,600 g/mol And 0.51 part of methyl thioglycolate as a chain transfer agent. Then, after stirring at 70 ° C for 1 hour under a nitrogen atmosphere, 0.2 part of AIBN as a thermal polymerization initiator was introduced, and after reacting at 70 ° C for 2 hours, 0.1 part by weight of AIBN as a thermal polymerization initiator was charged. Then, it was allowed to react at 80 ° C for 5 hours. A solution of the polymer B1 was thus obtained. The polymer B1 had a Mw of 22,000.

(聚合物B2~B7之製備) 如表1所示變更單體成分之組成,使用硫甘油0.8份作為鏈轉移劑,使用乙酸乙酯作為聚合溶劑,此外,藉由與聚合物B1之製備相同之方式製備聚合物B2~B7。關於各聚合物之Mw,聚合物B2為19100,聚合物B3為19700,聚合物B4為19600,聚合物B5為20000,聚合物B6為18900,聚合物B7為19500。(Preparation of Polymers B2 to B7) The composition of the monomer component was changed as shown in Table 1, and 0.8 parts of thioglycerol was used as a chain transfer agent, and ethyl acetate was used as a polymerization solvent, and further, the preparation was the same as that of the polymer B1. The polymers B2 to B7 were prepared in the same manner. Regarding the Mw of each polymer, the polymer B2 was 19,100, the polymer B3 was 19,700, the polymer B4 was 19,600, the polymer B5 was 20,000, the polymer B6 was 18,900, and the polymer B7 was 19,500.

將聚合物B1~B7之製備所使用之單體成分之組成、基於該單體成分中之(甲基)丙烯酸系單體之組成的玻璃轉移溫度Tm1 、及聚合物B1~B7之玻璃轉移溫度TB 彙總示於表1。The composition of the monomer component used in the preparation of the polymers B1 to B7, the glass transition temperature T m1 based on the composition of the (meth)acrylic monomer in the monomer component, and the glass transfer of the polymers B1 to B7 The temperature T B is summarized in Table 1.

[表1] [Table 1]

再者,上述各聚合物之重量平均分子量係使用GPC裝置(Tosoh公司製造,HLC-8220GPC)於下述條件下進行測定,藉由聚苯乙烯換算而求出。 [GPC條件] ・樣品濃度:0.2 wt%(四氫呋喃(THF)溶液) ・樣品注入量:10 μl ・溶析液:THF・流速:0.6 ml/min ・測定溫度:40℃ ・管柱: 樣品管柱;TSKguardcolumn SuperHZ-H(1根)+TSKgel SuperHZM-H(2根) 參考管柱;TSKgel SuperH-RC(1根) ・檢測器:示差折射計(RI)In addition, the weight average molecular weight of each of the above polymers was measured under the following conditions using a GPC apparatus (manufactured by Tosoh Corporation, HLC-8220GPC), and was determined by polystyrene conversion. [GPC condition] ・Sample concentration: 0.2 wt% (tetrahydrofuran (THF) solution) ・Sample injection amount: 10 μl ・Solution solution: THF ・Flow rate: 0.6 ml/min ・Measurement temperature: 40 °C ・Tube: Sample tube Column; TSKguardcolumn SuperHZ-H (1) + TSKgel SuperHZM-H (2) Reference column; TSKgel SuperH-RC (1) ・ Detector: Differential refractometer (RI)

又,於表1所示之TB 之算出時,作為X-22-174ASX之Tg之值,使用‑126℃,作為KF-2012之Tg之值,使用-127℃。該等含有聚有機矽氧烷骨架之甲基丙烯酸酯單體之Tg係藉由將該單體(測定試樣)放入至鋁製簡易密閉容器中並於以下之條件下進行DSC(示差掃描熱量測定)而求出。 [DSC條件] 裝置:TA Instruments,Q-2000 溫控程式:-160℃~40℃ 升溫速度:10℃/min 環境氣體:He(50 ml/min)Further, in the calculation of T B shown in Table 1, 126 ° C was used as the value of Tg of X-22-174ASX, and -127 ° C was used as the value of Tg of KF-2012. The Tg of the methacrylate monomer containing the polyorganosiloxane skeleton is placed in a simple sealed container made of aluminum and subjected to DSC (differential scanning) under the following conditions. Determined by calorie measurement. [DSC condition] Device: TA Instruments, Q-2000 Temperature control program: -160 °C ~ 40 °C Heating rate: 10 °C / min Ambient gas: He (50 ml / min)

<黏著片材之製作> (例1) 於上述聚合物A1之溶液中,相對於該溶液中所含之聚合物A1之100份,添加2.5份之聚合物B1、2.5份之異氰酸酯系交聯劑(商品名:Takenate D110N,三羥甲基丙烷苯二甲基二異氰酸酯,三井化學公司製造),均勻地混合而製備黏著劑組合物C1。 於作為支持基材之厚度125 μm之聚對苯二甲酸乙二酯(PET)膜(Toray公司製造,商品名「Lumirror」)之第一面直接塗佈黏著劑組合物C1,於110℃下加熱2分鐘而使其乾燥,藉此形成厚度25 μm之黏著劑層。於該黏著劑層之表面(黏著面)貼合剝離襯墊R1之剝離面。如此,以黏著面抵接於該剝離襯墊之剝離面的附剝離襯墊之黏著片材之形態獲得例1之黏著片材。 再者,作為剝離襯墊,使用Mitsubishi Chemical公司製造之MRQ25T100(於聚酯膜之單面具有利用聚矽氧系剝離處理劑所形成之剝離層之剝離襯墊,厚度25 μm)。<Preparation of Adhesive Sheet> (Example 1) In the solution of the above polymer A1, 2.5 parts of the polymer B1 and 2.5 parts of isocyanate-based cross-linking were added with respect to 100 parts of the polymer A1 contained in the solution. The agent (trade name: Takenate D110N, trimethylolpropane phthalyl diisocyanate, manufactured by Mitsui Chemicals, Inc.) was uniformly mixed to prepare an adhesive composition C1. The adhesive composition C1 was directly applied to the first side of a polyethylene terephthalate (PET) film (manufactured by Toray Co., Ltd., trade name "Lumirror") having a thickness of 125 μm as a supporting substrate, at 110 ° C. It was dried by heating for 2 minutes, thereby forming an adhesive layer having a thickness of 25 μm. The peeling surface of the release liner R1 is bonded to the surface (adhesive surface) of the adhesive layer. In this manner, the adhesive sheet of Example 1 was obtained in the form of an adhesive sheet with a release liner which abuts against the release surface of the release liner. Further, as the release liner, MRQ25T100 (a release liner having a release layer formed of a polyfluorene-based release treatment agent on one side of the polyester film, thickness: 25 μm) was used by Mitsubishi Chemical Co., Ltd.

(例2~例11) 如表2所示變更聚合物B及交聯劑之使用量,除此以外,藉由與黏著劑組合物C1之製備相同之方式製備黏著劑組合物C2~C11。分別使用該等黏著劑組合物C2~C11,除此以外,藉由與例1之黏著片材之製作相同之方式獲得例2~例11之黏著片材。(Examples 2 to 11) Adhesive compositions C2 to C11 were prepared in the same manner as in the preparation of the adhesive composition C1 except that the amounts of the polymer B and the crosslinking agent were changed as shown in Table 2. Adhesive sheets of Examples 2 to 11 were obtained in the same manner as in the production of the adhesive sheet of Example 1, except that the adhesive compositions C2 to C11 were used, respectively.

<對於SUS之黏著力之測定> 將各例之黏著片材連同剝離襯墊一起裁斷為25 mm寬度,將其等作為試片,將利用甲苯潔淨化之SUS板(SUS304BA板)作為被黏著體,按照以下之順序測定黏著力N23 、黏著力N50 及黏著力N80 。 (黏著力N23 之測定) 於23℃、50%RH之標準環境下,將覆蓋各試片之黏著面之剝離襯墊剝離,使2 kg之輥往返1次將所露出之黏著面壓接於被黏著體。將如此壓接於被黏著體之試片於上述標準環境下放置30分鐘後,使用萬能拉伸壓縮試驗機(裝置名「拉伸壓縮試驗機,TCM-1kNB」Minebea公司製造),依據JIS Z0237,於剝離角度180度、拉伸速度300 mm/min之條件下,測定180°剝離黏著力(相對於上述拉伸之阻力)。測定係進行3次,將其等之平均值作為23℃30分鐘後之黏著力(N23 )[N/25 mm]示於表2。 (黏著力N50 之測定) 將藉由與上述黏著力23 之測定相同之方式壓接於被黏著體之試片於50℃之環境下保持30分鐘,繼而於上述標準環境下放置30分鐘,其後,同樣地測定180°剝離黏著力。測定係進行3次,將其等之平均值作為50℃30分鐘後之黏著力(N50 )[N/25 mm]示於表2。 (黏著力N80 之測定) 將藉由與上述黏著力23 之測定相同之方式壓接於被黏著體之試片於80℃下加熱5分鐘,繼而於上述標準環境下放置30分鐘,其後,同樣地測定180°剝離黏著力。測定係進行3次,將其等之平均值作為80℃5分鐘後之黏著力(N80 )[N/25 mm]示於表2。再者,確認到例1~11之黏著片材均未於黏著力N80 之測定時產生抓固破壞。 基於該等黏著力測定結果,算出N80 /N50 、N50 /N23 、N80 /N23 、N50 -N23 、及(N80 -N50 )/(N50 -N23 )。將所獲得之結果示於表2。<Measurement of Adhesive Strength of SUS> The adhesive sheet of each example was cut into a width of 25 mm together with a release liner, and the like was used as a test piece, and a SUS plate (SUS304BA plate) cleaned with toluene was used as an adherend. The adhesion force N 23 , the adhesion force N 50 , and the adhesion force N 80 were measured in the following order. (Measurement of Adhesion N 23 ) The release liner covering the adhesive faces of each test piece was peeled off in a standard environment of 23 ° C and 50% RH, and the exposed surface of the test was crimped by a roll of 2 kg. It is stuck to the body. The test piece thus pressure-bonded to the adherend was placed in the above-mentioned standard environment for 30 minutes, and then a universal tensile compression tester (device name "Tensile Compression Tester, TCM-1kNB" manufactured by Minebea Co., Ltd.) was used, in accordance with JIS Z0237. The 180° peel adhesion (relative to the resistance of the above stretching) was measured under the conditions of a peeling angle of 180 degrees and a tensile speed of 300 mm/min. The measurement system was carried out three times, and the average value thereof was defined as the adhesion force (N 23 ) [N/25 mm] after 30 minutes at 23 ° C. (Measurement of Adhesion N 50 ) The test piece crimped to the adherend in the same manner as the measurement of the adhesive force 23 was kept at 50 ° C for 30 minutes, and then placed in the above standard environment for 30 minutes. Thereafter, the 180° peel adhesion was measured in the same manner. The measurement system was carried out three times, and the average value of these was shown in Table 2 as the adhesion (N 50 ) [N/25 mm] after 30 minutes at 50 °C. (Measurement of Adhesion N 80 ) The test piece crimped to the adherend was heated at 80 ° C for 5 minutes in the same manner as the above-described measurement of the adhesive force 23 , and then left in the above-mentioned standard environment for 30 minutes, and thereafter. The 180° peel adhesion was measured in the same manner. The measurement system was carried out three times, and the average value thereof was shown in Table 2 as the adhesion force (N 80 ) [N/25 mm] after 5 minutes at 80 °C. Further, it was confirmed that the adhesive sheets of Examples 1 to 11 did not cause scratching damage at the time of measurement of the adhesive force N 80 . Based on the results of the measurement of the adhesion, N 80 /N 50 , N 50 /N 23 , N 80 /N 23 , N 50 -N 23 , and (N 80 -N 50 )/(N 50 -N 23 ) were calculated. The results obtained are shown in Table 2.

[表2] [Table 2]

如表2所示,確認到使用玻璃轉移溫度Tm1 處於50℃~100℃之範圍之聚合物B3~B5的例5~9之黏著片材由於N80 /N50 為5以上,故而即便於在貼附初期施加50℃左右之溫度亦維持適於二次加工之低黏著性,且可藉由80℃5分鐘之加熱而使黏著力大幅地上升。As shown in Table 2, it was confirmed that the adhesive sheets of Examples 5 to 9 in which the polymers B3 to B5 having the glass transition temperature T m1 were in the range of 50 ° C to 100 ° C had a N 80 /N 50 of 5 or more, and thus even Applying a temperature of about 50 ° C at the initial stage of attachment also maintains low adhesion suitable for secondary processing, and the adhesion can be greatly increased by heating at 80 ° C for 5 minutes.

另一方面,使用玻璃轉移溫度Tm1 低於50℃之聚合物B1、B2、B7的例1~4及例11之黏著片材係N80 /N50 未達5,因在貼附初期施加50℃左右之溫度而黏著力容易上升者。於例4之黏著片材中,N50 相對較低,但藉由80℃5分鐘之加熱無法使黏著力大幅地上升。又,使用玻璃轉移溫度Tm1 超過100℃之聚合物B6之例10藉由80℃5分鐘之加熱無法使黏著力上升。On the other hand, the adhesive sheets N 80 /N 50 of Examples 1 to 4 and Example 11 of the polymers B1, B2, and B7 having a glass transition temperature T m1 of less than 50 ° C were less than 5, which were applied at the initial stage of attachment. The temperature is about 50 ° C and the adhesion is easy to rise. In the adhesive sheet of Example 4, N 50 was relatively low, but the adhesion could not be greatly increased by heating at 80 ° C for 5 minutes. Further, in the case of using the polymer B6 having a glass transition temperature T m1 exceeding 100 ° C, the adhesion could not be increased by heating at 80 ° C for 5 minutes.

以上,對本發明之具體例進行了詳細說明,但該等僅為例示,並非限定申請專利範圍。申請專利範圍所記載之技術包含將以上所例示之具體例進行各種變化、變更者。The specific examples of the present invention have been described in detail above, but these are merely examples and are not intended to limit the scope of the claims. The technology described in the patent application scope includes various changes and modifications of the specific examples described above.

1‧‧‧黏著片材1‧‧‧Adhesive sheet

2‧‧‧黏著片材2‧‧‧Adhesive sheets

3‧‧‧黏著片材3‧‧‧Adhesive sheets

10‧‧‧支持基材10‧‧‧Support substrate

10A‧‧‧第一面10A‧‧‧ first side

10B‧‧‧第二面10B‧‧‧ second side

21‧‧‧黏著劑層(第一黏著劑層)21‧‧‧Adhesive layer (first adhesive layer)

21A‧‧‧黏著面(第一黏著面)21A‧‧‧Adhesive surface (first adhesive side)

21B‧‧‧黏著面(第二黏著面)21B‧‧‧Adhesive surface (second adhesive surface)

22‧‧‧黏著劑層(第二黏著劑層)22‧‧‧Adhesive layer (second adhesive layer)

22A‧‧‧黏著面(第二黏著面)22A‧‧‧Adhesive surface (second adhesive surface)

31‧‧‧剝離襯墊31‧‧‧Release liner

32‧‧‧剝離襯墊32‧‧‧Release liner

100‧‧‧附剝離襯墊之黏著片材(黏著製品)100‧‧‧Adhesive sheet with release liner (adhesive product)

200‧‧‧附剝離襯墊之黏著片材(黏著製品)200‧‧‧Adhesive sheet with release liner (adhesive product)

300‧‧‧附剝離襯墊之黏著片材(黏著製品)300‧‧‧Adhesive sheet with release liner (adhesive product)

圖1係模式性地表示一實施形態之黏著片材之構成之剖視圖。 圖2係模式性地表示另一實施形態之黏著片材之構成之剖視圖。 圖3係模式性地表示另一實施形態之黏著片材之構成之剖視圖。Fig. 1 is a cross-sectional view schematically showing the configuration of an adhesive sheet of an embodiment. Fig. 2 is a cross-sectional view schematically showing the configuration of an adhesive sheet of another embodiment. Fig. 3 is a cross-sectional view schematically showing the configuration of an adhesive sheet of another embodiment.

Claims (10)

一種黏著片材,其係包含黏著劑層者, 上述黏著劑層含有聚合物A、及作為具有聚有機矽氧烷骨架之單體與(甲基)丙烯酸系單體之共聚物的聚合物B, 上述聚合物B之基於上述(甲基)丙烯酸系單體之組成的玻璃轉移溫度Tm1 為50℃以上且100℃以下,且 貼合於不鏽鋼板後於80℃下加熱5分鐘後之黏著力N80 為貼合於不鏽鋼板後於50℃下保持30分鐘後之黏著力N50 的5倍以上。An adhesive sheet comprising an adhesive layer, the adhesive layer comprising a polymer A, and a polymer B as a copolymer of a monomer having a polyorganosiloxane skeleton and a (meth)acrylic monomer The glass transition temperature T m1 of the polymer B based on the composition of the (meth)acrylic monomer is 50° C. or more and 100° C. or less, and is adhered to a stainless steel plate and then heated at 80° C. for 5 minutes. The force N 80 is 5 times or more the adhesive force N 50 after being held at 50 ° C for 30 minutes after being bonded to a stainless steel plate. 如請求項1之黏著片材,其中 上述黏著力N50 與貼合於不鏽鋼板後於23℃下放置30分鐘後之黏著力N23 之關係滿足下式: (N50 /N23 )<10。The adhesive sheet of claim 1, wherein the adhesive force N 50 and the adhesive force N 23 after being placed at 23 ° C for 30 minutes after being attached to the stainless steel sheet satisfy the following formula: (N 50 /N 23 ) <10 . 如請求項1或2之黏著片材,其中上述聚合物A之玻璃轉移溫度TA 為‑80℃以上且未達0℃。The adhesive sheet of claim 1 or 2, wherein the glass transition temperature T A of the above polymer A is ‐80° C. or more and less than 0° C. 如請求項1至3中任一項之黏著片材,其中上述聚合物B之玻璃轉移溫度TB 為-10℃以上且10℃以下。The adhesive sheet according to any one of claims 1 to 3, wherein the polymer B has a glass transition temperature T B of -10 ° C or more and 10 ° C or less. 如請求項1至4中任一項之黏著片材,其中上述聚合物B中均聚物之玻璃轉移溫度高於170℃之單體之共聚比率為30重量%以下。The adhesive sheet according to any one of claims 1 to 4, wherein a copolymerization ratio of a monomer having a glass transition temperature of more than 170 ° C in the above polymer B is 30% by weight or less. 如請求項1至5中任一項之黏著片材,其中上述黏著劑層含有相對於100重量份上述聚合物A多於0重量份且10重量份以下之交聯劑。The adhesive sheet according to any one of claims 1 to 5, wherein the adhesive layer contains more than 0 parts by weight and 10 parts by weight or less of the crosslinking agent with respect to 100 parts by weight of the above polymer A. 如請求項1至6中任一項之黏著片材,其中上述聚合物B之重量平均分子量為10000以上且50000以下。The adhesive sheet according to any one of claims 1 to 6, wherein the polymer B has a weight average molecular weight of 10,000 or more and 50,000 or less. 如請求項1至7中任一項之黏著片材,其中上述黏著劑層中之上述聚合物B之含量相對於100重量份上述聚合物A為0.05重量份以上且20重量份以下。The adhesive sheet according to any one of claims 1 to 7, wherein the content of the polymer B in the adhesive layer is 0.05 parts by weight or more and 20 parts by weight or less based on 100 parts by weight of the polymer A. 如請求項1至8中任一項之黏著片材,其包含具有第一面及第二面之支持基材,且於該支持基材之至少上述第一面積層有上述黏著劑層。The adhesive sheet according to any one of claims 1 to 8, comprising a support substrate having a first side and a second side, and at least the first area layer of the support substrate has the adhesive layer. 如請求項9之黏著片材,其中上述支持基材之厚度為30 μm以上。The adhesive sheet of claim 9, wherein the support substrate has a thickness of 30 μm or more.
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