TW202332128A - Portable electronic device and antenna module having light-emitting function - Google Patents

Portable electronic device and antenna module having light-emitting function Download PDF

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TW202332128A
TW202332128A TW112113201A TW112113201A TW202332128A TW 202332128 A TW202332128 A TW 202332128A TW 112113201 A TW112113201 A TW 112113201A TW 112113201 A TW112113201 A TW 112113201A TW 202332128 A TW202332128 A TW 202332128A
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shunting
signal
circuit substrate
electrically connected
matching
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TW112113201A
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Chinese (zh)
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王志祥
夏振恩
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台灣禾邦電子有限公司
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The present invention provides a portable electronic device and an antenna module having light-emitting function. The antenna module includes an RF and DC signal shunt circuit structure, an antenna structure, and a light-emitting structure. The RF and DC signal shunt circuit structure includes a current-shunting capacitor element and a current-shunting inductor element. The antenna structure is electrically connected to the current-shunting capacitor element of the RF and DC signal shunt circuit structure. The light-emitting structure is electrically connected to the current-shunting inductor element of the RF and DC signal shunt circuit structure. Therefore, when an RF signal and a DC signal are transmitted to the RF and DC signal shunt circuit structure through a same signal transmission cable, the RF signal can be transmitted to the antenna structure through the current-shunting capacitor element, and the DC signal can be transmitted to the light-emitting structure through the current-shunting inductor element.

Description

可攜式電子裝置及其具有發光功能的天線模組Portable electronic device and its antenna module with light emitting function

本發明涉及一種電子裝置及其天線模組,特別是涉及一種可攜式電子裝置及其具有發光功能的天線模組。The invention relates to an electronic device and its antenna module, in particular to a portable electronic device and its antenna module with light emitting function.

現有技術中,發光結構與天線結構是彼此分離設置,並且發光結構需要使用一直流訊號傳輸線來接收直接訊號,而天線結構則需要使用一射頻訊號傳輸線來接收射頻訊號,所以現有技術中的發光結構與天線結構的整合仍然具有可改善空間。In the prior art, the light-emitting structure and the antenna structure are arranged separately from each other, and the light-emitting structure needs to use a DC signal transmission line to receive the direct signal, while the antenna structure needs to use a radio-frequency signal transmission line to receive the radio-frequency signal, so the light-emitting structure in the prior art The integration with the antenna structure still has room for improvement.

本發明所要解決的技術問題在於,針對現有技術的不足提供一種可攜式電子裝置及其具有發光功能的天線模組。The technical problem to be solved by the present invention is to provide a portable electronic device and its antenna module with light emitting function in view of the deficiencies in the prior art.

為了解決上述的技術問題,本發明所採用的其中一技術方案是提供一種具有發光功能的天線模組,其包括:一射頻與直流訊號分流電路結構、一天線結構以及一發光結構。射頻與直流訊號分流電路結構包括一電路基板、設置在電路基板上的一分流用電容元件以及設置在電路基板上的一分流用電感元件。天線結構電性連接於射頻與直流訊號分流電路結構的分流用電容元件。發光結構電性連接於射頻與直流訊號分流電路結構的分流用電感元件。其中,所述分流用電感元件不會電性連接於位於所述分流用電容元件與所述天線結構兩者之間的導電路徑。In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide an antenna module with light emitting function, which includes: a radio frequency and direct current signal shunt circuit structure, an antenna structure and a light emitting structure. The shunting circuit structure of radio frequency and direct current signal includes a circuit substrate, a shunting capacitive element arranged on the circuit substrate and an inductive element arranged on the circuit substrate. The antenna structure is electrically connected to the shunting capacitive element of the radio frequency and direct current signal shunting circuit structure. The light-emitting structure is electrically connected to the shunting inductance element of the radio frequency and direct current signal shunting circuit structure. Wherein, the inductive element for shunting is not electrically connected to the conductive path between the capacitive element for shunting and the antenna structure.

為了解決上述的技術問題,本發明所採用的另外一技術方案是提供一種可攜式電子裝置,可攜式電子裝置使用一具有發光功能的天線模組,其特徵在於,天線模組包括:一射頻與直流訊號分流電路結構、一天線結構以及一發光結構。射頻與直流訊號分流電路結構包括一電路基板、設置在電路基板上的一分流用電容元件以及設置在電路基板上的一分流用電感元件。天線結構電性連接於射頻與直流訊號分流電路結構的分流用電容元件。發光結構電性連接於射頻與直流訊號分流電路結構的分流用電感元件。其中,所述分流用電感元件不會電性連接於位於所述分流用電容元件與所述天線結構兩者之間的導電路徑。In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a portable electronic device. The portable electronic device uses an antenna module with a light-emitting function. It is characterized in that the antenna module includes: a RF and DC signal shunt circuit structure, an antenna structure and a light emitting structure. The shunting circuit structure of radio frequency and direct current signal includes a circuit substrate, a shunting capacitive element arranged on the circuit substrate and an inductive element arranged on the circuit substrate. The antenna structure is electrically connected to the shunting capacitive element of the radio frequency and direct current signal shunting circuit structure. The light-emitting structure is electrically connected to the shunting inductance element of the radio frequency and direct current signal shunting circuit structure. Wherein, the inductive element for shunting is not electrically connected to the conductive path between the capacitive element for shunting and the antenna structure.

本發明的其中一有益效果在於,本發明所提供的一種可攜式電子裝置及其具有發光功能的天線模組,其能通過“射頻與直流訊號分流電路結構包括一電路基板、設置在電路基板上的一分流用電容元件以及設置在電路基板上的一分流用電感元件”、“天線結構電性連接於射頻與直流訊號分流電路結構的分流用電容元件”以及“發光結構電性連接於射頻與直流訊號分流電路結構的分流用電感元件”的技術方案,以使得當一射頻訊號以及一直流訊號透過同一個訊號傳輸線而輸入到射頻與直流訊號分流電路結構時,射頻訊號可以通過分流用電容元件而傳送到天線結構,並且直流訊號可以通過分流用電感元件而傳送到發光結構。One of the beneficial effects of the present invention is that a portable electronic device and its antenna module with light-emitting function provided by the present invention can pass through the "radio frequency and direct current signal shunt circuit structure including a circuit substrate, arranged on the circuit substrate A capacitive element for shunting on the circuit board and an inductive element for shunting arranged on the circuit substrate", "the antenna structure is electrically connected to the shunting capacitive element of the radio frequency and DC signal shunting circuit structure", and "the light emitting structure is electrically connected to the radio frequency A shunt inductive element with a DC signal shunt circuit structure" technical solution, so that when a radio frequency signal and a DC signal are input to the radio frequency and DC signal shunt circuit structure through the same signal transmission line, the radio frequency signal can pass through the shunt capacitor The component is transmitted to the antenna structure, and the DC signal can be transmitted to the light emitting structure through the inductive component for shunting.

為使能進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

以下是通過特定的具體實施例來說明本發明所公開有關“可攜式電子裝置及其具有發光功能的天線模組”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以實行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不背離本發明的構思下進行各種修改與變更。另外,需事先聲明的是,本發明的圖式僅為簡單示意說明,並非依實際尺寸的描繪。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。The following is a description of the implementation of the "portable electronic device and its antenna module with light-emitting function" disclosed by the present invention through specific specific examples. Those skilled in the art can understand the scope of the present invention from the content disclosed in this specification. Advantages and effects. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, it should be stated in advance that the drawings of the present invention are only schematic illustrations, and are not drawn according to actual dimensions. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

[第一實施例][first embodiment]

參閱圖1至圖4所示,本發明第一實施例提供一種具有發光功能的天線模組M,其包括:一射頻與直流訊號分流電路結構1、一天線結構2以及一發光結構3。Referring to FIG. 1 to FIG. 4 , the first embodiment of the present invention provides an antenna module M with light emitting function, which includes: a RF and DC signal shunt circuit structure 1 , an antenna structure 2 and a light emitting structure 3 .

首先,如圖1所示,射頻與直流訊號分流電路結構1包括一電路基板10、設置在電路基板10上的一分流用電容元件11以及設置在電路基板10上的一分流用電感元件12。另外,天線結構2電性連接於射頻與直流訊號分流電路結構1的分流用電容元件11,並且發光結構3電性連接於射頻與直流訊號分流電路結構1的分流用電感元件12。藉此,當一射頻訊號RF以及一直流訊號DC透過“同一個訊號傳輸線L”而輸入到射頻與直流訊號分流電路結構1時,射頻訊號RF可以通過分流用電容元件11而傳送到天線結構2(此時,射頻訊號RF不會通過分流用電感元件12),並且直流訊號DC可以通過分流用電感元件12而傳送到發光結構3(此時,直流訊號DC不會通過分流用電容元件11)。值得注意的是,分流用電容元件11與天線結構2兩者之間定義有導電路徑(至少包括第二導電路徑102),並且分流用電感元件12不會電性連接於位於分流用電容元件11與天線結構2兩者之間的導電路徑(至少包括第二導電路徑102)。First, as shown in FIG. 1 , the RF and DC signal shunting circuit structure 1 includes a circuit substrate 10 , a shunting capacitive element 11 disposed on the circuit substrate 10 , and a shunting inductive element 12 disposed on the circuit substrate 10 . In addition, the antenna structure 2 is electrically connected to the shunting capacitive element 11 of the RF and DC signal shunting circuit structure 1 , and the light emitting structure 3 is electrically connected to the shunting inductive element 12 of the RF and DC signal shunting circuit structure 1 . In this way, when a radio frequency signal RF and a direct current signal DC are input to the radio frequency and direct current signal shunt circuit structure 1 through "the same signal transmission line L", the radio frequency signal RF can be transmitted to the antenna structure 2 through the shunt capacitive element 11 (At this time, the radio frequency signal RF will not pass through the inductive element 12 for shunting), and the direct current signal DC can be transmitted to the light emitting structure 3 through the inductive element 12 for shunting (at this time, the direct current signal DC will not pass through the capacitive element 11 for shunting) . It should be noted that a conductive path (including at least the second conductive path 102 ) is defined between the shunt capacitive element 11 and the antenna structure 2 , and the shunt inductive element 12 is not electrically connected to the shunt capacitive element 11 . The conductive path between the antenna structure 2 and the antenna structure 2 (including at least the second conductive path 102 ).

再者,如圖1所示,射頻與直流訊號分流電路結構1包括一第一電連接器13、一第二電連接器14以及一第三電連接器15,天線結構2與電路基板10彼此分離,並且發光結構3與電路基板10彼此分離。更進一步來說,第一電連接器13設置在電路基板10上且電性連接於訊號傳輸線L,以用於接收射頻訊號RF以及直流訊號DC。第二電連接器14設置在電路基板10上且電性連接於天線結構2,以用於輸出射頻訊號RF到天線結構2,以使得射頻訊號RF可以透過天線結構2進行收發。第三電連接器15設置在電路基板10上且電性連接於發光結構3,以用於輸出直流訊號DC到發光結構3,以使得發光結構3可以透過直流訊號DC所提供的電源(直流電源)而產生光源。Furthermore, as shown in FIG. 1 , the RF and DC signal shunting circuit structure 1 includes a first electrical connector 13, a second electrical connector 14, and a third electrical connector 15, and the antenna structure 2 and the circuit substrate 10 are connected to each other. separated, and the light emitting structure 3 and the circuit substrate 10 are separated from each other. Furthermore, the first electrical connector 13 is disposed on the circuit substrate 10 and electrically connected to the signal transmission line L for receiving the radio frequency signal RF and the direct current signal DC. The second electrical connector 14 is disposed on the circuit substrate 10 and electrically connected to the antenna structure 2 for outputting a radio frequency signal RF to the antenna structure 2 so that the radio frequency signal RF can be transmitted and received through the antenna structure 2 . The third electrical connector 15 is disposed on the circuit substrate 10 and electrically connected to the light emitting structure 3 for outputting a direct current signal DC to the light emitting structure 3, so that the light emitting structure 3 can use the power provided by the direct current signal DC (direct current power supply) ) to produce a light source.

此外,如圖1所示,電路基板10具有一第一導電路徑101、一第二導電路徑102以及一第三導電路徑103。更進一步來說,第一導電路徑101電性連接於第一電連接器13、分流用電容元件11以及分流用電感元件12之間,以用於將射頻訊號RF以及直流訊號DC分別傳送到分流用電容元件11以及分流用電感元件12。第二導電路徑102電性連接於分流用電容元件11以及第二電連接器14之間,以用於將射頻訊號RF從分流用電容元件11傳送到第二電連接器14。第三導電路徑103電性連接於分流用電感元件12以及第三電連接器15之間,以用於將直流訊號DC從分流用電感元件12傳送到第三電連接器15。In addition, as shown in FIG. 1 , the circuit substrate 10 has a first conductive path 101 , a second conductive path 102 and a third conductive path 103 . Furthermore, the first conductive path 101 is electrically connected between the first electrical connector 13 , the shunt capacitive element 11 and the shunt inductive element 12 for transmitting the radio frequency signal RF and the direct current signal DC to the shunt respectively. Capacitive element 11 for flow and inductive element 12 for shunt. The second conductive path 102 is electrically connected between the shunting capacitive element 11 and the second electrical connector 14 for transmitting the radio frequency signal RF from the shunting capacitive element 11 to the second electrical connector 14 . The third conductive path 103 is electrically connected between the inductive element 12 for shunting and the third electrical connector 15 for transmitting the direct current signal DC from the inductive element 12 for shunting to the third electrical connector 15 .

舉例來說,分流用電容元件11可以是陶瓷電容器,或者是任何可以用於過濾直流訊號DC的被動元件(或者是,也可以不採用此種被動元件),並且分流用電感元件12可以是陶瓷電感器,或者是任何可以用於過濾射頻訊號RF的被動元件(或者是,也可以不採用此種被動元件)。由於分流用電容元件11與分流用電感元件12可以分別採用陶瓷電容器與陶瓷電感器,所以本發明可以用於承受高功率傳輸,此特性適用於小型基地站。另外,天線結構2可以是應用於Wi-Fi 6E或者適用於5G的Frequency Range 1(包括6G赫茲以下的全頻段,例如410 MHz至7125 MHz之間)的天線結構,或者是任何可以用於收發射頻訊號RF的天線結構,並且各頻段範圍都具有“低介入損耗”以及“高隔離度(也就是可以達到共用線路而不互相干擾的特性,能夠同時收發射頻訊號RF以及產生發光效果的功能)”的特性。此外,發光結構3可以包括至少一發光二極體晶片,或者是任何可以用於產生光源的至少一發光元件。然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本發明。For example, the capacitive element 11 for shunting can be a ceramic capacitor, or any passive element that can be used to filter the direct current signal DC (or, it is also possible not to use such a passive element), and the inductive element 12 for shunting can be ceramic Inductors, or any passive components that can be used to filter RF signals (or, alternatively, do not use such passive components). Since the shunting capacitive element 11 and the shunting inductive element 12 can use ceramic capacitors and ceramic inductors respectively, the present invention can be used to withstand high power transmission, and this feature is suitable for small base stations. In addition, the antenna structure 2 can be an antenna structure applied to Wi-Fi 6E or Frequency Range 1 applicable to 5G (including the entire frequency band below 6 GHz, for example, between 410 MHz and 7125 MHz), or any antenna structure that can be used for transmitting and receiving The antenna structure of the radio frequency signal RF, and each frequency range has "low insertion loss" and "high isolation (that is, the characteristics of sharing the line without mutual interference, and the ability to send and receive radio frequency signals RF and produce luminous effects at the same time) "Characteristics. In addition, the light emitting structure 3 may include at least one light emitting diode chip, or at least one light emitting element that can be used to generate a light source. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.

舉例來說,配合圖2至圖4所示,射頻與直流訊號分流電路結構1包括多個匹配用電感元件11A以及多個匹配用電容元件12A。更進一步來說,多個匹配用電感元件11A以及多個匹配用電容元件12A之中的其中一個可以設置在電路基板的第二導電路徑102上,以並聯或者串聯的方式電性連接於分流用電容元件11與第二電連接器14之間,藉此以使得本發明能夠提供較佳的天線阻抗匹配(例如,如圖2或者圖4所示,可以採用1個匹配用電感元件11A)。再者,多個匹配用電感元件11A以及多個匹配用電容元件12A之中的另外一個設置在電路基板的第三導電路徑103上,以並聯或者串聯的方式電性連接於分流用電感元件12與第三電連接器15之間,藉此以使得本發明能夠提供較佳的天線阻抗匹配(例如,如圖3或者圖4所示,可以採用1個匹配用電容元件12A)。也就是說,本發明可以透過匹配用電感元件11A以及/或者匹配用電容元件12A的選用(也就是說,在第二導電路徑102以及第三導電路徑103上,不限定是使用匹配用電感元件11A或者是使用匹配用電容元件12A,也不限定匹配用電感元件11A以及匹配用電容元件12A所使用的數量),以及透過並聯或者串聯的電性連接方式的調整,以使得本發明能夠提供較佳的天線阻抗匹配。然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本發明。For example, as shown in FIG. 2 to FIG. 4 , the RF and DC signal shunt circuit structure 1 includes a plurality of matching inductive elements 11A and a plurality of matching capacitive elements 12A. Furthermore, one of the plurality of matching inductive elements 11A and the plurality of matching capacitive elements 12A may be disposed on the second conductive path 102 of the circuit substrate, and electrically connected to the shunt in parallel or in series. Between the capacitive element 11 and the second electrical connector 14 , so that the present invention can provide better antenna impedance matching (for example, as shown in FIG. 2 or FIG. 4 , one inductive element 11A for matching can be used). Furthermore, the other one of the plurality of matching inductive elements 11A and the plurality of matching capacitive elements 12A is disposed on the third conductive path 103 of the circuit board, and is electrically connected to the shunt inductive element 12 in parallel or in series. and the third electrical connector 15 , so that the present invention can provide better antenna impedance matching (for example, as shown in FIG. 3 or FIG. 4 , one capacitive element 12A for matching can be used). That is to say, the present invention can use the inductive element 11A for matching and/or the capacitive element 12A for matching (that is to say, on the second conductive path 102 and the third conductive path 103, it is not limited to use the inductive element for matching 11A or use matching capacitive element 12A, and the number of matching inductive element 11A and matching capacitive element 12A is not limited), and through the adjustment of parallel or series electrical connection, so that the present invention can provide a relatively Good antenna impedance matching. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.

[第二實施例][Second embodiment]

參閱圖5所示,本發明第二實施例提供一種具有發光功能的天線模組M,其包括:一射頻與直流訊號分流電路結構1、一天線結構2以及一發光結構3。由圖5與圖1的比較可知,本發明第二實施例與第一實施例最主要的差異在於:在第二實施例中,射頻與直流訊號分流電路結構1包括一第一電連接器13以及一第二電連接器14(省略第一實施中的第三電連接器),並且發光結構3包括直接設置在電路基板10上的多個發光晶片30。另外,第三導電路徑103電性連接於分流用電感元件12以及發光結構3之間,以用於將直流訊號DC從分流用電感元件12傳送到多個發光晶片30。Referring to FIG. 5 , the second embodiment of the present invention provides an antenna module M with light emitting function, which includes: a radio frequency and DC signal shunt circuit structure 1 , an antenna structure 2 and a light emitting structure 3 . From the comparison of FIG. 5 and FIG. 1, it can be seen that the main difference between the second embodiment of the present invention and the first embodiment is that: in the second embodiment, the RF and DC signal shunt circuit structure 1 includes a first electrical connector 13 and a second electrical connector 14 (the third electrical connector in the first embodiment is omitted), and the light emitting structure 3 includes a plurality of light emitting chips 30 directly disposed on the circuit substrate 10 . In addition, the third conductive path 103 is electrically connected between the inductive element 12 for shunting and the light emitting structure 3 for transmitting the direct current signal DC from the inductive element 12 for shunting to the plurality of light emitting chips 30 .

值得注意的是,舉例來說,與第一實施例的圖2、圖3與圖4相同的是,在第二實施例中,多個匹配用電感元件(圖未示)以及多個匹配用電容元件(圖未示)之中的其中一個可以設置在電路基板的第二導電路徑102上,以並聯或者串聯的方式電性連接於分流用電容元件11與第二電連接器14之間,藉此以使得本發明能夠提供較佳的天線阻抗匹配。另外,多個匹配用電感元件(圖未示)以及多個匹配用電容元件(圖未示)之中的另外一個可以設置在電路基板的第三導電路徑103上,以並聯或者串聯的方式電性連接於分流用電感元件12與發光結構3之間。然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本發明。It is worth noting that, for example, the same as Fig. 2, Fig. 3 and Fig. 4 of the first embodiment, in the second embodiment, a plurality of matching inductance elements (not shown) and a plurality of matching One of the capacitive elements (not shown in the figure) may be disposed on the second conductive path 102 of the circuit substrate, and electrically connected between the shunting capacitive element 11 and the second electrical connector 14 in parallel or in series, Therefore, the present invention can provide better antenna impedance matching. In addition, the other one of the multiple matching inductive elements (not shown) and the multiple matching capacitive elements (not shown) can be arranged on the third conductive path 103 of the circuit substrate, and electrically connected in parallel or in series. It is connected between the shunting inductance element 12 and the light emitting structure 3 . However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.

[第三實施例][Third embodiment]

參閱圖6所示,本發明第三實施例提供一種具有發光功能的天線模組M,其包括:一射頻與直流訊號分流電路結構1、一天線結構2以及一發光結構3。由圖6與圖1的比較可知,本發明第三實施例與第一實施例最主要的差異在於:在第三實施例中,射頻與直流訊號分流電路結構1包括一第一導電焊墊16、一第二導電焊墊17以及一第三導電焊墊18。Referring to FIG. 6 , the third embodiment of the present invention provides an antenna module M with light emitting function, which includes: a radio frequency and DC signal shunt circuit structure 1 , an antenna structure 2 and a light emitting structure 3 . From the comparison of FIG. 6 and FIG. 1, it can be seen that the main difference between the third embodiment of the present invention and the first embodiment is: in the third embodiment, the RF and DC signal shunt circuit structure 1 includes a first conductive pad 16 , a second conductive pad 17 and a third conductive pad 18 .

更進一步來說,如圖6所示,第一導電焊墊16設置在電路基板10上且電性連接於訊號傳輸線L,以用於接收射頻訊號RF以及直流訊號DC。其中,第二導電焊墊17設置在電路基板10上且電性連接於天線結構2,以用於輸出射頻訊號RF到天線結構2,以使得射頻訊號RF可以透過天線結構2進行收發。其中,第三導電焊墊18設置在電路基板10上且電性連接於發光結構3,以用於輸出直流訊號DC到發光結構3,以使得發光結構3可以透過直流訊號DC所提供的電源(直流電源)而產生光源。Furthermore, as shown in FIG. 6 , the first conductive pad 16 is disposed on the circuit substrate 10 and electrically connected to the signal transmission line L for receiving the radio frequency signal RF and the direct current signal DC. Wherein, the second conductive pad 17 is disposed on the circuit substrate 10 and electrically connected to the antenna structure 2 for outputting the radio frequency signal RF to the antenna structure 2 so that the radio frequency signal RF can be transmitted and received through the antenna structure 2 . Wherein, the third conductive pad 18 is disposed on the circuit substrate 10 and is electrically connected to the light emitting structure 3 for outputting a direct current signal DC to the light emitting structure 3, so that the light emitting structure 3 can pass the power provided by the direct current signal DC ( DC power supply) to produce a light source.

更進一步來說,如圖6所示,電路基板10具有一第一導電路徑101、一第二導電路徑102以及一第三導電路徑103。其中,第一導電路徑101電性連接於第一導電焊墊16、分流用電容元件11以及分流用電感元件12之間,以用於將射頻訊號RF以及直流訊號DC分別傳送到分流用電容元件11以及分流用電感元件12。其中,第二導電路徑102電性連接於分流用電容元件11以及第二導電焊墊17之間,以用於將射頻訊號RF從分流用電容元件11傳送到第二導電焊墊17。其中,第三導電路徑103電性連接於分流用電感元件12以及第三導電焊墊18之間,以用於將直流訊號DC從分流用電感元件12傳送到第三導電焊墊18。Furthermore, as shown in FIG. 6 , the circuit substrate 10 has a first conductive path 101 , a second conductive path 102 and a third conductive path 103 . Wherein, the first conductive path 101 is electrically connected between the first conductive pad 16, the shunt capacitive element 11 and the shunt inductive element 12, and is used to transmit the radio frequency signal RF and the direct current signal DC to the shunt capacitive element respectively. 11 and the inductance element 12 for shunting. Wherein, the second conductive path 102 is electrically connected between the shunt capacitive element 11 and the second conductive pad 17 for transmitting the radio frequency signal RF from the shunt capacitive element 11 to the second conductive pad 17 . Wherein, the third conductive path 103 is electrically connected between the inductive element 12 for shunting and the third conductive pad 18 for transmitting the direct current signal DC from the inductive element 12 for shunting to the third conductive pad 18 .

值得注意的是,舉例來說,與第一實施例的圖2、圖3與圖4相同的是,在第三實施例中,多個匹配用電感元件(圖未示)以及多個匹配用電容元件(圖未示)之中的其中一個設置在電路基板的第二導電路徑102上,以並聯或者串聯的方式電性連接於分流用電容元件11與第二導電焊墊17之間。另外,多個匹配用電感元件(圖未示)以及多個匹配用電容元件(圖未示)之中的另外一個設置在電路基板的第三導電路徑103上,以並聯或者串聯的方式電性連接於分流用電感元件12與第三導電焊墊18之間。然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本發明。It is worth noting that, for example, the same as Fig. 2, Fig. 3 and Fig. 4 of the first embodiment, in the third embodiment, a plurality of matching inductance elements (not shown) and a plurality of matching One of the capacitive elements (not shown in the figure) is disposed on the second conductive path 102 of the circuit board, and is electrically connected between the shunt capacitive element 11 and the second conductive pad 17 in parallel or in series. In addition, the other one of the multiple matching inductive elements (not shown) and the multiple matching capacitive elements (not shown) is arranged on the third conductive path 103 of the circuit board, electrically connected in parallel or in series. It is connected between the inductance element 12 for shunting and the third conductive pad 18 . However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.

[第四實施例][Fourth embodiment]

參閱圖7所示,本發明第四實施例提供一種可攜式電子裝置P,可攜式電子裝置P使用一具有發光功能的天線模組M,並且天線模組M可以是第一實施例至第三實施例中的任一種天線模組。7, the fourth embodiment of the present invention provides a portable electronic device P, the portable electronic device P uses an antenna module M with a light-emitting function, and the antenna module M can be the first embodiment to Any one of the antenna modules in the third embodiment.

[實施例的有益效果][Advantageous Effects of Embodiment]

本發明的其中一有益效果在於,本發明所提供的一種可攜式電子裝置P及其具有發光功能的天線模組M,其能通過“射頻與直流訊號分流電路結構1包括一電路基板10、設置在電路基板10上的一分流用電容元件11以及設置在電路基板10上的一分流用電感元件12”、“天線結構2電性連接於射頻與直流訊號分流電路結構1的分流用電容元件11”以及“發光結構3電性連接於射頻與直流訊號分流電路結構1的分流用電感元件12”的技術方案,以使得當一射頻訊號RF以及一直流訊號DC透過同一個訊號傳輸線L而輸入到射頻與直流訊號分流電路結構1時,射頻訊號RF可以通過分流用電容元件11而傳送到天線結構2,並且直流訊號DC可以通過分流用電感元件12而傳送到發光結構3。One of the beneficial effects of the present invention is that a portable electronic device P and its antenna module M with light emitting function provided by the present invention can pass through the "radio frequency and DC signal shunt circuit structure 1. It includes a circuit substrate 10, A capacitive element 11 for shunting arranged on the circuit substrate 10 and an inductive element 12 for shunting arranged on the circuit substrate 10", the antenna structure 2 is electrically connected to the capacitive element for shunting of the radio frequency and DC signal shunting circuit structure 1 11" and "light emitting structure 3 is electrically connected to the shunting inductance element 12 of the radio frequency and DC signal shunting circuit structure 1", so that when a radio frequency signal RF and a direct current signal DC are input through the same signal transmission line L When the radio frequency and direct current signal are divided into the circuit structure 1 , the radio frequency signal RF can be transmitted to the antenna structure 2 through the capacitive element 11 for shunting, and the direct current signal DC can be transmitted to the light emitting structure 3 through the inductive element 12 for shunting.

以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

P:可攜式電子裝置 M:天線模組 1:射頻與直流訊號分流電路結構 10:電路基板 101:第一導電路徑 102:第二導電路徑 103:第三導電路徑 11:分流用電容元件 11A:匹配用電感元件 12:分流用電感元件 12A:匹配用電容元件 13:第一電連接器 14:第二電連接器 15:第三電連接器 16:第一導電焊墊 17:第二導電焊墊 18:第三導電焊墊 2:天線結構 3:發光結構 30:發光晶片 RF:射頻訊號 DC:直流訊號 L:訊號傳輸線 P: Portable electronic device M: Antenna module 1: RF and DC signal shunt circuit structure 10: Circuit board 101: the first conductive path 102: the second conductive path 103: The third conductive path 11: Capacitance element for shunt 11A: Matching inductance element 12: Inductive element for shunt 12A: Capacitance element for matching 13: The first electrical connector 14: Second electrical connector 15: The third electrical connector 16: The first conductive pad 17: Second conductive pad 18: The third conductive pad 2: Antenna structure 3: Luminous structure 30: Luminous chip RF: radio frequency signal DC: DC signal L: signal transmission line

圖1為本發明第一實施例所提供的具有發光功能的天線模組的第一實施態樣的功能方塊圖。FIG. 1 is a functional block diagram of a first implementation of the antenna module with light emitting function provided by the first embodiment of the present invention.

圖2為本發明第一實施例所提供的具有發光功能的天線模組的第二實施態樣的功能方塊圖。FIG. 2 is a functional block diagram of a second implementation of the antenna module with light emitting function provided by the first embodiment of the present invention.

圖3為本發明第一實施例所提供的具有發光功能的天線模組的第三實施態樣的功能方塊圖。FIG. 3 is a functional block diagram of a third embodiment of the antenna module with light emitting function provided by the first embodiment of the present invention.

圖4為本發明第一實施例所提供的具有發光功能的天線模組的第四實施態樣的功能方塊圖。FIG. 4 is a functional block diagram of a fourth embodiment of the antenna module with light emitting function provided by the first embodiment of the present invention.

圖5為本發明第二實施例所提供的具有發光功能的天線模組的其中一實施態樣的功能方塊圖。FIG. 5 is a functional block diagram of an implementation of the antenna module with light emitting function provided by the second embodiment of the present invention.

圖6為本發明第三實施例所提供的具有發光功能的天線模組的其中一實施態樣的功能方塊圖。FIG. 6 is a functional block diagram of an implementation of the antenna module with light emitting function provided by the third embodiment of the present invention.

圖7為本發明第四實施例所提供的可攜式電子裝置使用一具有發光功能的天線模組的功能方塊圖。FIG. 7 is a functional block diagram of a portable electronic device using an antenna module with light emitting function according to the fourth embodiment of the present invention.

M:天線模組 M: Antenna module

1:射頻與直流訊號分流電路結構 1: RF and DC signal shunt circuit structure

10:電路基板 10: Circuit board

101:第一導電路徑 101: the first conductive path

102:第二導電路徑 102: the second conductive path

103:第三導電路徑 103: The third conductive path

11:分流用電容元件 11: Capacitance element for shunt

12:分流用電感元件 12: Inductive element for shunt

13:第一電連接器 13: The first electrical connector

14:第二電連接器 14: Second electrical connector

15:第三電連接器 15: The third electrical connector

2:天線結構 2: Antenna structure

3:發光結構 3: Luminous structure

RF:射頻訊號 RF: radio frequency signal

DC:直流訊號 DC: DC signal

L:訊號傳輸線 L: signal transmission line

Claims (10)

一種具有發光功能的天線模組,其包括: 一射頻與直流訊號分流電路結構,所述射頻與直流訊號分流電路結構包括一電路基板、設置在所述電路基板上的一分流用電容元件以及設置在所述電路基板上的一分流用電感元件; 一天線結構,所述天線結構電性連接於所述射頻與直流訊號分流電路結構的所述分流用電容元件;以及 一發光結構,所述發光結構電性連接於所述射頻與直流訊號分流電路結構的所述分流用電感元件; 其中,所述分流用電感元件不會電性連接於位於所述分流用電容元件與所述天線結構兩者之間的導電路徑。 An antenna module with light emitting function, comprising: A shunting circuit structure for radio frequency and direct current signals, the shunting circuit structure for radio frequency and direct current signals includes a circuit substrate, a capacitive element for shunting arranged on the circuit substrate, and an inductive element for shunting arranged on the circuit substrate ; An antenna structure, the antenna structure is electrically connected to the capacitive element for shunting of the radio frequency and DC signal shunting circuit structure; and A light emitting structure, the light emitting structure is electrically connected to the shunting inductance element of the radio frequency and DC signal shunting circuit structure; Wherein, the inductive element for shunting is not electrically connected to the conductive path between the capacitive element for shunting and the antenna structure. 如請求項1所述的具有發光功能的天線模組, 其中,當一射頻訊號以及一直流訊號透過同一個訊號傳輸線而輸入到所述射頻與直流訊號分流電路結構時,所述射頻訊號通過所述分流用電容元件而傳送到所述天線結構,且所述直流訊號通過所述分流用電感元件而傳送到所述發光結構; 其中,所述射頻與直流訊號分流電路結構包括多個匹配用電感元件以及多個匹配用電容元件;其中,多個所述匹配用電感元件以及多個所述匹配用電容元件之中的其中一個設置在所述電路基板上,以並聯或者串聯的方式電性連接於所述分流用電容元件;其中,多個所述匹配用電感元件以及多個所述匹配用電容元件之中的另外一個設置在所述電路基板上,以並聯或者串聯的方式電性連接於所述分流用電感元件。 The antenna module with light-emitting function as described in claim 1, Wherein, when a radio frequency signal and a direct current signal are input to the radio frequency and direct current signal shunt circuit structure through the same signal transmission line, the radio frequency signal is transmitted to the antenna structure through the shunt capacitive element, and the The direct current signal is transmitted to the light emitting structure through the inductance element for shunting; Wherein, the RF and DC signal shunt circuit structure includes a plurality of matching inductive elements and a plurality of matching capacitive elements; wherein, one of the plurality of matching inductive elements and the plurality of matching capacitive elements It is arranged on the circuit substrate and electrically connected to the shunt capacitive element in parallel or in series; wherein, the other one of the plurality of matching inductive elements and the plurality of matching capacitive elements is arranged On the circuit substrate, the inductance element for shunting is electrically connected in parallel or in series. 如請求項1所述的具有發光功能的天線模組, 其中,所述天線結構與所述電路基板彼此分離,且所述發光結構與所述電路基板彼此分離; 其中,所述射頻與直流訊號分流電路結構包括一第一電連接器、一第二電連接器以及一第三電連接器;其中,所述第一電連接器設置在所述電路基板上且電性連接於同一個訊號傳輸線,以用於接收所述射頻訊號以及所述直流訊號;其中,所述第二電連接器設置在所述電路基板上且電性連接於所述天線結構,以用於輸出所述射頻訊號到所述天線結構;其中,所述第三電連接器設置在所述電路基板上且電性連接於所述發光結構,以用於輸出所述直流訊號到所述發光結構; 其中,所述電路基板具有一第一導電路徑、一第二導電路徑以及一第三導電路徑;其中,所述第一導電路徑電性連接於所述第一電連接器、所述分流用電容元件以及所述分流用電感元件之間,以用於將所述射頻訊號以及所述直流訊號分別傳送到所述分流用電容元件以及所述分流用電感元件;其中,所述第二導電路徑電性連接於所述分流用電容元件以及所述第二電連接器之間,以用於將所述射頻訊號從所述分流用電容元件傳送到所述第二電連接器;其中,所述第三導電路徑電性連接於所述分流用電感元件以及所述第三電連接器之間,以用於將所述直流訊號從所述分流用電感元件傳送到所述第三電連接器; 其中,所述射頻與直流訊號分流電路結構包括多個匹配用電感元件以及多個匹配用電容元件;其中,多個所述匹配用電感元件以及多個所述匹配用電容元件之中的其中一個設置在所述電路基板的所述第二導電路徑上,以並聯或者串聯的方式電性連接於所述分流用電容元件與所述第二電連接器之間;其中,多個所述匹配用電感元件以及多個所述匹配用電容元件之中的另外一個設置在所述電路基板的所述第三導電路徑上,以並聯或者串聯的方式電性連接於所述分流用電感元件與所述第三電連接器之間。 The antenna module with light-emitting function as described in claim 1, Wherein, the antenna structure and the circuit substrate are separated from each other, and the light emitting structure and the circuit substrate are separated from each other; Wherein, the RF and DC signal shunt circuit structure includes a first electrical connector, a second electrical connector and a third electrical connector; wherein, the first electrical connector is arranged on the circuit substrate and electrically connected to the same signal transmission line for receiving the radio frequency signal and the direct current signal; wherein the second electrical connector is disposed on the circuit substrate and electrically connected to the antenna structure to for outputting the radio frequency signal to the antenna structure; wherein the third electrical connector is disposed on the circuit substrate and electrically connected to the light emitting structure for outputting the direct current signal to the light-emitting structure; Wherein, the circuit substrate has a first conductive path, a second conductive path, and a third conductive path; wherein, the first conductive path is electrically connected to the first electrical connector, the shunt capacitor element and the inductive element for shunting, for transmitting the radio frequency signal and the DC signal to the capacitive element for shunting and the inductive element for shunting respectively; wherein, the second conductive path is electrically Sexually connected between the capacitive element for shunting and the second electrical connector, for transmitting the radio frequency signal from the capacitive element for shunting to the second electrical connector; wherein, the first Three conductive paths are electrically connected between the inductive element for shunting and the third electrical connector for transmitting the DC signal from the inductive element for shunting to the third electrical connector; Wherein, the RF and DC signal shunt circuit structure includes a plurality of matching inductive elements and a plurality of matching capacitive elements; wherein, one of the plurality of matching inductive elements and the plurality of matching capacitive elements It is arranged on the second conductive path of the circuit substrate, and is electrically connected between the shunting capacitive element and the second electrical connector in parallel or in series; wherein, a plurality of the matching The inductance element and the other one of the plurality of matching capacitive elements are arranged on the third conductive path of the circuit substrate, and are electrically connected to the shunt inductance element and the inductance element in parallel or in series. between the third electrical connectors. 如請求項1所述的具有發光功能的天線模組, 其中,所述天線結構與所述電路基板彼此分離,且所述發光結構包括直接設置在所述電路基板上的多個發光晶片; 其中,所述射頻與直流訊號分流電路結構包括一第一電連接器以及一第二電連接器;其中,所述第一電連接器設置在所述電路基板上且電性連接於同一個訊號傳輸線,以用於接收所述射頻訊號以及所述直流訊號;其中,所述第二電連接器設置在所述電路基板上且電性連接於所述天線結構,以用於輸出所述射頻訊號到所述天線結構; 其中,所述電路基板具有一第一導電路徑、一第二導電路徑以及一第三導電路徑;其中,所述第一導電路徑電性連接於所述第一電連接器、所述分流用電容元件以及所述分流用電感元件之間,以用於將所述射頻訊號以及所述直流訊號分別傳送到所述分流用電容元件以及所述分流用電感元件;其中,所述第二導電路徑電性連接於所述分流用電容元件以及所述第二電連接器之間,以用於將所述射頻訊號從所述分流用電容元件傳送到所述第二電連接器;其中,所述第三導電路徑電性連接於所述分流用電感元件以及所述發光結構之間,以用於將所述直流訊號從所述分流用電感元件傳送到多個所述發光晶片; 其中,所述射頻與直流訊號分流電路結構包括多個匹配用電感元件以及多個匹配用電容元件;其中,多個所述匹配用電感元件以及多個所述匹配用電容元件之中的其中一個設置在所述電路基板的所述第二導電路徑上,以並聯或者串聯的方式電性連接於所述分流用電容元件與所述第二電連接器之間;其中,多個所述匹配用電感元件以及多個所述匹配用電容元件之中的另外一個設置在所述電路基板的所述第三導電路徑上,以並聯或者串聯的方式電性連接於所述分流用電感元件與所述發光結構之間。 The antenna module with light-emitting function as described in claim 1, Wherein, the antenna structure and the circuit substrate are separated from each other, and the light emitting structure includes a plurality of light emitting chips directly arranged on the circuit substrate; Wherein, the RF and DC signal shunt circuit structure includes a first electrical connector and a second electrical connector; wherein, the first electrical connector is arranged on the circuit substrate and is electrically connected to the same signal a transmission line for receiving the radio frequency signal and the direct current signal; wherein the second electrical connector is disposed on the circuit substrate and electrically connected to the antenna structure for outputting the radio frequency signal to the antenna structure; Wherein, the circuit substrate has a first conductive path, a second conductive path, and a third conductive path; wherein, the first conductive path is electrically connected to the first electrical connector, the shunt capacitor element and the inductive element for shunting, for transmitting the radio frequency signal and the DC signal to the capacitive element for shunting and the inductive element for shunting respectively; wherein, the second conductive path is electrically Sexually connected between the capacitive element for shunting and the second electrical connector, for transmitting the radio frequency signal from the capacitive element for shunting to the second electrical connector; wherein, the first Three conductive paths are electrically connected between the inductive element for shunting and the light emitting structure, for transmitting the DC signal from the inductive element for shunting to a plurality of the light emitting chips; Wherein, the RF and DC signal shunt circuit structure includes a plurality of matching inductive elements and a plurality of matching capacitive elements; wherein, one of the plurality of matching inductive elements and the plurality of matching capacitive elements It is arranged on the second conductive path of the circuit substrate, and is electrically connected between the shunting capacitive element and the second electrical connector in parallel or in series; wherein, a plurality of the matching The inductance element and the other one of the plurality of matching capacitive elements are arranged on the third conductive path of the circuit substrate, and are electrically connected to the shunt inductance element and the inductance element in parallel or in series. between light-emitting structures. 如請求項1所述的具有發光功能的天線模組, 其中,所述天線結構與所述電路基板彼此分離,且所述發光結構與所述電路基板彼此分離; 其中,所述射頻與直流訊號分流電路結構包括一第一導電焊墊、一第二導電焊墊以及一第三導電焊墊;其中,所述第一導電焊墊設置在所述電路基板上且電性連接於同一個訊號傳輸線,以用於接收所述射頻訊號以及所述直流訊號;其中,所述第二導電焊墊設置在所述電路基板上且電性連接於所述天線結構,以用於輸出所述射頻訊號到所述天線結構;其中,所述第三導電焊墊設置在所述電路基板上且電性連接於所述發光結構,以用於輸出所述直流訊號到所述發光結構; 其中,所述電路基板具有一第一導電路徑、一第二導電路徑以及一第三導電路徑;其中,所述第一導電路徑電性連接於所述第一導電焊墊、所述分流用電容元件以及所述分流用電感元件之間,以用於將所述射頻訊號以及所述直流訊號分別傳送到所述分流用電容元件以及所述分流用電感元件;其中,所述第二導電路徑電性連接於所述分流用電容元件以及所述第二導電焊墊之間,以用於將所述射頻訊號從所述分流用電容元件傳送到所述第二導電焊墊;其中,所述第三導電路徑電性連接於所述分流用電感元件以及所述第三導電焊墊之間,以用於將所述直流訊號從所述分流用電感元件傳送到所述第三導電焊墊; 其中,所述射頻與直流訊號分流電路結構包括多個匹配用電感元件以及多個匹配用電容元件;其中,多個所述匹配用電感元件以及多個所述匹配用電容元件之中的其中一個設置在所述電路基板的所述第二導電路徑上,以並聯或者串聯的方式電性連接於所述分流用電容元件與所述第二導電焊墊之間;其中,多個所述匹配用電感元件以及多個所述匹配用電容元件之中的另外一個設置在所述電路基板的所述第三導電路徑上,以並聯或者串聯的方式電性連接於所述分流用電感元件與所述第三導電焊墊之間。 The antenna module with light-emitting function as described in claim 1, Wherein, the antenna structure and the circuit substrate are separated from each other, and the light emitting structure and the circuit substrate are separated from each other; Wherein, the RF and DC signal shunt circuit structure includes a first conductive pad, a second conductive pad and a third conductive pad; wherein the first conductive pad is arranged on the circuit substrate and electrically connected to the same signal transmission line for receiving the radio frequency signal and the direct current signal; wherein the second conductive pad is disposed on the circuit substrate and electrically connected to the antenna structure to for outputting the radio frequency signal to the antenna structure; wherein the third conductive pad is disposed on the circuit substrate and electrically connected to the light emitting structure for outputting the direct current signal to the light-emitting structure; Wherein, the circuit substrate has a first conductive path, a second conductive path, and a third conductive path; wherein, the first conductive path is electrically connected to the first conductive pad, the shunt capacitor element and the inductive element for shunting, for transmitting the radio frequency signal and the DC signal to the capacitive element for shunting and the inductive element for shunting respectively; wherein, the second conductive path is electrically is connected between the capacitive element for shunting and the second conductive pad for transmitting the radio frequency signal from the capacitive element for shunting to the second conductive pad; wherein, the first Three conductive paths are electrically connected between the inductive element for shunting and the third conductive pad for transmitting the DC signal from the inductive element for shunting to the third conductive pad; Wherein, the RF and DC signal shunt circuit structure includes a plurality of matching inductive elements and a plurality of matching capacitive elements; wherein, one of the plurality of matching inductive elements and the plurality of matching capacitive elements It is arranged on the second conductive path of the circuit substrate, and is electrically connected between the shunting capacitive element and the second conductive pad in parallel or in series; wherein, a plurality of the matching The inductance element and the other one of the plurality of matching capacitive elements are arranged on the third conductive path of the circuit substrate, and are electrically connected to the shunt inductance element and the inductance element in parallel or in series. between the third conductive pads. 一種可攜式電子裝置,所述可攜式電子裝置使用一具有發光功能的天線模組,其特徵在於,所述天線模組包括: 一射頻與直流訊號分流電路結構,所述射頻與直流訊號分流電路結構包括一電路基板、設置在所述電路基板上的一分流用電容元件以及設置在所述電路基板上的一分流用電感元件; 一天線結構,所述天線結構電性連接於所述射頻與直流訊號分流電路結構的所述分流用電容元件;以及 一發光結構,所述發光結構電性連接於所述射頻與直流訊號分流電路結構的所述分流用電感元件; 其中,所述分流用電感元件不會電性連接於位於所述分流用電容元件與所述天線結構兩者之間的導電路徑。 A portable electronic device, the portable electronic device uses an antenna module with light emitting function, characterized in that the antenna module includes: A shunting circuit structure for radio frequency and direct current signals, the shunting circuit structure for radio frequency and direct current signals includes a circuit substrate, a capacitive element for shunting arranged on the circuit substrate, and an inductive element for shunting arranged on the circuit substrate ; An antenna structure, the antenna structure is electrically connected to the capacitive element for shunting of the radio frequency and DC signal shunting circuit structure; and A light emitting structure, the light emitting structure is electrically connected to the shunting inductance element of the radio frequency and DC signal shunting circuit structure; Wherein, the inductive element for shunting is not electrically connected to the conductive path between the capacitive element for shunting and the antenna structure. 如請求項6所述的可攜式電子裝置, 其中,當一射頻訊號以及一直流訊號透過同一個訊號傳輸線而輸入到所述射頻與直流訊號分流電路結構時,所述射頻訊號通過所述分流用電容元件而傳送到所述天線結構,且所述直流訊號通過所述分流用電感元件而傳送到所述發光結構; 其中,所述射頻與直流訊號分流電路結構包括多個匹配用電感元件以及多個匹配用電容元件;其中,多個所述匹配用電感元件以及多個所述匹配用電容元件之中的其中一個設置在所述電路基板上,以並聯或者串聯的方式電性連接於所述分流用電容元件;其中,多個所述匹配用電感元件以及多個所述匹配用電容元件之中的另外一個設置在所述電路基板上,以並聯或者串聯的方式電性連接於所述分流用電感元件。 The portable electronic device as described in Claim 6, Wherein, when a radio frequency signal and a direct current signal are input to the radio frequency and direct current signal shunt circuit structure through the same signal transmission line, the radio frequency signal is transmitted to the antenna structure through the shunt capacitive element, and the The direct current signal is transmitted to the light emitting structure through the inductance element for shunting; Wherein, the RF and DC signal shunt circuit structure includes a plurality of matching inductive elements and a plurality of matching capacitive elements; wherein, one of the plurality of matching inductive elements and the plurality of matching capacitive elements It is arranged on the circuit substrate and electrically connected to the shunt capacitive element in parallel or in series; wherein, the other one of the plurality of matching inductive elements and the plurality of matching capacitive elements is arranged On the circuit substrate, the inductance element for shunting is electrically connected in parallel or in series. 如請求項6所述的可攜式電子裝置, 其中,所述天線結構與所述電路基板彼此分離,且所述發光結構與所述電路基板彼此分離; 其中,所述射頻與直流訊號分流電路結構包括一第一電連接器、一第二電連接器以及一第三電連接器;其中,所述第一電連接器設置在所述電路基板上且電性連接於同一個訊號傳輸線,以用於接收所述射頻訊號以及所述直流訊號;其中,所述第二電連接器設置在所述電路基板上且電性連接於所述天線結構,以用於輸出所述射頻訊號到所述天線結構;其中,所述第三電連接器設置在所述電路基板上且電性連接於所述發光結構,以用於輸出所述直流訊號到所述發光結構; 其中,所述電路基板具有一第一導電路徑、一第二導電路徑以及一第三導電路徑;其中,所述第一導電路徑電性連接於所述第一電連接器、所述分流用電容元件以及所述分流用電感元件之間,以用於將所述射頻訊號以及所述直流訊號分別傳送到所述分流用電容元件以及所述分流用電感元件;其中,所述第二導電路徑電性連接於所述分流用電容元件以及所述第二電連接器之間,以用於將所述射頻訊號從所述分流用電容元件傳送到所述第二電連接器;其中,所述第三導電路徑電性連接於所述分流用電感元件以及所述第三電連接器之間,以用於將所述直流訊號從所述分流用電感元件傳送到所述第三電連接器; 其中,所述射頻與直流訊號分流電路結構包括多個匹配用電感元件以及多個匹配用電容元件;其中,多個所述匹配用電感元件以及多個所述匹配用電容元件之中的其中一個設置在所述電路基板的所述第二導電路徑上,以並聯或者串聯的方式電性連接於所述分流用電容元件與所述第二電連接器之間;其中,多個所述匹配用電感元件以及多個所述匹配用電容元件之中的另外一個設置在所述電路基板的所述第三導電路徑上,以並聯或者串聯的方式電性連接於所述分流用電感元件與所述第三電連接器之間。 The portable electronic device as described in Claim 6, Wherein, the antenna structure and the circuit substrate are separated from each other, and the light emitting structure and the circuit substrate are separated from each other; Wherein, the RF and DC signal shunt circuit structure includes a first electrical connector, a second electrical connector and a third electrical connector; wherein, the first electrical connector is arranged on the circuit substrate and electrically connected to the same signal transmission line for receiving the radio frequency signal and the direct current signal; wherein the second electrical connector is disposed on the circuit substrate and electrically connected to the antenna structure to for outputting the radio frequency signal to the antenna structure; wherein the third electrical connector is disposed on the circuit substrate and electrically connected to the light emitting structure for outputting the direct current signal to the light-emitting structure; Wherein, the circuit substrate has a first conductive path, a second conductive path, and a third conductive path; wherein, the first conductive path is electrically connected to the first electrical connector, the shunt capacitor element and the inductive element for shunting, for transmitting the radio frequency signal and the DC signal to the capacitive element for shunting and the inductive element for shunting respectively; wherein, the second conductive path is electrically Sexually connected between the capacitive element for shunting and the second electrical connector, for transmitting the radio frequency signal from the capacitive element for shunting to the second electrical connector; wherein, the first Three conductive paths are electrically connected between the inductive element for shunting and the third electrical connector for transmitting the DC signal from the inductive element for shunting to the third electrical connector; Wherein, the RF and DC signal shunt circuit structure includes a plurality of matching inductive elements and a plurality of matching capacitive elements; wherein, one of the plurality of matching inductive elements and the plurality of matching capacitive elements It is arranged on the second conductive path of the circuit substrate, and is electrically connected between the shunting capacitive element and the second electrical connector in parallel or in series; wherein, a plurality of the matching The inductance element and the other one of the plurality of matching capacitive elements are arranged on the third conductive path of the circuit substrate, and are electrically connected to the shunt inductance element and the inductance element in parallel or in series. between the third electrical connectors. 如請求項6所述的可攜式電子裝置, 其中,所述天線結構與所述電路基板彼此分離,且所述發光結構包括直接設置在所述電路基板上的多個發光晶片; 其中,所述射頻與直流訊號分流電路結構包括一第一電連接器以及一第二電連接器;其中,所述第一電連接器設置在所述電路基板上且電性連接於同一個訊號傳輸線,以用於接收所述射頻訊號以及所述直流訊號;其中,所述第二電連接器設置在所述電路基板上且電性連接於所述天線結構,以用於輸出所述射頻訊號到所述天線結構; 其中,所述電路基板具有一第一導電路徑、一第二導電路徑以及一第三導電路徑;其中,所述第一導電路徑電性連接於所述第一電連接器、所述分流用電容元件以及所述分流用電感元件之間,以用於將所述射頻訊號以及所述直流訊號分別傳送到所述分流用電容元件以及所述分流用電感元件;其中,所述第二導電路徑電性連接於所述分流用電容元件以及所述第二電連接器之間,以用於將所述射頻訊號從所述分流用電容元件傳送到所述第二電連接器;其中,所述第三導電路徑電性連接於所述分流用電感元件以及所述發光結構之間,以用於將所述直流訊號從所述分流用電感元件傳送到多個所述發光晶片; 其中,所述射頻與直流訊號分流電路結構包括多個匹配用電感元件以及多個匹配用電容元件;其中,多個所述匹配用電感元件以及多個所述匹配用電容元件之中的其中一個設置在所述電路基板的所述第二導電路徑上,以並聯或者串聯的方式電性連接於所述分流用電容元件與所述第二電連接器之間;其中,多個所述匹配用電感元件以及多個所述匹配用電容元件之中的另外一個設置在所述電路基板的所述第三導電路徑上,以並聯或者串聯的方式電性連接於所述分流用電感元件與所述發光結構之間。 The portable electronic device as described in Claim 6, Wherein, the antenna structure and the circuit substrate are separated from each other, and the light emitting structure includes a plurality of light emitting chips directly arranged on the circuit substrate; Wherein, the RF and DC signal shunt circuit structure includes a first electrical connector and a second electrical connector; wherein, the first electrical connector is arranged on the circuit substrate and is electrically connected to the same signal a transmission line for receiving the radio frequency signal and the direct current signal; wherein the second electrical connector is disposed on the circuit substrate and electrically connected to the antenna structure for outputting the radio frequency signal to the antenna structure; Wherein, the circuit substrate has a first conductive path, a second conductive path, and a third conductive path; wherein, the first conductive path is electrically connected to the first electrical connector, the shunt capacitor element and the inductive element for shunting, for transmitting the radio frequency signal and the DC signal to the capacitive element for shunting and the inductive element for shunting respectively; wherein, the second conductive path is electrically Sexually connected between the capacitive element for shunting and the second electrical connector, for transmitting the radio frequency signal from the capacitive element for shunting to the second electrical connector; wherein, the first Three conductive paths are electrically connected between the inductive element for shunting and the light emitting structure, for transmitting the DC signal from the inductive element for shunting to a plurality of the light emitting chips; Wherein, the RF and DC signal shunt circuit structure includes a plurality of matching inductive elements and a plurality of matching capacitive elements; wherein, one of the plurality of matching inductive elements and the plurality of matching capacitive elements It is arranged on the second conductive path of the circuit substrate, and is electrically connected between the shunting capacitive element and the second electrical connector in parallel or in series; wherein, a plurality of the matching The inductance element and the other one of the plurality of matching capacitive elements are arranged on the third conductive path of the circuit substrate, and are electrically connected to the shunt inductance element and the inductance element in parallel or in series. between light-emitting structures. 如請求項6所述的可攜式電子裝置, 其中,所述天線結構與所述電路基板彼此分離,且所述發光結構與所述電路基板彼此分離; 其中,所述射頻與直流訊號分流電路結構包括一第一導電焊墊、一第二導電焊墊以及一第三導電焊墊;其中,所述第一導電焊墊設置在所述電路基板上且電性連接於同一個訊號傳輸線,以用於接收所述射頻訊號以及所述直流訊號;其中,所述第二導電焊墊設置在所述電路基板上且電性連接於所述天線結構,以用於輸出所述射頻訊號到所述天線結構;其中,所述第三導電焊墊設置在所述電路基板上且電性連接於所述發光結構,以用於輸出所述直流訊號到所述發光結構; 其中,所述電路基板具有一第一導電路徑、一第二導電路徑以及一第三導電路徑;其中,所述第一導電路徑電性連接於所述第一導電焊墊、所述分流用電容元件以及所述分流用電感元件之間,以用於將所述射頻訊號以及所述直流訊號分別傳送到所述分流用電容元件以及所述分流用電感元件;其中,所述第二導電路徑電性連接於所述分流用電容元件以及所述第二導電焊墊之間,以用於將所述射頻訊號從所述分流用電容元件傳送到所述第二導電焊墊;其中,所述第三導電路徑電性連接於所述分流用電感元件以及所述第三導電焊墊之間,以用於將所述直流訊號從所述分流用電感元件傳送到所述第三導電焊墊; 其中,所述射頻與直流訊號分流電路結構包括多個匹配用電感元件以及多個匹配用電容元件;其中,多個所述匹配用電感元件以及多個所述匹配用電容元件之中的其中一個設置在所述電路基板的所述第二導電路徑上,以並聯或者串聯的方式電性連接於所述分流用電容元件與所述第二導電焊墊之間;其中,多個所述匹配用電感元件以及多個所述匹配用電容元件之中的另外一個設置在所述電路基板的所述第三導電路徑上,以並聯或者串聯的方式電性連接於所述分流用電感元件與所述第三導電焊墊之間。 The portable electronic device as described in Claim 6, Wherein, the antenna structure and the circuit substrate are separated from each other, and the light emitting structure and the circuit substrate are separated from each other; Wherein, the RF and DC signal shunt circuit structure includes a first conductive pad, a second conductive pad and a third conductive pad; wherein the first conductive pad is arranged on the circuit substrate and electrically connected to the same signal transmission line for receiving the radio frequency signal and the direct current signal; wherein the second conductive pad is disposed on the circuit substrate and electrically connected to the antenna structure to for outputting the radio frequency signal to the antenna structure; wherein the third conductive pad is disposed on the circuit substrate and electrically connected to the light emitting structure for outputting the direct current signal to the light-emitting structure; Wherein, the circuit substrate has a first conductive path, a second conductive path, and a third conductive path; wherein, the first conductive path is electrically connected to the first conductive pad, the shunt capacitor element and the inductive element for shunting, for transmitting the radio frequency signal and the DC signal to the capacitive element for shunting and the inductive element for shunting respectively; wherein, the second conductive path is electrically is connected between the capacitive element for shunting and the second conductive pad for transmitting the radio frequency signal from the capacitive element for shunting to the second conductive pad; wherein, the first Three conductive paths are electrically connected between the inductive element for shunting and the third conductive pad for transmitting the DC signal from the inductive element for shunting to the third conductive pad; Wherein, the RF and DC signal shunt circuit structure includes a plurality of matching inductive elements and a plurality of matching capacitive elements; wherein, one of the plurality of matching inductive elements and the plurality of matching capacitive elements It is arranged on the second conductive path of the circuit substrate, and is electrically connected between the shunting capacitive element and the second conductive pad in parallel or in series; wherein, a plurality of the matching The inductance element and the other one of the plurality of matching capacitive elements are arranged on the third conductive path of the circuit substrate, and are electrically connected to the shunt inductance element and the inductance element in parallel or in series. between the third conductive pads.
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