TW202333277A - A system and method for selective unloading of ic packages - Google Patents

Abstract

A system for unloading integrated circuit (IC) units, the system comprising: a first and second unloading station; a delivery system arranged to deposit said IC units in the first or second unloading station, and; a control system for determining which unloading station each IC unit is to be deposited.

Description

System and method for selective unloading of IC packages

This invention relates to the processing of integrated circuits, and more particularly to the processing of individual integrated circuit units cut or separated from a substrate containing a plurality of such integrated circuits.

Two key criteria for the economic viability of a single device include the rate of the processing unit, measured in units per hour (UPH), and the capital cost of the device that performs the action. This may be hampered in terms of capital costs, depending on the type of IC package being segmented, its end use, and how these packages are provided to the end user after processing.

Traditional singulation devices provide a linear path for substrate processing from loading the substrate to cutting and then unloading, which also includes intermediate steps such as checking alignment and cleaning of the singulated units.

Therefore, it would be preferable to have a system that provided a greater degree of flexibility while still managing capital costs.

In a first aspect, the invention provides a system for unloading integrated circuit (IC) units, the system comprising: a first and second unloading station; a delivery system arranged to store the IC units In the first or second unloading station, and; a control system for determining in which unloading station each IC unit will be deposited.

In a second aspect, the present invention provides a method of unloading integrated circuit (IC) units to a first or second unloading station. The method includes the steps of: determining in which unloading station each IC unit will be stored, and Then; store the IC units in the selected unloading station.

The following description of the invention and its various embodiments will use interchangeable language to describe various parts. For example, a block for receiving a substrate may include a chuck or other similar device. The cutting process as defined herein may involve a dicing saw, so the terms cutting, sawing and pelletizing are used interchangeably when considering linear cuts to the substrate. The present invention may also include other cutting techniques, including laser cutting and waterjet.

The present invention is directed to a method of increasing the applicability of equipment and processes to a wider range of conditions and end-user needs without significant increases in capital equipment. In implementing prior art devices and processes consistent with the present invention, it is likely that additional equipment will be required to manipulate the substrate into the desired position.

Figures 1 and 2 show an apparatus 5 and a process arranged to provide these advantages. The device 5 is divided into four different parts, namely loader 10, cutting section 12, processor 15 and unloading sections 195A, 195B.

At one end, a loading station 20 loads substrates from the cassette loading bin 18 onto a frame carousel 25, which then redirects the substrates from the loading position to the cutting position. The substrate is joined by a frame picker 40, to which a camera 35 is attached. The camera checks the position of the substrate on the workbench 25 to ensure it is correctly aligned before being engaged by the frame picker 40. Depending on the stage of processing, the frame picker 40 transfers the substrate to one of two blocks arranged to receive the substrate, in this case the chucks 45, 50. The chucks are in the first loading position, which is hereinafter defined as the "original position".

Within the cutting section 12 are a cutting saw 47 and an alignment detection device 48, both mounted on linear slides for selective sliding between the two areas.

Each chuck 45, 50 is arranged to move on a linear slide to coincide with each of the cutting saw cleaning station and alignment inspection device. The cutting saw 47 can only accommodate one substrate at a time and therefore must slide from a first cutting area coinciding with a point on the track for the first chuck, and from a second cutting area coinciding with a point on the track for the second chuck . Therefore, the cutting saw 47 slides back and forth between the two cutting areas, depending on which chuck it is serving at the time. Similarly, the alignment detection device 48 moves from a first alignment detection station to a second alignment detection station corresponding to the first and second chucks. As a result, the alignment check 48 will slide back and forth between alignment check stations, depending on the chuck it serves.

Each chuck 45, 50 is arranged to transfer the substrate to the inspection station 48 before the substrate is transferred to the cutting station 47. Because the substrates are transferred one at a time, processing of any one substrate is staggered with respect to the next substrate.

In one specific embodiment of the process, the second substrate is loaded into the second chuck 50 during the alignment detection 48 stage, or alternatively, during the cutting stage 47 . Once the first substrate leaves the cutting station, the second substrate may be transferred to the second cutting area to coincide with the cutting saw 47 sliding from the first cutting area. The substrates are staggered from each other along their path through the system for a set amount of time to meet the designer's goals.

As with similar treatments, substrates may follow the following treatments: i) Loading (40) ii) Alignment check (48) iii) Cutting (47) iv) Uninstall(60)

In this particular embodiment, movement of the substrate on the chucks 45,50 is accomplished by moving the respective stations 47,48 onto the chucks themselves. That is, the first and second chucks 45, 50 operate along rails or otherwise to move the substrate to designated alignment inspection stations 48 and cutting stations 47.

The device further includes a bulk unit picker 60 that moves along a common rail with the frame picker 40 to jointly engage individual integrated circuit units from the first and second chucks 45, 50. Before proceeding further, the units pass through the cleaning box 65 and are placed on a drying block 70 where they are dried by a blower.

The units then pass through the guide plate 90 and the free block 95 before being transferred in reverse direction to the first net block 80 or the second net block 100 . The first and second net stations 80, 100 are both located on linear slides so that the net stations are adjacent to a pair of parallel slide rails with individual net pick-ups thereon.

From here, the segmented cells follow a parallel path whereby the first mesh block is conveyed to a pair of double rails 86, 102, whereupon the cell picker operates for alignment before being conveyed to the unloading section 195A, 195B. Aligner 160 and side detection unit 165 of these units.

The apparatus and process according to the invention include a control system to select the means for subsequent unloading and packaging of the units. Depending on the type of IC unit, the type of end-use processing equipment, the industry in which it is used, etc., the present invention is arranged to direct the units to a plurality of unloading stations using predetermined criteria. In this specific embodiment, two such unloading stations are provided, namely JEDEC IC tray 195A or wafer ring 195B. It should be noted that if the next step after unloading includes a sputtering process, the wafer ring can be a sputtered film frame.

If JEDEC IC pallet unloading is selected, the picker places units into the various categories indicated by pallets 142, 147, 152. Similarly, the second net block 100 may be positioned to engage a second set of dual rails with corresponding unit pickers for picking up individual units again for deposit to category pallets 142, 147, 152.

Each pallet has discrete tracks on which individual units can be collected from two sets of parallel slides for final storage to end boxes 140, 145, 150. Here, "good" units may be stored in two bins 140, 145, "rework" units in the third bin 150, and "failed" units in the last bin 155 for disposal.

If wafer ring unload 195B is selected, the picker places the unit into reject bin 155 or wafer ring loading station 195B. Here, the wafer loading picker 175 positions the wafer ring on the table 180 . The cell picker then places the cell on the available wafer ring. Once filled, clamp 170 engages the wafer ring and places the ring through guide rail 185 into the unloading elevator. Once the elevator is full, the wafer ring can be unloaded. The wafer ring is then unloaded and/or sputtered for the end user.

Unloading stations 195A, 195B are positioned close to each other to facilitate unloading from both stations with minimal adjustment.

Selection of unloading stations can be done between batches or during batches, where the same type of units are used for different end uses, and the control system is able to track loaded units, minus those that failed and were marked for rework, so that Signals when bins or lifts/cassettes need to be unloaded.

5:Device 10:Loader 12: Cutting section 15: Processor 18: Cassette loading box 20:Loading station 25:Frame turntable 35:Camera 40: Frame Picker 45,50:Chuck 47: Cutting Giant 48: Alignment detection device 55: Entering orbit 60: Bulk unit picker 65: Cleaning box 70: Dry block 80: First network block 86,102:Double track 90: Guide plate 95: free block 100: Second network block 140,145,150: End box 142,147,152:Pallet 155: Unqualified box 160:Aligner 165: Side detection unit 170: Fixture 175:Wafer loading picker 180:Workbench 185: Guide rail 190: Wafer ring unloading 195A, 195B: Unload section

This facilitates further explanation of the invention with respect to the accompanying drawings illustrating possible configurations of the invention. Other configurations of the invention are possible, and therefore the particularity of the drawings should not be construed as replacing the generality of the foregoing description of the invention. Figure 1 is a system plan view according to a specific embodiment of the present invention, and; Figure 2 is a processing flow chart according to a specific embodiment of the present invention.

5:Device

10:Loader

12: Cutting section

15: Processor

18: Cassette loading box

20:Loading station

25:Frame turntable

35:Camera

40: Frame Picker

45,50:Chuck

47: Cutting Giant

48: Alignment detection device

55: Entering orbit

60: Bulk unit picker

65: Cleaning box

70: Dry block

80: First network block

86,102:Double track

90: Guide plate

95: free block

100: Second network block

140,145,150: End box

142,147,152:Pallet

155: Unqualified box

160:Aligner

165: Side detection unit

170: Fixture

175:Wafer loading picker

180:Workbench

185: Guide rail

190: Wafer ring unloading

195A, 195B: Unload section

Claims (11)

A system for unloading integrated circuit (IC) units, the system includes: a first and second unloading station; a delivery system arranged to deposit the IC units in the first or second unloading station, and; A control system that determines which unloading station each IC unit will be deposited at. The system of claim 1, wherein the control system is arranged to make the determination based on predetermined criteria. The system of claim 1 or 2 further includes a detection system, wherein the delivery system is arranged to pass the IC unit through the detection system before depositing it at the first or second unloading station. The system of claim 3, wherein the detection system is arranged to identify unqualified IC units, and the delivery system is arranged to place unqualified IC units in unqualified bins before the unloading stations. The system of any one of claims 1 to 4, wherein the first loading station is arranged to unload the IC units to a JEDEC IC tray. The system of any one of claims 1 to 5, wherein the second loading station is arranged to unload the IC units to the wafer ring. A method of unloading integrated circuit (IC) units to a first or second unloading station, the method includes the steps: Determine which unloading station each IC unit will be stored at, and then; Store the IC units at selected unloading stations. The method of claim 7 further includes a step of testing the IC units before the placing step. The method of claim 8, wherein the detection step includes identifying unqualified IC units; It also includes the step of placing the unqualified IC units into a unqualified box before the placing step. The method of any one of claims 7 to 9 further includes the step of unloading the unit placed in the first unloading station to the JEDEC IC tray. The method of any one of claims 7 to 10 further includes the step of unloading the unit placed in the first unloading station to the wafer ring.