TW202329773A - Methods and apparatus for manufacturing an electronic apparatus - Google Patents

Abstract

Methods of manufacturing an electronic apparatus include patterning an edge surface of a substrate to form a first recess, a second recess, and an extension portion. A first electrode is positioned on a first major surface of the substrate and extends to the first recess. A second electrode is positioned on the first major surface and extends to the second recess. Methods include applying an electrically-conductive material covering the first recess, the second recess, and the extension portion. Methods include removing a portion of the electrically-conductive material and a portion of the extension portion to isolate a first electrically-conductive line of the electrically-conductive material within the first recess from a second electrically-conductive line of the electrically-conductive material within the second recess. The first electrically-conductive line is electrically connected to the first electrode and the second electrically-conductive line is electrically connected to the second electrode. An electronic apparatus is provided.

Description

Method and device for manufacturing an electronic device

Under the patent laws, this application claims priority to U.S. Provisional Application Serial No.: 63/281,973, filed November 22, 2021, the contents of which are hereby incorporated by reference in their entirety.

The disclosed invention relates generally to methods for manufacturing electronic devices, and more particularly, to methods for manufacturing electronic devices including surrounding electrodes positioned within a recess.

The fabrication of electronic components on substrates is known. An electronic component can be positioned on the first major surface of the substrate and a first electrode can be positioned on the first major surface electrically connected to the electronic component. The second electrode may be on the second major surface of the substrate. However, depending on the geometry of the substrate, connecting the first electrode to the second electrode can be time-consuming and lead to a shortened lifetime of the electronic components. In addition, inconsistent current transfer may occur due to poor electrical connections between electrodes.

The following presents a simplified summary of the disclosed invention in order to provide a basic understanding of some aspects described in the detailed description.

In some aspects, an electronic device can include a substrate having an edge surface. The edge surface may include a plurality of indentations and a plurality of extensions, wherein the extensions are located between adjacent indentations. The electronic device includes a plurality of conductive wires, and each recess can receive the conductive wires. The conductive lines are spaced apart along the non-planar edges and are electrically isolated due to the extensions being located between the conductive lines. The conductive lines extend between the first main surface and the second main surface of the substrate and can electrically connect the electrodes on the main surfaces.

In some aspects, a method of manufacturing an electronic device can include patterning an edge surface of a substrate to form a first indentation, a second indentation, and an extension between the first indentation and the second indentation. A first electrode can be positioned on the first major surface of the substrate and can extend into the first recess and a second electrode can be positioned on the first major surface and can extend into the second recess. The method may include applying a conductive material to cover the first indentation, the second indentation and the extension such that the conductive material is in contact with the first electrode and the second electrode. The method may include removing a portion of the conductive material and a portion of the extension to isolate the first conductive line of conductive material within the first recess from the second conductive line of conductive material within the second recess. The first conductive wire can be electrically connected to the first electrode and the second conductive wire can be electrically connected to the second electrode

In some aspects, the method can include masking the first major surface prior to applying the conductive material.

In some aspects, applying can include extending the conductive material continuously across the entire edge surface of the substrate.

In some aspects, removing can include polishing the conductive material and the extension.

In some aspects, removing can include making the first conductive line, the second conductive line, and the extension substantially coplanar.

In some aspects, removing can include changing the dimensions of the extension.

In some aspects, a method of manufacturing an electronic device can include patterning an edge surface of the substrate to form a recess between the first extension and the second extension. A first electrode may be positioned on the first major surface of the substrate and may extend into the recess and a second electrode may be positioned on the second major surface of the substrate and may extend into the recess. The method may include applying a conductive material to cover the recess, the first extension and the second extension such that the conductive material is in contact with the first electrode and the second electrode. The method may include removing a portion of the conductive material, the first portion of the first extension, and the second portion of the second extension such that a conductive line of the conductive material contacts the first electrode and the second electrode within the first indentation, and The first extension surface of the first extension part and the second extension surface of the second extension part are exposed.

In some aspects, the method can include masking the first major surface and the second major surface prior to applying the conductive material.

In some aspects, removing can include polishing the conductive material, the first extension, and the second extension.

In some aspects, removing can include making the conductive line, the first extended surface, and the second extended surface substantially coplanar.

In some aspects, an electronic device can include a substrate including a first major surface, a second major surface, and an edge surface extending between the first major surface and the second major surface. The edge surface may include a first indentation and a second indentation spaced apart and extending between the first major surface and the second major surface. The electronic device may include electronic components on the first major surface. The electronic device may include a first electrode on the first major surface and in electrical contact with the electronic component. The first electrode can extend from the electronic component to the first concave. The electronic device may include a second electrode on the first major surface and in electrical contact with the electronic component. The second electrode may be spaced apart from the first electrode and may extend from the electronic component toward the second indentation. The electronic device can include a first conductive line located within the first recess and extending between the first major surface and the second major surface. The first conductive line may be in contact with the first electrode. The electronic device may include a second conductive line within the second recess and extending between the first major surface and the second major surface. The second conductive line may be in contact with the second electrode.

In some aspects, the substrate can include an extension between the first indentation and the second indentation. The extension portion may include an extension surface substantially coplanar with the first conductive line and the second conductive line.

In some aspects, a third electrode can be positioned on the second major surface. The third electrode may extend toward the first indentation and may be in contact with the first conductive line. The fourth electrode may be on the second major surface. The fourth electrode can extend toward the second indentation and can be in contact with the second conductive line.

In some aspects, the extension portion can electrically isolate the first conductive line from the second conductive line, such that the first conductive line can define a first electrical current path between the first major surface and the second major surface, and the second conductive line A second current path may be defined between the first major surface and the second major surface.

In some aspects, the first indentation can be bounded by a circular surface extending between the first major surface and the second major surface.

In some aspects, the substrate can comprise a thickness greater than about 0.3 millimeters.

In some aspects, the distance separating the first indentation and the second indentation can be less than about 100 microns.

Additional features and advantages of the embodiments disclosed herein will be set forth in the detailed description that follows, and, in part, will be apparent to those having ordinary skill in the art or may be learned by practice of the disclosed embodiments as described herein. It is recognized that the following detailed description, claims and drawings are included. It is to be understood that both the foregoing general description and the following detailed description present aspects that are intended to provide an overview or framework for understanding the nature and character of the aspects disclosed herein. The accompanying drawings are included to provide a further understanding and are incorporated in and constitute a part of this specification. The drawings illustrate aspects of the disclosed invention, and together with the description explain its principles and operation.

Aspects will now be described more fully hereinafter with reference to the accompanying drawings, in which example aspects are shown. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts. This disclosed invention may, however, be embodied in many different forms and should not be construed as limited to the aspects set forth herein.

As used herein, the term "about" means that amounts, sizes, formulations, parameters and other quantities and characteristics are not and need not be exact, but may be approximate and/or larger or smaller as desired Reflect tolerances, conversion factors, rounding, measurement errors, etc., and other factors known to those of ordinary skill in the art.

Ranges can be expressed herein as from "about" one value, and/or to "about" another value. When expressing such a range, aspects include from one value to another. Similarly, when values are expressed as approximations, by use of the antecedent "about," it will be understood that the value forms another aspect. It should also be understood that the endpoints of each range are significant to, and independent of, the other endpoints.

Directional terms—eg, up, down, right, left, front, back, top, bottom, upper, lower, etc.—as used herein refer only to the drawn figure and are not intended to imply absolute directions.

In no way is it intended that any method set forth herein be construed as requiring that its steps be performed in a particular order, nor that a particular orientation is required for any device, unless expressly stated otherwise. Thus, if a method claim does not actually recite the order in which its steps are followed, or any apparatus claim does not actually recite the order or direction of individual components, or is not specifically stated in the claim or specification, although the steps are limited to a specific order, Or a particular order or orientation of device components is not recited, but no order or orientation is intended in any way to be inferred. This applies to any possible non-express basis of interpretation, including: questions of logic related to the arrangement of steps, flow of operations, order of parts, or orientation of parts; simple meaning derived from grammatical organization or punctuation; and; quantity or type.

As used herein, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a (a)" element includes aspects having two or more such elements unless the context clearly dictates otherwise.

The words "exemplary," "example," or variations thereof are used herein to mean serving as an example, instance, or illustration. Any aspect or design described herein as "exemplary" or "example" is not to be construed as superior or superior to other aspects or designs. Furthermore, the examples are provided for clarity and understanding only and are not meant to limit or limit the disclosed subject matter or the relevant portion of the disclosed invention in any way. It is understood that numerous additional or alternative examples of various scopes could have been presented, but have been omitted for the sake of brevity.

As used herein, unless otherwise stated, the terms "comprising" and "including" and variations thereof are to be construed as synonymous and open-ended. A list of elements following a transitional phrase comprising or comprising is a non-exclusive list such that elements other than those specifically listed in the list may also be present.

As used herein, the terms "substantially", "substantially" and variations thereof are intended to mean that the described characteristic is equal or approximately equal to the value or description. For example, a "substantially planar" surface is intended to mean a planar or approximately planar surface. Additionally, "substantially" is intended to mean that two values are equal or approximately equal. In some aspects, "substantially" can mean values that are within about 10% of each other, such as within about 5% of each other, or within about 2% of each other.

Modifications may be made to the disclosed invention without departing from the scope or spirit of the claimed subject matter. Unless otherwise stated, "first," "second," etc. are not intended to imply temporal aspects, spatial aspects, orderings, etc. Rather, such terms are merely used as identifiers, names, etc. of features, elements, items, or the like. For example, a first electrode and a second electrode generally correspond to electrode A and electrode B or two different or two same electrodes or the same electrode.

The disclosed invention relates to an electronic device and a method for manufacturing the electronic device. For the purposes of this application, electronic devices can be used in a variety of display and non-display applications, including but not limited to liquid crystal displays (LCD), electrophoretic displays (EPD), organic light emitting diode displays (OLED), plasma display panels (PDP ), microLED displays, miniLED displays, display backlight units, OLED lighting, LED lighting, augmented reality (AR), virtual reality (VR), touch sensors, optoelectronics, foldable phones, or other apps. 1 is a schematic top plan view of an electronic device 101 according to aspects of the disclosed invention. The electronic device 101 includes a substrate 103 . The substrate 103 may include glass (eg, a glass substrate), such as soda lime glass, borosilicate glass, aluminoborosilicate glass, alkali-containing glass, alkali-free glass, aluminosilicate, boroaluminosilicate, glass - one or more of ceramic or other glass-containing materials. In some aspects, substrate 103 may include lithium fluoride (LiF), magnesium fluoride (MgF ₂ ), calcium fluoride (CaF ₂ ), barium fluoride (BaF ₂ ), sapphire (Al ₂ O ₃ ), selenide One or more of zinc (ZnSe), germanium (Ge), or other materials. Substrate 103 may alternatively comprise ceramics, polymers, composite materials, metals, multilayer stacks, or composites of materials. The substrate 103 may include various shapes, such as polygonal (eg, rectangular, hexagonal), curved, irregular, and the like.

FIG. 2 shows a side view of the substrate 103 as viewed along line 2-2 of FIG. 1 . As shown in FIGS. 1-2 , the substrate 103 includes a first major surface 107, a second major surface 201 (eg, as shown in FIG. 2 ), and an edge surface 109 extending between the first major surface 107 and the second major surface 201. . In some aspects, substrate 103 can include thickness 203 between first major surface 107 and second major surface 201 that ranges from about 0.05 millimeters (mm) to about 1.3 mm. For example, substrate 103 may include thickness 203 in the range of about 0.1 mm to about 1 mm, or about 0.2 mm to about 0.7 mm. When the substrate 103 initially comprises a circular shape (eg, as shown in FIG. 1 ), then the edge surface 109 may extend continuously around the substrate 103 . In some aspects, substrate 103 may include a non-circular shape (eg, a polygonal shape), such that substrate 103 includes a plurality of edge surfaces that are angled relative to each other.

In some aspects, electronic device 101 can include electronic component 111 positioned on first major surface 107 . As used herein, the term “positioned on” may include direct contact between the electronic component 111 and the first major surface 107 . Additionally, in some aspects, the term "located on" may include indirect contact between the electronic component 111 and the first major surface 107, for example, when an intermediate structure (e.g., conductive material, dielectric material, semiconductor material, solder balls, etc. ) is located between the electronic component 111 and the first main surface 107 . In some aspects, electronic components 111 may include optoelectronic elements that can generate and/or emit light or control the emission, transmission, and/or reflection of light, and may include, for example, micro LEDs (microLEDs), organic light emitting diodes (OLED), other types of light-emitting diodes, thin-film transistors (TFT), liquid crystals, electrophoresis, micromirror structures, micro-driver ICs, resistors, capacitors, etc. The electronic component 111 may also include other conductive, pyroelectric, piezoelectric, capacitive or optoelectronic components. The electronic device 101 is not limited to a single electronic component 111 , but may include a plurality of electronic components spaced apart and located on the first main surface 107 . Additionally, or alternatively, the electronic device 101 may include a second electronic component on the second major surface 201 . In some aspects, the second electronic component can be substantially similar to the electronic component 111 or can include an electronic driver board that can send and receive electronic signals to and from the electronic component 111 .

Electronic device 101 includes one or more electrically conductive electrodes (e.g., comprising a conductive material that conducts electrical current), such as first electrode 115, second electrode 117, third electrode 119, and fourth electrode on first major surface 107. electrode 121 , and the first electrode 207 , the second electrode 209 , the third electrode 211 and the fourth electrode 213 located on the second main surface 201 . In some aspects, electrodes 115 , 117 , 119 , 121 can be attached to first major surface 107 and can extend from the interior of first major surface 107 to edge surface 109 . For example, the electrodes 115 , 117 , 119 , 121 may extend between a first end that may be electrically connected to the electronic component 111 and a second end that may be near the edge surface 109 . As used herein, the term "attached to" may include direct attachment and direct contact between a structure (eg, electrodes 115, 117, 119, 121) and a surface of substrate 103 (eg, first major surface 107). Additionally, in some aspects, the term "attached to" may include both indirect attachment and non-contact between a structure (eg, electrodes 115, 117, 119, 121) and first major surface 107 of substrate 103, for example, when When the intermediate structure is located between the structure and the first major surface 107 of the substrate 103 .

The electrodes 207 , 209 , 211 , 213 on the second major surface 201 may be substantially similar to the electrodes 115 , 117 , 119 , 121 on the first major surface 107 . For example, the electrodes 207 , 209 , 211 , 213 may be attached to the second main surface 201 and may extend from the interior of the second main surface 201 towards the edge surface 109 . For example, the electrodes 207 , 209 , 211 , 213 may extend between a first end that may be electrically connected to a second electronic component on the second main surface 201 and a second end that may be close to the edge surface 109 . In some aspects, electrodes 115, 117, 119, 121, 207, 209, 211, 213 may comprise metals such as aluminum (Al), copper (Cu), gold (Au), nickel (Ni), silver (Ag) , molybdenum (Mo), indium tin oxide (ITO), titanium (Ti), chromium (Cr) or tin (Sn) or other materials such as carbon nanotubes (CNT) and conductive ink or paste) or More variety of materials. In some aspects, the electrodes 115, 117, 119, 121, 207, 209, 211, 213, and other conductive materials referred to herein (eg, conductive wires, etc.) can comprise about 1.59×10 ⁻ Resistivity in the range of ⁸ ρ(Ω•m) to about 1×10 ^-6 ρ(Ω•m) at 20°C. The electrodes 115, 117, 119, 121, 207, 209, 211, 213 may be of similar size and material, or they may be of different size and/or material.

The electrodes 115, 117, 119, 121, 207, 209, 211, 213 on the major surfaces 107, 201 may be spaced apart and electrically isolated. For example, first electrode 115 may be located on first major surface 107 in electrical contact with electronic component 111 , wherein first electrode 115 extends from electronic component 111 to edge surface 109 . The second electrode 117 may be located on the first major surface 107 in electrical contact with the electronic component 111 , and the second electrode 117 is spaced from the first electrode 115 and extends from the electronic component 111 to the edge surface 109 . The method of manufacturing electronic device 101 may include forming first electrode 115 and second electrode 117 (eg, and other electrodes 119 , 121 ) positioned on first major surface 107 of substrate 103 and extending toward edge surface 109 of substrate 103 . The method may include forming a first electrode 207 and a second electrode 209 (eg, and other electrodes 211 , 213 ) positioned on the second major surface 201 of the substrate 103 and extending toward the edge surface 109 of the substrate 103 . The electrodes 115, 117, 119, 121, 207, 209, 211, 213 can be formed in various ways, such as by printing, sputtering, electroplating, etching, lithography or other methods. In some aspects, one or more electrodes 115 , 117 , 119 , 121 on first major surface 107 may be aligned with one or more electrodes 207 , 209 , 211 , 213 on second major surface 201 . For example, as shown with reference to FIG. 2 and first electrodes 115, 207, an axis may extend between and intersect first electrode 115 on first major surface 107 and first electrode 207 on second major surface 201 such that the The axis is substantially perpendicular to the first major surface 107 and the second major surface 201 . In this way, the position of the first electrode 115 on the first main surface 107 can be substantially matched with the position of the first electrode 207 on the second main surface 201, so that the first electrode 115 can be electrically connected by extending around the edge surface 109. , 207 surrounding electrodes.

FIG. 3 shows a top plan view of electronic device 101 after patterning of edge surface 109 . For example, the method may include patterning the edge surface 109 to form a first indentation 301 , a second indentation 303 and an extension 305 between the first indentation 301 and the second indentation 303 . Thus, the first indentation 301 , the second indentation 303 and the extension 305 form a non-planar edge 309 of the substrate 103 and the first electrodes 115 , 207 extend into the first indentation 301 and the second electrodes 117 , 209 extend into the first indentation 301 . Two concave 303. The substrate 103 can be patterned in a variety of ways to form the non-planar edge 309, for example, through laser-based dicing processes, etching, grinding, nanoperforation, ablation of the edge, molding or thermoforming the substrate 103, adding additional material One or more of molding or printing or patterning onto the edge surface 109, etc. In some aspects, a patterned grinding wheel may contact substrate 103 to form non-planar edge 309 . In some aspects, after patterning, the length of substrate 103 (e.g., along the side of substrate 103 parallel to first major surface 107) ranges from about 15 mm to about 300 mm, for example, from about 50 mm to about 200mm, and the width of the substrate 103 (for example, along the other side of the substrate 103 parallel to the first main surface 107) is in the range of about 15mm to about 300mm, for example, in the range of about 50mm to about 200mm Inside.

In some aspects, after patterning, one or more edges of substrate 103 may include non-planar edges (eg, similar to non-planar edge 309 ) and zero or more edges of substrate 103 may include planar edges. For example, the electronic device 101 shown in FIG. 3 includes two edges that are non-planar and two edges that are substantially planar, although in some aspects one or more edges may be non-planar. In this manner, edge surface 109 may be patterned to form a non-planar shape having first indentation 301 and second indentation 303 spaced apart and extending between first major surface 107 and second major surface 201 . Non-planar edge 309 may include a variety of shapes. For example, as shown in FIG. 3, the non-planar edge 309 may comprise a wave or sinusoidal shape, wherein one or more extensions 302, 305 are located farther from the center of the first major surface 107 than one or more indentations 301, 303. The distance is greater. In some aspects, the extensions 302, 305 and the indentations 301, 303 comprise curved or rounded shapes, wherein the indentations 301, 303 are concave and the extensions 302, 305 are convex. The first indentation 301 may be located between a pair of extensions, such as between the first extension 302 and the second extension 305 . First indentation 301 may be bounded by a convex circular surface (eg, first extension 302 and second extension 305 ) extending between first major surface 107 and second major surface 201 .

In some aspects, first distance 313 may separate first indentation 301 from second indentation 303 . For example, the first distance 313 may be measured between the position where the first electrode 115 reaches the first indentation 301 and the position where the second electrode 117 reaches the second indentation 303 . In some aspects, these locations may include the innermost portions of the indentations 301 , 303 closest to the center of the first major surface 107 . The first distance 313 may be less than about 100 microns, or less than about 50 microns, or in a range of about 5 microns to about 300 microns, or about 50 microns to about 200 microns. In some aspects, when the indentations 301, 303 comprise circular shapes, the first distance 313 may be less than the radius of curvature of the indentations 301, 303 or less than about double (2 times) the radius of curvature or less than about three times the radius of curvature . The second distance 317 may separate the innermost portion of the indentations 301 , 303 (eg, the portion closest to the center of the first major surface 107 ) from the outermost portion of the extensions 302 , 305 (eg, the portion closest to the center of the first major surface 107 ). the far part) apart. In some aspects, the second distance 317 can be in a range of about 0.05 microns to about 100 microns, or in a range of about 1 micron to about 50 microns, or in a range of about 1 micron to about 20 microns. The third distance 321 may separate electrodes, such as the first electrode 115 and the second electrode 117 . In some aspects, the third distance 321 can be in the range of about 1 micron to about 100 microns, or about 10 microns to about 50 microns.

In some aspects, the electrodes 115 , 117 , 119 , 121 , 207 , 209 , 211 , 213 can extend from the electronic component into the recess, one electrode on the first major surface 107 and one electrode on the second major surface 201 and extend into a concave. For example, the first electrode 115 may extend from the electronic component 111 to the first recess 301 , and the second electrode 117 may be spaced apart from the first electrode 115 and may extend from the electronic component 111 to the second recess 303 . The first electrode 115 may extend along a first axis intersecting the first indentation 301 , and the second electrode 209 may extend along a second axis intersecting the first indentation 301 and parallel to the first axis. Although the indentations are shown as being spaced a substantially constant distance apart (eg, first distance 313 ), in some aspects, the indentations of non-planar edge 309 may be spaced apart by a non-constant distance. For example, a first indentation 301 and a second indentation 303 may be separated by a first distance 313 , while a second indentation 303 and an adjacent indentation may be separated by a distance different from the first distance 313 . The non-planar edge 309 is not limited to include indentations 301, 303 having a curved shape. For example, in some aspects, the indentations 301, 303 may include squares, rectangles, triangles, and the like. The indentations 301 and 303 may comprise the same shape or different shapes, and they may have the same distance 317 or different distances in this direction. When the indentations 301 , 303 comprise a rectangular shape (eg, a square shape), the one or more planar walls are angled relative to the extensions 302 , 305 and are perpendicular. In some aspects, the extensions 302 , 305 may comprise triangles having a cross-sectional dimension that gradually decreases in a direction away from the electrodes 115 , 117 . Furthermore, the indentations 301, 303 may comprise the same general shape as the extensions 302, 305, or they may comprise a different shape, angle or curvature.

FIG. 4 shows a top plan view of electronic device 101 and FIG. 5 shows a side view of substrate 103 viewed along line 5 - 5 of FIG. 4 . As shown in FIGS. 4-5 , the method may include masking the first major surface 107 and the second major surface 201 prior to applying the conductive material to the substrate 103 . For example, masking may include forming a first mask 401 on first major surface 107 and forming a second mask 501 on second major surface 201 (eg, as shown in FIG. 5 ). A first mask 401 may be formed to cover electrodes on the first main surface 107 , such as the first electrode 115 , the second electrode 117 , the third electrode 119 and the fourth electrode 121 . In some aspects, the first mask 401 may cover zero or more portions of the electronic component 111 . The second mask 501 may be formed to cover the electrodes on the second main surface 201 , such as the first electrode 207 , the second electrode 209 , the third electrode 211 and the fourth electrode 213 . In some aspects, the second mask 501 can cover zero or more portions of the second electronic components on the second major surface 201 . The first mask 401 and the second mask 501 can be formed in various ways, for example by a lamination process, in which the masks 401 , 501 are deposited on the main surface 107 , 201 of the substrate 103 . In some aspects, masking may include forming a mask 401 , 501 over major surfaces 107 , 201 but not forming a mask over edge 309 . Instead, the mask 401 , 501 may be limited to covering the major surface 107 , 201 and any structures positioned on the major surface 107 , 201 (eg, electrodes, electronic components, etc.). However, the edge 309 of the substrate 103 may remain exposed and not covered by any mask. Alternatively, masks 401 and/or 501 may cover major surfaces 107 and/or 201 but leave portions of any of electrodes 115 , 117 , 119 , 121 , 207 , 209 , 211 , 213 uncovered.

Although shading is shown as occurring after patterning of the substrate 103 (eg, as shown in FIG. 3 ), such an order is not intended to be limiting. Conversely, in some aspects, shadowing may occur before patterning of substrate 103 or after patterning of substrate 103 . For example, when shading occurs prior to patterning, after or before forming electrodes 115, 117, 119, 121, 207, 209, 211, 213 over first major surface 107 and second major surface 201 (e.g., After FIG. 2 ) the first mask 401 and the second mask 501 may be formed over the first main surface 107 and the second main surface 201 . The mask 401 , 501 may cover the main surface 107 , 201 , while the edge surface 109 remains exposed and not covered by the mask 401 , 501 . After forming the mask 401 , 501 , the edge surface 109 may be patterned to form the non-planar edge 309 .

FIG. 6 shows a top plan view of electronic device 101 including conductive material 601 . In some aspects, the method can include applying conductive material 601 to cover the indentations (eg, first indentation 301 , second indentation 303 , etc.) and extensions (eg, first extension 302 , second extension 305 , etc. ) so that the conductive material 601 is in contact with the first electrode 115 and the second electrode 117 . Conductive material 601 may cover non-planar edge 309 such that applying conductive material 601 includes extending conductive material 601 continuously across the entire edge surface of substrate 103 (eg, non-planar edge 309 ). By extending continuously, the conductive material 601 may contact substantially all portions of the non-planar edge 309 and may extend within the indentations 301 , 303 between the first major surface 107 and the second major surface 201 . The thickness of conductive material 601 may vary along non-planar edge 309 . For example, the portion of conductive material 601 present in indentation 301 or 303 may be thicker than the portion on extension portion 302 or 305 . Conductive material 601 may be discontinuous along non-planar edge 309 with substantially no or little material present on extension 302 or 305 . Conductive material 601 may then be coated with additional conductive or non-conductive (electrically insulating) material. The conductive material 601 may not be in direct contact with the electrodes 115 or 117 after application.

Conductive material 601 may be applied to non-planar edge 309 in a variety of ways, for example, by electroless plating, sputtering, printing or knife coating with conductive ink or paste, dip coating, vacuum deposition, and the like. Any subsequent non-conductive layers over 601 may be formed by vacuum deposition, solution coating or printing methods. In some aspects, conductive material 601 may be formed by first applying a seed layer (eg, Ti; Cu) to non-planar edge 309 and then electroplating the seed layer to form conductive material 601 . Other possible seed layer materials can be used, such as nickel, chromium, silver, palladium, platinum, gold, ruthenium, etc. In some aspects, conductive material 601 may comprise the same material as electrodes 115 , 117 , 119 , 121 , 207 , 209 , 211 , 213 or a different material. As shown in FIG. 6 , conductive material 601 may include a non-constant thickness 603 measured between edge surface 605 and non-planar edge 309 of conductive material 601 . By including a non-constant thickness 603 , the conductive material 601 may include a smaller thickness at locations covering the extensions 302 , 305 and a larger thickness at locations positioned within the indentations 301 , 303 . However, in some aspects, the conductive material 601 can include a constant thickness 603 such that the thickness 603 of the conductive material 601 can be substantially the same at locations covering the extensions 302 , 305 and at locations within the indentations 301 , 303 .

After applying the conductive material 601 , the conductive material 601 may be in contact with the electrodes 115 , 117 , 119 , 121 on the first main surface 107 and the electrodes 207 , 209 , 211 , 213 on the second main surface 201 . For example, the electrodes 115, 117, 119, 121, 207, 209, 211, 213 may extend toward the indentations 301, 303, with the ends of the electrodes 115, 117, 119, 121, 207, 209, 211, 213 terminating in adjacent inner recesses. Concave 301,303 places. The ends of the electrodes may approach but not completely reach the indentations 301 , 303 . The ends of the electrodes 115 , 117 , 119 , 121 , 207 , 209 , 211 , 213 may not be covered by the first mask 401 and the second mask 501 and may be in contact with the conductive material 601 . In this case, the conductive material 601 may be applied to the non-planar edge 309 and extend over a portion of either or both of the major surfaces 107, 201. The conductive material 601 and the electrode 115 can also be electrically connected through an additional conductive material applied later. FIG. 7 shows a side view of the electronic device 101 viewed along line 7 - 7 of FIG. 6 . The conductive material 601 may cover the non-planar edge 309 such that the first major surface 107, the second major surface 201 and the electrodes 115, 117, 119, 121, 207, 209, 211, 213 are hidden from view and are shown in FIG. Dotted lines indicate. In some aspects, conductive material 601 can include a first surface 701 extending substantially parallel to first major surface 107 and a second surface 703 extending substantially parallel to second major surface 201 . In order to provide contact between the conductive material 601 and the first electrode 115 on the first main surface 107 , the first surface 701 may cover a first electrode surface 707 of the first electrode 115 . By covering the first electrode surface 707 , the distance between the first main surface 107 and the first surface 701 may be greater than or equal to the distance between the first main surface 107 and the first electrode surface 707 . The first electrode surface 707 can also cover the electrode surfaces of the second electrode 117 , the third electrode 119 and the fourth electrode 121 . In order to provide contact between the conductive material 601 and the first electrode 207 on the second main surface 201 , the second surface 703 may cover a second electrode surface 709 of the first electrode 207 . By covering the second electrode surface 709 , the distance between the second main surface 201 and the second surface 703 may be greater than or equal to the distance between the second main surface 201 and the second electrode surface 709 . The second electrode surface 709 can also cover the electrode surfaces of the second electrode 209 , the third electrode 211 and the fourth electrode 213 .

FIG. 8 shows a top plan view of electronic device 101 after removal of extensions 302 , 305 and conductive material 601 , and any non-conductive material subsequently applied to conductive material 601 . For example, the method may include removing a portion of the conductive material 601 and a portion of the extensions 302, 305 to align the first conductive line 801 of the conductive material 601 within the first indentation 301 with the conductive material 601 in the second indentation 303. The second conductive line 803 is electrically isolated such that the first conductive line 801 is electrically connected to the first electrode 115 and the second conductive line 803 is electrically connected to the second electrode 117 . Removing portions of the conductive material 601 and extensions 302, 305 can occur in a number of ways. In some aspects, removing may include polishing conductive material 601 and extensions (eg, first extension 302 and second extension 305 ), which may result in removal of portions as shown in FIG. 8 . In other aspects, removing can include one or more of grinding, etching, laser ablation, laser cutting, cutting, or other subtractive methods. In some aspects, removing can include making the conductive lines 801 , 803 and the extension portions 302 , 305 (eg, extension surfaces 807 , 809 ) substantially coplanar. In some aspects, a polishing process may be performed to planarize extensions 302 , 305 and remove portions of conductive material 601 covering extensions 302 , 305 . For example, a portion of the first extension portion 302 may be removed such that the first extension surface 807 of the first extension portion 302 may be substantially planar adjacent to the first indentation 301 . Similarly, a portion of the second extension portion 305 may be removed such that the second extension surface 809 may be substantially planar between the first indentation 301 and the second indentation 303 . In some aspects, the other extensions can be planarized such that the extensions 302, 305 can be substantially coplanar.

In some aspects, removing portions of conductive material 601 and extensions 302, 305 may change the dimensions of extensions 302, 305 such that first conductive line 801, second conductive line 803, first extension surface 807, and second extension surface 809 are basically coplanar. For example, as shown in FIG. 3 , a second distance 317 may separate the innermost portions of the indentations 301 , 303 from the outermost portions of the extensions 302 , 305 . However, by changing the dimensions of the extensions 302 , 305 (eg, as shown in FIG. 8 ), the second distance 317 is reduced and the extensions 302 , 305 no longer comprise the circular shape of FIG. 3 . In this way, the shape of the extensions 302, 305 may also change, wherein the extensions 302, 305 initially comprise a rounded convex shape (eg, as shown in FIG. 3) and comprise a planarized shape after removal. Additionally, the resulting distance 317 for each individual wire may vary, but by approximately greater than about 0.5 microns, greater than about 1 micron, greater than about 5 microns, or greater than about 10 microns.

During planarization of the extensions 302, 305, the conductive material 601 covering and in contact with the extensions 302, 305 may be removed. For example, by removing the portion of the conductive material 601 covering the extensions 302, 305, the conductive material 601 can be separated into separate parts, for example, the first conductive line 801, the second conductive line 801, the conductive line 803, etc. In some aspects, The conductive lines 801 , 803 may be located in the concave, and the extension part is located between the conductive lines 801 , 803 . For example, the first conductive line 801 is located in the first concave 301 , and the second conductive line 803 is located in the second concave 303 . The second extension portion 305 is located between the first conductive wire 801 and the second conductive wire 803 , so that the first conductive wire 801 and the second conductive wire 803 are not in contact. Other indentations along the non-planar edge 309 can also receive conductive lines, with extensions separating the conductive lines. In some aspects, the extension portions 302 , 305 can include extension surfaces 807 , 809 that can be substantially coplanar with the first conductive line 801 and the second conductive line 803 . For example, the first conductive line 801 may include a first line surface 813 and the second conductive line 803 may include a second line surface 815 . The first wire surface 813 and the second wire surface 815 may comprise the outermost surfaces of the conductive wires 801 , 803 spaced the greatest distance from the electronic component 111 . In several aspects, the first wire surface 813, the second wire surface 815, the first extension surface 807, and the second extension surface 809 can be substantially coplanar. The wire surfaces 813 , 815 are not limited to being coplanar with the extension surfaces 807 , 809 . Conversely, in some aspects, the wire surfaces 813, 815 may be parallel and non-coplanar with the extension surfaces 807, 809, eg, the wire surfaces 813, 815 face toward or protrude from the indentation within the indentation. If a non-conductive layer is present over the conductive material 303 , the surface of the non-conductive layer after removal of portions may be coplanar with the first extended surface 807 and the second extended surface 809 .

The extension can electrically isolate adjacent conductive lines. For example, the second extension portion 305 can electrically isolate the first conductive line 801 from the second conductive line 803 such that the first conductive line 801 defines a first current path between the first major surface 107 and the second major surface 201, and The second conductive line 803 defines a second current path between the first major surface 107 and the second major surface 201 . Due to the removal of the conductive material 601 covering the second extension 305, the first conductive line 801 will be electrically isolated from the second conductive line 803, such that the second extension 305 (eg, and the remaining extension) is exposed and covered by the conductive material . In some aspects, first mask 401 and second mask 501 may be removed from first major surface 107 and second major surface 201 before, during, or after removal of extensions 302 , 305 and portions of conductive material 601 . The first mask 401 and the second mask 501 can be removed in various ways, such as etching, grinding, polishing and the like.

FIG. 9 shows a side view of substrate 103 as viewed along line 9 - 9 of FIG. 8 . The first conductive line 801 is located within the first indentation 301 and extends between the first major surface 107 and the second major surface 201 . In this way, the first conductive line 801 is in contact with the first electrode 115 on the first main surface 107 and the first electrode 207 on the second main surface 201 . Although as shown in FIG. 9, the electrodes 115 and the conductive lines 801 have substantially similar widths, these widths may also be different. For example, the width of the electrode 115, the width of the indentation 301 and the width of the wire 801 may be different. Electrode 115 may be wider or narrower than indentation 301 . Electrodes 115 may be wider or narrower than wires 801 . In addition, the electrode 115 or the recess 301 or the wire 801 may include a plurality of parallel elements. For example, electrode 115 may be divided into more than 1 parallel line. The indentation 301 may comprise more than one indentation. The conductive line 801 may include more than one parallel line. The second conductive line 803 is located within the second indentation 303 and extends between the first major surface 107 and the second major surface 201 . In this way, the second conductive line 803 is in contact with the second electrode 117 on the first major surface 107 and the second electrode 209 on the second major surface 201 . In this way, the conductive wires 801 , 803 can electrically connect the electrodes 115 , 117 , 207 , 209 on the first main surface 107 and the second main surface 201 . For example, the first conductive wire 801 can electrically connect the first electrodes 115 , 207 and define a first current path between the first electrodes 115 , 207 . The first current path may comprise a path along which the first stream of charged particles moves through the conductive material 115 , 207 , 801 . The second conductive line 803 can electrically connect the second electrodes 117 , 209 and define a second current path between the second electrodes 117 , 209 . Since the second extension 305 is located between the conductive lines 801, 803 and there is no conductive material covering the second extension 305, the first current path is spaced and electrically isolated from the second current path.

In some aspects, conductive lines 801 , 803 may comprise the same or different material as electrodes 115 , 207 , 117 , 209 . For example, the conductive lines 801, 803 and the electrodes 115, 207, 117, 209 may comprise the same material, eg copper. An advantage of including the same material for the electrode and the conductive wire is that the contact resistance between the conductive wire and the electrode can be minimized, thereby improving the conductivity of the conductive wire.

Electronic device 101 provides several benefits of reduced manufacturing time and improved performance. For example, the parallel process quickly and reliably patterns the substrate 103 to form the non-planar edge 309 as compared to forming the indentations 301 , 303 individually in a serial process (eg, step by step). For example, a plurality of indentations 301, 303 may be formed in a single act or operation. Furthermore, the conductive material 601 may be applied to the non-planar edge 309 in a single step followed by removal of the conductive material 601 and portions of the extensions 302 , 305 . Thus, the individual conductive lines 801, 803 may be formed in a parallel process as opposed to a serial process (eg, stepwise formation of individual conductive lines). Due to the geometry of the non-planar edge 309 (eg, the extensions 302, 305), the conductive lines 801, 803 are electrically isolated. In addition, although FIGS. 1-9 illustrate the formation of conductive lines 801 , 803 relative to one substrate 103 , in some aspects, the above steps can be performed on multiple substrates 103 . For example, a plurality of substrates 103 can be stacked so that the substrates 103 can be simultaneously patterned to form conductive lines, thereby reducing manufacturing time.

Additionally, the geometry of the non-planar edge 309 can facilitate a greater number of conductive lines relative to a substrate including through-glass vias or surrounding electrodes on a planar edge surface. For example, in some aspects, non-planar edge 309 may include indentations 301 , 303 that include circular shapes with a radius of curvature greater than the distance separating adjacent indentations 301 , 303 . Alternatively, the radius may be greater than half the separation distance. Thus, a greater number of indentations 301 , 303 may be formed along the non-planar edge 309 than, for example, through glass vias in which the radius of curvature is smaller than the distance separating adjacent vias. In this manner, each recess can receive a conductive wire, wherein the conductive wire is electrically isolated from adjacent conductive wires. The indentations 301, 303 may thus comprise shapes that may receive the conductive lines 801, 803 while electrically isolating the conductive lines 801, 803 via the extensions.

It should be understood that while various aspects have been described in detail with respect to certain illustrative and specific examples thereof, the disclosed invention is not to be considered limited thereto since many modifications and combinations of the disclosed features are possible without departing from the following The scope of the request item.

101 : Electronic devices 103 : Substrate 107 : the first main surface 201 : Second main surface 109 : edge surface 203 : thickness 111 : electronic components 115 : first electrode 117 : second electrode 119 : the third electrode 121 : The fourth electrode 207 : first electrode 209 : second electrode 211 : The third electrode 213 : The fourth electrode 301 : first concave 303 : Second concave 305 : extension part 309 : edge 302 : extension part 313 : first distance 317 : Second distance 321 : The third distance 401 : first mask 501 : second mask 601 : Conductive material 701 : first surface 703 : Second surface 707 : first electrode surface 709 : Second electrode surface 801 : The first conductive wire 803 : Second conductive wire 807, 809 : extended surface 813 : first-line surface 815 : Second line surface

These and other features, aspects and advantages will be better understood when reading the following detailed description when read with reference to the accompanying drawings, in which:

FIG. 1 shows a plan view of an electronic device according to various aspects of the disclosed invention;

2 is a side view of an electronic device taken along line 2-2 of FIG. 1 according to an aspect of the present disclosure;

3 shows a plan view of the electronic device after the edge surface of the substrate of the electronic device according to aspects of the present disclosure is patterned;

4 illustrates a plan view of the electronic device after shading of the first major surface and the second major surface according to aspects of the disclosed invention;

5 illustrates a side view of an electronic device taken along line 5-5 of FIG. 4 in accordance with aspects of the disclosed invention;

6 illustrates a plan view of an electronic device after applying conductive material to an edge surface of a substrate in accordance with aspects of the presently disclosed invention;

7 illustrates a side view of the electronic device taken along line 7-7 of FIG. 6 according to aspects of the disclosed invention;

8 illustrates a plan view of an electronic device after removal of a portion of an edge surface of a substrate according to aspects of the disclosed invention; and

9 illustrates a side view of the electronic device taken along line 9-9 of FIG. 8 according to aspects of the disclosed invention;

Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none

101: Electronic devices

103: Substrate

107: the first main surface

111: Electronic components

115: the first electrode

117: second electrode

119: The third electrode

121: The fourth electrode

301: The first concave

303: Second concave

305: extension

309: edge

302: extension

313: first distance

317: second distance

321: The third distance

Claims (10)

A method of manufacturing an electronic device, comprising: patterning an edge surface of a substrate to form a first indentation, a second indentation, and an extension between the first indentation and the second indentation, wherein a first electrode is located on the substrate on a first major surface of and extend to the first indentation and a second electrode is on the first major surface and extends to the second indentation; applying a conductive material covering the first indentation, the second indentation and the extension such that the conductive material contacts the first electrode and the second electrode; and removing a portion of the conductive material and a portion of the extension to isolate a first conductive line of the conductive material in the first recess from a second conductive line of the conductive material in the second recess, the The first conductive wire is electrically connected to the first electrode and the second conductive wire is electrically connected to the second electrode. The method of claim 1, further comprising masking the first major surface prior to applying the conductive material. The method of claim 1, wherein applying includes extending the conductive material continuously across the entire edge surface of the substrate. The method of claim 1, wherein removing includes polishing the conductive material and the extension. A method of manufacturing an electronic device, comprising: patterning an edge surface of a substrate to form a recess between a first extension and a second extension, a first electrode on a first major surface of the substrate and extending into the recess, and a second electrode is located on a second major surface of the substrate and extends into the recess; applying a conductive material over the indentation, the first extension and the second extension such that the conductive material contacts the first electrode and the second electrode; and removing a portion of the conductive material, a first portion of the first extension, and a second portion of the second extension such that a conductive line of the conductive material contacts the first electrode and the first electrode within the first recess The second electrode, and a first extension surface of the first extension part and a second extension surface of the second extension part are exposed. An electronic device comprising: A substrate comprising a first major surface, a second major surface and an edge surface extending between the first major surface and the second major surface, the edge surface comprising a first indentation spaced apart and a second indentation extending between the first major surface and the second major surface; an electronic component located on the first major surface; a first electrode located on the first major surface and in electrical contact with the electronic component, the first electrode extending from the electronic component toward the first recess; a second electrode located on the first major surface and in electrical contact with the electronic component, the second electrode spaced from the first electrode and extending from the electronic component toward the second recess; a first conductive line within the first indentation and extending between the first major surface and the second major surface, the first conductive line in contact with the first electrode; and A second conductive line is located in the second concave and extends between the first main surface and the second main surface, the second conductive line is in contact with the second electrode. The electronic component as claimed in claim 6, wherein the substrate includes an extending portion between the first concave and the second concave, the extending portion includes an extending surface, and the extending surface is substantially the same as the first The conductive line is coplanar with the second conductive line. The electronic component as claimed in claim 6, further comprising a third electrode located on the second main surface, the third electrode extending toward the first concave and in contact with the first conductive line, and comprising a fourth An electrode, the fourth electrode is located on the second main surface and the fourth electrode extends toward the second concave and contacts the second conductive line. The electronic component according to claim 8, wherein the extension portion electrically isolates the first conductive line from the second conductive line such that the first conductive line is defined between the first major surface and the second major surface A first current path, and the second conductive line defines a second current path between the first main surface and the second main surface. The electronic component of claim 6, wherein the first indentation is defined by a circular surface extending between the first major surface and the second major surface.

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