TW202331264A - Bare circuit board - Google Patents

Abstract

A bare circuit board is provided, in which the bare circuit board includes a substrate, an antenna, a chip pad, a ground pattern and a trace. The substrate includes a surface. The antenna and the chip pad are formed on the substrate. The ground pattern is formed on the surface. The trace is formed on the surface and isn’t connected to the ground pattern. There is a measuring gap formed between the trace and the ground pattern, and the trace includes a first end and a second end. The first end is electrically connected to the chip pad and the second end is electrically connected to the antenna. The bare circuit board is configured to transmit a signal, and the width of the measuring gap is smaller than the equivalent wavelength of a quarter of the signal.

Description

Circuit Bare Board

The present invention relates to a circuit board, and in particular to a bare circuit board suitable for testing before mounting active components.

Most of the circuit boards in the existing mobile devices (such as smart phones and tablet computers) have antennas, so that the mobile devices can have the function of wireless communication. After the circuit board with the antenna is manufactured, it will be tested to confirm whether the antenna is working properly. Before testing, the chip for testing must be installed on the above circuit board, so that the chip is electrically connected to the antenna and controls the antenna to send and receive wireless signals, so as to test the antenna.

However, since the detection of the above-mentioned antenna needs to use a detection chip, the detection method of the existing antenna needs to spend extra time and cost to install the detection chip on the circuit board in advance, so that the detection method of the existing circuit board antenna is not only Time consuming and costly due to the need for wafers for testing. Furthermore, the above test results cover the overall performance of the chip and the circuit board, and the industry cannot directly know the electrical quality of the circuit board from the test results.

At least one embodiment of the present invention provides a bare circuit board, which is suitable for direct inspection without the above-mentioned chip.

The bare circuit board provided by at least one embodiment of the present invention includes a substrate, an antenna, a chip pad, a ground pattern, and wiring. The substrate includes a surface. The antenna and the chip pad are formed on the substrate. The ground pattern is formed on the surface. On the surface without contacting the ground pattern, wherein a measurement gap is formed between the trace and the ground pattern, and the trace includes a first end and a second end, the first end is electrically connected to the chip pad, and the second end is electrically connected to the chip pad. Connect the antenna, where the bare board is suitable for transmitting signals, and the width of the measurement gap is less than one quarter of the equivalent wavelength of the signal.

In at least one embodiment of the present invention, the frequency of the signal is in the range of 0.1 GHz to 110 GHz, and the substrate has a dielectric constant in the range of 3.3 to 3.7.

In at least one embodiment of the present invention, when the frequency of the above-mentioned signal is greater than or equal to 110 GHz, the width of the measurement gap is less than or equal to 150 microns.

In at least one embodiment of the present invention, when the frequency of the above-mentioned signal is greater than 45 GHz and less than 110 GHz, the width of the measurement gap is in the range of 150 microns to 400 microns.

In at least one embodiment of the present invention, when the frequency of the above-mentioned signal is greater than 0 Hz and less than 45 GHz, the width of the measurement gap is in the range of 400 microns to 650 microns.

In at least one embodiment of the present invention, at least a part of the measurement gap has a fixed width.

In at least one embodiment of the present invention, the aforementioned wiring has a first line width and a second line width, and the first line width is greater than the second line width.

In at least one embodiment of the present invention, the above-mentioned routing has a measurement section, the measurement section is adjacent to the measurement gap, and includes two ends and a central portion, the central portion is located between the two ends, and each end has a first line width, while the central portion has a second line width.

In at least one embodiment of the present invention, the above-mentioned trace has a measurement section, the measurement section is adjacent to the measurement gap, and includes two ends and a central section, the central section is located between the two ends, and the width of the measurement section is from One end portion is tapered toward the central portion.

In at least one embodiment of the present invention, the above ground pattern includes a plurality of ground portions, and the wiring is located between two adjacent ground portions.

Based on the above, the bare circuit board disclosed in the above embodiments can be directly tested by the measuring device through the probe without a chip for testing, so as to shorten the detection time and directly know the antenna quality of the bare circuit board .

In the following text, in order to clearly present the technical features of this application, the dimensions (such as length, width, thickness, and depth) of elements (such as layers, films, substrates, and regions) in the drawings will be enlarged in a non-proportional manner , and some component counts will be reduced. Therefore, the description and explanation of the following embodiments are not limited to the number of components in the drawings and the size and shape of the components, but should cover the deviations in size, shape and both caused by actual manufacturing processes and/or tolerances. For example, a planar surface shown in the drawings may have rough and/or non-linear features, while acute angles shown in the drawings may be rounded. Therefore, the components shown in the drawings of this case are mainly for illustration, and are not intended to accurately depict the actual shape of the components, nor are they used to limit the scope of the patent application of this case.

Secondly, words such as "about", "approximately" or "substantially" appearing in the content of this case not only cover the clearly stated values and numerical ranges, but also cover The allowable deviation range, wherein the deviation range can be determined by the error generated during measurement, and this error is caused by the limitation of the measurement system or process conditions, for example. Additionally, "about" can mean within one or more standard deviations of the above numerical values, eg, within ±30%, ±20%, ±10%, or ±5%. Words such as "about", "approximately" or "substantially" appearing in this text can choose the acceptable deviation range or standard deviation according to optical properties, etching properties, mechanical properties or other properties, not a single The standard deviation is used to apply all properties such as the above optical properties, etching properties, mechanical properties and other properties.

The terms used in this case are only used to describe specific embodiments, and are not intended to limit the scope of the patent application. Unless otherwise limited, the terms "a" or "the" in the singular may also be used to refer to the plural.

FIG. 1 is a schematic top view of a bare circuit board 1 according to at least one embodiment of the present invention, and FIG. 2 is a partially enlarged schematic view of FIG. 1 . Referring to FIGS. 1 and 2 , the bare circuit board 1 includes a substrate 11 , at least one antenna, at least one chip pad, a ground pattern 14 and at least one trace 15 . Taking FIG. 1 as an example, the bare circuit board 1 includes a plurality of antennas 12a and 12b, a plurality of chip pads 13a and 13b, and a plurality of wires 15 and 15a. In other embodiments, the number of antennas 12 a or 12 b included in the bare circuit board 1 may be only one. In still other embodiments, the number of chip pads 13a or 13b included in the bare circuit board 1 may be only one. Still in other embodiments, the number of traces 15 or 15a included in the bare circuit board 1 may be only one.

The bare circuit board 1 is a circuit substrate that has not been equipped with any active components. In other words, before any active components are installed on the bare circuit board 1 , the electrical signals transmitted on the circuit substrate will not pass through any active components. In addition, the above-mentioned active element is, for example, a transistor or an integrated circuit (Integrated Circuit, IC) having at least one transistor, and the active element may also be a packaged chip or an unpackaged die.

The substrate 11 includes a surface and has a dielectric constant, wherein the dielectric constant may be in the range of 3.3 to 3.7. The material of the substrate 11 includes polytetrafluoroethylene (Polytetrafluoroethylene, PTEF), poly 2,6-dimethyl-1,4-phenylene oxide (Polyphenylene Oxide, PPO), cyanate resin (Triazine A resin, TA resin, Cyanate resin, CE), BT (Bismaleimide Triazine) resin, glass, liquid crystal polymer (Liquid Crystal Polymer, LCP), polyimide (Polyimide, PI) and tetrakis (4-pyridylphenyl) ethylene (Tetra-(4 -pyridylphenyl)ethylene, TPPE) at least one of them.

These antennas 12 a and 12 b are formed on the substrate 11 at intervals. In this example, these antennas 12a and 12b form an array antenna. The materials of the antennas 12a and 12b include metal materials or alloy materials. In other embodiments, the materials of the antennas 12a and 12b further include non-metallic materials. The non-metallic material is mixed with the metal material or alloy material to be the material of the antennas 12a and 12b.

The die pads 13 a and 13 b are formed on the substrate 11 . In this example, these chip pads 13a and 13b can be installed on the radio frequency chip (not shown) that controls the transmission and reception of these antennas 12a and 12b, wherein the radio frequency chip can be mounted on the chip pad 13a through ball grid array packaging technology. Same as, but not limited to, 13b. In addition, the chip pads 13a and 13b, the antennas 12a and 12b and the ground pattern 14 can all be formed on the same surface of the substrate 11, wherein the ground pattern 14 can include a plurality of ground portions 141, two The antennas 12a are electrically connected to the two ground portions 141 via wires 15a respectively.

These traces 15 are formed on the surface and do not contact the ground pattern 14 . Each trace 15 is located between two adjacent grounding portions 141 and forms two measurement gaps 16 with these grounding portions 141 . Each trace 15 includes a first end 151 and a second end 152, wherein the first end 151 is electrically connected to the chip pad 13a, and the second end 152 is electrically connected to one of the antennas 12b. At least a portion of each measurement gap 16 has a fixed width D. In this example, the entire portion of each measurement gap 16 has a fixed width D. Referring to FIG. The circuit bare board 1 is suitable for transmitting signals with a frequency ranging from 0.1 GHz to 110 GHz. The width D of each measurement gap 16 is less than one quarter of the equivalent wavelength of the signal. Formulas 1, 2, and 3 are expressed as follows: ……………………………… Formula 1, ………………………… Equation 2, and …………………………… Formula 3, wherein, D is the width of the measurement gap 16, is the equivalent wavelength, is the wavelength of the signal transmitted in the air, is the dielectric constant of the substrate 11, and the unit of the above formula is SI system.

Further, when the frequency of the signal is greater than 0 Hz and less than 45 GHz, the width D of each measurement gap 16 is in the range of 400 microns to 650 microns. When the frequency of the signal is greater than 45 GHz and less than 110 GHz, the width D of the measurement gap 16 is in the range of 150 microns to 400 microns. When the frequency of the signal is greater than or equal to 110 GHz, the width D of the measurement gap 16 is less than or equal to 150 microns.

It is worth mentioning that each trace 15 has a measurement area 153 , and the measurement area 153 covers two adjacent measurement gaps 16 . Therefore, each trace 15 is suitable for electrically contacting the probe 2 ( FIG. 3 ) in the measurement area 153 . In this example, the line width of each trace 15 in the measurement area 153 has a substantially fixed width.

FIG. 3 is a schematic cross-sectional view of using the probe 2 to measure the circuit bare board 1 in FIG. 1 . Please refer to FIG. 3 , the probe 2 can be a GSG (Ground Signal Ground, GSG) probe, and supports measurement of signals transmitted at 110 GHz. The distance between the signal pin 21 of the probe 2 and each ground pin 22 can be up to 350 microns. When measuring the electrical parameters of the 110GHz signal, since the width D of these measurement gaps 16 is less than or equal to 150 microns, the signal pins 21 of the probe 2 and these ground pins 22 can electrically contact the traces 15 and 22 respectively. Corresponding to these ground parts 141 . Therefore, the bare circuit board 1 is suitable for making electrical contact with the probe 2 for measurement.

FIG. 4 is a schematic diagram of testing the bare circuit board 1 in FIG. 1 by using the measuring device 3 and the probe 2 . Referring to FIG. 4 , the measurement device 3 is, for example, a Vector Network Analyzer (Vector Network Analyzer, VNA) or a Time Domain Reflectometer (Time Domain Reflectometer, TDR). The measuring device 3 is electrically connected to the probe 2, and the signal can be smoothly transmitted to the bare circuit board 1 by the probe 2 electrically contacting the wiring 15 (see FIG. 1 or FIG. 2 ) and the corresponding grounding parts 141 Or receive a signal from the bare circuit board 1 .

In addition, the measurement device 3 is further communicated with the control device 4 . The control device 4 can be a computer, such as a desktop computer, an industrial computer or a notebook computer. Alternatively, the control device 4 can also be a microprocessor. For example, the control device 4 can be electrically connected to the measurement device 3 through, for example, a universal serial bus (Universal Serial Bus, USB). Alternatively, the control device 4 can be wirelessly connected to the measurement device 3 via Bluetooth or a wireless network (such as Wi-Fi).

Please refer to Fig. 2 to Fig. 4, when inspecting the bare circuit board 1, the control device 4 can control the measuring device 3 to generate the first test signal S1, and the measuring device 3 can output the first test signal S1 through the probe 2 to the detected The measurement area 153 ( FIG. 2 ) of one of the traces 15 , and the first test signal S1 is transmitted to the corresponding antenna 12 a or 12 b. The first test signal S1 is an electrical signal, and the electrical signal can only be transmitted through a circuit, and cannot be transmitted through radiation. After receiving the first test signal S1, the antenna 12a or 12b will not only radiate a wireless signal, but also output a second test signal S2, wherein the second test signal S2 is transmitted to the measuring device 3 through the wiring 15 and the probe 2 , and the second test signal S2 may be an electrical signal generated by the antenna 12a or 12b due to electromagnetic induction.

Then, the control device 4 can know the status of the wireless signal radiated by the antenna 12a or 12b according to the second test signal S2 measured by the measuring device 3, and then judge whether the antenna 12a or 12b is operating normally. For example, according to the second test signal S2, the measurement device 3 can measure the return loss (return loss), insertion loss (insertion loss), OTA radiation (Over The Air, OTA) and signal offset of the antenna 12a or 12b (signal shift) at least one of them. Since the bare circuit board 1 is a circuit substrate that has not yet installed any active components, and before any active components are installed on the bare circuit board 1, the current transmitted in the bare circuit board 1 will not pass through any active components, so the first test signal S1 and the second test signal S2 also do not pass through any active components.

FIG. 5 is a schematic diagram of using another measuring device 5 and probes 2 to inspect the bare circuit board 1 in FIG. 1 . Referring to FIG. 2 , FIG. 3 and FIG. 5 , the measurement device 5 may include a vector signal generator (Vector Signal Generator, VSG) 51 , a vector signal analyzer (Vector Signal Analyzer) 52 and a transceiver antenna 53 . The vector signal generator 51 is electrically connected to the probe 2 . The transmitting and receiving antenna 53 is electrically connected to the vector signal analyzer 52 and can be aimed at the antennas 12a and 12b to be tested. The transceiver antenna 53 may be a horn antenna (horn antenna). The control device 4 is communicatively connected to a vector signal generator 51 and a vector signal analyzer 52 .

In addition, the measurement device 5 may further include a frequency converter 54, the frequency converter 54 can convert the frequency of the signal output by the vector signal generator 51 and the frequency of the signal received by the vector signal analyzer 52 according to the frequency of the signal transmitted on the bare circuit board 1 the frequency of the signal. For example, the frequency converter 54 can perform up-conversion or down-conversion. The frequency converter 54 is electrically connected between the vector signal generator 51 and the probe 2 , and is electrically connected between the vector signal analyzer 52 and the transceiver antenna 53 .

When testing the bare circuit board 1, the control device 4 can control the vector signal generator 51 to generate the initial test signal SA0, and the frequency converter 54 can change the frequency of the initial test signal SA0 to convert the initial test signal SA0 into the first test signal. SA1, the measurement device 5 can output the first test signal SA1 to the measurement area 153 of one of the traces 15 detected through the probe 2, and the first test signal SA1 is transmitted to the corresponding antenna 12a or 12b, the first test signal SA1 is an electrical signal. The antenna 12a or 12b generates a second test signal SA2 after receiving the first test signal SA1, wherein the second test signal SA2 is a wireless signal radiated by the antenna 12a or 12b. Since the bare circuit board 1 is a circuit substrate without any active components, the first test signal SA1 and the second test signal SA2 do not pass through any active components.

The transceiver antenna 53 can receive the second test signal SA2, and convert the second test signal SA2 into an electrical signal SE, wherein the electrical signal SE will be transmitted to the vector signal analyzer 52, so that the measuring device 5 can be used according to the second test signal SA2 Measure the antenna 12a or 12b. Using the vector signal generator 51 and the vector signal analyzer 52 , the measurement device 5 can measure at least one of the error vector magnitude (Error Vector Magnitude, EVM) and the transmission power of the antenna 12 a or 12 b according to the second test signal SA2 . In addition, the control device 4 can control the measurement device 5 to generate the first test signal SA1, and detect the antenna 12a or 12b according to the second test signal SA2, so as to select a qualified bare circuit board 1 .

FIG. 6 is a schematic diagram of using another measuring device 6 and the probe 2 to inspect the bare circuit board 1 in FIG. 1 . Please refer to FIG. 6 , the measuring device 6 in FIG. 6 is similar to the measuring device 5 in FIG. 5 . The measurement device 6 may include a vector signal generator 61 , a vector signal analyzer 62 , a transceiver antenna 63 and a frequency converter 64 . The similarities between the two are basically not repeated. Different from the measurement device 5 in FIG. 5 , the vector signal generator 61 of the measurement device 6 is electrically connected to the transceiver antenna 63 , and the vector signal analyzer 62 is electrically connected to the probe 2 .

Please refer to FIG. 2, FIG. 3 and FIG. 6, when testing the bare circuit board 1, the control device 4 can control the vector signal generator 61 to generate the initial test signal SC0, and the frequency converter 64 can change the frequency of the initial test signal SC0 to Convert the initial test signal SC0 into an electrical signal SE, and input the electrical signal SE to the transceiver antenna 63, so that the transceiver antenna 63 can send the first test signal SC1 toward the antennas 12a and 12b, wherein the first test signal SC1 is the transceiver antenna 63 radiated wireless signals.

When the transceiver antenna 63 sends out the first test signal SC1, the antenna 12a or 12b to be measured can receive the first test signal SC1 and generate the second test signal SC2. The second test signal SC2 is an electrical signal, and the second test signal SC2 will be transmitted to the probe 2 through the corresponding wiring 15 and input to the vector signal analyzer 62 of the measurement device 6, so that the measurement device 6 can be used according to the first The second test signal SC2 measures the antenna 12a or 12b. Using the vector signal generator 61 and the vector signal analyzer 62 , the measurement device 6 can measure at least one of error vector magnitude (EVM) and received power of the antennas 12 a and 12 b according to the second test signal SC2 .

It must be noted that the bare circuit board 1 shown in FIG. 3 to FIG. 6 is not drawn in a proportional manner to the bare circuit board 1 in FIG. 1 . Specifically, FIG. 3 mainly shows clearly that the probe 2 can electrically contact the traces 15 and the corresponding grounding portions 141 . FIG. 4 to FIG. 6 are mainly to clearly show the detection of the bare circuit board 1 by the measuring device 3 , 5 or 6 together with the probe 2 .

Through the above content, for example, according to the above formulas 1, 2 and 3, the bare circuit board 1 changes the width D of the measurement gaps 16 formed between the traces 15 and the ground pattern 14 at the frequency of the signal, not only can be used Measuring device 3, 5 or 6 with probe 2 directly detects the bare circuit board 1 without the need for the existing detection chip, and can achieve a gap design that meets the frequency of the signal, thereby improving the suppression of the bare circuit board 1 when transmitting signals noise performance. The bare circuit board 1 of this embodiment can be directly measured by the measuring devices 3, 5, and 6, thereby eliminating the extra time and cost for installing the wafer for testing, and can directly know the bare circuit board from the test results. Board 1 is in electrical and wireless signal quality.

FIG. 7 is a schematic top view of a bare circuit board 7 according to another embodiment of the present invention. Please refer to FIG. 7 , the bare circuit board 7 in FIG. 7 is similar to the bare circuit board 1 in FIG. 1 . The bare circuit board 7 includes a substrate 71 , a plurality of antennas 72 , a plurality of chip pads 73 , a ground pattern 74 and a plurality of traces 75 . The similarities between the two are basically not repeated. Different from the bare circuit board 1 in FIG. 1, any trace 75 of the bare circuit board 7 basically has a first line width L1 and a second line width L2 in the measurement area 753, wherein the first line width L1 is larger than the second line width. Second line width L2.

In addition, the shape of these ground portions 741 can vary with the shape and width of each trace 75, so that the measurement gap 76 between each trace 75 and its adjacent ground portion 741 has a shape similar to that shown in FIG. The width D. That is, the width D of each measurement gap 76 is less than one quarter of the equivalent wavelength of the signal. Therefore, in this example, the bare circuit board 7 can also be directly detected by using the above-mentioned measuring device 3 , 5 or 6 together with the probe 2 , and the detection method is as shown in FIG. 3 to FIG. 6 , which will not be repeated here.

FIG. 8 is a schematic top view of a bare circuit board 8 according to yet another embodiment of the present invention. Please refer to FIG. 8 , the bare circuit board 8 in FIG. 8 is similar to the bare circuit board 1 in FIG. 1 . The bare circuit board 8 includes a substrate 81 , a plurality of antennas 82 , a plurality of chip pads 83 , a ground pattern 84 and a plurality of traces 85 . The similarities between the two are basically not repeated. Different from the bare circuit board 1 in FIG. 1 , any trace 85 of the bare circuit board 8 has at least one measurement section 854 in the measurement area 853 . Since the at least one measurement section 854 is within the measurement area 853 , the at least one measurement section 854 is also adjacent to the corresponding two measurement gaps 86 .

Taking FIG. 8 as an example, each trace 85 has a measurement section 854 in the measurement area 853 . In other embodiments, any trace 85 may have multiple measuring sections 854 in the measuring area 853 . The measuring section 854 includes a pair of end portions 855 and a central portion 856 , wherein the central portion 856 is located between the two end portions 855 . The width of the measuring section 854 is tapered from the two end portions 855 toward the central portion 856 .

In addition, the shape of these ground portions 841 can vary with the shape and width of each trace 85, so that the measurement gap 86 between each trace 85 and its adjacent ground portion 841 has a shape similar to that shown in FIG. The width D. Therefore, in this example, the bare circuit board 8 can also be directly detected by using the above-mentioned measuring device 3 , 5 or 6 together with the probe 2 , and the detection method is as shown in FIGS. 3 to 6 , which will not be repeated here. It should be added that, in this example, the edge of the measuring section 854 is similar to a semicircle. Taking FIG. 8 as an example, two opposite edges of the measuring section 854 may be hyperbolic. In other embodiments, the edges of the measuring section 854 may appear similar to the sides of a triangle.

FIG. 9 is a schematic top view of a bare circuit board 9 according to yet another embodiment of the present invention. Please refer to FIG. 9 , the bare circuit board 9 in FIG. 9 is similar to the bare circuit board 1 in FIG. 1 . The bare circuit board 9 includes a substrate 91 , a plurality of antennas 92 , a plurality of chip pads 93 , a ground pattern 94 and a plurality of traces 95 . The similarities between the two are basically not repeated. Different from the bare circuit board 1 in FIG. 1 , any trace 95 of the bare circuit board 9 has at least one measurement section 954 in the measurement area 953 . Since the at least one measurement section 954 is within the measurement area 953 , the at least one measurement section 954 is also adjacent to the corresponding two measurement gaps 96 . Taking FIG. 9 as an example, each trace 95 has a measurement section 954 in the measurement area 953 . In other embodiments, any trace 95 may have multiple measuring sections 954 in the measuring area 953 .

The measuring section 954 includes a pair of end portions 955 and a central portion 956 , wherein the central portion 956 is located between the two end portions 955 . Each end portion 955 has a first line width L3, and the central portion has a second line width L4, and the first line width L3 is greater than the second line width L4. In addition, the shape of these ground portions 941 can vary with the shape and width of each trace 95, so that the measurement gap 96 between each trace 95 and its adjacent ground portion 941 has a similar shape as shown in FIG. The width D. Therefore, in this example, the bare circuit board 9 can also be directly detected by using the above-mentioned measuring device 3 , 5 or 6 together with the probe 2 , and the detection method is as shown in FIG. 3 to FIG. 6 , which will not be repeated here.

Through the above, the shape and width of these traces 75, 85, and 95 can be adjusted according to actual product requirements, and the corresponding ground patterns 74, 84, or 94 can be adjusted according to the shape and width of these traces 75, 85, or 95. Varies so that the width D of the measurement gap (measurement gap 76, 86, or 96) between a trace (such as trace 75, 85, or 95) and its adjacent ground (such as ground 741, 841, or 941) The equivalent wavelength is less than a quarter of the signal, so the measurement device 3 , 5 or 6 can be used together with the probe 2 to directly detect the bare circuit boards 7 , 8 and 9 .

To sum up, the bare circuit board disclosed in the above embodiments can be directly tested by the measuring device through the probes without a chip for testing, so as to obtain the electrical and wireless signal detection of the bare circuit board As a result, qualified bare boards are selected.

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field of the present invention can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The protection scope of the invention shall be defined by the scope of the appended patent application.

1: Bare circuit board 11: Substrate 12a: Antenna 12b: Antenna 13a: chip pad 13b: chip pad 14: Ground pattern 141: Grounding part 15: Routing 15a: Routing 151: first end 152: second end 153: Measuring area 16: Measuring gap 2: Probe 21: Signal pin 22: Ground pin 3: Measuring device 4: Control device 5: Measuring device 51:Vector signal generator 52:Vector Signal Analyzer 53: Transceiver antenna 54:Frequency Converter 6: Measuring device 61:Vector signal generator 62:Vector Signal Analyzer 63: Transceiver antenna 64:Frequency Converter 7: Bare circuit board 71: Substrate 72: Antenna 73: chip pad 74: Ground pattern 741: Grounding part 75: Routing 753: Measurement area 76: Measuring gap 8: Bare circuit board 81: Substrate 82: Antenna 83: chip pad 84: Ground pattern 841: grounding part 85:Wiring 853: Measurement area 854: Measurement section 855: end 856: central part 86: Measuring gap 9: Bare circuit board 91: Substrate 92: Antenna 93: chip pad 94: Ground pattern 941: grounding part 95:Wiring 953: Measuring area 954: Measurement section 955: end 956: central part 96: Measuring gap L1: first line width L2: second line width S1: The first test signal S2: Second test signal SA0: initial test signal SA1: first test signal SA2: Second test signal SE: electric signal SC0: initial test signal SC1: first test signal SC2: Second test signal D: width L1: first line width L2: second line width L3: first line width L4: second line width

For a more complete understanding of the embodiments and advantages thereof, reference is now made to the following description taken in conjunction with the accompanying drawings, in which: [FIG. 1] is a schematic top view of a bare circuit board in at least one embodiment of the present invention; [Fig. 2] is a partially enlarged schematic diagram of Fig. 1; [Fig. 3] is a schematic cross-sectional view of using a probe to measure the bare circuit board of Fig. 1; [Fig. 4] is a schematic diagram of using a measuring device and a probe to detect the circuit bare board in Fig. 1; [Fig. 5] is a schematic diagram of using another measuring device and a probe to detect the circuit bare board in Fig. 1; [Fig. 6] is a schematic diagram of using another measuring device and a probe to detect the circuit bare board in Fig. 1; [ Fig. 7 ] is a schematic top view of a circuit bare board according to another embodiment of the present invention; [ FIG. 8 ] is a schematic top view of a circuit bare board according to yet another embodiment of the present invention; and [ FIG. 9 ] is a schematic top view of a bare circuit board according to yet another embodiment of the present invention.

Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none

1: Bare circuit board

11: Substrate

12a: Antenna

12b: Antenna

13a: chip pad

13b: chip pad

14: Ground pattern

141: Grounding part

15: Routing

15a: Routing

Claims (10)

A circuit bare board, comprising: a substrate comprising a surface; an antenna formed on the substrate; a chip pad formed on the substrate; a ground pattern formed on the surface; and A trace formed on the surface without contacting the ground pattern, wherein a measurement gap is formed between the trace and the ground pattern, and the trace includes a first end and a second end, the first end One end is electrically connected to the chip pad, the second end is electrically connected to the antenna, wherein the bare circuit board is suitable for transmitting a signal, and the width of the measurement gap is less than a quarter of the signal effective wavelength. The bare circuit board as claimed in claim 1, wherein the frequency of the signal is in the range of 0.1 GHz to 110 GHz, and the substrate has a dielectric constant in the range of 3.3 to 3.7. The bare circuit board according to claim 1, wherein when the frequency of the signal is greater than or equal to 110 GHz, the width of the measurement gap is less than or equal to 150 microns. The bare circuit board according to claim 1, wherein when the frequency of the signal is greater than 45 GHz and less than 110 GHz, the width of the measurement gap is in the range of 150 microns to 400 microns. The bare circuit board as claimed in claim 1, wherein when the frequency of the signal is greater than 0 Hz and less than 45 GHz, the width of the measurement gap is in the range of 400 microns to 650 microns. The bare circuit board as claimed in claim 1, wherein at least a part of the measurement gap has a fixed width. The bare circuit board according to claim 1, wherein the trace has a first line width and a second line width, and the first line width is greater than the second line width. The bare circuit board as described in claim item 7, wherein the trace has a measurement section, the measurement section is adjacent to the measurement gap, and includes: a pair of ends; and A central portion is located between the pair of end portions, wherein each of the end portions has the first line width, and the central portion has the second line width. The bare circuit board as described in claim 1, wherein the trace has a measurement section, the measurement section is adjacent to the measurement gap, and includes: a pair of ends; and A central portion is located between the pair of end portions, wherein the width of the measuring section is tapered from one of the end portions toward the central portion. The bare circuit board according to claim 1, wherein the ground pattern includes a plurality of ground portions, and the trace is located between two adjacent ground portions.

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